(kicad_pcb (version 20171130) (host pcbnew "(5.0.1)-3")
  (general
    (thickness 1.6)
    (drawings 46)
    (tracks 622)
    (zones 0)
    (modules 48)
    (nets 51)
  )
  (page A4)
  (layers
    (0 F.Cu signal)
    (31 B.Cu signal)
    (32 B.Adhes user)
    (33 F.Adhes user)
    (34 B.Paste user)
    (35 F.Paste user)
    (36 B.SilkS user)
    (37 F.SilkS user)
    (38 B.Mask user hide)
    (39 F.Mask user hide)
    (40 Dwgs.User user)
    (41 Cmts.User user)
    (42 Eco1.User user)
    (43 Eco2.User user)
    (44 Edge.Cuts user)
    (45 Margin user)
    (46 B.CrtYd user)
    (47 F.CrtYd user)
    (48 B.Fab user)
    (49 F.Fab user)
  )
  (setup
    (last_trace_width 0.25)
    (trace_clearance 0.2)
    (zone_clearance 0.508)
    (zone_45_only no)
    (trace_min 0.16)
    (segment_width 0.15)
    (edge_width 0.15)
    (via_size 0.6)
    (via_drill 0.4)
    (via_min_size 0.4)
    (via_min_drill 0.3)
    (uvia_size 0.3)
    (uvia_drill 0.1)
    (uvias_allowed no)
    (uvia_min_size 0.2)
    (uvia_min_drill 0.1)
    (pcb_text_width 0.3)
    (pcb_text_size 1.1 1.1)
    (mod_edge_width 0.15)
    (mod_text_size 1 1)
    (mod_text_width 0.15)
    (pad_size 1.524 1.524)
    (pad_drill 1)
    (pad_to_mask_clearance 0.2)
    (solder_mask_min_width 0.25)
    (aux_axis_origin 0 0)
    (grid_origin 150.0017 31.97824)
    (visible_elements 7FFFFFFF)
    (pcbplotparams
      (layerselection 0x010f0_ffffffff)
      (usegerberextensions true)
      (usegerberattributes false)
      (usegerberadvancedattributes false)
      (creategerberjobfile false)
      (excludeedgelayer true)
      (linewidth 0.100000)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (padsonsilk false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 0)
      (scaleselection 1)
      (outputdirectory "gerbers/"))
  )
  (net 0 "")
  (net 1 +3V3)
  (net 2 GND)
  (net 3 "Net-(C4-Pad1)")
  (net 4 "Net-(C5-Pad1)")
  (net 5 "Net-(C7-Pad1)")
  (net 6 "Net-(C9-Pad1)")
  (net 7 "Net-(D1-Pad1)")
  (net 8 RAW)
  (net 9 "Net-(D2-Pad1)")
  (net 10 "Net-(D3-Pad2)")
  (net 11 "Net-(D6-Pad2)")
  (net 12 "Net-(D7-Pad2)")
  (net 13 USB5V)
  (net 14 "Net-(J1-Pad2)")
  (net 15 "Net-(J1-Pad3)")
  (net 16 "Net-(J1-Pad4)")
  (net 17 +5V)
  (net 18 /SDA)
  (net 19 /SCL)
  (net 20 /analog_sp_in)
  (net 21 /Sensor-V_supply)
  (net 22 /valve1)
  (net 23 /valve2)
  (net 24 /D+)
  (net 25 /D-)
  (net 26 /reset)
  (net 27 /analog_pv_out)
  (net 28 "Net-(R5-Pad1)")
  (net 29 /Sensor-V_out)
  (net 30 /addr0)
  (net 31 /addr1)
  (net 32 /Sensor-SS)
  (net 33 "Net-(U3-Pad8)")
  (net 34 /SCK)
  (net 35 /MOSI)
  (net 36 /MISO)
  (net 37 "Net-(U3-Pad12)")
  (net 38 "Net-(U3-Pad20)")
  (net 39 "Net-(U3-Pad21)")
  (net 40 "Net-(U3-Pad22)")
  (net 41 "Net-(U3-Pad25)")
  (net 42 "Net-(U3-Pad26)")
  (net 43 "Net-(U3-Pad28)")
  (net 44 "Net-(U3-Pad30)")
  (net 45 "Net-(U3-Pad31)")
  (net 46 "Net-(U3-Pad33)")
  (net 47 "Net-(U3-Pad42)")
  (net 48 "Net-(U3-Pad36)")
  (net 49 "Net-(U3-Pad37)")
  (net 50 "Net-(D4-Pad2)")
  (net_class Default "This is the default net class."
