(kicad_pcb (version 20171130) (host pcbnew "(5.1.7)-1")
  (general
    (thickness 1.6)
    (drawings 13)
    (tracks 664)
    (zones 0)
    (modules 69)
    (nets 72)
  )
  (page USLetter)
  (title_block
    (title "Gen 4A Cart Control Box Circuit Board")
    (date 2020-11-18)
    (rev 0)
    (company "Android Industries")
    (comment 1 "Part Number: EX20139-002")
    (comment 2 "Designer: CMB")
    (comment 3 "Draft 8")
  )
  (layers
    (0 F.Cu signal)
    (31 B.Cu signal)
    (32 B.Adhes user)
    (33 F.Adhes user)
    (34 B.Paste user)
    (35 F.Paste user)
    (36 B.SilkS user)
    (37 F.SilkS user)
    (38 B.Mask user)
    (39 F.Mask user)
    (40 Dwgs.User user)
    (41 Cmts.User user)
    (42 Eco1.User user)
    (43 Eco2.User user)
    (44 Edge.Cuts user)
    (45 Margin user)
    (46 B.CrtYd user)
    (47 F.CrtYd user)
    (48 B.Fab user hide)
    (49 F.Fab user hide)
  )
  (setup
    (last_trace_width 0.4)
    (user_trace_width 0.8)
    (trace_clearance 0.2)
    (zone_clearance 0.508)
    (zone_45_only no)
    (trace_min 0.2)
    (via_size 0.8)
    (via_drill 0.4)
    (via_min_size 0.4)
    (via_min_drill 0.3)
    (uvia_size 0.3)
    (uvia_drill 0.1)
    (uvias_allowed no)
    (uvia_min_size 0.2)
    (uvia_min_drill 0.1)
    (edge_width 0.05)
    (segment_width 0.2)
    (pcb_text_width 0.3)
    (pcb_text_size 1.5 1.5)
    (mod_edge_width 0.12)
    (mod_text_size 0.6 0.6)
    (mod_text_width 0.15)
    (pad_size 1.524 1.524)
    (pad_drill 0.762)
    (pad_to_mask_clearance 0.051)
    (solder_mask_min_width 0.25)
    (aux_axis_origin 0 0)
    (visible_elements 7FFFFF7F)
    (pcbplotparams
      (layerselection 0x010fc_ffffffff)
      (usegerberextensions false)
      (usegerberattributes false)
      (usegerberadvancedattributes false)
      (creategerberjobfile false)
      (excludeedgelayer true)
      (linewidth 0.100000)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (padsonsilk false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 1)
      (scaleselection 1)
      (outputdirectory ""))
  )
  (net 0 "")
  (net 1 GND)
  (net 2 +5V)
  (net 3 /LV_RST)
  (net 4 +BATT)
  (net 5 /I_SENS)
  (net 6 +24V)
  (net 7 /LV_PWR_LT)
  (net 8 /LV_FLT_LT)
  (net 9 /LV_STAT_LT)
  (net 10 /LV_STRT)
  (net 11 /LV_EN)
  (net 12 /LV_PWM)
  (net 13 /V_SENS)
  (net 14 /LV_AC_SLW)
  (net 15 /LV_AC_STP)
  (net 16 /LV_F_BMP)
  (net 17 /LV_IR_RX)
  (net 18 /LV_SWP)
  (net 19 /LV_L_SIG)
  (net 20 /LV_R_SIG)
  (net 21 /LV_TX)
  (net 22 /LV_RX)
  (net 23 /LV_IR_TX)
  (net 24 /LV_SWP_RED_LT)
  (net 25 /LV_SWP_GRN_LT)
  (net 26 /LV_BRK)
  (net 27 GND1)
  (net 28 "Net-(Q1-Pad3)")
  (net 29 "Net-(Q1-Pad2)")
  (net 30 VCC)
  (net 31 "Net-(U2-Pad4)")
  (net 32 "Net-(U2-Pad2)")
  (net 33 "Net-(U2-Pad1)")
  (net 34 "Net-(C2-Pad1)")
  (net 35 "Net-(C4-Pad1)")
  (net 36 VBUS)
  (net 37 "Net-(C5-Pad1)")
  (net 38 "Net-(C6-Pad1)")
  (net 39 +VDC)
  (net 40 "Net-(C16-Pad2)")
  (net 41 "Net-(C22-Pad1)")
  (net 42 "Net-(C24-Pad2)")
  (net 43 "Net-(R5-Pad1)")
  (net 44 "Net-(R6-Pad2)")
  (net 45 /LV_B_BMP)
  (net 46 /+MTR)
  (net 47 "Net-(Q2-Pad1)")
  (net 48 "Net-(C23-Pad1)")
  (net 49 "Net-(C25-Pad2)")
  (net 50 "Net-(J8-Pad20)")
  (net 51 "Net-(J8-Pad18)")
  (net 52 "Net-(J8-Pad16)")
  (net 53 "Net-(J8-Pad14)")
  (net 54 "Net-(J8-Pad12)")
  (net 55 "Net-(J8-Pad10)")
  (net 56 "Net-(J8-Pad8)")
  (net 57 "Net-(J8-Pad2)")
  (net 58 "Net-(J8-Pad13)")
  (net 59 "Net-(J8-Pad11)")
  (net 60 "Net-(J8-Pad9)")
  (net 61 "Net-(J8-Pad7)")
  (net 62 "Net-(J8-Pad5)")
  (net 63 "Net-(J8-Pad1)")
  (net 64 "Net-(R14-Pad1)")
  (net 65 "Net-(R15-Pad1)")
  (net 66 "Net-(U1-Pad8)")
  (net 67 "Net-(U1-Pad7)")
  (net 68 "Net-(F1-Pad2)")
  (net 69 "Net-(J8-Pad19)")
  (net 70 "Net-(J8-Pad17)")
  (net 71 "Net-(J8-Pad15)")
  (net_class Default "This is the default net class."
    (clearance 0.2)
    (trace_width 0.4)
    (via_dia 0.8)
    (via_drill 0.4)
    (uvia_dia 0.3)
    (uvia_drill 0.1)
    (add_net +24V)
    (add_net +5V)
    (add_net +BATT)
    (add_net +VDC)
    (add_net /+MTR)
    (add_net /I_SENS)
    (add_net /LV_AC_SLW)
    (add_net /LV_AC_STP)
    (add_net /LV_BRK)
    (add_net /LV_B_BMP)
    (add_net /LV_EN)
    (add_net /LV_FLT_LT)
    (add_net /LV_F_BMP)
    (add_net /LV_IR_RX)
    (add_net /LV_IR_TX)
    (add_net /LV_L_SIG)
    (add_net /LV_PWM)
    (add_net /LV_PWR_LT)
    (add_net /LV_RST)
    (add_net /LV_RX)
    (add_net /LV_R_SIG)
    (add_net /LV_STAT_LT)
    (add_net /LV_STRT)
    (add_net /LV_SWP)
    (add_net /LV_SWP_GRN_LT)
    (add_net /LV_SWP_RED_LT)
    (add_net /LV_TX)
    (add_net /V_SENS)
    (add_net GND)
    (add_net GND1)
    (add_net "Net-(C16-Pad2)")
    (add_net "Net-(C2-Pad1)")
    (add_net "Net-(C22-Pad1)")
    (add_net "Net-(C23-Pad1)")
    (add_net "Net-(C24-Pad2)")
    (add_net "Net-(C25-Pad2)")
    (add_net "Net-(C4-Pad1)")
    (add_net "Net-(C5-Pad1)")
    (add_net "Net-(C6-Pad1)")
    (add_net "Net-(F1-Pad2)")
    (add_net "Net-(J8-Pad1)")
    (add_net "Net-(J8-Pad10)")
    (add_net "Net-(J8-Pad11)")
    (add_net "Net-(J8-Pad12)")
    (add_net "Net-(J8-Pad13)")
    (add_net "Net-(J8-Pad14)")
    (add_net "Net-(J8-Pad15)")
    (add_net "Net-(J8-Pad16)")
    (add_net "Net-(J8-Pad17)")
    (add_net "Net-(J8-Pad18)")
    (add_net "Net-(J8-Pad19)")
    (add_net "Net-(J8-Pad2)")
    (add_net "Net-(J8-Pad20)")
    (add_net "Net-(J8-Pad5)")
    (add_net "Net-(J8-Pad7)")
    (add_net "Net-(J8-Pad8)")
    (add_net "Net-(J8-Pad9)")
    (add_net "Net-(Q1-Pad2)")
    (add_net "Net-(Q1-Pad3)")
    (add_net "Net-(Q2-Pad1)")
    (add_net "Net-(R14-Pad1)")
    (add_net "Net-(R15-Pad1)")
    (add_net "Net-(R5-Pad1)")
    (add_net "Net-(R6-Pad2)")
    (add_net "Net-(U1-Pad7)")
    (add_net "Net-(U1-Pad8)")
    (add_net "Net-(U2-Pad1)")
    (add_net "Net-(U2-Pad2)")
    (add_net "Net-(U2-Pad4)")
    (add_net VBUS)
    (add_net VCC)
  )
  (module EX20139-002:Android-Logo locked (layer F.Cu) (tedit 5FB55F82)
    (at 193.04 110.49)
    (descr "Graphic Element")
    (attr virtual)
    (fp_text reference G*** (at 0 0) (layer F.SilkS) hide)
    (fp_text value LOGO (at 0.75 0) (layer F.SilkS) hide)
  )
  (module EX20139-002:LMZ14203HTZX-NOPB (layer B.Cu) (tedit 5FB56145)
    (at 137.16 96.52 180)
    (descr "Voltage Regulator")
    (zone_connect 2)
    (attr smd)
    (fp_text reference U7 (at -6.35 5.08 180) (layer B.SilkS))
    (fp_text value LMZ14203H (at 0 -11.43 180) (layer B.Fab))
    (pad 4 thru_hole circle (at -1.905 3.81 180) (size 0.8 0.8) (drill 0.4) (layers *.Cu *.Mask)
      (net 1 GND) (zone_connect 2))
    (pad 4 thru_hole circle (at -1.905 2.54 180) (size 0.8 0.8) (drill 0.4) (layers *.Cu *.Mask)
      (net 1 GND) (zone_connect 2))
    (pad 4 thru_hole circle (at 0 3.175 180) (size 0.8 0.8) (drill 0.4) (layers *.Cu *.Mask)
      (net 1 GND) (zone_connect 2))
    (pad 4 thru_hole circle (at 1.905 2.54 180) (size 0.8 0.8) (drill 0.4) (layers *.Cu *.Mask)
      (net 1 GND) (zone_connect 2))
    (pad 4 thru_hole circle (at 1.905 3.81 180) (size 0.8 0.8) (drill 0.4) (layers *.Cu *.Mask)
      (net 1 GND) (zone_connect 2))
    (pad 4 thru_hole circle (at 1.905 -2.54 180) (size 0.8 0.8) (drill 0.4) (layers *.Cu *.Mask)
      (net 1 GND) (zone_connect 2))
    (pad 4 thru_hole circle (at -1.905 -2.54 180) (size 0.8 0.8) (drill 0.4) (layers *.Cu *.Mask)
      (net 1 GND) (zone_connect 2))
    (pad 4 thru_hole circle (at -1.905 -3.81 180) (size 0.8 0.8) (drill 0.4) (layers *.Cu *.Mask)
      (net 1 GND) (zone_connect 2))
    (pad 4 thru_hole circle (at 0 -3.175 180) (size 0.8 0.8) (drill 0.4) (layers *.Cu *.Mask)
      (net 1 GND) (zone_connect 2))
    (pad 4 thru_hole circle (at 1.905 -3.81 180) (size 0.8 0.8) (drill 0.4) (layers *.Cu *.Mask)
      (net 1 GND) (zone_connect 2))
    (pad 1 smd roundrect (at -3.81 -7.305 180) (size 0.89 4.06) (drill (offset 0 -0.5)) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 39 +VDC) (zone_connect 2))
    (pad 2 smd roundrect (at -2.54 -7.305 180) (size 0.89 4.06) (drill (offset 0 -0.5)) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 65 "Net-(R15-Pad1)") (zone_connect 2))
    (pad 3 smd roundrect (at -1.27 -7.305 180) (size 0.89 4.06) (drill (offset 0 -0.5)) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 11 /LV_EN) (zone_connect 2))
    (pad 4 smd roundrect (at 0 -7.305 180) (size 0.89 4.06) (drill (offset 0 -0.5)) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 1 GND) (zone_connect 2))
    (pad 5 smd roundrect (at 1.27 -7.305 180) (size 0.89 4.06) (drill (offset 0 -0.5)) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 48 "Net-(C23-Pad1)") (zone_connect 2))
    (pad 6 smd roundrect (at 2.54 -7.305 180) (size 0.89 4.06) (drill (offset 0 -0.5)) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 49 "Net-(C25-Pad2)") (zone_connect 2))
    (pad 7 smd roundrect (at 3.81 -7.305 180) (size 0.89 4.06) (drill (offset 0 -0.5)) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 6 +24V) (zone_connect 2))
    (pad 4 smd roundrect (at 0 0 180) (size 5.35 8.54) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.042)
      (net 1 GND) (zone_connect 2))
    (pad 4 thru_hole circle (at 0 0 180) (size 5.35 5.35) (drill 3) (layers *.Cu *.Mask)
      (net 1 GND) (zone_connect 2))
    (model "3D Models/NDW0007A.stp"
      (offset (xyz 0 0.4 0.65))
      (scale (xyz 1 1 1))
      (rotate (xyz -90 0 0))
    )
  )
  (module EX20139-002:LMZ14203HTZX-NOPB (layer B.Cu) (tedit 5FB56145)
    (at 160.655 96.52 180)
    (descr "Voltage Regulator")
    (zone_connect 2)
    (attr smd)
    (fp_text reference U6 (at -6.35 5.08 180) (layer B.SilkS))
    (fp_text value LMZ14203H (at 0 -11.43 180) (layer B.Fab))
