(kicad_pcb
	(version 20240108)
	(generator "pcbnew")
	(generator_version "8.0")
	(general
		(thickness 1.536192)
		(legacy_teardrops no)
	)
	(paper "A4")
	(layers
		(0 "F.Cu" signal)
		(1 "In1.Cu" signal)
		(2 "In2.Cu" signal)
		(3 "In3.Cu" signal)
		(4 "In4.Cu" signal)
		(31 "B.Cu" signal)
		(32 "B.Adhes" user "B.Adhesive")
		(33 "F.Adhes" user "F.Adhesive")
		(34 "B.Paste" user)
		(35 "F.Paste" user)
		(36 "B.SilkS" user "B.Silkscreen")
		(37 "F.SilkS" user "F.Silkscreen")
		(38 "B.Mask" user)
		(39 "F.Mask" user)
		(40 "Dwgs.User" user "User.Drawings")
		(41 "Cmts.User" user "User.Comments")
		(42 "Eco1.User" user "User.Eco1")
		(43 "Eco2.User" user "User.Eco2")
		(44 "Edge.Cuts" user)
		(45 "Margin" user)
		(46 "B.CrtYd" user "B.Courtyard")
		(47 "F.CrtYd" user "F.Courtyard")
		(48 "B.Fab" user)
		(49 "F.Fab" user)
		(50 "User.1" user)
		(51 "User.2" user)
		(52 "User.3" user)
		(53 "User.4" user)
		(54 "User.5" user)
		(55 "User.6" user)
		(56 "User.7" user)
		(57 "User.8" user)
		(58 "User.9" user)
	)
	(setup
		(stackup
			(layer "F.SilkS"
				(type "Top Silk Screen")
			)
			(layer "F.Paste"
				(type "Top Solder Paste")
			)
			(layer "F.Mask"
				(type "Top Solder Mask")
				(thickness 0.01524)
			)
			(layer "F.Cu"
				(type "copper")
				(thickness 0.04318)
			)
			(layer "dielectric 1"
				(type "prepreg")
				(color "FR4 natural")
				(thickness 0.110744)
				(material "FR408-HR")
				(epsilon_r 3.69)
				(loss_tangent 0.0091)
			)
			(layer "In1.Cu"
				(type "copper")
				(thickness 0.017272)
			)
			(layer "dielectric 2"
				(type "core")
				(color "FR4 natural")
				(thickness 0.1016)
				(material "FR408-HR")
				(epsilon_r 3.69)
				(loss_tangent 0.0091)
			)
			(layer "In2.Cu"
				(type "copper")
				(thickness 0.017272)
			)
			(layer "dielectric 3"
				(type "prepreg")
				(color "FR4 natural")
				(thickness 0.925576)
				(material "FR408-HR")
				(epsilon_r 3.69)
				(loss_tangent 0.0091)
			)
			(layer "In3.Cu"
				(type "copper")
				(thickness 0.017272)
			)
			(layer "dielectric 4"
				(type "core")
				(color "FR4 natural")
				(thickness 0.1016)
				(material "FR408-HR")
				(epsilon_r 3.69)
				(loss_tangent 0.0091)
			)
			(layer "In4.Cu"
				(type "copper")
				(thickness 0.017272)
			)
			(layer "dielectric 5"
				(type "prepreg")
				(color "FR4 natural")
				(thickness 0.110744)
				(material "FR408-HR")
				(epsilon_r 3.69)
				(loss_tangent 0.0091)
			)
			(layer "B.Cu"
				(type "copper")
				(thickness 0.04318)
			)
			(layer "B.Mask"
				(type "Bottom Solder Mask")
				(thickness 0.01524)
			)
			(layer "B.Paste"
				(type "Bottom Solder Paste")
			)
			(layer "B.SilkS"
				(type "Bottom Silk Screen")
			)
			(copper_finish "None")
			(dielectric_constraints yes)
		)
		(pad_to_mask_clearance 0)
		(allow_soldermask_bridges_in_footprints no)
		(pcbplotparams
			(layerselection 0x00010fc_ffffffff)
			(plot_on_all_layers_selection 0x0000000_00000000)
			(disableapertmacros no)
			(usegerberextensions no)
			(usegerberattributes yes)
			(usegerberadvancedattributes yes)
			(creategerberjobfile yes)
			(dashed_line_dash_ratio 12.000000)
			(dashed_line_gap_ratio 3.000000)
			(svgprecision 4)
			(plotframeref no)
			(viasonmask no)
			(mode 1)
			(useauxorigin no)
			(hpglpennumber 1)
			(hpglpenspeed 20)
			(hpglpendiameter 15.000000)
			(pdf_front_fp_property_popups yes)
			(pdf_back_fp_property_popups yes)
			(dxfpolygonmode yes)
			(dxfimperialunits yes)
			(dxfusepcbnewfont yes)
			(psnegative no)
			(psa4output no)
			(plotreference yes)
			(plotvalue yes)
			(plotfptext yes)
			(plotinvisibletext no)
			(sketchpadsonfab no)
			(subtractmaskfromsilk no)
			(outputformat 1)
			(mirror no)
			(drillshape 1)
			(scaleselection 1)
			(outputdirectory "")
		)
	)
	(net 0 "")
	(net 1 "GND")
	(net 2 "/TX1_QDATA_IN-")
	(net 3 "unconnected-(J1-PadG22)")
	(net 4 "unconnected-(J1-PadD24)")
	(net 5 "/TX1_IDATA_IN+")
	(net 6 "unconnected-(J1-PadC34)")
	(net 7 "unconnected-(J1-PadD23)")
	(net 8 "/RX1_DCLK_OUT+")
	(net 9 "/GP_INT")
	(net 10 "unconnected-(J1-PadG30)")
	(net 11 "unconnected-(J1-PadD36)")
	(net 12 "/VADJ")
	(net 13 "/RX1_ENABLE")
	(net 14 "/RX1_QDATA_OUT+")
	(net 15 "/TX1_DCLK_IN+")
	(net 16 "/DGPIO_6")
	(net 17 "unconnected-(J1-PadD21)")
	(net 18 "unconnected-(J1-PadC22)")
	(net 19 "unconnected-(J1-PadC06)")
	(net 20 "/TX1_QDATA_IN+")
	(net 21 "/RX1_STROBE_OUT-")
	(net 22 "/DGPIO_2")
	(net 23 "unconnected-(J1-PadG21)")
	(net 24 "unconnected-(J1-PadD27)")
	(net 25 "unconnected-(J1-PadG36)")
	(net 26 "/DGPIO_0")
	(net 27 "/TX1_STROBE_IN-")
	(net 28 "unconnected-(J1-PadH22)")
	(net 29 "/FMCA_SDA")
	(net 30 "unconnected-(J1-PadD34)")
	(net 31 "unconnected-(J1-PadC39)")
	(net 32 "unconnected-(J1-PadG02)")
	(net 33 "/VDD_12V")
	(net 34 "unconnected-(J1-PadH26)")
	(net 35 "unconnected-(J1-PadH05)")
	(net 36 "unconnected-(J1-PadD05)")
	(net 37 "unconnected-(J1-PadC07)")
	(net 38 "/RX1_DCLK_OUT-")
	(net 39 "unconnected-(J1-PadC18)")
	(net 40 "unconnected-(J1-PadD40)")
	(net 41 "unconnected-(J1-PadC02)")
	(net 42 "/X1")
	(net 43 "unconnected-(J1-PadC19)")
	(net 44 "/DGPIO_11")
	(net 45 "/RX1_IDATA_OUT-")
	(net 46 "unconnected-(J1-PadH01)")
	(net 47 "unconnected-(J1-PadG03)")
	(net 48 "/SPI_DO")
	(net 49 "/RX1_STROBE_OUT+")
	(net 50 "unconnected-(J1-PadD35)")
	(net 51 "/SPI_DIO")
	(net 52 "unconnected-(J1-PadD04)")
	(net 53 "unconnected-(J1-PadH38)")
	(net 54 "/TX1_DCLK_OUT-")
	(net 55 "unconnected-(J1-PadD33)")
	(net 56 "unconnected-(J1-PadG24)")
	(net 57 "unconnected-(J1-PadH28)")
	(net 58 "unconnected-(J1-PadH37)")
	(net 59 "/PLATFORM_STATUS")
	(net 60 "/DGPIO_5")
	(net 61 "unconnected-(J1-PadG28)")
	(net 62 "/TX1_DCLK_IN-")
	(net 63 "/DGPIO_1")
	(net 64 "/DGPIO_4")
	(net 65 "/MODE")
	(net 66 "/FMCA_SCL")
	(net 67 "unconnected-(J1-PadG37)")
	(net 68 "/SPI_EN")
	(net 69 "/DGPIO_9")
	(net 70 "/DEV_CLK_OUT")
	(net 71 "/SPI_CLK")
	(net 72 "unconnected-(J1-PadH35)")
	(net 73 "unconnected-(J1-PadD20)")
	(net 74 "unconnected-(J1-PadC03)")
	(net 75 "/RX1_QDATA_OUT-")
	(net 76 "unconnected-(J1-PadD38)")
	(net 77 "unconnected-(J1-PadC23)")
	(net 78 "/3P3_VAX")
	(net 79 "/TX1_STROBE_IN+")
	(net 80 "/VADJ_ERR")
	(net 81 "/TX1_ENABLE")
	(net 82 "/DGPIO_7")
	(net 83 "/DGPIO_3")
	(net 84 "unconnected-(J1-PadD29)")
	(net 85 "/RX1_IDATA_OUT+")
	(net 86 "unconnected-(J1-PadG27)")
	(net 87 "unconnected-(J1-PadH29)")
	(net 88 "unconnected-(J1-PadH23)")
	(net 89 "/DGPIO_8")
	(net 90 "unconnected-(J1-PadG25)")
	(net 91 "/TX1_IDATA_IN-")
	(net 92 "unconnected-(J1-PadH25)")
	(net 93 "/ADP5056_EN")
	(net 94 "/X2")
	(net 95 "/DGPIO_10")
	(net 96 "/RESET")
	(net 97 "/TX1_DCLK_OUT+")
	(net 98 "unconnected-(J1-PadH40)")
	(net 99 "unconnected-(J2-PadD34)")
	(net 100 "unconnected-(J2-PadD5)")
	(net 101 "unconnected-(J2-PadG36)")
	(net 102 "unconnected-(J2-PadD36)")
	(net 103 "unconnected-(J2-PadC2)")
	(net 104 "unconnected-(J2-PadD38)")
	(net 105 "unconnected-(J2-PadC7)")
	(net 106 "unconnected-(J2-PadG37)")
	(net 107 "unconnected-(J2-PadD33)")
	(net 108 "unconnected-(J2-PadC6)")
	(net 109 "unconnected-(J2-PadH35)")
	(net 110 "unconnected-(J2-PadH1)")
	(net 111 "unconnected-(J2-PadD29)")
	(net 112 "unconnected-(J2-PadH40)")
	(net 113 "unconnected-(J2-PadD40)")
	(net 114 "unconnected-(J2-PadD4)")
	(net 115 "unconnected-(J2-PadC3)")
	(net 116 "unconnected-(J2-PadC39)")
	(net 117 "unconnected-(J2-PadD24)")
	(net 118 "unconnected-(J2-PadG2)")
	(net 119 "unconnected-(J2-PadH23)")
	(net 120 "unconnected-(J2-PadG30)")
	(net 121 "unconnected-(J2-PadH29)")
	(net 122 "unconnected-(J2-PadC23)")
	(net 123 "unconnected-(J2-PadC19)")
	(net 124 "unconnected-(J2-PadG22)")
	(net 125 "unconnected-(J2-PadH25)")
	(net 126 "unconnected-(J2-PadG21)")
	(net 127 "unconnected-(J2-PadH38)")
	(net 128 "unconnected-(J2-PadH5)")
	(net 129 "unconnected-(J2-PadH37)")
	(net 130 "unconnected-(J2-PadD27)")
	(net 131 "unconnected-(J2-PadC34)")
	(net 132 "unconnected-(J2-PadG3)")
	(net 133 "unconnected-(J2-PadG28)")
	(net 134 "unconnected-(J2-PadG25)")
	(net 135 "unconnected-(J2-PadC18)")
	(net 136 "unconnected-(J2-PadD35)")
	(net 137 "unconnected-(J2-PadD20)")
	(net 138 "unconnected-(J2-PadH28)")
	(net 139 "unconnected-(J2-PadG27)")
	(net 140 "unconnected-(J2-PadH26)")
	(net 141 "unconnected-(J2-PadD23)")
	(net 142 "unconnected-(J2-PadH22)")
	(net 143 "unconnected-(J2-PadC22)")
	(net 144 "unconnected-(J2-PadD21)")
	(net 145 "unconnected-(J2-PadG24)")
	(footprint "t_Samtec:SAMTEC_ASP-134604-01"
		(layer "F.Cu")
		(at 156.718 77.978)
		(property "Reference" "J2"
			(at -23.172875 -9.096015 0)
			(layer "F.SilkS")
			(hide yes)
		)
		(property "Value" "ASP-134604-01"
			(at -10.0255 8.91584 0)
			(layer "F.Fab")
		)
		(property "Footprint" "t_Samtec:SAMTEC_ASP-134604-01"
			(at 0 0 0)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Datasheet" "https://mm.digikey.com/Volume0/opasdata/d220001/medias/docus/6358/ASP-134604-01.pdf"
			(at 0 0 0)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 0)
