(kicad_pcb (version 20171130) (host pcbnew "(5.1.7)-1")
  (general
    (thickness 1.6)
    (drawings 18)
    (tracks 182)
    (zones 0)
    (modules 19)
    (nets 16)
  )
  (page A4)
  (layers
    (0 F.Cu signal hide)
    (31 B.Cu jumper hide)
    (32 B.Adhes user)
    (33 F.Adhes user)
    (34 B.Paste user)
    (35 F.Paste user)
    (36 B.SilkS user)
    (37 F.SilkS user)
    (38 B.Mask user)
    (39 F.Mask user)
    (40 Dwgs.User user)
    (41 Cmts.User user hide)
    (44 Edge.Cuts user)
    (45 Margin user)
    (46 B.CrtYd user)
    (47 F.CrtYd user)
    (48 B.Fab user hide)
    (49 F.Fab user hide)
  )
  (setup
    (last_trace_width 0.1524)
    (user_trace_width 0.5)
    (user_trace_width 1)
    (trace_clearance 0.1524)
    (zone_clearance 0.1524)
    (zone_45_only no)
    (trace_min 0)
    (via_size 0.6858)
    (via_drill 0.3302)
    (via_min_size 0.6858)
    (via_min_drill 0.3302)
    (uvia_size 0.6858)
    (uvia_drill 0.3302)
    (uvias_allowed no)
    (uvia_min_size 0)
    (uvia_min_drill 0)
    (edge_width 0.05)
    (segment_width 0.2)
    (pcb_text_width 0.3)
    (pcb_text_size 1.5 1.5)
    (mod_edge_width 0.12)
    (mod_text_size 1 1)
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    (pad_size 1.2 0.6)
    (pad_drill 0)
    (pad_to_mask_clearance 0.0508)
    (aux_axis_origin 0 0)
    (visible_elements 7FFFFFFF)
    (pcbplotparams
      (layerselection 0x010fc_ffffffff)
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      (mode 1)
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  )
  (net 0 "")
  (net 1 VDD)
  (net 2 GND)
  (net 3 "Net-(C3-Pad1)")
  (net 4 "Net-(Q1-Pad4)")
  (net 5 "Net-(R1-Pad1)")
  (net 6 "Net-(R2-Pad2)")
  (net 7 "Net-(R4-Pad2)")
  (net 8 "Net-(TP1-Pad1)")
  (net 9 "Net-(C2-Pad2)")
  (net 10 "Net-(C4-Pad2)")
  (net 11 "Net-(TP2-Pad1)")
  (net 12 "Net-(TP4-Pad1)")
  (net 13 Vsnk)
  (net 14 "Net-(D1-Pad4)")
  (net 15 "Net-(D1-Pad6)")
  (net_class Default "This is the default net class."
    (clearance 0.1524)
    (trace_width 0.1524)
    (via_dia 0.6858)
    (via_drill 0.3302)
    (uvia_dia 0.6858)
    (uvia_drill 0.3302)
    (add_net GND)
    (add_net "Net-(C2-Pad2)")
    (add_net "Net-(C3-Pad1)")
    (add_net "Net-(C4-Pad2)")
    (add_net "Net-(D1-Pad4)")
    (add_net "Net-(D1-Pad6)")
    (add_net "Net-(Q1-Pad4)")
    (add_net "Net-(R1-Pad1)")
    (add_net "Net-(R2-Pad2)")
    (add_net "Net-(R4-Pad2)")
    (add_net "Net-(TP1-Pad1)")
    (add_net "Net-(TP2-Pad1)")
    (add_net "Net-(TP4-Pad1)")
    (add_net VDD)
    (add_net Vsnk)
  )
  (module Package_DFN_QFN:HVQFN-24-1EP_4x4mm_P0.5mm_EP2.5x2.5mm (layer F.Cu) (tedit 5FF1080A)
    (at 119.75 92.75 90)
    (descr "HVQFN, 24 Pin (https://www.nxp.com/docs/en/package-information/SOT616-3.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py")
    (tags "HVQFN NoLead")
    (attr smd)
    (fp_text reference U1 (at 0.05 0.05 180) (layer F.SilkS) hide)
    (fp_text value STUSB4500QTR (at 0 3.32 -90) (layer F.Fab))
    (fp_text user %R (at 0 0 -90) (layer F.Fab))
    (pad 1 smd roundrect (at -1.9375 -1.25 90) (size 0.875 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 15 "Net-(D1-Pad6)"))
    (pad 2 smd roundrect (at -1.9375 -0.75 90) (size 0.875 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 15 "Net-(D1-Pad6)"))
    (pad 3 smd roundrect (at -1.9375 -0.25 90) (size 0.875 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
    (pad 4 smd roundrect (at -1.9375 0.25 90) (size 0.875 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 14 "Net-(D1-Pad4)"))
