(kicad_pcb (version 4) (host pcbnew 4.0.6)
  (general
    (links 0)
    (no_connects 0)
    (area 91.650001 64.189113 218.575811 107.5)
    (thickness 1.6)
    (drawings 227)
    (tracks 0)
    (zones 0)
    (modules 51)
    (nets 1)
  )
  (page A4)
  (layers
    (0 F.Cu signal)
    (31 B.Cu signal)
    (32 B.Adhes user)
    (33 F.Adhes user)
    (34 B.Paste user)
    (35 F.Paste user)
    (36 B.SilkS user)
    (37 F.SilkS user)
    (38 B.Mask user)
    (39 F.Mask user)
    (40 Dwgs.User user)
    (41 Cmts.User user)
    (42 Eco1.User user)
    (43 Eco2.User user)
    (44 Edge.Cuts user)
    (45 Margin user)
    (46 B.CrtYd user)
    (47 F.CrtYd user)
    (48 B.Fab user)
    (49 F.Fab user)
  )
  (setup
    (last_trace_width 0.25)
    (trace_clearance 0.2)
    (zone_clearance 0.508)
    (zone_45_only no)
    (trace_min 0.2)
    (segment_width 0.2)
    (edge_width 0.15)
    (via_size 0.6)
    (via_drill 0.4)
    (via_min_size 0.4)
    (via_min_drill 0.3)
    (uvia_size 0.3)
    (uvia_drill 0.1)
    (uvias_allowed no)
    (uvia_min_size 0.2)
    (uvia_min_drill 0.1)
    (pcb_text_width 0.3)
    (pcb_text_size 1.5 1.5)
    (mod_edge_width 0.15)
    (mod_text_size 1 1)
    (mod_text_width 0.15)
    (pad_size 1 1)
    (pad_drill 0.2)
    (pad_to_mask_clearance 0.2)
    (aux_axis_origin 109 105)
    (visible_elements 7FFFFF7F)
    (pcbplotparams
      (layerselection 0x00030_80000001)
      (usegerberextensions false)
      (excludeedgelayer true)
      (linewidth 0.100000)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15)
      (hpglpenoverlay 2)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (padsonsilk false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 1)
      (scaleselection 1)
      (outputdirectory ""))
  )
  (net 0 "")
  (net_class Default "This is the default net class."
    (clearance 0.2)
    (trace_width 0.25)
    (via_dia 0.6)
    (via_drill 0.4)
    (uvia_dia 0.3)
    (uvia_drill 0.1)
  )
  (module Housings_SSOP:HTSSOP-28_4.4x9.7mm_Pitch0.65mm_ThermalPad (layer F.Cu) (tedit 595C1A10)
    (at 157.226 79.248 270)
    (descr "HTSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm; thermal pad")
    (tags "TSSOP HTSSOP 0.65 thermal pad")
    (attr smd)
    (fp_text reference REF** (at 0 -5.9 270) (layer F.SilkS) hide)
    (fp_text value HTSSOP-28_4.4x9.7mm (at 4.318 0.381 360) (layer F.SilkS))
    (fp_text user %R (at 0 0 270) (layer F.Fab) hide)
    (pad 1 smd rect (at -2.85 -4.225 270) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
    (pad 2 smd rect (at -2.85 -3.575 270) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
    (pad 3 smd rect (at -2.85 -2.925 270) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
    (pad 4 smd rect (at -2.85 -2.275 270) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
    (pad 5 smd rect (at -2.85 -1.625 270) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
    (pad 6 smd rect (at -2.85 -0.975 270) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
    (pad 7 smd rect (at -2.85 -0.325 270) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
    (pad 8 smd rect (at -2.85 0.325 270) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
    (pad 9 smd rect (at -2.85 0.975 270) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
    (pad 10 smd rect (at -2.85 1.625 270) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
    (pad 11 smd rect (at -2.85 2.275 270) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
    (pad 12 smd rect (at -2.85 2.925 270) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
    (pad 13 smd rect (at -2.85 3.575 270) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
    (pad 14 smd rect (at -2.85 4.225 270) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
    (pad 15 smd rect (at 2.85 4.225 270) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
    (pad 16 smd rect (at 2.85 3.575 270) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
    (pad 17 smd rect (at 2.85 2.925 270) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
    (pad 18 smd rect (at 2.85 2.275 270) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
    (pad 19 smd rect (at 2.85 1.625 270) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
    (pad 20 smd rect (at 2.85 0.975 270) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
    (pad 21 smd rect (at 2.85 0.325 270) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
    (pad 22 smd rect (at 2.85 -0.325 270) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
    (pad 23 smd rect (at 2.85 -0.975 270) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
    (pad 24 smd rect (at 2.85 -1.625 270) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
    (pad 25 smd rect (at 2.85 -2.275 270) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
    (pad 26 smd rect (at 2.85 -2.925 270) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
    (pad 27 smd rect (at 2.85 -3.575 270) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
    (pad 28 smd rect (at 2.85 -4.225 270) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
    (pad 29 thru_hole rect (at -1.275 4.225 270) (size 0.89 1.1) (drill 0.3) (layers *.Cu *.Mask))
    (pad 29 thru_hole rect (at -0.425 4.225 270) (size 0.89 1.1) (drill 0.3) (layers *.Cu *.Mask))
    (pad 29 thru_hole rect (at 1.275 4.225 270) (size 0.89 1.1) (drill 0.3) (layers *.Cu *.Mask))
    (pad 29 thru_hole rect (at 0.425 4.225 270) (size 0.89 1.1) (drill 0.3) (layers *.Cu *.Mask))
    (pad 29 thru_hole rect (at 0.425 3.16875 270) (size 0.89 1.1) (drill 0.3) (layers *.Cu *.Mask))
    (pad 29 thru_hole rect (at 1.275 3.16875 270) (size 0.89 1.1) (drill 0.3) (layers *.Cu *.Mask))
    (pad 29 thru_hole rect (at -0.425 3.16875 270) (size 0.89 1.1) (drill 0.3) (layers *.Cu *.Mask))
    (pad 29 thru_hole rect (at -1.275 3.16875 270) (size 0.89 1.1) (drill 0.3) (layers *.Cu *.Mask))
    (pad 29 thru_hole rect (at -1.275 2.1125 270) (size 0.89 1.1) (drill 0.3) (layers *.Cu *.Mask))
    (pad 29 thru_hole rect (at -0.425 2.1125 270) (size 0.89 1.1) (drill 0.3) (layers *.Cu *.Mask))
    (pad 29 thru_hole rect (at 1.275 2.1125 270) (size 0.89 1.1) (drill 0.3) (layers *.Cu *.Mask))
    (pad 29 thru_hole rect (at 0.425 2.1125 270) (size 0.89 1.1) (drill 0.3) (layers *.Cu *.Mask))