    (clearance 0.2)
    (trace_width 0.25)
    (via_dia 0.6)
    (via_drill 0.4)
    (uvia_dia 0.3)
    (uvia_drill 0.1)
    (add_net "Net-(D4-Pad2)")
    (add_net "Net-(D6-Pad2)")
    (add_net "Net-(D7-Pad2)")
    (add_net RAW)
  )
  (net_class thin ""
    (clearance 0.16)
    (trace_width 0.16)
    (via_dia 0.6)
    (via_drill 0.4)
    (uvia_dia 0.3)
    (uvia_drill 0.1)
    (add_net +3V3)
    (add_net +5V)
    (add_net /D+)
    (add_net /D-)
    (add_net /MISO)
    (add_net /MOSI)
    (add_net /SCK)
    (add_net /SCL)
    (add_net /SDA)
    (add_net /Sensor-SS)
    (add_net /Sensor-V_out)
    (add_net /Sensor-V_supply)
    (add_net /addr0)
    (add_net /addr1)
    (add_net /analog_pv_out)
    (add_net /analog_sp_in)
    (add_net /reset)
    (add_net /valve1)
    (add_net /valve2)
    (add_net GND)
    (add_net "Net-(C4-Pad1)")
    (add_net "Net-(C5-Pad1)")
    (add_net "Net-(C7-Pad1)")
    (add_net "Net-(C9-Pad1)")
    (add_net "Net-(D1-Pad1)")
    (add_net "Net-(D2-Pad1)")
    (add_net "Net-(D3-Pad2)")
    (add_net "Net-(J1-Pad2)")
    (add_net "Net-(J1-Pad3)")
    (add_net "Net-(J1-Pad4)")
    (add_net "Net-(R5-Pad1)")
    (add_net "Net-(U3-Pad12)")
    (add_net "Net-(U3-Pad20)")
    (add_net "Net-(U3-Pad21)")
    (add_net "Net-(U3-Pad22)")
    (add_net "Net-(U3-Pad25)")
    (add_net "Net-(U3-Pad26)")
    (add_net "Net-(U3-Pad28)")
    (add_net "Net-(U3-Pad30)")
    (add_net "Net-(U3-Pad31)")
    (add_net "Net-(U3-Pad33)")
    (add_net "Net-(U3-Pad36)")
    (add_net "Net-(U3-Pad37)")
    (add_net "Net-(U3-Pad42)")
    (add_net "Net-(U3-Pad8)")
    (add_net USB5V)
  )
  (module Jumper:SolderJumper-3_P1.3mm_Open_Pad1.0x1.5mm (layer F.Cu) (tedit 5A3F8BB2)
    (at 168.9227 27.06624 270)
    (descr "SMD Solder 3-pad Jumper, 1x1.5mm Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference J5 (at -3.216 0.252) (layer F.SilkS))
    (fp_text value GS3 (at 0 2 270) (layer F.Fab))
    (pad 3 smd rect (at 1.3 0 270) (size 1 1.5) (layers F.Cu F.Mask)
      (net 1 +3V3))
    (pad 2 smd rect (at 0 0 270) (size 1 1.5) (layers F.Cu F.Mask)
      (net 21 /Sensor-V_supply))
    (pad 1 smd rect (at -1.3 0 270) (size 1 1.5) (layers F.Cu F.Mask)
      (net 17 +5V))
  )
  (module pressure_regulators:hsc_dip_rn (layer F.Cu) (tedit 5BE33109)
    (at 177.8127 30.24124 90)
    (tags "Honeywell HSC SSC")
    (fp_text reference U4 (at 0 0.5 90) (layer F.SilkS) hide)
    (fp_text value XSC-Analog-DIP (at 0 -0.5 90) (layer F.Fab))
    (pad 1 thru_hole circle (at -6.65 -3.81 90) (size 1.524 1.524) (drill 1) (layers *.Cu *.Mask))
    (pad 2 thru_hole circle (at -6.65 -1.27 90) (size 1.524 1.524) (drill 1) (layers *.Cu *.Mask)
      (net 21 /Sensor-V_supply))
    (pad 3 thru_hole circle (at -6.65 1.27 90) (size 1.524 1.524) (drill 1) (layers *.Cu *.Mask)
      (net 28 "Net-(R5-Pad1)"))
    (pad 4 thru_hole circle (at -6.65 3.81 90) (size 1.524 1.524) (drill 1) (layers *.Cu *.Mask)
      (net 2 GND))
    (pad 5 thru_hole circle (at 6.65 3.81 90) (size 1.524 1.524) (drill 1) (layers *.Cu *.Mask))
    (pad 6 thru_hole circle (at 6.65 1.27 90) (size 1.524 1.524) (drill 1) (layers *.Cu *.Mask))
    (pad 7 thru_hole circle (at 6.65 -1.27 90) (size 1.524 1.524) (drill 1) (layers *.Cu *.Mask))
    (pad 8 thru_hole circle (at 6.65 -3.81 90) (size 1.524 1.524) (drill 1) (layers *.Cu *.Mask))
  )
  (module pressure_regulators:hsc_dip_rn (layer F.Cu) (tedit 5AF1EF6D)
    (at 177.8127 32.27324 90)
    (tags "Honeywell HSC SSC")
    (fp_text reference U5 (at 0 1 90) (layer F.SilkS) hide)
    (fp_text value XSC-SPI-DIP (at 0 -0.5 90) (layer F.Fab))
    (pad 1 thru_hole circle (at -6.65 -3.81 90) (size 1.524 1.524) (drill 1) (layers *.Cu *.Mask)
      (net 2 GND))
    (pad 2 thru_hole circle (at -6.65 -1.27 90) (size 1.524 1.524) (drill 1) (layers *.Cu *.Mask)
      (net 1 +3V3))
    (pad 3 thru_hole circle (at -6.65 1.27 90) (size 1.524 1.524) (drill 1) (layers *.Cu *.Mask)
      (net 36 /MISO))
    (pad 4 thru_hole circle (at -6.65 3.81 90) (size 1.524 1.524) (drill 1) (layers *.Cu *.Mask)
      (net 34 /SCK))
    (pad 5 thru_hole circle (at 6.65 3.81 90) (size 1.524 1.524) (drill 1) (layers *.Cu *.Mask)
      (net 32 /Sensor-SS))
    (pad 6 thru_hole circle (at 6.65 1.27 90) (size 1.524 1.524) (drill 1) (layers *.Cu *.Mask))
    (pad 7 thru_hole circle (at 6.65 -1.27 90) (size 1.524 1.524) (drill 1) (layers *.Cu *.Mask))
    (pad 8 thru_hole circle (at 6.65 -3.81 90) (size 1.524 1.524) (drill 1) (layers *.Cu *.Mask))
  )
  (module Mounting_Holes:MountingHole_3.2mm_M3 (layer F.Cu) (tedit 5AF1F35C)
    (at 152.9997 59.98624)
    (descr "Mounting Hole 3.2mm, no annular, M3")
    (tags "mounting hole 3.2mm no annular m3")
    (attr virtual)
    (fp_text reference REF*** (at 0 -4.2) (layer F.SilkS) hide)
    (fp_text value MountingHole_3.2mm_M3 (at 0 4.2) (layer F.Fab))
    (fp_text user %R (at 0.3 0) (layer F.Fab))
    (pad 1 np_thru_hole circle (at 0 0) (size 3.2 3.2) (drill 3.2) (layers *.Cu *.Mask))
  )
  (module Mounting_Holes:MountingHole_3.2mm_M3 (layer F.Cu) (tedit 5AF1F348)
    (at 187.9997 24.98624)
    (descr "Mounting Hole 3.2mm, no annular, M3")
    (tags "mounting hole 3.2mm no annular m3")
    (attr virtual)
    (fp_text reference REF** (at 0 -4.2) (layer F.SilkS) hide)
    (fp_text value MountingHole_3.2mm_M3 (at 0 4.2) (layer F.Fab))
    (fp_text user %R (at 0.3 0) (layer F.Fab))
    (pad 1 np_thru_hole circle (at 0 0) (size 3.2 3.2) (drill 3.2) (layers *.Cu *.Mask))
  )
  (module Fuse:Fuse_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 177.4337 41.50324)
    (descr "Fuse SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference F1 (at -2.921 0.127) (layer F.SilkS))
    (fp_text value Polyfuse (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 10 "Net-(D3-Pad2)"))
