(kicad_pcb (version 20171130) (host pcbnew 5.1.6-c6e7f7d~87~ubuntu20.04.1)
  (general
    (thickness 1.6002)
    (drawings 27)
    (tracks 212)
    (zones 0)
    (modules 33)
    (nets 30)
  )
  (page A4)
  (layers
    (0 F.Cu signal)
    (31 B.Cu signal hide)
    (32 B.Adhes user hide)
    (33 F.Adhes user hide)
    (34 B.Paste user hide)
    (35 F.Paste user)
    (36 B.SilkS user hide)
    (37 F.SilkS user)
    (38 B.Mask user hide)
    (39 F.Mask user)
    (40 Dwgs.User user)
    (41 Cmts.User user hide)
    (42 Eco1.User user hide)
    (43 Eco2.User user hide)
    (44 Edge.Cuts user)
    (45 Margin user hide)
    (46 B.CrtYd user hide)
    (47 F.CrtYd user)
    (48 B.Fab user hide)
    (49 F.Fab user)
  )
  (setup
    (last_trace_width 0.1524)
    (user_trace_width 0.1524)
    (user_trace_width 0.2032)
    (user_trace_width 0.254)
    (user_trace_width 0.3048)
    (user_trace_width 0.381)
    (user_trace_width 0.4572)
    (user_trace_width 0.5588)
    (trace_clearance 0.1524)
    (zone_clearance 0.508)
    (zone_45_only no)
    (trace_min 0.1524)
    (via_size 0.8)
    (via_drill 0.4)
    (via_min_size 0.508)
    (via_min_drill 0.254)
    (uvia_size 0.3)
    (uvia_drill 0.1)
    (uvias_allowed no)
    (uvia_min_size 0.2)
    (uvia_min_drill 0.1)
    (edge_width 0.0508)
    (segment_width 0.2032)
    (pcb_text_width 0.254)
    (pcb_text_size 1.27 1.27)
    (mod_edge_width 0.127)
    (mod_text_size 0.762 0.762)
    (mod_text_width 0.127)
    (pad_size 1.524 1.524)
    (pad_drill 0.762)
    (pad_to_mask_clearance 0.0508)
    (aux_axis_origin 0 0)
    (visible_elements FFFFF77F)
    (pcbplotparams
      (layerselection 0x010fc_ffffffff)
      (usegerberextensions false)
      (usegerberattributes true)
      (usegerberadvancedattributes true)
      (creategerberjobfile true)
      (excludeedgelayer true)
      (linewidth 0.100000)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (padsonsilk false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 0)
      (scaleselection 1)
      (outputdirectory "gerber/"))
  )
  (net 0 "")
  (net 1 "Net-(U1-Pad1)")
  (net 2 "Net-(U1-Pad8)")
  (net 3 +5V)
  (net 4 GND)
  (net 5 VDD)
  (net 6 /LED_RED)
  (net 7 /LED_GREEN)
  (net 8 /A0)
  (net 9 /BUTTON)
  (net 10 /SDA)
  (net 11 /SCL)
  (net 12 "Net-(U2-Pad4)")
  (net 13 "Net-(U3-Pad3)")
  (net 14 "Net-(U4-Pad6)")
  (net 15 /ALERT_MCP)
  (net 16 /ALERT_STS3)
  (net 17 /MAX_GP0)
  (net 18 /MAX_GP1)
  (net 19 "Net-(D1-Pad1)")
  (net 20 "Net-(U3-Pad4)")
  (net 21 "Net-(D1-Pad3)")
  (net 22 /OLED_VDD)
  (net 23 /OLED_GND)
  (net 24 "Net-(TP5-Pad1)")
  (net 25 "Net-(TP6-Pad1)")
  (net 26 "Net-(TP1-Pad1)")
  (net 27 "Net-(TP2-Pad1)")
  (net 28 "Net-(TP3-Pad1)")
  (net 29 "Net-(TP4-Pad1)")
  (net_class Default "This is the default net class."