    (pad 29 thru_hole rect (at 0.425 1.05625 270) (size 0.89 1.1) (drill 0.3) (layers *.Cu *.Mask))
    (pad 29 thru_hole rect (at 1.275 1.05625 270) (size 0.89 1.1) (drill 0.3) (layers *.Cu *.Mask))
    (pad 29 thru_hole rect (at -0.425 1.05625 270) (size 0.89 1.1) (drill 0.3) (layers *.Cu *.Mask))
    (pad 29 thru_hole rect (at -1.275 1.05625 270) (size 0.89 1.1) (drill 0.3) (layers *.Cu *.Mask))
    (pad 29 thru_hole rect (at -1.275 0 270) (size 0.89 1.1) (drill 0.3) (layers *.Cu *.Mask))
    (pad 29 thru_hole rect (at -0.425 0 270) (size 0.89 1.1) (drill 0.3) (layers *.Cu *.Mask))
    (pad 29 thru_hole rect (at 1.275 0 270) (size 0.89 1.1) (drill 0.3) (layers *.Cu *.Mask))
    (pad 29 thru_hole rect (at 0.425 0 270) (size 0.89 1.1) (drill 0.3) (layers *.Cu *.Mask))
    (pad 29 thru_hole rect (at 0.425 -1.05625 270) (size 0.89 1.1) (drill 0.3) (layers *.Cu *.Mask))
    (pad 29 thru_hole rect (at 1.275 -1.05625 270) (size 0.89 1.1) (drill 0.3) (layers *.Cu *.Mask))
    (pad 29 thru_hole rect (at -0.425 -1.05625 270) (size 0.89 1.1) (drill 0.3) (layers *.Cu *.Mask))
    (pad 29 thru_hole rect (at -1.275 -1.05625 270) (size 0.89 1.1) (drill 0.3) (layers *.Cu *.Mask))
    (pad 29 thru_hole rect (at -1.275 -2.1125 270) (size 0.89 1.1) (drill 0.3) (layers *.Cu *.Mask))
    (pad 29 thru_hole rect (at -0.425 -2.1125 270) (size 0.89 1.1) (drill 0.3) (layers *.Cu *.Mask))
    (pad 29 thru_hole rect (at 1.275 -2.1125 270) (size 0.89 1.1) (drill 0.3) (layers *.Cu *.Mask))
    (pad 29 thru_hole rect (at 0.425 -2.1125 270) (size 0.89 1.1) (drill 0.3) (layers *.Cu *.Mask))
    (pad 29 thru_hole rect (at 0.425 -3.16875 270) (size 0.89 1.1) (drill 0.3) (layers *.Cu *.Mask))
    (pad 29 thru_hole rect (at 1.275 -3.16875 270) (size 0.89 1.1) (drill 0.3) (layers *.Cu *.Mask))
    (pad 29 thru_hole rect (at -0.425 -3.16875 270) (size 0.89 1.1) (drill 0.3) (layers *.Cu *.Mask))
    (pad 29 thru_hole rect (at -1.275 -3.16875 270) (size 0.89 1.1) (drill 0.3) (layers *.Cu *.Mask))
    (pad 29 thru_hole rect (at -1.275 -4.225 270) (size 0.89 1.1) (drill 0.3) (layers *.Cu *.Mask))
    (pad 29 thru_hole rect (at -0.425 -4.225 270) (size 0.89 1.1) (drill 0.3) (layers *.Cu *.Mask))
    (pad 29 thru_hole rect (at 1.275 -4.225 270) (size 0.89 1.1) (drill 0.3) (layers *.Cu *.Mask))
    (pad 29 thru_hole rect (at 0.425 -4.225 270) (size 0.89 1.1) (drill 0.3) (layers *.Cu *.Mask))
    (model ${KISYS3DMOD}/Housings_SSOP.3dshapes/HTSSOP-28_4.4x9.7mm_Pitch0.65mm_ThermalPad.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module SMD_Packages:1Pin (layer F.Cu) (tedit 595B3898)
    (at 110.871 76.2 270)
    (descr "module 1 pin (ou trou mecanique de percage)")
    (tags DEV)
    (fp_text reference REF** (at 0 -3.50012 270) (layer F.SilkS) hide)
    (fp_text value 1Pin (at 0.24892 3.74904 270) (layer F.Fab) hide)
    (pad 1 smd rect (at 0 0 270) (size 0.2 4) (layers F.Cu F.Paste F.Mask))
  )
  (module Wire_Pads:SolderWirePad_single_2mmDrill (layer F.Cu) (tedit 595B38A0)
    (at 115.5884 76.1034 270)
    (fp_text reference REF** (at 0 -3.81 270) (layer F.SilkS) hide)
    (fp_text value SolderWirePad_single_2mmDrill (at 0 3.8 270) (layer F.Fab) hide)
    (pad 1 thru_hole circle (at 0 0 270) (size 1 1) (drill 0.2) (layers *.Cu *.Mask))
  )
  (module Wire_Pads:SolderWirePad_single_2mmDrill (layer F.Cu) (tedit 595B3890)
    (at 115.5884 77.578 270)
    (fp_text reference REF** (at 0 -3.81 270) (layer F.SilkS) hide)
    (fp_text value SolderWirePad_single_2mmDrill (at 0 3.8 270) (layer F.Fab) hide)
    (pad 1 thru_hole circle (at 0 0 270) (size 1 1) (drill 0.3) (layers *.Cu *.Mask))
  )
  (module SMD_Packages:1Pin (layer F.Cu) (tedit 595B3885)
    (at 110.871 77.597 270)
    (descr "module 1 pin (ou trou mecanique de percage)")
    (tags DEV)
    (fp_text reference REF** (at 0 -3.50012 270) (layer F.SilkS) hide)
    (fp_text value 1Pin (at 0.24892 3.74904 270) (layer F.Fab) hide)
    (pad 1 smd rect (at 0 0 270) (size 0.3 4) (layers F.Cu F.Paste F.Mask))
  )
  (module Connectors_Molex:Molex_Microfit3_Header_02x03_Straight_43045-0628 (layer F.Cu) (tedit 595C11DF)
    (at 119.484 83 270)
    (descr "Microfit3 Header Straight 02x03 43045-0628")
    (tags "connector Microfit 02x03 header straight 3mm")
    (fp_text reference REF** (at -3 5 270) (layer F.SilkS) hide)
    (fp_text value ICSP (at -3.117 -1.547 450) (layer F.SilkS))
    (pad 1 thru_hole circle (at 0 0 270) (size 1.6 1.6) (drill 1.1) (layers *.Cu *.Mask))
    (pad 2 thru_hole circle (at -3 0 270) (size 1.6 1.6) (drill 1.1) (layers *.Cu *.Mask))
    (pad 3 thru_hole circle (at -6 0 270) (size 1.6 1.6) (drill 1.1) (layers *.Cu *.Mask))
    (pad 4 thru_hole circle (at 0 -3 270) (size 1.6 1.6) (drill 1.1) (layers *.Cu *.Mask))
    (pad 5 thru_hole circle (at -3 -3 270) (size 1.6 1.6) (drill 1.1) (layers *.Cu *.Mask))
    (pad 6 thru_hole circle (at -6 -3 270) (size 1.6 1.6) (drill 1.1) (layers *.Cu *.Mask))
  )
  (module SMD_Packages:1Pin (layer F.Cu) (tedit 5955920C)
    (at 110.71 87.479 270)
    (descr "module 1 pin (ou trou mecanique de percage)")
    (tags DEV)
    (fp_text reference REF** (at 0 -3.50012 270) (layer F.SilkS) hide)
    (fp_text value 1Pin (at 0.24892 3.74904 270) (layer F.Fab) hide)
    (pad 1 smd rect (at 0 0 270) (size 1.5 4) (layers F.Cu F.Paste F.Mask))
  )
  (module SMD_Packages:1Pin (layer F.Cu) (tedit 59559213)
    (at 110.71 90.273 270)
    (descr "module 1 pin (ou trou mecanique de percage)")
    (tags DEV)
    (fp_text reference REF** (at 0 -3.50012 270) (layer F.SilkS) hide)
    (fp_text value 1Pin (at 0.24892 3.74904 270) (layer F.Fab) hide)
    (pad 1 smd rect (at 0 0 270) (size 1.8 4) (layers F.Cu F.Paste F.Mask))
  )
  (module SMD_Packages:1Pin (layer F.Cu) (tedit 5955921A)
    (at 110.583 93.575 270)
    (descr "module 1 pin (ou trou mecanique de percage)")
    (tags DEV)
    (fp_text reference REF** (at 0 -3.50012 270) (layer F.SilkS) hide)
    (fp_text value 1Pin (at 0.24892 3.74904 270) (layer F.Fab) hide)
    (pad 1 smd rect (at 0 0 270) (size 2 4) (layers F.Cu F.Paste F.Mask))
  )
  (module SMD_Packages:1Pin (layer F.Cu) (tedit 59559203)
    (at 110.837 82.653 270)
    (descr "module 1 pin (ou trou mecanique de percage)")
    (tags DEV)
