(kicad_pcb (version 20171130) (host pcbnew "(5.0.0-3-g5ebb6b6)")
  (general
    (thickness 1.6)
    (drawings 22)
    (tracks 502)
    (zones 0)
    (modules 66)
    (nets 58)
  )
  (page A4)
  (layers
    (0 F.Cu signal)
    (31 B.Cu signal)
    (32 B.Adhes user)
    (33 F.Adhes user)
    (34 B.Paste user)
    (35 F.Paste user)
    (36 B.SilkS user)
    (37 F.SilkS user)
    (38 B.Mask user)
    (39 F.Mask user)
    (40 Dwgs.User user)
    (41 Cmts.User user)
    (42 Eco1.User user)
    (43 Eco2.User user)
    (44 Edge.Cuts user)
    (45 Margin user)
    (46 B.CrtYd user)
    (47 F.CrtYd user)
    (48 B.Fab user)
    (49 F.Fab user hide)
  )
  (setup
    (last_trace_width 0.1524)
    (user_trace_width 0.254)
    (user_trace_width 0.381)
    (user_trace_width 0.508)
    (user_trace_width 0.762)
    (trace_clearance 0.1524)
    (zone_clearance 0.508)
    (zone_45_only no)
    (trace_min 0.1524)
    (segment_width 0.2)
    (edge_width 0.15)
    (via_size 0.6858)
    (via_drill 0.3302)
    (via_min_size 0.508)
    (via_min_drill 0.254)
    (uvia_size 0.6858)
    (uvia_drill 0.3302)
    (uvias_allowed no)
    (uvia_min_size 0.2)
    (uvia_min_drill 0.1)
    (pcb_text_width 0.3)
    (pcb_text_size 1.5 1.5)
    (mod_edge_width 0.15)
    (mod_text_size 1 1)
    (mod_text_width 0.15)
    (pad_size 12.2 9.75)
    (pad_drill 0)
    (pad_to_mask_clearance 0.0508)
    (aux_axis_origin 0 0)
    (visible_elements FFFFFF7F)
    (pcbplotparams
      (layerselection 0x010fc_ffffffff)
      (usegerberextensions false)
      (usegerberattributes false)
      (usegerberadvancedattributes false)
      (creategerberjobfile false)
      (excludeedgelayer true)
      (linewidth 0.100000)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (padsonsilk false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 0)
      (scaleselection 1)
      (outputdirectory "gerbers/"))
  )
  (net 0 "")
  (net 1 -Vs)
  (net 2 -Vs_Out)
  (net 3 SCK_Bus)
  (net 4 SCK)
  (net 5 MISO)
  (net 6 MISO_Bus)
  (net 7 MOSI_Bus)
  (net 8 MOSI)
  (net 9 -Vs_ADC)
  (net 10 "Net-(R19-Pad1)")
  (net 11 "Net-(C10-Pad1)")
  (net 12 VCC)
  (net 13 "Net-(R17-Pad2)")
  (net 14 GND)
  (net 15 -I_ADC)
  (net 16 5I_ADC)
  (net 17 +I_ADC)
  (net 18 +Vs_ADC)
  (net 19 +Vs_Out)
  (net 20 "Net-(R11-Pad2)")
  (net 21 "Net-(R10-Pad2)")
  (net 22 5Vs_Out)
  (net 23 "Net-(R9-Pad2)")
  (net 24 "Net-(R8-Pad2)")
  (net 25 5Vs)
  (net 26 "Net-(R7-Pad2)")
  (net 27 "Net-(R6-Pad2)")
  (net 28 +Vs)
  (net 29 5Vs_ADC)
  (net 30 "Net-(C14-Pad1)")
  (net 31 "Net-(U5-Pad7)")
  (net 32 "Net-(U5-Pad8)")
  (net 33 CS)
  (net 34 "Net-(U6-Pad1)")
  (net 35 RW)
  (net 36 D0)
  (net 37 E)
  (net 38 D1)
  (net 39 D2)
  (net 40 D3)
  (net 41 D4)
  (net 42 "Net-(U6-Pad21)")
  (net 43 "Net-(U6-Pad9)")
  (net 44 "Net-(U6-Pad10)")
  (net 45 D5)
  (net 46 D6)
  (net 47 "Net-(U6-Pad26)")
  (net 48 D7)
  (net 49 "Net-(U6-Pad27)")
  (net 50 RS)
  (net 51 "Net-(U6-Pad28)")
  (net 52 "Net-(J6-Pad5)")
  (net 53 "Net-(J1-Pad3)")
  (net 54 +6V)
  (net 55 BTN1)
  (net 56 BTN2)
  (net 57 "Net-(U6-Pad20)")
  (net_class Default "This is the default net class."
    (clearance 0.1524)
    (trace_width 0.1524)
    (via_dia 0.6858)
    (via_drill 0.3302)
    (uvia_dia 0.6858)
    (uvia_drill 0.3302)
    (diff_pair_gap 0.1524)
    (diff_pair_width 0.1524)
    (add_net +6V)
    (add_net +I_ADC)
    (add_net +Vs)
    (add_net +Vs_ADC)
    (add_net +Vs_Out)
    (add_net -I_ADC)
    (add_net -Vs)
    (add_net -Vs_ADC)
    (add_net -Vs_Out)
    (add_net 5I_ADC)
    (add_net 5Vs)
    (add_net 5Vs_ADC)
    (add_net 5Vs_Out)
    (add_net BTN1)
    (add_net BTN2)
    (add_net CS)
    (add_net D0)
    (add_net D1)
    (add_net D2)
    (add_net D3)
    (add_net D4)
    (add_net D5)
    (add_net D6)
    (add_net D7)
    (add_net E)
    (add_net GND)
    (add_net MISO)
    (add_net MISO_Bus)
    (add_net MOSI)
    (add_net MOSI_Bus)
    (add_net "Net-(C10-Pad1)")
    (add_net "Net-(C14-Pad1)")
    (add_net "Net-(J1-Pad3)")
    (add_net "Net-(J6-Pad5)")
    (add_net "Net-(R10-Pad2)")
    (add_net "Net-(R11-Pad2)")
    (add_net "Net-(R17-Pad2)")
    (add_net "Net-(R19-Pad1)")
    (add_net "Net-(R6-Pad2)")
    (add_net "Net-(R7-Pad2)")
    (add_net "Net-(R8-Pad2)")
    (add_net "Net-(R9-Pad2)")
    (add_net "Net-(U5-Pad7)")
    (add_net "Net-(U5-Pad8)")
    (add_net "Net-(U6-Pad1)")
    (add_net "Net-(U6-Pad10)")
    (add_net "Net-(U6-Pad20)")
    (add_net "Net-(U6-Pad21)")
    (add_net "Net-(U6-Pad26)")
    (add_net "Net-(U6-Pad27)")
    (add_net "Net-(U6-Pad28)")
    (add_net "Net-(U6-Pad9)")
    (add_net RS)
    (add_net RW)
    (add_net SCK)
    (add_net SCK_Bus)
    (add_net VCC)
  )
  (module AVMeter:L7805CDT-TR-DPAK (layer F.Cu) (tedit 5BD7AA2F)
    (at 186.75 93.5 90)
    (clearance 0.508)
    (fp_text reference U7 (at 4.5 -0.25 180) (layer F.SilkS))
    (fp_text value L7805 (at 0 7.2 90) (layer F.Fab))
    (pad 2 smd rect (at 0 -3.35 90) (size 6.7 6.7) (layers F.Cu F.Paste F.Mask)
      (net 14 GND))
    (pad 1 smd rect (at -2.3 3.3 90) (size 1.6 3) (layers F.Cu F.Paste F.Mask)
      (net 30 "Net-(C14-Pad1)"))
    (pad 3 smd rect (at 2.3 3.3 90) (size 1.6 3) (layers F.Cu F.Paste F.Mask)
      (net 12 VCC))
  )
  (module Diode_SMD:D_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B4B45C8)
    (at 190 76.5125 90)
    (descr "Diode SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "diode handsolder")
    (attr smd)
    (fp_text reference D2 (at 3.5125 0 180) (layer F.SilkS))
    (fp_text value DIODE (at 0 1.82 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.4875 0 90) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 30 "Net-(C14-Pad1)"))
    (pad 1 smd roundrect (at -1.4875 0 90) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 54 +6V))
    (model ${KISYS3DMOD}/Diode_SMD.3dshapes/D_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_TO_SOT_SMD:SOT-23 (layer F.Cu) (tedit 5A02FF57)
    (at 235.5 93)
    (descr "SOT-23, Standard")
    (tags SOT-23)
    (attr smd)
    (fp_text reference D1 (at 0 -3 180) (layer F.SilkS))
    (fp_text value LM4040DBZ-2.0 (at 0 2.5) (layer F.Fab))
    (fp_text user %R (at 0 0 -270) (layer F.Fab))
    (pad 3 smd rect (at 1 0) (size 0.9 0.8) (layers F.Cu F.Paste F.Mask))
    (pad 2 smd rect (at -1 0.95) (size 0.9 0.8) (layers F.Cu F.Paste F.Mask)
      (net 14 GND))
    (pad 1 smd rect (at -1 -0.95) (size 0.9 0.8) (layers F.Cu F.Paste F.Mask)
      (net 11 "Net-(C10-Pad1)"))
    (model ${KISYS3DMOD}/Package_TO_SOT_SMD.3dshapes/SOT-23.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_SO:MSOP-8_3x3mm_P0.65mm (layer F.Cu) (tedit 5A02F25C)
    (at 241 106 180)
    (descr "8-Lead Plastic Micro Small Outline Package (MS) [MSOP] (see Microchip Packaging Specification 00000049BS.pdf)")
    (tags "SSOP 0.65")
    (attr smd)
    (fp_text reference U3 (at 0 2.5) (layer F.SilkS))
    (fp_text value LT6105 (at 0 2.6 180) (layer F.Fab))
