(kicad_pcb (version 20171130) (host pcbnew "(5.1.10)-1")
  (general
    (thickness 1.6)
    (drawings 65)
    (tracks 139)
    (zones 0)
    (modules 9)
    (nets 25)
  )
  (page A4)
  (layers
    (0 F.Cu signal)
    (31 B.Cu signal hide)
    (32 B.Adhes user hide)
    (33 F.Adhes user hide)
    (34 B.Paste user hide)
    (35 F.Paste user)
    (36 B.SilkS user hide)
    (37 F.SilkS user)
    (38 B.Mask user hide)
    (39 F.Mask user)
    (40 Dwgs.User user hide)
    (41 Cmts.User user hide)
    (42 Eco1.User user hide)
    (43 Eco2.User user hide)
    (44 Edge.Cuts user)
    (45 Margin user hide)
    (46 B.CrtYd user hide)
    (47 F.CrtYd user)
    (48 B.Fab user hide)
    (49 F.Fab user)
  )
  (setup
    (last_trace_width 0.25)
    (user_trace_width 0.3)
    (user_trace_width 0.4)
    (user_trace_width 0.5)
    (trace_clearance 0.2)
    (zone_clearance 0.254)
    (zone_45_only no)
    (trace_min 0.2)
    (via_size 0.8)
    (via_drill 0.4)
    (via_min_size 0.4)
    (via_min_drill 0.3)
    (user_via 1 0.8)
    (uvia_size 0.3)
    (uvia_drill 0.1)
    (uvias_allowed no)
    (uvia_min_size 0.2)
    (uvia_min_drill 0.1)
    (edge_width 0.05)
    (segment_width 0.2)
    (pcb_text_width 0.3)
    (pcb_text_size 1.5 1.5)
    (mod_edge_width 0.12)
    (mod_text_size 1 1)
    (mod_text_width 0.15)
    (pad_size 1.524 1.524)
    (pad_drill 0.762)
    (pad_to_mask_clearance 0.051)
    (solder_mask_min_width 0.25)
    (aux_axis_origin 150.5 96.25)
    (visible_elements 7FFFFFFF)
    (pcbplotparams
      (layerselection 0x010fc_ffffffff)
      (usegerberextensions false)
      (usegerberattributes false)
      (usegerberadvancedattributes false)
      (creategerberjobfile false)
      (excludeedgelayer true)
      (linewidth 0.200000)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin true)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (padsonsilk false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 0)
      (scaleselection 1)
      (outputdirectory "plots/"))
  )
  (net 0 "")
  (net 1 /LEDA)
  (net 2 /LEDK)
  (net 3 /TFT_RST)
  (net 4 /MOSI)
  (net 5 /SCLK)
  (net 6 /TFT_DC)
  (net 7 /TFT_CS)
  (net 8 +2V8)
  (net 9 GND)
  (net 10 "Net-(R101-Pad2)")
  (net 11 "Net-(R102-Pad2)")
  (net 12 "Net-(X101-Pad39)")
  (net 13 "Net-(X101-Pad33)")
  (net 14 "Net-(X101-Pad6)")
  (net 15 "Net-(X101-Pad5)")
  (net 16 "Net-(X101-Pad4)")
  (net 17 /XR-SCL)
  (net 18 /YD-SDA)
  (net 19 /XL-~TIRQ)
  (net 20 /YU-~TRST)
  (net 21 "Net-(JP101-Pad2)")
  (net 22 "Net-(JP102-Pad2)")
  (net 23 "Net-(JP102-Pad1)")
  (net 24 "Net-(R104-Pad1)")
  (net_class Default "This is the default net class."
