(kicad_pcb (version 20171130) (host pcbnew "(5.1.10)-1")
  (general
    (thickness 1.6)
    (drawings 57)
    (tracks 185)
    (zones 0)
    (modules 44)
    (nets 20)
  )
  (page A4)
  (layers
    (0 F.Cu signal)
    (31 B.Cu signal)
    (32 B.Adhes user)
    (33 F.Adhes user)
    (34 B.Paste user)
    (35 F.Paste user)
    (36 B.SilkS user)
    (37 F.SilkS user)
    (38 B.Mask user)
    (39 F.Mask user)
    (40 Dwgs.User user)
    (41 Cmts.User user)
    (42 Eco1.User user)
    (43 Eco2.User user)
    (44 Edge.Cuts user)
    (45 Margin user)
    (46 B.CrtYd user)
    (47 F.CrtYd user)
    (48 B.Fab user hide)
    (49 F.Fab user hide)
  )
  (setup
    (last_trace_width 0.5)
    (user_trace_width 0.25)
    (user_trace_width 0.4)
    (user_trace_width 0.5)
    (user_trace_width 0.6)
    (user_trace_width 0.7)
    (user_trace_width 0.75)
    (user_trace_width 0.8)
    (user_trace_width 1)
    (user_trace_width 1.2)
    (user_trace_width 2)
    (user_trace_width 2.54)
    (user_trace_width 3)
    (user_trace_width 5)
    (user_trace_width 7)
    (user_trace_width 10)
    (trace_clearance 0.2)
    (zone_clearance 0.2)
    (zone_45_only no)
    (trace_min 0.1524)
    (via_size 0.8)
    (via_drill 0.4)
    (via_min_size 0.508)
    (via_min_drill 0.254)
    (user_via 0.508 0.254)
    (user_via 0.6 0.3)
    (user_via 0.7 0.3)
    (user_via 0.75 0.3)
    (user_via 0.8 0.35)
    (user_via 0.9 0.425)
    (user_via 1 0.5)
    (user_via 1.25 0.6)
    (user_via 1.5 0.8)
    (uvia_size 0.3)
    (uvia_drill 0.1)
    (uvias_allowed no)
    (uvia_min_size 0.2)
    (uvia_min_drill 0.1)
    (edge_width 0.05)
    (segment_width 0.2)
    (pcb_text_width 0.3)
    (pcb_text_size 1.5 1.5)
    (mod_edge_width 0.12)
    (mod_text_size 1 1)
    (mod_text_width 0.15)
    (pad_size 1.1 0.9)
    (pad_drill 0)
    (pad_to_mask_clearance 0.051)
    (solder_mask_min_width 0.25)
    (aux_axis_origin 0 0)
    (visible_elements 7FFDFF7F)
    (pcbplotparams
      (layerselection 0x010fc_ffffffff)
      (usegerberextensions false)
      (usegerberattributes false)
      (usegerberadvancedattributes false)
      (creategerberjobfile false)
      (excludeedgelayer true)
      (linewidth 0.100000)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (padsonsilk false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 1)
      (scaleselection 1)
      (outputdirectory ""))
  )
  (net 0 "")
  (net 1 GND)
  (net 2 +3V3)
  (net 3 Vh)
  (net 4 /EN)
  (net 5 /VHp)
  (net 6 /LED_EN)
  (net 7 /LED_R)
  (net 8 /OVP/OVP_SW)
  (net 9 /OVP/OVP_TRIG)
  (net 10 /3V6/BuckIn)
  (net 11 /3V6/COMP)
  (net 12 /3V6/SS)
  (net 13 /3V6/VBsw)
  (net 14 /3V6/FB)
  (net 15 /LDO_In)
  (net 16 /3V6/COMP_Z)
  (net 17 /3V6/BOOT)
  (net 18 /LDO_ADJ)
  (net 19 "Net-(J4-Pad5)")
  (net_class Default "This is the default net class."
    (clearance 0.2)
    (trace_width 0.25)
    (via_dia 0.8)
    (via_drill 0.4)
    (uvia_dia 0.3)
    (uvia_drill 0.1)
    (add_net +3V3)
    (add_net /3V6/BuckIn)
    (add_net /3V6/COMP)
    (add_net /3V6/COMP_Z)
    (add_net /3V6/FB)
    (add_net /3V6/SS)
    (add_net /EN)
    (add_net /LDO_ADJ)
    (add_net /LDO_In)
    (add_net /LED_EN)
    (add_net /LED_R)
    (add_net /OVP/OVP_TRIG)
    (add_net GND)
    (add_net "Net-(J4-Pad5)")
  )
  (net_class 120VAC ""
    (clearance 3.25)
    (trace_width 0.325)
    (via_dia 0.8)
    (via_drill 0.4)
    (uvia_dia 0.3)
    (uvia_drill 0.1)
    (diff_pair_width 0.25)
    (diff_pair_gap 3.25)
  )
  (net_class 12V ""
    (clearance 0.2)
    (trace_width 0.25)
    (via_dia 0.8)
    (via_drill 0.4)
    (uvia_dia 0.3)
    (uvia_drill 0.1)
    (diff_pair_width 0.175)
    (diff_pair_gap 0.175)
  )
  (net_class 240VAC ""
    (clearance 12.75)
    (trace_width 0.35)
    (via_dia 0.8)
    (via_drill 0.4)
    (uvia_dia 0.3)
    (uvia_drill 0.1)
    (diff_pair_width 0.275)
    (diff_pair_gap 12.75)
  )
  (net_class 24V ""
    (clearance 0.25)
    (trace_width 0.25)
    (via_dia 0.8)
    (via_drill 0.4)
    (uvia_dia 0.3)
    (uvia_drill 0.1)
    (add_net /3V6/BOOT)
    (add_net /3V6/VBsw)
    (add_net /VHp)
  )
  (net_class 48V ""
    (clearance 0.6)
    (trace_width 0.3)
    (via_dia 0.8)
    (via_drill 0.4)
    (uvia_dia 0.3)
    (uvia_drill 0.1)
    (diff_pair_width 0.225)
    (diff_pair_gap 0.4)
    (add_net /OVP/OVP_SW)
    (add_net Vh)
  )
  (module TPW-Passive:DO-214AC_V2_Handsolder (layer F.Cu) (tedit 6583EEAA)
    (at 32.3 33.1 270)
    (descr "SMA/DO-214AC Diode")
    (tags "DO-214AC SMA")
    (attr smd)
    (fp_text reference D2 (at 4.4 0 180) (layer F.SilkS))
    (fp_text value 3.5A+ (at 0 -2.159 90) (layer F.Fab) hide)
    (pad 2 smd rect (at 1.875 0 270) (size 2.2 2.2) (drill (offset 0.425 0)) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 1 smd rect (at -1.875 0 270) (size 2.2 2.2) (drill (offset -0.425 0)) (layers F.Cu F.Paste F.Mask)
      (net 5 /VHp))
    (model ${KISYS3DMOD}/Diode_SMD.3dshapes/D_SMA.step
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module TPW-Passive:DO-214AC_V2_Handsolder (layer F.Cu) (tedit 6583EEAA)
    (at 45.9 39.3)
    (descr "SMA/DO-214AC Diode")
    (tags "DO-214AC SMA")
    (attr smd)
    (fp_text reference D1 (at 4.4 0 90) (layer F.SilkS))
    (fp_text value 3A (at 0 -2.159) (layer F.Fab) hide)
    (pad 2 smd rect (at 1.875 0) (size 2.2 2.2) (drill (offset 0.425 0)) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 1 smd rect (at -1.875 0) (size 2.2 2.2) (drill (offset -0.425 0)) (layers F.Cu F.Paste F.Mask)
      (net 13 /3V6/VBsw))
    (model ${KISYS3DMOD}/Diode_SMD.3dshapes/D_SMA.step
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module TPW-Passive:D_SOD-123_HS (layer F.Cu) (tedit 61085281)
    (at 29.4 37.065 270)
    (solder_paste_margin -0.05)
    (attr smd)
    (fp_text reference Z2 (at 2.135 1.5 90) (layer F.SilkS))
    (fp_text value 24 (at 0 -1.6 90) (layer F.Fab))
    (pad 1 smd rect (at -1.635 0 270) (size 1.5 1.22) (drill (offset -0.295 0)) (layers F.Cu F.Paste F.Mask)
      (net 9 /OVP/OVP_TRIG))
    (pad 2 smd rect (at 1.635 0 270) (size 1.5 1.22) (drill (offset 0.295 0)) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad "" smd circle (at 0 0 270) (size 1.2 1.2) (layers F.Adhes))
    (model ${KISYS3DMOD}/Diode_SMD.3dshapes/D_SOD-123.step
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Pin_Headers:Pin_Header_Angled_2x03_Pitch2.54mm (layer F.Cu) (tedit 659115CC)