    (pad 4 thru_hole circle (at -1.905 3.81 180) (size 0.8 0.8) (drill 0.4) (layers *.Cu *.Mask)
      (net 1 GND) (zone_connect 2))
    (pad 4 thru_hole circle (at -1.905 2.54 180) (size 0.8 0.8) (drill 0.4) (layers *.Cu *.Mask)
      (net 1 GND) (zone_connect 2))
    (pad 4 thru_hole circle (at 0 3.175 180) (size 0.8 0.8) (drill 0.4) (layers *.Cu *.Mask)
      (net 1 GND) (zone_connect 2))
    (pad 4 thru_hole circle (at 1.905 2.54 180) (size 0.8 0.8) (drill 0.4) (layers *.Cu *.Mask)
      (net 1 GND) (zone_connect 2))
    (pad 4 thru_hole circle (at 1.905 3.81 180) (size 0.8 0.8) (drill 0.4) (layers *.Cu *.Mask)
      (net 1 GND) (zone_connect 2))
    (pad 4 thru_hole circle (at 1.905 -2.54 180) (size 0.8 0.8) (drill 0.4) (layers *.Cu *.Mask)
      (net 1 GND) (zone_connect 2))
    (pad 4 thru_hole circle (at -1.905 -2.54 180) (size 0.8 0.8) (drill 0.4) (layers *.Cu *.Mask)
      (net 1 GND) (zone_connect 2))
    (pad 4 thru_hole circle (at -1.905 -3.81 180) (size 0.8 0.8) (drill 0.4) (layers *.Cu *.Mask)
      (net 1 GND) (zone_connect 2))
    (pad 4 thru_hole circle (at 0 -3.175 180) (size 0.8 0.8) (drill 0.4) (layers *.Cu *.Mask)
      (net 1 GND) (zone_connect 2))
    (pad 4 thru_hole circle (at 1.905 -3.81 180) (size 0.8 0.8) (drill 0.4) (layers *.Cu *.Mask)
      (net 1 GND) (zone_connect 2))
    (pad 1 smd roundrect (at -3.81 -7.305 180) (size 0.89 4.06) (drill (offset 0 -0.5)) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 39 +VDC) (zone_connect 2))
    (pad 2 smd roundrect (at -2.54 -7.305 180) (size 0.89 4.06) (drill (offset 0 -0.5)) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 64 "Net-(R14-Pad1)") (zone_connect 2))
    (pad 3 smd roundrect (at -1.27 -7.305 180) (size 0.89 4.06) (drill (offset 0 -0.5)) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (zone_connect 2))
    (pad 4 smd roundrect (at 0 -7.305 180) (size 0.89 4.06) (drill (offset 0 -0.5)) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 1 GND) (zone_connect 2))
    (pad 5 smd roundrect (at 1.27 -7.305 180) (size 0.89 4.06) (drill (offset 0 -0.5)) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 41 "Net-(C22-Pad1)") (zone_connect 2))
    (pad 6 smd roundrect (at 2.54 -7.305 180) (size 0.89 4.06) (drill (offset 0 -0.5)) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 42 "Net-(C24-Pad2)") (zone_connect 2))
    (pad 7 smd roundrect (at 3.81 -7.305 180) (size 0.89 4.06) (drill (offset 0 -0.5)) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 2 +5V) (zone_connect 2))
    (pad 4 smd roundrect (at 0 0 180) (size 5.35 8.54) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.042)
      (net 1 GND) (zone_connect 2))
    (pad 4 thru_hole circle (at 0 0 180) (size 5.35 5.35) (drill 3) (layers *.Cu *.Mask)
      (net 1 GND) (zone_connect 2))
    (model "3D Models/NDW0007A.stp"
      (offset (xyz 0 0.4 0.65))
      (scale (xyz 1 1 1))
      (rotate (xyz -90 0 0))
    )
  )
  (module EX20139-002:63824-1 (layer F.Cu) (tedit 5FB5615A)
    (at 187.96 100.33 270)
    (descr "Spade Terminal")
    (fp_text reference J6 (at 5.08 0 180) (layer F.SilkS))
    (fp_text value Conn_01x01_Male (at 0 3.175 90) (layer F.Fab))
    (pad 1 thru_hole circle (at 2.54 0 270) (size 2.5 2.5) (drill 1.4) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 1 thru_hole circle (at -2.54 0 270) (size 2.5 2.5) (drill 1.4) (layers *.Cu *.Mask)
      (net 1 GND))
    (model "3D Models/63824-1.stp"
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz -90 0 0))
    )
  )
  (module EX20139-002:63824-1 (layer F.Cu) (tedit 5FB5615A)
    (at 195.58 100.33 270)
    (descr "Spade Terminal")
    (fp_text reference J5 (at 5.08 0 180) (layer F.SilkS))
    (fp_text value Conn_01x01_Male (at 0 3.175 90) (layer F.Fab))
    (pad 1 thru_hole circle (at 2.54 0 270) (size 2.5 2.5) (drill 1.4) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 1 thru_hole circle (at -2.54 0 270) (size 2.5 2.5) (drill 1.4) (layers *.Cu *.Mask)
      (net 1 GND))
    (model "3D Models/63824-1.stp"
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz -90 0 0))
    )
  )
  (module EX20139-002:63824-1 (layer F.Cu) (tedit 5FB5615A)
    (at 180.34 100.33 270)
    (descr "Spade Terminal")
    (fp_text reference J4 (at 5.08 0 180) (layer F.SilkS))
    (fp_text value Conn_01x01_Male (at 0 3.175 90) (layer F.Fab))
    (pad 1 thru_hole circle (at 2.54 0 270) (size 2.5 2.5) (drill 1.4) (layers *.Cu *.Mask)
      (net 4 +BATT))
    (pad 1 thru_hole circle (at -2.54 0 270) (size 2.5 2.5) (drill 1.4) (layers *.Cu *.Mask)
      (net 4 +BATT))
    (model "3D Models/63824-1.stp"
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz -90 0 0))
    )
  )
  (module EX20139-002:63824-1 (layer F.Cu) (tedit 5FB5615A)
    (at 203.2 100.33 270)
    (descr "Spade Terminal")
    (fp_text reference J2 (at 5.08 0 180) (layer F.SilkS))
    (fp_text value Conn_01x01_Male (at 0 3.175 90) (layer F.Fab))
    (pad 1 thru_hole circle (at 2.54 0 270) (size 2.5 2.5) (drill 1.4) (layers *.Cu *.Mask)
      (net 46 /+MTR))
    (pad 1 thru_hole circle (at -2.54 0 270) (size 2.5 2.5) (drill 1.4) (layers *.Cu *.Mask)
      (net 46 /+MTR))
    (model "3D Models/63824-1.stp"
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz -90 0 0))
    )
  )
  (module Diode_SMD:D_SMB_Handsoldering (layer B.Cu) (tedit 590B3D55)
    (at 187.325 114.935 90)
    (descr "Diode SMB (DO-214AA) Handsoldering")
    (tags "Diode SMB (DO-214AA) Handsoldering")
    (attr smd)
    (fp_text reference D2 (at 5.715 0 180) (layer B.SilkS))
    (fp_text value 30V (at 0 -3 90) (layer B.Fab))
    (fp_text user %R (at 0 3 90) (layer B.Fab))
    (pad 2 smd rect (at 2.7 0 90) (size 3.5 2.3) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (pad 1 smd rect (at -2.7 0 90) (size 3.5 2.3) (layers B.Cu B.Paste B.Mask)
      (net 39 +VDC))
    (model ${KISYS3DMOD}/Diode_SMD.3dshapes/D_SMB.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder (layer B.Cu) (tedit 5F68FEEF)
    (at 96.52 95.25 270)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C16 (at -2.54 0 180) (layer B.SilkS))
    (fp_text value 100nF (at 0 -1.43 90) (layer B.Fab))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 2 smd roundrect (at 0.8625 0 270) (size 1.075 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 40 "Net-(C16-Pad2)"))
    (pad 1 smd roundrect (at -0.8625 0 270) (size 1.075 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 3 /LV_RST))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder (layer B.Cu) (tedit 5F68FEEF)
    (at 138.43 109.22 270)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (zone_connect 1)
    (attr smd)
    (fp_text reference C23 (at 2.54 0 180) (layer B.SilkS))
    (fp_text value 4.7nF (at 0 -1.43 90) (layer B.Fab))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 2 smd roundrect (at 0.8625 0 270) (size 1.075 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 1 GND) (zone_connect 1))
    (pad 1 smd roundrect (at -0.8625 0 270) (size 1.075 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 48 "Net-(C23-Pad1)") (zone_connect 1))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder (layer B.Cu) (tedit 5F68FEEF)
    (at 161.925 109.22 270)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (zone_connect 1)
    (attr smd)
    (fp_text reference C22 (at 2.54 0 180) (layer B.SilkS))
    (fp_text value 4.7nF (at 0 -1.43 90) (layer B.Fab))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 2 smd roundrect (at 0.8625 0 270) (size 1.075 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 1 GND) (zone_connect 1))
    (pad 1 smd roundrect (at -0.8625 0 270) (size 1.075 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 41 "Net-(C22-Pad1)") (zone_connect 1))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder (layer B.Cu) (tedit 5F68FEEF)
    (at 121.285 99.06)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (zone_connect 1)
    (attr smd)
    (fp_text reference C19 (at 0 -1.27) (layer B.SilkS))
    (fp_text value 100nF (at 0 -1.43) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 2 smd roundrect (at 0.8625 0) (size 1.075 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 1 GND) (zone_connect 1))
    (pad 1 smd roundrect (at -0.8625 0) (size 1.075 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 6 +24V) (zone_connect 1))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder (layer B.Cu) (tedit 5F68FEEF)
    (at 91.44 100.33 270)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (zone_connect 1)
    (attr smd)
    (fp_text reference C15 (at 2.54 0 180) (layer B.SilkS))
    (fp_text value 100nF (at 0 -1.43 90) (layer B.Fab))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 2 smd roundrect (at 0.8625 0 270) (size 1.075 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 1 GND) (zone_connect 1))
    (pad 1 smd roundrect (at -0.8625 0 270) (size 1.075 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 2 +5V) (zone_connect 1))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder (layer B.Cu) (tedit 5F68FEEF)
    (at 184.15 97.79)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (zone_connect 1)
    (attr smd)
    (fp_text reference C14 (at 0 -1.27) (layer B.SilkS))
    (fp_text value 100nF (at 0 -1.43) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 2 smd roundrect (at 0.8625 0) (size 1.075 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 1 GND) (zone_connect 1))
    (pad 1 smd roundrect (at -0.8625 0) (size 1.075 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 4 +BATT) (zone_connect 1))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder (layer B.Cu) (tedit 5F68FEEF)
    (at 86.36 100.33 270)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C13 (at 2.54 0 180) (layer B.SilkS))