    (clearance 0.2)
    (trace_width 0.25)
    (via_dia 0.8)
    (via_drill 0.4)
    (uvia_dia 0.3)
    (uvia_drill 0.1)
    (add_net +2V8)
    (add_net /LEDA)
    (add_net /LEDK)
    (add_net /MOSI)
    (add_net /SCLK)
    (add_net /TFT_CS)
    (add_net /TFT_DC)
    (add_net /TFT_RST)
    (add_net /XL-~TIRQ)
    (add_net /XR-SCL)
    (add_net /YD-SDA)
    (add_net /YU-~TRST)
    (add_net GND)
    (add_net "Net-(JP101-Pad2)")
    (add_net "Net-(JP102-Pad1)")
    (add_net "Net-(JP102-Pad2)")
    (add_net "Net-(R101-Pad2)")
    (add_net "Net-(R102-Pad2)")
    (add_net "Net-(R104-Pad1)")
    (add_net "Net-(X101-Pad33)")
    (add_net "Net-(X101-Pad39)")
    (add_net "Net-(X101-Pad4)")
    (add_net "Net-(X101-Pad5)")
    (add_net "Net-(X101-Pad6)")
  )
  (module Resistor_SMD:R_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 143.25 96)
    (descr "Resistor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R102 (at 0.0125 1.75) (layer F.SilkS))
    (fp_text value 12 (at 0 1.82) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 1.4875 0) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 11 "Net-(R102-Pad2)"))
    (pad 1 smd roundrect (at -1.4875 0) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 4 /MOSI))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 133.25 97.25 270)
    (descr "Resistor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R104 (at -3 0.25 180) (layer F.SilkS))
    (fp_text value 10 (at 0 1.82 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.4875 0 270) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 21 "Net-(JP101-Pad2)"))
    (pad 1 smd roundrect (at -1.4875 0 270) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 24 "Net-(R104-Pad1)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_TO_SOT_SMD:SOT-23 (layer F.Cu) (tedit 5A02FF57)
    (at 135.5 91.75 180)
    (descr "SOT-23, Standard")
    (tags SOT-23)
    (attr smd)
    (fp_text reference Q101 (at 2.25 0.25 90) (layer F.SilkS))
    (fp_text value IRLML0040 (at 0 2.5) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 3 smd rect (at 1 0 180) (size 0.9 0.8) (layers F.Cu F.Paste F.Mask)
      (net 23 "Net-(JP102-Pad1)"))
    (pad 2 smd rect (at -1 0.95 180) (size 0.9 0.8) (layers F.Cu F.Paste F.Mask)
      (net 9 GND))
    (pad 1 smd rect (at -1 -0.95 180) (size 0.9 0.8) (layers F.Cu F.Paste F.Mask)
      (net 2 /LEDK))
    (model ${KISYS3DMOD}/Package_TO_SOT_SMD.3dshapes/SOT-23.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Jumper:SolderJumper-3_P1.3mm_Bridged12_Pad1.0x1.5mm (layer F.Cu) (tedit 5C756B4C)
    (at 137.5 95.5)
    (descr "SMD Solder 3-pad Jumper, 1x1.5mm Pads, 0.3mm gap, pads 1-2 bridged with 1 copper strip")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference JP102 (at -0.25 -1.5) (layer F.SilkS))
    (fp_text value Jumper_3_Bridged12 (at 0 2) (layer F.Fab))
    (pad 2 smd rect (at 0 0) (size 1 1.5) (layers F.Cu F.Mask)
      (net 22 "Net-(JP102-Pad2)"))
    (pad 3 smd rect (at 1.3 0) (size 1 1.5) (layers F.Cu F.Mask)
      (net 2 /LEDK))
    (pad 1 smd rect (at -1.3 0) (size 1 1.5) (layers F.Cu F.Mask)
      (net 23 "Net-(JP102-Pad1)"))
