<b>Ceramic Chip Capacitor KEMET 0204 Reflow solder</b><p>
Metric Code Size 1005
>NAME
>VALUE
<b>Hyper CHIPLED Hyper-Bright LED</b><p>
LB Q993<br>
Source: http://www.osram.convergy.de/ ... Lb_q993.pdf
>NAME
>VALUE
<b>RESISTOR</b><p>
chip
>NAME
>VALUE
>NAME
>VALUE
>Name
>Value
<b>Test Pins/Pads</b><p>
Cream on SMD OFF.<br>
new: Attribute TP_SIGNAL_NAME<br>
<author>Created by librarian@cadsoft.de</author>
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
TEST PAD
TEST PAD
TEST PAD
<b>EAGLE Design Rules</b>
<p>
Die Standard-Design-Rules sind so gewählt, dass sie für
die meisten Anwendungen passen. Sollte ihre Platine
besondere Anforderungen haben, treffen Sie die erforderlichen
Einstellungen hier und speichern die Design Rules unter
einem neuen Namen ab.
<b>Laen's PCB Order Design Rules</b>
<p>
Please make sure your boards conform to these design rules.
Since Version 8.2, EAGLE supports online libraries. The ids
of those online libraries will not be understood (or retained)
with this version.
Since Version 8.3, EAGLE supports URNs for individual library
assets (packages, symbols, and devices). The URNs of those assets
will not be understood (or retained) with this version.
Since Version 8.3, EAGLE supports the association of 3D packages
with devices in libraries, schematics, and board files. Those 3D
packages will not be understood (or retained) with this version.