(kicad_pcb (version 4) (host pcbnew 4.0.7)
  (general
    (links 38)
    (no_connects 1)
    (area 192.779782 75.939782 223.780218 106.940218)
    (thickness 1.6)
    (drawings 14)
    (tracks 145)
    (zones 0)
    (modules 27)
    (nets 16)
  )
  (page USLetter)
  (layers
    (0 F.Cu signal)
    (31 B.Cu signal)
    (34 B.Paste user)
    (35 F.Paste user)
    (36 B.SilkS user)
    (37 F.SilkS user)
    (38 B.Mask user)
    (39 F.Mask user)
    (40 Dwgs.User user)
    (44 Edge.Cuts user)
  )
  (setup
    (last_trace_width 0.1524)
    (user_trace_width 0.254)
    (user_trace_width 0.3048)
    (user_trace_width 0.4064)
    (user_trace_width 0.6096)
    (user_trace_width 2.032)
    (trace_clearance 0.1524)
    (zone_clearance 0.35)
    (zone_45_only no)
    (trace_min 0.1524)
    (segment_width 0.254)
    (edge_width 0.1)
    (via_size 0.6858)
    (via_drill 0.3302)
    (via_min_size 0.6858)
    (via_min_drill 0.3302)
    (user_via 1 0.5)
    (uvia_size 0.762)
    (uvia_drill 0.508)
    (uvias_allowed no)
    (uvia_min_size 0.508)
    (uvia_min_drill 0.127)
    (pcb_text_width 0.3)
    (pcb_text_size 1.5 1.5)
    (mod_edge_width 0.15)
    (mod_text_size 1 1)
    (mod_text_width 0.15)
    (pad_size 1.6 1.6)
    (pad_drill 0)
    (pad_to_mask_clearance 0)
    (aux_axis_origin 0 0)
    (grid_origin 210.82 95.25)
    (visible_elements 7FFFFFFF)
    (pcbplotparams
      (layerselection 0x010f0_80000001)
      (usegerberextensions true)
      (excludeedgelayer true)
      (linewidth 0.100000)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15)
      (hpglpenoverlay 2)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (padsonsilk false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 0)
      (scaleselection 1)
      (outputdirectory gerbers/))
  )
  (net 0 "")
  (net 1 GND)
  (net 2 +BATT)
  (net 3 "Net-(CON1-Pad1)")
  (net 4 "Net-(CON1-Pad3)")
  (net 5 "Net-(CON1-Pad4)")
  (net 6 "Net-(CON1-Pad5)")
  (net 7 "Net-(D1-Pad1)")
  (net 8 "Net-(D2-Pad1)")
  (net 9 "Net-(D3-Pad1)")
  (net 10 "Net-(D0-Pad1)")
  (net 11 "Net-(D3-Pad2)")
  (net 12 "Net-(D4-Pad2)")
  (net 13 "Net-(D4-Pad1)")
  (net 14 "Net-(BT1-Pad1)")
  (net 15 "Net-(SW1-Pad1)")
  (net_class Default "This is the default net class."
