(kicad_pcb (version 20221018) (generator pcbnew)
  (general
    (thickness 1.646)
  )
  (paper "A4")
  (layers
    (0 "F.Cu" signal "Front")
    (31 "B.Cu" signal "Back")
    (34 "B.Paste" user)
    (35 "F.Paste" user)
    (36 "B.SilkS" user "B.Silkscreen")
    (37 "F.SilkS" user "F.Silkscreen")
    (38 "B.Mask" user)
    (39 "F.Mask" user)
    (44 "Edge.Cuts" user)
    (45 "Margin" user)
    (46 "B.CrtYd" user "B.Courtyard")
    (47 "F.CrtYd" user "F.Courtyard")
    (49 "F.Fab" user)
  )
  (setup
    (stackup
      (layer "F.SilkS" (type "Top Silk Screen") (color "White") (material "Direct Printing"))
      (layer "F.Paste" (type "Top Solder Paste"))
      (layer "F.Mask" (type "Top Solder Mask") (color "Purple") (thickness 0.025))
      (layer "F.Cu" (type "copper") (thickness 0.036))
      (layer "dielectric 1" (type "core") (color "FR4 natural") (thickness 1.524) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
      (layer "B.Cu" (type "copper") (thickness 0.036))
      (layer "B.Mask" (type "Bottom Solder Mask") (color "Purple") (thickness 0.025))
      (layer "B.Paste" (type "Bottom Solder Paste"))
      (layer "B.SilkS" (type "Bottom Silk Screen") (color "White") (material "Direct Printing"))
      (copper_finish "None")
      (dielectric_constraints no)
    )
    (pad_to_mask_clearance 0.0508)
    (pcbplotparams
      (layerselection 0x00010fc_ffffffff)
      (plot_on_all_layers_selection 0x0000000_00000000)
      (disableapertmacros false)
      (usegerberextensions false)
      (usegerberattributes true)
      (usegerberadvancedattributes true)
      (creategerberjobfile true)
      (dashed_line_dash_ratio 12.000000)
      (dashed_line_gap_ratio 3.000000)
      (svgprecision 4)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (dxfpolygonmode true)
      (dxfimperialunits true)
      (dxfusepcbnewfont true)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (sketchpadsonfab false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 0)
      (scaleselection 1)
      (outputdirectory "../../cubesat-gerbers/")
    )
  )
  (net 0 "")
  (net 1 "3V3_EN")
  (net 2 "GND")
  (net 3 "Net-(U1-UART1_RX{slash}I2C0_SCL{slash}SPI0_CSN{slash}GP5)")
  (net 4 "Net-(IC1-1,2EN)")
  (net 5 "Net-(IC1-1A)")
  (net 6 "Net-(IC1-1Y)")
  (net 7 "Net-(IC1-2Y)")
  (net 8 "5V0")
  (net 9 "Net-(IC1-2A)")
  (net 10 "+7V")
  (net 11 "Net-(IC1-3A)")
  (net 12 "Net-(IC1-3Y)")
  (net 13 "VSYS")
  (net 14 "ADC_VREF")
  (net 15 "Net-(IC1-4Y)")
  (net 16 "Net-(IC1-4A)")
  (net 17 "Net-(IC2-1A)")
  (net 18 "Net-(IC2-1Y)")
  (net 19 "Net-(IC2-2Y)")
  (net 20 "Net-(IC2-2A)")
  (net 21 "Net-(IC2-3A)")
  (net 22 "Net-(IC2-3Y)")
  (net 23 "Net-(IC2-4Y)")
  (net 24 "Net-(IC2-4A)")
  (net 25 "Net-(IC3-1,2EN)")
  (net 26 "Net-(IC3-1Y)")
  (net 27 "Net-(IC3-2Y)")
  (net 28 "Net-(IC3-3Y)")
  (net 29 "Net-(IC3-4Y)")
  (net 30 "Net-(IC4-1Y)")
  (net 31 "Net-(IC4-2Y)")
  (net 32 "Net-(IC4-3Y)")
  (net 33 "Net-(IC4-4Y)")
  (net 34 "Net-(U1-3V3(OUT))")
  (net 35 "Net-(U1-UART0_TX{slash}I2C0_SDA{slash}GPI1_RX{slash}GP12)")
  (net 36 "Net-(U1-UART0_RX{slash}I2C0_SCL{slash}SPI1_CSN{slash}GP13)")
  (net 37 "Net-(U1-I2C1_SDA{slash}SPI1_SCK{slash}GP10)")
  (net 38 "Net-(U1-I2C1_SCL{slash}SPI1_TX{slash}GP11)")
  (net 39 "Net-(P10-Pad1)")
  (net 40 "Net-(P11-Pad1)")
  (net 41 "Net-(P14-Pad1)")
  (net 42 "Net-(P17-Pad1)")
  (net 43 "Net-(U1-I2C1_SDA{slash}SPI0_SCK{slash}GP2)")
  (net 44 "Net-(U1-I2C1_SCL{slash}SPI0_TX{slash}GP3)")
  (net 45 "VBUS")
  (net 46 "unconnected-(U1-GND_10-PadTP1)")
  (net 47 "unconnected-(U1-SWDIO-PadD3)")
  (net 48 "unconnected-(U1-SWCLK-PadD1)")
  (net 49 "unconnected-(U1-GND-PadD)")
  (net 50 "unconnected-(U1-GND_13-PadC)")
  (net 51 "unconnected-(U1-GND_12-PadB)")
  (net 52 "unconnected-(U1-GND_11-PadA)")
  (net 53 "unconnected-(U1-BOOTSEL-PadTP6)")
  (net 54 "unconnected-(U1-GPIO25{slash}LED-PadTP5)")
  (net 55 "unconnected-(U1-GPIO{slash}SMPS-PadTP4)")
  (net 56 "unconnected-(U1-USB_DP-PadTP3)")
  (net 57 "unconnected-(U1-USB_DM-PadTP2)")
  (net 58 "unconnected-(U1-ADC2{slash}GP28-Pad34)")
  (net 59 "unconnected-(U1-I2C1_SCL{slash}ADC1{slash}GP27-Pad32)")
  (net 60 "unconnected-(U1-I2C1_SDA{slash}ADC0{slash}GP26-Pad31)")
  (net 61 "unconnected-(U1-RUN-Pad30)")
  (net 62 "unconnected-(U1-GP22-Pad29)")
  (net 63 "unconnected-(U1-I2C0_SCL{slash}GP21-Pad27)")