			(layer "F.Fab")
			(hide yes)
		)
		(property "PARTREV" "S"
			(at 0 0 0)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "STANDARD" "Manufacturer recommendations"
			(at 0 0 0)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "MANUFACTURER" "SAMTEC"
			(at 0 0 0)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(sheetname "Root")
		(sheetfile "SAMTEC_Twist.kicad_sch")
		(attr smd)
		(pad "" np_thru_hole circle
			(at -27.191 3.05)
			(size 1.27 1.27)
			(drill 1.27)
			(layers "*.Cu" "*.Mask")
		)
		(pad "" np_thru_hole circle
			(at 27.19 0)
			(size 1.27 1.27)
			(drill 1.27)
			(layers "*.Cu" "*.Mask")
		)
		(pad "C1" smd circle
			(at 24.765 -3.175)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 1 "GND")
			(pinfunction "C1")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "C2" smd circle
			(at 23.495 -3.175)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 103 "unconnected-(J2-PadC2)")
			(pinfunction "C2")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "C3" smd circle
			(at 22.225 -3.175)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 115 "unconnected-(J2-PadC3)")
			(pinfunction "C3")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "C4" smd circle
			(at 20.955 -3.175)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 1 "GND")
			(pinfunction "C4")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "C5" smd circle
			(at 19.685 -3.175)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 1 "GND")
			(pinfunction "C5")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "C6" smd circle
			(at 18.415 -3.175)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 108 "unconnected-(J2-PadC6)")
			(pinfunction "C6")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "C7" smd circle
			(at 17.145 -3.175)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 105 "unconnected-(J2-PadC7)")
			(pinfunction "C7")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "C8" smd circle
			(at 15.875 -3.175)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 1 "GND")
			(pinfunction "C8")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "C9" smd circle
			(at 14.605 -3.175)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 1 "GND")
			(pinfunction "C9")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "C10" smd circle
			(at 13.335 -3.175)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 79 "/TX1_STROBE_IN+")
			(pinfunction "C10")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "C11" smd circle
			(at 12.065 -3.175)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 27 "/TX1_STROBE_IN-")
			(pinfunction "C11")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "C12" smd circle
			(at 10.795 -3.175)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 1 "GND")
			(pinfunction "C12")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "C13" smd circle
			(at 9.525 -3.175)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 1 "GND")
			(pinfunction "C13")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "C14" smd circle
			(at 8.255 -3.175)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 13 "/RX1_ENABLE")
			(pinfunction "C14")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "C15" smd circle
			(at 6.985 -3.175)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 60 "/DGPIO_5")
			(pinfunction "C15")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "C16" smd circle
			(at 5.715 -3.175)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 1 "GND")
			(pinfunction "C16")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "C17" smd circle
			(at 4.445 -3.175)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 1 "GND")
			(pinfunction "C17")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "C18" smd circle
			(at 3.175 -3.175)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 135 "unconnected-(J2-PadC18)")
			(pinfunction "C18")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "C19" smd circle
			(at 1.905 -3.175)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 123 "unconnected-(J2-PadC19)")
			(pinfunction "C19")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "C20" smd circle
			(at 0.635 -3.175)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 1 "GND")
			(pinfunction "C20")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "C21" smd circle
			(at -0.635 -3.175)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 1 "GND")
			(pinfunction "C21")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "C22" smd circle
			(at -1.905 -3.175)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 143 "unconnected-(J2-PadC22)")
			(pinfunction "C22")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "C23" smd circle
			(at -3.175 -3.175)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 122 "unconnected-(J2-PadC23)")
			(pinfunction "C23")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "C24" smd circle
			(at -4.445 -3.175)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 1 "GND")
			(pinfunction "C24")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "C25" smd circle
			(at -5.715 -3.175)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 1 "GND")
			(pinfunction "C25")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "C26" smd circle
			(at -6.985 -3.175)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 16 "/DGPIO_6")
			(pinfunction "C26")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "C27" smd circle
			(at -8.255 -3.175)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 44 "/DGPIO_11")
			(pinfunction "C27")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "C28" smd circle
			(at -9.525 -3.175)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 1 "GND")
			(pinfunction "C28")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "C29" smd circle
			(at -10.795 -3.175)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 1 "GND")
			(pinfunction "C29")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "C30" smd circle
			(at -12.065 -3.175)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 66 "/FMCA_SCL")
			(pinfunction "C30")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "C31" smd circle
			(at -13.335 -3.175)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 29 "/FMCA_SDA")
			(pinfunction "C31")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "C32" smd circle
			(at -14.605 -3.175)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 1 "GND")
			(pinfunction "C32")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "C33" smd circle
			(at -15.875 -3.175)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 1 "GND")
			(pinfunction "C33")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "C34" smd circle
			(at -17.145 -3.175)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 131 "unconnected-(J2-PadC34)")
			(pinfunction "C34")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "C35" smd circle
			(at -18.415 -3.175)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 33 "/VDD_12V")
			(pinfunction "C35")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "C36" smd circle
			(at -19.685 -3.175)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 1 "GND")
			(pinfunction "C36")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "C37" smd circle
			(at -20.955 -3.175)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 33 "/VDD_12V")
			(pinfunction "C37")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "C38" smd circle
			(at -22.225 -3.175)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 1 "GND")
			(pinfunction "C38")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "C39" smd circle
			(at -23.495 -3.175)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 116 "unconnected-(J2-PadC39)")
			(pinfunction "C39")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "C40" smd circle
			(at -24.765 -3.175)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 1 "GND")
			(pinfunction "C40")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "D1" smd circle
			(at 24.765 -1.905)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 93 "/ADP5056_EN")
			(pinfunction "D1")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "D2" smd circle
			(at 23.495 -1.905)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 1 "GND")
			(pinfunction "D2")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "D3" smd circle
			(at 22.225 -1.905)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 1 "GND")
			(pinfunction "D3")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "D4" smd circle
			(at 20.955 -1.905)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 114 "unconnected-(J2-PadD4)")
			(pinfunction "D4")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "D5" smd circle
			(at 19.685 -1.905)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 100 "unconnected-(J2-PadD5)")
			(pinfunction "D5")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "D6" smd circle