    (clearance 0.1524)
    (trace_width 0.1524)
    (via_dia 0.8)
    (via_drill 0.4)
    (uvia_dia 0.3)
    (uvia_drill 0.1)
    (add_net +5V)
    (add_net /A0)
    (add_net /ALERT_MCP)
    (add_net /ALERT_STS3)
    (add_net /BUTTON)
    (add_net /LED_GREEN)
    (add_net /LED_RED)
    (add_net /MAX_GP0)
    (add_net /MAX_GP1)
    (add_net /OLED_GND)
    (add_net /OLED_VDD)
    (add_net /SCL)
    (add_net /SDA)
    (add_net GND)
    (add_net "Net-(D1-Pad1)")
    (add_net "Net-(D1-Pad3)")
    (add_net "Net-(TP1-Pad1)")
    (add_net "Net-(TP2-Pad1)")
    (add_net "Net-(TP3-Pad1)")
    (add_net "Net-(TP4-Pad1)")
    (add_net "Net-(TP5-Pad1)")
    (add_net "Net-(TP6-Pad1)")
    (add_net "Net-(U1-Pad1)")
    (add_net "Net-(U1-Pad8)")
    (add_net "Net-(U2-Pad4)")
    (add_net "Net-(U3-Pad3)")
    (add_net "Net-(U3-Pad4)")
    (add_net "Net-(U4-Pad6)")
    (add_net VDD)
  )
  (module Package_TO_SOT_SMD:SOT-23-5 (layer F.Cu) (tedit 5A02FF57)
    (at 161.798 111.506 180)
    (descr "5-pin SOT23 package")
    (tags SOT-23-5)
    (attr smd)
    (fp_text reference U2 (at 0 -2.9) (layer F.SilkS))
    (fp_text value AP2112K-3.3 (at 0 2.9) (layer F.Fab))
    (fp_text user %R (at 0 -0.254 90) (layer F.Fab))
    (pad 1 smd rect (at -1.1 -0.95 180) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask)
      (net 3 +5V))
    (pad 2 smd rect (at -1.1 0 180) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask)
      (net 4 GND))
    (pad 3 smd rect (at -1.1 0.95 180) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask)
      (net 3 +5V))
    (pad 4 smd rect (at 1.1 0.95 180) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask)
      (net 12 "Net-(U2-Pad4)"))
    (pad 5 smd rect (at 1.1 -0.95 180) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask)
      (net 5 VDD))
    (model ${KISYS3DMOD}/Package_TO_SOT_SMD.3dshapes/SOT-23-5.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module TestPoint:TestPoint_Pad_D1.5mm (layer B.Cu) (tedit 5A0F774F)
    (at 160.782 98.044)
    (descr "SMD pad as test Point, diameter 1.5mm")
    (tags "test point SMD pad")
    (attr virtual)
    (fp_text reference TP11 (at 0 1.648) (layer B.Fab))
    (fp_text value MCP (at -2.794 0.127) (layer B.SilkS))
    (fp_text user %R (at 0 1.65) (layer B.Fab))
    (pad 1 smd circle (at 0 0) (size 1.5 1.5) (layers B.Cu B.Mask)
      (net 15 /ALERT_MCP))
  )
  (module TestPoint:TestPoint_Pad_D1.5mm (layer B.Cu) (tedit 5A0F774F)
    (at 159.004 106.807)
    (descr "SMD pad as test Point, diameter 1.5mm")
    (tags "test point SMD pad")
    (attr virtual)
    (fp_text reference TP10 (at 0 1.648) (layer B.Fab))
    (fp_text value MAX1 (at 2.921 0) (layer B.SilkS))
    (fp_text user %R (at 0 1.65) (layer B.Fab))
    (pad 1 smd circle (at 0 0) (size 1.5 1.5) (layers B.Cu B.Mask)
      (net 18 /MAX_GP1))
  )
  (module TestPoint:TestPoint_Pad_D1.5mm (layer B.Cu) (tedit 5A0F774F)
    (at 159.004 104.14)
    (descr "SMD pad as test Point, diameter 1.5mm")
    (tags "test point SMD pad")
    (attr virtual)
    (fp_text reference TP9 (at 0 1.648) (layer B.Fab))
    (fp_text value MAX0 (at 3.175 -0.127) (layer B.SilkS))
    (fp_text user %R (at 0 1.65) (layer B.Fab))
    (pad 1 smd circle (at 0 0) (size 1.5 1.5) (layers B.Cu B.Mask)
      (net 17 /MAX_GP0))
  )
  (module TestPoint:TestPoint_Pad_D1.5mm (layer B.Cu) (tedit 5A0F774F)
    (at 166.116 97.79)
    (descr "SMD pad as test Point, diameter 1.5mm")
    (tags "test point SMD pad")
    (attr virtual)
    (fp_text reference TP8 (at 0 1.648) (layer B.Fab))
    (fp_text value STS3 (at -1.651 -1.651) (layer B.SilkS))