    (fp_text value 100nF (at 0 -1.43 90) (layer B.Fab))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 2 smd roundrect (at 0.8625 0 270) (size 1.075 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 27 GND1))
    (pad 1 smd roundrect (at -0.8625 0 270) (size 1.075 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 30 VCC))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1206_3216Metric_Pad1.33x1.80mm_HandSolder (layer B.Cu) (tedit 5F68FEEF)
    (at 199.39 100.33 180)
    (descr "Capacitor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C12 (at 0 1.85) (layer B.SilkS))
    (fp_text value 220nF (at 0 -1.85) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 2 smd roundrect (at 1.5625 0 180) (size 1.325 1.8) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.188679)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.5625 0 180) (size 1.325 1.8) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.188679)
      (net 46 /+MTR))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1206_3216Metric_Pad1.33x1.80mm_HandSolder (layer B.Cu) (tedit 5F68FEEF)
    (at 191.77 114.935 90)
    (descr "Capacitor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C11 (at 3.175 0 180) (layer B.SilkS))
    (fp_text value 220nF (at 0 -1.85 90) (layer B.Fab))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 2 smd roundrect (at 1.5625 0 90) (size 1.325 1.8) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.188679)
      (net 46 /+MTR))
    (pad 1 smd roundrect (at -1.5625 0 90) (size 1.325 1.8) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.188679)
      (net 39 +VDC))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder (layer B.Cu) (tedit 5F68FEEF)
    (at 190.5 121.92 180)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (zone_connect 1)
    (attr smd)
    (fp_text reference C10 (at 0 1.43) (layer B.SilkS))
    (fp_text value 100nF (at 0 -1.43) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 2 smd roundrect (at 0.8625 0 180) (size 1.075 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 1 GND) (zone_connect 1))
    (pad 1 smd roundrect (at -0.8625 0 180) (size 1.075 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 39 +VDC) (zone_connect 1))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder (layer B.Cu) (tedit 5F68FEEF)
    (at 129.54 120.015 90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (zone_connect 1)
    (attr smd)
    (fp_text reference C5 (at -2.54 0 180) (layer B.SilkS))
    (fp_text value 1nF (at 0 -1.43 90) (layer B.Fab))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 2 smd roundrect (at 0.8625 0 90) (size 1.075 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 1 GND) (zone_connect 1))
    (pad 1 smd roundrect (at -0.8625 0 90) (size 1.075 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 37 "Net-(C5-Pad1)") (zone_connect 1))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder (layer B.Cu) (tedit 5F68FEEF)
    (at 121.92 120.015 90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (zone_connect 1)
    (attr smd)
    (fp_text reference C3 (at -2.54 0 180) (layer B.SilkS))
    (fp_text value 100nF (at 0 -1.43 90) (layer B.Fab))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 2 smd roundrect (at 0.8625 0 90) (size 1.075 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 1 GND) (zone_connect 1))
    (pad 1 smd roundrect (at -0.8625 0 90) (size 1.075 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 5 /I_SENS) (zone_connect 1))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder (layer B.Cu) (tedit 5F68FEEF)
    (at 93.345 108.585 270)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (zone_connect 1)
    (attr smd)
    (fp_text reference C1 (at -2.54 0 180) (layer B.SilkS))
    (fp_text value 100nF (at 0 -1.43 90) (layer B.Fab))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 2 smd roundrect (at 0.8625 0 270) (size 1.075 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 1 GND) (zone_connect 1))
    (pad 1 smd roundrect (at -0.8625 0 270) (size 1.075 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 2 +5V) (zone_connect 1))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Fuse:Fuse_1210_3225Metric_Pad1.42x2.65mm_HandSolder (layer B.Cu) (tedit 5F68FEF1)
    (at 133.985 114.3 180)
    (descr "Fuse SMD 1210 (3225 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "fuse handsolder")
    (attr smd)
    (fp_text reference F1 (at 0 -2.54) (layer B.SilkS))
    (fp_text value 100mA (at 0 -2.28) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 2 smd roundrect (at 1.4875 0 180) (size 1.425 2.65) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.175439)
      (net 68 "Net-(F1-Pad2)"))
    (pad 1 smd roundrect (at -1.4875 0 180) (size 1.425 2.65) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.175439)
      (net 39 +VDC))
    (model ${KISYS3DMOD}/Fuse.3dshapes/Fuse_1210_3225Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_THT:CP_Radial_D12.5mm_P5.00mm (layer B.Cu) (tedit 5FB2E67D)
    (at 177.165 114.935)
    (descr "CP, Radial series, Radial, pin pitch=5.00mm, , diameter=12.5mm, Electrolytic Capacitor")
    (tags "CP Radial series Radial pin pitch 5.00mm  diameter 12.5mm Electrolytic Capacitor")
    (fp_text reference C17 (at 0 7.62) (layer B.SilkS))
    (fp_text value 470uF (at 0 -7.5) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 2 thru_hole circle (at 2.5 0) (size 2.4 2.4) (drill 1.2) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 1 thru_hole rect (at -2.5 0) (size 2.4 2.4) (drill 1.2) (layers *.Cu *.Mask)
      (net 39 +VDC))
    (model ${KISYS3DMOD}/Capacitor_THT.3dshapes/CP_Radial_D12.5mm_P5.00mm.wrl
      (offset (xyz -2.5 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_THT:CP_Radial_D6.3mm_P2.50mm (layer B.Cu) (tedit 5FB2E60E)
    (at 127.635 101.6 90)
    (descr "CP, Radial series, Radial, pin pitch=2.50mm, , diameter=6.3mm, Electrolytic Capacitor")
    (tags "CP Radial series Radial pin pitch 2.50mm  diameter 6.3mm Electrolytic Capacitor")
    (fp_text reference C27 (at 4.445 0) (layer B.SilkS))
    (fp_text value 47uF (at 0 -4.4 270) (layer B.Fab))
    (fp_text user %R (at 0 0 270) (layer B.Fab))
    (pad 2 thru_hole circle (at 1.25 0 90) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 1 thru_hole rect (at -1.25 0 90) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask)
      (net 6 +24V))
    (model ${KISYS3DMOD}/Capacitor_THT.3dshapes/CP_Radial_D6.3mm_P2.50mm.wrl
      (offset (xyz -1.25 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_IDC:IDC-Header_2x03_P2.54mm_Vertical (layer F.Cu) (tedit 5FB2CD1A)
    (at 118.11 89.6112)
    (descr "Through hole IDC box header, 2x03, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0")
    (tags "Through hole vertical IDC box header THT 2x03 2.54mm double row")
    (zone_connect 1)
    (fp_text reference J3 (at 0 10.0838 180) (layer F.SilkS))
    (fp_text value AVR-ISP-6 (at 6.604 9.525 90) (layer F.Fab))
    (fp_text user %R (at -2.54 10.16 90) (layer F.Fab))
    (pad 6 thru_hole circle (at 2.54 3.175 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND) (zone_connect 1))
    (pad 4 thru_hole circle (at 0 3.175 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 7 /LV_PWR_LT) (zone_connect 1))
    (pad 2 thru_hole circle (at -2.54 3.175 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 2 +5V) (zone_connect 1))
    (pad 5 thru_hole circle (at 2.54 5.715 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 3 /LV_RST) (zone_connect 1))
    (pad 3 thru_hole circle (at 0 5.715 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 8 /LV_FLT_LT) (zone_connect 1))
    (pad 1 thru_hole roundrect (at -2.54 5.715 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask) (roundrect_rratio 0.147059)
      (net 9 /LV_STAT_LT) (zone_connect 1))
    (model ${KISYS3DMOD}/Connector_IDC.3dshapes/IDC-Header_2x03_P2.54mm_Vertical.wrl
      (offset (xyz -2.54 -5.715 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 -90))
    )
  )
  (module Crystal:Resonator_SMD_muRata_CSTxExxV-3Pin_3.0x1.1mm_HandSoldering (layer B.Cu) (tedit 5AD3593B)
    (at 95.885 100.33 180)
    (descr "SMD Resomator/Filter Murata CSTCE, https://www.murata.com/en-eu/products/productdata/8801162264606/SPEC-CSTNE16M0VH3C000R0.pdf")
    (tags "SMD SMT ceramic resonator filter")
    (zone_connect 1)
    (attr smd)
    (fp_text reference Y1 (at 0 2.54) (layer B.SilkS))
    (fp_text value 16MHz (at 0 -1.8) (layer B.Fab))
    (fp_text user %R (at 0.1 0.05) (layer B.Fab))
    (pad 3 smd rect (at 1.2 0 180) (size 0.4 3.2) (layers B.Cu B.Paste B.Mask)
      (net 67 "Net-(U1-Pad7)") (zone_connect 1))
    (pad 2 smd rect (at 0 0 180) (size 0.4 3.2) (layers B.Cu B.Paste B.Mask)
      (net 1 GND) (zone_connect 1))
    (pad 1 smd rect (at -1.2 0 180) (size 0.4 3.2) (layers B.Cu B.Paste B.Mask)
      (net 66 "Net-(U1-Pad8)") (zone_connect 1))
    (model ${KISYS3DMOD}/Crystal.3dshapes/Resonator_SMD_muRata_CSTxExxV-3Pin_3.0x1.1mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_SO:SSOP-16_3.9x4.9mm_P0.635mm (layer B.Cu) (tedit 5A02F25C)
    (at 78.74 99.06 180)
    (descr "SSOP16: plastic shrink small outline package; 16 leads; body width 3.9 mm; lead pitch 0.635; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot519-1_po.pdf)")
    (tags "SSOP 0.635")
    (attr smd)
    (fp_text reference U2 (at 0 3.81) (layer B.SilkS))
    (fp_text value FT230XS (at 0 -3.5) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 16 smd rect (at 2.6 2.2225 180) (size 1.2 0.4) (layers B.Cu B.Paste B.Mask))
    (pad 15 smd rect (at 2.6 1.5875 180) (size 1.2 0.4) (layers B.Cu B.Paste B.Mask))