    (fp_text reference REF** (at 0 -3.50012 270) (layer F.SilkS) hide)
    (fp_text value 1Pin (at 0.24892 3.74904 270) (layer F.Fab) hide)
    (pad 1 smd rect (at 0 0 270) (size 1 4) (layers F.Cu F.Paste F.Mask))
  )
  (module SMD_Packages:1Pin (layer F.Cu) (tedit 59559207)
    (at 110.71 84.812 270)
    (descr "module 1 pin (ou trou mecanique de percage)")
    (tags DEV)
    (fp_text reference REF** (at 0 -3.50012 270) (layer F.SilkS) hide)
    (fp_text value 1Pin (at 0.24892 3.74904 270) (layer F.Fab) hide)
    (pad 1 smd rect (at 0 0 270) (size 1.2 4) (layers F.Cu F.Paste F.Mask))
  )
  (module SMD_Packages:1Pin (layer F.Cu) (tedit 59559200)
    (at 110.837 80.748 270)
    (descr "module 1 pin (ou trou mecanique de percage)")
    (tags DEV)
    (fp_text reference REF** (at 0 -3.50012 270) (layer F.SilkS) hide)
    (fp_text value 1Pin (at 0.24892 3.74904 270) (layer F.Fab) hide)
    (pad 1 smd rect (at 0 0 270) (size 0.7 4) (layers F.Cu F.Paste F.Mask))
  )
  (module SMD_Packages:1Pin (layer F.Cu) (tedit 5955915A)
    (at 110.837 79.224 270)
    (descr "module 1 pin (ou trou mecanique de percage)")
    (tags DEV)
    (fp_text reference REF** (at 0 -3.50012 270) (layer F.SilkS) hide)
    (fp_text value 1Pin (at 0.24892 3.74904 270) (layer F.Fab) hide)
    (pad 1 smd rect (at 0 0 270) (size 0.5 4) (layers F.Cu F.Paste F.Mask))
  )
  (module Wire_Pads:SolderWirePad_single_2mmDrill (layer F.Cu) (tedit 595591EA)
    (at 115.536 93.448 270)
    (fp_text reference REF** (at 0 -3.81 270) (layer F.SilkS) hide)
    (fp_text value SolderWirePad_single_2mmDrill (at -0.635 3.81 270) (layer F.Fab) hide)
    (pad 1 thru_hole circle (at 0 0 270) (size 2.5 2.5) (drill 2) (layers *.Cu *.Mask))
  )
  (module LEDs:LED_0603 (layer F.Cu) (tedit 595C1EC8)
    (at 116.078 98.679 270)
    (descr "LED 0603 smd package")
    (tags "LED led 0603 SMD smd SMT smt smdled SMDLED smtled SMTLED")
    (attr smd)
    (fp_text reference REF** (at 0 -1.25 270) (layer F.SilkS) hide)
    (fp_text value 0603 (at 0 -1.397 270) (layer F.SilkS))
    (pad 2 smd rect (at 0.8 0 90) (size 0.8 0.8) (layers F.Cu F.Paste F.Mask))
    (pad 1 smd rect (at -0.8 0 90) (size 0.8 0.8) (layers F.Cu F.Paste F.Mask))
    (model LEDs.3dshapes/LED_0603.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 180))
    )
  )
  (module LEDs:LED_0805 (layer F.Cu) (tedit 595C1C3A)
    (at 113.284 98.679 90)
    (descr "LED 0805 smd package")
    (tags "LED led 0805 SMD smd SMT smt smdled SMDLED smtled SMTLED")
    (attr smd)
    (fp_text reference REF** (at 0 -1.45 90) (layer F.SilkS) hide)
    (fp_text value 0805 (at 0 1.397 90) (layer F.SilkS))
    (pad 2 smd rect (at 1.1 0 270) (size 1.2 1.2) (layers F.Cu F.Paste F.Mask))
    (pad 1 smd rect (at -1.1 0 270) (size 1.2 1.2) (layers F.Cu F.Paste F.Mask))
    (model LEDs.3dshapes/LED_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 180))
    )
  )
  (module LEDs:LED_1206 (layer F.Cu) (tedit 595C1AF1)
    (at 110.363 98.679 90)
    (descr "LED 1206 smd package")
    (tags "LED led 1206 SMD smd SMT smt smdled SMDLED smtled SMTLED")
    (attr smd)
    (fp_text reference REF** (at 0 -1.6 90) (layer F.SilkS) hide)
    (fp_text value 1206 (at 0.114 1.521 90) (layer F.SilkS))
    (pad 2 smd rect (at 1.65 0 270) (size 1.5 1.5) (layers F.Cu F.Paste F.Mask))
    (pad 1 smd rect (at -1.65 0 270) (size 1.5 1.5) (layers F.Cu F.Paste F.Mask))
    (model LEDs.3dshapes/LED_1206.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 180))
    )
  )
  (module Resistors_ThroughHole:R_Axial_DIN0204_L3.6mm_D1.6mm_P7.62mm_Horizontal (layer F.Cu) (tedit 595C19F5)
    (at 143.891 99.187 90)
    (descr "Resistor, Axial_DIN0204 series, Axial, Horizontal, pin pitch=7.62mm, 0.16666666666666666W = 1/6W, length*diameter=3.6*1.6mm^2, http://cdn-reichelt.de/documents/datenblatt/B400/1_4W%23YAG.pdf")
    (tags "Resistor Axial_DIN0204 series Axial Horizontal pin pitch 7.62mm 0.16666666666666666W = 1/6W length 3.6mm diameter 1.6mm")
    (fp_text reference REF** (at 3.81 -1.86 90) (layer F.SilkS) hide)
    (fp_text value L3.6mm_D1.6mm (at 3.683 -1.397 90) (layer F.SilkS))
    (pad 1 thru_hole circle (at 0 0 90) (size 1.4 1.4) (drill 0.7) (layers *.Cu *.Mask))
    (pad 2 thru_hole oval (at 7.62 0 90) (size 1.4 1.4) (drill 0.7) (layers *.Cu *.Mask))
    (model Resistors_THT.3dshapes/R_Axial_DIN0204_L3.6mm_D1.6mm_P7.62mm_Horizontal.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.393701 0.393701 0.393701))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_ThroughHole:R_Axial_DIN0207_L6.3mm_D2.5mm_P10.16mm_Horizontal (layer F.Cu) (tedit 595C19F2)
    (at 147.701 100.711 90)
    (descr "Resistor, Axial_DIN0207 series, Axial, Horizontal, pin pitch=10.16mm, 0.25W = 1/4W, length*diameter=6.3*2.5mm^2, http://cdn-reichelt.de/documents/datenblatt/B400/1_4W%23YAG.pdf")
    (tags "Resistor Axial_DIN0207 series Axial Horizontal pin pitch 10.16mm 0.25W = 1/4W length 6.3mm diameter 2.5mm")
    (fp_text reference REF** (at 5.08 -2.31 90) (layer F.SilkS) hide)
    (fp_text value L6.3mm_D2.5mm (at 4.953 -2.032 90) (layer F.SilkS))
    (pad 1 thru_hole circle (at 0 0 90) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask))
    (pad 2 thru_hole oval (at 10.16 0 90) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask))
    (model Resistors_THT.3dshapes/R_Axial_DIN0207_L6.3mm_D2.5mm_P10.16mm_Horizontal.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.393701 0.393701 0.393701))
      (rotate (xyz 0 0 0))
    )
  )
  (module Discret:C1.5V8V (layer F.Cu) (tedit 595C19CD)
    (at 203.058 93.682)
    (fp_text reference REF** (at 0 2.286) (layer F.SilkS) hide)
    (fp_text value C1.5V8V (at 7.254 -0.21) (layer F.SilkS) hide)
    (fp_text user + (at -3.429 -0.127) (layer F.SilkS))
    (pad 1 thru_hole rect (at -1.905 0) (size 1.397 1.397) (drill 0.8128) (layers *.Cu *.Mask))
    (pad 2 thru_hole circle (at 1.905 0) (size 1.397 1.397) (drill 0.8128) (layers *.Cu *.Mask))
    (model Discret.3dshapes/C1.5V8V.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1.5 1.5 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Discret:C2V10 (layer F.Cu) (tedit 595C19D1)
    (at 202.808 95.932)
    (descr "Condensateur polarise")
    (tags CP)
    (fp_text reference REF** (at 0 2.54) (layer F.SilkS) hide)