    (pad 2 smd roundrect (at 0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 13 USB5V))
    (model ${KISYS3DMOD}/Fuse.3dshapes/Fuse_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer B.Cu) (tedit 5B301BBE)
    (at 166.2557 37.48024 270)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C1 (at -2.581 -0.002 90) (layer B.SilkS))
    (fp_text value 0.1uF (at 0 -1.43 270) (layer B.Fab))
    (fp_text user %R (at 0 0 270) (layer B.Fab))
    (pad 2 smd roundrect (at 0.875 0 270) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (pad 1 smd roundrect (at -0.875 0 270) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 1 +3V3))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer B.Cu) (tedit 5B301BBE)
    (at 167.9067 37.48024 270)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C2 (at -2.581 -0.002 270) (layer B.SilkS))
    (fp_text value 1uF (at 0 -1.43 270) (layer B.Fab))
    (fp_text user %R (at 0 0 270) (layer B.Fab))
    (pad 1 smd roundrect (at -0.875 0 270) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 1 +3V3))
    (pad 2 smd roundrect (at 0.875 0 270) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer B.Cu) (tedit 5B36C52B)
    (at 169.8117 37.09924 270)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C3 (at -2.835 -0.002 270) (layer B.SilkS))
    (fp_text value 10uF (at 0 -1.65 270) (layer B.Fab))
    (fp_text user %R (at 0 0 270) (layer B.Fab))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 1 +3V3))
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 2 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer B.Cu) (tedit 5B301BBE)
    (at 162.9537 38.62324 180)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C4 (at 2.538 -0.086 180) (layer B.SilkS))
    (fp_text value 18pF (at 0 -1.43 180) (layer B.Fab))
    (fp_text user %R (at 0 0 180) (layer B.Fab))
    (pad 2 smd roundrect (at 0.875 0 180) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (pad 1 smd roundrect (at -0.875 0 180) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 3 "Net-(C4-Pad1)"))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer B.Cu) (tedit 5B301BBE)
    (at 160.9217 40.27424 180)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C5 (at 2.538 0.041 180) (layer B.SilkS))
    (fp_text value 18pF (at 0 -1.43 180) (layer B.Fab))
    (fp_text user %R (at 0 0 180) (layer B.Fab))
    (pad 1 smd roundrect (at -0.875 0 180) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 4 "Net-(C5-Pad1)"))
    (pad 2 smd roundrect (at 0.875 0 180) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer B.Cu) (tedit 5B301BBE)
    (at 176.5017 57.67824 90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C6 (at -2.621 0.17 90) (layer B.SilkS))
    (fp_text value 0.1uF (at 0 -1.43 90) (layer B.Fab))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 1 smd roundrect (at -0.875 0 90) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 13 USB5V))
    (pad 2 smd roundrect (at 0.875 0 90) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer B.Cu) (tedit 5B301BBE)
    (at 156.2387 42.43324)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C7 (at -2.554 0.086) (layer B.SilkS))
    (fp_text value 1uF (at 0 -1.43) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 1 smd roundrect (at -0.875 0) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 5 "Net-(C7-Pad1)"))
    (pad 2 smd roundrect (at 0.875 0) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer B.Cu) (tedit 5B301BBE)
    (at 172.6017 57.67824 270)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C8 (at 2.621 -0.006 270) (layer B.SilkS))
    (fp_text value 0.1uF (at 0 -1.43 270) (layer B.Fab))
    (fp_text user %R (at 0 0 270) (layer B.Fab))
    (pad 1 smd roundrect (at -0.875 0 270) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 8 RAW))
    (pad 2 smd roundrect (at 0.875 0 270) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer B.Cu) (tedit 5B301BBE)
    (at 164.2997 48.28624)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C9 (at -2.614 -0.052) (layer B.SilkS))
    (fp_text value 1uF (at 0 -1.43) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 2 smd roundrect (at 0.875 0) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (pad 1 smd roundrect (at -0.875 0) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 6 "Net-(C9-Pad1)"))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer B.Cu) (tedit 5B301BBE)
    (at 178.2017 57.67824 90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C10 (at -3.129 0.121 90) (layer B.SilkS))
    (fp_text value 1uF (at 0 -1.43 90) (layer B.Fab))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 2 smd roundrect (at 0.875 0 90) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (pad 1 smd roundrect (at -0.875 0 90) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 13 USB5V))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer B.Cu) (tedit 5B301BBE)
    (at 170.9017 57.67824 270)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C11 (at 3.129 -0.055 270) (layer B.SilkS))
    (fp_text value 1uF (at 0 -1.43 270) (layer B.Fab))
    (fp_text user %R (at 0 0 270) (layer B.Fab))
    (pad 2 smd roundrect (at 0.875 0 270) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (pad 1 smd roundrect (at -0.875 0 270) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 8 RAW))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer B.Cu) (tedit 5B36C52B)
    (at 174.6017 57.89524 90)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C12 (at -3.166 0.038 90) (layer B.SilkS))
    (fp_text value 10uF (at 0 -1.65 90) (layer B.Fab))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 2 smd roundrect (at 1.025 0 90) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 2 GND))