    (at 72.39 38.735 270)
    (descr "Through hole angled pin header, 2x03, 2.54mm pitch, 6mm pin length, double rows")
    (tags "Through hole angled pin header THT 2x03 2.54mm double row")
    (fp_text reference J4 (at 5.265 -0.01 180) (layer F.SilkS))
    (fp_text value V_OUT (at 5.655 7.35 90) (layer F.Fab))
    (fp_text user %R (at 5.31 2.54) (layer F.Fab))
    (pad 6 thru_hole oval (at 2.54 5.08 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 4 /EN))
    (pad 5 thru_hole oval (at 0 5.08 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 19 "Net-(J4-Pad5)"))
    (pad 4 thru_hole oval (at 2.54 2.54 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 2 +3V3) (zone_connect 2))
    (pad 3 thru_hole oval (at 0 2.54 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 2 +3V3) (zone_connect 2))
    (pad 2 thru_hole oval (at 2.54 0 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 1 thru_hole roundrect (at 0 0 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask) (roundrect_rratio 0.25)
      (net 1 GND))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_2x03_P2.54mm_Horizontal.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Pin_Headers:Pin_Header_Angled_2x02_Pitch2.54mm (layer F.Cu) (tedit 6583CC71)
    (at 24.13 38.735 270)
    (descr "Through hole angled pin header, 2x02, 2.54mm pitch, 6mm pin length, double rows")
    (tags "Through hole angled pin header THT 2x02 2.54mm double row")
    (fp_text reference J3 (at 5.165 0.03 180) (layer F.SilkS))
    (fp_text value V_IN (at 5.655 4.81 90) (layer F.Fab))
    (fp_text user %R (at 5.31 1.27) (layer F.Fab))
    (pad 4 thru_hole oval (at 2.54 2.54 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND) (zone_connect 2))
    (pad 3 thru_hole oval (at 0 2.54 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND) (zone_connect 2))
    (pad 2 thru_hole circle (at 2.54 0 270) (size 1.73 1.73) (drill 1) (layers *.Cu *.Mask)
      (net 3 Vh))
    (pad 1 thru_hole rect (at 0 0 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 3 Vh))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_2x02_P2.54mm_Horizontal.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module TPW-Passive:R_0603_HandSoldering-Medium (layer F.Cu) (tedit 64F431FB)
    (at 65.4 33.95 180)
    (descr "Resistor SMD 0603, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0603")
    (attr smd)
    (fp_text reference R10 (at 0 1.2) (layer F.SilkS))
    (fp_text value 4k7 (at 0 1.3) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd rect (at 0.75 0 180) (size 0.75 0.9) (drill (offset 0.125 0)) (layers F.Cu F.Paste F.Mask)
      (net 18 /LDO_ADJ))
    (pad 1 smd rect (at -0.75 0 180) (size 0.75 0.9) (drill (offset -0.125 0)) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (model ${KISYS3DMOD}/Resistors_SMD.3dshapes/R_0603.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module TPW-Passive:R_0603_HandSoldering-Medium (layer F.Cu) (tedit 64F431FB)
    (at 65.4 35.35 180)
    (descr "Resistor SMD 0603, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0603")
    (attr smd)
    (fp_text reference R9 (at 0 -1.3) (layer F.SilkS))
    (fp_text value 8k25 (at 0 1.3) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd rect (at 0.75 0 180) (size 0.75 0.9) (drill (offset 0.125 0)) (layers F.Cu F.Paste F.Mask)
      (net 18 /LDO_ADJ))
    (pad 1 smd rect (at -0.75 0 180) (size 0.75 0.9) (drill (offset -0.125 0)) (layers F.Cu F.Paste F.Mask)
      (net 2 +3V3))
    (model ${KISYS3DMOD}/Resistors_SMD.3dshapes/R_0603.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module TPW-Passive:D_SOD-123_HS (layer F.Cu) (tedit 61085281)
    (at 65.4 28.5 90)
    (solder_paste_margin -0.05)
    (attr smd)
    (fp_text reference Z1 (at 3.6 -0.9 90) (layer F.SilkS))
    (fp_text value 3V6 (at 0 -1.6 90) (layer F.Fab))
    (pad 1 smd rect (at -1.635 0 90) (size 1.5 1.22) (drill (offset -0.295 0)) (layers F.Cu F.Paste F.Mask)
      (net 2 +3V3))
    (pad 2 smd rect (at 1.635 0 90) (size 1.5 1.22) (drill (offset 0.295 0)) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad "" smd circle (at 0 0 90) (size 1.2 1.2) (layers F.Adhes))
    (model ${KISYS3DMOD}/Diode_SMD.3dshapes/D_SOD-123.step
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module TO_SOT_Packages_SMD:TO-252-5_TabPin3 (layer F.Cu) (tedit 6580F7ED)
    (at 60.6 30.5 90)
    (descr "TO-252 / DPAK SMD package, http://www.infineon.com/cms/en/product/packages/PG-TO252/PG-TO252-5-11/")
    (tags "DPAK TO-252 DPAK-5 TO-252-5")
    (attr smd)
    (fp_text reference U1 (at 5.1 -3.6 270) (layer F.SilkS))
    (fp_text value LD39150DT33 (at 0 4.5 270) (layer F.Fab))
    (fp_text user %R (at 0 0 270) (layer F.Fab))
    (pad 3 smd rect (at 0.425 1.525 90) (size 3.05 2.75) (layers F.Cu F.Paste)
      (net 1 GND))
    (pad 3 smd rect (at 3.775 -1.525 90) (size 3.05 2.75) (layers F.Cu F.Paste)
      (net 1 GND))
    (pad 3 smd rect (at 0.425 -1.525 90) (size 3.05 2.75) (layers F.Cu F.Paste)
      (net 1 GND))
    (pad 3 smd rect (at 3.775 1.525 90) (size 3.05 2.75) (layers F.Cu F.Paste)
      (net 1 GND))
    (pad 3 smd rect (at 2.1 0 90) (size 6.4 5.8) (layers F.Cu F.Mask)
      (net 1 GND))
    (pad 5 smd rect (at -4.2 2.28 90) (size 2.2 0.8) (layers F.Cu F.Paste F.Mask)
      (net 18 /LDO_ADJ))
    (pad 4 smd rect (at -4.2 1.14 90) (size 2.2 0.8) (layers F.Cu F.Paste F.Mask)
      (net 2 +3V3) (zone_connect 2))
    (pad 3 smd rect (at -4.2 0 90) (size 2.2 0.8) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 2 smd rect (at -4.2 -1.14 90) (size 2.2 0.8) (layers F.Cu F.Paste F.Mask)
      (net 15 /LDO_In) (zone_connect 2))
    (pad 1 smd rect (at -4.2 -2.28 90) (size 2.2 0.8) (layers F.Cu F.Paste F.Mask)
      (net 15 /LDO_In))
    (model ${KISYS3DMOD}/Package_TO_SOT_SMD.3dshapes/TO-252-5_TabPin3.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module TPW-Passive:C_0805_0603_HandSoldering-Medium (layer F.Cu) (tedit 63747D5B)
    (at 54 38.1 90)
    (descr "Capacitor SMD 0805, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C11 (at 0.5 -1.5 90) (layer F.SilkS))
    (fp_text value 22u (at 0 1.75 90) (layer F.Fab))
    (fp_text user %R (at 0 -1.5 90) (layer F.Fab))
    (pad 2 smd custom (at 1.1 0 90) (size 1.2 1.25) (layers F.Cu F.Paste F.Mask)
      (net 15 /LDO_In)
      (options (clearance outline) (anchor rect))
      (primitives
        (gr_poly (pts