  (net 64 "unconnected-(U1-I2C1_SDA{slash}SPI0_SCK{slash}GP18-Pad24)")
  (net 65 "unconnected-(U1-UART1_TX{slash}I2C0_SDA{slash}SPI0_RX{slash}GP4-Pad6)")
  (net 66 "unconnected-(U1-UART0_RX{slash}I2C0_SCL{slash}GPI0_CSN{slash}GP1-Pad2)")
  (net 67 "unconnected-(U1-UART0_TX{slash}I2C0_SDA{slash}SPI0_RX{slash}GP0-Pad1)")
  (footprint "MCU_Shield_RP2040_R6:1X02" (layer "F.Cu")
    (at 128.905 67.945 180)
    (descr "<b>PIN HEADER</b>")
    (property "Sheetfile" "MCU_Shield_RP2040_R6.kicad_sch")
    (property "Sheetname" "MCU_Shield_RP2040_R6_0")
    (fp_text reference "DEBUG0" (at 2.6162 -3.2512) (layer "F.SilkS"))
    (fp_text value "PINHD-1X2" (at 3.175 0) (layer "F.Fab"))
    (pad "1" thru_hole oval (at -1.27 0 270) (size 3.048 1.524) (drill 1.016) (layers "*.Cu" "*.Mask")
      (net 3 "Net-(U1-UART1_RX{slash}I2C0_SCL{slash}SPI0_CSN{slash}GP5)") (pinfunction "1") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 45))
    (pad "2" thru_hole oval (at 1.27 0 270) (size 3.048 1.524) (drill 1.016) (layers "*.Cu" "*.Mask")
      (net 2 "GND") (pinfunction "2") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 45))
  )
  (footprint "MCU_Shield_RP2040_R6:TE_282834-2" (layer "F.Cu")
    (at 103.505 99.695 90)
    (property "Sheetfile" "MCU_Shield_RP2040_R6.kicad_sch")
    (property "Sheetname" "MCU_Shield_RP2040_R6_0")
    (fp_text reference "P9" (at -1.73 2.54 90) (layer "F.SilkS"))
    (fp_text value "282834-2" (at -3.02 4.5 90) (layer "F.Fab") hide)
    (pad "1" thru_hole rect (at -1.27 0 90) (size 1.8 1.8) (drill 1.2) (layers "*.Cu" "*.Mask")
      (net 39 "Net-(P10-Pad1)") (pinfunction "1") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 45))
    (pad "2" thru_hole circle (at 1.27 0 90) (size 1.8 1.8) (drill 1.2) (layers "*.Cu" "*.Mask")
      (net 8 "5V0") (pinfunction "2") (pintype "passive") (solder_mask_margin 0.0635))
  )
  (footprint "MCU_Shield_RP2040_R6:DIP762W53P254L1980H508Q16B" (layer "F.Cu")
    (at 173.99 117.475 -90)
    (descr "16-DIP, 2.54 mm (0.10 in) pitch, 7.62 mm (0.30 in) span, 19.80 X 6.35 X 5.08 mm body\n <p>16-pin DIP package with 2.54 mm (0.10 in) pitch, 7.62 mm (0.30 in) span with body size 19.80 X 6.35 X 5.08 mm</p>")
    (property "Sheetfile" "MCU_Shield_RP2040_R6.kicad_sch")
    (property "Sheetname" "MCU_Shield_RP2040_R6_0")
    (fp_text reference "IC1" (at 0 6.35 -180) (layer "F.SilkS"))
    (fp_text value "SN754410" (at 0 4.445) (layer "F.Fab"))
    (pad "1" thru_hole circle (at -3.81 -8.89 270) (size 1.3887 1.3887) (drill 0.7887) (layers "*.Cu" "*.Mask")
      (net 4 "Net-(IC1-1,2EN)") (pinfunction "1,2EN") (pintype "input") (solder_mask_margin 0.0635))
    (pad "2" thru_hole circle (at -3.81 -6.35 270) (size 1.3887 1.3887) (drill 0.7887) (layers "*.Cu" "*.Mask")
      (net 5 "Net-(IC1-1A)") (pinfunction "1A") (pintype "input") (solder_mask_margin 0.0635))
    (pad "3" thru_hole circle (at -3.81 -3.81 270) (size 1.3887 1.3887) (drill 0.7887) (layers "*.Cu" "*.Mask")
      (net 6 "Net-(IC1-1Y)") (pinfunction "1Y") (pintype "output") (solder_mask_margin 0.0635))
    (pad "4" thru_hole circle (at -3.81 -1.27 270) (size 1.3887 1.3887) (drill 0.7887) (layers "*.Cu" "*.Mask")
      (net 2 "GND") (pinfunction "GND1") (pintype "power_in") (solder_mask_margin 0.0635))
    (pad "5" thru_hole circle (at -3.81 1.27 270) (size 1.3887 1.3887) (drill 0.7887) (layers "*.Cu" "*.Mask")
      (net 2 "GND") (pinfunction "GND2") (pintype "power_in") (solder_mask_margin 0.0635))
    (pad "6" thru_hole circle (at -3.81 3.81 270) (size 1.3887 1.3887) (drill 0.7887) (layers "*.Cu" "*.Mask")
      (net 7 "Net-(IC1-2Y)") (pinfunction "2Y") (pintype "output") (solder_mask_margin 0.0635))
    (pad "7" thru_hole circle (at -3.81 6.35 270) (size 1.3887 1.3887) (drill 0.7887) (layers "*.Cu" "*.Mask")
      (net 9 "Net-(IC1-2A)") (pinfunction "2A") (pintype "input") (solder_mask_margin 0.0635))
    (pad "8" thru_hole circle (at -3.81 8.89 270) (size 1.3887 1.3887) (drill 0.7887) (layers "*.Cu" "*.Mask")
      (net 10 "+7V") (pinfunction "VCC2") (pintype "power_in") (solder_mask_margin 0.0635))
    (pad "9" thru_hole circle (at 3.81 8.89 270) (size 1.3887 1.3887) (drill 0.7887) (layers "*.Cu" "*.Mask")
      (net 4 "Net-(IC1-1,2EN)") (pinfunction "3,4EN") (pintype "input") (solder_mask_margin 0.0635))