    (fp_text user %R (at 0 1.65) (layer B.Fab))
    (pad 1 smd circle (at 0 0) (size 1.5 1.5) (layers B.Cu B.Mask)
      (net 16 /ALERT_STS3))
  )
  (module TestPoint:TestPoint_Pad_D1.5mm (layer B.Cu) (tedit 5A0F774F)
    (at 151.638 106.172)
    (descr "SMD pad as test Point, diameter 1.5mm")
    (tags "test point SMD pad")
    (attr virtual)
    (fp_text reference TP7 (at 0 1.648) (layer B.Fab) hide)
    (fp_text value BTN (at 0.762 1.905) (layer B.SilkS))
    (fp_text user %R (at 0 1.65) (layer B.Fab) hide)
    (pad 1 smd circle (at 0 0) (size 1.5 1.5) (layers B.Cu B.Mask)
      (net 9 /BUTTON))
  )
  (module TestPoint:TestPoint_Pad_D1.5mm (layer B.Cu) (tedit 5A0F774F)
    (at 169.418 96.266 180)
    (descr "SMD pad as test Point, diameter 1.5mm")
    (tags "test point SMD pad")
    (attr virtual)
    (fp_text reference TP6 (at 0 1.648) (layer B.Fab) hide)
    (fp_text value TX (at 1.651 0.381) (layer B.SilkS))
    (fp_text user %R (at 0 1.65) (layer B.Fab))
    (pad 1 smd circle (at 0 0 180) (size 1.5 1.5) (layers B.Cu B.Mask)
      (net 25 "Net-(TP6-Pad1)"))
  )
  (module TestPoint:TestPoint_Pad_D1.5mm (layer B.Cu) (tedit 5A0F774F)
    (at 169.418 99.06 180)
    (descr "SMD pad as test Point, diameter 1.5mm")
    (tags "test point SMD pad")
    (attr virtual)
    (fp_text reference TP5 (at 0 1.648) (layer B.Fab) hide)
    (fp_text value RX (at 1.397 -1.524) (layer B.SilkS))
    (fp_text user %R (at 0 1.65) (layer B.Fab))
    (pad 1 smd circle (at 0 0 180) (size 1.5 1.5) (layers B.Cu B.Mask)
      (net 24 "Net-(TP5-Pad1)"))
  )
  (module TestPoint:TestPoint_Pad_D1.5mm (layer B.Cu) (tedit 5A0F774F)
    (at 169.164 108.458)
    (descr "SMD pad as test Point, diameter 1.5mm")
    (tags "test point SMD pad")
    (attr virtual)
    (fp_text reference TP4 (at 0 1.648) (layer B.Fab) hide)
    (fp_text value D3 (at -0.127 -1.778) (layer B.SilkS))
    (fp_text user %R (at 0 1.65) (layer B.Fab) hide)
    (pad 1 smd circle (at 0 0) (size 1.5 1.5) (layers B.Cu B.Mask)
      (net 29 "Net-(TP4-Pad1)"))
  )
  (module TestPoint:TestPoint_Pad_D1.5mm (layer B.Cu) (tedit 5A0F774F)
    (at 169.164 111.252)
    (descr "SMD pad as test Point, diameter 1.5mm")
    (tags "test point SMD pad")
    (attr virtual)
    (fp_text reference TP3 (at 0 1.648) (layer B.Fab) hide)
    (fp_text value D4 (at 0 1.905) (layer B.SilkS))
    (fp_text user %R (at 0 1.65) (layer B.Fab) hide)
    (pad 1 smd circle (at 0 0) (size 1.5 1.5) (layers B.Cu B.Mask)
      (net 28 "Net-(TP3-Pad1)"))
  )
  (module TestPoint:TestPoint_Pad_D1.5mm (layer B.Cu) (tedit 5A0F774F)
    (at 151.638 103.378)
    (descr "SMD pad as test Point, diameter 1.5mm")
    (tags "test point SMD pad")
    (attr virtual)
    (fp_text reference TP2 (at 0 1.648) (layer B.Fab) hide)
    (fp_text value D5 (at 0 -1.778) (layer B.SilkS))
    (fp_text user %R (at 0 1.65) (layer B.Fab) hide)
    (pad 1 smd circle (at 0 0) (size 1.5 1.5) (layers B.Cu B.Mask)
      (net 27 "Net-(TP2-Pad1)"))
  )
  (module TestPoint:TestPoint_Pad_D1.5mm (layer B.Cu) (tedit 5A0F774F)
    (at 154.686 103.378)
    (descr "SMD pad as test Point, diameter 1.5mm")
    (tags "test point SMD pad")
    (attr virtual)
    (fp_text reference TP1 (at 0 1.648) (layer B.Fab) hide)
    (fp_text value D0 (at 0 1.778) (layer B.SilkS))
    (fp_text user %R (at 0 1.65) (layer B.Fab) hide)
    (pad 1 smd circle (at 0 0) (size 1.5 1.5) (layers B.Cu B.Mask)
      (net 26 "Net-(TP1-Pad1)"))
  )
  (module Package_DFN_QFN:DFN-8-1EP_2x2mm_P0.5mm_EP1.05x1.75mm (layer F.Cu) (tedit 5F5C54BB)
    (at 166.116 97.79 90)
    (descr "DFN8 2x2, 0.5P; CASE 506CN (see ON Semiconductor 506CN.PDF)")