           (xy -0.6 0.375) (xy -0.75 0.375) (xy -0.75 -0.375) (xy -0.6 -0.375)) (width 0))
      ))
    (pad 1 smd custom (at -1.1 0 90) (size 1.2 1.25) (layers F.Cu F.Paste F.Mask)
      (net 1 GND)
      (options (clearance outline) (anchor rect))
      (primitives
        (gr_poly (pts
           (xy 0.75 0.375) (xy 0.6 0.375) (xy 0.6 -0.375) (xy 0.75 -0.375)) (width 0))
      ))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module TPW-Connectors:Jumper-Solder-Wedge-30V (layer F.Cu) (tedit 64FB8C0E)
    (at 70.1 25.8 270)
    (descr "Jumper Solder 1mm Wedge Shape Approx 30V 1A")
    (tags "Jumper Solder 30V")
    (attr virtual)
    (fp_text reference JP1 (at -0.9 1.2 90) (layer F.SilkS) hide)
    (fp_text value LED_EN (at 0 -1.1 90) (layer F.Fab) hide)
    (pad 2 smd custom (at 0.5 0 270) (size 0.5 0.5) (layers F.Cu F.Paste F.Mask)
      (net 1 GND) (zone_connect 0)
      (options (clearance outline) (anchor circle))
      (primitives
        (gr_arc (start 0 0) (end 0 -0.25) (angle 180) (width 0.5))
        (gr_poly (pts
           (xy 0 0.5) (xy -0.75 0.5) (xy -0.25 0) (xy -0.75 -0.5) (xy 0 -0.5)
) (width 0))
      ))
    (pad 1 smd custom (at -0.75 0 270) (size 1 1) (layers F.Cu F.Paste F.Mask)
      (net 6 /LED_EN) (zone_connect 0)
      (options (clearance outline) (anchor circle))
      (primitives
        (gr_poly (pts
           (xy 0.75 0) (xy 0.25 0.5) (xy 0 0.5) (xy 0 -0.5) (xy 0.25 -0.5)
) (width 0))
      ))
  )
  (module TPW-Connectors:TestPoint-PTH-1.0mm-Octagon (layer F.Cu) (tedit 64FAB24D)
    (at 63 38.7 180)
    (descr "Through hole straight pin header, 1x01, 2.54mm pitch, single row, test point")
    (tags "Through hole pin header THT 1x01 2.54mm single row test point")
    (zone_connect 2)
    (fp_text reference TP4 (at 0 -1.9) (layer F.SilkS))
    (fp_text value 3V6 (at 0 1.9) (layer F.Fab) hide)
    (pad 1 thru_hole custom (at 0 0 180) (size 1.1 1.1) (drill 1) (layers *.Cu *.Mask)
      (net 2 +3V3) (zone_connect 2)
      (options (clearance outline) (anchor circle))
      (primitives
        (gr_poly (pts
           (xy 0.8 -0.4) (xy 0.8 0.4) (xy 0.4 0.8) (xy -0.4 0.8) (xy -0.8 0.4)
           (xy -0.8 -0.4) (xy -0.4 -0.8) (xy 0.4 -0.8)) (width 0))
      ))
  )
  (module TPW-Decorative:sig-wlx (layer B.Cu) (tedit 637727B1)
    (at 47 29.85 180)
    (attr virtual)
    (fp_text reference G3 (at 0 -0.1) (layer B.SilkS) hide)
    (fp_text value WLX (at 0.75 -0.1) (layer B.SilkS) hide)
  )
  (module TPW-Passive:C_0603_HandSoldering-Medium (layer F.Cu) (tedit 64F431CD)
    (at 38.5 38.5 270)
    (descr "Capacitor SMD 0603, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0603")
    (attr smd)
    (fp_text reference C7 (at 2 0.6 90) (layer F.SilkS))
    (fp_text value 47p (at 0 1.25 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd rect (at 0.75 0 270) (size 1 0.75) (drill (offset 0.1 0)) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 1 smd rect (at -0.75 0 270) (size 1 0.75) (drill (offset -0.1 0)) (layers F.Cu F.Paste F.Mask)
      (net 11 /3V6/COMP))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module TPW-Passive:C_0603_HandSoldering-Medium (layer F.Cu) (tedit 659114CD)
    (at 23.475 27.1 270)
    (descr "Capacitor SMD 0603, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0603")
    (attr smd)
    (fp_text reference C12 (at 2.5 0 270) (layer F.SilkS))
    (fp_text value OPT/100n (at 0 1.25 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd rect (at -0.7 0 270) (size 0.9 0.75) (drill (offset -0.1 0)) (layers F.Cu F.Paste F.Mask)
      (net 8 /OVP/OVP_SW))
    (pad 2 smd rect (at 0.7 0 270) (size 0.9 0.75) (drill (offset 0.1 0)) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module TPW-Passive:C_0603_HandSoldering-Medium (layer F.Cu) (tedit 64F431CD)
    (at 42.5 33.9 90)
    (descr "Capacitor SMD 0603, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0603")
    (attr smd)
    (fp_text reference C9 (at -2.2 0.4 90) (layer F.SilkS))
    (fp_text value 100n (at 0 1.25 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd rect (at 0.75 0 90) (size 1 0.75) (drill (offset 0.1 0)) (layers F.Cu F.Paste F.Mask)
      (net 17 /3V6/BOOT))
    (pad 1 smd rect (at -0.75 0 90) (size 1 0.75) (drill (offset -0.1 0)) (layers F.Cu F.Paste F.Mask)
      (net 13 /3V6/VBsw))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module TPW-Passive:C_0603_HandSoldering-Medium (layer F.Cu) (tedit 64F431CD)
    (at 35.4 30.9 270)
    (descr "Capacitor SMD 0603, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0603")
    (attr smd)
    (fp_text reference C8 (at 1.1 1 270) (layer F.SilkS))
    (fp_text value 10n (at 0 1.25 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd rect (at 0.75 0 270) (size 1 0.75) (drill (offset 0.1 0)) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 1 smd rect (at -0.75 0 270) (size 1 0.75) (drill (offset -0.1 0)) (layers F.Cu F.Paste F.Mask)
      (net 12 /3V6/SS))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module TPW-Passive:C_0603_HandSoldering-Medium (layer F.Cu) (tedit 64F431CD)
    (at 41.5 38.5 270)
    (descr "Capacitor SMD 0603, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0603")
    (attr smd)
    (fp_text reference C6 (at 2.2 0.8 90) (layer F.SilkS))
    (fp_text value 1n (at 0 1.25 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd rect (at 0.75 0 270) (size 1 0.75) (drill (offset 0.1 0)) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 1 smd rect (at -0.75 0 270) (size 1 0.75) (drill (offset -0.1 0)) (layers F.Cu F.Paste F.Mask)
      (net 16 /3V6/COMP_Z))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module TPW-Passive:C_0603_HandSoldering-Medium (layer F.Cu) (tedit 64F431CD)
    (at 60.6 37.849999 270)
    (descr "Capacitor SMD 0603, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0603")
    (attr smd)
    (fp_text reference C2 (at 2.750001 0 180) (layer F.SilkS))
    (fp_text value 2u2 (at 0 1.25 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd rect (at 0.75 0 270) (size 1 0.75) (drill (offset 0.1 0)) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 1 smd rect (at -0.75 0 270) (size 1 0.75) (drill (offset -0.1 0)) (layers F.Cu F.Paste F.Mask)
      (net 2 +3V3))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module TPW-Passive:C_0603_HandSoldering-Medium (layer F.Cu) (tedit 64F431CD)
    (at 56 38.4 270)