    (pad "10" thru_hole circle (at 3.81 6.35 270) (size 1.3887 1.3887) (drill 0.7887) (layers "*.Cu" "*.Mask")
      (net 11 "Net-(IC1-3A)") (pinfunction "3A") (pintype "input") (solder_mask_margin 0.0635))
    (pad "11" thru_hole circle (at 3.81 3.81 270) (size 1.3887 1.3887) (drill 0.7887) (layers "*.Cu" "*.Mask")
      (net 12 "Net-(IC1-3Y)") (pinfunction "3Y") (pintype "output") (solder_mask_margin 0.0635))
    (pad "12" thru_hole circle (at 3.81 1.27 270) (size 1.3887 1.3887) (drill 0.7887) (layers "*.Cu" "*.Mask")
      (net 2 "GND") (pinfunction "GND3") (pintype "power_in") (solder_mask_margin 0.0635))
    (pad "13" thru_hole circle (at 3.81 -1.27 270) (size 1.3887 1.3887) (drill 0.7887) (layers "*.Cu" "*.Mask")
      (net 2 "GND") (pinfunction "GND4") (pintype "power_in") (solder_mask_margin 0.0635))
    (pad "14" thru_hole circle (at 3.81 -3.81 270) (size 1.3887 1.3887) (drill 0.7887) (layers "*.Cu" "*.Mask")
      (net 15 "Net-(IC1-4Y)") (pinfunction "4Y") (pintype "output") (solder_mask_margin 0.0635))
    (pad "15" thru_hole circle (at 3.81 -6.35 270) (size 1.3887 1.3887) (drill 0.7887) (layers "*.Cu" "*.Mask")
      (net 16 "Net-(IC1-4A)") (pinfunction "4A") (pintype "input") (solder_mask_margin 0.0635))
    (pad "16" thru_hole circle (at 3.81 -8.89 270) (size 1.3887 1.3887) (drill 0.7887) (layers "*.Cu" "*.Mask")
      (net 8 "5V0") (pinfunction "VCC1") (pintype "power_in") (solder_mask_margin 0.0635))
  )
  (footprint "MCU_Shield_RP2040_R6:TE_282834-4" (layer "F.Cu")
    (at 193.675 128.905 -90)
    (property "Sheetfile" "MCU_Shield_RP2040_R6.kicad_sch")
    (property "Sheetname" "MCU_Shield_RP2040_R6_0")
    (fp_text reference "P4" (at -1.905 2.54 90) (layer "F.SilkS"))
    (fp_text value "282834-4" (at -5.56 4.5 90) (layer "F.Fab") hide)
    (pad "1" thru_hole rect (at -3.81 0 270) (size 1.8 1.8) (drill 1.2) (layers "*.Cu" "*.Mask")
      (net 18 "Net-(IC2-1Y)") (pinfunction "1") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 45))
    (pad "2" thru_hole circle (at -1.27 0 270) (size 1.8 1.8) (drill 1.2) (layers "*.Cu" "*.Mask")
      (net 19 "Net-(IC2-2Y)") (pinfunction "2") (pintype "passive") (solder_mask_margin 0.0635))
    (pad "3" thru_hole circle (at 1.27 0 270) (size 1.8 1.8) (drill 1.2) (layers "*.Cu" "*.Mask")
      (net 22 "Net-(IC2-3Y)") (pinfunction "3") (pintype "passive") (solder_mask_margin 0.0635))
    (pad "4" thru_hole circle (at 3.81 0 270) (size 1.8 1.8) (drill 1.2) (layers "*.Cu" "*.Mask")
      (net 23 "Net-(IC2-4Y)") (pinfunction "4") (pintype "passive") (solder_mask_margin 0.0635))
  )
  (footprint "MCU_Shield_RP2040_R6:TE_282834-4" (layer "F.Cu")
    (at 103.505 122.555 90)
    (property "Sheetfile" "MCU_Shield_RP2040_R6.kicad_sch")
    (property "Sheetname" "MCU_Shield_RP2040_R6_0")
    (fp_text reference "P6" (at -3.73 2.8499 90) (layer "F.SilkS"))
    (fp_text value "282834-4" (at -5.56 4.5 90) (layer "F.Fab") hide)
    (pad "1" thru_hole rect (at -3.81 0 90) (size 1.8 1.8) (drill 1.2) (layers "*.Cu" "*.Mask")
      (net 26 "Net-(IC3-1Y)") (pinfunction "1") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 45))
    (pad "2" thru_hole circle (at -1.27 0 90) (size 1.8 1.8) (drill 1.2) (layers "*.Cu" "*.Mask")
      (net 27 "Net-(IC3-2Y)") (pinfunction "2") (pintype "passive") (solder_mask_margin 0.0635))
    (pad "3" thru_hole circle (at 1.27 0 90) (size 1.8 1.8) (drill 1.2) (layers "*.Cu" "*.Mask")
      (net 28 "Net-(IC3-3Y)") (pinfunction "3") (pintype "passive") (solder_mask_margin 0.0635))
    (pad "4" thru_hole circle (at 3.81 0 90) (size 1.8 1.8) (drill 1.2) (layers "*.Cu" "*.Mask")
      (net 29 "Net-(IC3-4Y)") (pinfunction "4") (pintype "passive") (solder_mask_margin 0.0635))
  )
  (footprint "MCU_Shield_RP2040_R6:DIP762W53P254L1980H508Q16B" (layer "F.Cu")
    (at 173.99 128.905 -90)
    (descr "16-DIP, 2.54 mm (0.10 in) pitch, 7.62 mm (0.30 in) span, 19.80 X 6.35 X 5.08 mm body\n <p>16-pin DIP package with 2.54 mm (0.10 in) pitch, 7.62 mm (0.30 in) span with body size 19.80 X 6.35 X 5.08 mm</p>")
    (property "Sheetfile" "MCU_Shield_RP2040_R6.kicad_sch")
    (property "Sheetname" "MCU_Shield_RP2040_R6_0")
    (fp_text reference "IC2" (at 0 6.35 -180) (layer "F.SilkS"))
    (fp_text value "SN754410" (at 0 4.445) (layer "F.Fab"))
    (pad "1" thru_hole circle (at -3.81 -8.89 270) (size 1.3887 1.3887) (drill 0.7887) (layers "*.Cu" "*.Mask")