    (fp_text value C2V10 (at 7.631 -0.047) (layer F.SilkS) hide)
    (pad 1 thru_hole rect (at -2.54 0) (size 1.778 1.778) (drill 1.016) (layers *.Cu *.Mask))
    (pad 2 thru_hole circle (at 2.54 0) (size 1.778 1.778) (drill 1.016) (layers *.Cu *.Mask))
    (model Discret.3dshapes/C2V10.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Wire_Pads:SolderWirePad_single_2mmDrill (layer F.Cu) (tedit 59558E1D)
    (at 115.5995 79.1605 270)
    (fp_text reference REF** (at 0 -3.81 270) (layer F.SilkS) hide)
    (fp_text value SolderWirePad_single_2mmDrill (at 0 3.8 270) (layer F.Fab) hide)
    (pad 1 thru_hole circle (at 0 0 270) (size 1 1) (drill 0.5) (layers *.Cu *.Mask))
  )
  (module Wire_Pads:SolderWirePad_single_2mmDrill (layer F.Cu) (tedit 59558D35)
    (at 115.5775 80.7465 270)
    (fp_text reference REF** (at 0 -3.81 270) (layer F.SilkS) hide)
    (fp_text value SolderWirePad_single_2mmDrill (at 2.475 4.675 270) (layer F.Fab) hide)
    (pad 1 thru_hole circle (at 0 0 270) (size 1.2 1.2) (drill 0.7) (layers *.Cu *.Mask))
  )
  (module Wire_Pads:SolderWirePad_single_2mmDrill (layer F.Cu) (tedit 59558D46)
    (at 115.5995 82.7165 270)
    (fp_text reference REF** (at 0 -3.81 270) (layer F.SilkS) hide)
    (fp_text value SolderWirePad_single_2mmDrill (at -0.635 3.81 270) (layer F.Fab) hide)
    (pad 1 thru_hole circle (at 0 0 270) (size 1.5 1.5) (drill 1) (layers *.Cu *.Mask))
  )
  (module Wire_Pads:SolderWirePad_single_2mmDrill (layer F.Cu) (tedit 59558D7E)
    (at 115.5995 85.0025 270)
    (fp_text reference REF** (at 0 -3.81 270) (layer F.SilkS) hide)
    (fp_text value SolderWirePad_single_2mmDrill (at -0.635 3.81 270) (layer F.Fab) hide)
    (pad 1 thru_hole circle (at 0 0 270) (size 1.7 1.7) (drill 1.2) (layers *.Cu *.Mask))
  )
  (module Wire_Pads:SolderWirePad_single_2mmDrill (layer F.Cu) (tedit 59558D8B)
    (at 115.5995 87.5425 270)
    (fp_text reference REF** (at 0 -3.81 270) (layer F.SilkS) hide)
    (fp_text value SolderWirePad_single_2mmDrill (at -0.635 3.81 270) (layer F.Fab) hide)
    (pad 1 thru_hole circle (at 0 0 270) (size 2 2) (drill 1.5) (layers *.Cu *.Mask))
  )
  (module Wire_Pads:SolderWirePad_single_2mmDrill (layer F.Cu) (tedit 59558D9C)
    (at 115.663 90.4 270)
    (fp_text reference REF** (at 0 -3.81 270) (layer F.SilkS) hide)
    (fp_text value SolderWirePad_single_2mmDrill (at -0.635 3.81 270) (layer F.Fab) hide)
    (pad 1 thru_hole circle (at 0 0 270) (size 2.3 2.3) (drill 1.8) (layers *.Cu *.Mask))
  )
  (module TO_SOT_Packages_SMD:SOT-89-3_Handsoldering (layer F.Cu) (tedit 595C1A4E)
    (at 146.812 80.01 90)
    (descr "SOT-89-3 Handsoldering")
    (tags "SOT-89-3 Handsoldering")
    (attr smd)
    (fp_text reference REF** (at 0.45 -3.3 90) (layer F.SilkS) hide)
    (fp_text value SOT-89-3 (at 0 3 90) (layer F.SilkS))
    (fp_text user %R (at 0.38 0 90) (layer F.Fab) hide)
    (pad 1 smd rect (at -1.98 -1.5) (size 1 2.5) (layers F.Cu F.Paste F.Mask))
    (pad 2 smd rect (at -1.98 0) (size 1 2.5) (layers F.Cu F.Paste F.Mask))
    (pad 3 smd rect (at -1.98 1.5) (size 1 2.5) (layers F.Cu F.Paste F.Mask))
    (pad 2 smd rect (at 1.98 0) (size 2 4) (layers F.Cu F.Paste F.Mask))
    (pad 2 smd trapezoid (at -0.37 0 180) (size 1.5 0.75) (rect_delta 0 0.5 ) (layers F.Cu F.Paste F.Mask))
    (model ${KISYS3DMOD}/TO_SOT_Packages_SMD.3dshapes/SOT-89-3.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module TO_SOT_Packages_SMD:SOT-223-3Lead_TabPin2 (layer F.Cu) (tedit 595C1AE3)
    (at 139.954 80.01 90)
    (descr "module CMS SOT223 4 pins")
    (tags "CMS SOT")
    (attr smd)
    (fp_text reference REF** (at 0 -4.5 90) (layer F.SilkS) hide)
    (fp_text value SOT-223-3 (at 0 4 90) (layer F.SilkS))
    (fp_text user %R (at 0 0 90) (layer F.Fab) hide)
    (pad 2 smd rect (at 3.15 0 90) (size 2 3.8) (layers F.Cu F.Paste F.Mask))
    (pad 2 smd rect (at -3.15 0 90) (size 2 1.5) (layers F.Cu F.Paste F.Mask))
    (pad 3 smd rect (at -3.15 2.3 90) (size 2 1.5) (layers F.Cu F.Paste F.Mask))
    (pad 1 smd rect (at -3.15 -2.3 90) (size 2 1.5) (layers F.Cu F.Paste F.Mask))
    (model ${KISYS3DMOD}/TO_SOT_Packages_SMD.3dshapes/SOT-223.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Power_Integrations:TO-220 (layer F.Cu) (tedit 59719278)
    (at 174.879 80.772 270)
    (descr "Non Isolated JEDEC TO-220 Package")
    (tags "Power Integration YN Package")
    (fp_text reference REF** (at 0 -4.318 270) (layer F.SilkS) hide)
    (fp_text value TO-220 (at -0.508 -3.937 270) (layer F.SilkS))
    (pad 2 thru_hole oval (at 0 0 270) (size 2.032 2.54) (drill 1.143) (layers *.Cu *.Mask))
    (pad 3 thru_hole oval (at 2.54 0 270) (size 2.032 2.54) (drill 1.143) (layers *.Cu *.Mask))
    (pad 1 thru_hole oval (at -2.54 0 270) (size 2.032 2.54) (drill 1.143) (layers *.Cu *.Mask))
  )
  (module Connectors_Terminal_Blocks:TerminalBlock_Pheonix_PT-3.5mm_2pol (layer F.Cu) (tedit 59719275)
    (at 185.42 80.264 180)
    (descr "2-way 3.5mm pitch terminal block, Phoenix PT series")
    (fp_text reference REF** (at 1.75 -4.3 180) (layer F.SilkS) hide)
    (fp_text value PT-3.5mm (at -2.54 0.508 270) (layer F.SilkS))
    (pad 2 thru_hole circle (at 3.5 0 180) (size 2.4 2.4) (drill 1.2) (layers *.Cu *.Mask))
    (pad 1 thru_hole rect (at 0 0 180) (size 2.4 2.4) (drill 1.2) (layers *.Cu *.Mask))
    (model Terminal_Blocks.3dshapes/TerminalBlock_Pheonix_PT-3.5mm_2pol.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connectors_Terminal_Blocks:TerminalBlock_Pheonix_MPT-2.54mm_2pol (layer F.Cu) (tedit 595C1D66)
    (at 193.04 78.74 180)
    (descr "2-way 2.54mm pitch terminal block, Phoenix MPT series")
    (fp_text reference REF** (at 1.27 -4.50088 180) (layer F.SilkS) hide)
    (fp_text value MPT-2.54mm (at -2.413 -0.635 270) (layer F.SilkS))
    (pad 2 thru_hole oval (at 2.54 0 180) (size 1.99898 1.99898) (drill 1.09728) (layers *.Cu *.Mask))
    (pad 1 thru_hole rect (at 0 0 180) (size 1.99898 1.99898) (drill 1.09728) (layers *.Cu *.Mask))
    (model Terminal_Blocks.3dshapes/TerminalBlock_Pheonix_MPT-2.54mm_2pol.wrl
      (at (xyz 0.05 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Crystals:Crystal_SMD_HC49-SD (layer F.Cu) (tedit 595C1BB1)
    (at 137.9728 93.6879 90)
    (descr "SMD Crystal HC-49-SD http://cdn-reichelt.de/documents/datenblatt/B400/xxx-HC49-SMD.pdf, 11.4x4.7mm^2 package")