    (fp_text user %R (at 0 0 180) (layer F.Fab))
    (pad 1 smd rect (at -2.2 -0.975 180) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 20 "Net-(R11-Pad2)"))
    (pad 2 smd rect (at -2.2 -0.325 180) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 12 VCC))
    (pad 3 smd rect (at -2.2 0.325 180) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask))
    (pad 4 smd rect (at -2.2 0.975 180) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 1 -Vs))
    (pad 5 smd rect (at 2.2 0.975 180) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 15 -I_ADC))
    (pad 6 smd rect (at 2.2 0.325 180) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask))
    (pad 7 smd rect (at 2.2 -0.325 180) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask))
    (pad 8 smd rect (at 2.2 -0.975 180) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 21 "Net-(R10-Pad2)"))
    (model ${KISYS3DMOD}/Package_SO.3dshapes/MSOP-8_3x3mm_P0.65mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_THT:CP_Radial_D12.5mm_P7.50mm (layer F.Cu) (tedit 5AE50EF1)
    (at 200 75 270)
    (descr "CP, Radial series, Radial, pin pitch=7.50mm, , diameter=12.5mm, Electrolytic Capacitor")
    (tags "CP Radial series Radial pin pitch 7.50mm  diameter 12.5mm Electrolytic Capacitor")
    (fp_text reference C14 (at -4 0) (layer F.SilkS))
    (fp_text value 3500uf (at 3.75 7.5 270) (layer F.Fab))
    (fp_text user %R (at 3.75 0 270) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0 270) (size 2.4 2.4) (drill 1.2) (layers *.Cu *.Mask)
      (net 30 "Net-(C14-Pad1)"))
    (pad 2 thru_hole circle (at 7.5 0 270) (size 2.4 2.4) (drill 1.2) (layers *.Cu *.Mask)
      (net 14 GND))
    (model ${KISYS3DMOD}/Capacitor_THT.3dshapes/CP_Radial_D12.5mm_P7.50mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module AVMeter:KF301_2Pin_5Pitch (layer F.Cu) (tedit 5BC221DD)
    (at 183 81.5 270)
    (fp_text reference J5 (at -6.5 -3.5) (layer F.SilkS))
    (fp_text value Screw_Terminal_01x02 (at -0.1 4.9 270) (layer F.Fab))
    (pad 1 thru_hole rect (at -2.5 0 270) (size 2.6 2.6) (drill 1.3) (layers *.Cu *.Mask)
      (net 54 +6V))
    (pad 2 thru_hole circle (at 2.5 0 270) (size 2.6 2.6) (drill 1.3) (layers *.Cu *.Mask)
      (net 14 GND))
  )
  (module AVMeter:KF301_2Pin_5Pitch (layer F.Cu) (tedit 5BC221DD)
    (at 241 120)
    (fp_text reference J4 (at 0.1 -5.7) (layer F.SilkS))
    (fp_text value Screw_Terminal_01x02 (at -0.1 4.9) (layer F.Fab))
    (pad 1 thru_hole rect (at -2.5 0) (size 2.6 2.6) (drill 1.3) (layers *.Cu *.Mask)
      (net 1 -Vs))
    (pad 2 thru_hole circle (at 2.5 0) (size 2.6 2.6) (drill 1.3) (layers *.Cu *.Mask)
      (net 2 -Vs_Out))
  )
  (module AVMeter:KF301_2Pin_5Pitch (layer F.Cu) (tedit 5BC221DD)
    (at 219 120)
    (fp_text reference J3 (at 0.1 -5.7) (layer F.SilkS))
    (fp_text value Screw_Terminal_01x02 (at -0.1 4.9) (layer F.Fab))
    (pad 2 thru_hole circle (at 2.5 0) (size 2.6 2.6) (drill 1.3) (layers *.Cu *.Mask)
      (net 22 5Vs_Out))
    (pad 1 thru_hole rect (at -2.5 0) (size 2.6 2.6) (drill 1.3) (layers *.Cu *.Mask)
      (net 25 5Vs))
  )
  (module AVMeter:KF301_2Pin_5Pitch (layer F.Cu) (tedit 5BC221DD)
    (at 197 120)
    (fp_text reference J2 (at 0.1 -5.7) (layer F.SilkS))
    (fp_text value Screw_Terminal_01x02 (at -0.1 4.9) (layer F.Fab))
    (pad 2 thru_hole circle (at 2.5 0) (size 2.6 2.6) (drill 1.3) (layers *.Cu *.Mask)
      (net 19 +Vs_Out))
    (pad 1 thru_hole rect (at -2.5 0) (size 2.6 2.6) (drill 1.3) (layers *.Cu *.Mask)
      (net 28 +Vs))
  )
  (module Capacitor_SMD:C_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 207.5 93 90)
    (descr "Capacitor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C9 (at 3.5 -0.120336 -180) (layer F.SilkS))
    (fp_text value 10uf (at 0 1.82 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.4875 0 90) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 14 GND))
    (pad 1 smd roundrect (at -1.4875 0 90) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 12 VCC))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5BD90EB9)
    (at 226 76 180)
    (descr "Capacitor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C16 (at 0.0125 -1.5 180) (layer F.SilkS))
    (fp_text value 100nf (at 0 1.82 180) (layer F.Fab))
    (fp_text user %R (at 0 0 180) (layer F.Fab))
    (pad 2 smd roundrect (at 1.4875 0 180) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 14 GND))
    (pad 1 smd roundrect (at -1.4875 0 180) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 12 VCC))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5BD4FA1E)
    (at 200 96 270)
    (descr "Capacitor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C15 (at -3 0) (layer F.SilkS))
    (fp_text value 100nf (at 0 1.82 270) (layer F.Fab))
    (fp_text user %R (at 0 0 270) (layer F.Fab))
    (pad 2 smd roundrect (at 1.4875 0 270) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 14 GND))
    (pad 1 smd roundrect (at -1.4875 0 270) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175)
      (net 30 "Net-(C14-Pad1)"))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 197 101.5 180)
    (descr "Capacitor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C2 (at 0 2) (layer F.SilkS))
    (fp_text value 220nf (at 0 1.82 180) (layer F.Fab))
    (fp_text user %R (at 0 0 180) (layer F.Fab))
    (pad 2 smd roundrect (at 1.4875 0 180) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 14 GND))
    (pad 1 smd roundrect (at -1.4875 0 180) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 12 VCC))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 219.0125 101.75 180)
    (descr "Capacitor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C3 (at 0.0125 2) (layer F.SilkS))
    (fp_text value 220nf (at 0 1.82 180) (layer F.Fab))
    (fp_text user %R (at 0 0 180) (layer F.Fab))
    (pad 2 smd roundrect (at 1.4875 0 180) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 14 GND))
    (pad 1 smd roundrect (at -1.4875 0 180) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 12 VCC))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 241 101.5 180)
    (descr "Capacitor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C4 (at 0 2) (layer F.SilkS))
    (fp_text value 220nf (at 0 1.82 180) (layer F.Fab))
    (fp_text user %R (at 0 0 180) (layer F.Fab))
    (pad 1 smd roundrect (at -1.4875 0 180) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 12 VCC))
    (pad 2 smd roundrect (at 1.4875 0 180) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 14 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 208.5 113 90)
    (descr "Capacitor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C5 (at 3.5 0 180) (layer F.SilkS))
    (fp_text value 0.1uf (at 0 1.82 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.4875 0 90) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 14 GND))
