(kicad_pcb (version 20211014) (generator pcbnew)
  (general
    (thickness 1.6)
  )
  (paper "A4")
  (layers
    (0 "F.Cu" signal)
    (31 "B.Cu" signal)
    (32 "B.Adhes" user "B.Adhesive")
    (33 "F.Adhes" user "F.Adhesive")
    (34 "B.Paste" user)
    (35 "F.Paste" user)
    (36 "B.SilkS" user "B.Silkscreen")
    (37 "F.SilkS" user "F.Silkscreen")
    (38 "B.Mask" user)
    (39 "F.Mask" user)
    (40 "Dwgs.User" user "User.Drawings")
    (41 "Cmts.User" user "User.Comments")
    (42 "Eco1.User" user "User.Eco1")
    (43 "Eco2.User" user "User.Eco2")
    (44 "Edge.Cuts" user)
    (45 "Margin" user)
    (46 "B.CrtYd" user "B.Courtyard")
    (47 "F.CrtYd" user "F.Courtyard")
    (48 "B.Fab" user)
    (49 "F.Fab" user)
    (50 "User.1" user)
    (51 "User.2" user)
    (52 "User.3" user)
    (53 "User.4" user)
    (54 "User.5" user)
    (55 "User.6" user)
    (56 "User.7" user)
    (57 "User.8" user)
    (58 "User.9" user)
  )
  (setup
    (stackup
      (layer "F.SilkS" (type "Top Silk Screen"))
      (layer "F.Paste" (type "Top Solder Paste"))
      (layer "F.Mask" (type "Top Solder Mask") (thickness 0.01))
      (layer "F.Cu" (type "copper") (thickness 0.035))
      (layer "dielectric 1" (type "core") (thickness 1.51) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
      (layer "B.Cu" (type "copper") (thickness 0.035))
      (layer "B.Mask" (type "Bottom Solder Mask") (thickness 0.01))
      (layer "B.Paste" (type "Bottom Solder Paste"))
      (layer "B.SilkS" (type "Bottom Silk Screen"))
      (copper_finish "None")
      (dielectric_constraints no)
    )
    (pad_to_mask_clearance 0)
    (pcbplotparams
      (layerselection 0x00010fc_ffffffff)
      (disableapertmacros false)
      (usegerberextensions false)
      (usegerberattributes true)
      (usegerberadvancedattributes true)
      (creategerberjobfile true)
      (svguseinch false)
      (svgprecision 6)
      (excludeedgelayer true)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (dxfpolygonmode true)
      (dxfimperialunits true)
      (dxfusepcbnewfont true)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (sketchpadsonfab false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 1)
      (scaleselection 1)
      (outputdirectory "")
    )
  )
  (net 0 "")
  (net 1 "Net-(D1-Pad1)")
  (net 2 "Net-(D1-Pad2)")
  (net 3 "/PACK-")
  (net 4 "/CSG")
  (net 5 "/DSG")
  (net 6 "unconnected-(J1-Pad4)")
  (net 7 "unconnected-(J1-Pad5)")
  (net 8 "/SRN_out")
  (net 9 "Net-(Q1-Pad1)")
  (net 10 "Net-(Q1-Pad2)")
  (net 11 "GND")
  (footprint "MountingHole:MountingHole_2.7mm_M2.5_ISO7380" (layer "F.Cu")
    (tedit 56D1B4CB)
    (at 78.74 53.34)
    (descr "Mounting Hole 2.7mm, no annular, M2.5, ISO7380")
    (tags "mounting hole 2.7mm no annular m2.5 iso7380")
    (attr exclude_from_pos_files exclude_from_bom)
    (fp_text reference "REF**" (at 0 -3.25) (layer "F.SilkS") hide)
    (fp_text value "MountingHole_2.7mm_M2.5_ISO7380" (at 0 3.25) (layer "F.Fab") hide)
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab") hide)
    (pad "" np_thru_hole circle (at 0 0) (size 2.7 2.7) (drill 2.7) (layers *.Cu *.Mask))
  )
  (footprint "Package_TO_SOT_THT:TO-247-3_Vertical" (layer "F.Cu")
    (tedit 5AC86DC3)
    (at 95.84 71.59 90)
