(kicad_pcb (version 20171130) (host pcbnew "(5.1.5)-3")
  (general
    (thickness 1.6)
    (drawings 82)
    (tracks 950)
    (zones 0)
    (modules 81)
    (nets 50)
  )
  (page A)
  (title_block
    (title VP2_TFT)
    (date 2019-04-06)
    (rev A)
    (company KD6VKF)
  )
  (layers
    (0 F.Cu signal)
    (31 B.Cu signal)
    (32 B.Adhes user)
    (33 F.Adhes user)
    (34 B.Paste user)
    (35 F.Paste user)
    (36 B.SilkS user)
    (37 F.SilkS user)
    (38 B.Mask user)
    (39 F.Mask user)
    (40 Dwgs.User user)
    (41 Cmts.User user)
    (42 Eco1.User user)
    (43 Eco2.User user)
    (44 Edge.Cuts user)
    (45 Margin user)
    (46 B.CrtYd user)
    (47 F.CrtYd user)
    (48 B.Fab user)
    (49 F.Fab user)
  )
  (setup
    (last_trace_width 0.25)
    (trace_clearance 0.2)
    (zone_clearance 0.508)
    (zone_45_only no)
    (trace_min 0.2)
    (via_size 0.8)
    (via_drill 0.4)
    (via_min_size 0.4)
    (via_min_drill 0.3)
    (uvia_size 0.3)
    (uvia_drill 0.1)
    (uvias_allowed no)
    (uvia_min_size 0.2)
    (uvia_min_drill 0.1)
    (edge_width 0.15)
    (segment_width 0.2)
    (pcb_text_width 0.3)
    (pcb_text_size 1.5 1.5)
    (mod_edge_width 0.15)
    (mod_text_size 0.6096 0.6096)
    (mod_text_width 0.127)
    (pad_size 3.302 3.302)
    (pad_drill 3.302)
    (pad_to_mask_clearance 0.051)
    (solder_mask_min_width 0.25)
    (aux_axis_origin 0 0)
    (visible_elements 7FFFFFFF)
    (pcbplotparams
      (layerselection 0x010fc_ffffffff)
      (usegerberextensions false)
      (usegerberattributes false)
      (usegerberadvancedattributes false)
      (creategerberjobfile false)
      (excludeedgelayer true)
      (linewidth 0.100000)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (padsonsilk false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 0)
      (scaleselection 1)
      (outputdirectory "./"))
  )
  (net 0 "")
  (net 1 +3V3)
  (net 2 GND)
  (net 3 SDA)
  (net 4 SCL)
  (net 5 "Net-(M2-Pad8)")
  (net 6 "Net-(M2-Pad10)")
  (net 7 VBUS)
  (net 8 "Net-(D1-PadC)")
  (net 9 +BATT)
  (net 10 "Net-(R12-Pad1)")
  (net 11 "Net-(R13-Pad1)")
  (net 12 PWM)
  (net 13 VBAT)
  (net 14 "Net-(Q1-Pad2)")
  (net 15 "Net-(JP1-Pad2)")
  (net 16 D1)
  (net 17 "Net-(D3-PadC)")
  (net 18 "Net-(D4-PadC)")
  (net 19 D0)
  (net 20 "Net-(J4-PadFEED)")
  (net 21 /MISO)
  (net 22 /SCK)
  (net 23 /MOSI)
  (net 24 "Net-(D5-PadA)")
  (net 25 /~RESET)
  (net 26 /~TFT_DC)
  (net 27 /~TFT_CS)
  (net 28 /~SD_CS)
  (net 29 D2)
  (net 30 /IRQ)
  (net 31 /CD)
  (net 32 /TFT_LED)
  (net 33 "Net-(F2-Pad1)")
  (net 34 "Net-(M2-Pad4)")
  (net 35 "Net-(BT1-Pad1)")
  (net 36 /SD_MISO)
  (net 37 /SD_MOSI)
  (net 38 "Net-(D6-PadC)")
  (net 39 "Net-(D6-PadA)")
  (net 40 /SENSOR)
  (net 41 LED_R)
  (net 42 LED_G)
  (net 43 /Vin)
  (net 44 "Net-(TP7-Pad1)")
  (net 45 "Net-(D7-PadA)")
  (net 46 /PB1)
  (net 47 /PB3)
  (net 48 /PB2)
  (net 49 "Net-(R25-Pad2)")
  (net_class Default "This is the default net class."
    (clearance 0.2)
    (trace_width 0.25)
    (via_dia 0.8)
    (via_drill 0.4)
    (uvia_dia 0.3)
    (uvia_drill 0.1)
    (add_net /CD)
    (add_net /IRQ)
    (add_net /MISO)
    (add_net /MOSI)
    (add_net /PB1)
    (add_net /PB2)
    (add_net /PB3)
    (add_net /SCK)
    (add_net /SD_MISO)
    (add_net /SD_MOSI)
    (add_net /SENSOR)
    (add_net /TFT_LED)
    (add_net /Vin)
    (add_net /~RESET)
    (add_net /~SD_CS)
    (add_net /~TFT_CS)
    (add_net /~TFT_DC)
    (add_net D0)
    (add_net D1)
    (add_net D2)
    (add_net LED_G)
    (add_net LED_R)
    (add_net "Net-(BT1-Pad1)")
    (add_net "Net-(D1-PadC)")
    (add_net "Net-(D3-PadC)")
    (add_net "Net-(D4-PadC)")
    (add_net "Net-(D5-PadA)")
    (add_net "Net-(D6-PadA)")
    (add_net "Net-(D6-PadC)")
    (add_net "Net-(D7-PadA)")
    (add_net "Net-(F2-Pad1)")
    (add_net "Net-(J4-PadFEED)")
    (add_net "Net-(JP1-Pad2)")
    (add_net "Net-(M2-Pad10)")
    (add_net "Net-(M2-Pad4)")
    (add_net "Net-(M2-Pad8)")
    (add_net "Net-(Q1-Pad2)")
    (add_net "Net-(R12-Pad1)")
    (add_net "Net-(R13-Pad1)")
    (add_net "Net-(R25-Pad2)")
    (add_net "Net-(TP7-Pad1)")
    (add_net PWM)
    (add_net SCL)
    (add_net SDA)
  )
  (net_class Power ""
    (clearance 0.25)
    (trace_width 0.38)
    (via_dia 0.8)
    (via_drill 0.4)
    (uvia_dia 0.3)
    (uvia_drill 0.1)
    (add_net +3V3)
    (add_net +BATT)
    (add_net GND)
    (add_net VBAT)
    (add_net VBUS)
  )
  (module Resistor_THT:R_Axial_DIN0204_L3.6mm_D1.6mm_P5.08mm_Horizontal (layer F.Cu) (tedit 5AE5139B)
    (at 171.45 107.95 180)
    (descr "Resistor, Axial_DIN0204 series, Axial, Horizontal, pin pitch=5.08mm, 0.167W, length*diameter=3.6*1.6mm^2, http://cdn-reichelt.de/documents/datenblatt/B400/1_4W%23YAG.pdf")
    (tags "Resistor Axial_DIN0204 series Axial Horizontal pin pitch 5.08mm 0.167W length 3.6mm diameter 1.6mm")
    (fp_text reference R25 (at 2.54 -1.92) (layer F.SilkS))
    (fp_text value DNI (at 2.667 0) (layer F.SilkS))
    (fp_text user %R (at 2.54 -1.905) (layer F.Fab))
    (pad 2 thru_hole oval (at 5.08 0 180) (size 1.4 1.4) (drill 0.7) (layers *.Cu *.Mask)
      (net 49 "Net-(R25-Pad2)"))
    (pad 1 thru_hole circle (at 0 0 180) (size 1.4 1.4) (drill 0.7) (layers *.Cu *.Mask)
      (net 1 +3V3))
    (model ${KISYS3DMOD}/Resistor_THT.3dshapes/R_Axial_DIN0204_L3.6mm_D1.6mm_P5.08mm_Horizontal.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_THT:R_Axial_DIN0204_L3.6mm_D1.6mm_P5.08mm_Horizontal (layer F.Cu) (tedit 5AE5139B)
    (at 178.181 95.123 180)
    (descr "Resistor, Axial_DIN0204 series, Axial, Horizontal, pin pitch=5.08mm, 0.167W, length*diameter=3.6*1.6mm^2, http://cdn-reichelt.de/documents/datenblatt/B400/1_4W%23YAG.pdf")
    (tags "Resistor Axial_DIN0204 series Axial Horizontal pin pitch 5.08mm 0.167W length 3.6mm diameter 1.6mm")
    (fp_text reference R9 (at 2.921 -2.159) (layer F.SilkS))
    (fp_text value 10K (at 2.413 0.127) (layer F.SilkS))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 thru_hole oval (at 5.08 0 180) (size 1.4 1.4) (drill 0.7) (layers *.Cu *.Mask)
      (net 25 /~RESET))
    (pad 1 thru_hole circle (at 0 0 180) (size 1.4 1.4) (drill 0.7) (layers *.Cu *.Mask)
      (net 1 +3V3))
    (model ${KISYS3DMOD}/Resistor_THT.3dshapes/R_Axial_DIN0204_L3.6mm_D1.6mm_P5.08mm_Horizontal.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_THT:R_Axial_DIN0204_L3.6mm_D1.6mm_P5.08mm_Horizontal (layer F.Cu) (tedit 5AE5139B)
    (at 178.181 92.71 180)
    (descr "Resistor, Axial_DIN0204 series, Axial, Horizontal, pin pitch=5.08mm, 0.167W, length*diameter=3.6*1.6mm^2, http://cdn-reichelt.de/documents/datenblatt/B400/1_4W%23YAG.pdf")
    (tags "Resistor Axial_DIN0204 series Axial Horizontal pin pitch 5.08mm 0.167W length 3.6mm diameter 1.6mm")
    (fp_text reference R3 (at 3.302 1.905) (layer F.SilkS))
    (fp_text value 10K (at 2.794 0) (layer F.SilkS))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 thru_hole oval (at 5.08 0 180) (size 1.4 1.4) (drill 0.7) (layers *.Cu *.Mask)
      (net 27 /~TFT_CS))
    (pad 1 thru_hole circle (at 0 0 180) (size 1.4 1.4) (drill 0.7) (layers *.Cu *.Mask)
      (net 1 +3V3))
    (model ${KISYS3DMOD}/Resistor_THT.3dshapes/R_Axial_DIN0204_L3.6mm_D1.6mm_P5.08mm_Horizontal.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Battery:BatteryHolder_Keystone_3001_1x12mm (layer F.Cu) (tedit 5E23FA47)
    (at 161.29 97.79 180)
    (descr http://www.keyelco.com/product-pdf.cfm?p=778)
    (tags "Keystone type 3001 coin cell retainer")
    (fp_text reference BT1 (at 0 -8) (layer F.SilkS))
    (fp_text value CR1220 (at 0 7.5) (layer F.SilkS))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd circle (at 0 0 180) (size 9 9) (layers F.Cu F.Mask)
      (net 2 GND))
    (pad 1 thru_hole circle (at 6.6 0 180) (size 3 3) (drill 1.9) (layers *.Cu *.Mask)
      (net 35 "Net-(BT1-Pad1)"))
    (pad 1 thru_hole circle (at -6.6 0 180) (size 3 3) (drill 1.9) (layers *.Cu *.Mask)
      (net 35 "Net-(BT1-Pad1)"))
    (model ${KISYS3DMOD}/Battery.3dshapes/BatteryHolder_Keystone_3001_1x12mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_PinHeader_2.54mm:PinHeader_1x05_P2.54mm_Vertical (layer F.Cu) (tedit 59FED5CC)
    (at 128.524 131.318 270)
    (descr "Through hole straight pin header, 1x05, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x05 2.54mm single row")
    (fp_text reference J2 (at -1.905 11.43) (layer F.SilkS))
    (fp_text value USB_PWR (at -2.032 6.096 180) (layer F.SilkS))
    (fp_text user %R (at 0 5.08) (layer F.Fab))
    (pad 5 thru_hole oval (at 0 10.16 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 2 GND))
    (pad 4 thru_hole oval (at 0 7.62 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
    (pad 3 thru_hole oval (at 0 5.08 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
    (pad 2 thru_hole oval (at 0 2.54 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
    (pad 1 thru_hole rect (at 0 0 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 43 /Vin))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x05_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_THT:R_Axial_DIN0207_L6.3mm_D2.5mm_P2.54mm_Vertical (layer F.Cu) (tedit 5AE5139B)
    (at 188.341 91.313 180)
    (descr "Resistor, Axial_DIN0207 series, Axial, Vertical, pin pitch=2.54mm, 0.25W = 1/4W, length*diameter=6.3*2.5mm^2, http://cdn-reichelt.de/documents/datenblatt/B400/1_4W%23YAG.pdf")
    (tags "Resistor Axial_DIN0207 series Axial Vertical pin pitch 2.54mm 0.25W = 1/4W length 6.3mm diameter 2.5mm")
    (fp_text reference R19 (at 1.27 -1.905) (layer F.SilkS))
    (fp_text value 1K (at 1.524 1.524) (layer F.SilkS))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 thru_hole oval (at 2.54 0 180) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask)
      (net 34 "Net-(M2-Pad4)"))
    (pad 1 thru_hole circle (at 0 0 180) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask)
      (net 24 "Net-(D5-PadA)"))
    (model ${KISYS3DMOD}/Resistor_THT.3dshapes/R_Axial_DIN0207_L6.3mm_D2.5mm_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_THT:R_Axial_DIN0204_L3.6mm_D1.6mm_P2.54mm_Vertical (layer F.Cu) (tedit 5AE5139B)
    (at 106.8578 85.1916)
    (descr "Resistor, Axial_DIN0204 series, Axial, Vertical, pin pitch=2.54mm, 0.167W, length*diameter=3.6*1.6mm^2, http://cdn-reichelt.de/documents/datenblatt/B400/1_4W%23YAG.pdf")
    (tags "Resistor Axial_DIN0204 series Axial Vertical pin pitch 2.54mm 0.167W length 3.6mm diameter 1.6mm")
    (fp_text reference R24 (at 1.3462 -1.2446) (layer F.SilkS))
    (fp_text value 1K (at 1.3462 -0.6096) (layer F.SilkS))
    (fp_text user %R (at -0.0598 -1.6002) (layer B.Fab) hide)
    (pad 2 thru_hole oval (at 2.54 0) (size 1.4 1.4) (drill 0.7) (layers *.Cu *.Mask)
      (net 1 +3V3))
    (pad 1 thru_hole circle (at 0 0) (size 1.4 1.4) (drill 0.7) (layers *.Cu *.Mask)