      (net 4 "Net-(IC1-1,2EN)") (pinfunction "1,2EN") (pintype "input") (solder_mask_margin 0.0635))
    (pad "2" thru_hole circle (at -3.81 -6.35 270) (size 1.3887 1.3887) (drill 0.7887) (layers "*.Cu" "*.Mask")
      (net 17 "Net-(IC2-1A)") (pinfunction "1A") (pintype "input") (solder_mask_margin 0.0635))
    (pad "3" thru_hole circle (at -3.81 -3.81 270) (size 1.3887 1.3887) (drill 0.7887) (layers "*.Cu" "*.Mask")
      (net 18 "Net-(IC2-1Y)") (pinfunction "1Y") (pintype "output") (solder_mask_margin 0.0635))
    (pad "4" thru_hole circle (at -3.81 -1.27 270) (size 1.3887 1.3887) (drill 0.7887) (layers "*.Cu" "*.Mask")
      (net 2 "GND") (pinfunction "GND1") (pintype "power_in") (solder_mask_margin 0.0635))
    (pad "5" thru_hole circle (at -3.81 1.27 270) (size 1.3887 1.3887) (drill 0.7887) (layers "*.Cu" "*.Mask")
      (net 2 "GND") (pinfunction "GND2") (pintype "power_in") (solder_mask_margin 0.0635))
    (pad "6" thru_hole circle (at -3.81 3.81 270) (size 1.3887 1.3887) (drill 0.7887) (layers "*.Cu" "*.Mask")
      (net 19 "Net-(IC2-2Y)") (pinfunction "2Y") (pintype "output") (solder_mask_margin 0.0635))
    (pad "7" thru_hole circle (at -3.81 6.35 270) (size 1.3887 1.3887) (drill 0.7887) (layers "*.Cu" "*.Mask")
      (net 20 "Net-(IC2-2A)") (pinfunction "2A") (pintype "input") (solder_mask_margin 0.0635))
    (pad "8" thru_hole circle (at -3.81 8.89 270) (size 1.3887 1.3887) (drill 0.7887) (layers "*.Cu" "*.Mask")
      (net 10 "+7V") (pinfunction "VCC2") (pintype "power_in") (solder_mask_margin 0.0635))
    (pad "9" thru_hole circle (at 3.81 8.89 270) (size 1.3887 1.3887) (drill 0.7887) (layers "*.Cu" "*.Mask")
      (net 4 "Net-(IC1-1,2EN)") (pinfunction "3,4EN") (pintype "input") (solder_mask_margin 0.0635))
    (pad "10" thru_hole circle (at 3.81 6.35 270) (size 1.3887 1.3887) (drill 0.7887) (layers "*.Cu" "*.Mask")
      (net 21 "Net-(IC2-3A)") (pinfunction "3A") (pintype "input") (solder_mask_margin 0.0635))
    (pad "11" thru_hole circle (at 3.81 3.81 270) (size 1.3887 1.3887) (drill 0.7887) (layers "*.Cu" "*.Mask")
      (net 22 "Net-(IC2-3Y)") (pinfunction "3Y") (pintype "output") (solder_mask_margin 0.0635))
    (pad "12" thru_hole circle (at 3.81 1.27 270) (size 1.3887 1.3887) (drill 0.7887) (layers "*.Cu" "*.Mask")
      (net 2 "GND") (pinfunction "GND3") (pintype "power_in") (solder_mask_margin 0.0635))
    (pad "13" thru_hole circle (at 3.81 -1.27 270) (size 1.3887 1.3887) (drill 0.7887) (layers "*.Cu" "*.Mask")
      (net 2 "GND") (pinfunction "GND4") (pintype "power_in") (solder_mask_margin 0.0635))
    (pad "14" thru_hole circle (at 3.81 -3.81 270) (size 1.3887 1.3887) (drill 0.7887) (layers "*.Cu" "*.Mask")
      (net 23 "Net-(IC2-4Y)") (pinfunction "4Y") (pintype "output") (solder_mask_margin 0.0635))
    (pad "15" thru_hole circle (at 3.81 -6.35 270) (size 1.3887 1.3887) (drill 0.7887) (layers "*.Cu" "*.Mask")
      (net 24 "Net-(IC2-4A)") (pinfunction "4A") (pintype "input") (solder_mask_margin 0.0635))
    (pad "16" thru_hole circle (at 3.81 -8.89 270) (size 1.3887 1.3887) (drill 0.7887) (layers "*.Cu" "*.Mask")
      (net 8 "5V0") (pinfunction "VCC1") (pintype "power_in") (solder_mask_margin 0.0635))
  )
  (footprint "MCU_Shield_RP2040_R6:TE_282834-2" (layer "F.Cu")
    (at 193.675 80.645 -90)
    (property "Sheetfile" "MCU_Shield_RP2040_R6.kicad_sch")
    (property "Sheetname" "MCU_Shield_RP2040_R6_0")
    (fp_text reference "P18" (at -1.27 1.905 -270) (layer "F.SilkS"))
    (fp_text value "282834-2" (at -3.02 4.5 90) (layer "F.Fab") hide)
    (pad "1" thru_hole rect (at -1.27 0 270) (size 1.8 1.8) (drill 1.2) (layers "*.Cu" "*.Mask")
      (net 42 "Net-(P17-Pad1)") (pinfunction "1") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 45))
    (pad "2" thru_hole circle (at 1.27 0 270) (size 1.8 1.8) (drill 1.2) (layers "*.Cu" "*.Mask")
      (net 8 "5V0") (pinfunction "2") (pintype "passive") (solder_mask_margin 0.0635))
  )
  (footprint "MCU_Shield_RP2040_R6:TE_282834-4" (layer "F.Cu")
    (at 193.675 117.475 -90)
    (property "Sheetfile" "MCU_Shield_RP2040_R6.kicad_sch")
    (property "Sheetname" "MCU_Shield_RP2040_R6_0")
    (fp_text reference "P2" (at -3.73 2.8499 90) (layer "F.SilkS"))
    (fp_text value "282834-4" (at -5.56 4.5 -90) (layer "F.Fab") hide)
    (pad "1" thru_hole rect (at -3.81 0 270) (size 1.8 1.8) (drill 1.2) (layers "*.Cu" "*.Mask")