    (descr "TO-247-3, Vertical, RM 5.45mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html")
    (tags "TO-247-3 Vertical RM 5.45mm")
    (property "Sheetfile" "simpleBMS_powerModule.kicad_sch")
    (property "Sheetname" "")
    (attr through_hole)
    (fp_text reference "Q2" (at -3.68 -2.46 90) (layer "F.SilkS"))
    (fp_text value "Q_NMOS_GDS" (at 5.45 3.95 90) (layer "F.Fab") hide)
    (fp_text user "${REFERENCE}" (at -0.25 -3.29 90) (layer "F.Fab") hide)
    (pad "1" thru_hole rect (at 0 0 90) (size 2.5 4.5) (drill 1.5) (layers *.Cu *.Mask)
      (net 1 "Net-(D1-Pad1)") (pinfunction "G") (pintype "input"))
    (pad "2" thru_hole oval (at 5.45 0 90) (size 2.5 4.5) (drill 1.5) (layers *.Cu *.Mask)
      (net 10 "Net-(Q1-Pad2)") (pinfunction "D") (pintype "passive") (zone_connect 2))
    (pad "3" thru_hole oval (at 10.9 0 90) (size 2.5 4.5) (drill 1.5) (layers *.Cu *.Mask)
      (net 3 "/PACK-") (pinfunction "S") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Package_TO_SOT_THT.3dshapes/TO-247-3_Vertical.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "MountingHole:MountingHole_2.7mm_M2.5_ISO7380" (layer "F.Cu")
    (tedit 56D1B4CB)
    (at 78.74 80.01)
    (descr "Mounting Hole 2.7mm, no annular, M2.5, ISO7380")
    (tags "mounting hole 2.7mm no annular m2.5 iso7380")
    (attr exclude_from_pos_files exclude_from_bom)
    (fp_text reference "REF**" (at 0 -3.25) (layer "F.SilkS") hide)
    (fp_text value "MountingHole_2.7mm_M2.5_ISO7380" (at 0 3.25) (layer "F.Fab") hide)
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab") hide)
    (pad "" np_thru_hole circle (at 0 0) (size 2.7 2.7) (drill 2.7) (layers *.Cu *.Mask))
  )
  (footprint "Connector_PinSocket_2.54mm:PinSocket_1x07_P2.54mm_Horizontal" (layer "F.Cu")
    (tedit 5A19A42A)
    (at 99.66 53.34 -90)
    (descr "Through hole angled socket strip, 1x07, 2.54mm pitch, 8.51mm socket length, single row (from Kicad 4.0.7), script generated")
    (tags "Through hole angled socket strip THT 1x07 2.54mm single row")
    (property "Sheetfile" "simpleBMS_powerModule.kicad_sch")
    (property "Sheetname" "")
    (attr through_hole)
    (fp_text reference "J1" (at -4.38 -2.77 90) (layer "F.SilkS") hide)
    (fp_text value "To Upper" (at 2.63 4.55) (layer "F.SilkS"))
    (fp_text user "${REFERENCE}" (at -5.775 7.62) (layer "F.Fab"))
    (pad "1" thru_hole rect (at 0 0 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 3 "/PACK-") (pinfunction "Pin_1") (pintype "passive"))
    (pad "2" thru_hole oval (at 0 2.54 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 4 "/CSG") (pinfunction "Pin_2") (pintype "passive"))
    (pad "3" thru_hole oval (at 0 5.08 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 5 "/DSG") (pinfunction "Pin_3") (pintype "passive"))
    (pad "4" thru_hole oval (at 0 7.62 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 6 "unconnected-(J1-Pad4)") (pinfunction "Pin_4") (pintype "passive+no_connect"))
    (pad "5" thru_hole oval (at 0 10.16 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 7 "unconnected-(J1-Pad5)") (pinfunction "Pin_5") (pintype "passive+no_connect"))
    (pad "6" thru_hole oval (at 0 12.7 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 11 "GND") (pinfunction "Pin_6") (pintype "passive"))