      (net 45 "Net-(D7-PadA)"))
    (model ${KISYS3DMOD}/Resistor_THT.3dshapes/R_Axial_DIN0204_L3.6mm_D1.6mm_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module VP2_TFT_1:MoteinoM6 (layer F.Cu) (tedit 5E20F22F)
    (at 150.622 124.714 90)
    (fp_text reference M2 (at 32.512 -24.003 90) (layer F.SilkS))
    (fp_text value Moteino_M6 (at 16.002 -6.604 90) (layer F.SilkS))
    (fp_text user SCK (at 31.75 -4.445 90) (layer B.SilkS))
    (fp_text user MI (at 29.21 -4.445 90) (layer B.SilkS))
    (fp_text user SK (at 31.77032 -1.94056 90) (layer B.SilkS))
    (fp_text user 12 (at 29.21 -3.175 90) (layer B.SilkS))
    (fp_text user 13 (at 31.75 -3.175 90) (layer B.SilkS))
    (fp_text user SDA (at 21.59 -19.05 90) (layer F.SilkS))
    (fp_text user SCL (at 19.05 -19.05 90) (layer F.SilkS))
    (fp_text user 2 (at 3.81 -3.175 90) (layer B.SilkS))
    (fp_text user 6 (at 13.97 -3.175 90) (layer B.SilkS))
    (fp_text user 7 (at 16.51 -3.175 90) (layer B.SilkS))
    (fp_text user 3 (at 6.35 -3.175 90) (layer B.SilkS))
    (fp_text user 4 (at 8.89 -3.175 90) (layer B.SilkS))
    (fp_text user 5 (at 11.43 -3.175 90) (layer B.SilkS))
    (fp_text user RST (at 1.27 -3.175 90) (layer B.SilkS))
    (fp_text user MO (at 26.67 -4.445 90) (layer B.SilkS))
    (fp_text user 8 (at 18.9738 -3.1496 90) (layer B.SilkS))
    (fp_text user 9 (at 21.59 -3.175 90) (layer B.SilkS))
    (fp_text user 10 (at 24.13 -3.175 90) (layer B.SilkS))
    (fp_text user 11 (at 26.67 -3.175 90) (layer B.SilkS))
    (fp_text user TX (at 8.763 -17.907 90) (layer B.SilkS))
    (fp_text user RX (at 11.303 -17.907 90) (layer B.SilkS))
    (fp_text user VIN (at 3.9116 -19.0246 90) (layer B.SilkS))
    (fp_text user 1 (at 8.89 -19.9898 90) (layer B.SilkS))
    (fp_text user GND (at 1.397 -20.0406 90) (layer B.SilkS))
    (fp_text user 0 (at 11.43 -19.9898 90) (layer B.SilkS))
    (fp_text user 3v3 (at 6.35 -18.923 90) (layer B.SilkS))
    (fp_text user A1 (at 29.21 -20.32 90) (layer B.SilkS))
    (fp_text user A2 (at 26.67 -20.193 90) (layer F.SilkS))
    (fp_text user A0 (at 31.75 -20.193 90) (layer B.SilkS))
    (fp_text user A6 (at 16.51 -20.193 90) (layer F.SilkS))
    (fp_text user A5 (at 19.05 -20.193 90) (layer F.SilkS))
    (fp_text user A4 (at 21.59 -20.193 90) (layer F.SilkS))
    (fp_text user A3 (at 24.13 -20.193 90) (layer F.SilkS))
    (fp_text user A7 (at 13.97 -20.193 90) (layer B.SilkS))
    (fp_text user GND (at 1.397 -20.066 90) (layer F.SilkS))
    (fp_text user VIN (at 3.9116 -19.0246 90) (layer F.SilkS))
    (fp_text user 3v3 (at 6.35 -18.923 90) (layer F.SilkS))
    (fp_text user 1 (at 8.89 -19.9898 90) (layer F.SilkS))
    (fp_text user 0 (at 11.43 -19.9898 90) (layer F.SilkS))
    (fp_text user A7 (at 13.97 -20.193 90) (layer F.SilkS))
    (fp_text user A6 (at 16.51 -20.193 90) (layer B.SilkS))
    (fp_text user TX (at 8.763 -17.907 90) (layer F.SilkS))
    (fp_text user RX (at 11.303 -17.907 90) (layer F.SilkS))
    (fp_text user RST (at 1.27 -3.175 90) (layer F.SilkS))
    (fp_text user MO (at 26.67 -4.445 90) (layer F.SilkS))
    (fp_text user MI (at 29.21 -4.445 90) (layer F.SilkS))
    (fp_text user SCK (at 31.75 -4.445 90) (layer F.SilkS))
    (fp_text user SCL (at 19.05 -19.05 90) (layer B.SilkS))
    (fp_text user SDA (at 21.59 -19.05 90) (layer B.SilkS))
    (fp_text user A5 (at 19.05 -20.193 90) (layer B.SilkS))
    (fp_text user A4 (at 21.59 -20.193 90) (layer B.SilkS))
    (fp_text user A3 (at 24.13 -20.193 90) (layer B.SilkS))
    (fp_text user A2 (at 26.67 -20.193 90) (layer B.SilkS))
    (fp_text user A1 (at 29.21 -20.32 90) (layer F.SilkS))
    (fp_text user A0 (at 31.75 -20.193 90) (layer F.SilkS))
    (fp_text user 2 (at 3.81 -3.175 90) (layer F.SilkS))
    (fp_text user 3 (at 6.35 -3.175 90) (layer F.SilkS))
    (fp_text user 4 (at 8.89 -3.175 90) (layer F.SilkS))
    (fp_text user 5 (at 11.43 -3.175 90) (layer F.SilkS))
    (fp_text user 6 (at 13.97 -3.175 90) (layer F.SilkS))
    (fp_text user 7 (at 16.51 -3.175 90) (layer F.SilkS))
    (fp_text user 8 (at 19.05 -3.175 90) (layer F.SilkS))
    (fp_text user 9 (at 21.59 -3.175 90) (layer F.SilkS))
    (fp_text user 10 (at 24.13 -3.175 90) (layer F.SilkS))
    (fp_text user 11 (at 26.67 -3.175 90) (layer F.SilkS))
    (fp_text user 12 (at 29.21 -3.175 90) (layer F.SilkS))
    (fp_text user 13 (at 31.75 -3.175 90) (layer F.SilkS))
    (pad 1 thru_hole rect (at 1.27 -1.524 90) (size 1.778 2.286) (drill 1.143) (layers *.Cu *.Mask)
      (net 25 /~RESET))
    (pad 2 thru_hole roundrect (at 3.81 -1.524 90) (size 1.778 2.286) (drill 1.143) (layers *.Cu *.Mask) (roundrect_rratio 0.25)
      (net 29 D2))
    (pad 3 thru_hole roundrect (at 6.35 -1.524 90) (size 1.778 2.286) (drill 1.143) (layers *.Cu *.Mask) (roundrect_rratio 0.25)
      (net 12 PWM))
    (pad 4 thru_hole roundrect (at 8.89 -1.524 90) (size 1.778 2.286) (drill 1.143) (layers *.Cu *.Mask) (roundrect_rratio 0.25)
      (net 34 "Net-(M2-Pad4)"))
    (pad 5 thru_hole roundrect (at 11.43 -1.524 90) (size 1.778 2.286) (drill 1.143) (layers *.Cu *.Mask) (roundrect_rratio 0.25)
      (net 28 /~SD_CS))
    (pad 6 thru_hole roundrect (at 13.97 -1.524 90) (size 1.778 2.286) (drill 1.143) (layers *.Cu *.Mask) (roundrect_rratio 0.25)
      (net 26 /~TFT_DC))
    (pad 7 thru_hole roundrect (at 16.51 -1.524 90) (size 1.778 2.286) (drill 1.143) (layers *.Cu *.Mask) (roundrect_rratio 0.25)
      (net 27 /~TFT_CS))
    (pad 8 thru_hole roundrect (at 19.05 -1.524 90) (size 1.778 2.286) (drill 1.143) (layers *.Cu *.Mask) (roundrect_rratio 0.25)
      (net 5 "Net-(M2-Pad8)"))
    (pad 9 thru_hole roundrect (at 21.59 -1.524 90) (size 1.778 2.286) (drill 1.143) (layers *.Cu *.Mask) (roundrect_rratio 0.25)
      (net 42 LED_G))
    (pad 10 thru_hole roundrect (at 24.13 -1.524 90) (size 1.778 2.286) (drill 1.143) (layers *.Cu *.Mask) (roundrect_rratio 0.25)
      (net 6 "Net-(M2-Pad10)"))
    (pad 11 thru_hole roundrect (at 26.67 -1.524 90) (size 1.778 2.286) (drill 1.143) (layers *.Cu *.Mask) (roundrect_rratio 0.25)
      (net 23 /MOSI))
    (pad 12 thru_hole roundrect (at 29.21 -1.524 90) (size 1.778 2.286) (drill 1.143) (layers *.Cu *.Mask) (roundrect_rratio 0.25)
      (net 21 /MISO))
    (pad 13 thru_hole roundrect (at 31.75 -1.524 90) (size 1.778 2.286) (drill 1.143) (layers *.Cu *.Mask) (roundrect_rratio 0.25)
      (net 22 /SCK))
    (pad 14 thru_hole roundrect (at 31.75 -21.844 90) (size 1.778 2.286) (drill 1.143) (layers *.Cu *.Mask) (roundrect_rratio 0.25)
      (net 46 /PB1))
    (pad 15 thru_hole roundrect (at 29.21 -21.844 90) (size 1.778 2.286) (drill 1.143) (layers *.Cu *.Mask) (roundrect_rratio 0.25)
      (net 47 /PB3))
    (pad 16 thru_hole roundrect (at 26.67 -21.844 90) (size 1.778 2.286) (drill 1.143) (layers *.Cu *.Mask) (roundrect_rratio 0.25)
      (net 48 /PB2))
    (pad 17 thru_hole roundrect (at 24.13 -21.844 90) (size 1.778 2.286) (drill 1.143) (layers *.Cu *.Mask) (roundrect_rratio 0.25)
      (net 41 LED_R))
    (pad 18 thru_hole roundrect (at 21.59 -21.844 90) (size 1.778 2.286) (drill 1.143) (layers *.Cu *.Mask) (roundrect_rratio 0.25)
      (net 3 SDA))
    (pad 19 thru_hole roundrect (at 19.05 -21.844 90) (size 1.778 2.286) (drill 1.143) (layers *.Cu *.Mask) (roundrect_rratio 0.25)
      (net 4 SCL))
    (pad 20 thru_hole roundrect (at 16.51 -21.844 90) (size 1.778 2.286) (drill 1.143) (layers *.Cu *.Mask) (roundrect_rratio 0.25)
      (net 40 /SENSOR))
    (pad 21 thru_hole roundrect (at 13.97 -21.844 90) (size 1.778 2.286) (drill 1.143) (layers *.Cu *.Mask) (roundrect_rratio 0.25)
      (net 13 VBAT))
    (pad 22 thru_hole roundrect (at 11.43 -21.844 90) (size 1.778 2.286) (drill 1.143) (layers *.Cu *.Mask) (roundrect_rratio 0.25)
      (net 19 D0))
    (pad 23 thru_hole roundrect (at 8.89 -21.844 90) (size 1.778 2.286) (drill 1.143) (layers *.Cu *.Mask) (roundrect_rratio 0.25)
      (net 16 D1))
    (pad 24 thru_hole roundrect (at 6.35 -21.844 90) (size 1.778 2.286) (drill 1.143) (layers *.Cu *.Mask) (roundrect_rratio 0.25)
      (net 1 +3V3))
    (pad 25 thru_hole roundrect (at 3.81 -21.844 90) (size 1.778 2.286) (drill 1.143) (layers *.Cu *.Mask) (roundrect_rratio 0.25)
      (net 7 VBUS))
    (pad 26 thru_hole roundrect (at 1.27 -21.844 90) (size 1.778 2.286) (drill 1.143) (layers *.Cu *.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (model ${KISYS3DMOD}/Connector_PinSocket_2.54mm.3dshapes/PinSocket_1x13_P2.54mm_Vertical.wrl
      (offset (xyz 1.269999980926514 1.269999980926514 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 -90))
    )
    (model ${KISYS3DMOD}/Connector_PinSocket_2.54mm.3dshapes/PinSocket_1x13_P2.54mm_Vertical.wrl
      (offset (xyz 1.269999980926514 21.58999967575073 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 -90))
    )
  )
  (module Resistor_THT:R_Axial_DIN0207_L6.3mm_D2.5mm_P2.54mm_Vertical (layer F.Cu) (tedit 5AE5139B)
    (at 182.118 131.318)
    (descr "Resistor, Axial_DIN0207 series, Axial, Vertical, pin pitch=2.54mm, 0.25W = 1/4W, length*diameter=6.3*2.5mm^2, http://cdn-reichelt.de/documents/datenblatt/B400/1_4W%23YAG.pdf")
    (tags "Resistor Axial_DIN0207 series Axial Vertical pin pitch 2.54mm 0.25W = 1/4W length 6.3mm diameter 2.5mm")
    (fp_text reference R18 (at 1.524 -1.778) (layer F.SilkS))
    (fp_text value 1K (at 1.524 1.27) (layer F.SilkS))
    (fp_text user %R (at 2.54 0) (layer F.Fab) hide)
    (pad 2 thru_hole oval (at 2.54 0) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask)
      (net 18 "Net-(D4-PadC)"))
    (pad 1 thru_hole circle (at 0 0) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask)
      (net 2 GND))
    (model ${KISYS3DMOD}/Resistor_THT.3dshapes/R_Axial_DIN0207_L6.3mm_D2.5mm_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_THT:R_Axial_DIN0207_L6.3mm_D2.5mm_P2.54mm_Vertical (layer F.Cu) (tedit 5AE5139B)
    (at 174.498 131.064)
    (descr "Resistor, Axial_DIN0207 series, Axial, Vertical, pin pitch=2.54mm, 0.25W = 1/4W, length*diameter=6.3*2.5mm^2, http://cdn-reichelt.de/documents/datenblatt/B400/1_4W%23YAG.pdf")
    (tags "Resistor Axial_DIN0207 series Axial Vertical pin pitch 2.54mm 0.25W = 1/4W length 6.3mm diameter 2.5mm")
    (fp_text reference R17 (at 1.778 -1.524) (layer F.SilkS))
    (fp_text value 1K (at 1.524 1.27) (layer F.SilkS))
    (fp_text user %R (at 1.524 -1.778) (layer F.Fab) hide)
    (pad 2 thru_hole oval (at 2.54 0) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask)
      (net 17 "Net-(D3-PadC)"))
    (pad 1 thru_hole circle (at 0 0) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask)
      (net 2 GND))
    (model ${KISYS3DMOD}/Resistor_THT.3dshapes/R_Axial_DIN0207_L6.3mm_D2.5mm_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_THT:R_Axial_DIN0204_L3.6mm_D1.6mm_P2.54mm_Vertical (layer F.Cu) (tedit 5AE5139B)