    (tags "DFN 0.5")
    (clearance 0.0508)
    (attr smd)
    (fp_text reference U4 (at 0 -2 90) (layer F.SilkS))
    (fp_text value STS3x (at 0 2 90) (layer F.Fab))
    (pad 1 smd rect (at -1.15 -0.75 90) (size 0.55 0.25) (layers F.Cu F.Paste F.Mask)
      (net 10 /SDA))
    (pad 2 smd rect (at -1.15 -0.25 90) (size 0.55 0.25) (layers F.Cu F.Paste F.Mask)
      (net 4 GND))
    (pad 3 smd rect (at -1.15 0.25 90) (size 0.55 0.25) (layers F.Cu F.Paste F.Mask)
      (net 16 /ALERT_STS3))
    (pad 4 smd rect (at -1.15 0.75 90) (size 0.55 0.25) (layers F.Cu F.Paste F.Mask)
      (net 11 /SCL))
    (pad 5 smd rect (at 1.15 0.75 90) (size 0.55 0.25) (layers F.Cu F.Paste F.Mask)
      (net 5 VDD))
    (pad 6 smd rect (at 1.15 0.25 90) (size 0.55 0.25) (layers F.Cu F.Paste F.Mask)
      (net 14 "Net-(U4-Pad6)"))
    (pad 7 smd rect (at 1.15 -0.25 90) (size 0.55 0.25) (layers F.Cu F.Paste F.Mask)
      (net 4 GND))
    (pad 8 smd rect (at 1.15 -0.75 90) (size 0.55 0.25) (layers F.Cu F.Paste F.Mask)
      (net 4 GND))
    (pad 9 smd rect (at 0 0 90) (size 1 1.7) (layers F.Cu F.Mask))
    (pad "" smd rect (at 0 0.4375 90) (size 0.85 0.65) (layers F.Paste))
    (pad "" smd rect (at 0 -0.4375 90) (size 0.85 0.65) (layers F.Paste))
    (model ${KISYS3DMOD}/Package_DFN_QFN.3dshapes/DFN-8-1EP_2x2mm_P0.5mm_EP1.05x1.75mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_DFN_QFN:DFN-8-1EP_3x2mm_P0.5mm_EP1.36x1.46mm (layer F.Cu) (tedit 5EA4BD86)
    (at 160.528 98.044 90)
    (descr "8-Lead Plastic Dual Flat, No Lead Package (8MA2) - 2x3x0.6 mm Body (http://ww1.microchip.com/downloads/en/DeviceDoc/20005010F.pdf)")
    (tags "DFN 0.5")
    (attr smd)
    (fp_text reference U7 (at 0 -2.05 90) (layer F.SilkS))
    (fp_text value MCP9804_DFN8 (at 0 2.05 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad "" smd rect (at 0.325 0.375 90) (size 0.5 0.6) (layers F.Paste))
    (pad "" smd rect (at 0.325 -0.375 90) (size 0.5 0.6) (layers F.Paste))
    (pad "" smd rect (at -0.325 0.375 90) (size 0.5 0.6) (layers F.Paste))
    (pad "" smd rect (at -0.325 -0.375 90) (size 0.5 0.6) (layers F.Paste))
    (pad 9 smd rect (at 0 0 90) (size 1.36 1.46) (layers F.Cu F.Mask))
    (pad 8 smd rect (at 1.5 -0.75 90) (size 0.75 0.3) (layers F.Cu F.Paste F.Mask)
      (net 5 VDD))
    (pad 7 smd rect (at 1.5 -0.25 90) (size 0.75 0.3) (layers F.Cu F.Paste F.Mask)
      (net 4 GND))
    (pad 6 smd rect (at 1.5 0.25 90) (size 0.75 0.3) (layers F.Cu F.Paste F.Mask)
      (net 4 GND))
    (pad 5 smd rect (at 1.5 0.75 90) (size 0.75 0.3) (layers F.Cu F.Paste F.Mask)
      (net 4 GND))
    (pad 4 smd rect (at -1.5 0.75 90) (size 0.75 0.3) (layers F.Cu F.Paste F.Mask)
      (net 4 GND))
    (pad 3 smd rect (at -1.5 0.25 90) (size 0.75 0.3) (layers F.Cu F.Paste F.Mask)
      (net 15 /ALERT_MCP))
    (pad 2 smd rect (at -1.5 -0.25 90) (size 0.75 0.3) (layers F.Cu F.Paste F.Mask)
      (net 11 /SCL))
    (pad 1 smd rect (at -1.5 -0.75 90) (size 0.75 0.3) (layers F.Cu F.Paste F.Mask)
      (net 10 /SDA))
    (model ${KISYS3DMOD}/Package_DFN_QFN.3dshapes/DFN-8-1EP_3x2mm_P0.5mm_EP1.36x1.46mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Module:WEMOS_D1_mini_light locked (layer F.Cu) (tedit 5F77CEDC)
    (at 148.844 95.504)
    (descr "16-pin module, column spacing 22.86 mm (900 mils), https://wiki.wemos.cc/products:d1:d1_mini, https://c1.staticflickr.com/1/734/31400410271_f278b087db_z.jpg")
    (tags "ESP8266 WiFi microcontroller")
    (fp_text reference U1 (at 0.127 -2.286) (layer F.SilkS))
    (fp_text value WeMos_D1_mini (at 11.7 0) (layer F.Fab))