    (pad "7" thru_hole oval (at 0 15.24 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 8 "/SRN_out") (pinfunction "Pin_7") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Connector_PinSocket_2.54mm.3dshapes/PinSocket_1x07_P2.54mm_Horizontal.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "MountingHole:MountingHole_2.7mm_M2.5_ISO7380" (layer "F.Cu")
    (tedit 56D1B4CB)
    (at 105.41 53.34)
    (descr "Mounting Hole 2.7mm, no annular, M2.5, ISO7380")
    (tags "mounting hole 2.7mm no annular m2.5 iso7380")
    (attr exclude_from_pos_files exclude_from_bom)
    (fp_text reference "REF**" (at 0 -3.25) (layer "F.SilkS") hide)
    (fp_text value "MountingHole_2.7mm_M2.5_ISO7380" (at 0 3.25) (layer "F.Fab") hide)
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab") hide)
    (pad "" np_thru_hole circle (at 0 0) (size 2.7 2.7) (drill 2.7) (layers *.Cu *.Mask))
  )
  (footprint "TerminalBlock_Keystone:7784" (layer "F.Cu")
    (tedit 0)
    (at 79.75 65.85 90)
    (property "Sheetfile" "simpleBMS_powerModule.kicad_sch")
    (property "Sheetname" "")
    (attr through_hole)
    (fp_text reference "H1" (at 0 -0.5 90 unlocked) (layer "F.SilkS") hide)
    (fp_text value "MountingHole_Pad" (at 0 1 270 unlocked) (layer "F.Fab") hide)
    (pad "1" thru_hole circle (at -3.96 0 90) (size 2.3 2.3) (drill 1.7) (layers *.Cu *.Mask)
      (net 11 "GND") (pinfunction "1") (pintype "input"))
    (pad "1" thru_hole circle (at 3.96 0 90) (size 2.3 2.3) (drill 1.7) (layers *.Cu *.Mask)
      (net 11 "GND") (pinfunction "1") (pintype "input"))
  )
  (footprint "Connector:TERM BLOCK 1POS SIDE ENTRY 1704836" (layer "F.Cu")
    (tedit 0)
    (at 79.8 65.74 180)
    (property "Sheetfile" "simpleBMS_powerModule.kicad_sch")
    (property "Sheetname" "")
    (attr through_hole)
    (fp_text reference "J2" (at 0 -0.5 180 unlocked) (layer "F.SilkS") hide)
    (fp_text value "Cells" (at -0.05 8.48 unlocked) (layer "F.SilkS"))
    (pad "1" thru_hole circle (at 2.6 6.25 180) (size 1.8 1.8) (drill 1.3) (layers *.Cu *.Mask)
      (net 11 "GND") (pinfunction "Pin_1") (pintype "passive") (zone_connect 2))
    (pad "1" thru_hole circle (at 2.6 -6.25 270) (size 1.8 1.8) (drill 1.3) (layers *.Cu *.Mask)
      (net 11 "GND") (pinfunction "Pin_1") (pintype "passive") (zone_connect 2))
    (pad "1" thru_hole circle (at -2.6 -6.25) (size 1.8 1.8) (drill 1.3) (layers *.Cu *.Mask)
      (net 11 "GND") (pinfunction "Pin_1") (pintype "passive") (zone_connect 2))
    (pad "1" thru_hole circle (at -2.6 6.25 270) (size 1.8 1.8) (drill 1.3) (layers *.Cu *.Mask)
      (net 11 "GND") (pinfunction "Pin_1") (pintype "passive") (zone_connect 2))
  )
  (footprint "Package_TO_SOT_THT:TO-247-3_Vertical" (layer "F.Cu")
    (tedit 5AC86DC3)
    (at 87.94 60.69 -90)
    (descr "TO-247-3, Vertical, RM 5.45mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html")
    (tags "TO-247-3 Vertical RM 5.45mm")
    (property "Sheetfile" "simpleBMS_powerModule.kicad_sch")
    (property "Sheetname" "")
    (attr through_hole)
    (fp_text reference "Q1" (at 14.5 -2.66 90) (layer "F.SilkS"))
    (fp_text value "Q_NMOS_GDS" (at 5.12 3.21 90) (layer "F.Fab") hide)
    (fp_text user "${REFERENCE}" (at -0.06 -3.28 90) (layer "F.Fab") hide)