    (pad 1 smd roundrect (at -1.4875 0 90) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 18 +Vs_ADC))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 205.5 105 270)
    (descr "Capacitor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C6 (at -3.5 0 180) (layer F.SilkS))
    (fp_text value 0.1uf (at 0 1.82 270) (layer F.Fab))
    (fp_text user %R (at 0 0 270) (layer F.Fab))
    (pad 2 smd roundrect (at 1.4875 0 270) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 14 GND))
    (pad 1 smd roundrect (at -1.4875 0 270) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 17 +I_ADC))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 227.5 105 270)
    (descr "Capacitor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C7 (at -3.5 0 180) (layer F.SilkS))
    (fp_text value 0.1uf (at 0 1.82 270) (layer F.Fab))
    (fp_text user %R (at 0 0 270) (layer F.Fab))
    (pad 2 smd roundrect (at 1.4875 0 270) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 14 GND))
    (pad 1 smd roundrect (at -1.4875 0 270) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 16 5I_ADC))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 249.5 105 270)
    (descr "Capacitor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C8 (at -3.5 0 180) (layer F.SilkS))
    (fp_text value 0.1uf (at 0 1.82 270) (layer F.Fab))
    (fp_text user %R (at 0 0 270) (layer F.Fab))
    (pad 2 smd roundrect (at 1.4875 0 270) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 14 GND))
    (pad 1 smd roundrect (at -1.4875 0 270) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 15 -I_ADC))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 230.5 113 90)
    (descr "Capacitor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C1 (at 3.5 0) (layer F.SilkS))
    (fp_text value 0.1uf (at 0 1.82 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd roundrect (at -1.4875 0 90) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 29 5Vs_ADC))
    (pad 2 smd roundrect (at 1.4875 0 90) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 14 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 230.5 92.9875 270)
    (descr "Capacitor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C10 (at -3.4875 0) (layer F.SilkS))
    (fp_text value 10uf (at 0 1.82 270) (layer F.Fab))
    (fp_text user %R (at 0 0 270) (layer F.Fab))
    (pad 1 smd roundrect (at -1.4875 0 270) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 11 "Net-(C10-Pad1)"))
    (pad 2 smd roundrect (at 1.4875 0 270) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 14 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 204.5 93 90)
    (descr "Capacitor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C11 (at 3.5 0.079664 -180) (layer F.SilkS))
    (fp_text value 100nf (at 0 1.82 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.4875 0 90) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 14 GND))
    (pad 1 smd roundrect (at -1.4875 0 90) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 12 VCC))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 227.5 92.9875 270)
    (descr "Capacitor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C12 (at -3.4875 0) (layer F.SilkS))
    (fp_text value 100nf (at 0 1.82 270) (layer F.Fab))
    (fp_text user %R (at 0 0 270) (layer F.Fab))
    (pad 1 smd roundrect (at -1.4875 0 270) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 11 "Net-(C10-Pad1)"))
    (pad 2 smd roundrect (at 1.4875 0 270) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 14 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 255 112 270)
    (descr "Capacitor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C13 (at -3.5 0) (layer F.SilkS))
    (fp_text value 0.1uf (at 0 1.82 270) (layer F.Fab))
    (fp_text user %R (at 0 0 270) (layer F.Fab))
    (pad 2 smd roundrect (at 1.4875 0 270) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 14 GND))
    (pad 1 smd roundrect (at -1.4875 0 270) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 9 -Vs_ADC))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_PinHeader_2.54mm:PinHeader_1x03_P2.54mm_Vertical (layer F.Cu) (tedit 59FED5CC)
    (at 248.5 80.46)
    (descr "Through hole straight pin header, 1x03, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x03 2.54mm single row")
    (fp_text reference RV1 (at 0 -2.21 180) (layer F.SilkS))
    (fp_text value R_POT_TRIM (at 0 7.41) (layer F.Fab))
    (fp_text user %R (at 1.374999 -0.415001 -270) (layer F.Fab))
    (pad 3 thru_hole oval (at 0 5.08) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 12 VCC))
    (pad 2 thru_hole oval (at 0 2.54) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 53 "Net-(J1-Pad3)"))
    (pad 1 thru_hole rect (at 0 0) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 14 GND))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x03_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_PinHeader_2.54mm:PinHeader_1x16_P2.54mm_Vertical (layer B.Cu) (tedit 5BD90EA0)
    (at 251 72.5 90)
    (descr "Through hole straight pin header, 1x16, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x16 2.54mm single row")
    (fp_text reference J1 (at -2.5 0 180) (layer B.SilkS) hide)
    (fp_text value Conn_01x16 (at 0.75 -44.75 180) (layer B.Fab) hide)
    (fp_text user %R (at 0 -19.05) (layer B.Fab))
    (pad 1 thru_hole rect (at 0 0 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 14 GND))
    (pad 2 thru_hole oval (at 0 -2.54 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 12 VCC))
    (pad 3 thru_hole oval (at 0 -5.08 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 53 "Net-(J1-Pad3)"))
    (pad 4 thru_hole oval (at 0 -7.62 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 50 RS))
    (pad 5 thru_hole oval (at 0 -10.16 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 35 RW))
    (pad 6 thru_hole oval (at 0 -12.7 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 37 E))
    (pad 7 thru_hole oval (at 0 -15.24 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 36 D0))
    (pad 8 thru_hole oval (at 0 -17.78 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 38 D1))
    (pad 9 thru_hole oval (at 0 -20.32 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 39 D2))
    (pad 10 thru_hole oval (at 0 -22.86 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 40 D3))
    (pad 11 thru_hole oval (at 0 -25.4 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 41 D4))
    (pad 12 thru_hole oval (at 0 -27.94 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 45 D5))
    (pad 13 thru_hole oval (at 0 -30.48 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 46 D6))
    (pad 14 thru_hole oval (at 0 -33.02 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 48 D7))
    (pad 15 thru_hole oval (at 0 -35.56 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 12 VCC))