    (pad 5 smd roundrect (at -1.9375 0.75 90) (size 0.875 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 14 "Net-(D1-Pad4)"))
    (pad 6 smd roundrect (at -1.9375 1.25 90) (size 0.875 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (pad 7 smd roundrect (at -1.25 1.9375 90) (size 0.25 0.875) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 8 "Net-(TP1-Pad1)"))
    (pad 8 smd roundrect (at -0.75 1.9375 90) (size 0.25 0.875) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 11 "Net-(TP2-Pad1)"))
    (pad 9 smd roundrect (at -0.25 1.9375 90) (size 0.25 0.875) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 6 "Net-(R2-Pad2)"))
    (pad 10 smd roundrect (at 0.25 1.9375 90) (size 0.25 0.875) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (pad 11 smd roundrect (at 0.75 1.9375 90) (size 0.25 0.875) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
    (pad 12 smd roundrect (at 1.25 1.9375 90) (size 0.25 0.875) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (pad 13 smd roundrect (at 1.9375 1.25 90) (size 0.875 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (pad 14 smd roundrect (at 1.9375 0.75 90) (size 0.875 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
    (pad 15 smd roundrect (at 1.9375 0.25 90) (size 0.875 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
    (pad 16 smd roundrect (at 1.9375 -0.25 90) (size 0.875 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 7 "Net-(R4-Pad2)"))
    (pad 17 smd roundrect (at 1.9375 -0.75 90) (size 0.875 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
    (pad 18 smd roundrect (at 1.9375 -1.25 90) (size 0.875 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 5 "Net-(R1-Pad1)"))
    (pad 19 smd roundrect (at 1.25 -1.9375 90) (size 0.25 0.875) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
    (pad 20 smd roundrect (at 0.75 -1.9375 90) (size 0.25 0.875) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
    (pad 21 smd roundrect (at 0.25 -1.9375 90) (size 0.25 0.875) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 9 "Net-(C2-Pad2)"))
    (pad 22 smd roundrect (at -0.25 -1.9375 90) (size 0.25 0.875) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (pad 23 smd roundrect (at -0.75 -1.9375 90) (size 0.25 0.875) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 3 "Net-(C3-Pad1)"))
    (pad 24 smd roundrect (at -1.25 -1.9375 90) (size 0.25 0.875) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 VDD))
    (pad 25 smd rect (at 0 0 90) (size 2.5 2.5) (layers F.Cu F.Mask)
      (net 2 GND))
    (pad "" smd roundrect (at -0.625 -0.625 90) (size 1.01 1.01) (layers F.Paste) (roundrect_rratio 0.247525))
    (pad "" smd roundrect (at -0.625 0.625 90) (size 1.01 1.01) (layers F.Paste) (roundrect_rratio 0.247525))
    (pad "" smd roundrect (at 0.625 -0.625 90) (size 1.01 1.01) (layers F.Paste) (roundrect_rratio 0.247525))
    (pad "" smd roundrect (at 0.625 0.625 90) (size 1.01 1.01) (layers F.Paste) (roundrect_rratio 0.247525))
    (model ${KISYS3DMOD}/Package_DFN_QFN.3dshapes/HVQFN-24-1EP_4x4mm_P0.5mm_EP2.5x2.5mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
    (model ${KISYS3DMOD}/Package_DFN_QFN.3dshapes/QFN-24-1EP_4x4mm_P0.5mm_EP2.7x2.7mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module ESDA25SC6Y:STMicroelectronics-SOT23-6L-0-0-0 (layer F.Cu) (tedit 5FF107F1)
    (at 115.5 101.5 180)
    (fp_text reference D1 (at -2.05 -2.325) (layer F.SilkS) hide)
    (fp_text value ESDA25SC6Y (at 0 0) (layer F.SilkS) hide)
    (pad 1 smd rect (at -1.15 -0.95 180) (size 1.2 0.6) (layers F.Cu F.Paste F.Mask)
      (net 13 Vsnk))