    (pad "1" thru_hole rect (at 0 0 270) (size 2.5 4.5) (drill 1.5) (layers *.Cu *.Mask)
      (net 9 "Net-(Q1-Pad1)") (pinfunction "G") (pintype "input"))
    (pad "2" thru_hole oval (at 5.45 0 270) (size 2.5 4.5) (drill 1.5) (layers *.Cu *.Mask)
      (net 10 "Net-(Q1-Pad2)") (pinfunction "D") (pintype "passive") (zone_connect 2))
    (pad "3" thru_hole oval (at 10.9 0 270) (size 2.5 4.5) (drill 1.5) (layers *.Cu *.Mask)
      (net 8 "/SRN_out") (pinfunction "S") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Package_TO_SOT_THT.3dshapes/TO-247-3_Vertical.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "TerminalBlock_Keystone:7784" (layer "F.Cu")
    (tedit 0)
    (at 104.648 66.1 90)
    (property "Sheetfile" "simpleBMS_powerModule.kicad_sch")
    (property "Sheetname" "")
    (attr through_hole)
    (fp_text reference "H2" (at 0 -0.5 90 unlocked) (layer "F.SilkS") hide)
    (fp_text value "Load" (at 9.204 -0.16 unlocked) (layer "F.SilkS"))
    (pad "1" thru_hole circle (at 3.96 0 90) (size 2.3 2.3) (drill 1.7) (layers *.Cu *.Mask)
      (net 3 "/PACK-") (pinfunction "1") (pintype "input"))
    (pad "1" thru_hole circle (at -3.96 0 90) (size 2.3 2.3) (drill 1.7) (layers *.Cu *.Mask)
      (net 3 "/PACK-") (pinfunction "1") (pintype "input"))
  )
  (footprint "Connector:TERM BLOCK 1POS SIDE ENTRY 1704836" (layer "F.Cu")
    (tedit 0)
    (at 104.21 65.74 180)
    (property "Sheetfile" "simpleBMS_powerModule.kicad_sch")
    (property "Sheetname" "")
    (attr through_hole)
    (fp_text reference "J3" (at 0 -0.5 180 unlocked) (layer "F.SilkS") hide)
    (fp_text value "Conn_01x01_Male" (at 0 12.7 180 unlocked) (layer "F.Fab") hide)
    (pad "1" thru_hole circle (at -2.6 6.25 270) (size 1.8 1.8) (drill 1.3) (layers *.Cu *.Mask)
      (net 3 "/PACK-") (pinfunction "Pin_1") (pintype "passive") (zone_connect 2))
    (pad "1" thru_hole circle (at 2.6 6.25 180) (size 1.8 1.8) (drill 1.3) (layers *.Cu *.Mask)
      (net 3 "/PACK-") (pinfunction "Pin_1") (pintype "passive") (zone_connect 2))
    (pad "1" thru_hole circle (at 2.6 -6.25 270) (size 1.8 1.8) (drill 1.3) (layers *.Cu *.Mask)
      (net 3 "/PACK-") (pinfunction "Pin_1") (pintype "passive") (zone_connect 2))
    (pad "1" thru_hole circle (at -2.6 -6.25) (size 1.8 1.8) (drill 1.3) (layers *.Cu *.Mask)
      (net 3 "/PACK-") (pinfunction "Pin_1") (pintype "passive") (zone_connect 2))
  )
  (footprint "MountingHole:MountingHole_2.7mm_M2.5_ISO7380" (layer "F.Cu")
    (tedit 56D1B4CB)
    (at 105.41 80.01)
    (descr "Mounting Hole 2.7mm, no annular, M2.5, ISO7380")
    (tags "mounting hole 2.7mm no annular m2.5 iso7380")
    (attr exclude_from_pos_files exclude_from_bom)
    (fp_text reference "REF**" (at 0 -3.25) (layer "F.SilkS") hide)
    (fp_text value "MountingHole_2.7mm_M2.5_ISO7380" (at 0 3.25) (layer "F.Fab") hide)
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab") hide)
    (pad "" np_thru_hole circle (at 0 0) (size 2.7 2.7) (drill 2.7) (layers *.Cu *.Mask))
  )
  (footprint "Diode_SMD:D_0805_2012Metric_Pad1.15x1.40mm_HandSolder" (layer "B.Cu")
    (tedit 5F68FEF0)
    (at 95.73 78.2425 -90)
    (descr "Diode SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "diode handsolder")