    (at 108.204 98.806 180)
    (descr "Resistor, Axial_DIN0204 series, Axial, Vertical, pin pitch=2.54mm, 0.167W, length*diameter=3.6*1.6mm^2, http://cdn-reichelt.de/documents/datenblatt/B400/1_4W%23YAG.pdf")
    (tags "Resistor Axial_DIN0204 series Axial Vertical pin pitch 2.54mm 0.167W length 3.6mm diameter 1.6mm")
    (fp_text reference R12 (at 1.27 -1.524 180) (layer F.SilkS))
    (fp_text value 1K (at 1.27 -0.762 180) (layer F.SilkS))
    (fp_text user %R (at 1.27 1.778 180) (layer F.Fab) hide)
    (pad 2 thru_hole oval (at 2.54 0 180) (size 1.4 1.4) (drill 0.7) (layers *.Cu *.Mask)
      (net 8 "Net-(D1-PadC)"))
    (pad 1 thru_hole circle (at 0 0 180) (size 1.4 1.4) (drill 0.7) (layers *.Cu *.Mask)
      (net 10 "Net-(R12-Pad1)"))
    (model ${KISYS3DMOD}/Resistor_THT.3dshapes/R_Axial_DIN0204_L3.6mm_D1.6mm_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B36C52B)
    (at 114.3 92.456)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R13 (at 4.318 -0.254 180) (layer F.SilkS))
    (fp_text value R13 (at 0 -1.27 180) (layer F.SilkS))
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 2 GND))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 11 "Net-(R13-Pad1)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B36C52B)
    (at 111.506 90.17 180)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R10 (at 0.127 -1.778 180) (layer F.SilkS))
    (fp_text value 100K (at 0 -1.016 180) (layer F.SilkS))
    (pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 13 VBAT))
    (pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 9 +BATT))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B36C52B)
    (at 107.442 88.401 90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R11 (at 0.136 2.032 90) (layer F.SilkS))
    (fp_text value 100K (at 0.009 1.27 90) (layer F.SilkS))
    (fp_text user %R (at 2.54 0 90) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 2 GND))
    (pad 1 smd roundrect (at -1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 13 VBAT))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module TestPoint:TestPoint_THTPad_D1.0mm_Drill0.5mm (layer F.Cu) (tedit 5A0F774F)
    (at 156.21 115.57)
    (descr "THT pad as test Point, diameter 1.0mm, hole diameter 0.5mm")
    (tags "test point THT pad")
    (attr virtual)
    (fp_text reference TP7 (at -2.794 -1.016) (layer F.SilkS))
    (fp_text value /RST (at -2.794 0.254) (layer F.SilkS))
    (fp_text user %R (at -1.651 -0.762) (layer F.Fab) hide)
    (pad 1 thru_hole circle (at 0 0) (size 1 1) (drill 0.5) (layers *.Cu *.Mask)
      (net 44 "Net-(TP7-Pad1)"))
  )
  (module TestPoint:TestPoint_THTPad_D1.0mm_Drill0.5mm (layer F.Cu) (tedit 5A0F774F)
    (at 156.21 133.096)
    (descr "THT pad as test Point, diameter 1.0mm, hole diameter 0.5mm")
    (tags "test point THT pad")
    (attr virtual)
    (fp_text reference TP6 (at 0 -1.524) (layer F.SilkS))
    (fp_text value TST (at 0 1.778) (layer F.SilkS))
    (fp_text user %R (at 0 -1.45) (layer F.Fab))
    (pad 1 thru_hole circle (at 0 0) (size 1 1) (drill 0.5) (layers *.Cu *.Mask)
      (net 39 "Net-(D6-PadA)"))
  )
  (module TestPoint:TestPoint_THTPad_D1.0mm_Drill0.5mm (layer F.Cu) (tedit 5A0F774F)
    (at 144.373601 102.844601)
    (descr "THT pad as test Point, diameter 1.0mm, hole diameter 0.5mm")
    (tags "test point THT pad")
    (attr virtual)
    (fp_text reference TP3 (at -2.387601 -0.228601) (layer F.SilkS))
    (fp_text value LED (at -2.514601 0.533399) (layer F.SilkS))
    (fp_text user %R (at -2.387601 -0.228601) (layer F.Fab))
    (pad 1 thru_hole circle (at 0 0) (size 1 1) (drill 0.5) (layers *.Cu *.Mask)
      (net 42 LED_G))
  )
  (module TestPoint:TestPoint_THTPad_D1.0mm_Drill0.5mm (layer F.Cu) (tedit 5A0F774F)
    (at 171.5516 101.1428)
    (descr "THT pad as test Point, diameter 1.0mm, hole diameter 0.5mm")
    (tags "test point THT pad")
    (attr virtual)
    (fp_text reference TP2 (at 2.0574 -0.5588) (layer F.SilkS))
    (fp_text value SQW (at 2.0574 0.3302) (layer F.SilkS))
    (fp_text user %R (at 2.0574 -0.5588) (layer F.Fab))
    (pad 1 thru_hole circle (at 0 0) (size 1 1) (drill 0.5) (layers *.Cu *.Mask)
      (net 30 /IRQ))
  )
  (module TestPoint:TestPoint_THTPad_D1.0mm_Drill0.5mm (layer F.Cu) (tedit 5A0F774F)
    (at 156.21 107.188)
    (descr "THT pad as test Point, diameter 1.0mm, hole diameter 0.5mm")
    (tags "test point THT pad")
    (attr virtual)
    (fp_text reference TP1 (at -2.032 -0.381) (layer F.SilkS))
    (fp_text value 32kHZ (at -2.286 0.508) (layer F.SilkS))
    (fp_text user %R (at -2.032 -0.381) (layer F.Fab))
    (pad 1 thru_hole circle (at 0 0) (size 1 1) (drill 0.5) (layers *.Cu *.Mask)
      (net 49 "Net-(R25-Pad2)"))
  )
  (module Package_TO_SOT_SMD:SOT-353_SC-70-5_Handsoldering (layer F.Cu) (tedit 5E1D5E20)
    (at 122.7455 90.2335)
    (descr "SOT-353, SC-70-5, Handsoldering")
    (tags "SOT-353 SC-70-5 Handsoldering")
    (attr smd)
    (fp_text reference U3 (at 0 -2) (layer F.SilkS))
    (fp_text value 74AHC1G125 (at 0 2 180) (layer F.SilkS))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd rect (at -1.33 -0.65) (size 1.5 0.4) (layers F.Cu F.Paste F.Mask)
      (net 28 /~SD_CS))
    (pad 2 smd rect (at -1.33 0) (size 1.5 0.4) (layers F.Cu F.Paste F.Mask)
      (net 23 /MOSI))
    (pad 3 smd rect (at -1.33 0.65) (size 1.5 0.4) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad 4 smd rect (at 1.33 0.65) (size 1.5 0.4) (layers F.Cu F.Paste F.Mask)
      (net 37 /SD_MOSI))
    (pad 5 smd rect (at 1.33 -0.65) (size 1.5 0.4) (layers F.Cu F.Paste F.Mask)
      (net 1 +3V3))
    (model ${KISYS3DMOD}/Package_TO_SOT_SMD.3dshapes/SOT-353_SC-70-5.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_TO_SOT_SMD:SOT-353_SC-70-5_Handsoldering (layer F.Cu) (tedit 5E1D5CF9)
    (at 123.19 112.776)
    (descr "SOT-353, SC-70-5, Handsoldering")
    (tags "SOT-353 SC-70-5 Handsoldering")
    (attr smd)
    (fp_text reference U1 (at 0 -2) (layer F.SilkS))
    (fp_text value 74AHC1G125 (at -0.762 1.778 180) (layer F.SilkS))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd rect (at -1.33 -0.65) (size 1.5 0.4) (layers F.Cu F.Paste F.Mask)
      (net 28 /~SD_CS))
    (pad 2 smd rect (at -1.33 0) (size 1.5 0.4) (layers F.Cu F.Paste F.Mask)
      (net 36 /SD_MISO))
    (pad 3 smd rect (at -1.33 0.65) (size 1.5 0.4) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad 4 smd rect (at 1.33 0.65) (size 1.5 0.4) (layers F.Cu F.Paste F.Mask)
      (net 21 /MISO))
    (pad 5 smd rect (at 1.33 -0.65) (size 1.5 0.4) (layers F.Cu F.Paste F.Mask)
      (net 1 +3V3))
    (model ${KISYS3DMOD}/Package_TO_SOT_SMD.3dshapes/SOT-353_SC-70-5.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module STAND-OFF (layer F.Cu) (tedit 5CAB8B1C)
    (at 193.675 133.027501)
    (descr "STANDOFF (#4 SCREW)")
    (tags "STANDOFF (#4 SCREW)")
    (attr virtual)
    (fp_text reference H1 (at 0 -3.302) (layer F.SilkS) hide)
    (fp_text value STAND-OFF (at 0 3.429) (layer F.SilkS) hide)
    (pad "" np_thru_hole circle (at 0 0) (size 3.302 3.302) (drill 3.302) (layers *.Cu *.Mask)
      (solder_mask_margin 0.1016))
  )
  (module LED-1206 (layer B.Cu) (tedit 595FF932)
    (at 168.148 134.62)
    (descr "LED 1206 SMT")
    (tags "LED 1206 SMT")
    (attr smd)
    (fp_text reference D6 (at 0 1.27) (layer B.SilkS))
    (fp_text value Y (at 3.81 0) (layer B.SilkS))
    (pad A smd rect (at -1.4986 0) (size 1.19888 1.39954) (layers B.Cu B.Paste B.Mask)
      (net 39 "Net-(D6-PadA)") (solder_mask_margin 0.1016))
    (pad C smd rect (at 1.4986 0) (size 1.19888 1.39954) (layers B.Cu B.Paste B.Mask)
      (net 38 "Net-(D6-PadC)") (solder_mask_margin 0.1016))
    (model ${KISYS3DMOD}/LED_SMD.3dshapes/LED_1206_3216Metric_Castellated.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connectors:1X01 (layer F.Cu) (tedit 5963CE6C)
    (at 104.14 85.598 270)
    (descr "PLATED THROUGH HOLE")
    (tags "PLATED THROUGH HOLE")
    (attr virtual)
    (fp_text reference TP5 (at 1.651 1.524 180) (layer F.SilkS))
    (fp_text value VBATT (at -2.032 0 180) (layer F.SilkS))
    (pad 1 thru_hole circle (at 0 0 270) (size 1.8796 1.8796) (drill 1.016) (layers *.Cu *.Mask)
      (net 9 +BATT) (solder_mask_margin 0.1016))
  )
  (module Connectors:1X01 (layer F.Cu) (tedit 5963CE6C)
    (at 108.204 129.286)
    (descr "PLATED THROUGH HOLE")
    (tags "PLATED THROUGH HOLE")
    (attr virtual)
    (fp_text reference TP4 (at 0 -1.778) (layer F.SilkS))
    (fp_text value GND (at 0 1.905) (layer F.SilkS))
    (pad 1 thru_hole circle (at 0 0) (size 1.8796 1.8796) (drill 1.016) (layers *.Cu *.Mask)
      (net 2 GND) (solder_mask_margin 0.1016))
  )
  (module TFT:ILI9341_TFT_TOUCH (layer B.Cu) (tedit 5CE4E9A9)
    (at 196.088 83.312 180)
    (descr "Through hole straight pin header, 1x14, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x14 2.54mm single row")
    (fp_text reference M1B1 (at 85.217 -7.239 270) (layer B.SilkS))
    (fp_text value ILI9341_TOUCH (at 81.788 -50.8 180) (layer B.SilkS))
    (fp_text user %R (at 2 -25.01 90) (layer B.Fab))
    (fp_text user VCC (at 4.826 -8.509 180) (layer B.SilkS))
    (fp_text user GND (at 4.782286 -10.952818 180) (layer B.SilkS))
    (fp_text user ~CS (at 4.365 -13.175976 180) (layer B.SilkS))
    (fp_text user ~RESET (at 5.344714 -16.415134 180) (layer B.SilkS))
    (fp_text user D/~C (at 4.782286 -19.685 180) (layer B.SilkS))
    (fp_text user MOSI (at 4.873 -21.21811 180) (layer B.SilkS))
    (fp_text user SCK (at 4.746 -24.051928 180) (layer B.SilkS))
    (fp_text user LED (at 4.782286 -26.123746 180) (layer B.SilkS))
    (fp_text user MISO (at 4.953 -29.845 180) (layer B.SilkS))
    (fp_text user T_CLK (at 5.272143 -31.410382 180) (layer B.SilkS))
    (fp_text user ~T_CS (at 4.945571 -34.14154 180) (layer B.SilkS))
    (fp_text user T_DIN (at 5.163286 -36.594358 180) (layer B.SilkS))
    (fp_text user T_DO (at 4.981857 -39.047176 180) (layer B.SilkS))
    (fp_text user T_IRQ (at 5.163286 -41.5 180) (layer B.SilkS))
    (fp_text user SD_CS (at 84.963 -19.431 180) (layer B.SilkS))
    (fp_text user SD_MOSI (at 85.598 -22.055666 180) (layer B.SilkS))
    (fp_text user SD_MISO (at 85.598 -24.680332 180) (layer B.SilkS))
    (fp_text user SD_SCK (at 85.09 -26.67 180) (layer B.SilkS))
    (fp_text user VCC (at 4.770286 -8.479696) (layer F.SilkS))
    (fp_text user GND (at 4.842858 -11.059514) (layer F.SilkS))
    (fp_text user ~CS (at 4.425572 -13.282672) (layer F.SilkS))
    (fp_text user ~RESET (at 5.405286 -16.52183) (layer F.SilkS))
    (fp_text user D/~C (at 4.699 -19.685) (layer F.SilkS))
    (fp_text user MOSI (at 4.933572 -21.324806) (layer F.SilkS))
    (fp_text user T_DO (at 5.042429 -39.153872) (layer F.SilkS))
    (fp_text user T_CLK (at 5.332715 -31.517078) (layer F.SilkS))