    (pad 1 smd roundrect (at -1.025 0 90) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 13 USB5V))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer B.Cu) (tedit 5B36C52B)
    (at 169.0017 57.89524 270)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C13 (at 3.166 -0.05 90) (layer B.SilkS))
    (fp_text value 10uF (at 0 -1.65 270) (layer B.Fab))
    (fp_text user %R (at 0 0 270) (layer B.Fab))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 8 RAW))
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 2 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_PinHeader_2.54mm:PinHeader_2x03_P2.54mm_Vertical (layer F.Cu) (tedit 5BE32981)
    (at 157.4997 50.98624 270)
    (descr "Through hole straight pin header, 2x03, 2.54mm pitch, double rows")
    (tags "Through hole pin header THT 2x03 2.54mm double row")
    (fp_text reference CON1 (at 1.27 -2.33 270) (layer F.SilkS) hide)
    (fp_text value AVR-ISP-6 (at 1.27 7.41 270) (layer F.Fab))
    (fp_text user %R (at 1.27 2.54) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 36 /MISO))
    (pad 2 thru_hole oval (at 2.54 0 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 +3V3))
    (pad 3 thru_hole oval (at 0 2.54 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 34 /SCK))
    (pad 4 thru_hole oval (at 2.54 2.54 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 35 /MOSI))
    (pad 5 thru_hole oval (at 0 5.08 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 26 /reset))
    (pad 6 thru_hole oval (at 2.54 5.08 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 2 GND))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_2x03_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Diode_SMD:D_SOD-323_HandSoldering (layer F.Cu) (tedit 58641869)
    (at 177.6857 45.35424 180)
    (descr SOD-323)
    (tags SOD-323)
    (attr smd)
    (fp_text reference D1 (at 3.084 -0.024 180) (layer F.SilkS))
    (fp_text value D (at 0.1 1.9 180) (layer F.Fab))
    (fp_text user %R (at 0 -1.85 180) (layer F.Fab))
    (pad 1 smd rect (at -1.25 0 180) (size 1 1) (layers F.Cu F.Paste F.Mask)
      (net 7 "Net-(D1-Pad1)"))
    (pad 2 smd rect (at 1.25 0 180) (size 1 1) (layers F.Cu F.Paste F.Mask)
      (net 8 RAW))
    (model ${KISYS3DMOD}/Diode_SMD.3dshapes/D_SOD-323.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Diode_SMD:D_SOD-323_HandSoldering (layer F.Cu) (tedit 58641869)
    (at 177.6857 47.38624 180)
    (descr SOD-323)
    (tags SOD-323)
    (attr smd)
    (fp_text reference D2 (at 3.034 0.408 180) (layer F.SilkS))
    (fp_text value D (at 0.1 1.9 180) (layer F.Fab))
    (fp_text user %R (at 0 -1.85 180) (layer F.Fab))
    (pad 2 smd rect (at 1.25 0 180) (size 1 1) (layers F.Cu F.Paste F.Mask)
      (net 8 RAW))
    (pad 1 smd rect (at -1.25 0 180) (size 1 1) (layers F.Cu F.Paste F.Mask)
      (net 9 "Net-(D2-Pad1)"))
    (model ${KISYS3DMOD}/Diode_SMD.3dshapes/D_SOD-323.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Diode_SMD:D_SOD-323_HandSoldering (layer F.Cu) (tedit 58641869)
    (at 177.6857 43.32224 180)
    (descr SOD-323)
    (tags SOD-323)
    (attr smd)
    (fp_text reference D3 (at 3.084 -0.056 180) (layer F.SilkS))
    (fp_text value D (at 0.1 1.9 180) (layer F.Fab))
    (fp_text user %R (at 0 -1.85 180) (layer F.Fab))
    (pad 1 smd rect (at -1.25 0 180) (size 1 1) (layers F.Cu F.Paste F.Mask)
      (net 7 "Net-(D1-Pad1)"))
    (pad 2 smd rect (at 1.25 0 180) (size 1 1) (layers F.Cu F.Paste F.Mask)
      (net 10 "Net-(D3-Pad2)"))
    (model ${KISYS3DMOD}/Diode_SMD.3dshapes/D_SOD-323.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module LED_SMD:LED_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5BE3274E)
    (at 160.3027 33.50224 180)
    (descr "LED SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "LED handsolder")
    (attr smd)
    (fp_text reference D4 (at 0 -1.43 180) (layer F.SilkS) hide)
    (fp_text value LED (at 0 1.43 180) (layer F.Fab))
    (fp_text user %R (at 0 0 180) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (pad 2 smd roundrect (at 0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 50 "Net-(D4-Pad2)"))
    (model ${KISYS3DMOD}/LED_SMD.3dshapes/LED_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Diode_SMD:D_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B4B45C8)
    (at 152.9207 39.63924 180)
    (descr "Diode SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "diode handsolder")
    (attr smd)
    (fp_text reference D5 (at 0 -1.43 180) (layer F.SilkS))
    (fp_text value 1N4148 (at 0 1.43 180) (layer F.Fab))
    (fp_text user %R (at 0 0 180) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 +3V3))
    (pad 2 smd roundrect (at 0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 26 /reset))
    (model ${KISYS3DMOD}/Diode_SMD.3dshapes/D_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Diode_SMD:D_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer B.Cu) (tedit 5B4B45C8)
    (at 183.0197 46.37024 90)
    (descr "Diode SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "diode handsolder")
    (attr smd)
    (fp_text reference D6 (at -2.626 0.129 90) (layer B.SilkS))
    (fp_text value D_Schottky (at 0 -1.43 90) (layer B.Fab))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 2 smd roundrect (at 0.875 0 90) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 11 "Net-(D6-Pad2)"))
    (pad 1 smd roundrect (at -0.875 0 90) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 8 RAW))
    (model ${KISYS3DMOD}/Diode_SMD.3dshapes/D_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Diode_SMD:D_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer B.Cu) (tedit 5B4B45C8)
    (at 180.4797 46.37024 90)
    (descr "Diode SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "diode handsolder")
    (attr smd)
    (fp_text reference D7 (at -2.626 0.129 90) (layer B.SilkS))