    (clearance 0.1524)
    (trace_width 0.1524)
    (via_dia 0.6858)
    (via_drill 0.3302)
    (uvia_dia 0.762)
    (uvia_drill 0.508)
    (add_net +BATT)
    (add_net GND)
    (add_net "Net-(BT1-Pad1)")
    (add_net "Net-(CON1-Pad1)")
    (add_net "Net-(CON1-Pad3)")
    (add_net "Net-(CON1-Pad4)")
    (add_net "Net-(CON1-Pad5)")
    (add_net "Net-(D0-Pad1)")
    (add_net "Net-(D1-Pad1)")
    (add_net "Net-(D2-Pad1)")
    (add_net "Net-(D3-Pad1)")
    (add_net "Net-(D3-Pad2)")
    (add_net "Net-(D4-Pad1)")
    (add_net "Net-(D4-Pad2)")
    (add_net "Net-(SW1-Pad1)")
  )
  (module LED_0201 (layer F.Cu) (tedit 5B8CBE79)
    (at 208.28 103.505)
    (descr "Resistor SMD 0201, reflow soldering, Vishay (see crcw0201e3.pdf)")
    (tags "resistor 0201")
    (attr smd)
    (fp_text reference D4 (at 1.016 0.889) (layer F.SilkS))
    (fp_text value LED (at 0 1.7) (layer F.Fab))
    (pad 1 smd rect (at -0.3 0) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask)
      (net 13 "Net-(D4-Pad1)"))
    (pad 2 smd rect (at 0.3 0) (size 0.4 0.4) (layers F.Cu F.Paste F.Mask)
      (net 12 "Net-(D4-Pad2)"))
    (model Resistors_SMD.3dshapes/R_0201.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module LED_0402 (layer F.Cu) (tedit 5B8CBDF1)
    (at 208.28 101.6)
    (descr "Resistor SMD 0402, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0402")
    (attr smd)
    (fp_text reference D3 (at 1.3 1) (layer F.SilkS))
    (fp_text value LED (at 0 1.8) (layer F.Fab))
    (pad 1 smd rect (at -0.5 0) (size 0.7 0.6) (layers F.Cu F.Paste F.Mask)
      (net 9 "Net-(D3-Pad1)"))
    (pad 2 smd rect (at 0.5 0) (size 0.7 0.6) (layers F.Cu F.Paste F.Mask)
      (net 11 "Net-(D3-Pad2)"))
    (model Resistors_SMD.3dshapes/R_0402.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module footprints:LED-1206 (layer F.Cu) (tedit 5902C0FC)
    (at 208.28 92.075)
    (descr "LED 1206 smd package")
    (tags "LED1206 SMD")
    (attr smd)
    (fp_text reference D0 (at 2.667 1.778) (layer F.SilkS))
    (fp_text value LED (at 0 2) (layer F.Fab))
    (pad 2 smd rect (at 1.524 0 180) (size 1.7 1.80086) (layers F.Cu F.Paste F.Mask)
      (net 5 "Net-(CON1-Pad4)"))
    (pad 1 smd rect (at -1.651 0 180) (size 1.7 1.80086) (layers F.Cu F.Paste F.Mask)
      (net 10 "Net-(D0-Pad1)"))
    (model LEDs.3dshapes/LED_1206.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module footprints:Pin_Header_Straight_1x01 (layer F.Cu) (tedit 5B88CCD5)
    (at 208.28 80.01)
    (descr "Through hole pin header")
    (tags "pin header")
    (fp_text reference P5 (at -0.6 -0.5) (layer F.SilkS) hide)
    (fp_text value CONN_01X01 (at 0 0.9) (layer F.Fab))
    (pad 1 thru_hole circle (at 0 0) (size 5 5) (drill 2) (layers *.Cu *.Mask)
      (net 1 GND))
  )
  (module footprints:BATT_CR2032_SMD (layer B.Cu) (tedit 56CFB5D2)
    (at 208.28 96.52 180)
    (tags battery)
    (fp_text reference BT1 (at 0 -5.08 180) (layer B.SilkS) hide)
    (fp_text value Battery (at 0 2.54 180) (layer B.SilkS) hide)
    (pad 2 smd circle (at 0 0 180) (size 17.78 17.78) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (pad 1 smd rect (at -11.43 0 180) (size 2.54 5.08) (layers B.Cu B.Paste B.Mask)
      (net 14 "Net-(BT1-Pad1)"))
    (pad 1 smd rect (at 11.43 0 180) (size 2.54 5.08) (layers B.Cu B.Paste B.Mask)
      (net 14 "Net-(BT1-Pad1)"))
  )
  (module footprints:C_1206_HandSoldering (layer F.Cu) (tedit 5902BDF4)