  )
  (module Jumper:SolderJumper-3_P1.3mm_Bridged12_Pad1.0x1.5mm (layer F.Cu) (tedit 5C756B4C)
    (at 133.25 107.25 180)
    (descr "SMD Solder 3-pad Jumper, 1x1.5mm Pads, 0.3mm gap, pads 1-2 bridged with 1 copper strip")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference JP101 (at -0.5 2) (layer F.SilkS))
    (fp_text value Jumper_3_Bridged12 (at 0 2) (layer F.Fab))
    (pad 2 smd rect (at 0 0 180) (size 1 1.5) (layers F.Cu F.Mask)
      (net 21 "Net-(JP101-Pad2)"))
    (pad 3 smd rect (at 1.3 0 180) (size 1 1.5) (layers F.Cu F.Mask)
      (net 1 /LEDA))
    (pad 1 smd rect (at -1.3 0 180) (size 1 1.5) (layers F.Cu F.Mask)
      (net 8 +2V8))
  )
  (module MarcoK:TFT_3.5IN_320X480_50PIN (layer B.Cu) (tedit 0)
    (at 150.0685 96.7385 180)
    (fp_text reference X101 (at -13.1815 -2.7615 180) (layer F.SilkS))
    (fp_text value DISP_LCD_3.5IN_320X480_50PIN_BUY_DISPLAY_ER-TFT035-6 (at 14.726 -9.225 180) (layer F.Fab))
    (fp_text user "Suggested Captouch cutout" (at -6.604 -31.856) (layer B.Fab))
    (fp_text user "Suggested Cutout Zone" (at 0 -16.87) (layer B.Fab))
    (fp_text user YD (at 0 -27) (layer B.Fab))
    (fp_text user YU (at 0 41.5) (layer B.Fab))
    (fp_text user XR (at 21.5 10) (layer B.Fab))
    (fp_text user XL (at -21.5 10) (layer B.Fab))
    (fp_text user 1 (at 11.6 -11.07) (layer B.Fab))
    (fp_text user 50 (at -11.2 -11.07) (layer B.Fab))
    (fp_text user "TFT LCD Display" (at 0 12.5) (layer B.Fab))
    (fp_text user "3.5\" 320x480" (at 0 7.2) (layer B.Fab))
    (pad PAD2 smd roundrect (at -14.35 -6.46) (size 2.4 2.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.125)
      (solder_mask_margin 0.0508))
    (pad PAD1 smd roundrect (at 14.35 -6.46) (size 2.4 2.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.125)
      (solder_mask_margin 0.0508))
    (pad 50 smd rect (at -12.25 -3.76) (size 0.275 1.2) (layers F.Cu F.Paste F.Mask)
      (net 9 GND) (solder_mask_margin 0.0508))
    (pad 49 smd rect (at -11.75 -3.76) (size 0.275 1.2) (layers F.Cu F.Paste F.Mask)
      (net 9 GND) (solder_mask_margin 0.0508))
    (pad 48 smd rect (at -11.25 -3.76) (size 0.275 1.2) (layers F.Cu F.Paste F.Mask)
      (net 9 GND) (solder_mask_margin 0.0508))
    (pad 47 smd rect (at -10.75 -3.76) (size 0.275 1.2) (layers F.Cu F.Paste F.Mask)
      (net 20 /YU-~TRST) (solder_mask_margin 0.0508))
    (pad 46 smd rect (at -10.25 -3.76) (size 0.275 1.2) (layers F.Cu F.Paste F.Mask)
      (net 19 /XL-~TIRQ) (solder_mask_margin 0.0508))
    (pad 45 smd rect (at -9.75 -3.76) (size 0.275 1.2) (layers F.Cu F.Paste F.Mask)
      (net 18 /YD-SDA) (solder_mask_margin 0.0508))
    (pad 44 smd rect (at -9.25 -3.76) (size 0.275 1.2) (layers F.Cu F.Paste F.Mask)
      (net 17 /XR-SCL) (solder_mask_margin 0.0508))
    (pad 43 smd rect (at -8.75 -3.76) (size 0.275 1.2) (layers F.Cu F.Paste F.Mask)
      (net 9 GND) (solder_mask_margin 0.0508))
    (pad 42 smd rect (at -8.25 -3.76) (size 0.275 1.2) (layers F.Cu F.Paste F.Mask)
      (net 8 +2V8) (solder_mask_margin 0.0508))
    (pad 41 smd rect (at -7.75 -3.76) (size 0.275 1.2) (layers F.Cu F.Paste F.Mask)