    (pad 16 thru_hole oval (at 0 -38.1 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 14 GND))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x16_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_PinHeader_2.54mm:PinHeader_2x03_P2.54mm_Vertical (layer F.Cu) (tedit 59FED5CC)
    (at 254 90.5)
    (descr "Through hole straight pin header, 2x03, 2.54mm pitch, double rows")
    (tags "Through hole pin header THT 2x03 2.54mm double row")
    (fp_text reference J6 (at 1.27 -2.5) (layer F.SilkS))
    (fp_text value Conn_02x03_Odd_Even (at 1.27 7.41) (layer F.Fab))
    (fp_text user %R (at 1.27 2.54 -270) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 5 MISO))
    (pad 2 thru_hole oval (at 2.54 0) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 12 VCC))
    (pad 3 thru_hole oval (at 0 2.54) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 4 SCK))
    (pad 4 thru_hole oval (at 2.54 2.54) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 8 MOSI))
    (pad 5 thru_hole oval (at 0 5.08) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 52 "Net-(J6-Pad5)"))
    (pad 6 thru_hole oval (at 2.54 5.08) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 14 GND))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_2x03_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_DIP:DIP-28_W7.62mm (layer F.Cu) (tedit 5A02E8C5)
    (at 244.5 79 270)
    (descr "28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils)")
    (tags "THT DIP DIL PDIP 2.54mm 7.62mm 300mil")
    (fp_text reference U6 (at 3.75 36 270) (layer F.SilkS))
    (fp_text value ATmega328-PU (at 3.81 35.35 270) (layer F.Fab))
    (fp_text user %R (at 3.81 16.51 270) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0 270) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask)
      (net 34 "Net-(U6-Pad1)"))
    (pad 15 thru_hole oval (at 7.62 33.02 270) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask)
      (net 37 E))
    (pad 2 thru_hole oval (at 0 2.54 270) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask)
      (net 36 D0))
    (pad 16 thru_hole oval (at 7.62 30.48 270) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask)
      (net 35 RW))
    (pad 3 thru_hole oval (at 0 5.08 270) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask)
      (net 38 D1))
    (pad 17 thru_hole oval (at 7.62 27.94 270) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask)
      (net 8 MOSI))
    (pad 4 thru_hole oval (at 0 7.62 270) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask)
      (net 39 D2))
    (pad 18 thru_hole oval (at 7.62 25.4 270) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask)
      (net 5 MISO))
    (pad 5 thru_hole oval (at 0 10.16 270) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask)
      (net 40 D3))
    (pad 19 thru_hole oval (at 7.62 22.86 270) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask)
      (net 4 SCK))
    (pad 6 thru_hole oval (at 0 12.7 270) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask)
      (net 41 D4))
    (pad 20 thru_hole oval (at 7.62 20.32 270) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask)
      (net 57 "Net-(U6-Pad20)"))
    (pad 7 thru_hole oval (at 0 15.24 270) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask)
      (net 12 VCC))
    (pad 21 thru_hole oval (at 7.62 17.78 270) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask)
      (net 42 "Net-(U6-Pad21)"))
    (pad 8 thru_hole oval (at 0 17.78 270) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask)
      (net 14 GND))
    (pad 22 thru_hole oval (at 7.62 15.24 270) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask)
      (net 14 GND))
    (pad 9 thru_hole oval (at 0 20.32 270) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask)
      (net 43 "Net-(U6-Pad9)"))
    (pad 23 thru_hole oval (at 7.62 12.7 270) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask)
      (net 33 CS))
    (pad 10 thru_hole oval (at 0 22.86 270) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask)
      (net 44 "Net-(U6-Pad10)"))
    (pad 24 thru_hole oval (at 7.62 10.16 270) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask)
      (net 55 BTN1))
    (pad 11 thru_hole oval (at 0 25.4 270) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask)
      (net 45 D5))
    (pad 25 thru_hole oval (at 7.62 7.62 270) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask)
      (net 56 BTN2))
    (pad 12 thru_hole oval (at 0 27.94 270) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask)
      (net 46 D6))
    (pad 26 thru_hole oval (at 7.62 5.08 270) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask)
      (net 47 "Net-(U6-Pad26)"))
    (pad 13 thru_hole oval (at 0 30.48 270) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask)
      (net 48 D7))
    (pad 27 thru_hole oval (at 7.62 2.54 270) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask)
      (net 49 "Net-(U6-Pad27)"))
    (pad 14 thru_hole oval (at 0 33.02 270) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask)
      (net 50 RS))
    (pad 28 thru_hole oval (at 7.62 0 270) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask)
      (net 51 "Net-(U6-Pad28)"))
    (model ${KISYS3DMOD}/Package_DIP.3dshapes/DIP-28_W7.62mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_SO:MSOP-8_3x3mm_P0.65mm (layer F.Cu) (tedit 5A02F25C)
    (at 197 106 180)
    (descr "8-Lead Plastic Micro Small Outline Package (MS) [MSOP] (see Microchip Packaging Specification 00000049BS.pdf)")
    (tags "SSOP 0.65")
    (attr smd)
    (fp_text reference U1 (at 0 2.5) (layer F.SilkS))
    (fp_text value LT6105 (at 0 2.6 180) (layer F.Fab))
    (fp_text user %R (at 0 0 180) (layer F.Fab))
    (pad 1 smd rect (at -2.2 -0.975 180) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 26 "Net-(R7-Pad2)"))
    (pad 2 smd rect (at -2.2 -0.325 180) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 12 VCC))
    (pad 3 smd rect (at -2.2 0.325 180) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask))
    (pad 4 smd rect (at -2.2 0.975 180) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 14 GND))
    (pad 5 smd rect (at 2.2 0.975 180) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 17 +I_ADC))
    (pad 6 smd rect (at 2.2 0.325 180) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask))
    (pad 7 smd rect (at 2.2 -0.325 180) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask))
    (pad 8 smd rect (at 2.2 -0.975 180) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 27 "Net-(R6-Pad2)"))
    (model ${KISYS3DMOD}/Package_SO.3dshapes/MSOP-8_3x3mm_P0.65mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_SO:MSOP-8_3x3mm_P0.65mm (layer F.Cu) (tedit 5A02F25C)
    (at 219 106 180)
    (descr "8-Lead Plastic Micro Small Outline Package (MS) [MSOP] (see Microchip Packaging Specification 00000049BS.pdf)")
    (tags "SSOP 0.65")
    (attr smd)