    (at 220.853 93.853 90)
    (descr "Capacitor SMD 1206, hand soldering")
    (tags "capacitor 1206")
    (attr smd)
    (fp_text reference C1 (at 0 0 90) (layer F.SilkS))
    (fp_text value "0.1 uF" (at 0 2.3 90) (layer F.Fab))
    (pad 1 smd rect (at -1.778 0 90) (size 1.6 1.6) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 2 smd rect (at 1.778 0 90) (size 1.6 1.6) (layers F.Cu F.Paste F.Mask)
      (net 2 +BATT))
    (model Capacitors_SMD.3dshapes/C_1206.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module footprints:AVR-ISP-6 (layer B.Cu) (tedit 5B8B50E2)
    (at 217.17 85.09 45)
    (descr "6-lead dip package, row spacing 7.62 mm (300 mils)")
    (tags "dil dip 2.54 300")
    (fp_text reference CON1 (at 0 2.54 45) (layer B.SilkS) hide)
    (fp_text value AVR-ISP-6 (at 0 3.72 45) (layer B.Fab) hide)
    (pad 1 smd rect (at 0 0 45) (size 1.6 1.6) (layers B.Cu B.Paste B.Mask)
      (net 3 "Net-(CON1-Pad1)"))
    (pad 2 smd circle (at 2.54 0 45) (size 1.6 1.6) (layers B.Cu B.Paste B.Mask)
      (net 2 +BATT))
    (pad 3 smd oval (at 0 -2.54 45) (size 1.6 1.6) (layers B.Cu B.Paste B.Mask)
      (net 4 "Net-(CON1-Pad3)"))
    (pad 4 smd oval (at 2.54 -2.54 45) (size 1.6 1.6) (layers B.Cu B.Paste B.Mask)
      (net 5 "Net-(CON1-Pad4)"))
    (pad 5 smd oval (at 0 -5.08 45) (size 1.6 1.6) (layers B.Cu B.Paste B.Mask)
      (net 6 "Net-(CON1-Pad5)"))
    (pad 6 smd oval (at 2.54 -5.08 45) (size 1.6 1.6) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
  )
  (module footprints:LED-0805 (layer F.Cu) (tedit 5902C116)
    (at 208.28 95.885)
    (descr "LED 0805 smd package")
    (tags "LED 0805 SMD")
    (attr smd)
    (fp_text reference D1 (at 2.2225 1.4605) (layer F.SilkS))
    (fp_text value LED (at 0 1.75) (layer F.Fab))
    (pad 2 smd rect (at 1.143 0 180) (size 1.3 1.19888) (layers F.Cu F.Paste F.Mask)
      (net 3 "Net-(CON1-Pad1)"))
    (pad 1 smd rect (at -1.27 0 180) (size 1.3 1.19888) (layers F.Cu F.Paste F.Mask)
      (net 7 "Net-(D1-Pad1)"))
    (model LEDs.3dshapes/LED-0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
    (model LEDs.3dshapes/LED_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module footprints:LED-0603 (layer F.Cu) (tedit 5902C124)
    (at 208.28 99.06)
    (descr "LED 0603 smd package")
    (tags "LED led 0603 SMD smd SMT smt smdled SMDLED smtled SMTLED")
    (attr smd)
    (fp_text reference D2 (at 1.778 1.0795) (layer F.SilkS))
    (fp_text value LED (at 0 1.5) (layer F.Fab))
    (pad 2 smd rect (at 0.889 0 180) (size 1 0.79756) (layers F.Cu F.Paste F.Mask)
      (net 4 "Net-(CON1-Pad3)"))
    (pad 1 smd rect (at -0.889 0 180) (size 1 0.79756) (layers F.Cu F.Paste F.Mask)
      (net 8 "Net-(D2-Pad1)"))
    (model LEDs.3dshapes/LED_0603.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module footprints:SOIJ-8_5.3x5.3mm_Pitch1.27mm (layer F.Cu) (tedit 5B8B51AD)
    (at 216.027 95.758 90)
    (descr "8-Lead Plastic Small Outline (SM) - Medium, 5.28 mm Body [SOIC] (see Microchip Packaging Specification 00000049BS.pdf)")
    (tags "SOIC 1.27")
    (attr smd)
    (fp_text reference IC1 (at -1.27 2.159 90) (layer F.SilkS) hide)
    (fp_text value ATTINY (at -0.254 0.127 180) (layer F.SilkS))
    (pad 1 smd rect (at -3.65 -1.905 90) (size 1.7 0.65) (layers F.Cu F.Paste F.Mask)
      (net 6 "Net-(CON1-Pad5)"))