      (net 8 +2V8) (solder_mask_margin 0.0508))
    (pad 40 smd rect (at -7.25 -3.76) (size 0.275 1.2) (layers F.Cu F.Paste F.Mask)
      (net 8 +2V8) (solder_mask_margin 0.0508))
    (pad 39 smd rect (at -6.75 -3.76) (size 0.275 1.2) (layers F.Cu F.Paste F.Mask)
      (net 12 "Net-(X101-Pad39)") (solder_mask_margin 0.0508))
    (pad 38 smd rect (at -6.25 -3.76) (size 0.275 1.2) (layers F.Cu F.Paste F.Mask)
      (net 7 /TFT_CS) (solder_mask_margin 0.0508))
    (pad 37 smd rect (at -5.75 -3.76) (size 0.275 1.2) (layers F.Cu F.Paste F.Mask)
      (net 6 /TFT_DC) (solder_mask_margin 0.0508))
    (pad 36 smd rect (at -5.25 -3.76) (size 0.275 1.2) (layers F.Cu F.Paste F.Mask)
      (net 10 "Net-(R101-Pad2)") (solder_mask_margin 0.0508))
    (pad 35 smd rect (at -4.75 -3.76) (size 0.275 1.2) (layers F.Cu F.Paste F.Mask)
      (net 8 +2V8) (solder_mask_margin 0.0508))
    (pad 34 smd rect (at -4.25 -3.76) (size 0.275 1.2) (layers F.Cu F.Paste F.Mask)
      (net 11 "Net-(R102-Pad2)") (solder_mask_margin 0.0508))
    (pad 33 smd rect (at -3.75 -3.76) (size 0.275 1.2) (layers F.Cu F.Paste F.Mask)
      (net 13 "Net-(X101-Pad33)") (solder_mask_margin 0.0508))
    (pad 32 smd rect (at -3.25 -3.76) (size 0.275 1.2) (layers F.Cu F.Paste F.Mask)
      (net 9 GND) (solder_mask_margin 0.0508))
    (pad 31 smd rect (at -2.75 -3.76) (size 0.275 1.2) (layers F.Cu F.Paste F.Mask)
      (net 9 GND) (solder_mask_margin 0.0508))
    (pad 30 smd rect (at -2.25 -3.76) (size 0.275 1.2) (layers F.Cu F.Paste F.Mask)
      (net 9 GND) (solder_mask_margin 0.0508))
    (pad 29 smd rect (at -1.75 -3.76) (size 0.275 1.2) (layers F.Cu F.Paste F.Mask)
      (net 9 GND) (solder_mask_margin 0.0508))
    (pad 28 smd rect (at -1.25 -3.76) (size 0.275 1.2) (layers F.Cu F.Paste F.Mask)
      (net 9 GND) (solder_mask_margin 0.0508))
    (pad 27 smd rect (at -0.75 -3.76) (size 0.275 1.2) (layers F.Cu F.Paste F.Mask)
      (net 9 GND) (solder_mask_margin 0.0508))
    (pad 26 smd rect (at -0.25 -3.76) (size 0.275 1.2) (layers F.Cu F.Paste F.Mask)
      (net 9 GND) (solder_mask_margin 0.0508))
    (pad 25 smd rect (at 0.25 -3.76) (size 0.275 1.2) (layers F.Cu F.Paste F.Mask)
      (net 9 GND) (solder_mask_margin 0.0508))
    (pad 24 smd rect (at 0.75 -3.76) (size 0.275 1.2) (layers F.Cu F.Paste F.Mask)
      (net 9 GND) (solder_mask_margin 0.0508))
    (pad 23 smd rect (at 1.25 -3.76) (size 0.275 1.2) (layers F.Cu F.Paste F.Mask)
      (net 9 GND) (solder_mask_margin 0.0508))
    (pad 22 smd rect (at 1.75 -3.76) (size 0.275 1.2) (layers F.Cu F.Paste F.Mask)
      (net 9 GND) (solder_mask_margin 0.0508))
    (pad 21 smd rect (at 2.25 -3.76) (size 0.275 1.2) (layers F.Cu F.Paste F.Mask)
      (net 9 GND) (solder_mask_margin 0.0508))
    (pad 20 smd rect (at 2.75 -3.76) (size 0.275 1.2) (layers F.Cu F.Paste F.Mask)
      (net 9 GND) (solder_mask_margin 0.0508))
    (pad 19 smd rect (at 3.25 -3.76) (size 0.275 1.2) (layers F.Cu F.Paste F.Mask)
      (net 9 GND) (solder_mask_margin 0.0508))
    (pad 18 smd rect (at 3.75 -3.76) (size 0.275 1.2) (layers F.Cu F.Paste F.Mask)
      (net 9 GND) (solder_mask_margin 0.0508))