      (net 6 "Net-(IC1-1Y)") (pinfunction "1") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 45))
    (pad "2" thru_hole circle (at -1.27 0 270) (size 1.8 1.8) (drill 1.2) (layers "*.Cu" "*.Mask")
      (net 7 "Net-(IC1-2Y)") (pinfunction "2") (pintype "passive") (solder_mask_margin 0.0635))
    (pad "3" thru_hole circle (at 1.27 0 270) (size 1.8 1.8) (drill 1.2) (layers "*.Cu" "*.Mask")
      (net 12 "Net-(IC1-3Y)") (pinfunction "3") (pintype "passive") (solder_mask_margin 0.0635))
    (pad "4" thru_hole circle (at 3.81 0 270) (size 1.8 1.8) (drill 1.2) (layers "*.Cu" "*.Mask")
      (net 15 "Net-(IC1-4Y)") (pinfunction "4") (pintype "passive") (solder_mask_margin 0.0635))
  )
  (footprint "MCU_Shield_RP2040_R6:TE_282834-2" (layer "F.Cu")
    (at 193.675 74.295 -90)
    (property "Sheetfile" "MCU_Shield_RP2040_R6.kicad_sch")
    (property "Sheetname" "MCU_Shield_RP2040_R6_0")
    (fp_text reference "P19" (at -1.27 1.905 -270) (layer "F.SilkS"))
    (fp_text value "282834-2" (at -3.02 4.5 90) (layer "F.Fab") hide)
    (pad "1" thru_hole rect (at -1.27 0 270) (size 1.8 1.8) (drill 1.2) (layers "*.Cu" "*.Mask")
      (net 42 "Net-(P17-Pad1)") (pinfunction "1") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 45))
    (pad "2" thru_hole circle (at 1.27 0 270) (size 1.8 1.8) (drill 1.2) (layers "*.Cu" "*.Mask")
      (net 8 "5V0") (pinfunction "2") (pintype "passive") (solder_mask_margin 0.0635))
  )
  (footprint "MCU_Shield_RP2040_R6:SC0915_RPI" (layer "F.Cu")
    (at 146.009359 90.805)
    (property "Sheetfile" "MCU_Shield_RP2040_R6.kicad_sch")
    (property "Sheetname" "MCU_Shield_RP2040_R6_0")
    (fp_text reference "U1" (at -3.2766 0.635) (layer "F.Fab"))
    (fp_text value "SC0915" (at -3.134359 2.54) (layer "F.SilkS"))
    (pad "1" smd rect (at -9.6901 -24.13) (size 3.2004 1.6002) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 67 "unconnected-(U1-UART0_TX{slash}I2C0_SDA{slash}SPI0_RX{slash}GP0-Pad1)") (pinfunction "UART0_TX/I2C0_SDA/SPI0_RX/GP0") (pintype "bidirectional") (solder_mask_margin 0.0635) (thermal_bridge_angle 45))
    (pad "2" smd rect (at -9.6901 -21.59) (size 3.2004 1.6002) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 66 "unconnected-(U1-UART0_RX{slash}I2C0_SCL{slash}GPI0_CSN{slash}GP1-Pad2)") (pinfunction "UART0_RX/I2C0_SCL/GPI0_CSN/GP1") (pintype "bidirectional") (solder_mask_margin 0.0635) (thermal_bridge_angle 45))
    (pad "3" smd rect (at -9.6901 -19.05) (size 3.2004 1.6002) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "GND") (pinfunction "GND_2") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 45))
    (pad "4" smd rect (at -9.6901 -16.51) (size 3.2004 1.6002) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 43 "Net-(U1-I2C1_SDA{slash}SPI0_SCK{slash}GP2)") (pinfunction "I2C1_SDA/SPI0_SCK/GP2") (pintype "bidirectional") (solder_mask_margin 0.0635) (thermal_bridge_angle 45))
    (pad "5" smd rect (at -9.6901 -13.97) (size 3.2004 1.6002) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 44 "Net-(U1-I2C1_SCL{slash}SPI0_TX{slash}GP3)") (pinfunction "I2C1_SCL/SPI0_TX/GP3") (pintype "bidirectional") (solder_mask_margin 0.0635) (thermal_bridge_angle 45))
    (pad "6" smd rect (at -9.6901 -11.43) (size 3.2004 1.6002) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 65 "unconnected-(U1-UART1_TX{slash}I2C0_SDA{slash}SPI0_RX{slash}GP4-Pad6)") (pinfunction "UART1_TX/I2C0_SDA/SPI0_RX/GP4") (pintype "bidirectional") (solder_mask_margin 0.0635) (thermal_bridge_angle 45))
    (pad "7" smd rect (at -9.6901 -8.89) (size 3.2004 1.6002) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 3 "Net-(U1-UART1_RX{slash}I2C0_SCL{slash}SPI0_CSN{slash}GP5)") (pinfunction "UART1_RX/I2C0_SCL/SPI0_CSN/GP5") (pintype "bidirectional") (solder_mask_margin 0.0635) (thermal_bridge_angle 45))
    (pad "8" smd rect (at -9.6901 -6.35) (size 3.2004 1.6002) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "GND") (pinfunction "GND_3") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 45))
    (pad "9" smd rect (at -9.6901 -3.81) (size 3.2004 1.6002) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 17 "Net-(IC2-1A)") (pinfunction "I2C1_SDA/SPI0_SCK/GP6") (pintype "bidirectional") (solder_mask_margin 0.0635) (thermal_bridge_angle 45))