			(at 18.415 -1.905)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 1 "GND")
			(pinfunction "D6")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "D7" smd circle
			(at 17.145 -1.905)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 1 "GND")
			(pinfunction "D7")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "D8" smd circle
			(at 15.875 -1.905)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 97 "/TX1_DCLK_OUT+")
			(pinfunction "D8")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "D9" smd circle
			(at 14.605 -1.905)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 54 "/TX1_DCLK_OUT-")
			(pinfunction "D9")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "D10" smd circle
			(at 13.335 -1.905)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 1 "GND")
			(pinfunction "D10")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "D11" smd circle
			(at 12.065 -1.905)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 20 "/TX1_QDATA_IN+")
			(pinfunction "D11")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "D12" smd circle
			(at 10.795 -1.905)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 2 "/TX1_QDATA_IN-")
			(pinfunction "D12")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "D13" smd circle
			(at 9.525 -1.905)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 1 "GND")
			(pinfunction "D13")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "D14" smd circle
			(at 8.255 -1.905)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 81 "/TX1_ENABLE")
			(pinfunction "D14")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "D15" smd circle
			(at 6.985 -1.905)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 64 "/DGPIO_4")
			(pinfunction "D15")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "D16" smd circle
			(at 5.715 -1.905)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 1 "GND")
			(pinfunction "D16")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "D17" smd circle
			(at 4.445 -1.905)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 65 "/MODE")
			(pinfunction "D17")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "D18" smd circle
			(at 3.175 -1.905)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 96 "/RESET")
			(pinfunction "D18")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "D19" smd circle
			(at 1.905 -1.905)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 1 "GND")
			(pinfunction "D19")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "D20" smd circle
			(at 0.635 -1.905)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 137 "unconnected-(J2-PadD20)")
			(pinfunction "D20")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "D21" smd circle
			(at -0.635 -1.905)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 144 "unconnected-(J2-PadD21)")
			(pinfunction "D21")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "D22" smd circle
			(at -1.905 -1.905)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 1 "GND")
			(pinfunction "D22")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "D23" smd circle
			(at -3.175 -1.905)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 141 "unconnected-(J2-PadD23)")
			(pinfunction "D23")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "D24" smd circle
			(at -4.445 -1.905)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 117 "unconnected-(J2-PadD24)")
			(pinfunction "D24")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "D25" smd circle
			(at -5.715 -1.905)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 1 "GND")
			(pinfunction "D25")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "D26" smd circle
			(at -6.985 -1.905)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 82 "/DGPIO_7")
			(pinfunction "D26")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "D27" smd circle
			(at -8.255 -1.905)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 130 "unconnected-(J2-PadD27)")
			(pinfunction "D27")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "D28" smd circle
			(at -9.525 -1.905)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 1 "GND")
			(pinfunction "D28")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "D29" smd circle
			(at -10.795 -1.905)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 111 "unconnected-(J2-PadD29)")
			(pinfunction "D29")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "D30" smd circle
			(at -12.065 -1.905)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 42 "/X1")
			(pinfunction "D30")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "D31" smd circle
			(at -13.335 -1.905)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 94 "/X2")
			(pinfunction "D31")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "D32" smd circle
			(at -14.605 -1.905)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 78 "/3P3_VAX")
			(pinfunction "D32")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "D33" smd circle
			(at -15.875 -1.905)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 107 "unconnected-(J2-PadD33)")
			(pinfunction "D33")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "D34" smd circle
			(at -17.145 -1.905)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 99 "unconnected-(J2-PadD34)")
			(pinfunction "D34")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "D35" smd circle
			(at -18.415 -1.905)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 136 "unconnected-(J2-PadD35)")
			(pinfunction "D35")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "D36" smd circle
			(at -19.685 -1.905)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 102 "unconnected-(J2-PadD36)")
			(pinfunction "D36")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "D37" smd circle
			(at -20.955 -1.905)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 1 "GND")
			(pinfunction "D37")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "D38" smd circle
			(at -22.225 -1.905)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 104 "unconnected-(J2-PadD38)")
			(pinfunction "D38")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "D39" smd circle
			(at -23.495 -1.905)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 1 "GND")
			(pinfunction "D39")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "D40" smd circle
			(at -24.765 -1.905)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 113 "unconnected-(J2-PadD40)")
			(pinfunction "D40")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "G1" smd circle
			(at 24.765 1.905)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 1 "GND")
			(pinfunction "G1")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "G2" smd circle
			(at 23.495 1.905)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 118 "unconnected-(J2-PadG2)")
			(pinfunction "G2")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "G3" smd circle
			(at 22.225 1.905)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 132 "unconnected-(J2-PadG3)")
			(pinfunction "G3")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "G4" smd circle
			(at 20.955 1.905)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 1 "GND")
			(pinfunction "G4")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "G5" smd circle
			(at 19.685 1.905)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 1 "GND")
			(pinfunction "G5")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "G6" smd circle
			(at 18.415 1.905)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 8 "/RX1_DCLK_OUT+")
			(pinfunction "G6")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "G7" smd circle
			(at 17.145 1.905)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 38 "/RX1_DCLK_OUT-")
			(pinfunction "G7")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "G8" smd circle
			(at 15.875 1.905)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 1 "GND")
			(pinfunction "G8")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "G9" smd circle
			(at 14.605 1.905)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 85 "/RX1_IDATA_OUT+")
			(pinfunction "G9")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "G10" smd circle
			(at 13.335 1.905)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 45 "/RX1_IDATA_OUT-")
			(pinfunction "G10")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "G11" smd circle
			(at 12.065 1.905)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 1 "GND")
			(pinfunction "G11")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "G12" smd circle
			(at 10.795 1.905)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 5 "/TX1_IDATA_IN+")
			(pinfunction "G12")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "G13" smd circle
			(at 9.525 1.905)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 91 "/TX1_IDATA_IN-")
			(pinfunction "G13")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "G14" smd circle
			(at 8.255 1.905)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 1 "GND")