    (property "Sheetfile" "simpleBMS_powerModule.kicad_sch")
    (property "Sheetname" "")
    (attr smd)
    (fp_text reference "D1" (at 2.9175 -0.13 90) (layer "B.SilkS"))
    (fp_text value "D" (at 0.2 -2.6 90) (layer "B.Fab") hide)
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "B.Fab") hide)
    (pad "1" smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.217391)
      (net 1 "Net-(D1-Pad1)") (pinfunction "K") (pintype "passive"))
    (pad "2" smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.217391)
      (net 2 "Net-(D1-Pad2)") (pinfunction "A") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Diode_SMD.3dshapes/D_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Package_TO_SOT_SMD:TO-252-2" (layer "B.Cu")
    (tedit 5A70A390)
    (at 98.044 66.039 180)
    (descr "TO-252 / DPAK SMD package, http://www.infineon.com/cms/en/product/packages/PG-TO252/PG-TO252-3-1/")
    (tags "DPAK TO-252 DPAK-3 TO-252-3 SOT-428")
    (property "Sheetfile" "simpleBMS_powerModule.kicad_sch")
    (property "Sheetname" "")
    (zone_connect 2)
    (attr smd)
    (fp_text reference "Q5" (at -2.54 -0.255) (layer "B.SilkS"))
    (fp_text value "Q_NMOS_GDS" (at 0 -4.5) (layer "B.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0) (layer "B.Fab"))
    (pad "" smd rect (at 3.775 1.525 180) (size 3.05 2.75) (layers "B.Paste"))
    (pad "" smd rect (at 0.425 -1.525 180) (size 3.05 2.75) (layers "B.Paste"))
    (pad "" smd rect (at 3.775 -1.525 180) (size 3.05 2.75) (layers "B.Paste"))
    (pad "" smd rect (at 0.425 1.525 180) (size 3.05 2.75) (layers "B.Paste"))
    (pad "1" smd rect (at -4.2 2.28 180) (size 2.2 1.2) (layers "B.Cu" "B.Paste" "B.Mask")
      (net 1 "Net-(D1-Pad1)") (pinfunction "G") (pintype "input"))
    (pad "2" smd rect (at 2.1 0 180) (size 6.4 5.8) (layers "B.Cu" "B.Mask")
      (net 10 "Net-(Q1-Pad2)") (pinfunction "D") (pintype "passive"))
    (pad "3" smd rect (at -4.2 -2.28 180) (size 2.2 1.2) (layers "B.Cu" "B.Paste" "B.Mask")
      (net 3 "/PACK-") (pinfunction "S") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Package_TO_SOT_SMD.3dshapes/TO-252-2.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Package_TO_SOT_SMD:SOT-23" (layer "B.Cu")
    (tedit 5FA16958)
    (at 101.77 75.86 180)
    (descr "SOT, 3 Pin (https://www.jedec.org/system/files/docs/to-236h.pdf variant AB), generated with kicad-footprint-generator ipc_gullwing_generator.py")
    (tags "SOT TO_SOT_SMD")
    (property "Sheetfile" "simpleBMS_powerModule.kicad_sch")
    (property "Sheetname" "")
    (attr smd)
    (fp_text reference "Q3" (at -0.17 -2.46) (layer "B.SilkS"))
    (fp_text value "PJA3471_R1_00001" (at 0 -2.4) (layer "B.Fab") hide)
    (fp_text user "${REFERENCE}" (at 0 0) (layer "B.Fab") hide)
    (pad "1" smd roundrect (at -0.9375 0.95 180) (size 1.475 0.6) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 11 "GND") (pinfunction "G") (pintype "input"))
    (pad "2" smd roundrect (at -0.9375 -0.95 180) (size 1.475 0.6) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 4 "/CSG") (pinfunction "S") (pintype "passive"))
    (pad "3" smd roundrect (at 0.9375 0 180) (size 1.475 0.6) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