    (fp_text reference U2 (at 0 2.5) (layer F.SilkS))
    (fp_text value LT6105 (at 0 2.6 180) (layer F.Fab))
    (fp_text user %R (at 0 0 180) (layer F.Fab))
    (pad 1 smd rect (at -2.2 -0.975 180) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 23 "Net-(R9-Pad2)"))
    (pad 2 smd rect (at -2.2 -0.325 180) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 12 VCC))
    (pad 3 smd rect (at -2.2 0.325 180) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask))
    (pad 4 smd rect (at -2.2 0.975 180) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 14 GND))
    (pad 5 smd rect (at 2.2 0.975 180) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 16 5I_ADC))
    (pad 6 smd rect (at 2.2 0.325 180) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask))
    (pad 7 smd rect (at 2.2 -0.325 180) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask))
    (pad 8 smd rect (at 2.2 -0.975 180) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 24 "Net-(R8-Pad2)"))
    (model ${KISYS3DMOD}/Package_SO.3dshapes/MSOP-8_3x3mm_P0.65mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_SO:SOIC-16_3.9x9.9mm_P1.27mm (layer F.Cu) (tedit 5A02F2D3)
    (at 219 94 90)
    (descr "16-Lead Plastic Small Outline (SL) - Narrow, 3.90 mm Body [SOIC] (see Microchip Packaging Specification 00000049BS.pdf)")
    (tags "SOIC 1.27")
    (attr smd)
    (fp_text reference U5 (at 4.5 0 180) (layer F.SilkS))
    (fp_text value MCP3208 (at 0 6 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 16 smd rect (at 2.7 -4.445 90) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
      (net 12 VCC))
    (pad 15 smd rect (at 2.7 -3.175 90) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
      (net 11 "Net-(C10-Pad1)"))
    (pad 14 smd rect (at 2.7 -1.905 90) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
      (net 14 GND))
    (pad 13 smd rect (at 2.7 -0.635 90) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
      (net 3 SCK_Bus))
    (pad 12 smd rect (at 2.7 0.635 90) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
      (net 6 MISO_Bus))
    (pad 11 smd rect (at 2.7 1.905 90) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
      (net 7 MOSI_Bus))
    (pad 10 smd rect (at 2.7 3.175 90) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
      (net 33 CS))
    (pad 9 smd rect (at 2.7 4.445 90) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
      (net 14 GND))
    (pad 8 smd rect (at -2.7 4.445 90) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
      (net 32 "Net-(U5-Pad8)"))
    (pad 7 smd rect (at -2.7 3.175 90) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
      (net 31 "Net-(U5-Pad7)"))
    (pad 6 smd rect (at -2.7 1.905 90) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
      (net 9 -Vs_ADC))
    (pad 5 smd rect (at -2.7 0.635 90) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
      (net 15 -I_ADC))
    (pad 4 smd rect (at -2.7 -0.635 90) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
      (net 29 5Vs_ADC))
    (pad 3 smd rect (at -2.7 -1.905 90) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
      (net 16 5I_ADC))
    (pad 2 smd rect (at -2.7 -3.175 90) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
      (net 18 +Vs_ADC))
    (pad 1 smd rect (at -2.7 -4.445 90) (size 1.5 0.6) (layers F.Cu F.Paste F.Mask)
      (net 17 +I_ADC))
    (model ${KISYS3DMOD}/Package_SO.3dshapes/SOIC-16_3.9x9.9mm_P1.27mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_TO_SOT_SMD:SOT-23-5 (layer F.Cu) (tedit 5A02FF57)
    (at 251.5 112 90)
    (descr "5-pin SOT23 package")
    (tags SOT-23-5)
    (attr smd)
    (fp_text reference U4 (at 3 0 180) (layer F.SilkS))
    (fp_text value LM321 (at 0 2.9 90) (layer F.Fab))
    (fp_text user %R (at 0 0 -180) (layer F.Fab))
    (pad 5 smd rect (at 1.1 -0.95 90) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask)
      (net 12 VCC))
    (pad 4 smd rect (at 1.1 0.95 90) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask)
      (net 9 -Vs_ADC))
    (pad 3 smd rect (at -1.1 0.95 90) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask)
      (net 10 "Net-(R19-Pad1)"))
    (pad 2 smd rect (at -1.1 0 90) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask)
      (net 14 GND))
    (pad 1 smd rect (at -1.1 -0.95 90) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask)
      (net 14 GND))
    (model ${KISYS3DMOD}/Package_TO_SOT_SMD.3dshapes/SOT-23-5.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 227.5 120 90)
    (descr "Resistor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R1 (at 3.5 0) (layer F.SilkS))
    (fp_text value 18K (at 0 1.82 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.4875 0 90) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 29 5Vs_ADC))
    (pad 1 smd roundrect (at -1.4875 0 90) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 22 5Vs_Out))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 227.5 113 90)
    (descr "Resistor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R2 (at 3.5 0 180) (layer F.SilkS))
    (fp_text value 1K (at 0 1.82 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd roundrect (at -1.4875 0 90) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 29 5Vs_ADC))
    (pad 2 smd roundrect (at 1.4875 0 90) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 14 GND))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 191.5 105 90)
    (descr "Resistor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R6 (at 3.5 0 180) (layer F.SilkS))
    (fp_text value 150 (at 0 1.82 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.4875 0 90) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 27 "Net-(R6-Pad2)"))
    (pad 1 smd roundrect (at -1.4875 0 90) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 28 +Vs))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 202.5 105 90)
    (descr "Resistor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R7 (at 3.5 0 180) (layer F.SilkS))
    (fp_text value 150 (at 0 1.82 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd roundrect (at -1.4875 0 90) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 19 +Vs_Out))
    (pad 2 smd roundrect (at 1.4875 0 90) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 26 "Net-(R7-Pad2)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 213.5 105 90)
    (descr "Resistor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R8 (at 3.5 0 180) (layer F.SilkS))
    (fp_text value 150 (at 0 1.82 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd roundrect (at -1.4875 0 90) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 25 5Vs))
    (pad 2 smd roundrect (at 1.4875 0 90) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 24 "Net-(R8-Pad2)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 224.5 105 90)
    (descr "Resistor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R9 (at 3.5 0 180) (layer F.SilkS))