			(pinfunction "G14")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "G15" smd circle
			(at 6.985 1.905)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 71 "/SPI_CLK")
			(pinfunction "G15")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "G16" smd circle
			(at 5.715 1.905)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 48 "/SPI_DO")
			(pinfunction "G16")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "G17" smd circle
			(at 4.445 1.905)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 1 "GND")
			(pinfunction "G17")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "G18" smd circle
			(at 3.175 1.905)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 26 "/DGPIO_0")
			(pinfunction "G18")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "G19" smd circle
			(at 1.905 1.905)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 63 "/DGPIO_1")
			(pinfunction "G19")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "G20" smd circle
			(at 0.635 1.905)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 1 "GND")
			(pinfunction "G20")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "G21" smd circle
			(at -0.635 1.905)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 126 "unconnected-(J2-PadG21)")
			(pinfunction "G21")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "G22" smd circle
			(at -1.905 1.905)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 124 "unconnected-(J2-PadG22)")
			(pinfunction "G22")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "G23" smd circle
			(at -3.175 1.905)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 1 "GND")
			(pinfunction "G23")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "G24" smd circle
			(at -4.445 1.905)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 145 "unconnected-(J2-PadG24)")
			(pinfunction "G24")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "G25" smd circle
			(at -5.715 1.905)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 134 "unconnected-(J2-PadG25)")
			(pinfunction "G25")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "G26" smd circle
			(at -6.985 1.905)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 1 "GND")
			(pinfunction "G26")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "G27" smd circle
			(at -8.255 1.905)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 139 "unconnected-(J2-PadG27)")
			(pinfunction "G27")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "G28" smd circle
			(at -9.525 1.905)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 133 "unconnected-(J2-PadG28)")
			(pinfunction "G28")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "G29" smd circle
			(at -10.795 1.905)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 1 "GND")
			(pinfunction "G29")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "G30" smd circle
			(at -12.065 1.905)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 120 "unconnected-(J2-PadG30)")
			(pinfunction "G30")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "G31" smd circle
			(at -13.335 1.905)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 51 "/SPI_DIO")
			(pinfunction "G31")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "G32" smd circle
			(at -14.605 1.905)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 1 "GND")
			(pinfunction "G32")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "G33" smd circle
			(at -15.875 1.905)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 80 "/VADJ_ERR")
			(pinfunction "G33")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "G34" smd circle
			(at -17.145 1.905)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 59 "/PLATFORM_STATUS")
			(pinfunction "G34")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "G35" smd circle
			(at -18.415 1.905)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 1 "GND")
			(pinfunction "G35")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "G36" smd circle
			(at -19.685 1.905)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 101 "unconnected-(J2-PadG36)")
			(pinfunction "G36")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "G37" smd circle
			(at -20.955 1.905)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 106 "unconnected-(J2-PadG37)")
			(pinfunction "G37")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "G38" smd circle
			(at -22.225 1.905)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 1 "GND")
			(pinfunction "G38")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "G39" smd circle
			(at -23.495 1.905)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 12 "/VADJ")
			(pinfunction "G39")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "G40" smd circle
			(at -24.765 1.905)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 1 "GND")
			(pinfunction "G40")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "H1" smd circle
			(at 24.765 3.175)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 110 "unconnected-(J2-PadH1)")
			(pinfunction "H1")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "H2" smd circle
			(at 23.495 3.175)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 1 "GND")
			(pinfunction "H2")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "H3" smd circle
			(at 22.225 3.175)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 1 "GND")
			(pinfunction "H3")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "H4" smd circle
			(at 20.955 3.175)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 70 "/DEV_CLK_OUT")
			(pinfunction "H4")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "H5" smd circle
			(at 19.685 3.175)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 128 "unconnected-(J2-PadH5)")
			(pinfunction "H5")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "H6" smd circle
			(at 18.415 3.175)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 1 "GND")
			(pinfunction "H6")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "H7" smd circle
			(at 17.145 3.175)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 49 "/RX1_STROBE_OUT+")
			(pinfunction "H7")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "H8" smd circle
			(at 15.875 3.175)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 21 "/RX1_STROBE_OUT-")
			(pinfunction "H8")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "H9" smd circle
			(at 14.605 3.175)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 1 "GND")
			(pinfunction "H9")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "H10" smd circle
			(at 13.335 3.175)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 14 "/RX1_QDATA_OUT+")
			(pinfunction "H10")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "H11" smd circle
			(at 12.065 3.175)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 75 "/RX1_QDATA_OUT-")
			(pinfunction "H11")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "H12" smd circle
			(at 10.795 3.175)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 1 "GND")
			(pinfunction "H12")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "H13" smd circle
			(at 9.525 3.175)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 15 "/TX1_DCLK_IN+")
			(pinfunction "H13")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "H14" smd circle
			(at 8.255 3.175)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 62 "/TX1_DCLK_IN-")
			(pinfunction "H14")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "H15" smd circle
			(at 6.985 3.175)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 1 "GND")
			(pinfunction "H15")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "H16" smd circle
			(at 5.715 3.175)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 95 "/DGPIO_10")
			(pinfunction "H16")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "H17" smd circle
			(at 4.445 3.175)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 83 "/DGPIO_3")
			(pinfunction "H17")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "H18" smd circle
			(at 3.175 3.175)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 1 "GND")
			(pinfunction "H18")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "H19" smd circle
			(at 1.905 3.175)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 68 "/SPI_EN")
			(pinfunction "H19")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "H20" smd circle
			(at 0.635 3.175)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 22 "/DGPIO_2")
			(pinfunction "H20")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "H21" smd circle
			(at -0.635 3.175)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 1 "GND")
			(pinfunction "H21")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "H22" smd circle
			(at -1.905 3.175)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 142 "unconnected-(J2-PadH22)")
			(pinfunction "H22")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "H23" smd circle