    (pad "10" smd rect (at -9.6901 -1.27) (size 3.2004 1.6002) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 20 "Net-(IC2-2A)") (pinfunction "I2C1_SCL/SPI0_TX/GP7") (pintype "bidirectional") (solder_mask_margin 0.0635) (thermal_bridge_angle 45))
    (pad "11" smd rect (at -9.6901 1.27) (size 3.2004 1.6002) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 21 "Net-(IC2-3A)") (pinfunction "UART1_TX/I2C0_SDA/SPI1_RX/GP8") (pintype "bidirectional") (solder_mask_margin 0.0635) (thermal_bridge_angle 45))
    (pad "12" smd rect (at -9.6901 3.81) (size 3.2004 1.6002) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 24 "Net-(IC2-4A)") (pinfunction "UART1_RX/I2C0_SCL/SPI1_CSN/GP9") (pintype "bidirectional") (solder_mask_margin 0.0635) (thermal_bridge_angle 45))
    (pad "13" smd rect (at -9.6901 6.35) (size 3.2004 1.6002) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "GND") (pinfunction "GND_4") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 45))
    (pad "14" smd rect (at -9.6901 8.89) (size 3.2004 1.6002) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 37 "Net-(U1-I2C1_SDA{slash}SPI1_SCK{slash}GP10)") (pinfunction "I2C1_SDA/SPI1_SCK/GP10") (pintype "bidirectional") (solder_mask_margin 0.0635) (thermal_bridge_angle 45))
    (pad "15" smd rect (at -9.6901 11.43) (size 3.2004 1.6002) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 38 "Net-(U1-I2C1_SCL{slash}SPI1_TX{slash}GP11)") (pinfunction "I2C1_SCL/SPI1_TX/GP11") (pintype "bidirectional") (solder_mask_margin 0.0635) (thermal_bridge_angle 45))
    (pad "16" smd rect (at -9.6901 13.97) (size 3.2004 1.6002) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 35 "Net-(U1-UART0_TX{slash}I2C0_SDA{slash}GPI1_RX{slash}GP12)") (pinfunction "UART0_TX/I2C0_SDA/GPI1_RX/GP12") (pintype "bidirectional") (solder_mask_margin 0.0635) (thermal_bridge_angle 45))
    (pad "17" smd rect (at -9.6901 16.51) (size 3.2004 1.6002) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 36 "Net-(U1-UART0_RX{slash}I2C0_SCL{slash}SPI1_CSN{slash}GP13)") (pinfunction "UART0_RX/I2C0_SCL/SPI1_CSN/GP13") (pintype "bidirectional") (solder_mask_margin 0.0635) (thermal_bridge_angle 45))
    (pad "18" smd rect (at -9.6901 19.05) (size 3.2004 1.6002) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "GND") (pinfunction "GND_5") (pintype "passive") (solder_mask_margin 0.0635) (zone_connect 2) (thermal_bridge_angle 45))
    (pad "19" smd rect (at -9.6901 21.59) (size 3.2004 1.6002) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 5 "Net-(IC1-1A)") (pinfunction "I2C1_SDA/SPI1_SCK/GP14") (pintype "bidirectional") (solder_mask_margin 0.0635) (thermal_bridge_angle 45))
    (pad "20" smd rect (at -9.6901 24.13) (size 3.2004 1.6002) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 9 "Net-(IC1-2A)") (pinfunction "I2C1_SCL/SPI1_TX/GP15") (pintype "bidirectional") (solder_mask_margin 0.0635) (thermal_bridge_angle 45))
    (pad "21" smd rect (at 9.6901 24.13 180) (size 3.2004 1.6002) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 11 "Net-(IC1-3A)") (pinfunction "UART0_TX/I2C0_SDA/SPI0_RX/GP16") (pintype "bidirectional") (solder_mask_margin 0.0635) (thermal_bridge_angle 45))
    (pad "22" smd rect (at 9.6901 21.59 180) (size 3.2004 1.6002) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 16 "Net-(IC1-4A)") (pinfunction "UART0_RX/I2C0_SCL/SPI0_CSN/GP17") (pintype "bidirectional") (solder_mask_margin 0.0635) (thermal_bridge_angle 45))
    (pad "23" smd rect (at 9.6901 19.05 180) (size 3.2004 1.6002) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "GND") (pinfunction "GND_6") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 45))
    (pad "24" smd rect (at 9.6901 16.51 180) (size 3.2004 1.6002) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 64 "unconnected-(U1-I2C1_SDA{slash}SPI0_SCK{slash}GP18-Pad24)") (pinfunction "I2C1_SDA/SPI0_SCK/GP18") (pintype "bidirectional") (solder_mask_margin 0.0635) (thermal_bridge_angle 45))
    (pad "25" smd rect (at 9.6901 13.97 180) (size 3.2004 1.6002) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 25 "Net-(IC3-1,2EN)") (pinfunction "I2C1_SCL/SPI0_TX/GP19") (pintype "bidirectional") (solder_mask_margin 0.0635) (thermal_bridge_angle 45))
    (pad "26" smd rect (at 9.6901 11.43 180) (size 3.2004 1.6002) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 4 "Net-(IC1-1,2EN)") (pinfunction "I2C0_SDA/GP20") (pintype "bidirectional") (solder_mask_margin 0.0635) (thermal_bridge_angle 45))