    (descr "Capacitor SMD 0603, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0603")
    (attr smd)
    (fp_text reference C1 (at -2.2 0 90) (layer F.SilkS))
    (fp_text value 1u (at 0 1.25 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd rect (at 0.75 0 270) (size 1 0.75) (drill (offset 0.1 0)) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 1 smd rect (at -0.75 0 270) (size 1 0.75) (drill (offset -0.1 0)) (layers F.Cu F.Paste F.Mask)
      (net 15 /LDO_In))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module TPW-Connectors:TestPoint-PTH-1.0mm-Octagon (layer F.Cu) (tedit 64F4D8E6)
    (at 26.8 35.4 90)
    (descr "Through hole straight pin header, 1x01, 2.54mm pitch, single row, test point")
    (tags "Through hole pin header THT 1x01 2.54mm single row test point")
    (zone_connect 2)
    (fp_text reference TP1 (at -1.9 0) (layer F.SilkS))
    (fp_text value Vh (at 0 1.9 90) (layer F.Fab) hide)
    (pad 1 thru_hole custom (at 0 0 90) (size 1.1 1.1) (drill 1) (layers *.Cu *.Mask)
      (net 3 Vh) (zone_connect 2)
      (options (clearance outline) (anchor circle))
      (primitives
        (gr_poly (pts
           (xy 0.8 -0.4) (xy 0.8 0.4) (xy 0.4 0.8) (xy -0.4 0.8) (xy -0.8 0.4)
           (xy -0.8 -0.4) (xy -0.4 -0.8) (xy 0.4 -0.8)) (width 0))
      ))
  )
  (module TPW-Connectors:TestPoint-PTH-1.0mm-Octagon (layer F.Cu) (tedit 64F4388A)
    (at 32 25.2)
    (descr "Through hole straight pin header, 1x01, 2.54mm pitch, single row, test point")
    (tags "Through hole pin header THT 1x01 2.54mm single row test point")
    (zone_connect 2)
    (fp_text reference TP2 (at 0 1.9) (layer F.SilkS))
    (fp_text value Vhp (at 0 1.9) (layer F.Fab) hide)
    (pad 1 thru_hole custom (at 0 0) (size 1.1 1.1) (drill 1) (layers *.Cu *.Mask)
      (net 5 /VHp) (zone_connect 2)
      (options (clearance outline) (anchor circle))
      (primitives
        (gr_poly (pts
           (xy 0.8 -0.4) (xy 0.8 0.4) (xy 0.4 0.8) (xy -0.4 0.8) (xy -0.8 0.4)
           (xy -0.8 -0.4) (xy -0.4 -0.8) (xy 0.4 -0.8)) (width 0))
      ))
  )
  (module TPW-Connectors:TestPoint-PTH-1.0mm-Octagon (layer F.Cu) (tedit 64F438A9)
    (at 58.1 38.6 180)
    (descr "Through hole straight pin header, 1x01, 2.54mm pitch, single row, test point")
    (tags "Through hole pin header THT 1x01 2.54mm single row test point")
    (zone_connect 2)
    (fp_text reference TP3 (at 0 -1.9 180) (layer F.SilkS))
    (fp_text value 3V6 (at 0 1.9) (layer F.Fab) hide)
    (pad 1 thru_hole custom (at 0 0 180) (size 1.1 1.1) (drill 1) (layers *.Cu *.Mask)
      (net 15 /LDO_In) (zone_connect 2)
      (options (clearance outline) (anchor circle))
      (primitives
        (gr_poly (pts
           (xy 0.8 -0.4) (xy 0.8 0.4) (xy 0.4 0.8) (xy -0.4 0.8) (xy -0.8 0.4)
           (xy -0.8 -0.4) (xy -0.4 -0.8) (xy 0.4 -0.8)) (width 0))
      ))
  )
  (module TPW-Passive:R_0603_HandSoldering-Medium (layer F.Cu) (tedit 64F431FB)
    (at 22.6 24.7 180)
    (descr "Resistor SMD 0603, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0603")
    (attr smd)
    (fp_text reference R8 (at 1.8 0 90) (layer F.SilkS))
    (fp_text value 10k (at 0 1.3) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd rect (at 0.75 0 180) (size 0.75 0.9) (drill (offset 0.125 0)) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 1 smd rect (at -0.75 0 180) (size 0.75 0.9) (drill (offset -0.125 0)) (layers F.Cu F.Paste F.Mask)
      (net 8 /OVP/OVP_SW))
    (model ${KISYS3DMOD}/Resistors_SMD.3dshapes/R_0603.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module TPW-Passive:R_0603_HandSoldering-Medium (layer F.Cu) (tedit 64F431FB)
    (at 28.9 33.2)
    (descr "Resistor SMD 0603, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0603")
    (attr smd)
    (fp_text reference R7 (at -2.1 0) (layer F.SilkS))
    (fp_text value 10k (at 0 1.3) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd rect (at 0.75 0) (size 0.75 0.9) (drill (offset 0.125 0)) (layers F.Cu F.Paste F.Mask)
      (net 9 /OVP/OVP_TRIG))
    (pad 1 smd rect (at -0.75 0) (size 0.75 0.9) (drill (offset -0.125 0)) (layers F.Cu F.Paste F.Mask)
      (net 3 Vh))
    (model ${KISYS3DMOD}/Resistors_SMD.3dshapes/R_0603.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module TPW-Passive:R_0603_HandSoldering-Medium (layer F.Cu) (tedit 64F431FB)
    (at 37 38.499999 270)
    (descr "Resistor SMD 0603, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0603")
    (attr smd)
    (fp_text reference R6 (at 2.000001 0.8 90) (layer F.SilkS))
    (fp_text value 2k87 (at 0 1.3 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd rect (at 0.75 0 270) (size 0.75 0.9) (drill (offset 0.125 0)) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 1 smd rect (at -0.75 0 270) (size 0.75 0.9) (drill (offset -0.125 0)) (layers F.Cu F.Paste F.Mask)
      (net 14 /3V6/FB))
    (model ${KISYS3DMOD}/Resistors_SMD.3dshapes/R_0603.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module TPW-Passive:R_0603_HandSoldering-Medium (layer F.Cu) (tedit 64F431FB)
    (at 42.5 30.8 270)
    (descr "Resistor SMD 0603, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0603")
    (attr smd)
    (fp_text reference R5 (at -1.8 0.1 180) (layer F.SilkS))
    (fp_text value 10k (at 0 1.3 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd rect (at 0.75 0 270) (size 0.75 0.9) (drill (offset 0.125 0)) (layers F.Cu F.Paste F.Mask)
      (net 14 /3V6/FB))
    (pad 1 smd rect (at -0.75 0 270) (size 0.75 0.9) (drill (offset -0.125 0)) (layers F.Cu F.Paste F.Mask)
      (net 15 /LDO_In))
    (model ${KISYS3DMOD}/Resistors_SMD.3dshapes/R_0603.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module TPW-Passive:R_0603_HandSoldering-Medium (layer F.Cu) (tedit 64F431FB)
    (at 40 38.5 270)
    (descr "Resistor SMD 0603, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0603")
    (attr smd)
    (fp_text reference R4 (at 2.2 0.4 270) (layer F.SilkS))
    (fp_text value 29k4 (at 0 1.3 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd rect (at 0.75 0 270) (size 0.75 0.9) (drill (offset 0.125 0)) (layers F.Cu F.Paste F.Mask)
      (net 16 /3V6/COMP_Z))
    (pad 1 smd rect (at -0.75 0 270) (size 0.75 0.9) (drill (offset -0.125 0)) (layers F.Cu F.Paste F.Mask)
      (net 11 /3V6/COMP))
    (model ${KISYS3DMOD}/Resistors_SMD.3dshapes/R_0603.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module TPW-Passive:R_0603_HandSoldering-Medium (layer F.Cu) (tedit 64F431FB)