			(at -3.175 3.175)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 119 "unconnected-(J2-PadH23)")
			(pinfunction "H23")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "H24" smd circle
			(at -4.445 3.175)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 1 "GND")
			(pinfunction "H24")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "H25" smd circle
			(at -5.715 3.175)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 125 "unconnected-(J2-PadH25)")
			(pinfunction "H25")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "H26" smd circle
			(at -6.985 3.175)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 140 "unconnected-(J2-PadH26)")
			(pinfunction "H26")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "H27" smd circle
			(at -8.255 3.175)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 1 "GND")
			(pinfunction "H27")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "H28" smd circle
			(at -9.525 3.175)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 138 "unconnected-(J2-PadH28)")
			(pinfunction "H28")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "H29" smd circle
			(at -10.795 3.175)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 121 "unconnected-(J2-PadH29)")
			(pinfunction "H29")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "H30" smd circle
			(at -12.065 3.175)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 1 "GND")
			(pinfunction "H30")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "H31" smd circle
			(at -13.335 3.175)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 89 "/DGPIO_8")
			(pinfunction "H31")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "H32" smd circle
			(at -14.605 3.175)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 69 "/DGPIO_9")
			(pinfunction "H32")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "H33" smd circle
			(at -15.875 3.175)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 1 "GND")
			(pinfunction "H33")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "H34" smd circle
			(at -17.145 3.175)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 9 "/GP_INT")
			(pinfunction "H34")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "H35" smd circle
			(at -18.415 3.175)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 109 "unconnected-(J2-PadH35)")
			(pinfunction "H35")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "H36" smd circle
			(at -19.685 3.175)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 1 "GND")
			(pinfunction "H36")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "H37" smd circle
			(at -20.955 3.175)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 129 "unconnected-(J2-PadH37)")
			(pinfunction "H37")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "H38" smd circle
			(at -22.225 3.175)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 127 "unconnected-(J2-PadH38)")
			(pinfunction "H38")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "H39" smd circle
			(at -23.495 3.175)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 1 "GND")
			(pinfunction "H39")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "H40" smd circle
			(at -24.765 3.175)
			(size 0.64 0.64)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(net 112 "unconnected-(J2-PadH40)")
			(pinfunction "H40")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(model "${T_LIBS}/3d/t_Samtec/ASP-134604-01.step"
			(offset
				(xyz 0 0 0)
			)
			(scale
				(xyz 1 1 1)
			)
			(rotate
				(xyz -90 0 0)
			)
		)
	)
	(footprint "t_Samtec:SAMTEC_ASP-134603-01"
		(layer "B.Cu")
		(at 156.718 58.42 180)
		(property "Reference" "J1"
			(at -25.4 7.635 0)
			(layer "B.SilkS")
		)
		(property "Value" "ASP-134603-01"
			(at -15.875 -7.635 0)
			(layer "B.Fab")
			(hide yes)
		)
		(property "Footprint" "t_Samtec:SAMTEC_ASP-134603-01"
			(at 0 0 0)
			(layer "B.Fab")
			(hide yes)
		)
		(property "Datasheet" "https://mm.digikey.com/Volume0/opasdata/d220001/medias/docus/6129/seaf-xx-xx.x-xx-xx-x-a-xx-k-xr-mkt.pdf"
			(at 0 0 0)
			(layer "B.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 0)
			(layer "B.Fab")
			(hide yes)
		)
		(property "PARTREV" "H"
			(at 0 0 0)
			(unlocked yes)
			(layer "B.Fab")
			(hide yes)
		)
		(property "SNAPEDA_PN" "ASP-134603-01"
			(at 0 0 0)
			(unlocked yes)
			(layer "B.Fab")
			(hide yes)
		)
		(property "STANDARD" "Manufacturer Recommendations"
			(at 0 0 0)
			(unlocked yes)
			(layer "B.Fab")
			(hide yes)
		)
		(property "MAXIMUM_PACKAGE_HEIGHT" "6.55mm"
			(at 0 0 0)
			(unlocked yes)
			(layer "B.Fab")
			(hide yes)
		)
		(property "MANUFACTURER" "Samtec"
			(at 0 0 0)
			(unlocked yes)
			(layer "B.Fab")
			(hide yes)
		)
		(sheetname "Root")
		(sheetfile "SAMTEC_Twist.kicad_sch")
		(attr smd)
		(pad "" np_thru_hole circle
			(at -27.18 0 180)
			(size 1.27 1.27)
			(drill 1.27)
			(layers "*.Cu" "*.Mask")
		)
		(pad "" np_thru_hole circle
			(at 27.18 -3.05 180)
			(size 1.27 1.27)
			(drill 1.27)
			(layers "*.Cu" "*.Mask")
		)
		(pad "C01" smd circle
			(at 24.765 -3.175 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 1 "GND")
			(pinfunction "C01")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "C02" smd circle
			(at 23.495 -3.175 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 41 "unconnected-(J1-PadC02)")
			(pinfunction "C02")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "C03" smd circle
			(at 22.225 -3.175 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 74 "unconnected-(J1-PadC03)")
			(pinfunction "C03")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "C04" smd circle
			(at 20.955 -3.175 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 1 "GND")
			(pinfunction "C04")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "C05" smd circle
			(at 19.685 -3.175 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 1 "GND")
			(pinfunction "C05")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "C06" smd circle
			(at 18.415 -3.175 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 19 "unconnected-(J1-PadC06)")
			(pinfunction "C06")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "C07" smd circle
			(at 17.145 -3.175 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 37 "unconnected-(J1-PadC07)")
			(pinfunction "C07")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "C08" smd circle
			(at 15.875 -3.175 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 1 "GND")
			(pinfunction "C08")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "C09" smd circle
			(at 14.605 -3.175 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 1 "GND")
			(pinfunction "C09")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "C10" smd circle
			(at 13.335 -3.175 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 79 "/TX1_STROBE_IN+")
			(pinfunction "C10")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "C11" smd circle
			(at 12.065 -3.175 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 27 "/TX1_STROBE_IN-")
			(pinfunction "C11")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "C12" smd circle
			(at 10.795 -3.175 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 1 "GND")
			(pinfunction "C12")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "C13" smd circle
			(at 9.525 -3.175 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 1 "GND")
			(pinfunction "C13")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "C14" smd circle
			(at 8.255 -3.175 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 13 "/RX1_ENABLE")
			(pinfunction "C14")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "C15" smd circle
			(at 6.985 -3.175 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 60 "/DGPIO_5")
			(pinfunction "C15")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "C16" smd circle
			(at 5.715 -3.175 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 1 "GND")
			(pinfunction "C16")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "C17" smd circle
			(at 4.445 -3.175 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 1 "GND")
			(pinfunction "C17")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "C18" smd circle
			(at 3.175 -3.175 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 39 "unconnected-(J1-PadC18)")
			(pinfunction "C18")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "C19" smd circle
			(at 1.905 -3.175 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 43 "unconnected-(J1-PadC19)")
			(pinfunction "C19")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "C20" smd circle
			(at 0.635 -3.175 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 1 "GND")
			(pinfunction "C20")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "C21" smd circle
			(at -0.635 -3.175 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 1 "GND")
			(pinfunction "C21")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "C22" smd circle