    (pad 14 smd rect (at 2.6 0.9525 180) (size 1.2 0.4) (layers B.Cu B.Paste B.Mask))
    (pad 13 smd rect (at 2.6 0.3175 180) (size 1.2 0.4) (layers B.Cu B.Paste B.Mask)
      (net 27 GND1))
    (pad 12 smd rect (at 2.6 -0.3175 180) (size 1.2 0.4) (layers B.Cu B.Paste B.Mask)
      (net 36 VBUS))
    (pad 11 smd rect (at 2.6 -0.9525 180) (size 1.2 0.4) (layers B.Cu B.Paste B.Mask)
      (net 30 VCC))
    (pad 10 smd rect (at 2.6 -1.5875 180) (size 1.2 0.4) (layers B.Cu B.Paste B.Mask)
      (net 30 VCC))
    (pad 9 smd rect (at 2.6 -2.2225 180) (size 1.2 0.4) (layers B.Cu B.Paste B.Mask)
      (net 43 "Net-(R5-Pad1)"))
    (pad 8 smd rect (at -2.6 -2.2225 180) (size 1.2 0.4) (layers B.Cu B.Paste B.Mask)
      (net 44 "Net-(R6-Pad2)"))
    (pad 7 smd rect (at -2.6 -1.5875 180) (size 1.2 0.4) (layers B.Cu B.Paste B.Mask))
    (pad 6 smd rect (at -2.6 -0.9525 180) (size 1.2 0.4) (layers B.Cu B.Paste B.Mask))
    (pad 5 smd rect (at -2.6 -0.3175 180) (size 1.2 0.4) (layers B.Cu B.Paste B.Mask)
      (net 27 GND1))
    (pad 4 smd rect (at -2.6 0.3175 180) (size 1.2 0.4) (layers B.Cu B.Paste B.Mask)
      (net 31 "Net-(U2-Pad4)"))
    (pad 3 smd rect (at -2.6 0.9525 180) (size 1.2 0.4) (layers B.Cu B.Paste B.Mask)
      (net 30 VCC))
    (pad 2 smd rect (at -2.6 1.5875 180) (size 1.2 0.4) (layers B.Cu B.Paste B.Mask)
      (net 32 "Net-(U2-Pad2)"))
    (pad 1 smd rect (at -2.6 2.2225 180) (size 1.2 0.4) (layers B.Cu B.Paste B.Mask)
      (net 33 "Net-(U2-Pad1)"))
    (model ${KISYS3DMOD}/Package_SO.3dshapes/SSOP-16_3.9x4.9mm_P0.635mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_JST:JST_PHD_B20B-PHDSS_2x10_P2.00mm_Vertical (layer F.Cu) (tedit 5FAD9E4F)
    (at 118.11 107.95 180)
    (descr "JST PHD series connector, B20B-PHDSS (http://www.jst-mfg.com/product/pdf/eng/ePHD.pdf), generated with kicad-footprint-generator")
    (tags "connector JST PHD vertical")
    (fp_text reference J8 (at 0 -3.81) (layer F.SilkS))
    (fp_text value B20B-PHDSS (at 0 3.7) (layer F.Fab))
    (fp_text user %R (at 0 -1.8) (layer F.Fab))
    (pad 20 thru_hole circle (at 9 1 180) (size 1.2 1.2) (drill 0.75) (layers *.Cu *.Mask)
      (net 50 "Net-(J8-Pad20)"))
    (pad 18 thru_hole circle (at 7 1 180) (size 1.2 1.2) (drill 0.75) (layers *.Cu *.Mask)
      (net 51 "Net-(J8-Pad18)"))
    (pad 16 thru_hole circle (at 5 1 180) (size 1.2 1.2) (drill 0.75) (layers *.Cu *.Mask)
      (net 52 "Net-(J8-Pad16)"))
    (pad 14 thru_hole circle (at 3 1 180) (size 1.2 1.2) (drill 0.75) (layers *.Cu *.Mask)
      (net 53 "Net-(J8-Pad14)"))
    (pad 12 thru_hole circle (at 1 1 180) (size 1.2 1.2) (drill 0.75) (layers *.Cu *.Mask)
      (net 54 "Net-(J8-Pad12)"))
    (pad 10 thru_hole circle (at -1 1 180) (size 1.2 1.2) (drill 0.75) (layers *.Cu *.Mask)
      (net 55 "Net-(J8-Pad10)"))
    (pad 8 thru_hole circle (at -3 1 180) (size 1.2 1.2) (drill 0.75) (layers *.Cu *.Mask)
      (net 56 "Net-(J8-Pad8)"))
    (pad 6 thru_hole circle (at -5 1 180) (size 1.2 1.2) (drill 0.75) (layers *.Cu *.Mask)
      (net 6 +24V))
    (pad 4 thru_hole circle (at -7 1 180) (size 1.2 1.2) (drill 0.75) (layers *.Cu *.Mask)
      (net 68 "Net-(F1-Pad2)"))
    (pad 2 thru_hole circle (at -9 1 180) (size 1.2 1.2) (drill 0.75) (layers *.Cu *.Mask)
      (net 57 "Net-(J8-Pad2)"))
    (pad 19 thru_hole circle (at 9 -1 180) (size 1.2 1.2) (drill 0.75) (layers *.Cu *.Mask)
      (net 69 "Net-(J8-Pad19)"))
    (pad 17 thru_hole circle (at 7 -1 180) (size 1.2 1.2) (drill 0.75) (layers *.Cu *.Mask)
      (net 70 "Net-(J8-Pad17)"))
    (pad 15 thru_hole circle (at 5 -1 180) (size 1.2 1.2) (drill 0.75) (layers *.Cu *.Mask)
      (net 71 "Net-(J8-Pad15)"))
    (pad 13 thru_hole circle (at 3 -1 180) (size 1.2 1.2) (drill 0.75) (layers *.Cu *.Mask)
      (net 58 "Net-(J8-Pad13)"))
    (pad 11 thru_hole circle (at 1 -1 180) (size 1.2 1.2) (drill 0.75) (layers *.Cu *.Mask)
      (net 59 "Net-(J8-Pad11)"))
    (pad 9 thru_hole circle (at -1 -1 180) (size 1.2 1.2) (drill 0.75) (layers *.Cu *.Mask)
      (net 60 "Net-(J8-Pad9)"))
    (pad 7 thru_hole circle (at -3 -1 180) (size 1.2 1.2) (drill 0.75) (layers *.Cu *.Mask)
      (net 61 "Net-(J8-Pad7)"))
    (pad 5 thru_hole circle (at -5 -1 180) (size 1.2 1.2) (drill 0.75) (layers *.Cu *.Mask)
      (net 62 "Net-(J8-Pad5)"))
    (pad 3 thru_hole circle (at -7 -1 180) (size 1.2 1.2) (drill 0.75) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 1 thru_hole roundrect (at -9 -1 180) (size 1.2 1.2) (drill 0.75) (layers *.Cu *.Mask) (roundrect_rratio 0.208333)
      (net 63 "Net-(J8-Pad1)"))
    (model "3D Models/B20B-PHDSS.stp"
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz -90 0 180))
    )
  )
  (module Package_TO_SOT_SMD:TO-263-7_TabPin8 (layer B.Cu) (tedit 5A70FBD7)
    (at 199.39 114.3 90)
    (descr "TO-263 / D2PAK / DDPAK SMD package, http://www.infineon.com/cms/en/product/packages/PG-TO263/PG-TO263-7-1/")
    (tags "D2PAK DDPAK TO-263 D2PAK-7 TO-263-7 SOT-427")
    (zone_connect 2)
    (attr smd)
    (fp_text reference Q1 (at 8.89 0 180) (layer B.SilkS))
    (fp_text value BTN8982TA (at 0 -6.65 90) (layer B.Fab))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad "" smd rect (at 0.95 -2.775 90) (size 4.55 5.25) (layers B.Paste)
      (zone_connect 2))
    (pad "" smd rect (at 5.8 2.775 90) (size 4.55 5.25) (layers B.Paste)
      (zone_connect 2))
    (pad "" smd rect (at 0.95 2.775 90) (size 4.55 5.25) (layers B.Paste)
      (zone_connect 2))
    (pad "" smd rect (at 5.8 -2.775 90) (size 4.55 5.25) (layers B.Paste)
      (zone_connect 2))
    (pad 8 smd rect (at 3.375 0 90) (size 9.4 10.8) (layers B.Cu B.Mask)
      (net 46 /+MTR) (zone_connect 2))
    (pad 7 smd rect (at -5.775 -3.81 90) (size 4.6 0.8) (layers B.Cu B.Paste B.Mask)
      (net 39 +VDC) (zone_connect 2))
    (pad 6 smd rect (at -5.775 -2.54 90) (size 4.6 0.8) (layers B.Cu B.Paste B.Mask)
      (net 37 "Net-(C5-Pad1)") (zone_connect 2))
    (pad 5 smd rect (at -5.775 -1.27 90) (size 4.6 0.8) (layers B.Cu B.Paste B.Mask)
      (net 1 GND) (zone_connect 2))
    (pad 4 smd rect (at -5.775 0 90) (size 4.6 0.8) (layers B.Cu B.Paste B.Mask)
      (net 46 /+MTR) (zone_connect 2))
    (pad 3 smd rect (at -5.775 1.27 90) (size 4.6 0.8) (layers B.Cu B.Paste B.Mask)
      (net 28 "Net-(Q1-Pad3)") (zone_connect 2))
    (pad 2 smd rect (at -5.775 2.54 90) (size 4.6 0.8) (layers B.Cu B.Paste B.Mask)
      (net 29 "Net-(Q1-Pad2)") (zone_connect 2))
    (pad 1 smd rect (at -5.775 3.81 90) (size 4.6 0.8) (layers B.Cu B.Paste B.Mask)
      (net 1 GND) (zone_connect 2))
    (model ${KISYS3DMOD}/Package_TO_SOT_SMD.3dshapes/TO-263-7_TabPin8.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder (layer B.Cu) (tedit 5F68FEEE)
    (at 184.15 105.41 180)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R8 (at 0 1.27) (layer B.SilkS))
    (fp_text value 10K (at 0 -1.43) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 2 smd roundrect (at 0.9125 0 180) (size 0.975 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 47 "Net-(Q2-Pad1)"))
    (pad 1 smd roundrect (at -0.9125 0 180) (size 0.975 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 39 +VDC))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder (layer B.Cu) (tedit 5F68FEEE)
    (at 121.92 114.3 90)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (zone_connect 1)
    (attr smd)
    (fp_text reference R11 (at -2.54 0) (layer B.SilkS))
    (fp_text value 6.49K (at 0 -1.43 270) (layer B.Fab))
    (fp_text user %R (at 0 0 270) (layer B.Fab))
    (pad 2 smd roundrect (at 0.9125 0 90) (size 0.975 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 1 GND) (zone_connect 1))
    (pad 1 smd roundrect (at -0.9125 0 90) (size 0.975 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 13 /V_SENS) (zone_connect 1))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder (layer B.Cu) (tedit 5F68FEEE)
    (at 124.46 114.3 90)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (zone_connect 1)
    (attr smd)
    (fp_text reference R13 (at -2.54 0) (layer B.SilkS))
    (fp_text value 6.49K (at 0 -1.43 270) (layer B.Fab))
    (fp_text user %R (at 0 0 270) (layer B.Fab))
    (pad 2 smd roundrect (at 0.9125 0 90) (size 0.975 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 1 GND) (zone_connect 1))
    (pad 1 smd roundrect (at -0.9125 0 90) (size 0.975 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 10 /LV_STRT) (zone_connect 1))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder (layer B.Cu) (tedit 5F68FEEE)
    (at 127 114.3 90)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R10 (at -2.54 0 180) (layer B.SilkS))
    (fp_text value 34.0K (at 0 -1.43 90) (layer B.Fab))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 2 smd roundrect (at 0.9125 0 90) (size 0.975 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 63 "Net-(J8-Pad1)"))
    (pad 1 smd roundrect (at -0.9125 0 90) (size 0.975 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 13 /V_SENS))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder (layer B.Cu) (tedit 5F68FEEE)
    (at 129.54 114.3 90)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R12 (at -2.54 0 180) (layer B.SilkS))
    (fp_text value 34.0K (at 0 -1.43 90) (layer B.Fab))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 2 smd roundrect (at 0.9125 0 90) (size 0.975 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 57 "Net-(J8-Pad2)"))
    (pad 1 smd roundrect (at -0.9125 0 90) (size 0.975 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 10 /LV_STRT))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_SO:SSOP-18_4.4x6.5mm_P0.65mm (layer B.Cu) (tedit 5B1FF5C1)