    (at 35.4 37 270)
    (descr "Resistor SMD 0603, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0603")
    (attr smd)
    (fp_text reference R3 (at 1.3 1.1 270) (layer F.SilkS))
    (fp_text value 22k (at 0 1.3 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd rect (at 0.75 0 270) (size 0.75 0.9) (drill (offset 0.125 0)) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 1 smd rect (at -0.75 0 270) (size 0.75 0.9) (drill (offset -0.125 0)) (layers F.Cu F.Paste F.Mask)
      (net 4 /EN))
    (model ${KISYS3DMOD}/Resistors_SMD.3dshapes/R_0603.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module TPW-Passive:R_0603_HandSoldering-Medium (layer F.Cu) (tedit 64F431FB)
    (at 35.4 34 90)
    (descr "Resistor SMD 0603, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0603")
    (attr smd)
    (fp_text reference R2 (at -1.3 -1 270) (layer F.SilkS))
    (fp_text value 169k (at 0 1.3 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd rect (at 0.75 0 90) (size 0.75 0.9) (drill (offset 0.125 0)) (layers F.Cu F.Paste F.Mask)
      (net 4 /EN))
    (pad 1 smd rect (at -0.75 0 90) (size 0.75 0.9) (drill (offset -0.125 0)) (layers F.Cu F.Paste F.Mask)
      (net 10 /3V6/BuckIn))
    (model ${KISYS3DMOD}/Resistors_SMD.3dshapes/R_0603.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module TPW-Passive:R_0603_HandSoldering-Medium (layer F.Cu) (tedit 64F431FB)
    (at 68.6 26.1 90)
    (descr "Resistor SMD 0603, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0603")
    (attr smd)
    (fp_text reference R1 (at -1.9 0 180) (layer F.SilkS))
    (fp_text value 2k? (at 0 1.3 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd rect (at 0.75 0 90) (size 0.75 0.9) (drill (offset 0.125 0)) (layers F.Cu F.Paste F.Mask)
      (net 7 /LED_R))
    (pad 1 smd rect (at -0.75 0 90) (size 0.75 0.9) (drill (offset -0.125 0)) (layers F.Cu F.Paste F.Mask)
      (net 2 +3V3))
    (model ${KISYS3DMOD}/Resistors_SMD.3dshapes/R_0603.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module TPW-Decorative:webster-face (layer B.Cu) (tedit 0)
    (at 46.2 36.25 180)
    (fp_text reference G2 (at 0 0) (layer B.SilkS) hide)
    (fp_text value WebsterFace (at 0.75 0) (layer B.SilkS) hide)
  )
  (module Pin_Headers:Pin_Header_Straight_1x04_Pitch2.54mm (layer B.Cu) (tedit 64F415DC)
    (at 21.59 34.925)
    (descr "Through hole straight pin header, 1x04, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x04 2.54mm single row")
    (fp_text reference J1 (at 0.41 -9.66) (layer B.SilkS))
    (fp_text value V_IN (at 0 -9.95) (layer B.Fab))
    (fp_text user %R (at 0 -3.81 -90) (layer B.Fab))
    (pad 1 thru_hole circle (at 0 0) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 2 thru_hole oval (at 0 -2.54) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 3 Vh))
    (pad 3 thru_hole oval (at 0 -5.08) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 3 Vh))
    (pad 4 thru_hole oval (at 0 -7.62 315) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (model ${KISYS3DMOD}/Pin_Headers.3dshapes/Pin_Header_Straight_1x04_Pitch2.54mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x04_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Pin_Headers:Pin_Header_Straight_1x05_Pitch2.54mm (layer B.Cu) (tedit 6583DBA6)
    (at 72.39 36.195)
    (descr "Through hole straight pin header, 1x05, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x05 2.54mm single row")
    (fp_text reference J2 (at -2.09 -12.095) (layer B.SilkS) hide)
    (fp_text value V_OUT (at 0 -12.49) (layer B.Fab))
    (fp_text user %R (at 0 -5.08 -90) (layer B.Fab))
    (pad 5 thru_hole oval (at 0 -10.16 315) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 4 thru_hole oval (at 0 -7.62 315) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 2 +3V3))
    (pad 3 thru_hole oval (at 0 -5.08) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 4 /EN))
    (pad 2 thru_hole oval (at 0 -2.54 315) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 2 +3V3) (zone_connect 2))
    (pad 1 thru_hole circle (at 0 0) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (model ${KISYS3DMOD}/Pin_Headers.3dshapes/Pin_Header_Straight_1x05_Pitch2.54mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x05_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Inductors_SMD:L_Taiyo-Yuden_NR-80xx_HandSoldering (layer F.Cu) (tedit 64F65CCB)
    (at 47.6 31.7 270)
    (descr "Inductor, Taiyo Yuden, NR series, Taiyo-Yuden_NR-80xx, 8.0mmx8.0mm")
    (tags "inductor taiyo-yuden nr smd")
    (attr smd)
    (fp_text reference L2 (at -4.2 4.9 90) (layer F.SilkS))
    (fp_text value 10u (at 0 5.5 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd rect (at 3.45 0 270) (size 3.1 7.7) (layers F.Cu F.Paste F.Mask)
      (net 13 /3V6/VBsw))
    (pad 1 smd rect (at -3.45 0 270) (size 3.1 7.7) (layers F.Cu F.Paste F.Mask)
      (net 15 /LDO_In) (zone_connect 2))
    (model ${KISYS3DMOD}/Inductors_SMD.3dshapes/L_Taiyo-Yuden_NR-80xx.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
    (model :Local:TaiyoYuden.3dshapes/AndreyGulyants-NRS8040.step
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz -90 0 90))
    )
  )
  (module LEDs:LED_0603_HandSoldering (layer F.Cu) (tedit 65911A7E)
    (at 67.2 26.4 270)
    (descr "LED SMD 0603, hand soldering")
    (tags "LED 0603")
    (attr smd)
    (fp_text reference LED1 (at -2.3 0 180) (layer F.SilkS))
    (fp_text value PRP (at 0 1.55 90) (layer F.Fab))
    (pad 2 smd rect (at 1.05 0 270) (size 1.1 0.9) (layers F.Cu F.Paste F.Mask)
      (net 7 /LED_R))
    (pad 1 smd rect (at -1.05 0 270) (size 1.1 0.9) (layers F.Cu F.Paste F.Mask)
      (net 6 /LED_EN))
    (model ${KISYS3DMOD}/LEDs.3dshapes/LED_0603.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 180))
    )
    (model ${KISYS3DMOD}/LED_SMD.3dshapes/LED_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Housings_SOIC:SOIC-8_3.9x4.9mm_Pitch1.27mm (layer F.Cu) (tedit 64DDC670)
    (at 38.899999 33.2 270)
    (descr "8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC] (see Microchip Packaging Specification 00000049BS.pdf)")
    (tags "SOIC 1.27")
    (attr smd)
    (fp_text reference U2 (at 3.1 -3.000001 90) (layer F.SilkS))
    (fp_text value 2A (at 0 3.5 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 8 smd rect (at 2.7 -1.905 270) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 13 /3V6/VBsw))