    (fp_text user T_IRQ (at 5.223858 -41.606696) (layer F.SilkS))
    (fp_text user LED (at 4.842858 -26.230442) (layer F.SilkS))
    (fp_text user MISO (at 4.953 -29.845) (layer F.SilkS))
    (fp_text user SCK (at 4.806572 -24.158624) (layer F.SilkS))
    (fp_text user ~T_CS (at 5.006143 -34.248236) (layer F.SilkS))
    (fp_text user T_DIN (at 5.223858 -36.701054) (layer F.SilkS))
    (fp_text user SD_CS (at 84.963 -19.304) (layer F.SilkS))
    (fp_text user SD_MOSI (at 85.598 -21.928666) (layer F.SilkS))
    (fp_text user SD_MISO (at 85.598 -24.553332) (layer F.SilkS))
    (fp_text user SD_SCK (at 85.09 -26.67) (layer F.SilkS))
    (pad 1 thru_hole rect (at 2 -8.49 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 +3V3))
    (pad 2 thru_hole oval (at 2 -11.04 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 2 GND))
    (pad 3 thru_hole oval (at 2 -13.58 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 27 /~TFT_CS))
    (pad 4 thru_hole oval (at 2 -16.12 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 25 /~RESET))
    (pad 5 thru_hole oval (at 2 -18.66 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 26 /~TFT_DC))
    (pad 6 thru_hole oval (at 2 -21.2 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 23 /MOSI))
    (pad 7 thru_hole oval (at 2 -23.74 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 22 /SCK))
    (pad 8 thru_hole oval (at 2 -26.28 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 32 /TFT_LED))
    (pad 9 thru_hole oval (at 2 -28.82 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 21 /MISO))
    (pad 10 thru_hole oval (at 2 -31.36 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
    (pad 11 thru_hole oval (at 2 -33.9 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
    (pad 12 thru_hole oval (at 2 -36.44 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
    (pad 13 thru_hole oval (at 2 -38.98 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
    (pad 14 thru_hole oval (at 2 -41.52 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
    (pad "" np_thru_hole circle (at 6.92 -3 180) (size 5 5) (drill 3.5) (layers *.Cu *.Mask))
    (pad "" np_thru_hole circle (at 6.92 -47 180) (size 5 5) (drill 3.5) (layers *.Cu *.Mask))
    (pad "" np_thru_hole circle (at 83 -47 180) (size 5 5) (drill 3.5) (layers *.Cu *.Mask))
    (pad "" np_thru_hole circle (at 83 -3 180) (size 5 5) (drill 3.5) (layers *.Cu *.Mask))
    (pad 15 thru_hole rect (at 82 -19.49 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 28 /~SD_CS))
    (pad 16 thru_hole oval (at 82 -22.04 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 37 /SD_MOSI))
    (pad 17 thru_hole oval (at 82 -24.58 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 36 /SD_MISO))
    (pad 18 thru_hole oval (at 82 -27.12 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 22 /SCK))
    (model ${KISYS3DMOD}/Connector_PinSocket_2.54mm.3dshapes/PinSocket_1x14_P2.54mm_Vertical.step
      (offset (xyz 1.904999971389771 -8.635999870300294 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
    (model ${KISYS3DMOD}/Connector_PinSocket_2.54mm.3dshapes/PinSocket_1x04_P2.54mm_Vertical.wrl
      (offset (xyz 82.04199876785279 -19.68499970436096 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Jumpers:SMT-JUMPER_2_NO_SILK (layer F.Cu) (tedit 200000)
    (at 122.936 94.996)
    (attr smd)
    (fp_text reference JP3 (at 0 -1.524) (layer F.SilkS))
    (fp_text value "NO SI BUFF" (at 0 1.651) (layer F.SilkS))
    (pad 1 smd rect (at -0.4064 0) (size 0.635 1.27) (layers F.Cu F.Mask)
      (net 23 /MOSI) (solder_mask_margin 0.1016))
    (pad 2 smd rect (at 0.4064 0) (size 0.635 1.27) (layers F.Cu F.Mask)
      (net 37 /SD_MOSI) (solder_mask_margin 0.1016))
  )
  (module Package_SO:SOIC-8_3.9x4.9mm_P1.27mm (layer F.Cu) (tedit 5CE4D86F)
    (at 159.004 111.633)
    (descr "8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC] (see Microchip Packaging Specification http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf)")
    (tags "SOIC 1.27")
    (attr smd)
    (fp_text reference U4 (at -0.127 -3.175) (layer F.SilkS))
    (fp_text value DS3231MZ (at -0.127 3.048) (layer F.SilkS))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd rect (at -2.7 -1.905) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 49 "Net-(R25-Pad2)"))
    (pad 2 smd rect (at -2.7 -0.635) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 1 +3V3))
    (pad 3 smd rect (at -2.7 0.635) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 30 /IRQ))
    (pad 4 smd rect (at -2.7 1.905) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 44 "Net-(TP7-Pad1)"))
    (pad 5 smd rect (at 2.7 1.905) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad 6 smd rect (at 2.7 0.635) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 35 "Net-(BT1-Pad1)"))
    (pad 7 smd rect (at 2.7 -0.635) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 3 SDA))
    (pad 8 smd rect (at 2.7 -1.905) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 4 SCL))
    (model ${KISYS3DMOD}/Package_SO.3dshapes/SOIC-8_3.9x4.9mm_P1.27mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_Coaxial:SMA_Amphenol_132291-12_Vertical (layer F.Cu) (tedit 5B433F39)
    (at 149.86906 81.20647 270)
    (descr https://www.amphenolrf.com/downloads/dl/file/id/1688/product/3020/132291_12_customer_drawing.pdf)
    (tags "SMA THT Female Jack Vertical Bulkhead")
    (fp_text reference J5 (at 0 -4.75 270) (layer F.SilkS))
    (fp_text value SMA (at 0 5 270) (layer F.Fab))
    (fp_text user %R (at 0 0 270) (layer F.Fab))
    (pad 1 thru_hole circle (at 0 0 270) (size 2.05 2.05) (drill 1.5) (layers *.Cu *.Mask)
      (net 20 "Net-(J4-PadFEED)"))
    (pad 2 thru_hole circle (at 2.54 2.54 270) (size 2.25 2.25) (drill 1.7) (layers *.Cu *.Mask)
      (net 2 GND))
    (pad 2 thru_hole circle (at 2.54 -2.54 270) (size 2.25 2.25) (drill 1.7) (layers *.Cu *.Mask)
      (net 2 GND))
    (pad 2 thru_hole circle (at -2.54 -2.54 270) (size 2.25 2.25) (drill 1.7) (layers *.Cu *.Mask)
      (net 2 GND))
    (pad 2 thru_hole circle (at -2.54 2.54 270) (size 2.25 2.25) (drill 1.7) (layers *.Cu *.Mask)
      (net 2 GND))
    (model ${KISYS3DMOD}/Connector_Coaxial.3dshapes/SMA_Amphenol_132291-12_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module 1206 (layer F.Cu) (tedit 200000)
    (at 106.807 106.299)
    (descr "GENERIC 3216 (1206) PACKAGE")
    (tags "GENERIC 3216 (1206) PACKAGE")
    (attr smd)
    (fp_text reference F2 (at 0 -1.524) (layer F.SilkS))
    (fp_text value PPTC0.5A (at -0.889 1.905) (layer F.SilkS))
    (pad 1 smd rect (at -1.39954 0) (size 1.59766 1.79832) (layers F.Cu F.Paste F.Mask)
      (net 33 "Net-(F2-Pad1)") (solder_mask_margin 0.1016))
    (pad 2 smd rect (at 1.39954 0) (size 1.59766 1.79832) (layers F.Cu F.Paste F.Mask)
      (net 9 +BATT) (solder_mask_margin 0.1016))
    (model ${KISYS3DMOD}/Diode_SMD.3dshapes/D_1206_3216Metric.step
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Jumpers:SMT-JUMPER_2_NO_SILK (layer F.Cu) (tedit 200000)
    (at 169.926 88.9)
    (attr smd)
    (fp_text reference JP6 (at 0 -1.524) (layer F.SilkS))
    (fp_text value CARD_DET (at 0 1.651) (layer F.SilkS))
    (pad 1 smd rect (at -0.4064 0) (size 0.635 1.27) (layers F.Cu F.Mask)
      (net 31 /CD) (solder_mask_margin 0.1016))
    (pad 2 smd rect (at 0.4064 0) (size 0.635 1.27) (layers F.Cu F.Mask)
      (net 29 D2) (solder_mask_margin 0.1016))
  )
  (module Resistor_THT:R_Axial_DIN0204_L3.6mm_D1.6mm_P5.08mm_Horizontal (layer F.Cu) (tedit 5AE5139B)
    (at 177.292 89.916)
    (descr "Resistor, Axial_DIN0204 series, Axial, Horizontal, pin pitch=5.08mm, 0.167W, length*diameter=3.6*1.6mm^2, http://cdn-reichelt.de/documents/datenblatt/B400/1_4W%23YAG.pdf")
    (tags "Resistor Axial_DIN0204 series Axial Horizontal pin pitch 5.08mm 0.167W length 3.6mm diameter 1.6mm")
    (fp_text reference R22 (at 2.413 -1.524) (layer F.SilkS))
    (fp_text value 100K (at 2.54 0) (layer F.SilkS))
    (fp_text user %R (at 2.286 -1.524) (layer F.Fab))
    (pad 1 thru_hole circle (at 0 0) (size 1.4 1.4) (drill 0.7) (layers *.Cu *.Mask)
      (net 31 /CD))
    (pad 2 thru_hole oval (at 5.08 0) (size 1.4 1.4) (drill 0.7) (layers *.Cu *.Mask)
      (net 1 +3V3))
    (model ${KISYS3DMOD}/Resistor_THT.3dshapes/R_Axial_DIN0204_L3.6mm_D1.6mm_P5.08mm_Horizontal.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Jumpers:SMT-JUMPER_2_NO_SILK (layer F.Cu) (tedit 200000)
    (at 159.766 86.36)
    (attr smd)
    (fp_text reference JP5 (at 0 -1.524) (layer F.SilkS))
    (fp_text value IRQ (at 0.508 1.524) (layer F.SilkS))
    (pad 1 smd rect (at -0.4064 0) (size 0.635 1.27) (layers F.Cu F.Mask)
      (net 29 D2) (solder_mask_margin 0.1016))
    (pad 2 smd rect (at 0.4064 0) (size 0.635 1.27) (layers F.Cu F.Mask)
      (net 30 /IRQ) (solder_mask_margin 0.1016))
  )
  (module CAP-PTH-SMALL-KIT (layer F.Cu) (tedit 5CAC1CD5)
    (at 170.307 125.095 270)
    (descr CAP-PTH-SMALL-KIT)
    (tags CAP-PTH-SMALL-KIT)
    (attr virtual)
    (fp_text reference C8 (at 0.254 2.032 270) (layer F.SilkS))
    (fp_text value 0.1UF (at 2.032 -2.032 270) (layer F.SilkS))
    (pad 1 thru_hole circle (at -1.397 0 270) (size 2.032 2.032) (drill 1.016) (layers *.Cu *.Mask)
      (net 1 +3V3) (solder_mask_margin 0.1016))
    (pad 2 thru_hole circle (at 1.397 0 270) (size 2.032 2.032) (drill 1.016) (layers *.Cu *.Mask)
      (net 2 GND) (solder_mask_margin 0.1016))
    (model ${KISYS3DMOD}/Capacitor_THT.3dshapes/C_Disc_D3.0mm_W1.6mm_P2.50mm.wrl
      (offset (xyz -1.269999980926514 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module CPOL-RADIAL-2.5MM-6.5MM (layer F.Cu) (tedit 200000)
    (at 176.784 124.968 90)
    (descr "2.5 MM SPACED PTHS WITH 6.5 MM DIAMETER OUTLINE")
    (tags "2.5 MM SPACED PTHS WITH 6.5 MM DIAMETER OUTLINE")
    (attr virtual)
    (fp_text reference C9 (at 0 -3.81 90) (layer F.SilkS))
    (fp_text value 100UF (at 0.127 0.127 90) (layer F.SilkS))
    (pad 1 thru_hole rect (at 1.24968 0 90) (size 1.651 1.651) (drill 0.6985) (layers *.Cu *.Mask)
      (net 1 +3V3) (solder_mask_margin 0.1016))
    (pad 2 thru_hole circle (at -1.24968 0 90) (size 1.651 1.651) (drill 0.6985) (layers *.Cu *.Mask)
      (net 2 GND) (solder_mask_margin 0.1016))
    (model ${KISYS3DMOD}/Capacitor_THT.3dshapes/C_Radial_D6.3mm_H7.0mm_P2.50mm.wrl
      (offset (xyz -1.269999980926514 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module U.FL (layer F.Cu) (tedit 200000)
    (at 142.875 81.23187)
    (descr "U.FL SMD ANTENNA CONNECTOR")
    (tags "U.FL SMD ANTENNA CONNECTOR")
    (attr smd)
    (fp_text reference J4 (at 0 3.556) (layer F.SilkS))
    (fp_text value U.FL (at 0 2.54) (layer F.SilkS))
    (pad 1 smd rect (at 0 -1.37414) (size 2.19964 0.84836) (layers F.Cu F.Paste F.Mask)