    (pad "27" smd rect (at 9.6901 8.89 180) (size 3.2004 1.6002) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 63 "unconnected-(U1-I2C0_SCL{slash}GP21-Pad27)") (pinfunction "I2C0_SCL/GP21") (pintype "bidirectional") (solder_mask_margin 0.0635) (thermal_bridge_angle 45))
    (pad "28" smd rect (at 9.6901 6.35 180) (size 3.2004 1.6002) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "GND") (pinfunction "GND_7") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 45))
    (pad "29" smd rect (at 9.6901 3.81 180) (size 3.2004 1.6002) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 62 "unconnected-(U1-GP22-Pad29)") (pinfunction "GP22") (pintype "bidirectional") (solder_mask_margin 0.0635) (thermal_bridge_angle 45))
    (pad "30" smd rect (at 9.6901 1.27 180) (size 3.2004 1.6002) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 61 "unconnected-(U1-RUN-Pad30)") (pinfunction "RUN") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 45))
    (pad "31" smd rect (at 9.6901 -1.27 180) (size 3.2004 1.6002) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 60 "unconnected-(U1-I2C1_SDA{slash}ADC0{slash}GP26-Pad31)") (pinfunction "I2C1_SDA/ADC0/GP26") (pintype "bidirectional") (solder_mask_margin 0.0635) (thermal_bridge_angle 45))
    (pad "32" smd rect (at 9.6901 -3.81 180) (size 3.2004 1.6002) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 59 "unconnected-(U1-I2C1_SCL{slash}ADC1{slash}GP27-Pad32)") (pinfunction "I2C1_SCL/ADC1/GP27") (pintype "bidirectional") (solder_mask_margin 0.0635) (thermal_bridge_angle 45))
    (pad "33" smd rect (at 9.6901 -6.35 180) (size 3.2004 1.6002) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "GND") (pinfunction "AGND/GND") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 45))
    (pad "34" smd rect (at 9.6901 -8.89 180) (size 3.2004 1.6002) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 58 "unconnected-(U1-ADC2{slash}GP28-Pad34)") (pinfunction "ADC2/GP28") (pintype "bidirectional") (solder_mask_margin 0.0635) (thermal_bridge_angle 45))
    (pad "35" smd rect (at 9.6901 -11.43 180) (size 3.2004 1.6002) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 14 "ADC_VREF") (pinfunction "ADC_VREF") (pintype "power_in") (solder_mask_margin 0.0635) (thermal_bridge_angle 45))
    (pad "36" smd rect (at 9.6901 -13.97 180) (size 3.2004 1.6002) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 34 "Net-(U1-3V3(OUT))") (pinfunction "3V3(OUT)") (pintype "output") (solder_mask_margin 0.0635) (thermal_bridge_angle 45))
    (pad "37" smd rect (at 9.6901 -16.51 180) (size 3.2004 1.6002) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "3V3_EN") (pinfunction "3V3_EN") (pintype "power_in") (solder_mask_margin 0.0635) (thermal_bridge_angle 45))
    (pad "38" smd rect (at 9.6901 -19.05 180) (size 3.2004 1.6002) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "GND") (pinfunction "GND_8") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 45))
    (pad "39" smd rect (at 9.6901 -21.59 180) (size 3.2004 1.6002) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 13 "VSYS") (pinfunction "VSYS") (pintype "power_in") (solder_mask_margin 0.0635) (thermal_bridge_angle 45))
    (pad "40" smd rect (at 9.6901 -24.13 180) (size 3.2004 1.6002) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 45 "VBUS") (pinfunction "VBUS") (pintype "power_in") (solder_mask_margin 0.0635) (thermal_bridge_angle 45))
    (pad "A" smd rect (at -2.725418 -24.000459) (size 1.0922 1.8034) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 52 "unconnected-(U1-GND_11-PadA)") (pinfunction "GND_11") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 45))
    (pad "B" smd rect (at 2.725418 -24.000459) (size 1.0922 1.8034) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 51 "unconnected-(U1-GND_12-PadB)") (pinfunction "GND_12") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 45))
    (pad "C" smd rect (at -2.4257 -20.97024) (size 1.0414 1.4478) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 50 "unconnected-(U1-GND_13-PadC)") (pinfunction "GND_13") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 45))
    (pad "D" smd rect (at 2.4257 -20.97024) (size 1.0414 1.4478) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 49 "unconnected-(U1-GND-PadD)") (pinfunction "GND") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 45))