    (pad 17 smd rect (at 4.25 -3.76) (size 0.275 1.2) (layers F.Cu F.Paste F.Mask)
      (net 9 GND) (solder_mask_margin 0.0508))
    (pad 16 smd rect (at 4.75 -3.76) (size 0.275 1.2) (layers F.Cu F.Paste F.Mask)
      (net 9 GND) (solder_mask_margin 0.0508))
    (pad 15 smd rect (at 5.25 -3.76) (size 0.275 1.2) (layers F.Cu F.Paste F.Mask)
      (net 9 GND) (solder_mask_margin 0.0508))
    (pad 14 smd rect (at 5.75 -3.76) (size 0.275 1.2) (layers F.Cu F.Paste F.Mask)
      (net 9 GND) (solder_mask_margin 0.0508))
    (pad 13 smd rect (at 6.25 -3.76) (size 0.275 1.2) (layers F.Cu F.Paste F.Mask)
      (net 8 +2V8) (solder_mask_margin 0.0508))
    (pad 12 smd rect (at 6.75 -3.76) (size 0.275 1.2) (layers F.Cu F.Paste F.Mask)
      (net 9 GND) (solder_mask_margin 0.0508))
    (pad 11 smd rect (at 7.25 -3.76) (size 0.275 1.2) (layers F.Cu F.Paste F.Mask)
      (net 9 GND) (solder_mask_margin 0.0508))
    (pad 10 smd rect (at 7.75 -3.76) (size 0.275 1.2) (layers F.Cu F.Paste F.Mask)
      (net 3 /TFT_RST) (solder_mask_margin 0.0508))
    (pad 9 smd rect (at 8.25 -3.76) (size 0.275 1.2) (layers F.Cu F.Paste F.Mask)
      (net 8 +2V8) (solder_mask_margin 0.0508))
    (pad 8 smd rect (at 8.75 -3.76) (size 0.275 1.2) (layers F.Cu F.Paste F.Mask)
      (net 8 +2V8) (solder_mask_margin 0.0508))
    (pad 7 smd rect (at 9.25 -3.76) (size 0.275 1.2) (layers F.Cu F.Paste F.Mask)
      (net 8 +2V8) (solder_mask_margin 0.0508))
    (pad 6 smd rect (at 9.75 -3.76) (size 0.275 1.2) (layers F.Cu F.Paste F.Mask)
      (net 14 "Net-(X101-Pad6)") (solder_mask_margin 0.0508))
    (pad 5 smd rect (at 10.25 -3.76) (size 0.275 1.2) (layers F.Cu F.Paste F.Mask)
      (net 15 "Net-(X101-Pad5)") (solder_mask_margin 0.0508))
    (pad 4 smd rect (at 10.75 -3.76) (size 0.275 1.2) (layers F.Cu F.Paste F.Mask)
      (net 16 "Net-(X101-Pad4)") (solder_mask_margin 0.0508))
    (pad 3 smd rect (at 11.25 -3.76) (size 0.275 1.2) (layers F.Cu F.Paste F.Mask)
      (net 22 "Net-(JP102-Pad2)") (solder_mask_margin 0.0508))
    (pad 2 smd rect (at 11.75 -3.76) (size 0.275 1.2) (layers F.Cu F.Paste F.Mask)
      (net 22 "Net-(JP102-Pad2)") (solder_mask_margin 0.0508))
    (pad 1 smd rect (at 12.25 -3.76) (size 0.275 1.2) (layers F.Cu F.Paste F.Mask)
      (net 24 "Net-(R104-Pad1)") (solder_mask_margin 0.0508))
  )
  (module Resistor_SMD:R_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 150 93 180)
    (descr "Resistor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R103 (at 0.25 1.5) (layer F.SilkS))
    (fp_text value 10K (at 0 1.82) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 1.4875 0 180) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 7 /TFT_CS))
    (pad 1 smd roundrect (at -1.4875 0 180) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 8 +2V8))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 144 93)
    (descr "Resistor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R101 (at 0 -1.5) (layer F.SilkS))
    (fp_text value 12 (at 0 1.82) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 1.4875 0) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 10 "Net-(R101-Pad2)"))
