(kicad_pcb (version 4) (host pcbnew 4.0.4+e1-6308~48~ubuntu16.04.1-stable)
  (general
    (links 25)
    (no_connects 0)
    (area 104.572999 74.854999 178.510001 123.265001)
    (thickness 1.6)
    (drawings 43)
    (tracks 88)
    (zones 0)
    (modules 8)
    (nets 12)
  )
  (page USLetter)
  (title_block
    (title "Micro SD Connector (0475710001) Breakout Board")
    (date "01 Jan 2017")
    (rev v1.0)
    (company "CERN Open Hardware License v1.2")
    (comment 1 jenner@wickerbox.net)
    (comment 2 http://wickerbox.net)
    (comment 3 "Wickerbox Electronics")
  )
  (layers
    (0 F.Cu signal)
    (31 B.Cu signal)
    (34 B.Paste user)
    (35 F.Paste user)
    (36 B.SilkS user)
    (37 F.SilkS user)
    (38 B.Mask user)
    (39 F.Mask user)
    (44 Edge.Cuts user)
    (46 B.CrtYd user)
    (47 F.CrtYd user)
    (48 B.Fab user)
    (49 F.Fab user)
  )
  (setup
    (last_trace_width 0.254)
    (user_trace_width 0.1524)
    (user_trace_width 0.254)
    (user_trace_width 0.3302)
    (user_trace_width 0.508)
    (user_trace_width 0.762)
    (user_trace_width 1.27)
    (trace_clearance 0.254)
    (zone_clearance 0.508)
    (zone_45_only no)
    (trace_min 0.1524)
    (segment_width 0.1524)
    (edge_width 0.1524)
    (via_size 0.6858)
    (via_drill 0.3302)
    (via_min_size 0.6858)
    (via_min_drill 0.3302)
    (user_via 0.6858 0.3302)
    (user_via 0.762 0.4064)
    (user_via 0.8636 0.508)
    (uvia_size 0.6858)
    (uvia_drill 0.3302)
    (uvias_allowed no)
    (uvia_min_size 0)
    (uvia_min_drill 0)
    (pcb_text_width 0.1524)
    (pcb_text_size 1.016 1.016)
    (mod_edge_width 0.1524)
    (mod_text_size 1.016 1.016)
    (mod_text_width 0.1524)
    (pad_size 1.524 1.524)
    (pad_drill 0.762)
    (pad_to_mask_clearance 0.0762)
    (solder_mask_min_width 0.1016)
    (pad_to_paste_clearance -0.0762)
    (aux_axis_origin 0 0)
    (visible_elements FFFEDF7D)
    (pcbplotparams
      (layerselection 0x310fc_80000001)
      (usegerberextensions true)
      (excludeedgelayer true)
      (linewidth 0.100000)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15)
      (hpglpenoverlay 2)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (padsonsilk false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 0)
      (scaleselection 1)
      (outputdirectory gerbers))
  )
  (net 0 "")
  (net 1 VIN)
  (net 2 GND)
  (net 3 +3V3)
  (net 4 /MISO)
  (net 5 /CLK)
  (net 6 /MOSI)
  (net 7 /CS)
  (net 8 /SD_MISO)
  (net 9 /SD_CLK)
  (net 10 /SD_CS)
  (net 11 /SD_MOSI)
  (net_class Default "This is the default net class."
