<?xml version="1.0" encoding="utf-8"?>
<!DOCTYPE eagle SYSTEM "eagle.dtd">
<eagle version="6.6.0">
<drawing>
<board>
<plain>
<wire x1="0" y1="0" x2="46.99" y2="0" width="0.1524" layer="20"/>
<wire x1="46.99" y1="0" x2="46.99" y2="59.69" width="0.1524" layer="20"/>
<wire x1="46.99" y1="59.69" x2="0" y2="59.69" width="0.1524" layer="20"/>
<wire x1="0" y1="59.69" x2="0" y2="0" width="0.1524" layer="20"/>
</plain>
<libraries>
<library name="J-HDR3.5mm">
<description>&lt;pre&gt;HEADER 3.5MM center to center
USE AT YOUR OWN RISK...
 
Copyright (C) 2013 Ronald Steven Sutherland
Released under the Creative Commons 
Attribution Share-Alike 3.0 License
http://creativecommons.org/licenses/by-sa/3.0</description>
<packages>
<package name="MCV2">
<description>&lt;pre&gt;MCV 1,5/2-G-3,5-RN [PHOENIX CONTACT,1731471] CONN HEADER SHROUDED 2POS 3.5MM
PST 1,0/2-3,5 [PHOENIX CONTACT,1945096] CONN HEADER STRIP PIN 2POS 3.5MM

Drill Size 3/64": .0469" (1.2mm)</description>
</package>
</packages>
</library>
<library name="D-LED">
<description>&lt;pre&gt;Light-emitting diode
http://en.wikipedia.org/wiki/Light-emitting_diode
USE AT YOUR OWN RISK...

Copyright (C) 2013 Ronald Steven Sutherland
Released under the Creative Commons 
Attribution Share-Alike 3.0 License
http://creativecommons.org/licenses/by-sa/3.0</description>
<packages>
<package name="LED5MM">
<description>&lt;B&gt;LED&lt;/B&gt;&lt;p&gt;
5 mm, round</description>
</package>
</packages>
</library>
<library name="R-C">
<description>&lt;pre&gt;CHIP RESISTOR
NOTE: rounded pads... http://www.kemet.com/kemet/web/homepage/kfbk3.nsf/vaFeedbackFAQ/2209BDBA03843BBF85256BCD004EBC11/$file/f2100e.pdf
See section on Tombstoneing. Lead free solder may not wet edges, and IPC does not allow exposed copper. 
My (rsutherland@epccs) experience suggest highly rounded pads reduce solder beads that can be extruded along edges of larger capacitors (0805).

USE AT YOUR OWN RISK...
 
Copyright (C) 2013 Ronald Steven Sutherland
Released under the Creative Commons 
Attribution Share-Alike 3.0 License
http://creativecommons.org/licenses/by-sa/3.0</description>
<packages>
<package name="C0805(2012)">
<description>&lt;pre&gt;EIA 0805 (Metric Code Size 2012) Ceramic Chip
rounded pads are added in IPC 782 rev A
http://www.kemet.com/kemet/web/homepage/kfbk3.nsf/vaFeedbackFAQ/2209BDBA03843BBF85256BCD004EBC11/$file/f2100e.pdf</description>
</package>
</packages>
</library>
</libraries>
<attributes>
</attributes>
<variantdefs>
</variantdefs>
<elements>
<element name="J1" library="J-HDR3.5mm" package="MCV2" value="PST1,0/2-3,5">
<attribute name="NAME"/>
</element>
<element name="D1" library="D-LED" package="LED5MM" value="5MMGN">
<attribute name="NAME"/>
</element>
<element name="R1" library="R-C" package="C0805(2012)" value="1k">
<attribute name="NAME"/>
<attribute name="VALUE"/>
</element>
</elements>
<signals>
<signal name="N$2">
<contactref element="R1" pad="2"/>
<contactref element="D1" pad="K"/>
</signal>
<signal name="N$3">
<contactref element="D1" pad="A"/>
<contactref element="J1" pad="2"/>
</signal>
<signal name="0V">
<contactref element="J1" pad="1"/>
<contactref element="R1" pad="1"/>
</signal>
</signals>
</board>
</drawing>
</eagle>