      (net 2 "Net-(D1-Pad2)") (pinfunction "D") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Package_TO_SOT_SMD.3dshapes/SOT-23.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder" (layer "B.Cu")
    (tedit 5F68FEEE)
    (at 89.08 56.18)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (property "Sheetfile" "simpleBMS_powerModule.kicad_sch")
    (property "Sheetname" "")
    (attr smd)
    (fp_text reference "R3" (at 0 1.65) (layer "B.SilkS"))
    (fp_text value "4.5k" (at 0 -1.65) (layer "B.Fab") hide)
    (fp_text user "${REFERENCE}" (at 0 0) (layer "B.Fab") hide)
    (pad "1" smd roundrect (at -1 0) (size 1.2 1.4) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.208333)
      (net 9 "Net-(Q1-Pad1)") (pintype "passive"))
    (pad "2" smd roundrect (at 1 0) (size 1.2 1.4) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.208333)
      (net 5 "/DSG") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Diode_SMD:D_0805_2012Metric_Pad1.15x1.40mm_HandSolder" (layer "B.Cu")
    (tedit 5F68FEF0)
    (at 92.82 78.265 90)
    (descr "Diode SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "diode handsolder")
    (property "Sheetfile" "simpleBMS_powerModule.kicad_sch")
    (property "Sheetname" "")
    (attr smd)
    (fp_text reference "D2" (at -2.915 0.01 90) (layer "B.SilkS"))
    (fp_text value "16V" (at 0 -1.65 90) (layer "B.Fab") hide)
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "B.Fab") hide)
    (pad "1" smd roundrect (at -1.025 0 90) (size 1.15 1.4) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.217391)
      (net 1 "Net-(D1-Pad1)") (pinfunction "K") (pintype "passive"))
    (pad "2" smd roundrect (at 1.025 0 90) (size 1.15 1.4) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.217391)
      (net 3 "/PACK-") (pinfunction "A") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Diode_SMD.3dshapes/D_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder" (layer "B.Cu")
    (tedit 5F68FEEE)
    (at 98.67 78.19 90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (property "Sheetfile" "simpleBMS_powerModule.kicad_sch")
    (property "Sheetname" "")
    (attr smd)
    (fp_text reference "R4" (at -2.83 0.11 90) (layer "B.SilkS"))
    (fp_text value "1M" (at 0 -1.65 90) (layer "B.Fab") hide)
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "B.Fab") hide)
    (pad "1" smd roundrect (at -1 0 90) (size 1.2 1.4) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.208333)
      (net 2 "Net-(D1-Pad2)") (pintype "passive"))
    (pad "2" smd roundrect (at 1 0 90) (size 1.2 1.4) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.208333)
      (net 1 "Net-(D1-Pad1)") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Package_TO_SOT_SMD:TO-252-2" (layer "B.Cu")
    (tedit 5A70A390)
    (at 88.9 67.818 90)
    (descr "TO-252 / DPAK SMD package, http://www.infineon.com/cms/en/product/packages/PG-TO252/PG-TO252-3-1/")
    (tags "DPAK TO-252 DPAK-3 TO-252-3 SOT-428")
    (property "Sheetfile" "simpleBMS_powerModule.kicad_sch")
    (property "Sheetname" "")
    (zone_connect 2)
    (attr smd)
    (fp_text reference "Q4" (at 6.604 2.286 90) (layer "B.SilkS"))
    (fp_text value "Q_NMOS_GDS" (at 0 -4.5 90) (layer "B.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "B.Fab"))
    (pad "" smd rect (at 0.425 1.525 90) (size 3.05 2.75) (layers "B.Paste")