    (at 116.84 114.3 270)
    (descr "SSOP18: plastic shrink small outline package; 18 leads; body width 4.4 mm (http://toshiba.semicon-storage.com/info/docget.jsp?did=30523&prodName=TBD62783APG)")
    (tags "SSOP 0.65")
    (zone_connect 1)
    (attr smd)
    (fp_text reference U5 (at 0 4.445 180) (layer B.SilkS))
    (fp_text value TBD62084A (at 0 -4.2 90) (layer B.Fab))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 1 smd rect (at -2.7 2.6 270) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 69 "Net-(J8-Pad19)") (zone_connect 1))
    (pad 2 smd rect (at -2.7 1.95 270) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 70 "Net-(J8-Pad17)") (zone_connect 1))
    (pad 3 smd rect (at -2.7 1.3 270) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 71 "Net-(J8-Pad15)") (zone_connect 1))
    (pad 4 smd rect (at -2.7 0.65 270) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 58 "Net-(J8-Pad13)") (zone_connect 1))
    (pad 5 smd rect (at -2.7 0 270) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 59 "Net-(J8-Pad11)") (zone_connect 1))
    (pad 6 smd rect (at -2.7 -0.65 270) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 60 "Net-(J8-Pad9)") (zone_connect 1))
    (pad 7 smd rect (at -2.7 -1.3 270) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 61 "Net-(J8-Pad7)") (zone_connect 1))
    (pad 8 smd rect (at -2.7 -1.95 270) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 62 "Net-(J8-Pad5)") (zone_connect 1))
    (pad 9 smd rect (at -2.7 -2.6 270) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 1 GND) (zone_connect 1))
    (pad 18 smd rect (at 2.7 2.6 270) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 17 /LV_IR_RX) (zone_connect 1))
    (pad 17 smd rect (at 2.7 1.95 270) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 18 /LV_SWP) (zone_connect 1))
    (pad 16 smd rect (at 2.7 1.3 270) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 20 /LV_R_SIG) (zone_connect 1))
    (pad 15 smd rect (at 2.7 0.65 270) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 19 /LV_L_SIG) (zone_connect 1))
    (pad 14 smd rect (at 2.7 0 270) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 14 /LV_AC_SLW) (zone_connect 1))
    (pad 13 smd rect (at 2.7 -0.65 270) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 15 /LV_AC_STP) (zone_connect 1))
    (pad 12 smd rect (at 2.7 -1.3 270) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 45 /LV_B_BMP) (zone_connect 1))
    (pad 11 smd rect (at 2.7 -1.95 270) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 16 /LV_F_BMP) (zone_connect 1))
    (pad 10 smd rect (at 2.7 -2.6 270) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (zone_connect 1))
    (model ${KISYS3DMOD}/Package_SO.3dshapes/SSOP-18_4.4x6.5mm_P0.65mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1210_3225Metric_Pad1.33x2.70mm_HandSolder (layer B.Cu) (tedit 5F68FEEF)
    (at 153.035 101.6 90)
    (descr "Capacitor SMD 1210 (3225 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C26 (at 3.175 0 180) (layer B.SilkS))
    (fp_text value 100uF (at 0 -2.3 90) (layer B.Fab))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 2 smd roundrect (at 1.5625 0 90) (size 1.325 2.7) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.188679)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.5625 0 90) (size 1.325 2.7) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.188679)
      (net 2 +5V))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1210_3225Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_SO:SSOP-18_4.4x6.5mm_P0.65mm (layer B.Cu) (tedit 5B1FF5C1)
    (at 115.57 101.6 270)
    (descr "SSOP18: plastic shrink small outline package; 18 leads; body width 4.4 mm (http://toshiba.semicon-storage.com/info/docget.jsp?did=30523&prodName=TBD62783APG)")
    (tags "SSOP 0.65")
    (attr smd)
    (fp_text reference U4 (at 0 4.445 180) (layer B.SilkS))
    (fp_text value TBD62783A (at 0 -4.2 90) (layer B.Fab))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 1 smd rect (at -2.7 2.6 270) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 25 /LV_SWP_GRN_LT))
    (pad 2 smd rect (at -2.7 1.95 270) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 24 /LV_SWP_RED_LT))
    (pad 3 smd rect (at -2.7 1.3 270) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 26 /LV_BRK))
    (pad 4 smd rect (at -2.7 0.65 270) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 26 /LV_BRK))
    (pad 5 smd rect (at -2.7 0 270) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 23 /LV_IR_TX))
    (pad 6 smd rect (at -2.7 -0.65 270) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 7 /LV_PWR_LT))
    (pad 7 smd rect (at -2.7 -1.3 270) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 9 /LV_STAT_LT))
    (pad 8 smd rect (at -2.7 -1.95 270) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 8 /LV_FLT_LT))
    (pad 9 smd rect (at -2.7 -2.6 270) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 6 +24V))
    (pad 18 smd rect (at 2.7 2.6 270) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 50 "Net-(J8-Pad20)"))
    (pad 17 smd rect (at 2.7 1.95 270) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 51 "Net-(J8-Pad18)"))
    (pad 16 smd rect (at 2.7 1.3 270) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 52 "Net-(J8-Pad16)"))
    (pad 15 smd rect (at 2.7 0.65 270) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 52 "Net-(J8-Pad16)"))
    (pad 14 smd rect (at 2.7 0 270) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 53 "Net-(J8-Pad14)"))
    (pad 13 smd rect (at 2.7 -0.65 270) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 54 "Net-(J8-Pad12)"))
    (pad 12 smd rect (at 2.7 -1.3 270) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 55 "Net-(J8-Pad10)"))
    (pad 11 smd rect (at 2.7 -1.95 270) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 56 "Net-(J8-Pad8)"))
    (pad 10 smd rect (at 2.7 -2.6 270) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (model ${KISYS3DMOD}/Package_SO.3dshapes/SSOP-18_4.4x6.5mm_P0.65mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder (layer B.Cu) (tedit 5F68FEEE)
    (at 135.89 109.22 270)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (zone_connect 1)
    (attr smd)
    (fp_text reference R19 (at 2.54 0 180) (layer B.SilkS))
    (fp_text value 1.18K (at 0 -1.43 90) (layer B.Fab))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 2 smd roundrect (at 0.9125 0 270) (size 0.975 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 1 GND) (zone_connect 1))
    (pad 1 smd roundrect (at -0.9125 0 270) (size 0.975 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 49 "Net-(C25-Pad2)") (zone_connect 1))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder (layer B.Cu) (tedit 5F68FEEE)
    (at 132.715 110.49)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (zone_connect 1)
    (attr smd)
    (fp_text reference R18 (at -2.54 0) (layer B.SilkS))
    (fp_text value 34.0K (at 0 -1.43) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 2 smd roundrect (at 0.9125 0) (size 0.975 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 49 "Net-(C25-Pad2)") (zone_connect 1))
    (pad 1 smd roundrect (at -0.9125 0) (size 0.975 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 6 +24V) (zone_connect 1))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder (layer B.Cu) (tedit 5F68FEEE)
    (at 159.385 109.22 270)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (zone_connect 1)
    (attr smd)
    (fp_text reference R17 (at 2.54 0 180) (layer B.SilkS))
    (fp_text value 6.49K (at 0 -1.43 90) (layer B.Fab))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 2 smd roundrect (at 0.9125 0 270) (size 0.975 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 1 GND) (zone_connect 1))
    (pad 1 smd roundrect (at -0.9125 0 270) (size 0.975 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 42 "Net-(C24-Pad2)") (zone_connect 1))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder (layer B.Cu) (tedit 5F68FEEE)
    (at 156.21 110.49)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (zone_connect 1)
    (attr smd)
    (fp_text reference R16 (at -2.54 0) (layer B.SilkS))
    (fp_text value 34.0K (at 0 -1.43) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 2 smd roundrect (at 0.9125 0) (size 0.975 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 42 "Net-(C24-Pad2)") (zone_connect 1))
    (pad 1 smd roundrect (at -0.9125 0) (size 0.975 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 2 +5V) (zone_connect 1))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder (layer B.Cu) (tedit 5F68FEEE)
    (at 141.605 107.95)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (zone_connect 1)
    (attr smd)
    (fp_text reference R15 (at 0 1.27) (layer B.SilkS))
    (fp_text value 549K (at 0 -1.43) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 2 smd roundrect (at 0.9125 0) (size 0.975 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 39 +VDC) (zone_connect 1))
    (pad 1 smd roundrect (at -0.9125 0) (size 0.975 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 65 "Net-(R15-Pad1)") (zone_connect 1))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder (layer B.Cu) (tedit 5F68FEEE)
    (at 165.1 107.95)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (zone_connect 1)
    (attr smd)
    (fp_text reference R14 (at 0 1.27) (layer B.SilkS))
    (fp_text value 86.6K (at 0 -1.43) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 2 smd roundrect (at 0.9125 0) (size 0.975 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 39 +VDC) (zone_connect 1))