    (pad 2 smd rect (at -3.65 -0.635 90) (size 1.7 0.65) (layers F.Cu F.Paste F.Mask)
      (net 11 "Net-(D3-Pad2)"))
    (pad 3 smd rect (at -3.65 0.635 90) (size 1.7 0.65) (layers F.Cu F.Paste F.Mask)
      (net 12 "Net-(D4-Pad2)"))
    (pad 4 smd rect (at -3.65 1.905 90) (size 1.7 0.65) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 5 smd rect (at 3.65 1.905 90) (size 1.7 0.65) (layers F.Cu F.Paste F.Mask)
      (net 5 "Net-(CON1-Pad4)"))
    (pad 6 smd rect (at 3.65 0.635 90) (size 1.7 0.65) (layers F.Cu F.Paste F.Mask)
      (net 3 "Net-(CON1-Pad1)"))
    (pad 7 smd rect (at 3.65 -0.635 90) (size 1.7 0.65) (layers F.Cu F.Paste F.Mask)
      (net 4 "Net-(CON1-Pad3)"))
    (pad 8 smd rect (at 3.65 -1.905 90) (size 1.7 0.65) (layers F.Cu F.Paste F.Mask)
      (net 2 +BATT))
    (model Housings_SOIC.3dshapes/SOIJ-8_5.3x5.3mm_Pitch1.27mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module footprints:testPad (layer F.Cu) (tedit 5902BD57)
    (at 212.09 92.075)
    (descr "module 1 pin (ou trou mecanique de percage)")
    (tags DEV)
    (fp_text reference P0 (at -0.0635 0) (layer F.SilkS) hide)
    (fp_text value CONN_01X01 (at 0 0) (layer F.Fab))
    (pad 1 smd oval (at 0 0) (size 0.508 0.762) (layers F.Cu F.Paste F.Mask)
      (net 5 "Net-(CON1-Pad4)"))
  )
  (module footprints:testPad (layer F.Cu) (tedit 5902BD57)
    (at 211.582 95.885)
    (descr "module 1 pin (ou trou mecanique de percage)")
    (tags DEV)
    (fp_text reference P1 (at -0.0635 0) (layer F.SilkS) hide)
    (fp_text value CONN_01X01 (at 0 0) (layer F.Fab))
    (pad 1 smd oval (at 0 0) (size 0.508 0.762) (layers F.Cu F.Paste F.Mask)
      (net 3 "Net-(CON1-Pad1)"))
  )
  (module footprints:testPad (layer F.Cu) (tedit 5902BD57)
    (at 211.201 99.06)
    (descr "module 1 pin (ou trou mecanique de percage)")
    (tags DEV)
    (fp_text reference P2 (at -0.0635 0) (layer F.SilkS) hide)
    (fp_text value CONN_01X01 (at 0 0) (layer F.Fab))
    (pad 1 smd oval (at 0 0) (size 0.508 0.762) (layers F.Cu F.Paste F.Mask)
      (net 4 "Net-(CON1-Pad3)"))
  )
  (module footprints:testPad (layer F.Cu) (tedit 5902BD57)
    (at 210.82 101.6)
    (descr "module 1 pin (ou trou mecanique de percage)")
    (tags DEV)
    (fp_text reference P3 (at -0.0635 0) (layer F.SilkS) hide)
    (fp_text value CONN_01X01 (at 0 0) (layer F.Fab))
    (pad 1 smd oval (at 0 0) (size 0.508 0.762) (layers F.Cu F.Paste F.Mask)
      (net 11 "Net-(D3-Pad2)"))
  )
  (module footprints:testPad (layer F.Cu) (tedit 5902BD57)
    (at 210.566 103.505)
    (descr "module 1 pin (ou trou mecanique de percage)")
    (tags DEV)
    (fp_text reference P4 (at -0.0635 0) (layer F.SilkS) hide)
    (fp_text value CONN_01X01 (at 0 0) (layer F.Fab))
    (pad 1 smd oval (at 0 0) (size 0.508 0.762) (layers F.Cu F.Paste F.Mask)
      (net 12 "Net-(D4-Pad2)"))
  )
  (module footprints:testPad (layer F.Cu) (tedit 5902BD57)
    (at 198.247 92.075)
    (descr "module 1 pin (ou trou mecanique de percage)")
    (tags DEV)
    (fp_text reference PG0 (at -0.0635 0) (layer F.SilkS) hide)
    (fp_text value CONN_01X01 (at 0 0) (layer F.Fab))
    (pad 1 smd oval (at 0 0) (size 0.508 0.762) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
  )
  (module footprints:testPad (layer F.Cu) (tedit 5902BD57)
    (at 198.6915 95.885)
    (descr "module 1 pin (ou trou mecanique de percage)")
    (tags DEV)