    (fp_text value 150 (at 0 1.82 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.4875 0 90) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 23 "Net-(R9-Pad2)"))
    (pad 1 smd roundrect (at -1.4875 0 90) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 22 5Vs_Out))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 235.5 105 90)
    (descr "Resistor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R10 (at 3.5 0 180) (layer F.SilkS))
    (fp_text value 150 (at 0 1.82 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.4875 0 90) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 21 "Net-(R10-Pad2)"))
    (pad 1 smd roundrect (at -1.4875 0 90) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 1 -Vs))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 246.5 105.0125 90)
    (descr "Resistor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R11 (at 3.5125 0 180) (layer F.SilkS))
    (fp_text value 150 (at 0 1.82 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.4875 0 90) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 20 "Net-(R11-Pad2)"))
    (pad 1 smd roundrect (at -1.4875 0 90) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 2 -Vs_Out))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 205.5 119.9875 90)
    (descr "Resistor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R12 (at 3.4875 0 180) (layer F.SilkS))
    (fp_text value 18K (at 0 1.82 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd roundrect (at -1.4875 0 90) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 19 +Vs_Out))
    (pad 2 smd roundrect (at 1.4875 0 90) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 18 +Vs_ADC))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 205.5 113 90)
    (descr "Resistor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R13 (at 3.5 0 180) (layer F.SilkS))
    (fp_text value 1K (at 0 1.82 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd roundrect (at -1.4875 0 90) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 18 +Vs_ADC))
    (pad 2 smd roundrect (at 1.4875 0 90) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 14 GND))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 188.5 105 270)
    (descr "Resistor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R14 (at -3.5 0 180) (layer F.SilkS))
    (fp_text value 1.5K (at 0 1.82 270) (layer F.Fab))
    (fp_text user %R (at 0 0 270) (layer F.Fab))
    (pad 2 smd roundrect (at 1.4875 0 270) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 14 GND))
    (pad 1 smd roundrect (at -1.4875 0 270) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 17 +I_ADC))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 210.5 105 270)
    (descr "Resistor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R15 (at -3.5 0 180) (layer F.SilkS))
    (fp_text value 1.5K (at 0 1.82 270) (layer F.Fab))
    (fp_text user %R (at 0 0 270) (layer F.Fab))
    (pad 2 smd roundrect (at 1.4875 0 270) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 14 GND))
    (pad 1 smd roundrect (at -1.4875 0 270) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 16 5I_ADC))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 232.5 105 270)
    (descr "Resistor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R16 (at -3.5 0 180) (layer F.SilkS))
    (fp_text value 1.5K (at 0 1.82 270) (layer F.Fab))
    (fp_text user %R (at 0 0 270) (layer F.Fab))
    (pad 2 smd roundrect (at 1.4875 0 270) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 14 GND))
    (pad 1 smd roundrect (at -1.4875 0 270) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 15 -I_ADC))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 248 119.5 90)
    (descr "Resistor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R17 (at 3.5 0 180) (layer F.SilkS))
    (fp_text value 18K (at 0 1.82 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.4875 0 90) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 13 "Net-(R17-Pad2)"))
    (pad 1 smd roundrect (at -1.4875 0 90) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 2 -Vs_Out))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 254 119.5 270)
    (descr "Resistor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R18 (at -3.5 0) (layer F.SilkS))
    (fp_text value 1K (at 0 1.82 270) (layer F.Fab))
    (fp_text user %R (at 0 0 270) (layer F.Fab))
    (pad 1 smd roundrect (at -1.4875 0 270) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 13 "Net-(R17-Pad2)"))
    (pad 2 smd roundrect (at 1.4875 0 270) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 14 GND))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 257 119.5 270)
    (descr "Resistor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R19 (at -3.5 0) (layer F.SilkS))
    (fp_text value 10K (at 0 1.82 270) (layer F.Fab))
    (fp_text user %R (at 0 0 270) (layer F.Fab))
    (pad 2 smd roundrect (at 1.4875 0 270) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 13 "Net-(R17-Pad2)"))
    (pad 1 smd roundrect (at -1.4875 0 270) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 10 "Net-(R19-Pad1)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 210.5 93 90)
    (descr "Resistor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R20 (at 3.5 0.079664) (layer F.SilkS))
    (fp_text value 3K (at 0 1.82 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd roundrect (at -1.4875 0 90) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 12 VCC))
    (pad 2 smd roundrect (at 1.4875 0 90) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 11 "Net-(C10-Pad1)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 248 112 270)
    (descr "Resistor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R21 (at -3.5 0) (layer F.SilkS))
    (fp_text value 10K (at 0 1.82 270) (layer F.Fab))
    (fp_text user %R (at 0 0 270) (layer F.Fab))
    (pad 2 smd roundrect (at 1.4875 0 270) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 10 "Net-(R19-Pad1)"))
    (pad 1 smd roundrect (at -1.4875 0 270) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 9 -Vs_ADC))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 241.1 93 270)
    (descr "Resistor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R22 (at -3.5 0) (layer F.SilkS))
    (fp_text value 330 (at 0 1.82 270) (layer F.Fab))
    (fp_text user %R (at 0 0 270) (layer F.Fab))
    (pad 1 smd roundrect (at -1.4875 0 270) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 8 MOSI))
    (pad 2 smd roundrect (at 1.4875 0 270) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 7 MOSI_Bus))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 244.1 93 270)
    (descr "Resistor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R23 (at -3.5 0) (layer F.SilkS))
    (fp_text value 330 (at 0 1.82 270) (layer F.Fab))
    (fp_text user %R (at 0 0 270) (layer F.Fab))