    (clearance 0.254)
    (trace_width 0.254)
    (via_dia 0.6858)
    (via_drill 0.3302)
    (uvia_dia 0.6858)
    (uvia_drill 0.3302)
    (add_net +3V3)
    (add_net /CLK)
    (add_net /CS)
    (add_net /MISO)
    (add_net /MOSI)
    (add_net /SD_CLK)
    (add_net /SD_CS)
    (add_net /SD_MISO)
    (add_net /SD_MOSI)
    (add_net GND)
    (add_net VIN)
  )
  (module Wickerlib:RLC-0603-SMD (layer F.Cu) (tedit 579029AB)
    (at 133.096 106.172 270)
    (descr "Capacitor SMD RLC-0603-SMD, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor RLC-0603-SMD")
    (attr smd)
    (fp_text reference C1 (at 0.09 0.04 270) (layer F.Fab))
    (fp_text value 1uF (at 0 1.9 270) (layer F.Fab) hide)
    (fp_text user %R (at 0.254 1.524 270) (layer F.SilkS))
    (pad 1 smd rect (at -0.75 0 270) (size 0.8 0.75) (layers F.Cu F.Paste F.Mask)
      (net 1 VIN))
    (pad 2 smd rect (at 0.75 0 270) (size 0.8 0.75) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
  )
  (module Wickerlib:RLC-0603-SMD (layer F.Cu) (tedit 579029AB)
    (at 130.568 102.87 180)
    (descr "Capacitor SMD RLC-0603-SMD, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor RLC-0603-SMD")
    (attr smd)
    (fp_text reference C2 (at 0.09 0.04 180) (layer F.Fab))
    (fp_text value 0.1uF (at 0 1.9 180) (layer F.Fab) hide)
    (fp_text user %R (at 0.012 1.524 180) (layer F.SilkS))
    (pad 1 smd rect (at -0.75 0 180) (size 0.8 0.75) (layers F.Cu F.Paste F.Mask)
      (net 1 VIN))
    (pad 2 smd rect (at 0.75 0 180) (size 0.8 0.75) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
  )
  (module Wickerlib:RLC-0603-SMD (layer F.Cu) (tedit 579029AB)
    (at 130.568 95.25 180)
    (descr "Capacitor SMD RLC-0603-SMD, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor RLC-0603-SMD")
    (attr smd)
    (fp_text reference C3 (at 0.09 0.04 180) (layer F.Fab))
    (fp_text value 0.1uF (at 0 1.9 180) (layer F.Fab) hide)
    (fp_text user %R (at -0.012 -1.778 180) (layer F.SilkS))
    (pad 1 smd rect (at -0.75 0 180) (size 0.8 0.75) (layers F.Cu F.Paste F.Mask)
      (net 3 +3V3))
    (pad 2 smd rect (at 0.75 0 180) (size 0.8 0.75) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
  )
  (module Wickerlib:RLC-0603-SMD (layer F.Cu) (tedit 579029AB)
    (at 138.176 106.184 270)
    (descr "Capacitor SMD RLC-0603-SMD, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor RLC-0603-SMD")
    (attr smd)
    (fp_text reference C4 (at 0.09 0.04 270) (layer F.Fab))
    (fp_text value 1uF (at 0 1.9 270) (layer F.Fab) hide)
    (fp_text user %R (at 0.242 -1.524 270) (layer F.SilkS))
    (pad 1 smd rect (at -0.75 0 270) (size 0.8 0.75) (layers F.Cu F.Paste F.Mask)
      (net 3 +3V3))
    (pad 2 smd rect (at 0.75 0 270) (size 0.8 0.75) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
  )
  (module Wickerlib:CONN-HEADER-STRAIGHT-P2.54MM-1x06 (layer F.Cu) (tedit 586D9505)
    (at 123.698 106.68 180)
    (descr "Through hole pin header")
    (tags "pin header")
    (fp_text reference J1 (at -0.01 6.35 360) (layer F.Fab))
    (fp_text value BREAKOUT (at -2.63 6.86 270) (layer F.Fab) hide)
    (fp_text user %R (at 0.14 -2.74 180) (layer F.SilkS) hide)
    (pad 1 thru_hole rect (at 0 0 180) (size 2.032 1.7272) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 1 VIN))
    (pad 2 thru_hole oval (at 0 2.54 180) (size 2.032 1.7272) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 4 /MISO))