    (tags "SMD SMT crystal")
    (attr smd)
    (fp_text reference REF** (at 0 -3.55 90) (layer F.SilkS) hide)
    (fp_text value Crystal_SMD_HC49-SD (at -0.349 3.218 90) (layer F.SilkS))
    (fp_text user %R (at 0 0 90) (layer F.Fab) hide)
    (pad 1 smd rect (at -4.25 0 90) (size 4.5 2) (layers F.Cu F.Paste F.Mask))
    (pad 2 smd rect (at 4.25 0 90) (size 4.5 2) (layers F.Cu F.Paste F.Mask))
    (model ${KISYS3DMOD}/Crystals.3dshapes/Crystal_SMD_HC49-SD.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module SMD_Packages:SOIC-8-N (layer F.Cu) (tedit 595C1A22)
    (at 167.005 78.486 270)
    (descr "Module Narrow CMS SOJ 8 pins large")
    (tags "CMS SOJ")
    (attr smd)
    (fp_text reference REF** (at 0 -1.27 270) (layer F.SilkS) hide)
    (fp_text value SOIC-8-N (at 0 -4.572 270) (layer F.SilkS))
    (pad 8 smd rect (at -1.905 -3.175 270) (size 0.508 1.143) (layers F.Cu F.Paste F.Mask))
    (pad 7 smd rect (at -0.635 -3.175 270) (size 0.508 1.143) (layers F.Cu F.Paste F.Mask))
    (pad 6 smd rect (at 0.635 -3.175 270) (size 0.508 1.143) (layers F.Cu F.Paste F.Mask))
    (pad 5 smd rect (at 1.905 -3.175 270) (size 0.508 1.143) (layers F.Cu F.Paste F.Mask))
    (pad 4 smd rect (at 1.905 3.175 270) (size 0.508 1.143) (layers F.Cu F.Paste F.Mask))
    (pad 3 smd rect (at 0.635 3.175 270) (size 0.508 1.143) (layers F.Cu F.Paste F.Mask))
    (pad 2 smd rect (at -0.635 3.175 270) (size 0.508 1.143) (layers F.Cu F.Paste F.Mask))
    (pad 1 smd rect (at -1.905 3.175 270) (size 0.508 1.143) (layers F.Cu F.Paste F.Mask))
    (model SMD_Packages.3dshapes/SOIC-8-N.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.5 0.38 0.5))
      (rotate (xyz 0 0 0))
    )
  )
  (module TO_SOT_Packages_SMD:SOT-23-5 (layer F.Cu) (tedit 595C1BA4)
    (at 127.508 82.296 270)
    (descr "5-pin SOT23 package")
    (tags SOT-23-5)
    (attr smd)
    (fp_text reference REF** (at 0 -2.9 270) (layer F.SilkS) hide)
    (fp_text value SOT-23 (at 0 -2.413 270) (layer F.SilkS))
    (fp_text user %R (at 0 0 270) (layer F.Fab) hide)
    (pad 1 smd rect (at -1.1 -0.95 270) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask))
    (pad 2 smd rect (at -1.1 0 270) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask))
    (pad 3 smd rect (at -1.1 0.95 270) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask))
    (pad 4 smd rect (at 1.1 0.95 270) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask))
    (pad 5 smd rect (at 1.1 -0.95 270) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask))
    (model ${KISYS3DMOD}/TO_SOT_Packages_SMD.3dshapes/SOT-23-5.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Housings_DFN_QFN:QFN-32-1EP_5x5mm_Pitch0.5mm (layer F.Cu) (tedit 595C1D81)
    (at 167.005 84.582)
    (descr "UH Package; 32-Lead Plastic QFN (5mm x 5mm); (see Linear Technology QFN_32_05-08-1693.pdf)")
    (tags "QFN 0.5")
    (attr smd)
    (fp_text reference REF** (at 0 -3.75) (layer F.SilkS) hide)
    (fp_text value QFN-32-1EP_5x5mm (at 0 3.683 180) (layer F.SilkS))
    (pad 1 smd rect (at -2.4 -1.75) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
    (pad 2 smd rect (at -2.4 -1.25) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
    (pad 3 smd rect (at -2.4 -0.75) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
    (pad 4 smd rect (at -2.4 -0.25) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
    (pad 5 smd rect (at -2.4 0.25) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
    (pad 6 smd rect (at -2.4 0.75) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
    (pad 7 smd rect (at -2.4 1.25) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
    (pad 8 smd rect (at -2.4 1.75) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
    (pad 9 smd rect (at -1.75 2.4 90) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
    (pad 10 smd rect (at -1.25 2.4 90) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
    (pad 11 smd rect (at -0.75 2.4 90) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
    (pad 12 smd rect (at -0.25 2.4 90) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
    (pad 13 smd rect (at 0.25 2.4 90) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
    (pad 14 smd rect (at 0.75 2.4 90) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
    (pad 15 smd rect (at 1.25 2.4 90) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
    (pad 16 smd rect (at 1.75 2.4 90) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
    (pad 17 smd rect (at 2.4 1.75) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
    (pad 18 smd rect (at 2.4 1.25) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
    (pad 19 smd rect (at 2.4 0.75) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
    (pad 20 smd rect (at 2.4 0.25) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
    (pad 21 smd rect (at 2.4 -0.25) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
    (pad 22 smd rect (at 2.4 -0.75) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
    (pad 23 smd rect (at 2.4 -1.25) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
    (pad 24 smd rect (at 2.4 -1.75) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
    (pad 25 smd rect (at 1.75 -2.4 90) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
    (pad 26 smd rect (at 1.25 -2.4 90) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
    (pad 27 smd rect (at 0.75 -2.4 90) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
    (pad 28 smd rect (at 0.25 -2.4 90) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
    (pad 29 smd rect (at -0.25 -2.4 90) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
    (pad 30 smd rect (at -0.75 -2.4 90) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
    (pad 31 smd rect (at -1.25 -2.4 90) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
    (pad 32 smd rect (at -1.75 -2.4 90) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
    (pad 33 smd rect (at 0.8625 0.8625) (size 1.725 1.725) (layers F.Cu F.Paste F.Mask)
      (solder_paste_margin_ratio -0.2))
    (pad 33 smd rect (at 0.8625 -0.8625) (size 1.725 1.725) (layers F.Cu F.Paste F.Mask)
      (solder_paste_margin_ratio -0.2))