    (pad 2 smd roundrect (at 1.4875 0 270) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 6 MISO_Bus))
    (pad 1 smd roundrect (at -1.4875 0 270) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 5 MISO))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 247.1 93 270)
    (descr "Resistor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R24 (at -3.5 0) (layer F.SilkS))
    (fp_text value 330 (at 0 1.82 270) (layer F.Fab))
    (fp_text user %R (at 0 0 270) (layer F.Fab))
    (pad 1 smd roundrect (at -1.4875 0 270) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 4 SCK))
    (pad 2 smd roundrect (at 1.4875 0 270) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 3 SCK_Bus))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0612_1632Metric_Pad1.18x3.40mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 197 111)
    (descr "Resistor SMD 0612 (1632 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://www.vishay.com/docs/20019/rcwe.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R3 (at 2.25 0 -270) (layer F.SilkS))
    (fp_text value 50m (at 0 2.65) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd roundrect (at -0.8375 0) (size 1.175 3.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.212766)
      (net 28 +Vs))
    (pad 2 smd roundrect (at 0.8375 0) (size 1.175 3.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.212766)
      (net 19 +Vs_Out))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0612_1632Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0612_1632Metric_Pad1.18x3.40mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 219 111)
    (descr "Resistor SMD 0612 (1632 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://www.vishay.com/docs/20019/rcwe.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R4 (at 2.25 0 -270) (layer F.SilkS))
    (fp_text value 50m (at 0 2.65) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 0.8375 0) (size 1.175 3.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.212766)
      (net 22 5Vs_Out))
    (pad 1 smd roundrect (at -0.8375 0) (size 1.175 3.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.212766)
      (net 25 5Vs))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0612_1632Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0612_1632Metric_Pad1.18x3.40mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 241 111)
    (descr "Resistor SMD 0612 (1632 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://www.vishay.com/docs/20019/rcwe.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R5 (at 2.25 0 -270) (layer F.SilkS))
    (fp_text value 50m (at 0 2.65) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 0.8375 0) (size 1.175 3.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.212766)
      (net 2 -Vs_Out))
    (pad 1 smd roundrect (at -0.8375 0) (size 1.175 3.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.212766)
      (net 1 -Vs))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0612_1632Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 200 90 90)
    (descr "Capacitor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C17 (at 3 0) (layer F.SilkS))
    (fp_text value 0.1uf (at 0 1.82 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd roundrect (at -1.4875 0 90) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 12 VCC))
    (pad 2 smd roundrect (at 1.4875 0 90) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 14 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MountingHole:MountingHole_3.2mm_M3 (layer F.Cu) (tedit 5BD4F261)
    (at 181.5 72.5)
    (descr "Mounting Hole 3.2mm, no annular, M3")
    (tags "mounting hole 3.2mm no annular m3")
    (attr virtual)
    (fp_text reference REF** (at 0 -4.2) (layer F.SilkS) hide)
    (fp_text value MountingHole_3.2mm_M3 (at 0 4.2) (layer F.Fab))
    (fp_text user %R (at 0.3 0) (layer F.Fab))
    (pad 1 np_thru_hole circle (at 0 0) (size 3.2 3.2) (drill 3.2) (layers *.Cu *.Mask))
  )
  (module MountingHole:MountingHole_3.2mm_M3 (layer F.Cu) (tedit 5BD4F272)
    (at 256.5 72.5)
    (descr "Mounting Hole 3.2mm, no annular, M3")
    (tags "mounting hole 3.2mm no annular m3")
    (attr virtual)
    (fp_text reference REF** (at 0 -4.2) (layer F.SilkS) hide)
    (fp_text value MountingHole_3.2mm_M3 (at 0 4.2) (layer F.Fab))
    (fp_text user %R (at 0.3 0) (layer F.Fab))
    (pad 1 np_thru_hole circle (at 0 0) (size 3.2 3.2) (drill 3.2) (layers *.Cu *.Mask))
  )
  (module MountingHole:MountingHole_3.2mm_M3 (layer F.Cu) (tedit 5BD4F259)
    (at 181.5 103.5)
    (descr "Mounting Hole 3.2mm, no annular, M3")
    (tags "mounting hole 3.2mm no annular m3")
    (attr virtual)
    (fp_text reference REF** (at -6.5 0) (layer F.SilkS) hide)
    (fp_text value MountingHole_3.2mm_M3 (at 0 4.2) (layer F.Fab))
    (fp_text user %R (at 0.3 0) (layer F.Fab))
    (pad 1 np_thru_hole circle (at 0 0) (size 3.2 3.2) (drill 3.2) (layers *.Cu *.Mask))
  )
  (module MountingHole:MountingHole_3.2mm_M3 (layer F.Cu) (tedit 5BD4F280)
    (at 256.5 103.5)
    (descr "Mounting Hole 3.2mm, no annular, M3")
    (tags "mounting hole 3.2mm no annular m3")
    (attr virtual)
    (fp_text reference REF** (at 6 0) (layer F.SilkS) hide)
    (fp_text value MountingHole_3.2mm_M3 (at 0 4.2) (layer F.Fab))
    (fp_text user %R (at 0.3 0) (layer F.Fab))
    (pad 1 np_thru_hole circle (at 0 0) (size 3.2 3.2) (drill 3.2) (layers *.Cu *.Mask))
  )
  (module Connector_PinSocket_2.54mm:PinSocket_1x02_P2.54mm_Vertical (layer F.Cu) (tedit 5A19A420)
    (at 254 80.5 90)
    (descr "Through hole straight socket strip, 1x02, 2.54mm pitch, single row (from Kicad 4.0.7), script generated")
    (tags "Through hole socket strip THT 1x02 2.54mm single row")
    (fp_text reference J7 (at 2.25 1.5 180) (layer F.SilkS))
    (fp_text value Conn_01x02 (at 0 5.31 90) (layer F.Fab))
    (fp_text user %R (at 0 1.27 180) (layer F.Fab))
    (pad 2 thru_hole oval (at 0 2.54 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 12 VCC))
    (pad 1 thru_hole rect (at 0 0 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 55 BTN1))
    (model ${KISYS3DMOD}/Connector_PinSocket_2.54mm.3dshapes/PinSocket_1x02_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_PinSocket_2.54mm:PinSocket_1x02_P2.54mm_Vertical (layer F.Cu) (tedit 5A19A420)
    (at 254 85 90)
    (descr "Through hole straight socket strip, 1x02, 2.54mm pitch, single row (from Kicad 4.0.7), script generated")
    (tags "Through hole socket strip THT 1x02 2.54mm single row")
    (fp_text reference J8 (at 2.25 1.25) (layer F.SilkS))
    (fp_text value Conn_01x02 (at 0 5.31 90) (layer F.Fab))
    (fp_text user %R (at 0 1.27 180) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 56 BTN2))
    (pad 2 thru_hole oval (at 0 2.54 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 12 VCC))
    (model ${KISYS3DMOD}/Connector_PinSocket_2.54mm.3dshapes/PinSocket_1x02_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 230.5 120 90)