    (pad 3 thru_hole oval (at 0 5.08 180) (size 2.032 1.7272) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 5 /CLK))
    (pad 4 thru_hole oval (at 0 7.62 180) (size 2.032 1.7272) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 6 /MOSI))
    (pad 5 thru_hole oval (at 0 10.16 180) (size 2.032 1.7272) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 7 /CS))
    (pad 6 thru_hole oval (at 0 12.7 180) (size 2.032 1.7272) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 2 GND))
  )
  (module Wickerlib:CONN-SD-MICRO-MOLEX-0475710001 (layer F.Cu) (tedit 57958DF9)
    (at 140.696 100.1014 90)
    (fp_text reference J2 (at 0 3.25 180) (layer F.Fab))
    (fp_text value CONN-MICRO-SD-CARD-PUSH-PULL (at 4 6.25 90) (layer F.Fab) hide)
    (fp_text user %R (at 6.6294 0.528 180) (layer F.SilkS))
    (pad G5 smd rect (at 4.8514 5.1 90) (size 1.4 0.9) (layers F.Cu F.Paste F.Mask))
    (pad G2 smd rect (at -5.4135 4.9635 90) (size 1.2 1.15) (layers F.Cu F.Paste F.Mask))
    (pad G3 smd rect (at 4.8264 2.8 90) (size 1.45 1.2) (layers F.Cu F.Paste F.Mask))
    (pad G1 smd rect (at -5.4135 2.3635 90) (size 1.2 1.15) (layers F.Cu F.Paste F.Mask))
    (pad 7 smd rect (at -2.8135 1.3235 90) (size 0.7 1) (layers F.Cu F.Paste F.Mask)
      (net 8 /SD_MISO))
    (pad 8 smd rect (at -3.9135 1.3235 90) (size 0.7 1) (layers F.Cu F.Paste F.Mask))
    (pad 6 smd rect (at -1.7135 1.3235 90) (size 0.7 1) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad 5 smd rect (at -0.6135 1.3235 90) (size 0.7 1) (layers F.Cu F.Paste F.Mask)
      (net 9 /SD_CLK))
    (pad 4 smd rect (at 0.4865 1.3235 90) (size 0.7 1) (layers F.Cu F.Paste F.Mask)
      (net 3 +3V3))
    (pad 1 smd rect (at 3.7865 1.3235 90) (size 0.7 1) (layers F.Cu F.Paste F.Mask))
    (pad 2 smd rect (at 2.6865 1.3235 90) (size 0.7 1) (layers F.Cu F.Paste F.Mask)
      (net 10 /SD_CS))
    (pad 3 smd rect (at 1.5865 1.3235 90) (size 0.7 1) (layers F.Cu F.Paste F.Mask)
      (net 11 /SD_MOSI))
    (pad G4 smd rect (at 5.0514 3.95 90) (size 1 0.7) (layers F.Cu F.Paste F.Mask))
  )
  (module Wickerlib:SOT-353 (layer F.Cu) (tedit 586C4D4B)
    (at 135.636 106.538)
    (descr SOT353)
    (attr smd)
    (fp_text reference U1 (at 0 0) (layer F.Fab))
    (fp_text value "MIC5365 150mA" (at 0 2.25) (layer F.Fab) hide)
    (fp_text user %R (at -0.254 -1.89) (layer F.SilkS))
    (pad 1 smd rect (at -0.95 -0.65) (size 0.6 0.42) (layers F.Cu F.Paste F.Mask)
      (net 1 VIN))
    (pad 3 smd rect (at -0.95 0.65) (size 0.6 0.42) (layers F.Cu F.Paste F.Mask)
      (net 1 VIN))
    (pad 5 smd rect (at 0.95 -0.65) (size 0.6 0.42) (layers F.Cu F.Paste F.Mask)
      (net 3 +3V3))
    (pad 2 smd rect (at -0.95 0) (size 0.6 0.42) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad 4 smd rect (at 0.95 0.65) (size 0.6 0.42) (layers F.Cu F.Paste F.Mask))
    (model TO_SOT_Packages_SMD.3dshapes/SOT-353.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.07000000000000001 0.09 0.08))
      (rotate (xyz 0 0 90))
    )
  )
  (module Wickerlib:SOIC-14-3.9x8.7MM-P1.27MM (layer F.Cu) (tedit 58157842)
    (at 136.304 99.06 180)
    (descr "14-Lead Plastic Small Outline (SL) - Narrow, 3.90 mm Body [SOIC] (see Microchip Packaging Specification 00000049BS.pdf)")
    (tags "SOIC 1.27")
    (attr smd)
    (fp_text reference U2 (at 0 0.1 360) (layer F.Fab))
    (fp_text value TXB0104 (at 0 5.375 180) (layer F.Fab) hide)