    (pad 1 smd roundrect (at -0.9125 0) (size 0.975 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 64 "Net-(R14-Pad1)") (zone_connect 1))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder (layer B.Cu) (tedit 5F68FEEF)
    (at 132.715 107.95)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (zone_connect 1)
    (attr smd)
    (fp_text reference C25 (at -2.54 0) (layer B.SilkS))
    (fp_text value 1nF (at 0 -1.43) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 2 smd roundrect (at 0.8625 0) (size 1.075 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 49 "Net-(C25-Pad2)") (zone_connect 1))
    (pad 1 smd roundrect (at -0.8625 0) (size 1.075 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 6 +24V) (zone_connect 1))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder (layer B.Cu) (tedit 5F68FEEF)
    (at 156.21 107.95)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (zone_connect 1)
    (attr smd)
    (fp_text reference C24 (at -2.54 0) (layer B.SilkS))
    (fp_text value 1nF (at 0 -1.43) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 2 smd roundrect (at 0.8625 0) (size 1.075 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 42 "Net-(C24-Pad2)") (zone_connect 1))
    (pad 1 smd roundrect (at -0.8625 0) (size 1.075 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 2 +5V) (zone_connect 1))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1206_3216Metric_Pad1.33x1.80mm_HandSolder (layer B.Cu) (tedit 5F68FEEF)
    (at 144.145 101.6 90)
    (descr "Capacitor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C21 (at 3.175 0 180) (layer B.SilkS))
    (fp_text value 10uF (at 0 -1.85 90) (layer B.Fab))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 2 smd roundrect (at 1.5625 0 90) (size 1.325 1.8) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.188679)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.5625 0 90) (size 1.325 1.8) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.188679)
      (net 39 +VDC))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1206_3216Metric_Pad1.33x1.80mm_HandSolder (layer B.Cu) (tedit 5F68FEEF)
    (at 167.64 101.6 90)
    (descr "Capacitor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C20 (at 3.175 0 180) (layer B.SilkS))
    (fp_text value 10uF (at 0 -1.85 90) (layer B.Fab))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 2 smd roundrect (at 1.5625 0 90) (size 1.325 1.8) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.188679)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.5625 0 90) (size 1.325 1.8) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.188679)
      (net 39 +VDC))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_USB:USB_B_OST_USB-B1HSxx_Horizontal locked (layer F.Cu) (tedit 5FA41CFF)
    (at 80.01 126.2888 270)
    (descr "USB B receptacle, Horizontal, through-hole, http://www.on-shore.com/wp-content/uploads/2015/09/usb-b1hsxx.pdf")
    (tags "USB-B receptacle horizontal through-hole")
    (fp_text reference J1 (at -17.7038 0.635) (layer F.SilkS))
    (fp_text value USB_B (at -8.24 9.02 270) (layer F.Fab))
    (fp_text user %R (at -8.24 0 270) (layer F.Fab))
    (pad 5 thru_hole circle (at -10.29 6.02 270) (size 3.5 3.5) (drill 2.33) (layers *.Cu *.Mask)
      (net 27 GND1))
    (pad 5 thru_hole circle (at -10.29 -6.02 270) (size 3.5 3.5) (drill 2.33) (layers *.Cu *.Mask)
      (net 27 GND1))
    (pad 4 thru_hole circle (at -13 -1.25 270) (size 1.7 1.7) (drill 0.92) (layers *.Cu *.Mask)
      (net 27 GND1))
    (pad 3 thru_hole circle (at -13 1.25 270) (size 1.7 1.7) (drill 0.92) (layers *.Cu *.Mask)
      (net 38 "Net-(C6-Pad1)"))
    (pad 2 thru_hole circle (at -15 1.25 270) (size 1.7 1.7) (drill 0.92) (layers *.Cu *.Mask)
      (net 35 "Net-(C4-Pad1)"))
    (pad 1 thru_hole rect (at -15 -1.25 270) (size 1.7 1.7) (drill 0.92) (layers *.Cu *.Mask)
      (net 34 "Net-(C2-Pad1)"))
    (model "3D Models/USB-B1HS.stp"
      (offset (xyz -16.15 0 5.75))
      (scale (xyz 1 1 1))
      (rotate (xyz -90 0 -90))
    )
  )
  (module Connector_USB:USB_A_Molex_67643_Horizontal (layer F.Cu) (tedit 5FA41C58)
    (at 160.655 126.2888)
    (descr "USB type A, Horizontal, https://www.molex.com/pdm_docs/sd/676433910_sd.pdf")
    (tags "USB_A Female Connector receptacle")
    (fp_text reference J7 (at 0 -16.4338) (layer F.SilkS))
    (fp_text value USB_A (at 0 1.5) (layer F.Fab))
    (fp_text user %R (at 0 -9.3) (layer F.Fab))
    (pad 4 thru_hole circle (at 3.5 -13) (size 1.6 1.6) (drill 0.95) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 3 thru_hole circle (at 1 -13) (size 1.6 1.6) (drill 0.95) (layers *.Cu *.Mask))
    (pad 2 thru_hole circle (at -1 -13) (size 1.6 1.6) (drill 0.95) (layers *.Cu *.Mask))
    (pad 1 thru_hole rect (at -3.5 -13) (size 1.6 1.5) (drill 0.95) (layers *.Cu *.Mask)
      (net 2 +5V))
    (pad 5 thru_hole circle (at 6.57 -10.29) (size 3 3) (drill 2.3) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 5 thru_hole circle (at -6.57 -10.29) (size 3 3) (drill 2.3) (layers *.Cu *.Mask)
      (net 1 GND))
    (model "3D Models/87520-1010BLFc.stp"
      (offset (xyz 0 14 3.6))
      (scale (xyz 1 1 1))
      (rotate (xyz -90 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder (layer B.Cu) (tedit 5F68FEEE)
    (at 184.15 101.6)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (zone_connect 1)
    (attr smd)
    (fp_text reference R9 (at 0 -1.27) (layer B.SilkS))
    (fp_text value 34.0K (at 0 -1.43) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 2 smd roundrect (at 0.9125 0) (size 0.975 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 1 GND) (zone_connect 1))
    (pad 1 smd roundrect (at -0.9125 0) (size 0.975 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 47 "Net-(Q2-Pad1)") (zone_connect 1))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder (layer B.Cu) (tedit 5F68FEEE)
    (at 133.35 124.46 180)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R4 (at -2.54 0) (layer B.SilkS))
    (fp_text value 10K (at 0 -1.43) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 2 smd roundrect (at 0.9125 0 180) (size 0.975 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 12 /LV_PWM))
    (pad 1 smd roundrect (at -0.9125 0 180) (size 0.975 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 29 "Net-(Q1-Pad2)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder (layer B.Cu) (tedit 5F68FEEE)
    (at 133.35 121.92 180)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R3 (at -2.54 0) (layer B.SilkS))
    (fp_text value 10K (at 0 -1.43) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 2 smd roundrect (at 0.9125 0 180) (size 0.975 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 11 /LV_EN))
    (pad 1 smd roundrect (at -0.9125 0 180) (size 0.975 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 28 "Net-(Q1-Pad3)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder (layer B.Cu) (tedit 5F68FEEE)
    (at 127 120.015 90)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (zone_connect 1)
    (attr smd)
    (fp_text reference R2 (at -2.54 0 180) (layer B.SilkS))
    (fp_text value 1K (at 0 -1.43 90) (layer B.Fab))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 2 smd roundrect (at 0.9125 0 90) (size 0.975 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 1 GND) (zone_connect 1))
    (pad 1 smd roundrect (at -0.9125 0 90) (size 0.975 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 37 "Net-(C5-Pad1)") (zone_connect 1))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder (layer B.Cu) (tedit 5F68FEEE)
    (at 99.06 95.25 270)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R7 (at -2.54 0 180) (layer B.SilkS))
    (fp_text value 10K (at 0 -1.43 90) (layer B.Fab))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 2 smd roundrect (at 0.9125 0 270) (size 0.975 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 3 /LV_RST))
    (pad 1 smd roundrect (at -0.9125 0 270) (size 0.975 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 2 +5V))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder (layer B.Cu) (tedit 5F68FEEE)
    (at 124.46 120.015 90)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R1 (at -2.54 0 180) (layer B.SilkS))
    (fp_text value 86.6K (at 0 -1.43 90) (layer B.Fab))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 2 smd roundrect (at 0.9125 0 90) (size 0.975 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 5 /I_SENS))
    (pad 1 smd roundrect (at -0.9125 0 90) (size 0.975 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 37 "Net-(C5-Pad1)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder (layer B.Cu) (tedit 5F68FEEE)
    (at 83.82 106.045 90)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R6 (at -2.54 0 180) (layer B.SilkS))
    (fp_text value 27 (at 0 -1.43 90) (layer B.Fab))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 2 smd roundrect (at 0.9125 0 90) (size 0.975 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 44 "Net-(R6-Pad2)"))
    (pad 1 smd roundrect (at -0.9125 0 90) (size 0.975 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 38 "Net-(C6-Pad1)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder (layer B.Cu) (tedit 5F68FEEE)
    (at 78.74 106.045 270)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R5 (at 2.54 0 180) (layer B.SilkS))
    (fp_text value 27 (at 0 -1.43 90) (layer B.Fab))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 2 smd roundrect (at 0.9125 0 270) (size 0.975 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 35 "Net-(C4-Pad1)"))