    (fp_text value D_Schottky (at 0 -1.43 90) (layer B.Fab))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 1 smd roundrect (at -0.875 0 90) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 8 RAW))
    (pad 2 smd roundrect (at 0.875 0 90) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 12 "Net-(D7-Pad2)"))
    (model ${KISYS3DMOD}/Diode_SMD.3dshapes/D_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_PinSocket_2.54mm:PinSocket_2x04_P2.54mm_Horizontal (layer F.Cu) (tedit 5A19A432)
    (at 169.8117 50.68824 90)
    (descr "Through hole angled socket strip, 2x04, 2.54mm pitch, 8.51mm socket length, double cols (from Kicad 4.0.7), script generated")
    (tags "Through hole angled socket strip THT 2x04 2.54mm double row")
    (fp_text reference J3 (at -7.452 7.622 90) (layer F.SilkS))
    (fp_text value CONN_02X04 (at -5.65 10.39 90) (layer F.Fab))
    (fp_text user %R (at -8.315 3.81 180) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 19 /SCL))
    (pad 2 thru_hole oval (at -2.54 0 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 19 /SCL))
    (pad 3 thru_hole oval (at 0 2.54 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 18 /SDA))
    (pad 4 thru_hole oval (at -2.54 2.54 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 18 /SDA))
    (pad 5 thru_hole oval (at 0 5.08 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 8 RAW))
    (pad 6 thru_hole oval (at -2.54 5.08 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 8 RAW))
    (pad 7 thru_hole oval (at 0 7.62 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 2 GND))
    (pad 8 thru_hole oval (at -2.54 7.62 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 2 GND))
    (model ${KISYS3DMOD}/Connector_PinSocket_2.54mm.3dshapes/PinSocket_2x04_P2.54mm_Horizontal.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_PinSocket_2.54mm:PinSocket_1x02_P2.54mm_Horizontal (layer F.Cu) (tedit 5A19A41B)
    (at 161.8107 53.22824 90)
    (descr "Through hole angled socket strip, 1x02, 2.54mm pitch, 8.51mm socket length, single row (from Kicad 4.0.7), script generated")
    (tags "Through hole angled socket strip THT 1x02 2.54mm single row")
    (fp_text reference J4 (at -4.658 2.415 90) (layer F.SilkS))
    (fp_text value CONN_01X02 (at -4.38 5.31 90) (layer F.Fab))
    (fp_text user %R (at -5.775 1.27 90) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 20 /analog_sp_in))
    (pad 2 thru_hole oval (at 0 2.54 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 6 "Net-(C9-Pad1)"))
    (model ${KISYS3DMOD}/Connector_PinSocket_2.54mm.3dshapes/PinSocket_1x02_P2.54mm_Horizontal.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_PinHeader_2.54mm:PinHeader_2x01_P2.54mm_Vertical (layer B.Cu) (tedit 59FED5CC)
    (at 188.8637 35.78824 180)
    (descr "Through hole straight pin header, 2x01, 2.54mm pitch, double rows")
    (tags "Through hole pin header THT 2x01 2.54mm double row")
    (fp_text reference J6 (at 1.27 2.33 180) (layer B.SilkS))
    (fp_text value CONN_01X02 (at 1.27 -2.33 180) (layer B.Fab))
    (fp_text user %R (at 1.27 0 90) (layer B.Fab))
    (pad 1 thru_hole rect (at 0 0 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 8 RAW))
    (pad 2 thru_hole oval (at 2.54 0 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 11 "Net-(D6-Pad2)"))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_2x01_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_PinHeader_2.54mm:PinHeader_2x01_P2.54mm_Vertical (layer B.Cu) (tedit 59FED5CC)
    (at 188.8637 30.20024 180)
    (descr "Through hole straight pin header, 2x01, 2.54mm pitch, double rows")
    (tags "Through hole pin header THT 2x01 2.54mm double row")
    (fp_text reference J7 (at 1.27 2.33 180) (layer B.SilkS))
    (fp_text value CONN_01X02 (at 1.27 -2.33 180) (layer B.Fab))
    (fp_text user %R (at 1.27 0 90) (layer B.Fab))
    (pad 2 thru_hole oval (at 2.54 0 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 12 "Net-(D7-Pad2)"))
    (pad 1 thru_hole rect (at 0 0 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 8 RAW))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_2x01_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_SO:SOIC-8_3.9x4.9mm_P1.27mm (layer B.Cu) (tedit 5A02F2D3)
    (at 174.6377 45.60824)
    (descr "8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC] (see Microchip Packaging Specification 00000049BS.pdf)")
    (tags "SOIC 1.27")
    (attr smd)
    (fp_text reference Q1 (at 0.129 -1.438) (layer B.SilkS))
    (fp_text value DMN6070SSD (at 0 -3.5) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 1 smd rect (at -2.7 1.905) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (pad 2 smd rect (at -2.7 0.635) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
      (net 22 /valve1))
    (pad 3 smd rect (at -2.7 -0.635) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (pad 4 smd rect (at -2.7 -1.905) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
      (net 23 /valve2))
    (pad 5 smd rect (at 2.7 -1.905) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
      (net 12 "Net-(D7-Pad2)"))
    (pad 6 smd rect (at 2.7 -0.635) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
      (net 12 "Net-(D7-Pad2)"))
    (pad 7 smd rect (at 2.7 0.635) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
      (net 11 "Net-(D6-Pad2)"))
    (pad 8 smd rect (at 2.7 1.905) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
      (net 11 "Net-(D6-Pad2)"))
    (model ${KISYS3DMOD}/Package_SO.3dshapes/SOIC-8_3.9x4.9mm_P1.27mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer B.Cu) (tedit 5B301BBD)
    (at 156.2227 45.73524)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R1 (at -2.538 0.086) (layer B.SilkS))