    (fp_text user "No copper" (at 11.43 -3.81) (layer Cmts.User))
    (fp_text user "KEEP OUT" (at 11.43 -6.35) (layer Cmts.User))
    (fp_text user %R (at 11.43 10) (layer F.Fab))
    (pad 16 thru_hole oval (at 22.86 0) (size 2 1.6) (drill 1) (layers *.Cu *.Mask)
      (net 25 "Net-(TP6-Pad1)"))
    (pad 15 thru_hole oval (at 22.86 2.54) (size 2 1.6) (drill 1) (layers *.Cu *.Mask)
      (net 24 "Net-(TP5-Pad1)"))
    (pad 14 thru_hole oval (at 22.86 5.08) (size 2 1.6) (drill 1) (layers *.Cu *.Mask)
      (net 11 /SCL))
    (pad 13 thru_hole oval (at 22.86 7.62) (size 2 1.6) (drill 1) (layers *.Cu *.Mask)
      (net 10 /SDA))
    (pad 12 thru_hole oval (at 22.86 10.16) (size 2 1.6) (drill 1) (layers *.Cu *.Mask)
      (net 29 "Net-(TP4-Pad1)"))
    (pad 11 thru_hole oval (at 22.86 12.7) (size 2 1.6) (drill 1) (layers *.Cu *.Mask)
      (net 28 "Net-(TP3-Pad1)"))
    (pad 10 thru_hole oval (at 22.86 15.24) (size 2 1.6) (drill 1) (layers *.Cu *.Mask)
      (net 4 GND))
    (pad 9 thru_hole oval (at 22.86 17.78) (size 2 1.6) (drill 1) (layers *.Cu *.Mask)
      (net 3 +5V))
    (pad 8 thru_hole oval (at 0 17.78) (size 2 1.6) (drill 1) (layers *.Cu *.Mask)
      (net 2 "Net-(U1-Pad8)"))
    (pad 7 thru_hole oval (at 0 15.24) (size 2 1.6) (drill 1) (layers *.Cu *.Mask)
      (net 7 /LED_GREEN))
    (pad 6 thru_hole oval (at 0 12.7) (size 2 1.6) (drill 1) (layers *.Cu *.Mask)
      (net 6 /LED_RED))
    (pad 5 thru_hole oval (at 0 10.16) (size 2 1.6) (drill 1) (layers *.Cu *.Mask)
      (net 9 /BUTTON))
    (pad 4 thru_hole oval (at 0 7.62) (size 2 1.6) (drill 1) (layers *.Cu *.Mask)
      (net 27 "Net-(TP2-Pad1)"))
    (pad 3 thru_hole oval (at 0 5.08) (size 2 1.6) (drill 1) (layers *.Cu *.Mask)
      (net 26 "Net-(TP1-Pad1)"))
    (pad 1 thru_hole rect (at 0 0) (size 2 2) (drill 1) (layers *.Cu *.Mask)
      (net 1 "Net-(U1-Pad1)"))
    (pad 2 thru_hole oval (at 0 2.54) (size 2 1.6) (drill 1) (layers *.Cu *.Mask)
      (net 8 /A0))
    (model ${KISYS3DMOD}/Module.3dshapes/WEMOS_D1_mini_light.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x08_P2.54mm_Vertical.wrl
      (offset (xyz 0 0 9.5))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 -180 0))
    )
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x08_P2.54mm_Vertical.wrl
      (offset (xyz 22.86 0 9.5))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 -180 0))
    )
    (model ${KISYS3DMOD}/Connector_PinSocket_2.54mm.3dshapes/PinSocket_1x08_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
    (model ${KISYS3DMOD}/Connector_PinSocket_2.54mm.3dshapes/PinSocket_1x08_P2.54mm_Vertical.wrl
      (offset (xyz 22.86 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 169.418 105.156 270)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R10 (at 3.175 -0.127 90) (layer F.SilkS))
    (fp_text value 4K7 (at 0 1.43 90) (layer F.Fab) hide)
    (fp_text user %R (at 0 0 90) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 0.875 0 270) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 10 /SDA))
    (pad 1 smd roundrect (at -0.875 0 270) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 5 VDD))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 169.418 100.711 270)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R9 (at -2.794 -0.127 90) (layer F.SilkS))
    (fp_text value 4K7 (at 0 1.43 90) (layer F.Fab) hide)
    (fp_text user %R (at 0 0 90) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 0.875 0 270) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 5 VDD))