    (fp_text reference PG1 (at -0.0635 0) (layer F.SilkS) hide)
    (fp_text value CONN_01X01 (at 0 0) (layer F.Fab))
    (pad 1 smd oval (at 0 0) (size 0.508 0.762) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
  )
  (module footprints:testPad (layer F.Cu) (tedit 5902BD57)
    (at 199.898 99.06)
    (descr "module 1 pin (ou trou mecanique de percage)")
    (tags DEV)
    (fp_text reference PG2 (at -0.0635 0) (layer F.SilkS) hide)
    (fp_text value CONN_01X01 (at 0 0) (layer F.Fab))
    (pad 1 smd oval (at 0 0) (size 0.508 0.762) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
  )
  (module footprints:testPad (layer F.Cu) (tedit 5902BD57)
    (at 201.7395 101.6)
    (descr "module 1 pin (ou trou mecanique de percage)")
    (tags DEV)
    (fp_text reference PG3 (at -0.0635 0) (layer F.SilkS) hide)
    (fp_text value CONN_01X01 (at 0 0) (layer F.Fab))
    (pad 1 smd oval (at 0 0) (size 0.508 0.762) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
  )
  (module footprints:testPad (layer F.Cu) (tedit 5902BD57)
    (at 203.708 103.505)
    (descr "module 1 pin (ou trou mecanique de percage)")
    (tags DEV)
    (fp_text reference PG4 (at -0.0635 0) (layer F.SilkS) hide)
    (fp_text value CONN_01X01 (at 0 0) (layer F.Fab))
    (pad 1 smd oval (at 0 0) (size 0.508 0.762) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
  )
  (module footprints:R_1206 (layer F.Cu) (tedit 5902A5E4)
    (at 202.565 92.075 180)
    (descr "Resistor SMD 1206, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 1206")
    (attr smd)
    (fp_text reference R0 (at 0 0 180) (layer F.SilkS) hide)
    (fp_text value 330 (at 0 2.3 180) (layer F.Fab))
    (pad 1 smd rect (at -1.778 0 180) (size 1.1 1.7) (layers F.Cu F.Paste F.Mask)
      (net 10 "Net-(D0-Pad1)"))
    (pad 2 smd rect (at 1.651 0 180) (size 1.1 1.7) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (model Resistors_SMD.3dshapes/R_1206.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module footprints:R_0805 (layer F.Cu) (tedit 58DFDC5C)
    (at 203.2 95.885 180)
    (descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0805")
    (attr smd)
    (fp_text reference R1 (at 0 0 180) (layer F.SilkS) hide)
    (fp_text value 330 (at 0 2.1 180) (layer F.Fab))
    (pad 1 smd rect (at -1.143 0 180) (size 0.9 1.3) (layers F.Cu F.Paste F.Mask)
      (net 7 "Net-(D1-Pad1)"))
    (pad 2 smd rect (at 1.143 0 180) (size 0.9 1.3) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (model Resistors_SMD.3dshapes/R_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module footprints:R_0603 (layer F.Cu) (tedit 5902A5F6)
    (at 203.835 99.06 180)
    (descr "Resistor SMD 0603, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0603")
    (attr smd)
    (fp_text reference R2 (at 0 0 180) (layer F.SilkS) hide)
    (fp_text value 330 (at 0 1.9 180) (layer F.Fab))
    (pad 1 smd rect (at -0.889 0 180) (size 0.7 0.9) (layers F.Cu F.Paste F.Mask)
      (net 8 "Net-(D2-Pad1)"))
    (pad 2 smd rect (at 1.016 0 180) (size 0.7 0.9) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (model Resistors_SMD.3dshapes/R_0603.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module footprints:R_0402 (layer F.Cu) (tedit 58DFDC4A)
    (at 204.47 101.6 180)
    (descr "Resistor SMD 0402, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0402")
    (attr smd)
    (fp_text reference R3 (at 0 0 180) (layer Dwgs.User) hide)