    (descr "Resistor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R25 (at 3.5 0 180) (layer F.SilkS))
    (fp_text value 18K (at 0 1.82 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd roundrect (at -1.4875 0 90) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 22 5Vs_Out))
    (pad 2 smd roundrect (at 1.4875 0 90) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 29 5Vs_ADC))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 208.5 120 90)
    (descr "Resistor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R26 (at 3.5 0 180) (layer F.SilkS))
    (fp_text value 18K (at 0 1.82 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.4875 0 90) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 18 +Vs_ADC))
    (pad 1 smd roundrect (at -1.4875 0 90) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 19 +Vs_Out))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 251 119.5 90)
    (descr "Resistor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R27 (at 3.5 0 180) (layer F.SilkS))
    (fp_text value 18K (at 0 1.82 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd roundrect (at -1.4875 0 90) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 2 -Vs_Out))
    (pad 2 smd roundrect (at 1.4875 0 90) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 13 "Net-(R17-Pad2)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (gr_text "REV 1.0" (at 185.5 121.75) (layer F.Cu))
  (gr_text . (at 244.5 76.75) (layer F.SilkS))
  (gr_text VEE (at 245.75 74.9 270) (layer F.SilkS))
  (gr_text GND (at 251 75 270) (layer F.SilkS))
  (gr_text VCC (at 248.25 75 270) (layer F.SilkS))
  (gr_text RS (at 243.25 74.55 270) (layer F.SilkS))
  (gr_text RW (at 240.75 74.55 270) (layer F.SilkS))
  (gr_text E (at 238.25 74.05 270) (layer F.SilkS))
  (gr_text D0 (at 235.75 74.55 270) (layer F.SilkS))
  (gr_text D1 (at 233.25 74.55 270) (layer F.SilkS))
  (gr_text D2 (at 230.75 74.55 270) (layer F.SilkS))
  (gr_text D3 (at 228.1 74.4) (layer F.SilkS))
  (gr_text D4 (at 225.5 74.4) (layer F.SilkS))
  (gr_text D5 (at 223 74.55 270) (layer F.SilkS))
  (gr_text D6 (at 220.5 74.575 270) (layer F.SilkS))
  (gr_text D7 (at 218 74.55 270) (layer F.SilkS))
  (gr_text VCC (at 215.25 75.05 270) (layer F.SilkS))
  (gr_text GND (at 212.75 75.05 270) (layer F.SilkS))
  (gr_line (start 179 70) (end 179 124) (layer Edge.Cuts) (width 0.2))
  (gr_line (start 259 124) (end 259 70) (layer Edge.Cuts) (width 0.2))
  (gr_line (start 179 124) (end 259 124) (layer Edge.Cuts) (width 0.2))
  (gr_line (start 179 70) (end 259 70) (layer Edge.Cuts) (width 0.2))
  (zone (net 19) (net_name +Vs_Out) (layer F.Cu) (hatch edge 0.508)
    (priority 1)
    (connect_pads yes (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 197.5 122.5) (xy 197.5 109.3) (xy 201.5 109.3) (xy 201.5 122.5)
      )
    )
  )
  (zone (net 25) (net_name 5Vs) (layer F.Cu) (hatch edge 0.508)
    (priority 1)
    (connect_pads yes (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 214.5 122.5) (xy 214.5 109.3) (xy 218.5 109.3) (xy 218.5 122.5)
      )
    )
  )
  (zone (net 22) (net_name 5Vs_Out) (layer F.Cu) (hatch edge 0.508)
    (priority 1)
    (connect_pads yes (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 219.5 122.5) (xy 219.5 109.3) (xy 223.5 109.3) (xy 223.5 122.5)
      )
    )
  )
  (zone (net 1) (net_name -Vs) (layer F.Cu) (hatch edge 0.508)
    (priority 1)
    (connect_pads yes (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 236.5 122.5) (xy 236.5 109.3) (xy 240.5 109.3) (xy 240.5 122.5)
      )
    )
  )
  (zone (net 2) (net_name -Vs_Out) (layer F.Cu) (hatch edge 0.508)
    (priority 1)
    (connect_pads yes (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 241.5 122.5) (xy 241.5 109.3) (xy 245.5 109.3) (xy 245.5 122.5)
      )
    )
  )
  (zone (net 28) (net_name +Vs) (layer F.Cu) (hatch edge 0.508)
    (priority 1)
    (connect_pads yes (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 192.5 122.5) (xy 192.5 109.3) (xy 196.5 109.3) (xy 196.5 122.5)
      )
    )
  )
  (zone (net 54) (net_name +6V) (layer F.Cu) (hatch edge 0.508)
    (priority 5)
    (connect_pads yes (clearance 1))
    (min_thickness 0.508)
    (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 180 77) (xy 192.5 77) (xy 192.5 81) (xy 180 81)
      )
    )
  )
  (zone (net 14) (net_name GND) (layer F.Cu) (hatch edge 0.508)
    (priority 5)
    (connect_pads yes (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 180 82) (xy 186.75 82) (xy 186.75 96.5) (xy 180 96.5)
      )
    )
  )
  (zone (net 14) (net_name GND) (layer B.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 260 97.5) (xy 239 97.5) (xy 239 88.75) (xy 204.5 88.75) (xy 204.5 89.75)
        (xy 238 89.75) (xy 238 98.5) (xy 260 98.5) (xy 260 125.5) (xy 178 125)
        (xy 178 100.5) (xy 196.5 100.5) (xy 196.5 101.5) (xy 202.5 101.5) (xy 202.5 91)
        (xy 201.5 91) (xy 201.5 100.5) (xy 197.5 100.5) (xy 197.5 99.25) (xy 178 99.25)
        (xy 178 69) (xy 260 69)
      )
    )
  )
  (zone (net 14) (net_name GND) (layer F.Cu) (hatch edge 0.508)
    (priority 1)
    (connect_pads (clearance 0.254))
    (min_thickness 0.1524)
    (fill yes (arc_segments 16) (thermal_gap 0.254) (thermal_bridge_width 0.254))
    (polygon
      (pts
        (xy 204 106.25) (xy 211.5 106.25) (xy 211.5 112) (xy 204 112)
      )
    )
  )
  (zone (net 14) (net_name GND) (layer F.Cu) (hatch edge 0.508)
    (priority 1)
    (connect_pads (clearance 0.254))
    (min_thickness 0.2)
    (fill yes (arc_segments 16) (thermal_gap 0.254) (thermal_bridge_width 0.254))
    (polygon
      (pts
        (xy 226 106.25) (xy 233.75 106.25) (xy 233.75 112) (xy 226 112)
      )
    )
  )
  (zone (net 14) (net_name GND) (layer F.Cu) (hatch edge 0.508)
    (priority 1)
    (connect_pads (clearance 0.254))
    (min_thickness 0.2032)
    (fill yes (arc_segments 16) (thermal_gap 0.254) (thermal_bridge_width 0.254))
    (polygon
      (pts
        (xy 246.5 106.25) (xy 246.5 122.5) (xy 258.25 122.5) (xy 258.25 106.25)
      )
    )
  )
  (zone (net 30) (net_name "Net-(C14-Pad1)") (layer F.Cu) (hatch edge 0.508)
    (priority 2)
    (connect_pads yes (clearance 0.254))
    (min_thickness 0.1524)
    (fill yes (arc_segments 16) (thermal_gap 0.254) (thermal_bridge_width 0.254))
    (polygon
      (pts
        (xy 202.25 77.5) (xy 198 77.5) (xy 198 93.5) (xy 201 93.5) (xy 201 95.5)
        (xy 198 95.5) (xy 198 96.75) (xy 187 96.75) (xy 187 72.5) (xy 202.25 72.5)
      )
    )
  )
  (zone (net 12) (net_name VCC) (layer F.Cu) (hatch edge 0.508)
    (priority 3)
    (connect_pads yes (clearance 0.508))
    (min_thickness 0.1524)
    (fill yes (arc_segments 16) (thermal_gap 0.254) (thermal_bridge_width 0.254))
    (polygon
      (pts
        (xy 188.25 90.25) (xy 188.25 92.25) (xy 201.25 92.25) (xy 201.25 90.25)
      )
    )
  )
)