    (fp_text value 22 (at 0 -1.43) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 2 smd roundrect (at 0.875 0) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 15 "Net-(J1-Pad3)"))
    (pad 1 smd roundrect (at -0.875 0) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 24 /D+))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer B.Cu) (tedit 5B301BBD)
    (at 156.2227 44.08424)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R2 (at -2.538 0.086) (layer B.SilkS))
    (fp_text value 22 (at 0 -1.43) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 1 smd roundrect (at -0.875 0) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 25 /D-))
    (pad 2 smd roundrect (at 0.875 0) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 14 "Net-(J1-Pad2)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 152.9367 37.82024)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R3 (at 2.542 0.213 180) (layer F.SilkS))
    (fp_text value 10k (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 26 /reset))
    (pad 2 smd roundrect (at 0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 +3V3))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer B.Cu) (tedit 5B301BBD)
    (at 164.4777 50.43424)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R4 (at -2.665 0.086) (layer B.SilkS))
    (fp_text value 3k2 (at 0 -1.43) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 2 smd roundrect (at 0.875 0) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 27 /analog_pv_out))
    (pad 1 smd roundrect (at -0.875 0) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 6 "Net-(C9-Pad1)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 169.48404 32.46628 180)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R5 (at -2.61566 -0.14696 180) (layer F.SilkS))
    (fp_text value 1k8 (at 0 1.43 180) (layer F.Fab))
    (fp_text user %R (at 0 0 180) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 28 "Net-(R5-Pad1)"))
    (pad 2 smd roundrect (at 0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 29 /Sensor-V_out))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 169.4688 30.69336 180)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R6 (at -2.6309 -0.01488 180) (layer F.SilkS))
    (fp_text value 2k7 (at 0 1.43 180) (layer F.Fab))
    (fp_text user %R (at 0 0 180) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 29 /Sensor-V_out))
    (pad 1 smd roundrect (at -0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 157.4947 34.15124 270)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R7 (at 0.24 1.143 90) (layer F.SilkS))
    (fp_text value 680 (at 0 1.43 270) (layer F.Fab))
    (fp_text user %R (at 0 0 270) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0 270) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 50 "Net-(D4-Pad2)"))
    (pad 2 smd roundrect (at 0.875 0 270) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 +3V3))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Button_Switch_SMD:SW_SPST_B3U-1000P (layer F.Cu) (tedit 5BE328E8)
    (at 153.33472 34.42208 180)
    (descr "Ultra-small-sized Tactile Switch with High Contact Reliability, Top-actuated Model, without Ground Terminal, without Boss")
    (tags "Tactile Switch")
    (attr smd)
    (fp_text reference SW1 (at 0.15802 -2.12816 180) (layer F.SilkS))
    (fp_text value SW_Push (at 0 2.5 180) (layer F.Fab))
    (fp_text user %R (at 0 -2.5 180) (layer F.Fab))
    (pad 1 smd rect (at -1.7 0 180) (size 0.9 1.7) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad 2 smd rect (at 1.7 0 180) (size 0.9 1.7) (layers F.Cu F.Paste F.Mask)
      (net 26 /reset))
    (model ${KISYS3DMOD}/Button_Switch_SMD.3dshapes/SW_SPST_B3U-1000P.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_TO_SOT_SMD:SOT-23 (layer F.Cu) (tedit 5A02FF57)
    (at 182.3997 42.78624)
    (descr "SOT-23, Standard")
    (tags SOT-23)
    (attr smd)
    (fp_text reference U1 (at 1.802 -1.508) (layer F.SilkS))
    (fp_text value TLV76033DBZT (at 0 2.5) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd rect (at -1 -0.95) (size 0.9 0.8) (layers F.Cu F.Paste F.Mask)
      (net 1 +3V3))
    (pad 2 smd rect (at -1 0.95) (size 0.9 0.8) (layers F.Cu F.Paste F.Mask)
      (net 7 "Net-(D1-Pad1)"))
    (pad 3 smd rect (at 1 0) (size 0.9 0.8) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (model ${KISYS3DMOD}/Package_TO_SOT_SMD.3dshapes/SOT-23.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_TO_SOT_SMD:SOT-23 (layer F.Cu) (tedit 5A02FF57)
    (at 182.3997 46.78624)
    (descr "SOT-23, Standard")
    (tags SOT-23)
    (attr smd)
    (fp_text reference U2 (at 1.702 -1.308) (layer F.SilkS))
    (fp_text value TLV76050DBZT (at 0 2.5) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 3 smd rect (at 1 0) (size 0.9 0.8) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad 2 smd rect (at -1 0.95) (size 0.9 0.8) (layers F.Cu F.Paste F.Mask)
      (net 9 "Net-(D2-Pad1)"))
    (pad 1 smd rect (at -1 -0.95) (size 0.9 0.8) (layers F.Cu F.Paste F.Mask)
      (net 17 +5V))
    (model ${KISYS3DMOD}/Package_TO_SOT_SMD.3dshapes/SOT-23.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_QFP:TQFP-44_10x10mm_P0.8mm (layer F.Cu) (tedit 5BE32723)
    (at 163.7538 41.4528)
    (descr "44-Lead Plastic Thin Quad Flatpack (PT) - 10x10x1.0 mm Body [TQFP] (see Microchip Packaging Specification 00000049BS.pdf)")
    (tags "QFP 0.8")
    (attr smd)
    (fp_text reference U3 (at 1.8689 -3.63256) (layer F.SilkS))
    (fp_text value ATMEGA32U4-AU (at 0 7.45) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd rect (at -5.7 -4) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 32 /Sensor-SS))
    (pad 2 smd rect (at -5.7 -3.2) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 13 USB5V))
    (pad 3 smd rect (at -5.7 -2.4) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 25 /D-))