			(at -1.905 -3.175 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 18 "unconnected-(J1-PadC22)")
			(pinfunction "C22")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "C23" smd circle
			(at -3.175 -3.175 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 77 "unconnected-(J1-PadC23)")
			(pinfunction "C23")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "C24" smd circle
			(at -4.445 -3.175 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 1 "GND")
			(pinfunction "C24")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "C25" smd circle
			(at -5.715 -3.175 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 1 "GND")
			(pinfunction "C25")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "C26" smd circle
			(at -6.985 -3.175 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 16 "/DGPIO_6")
			(pinfunction "C26")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "C27" smd circle
			(at -8.255 -3.175 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 44 "/DGPIO_11")
			(pinfunction "C27")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "C28" smd circle
			(at -9.525 -3.175 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 1 "GND")
			(pinfunction "C28")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "C29" smd circle
			(at -10.795 -3.175 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 1 "GND")
			(pinfunction "C29")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "C30" smd circle
			(at -12.065 -3.175 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 66 "/FMCA_SCL")
			(pinfunction "C30")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "C31" smd circle
			(at -13.335 -3.175 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 29 "/FMCA_SDA")
			(pinfunction "C31")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "C32" smd circle
			(at -14.605 -3.175 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 1 "GND")
			(pinfunction "C32")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "C33" smd circle
			(at -15.875 -3.175 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 1 "GND")
			(pinfunction "C33")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "C34" smd circle
			(at -17.145 -3.175 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 6 "unconnected-(J1-PadC34)")
			(pinfunction "C34")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "C35" smd circle
			(at -18.415 -3.175 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 33 "/VDD_12V")
			(pinfunction "C35")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "C36" smd circle
			(at -19.685 -3.175 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 1 "GND")
			(pinfunction "C36")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "C37" smd circle
			(at -20.955 -3.175 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 33 "/VDD_12V")
			(pinfunction "C37")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "C38" smd circle
			(at -22.225 -3.175 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 1 "GND")
			(pinfunction "C38")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "C39" smd circle
			(at -23.495 -3.175 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 31 "unconnected-(J1-PadC39)")
			(pinfunction "C39")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "C40" smd circle
			(at -24.765 -3.175 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 1 "GND")
			(pinfunction "C40")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "D01" smd circle
			(at 24.765 -1.905 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 93 "/ADP5056_EN")
			(pinfunction "D01")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "D02" smd circle
			(at 23.495 -1.905 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 1 "GND")
			(pinfunction "D02")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "D03" smd circle
			(at 22.225 -1.905 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 1 "GND")
			(pinfunction "D03")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "D04" smd circle
			(at 20.955 -1.905 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 52 "unconnected-(J1-PadD04)")
			(pinfunction "D04")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "D05" smd circle
			(at 19.685 -1.905 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 36 "unconnected-(J1-PadD05)")
			(pinfunction "D05")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "D06" smd circle
			(at 18.415 -1.905 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 1 "GND")
			(pinfunction "D06")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "D07" smd circle
			(at 17.145 -1.905 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 1 "GND")
			(pinfunction "D07")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "D08" smd circle
			(at 15.875 -1.905 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 97 "/TX1_DCLK_OUT+")
			(pinfunction "D08")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "D09" smd circle
			(at 14.605 -1.905 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 54 "/TX1_DCLK_OUT-")
			(pinfunction "D09")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "D10" smd circle
			(at 13.335 -1.905 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 1 "GND")
			(pinfunction "D10")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "D11" smd circle
			(at 12.065 -1.905 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 20 "/TX1_QDATA_IN+")
			(pinfunction "D11")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "D12" smd circle
			(at 10.795 -1.905 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 2 "/TX1_QDATA_IN-")
			(pinfunction "D12")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "D13" smd circle
			(at 9.525 -1.905 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 1 "GND")
			(pinfunction "D13")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "D14" smd circle
			(at 8.255 -1.905 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 81 "/TX1_ENABLE")
			(pinfunction "D14")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "D15" smd circle
			(at 6.985 -1.905 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 64 "/DGPIO_4")
			(pinfunction "D15")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "D16" smd circle
			(at 5.715 -1.905 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 1 "GND")
			(pinfunction "D16")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "D17" smd circle
			(at 4.445 -1.905 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 65 "/MODE")
			(pinfunction "D17")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "D18" smd circle
			(at 3.175 -1.905 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 96 "/RESET")
			(pinfunction "D18")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "D19" smd circle
			(at 1.905 -1.905 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 1 "GND")
			(pinfunction "D19")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "D20" smd circle
			(at 0.635 -1.905 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 73 "unconnected-(J1-PadD20)")
			(pinfunction "D20")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "D21" smd circle
			(at -0.635 -1.905 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 17 "unconnected-(J1-PadD21)")
			(pinfunction "D21")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "D22" smd circle
			(at -1.905 -1.905 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 1 "GND")
			(pinfunction "D22")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "D23" smd circle
			(at -3.175 -1.905 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 7 "unconnected-(J1-PadD23)")
			(pinfunction "D23")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "D24" smd circle
			(at -4.445 -1.905 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 4 "unconnected-(J1-PadD24)")
			(pinfunction "D24")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "D25" smd circle
			(at -5.715 -1.905 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 1 "GND")
			(pinfunction "D25")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "D26" smd circle
			(at -6.985 -1.905 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 82 "/DGPIO_7")
			(pinfunction "D26")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "D27" smd circle
			(at -8.255 -1.905 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 24 "unconnected-(J1-PadD27)")
			(pinfunction "D27")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "D28" smd circle
			(at -9.525 -1.905 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 1 "GND")
			(pinfunction "D28")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "D29" smd circle
			(at -10.795 -1.905 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 84 "unconnected-(J1-PadD29)")
			(pinfunction "D29")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "D30" smd circle
			(at -12.065 -1.905 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 42 "/X1")