    (pad 2 smd rect (at -1.15 0 180) (size 1.2 0.6) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad 3 smd rect (at -1.15 0.95 180) (size 1.2 0.6) (layers F.Cu F.Paste F.Mask)
      (net 1 VDD))
    (pad 4 smd rect (at 1.15 0.95 180) (size 1.2 0.6) (layers F.Cu F.Paste F.Mask)
      (net 14 "Net-(D1-Pad4)"))
    (pad 5 smd rect (at 1.15 0 180) (size 1.2 0.6) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad 6 smd rect (at 1.15 -0.95 180) (size 1.2 0.6) (layers F.Cu F.Paste F.Mask)
      (net 15 "Net-(D1-Pad6)"))
    (model eec.models/STMicroelectronics_-_ESDA25SC6Y.step
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
    (model ${KISYS3DMOD}/Package_TO_SOT_SMD.3dshapes/SOT-23-6.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module DS2502:Maxim-DS2502R+TR-Level_A (layer F.Cu) (tedit 5FF107E7)
    (at 111.050002 101.749999 90)
    (fp_text reference U2 (at -3.4 -2.500001 90) (layer F.SilkS) hide)
    (fp_text value DS2502R+TR (at 0 0 90) (layer F.SilkS) hide)
    (pad 3 smd rect (at 1.000001 -0.000001) (size 0.599999 1.799999) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad 2 smd rect (at -1.000001 0.949998) (size 0.599999 1.799999) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad 1 smd rect (at -1.000001 -0.950001) (size 0.599999 1.799999) (layers F.Cu F.Paste F.Mask)
      (net 12 "Net-(TP4-Pad1)"))
    (model ${KISYS3DMOD}/Package_TO_SOT_SMD.3dshapes/SOT-23.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module STL6P3LLH6:STMicroelectronics-PowerFLAT3.3x3.3-8465286-0-2-MFG (layer B.Cu) (tedit 5FF107A4)
    (at 118.7 91.5 90)
    (fp_text reference Q1 (at -1 0.5 90) (layer B.SilkS) hide)
    (fp_text value STL6P3LLH6 (at 0 0 90) (layer B.SilkS) hide)
    (pad 1 smd rect (at -0.975 -1.525 90) (size 0.4 0.75) (layers B.Cu B.Paste B.Mask)
      (net 1 VDD))
    (pad 2 smd rect (at -0.325 -1.525 90) (size 0.4 0.75) (layers B.Cu B.Paste B.Mask)
      (net 1 VDD))
    (pad 3 smd rect (at 0.325 -1.525 90) (size 0.4 0.75) (layers B.Cu B.Paste B.Mask)
      (net 1 VDD))
    (pad 4 smd rect (at 0.975 -1.525 90) (size 0.4 0.75) (layers B.Cu B.Paste B.Mask)
      (net 4 "Net-(Q1-Pad4)"))
    (pad 5-6-7-8 smd custom (at 0 1.05 90) (size 1 1) (layers B.Cu B.Paste B.Mask)
      (net 13 Vsnk)
      (options (clearance outline) (anchor circle))
      (primitives
        (gr_poly (pts
           (xy -1.225 -1.55) (xy 1.225 -1.55) (xy 1.225 -1.25) (xy 1.755 -1.25) (xy 1.755 -0.85)
           (xy 1.225 -0.85) (xy 1.225 0.85) (xy -1.225 0.85) (xy -1.225 -0.85) (xy -1.755 -0.85)
           (xy -1.755 -1.25) (xy -1.225 -1.25) (xy -1.225 -1.55)) (width 0))
      ))
    (model eec.models/STMicroelectronics_-_STL6P3LLH6.step
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
    (model "C:/Users/jakob/USB-C Converter/Trans_STMicroelectronics_STL6P3LLH6/eec.models/STMicroelectronics_-_STL6P3LLH6.step"
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder (layer B.Cu) (tedit 5FF1078B)
    (at 119.9 95.2625 270)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C4 (at 0 1.68 270) (layer B.SilkS) hide)
    (fp_text value 100n (at 0 -1.68 270) (layer B.Fab))
    (fp_text user %R (at 0 0 270) (layer B.Fab))
    (pad 2 smd roundrect (at 1.0375 0 270) (size 1.175 1.45) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.212766)
      (net 10 "Net-(C4-Pad2)"))
    (pad 1 smd roundrect (at -1.0375 0 270) (size 1.175 1.45) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.212766)
      (net 13 Vsnk))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder (layer B.Cu) (tedit 5FF1077A)