      (zone_connect 2))
    (pad "" smd rect (at 0.425 -1.525 90) (size 3.05 2.75) (layers "B.Paste")
      (zone_connect 2))
    (pad "" smd rect (at 3.775 1.525 90) (size 3.05 2.75) (layers "B.Paste")
      (zone_connect 2))
    (pad "" smd rect (at 3.775 -1.525 90) (size 3.05 2.75) (layers "B.Paste")
      (zone_connect 2))
    (pad "1" smd rect (at -4.2 2.28 90) (size 2.2 1.2) (layers "B.Cu" "B.Paste" "B.Mask")
      (net 9 "Net-(Q1-Pad1)") (pinfunction "G") (pintype "input") (zone_connect 2))
    (pad "2" smd rect (at 2.1 0 90) (size 6.4 5.8) (layers "B.Cu" "B.Mask")
      (net 10 "Net-(Q1-Pad2)") (pinfunction "D") (pintype "passive") (zone_connect 2))
    (pad "3" smd rect (at -4.2 -2.28 90) (size 2.2 1.2) (layers "B.Cu" "B.Paste" "B.Mask")
      (net 8 "/SRN_out") (pinfunction "S") (pintype "passive") (zone_connect 2))
    (model "${KICAD6_3DMODEL_DIR}/Package_TO_SOT_SMD.3dshapes/TO-252-2.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder" (layer "B.Cu")
    (tedit 5F68FEEE)
    (at 84.84 56.23 180)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (property "Sheetfile" "simpleBMS_powerModule.kicad_sch")
    (property "Sheetname" "")
    (attr smd)
    (fp_text reference "R2" (at 0.004 -1.428) (layer "B.SilkS"))
    (fp_text value "1M" (at 0 -1.65) (layer "B.Fab") hide)
    (fp_text user "${REFERENCE}" (at 0 0) (layer "B.Fab") hide)
    (pad "1" smd roundrect (at -1 0 180) (size 1.2 1.4) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.208333)
      (net 9 "Net-(Q1-Pad1)") (pintype "passive"))
    (pad "2" smd roundrect (at 1 0 180) (size 1.2 1.4) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.208333)
      (net 8 "/SRN_out") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Resistor_SMD:R_2512_6332Metric_Pad1.40x3.35mm_HandSolder" (layer "B.Cu")
    (tedit 5F68FEEE)
    (at 84.72 75.29)
    (descr "Resistor SMD 2512 (6332 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (property "Sheetfile" "simpleBMS_powerModule.kicad_sch")
    (property "Sheetname" "")
    (attr smd)
    (fp_text reference "R1" (at 0 2.62) (layer "B.SilkS"))
    (fp_text value "1.67m" (at 0 -2.62) (layer "B.Fab") hide)
    (fp_text user "${REFERENCE}" (at 0 0) (layer "B.Fab") hide)
    (pad "1" smd roundrect (at -3.05 0) (size 1.4 3.35) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.178571)
      (net 11 "GND") (pintype "passive") (zone_connect 2))
    (pad "2" smd roundrect (at 3.05 0) (size 1.4 3.35) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.178571)
      (net 8 "/SRN_out") (pintype "passive") (zone_connect 2))
    (model "${KICAD6_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_2512_6332Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Resistor_SMD:R_0805_2012Metric_Pad1.20x1.40mm_HandSolder" (layer "B.Cu")
    (tedit 5F68FEEE)
    (at 90.19 78.3 90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (property "Sheetfile" "simpleBMS_powerModule.kicad_sch")
    (property "Sheetname" "")
    (attr smd)
    (fp_text reference "R5" (at -3 0.01 270) (layer "B.SilkS"))
    (fp_text value "3.3M" (at 0 -1.65 90) (layer "B.Fab") hide)
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "B.Fab") hide)