      (net 2 GND) (solder_mask_margin 0.1016))
    (pad 2 smd rect (at 0 1.37414) (size 2.19964 0.84836) (layers F.Cu F.Paste F.Mask)
      (net 2 GND) (solder_mask_margin 0.1016))
    (pad FEED smd rect (at 1.524 0) (size 1.04902 0.99822) (layers F.Cu F.Paste F.Mask)
      (net 20 "Net-(J4-PadFEED)") (solder_mask_margin 0.1016))
    (pad NC smd rect (at -1.524 0) (size 1.04902 0.99822) (layers F.Cu F.Paste F.Mask)
      (solder_mask_margin 0.1016))
    (model ${KISYS3DMOD}/Connector_Coaxial.3dshapes/U.FL_Hirose_U.FL-R-SMT-1_Vertical.step
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module TACTILE_SWITCH_PTH_6.0MM (layer B.Cu) (tedit 5CE4E6A0)
    (at 162.141562 129.522326 180)
    (descr "MOMENTARY SWITCH (PUSHBUTTON) - SPST - PTH, 6.0MM SQUARE")
    (tags "MOMENTARY SWITCH (PUSHBUTTON) - SPST - PTH, 6.0MM SQUARE")
    (attr virtual)
    (fp_text reference S3 (at 0.0635 -3.81 180) (layer B.SilkS))
    (fp_text value "\"ENT\"" (at -0.037438 4.046326 180) (layer B.SilkS))
    (pad 4 thru_hole circle (at 3.2512 -2.2606 180) (size 1.8796 1.8796) (drill 1.016) (layers *.Cu *.Mask)
      (solder_mask_margin 0.1016))
    (pad 3 thru_hole circle (at -3.2512 -2.2606 180) (size 1.8796 1.8796) (drill 1.016) (layers *.Cu *.Mask)
      (net 2 GND) (solder_mask_margin 0.1016))
    (pad 2 thru_hole circle (at 3.2512 2.2606 180) (size 1.8796 1.8796) (drill 1.016) (layers *.Cu *.Mask)
      (solder_mask_margin 0.1016))
    (pad 1 thru_hole circle (at -3.2512 2.2606 180) (size 1.8796 1.8796) (drill 1.016) (layers *.Cu *.Mask)
      (net 47 /PB3) (solder_mask_margin 0.1016))
    (model ${KISYS3DMOD}/Button_Switch_THT.3dshapes/SW_PUSH_6mm_H7.3mm.step
      (offset (xyz -3.022599954605103 2.285999965667724 -0.6349999904632568))
      (scale (xyz 0.95 1.0001 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module CAP-PTH-SMALL-KIT (layer F.Cu) (tedit 5CAC25D3)
    (at 110.49 80.01 270)
    (descr CAP-PTH-SMALL-KIT)
    (tags CAP-PTH-SMALL-KIT)
    (attr virtual)
    (fp_text reference C6 (at 0 1.905 270) (layer F.SilkS))
    (fp_text value 0.1UF (at 0 -1.651 270) (layer F.SilkS))
    (pad 1 thru_hole circle (at -1.397 0 270) (size 2.032 2.032) (drill 1.016) (layers *.Cu *.Mask)
      (net 9 +BATT) (solder_mask_margin 0.1016))
    (pad 2 thru_hole circle (at 1.397 0 270) (size 2.032 2.032) (drill 1.016) (layers *.Cu *.Mask)
      (net 2 GND) (solder_mask_margin 0.1016))
    (model ${KISYS3DMOD}/Capacitor_THT.3dshapes/C_Disc_D5.0mm_W2.5mm_P2.50mm.step
      (offset (xyz -1.269999980926514 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module CPOL-RADIAL-2.5MM-6.5MM (layer F.Cu) (tedit 200000)
    (at 117.475 79.883 90)
    (descr "2.5 MM SPACED PTHS WITH 6.5 MM DIAMETER OUTLINE")
    (tags "2.5 MM SPACED PTHS WITH 6.5 MM DIAMETER OUTLINE")
    (attr virtual)
    (fp_text reference C7 (at 0 -3.81 90) (layer F.SilkS))
    (fp_text value 100UF (at 0 0 90) (layer F.SilkS))
    (pad 1 thru_hole rect (at 1.24968 0 90) (size 1.651 1.651) (drill 0.6985) (layers *.Cu *.Mask)
      (net 9 +BATT) (solder_mask_margin 0.1016))
    (pad 2 thru_hole circle (at -1.24968 0 90) (size 1.651 1.651) (drill 0.6985) (layers *.Cu *.Mask)
      (net 2 GND) (solder_mask_margin 0.1016))
    (model ${KISYS3DMOD}/Capacitor_THT.3dshapes/C_Radial_D6.3mm_H7.0mm_P2.50mm.wrl
      (offset (xyz -1.269999980926514 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module CPOL-RADIAL-2.5MM-6.5MM (layer F.Cu) (tedit 200000)
    (at 114.554 117.348 90)
    (descr "2.5 MM SPACED PTHS WITH 6.5 MM DIAMETER OUTLINE")
    (tags "2.5 MM SPACED PTHS WITH 6.5 MM DIAMETER OUTLINE")
    (attr virtual)
    (fp_text reference C5 (at 0 -3.81 90) (layer F.SilkS))
    (fp_text value 100UF (at 0 1.905 90) (layer F.SilkS))
    (pad 1 thru_hole rect (at 1.24968 0 90) (size 1.651 1.651) (drill 0.6985) (layers *.Cu *.Mask)
      (net 7 VBUS) (solder_mask_margin 0.1016))
    (pad 2 thru_hole circle (at -1.24968 0 90) (size 1.651 1.651) (drill 0.6985) (layers *.Cu *.Mask)
      (net 2 GND) (solder_mask_margin 0.1016))
    (model ${KISYS3DMOD}/Capacitor_THT.3dshapes/C_Radial_D6.3mm_H7.0mm_P2.50mm.wrl
      (offset (xyz -1.269999980926514 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module CAP-PTH-SMALL-KIT (layer F.Cu) (tedit 5CAC1D0B)
    (at 114.3 124.333 270)
    (descr CAP-PTH-SMALL-KIT)
    (tags CAP-PTH-SMALL-KIT)
    (attr virtual)
    (fp_text reference C4 (at 0 1.905 270) (layer F.SilkS))
    (fp_text value 0.1UF (at 0.254 -2.159 270) (layer F.SilkS))
    (pad 1 thru_hole circle (at -1.397 0 270) (size 2.032 2.032) (drill 1.016) (layers *.Cu *.Mask)
      (net 7 VBUS) (solder_mask_margin 0.1016))
    (pad 2 thru_hole circle (at 1.397 0 270) (size 2.032 2.032) (drill 1.016) (layers *.Cu *.Mask)
      (net 2 GND) (solder_mask_margin 0.1016))
    (model ${KISYS3DMOD}/Capacitor_THT.3dshapes/C_Disc_D3.0mm_W1.6mm_P2.50mm.step
      (offset (xyz -1.269999980926514 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module 1206 (layer F.Cu) (tedit 5CAB8C47)
    (at 107.442 117.094)
    (descr "GENERIC 3216 (1206) PACKAGE")
    (tags "GENERIC 3216 (1206) PACKAGE")
    (attr smd)
    (fp_text reference F1 (at -0.127 -1.651) (layer F.SilkS))
    (fp_text value PPTC0.5A (at 0.762 1.651) (layer F.SilkS))
    (pad 1 smd rect (at -1.39954 0) (size 1.59766 1.79832) (layers F.Cu F.Paste F.Mask)
      (net 43 /Vin) (solder_mask_margin 0.1016))
    (pad 2 smd rect (at 1.39954 0) (size 1.59766 1.79832) (layers F.Cu F.Paste F.Mask)
      (net 7 VBUS) (solder_mask_margin 0.1016))
    (model ${KISYS3DMOD}/Diode_SMD.3dshapes/D_1206_3216Metric.step
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module STAND-OFF (layer F.Cu) (tedit 5CAB8A5C)
    (at 193.675 80.01)
    (descr "STANDOFF (#4 SCREW)")
    (tags "STANDOFF (#4 SCREW)")
    (attr virtual)
    (fp_text reference H2 (at 0 -3.302) (layer F.SilkS) hide)
    (fp_text value STAND-OFF (at 0 3.429) (layer F.SilkS) hide)
    (pad "" np_thru_hole circle (at 0 0) (size 3.302 3.302) (drill 3.302) (layers *.Cu *.Mask)
      (solder_mask_margin 0.1016))
  )
  (module STAND-OFF (layer F.Cu) (tedit 5CAB8854)
    (at 104.709501 133.027501)
    (descr "STANDOFF (#4 SCREW)")
    (tags "STANDOFF (#4 SCREW)")
    (attr virtual)
    (fp_text reference H3 (at 0 -3.302) (layer F.SilkS) hide)
    (fp_text value STAND-OFF (at 0 3.429) (layer F.SilkS) hide)
    (pad "" np_thru_hole circle (at 0 0) (size 3.302 3.302) (drill 3.302) (layers *.Cu *.Mask)
      (solder_mask_margin 0.1016))
  )
  (module STAND-OFF (layer F.Cu) (tedit 5CAB8AB6)
    (at 104.709501 80.01)
    (descr "STANDOFF (#4 SCREW)")
    (tags "STANDOFF (#4 SCREW)")
    (attr virtual)
    (fp_text reference H4 (at 0 -3.302) (layer F.SilkS) hide)
    (fp_text value STAND-OFF (at 0 3.429) (layer F.SilkS) hide)
    (pad "" np_thru_hole circle (at 0 0) (size 3.302 3.302) (drill 3.302) (layers *.Cu *.Mask)
      (solder_mask_margin 0.1016))
  )
  (module TACTILE_SWITCH_PTH_6.0MM (layer F.Cu) (tedit 200000)
    (at 132.08 86.36 180)
    (descr "MOMENTARY SWITCH (PUSHBUTTON) - SPST - PTH, 6.0MM SQUARE")
    (tags "MOMENTARY SWITCH (PUSHBUTTON) - SPST - PTH, 6.0MM SQUARE")
    (attr virtual)
    (fp_text reference S4 (at 0 -3.683 180) (layer F.SilkS))
    (fp_text value "\"RESET\"" (at 0 3.81 180) (layer F.SilkS))
    (pad 1 thru_hole circle (at -3.2512 -2.2606 180) (size 1.8796 1.8796) (drill 1.016) (layers *.Cu *.Mask)
      (net 25 /~RESET) (solder_mask_margin 0.1016))
    (pad 2 thru_hole circle (at 3.2512 -2.2606 180) (size 1.8796 1.8796) (drill 1.016) (layers *.Cu *.Mask)
      (solder_mask_margin 0.1016))
    (pad 3 thru_hole circle (at -3.2512 2.2606 180) (size 1.8796 1.8796) (drill 1.016) (layers *.Cu *.Mask)
      (net 2 GND) (solder_mask_margin 0.1016))
    (pad 4 thru_hole circle (at 3.2512 2.2606 180) (size 1.8796 1.8796) (drill 1.016) (layers *.Cu *.Mask)
      (solder_mask_margin 0.1016))
    (model ${KISYS3DMOD}/Button_Switch_THT.3dshapes/SW_PUSH_6mm_H4.3mm.wrl
      (offset (xyz -3.174999952316284 2.260599966049194 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_THT:R_Axial_DIN0204_L3.6mm_D1.6mm_P5.08mm_Horizontal (layer F.Cu) (tedit 5CAB8E07)
    (at 166.37 120.396)
    (descr "Resistor, Axial_DIN0204 series, Axial, Horizontal, pin pitch=5.08mm, 0.167W, length*diameter=3.6*1.6mm^2, http://cdn-reichelt.de/documents/datenblatt/B400/1_4W%23YAG.pdf")
    (tags "Resistor Axial_DIN0204 series Axial Horizontal pin pitch 5.08mm 0.167W length 3.6mm diameter 1.6mm")
    (fp_text reference R1 (at -2.54 0) (layer F.SilkS))
    (fp_text value 10K (at 2.54 0) (layer F.SilkS))
    (fp_text user %R (at -2.54 0) (layer F.Fab) hide)
    (pad 2 thru_hole oval (at 5.08 0) (size 1.4 1.4) (drill 0.7) (layers *.Cu *.Mask)
      (net 4 SCL))
    (pad 1 thru_hole circle (at 0 0) (size 1.4 1.4) (drill 0.7) (layers *.Cu *.Mask)
      (net 1 +3V3))
    (model ${KISYS3DMOD}/Resistor_THT.3dshapes/R_Axial_DIN0204_L3.6mm_D1.6mm_P5.08mm_Horizontal.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_THT:R_Axial_DIN0204_L3.6mm_D1.6mm_P5.08mm_Horizontal (layer F.Cu) (tedit 5CAB8E32)
    (at 166.37 117.856)
    (descr "Resistor, Axial_DIN0204 series, Axial, Horizontal, pin pitch=5.08mm, 0.167W, length*diameter=3.6*1.6mm^2, http://cdn-reichelt.de/documents/datenblatt/B400/1_4W%23YAG.pdf")
    (tags "Resistor Axial_DIN0204 series Axial Horizontal pin pitch 5.08mm 0.167W length 3.6mm diameter 1.6mm")
    (fp_text reference R2 (at -2.54 0) (layer F.SilkS))
    (fp_text value 10K (at 2.54 0) (layer F.SilkS))
    (fp_text user %R (at -2.54 0.127) (layer F.Fab) hide)
    (pad 1 thru_hole circle (at 0 0) (size 1.4 1.4) (drill 0.7) (layers *.Cu *.Mask)
      (net 1 +3V3))
    (pad 2 thru_hole oval (at 5.08 0) (size 1.4 1.4) (drill 0.7) (layers *.Cu *.Mask)
      (net 3 SDA))
    (model ${KISYS3DMOD}/Resistor_THT.3dshapes/R_Axial_DIN0204_L3.6mm_D1.6mm_P5.08mm_Horizontal.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_THT:R_Axial_DIN0204_L3.6mm_D1.6mm_P5.08mm_Horizontal (layer F.Cu) (tedit 5CAB8A1A)
    (at 185.928 111.76)
    (descr "Resistor, Axial_DIN0204 series, Axial, Horizontal, pin pitch=5.08mm, 0.167W, length*diameter=3.6*1.6mm^2, http://cdn-reichelt.de/documents/datenblatt/B400/1_4W%23YAG.pdf")
    (tags "Resistor Axial_DIN0204 series Axial Horizontal pin pitch 5.08mm 0.167W length 3.6mm diameter 1.6mm")
    (fp_text reference R4 (at 2.54 1.651) (layer F.SilkS))
    (fp_text value 1K5 (at 2.54 0) (layer F.SilkS))
    (fp_text user %R (at 2.54 0) (layer F.Fab) hide)
    (pad 1 thru_hole circle (at 0 0) (size 1.4 1.4) (drill 0.7) (layers *.Cu *.Mask)
      (net 7 VBUS))
    (pad 2 thru_hole oval (at 5.08 0) (size 1.4 1.4) (drill 0.7) (layers *.Cu *.Mask)
      (net 15 "Net-(JP1-Pad2)"))