    (fp_text user %R (at -1.11 5.334 180) (layer F.SilkS))
    (pad 1 smd rect (at -2.7 -3.81 180) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
      (net 3 +3V3))
    (pad 2 smd rect (at -2.7 -2.54 180) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
      (net 8 /SD_MISO))
    (pad 3 smd rect (at -2.7 -1.27 180) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
      (net 9 /SD_CLK))
    (pad 4 smd rect (at -2.7 0 180) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
      (net 11 /SD_MOSI))
    (pad 5 smd rect (at -2.7 1.27 180) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
      (net 10 /SD_CS))
    (pad 6 smd rect (at -2.7 2.54 180) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask))
    (pad 7 smd rect (at -2.7 3.81 180) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad 8 smd rect (at 2.7 3.81 180) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
      (net 3 +3V3))
    (pad 9 smd rect (at 2.7 2.54 180) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask))
    (pad 10 smd rect (at 2.7 1.27 180) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
      (net 7 /CS))
    (pad 11 smd rect (at 2.7 0 180) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
      (net 6 /MOSI))
    (pad 12 smd rect (at 2.7 -1.27 180) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
      (net 5 /CLK))
    (pad 13 smd rect (at 2.7 -2.54 180) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
      (net 4 /MISO))
    (pad 14 smd rect (at 2.7 -3.81 180) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
      (net 1 VIN))
  )
  (gr_text "SD Connector:\nMolex P/N 0475710001\n\nVIN can be 5V or 3.3V\n\nwickerbox.net" (at 135.128 101.854) (layer B.SilkS))
  (gr_text "v1.0                    1/4/17" (at 134.62 110.236) (layer F.Fab))
  (gr_text "MicroSD Card Breakout" (at 135.636 94.234) (layer B.SilkS))
  (gr_text "Narrow Micro SD Card Breakout" (at 134.62 90.932) (layer F.Fab))
  (gr_line (start 121.92 93.98) (end 121.92 106.68) (layer Edge.Cuts) (width 0.1524))
  (gr_line (start 146.812 93.98) (end 146.812 106.68) (layer Edge.Cuts) (width 0.1524))
  (gr_arc (start 123.698 106.68) (end 123.698 108.458) (angle 90) (layer Edge.Cuts) (width 0.1524))
  (gr_line (start 145.034 108.458) (end 123.698 108.458) (layer Edge.Cuts) (width 0.1524))
  (gr_arc (start 145.034 106.68) (end 146.812 106.68) (angle 90) (layer Edge.Cuts) (width 0.1524))
  (gr_arc (start 145.034 93.98) (end 145.034 92.202) (angle 90) (layer Edge.Cuts) (width 0.1524))
  (gr_line (start 123.698 92.202) (end 145.034 92.202) (layer Edge.Cuts) (width 0.1524))
  (gr_arc (start 123.698 93.98) (end 121.92 93.98) (angle 90) (layer Edge.Cuts) (width 0.1524))
  (gr_text VIN (at 126.625048 106.68) (layer F.SilkS))
  (gr_text MISO (at 127.254 104.14) (layer F.SilkS))
  (gr_text "CLK\n" (at 126.842762 101.6) (layer F.SilkS))
  (gr_text MOSI (at 127.254 99.06) (layer F.SilkS))
  (gr_text "CS\n" (at 126.407333 96.52) (layer F.SilkS))
  (gr_text GND (at 126.963714 93.98) (layer F.SilkS))
  (zone (net 2) (net_name GND) (layer B.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 146.812 92.202) (xy 121.92 92.202) (xy 121.92 108.458) (xy 146.812 108.458)
      )
    )
  )
  (zone (net 2) (net_name GND) (layer F.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 146.812 92.202) (xy 121.92 92.202) (xy 121.92 108.458) (xy 146.812 108.458)
      )
    )
  )
)