    (at 116.2125 95.75)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C1 (at 0 1.68 180) (layer B.SilkS) hide)
    (fp_text value 4.7u (at 0 -1.68) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 2 smd roundrect (at 1.0375 0) (size 1.175 1.45) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.212766)
      (net 1 VDD))
    (pad 1 smd roundrect (at -1.0375 0) (size 1.175 1.45) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.212766)
      (net 2 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module USB4110-GF-A:GCT_USB4110-GF-A (layer B.Cu) (tedit 5FF10766)
    (at 116.11 99.25 180)
    (fp_text reference J1 (at -1.425 3.135 180) (layer B.SilkS) hide)
    (fp_text value USB4110-GF-A (at 5.56 -7.265 180) (layer B.Fab))
    (pad A1/B12 smd rect (at -3.2 1.075 180) (size 0.6 1.15) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (pad A4/B9 smd rect (at -2.4 1.075 180) (size 0.6 1.15) (layers B.Cu B.Paste B.Mask)
      (net 1 VDD))
    (pad B4/A9 smd rect (at 2.4 1.075 180) (size 0.6 1.15) (layers B.Cu B.Paste B.Mask)
      (net 1 VDD))
    (pad B1/A12 smd rect (at 3.2 1.075 180) (size 0.6 1.15) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (pad B8 smd rect (at -1.75 1.075 180) (size 0.3 1.15) (layers B.Cu B.Paste B.Mask))
    (pad B5 smd rect (at 1.75 1.075 180) (size 0.3 1.15) (layers B.Cu B.Paste B.Mask)
      (net 14 "Net-(D1-Pad4)"))
    (pad A5 smd rect (at -1.25 1.075 180) (size 0.3 1.15) (layers B.Cu B.Paste B.Mask)
      (net 15 "Net-(D1-Pad6)"))
    (pad A8 smd rect (at 1.25 1.075 180) (size 0.3 1.15) (layers B.Cu B.Paste B.Mask))
    (pad B7 smd rect (at -0.75 1.075 180) (size 0.3 1.15) (layers B.Cu B.Paste B.Mask))
    (pad B6 smd rect (at 0.75 1.075 180) (size 0.3 1.15) (layers B.Cu B.Paste B.Mask))
    (pad A6 smd rect (at -0.25 1.075 180) (size 0.3 1.15) (layers B.Cu B.Paste B.Mask))
    (pad A7 smd rect (at 0.25 1.075 180) (size 0.3 1.15) (layers B.Cu B.Paste B.Mask))
    (pad S1 smd rect (at -5.11 0.5 180) (size 2.18 2) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (pad S2 smd rect (at 5.11 0.5 180) (size 1.8 2) (drill (offset -0.48 0)) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (pad S3 smd rect (at -5.11 -3.43 180) (size 2.18 2) (drill (offset 0.4 0)) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (pad S4 smd rect (at 5.11 -3.43 180) (size 2.18 2) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (pad None np_thru_hole circle (at -2.89 0 180) (size 0.65 0.65) (drill 0.65) (layers *.Cu *.Mask))
    (pad None np_thru_hole circle (at 2.89 0 180) (size 0.65 0.65) (drill 0.65) (layers *.Cu *.Mask))
    (model "C:/Users/jakob/USB-C Converter/USB4110-GF-A/USB4110-GF-A.step"
      (offset (xyz 0 -6.3 1.5))
      (scale (xyz 1 1 1))
      (rotate (xyz 90 180 180))
    )
  )
  (module TestPoint:TestPoint_Pad_D1.0mm (layer F.Cu) (tedit 5A0F774F)
    (at 122.25 97.6)
    (descr "SMD pad as test Point, diameter 1.0mm")
    (tags "test point SMD pad")
    (attr virtual)
    (fp_text reference SCL (at -1.15 0 180) (layer F.SilkS))
    (fp_text value SCL (at 0 1.55) (layer F.Fab))
    (fp_text user %R (at 0 -1.45) (layer F.Fab))
    (pad 1 smd circle (at 0 0) (size 1 1) (layers F.Cu F.Mask)
      (net 8 "Net-(TP1-Pad1)"))
  )
  (module Capacitor_SMD:C_0201_0603Metric_Pad0.64x0.40mm_HandSolder (layer F.Cu) (tedit 5F6BB9E0)
    (at 116.7175 96.8 180)
    (descr "Capacitor SMD 0201 (0603 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://www.vishay.com/docs/20052/crcw0201e3.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C2 (at 0 -1.05) (layer F.SilkS) hide)