    (pad 4 smd rect (at -5.7 -1.6) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 24 /D+))
    (pad 5 smd rect (at -5.7 -0.8) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad 6 smd rect (at -5.7 0) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 5 "Net-(C7-Pad1)"))
    (pad 7 smd rect (at -5.7 0.8) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 13 USB5V))
    (pad 8 smd rect (at -5.7 1.6) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 33 "Net-(U3-Pad8)"))
    (pad 9 smd rect (at -5.7 2.4) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 34 /SCK))
    (pad 10 smd rect (at -5.7 3.2) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 35 /MOSI))
    (pad 11 smd rect (at -5.7 4) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 36 /MISO))
    (pad 12 smd rect (at -4 5.7 90) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 37 "Net-(U3-Pad12)"))
    (pad 13 smd rect (at -3.2 5.7 90) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 26 /reset))
    (pad 14 smd rect (at -2.4 5.7 90) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 1 +3V3))
    (pad 15 smd rect (at -1.6 5.7 90) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad 16 smd rect (at -0.8 5.7 90) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 4 "Net-(C5-Pad1)"))
    (pad 17 smd rect (at 0 5.7 90) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 3 "Net-(C4-Pad1)"))
    (pad 18 smd rect (at 0.8 5.7 90) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 19 /SCL))
    (pad 19 smd rect (at 1.6 5.7 90) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 18 /SDA))
    (pad 20 smd rect (at 2.4 5.7 90) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 38 "Net-(U3-Pad20)"))
    (pad 21 smd rect (at 3.2 5.7 90) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 39 "Net-(U3-Pad21)"))
    (pad 22 smd rect (at 4 5.7 90) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 40 "Net-(U3-Pad22)"))
    (pad 23 smd rect (at 5.7 4) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad 24 smd rect (at 5.7 3.2) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 1 +3V3))
    (pad 25 smd rect (at 5.7 2.4) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 41 "Net-(U3-Pad25)"))
    (pad 26 smd rect (at 5.7 1.6) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 42 "Net-(U3-Pad26)"))
    (pad 27 smd rect (at 5.7 0.8) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 23 /valve2))
    (pad 28 smd rect (at 5.7 0) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 43 "Net-(U3-Pad28)"))
    (pad 29 smd rect (at 5.7 -0.8) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 27 /analog_pv_out))
    (pad 30 smd rect (at 5.7 -1.6) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 44 "Net-(U3-Pad30)"))
    (pad 31 smd rect (at 5.7 -2.4) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 45 "Net-(U3-Pad31)"))
    (pad 32 smd rect (at 5.7 -3.2) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 22 /valve1))
    (pad 33 smd rect (at 5.7 -4) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 46 "Net-(U3-Pad33)"))
    (pad 34 smd rect (at 4 -5.7 90) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 1 +3V3))
    (pad 35 smd rect (at 3.2 -5.7 90) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad 36 smd rect (at 2.4 -5.7 90) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 48 "Net-(U3-Pad36)"))
    (pad 37 smd rect (at 1.6 -5.7 90) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 49 "Net-(U3-Pad37)"))
    (pad 38 smd rect (at 0.8 -5.7 90) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 31 /addr1))
    (pad 39 smd rect (at 0 -5.7 90) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 30 /addr0))
    (pad 40 smd rect (at -0.8 -5.7 90) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 20 /analog_sp_in))
    (pad 41 smd rect (at -1.6 -5.7 90) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 29 /Sensor-V_out))
    (pad 42 smd rect (at -2.4 -5.7 90) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 47 "Net-(U3-Pad42)"))
    (pad 43 smd rect (at -3.2 -5.7 90) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad 44 smd rect (at -4 -5.7 90) (size 1.5 0.55) (layers F.Cu F.Paste F.Mask)
      (net 1 +3V3))
    (model ${KISYS3DMOD}/Package_QFP.3dshapes/TQFP-44_10x10mm_P0.8mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Crystal:Crystal_SMD_0603-2Pin_6.0x3.5mm_HandSoldering (layer B.Cu) (tedit 5A0FD1B2)
    (at 164.6047 43.19524 180)
    (descr "SMD Crystal SERIES SMD0603/2 http://www.petermann-technik.de/fileadmin/petermann/pdf/SMD0603-2.pdf, hand-soldering, 6.0x3.5mm^2 package")
    (tags "SMD SMT crystal hand-soldering")
    (attr smd)
    (fp_text reference Y1 (at 0 1.057 180) (layer B.SilkS))
    (fp_text value "Crystal 8MHz" (at 0 -2.95 180) (layer B.Fab))
    (fp_text user %R (at 0 0 180) (layer B.Fab))
    (pad 1 smd rect (at -2.9125 0 180) (size 3.325 2.5) (layers B.Cu B.Paste B.Mask)
      (net 3 "Net-(C4-Pad1)"))
    (pad 2 smd rect (at 2.9125 0 180) (size 3.325 2.5) (layers B.Cu B.Paste B.Mask)
      (net 4 "Net-(C5-Pad1)"))
    (model ${KISYS3DMOD}/Crystal.3dshapes/Crystal_SMD_0603-2Pin_6.0x3.5mm_HandSoldering.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module pressure_regulators:USB_Micro-B (layer F.Cu) (tedit 5AF45B5E)
    (at 187.9017 44.17824 90)
    (descr "Micro USB Type B Receptacle")
    (tags "USB USB_B USB_micro USB_OTG")
    (attr smd)
    (fp_text reference J1 (at 0 -3.24 90) (layer F.SilkS) hide)
    (fp_text value USB_B_Micro (at 0 5.01 90) (layer F.Fab))
    (pad 1 smd rect (at -1.3 -1.35 180) (size 1.35 0.4) (layers F.Cu F.Paste F.Mask)
      (net 13 USB5V))
    (pad 2 smd rect (at -0.65 -1.35 180) (size 1.35 0.4) (layers F.Cu F.Paste F.Mask)
      (net 14 "Net-(J1-Pad2)"))
    (pad 3 smd rect (at 0 -1.35 180) (size 1.35 0.4) (layers F.Cu F.Paste F.Mask)