    (pad 33 smd rect (at -0.8625 0.8625) (size 1.725 1.725) (layers F.Cu F.Paste F.Mask)
      (solder_paste_margin_ratio -0.2))
    (pad 33 smd rect (at -0.8625 -0.8625) (size 1.725 1.725) (layers F.Cu F.Paste F.Mask)
      (solder_paste_margin_ratio -0.2))
    (model Housings_DFN_QFN.3dshapes/QFN-32-1EP_5x5mm_Pitch0.5mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Housings_SSOP:TSSOP-8_3x3mm_Pitch0.65mm (layer F.Cu) (tedit 595C1A3C)
    (at 156.591 94.488)
    (descr "TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot505-1_po.pdf)")
    (tags "SSOP 0.65")
    (attr smd)
    (fp_text reference REF** (at 0 -2.55) (layer F.SilkS) hide)
    (fp_text value TSSOP-8_3x3mm (at 0 2.55) (layer F.SilkS))
    (fp_text user %R (at 0 0) (layer F.Fab) hide)
    (pad 1 smd rect (at -2.15 -0.975) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
    (pad 2 smd rect (at -2.15 -0.325) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
    (pad 3 smd rect (at -2.15 0.325) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
    (pad 4 smd rect (at -2.15 0.975) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
    (pad 5 smd rect (at 2.15 0.975) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
    (pad 6 smd rect (at 2.15 0.325) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
    (pad 7 smd rect (at 2.15 -0.325) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
    (pad 8 smd rect (at 2.15 -0.975) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask))
    (model ${KISYS3DMOD}/Housings_SSOP.3dshapes/TSSOP-8_3x3mm_Pitch0.65mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Housings_DIP:DIP-28_W7.62mm_Socket (layer F.Cu) (tedit 595C1D0F)
    (at 151.384 98.933 90)
    (descr "28-lead dip package, row spacing 7.62 mm (300 mils), Socket")
    (tags "DIL DIP PDIP 2.54mm 7.62mm 300mil Socket")
    (fp_text reference REF** (at 3.81 -2.39 90) (layer F.SilkS) hide)
    (fp_text value DIP-28_W7.62mm (at 9.906 29.21 180) (layer F.SilkS))
    (fp_text user %R (at 3.81 16.51 90) (layer F.Fab) hide)
    (pad 1 thru_hole rect (at 0 0 90) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask))
    (pad 15 thru_hole oval (at 7.62 33.02 90) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask))
    (pad 2 thru_hole oval (at 0 2.54 90) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask))
    (pad 16 thru_hole oval (at 7.62 30.48 90) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask))
    (pad 3 thru_hole oval (at 0 5.08 90) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask))
    (pad 17 thru_hole oval (at 7.62 27.94 90) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask))
    (pad 4 thru_hole oval (at 0 7.62 90) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask))
    (pad 18 thru_hole oval (at 7.62 25.4 90) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask))
    (pad 5 thru_hole oval (at 0 10.16 90) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask))
    (pad 19 thru_hole oval (at 7.62 22.86 90) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask))
    (pad 6 thru_hole oval (at 0 12.7 90) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask))
    (pad 20 thru_hole oval (at 7.62 20.32 90) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask))
    (pad 7 thru_hole oval (at 0 15.24 90) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask))
    (pad 21 thru_hole oval (at 7.62 17.78 90) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask))
    (pad 8 thru_hole oval (at 0 17.78 90) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask))
    (pad 22 thru_hole oval (at 7.62 15.24 90) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask))
    (pad 9 thru_hole oval (at 0 20.32 90) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask))
    (pad 23 thru_hole oval (at 7.62 12.7 90) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask))
    (pad 10 thru_hole oval (at 0 22.86 90) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask))
    (pad 24 thru_hole oval (at 7.62 10.16 90) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask))
    (pad 11 thru_hole oval (at 0 25.4 90) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask))
    (pad 25 thru_hole oval (at 7.62 7.62 90) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask))
    (pad 12 thru_hole oval (at 0 27.94 90) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask))
    (pad 26 thru_hole oval (at 7.62 5.08 90) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask))
    (pad 13 thru_hole oval (at 0 30.48 90) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask))
    (pad 27 thru_hole oval (at 7.62 2.54 90) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask))
    (pad 14 thru_hole oval (at 0 33.02 90) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask))
    (pad 28 thru_hole oval (at 7.62 0 90) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask))
    (model ${KISYS3DMOD}/Housings_DIP.3dshapes/DIP-28_W7.62mm_Socket.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_Array_Convex_4x0603 (layer F.Cu) (tedit 595C1B16)
    (at 180.848 94.488 270)
    (descr "Chip Resistor Network, ROHM MNR14 (see mnr_g.pdf)")
    (tags "resistor array")
    (attr smd)
    (fp_text reference REF** (at 0 -2.8 270) (layer F.SilkS) hide)
    (fp_text value Con_4x0603 (at 2.25 0 360) (layer F.SilkS))
    (fp_text user %R (at 0 0 360) (layer F.Fab) hide)
    (pad 1 smd rect (at -0.9 -1.2 270) (size 0.8 0.5) (layers F.Cu F.Paste F.Mask))
    (pad 3 smd rect (at -0.9 0.4 270) (size 0.8 0.4) (layers F.Cu F.Paste F.Mask))
    (pad 2 smd rect (at -0.9 -0.4 270) (size 0.8 0.4) (layers F.Cu F.Paste F.Mask))
    (pad 4 smd rect (at -0.9 1.2 270) (size 0.8 0.5) (layers F.Cu F.Paste F.Mask))
    (pad 7 smd rect (at 0.9 -0.4 270) (size 0.8 0.4) (layers F.Cu F.Paste F.Mask))
    (pad 8 smd rect (at 0.9 -1.2 270) (size 0.8 0.5) (layers F.Cu F.Paste F.Mask))
    (pad 6 smd rect (at 0.9 0.4 270) (size 0.8 0.4) (layers F.Cu F.Paste F.Mask))
    (pad 5 smd rect (at 0.9 1.2 270) (size 0.8 0.5) (layers F.Cu F.Paste F.Mask))
    (model ${KISYS3DMOD}/Resistors_SMD.3dshapes/R_Array_Convex_4x0603.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_Array_Convex_4x1206 (layer F.Cu) (tedit 595C1B1B)
    (at 169.164 94.742 90)
    (descr "Chip Resistor Network, ROHM MNR34 (see mnr_g.pdf)")