    (pad 1 smd roundrect (at -0.9125 0 270) (size 0.975 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 43 "Net-(R5-Pad1)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Inductor_SMD:L_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer B.Cu) (tedit 5F68FEF0)
    (at 73.66 106.045 270)
    (descr "Inductor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "inductor handsolder")
    (attr smd)
    (fp_text reference FB1 (at 2.54 0 180) (layer B.SilkS))
    (fp_text value Ferrite_Bead (at 0 -1.43 90) (layer B.Fab))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 2 smd roundrect (at 0.875 0 270) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 34 "Net-(C2-Pad1)"))
    (pad 1 smd roundrect (at -0.875 0 270) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 36 VBUS))
    (model ${KISYS3DMOD}/Inductor_SMD.3dshapes/L_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder (layer B.Cu) (tedit 5F68FEEF)
    (at 83.82 100.33 270)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C9 (at 2.54 0 180) (layer B.SilkS))
    (fp_text value 100nF (at 0 -1.43 90) (layer B.Fab))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 2 smd roundrect (at 0.8625 0 270) (size 1.075 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 27 GND1))
    (pad 1 smd roundrect (at -0.8625 0 270) (size 1.075 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 30 VCC))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder (layer B.Cu) (tedit 5F68FEEF)
    (at 73.66 99.06 90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C8 (at 2.54 0 180) (layer B.SilkS))
    (fp_text value 100nF (at 0 -1.43 90) (layer B.Fab))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 2 smd roundrect (at 0.8625 0 90) (size 1.075 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 27 GND1))
    (pad 1 smd roundrect (at -0.8625 0 90) (size 1.075 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 36 VBUS))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1206_3216Metric_Pad1.33x1.80mm_HandSolder (layer B.Cu) (tedit 5F68FEEF)
    (at 78.74 92.71)
    (descr "Capacitor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C7 (at 0 -1.905 180) (layer B.SilkS))
    (fp_text value 4.7uF (at 0 -1.85) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 2 smd roundrect (at 1.5625 0) (size 1.325 1.8) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.188679)
      (net 27 GND1))
    (pad 1 smd roundrect (at -1.5625 0) (size 1.325 1.8) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.188679)
      (net 36 VBUS))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder (layer B.Cu) (tedit 5F68FEEF)
    (at 86.36 106.045 90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C6 (at -2.54 0 180) (layer B.SilkS))
    (fp_text value 47pF (at 0 -1.43 90) (layer B.Fab))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 2 smd roundrect (at 0.8625 0 90) (size 1.075 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 27 GND1))
    (pad 1 smd roundrect (at -0.8625 0 90) (size 1.075 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 38 "Net-(C6-Pad1)"))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder (layer B.Cu) (tedit 5F68FEEF)
    (at 81.28 106.045 90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C4 (at -2.54 0 180) (layer B.SilkS))
    (fp_text value 47pF (at 0 -1.43 90) (layer B.Fab))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 2 smd roundrect (at 0.8625 0 90) (size 1.075 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 27 GND1))
    (pad 1 smd roundrect (at -0.8625 0 90) (size 1.075 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 35 "Net-(C4-Pad1)"))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder (layer B.Cu) (tedit 5F68FEEF)
    (at 76.2 106.045 90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C2 (at -2.54 0 180) (layer B.SilkS))
    (fp_text value 10nF (at 0 -1.43 90) (layer B.Fab))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 2 smd roundrect (at 0.8625 0 90) (size 1.075 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 27 GND1))
    (pad 1 smd roundrect (at -0.8625 0 90) (size 1.075 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 34 "Net-(C2-Pad1)"))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_QFP:TQFP-32_7x7mm_P0.8mm (layer B.Cu) (tedit 5A02F146)
    (at 100.33 107.95)
    (descr "32-Lead Plastic Thin Quad Flatpack (PT) - 7x7x1.0 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf)")
    (tags "QFP 0.8")
    (attr smd)
    (fp_text reference U1 (at 0 -6.35) (layer B.SilkS))
    (fp_text value ATmega328P-AU (at 0 -6.05) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 32 smd rect (at -2.8 4.25 270) (size 1.6 0.55) (layers B.Cu B.Paste B.Mask)
      (net 45 /LV_B_BMP))
    (pad 31 smd rect (at -2 4.25 270) (size 1.6 0.55) (layers B.Cu B.Paste B.Mask)
      (net 21 /LV_TX))
    (pad 30 smd rect (at -1.2 4.25 270) (size 1.6 0.55) (layers B.Cu B.Paste B.Mask)
      (net 22 /LV_RX))
    (pad 29 smd rect (at -0.4 4.25 270) (size 1.6 0.55) (layers B.Cu B.Paste B.Mask)
      (net 3 /LV_RST))
    (pad 28 smd rect (at 0.4 4.25 270) (size 1.6 0.55) (layers B.Cu B.Paste B.Mask)
      (net 17 /LV_IR_RX))
    (pad 27 smd rect (at 1.2 4.25 270) (size 1.6 0.55) (layers B.Cu B.Paste B.Mask)
      (net 18 /LV_SWP))
    (pad 26 smd rect (at 2 4.25 270) (size 1.6 0.55) (layers B.Cu B.Paste B.Mask)
      (net 20 /LV_R_SIG))
    (pad 25 smd rect (at 2.8 4.25 270) (size 1.6 0.55) (layers B.Cu B.Paste B.Mask)
      (net 19 /LV_L_SIG))
    (pad 24 smd rect (at 4.25 2.8) (size 1.6 0.55) (layers B.Cu B.Paste B.Mask)
      (net 14 /LV_AC_SLW))
    (pad 23 smd rect (at 4.25 2) (size 1.6 0.55) (layers B.Cu B.Paste B.Mask)
      (net 15 /LV_AC_STP))
    (pad 22 smd rect (at 4.25 1.2) (size 1.6 0.55) (layers B.Cu B.Paste B.Mask)
      (net 13 /V_SENS))
    (pad 21 smd rect (at 4.25 0.4) (size 1.6 0.55) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (pad 20 smd rect (at 4.25 -0.4) (size 1.6 0.55) (layers B.Cu B.Paste B.Mask))
    (pad 19 smd rect (at 4.25 -1.2) (size 1.6 0.55) (layers B.Cu B.Paste B.Mask)
      (net 5 /I_SENS))
    (pad 18 smd rect (at 4.25 -2) (size 1.6 0.55) (layers B.Cu B.Paste B.Mask)
      (net 2 +5V))
    (pad 17 smd rect (at 4.25 -2.8) (size 1.6 0.55) (layers B.Cu B.Paste B.Mask)
      (net 8 /LV_FLT_LT))
    (pad 16 smd rect (at 2.8 -4.25 270) (size 1.6 0.55) (layers B.Cu B.Paste B.Mask)
      (net 9 /LV_STAT_LT))
    (pad 15 smd rect (at 2 -4.25 270) (size 1.6 0.55) (layers B.Cu B.Paste B.Mask)
      (net 7 /LV_PWR_LT))
    (pad 14 smd rect (at 1.2 -4.25 270) (size 1.6 0.55) (layers B.Cu B.Paste B.Mask)
      (net 23 /LV_IR_TX))
    (pad 13 smd rect (at 0.4 -4.25 270) (size 1.6 0.55) (layers B.Cu B.Paste B.Mask)
      (net 12 /LV_PWM))
    (pad 12 smd rect (at -0.4 -4.25 270) (size 1.6 0.55) (layers B.Cu B.Paste B.Mask)
      (net 11 /LV_EN))
    (pad 11 smd rect (at -1.2 -4.25 270) (size 1.6 0.55) (layers B.Cu B.Paste B.Mask)
      (net 26 /LV_BRK))
    (pad 10 smd rect (at -2 -4.25 270) (size 1.6 0.55) (layers B.Cu B.Paste B.Mask)
      (net 24 /LV_SWP_RED_LT))
    (pad 9 smd rect (at -2.8 -4.25 270) (size 1.6 0.55) (layers B.Cu B.Paste B.Mask)
      (net 25 /LV_SWP_GRN_LT))
    (pad 8 smd rect (at -4.25 -2.8) (size 1.6 0.55) (layers B.Cu B.Paste B.Mask)
      (net 66 "Net-(U1-Pad8)"))
    (pad 7 smd rect (at -4.25 -2) (size 1.6 0.55) (layers B.Cu B.Paste B.Mask)
      (net 67 "Net-(U1-Pad7)"))
    (pad 6 smd rect (at -4.25 -1.2) (size 1.6 0.55) (layers B.Cu B.Paste B.Mask)
      (net 2 +5V))
    (pad 5 smd rect (at -4.25 -0.4) (size 1.6 0.55) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (pad 4 smd rect (at -4.25 0.4) (size 1.6 0.55) (layers B.Cu B.Paste B.Mask)
      (net 2 +5V))
    (pad 3 smd rect (at -4.25 1.2) (size 1.6 0.55) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (pad 2 smd rect (at -4.25 2) (size 1.6 0.55) (layers B.Cu B.Paste B.Mask)
      (net 10 /LV_STRT))
    (pad 1 smd rect (at -4.25 2.8) (size 1.6 0.55) (layers B.Cu B.Paste B.Mask)
      (net 16 /LV_F_BMP))
    (model ${KISYS3DMOD}/Package_QFP.3dshapes/TQFP-32_7x7mm_P0.8mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_TO_SOT_SMD:TO-252-2 (layer B.Cu) (tedit 5A70A390)
    (at 174.625 101.6 90)
    (descr "TO-252 / DPAK SMD package, http://www.infineon.com/cms/en/product/packages/PG-TO252/PG-TO252-3-1/")
    (tags "DPAK TO-252 DPAK-3 TO-252-3 SOT-428")
    (attr smd)
    (fp_text reference Q2 (at 6.35 0) (layer B.SilkS))
    (fp_text value IPD90P04P4L-04 (at 0 -4.5 90) (layer B.Fab))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad "" smd rect (at 0.425 -1.525 90) (size 3.05 2.75) (layers B.Paste))
    (pad "" smd rect (at 3.775 1.525 90) (size 3.05 2.75) (layers B.Paste))
    (pad "" smd rect (at 0.425 1.525 90) (size 3.05 2.75) (layers B.Paste))
    (pad "" smd rect (at 3.775 -1.525 90) (size 3.05 2.75) (layers B.Paste))
    (pad 2 smd rect (at 2.1 0 90) (size 6.4 5.8) (layers B.Cu B.Mask)
      (net 4 +BATT))
    (pad 3 smd rect (at -4.2 -2.28 90) (size 2.2 1.2) (layers B.Cu B.Paste B.Mask)
      (net 39 +VDC))
    (pad 1 smd rect (at -4.2 2.28 90) (size 2.2 1.2) (layers B.Cu B.Paste B.Mask)
      (net 47 "Net-(Q2-Pad1)"))
    (model ${KISYS3DMOD}/Package_TO_SOT_SMD.3dshapes/TO-252-2.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_SO:SSOP-16_3.9x4.9mm_P0.635mm (layer B.Cu) (tedit 5A02F25C)
    (at 88.9 95.25)
    (descr "SSOP16: plastic shrink small outline package; 16 leads; body width 3.9 mm; lead pitch 0.635; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot519-1_po.pdf)")
    (tags "SSOP 0.635")
    (zone_connect 1)
    (attr smd)
    (fp_text reference U3 (at 0 -3.81) (layer B.SilkS))
    (fp_text value ISO7731 (at 0 -3.5) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 16 smd rect (at 2.6 2.2225) (size 1.2 0.4) (layers B.Cu B.Paste B.Mask)