    (fp_text value 330 (at 0 1.8 180) (layer F.Fab))
    (pad 1 smd rect (at -0.4 0 180) (size 0.6 0.6) (layers F.Cu F.Paste F.Mask)
      (net 9 "Net-(D3-Pad1)"))
    (pad 2 smd rect (at 0.5 0 180) (size 0.6 0.6) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (model Resistors_SMD.3dshapes/R_0402.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module footprints:R_0201 (layer F.Cu) (tedit 5A2C7C82)
    (at 205.74 103.505 180)
    (descr "Resistor SMD 0201, reflow soldering, Vishay (see crcw0201e3.pdf)")
    (tags "resistor 0201")
    (attr smd)
    (fp_text reference R4 (at 1.397 0.762 180) (layer F.SilkS) hide)
    (fp_text value 330 (at 0 1.7 180) (layer F.Fab))
    (pad 1 smd rect (at -0.4 0 180) (size 0.45 0.43) (layers F.Cu F.Paste F.Mask)
      (net 13 "Net-(D4-Pad1)"))
    (pad 2 smd rect (at 0.4 0 180) (size 0.45 0.43) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (model Resistors_SMD.3dshapes/R_0201.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module footprints:SPST_SMD (layer B.Cu) (tedit 5860A656)
    (at 199.898 86.614 45)
    (descr "Through hole pin header")
    (tags "pin header")
    (fp_text reference SW1 (at 0 -3 45) (layer B.SilkS))
    (fp_text value SW_SPDT (at 0.1 0 45) (layer B.Fab))
    (fp_text user JS102011SAQN (at 0 -1.700001 45) (layer B.Fab))
    (pad "" np_thru_hole circle (at 3.4 -2.75 45) (size 0.9 0.9) (drill 0.9) (layers *.Cu *.Mask))
    (pad 1 smd rect (at -2.5 0 45) (size 1.2 2.5) (layers B.Cu B.Paste B.Mask)
      (net 15 "Net-(SW1-Pad1)"))
    (pad 2 smd rect (at 0.04 0 45) (size 1.2 2.5) (layers B.Cu B.Paste B.Mask)
      (net 14 "Net-(BT1-Pad1)"))
    (pad 3 smd rect (at 2.5 0 45) (size 1.2 2.5) (layers B.Cu B.Paste B.Mask)
      (net 2 +BATT))
    (pad "" np_thru_hole circle (at -3.4 -2.75 45) (size 0.9 0.9) (drill 0.9) (layers *.Cu *.Mask))
    (model Pin_Headers.3dshapes/Pin_Header_Straight_2x06.wrl
      (at (xyz 0.05 -0.25 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 90))
    )
  )
  (module footprints:logo (layer F.Cu) (tedit 0)
    (at 208.788 86.36)
    (fp_text reference G*** (at 0 0) (layer F.SilkS) hide)
    (fp_text value LOGO (at 0.75 0) (layer F.SilkS) hide)
  )
  (gr_text - (at 214.63 78.232) (layer B.SilkS))
  (gr_text + (at 220.726 83.82) (layer B.SilkS))
  (gr_text ON (at 202.184 80.264) (layer B.SilkS))
  (gr_circle (center 208.28 91.44) (end 193.04 88.9) (layer Edge.Cuts) (width 0.1))
  (gr_text "bit.ly/\nSMDChallenge" (at 209.042 85.344) (layer B.SilkS))
  (gr_text 0201 (at 203.327 103.632) (layer F.SilkS))
  (gr_text CR2032 (at 194.31 92.202 270) (layer B.SilkS))
  (gr_text 0402 (at 201.295 101.6) (layer F.SilkS))
  (gr_text 0603 (at 199.39 99.06) (layer F.SilkS))
  (gr_text 0805 (at 198.12 95.885) (layer F.SilkS))
  (gr_text 1206 (at 197.485 92.075) (layer F.SilkS))
  (zone (net 1) (net_name GND) (layer F.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.35))
    (min_thickness 0.2)
    (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 226.06 110.49) (xy 190.5 110.49) (xy 190.5 72.39) (xy 226.06 72.39)
      )
    )
  )
  (zone (net 1) (net_name GND) (layer B.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.35))
    (min_thickness 0.2)
    (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 228.6 113.03) (xy 187.96 113.03) (xy 187.96 69.85) (xy 228.6 69.85)
      )
    )
  )
)