      (net 15 "Net-(J1-Pad3)"))
    (pad 4 smd rect (at 0.65 -1.35 180) (size 1.35 0.4) (layers F.Cu F.Paste F.Mask)
      (net 16 "Net-(J1-Pad4)"))
    (pad 5 smd rect (at 1.3 -1.35 180) (size 1.35 0.4) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad 6 thru_hole oval (at -2.425 -1.55 90) (size 0.95 1.25) (drill oval 0.65 0.85) (layers *.Cu *.Mask)
      (net 2 GND))
    (pad 6 thru_hole oval (at 2.425 -1.55 90) (size 0.95 1.25) (drill oval 0.65 0.85) (layers *.Cu *.Mask)
      (net 2 GND))
    (pad 6 thru_hole oval (at -3.5 1.35 180) (size 1.95 1) (drill oval 1.5 0.5) (layers *.Cu *.Mask)
      (net 2 GND))
    (pad 6 thru_hole oval (at 3.5 1.35 180) (size 1.95 1) (drill oval 1.5 0.5) (layers *.Cu *.Mask)
      (net 2 GND))
  )
  (module Jumper:SolderJumper-2_P1.3mm_Open_TrianglePad1.0x1.5mm (layer F.Cu) (tedit 5A64794F)
    (at 181.9997 49.98624 180)
    (descr "SMD Solder Jumper, 1x1.5mm Triangular Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference J2 (at 0 -1.8 180) (layer F.SilkS))
    (fp_text value GS2 (at 0 1.9 180) (layer F.Fab))
    (pad 2 smd custom (at 0.725 0 180) (size 0.3 0.3) (layers F.Cu F.Mask)
      (net 8 RAW) (zone_connect 0)
      (options (clearance outline) (anchor rect))
      (primitives
        (gr_poly (pts
           (xy -0.65 -0.75) (xy 0.5 -0.75) (xy 0.5 0.75) (xy -0.65 0.75) (xy -0.15 0)
) (width 0))
      ))
    (pad 1 smd custom (at -0.725 0 180) (size 0.3 0.3) (layers F.Cu F.Mask)
      (net 17 +5V) (zone_connect 0)
      (options (clearance outline) (anchor rect))
      (primitives
        (gr_poly (pts
           (xy -0.5 -0.75) (xy 0.5 -0.75) (xy 1 0) (xy 0.5 0.75) (xy -0.5 0.75)
) (width 0))
      ))
  )
  (module Jumper:SolderJumper-2_P1.3mm_Open_TrianglePad1.0x1.5mm (layer F.Cu) (tedit 5A64794F)
    (at 153.4997 44.48624 180)
    (descr "SMD Solder Jumper, 1x1.5mm Triangular Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference J8 (at -2.344 0.062 180) (layer F.SilkS))
    (fp_text value GS2 (at 0 1.9 180) (layer F.Fab))
    (pad 1 smd custom (at -0.725 0 180) (size 0.3 0.3) (layers F.Cu F.Mask)
      (net 30 /addr0) (zone_connect 0)
      (options (clearance outline) (anchor rect))
      (primitives
        (gr_poly (pts
           (xy -0.5 -0.75) (xy 0.5 -0.75) (xy 1 0) (xy 0.5 0.75) (xy -0.5 0.75)
) (width 0))
      ))
    (pad 2 smd custom (at 0.725 0 180) (size 0.3 0.3) (layers F.Cu F.Mask)
      (net 2 GND) (zone_connect 0)
      (options (clearance outline) (anchor rect))
      (primitives
        (gr_poly (pts
           (xy -0.65 -0.75) (xy 0.5 -0.75) (xy 0.5 0.75) (xy -0.65 0.75) (xy -0.15 0)
) (width 0))
      ))
  )
  (module Jumper:SolderJumper-2_P1.3mm_Open_TrianglePad1.0x1.5mm (layer F.Cu) (tedit 5A64794F)
    (at 153.4997 46.98624 180)
    (descr "SMD Solder Jumper, 1x1.5mm Triangular Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference J9 (at -2.344 0.022 180) (layer F.SilkS))
    (fp_text value GS2 (at 0 1.9 180) (layer F.Fab))
    (pad 2 smd custom (at 0.725 0 180) (size 0.3 0.3) (layers F.Cu F.Mask)
      (net 2 GND) (zone_connect 0)
      (options (clearance outline) (anchor rect))
      (primitives
        (gr_poly (pts
           (xy -0.65 -0.75) (xy 0.5 -0.75) (xy 0.5 0.75) (xy -0.65 0.75) (xy -0.15 0)
) (width 0))
      ))
    (pad 1 smd custom (at -0.725 0 180) (size 0.3 0.3) (layers F.Cu F.Mask)
      (net 31 /addr1) (zone_connect 0)
      (options (clearance outline) (anchor rect))
      (primitives
        (gr_poly (pts
           (xy -0.5 -0.75) (xy 0.5 -0.75) (xy 1 0) (xy 0.5 0.75) (xy -0.5 0.75)
) (width 0))
      ))
  )
  (gr_text "Pressure regulator \nv1.1\ncraig.watson\n@case.edu\n" (at 177.0017 30.37824) (layer B.SilkS))
  (gr_text LED (at 163.4637 33.37524) (layer F.SilkS))
  (gr_text ICSP (at 157.1017 55.97824) (layer F.SilkS))
  (gr_text Valve2 (at 187.5937 32.23224) (layer F.SilkS))
  (gr_text Valve1 (at 187.5937 37.82024) (layer F.SilkS))
  (gr_text SP (at 161.8017 51.17824) (layer F.SilkS))
  (gr_text PV (at 164.6017 51.17824) (layer F.SilkS))
  (gr_text SCL (at 168.9017 48.67824) (layer F.SilkS))
  (gr_text SDA (at 172.1017 48.67824) (layer F.SilkS))
  (gr_text Vin (at 175.0517 48.72824) (layer F.SilkS))
  (gr_text GND (at 178.0517 48.87824) (layer F.SilkS))
  (gr_text "i2c addr" (at 151.3017 45.77824 270) (layer F.SilkS))
  (gr_text 0-3V3 (at 162.9017 60.27824) (layer B.SilkS))
  (gr_text SP (at 161.8017 56.57824 90) (layer B.SilkS))
  (gr_text PV (at 164.5017 56.47824 90) (layer B.SilkS))
  (gr_text 3V3 (at 171.7017 28.27824) (layer F.SilkS))
  (gr_text 5V (at 171.2017 25.67824) (layer F.SilkS))
  (gr_text Analog (at 181.5017 30.47824 90) (layer F.SilkS))
  (gr_text SPI (at 177.1017 32.27824 90) (layer F.SilkS))
  (gr_arc (start 183 55) (end 181 55) (angle 90) (layer Edge.Cuts) (width 0.15))
  (gr_arc (start 165 30) (end 167 30) (angle 90) (layer Edge.Cuts) (width 0.15))
  (gr_line (start 167 30) (end 167 22) (angle 90) (layer Edge.Cuts) (width 0.15))
  (gr_line (start 167 22) (end 191 22) (angle 90) (layer Edge.Cuts) (width 0.15))
  (gr_line (start 183 53) (end 191 53) (angle 90) (layer Edge.Cuts) (width 0.15))
  (gr_line (start 181 63) (end 181 55) (angle 90) (layer Edge.Cuts) (width 0.15))
  (gr_line (start 181 63) (end 150 63) (angle 90) (layer Edge.Cuts) (width 0.15))
  (gr_line (start 191 22) (end 191 53) (angle 90) (layer Edge.Cuts) (width 0.15))
  (gr_line (start 150 32) (end 150 63) (angle 90) (layer Edge.Cuts) (width 0.15))
  (gr_line (start 150 32) (end 165 32) (angle 90) (layer Edge.Cuts) (width 0.15))
  (zone (net 2) (net_name GND) (layer B.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 202.5777 66.43624) (xy 140.3477 66.43624) (xy 140.3477 18.93824) (xy 202.5777 18.93824)
      )
    )
  )
)