    (pad 7 smd rect (at 2.7 -0.635 270) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 6 smd rect (at 2.7 0.635 270) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 11 /3V6/COMP))
    (pad 5 smd rect (at 2.7 1.905 270) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 14 /3V6/FB))
    (pad 4 smd rect (at -2.7 1.905 270) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 12 /3V6/SS))
    (pad 3 smd rect (at -2.7 0.635 270) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 4 /EN))
    (pad 2 smd rect (at -2.7 -0.635 270) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 10 /3V6/BuckIn))
    (pad 1 smd rect (at -2.7 -1.905 270) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 17 /3V6/BOOT))
    (model ${KISYS3DMOD}/Housings_SOIC.3dshapes/SOIC-8_3.9x4.9mm_Pitch1.27mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
    (model ${KISYS3DMOD}/Package_SO.3dshapes/SOIC-8_3.9x4.9mm_P1.27mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Housings_SOIC:SOIC-8_3.9x4.9mm_Pitch1.27mm (layer F.Cu) (tedit 65861B9E)
    (at 27.55 27.95 90)
    (descr "8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC] (see Microchip Packaging Specification 00000049BS.pdf)")
    (tags "SOIC 1.27")
    (attr smd)
    (fp_text reference Q1 (at -3.55 -3.25 180) (layer F.SilkS))
    (fp_text value PMOS-2CH (at 0 3.5 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd rect (at -2.7 -1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 3 Vh))
    (pad 2 smd roundrect (at -2.7 -0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 8 /OVP/OVP_SW))
    (pad 3 smd roundrect (at -2.7 0.635 90) (size 1.55 0.6) (drill (offset -0.075 0)) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 3 Vh))
    (pad 4 smd roundrect (at -2.7 1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 9 /OVP/OVP_TRIG))
    (pad 5 smd roundrect (at 2.7 1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 8 /OVP/OVP_SW))
    (pad 6 smd roundrect (at 2.7 0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 8 /OVP/OVP_SW))
    (pad 7 smd rect (at 2.7 -0.635 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 5 /VHp))
    (pad 8 smd rect (at 2.7 -1.905 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 5 /VHp))
    (model ${KISYS3DMOD}/Housings_SOIC.3dshapes/SOIC-8_3.9x4.9mm_Pitch1.27mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
    (model ${KISYS3DMOD}/Package_SO.3dshapes/SOIC-8_3.9x4.9mm_P1.27mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module TPW-Passive:L_0805_0603_HandSoldering-Medium (layer F.Cu) (tedit 64D71685)
    (at 35.2 28.2 180)
    (descr "Capacitor SMD 0805, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference L1 (at 2.5 -0.2) (layer F.SilkS))
    (fp_text value L_Core_Ferrite (at 0 1.65) (layer F.Fab))
    (pad 2 smd custom (at 1.15 0 180) (size 1.1 1.3) (layers F.Cu F.Paste F.Mask)
      (net 5 /VHp)
      (options (clearance outline) (anchor rect))
      (primitives
        (gr_poly (pts
           (xy -0.55 0.45) (xy -0.65 0.45) (xy -0.65 -0.45) (xy -0.55 -0.45)) (width 0))
      ))
    (pad 1 smd custom (at -1.15 0 180) (size 1.1 1.3) (layers F.Cu F.Paste F.Mask)
      (net 10 /3V6/BuckIn)
      (options (clearance outline) (anchor rect))
      (primitives
        (gr_poly (pts
           (xy 0.55 -0.45) (xy 0.65 -0.45) (xy 0.65 0.45) (xy 0.55 0.45) (xy 0.55 -0.65)
) (width 0))
      ))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module TPW-Decorative:sig-wlx (layer F.Cu) (tedit 637727B1)
    (at 50.6 25.200001)
    (attr virtual)
    (fp_text reference G1 (at 0 0.1) (layer F.SilkS) hide)
    (fp_text value WLX (at 0.75 0.1) (layer F.SilkS) hide)
  )
  (module TPW-Passive:C_0805_0603_HandSoldering-Medium (layer F.Cu) (tedit 63747D5B)
    (at 55 26.399999 270)
    (descr "Capacitor SMD 0805, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C10 (at 2.400001 0.1) (layer F.SilkS))
    (fp_text value 22u (at 0 1.75 90) (layer F.Fab))
    (fp_text user %R (at 0 -1.5 90) (layer F.Fab))
    (pad 1 smd custom (at -1.1 0 270) (size 1.2 1.25) (layers F.Cu F.Paste F.Mask)
      (net 1 GND)
      (options (clearance outline) (anchor rect))
      (primitives
        (gr_poly (pts
           (xy 0.75 0.375) (xy 0.6 0.375) (xy 0.6 -0.375) (xy 0.75 -0.375)) (width 0))
      ))
    (pad 2 smd custom (at 1.1 0 270) (size 1.2 1.25) (layers F.Cu F.Paste F.Mask)
      (net 15 /LDO_In)
      (options (clearance outline) (anchor rect))
      (primitives
        (gr_poly (pts
           (xy -0.6 0.375) (xy -0.75 0.375) (xy -0.75 -0.375) (xy -0.6 -0.375)) (width 0))
      ))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module TPW-Passive:C_0805_0603_HandSoldering-Medium (layer F.Cu) (tedit 63747D5B)
    (at 40.1 27.199999 90)
    (descr "Capacitor SMD 0805, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C5 (at 3.199999 0 180) (layer F.SilkS))
    (fp_text value 10u/OPT (at 0 1.75 90) (layer F.Fab))
    (fp_text user %R (at 0 -1.5 90) (layer F.Fab))
    (pad 1 smd custom (at -1.1 0 90) (size 1.2 1.25) (layers F.Cu F.Paste F.Mask)
      (net 10 /3V6/BuckIn)
      (options (clearance outline) (anchor rect))
      (primitives
        (gr_poly (pts
           (xy 0.75 0.375) (xy 0.6 0.375) (xy 0.6 -0.375) (xy 0.75 -0.375)) (width 0))
      ))
    (pad 2 smd custom (at 1.1 0 90) (size 1.2 1.25) (layers F.Cu F.Paste F.Mask)
      (net 1 GND)
      (options (clearance outline) (anchor rect))
      (primitives
        (gr_poly (pts
           (xy -0.6 0.375) (xy -0.75 0.375) (xy -0.75 -0.375) (xy -0.6 -0.375)) (width 0))
      ))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module TPW-Passive:C_0805_0603_HandSoldering-Medium (layer F.Cu) (tedit 63747D5B)
    (at 38.1 27.2 90)
    (descr "Capacitor SMD 0805, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C4 (at 3.2 0) (layer F.SilkS))
    (fp_text value 10u (at 0 1.75 90) (layer F.Fab))
    (fp_text user %R (at 0 -1.5 90) (layer F.Fab))
    (pad 1 smd custom (at -1.1 0 90) (size 1.2 1.25) (layers F.Cu F.Paste F.Mask)
      (net 10 /3V6/BuckIn)
      (options (clearance outline) (anchor rect))
      (primitives
        (gr_poly (pts
           (xy 0.75 0.375) (xy 0.6 0.375) (xy 0.6 -0.375) (xy 0.75 -0.375)) (width 0))
      ))
    (pad 2 smd custom (at 1.1 0 90) (size 1.2 1.25) (layers F.Cu F.Paste F.Mask)
      (net 1 GND)