    (model ${KISYS3DMOD}/Resistor_THT.3dshapes/R_Axial_DIN0204_L3.6mm_D1.6mm_P5.08mm_Horizontal.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_THT:R_Axial_DIN0204_L3.6mm_D1.6mm_P5.08mm_Horizontal (layer F.Cu) (tedit 5CAB8E23)
    (at 166.37 115.316)
    (descr "Resistor, Axial_DIN0204 series, Axial, Horizontal, pin pitch=5.08mm, 0.167W, length*diameter=3.6*1.6mm^2, http://cdn-reichelt.de/documents/datenblatt/B400/1_4W%23YAG.pdf")
    (tags "Resistor Axial_DIN0204 series Axial Horizontal pin pitch 5.08mm 0.167W length 3.6mm diameter 1.6mm")
    (fp_text reference R5 (at -2.54 0) (layer F.SilkS))
    (fp_text value 10K (at 2.54 0) (layer F.SilkS))
    (fp_text user %R (at 2.54 0) (layer F.Fab))
    (pad 2 thru_hole oval (at 5.08 0) (size 1.4 1.4) (drill 0.7) (layers *.Cu *.Mask)
      (net 28 /~SD_CS))
    (pad 1 thru_hole circle (at 0 0) (size 1.4 1.4) (drill 0.7) (layers *.Cu *.Mask)
      (net 1 +3V3))
    (model ${KISYS3DMOD}/Resistor_THT.3dshapes/R_Axial_DIN0204_L3.6mm_D1.6mm_P5.08mm_Horizontal.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_THT:R_Axial_DIN0204_L3.6mm_D1.6mm_P5.08mm_Horizontal (layer F.Cu) (tedit 5CD9E78B)
    (at 178.181 110.363 90)
    (descr "Resistor, Axial_DIN0204 series, Axial, Horizontal, pin pitch=5.08mm, 0.167W, length*diameter=3.6*1.6mm^2, http://cdn-reichelt.de/documents/datenblatt/B400/1_4W%23YAG.pdf")
    (tags "Resistor Axial_DIN0204 series Axial Horizontal pin pitch 5.08mm 0.167W length 3.6mm diameter 1.6mm")
    (fp_text reference R6 (at 2.667 -1.651 90) (layer F.SilkS))
    (fp_text value 10K (at 2.54 -0.127 90) (layer F.SilkS))
    (fp_text user %R (at 2.54 0 90) (layer F.Fab) hide)
    (pad 2 thru_hole oval (at 5.08 0 90) (size 1.4 1.4) (drill 0.7) (layers *.Cu *.Mask)
      (net 26 /~TFT_DC))
    (pad 1 thru_hole circle (at 0 0 90) (size 1.4 1.4) (drill 0.7) (layers *.Cu *.Mask)
      (net 1 +3V3))
    (model ${KISYS3DMOD}/Resistor_THT.3dshapes/R_Axial_DIN0204_L3.6mm_D1.6mm_P5.08mm_Horizontal.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_THT:R_Axial_DIN0204_L3.6mm_D1.6mm_P5.08mm_Horizontal (layer F.Cu) (tedit 5CAB8A82)
    (at 160.517585 120.272315 180)
    (descr "Resistor, Axial_DIN0204 series, Axial, Horizontal, pin pitch=5.08mm, 0.167W, length*diameter=3.6*1.6mm^2, http://cdn-reichelt.de/documents/datenblatt/B400/1_4W%23YAG.pdf")
    (tags "Resistor Axial_DIN0204 series Axial Horizontal pin pitch 5.08mm 0.167W length 3.6mm diameter 1.6mm")
    (fp_text reference R7 (at 2.54 -1.92 180) (layer F.SilkS))
    (fp_text value 10K (at 2.580999 0.067999 180) (layer F.SilkS))
    (fp_text user %R (at 2.54 -1.901685 180) (layer F.Fab) hide)
    (pad 2 thru_hole oval (at 5.08 0 180) (size 1.4 1.4) (drill 0.7) (layers *.Cu *.Mask)
      (net 6 "Net-(M2-Pad10)"))
    (pad 1 thru_hole circle (at 0 0 180) (size 1.4 1.4) (drill 0.7) (layers *.Cu *.Mask)
      (net 1 +3V3))
    (model ${KISYS3DMOD}/Resistor_THT.3dshapes/R_Axial_DIN0204_L3.6mm_D1.6mm_P5.08mm_Horizontal.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_THT:R_Axial_DIN0204_L3.6mm_D1.6mm_P5.08mm_Horizontal (layer F.Cu) (tedit 5CAB8A9B)
    (at 160.517585 118.11 180)
    (descr "Resistor, Axial_DIN0204 series, Axial, Horizontal, pin pitch=5.08mm, 0.167W, length*diameter=3.6*1.6mm^2, http://cdn-reichelt.de/documents/datenblatt/B400/1_4W%23YAG.pdf")
    (tags "Resistor Axial_DIN0204 series Axial Horizontal pin pitch 5.08mm 0.167W length 3.6mm diameter 1.6mm")
    (fp_text reference R8 (at 2.148585 1.524 180) (layer F.SilkS))
    (fp_text value 10K (at 2.580999 -0.050001 180) (layer F.SilkS))
    (fp_text user %R (at 2.148585 1.651 180) (layer F.Fab) hide)
    (pad 1 thru_hole circle (at 0 0 180) (size 1.4 1.4) (drill 0.7) (layers *.Cu *.Mask)
      (net 1 +3V3))
    (pad 2 thru_hole oval (at 5.08 0 180) (size 1.4 1.4) (drill 0.7) (layers *.Cu *.Mask)
      (net 5 "Net-(M2-Pad8)"))
    (model ${KISYS3DMOD}/Resistor_THT.3dshapes/R_Axial_DIN0204_L3.6mm_D1.6mm_P5.08mm_Horizontal.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module 0805 (layer F.Cu) (tedit 5CAC1E4F)
    (at 104.394 88.773 90)
    (descr "GENERIC 2012 (0805) PACKAGE")
    (tags "GENERIC 2012 (0805) PACKAGE")
    (attr smd)
    (fp_text reference C1 (at 0 -1.27 90) (layer F.SilkS))
    (fp_text value 10UF (at 0 1.27 90) (layer F.SilkS))
    (pad 1 smd rect (at -0.89916 0 90) (size 0.79756 1.19888) (layers F.Cu F.Paste F.Mask)
      (net 7 VBUS) (solder_mask_margin 0.1016))
    (pad 2 smd rect (at 0.89916 0 90) (size 0.79756 1.19888) (layers F.Cu F.Paste F.Mask)
      (net 2 GND) (solder_mask_margin 0.1016))
    (model ${KISYS3DMOD}/Capacitor_Tantalum_SMD.3dshapes/CP_EIA-2012-12_Kemet-R.step
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module LED-1206 (layer B.Cu) (tedit 595FF932)
    (at 105.41 102.235 180)
    (descr "LED 1206 SMT")
    (tags "LED 1206 SMT")
    (attr smd)
    (fp_text reference D1 (at 0.127 1.397 180) (layer B.SilkS))
    (fp_text value "\"CHARGE\"" (at 0 -1.905 180) (layer B.SilkS))
    (pad A smd rect (at -1.4986 0 180) (size 1.19888 1.39954) (layers B.Cu B.Paste B.Mask)
      (net 7 VBUS) (solder_mask_margin 0.1016))
    (pad C smd rect (at 1.4986 0 180) (size 1.19888 1.39954) (layers B.Cu B.Paste B.Mask)
      (net 8 "Net-(D1-PadC)") (solder_mask_margin 0.1016))
    (model ${KISYS3DMOD}/LED_SMD.3dshapes/LED_1206_3216Metric_Castellated.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Silicon-Standard:SMA-DIODE (layer F.Cu) (tedit 5CAB886E)
    (at 104.648 94.35084 90)
    (descr DIODE)
    (tags DIODE)
    (attr smd)
    (fp_text reference D2 (at 0.11684 -2.54 90) (layer F.SilkS))
    (fp_text value MBRA140 (at 0.24384 -1.7145 90) (layer F.SilkS))
    (pad A smd rect (at -2.14884 0 270) (size 1.27 1.46812) (layers F.Cu F.Paste F.Mask)
      (net 9 +BATT) (solder_mask_margin 0.1016))
    (pad C smd rect (at 2.14884 0 90) (size 1.27 1.46812) (layers F.Cu F.Paste F.Mask)
      (net 7 VBUS) (solder_mask_margin 0.1016))
    (model ${KISYS3DMOD}/Diode_SMD.3dshapes/D_2010_5025Metric.step
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_TO_SOT_SMD:SOT-23-5 (layer F.Cu) (tedit 5CAC261C)
    (at 114.046 95.758)
    (descr "5-pin SOT23 package")
    (tags SOT-23-5)
    (attr smd)
    (fp_text reference U2 (at -2.794 -1.778) (layer F.SilkS))
    (fp_text value MCP73831 (at 0 2.9) (layer F.SilkS))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd rect (at -1.1 -0.95) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask)
      (net 10 "Net-(R12-Pad1)"))
    (pad 2 smd rect (at -1.1 0) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad 3 smd rect (at -1.1 0.95) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask)
      (net 9 +BATT))
    (pad 4 smd rect (at 1.1 0.95) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask)
      (net 7 VBUS))
    (pad 5 smd rect (at 1.1 -0.95) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask)
      (net 11 "Net-(R13-Pad1)"))
    (model ${KISYS3DMOD}/Package_TO_SOT_SMD.3dshapes/SOT-23-5.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module TACTILE_SWITCH_PTH_6.0MM (layer B.Cu) (tedit 5CE4E5D9)
    (at 136.487562 129.522326 180)
    (descr "MOMENTARY SWITCH (PUSHBUTTON) - SPST - PTH, 6.0MM SQUARE")
    (tags "MOMENTARY SWITCH (PUSHBUTTON) - SPST - PTH, 6.0MM SQUARE")
    (attr virtual)
    (fp_text reference S1 (at 0.127 -3.937 180) (layer B.SilkS))
    (fp_text value "\"+\"" (at -0.037438 4.046326 180) (layer B.SilkS))
    (pad 1 thru_hole circle (at -3.2512 2.2606 180) (size 1.8796 1.8796) (drill 1.016) (layers *.Cu *.Mask)
      (net 46 /PB1) (solder_mask_margin 0.1016))
    (pad 2 thru_hole circle (at 3.2512 2.2606 180) (size 1.8796 1.8796) (drill 1.016) (layers *.Cu *.Mask)
      (solder_mask_margin 0.1016))
    (pad 3 thru_hole circle (at -3.2512 -2.2606 180) (size 1.8796 1.8796) (drill 1.016) (layers *.Cu *.Mask)
      (net 2 GND) (solder_mask_margin 0.1016))
    (pad 4 thru_hole circle (at 3.2512 -2.2606 180) (size 1.8796 1.8796) (drill 1.016) (layers *.Cu *.Mask)
      (solder_mask_margin 0.1016))
    (model ${KISYS3DMOD}/Button_Switch_THT.3dshapes/SW_PUSH_6mm_H7.3mm.wrl
      (offset (xyz -2.920999956130982 2.285999965667724 0))
      (scale (xyz 0.95 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_JST:JST_PH_B2B-PH-K_1x02_P2.00mm_Vertical (layer B.Cu) (tedit 5CAB8825)
    (at 107.188 112.522 90)
    (descr "JST PH series connector, B2B-PH-K (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator")
    (tags "connector JST PH side entry")
    (fp_text reference J1 (at -1.778 -3.556 90) (layer B.SilkS))
    (fp_text value BATT (at 0.635 2.667 90) (layer B.SilkS))
    (fp_text user %R (at 1 -1.5 90) (layer B.Fab) hide)
    (pad 1 thru_hole roundrect (at 0 0 90) (size 1.2 1.75) (drill 0.75) (layers *.Cu *.Mask) (roundrect_rratio 0.208333)
      (net 2 GND))
    (pad 2 thru_hole oval (at 2 0 90) (size 1.2 1.75) (drill 0.75) (layers *.Cu *.Mask)
      (net 33 "Net-(F2-Pad1)"))
    (model ${KISYS3DMOD}/Connector_JST.3dshapes/JST_PH_B2B-PH-K_1x02_P2.00mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module USB-MICROB (layer F.Cu) (tedit 5CAB8C74)
    (at 103.378 122.936 180)
    (descr "USB TYPE MICROUSB CONNECTOR-NO BOSSED PINS")
    (tags "USB TYPE MICROUSB CONNECTOR-NO BOSSED PINS")
    (attr smd)
    (fp_text reference J3 (at -2.794 -4.064 180) (layer F.SilkS))
    (fp_text value "USB-B PWR" (at -4.180074 -0.025815 270) (layer F.SilkS))
    (pad D+ smd rect (at -2.64922 0) (size 1.39954 0.34798) (layers F.Cu F.Paste F.Mask)
      (solder_mask_margin 0.1016))
    (pad D- smd rect (at -2.64922 0.6477) (size 1.39954 0.34798) (layers F.Cu F.Paste F.Mask)
      (solder_mask_margin 0.1016))
    (pad GND smd rect (at -2.64922 -1.29794) (size 1.39954 0.34798) (layers F.Cu F.Paste F.Mask)
      (net 2 GND) (solder_mask_margin 0.1016))
    (pad ID smd rect (at -2.64922 -0.6477) (size 1.39954 0.34798) (layers F.Cu F.Paste F.Mask)
      (solder_mask_margin 0.1016))
    (pad MT1 smd rect (at 0 3.99796 270) (size 1.79832 1.89992) (layers F.Cu F.Paste F.Mask)
      (net 2 GND) (solder_mask_margin 0.1016))
    (pad MT2 smd rect (at 0 -3.99796 270) (size 1.79832 1.89992) (layers F.Cu F.Paste F.Mask)
      (net 2 GND) (solder_mask_margin 0.1016))
    (pad P$1 smd rect (at 0 1.27 270) (size 1.89992 1.89992) (layers F.Cu F.Paste F.Mask)
      (net 2 GND) (solder_mask_margin 0.1016))
    (pad P$2 smd rect (at 0 -1.27 270) (size 1.89992 1.89992) (layers F.Cu F.Paste F.Mask)
      (net 2 GND) (solder_mask_margin 0.1016))
    (pad VBUS smd rect (at -2.64922 1.29794) (size 1.39954 0.34798) (layers F.Cu F.Paste F.Mask)
      (net 43 /Vin) (solder_mask_margin 0.1016))
    (model ${KISYS3DMOD}/Connector_USB.3dshapes/USB_Micro-B_Molex_47346-0001.wrl
      (offset (xyz -1.269999980926514 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 -90))