    (fp_text value 1uF (at 0 1.05) (layer F.Fab))
    (fp_text user %R (at 0 -0.68) (layer F.Fab))
    (pad "" smd roundrect (at -0.4325 0 180) (size 0.458 0.36) (layers F.Paste) (roundrect_rratio 0.25))
    (pad "" smd roundrect (at 0.4325 0 180) (size 0.458 0.36) (layers F.Paste) (roundrect_rratio 0.25))
    (pad 1 smd roundrect (at -0.4075 0 180) (size 0.635 0.4) (layers F.Cu F.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (pad 2 smd roundrect (at 0.4075 0 180) (size 0.635 0.4) (layers F.Cu F.Mask) (roundrect_rratio 0.25)
      (net 9 "Net-(C2-Pad2)"))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0201_0603Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0201_0603Metric_Pad0.64x0.40mm_HandSolder (layer F.Cu) (tedit 5F6BB9E0)
    (at 117.4925 95.85)
    (descr "Capacitor SMD 0201 (0603 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://www.vishay.com/docs/20052/crcw0201e3.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C3 (at -1.2925 -0.05 180) (layer F.SilkS) hide)
    (fp_text value 1uF (at 0 1.05) (layer F.Fab))
    (fp_text user %R (at 0 -0.68) (layer F.Fab))
    (pad 2 smd roundrect (at 0.4075 0) (size 0.635 0.4) (layers F.Cu F.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (pad 1 smd roundrect (at -0.4075 0) (size 0.635 0.4) (layers F.Cu F.Mask) (roundrect_rratio 0.25)
      (net 3 "Net-(C3-Pad1)"))
    (pad "" smd roundrect (at 0.4325 0) (size 0.458 0.36) (layers F.Paste) (roundrect_rratio 0.25))
    (pad "" smd roundrect (at -0.4325 0) (size 0.458 0.36) (layers F.Paste) (roundrect_rratio 0.25))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0201_0603Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0201_0603Metric_Pad0.64x0.40mm_HandSolder (layer F.Cu) (tedit 5F6BB9E0)
    (at 115.3175 98 180)
    (descr "Resistor SMD 0201 (0603 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://www.vishay.com/docs/20052/crcw0201e3.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R1 (at 0 -1.05) (layer F.SilkS) hide)
    (fp_text value 1k (at 0 1.05) (layer F.Fab))
    (fp_text user %R (at 0 -0.68) (layer F.Fab))
    (pad "" smd roundrect (at -0.4325 0 180) (size 0.458 0.36) (layers F.Paste) (roundrect_rratio 0.25))
    (pad "" smd roundrect (at 0.4325 0 180) (size 0.458 0.36) (layers F.Paste) (roundrect_rratio 0.25))
    (pad 1 smd roundrect (at -0.4075 0 180) (size 0.635 0.4) (layers F.Cu F.Mask) (roundrect_rratio 0.25)
      (net 5 "Net-(R1-Pad1)"))
    (pad 2 smd roundrect (at 0.4075 0 180) (size 0.635 0.4) (layers F.Cu F.Mask) (roundrect_rratio 0.25)
      (net 1 VDD))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0201_0603Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0201_0603Metric_Pad0.64x0.40mm_HandSolder (layer B.Cu) (tedit 5F6BB9E0)
    (at 121.3 94.2925 90)
    (descr "Resistor SMD 0201 (0603 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://www.vishay.com/docs/20052/crcw0201e3.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R2 (at 0 1.05 270) (layer B.SilkS) hide)
    (fp_text value 1k (at 0 -1.05 270) (layer B.Fab))
    (fp_text user %R (at 0 0.68 270) (layer B.Fab))
    (pad 2 smd roundrect (at 0.4075 0 90) (size 0.635 0.4) (layers B.Cu B.Mask) (roundrect_rratio 0.25)
      (net 6 "Net-(R2-Pad2)"))
    (pad 1 smd roundrect (at -0.4075 0 90) (size 0.635 0.4) (layers B.Cu B.Mask) (roundrect_rratio 0.25)
      (net 13 Vsnk))
    (pad "" smd roundrect (at 0.4325 0 90) (size 0.458 0.36) (layers B.Paste) (roundrect_rratio 0.25))