    (pad 1 smd roundrect (at -0.875 0 270) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 11 /SCL))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 152.4 110.236)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R8 (at 2.667 -1.778) (layer F.SilkS))
    (fp_text value 330R (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 19 "Net-(D1-Pad1)"))
    (pad 1 smd roundrect (at -0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 7 /LED_GREEN))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 152.4 108.458 180)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R7 (at -2.667 -1.778) (layer F.SilkS))
    (fp_text value 330R (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 6 /LED_RED))
    (pad 1 smd roundrect (at -0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 21 "Net-(D1-Pad3)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module LED_THT:LED_D5.0mm-3 (layer F.Cu) (tedit 5F75D934)
    (at 152.654 112.522 270)
    (descr "LED, diameter 5.0mm, 2 pins, diameter 5.0mm, 3 pins, http://www.kingbright.com/attachments/file/psearch/000/00/00/L-59EGC(Ver.17A).pdf")
    (tags "LED diameter 5.0mm 2 pins diameter 5.0mm 3 pins")
    (fp_text reference LED (at 7.239 0.889 180) (layer F.SilkS))
    (fp_text value LED_Dual_CAC (at 2.5 2.5 270) (layer F.Fab))
    (pad 3 thru_hole circle (at 5.08 0 270) (size 1.8 1.8) (drill 0.9) (layers *.Cu *.Mask)
      (net 21 "Net-(D1-Pad3)"))
    (pad 2 thru_hole circle (at 2.54 0 270) (size 1.8 1.8) (drill 0.9) (layers *.Cu *.Mask)
      (net 3 +5V))
    (pad 1 thru_hole rect (at 0 0 270) (size 1.8 1.8) (drill 0.9) (layers *.Cu *.Mask)
      (net 19 "Net-(D1-Pad1)"))
    (model ${KISYS3DMOD}/LED_THT.3dshapes/LED_D5.0mm-3.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_PinHeader_2.54mm:PinHeader_1x04_P2.54mm_Vertical locked (layer F.Cu) (tedit 59FED5CC)
    (at 156.21 119.634 90)
    (descr "Through hole straight pin header, 1x04, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x04 2.54mm single row")
    (fp_text reference OLED (at 0.254 10.922 180) (layer F.SilkS))
    (fp_text value "OLED Header 128x64" (at 0 9.95 90) (layer F.Fab))
    (fp_text user %R (at -0.762 3.81) (layer F.Fab))
    (pad 4 thru_hole oval (at 0 7.62 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 22 /OLED_VDD))
    (pad 3 thru_hole oval (at 0 5.08 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 23 /OLED_GND))
    (pad 2 thru_hole oval (at 0 2.54 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 11 /SCL))
    (pad 1 thru_hole rect (at 0 0 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 10 /SDA))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x04_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Button_Switch_SMD:SW_Push_SPST_NO_Alps_SKRK (layer B.Cu) (tedit 5C2A8900)
    (at 152.908 96.012 180)
    (descr http://www.alps.com/prod/info/E/HTML/Tact/SurfaceMount/SKRK/SKRKAHE020.html)
    (tags "SMD SMT button")
    (attr smd)
    (fp_text reference SW1 (at 0.127 0 180) (layer B.SilkS))
    (fp_text value SW_Push (at 0 -2.5 180) (layer B.Fab) hide)
    (fp_text user %R (at 0 0 180) (layer B.Fab))
    (pad 1 smd roundrect (at -2.1 0 180) (size 0.8 2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 4 GND))
    (pad 2 smd roundrect (at 2.1 0 180) (size 0.8 2) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 9 /BUTTON))
    (model ${KISYS3DMOD}/Button_Switch_SMD.3dshapes/SW_Push_SPST_NO_Alps_SKRK.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B36C52B)
    (at 165.608 112.903 90)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C1 (at 0.762 1.905 270) (layer F.SilkS))
    (fp_text value 1uF (at 0 1.65 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd roundrect (at -1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 3 +5V))
