METER GROUNDS
METER MOVEMENT
LED BACKLIGHT
B17 METER TESTER CAPE
DCA 11/03/17
REV -
B17 METER TESTER TESTS RED AND BLUE BACKLIGHTS AND METER MOVEMENT
ON UP TO FOUR METERS AT A TIME.
CONNECTIONS:
M1 - METER 1 MOVEMENT
M1_GND - METER 1 GROUND
M1R - METER 1 RED LED
M1B - METER 1 BLUE LED
SAME PATTERN FOR ALL METERS
PRESS TO
START/STOP TEST
POWER/STATUS
>NAME
>VALUE
>NAME
>VALUE
P8
P9
>NAME
>VALUE
>NAME
>VALUE
SMD Package 0603 (metric 1608). Footprint STANDARD ST0 - Maximum Clearance between SMDs.
Chip standard dimensions: L0.063" x W0.031" (L1.60mm x W0.80mm).
SMD size 0.037.5" x 0.043" (0.9525mm x 1.0922mm).
SMD coordinates X = +/- 0.03475" (+/- 0.88265mm).
Clearance between SMDs 0.032" (0.8128mm).
Package outline dimensions L0.121" x W0.057" (3.0734mm x 1.4478mm).
>NAME
>VALUE
Pad for 20 AWG stranded wire, dia 0.120", drill 0.052", shape Round - with Outline
>NAME
>NAME
>VALUE
>NAME
>VALUE
SMD Package 0805 (metric 2012). Footprint STANDARD ST0 - Maximum Clearance between SMDs.
Chip standard dimensions: L0.079" x W0.049" (L2.00mm x W1.25mm).
SMD size 0.047" x 0.060" (1.1938mm x 1.524mm).
SMD coordinates X = +/- 0.0435" (+/- 1.1049mm).
Clearance between SMDs 0.040" (1.016mm).
Package outline dimensions L0.148" x W0.074" (3.7592mm x 1.8796mm).
>NAME
>VALUE
SMD Package 0805 (metric 2012). Footprint STANDARD ST1.
Chip standard dimensions: L0.079" x W0.049" (L2.00mm x W1.25mm).
SMD size 0.052" x 0.060" (1.3208mm x 1.524mm).
SMD coordinates X = +/- 0.041" (+/- 1.0414mm).
Clearance between SMDs 0.030" (0.762mm).
Package outline dimensions L0.148" x W0.074" (3.7592mm x 1.8796mm).
>NAME
>VALUE
Capacitor, Electrolytic, Aluminum Can type, Surface Mount, Standard (Nominal) Package LG Footprint; Fits NIC_NACE, NIC_NACZ, Jianghai_HVF, Nichicon, Can Sizes (DxL) 6.3x5.5mm, 6.3x5.7mm, 6.3x5.8mm 6.3x6.3mm, 6.3x7.7mm & 6.3x8mm;
SMDs are aligned on X axis; Polarity + sign is under pad;
Device Base Dimensions max : 6.8mm x 6.8mm (0.2677" x 0.2677");
Device Can diameter max: 6.8mm (0.2677");
Outline dimensions: 7.0mm (0.2756") x 7.0mm (0.2756");
Lead Footprint area max: 0.8mm x 3.0mm (0.0315" x 0.11811");
SMD dimensions: 3.7mm x 1.4mm (0.14567" x 0.055118");
SMD locations: +/- 2.7mm (0.1063");
Clearance between SMDs: 1.7mm (0.06693");
>NAME
>VALUE
SOT23 package, Standard footprint version. SMD dimensions 0.8mm x 0.9mm (0.0315" x 0.03543").
SMD coordinates: SMD1 & SMD2 = +/- 0.96mm (0.0378"), SMDs 1,2 & SMD3 = +/-1.015mm (0.04").
Clearance between SMD1 & SMD2 = 1.12mm (0.044"), Clearance between SMD1,2 & SMD3 = 1.14mm (0.0448")
>VALUE
>NAME
MidNite Logo, size X=0.340" Y=0.177". The M Lower left corner Located at (0, 0). Imported from the main bitmap file badgegrey2 using: Scaled, Mil, and a scale factor of 0.25.
TACT Switch SMT - 6mm x 6mm
>NAME
>VALUE
SMD Package 0805 (metric 2012). Lite Footprint (Old package).
Chip standard dimensions: L0.079" x W0.049" (L2.00mm x W1.25mm).
SMD size 0.035" x 0.056" (0.889mm x 1.4224mm).
SMD coordinates X = +/- 0.0375" (+/- 0.9525mm).
Clearance between SMDs 0.040" (1.016mm).
Package outline dimensions L0.125" x W0.071" (3.175mm x 1.8034mm).
>NAME
>VALUE
<b>EAGLE Design Rules</b>
<p>
Die Standard-Design-Rules sind so gewählt, dass sie für
die meisten Anwendungen passen. Sollte ihre Platine
besondere Anforderungen haben, treffen Sie die erforderlichen
Einstellungen hier und speichern die Design Rules unter
einem neuen Namen ab.
<b>EAGLE Design Rules</b>
<p>
The default Design Rules have been set to cover
a wide range of applications. Your particular design
may have different requirements, so please make the
necessary adjustments and save your customized
design rules under a new name.
Since Version 6.2.2 text objects can contain more than one line,
which will not be processed correctly with this version.