    )
  )
  (module TO-92 (layer F.Cu) (tedit 5CAB8995)
    (at 188.214 109.22 90)
    (descr "TO-92 leads molded, narrow, drill 0.75mm (see NXP sot054_po.pdf)")
    (tags "to-92 sc-43 sc-43a sot54 PA33 transistor")
    (fp_text reference Q1 (at 1.27 -3.56 90) (layer F.SilkS))
    (fp_text value 2N3904 (at 4.318 -0.127) (layer F.SilkS))
    (fp_text user %R (at 1.27 -3.56 90) (layer F.Fab))
    (pad 2 thru_hole circle (at 1.27 -1.27 180) (size 1.3 1.3) (drill 0.75) (layers *.Cu *.Mask)
      (net 14 "Net-(Q1-Pad2)"))
    (pad 3 thru_hole circle (at 2.54 0 180) (size 1.3 1.3) (drill 0.75) (layers *.Cu *.Mask)
      (net 15 "Net-(JP1-Pad2)"))
    (pad 1 thru_hole rect (at 0 0 180) (size 1.3 1.3) (drill 0.75) (layers *.Cu *.Mask)
      (net 32 /TFT_LED))
    (model ${KISYS3DMOD}/Package_TO_SOT_THT.3dshapes/TO-92.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_THT:R_Axial_DIN0204_L3.6mm_D1.6mm_P5.08mm_Horizontal (layer F.Cu) (tedit 5CAC3A2F)
    (at 185.928 101.6)
    (descr "Resistor, Axial_DIN0204 series, Axial, Horizontal, pin pitch=5.08mm, 0.167W, length*diameter=3.6*1.6mm^2, http://cdn-reichelt.de/documents/datenblatt/B400/1_4W%23YAG.pdf")
    (tags "Resistor Axial_DIN0204 series Axial Horizontal pin pitch 5.08mm 0.167W length 3.6mm diameter 1.6mm")
    (fp_text reference R14 (at 2.413 1.651) (layer F.SilkS))
    (fp_text value 10K (at 2.54 0) (layer F.SilkS))
    (fp_text user %R (at 2.413 1.651) (layer F.Fab) hide)
    (pad 1 thru_hole circle (at 0 0) (size 1.4 1.4) (drill 0.7) (layers *.Cu *.Mask)
      (net 14 "Net-(Q1-Pad2)"))
    (pad 2 thru_hole oval (at 5.08 0) (size 1.4 1.4) (drill 0.7) (layers *.Cu *.Mask)
      (net 12 PWM))
    (model ${KISYS3DMOD}/Resistor_THT.3dshapes/R_Axial_DIN0204_L3.6mm_D1.6mm_P5.08mm_Horizontal.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_THT:R_Axial_DIN0204_L3.6mm_D1.6mm_P5.08mm_Horizontal (layer B.Cu) (tedit 5CAB8A3E)
    (at 185.166 83.312 90)
    (descr "Resistor, Axial_DIN0204 series, Axial, Horizontal, pin pitch=5.08mm, 0.167W, length*diameter=3.6*1.6mm^2, http://cdn-reichelt.de/documents/datenblatt/B400/1_4W%23YAG.pdf")
    (tags "Resistor Axial_DIN0204 series Axial Horizontal pin pitch 5.08mm 0.167W length 3.6mm diameter 1.6mm")
    (fp_text reference R15 (at 2.54 1.92 90) (layer B.SilkS))
    (fp_text value 100K (at 2.54 -0.127 90) (layer B.SilkS))
    (fp_text user %R (at 2.54 1.778 90) (layer B.Fab) hide)
    (pad 2 thru_hole oval (at 5.08 0 90) (size 1.4 1.4) (drill 0.7) (layers *.Cu *.Mask)
      (net 40 /SENSOR))
    (pad 1 thru_hole circle (at 0 0 90) (size 1.4 1.4) (drill 0.7) (layers *.Cu *.Mask)
      (net 1 +3V3))
    (model ${KISYS3DMOD}/Resistor_THT.3dshapes/R_Axial_DIN0204_L3.6mm_D1.6mm_P5.08mm_Horizontal.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module PHOTOCELL (layer B.Cu) (tedit 200000)
    (at 177.8 79.375 180)
    (descr "CDS PHOTOCOUNDUCTIVE PHOTOCELL (PTH)")
    (tags "CDS PHOTOCOUNDUCTIVE PHOTOCELL (PTH)")
    (attr virtual)
    (fp_text reference R16 (at 0 2.54 180) (layer B.SilkS))
    (fp_text value AMBIENT (at 0 -2.667 180) (layer B.SilkS))
    (pad 1 thru_hole circle (at -1.99898 0 180) (size 1.6764 1.6764) (drill 0.79756) (layers *.Cu *.Mask)
      (net 40 /SENSOR) (solder_mask_margin 0.1016))
    (pad 2 thru_hole circle (at 1.99898 0 180) (size 1.6764 1.6764) (drill 0.79756) (layers *.Cu *.Mask)
      (net 2 GND) (solder_mask_margin 0.1016))
    (model ${KISYS3DMOD}/OptoDevice.3dshapes/R_LDR_5.1x4.3mm_P3.4mm_Vertical.step
      (offset (xyz -1.904999971389771 0 0))
      (scale (xyz 1.14 1 0.6))
      (rotate (xyz 0 0 0))
    )
  )
  (module TACTILE_SWITCH_PTH_6.0MM (layer B.Cu) (tedit 5CE4E6C0)
    (at 149.441562 129.522326 180)
    (descr "MOMENTARY SWITCH (PUSHBUTTON) - SPST - PTH, 6.0MM SQUARE")
    (tags "MOMENTARY SWITCH (PUSHBUTTON) - SPST - PTH, 6.0MM SQUARE")
    (attr virtual)
    (fp_text reference S2 (at 0 -3.81 180) (layer B.SilkS))
    (fp_text value "\"-\"" (at -0.200723 3.919326 180) (layer B.SilkS))
    (pad 1 thru_hole circle (at -3.2512 2.2606 180) (size 1.8796 1.8796) (drill 1.016) (layers *.Cu *.Mask)
      (net 48 /PB2) (solder_mask_margin 0.1016))
    (pad 2 thru_hole circle (at 3.2512 2.2606 180) (size 1.8796 1.8796) (drill 1.016) (layers *.Cu *.Mask)
      (solder_mask_margin 0.1016))
    (pad 3 thru_hole circle (at -3.2512 -2.2606 180) (size 1.8796 1.8796) (drill 1.016) (layers *.Cu *.Mask)
      (net 2 GND) (solder_mask_margin 0.1016))
    (pad 4 thru_hole circle (at 3.2512 -2.2606 180) (size 1.8796 1.8796) (drill 1.016) (layers *.Cu *.Mask)
      (solder_mask_margin 0.1016))
    (model ${KISYS3DMOD}/Button_Switch_THT.3dshapes/SW_PUSH_6mm_H7.3mm.wrl
      (offset (xyz -3.047999954223633 1.904999971389771 0))
      (scale (xyz 0.95 0.9 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module 0805 (layer F.Cu) (tedit 5CAB88D2)
    (at 107.569 93.5355 270)
    (descr "GENERIC 2012 (0805) PACKAGE")
    (tags "GENERIC 2012 (0805) PACKAGE")
    (attr smd)
    (fp_text reference C2 (at 1.0795 -1.397 270) (layer F.SilkS))
    (fp_text value 1.0UF (at 0.0635 1.016 270) (layer F.SilkS))
    (pad 2 smd rect (at 0.89916 0 270) (size 0.79756 1.19888) (layers F.Cu F.Paste F.Mask)
      (net 2 GND) (solder_mask_margin 0.1016))
    (pad 1 smd rect (at -0.89916 0 270) (size 0.79756 1.19888) (layers F.Cu F.Paste F.Mask)
      (net 13 VBAT) (solder_mask_margin 0.1016))
    (model ${KISYS3DMOD}/Capacitor_Tantalum_SMD.3dshapes/CP_EIA-1608-08_AVX-J.step
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module 0805 (layer F.Cu) (tedit 5CD9E87E)
    (at 107.061 102.489 90)
    (descr "GENERIC 2012 (0805) PACKAGE")
    (tags "GENERIC 2012 (0805) PACKAGE")
    (attr smd)
    (fp_text reference C3 (at 0 -2.0066 90) (layer F.SilkS))
    (fp_text value 10UF (at -0.0635 -1.2446 90) (layer F.SilkS))
    (pad 1 smd rect (at -0.89916 0 90) (size 0.79756 1.19888) (layers F.Cu F.Paste F.Mask)
      (net 9 +BATT) (solder_mask_margin 0.1016))
    (pad 2 smd rect (at 0.89916 0 90) (size 0.79756 1.19888) (layers F.Cu F.Paste F.Mask)
      (net 2 GND) (solder_mask_margin 0.1016))
    (model ${KISYS3DMOD}/Capacitor_Tantalum_SMD.3dshapes/CP_EIA-2012-12_Kemet-R.step
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module LED-1206 (layer B.Cu) (tedit 595FF932)
    (at 175.514 134.493)
    (descr "LED 1206 SMT")
    (tags "LED 1206 SMT")
    (attr smd)
    (fp_text reference D3 (at 0 1.27) (layer B.SilkS))
    (fp_text value "R (A3)" (at 3.9116 0.127) (layer B.SilkS))
    (pad A smd rect (at -1.4986 0) (size 1.19888 1.39954) (layers B.Cu B.Paste B.Mask)
      (net 41 LED_R) (solder_mask_margin 0.1016))
    (pad C smd rect (at 1.4986 0) (size 1.19888 1.39954) (layers B.Cu B.Paste B.Mask)
      (net 17 "Net-(D3-PadC)") (solder_mask_margin 0.1016))
    (model ${KISYS3DMOD}/LED_SMD.3dshapes/LED_1206_3216Metric_Castellated.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module LED-1206 (layer B.Cu) (tedit 595FF932)
    (at 183.0324 134.493)
    (descr "LED 1206 SMT")
    (tags "LED 1206 SMT")
    (attr smd)
    (fp_text reference D4 (at 0 1.27) (layer B.SilkS))
    (fp_text value "G (D9)" (at 3.9116 -0.127) (layer B.SilkS))
    (pad C smd rect (at 1.4986 0) (size 1.19888 1.39954) (layers B.Cu B.Paste B.Mask)
      (net 18 "Net-(D4-PadC)") (solder_mask_margin 0.1016))
    (pad A smd rect (at -1.4986 0) (size 1.19888 1.39954) (layers B.Cu B.Paste B.Mask)
      (net 42 LED_G) (solder_mask_margin 0.1016))
    (model ${KISYS3DMOD}/LED_SMD.3dshapes/LED_1206_3216Metric_Castellated.step
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module LED-1206 (layer F.Cu) (tedit 595FF932)
    (at 188.722 80.01 90)
    (descr "LED 1206 SMT")
    (tags "LED 1206 SMT")
    (attr smd)
    (fp_text reference D5 (at 0 -1.27 180) (layer F.SilkS))
    (fp_text value "\"ACTY\" (D4)" (at 2.921 0 180) (layer F.SilkS))
    (pad A smd rect (at -1.4986 0 90) (size 1.19888 1.39954) (layers F.Cu F.Paste F.Mask)
      (net 24 "Net-(D5-PadA)") (solder_mask_margin 0.1016))
    (pad C smd rect (at 1.4986 0 90) (size 1.19888 1.39954) (layers F.Cu F.Paste F.Mask)
      (net 2 GND) (solder_mask_margin 0.1016))
    (model ${KISYS3DMOD}/LED_SMD.3dshapes/LED_1206_3216Metric_Castellated.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_PinHeader_2.54mm:PinHeader_1x04_P2.54mm_Vertical (layer F.Cu) (tedit 5CAB8831)
    (at 126.492 127 270)
    (descr "Through hole straight pin header, 1x04, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x04 2.54mm single row")
    (fp_text reference J6 (at -1.778 8.89 180) (layer F.SilkS))
    (fp_text value GPS/APRS (at -3.302 3.81) (layer F.SilkS))
    (fp_text user %R (at 0 3.81 180) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 +3V3))
    (pad 2 thru_hole oval (at 0 2.54 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 2 GND))
    (pad 3 thru_hole oval (at 0 5.08 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 16 D1))
    (pad 4 thru_hole oval (at 0 7.62 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 19 D0))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x04_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_PinHeader_2.54mm:PinHeader_1x04_P2.54mm_Vertical (layer F.Cu) (tedit 5CAB8DC1)
    (at 169.418 81.788 270)
    (descr "Through hole straight pin header, 1x04, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x04 2.54mm single row")
    (fp_text reference J7 (at 0 -2.33 270) (layer F.SilkS))
    (fp_text value DHT11 (at 3.175 3.81 180) (layer F.SilkS))
    (fp_text user %R (at 0 3.81) (layer F.Fab))
    (pad 4 thru_hole oval (at 0 7.62 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 2 GND))
    (pad 3 thru_hole oval (at 0 5.08 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
    (pad 2 thru_hole oval (at 0 2.54 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 29 D2))
    (pad 1 thru_hole rect (at 0 0 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 +3V3))
    (model ${KISYS3DMOD}/Connector_PinSocket_2.54mm.3dshapes/PinSocket_1x04_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
    (model ${KISYS3DMOD}/Sensor.3dshapes/Aosong_DHT11_5.5x12.0_P2.54mm.wrl
      (offset (xyz 0 0 8.254999876022339))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_PinHeader_2.54mm:PinHeader_1x04_P2.54mm_Vertical (layer F.Cu) (tedit 5CAB8E7F)
    (at 175.006 118.618 180)
    (descr "Through hole straight pin header, 1x04, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x04 2.54mm single row")
    (fp_text reference J8 (at 0 -2.33 180) (layer F.SilkS))
    (fp_text value I2C (at -2.667 3.429 90) (layer F.SilkS))
    (fp_text user %R (at 0 3.81 270) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 +3V3))
    (pad 2 thru_hole oval (at 0 2.54 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 2 GND))