			(pinfunction "D30")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "D31" smd circle
			(at -13.335 -1.905 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 94 "/X2")
			(pinfunction "D31")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "D32" smd circle
			(at -14.605 -1.905 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 78 "/3P3_VAX")
			(pinfunction "D32")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "D33" smd circle
			(at -15.875 -1.905 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 55 "unconnected-(J1-PadD33)")
			(pinfunction "D33")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "D34" smd circle
			(at -17.145 -1.905 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 30 "unconnected-(J1-PadD34)")
			(pinfunction "D34")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "D35" smd circle
			(at -18.415 -1.905 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 50 "unconnected-(J1-PadD35)")
			(pinfunction "D35")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "D36" smd circle
			(at -19.685 -1.905 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 11 "unconnected-(J1-PadD36)")
			(pinfunction "D36")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "D37" smd circle
			(at -20.955 -1.905 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 1 "GND")
			(pinfunction "D37")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "D38" smd circle
			(at -22.225 -1.905 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 76 "unconnected-(J1-PadD38)")
			(pinfunction "D38")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "D39" smd circle
			(at -23.495 -1.905 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 1 "GND")
			(pinfunction "D39")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "D40" smd circle
			(at -24.765 -1.905 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 40 "unconnected-(J1-PadD40)")
			(pinfunction "D40")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "G01" smd circle
			(at 24.765 1.905 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 1 "GND")
			(pinfunction "G01")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "G02" smd circle
			(at 23.495 1.905 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 32 "unconnected-(J1-PadG02)")
			(pinfunction "G02")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "G03" smd circle
			(at 22.225 1.905 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 47 "unconnected-(J1-PadG03)")
			(pinfunction "G03")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "G04" smd circle
			(at 20.955 1.905 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 1 "GND")
			(pinfunction "G04")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "G05" smd circle
			(at 19.685 1.905 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 1 "GND")
			(pinfunction "G05")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "G06" smd circle
			(at 18.415 1.905 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 8 "/RX1_DCLK_OUT+")
			(pinfunction "G06")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "G07" smd circle
			(at 17.145 1.905 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 38 "/RX1_DCLK_OUT-")
			(pinfunction "G07")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "G08" smd circle
			(at 15.875 1.905 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 1 "GND")
			(pinfunction "G08")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "G09" smd circle
			(at 14.605 1.905 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 85 "/RX1_IDATA_OUT+")
			(pinfunction "G09")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "G10" smd circle
			(at 13.335 1.905 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 45 "/RX1_IDATA_OUT-")
			(pinfunction "G10")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "G11" smd circle
			(at 12.065 1.905 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 1 "GND")
			(pinfunction "G11")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "G12" smd circle
			(at 10.795 1.905 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 5 "/TX1_IDATA_IN+")
			(pinfunction "G12")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "G13" smd circle
			(at 9.525 1.905 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 91 "/TX1_IDATA_IN-")
			(pinfunction "G13")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "G14" smd circle
			(at 8.255 1.905 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 1 "GND")
			(pinfunction "G14")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "G15" smd circle
			(at 6.985 1.905 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 71 "/SPI_CLK")
			(pinfunction "G15")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "G16" smd circle
			(at 5.715 1.905 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 48 "/SPI_DO")
			(pinfunction "G16")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "G17" smd circle
			(at 4.445 1.905 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 1 "GND")
			(pinfunction "G17")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "G18" smd circle
			(at 3.175 1.905 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 26 "/DGPIO_0")
			(pinfunction "G18")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "G19" smd circle
			(at 1.905 1.905 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 63 "/DGPIO_1")
			(pinfunction "G19")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "G20" smd circle
			(at 0.635 1.905 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 1 "GND")
			(pinfunction "G20")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "G21" smd circle
			(at -0.635 1.905 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 23 "unconnected-(J1-PadG21)")
			(pinfunction "G21")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "G22" smd circle
			(at -1.905 1.905 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 3 "unconnected-(J1-PadG22)")
			(pinfunction "G22")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "G23" smd circle
			(at -3.175 1.905 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 1 "GND")
			(pinfunction "G23")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "G24" smd circle
			(at -4.445 1.905 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 56 "unconnected-(J1-PadG24)")
			(pinfunction "G24")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "G25" smd circle
			(at -5.715 1.905 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 90 "unconnected-(J1-PadG25)")
			(pinfunction "G25")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "G26" smd circle
			(at -6.985 1.905 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 1 "GND")
			(pinfunction "G26")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "G27" smd circle
			(at -8.255 1.905 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 86 "unconnected-(J1-PadG27)")
			(pinfunction "G27")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "G28" smd circle
			(at -9.525 1.905 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 61 "unconnected-(J1-PadG28)")
			(pinfunction "G28")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "G29" smd circle
			(at -10.795 1.905 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 1 "GND")
			(pinfunction "G29")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "G30" smd circle
			(at -12.065 1.905 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 10 "unconnected-(J1-PadG30)")
			(pinfunction "G30")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "G31" smd circle
			(at -13.335 1.905 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 51 "/SPI_DIO")
			(pinfunction "G31")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "G32" smd circle
			(at -14.605 1.905 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 1 "GND")
			(pinfunction "G32")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "G33" smd circle
			(at -15.875 1.905 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 80 "/VADJ_ERR")
			(pinfunction "G33")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "G34" smd circle
			(at -17.145 1.905 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 59 "/PLATFORM_STATUS")
			(pinfunction "G34")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "G35" smd circle
			(at -18.415 1.905 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 1 "GND")
			(pinfunction "G35")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "G36" smd circle
			(at -19.685 1.905 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 25 "unconnected-(J1-PadG36)")
			(pinfunction "G36")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "G37" smd circle
			(at -20.955 1.905 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 67 "unconnected-(J1-PadG37)")
			(pinfunction "G37")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "G38" smd circle
			(at -22.225 1.905 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 1 "GND")