    (pad 2 smd roundrect (at 1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 4 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B36C52B)
    (at 158.496 110.998 90)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C2 (at 0 -1.65 90) (layer F.SilkS))
    (fp_text value 1uF (at 0 1.65 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 4 GND))
    (pad 1 smd roundrect (at -1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 5 VDD))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 165.608 108.204 180)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C4 (at 0.635 1.397) (layer F.SilkS))
    (fp_text value 100nF (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 4 GND))
    (pad 1 smd roundrect (at -0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 5 VDD))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 161.163 108.204 180)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C5 (at 0.508 1.397) (layer F.SilkS))
    (fp_text value 100nF (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 5 VDD))
    (pad 2 smd roundrect (at 0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 4 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 157.875 94.996)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C6 (at -3.062 0.254) (layer F.SilkS))
    (fp_text value 100nF (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 5 VDD))
    (pad 2 smd roundrect (at 0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 4 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 165.862 94.869 180)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C7 (at 2.794 -0.381) (layer F.SilkS))
    (fp_text value 100nF (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 4 GND))
    (pad 1 smd roundrect (at -0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 5 VDD))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module OptoDevice:R_LDR_4.9x4.2mm_P2.54mm_Vertical (layer F.Cu) (tedit 5B8603A6)
    (at 154.686 99.314 180)
    (descr "Resistor, LDR 4.9x4.2mm")
    (tags "Resistor LDR4.9x4.2")
    (fp_text reference CdS (at 1.27 -2.9) (layer F.SilkS))
    (fp_text value LDR03 (at 1.17 3.1) (layer F.Fab))
    (fp_text user %R (at 1.27 -2.9) (layer F.Fab))
    (pad 1 thru_hole circle (at 0 0 180) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask)
      (net 5 VDD))
    (pad 2 thru_hole circle (at 2.54 0 180) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask)
      (net 8 /A0))
    (model ${KISYS3DMOD}/OptoDevice.3dshapes/R_LDR_4.9x4.2mm_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_DFN_QFN:DFN-6-1EP_3x3mm_P1mm_EP1.5x2.4mm (layer F.Cu) (tedit 5DC5F54E)
    (at 165.608 103.124)
    (descr "DFN, 6 Pin (https://www.silabs.com/documents/public/data-sheets/Si7020-A20.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py")
    (tags "DFN NoLead")
    (attr smd)
    (fp_text reference U3 (at -2.794 -0.889 90) (layer F.SilkS))
    (fp_text value Si7051-A20 (at 0 2.45) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd roundrect (at -1.45 -1) (size 0.8 0.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 10 /SDA))
    (pad 2 smd roundrect (at -1.45 0) (size 0.8 0.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 4 GND))
    (pad 3 smd roundrect (at -1.45 1) (size 0.8 0.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 13 "Net-(U3-Pad3)"))
    (pad 4 smd roundrect (at 1.45 1) (size 0.8 0.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 20 "Net-(U3-Pad4)"))
    (pad 5 smd roundrect (at 1.45 0) (size 0.8 0.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 5 VDD))