    (pad 3 thru_hole oval (at 0 5.08 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 4 SCL))
    (pad 4 thru_hole oval (at 0 7.62 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 3 SDA))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x04_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_THT:R_Axial_DIN0204_L3.6mm_D1.6mm_P5.08mm_Horizontal (layer F.Cu) (tedit 5CAB89C7)
    (at 185.801 97.917)
    (descr "Resistor, Axial_DIN0204 series, Axial, Horizontal, pin pitch=5.08mm, 0.167W, length*diameter=3.6*1.6mm^2, http://cdn-reichelt.de/documents/datenblatt/B400/1_4W%23YAG.pdf")
    (tags "Resistor Axial_DIN0204 series Axial Horizontal pin pitch 5.08mm 0.167W length 3.6mm diameter 1.6mm")
    (fp_text reference R20 (at 2.54 -1.92) (layer F.SilkS))
    (fp_text value 100K (at 2.54 0) (layer F.SilkS))
    (fp_text user %R (at 2.54 -1.905) (layer F.Fab) hide)
    (pad 2 thru_hole oval (at 5.08 0) (size 1.4 1.4) (drill 0.7) (layers *.Cu *.Mask)
      (net 12 PWM))
    (pad 1 thru_hole circle (at 0 0) (size 1.4 1.4) (drill 0.7) (layers *.Cu *.Mask)
      (net 1 +3V3))
    (model ${KISYS3DMOD}/Resistor_THT.3dshapes/R_Axial_DIN0204_L3.6mm_D1.6mm_P5.08mm_Horizontal.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_THT:R_Axial_DIN0204_L3.6mm_D1.6mm_P5.08mm_Horizontal (layer F.Cu) (tedit 5CAB8DB4)
    (at 175.514 85.598 180)
    (descr "Resistor, Axial_DIN0204 series, Axial, Horizontal, pin pitch=5.08mm, 0.167W, length*diameter=3.6*1.6mm^2, http://cdn-reichelt.de/documents/datenblatt/B400/1_4W%23YAG.pdf")
    (tags "Resistor Axial_DIN0204 series Axial Horizontal pin pitch 5.08mm 0.167W length 3.6mm diameter 1.6mm")
    (fp_text reference R21 (at 2.54 -1.651 180) (layer F.SilkS))
    (fp_text value 4K7 (at 2.54 0 180) (layer F.SilkS))
    (fp_text user %R (at 2.54 -1.651 180) (layer F.Fab) hide)
    (pad 1 thru_hole circle (at 0 0 180) (size 1.4 1.4) (drill 0.7) (layers *.Cu *.Mask)
      (net 1 +3V3))
    (pad 2 thru_hole oval (at 5.08 0 180) (size 1.4 1.4) (drill 0.7) (layers *.Cu *.Mask)
      (net 29 D2))
    (model ${KISYS3DMOD}/Resistor_THT.3dshapes/R_Axial_DIN0204_L3.6mm_D1.6mm_P5.08mm_Horizontal.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Jumpers:SMT-JUMPER_2_NO_SILK (layer F.Cu) (tedit 200000)
    (at 123.444 116.078)
    (attr smd)
    (fp_text reference JP2 (at -2.032 -0.254) (layer F.SilkS))
    (fp_text value "NO SO BUFF" (at 0 1.651) (layer F.SilkS))
    (pad 1 smd rect (at -0.4064 0) (size 0.635 1.27) (layers F.Cu F.Mask)
      (net 36 /SD_MISO) (solder_mask_margin 0.1016))
    (pad 2 smd rect (at 0.4064 0) (size 0.635 1.27) (layers F.Cu F.Mask)
      (net 21 /MISO) (solder_mask_margin 0.1016))
  )
  (module Jumpers:SMT-JUMPER_2_NO_SILK (layer F.Cu) (tedit 200000)
    (at 186.5884 115.57)
    (attr smd)
    (fp_text reference JP1 (at 0 -1.524) (layer F.SilkS))
    (fp_text value "NO PWM" (at 0 1.651) (layer F.SilkS))
    (pad 1 smd rect (at -0.4064 0) (size 0.635 1.27) (layers F.Cu F.Mask)
      (net 32 /TFT_LED) (solder_mask_margin 0.1016))
    (pad 2 smd rect (at 0.4064 0) (size 0.635 1.27) (layers F.Cu F.Mask)
      (net 15 "Net-(JP1-Pad2)") (solder_mask_margin 0.1016))
  )
  (module Display:CR2013-MI2120 (layer B.Cu) (tedit 5CDB2270)
    (at 182.205465 92.749535 180)
    (descr "CR2013-MI2120 ILI9341 LCD Breakout http://pan.baidu.com/s/11Y990")
    (tags "CR2013-MI2120 ILI9341 LCD Breakout")
    (fp_text reference M1A1 (at 63.714465 2.579535 90) (layer B.SilkS))
    (fp_text value CR2013-MI2120 (at 60.793465 -31.075465 180) (layer B.SilkS))
    (fp_text user %R (at 31.58 -9.55 180) (layer B.Fab))
    (fp_text user 3V3 (at 2.213428 0 180) (layer B.SilkS))
    (fp_text user GND (at 2.322286 -2.435622 180) (layer B.SilkS))
    (fp_text user ~CS (at 1.905 -5.149584 180) (layer B.SilkS))
    (fp_text user ~RESET (at 2.884714 -7.863546 180) (layer B.SilkS))
    (fp_text user D/~C (at 2.322286 -10.577508 180) (layer B.SilkS))
    (fp_text user MOSI (at 2.54 -13.01313 180) (layer B.SilkS))
    (fp_text user SCK (at 2.286 -15.448752 180) (layer B.SilkS))
    (fp_text user LED (at 2.195286 -17.884374 180) (layer B.SilkS))
    (fp_text user MISO (at 2.54 -20.32 180) (layer B.SilkS))
    (fp_text user SD_CS (at 60.793465 -5.167465 180) (layer B.SilkS))
    (fp_text user MOSI (at 60.978143 -10.2235 180) (layer B.SilkS))
    (fp_text user MISO (at 60.978143 -7.58825 180) (layer B.SilkS))
    (fp_text user SCK (at 61.232143 -12.85875 180) (layer B.SilkS))
    (fp_text user FLASH_CS (at 59.599285 -15.494 180) (layer B.SilkS))
    (fp_text user SCK (at 2.185093 -15.498082) (layer F.SilkS))
    (fp_text user LED (at 2.094379 -17.933704) (layer F.SilkS))
    (fp_text user MISO (at 2.439093 -20.36933) (layer F.SilkS))
    (fp_text user GND (at 2.221379 -2.484952) (layer F.SilkS))
    (fp_text user ~CS (at 1.804093 -5.198914) (layer F.SilkS))
    (fp_text user D/~C (at 2.221379 -10.626838) (layer F.SilkS))
    (fp_text user ~RESET (at 2.783808 -7.912876) (layer F.SilkS))
    (fp_text user MOSI (at 2.439093 -13.06246) (layer F.SilkS))
    (fp_text user 3V3 (at 2.112522 -0.04933) (layer F.SilkS))
    (fp_text user SD_CS (at 60.793465 -5.167465) (layer F.SilkS))
    (fp_text user MOSI (at 60.868476 -10.184968) (layer F.SilkS))
    (fp_text user MISO (at 60.868476 -7.549718) (layer F.SilkS))
    (fp_text user SCK (at 61.122476 -12.820218) (layer F.SilkS))
    (fp_text user FLASH_CS (at 59.489618 -15.455468) (layer F.SilkS))
    (pad 1 thru_hole rect (at 0 0 180) (size 1.5 1.5) (drill 1) (layers *.Cu *.Mask)
      (net 1 +3V3))
    (pad 2 thru_hole circle (at 0 -2.54 180) (size 1.5 1.5) (drill 1) (layers *.Cu *.Mask)
      (net 2 GND))
    (pad 3 thru_hole circle (at 0 -5.08 180) (size 1.5 1.5) (drill 1) (layers *.Cu *.Mask)
      (net 27 /~TFT_CS))
    (pad 4 thru_hole circle (at 0 -7.62 180) (size 1.5 1.5) (drill 1) (layers *.Cu *.Mask)
      (net 25 /~RESET))
    (pad 5 thru_hole circle (at 0 -10.16 180) (size 1.5 1.5) (drill 1) (layers *.Cu *.Mask)
      (net 26 /~TFT_DC))
    (pad 6 thru_hole circle (at 0 -12.7 180) (size 1.5 1.5) (drill 1) (layers *.Cu *.Mask)
      (net 23 /MOSI))
    (pad 7 thru_hole circle (at 0 -15.24 180) (size 1.5 1.5) (drill 1) (layers *.Cu *.Mask)
      (net 22 /SCK))
    (pad 8 thru_hole circle (at 0 -17.78 180) (size 1.5 1.5) (drill 1) (layers *.Cu *.Mask)
      (net 32 /TFT_LED))
    (pad 9 thru_hole circle (at 0 -20.32 180) (size 1.5 1.5) (drill 1) (layers *.Cu *.Mask)
      (net 21 /MISO))
    (pad 10 thru_hole circle (at 63.52 -5.08 180) (size 1.5 1.5) (drill 1) (layers *.Cu *.Mask)
      (net 28 /~SD_CS))
    (pad 11 thru_hole circle (at 63.52 -7.62 180) (size 1.5 1.5) (drill 1) (layers *.Cu *.Mask)
      (net 37 /SD_MOSI))
    (pad 12 thru_hole circle (at 63.52 -10.16 180) (size 1.5 1.5) (drill 1) (layers *.Cu *.Mask)
      (net 36 /SD_MISO))
    (pad 13 thru_hole circle (at 63.52 -12.7 180) (size 1.5 1.5) (drill 1) (layers *.Cu *.Mask)
      (net 22 /SCK))
    (pad 14 thru_hole circle (at 63.52 -15.24 180) (size 1.5 1.5) (drill 1) (layers *.Cu *.Mask)
      (net 31 /CD))
    (pad "" thru_hole circle (at 1.5 6.89 180) (size 4 4) (drill 2.7) (layers *.Cu *.Mask))
    (pad "" thru_hole circle (at 62.7 6.89 180) (size 4 4) (drill 2.7) (layers *.Cu *.Mask))
    (pad "" thru_hole circle (at 62.7 -27.21 180) (size 4 4) (drill 2.7) (layers *.Cu *.Mask))
    (pad "" thru_hole circle (at 1.5 -27.21 180) (size 4 4) (drill 2.7) (layers *.Cu *.Mask))
    (model ${KISYS3DMOD}/Display.3dshapes/CR2013-MI2120.wrl
      (offset (xyz 0 0 6.857999897003174))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
    (model ${KISYS3DMOD}/Connector_PinSocket_2.54mm.3dshapes/PinSocket_1x09_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
    (model ${KISYS3DMOD}/Connector_PinSocket_2.54mm.3dshapes/PinSocket_1x05_P2.54mm_Vertical.wrl
      (offset (xyz 63.49999904632568 -5.079999923706055 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x05_P2.54mm_Vertical.step
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      (scale (xyz 1 1 1))
      (rotate (xyz 180 0 0))
    )
    (model ${KISYS3DMOD}/Connector_Card.3dshapes/microSD_HC_Hirose_DM3D-SF.wrl
      (offset (xyz 29.20999956130981 5.079999923706055 7.619999885559082))
      (scale (xyz 1 1 1))
      (rotate (xyz 180 0 180))
    )
  )
  (module 0805 (layer F.Cu) (tedit 200000)
    (at 180.71084 81.788)
    (descr "GENERIC 2012 (0805) PACKAGE")
    (tags "GENERIC 2012 (0805) PACKAGE")
    (attr smd)
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    (fp_text value 0.1UF (at 0 1.27) (layer F.SilkS))
    (pad 1 smd rect (at -0.89916 0) (size 0.79756 1.19888) (layers F.Cu F.Paste F.Mask)
      (net 40 /SENSOR) (solder_mask_margin 0.1016))
    (pad 2 smd rect (at 0.89916 0) (size 0.79756 1.19888) (layers F.Cu F.Paste F.Mask)
      (net 2 GND) (solder_mask_margin 0.1016))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
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      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_THT:R_Axial_DIN0207_L6.3mm_D2.5mm_P2.54mm_Vertical (layer F.Cu) (tedit 5AE5139B)
    (at 167.894 131.572)
    (descr "Resistor, Axial_DIN0207 series, Axial, Vertical, pin pitch=2.54mm, 0.25W = 1/4W, length*diameter=6.3*2.5mm^2, http://cdn-reichelt.de/documents/datenblatt/B400/1_4W%23YAG.pdf")
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    (fp_text user %R (at 1.27 -2.37) (layer F.Fab))
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      (net 2 GND))
    (pad 2 thru_hole oval (at 2.54 0) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask)
      (net 38 "Net-(D6-PadC)"))
    (model ${KISYS3DMOD}/Resistor_THT.3dshapes/R_Axial_DIN0207_L6.3mm_D2.5mm_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module LED-1206 (layer B.Cu) (tedit 595FF932)
    (at 105.8926 88.138 180)
    (descr "LED 1206 SMT")
    (tags "LED 1206 SMT")
    (attr smd)
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    (pad A smd rect (at -1.4986 0 180) (size 1.19888 1.39954) (layers B.Cu B.Paste B.Mask)
      (net 45 "Net-(D7-PadA)") (solder_mask_margin 0.1016))
    (model ${KISYS3DMOD}/LED_SMD.3dshapes/LED_1206_3216Metric_Castellated.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
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  (gr_text D2 (at 166.878 83.693) (layer F.SilkS))
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  (gr_text GND (at 172.72 116.332) (layer F.SilkS))
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  (gr_text RX0 (at 119.126 124.841) (layer F.SilkS))
  (gr_text TX1 (at 121.412 124.841) (layer F.SilkS))
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  (gr_text "10K = 100mA\n5K = 200mA\n2K = 500mA\n1K = 1000mA\n" (at 116.84 94.234) (layer F.SilkS))
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