    (pad "" smd roundrect (at -0.4325 0 90) (size 0.458 0.36) (layers B.Paste) (roundrect_rratio 0.25))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0201_0603Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0201_0603Metric_Pad0.64x0.40mm_HandSolder (layer F.Cu) (tedit 5F6BB9E0)
    (at 115.2 96.6325 90)
    (descr "Resistor SMD 0201 (0603 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://www.vishay.com/docs/20052/crcw0201e3.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R3 (at 0 -1.05 90) (layer F.SilkS) hide)
    (fp_text value 100k (at 0 1.05 90) (layer F.Fab))
    (fp_text user %R (at 0 -0.68 90) (layer F.Fab))
    (pad "" smd roundrect (at -0.4325 0 90) (size 0.458 0.36) (layers F.Paste) (roundrect_rratio 0.25))
    (pad "" smd roundrect (at 0.4325 0 90) (size 0.458 0.36) (layers F.Paste) (roundrect_rratio 0.25))
    (pad 1 smd roundrect (at -0.4075 0 90) (size 0.635 0.4) (layers F.Cu F.Mask) (roundrect_rratio 0.25)
      (net 1 VDD))
    (pad 2 smd roundrect (at 0.4075 0 90) (size 0.635 0.4) (layers F.Cu F.Mask) (roundrect_rratio 0.25)
      (net 4 "Net-(Q1-Pad4)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0201_0603Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0201_0603Metric_Pad0.64x0.40mm_HandSolder (layer F.Cu) (tedit 5F6BB9E0)
    (at 116.25 91.5075 90)
    (descr "Resistor SMD 0201 (0603 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://www.vishay.com/docs/20052/crcw0201e3.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R4 (at 0 -0.65 90) (layer F.SilkS) hide)
    (fp_text value 22k (at 0 1.05 90) (layer F.Fab))
    (fp_text user %R (at 0 -0.68 90) (layer F.Fab))
    (pad 2 smd roundrect (at 0.4075 0 90) (size 0.635 0.4) (layers F.Cu F.Mask) (roundrect_rratio 0.25)
      (net 7 "Net-(R4-Pad2)"))
    (pad 1 smd roundrect (at -0.4075 0 90) (size 0.635 0.4) (layers F.Cu F.Mask) (roundrect_rratio 0.25)
      (net 4 "Net-(Q1-Pad4)"))
    (pad "" smd roundrect (at 0.4325 0 90) (size 0.458 0.36) (layers F.Paste) (roundrect_rratio 0.25))
    (pad "" smd roundrect (at -0.4325 0 90) (size 0.458 0.36) (layers F.Paste) (roundrect_rratio 0.25))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0201_0603Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0201_0603Metric_Pad0.64x0.40mm_HandSolder (layer B.Cu) (tedit 5F6BB9E0)
    (at 118.5 94.6575 90)
    (descr "Resistor SMD 0201 (0603 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://www.vishay.com/docs/20052/crcw0201e3.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R5 (at 0 1.05 270) (layer B.SilkS) hide)
    (fp_text value 100 (at 0 -1.05 270) (layer B.Fab))
    (fp_text user %R (at 0 0.68 270) (layer B.Fab))
    (pad "" smd roundrect (at -0.4325 0 90) (size 0.458 0.36) (layers B.Paste) (roundrect_rratio 0.25))
    (pad "" smd roundrect (at 0.4325 0 90) (size 0.458 0.36) (layers B.Paste) (roundrect_rratio 0.25))
    (pad 1 smd roundrect (at -0.4075 0 90) (size 0.635 0.4) (layers B.Cu B.Mask) (roundrect_rratio 0.25)
      (net 10 "Net-(C4-Pad2)"))
    (pad 2 smd roundrect (at 0.4075 0 90) (size 0.635 0.4) (layers B.Cu B.Mask) (roundrect_rratio 0.25)
      (net 4 "Net-(Q1-Pad4)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0201_0603Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module TestPoint:TestPoint_Pad_D1.0mm (layer F.Cu) (tedit 5A0F774F)
    (at 124.65 97.6)
    (descr "SMD pad as test Point, diameter 1.0mm")
    (tags "test point SMD pad")
    (attr virtual)
    (fp_text reference SDA (at -1.15 0 180) (layer F.SilkS))
    (fp_text value SDA (at 0 1.55) (layer F.Fab))
    (fp_text user %R (at 0 -1.45) (layer F.Fab))