      (net 2 +5V) (zone_connect 1))
    (pad 15 smd rect (at 2.6 1.5875) (size 1.2 0.4) (layers B.Cu B.Paste B.Mask)
      (net 1 GND) (zone_connect 1))
    (pad 14 smd rect (at 2.6 0.9525) (size 1.2 0.4) (layers B.Cu B.Paste B.Mask)
      (net 40 "Net-(C16-Pad2)") (zone_connect 1))
    (pad 13 smd rect (at 2.6 0.3175) (size 1.2 0.4) (layers B.Cu B.Paste B.Mask)
      (net 22 /LV_RX) (zone_connect 1))
    (pad 12 smd rect (at 2.6 -0.3175) (size 1.2 0.4) (layers B.Cu B.Paste B.Mask)
      (net 21 /LV_TX) (zone_connect 1))
    (pad 11 smd rect (at 2.6 -0.9525) (size 1.2 0.4) (layers B.Cu B.Paste B.Mask)
      (zone_connect 1))
    (pad 10 smd rect (at 2.6 -1.5875) (size 1.2 0.4) (layers B.Cu B.Paste B.Mask)
      (net 2 +5V) (zone_connect 1))
    (pad 9 smd rect (at 2.6 -2.2225) (size 1.2 0.4) (layers B.Cu B.Paste B.Mask)
      (net 1 GND) (zone_connect 1))
    (pad 8 smd rect (at -2.6 -2.2225) (size 1.2 0.4) (layers B.Cu B.Paste B.Mask)
      (net 27 GND1) (zone_connect 1))
    (pad 7 smd rect (at -2.6 -1.5875) (size 1.2 0.4) (layers B.Cu B.Paste B.Mask)
      (net 30 VCC) (zone_connect 1))
    (pad 6 smd rect (at -2.6 -0.9525) (size 1.2 0.4) (layers B.Cu B.Paste B.Mask)
      (zone_connect 1))
    (pad 5 smd rect (at -2.6 -0.3175) (size 1.2 0.4) (layers B.Cu B.Paste B.Mask)
      (net 31 "Net-(U2-Pad4)") (zone_connect 1))
    (pad 4 smd rect (at -2.6 0.3175) (size 1.2 0.4) (layers B.Cu B.Paste B.Mask)
      (net 33 "Net-(U2-Pad1)") (zone_connect 1))
    (pad 3 smd rect (at -2.6 0.9525) (size 1.2 0.4) (layers B.Cu B.Paste B.Mask)
      (net 32 "Net-(U2-Pad2)") (zone_connect 1))
    (pad 2 smd rect (at -2.6 1.5875) (size 1.2 0.4) (layers B.Cu B.Paste B.Mask)
      (net 27 GND1) (zone_connect 1))
    (pad 1 smd rect (at -2.6 2.2225) (size 1.2 0.4) (layers B.Cu B.Paste B.Mask)
      (net 30 VCC) (zone_connect 1))
    (model ${KISYS3DMOD}/Package_SO.3dshapes/SSOP-16_3.9x4.9mm_P0.635mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_JST:JST_PH_B3B-PH-K_1x03_P2.00mm_Vertical (layer F.Cu) (tedit 5FA03BCF)
    (at 147.955 101.6 90)
    (descr "JST PH series connector, B3B-PH-K (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator")
    (tags "connector JST PH side entry")
    (zone_connect 1)
    (fp_text reference J9 (at 5.08 0.635 180) (layer F.SilkS))
    (fp_text value B3B-PH-K-S (at 0 4 90) (layer F.Fab))
    (fp_text user %R (at 0 1.5 90) (layer F.Fab))
    (pad 3 thru_hole oval (at 2 0 90) (size 1.2 1.75) (drill 0.75) (layers *.Cu *.Mask)
      (net 1 GND) (zone_connect 1))
    (pad 2 thru_hole oval (at 0 0 90) (size 1.2 1.75) (drill 0.75) (layers *.Cu *.Mask)
      (net 2 +5V) (zone_connect 1))
    (pad 1 thru_hole roundrect (at -2 0 90) (size 1.2 1.75) (drill 0.75) (layers *.Cu *.Mask) (roundrect_rratio 0.208333)
      (net 39 +VDC) (zone_connect 1))
    (model ${KISYS3DMOD}/Connector_JST.3dshapes/JST_PH_B3B-PH-K_1x03_P2.00mm_Vertical.wrl
      (offset (xyz -2 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Diode_SMD:D_SMB_Handsoldering (layer B.Cu) (tedit 590B3D55)
    (at 199.39 93.98 180)
    (descr "Diode SMB (DO-214AA) Handsoldering")
    (tags "Diode SMB (DO-214AA) Handsoldering")
    (attr smd)
    (fp_text reference D1 (at 0 3.175 180) (layer B.SilkS))
    (fp_text value 30V (at 0 -3) (layer B.Fab))
    (fp_text user %R (at 0 3) (layer B.Fab))
    (pad 2 smd rect (at 2.7 0 180) (size 3.5 2.3) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (pad 1 smd rect (at -2.7 0 180) (size 3.5 2.3) (layers B.Cu B.Paste B.Mask)
      (net 46 /+MTR))
    (model ${KISYS3DMOD}/Diode_SMD.3dshapes/D_SMB.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (gr_text "Gen 4A Cart\nControl Box Circuit Board\nEX20139-002" (at 193.04 116.84) (layer F.SilkS))
  (gr_line (start 209.473799 126.288799) (end 209.473799 89.6112) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 69.9262 126.288799) (end 209.473799 126.288799) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 69.9262 89.6112) (end 69.9262 126.288799) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 209.473799 89.6112) (end 69.9262 89.6112) (layer Edge.Cuts) (width 0.05))
  (gr_text GND (at 187.96 95.885 90) (layer F.SilkS))
  (gr_text GND (at 195.58 95.885 90) (layer F.SilkS))
  (gr_text +MTR (at 203.2 95.885 90) (layer F.SilkS))
  (gr_text +BATT (at 180.34 95.885 90) (layer F.SilkS))
  (zone (net 0) (net_name "") (layers F&B.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.508))
    (min_thickness 0.254)
    (keepout (tracks not_allowed) (vias not_allowed) (copperpour not_allowed))
    (fill (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 89.535 126.365) (xy 88.265 126.365) (xy 88.265 89.535) (xy 89.535 89.535)
      )
    )
  )
  (zone (net 27) (net_name GND1) (layer B.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 88.265 126.365) (xy 69.85 126.365) (xy 69.85 89.535) (xy 88.265 89.535)
      )
    )
  )
  (zone (net 27) (net_name GND1) (layer F.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 88.265 126.365) (xy 69.85 126.365) (xy 69.85 89.535) (xy 88.265 89.535)
      )
    )
  )
  (zone (net 2) (net_name +5V) (layer B.Cu) (hatch edge 0.508)
    (priority 5)
    (connect_pads yes (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508) (smoothing fillet) (radius 0.635))
    (polygon
      (pts
        (xy 157.48 111.76) (xy 158.115 111.76) (xy 158.115 114.3) (xy 151.13 114.3) (xy 151.13 101.6)
        (xy 157.48 101.6)
      )
    )
  )
  (zone (net 6) (net_name +24V) (layer B.Cu) (hatch edge 0.508)
    (priority 7)
    (connect_pads yes (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508) (smoothing fillet) (radius 0.635))
    (polygon
      (pts
        (xy 133.985 111.125) (xy 130.175 111.125) (xy 130.175 107.95) (xy 117.475 107.95) (xy 117.475 98.425)
        (xy 121.285 98.425) (xy 121.285 101.6) (xy 133.985 101.6)
      )
    )
  )
  (zone (net 4) (net_name +BATT) (layer B.Cu) (hatch edge 0.508)
    (priority 2)
    (connect_pads yes (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508) (smoothing fillet) (radius 0.635))
    (polygon
      (pts
        (xy 182.245 104.775) (xy 176.53 104.775) (xy 176.53 102.87) (xy 171.45 102.87) (xy 171.45 95.885)
        (xy 182.245 95.885)
      )
    )
  )
  (zone (net 39) (net_name +VDC) (layer B.Cu) (hatch edge 0.508)
    (priority 1)
    (connect_pads yes (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508) (smoothing fillet) (radius 0.635))
    (polygon
      (pts
        (xy 176.53 102.87) (xy 176.53 107.315) (xy 178.435 107.315) (xy 178.435 116.205) (xy 180.975 116.205)
        (xy 180.975 114.935) (xy 196.215 114.935) (xy 196.215 126.365) (xy 133.985 126.365) (xy 133.985 111.125)
        (xy 140.335 111.125) (xy 140.335 101.6) (xy 151.13 101.6) (xy 151.13 114.3) (xy 165.1 114.3)
        (xy 165.1 106.68) (xy 163.83 106.68) (xy 163.83 101.6) (xy 171.45 101.6) (xy 171.45 102.87)
      )
    )
  )
  (zone (net 46) (net_name /+MTR) (layer B.Cu) (hatch edge 0.508)
    (priority 3)
    (connect_pads yes (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508) (smoothing fillet) (radius 0.635))
    (polygon
      (pts
        (xy 205.105 116.205) (xy 193.675 116.205) (xy 193.675 114.3) (xy 190.5 114.3) (xy 190.5 112.395)
        (xy 193.675 112.395) (xy 193.675 106.045) (xy 200.025 106.045) (xy 200.025 92.71) (xy 205.105 92.71)
      )
    )
  )
  (zone (net 1) (net_name GND) (layer F.Cu) (hatch edge 0.508)
    (connect_pads yes (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508) (smoothing fillet) (radius 0.635))
    (polygon
      (pts
        (xy 209.55 126.365) (xy 89.535 126.365) (xy 89.535 89.535) (xy 209.55 89.535)
      )
    )
  )
  (zone (net 4) (net_name +BATT) (layer F.Cu) (hatch edge 0.508)
    (priority 3)
    (connect_pads yes (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508) (smoothing fillet) (radius 0.635))
    (polygon
      (pts
        (xy 182.245 104.775) (xy 178.435 104.775) (xy 178.435 95.885) (xy 182.245 95.885)
      )
    )
  )
  (zone (net 46) (net_name /+MTR) (layer F.Cu) (hatch edge 0.508)
    (priority 4)
    (connect_pads yes (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508) (smoothing fillet) (radius 0.635))
    (polygon
      (pts
        (xy 205.105 104.775) (xy 201.295 104.775) (xy 201.295 95.885) (xy 205.105 95.885)
      )
    )
  )
  (zone (net 1) (net_name GND) (layer B.Cu) (hatch edge 0.508)
    (connect_pads yes (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508) (smoothing fillet) (radius 0.635))
    (polygon
      (pts
        (xy 209.55 126.365) (xy 89.535 126.365) (xy 89.535 89.535) (xy 209.55 89.535)
      )
    )
  )
  (zone (net 0) (net_name "") (layer F.Mask) (hatch edge 0.508)
    (connect_pads yes (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 165.735 100.965) (xy 155.575 100.965) (xy 155.575 92.075) (xy 165.735 92.075)
      )
    )
  )
  (zone (net 0) (net_name "") (layer B.Mask) (hatch edge 0.508)
    (connect_pads yes (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 142.24 100.965) (xy 132.08 100.965) (xy 132.08 92.075) (xy 142.24 92.075)
      )
    )
  )
  (zone (net 0) (net_name "") (layer B.Mask) (hatch edge 0.508)
    (connect_pads yes (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 165.735 100.965) (xy 155.575 100.965) (xy 155.575 92.075) (xy 165.735 92.075)
      )
    )
  )
  (zone (net 0) (net_name "") (layer F.Mask) (hatch edge 0.508)
    (connect_pads yes (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 142.24 100.965) (xy 132.08 100.965) (xy 132.08 92.075) (xy 142.24 92.075)
      )
    )
  )
)