    (pad "D1" smd rect (at -2.54 24.698959 90) (size 3.2004 1.6002) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 48 "unconnected-(U1-SWCLK-PadD1)") (pinfunction "SWCLK") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 45))
    (pad "D2" smd rect (at 0 24.698959 90) (size 3.2004 1.6002) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "GND") (pinfunction "GND_9") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 45))
    (pad "D3" smd rect (at 2.54 24.698959 90) (size 3.2004 1.6002) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 47 "unconnected-(U1-SWDIO-PadD3)") (pinfunction "SWDIO") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 45))
    (pad "TP1" smd rect (at 0 -21.000718) (size 1.4986 1.4986) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 46 "unconnected-(U1-GND_10-PadTP1)") (pinfunction "GND_10") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 45))
    (pad "TP2" smd rect (at 1.000759 -24.300181) (size 1.4986 1.4986) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 57 "unconnected-(U1-USB_DM-PadTP2)") (pinfunction "USB_DM") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 45))
    (pad "TP3" smd rect (at -1.000759 -24.300181) (size 1.4986 1.4986) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 56 "unconnected-(U1-USB_DP-PadTP3)") (pinfunction "USB_DP") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 45))
    (pad "TP4" smd rect (at -2.499359 -17.5006) (size 1.4986 1.4986) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 55 "unconnected-(U1-GPIO{slash}SMPS-PadTP4)") (pinfunction "GPIO/SMPS") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 45))
    (pad "TP5" smd rect (at -2.499359 -15.00124) (size 1.4986 1.4986) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 54 "unconnected-(U1-GPIO25{slash}LED-PadTP5)") (pinfunction "GPIO25/LED") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 45))
    (pad "TP6" smd rect (at -2.499359 -12.501881) (size 1.4986 1.4986) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 53 "unconnected-(U1-BOOTSEL-PadTP6)") (pinfunction "BOOTSEL") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 45))
  )
  (footprint "MCU_Shield_RP2040_R6:TE_282834-2" (layer "F.Cu")
    (at 103.505 86.995 90)
    (property "Sheetfile" "MCU_Shield_RP2040_R6.kicad_sch")
    (property "Sheetname" "MCU_Shield_RP2040_R6_0")
    (fp_text reference "P11" (at -1.73 2.54 90) (layer "F.SilkS"))
    (fp_text value "282834-2" (at -3.02 4.5 90) (layer "F.Fab") hide)
    (pad "1" thru_hole rect (at -1.27 0 90) (size 1.8 1.8) (drill 1.2) (layers "*.Cu" "*.Mask")
      (net 40 "Net-(P11-Pad1)") (pinfunction "1") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 45))
    (pad "2" thru_hole circle (at 1.27 0 90) (size 1.8 1.8) (drill 1.2) (layers "*.Cu" "*.Mask")
      (net 8 "5V0") (pinfunction "2") (pintype "passive") (solder_mask_margin 0.0635))
  )
  (footprint "MCU_Shield_RP2040_R6:TE_282834-2" (layer "F.Cu")
    (at 103.505 106.045 90)
    (property "Sheetfile" "MCU_Shield_RP2040_R6.kicad_sch")
    (property "Sheetname" "MCU_Shield_RP2040_R6_0")
    (fp_text reference "P8" (at -1.27 2.54 90) (layer "F.SilkS"))
    (fp_text value "282834-2" (at -3.02 4.5 90) (layer "F.Fab") hide)
    (pad "1" thru_hole rect (at -1.27 0 90) (size 1.8 1.8) (drill 1.2) (layers "*.Cu" "*.Mask")
      (net 39 "Net-(P10-Pad1)") (pinfunction "1") (pintype "passive") (solder_mask_margin 0.0635) (thermal_bridge_angle 45))
    (pad "2" thru_hole circle (at 1.27 0 90) (size 1.8 1.8) (drill 1.2) (layers "*.Cu" "*.Mask")
      (net 8 "5V0") (pinfunction "2") (pintype "passive") (solder_mask_margin 0.0635))
  )
  (footprint "" (layer "F.Cu")
    (at 193.5861 142.24)
    (fp_text reference "@HOLE5" (at 0 0) (layer "F.SilkS") hide)
    (fp_text value "" (at 0 0) (layer "F.SilkS"))
    (pad "" np_thru_hole circle (at 0 0) (size 3.175 3.175) (drill 3.175) (layers "*.Cu" "*.Mask"))
  )
  (footprint "" (layer "F.Cu")
    (at 103.505 142.24)
    (fp_text reference "@HOLE3" (at 0 0) (layer "F.SilkS") hide)
    (fp_text value "" (at 0 0) (layer "F.SilkS"))
    (pad "" np_thru_hole circle (at 0 0) (size 3.175 3.175) (drill 3.175) (layers "*.Cu" "*.Mask"))
  )
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