			(pinfunction "G38")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "G39" smd circle
			(at -23.495 1.905 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 12 "/VADJ")
			(pinfunction "G39")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "G40" smd circle
			(at -24.765 1.905 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 1 "GND")
			(pinfunction "G40")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "H01" smd circle
			(at 24.765 3.175 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 46 "unconnected-(J1-PadH01)")
			(pinfunction "H01")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "H02" smd circle
			(at 23.495 3.175 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 1 "GND")
			(pinfunction "H02")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "H03" smd circle
			(at 22.225 3.175 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 1 "GND")
			(pinfunction "H03")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "H04" smd circle
			(at 20.955 3.175 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 70 "/DEV_CLK_OUT")
			(pinfunction "H04")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "H05" smd circle
			(at 19.685 3.175 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 35 "unconnected-(J1-PadH05)")
			(pinfunction "H05")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "H06" smd circle
			(at 18.415 3.175 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 1 "GND")
			(pinfunction "H06")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "H07" smd circle
			(at 17.145 3.175 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 49 "/RX1_STROBE_OUT+")
			(pinfunction "H07")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "H08" smd circle
			(at 15.875 3.175 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 21 "/RX1_STROBE_OUT-")
			(pinfunction "H08")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "H09" smd circle
			(at 14.605 3.175 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 1 "GND")
			(pinfunction "H09")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "H10" smd circle
			(at 13.335 3.175 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 14 "/RX1_QDATA_OUT+")
			(pinfunction "H10")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "H11" smd circle
			(at 12.065 3.175 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 75 "/RX1_QDATA_OUT-")
			(pinfunction "H11")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "H12" smd circle
			(at 10.795 3.175 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 1 "GND")
			(pinfunction "H12")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "H13" smd circle
			(at 9.525 3.175 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 15 "/TX1_DCLK_IN+")
			(pinfunction "H13")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "H14" smd circle
			(at 8.255 3.175 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 62 "/TX1_DCLK_IN-")
			(pinfunction "H14")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "H15" smd circle
			(at 6.985 3.175 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 1 "GND")
			(pinfunction "H15")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "H16" smd circle
			(at 5.715 3.175 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 95 "/DGPIO_10")
			(pinfunction "H16")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "H17" smd circle
			(at 4.445 3.175 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 83 "/DGPIO_3")
			(pinfunction "H17")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "H18" smd circle
			(at 3.175 3.175 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 1 "GND")
			(pinfunction "H18")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "H19" smd circle
			(at 1.905 3.175 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 68 "/SPI_EN")
			(pinfunction "H19")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "H20" smd circle
			(at 0.635 3.175 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 22 "/DGPIO_2")
			(pinfunction "H20")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "H21" smd circle
			(at -0.635 3.175 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 1 "GND")
			(pinfunction "H21")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "H22" smd circle
			(at -1.905 3.175 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 28 "unconnected-(J1-PadH22)")
			(pinfunction "H22")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "H23" smd circle
			(at -3.175 3.175 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 88 "unconnected-(J1-PadH23)")
			(pinfunction "H23")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "H24" smd circle
			(at -4.445 3.175 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 1 "GND")
			(pinfunction "H24")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "H25" smd circle
			(at -5.715 3.175 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 92 "unconnected-(J1-PadH25)")
			(pinfunction "H25")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "H26" smd circle
			(at -6.985 3.175 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 34 "unconnected-(J1-PadH26)")
			(pinfunction "H26")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "H27" smd circle
			(at -8.255 3.175 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 1 "GND")
			(pinfunction "H27")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "H28" smd circle
			(at -9.525 3.175 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 57 "unconnected-(J1-PadH28)")
			(pinfunction "H28")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "H29" smd circle
			(at -10.795 3.175 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 87 "unconnected-(J1-PadH29)")
			(pinfunction "H29")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "H30" smd circle
			(at -12.065 3.175 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 1 "GND")
			(pinfunction "H30")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "H31" smd circle
			(at -13.335 3.175 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 89 "/DGPIO_8")
			(pinfunction "H31")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "H32" smd circle
			(at -14.605 3.175 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 69 "/DGPIO_9")
			(pinfunction "H32")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "H33" smd circle
			(at -15.875 3.175 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 1 "GND")
			(pinfunction "H33")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "H34" smd circle
			(at -17.145 3.175 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 9 "/GP_INT")
			(pinfunction "H34")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "H35" smd circle
			(at -18.415 3.175 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 72 "unconnected-(J1-PadH35)")
			(pinfunction "H35")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "H36" smd circle
			(at -19.685 3.175 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 1 "GND")
			(pinfunction "H36")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "H37" smd circle
			(at -20.955 3.175 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 58 "unconnected-(J1-PadH37)")
			(pinfunction "H37")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "H38" smd circle
			(at -22.225 3.175 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 53 "unconnected-(J1-PadH38)")
			(pinfunction "H38")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(pad "H39" smd circle
			(at -23.495 3.175 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 1 "GND")
			(pinfunction "H39")
			(pintype "passive")
			(solder_mask_margin 0.102)
		)
		(pad "H40" smd circle
			(at -24.765 3.175 180)
			(size 0.64 0.64)
			(layers "B.Cu" "B.Mask")
			(net 98 "unconnected-(J1-PadH40)")
			(pinfunction "H40")
			(pintype "passive+no_connect")
			(solder_mask_margin 0.102)
		)
		(model "${T_LIBS}/3d/t_Samtec/ASP-134603-01.step"
			(offset
				(xyz 0 0 1.778)
			)
			(scale
				(xyz 1 1 1)
			)
			(rotate
				(xyz -90 0 0)
			)
		)
	)
	(gr_rect
		(start 124.587 49.022)
		(end 187.579 86.995)
		(fill none)
		(layer "Edge.Cuts")
	)
	(gr_text "THIS SIDE UP!"
		(at 164.465 77.089 0)
		(layer "B.SilkS")
	)
	(gr_text_box "SK1710 YTH  SAMTEC TWIST BOARD\n"
		(start 129.286 65.786)
		(end 172.974 69.85)
		(layer "B.SilkS")
		(border yes)
	)
	(gr_text_box "C1"
		(start 124.841 66.2305)
		(end 128.016 69.215)
		(layer "B.SilkS")
		(border yes)
	)
	(gr_text_box "C1"
		(start 179.2605 67.31)
		(end 182.6895 69.723)
		(layer "F.SilkS")
		(border yes)
	)
	(zone
		(net 1)
		(net_name "GND")
		(layers "F.Cu" "In1.Cu" "In2.Cu" "In3.Cu" "In4.Cu" "B.Cu")
		(hatch edge 0.5)
		(connect_pads
			(clearance 0.5)
		)
		(min_thickness 0.2032)
		(filled_areas_thickness no)
		(fill yes
			(thermal_gap 0.2032)
			(thermal_bridge_width 0.2032)
		)
		(polygon
			(pts
				(xy 125.349 49.657) (xy 186.817 49.403) (xy 186.69 86.487) (xy 125.349 86.614)
			)
		)
	)
)