    (pad "1" smd roundrect (at -1 0 90) (size 1.2 1.4) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.208333)
      (net 1 "Net-(D1-Pad1)") (pintype "passive"))
    (pad "2" smd roundrect (at 1 0 90) (size 1.2 1.4) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.208333)
      (net 3 "/PACK-") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (gr_line (start 108.95 49.8) (end 108.95 83.55) (layer "Edge.Cuts") (width 0.1))
  (gr_line (start 75.2 83.55) (end 75.2 49.8) (layer "Edge.Cuts") (width 0.1))
  (gr_line (start 75.2 49.8) (end 108.95 49.8) (layer "Edge.Cuts") (width 0.1))
  (gr_line (start 108.95 83.55) (end 75.2 83.55) (layer "Edge.Cuts") (width 0.1))
  (zone (net 11) (net_name "GND") (layers F&B.Cu) (hatch edge 0.508)
    (connect_pads yes (clearance 0.508))
    (min_thickness 0.254) (filled_areas_thickness no)
    (fill yes (thermal_gap 0.508) (thermal_bridge_width 0.508) (smoothing fillet) (radius 1))
    (polygon
      (pts
        (xy 83.19 76.92)
        (xy 76.33 76.96)
        (xy 76.31 58.09)
        (xy 83.18 58.09)
      )
    )
  )
  (zone (net 3) (net_name "/PACK-") (layer "F.Cu") (hatch edge 0.508)
    (connect_pads yes (clearance 0.508))
    (min_thickness 0.254) (filled_areas_thickness no)
    (fill yes (thermal_gap 0.508) (thermal_bridge_width 0.508) (smoothing fillet) (radius 1))
    (polygon
      (pts
        (xy 107.92 72.55)
        (xy 100.076 72.55)
        (xy 100.076 62.484)
        (xy 93.06 62.484)
        (xy 92.97 57.71)
        (xy 107.85 57.75)
      )
    )
  )
  (zone (net 8) (net_name "/SRN_out") (layers F&B.Cu) (hatch edge 0.508)
    (connect_pads yes (clearance 0.508))
    (min_thickness 0.254) (filled_areas_thickness no)
    (fill yes (thermal_gap 0.508) (thermal_bridge_width 0.508) (smoothing fillet) (radius 1))
    (polygon
      (pts
        (xy 91.56 73.98)
        (xy 88.68 76.96)
        (xy 85.2 76.96)
        (xy 85.19 70.01)
        (xy 91.49 69.96)
      )
    )
  )
  (zone (net 10) (net_name "Net-(Q1-Pad2)") (layers F&B.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.508))
    (min_thickness 0.254) (filled_areas_thickness no)
    (fill yes (thermal_gap 0.508) (thermal_bridge_width 0.508) (smoothing fillet) (radius 1))
    (polygon
      (pts
        (xy 99.314 69.342)
        (xy 85.598 69.342)
        (xy 85.598 62.992)
        (xy 99.314 62.992)
      )
    )
  )
  (zone (net 3) (net_name "/PACK-") (layer "B.Cu") (hatch edge 0.508)
    (connect_pads yes (clearance 0.508))
    (min_thickness 0.254) (filled_areas_thickness no)
    (fill yes (thermal_gap 0.508) (thermal_bridge_width 0.508) (smoothing fillet) (radius 1))
    (polygon
      (pts
        (xy 107.6 57.7)
        (xy 107.7 72.534136)
        (xy 100.584 72.39)
        (xy 100.584 62.484)
        (xy 93.04 62.484)
        (xy 92.996554 57.71198)
        (xy 102.282855 57.744136)
      )
    )
  )
  (zone (net 0) (net_name "") (layer "F.Mask") (hatch edge 0.508)
    (connect_pads (clearance 0.508))
    (min_thickness 0.254) (filled_areas_thickness no)
    (fill yes (thermal_gap 0.508) (thermal_bridge_width 0.508) (smoothing fillet) (radius 1))
    (polygon
      (pts
        (xy 99.314 69.342)
        (xy 85.598 69.342)
        (xy 85.598 62.992)
        (xy 99.314 62.992)
      )
    )
  )
)