    (pad 1 smd circle (at 0 0) (size 1 1) (layers F.Cu F.Mask)
      (net 11 "Net-(TP2-Pad1)"))
  )
  (module TestPoint:TestPoint_Pad_1.0x1.0mm (layer F.Cu) (tedit 5A0F774F)
    (at 122 88.75)
    (descr "SMD rectangular pad as test Point, square 1.0mm side length")
    (tags "test point SMD pad rectangle square")
    (attr virtual)
    (fp_text reference 20V (at 0 1.15) (layer F.SilkS))
    (fp_text value Vsnk (at 0 1.55) (layer F.Fab))
    (fp_text user %R (at 0 -1.45) (layer F.Fab))
    (pad 1 smd rect (at 0 0) (size 1 1) (layers F.Cu F.Mask)
      (net 13 Vsnk))
  )
  (module TestPoint:TestPoint_Pad_1.0x1.0mm (layer F.Cu) (tedit 5A0F774F)
    (at 119 88.75)
    (descr "SMD rectangular pad as test Point, square 1.0mm side length")
    (tags "test point SMD pad rectangle square")
    (attr virtual)
    (fp_text reference 1WIRE (at 0 1.15) (layer F.SilkS))
    (fp_text value 1Wire (at 0 1.55) (layer F.Fab))
    (fp_text user %R (at 0 -1.45) (layer F.Fab))
    (pad 1 smd rect (at 0 0) (size 1 1) (layers F.Cu F.Mask)
      (net 12 "Net-(TP4-Pad1)"))
  )
  (module TestPoint:TestPoint_Pad_1.0x1.0mm (layer F.Cu) (tedit 5A0F774F)
    (at 116 88.75)
    (descr "SMD rectangular pad as test Point, square 1.0mm side length")
    (tags "test point SMD pad rectangle square")
    (attr virtual)
    (fp_text reference GND (at 0 1.15) (layer F.SilkS))
    (fp_text value GND (at 0 1.55) (layer F.Fab))
    (fp_text user %R (at 0 -1.45) (layer F.Fab))
    (pad 1 smd rect (at 0 0) (size 1 1) (layers F.Cu F.Mask)
      (net 2 GND))
  )
  (gr_text "JET - 2021" (at 120.8 103.7) (layer F.SilkS))
  (gr_text "XPS Type-C Conversion\n\n" (at 119.7 103.5) (layer F.SilkS))
  (gr_line (start 125.5 96.75) (end 125.5 98.4) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 122.1 101.6) (end 122.1 104) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 125.5 101.6) (end 122.1 101.6) (layer Edge.Cuts) (width 0.05))
  (gr_arc (start 124.25 99.4) (end 124.25 98.4) (angle -180) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 124.25 100.4) (end 125.5 100.4) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 125.5 98.4) (end 124.25 98.4) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 109.25 100) (end 109.25 104) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 111 96.25) (end 109.25 100) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 113.5 96.25) (end 115 94.25) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 115 87.75) (end 123 87.75) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 123 87.75) (end 123 96.75) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 115 94.25) (end 115 87.75) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 111 96.25) (end 113.5 96.25) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 125.5 96.75) (end 123 96.75) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 125.5 100.4) (end 125.5 101.6) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 122.1 104) (end 109.25 104) (layer Edge.Cuts) (width 0.05))
  (zone (net 2) (net_name GND) (layer F.Cu) (hatch edge 0.508)
    (connect_pads yes (clearance 0.1524))
    (min_thickness 0.1524)
    (fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 127.55 86.8) (xy 129.45 105.65) (xy 106.3 106.25) (xy 106.2 86.35)
      )
    )
  )
  (zone (net 2) (net_name GND) (layer B.Cu) (hatch edge 0.508)
    (connect_pads yes (clearance 0.1524))
    (min_thickness 0.1524)
    (fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 129.15 85.7) (xy 130.05 106.4) (xy 104.9 106.8) (xy 104.8 85.55)
      )
    )
  )
)