    (tags "resistor array")
    (attr smd)
    (fp_text reference REF** (at 0 -3.5 90) (layer F.SilkS) hide)
    (fp_text value Con_4x1206 (at 0 0 180) (layer F.SilkS))
    (fp_text user %R (at 0 0 180) (layer F.Fab) hide)
    (pad 1 smd rect (at -1.5 -2 90) (size 0.9 0.9) (layers F.Cu F.Paste F.Mask))
    (pad 4 smd rect (at -1.5 2 90) (size 0.9 0.9) (layers F.Cu F.Paste F.Mask))
    (pad 2 smd rect (at -1.5 -0.66 90) (size 0.9 0.9) (layers F.Cu F.Paste F.Mask))
    (pad 3 smd rect (at -1.5 0.66 90) (size 0.9 0.9) (layers F.Cu F.Paste F.Mask))
    (pad 7 smd rect (at 1.5 -0.66 90) (size 0.9 0.9) (layers F.Cu F.Paste F.Mask))
    (pad 8 smd rect (at 1.5 -2 90) (size 0.9 0.9) (layers F.Cu F.Paste F.Mask))
    (pad 5 smd rect (at 1.5 2 90) (size 0.9 0.9) (layers F.Cu F.Paste F.Mask))
    (pad 6 smd rect (at 1.5 0.66 90) (size 0.9 0.9) (layers F.Cu F.Paste F.Mask))
    (model ${KISYS3DMOD}/Resistors_SMD.3dshapes/R_Array_Convex_4x1206.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:CP_Elec_6.3x4.5 (layer F.Cu) (tedit 595C198A)
    (at 191.643 95.885 180)
    (descr "SMT capacitor, aluminium electrolytic, 6.3x4.5")
    (attr smd)
    (fp_text reference REF** (at 0 4.56 180) (layer F.SilkS) hide)
    (fp_text value CP6.3x4.5 (at 0 4.191 180) (layer F.SilkS))
    (fp_text user + (at -1.73 -0.08 180) (layer F.Fab))
    (fp_text user + (at -4.28 2.96 180) (layer F.SilkS))
    (fp_text user %R (at 0 4.56 180) (layer F.Fab) hide)
    (pad 1 smd rect (at -2.7 0) (size 3.5 1.6) (layers F.Cu F.Paste F.Mask))
    (pad 2 smd rect (at 2.7 0) (size 3.5 1.6) (layers F.Cu F.Paste F.Mask))
    (model Capacitors_SMD.3dshapes/CP_Elec_6.3x4.5.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 180))
    )
  )
  (module Buttons_Switches_SMD:SW_SPST_B3S-1100 (layer F.Cu) (tedit 59928AAA)
    (at 202.057 79.883)
    (descr "Surface Mount Tactile Switch for High-Density Packaging with Ground Terminal")
    (tags "Tactile Switch")
    (attr smd)
    (fp_text reference REF** (at 0 -5.42) (layer F.SilkS) hide)
    (fp_text value SW_SPST (at 0.0254 4.9276) (layer F.SilkS))
    (fp_text user %R (at 0 -5.42) (layer F.Fab) hide)
    (pad 1 smd rect (at -3.98 -3.17) (size 1.55 1.3) (layers F.Cu F.Paste F.Mask))
    (pad 1 smd rect (at 3.98 -3.17) (size 1.55 1.3) (layers F.Cu F.Paste F.Mask))
    (pad 2 smd rect (at -3.98 1.33) (size 1.55 1.3) (layers F.Cu F.Paste F.Mask))
    (pad 2 smd rect (at 3.98 1.33) (size 1.55 1.3) (layers F.Cu F.Paste F.Mask))
    (pad 3 smd rect (at 0 3.17) (size 1.3 1.7) (layers F.Cu F.Paste F.Mask))
  )
  (module Buttons_Switches_SMD:SW_SPST_B3U-1000P (layer F.Cu) (tedit 59928A97)
    (at 196.088 87.122)
    (descr "Ultra-small-sized Tactile Switch with High Contact Reliability, Top-actuated Model, without Ground Terminal, without Boss")
    (tags "Tactile Switch")
    (attr smd)
    (fp_text reference REF** (at 0 -2.5) (layer F.SilkS) hide)
    (fp_text value SW_SPST_1000P (at -1.2446 2.286) (layer F.SilkS))
    (fp_text user %R (at 0 -2.5) (layer F.Fab) hide)
    (pad 1 smd rect (at -1.7 0) (size 0.9 1.7) (layers F.Cu F.Paste F.Mask))
    (pad 2 smd rect (at 1.7 0) (size 0.9 1.7) (layers F.Cu F.Paste F.Mask))
  )
  (module Capacitors_ThroughHole:CP_Radial_Tantal_D5.0mm_P2.50mm (layer F.Cu) (tedit 595C19C9)
    (at 202.058 91.682)
    (descr "CP, Radial_Tantal series, Radial, pin pitch=2.50mm, , diameter=5.0mm, Tantal Electrolytic Capacitor, http://cdn-reichelt.de/documents/datenblatt/B300/TANTAL-TB-Serie%23.pdf")
    (tags "CP Radial_Tantal series Radial pin pitch 2.50mm  diameter 5.0mm Tantal Electrolytic Capacitor")
    (fp_text reference REF** (at 1.25 -3.56) (layer F.SilkS) hide)
    (fp_text value D5.0mm_P2.50mm (at 10.794 0.012) (layer F.SilkS) hide)
    (fp_text user %R (at 0.775 0) (layer F.Fab) hide)
    (pad 1 thru_hole rect (at 0 0) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask))
    (pad 2 thru_hole circle (at 2.5 0) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask))
    (model ${KISYS3DMOD}/Capacitors_THT.3dshapes/CP_Radial_Tantal_D5.0mm_P2.50mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.393701 0.393701 0.393701))
      (rotate (xyz 0 0 0))
    )
  )
  (module Crystals:Crystal_HC18-U_Vertical (layer F.Cu) (tedit 59570350)
    (at 137.9806 96.1524 90)
    (descr "Crystal THT HC-18/U, http://5hertz.com/pdfs/04404_D.pdf")
    (tags "THT crystalHC-18/U")
    (fp_text reference REF** (at 2.45 -3.525 90) (layer F.SilkS) hide)
    (fp_text value Crystal_HC18-U_Vertical (at 2.45 3.525 90) (layer F.Fab) hide)
    (fp_text user %R (at 2.45 0 90) (layer F.Fab) hide)
    (pad 1 thru_hole circle (at 0 0 90) (size 1.5 1.5) (drill 0.8) (layers *.Cu *.Mask))
    (pad 2 thru_hole circle (at 4.9 0 90) (size 1.5 1.5) (drill 0.8) (layers *.Cu *.Mask))
    (model ${KISYS3DMOD}/Crystals.3dshapes/Crystal_HC18-U_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.393701 0.393701 0.393701))
      (rotate (xyz 0 0 0))
    )
  )
  (module SMD_Packages:VLM0806_Housing_Handsoldering (layer F.Cu) (tedit 595C1B20)
    (at 133.604 80.01)
    (descr "VLM0806, Housing, Rohm,")
    (tags "VLM0806, Housing, Rohm,")
    (attr smd)
    (fp_text reference REF** (at 0.07112 -2.99974) (layer F.SilkS) hide)
    (fp_text value VLM0806 (at 0 1.25) (layer F.SilkS))
    (pad 1 smd rect (at 0.20066 0.29972) (size 0.29972 0.29972) (layers F.Cu F.Paste F.Mask))
    (pad 2 smd rect (at -0.20066 0.29972) (size 0.29972 0.29972) (layers F.Cu F.Paste F.Mask))
    (pad 3 smd rect (at 0 -0.29972) (size 0.70104 0.29972) (layers F.Cu F.Paste F.Mask))
    (pad 1 smd rect (at 0.8001 0.39878) (size 1.50114 0.50038) (layers F.Cu F.Paste F.Mask))
    (pad 2 smd rect (at -0.8001 0.39878) (size 1.50114 0.50038) (layers F.Cu F.Paste F.Mask))
    (pad 3 smd rect (at 0 -0.90932 90) (size 1.50114 0.50038) (layers F.Cu F.Paste F.Mask))
    (model SMD_Packages.3dshapes/VLM0806_Housing_Handsoldering.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.3937 0.3937 0.3937))
      (rotate (xyz 0 0 0))
    )
  )
  (module LEDs:LED_0402 (layer F.Cu) (tedit 595C1C3B)
    (at 118.618 98.552 90)
    (descr "LED 0402 smd package")
    (tags "LED led 0402 SMD smd SMT smt smdled SMDLED smtled SMTLED")
    (attr smd)