      (options (clearance outline) (anchor rect))
      (primitives
        (gr_poly (pts
           (xy -0.6 0.375) (xy -0.75 0.375) (xy -0.75 -0.375) (xy -0.6 -0.375)) (width 0))
      ))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module TPW-Passive:C_0805_0603_HandSoldering-Medium (layer F.Cu) (tedit 63747D5B)
    (at 35.2 26.275)
    (descr "Capacitor SMD 0805, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C3 (at 0 -1.375) (layer F.SilkS))
    (fp_text value 10u (at 0 1.75) (layer F.Fab))
    (fp_text user %R (at 0 -1.5) (layer F.Fab))
    (pad 2 smd custom (at 1.1 0) (size 1.2 1.25) (layers F.Cu F.Paste F.Mask)
      (net 1 GND)
      (options (clearance outline) (anchor rect))
      (primitives
        (gr_poly (pts
           (xy -0.6 0.375) (xy -0.75 0.375) (xy -0.75 -0.375) (xy -0.6 -0.375)) (width 0))
      ))
    (pad 1 smd custom (at -1.1 0) (size 1.2 1.25) (layers F.Cu F.Paste F.Mask)
      (net 5 /VHp)
      (options (clearance outline) (anchor rect))
      (primitives
        (gr_poly (pts
           (xy 0.75 0.375) (xy 0.6 0.375) (xy 0.6 -0.375) (xy 0.75 -0.375)) (width 0))
      ))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (gr_text "ABSOLUTE\nMAXIMUM\n6V INPUT" (at 58.1 36.7 90) (layer B.SilkS))
  (gr_text "ABSOLUTE\nMAXIMUM\n28V INPUT" (at 32.1 27 -90) (layer B.SilkS))
  (gr_text G (at 21.717 43.307) (layer B.SilkS))
  (gr_text EN (at 67.31 43.434) (layer B.SilkS))
  (gr_text VO (at 69.85 43.434) (layer B.SilkS))
  (gr_text G (at 72.39 43.434) (layer B.SilkS))
  (gr_text VI (at 24.13 43.307) (layer B.SilkS))
  (gr_text "GND\nVIN\nVIN\nG" (at 22.86 31.115) (layer B.SilkS))
  (gr_text "GND\nVOUT\nEN\nVOUT\nGND" (at 71 31.115) (layer B.SilkS))
  (dimension 43.18 (width 0.15) (layer Dwgs.User)
    (gr_text "1.7000 in" (at 45.72 55.275) (layer Dwgs.User))
    (feature1 (pts (xy 67.31 53.34) (xy 67.31 54.561421)))
    (feature2 (pts (xy 24.13 53.34) (xy 24.13 54.561421)))
    (crossbar (pts (xy 24.13 53.975) (xy 67.31 53.975)))
    (arrow1a (pts (xy 67.31 53.975) (xy 66.183496 54.561421)))
    (arrow1b (pts (xy 67.31 53.975) (xy 66.183496 53.388579)))
    (arrow2a (pts (xy 24.13 53.975) (xy 25.256504 54.561421)))
    (arrow2b (pts (xy 24.13 53.975) (xy 25.256504 53.388579)))
  )
  (gr_line (start 65 43.4) (end 65 44.4) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 28 43.4) (end 28 44.4) (layer Edge.Cuts) (width 0.05))
  (gr_arc (start 73.5 24.2) (end 74.5 24.2) (angle -90) (layer Edge.Cuts) (width 0.05))
  (gr_text v1 (at 38.45 29.85) (layer B.SilkS))
  (gr_text 2023 (at 55.3 29.85) (layer B.SilkS))
  (gr_text "APCCMOD\n3V301 v1" (at 69.4 33 90) (layer F.SilkS))
  (dimension 35 (width 0.12) (layer Dwgs.User)
    (gr_text "35.000 mm" (at 46.5 47.67) (layer Dwgs.User))
    (feature1 (pts (xy 64 41.9) (xy 64 46.986421)))
    (feature2 (pts (xy 29 41.9) (xy 29 46.986421)))
    (crossbar (pts (xy 29 46.4) (xy 64 46.4)))
    (arrow1a (pts (xy 64 46.4) (xy 62.873496 46.986421)))
    (arrow1b (pts (xy 64 46.4) (xy 62.873496 45.813579)))
    (arrow2a (pts (xy 29 46.4) (xy 30.126504 46.986421)))
    (arrow2b (pts (xy 29 46.4) (xy 30.126504 45.813579)))
  )
  (gr_line (start 66 45.4) (end 73.5 45.4) (layer Edge.Cuts) (width 0.05))
  (gr_arc (start 64 43.4) (end 65 43.4) (angle -90) (layer Edge.Cuts) (width 0.05))
  (gr_arc (start 66 44.4) (end 65 44.4) (angle -90) (layer Edge.Cuts) (width 0.05))
  (gr_arc (start 29 43.4) (end 29 42.4) (angle -90) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 29 42.4) (end 64 42.4) (layer Edge.Cuts) (width 0.05))
  (gr_arc (start 27 44.4) (end 27 45.4) (angle -90) (layer Edge.Cuts) (width 0.05))
  (dimension 54.5 (width 0.15) (layer Dwgs.User)
    (gr_text "54.500 mm" (at 47.25 17.7) (layer Dwgs.User))
    (feature1 (pts (xy 74.5 22) (xy 74.5 18.413579)))
    (feature2 (pts (xy 20 22) (xy 20 18.413579)))
    (crossbar (pts (xy 20 19) (xy 74.5 19)))
    (arrow1a (pts (xy 74.5 19) (xy 73.373496 19.586421)))
    (arrow1b (pts (xy 74.5 19) (xy 73.373496 18.413579)))
    (arrow2a (pts (xy 20 19) (xy 21.126504 19.586421)))
    (arrow2b (pts (xy 20 19) (xy 21.126504 18.413579)))
  )
  (gr_text 2023 (at 45.4 25.2) (layer F.SilkS))
  (gr_text LDO (at 59.6 32.6) (layer F.SilkS))
  (gr_text Buck (at 36.7 33) (layer F.SilkS))
  (gr_text OVP (at 27.6 27.9) (layer F.SilkS))
  (gr_text APCCMOD-3V301 (at 55.3 27.35) (layer B.SilkS))
  (dimension 22.2 (width 0.15) (layer Dwgs.User)
    (gr_text "22.200 mm" (at 14.7 34.3 90) (layer Dwgs.User))
    (feature1 (pts (xy 19 23.2) (xy 15.413579 23.2)))
    (feature2 (pts (xy 19 45.4) (xy 15.413579 45.4)))
    (crossbar (pts (xy 16 45.4) (xy 16 23.2)))
    (arrow1a (pts (xy 16 23.2) (xy 16.586421 24.326504)))
    (arrow1b (pts (xy 16 23.2) (xy 15.413579 24.326504)))
    (arrow2a (pts (xy 16 45.4) (xy 16.586421 44.273496)))
    (arrow2b (pts (xy 16 45.4) (xy 15.413579 44.273496)))
  )
  (gr_arc (start 21 44.4) (end 20 44.4) (angle -90) (layer Edge.Cuts) (width 0.05))
  (gr_arc (start 73.5 44.4) (end 73.5 45.4) (angle -90) (layer Edge.Cuts) (width 0.05))
  (gr_arc (start 21 24.2) (end 21 23.2) (angle -90) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 21 45.4) (end 27 45.4) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 74.5 44.4) (end 74.5 24.2) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 73.5 23.2) (end 21 23.2) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 20 24.2) (end 20 44.4) (layer Edge.Cuts) (width 0.05))
  (zone (net 1) (net_name GND) (layer B.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.2))
    (min_thickness 0.2)
    (fill yes (arc_segments 32) (thermal_gap 0.25) (thermal_bridge_width 0.5))
    (polygon
      (pts
        (xy 76 47) (xy 19 47) (xy 19 21) (xy 76 21)
      )
    )
  )
  (zone (net 1) (net_name GND) (layer F.Cu) (hatch edge 0.508)
    (connect_pads yes (clearance 0.25))
    (min_thickness 0.25)
    (fill yes (arc_segments 32) (thermal_gap 0.254) (thermal_bridge_width 0.254))
    (polygon
      (pts
        (xy 30.805171 40.2) (xy 30.805171 37.2) (xy 31 37) (xy 33.6 37) (xy 33.8 37.2)
        (xy 33.805171 40.2) (xy 33.6 40.4) (xy 31 40.4)
      )
    )
  )
  (zone (net 1) (net_name GND) (layer F.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.25))
    (min_thickness 0.25)
    (fill yes (arc_segments 32) (thermal_gap 0.254) (thermal_bridge_width 0.254))
    (polygon
      (pts