    (pad 6 smd roundrect (at 1.45 -1) (size 0.8 0.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 11 /SCL))
    (pad 7 smd rect (at 0 0) (size 1.5 2.4) (layers F.Cu F.Mask))
    (pad "" smd roundrect (at -0.375 -0.6) (size 0.6 0.97) (layers F.Paste) (roundrect_rratio 0.25))
    (pad "" smd roundrect (at -0.375 0.6) (size 0.6 0.97) (layers F.Paste) (roundrect_rratio 0.25))
    (pad "" smd roundrect (at 0.375 -0.6) (size 0.6 0.97) (layers F.Paste) (roundrect_rratio 0.25))
    (pad "" smd roundrect (at 0.375 0.6) (size 0.6 0.97) (layers F.Paste) (roundrect_rratio 0.25))
    (model ${KISYS3DMOD}/Package_DFN_QFN.3dshapes/DFN-6-1EP_3x3mm_P1mm_EP1.5x2.4mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module wemos_tmp:UDFN-6_2x2mm_90-100138 (layer F.Cu) (tedit 5F5C3138)
    (at 160.528 103.632 270)
    (descr http://datasheets.maximintegrated.com/en/ds/MAX44009.pdf)
    (attr smd)
    (fp_text reference U6 (at 0 1.905 90) (layer F.SilkS))
    (fp_text value MAX31889 (at 0 2.5 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd rect (at -0.825 0 270) (size 0.975 0.45) (layers F.Cu F.Paste F.Mask)
      (net 11 /SCL))
    (pad 1 smd rect (at -0.825 -0.65 270) (size 0.975 0.45) (layers F.Cu F.Paste F.Mask)
      (net 17 /MAX_GP0))
    (pad 3 smd rect (at -0.825 0.65 270) (size 0.975 0.45) (layers F.Cu F.Paste F.Mask)
      (net 10 /SDA))
    (pad 4 smd rect (at 0.775 0.65 270) (size 0.975 0.45) (layers F.Cu F.Paste F.Mask)
      (net 18 /MAX_GP1))
    (pad 5 smd rect (at 0.775 0 270) (size 0.975 0.45) (layers F.Cu F.Paste F.Mask)
      (net 4 GND))
    (pad 6 smd rect (at 0.775 -0.65 270) (size 0.975 0.45) (layers F.Cu F.Paste F.Mask)
      (net 5 VDD))
  )
  (module Jumper:SolderJumper-3_P1.3mm_Bridged12_Pad1.0x1.5mm (layer B.Cu) (tedit 5C756B4C)
    (at 167.132 119.126 270)
    (descr "SMD Solder 3-pad Jumper, 1x1.5mm Pads, 0.3mm gap, pads 1-2 bridged with 1 copper strip")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference J2 (at 0 1.8 90) (layer B.Fab))
    (fp_text value OLED_VDD (at 1.651 -3.429 180) (layer B.SilkS))
    (pad 2 smd rect (at 0 0 270) (size 1 1.5) (layers B.Cu B.Mask)
      (net 22 /OLED_VDD))
    (pad 3 smd rect (at 1.3 0 270) (size 1 1.5) (layers B.Cu B.Mask)
      (net 4 GND))
    (pad 1 smd rect (at -1.3 0 270) (size 1 1.5) (layers B.Cu B.Mask)
      (net 3 +5V))
  )
  (module Jumper:SolderJumper-3_P1.3mm_Bridged12_Pad1.0x1.5mm (layer B.Cu) (tedit 5C756B4C)
    (at 161.544 116.84)
    (descr "SMD Solder 3-pad Jumper, 1x1.5mm Pads, 0.3mm gap, pads 1-2 bridged with 1 copper strip")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference J3 (at 0 1.8) (layer B.Fab) hide)
    (fp_text value OLED_GND (at -4.572 0.635) (layer B.SilkS))
    (pad 1 smd rect (at -1.3 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 4 GND))
    (pad 3 smd rect (at 1.3 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 3 +5V))
    (pad 2 smd rect (at 0 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 23 /OLED_GND))
  )
  (gr_text "glue 11x11mm heat sink\nas common heat source\non top of all 4 sensors" (at 182.372 90.678) (layer Dwgs.User))
  (gr_text + (at 154.051 97.79) (layer F.SilkS))
  (gr_text +5 (at 154.305 115.189 90) (layer F.SilkS))
  (gr_text D7 (at 154.305 112.522 90) (layer F.SilkS))
  (gr_text D6 (at 154.305 117.475 90) (layer F.SilkS))
  (gr_text VCC (at 164.084 117.729) (layer F.SilkS))
  (gr_text GND (at 161.362571 117.729) (layer F.SilkS))
  (gr_text SCL (at 158.677428 117.729) (layer F.SilkS))
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