    (fp_text reference REF** (at 0 -1.2 90) (layer F.SilkS) hide)
    (fp_text value 0402 (at 0 1.143 90) (layer F.SilkS))
    (pad 2 smd rect (at 0.55 0 270) (size 0.6 0.7) (layers F.Cu F.Paste F.Mask))
    (pad 1 smd rect (at -0.55 0 270) (size 0.6 0.7) (layers F.Cu F.Paste F.Mask))
    (model LEDs.3dshapes/LED_0402.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 180))
    )
  )
  (module TO_SOT_Packages_SMD:SOT-23 (layer F.Cu) (tedit 59928B79)
    (at 127.381 77.216 270)
    (descr "SOT-23, Standard")
    (tags SOT-23)
    (attr smd)
    (fp_text reference REF** (at 0 -2.5 270) (layer F.SilkS) hide)
    (fp_text value SOT-23 (at 0.254 -2.159 270) (layer F.SilkS))
    (fp_text user %R (at 0 0 270) (layer F.Fab) hide)
    (pad 1 smd rect (at -1 -0.95 270) (size 0.9 0.8) (layers F.Cu F.Paste F.Mask))
    (pad 2 smd rect (at -1 0.95 270) (size 0.9 0.8) (layers F.Cu F.Paste F.Mask))
    (pad 3 smd rect (at 1 0 270) (size 0.9 0.8) (layers F.Cu F.Paste F.Mask))
    (model ${KISYS3DMOD}/TO_SOT_Packages_SMD.3dshapes/SOT-23.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module SMD_Packages:Fuse_SMD (layer F.Cu) (tedit 595C2707)
    (at 120.904 90.297)
    (attr smd)
    (fp_text reference REF** (at 0 -0.508) (layer F.SilkS) hide)
    (fp_text value Fuse_SMD (at 3.175 -0.254 90) (layer F.SilkS))
    (pad 1 smd rect (at 0 -3.175) (size 3.556 4.191) (layers F.Cu F.Paste F.Mask))
    (pad 2 smd rect (at 0 3.175) (size 3.556 4.191) (layers F.Cu F.Paste F.Mask))
    (model SMD_Packages.3dshapes/Fuse_SMD.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.4 0.4 0.4))
      (rotate (xyz 0 0 90))
    )
  )
  (module "SWM Custom Footprint:SMD_SPST_2060834" (layer F.Cu) (tedit 59928C0C)
    (at 127.254 87.122)
    (descr http://www.farnell.com/datasheets/1807489.pdf?_ga=2.208957906.1192718177.1500510013-952116435.1487714873)
    (tags "Element14,Part Number 5-1437565-0")
    (fp_text reference SPST-elmt14 (at 6.35 5.08 90) (layer F.SilkS))
    (fp_text value "SWM - Element 14 - SMD SPST - 2060834" (at 6.858 22.86) (layer F.Fab) hide)
    (pad 3 smd rect (at 0 0) (size 1.4 2.1) (layers F.Cu F.Paste F.Mask))
    (pad 1 smd rect (at 4.46 0) (size 1.4 2.1) (layers F.Cu F.Paste F.Mask))
    (pad 2 smd rect (at 4.46 9.1) (size 1.4 2.1) (layers F.Cu F.Paste F.Mask))
    (pad 4 smd rect (at 0 9.1) (size 1.4 2.1) (layers F.Cu F.Paste F.Mask))
  )
  (module "SWM Custom Footprint:Element14-Resonator-2443265-16mhz-v2" (layer F.Cu) (tedit 59928C66)
    (at 151.638 87.63)
    (fp_text reference Resonator (at 2.032 0.762) (layer F.SilkS))
    (fp_text value Element14-Resonator-2443265-16mhz (at 1.3 -3.4) (layer F.Fab) hide)
    (fp_text user 1 (at 4.1 -0.9) (layer F.Fab))
    (pad 1 smd rect (at 2.9 -0.9) (size 0.4 1.7) (layers F.Cu F.Paste F.Mask))
    (pad 2 smd rect (at 1.8 -0.9) (size 0.4 1.7) (layers F.Cu F.Paste F.Mask))
    (pad 3 smd rect (at 0.7 -0.9) (size 0.4 1.7) (layers F.Cu F.Paste F.Mask))
  )
  (gr_text SC-59 (at 130.81 77.216 90) (layer F.SilkS))
  (gr_text 10 (at 207.1012 84.5816 90) (layer F.SilkS))
  (gr_text 5 (at 207.6012 79.5816 90) (layer F.SilkS))
  (gr_text 20 (at 207.1012 94.5816 90) (layer F.SilkS))
  (gr_text 20 (at 207.1012 94.5816 90) (layer F.SilkS))
  (gr_text 5 (at 207.6012 79.5816 90) (layer F.SilkS))
  (gr_text 10 (at 207.1012 84.5816 90) (layer F.SilkS))
  (gr_text 10 (at 200 102.25) (layer F.SilkS))
  (gr_text 5 (at 205 102.75) (layer F.SilkS))
  (gr_text 20 (at 190 102.25) (layer F.SilkS))
  (gr_text RST (at 119.507 81.788) (layer F.SilkS))
  (gr_text SCK (at 119.507 78.74) (layer F.SilkS))
  (gr_text MISO (at 119.38 75.692) (layer F.SilkS))
  (gr_text MOSI (at 122.555 78.74) (layer F.SilkS))
  (gr_text VCC (at 122.428 75.692) (layer F.SilkS))
  (gr_text GND (at 122.428 81.788) (layer F.SilkS))
  (gr_text .2 (at 113.6834 76.1034 270) (layer F.SilkS))
  (gr_text .3 (at 113.6834 77.578 270) (layer F.SilkS))
  (gr_text 2.0 (at 113.6945 93.8925 270) (layer F.SilkS))
  (gr_text 1.8 (at 113.758 90.4 270) (layer F.SilkS))
  (gr_text 1.5 (at 113.6945 87.5425 270) (layer F.SilkS))
  (gr_text 1.2 (at 113.6945 85.0025 270) (layer F.SilkS))
  (gr_text 1.0 (at 113.6945 82.7165 270) (layer F.SilkS))
  (gr_text .7 (at 113.6945 80.6845 270) (layer F.SilkS))
  (gr_text .5 (at 113.6945 79.1605 270) (layer F.SilkS))
  (dimension 101 (width 0.3) (layer Dwgs.User)
    (gr_text "101.000 mm" (at 159.5 65.65) (layer Dwgs.User))
    (feature1 (pts (xy 109 75) (xy 109 64.3)))
    (feature2 (pts (xy 210 75) (xy 210 64.3)))
    (crossbar (pts (xy 210 67) (xy 109 67)))
    (arrow1a (pts (xy 109 67) (xy 110.126504 66.413579)))
    (arrow1b (pts (xy 109 67) (xy 110.126504 67.586421)))
    (arrow2a (pts (xy 210 67) (xy 208.873496 66.413579)))
    (arrow2b (pts (xy 210 67) (xy 208.873496 67.586421)))
  )
  (dimension 30 (width 0.3) (layer Dwgs.User)
    (gr_text "30.000 mm" (at 98.15 90 90) (layer Dwgs.User))
    (feature1 (pts (xy 109 75) (xy 96.8 75)))
    (feature2 (pts (xy 109 105) (xy 96.8 105)))
    (crossbar (pts (xy 99.5 105) (xy 99.5 75)))
    (arrow1a (pts (xy 99.5 75) (xy 100.086421 76.126504)))
    (arrow1b (pts (xy 99.5 75) (xy 98.913579 76.126504)))
    (arrow2a (pts (xy 99.5 105) (xy 100.086421 103.873496)))
    (arrow2b (pts (xy 99.5 105) (xy 98.913579 103.873496)))
  )
  (target plus (at 210 75) (size 5) (width 0.15) (layer Edge.Cuts))
  (target plus (at 109 105) (size 5) (width 0.15) (layer Edge.Cuts))
  (gr_text 100 (at 110 102.25) (layer F.SilkS))
  (gr_text 90 (at 120.015 102.235) (layer F.SilkS))
  (gr_text "80\n" (at 130 102.25) (layer F.SilkS))
  (gr_text 70 (at 139.954 102.235) (layer F.SilkS))
  (gr_text 60 (at 150 102.25) (layer F.SilkS))
  (gr_text 50 (at 160 102.25) (layer F.SilkS))
  (gr_text 40 (at 170 102.25) (layer F.SilkS))
  (gr_line (start 210 75) (end 210 105) (angle 90) (layer Edge.Cuts) (width 0.15))
  (gr_line (start 109 75) (end 210 75) (angle 90) (layer Edge.Cuts) (width 0.15))
  (gr_line (start 109 105) (end 109 75) (angle 90) (layer Edge.Cuts) (width 0.15))
  (gr_line (start 210 105) (end 109 105) (angle 90) (layer Edge.Cuts) (width 0.15))
  (gr_text 20 (at 190 102.25) (layer F.SilkS))
  (gr_text 5 (at 205 102.75) (layer F.SilkS))
  (gr_text 30 (at 180 102.25) (layer F.SilkS))
  (gr_text 10 (at 200 102.25) (layer F.SilkS))
)