        (xy 39.5 26.7) (xy 39.5 24.7) (xy 39.8 24.4) (xy 40.4 24.4) (xy 40.7 24.7)
        (xy 40.7 26.7)
      )
    )
  )
  (zone (net 1) (net_name GND) (layer F.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.25))
    (min_thickness 0.25)
    (fill yes (arc_segments 32) (thermal_gap 0.254) (thermal_bridge_width 0.254))
    (polygon
      (pts
        (xy 37.475 26.7) (xy 37.475 24.625) (xy 37.725 24.375) (xy 38.475 24.375) (xy 38.725 24.625)
        (xy 38.725 26.7)
      )
    )
  )
  (zone (net 3) (net_name Vh) (layer F.Cu) (hatch edge 0.508)
    (connect_pads yes (clearance 0.25))
    (min_thickness 0.2)
    (fill yes (arc_segments 32) (thermal_gap 0.25) (thermal_bridge_width 2))
    (polygon
      (pts
        (xy 20.8 29.8) (xy 20.8 32.4) (xy 21.5 33.2) (xy 21.9 33.2) (xy 23.1 34.4)
        (xy 23.1 37.7) (xy 23.3 37.9) (xy 23.3 41.3) (xy 24.2 42.1) (xy 25.5 42.1)
        (xy 27.6 40) (xy 27.6 35) (xy 27 34.4) (xy 27 31.6) (xy 26 30.6)
        (xy 26 29.8) (xy 25.2 29) (xy 21.6 29)
      )
    )
  )
  (zone (net 1) (net_name GND) (layer F.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.25))
    (min_thickness 0.25)
    (fill yes (arc_segments 32) (thermal_gap 0.254) (thermal_bridge_width 0.254))
    (polygon
      (pts
        (xy 35.7 26.6) (xy 35.7 24.525) (xy 35.95 24.275) (xy 36.65 24.275) (xy 36.9 24.525)
        (xy 36.9 26.6)
      )
    )
  )
  (zone (net 10) (net_name /3V6/BuckIn) (layer F.Cu) (hatch edge 0.508)
    (connect_pads yes (clearance 0.25))
    (min_thickness 0.25)
    (fill yes (arc_segments 32) (thermal_gap 0.254) (thermal_bridge_width 0.254))
    (polygon
      (pts
        (xy 40.7 29) (xy 40.4 29.3) (xy 40.3 29.3) (xy 40 29.6) (xy 40 31.3)
        (xy 39.1 31.3) (xy 39.1 29.6) (xy 38.8 29.3) (xy 37.155145 29.301909) (xy 36.755145 28.901909)
        (xy 35.8 28.9) (xy 35.8 27.7) (xy 40.7 27.7)
      )
    )
  )
  (zone (net 13) (net_name /3V6/VBsw) (layer F.Cu) (hatch edge 0.508)
    (connect_pads yes (clearance 0.25))
    (min_thickness 0.25)
    (fill yes (arc_segments 32) (thermal_gap 0.254) (thermal_bridge_width 0.254))
    (polygon
      (pts
        (xy 51.4 33.6) (xy 51.4 36.7) (xy 50.8 37.3) (xy 43.6 37.3) (xy 43 36.670602)
        (xy 41 36.675) (xy 41 35.15) (xy 41.2 35.1) (xy 42 34.3) (xy 42.9 34.3)
        (xy 43.7 33.5) (xy 51.3 33.5)
      )
    )
  )
  (zone (net 1) (net_name GND) (layer F.Cu) (hatch edge 0.508)
    (connect_pads yes (clearance 0.25))
    (min_thickness 0.25)
    (fill yes (arc_segments 32) (thermal_gap 0.254) (thermal_bridge_width 0.254))
    (polygon
      (pts
        (xy 54.600001 40) (xy 54.599999 40.5) (xy 54.3 40.8) (xy 53.7 40.8) (xy 53.4 40.5)
        (xy 53.4 39.999999)
      )
    )
  )
  (zone (net 5) (net_name /VHp) (layer F.Cu) (hatch edge 0.508)
    (connect_pads yes (clearance 0.25))
    (min_thickness 0.2)
    (fill yes (arc_segments 32) (thermal_gap 0.25) (thermal_bridge_width 2))
    (polygon
      (pts
        (xy 27.3 26.2) (xy 27.8 26.7) (xy 29.9 26.7) (xy 30.7 25.9) (xy 30.7 25.3)
        (xy 31.4 24.6) (xy 32.6 24.6) (xy 33 25) (xy 34 25) (xy 34.6 25.6)
        (xy 34.6 28.5) (xy 33.4 29.7) (xy 33.4 32) (xy 31.2 32) (xy 31.2 29.7)
        (xy 30.4 28.8) (xy 27.1 28.8) (xy 25.3 27) (xy 25.3 24.5) (xy 27.3 24.5)
      )
    )
  )
  (zone (net 1) (net_name GND) (layer F.Cu) (hatch edge 0.508)
    (connect_pads yes (clearance 0.25))
    (min_thickness 0.25)
    (fill yes (arc_segments 32) (thermal_gap 0.254) (thermal_bridge_width 0.254))
    (polygon
      (pts
        (xy 52.7 40.794829) (xy 49.9 40.794829) (xy 49.7 40.6) (xy 49.7 38) (xy 49.9 37.8)
        (xy 52.700001 37.797415) (xy 52.9 38.002586) (xy 52.9 40.6)
      )
    )
  )
  (zone (net 1) (net_name GND) (layer F.Cu) (hatch edge 0.508)
    (connect_pads yes (clearance 0.25))
    (min_thickness 0.25)
    (fill yes (arc_segments 32) (thermal_gap 0.254) (thermal_bridge_width 0.254))
    (polygon
      (pts
        (xy 63.5 25.6) (xy 64.4 26.5) (xy 64.4 30.1) (xy 63.5 31) (xy 63.5 31.6)
        (xy 57.7 31.6) (xy 57.7 31) (xy 56.8 30.1) (xy 56.8 26.5) (xy 57.7 25.6)
        (xy 57.7 24) (xy 58 23.7) (xy 63.2 23.7) (xy 63.5 24)
      )
    )
  )
  (zone (net 0) (net_name "") (layer B.Mask) (hatch edge 0.508)
    (connect_pads (clearance 0.25))
    (min_thickness 0.254)
    (fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 75 46) (xy 20 46) (xy 20 43) (xy 21 43) (xy 21 44)
        (xy 21.5 44.5) (xy 26.5 44.5) (xy 27 44) (xy 27 42.5) (xy 28 41.5)
        (xy 65 41.5) (xy 66 42.5) (xy 66 44) (xy 66.488779 44.5) (xy 73.1 44.5)
        (xy 73.6 44) (xy 73.6 42.7) (xy 73.9 42.7) (xy 73.9 24.7) (xy 73.3 24.1)
        (xy 21.7 24.1) (xy 21.1 24.7) (xy 21.1 26) (xy 20 26) (xy 20 22)
        (xy 75 22)
      )
    )
  )
  (zone (net 2) (net_name +3V3) (layer F.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.2))
    (min_thickness 0.2)
    (fill yes (arc_segments 32) (thermal_gap 0.254) (thermal_bridge_width 0.75))
    (polygon
      (pts
        (xy 65.6 32) (xy 66.9 30.7) (xy 66.9 29.9) (xy 69.4 27.4) (xy 71.7 27.4)
        (xy 72.4 28.1) (xy 72.4 29.4) (xy 71.3 30.5) (xy 71.3 31.8) (xy 72.4 32.9)
        (xy 72.4 34.4) (xy 71.3 35.5) (xy 71.3 41.4) (xy 71.1 41.6) (xy 68.6 41.6)
        (xy 68.4 41.4) (xy 68.4 38.3) (xy 67.7 37.6) (xy 66.9 37.6) (xy 66.2 38.3)
        (xy 66.2 39.5) (xy 63.4 39.5) (xy 62.2 38.3) (xy 61.4 37.5) (xy 60.3 37.5)
        (xy 60.3 36.5) (xy 61 36.5) (xy 61.2 36.3) (xy 61.2 32.9) (xy 62.1 32)
      )
    )
  )
  (zone (net 15) (net_name /LDO_In) (layer F.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.25))
    (min_thickness 0.2)
    (fill yes (arc_segments 32) (thermal_gap 0.25) (thermal_bridge_width 0.5))
    (polygon
      (pts
        (xy 54.4 26.9) (xy 56 26.9) (xy 56 31.3) (xy 57 32.3) (xy 59.3 32.3)
        (xy 59.9 32.9) (xy 59.9 36.5) (xy 58.9 37.5) (xy 58.9 39) (xy 57.3 39)
        (xy 57.3 38.2) (xy 56.9 37.8) (xy 55.2 37.8) (xy 54.7 37.3) (xy 52.4 37.3)
        (xy 52 36.9) (xy 52 33) (xy 48.8 29.8) (xy 48.8 26.7) (xy 54.2 26.7)
      )
    )
  )
  (zone (net 0) (net_name "") (layer F.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.2))
    (min_thickness 0.254)
    (keepout (tracks allowed) (vias allowed) (copperpour not_allowed))
    (fill (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 65.9 35) (xy 64.7 35) (xy 64.7 33.3) (xy 65.9 33.3)
      )
    )
  )
)