    (pad 1 smd roundrect (at -1.4875 0) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 5 /SCLK))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_PinHeader_2.54mm:PinHeader_1x15_P2.54mm_Vertical (layer F.Cu) (tedit 59FED5CC)
    (at 168 88 270)
    (descr "Through hole straight pin header, 1x15, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x15 2.54mm single row")
    (fp_text reference J101 (at 2.17 0.36 180) (layer F.SilkS))
    (fp_text value Conn_01x15_Female (at 0 37.89 90) (layer F.Fab))
    (fp_text user %R (at 0 17.78) (layer F.Fab))
    (pad 15 thru_hole oval (at 0 35.56 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 /LEDA))
    (pad 14 thru_hole oval (at 0 33.02 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 2 /LEDK))
    (pad 13 thru_hole oval (at 0 30.48 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 3 /TFT_RST))
    (pad 12 thru_hole oval (at 0 27.94 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 4 /MOSI))
    (pad 11 thru_hole oval (at 0 25.4 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 5 /SCLK))
    (pad 10 thru_hole oval (at 0 22.86 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 6 /TFT_DC))
    (pad 9 thru_hole oval (at 0 20.32 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 7 /TFT_CS))
    (pad 8 thru_hole oval (at 0 17.78 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 8 +2V8))
    (pad 7 thru_hole oval (at 0 15.24 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 9 GND))
    (pad 6 thru_hole oval (at 0 12.7 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 17 /XR-SCL))
    (pad 5 thru_hole oval (at 0 10.16 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 18 /YD-SDA))
    (pad 4 thru_hole oval (at 0 7.62 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 19 /XL-~TIRQ))
    (pad 3 thru_hole oval (at 0 5.08 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 20 /YU-~TRST))
    (pad 2 thru_hole oval (at 0 2.54 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 9 GND))
    (pad 1 thru_hole rect (at 0 0 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 9 GND))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x15_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (gr_text 20220105-V0.1 (at 163 107) (layer B.SilkS))
  (gr_text "Recommended component values:\nR101 - Current limiter - 10 to 20 Ohms.\nR102 - Current limiter - 10 to 20 Ohms.\nR103 - Voltage pull up - 10K Ohms.\nR104 - Backlight LED current limiter - 10 Ohms at 3.3 VCC.\nX101 - 0.5mm pitch, 50 pin, 0.3mm FFC thickness\nX101 - For example DigiKey part number 609-1202-1-ND\nQ101 - IRLML0040 - N Channel MOSFET\nQ101 - if IRLML0040 is unavailable:\nQ101 - Can be any N channel with Vgs < 3.0 Volts" (at 169.25 96.75) (layer B.SilkS))
  (gr_text "Resistive touch signals" (at 159 84) (layer F.SilkS))
  (gr_text "Signals for capacitive\ntouch controller." (at 159.25 93.75) (layer F.SilkS))
  (gr_text ~TRST (at 163.25 91.25 90) (layer F.SilkS))
  (gr_text ~TIRQ (at 160.5 91.25 90) (layer F.SilkS))
  (gr_text SDA (at 157.75 91 90) (layer F.SilkS))
  (gr_text SCL (at 155.25 91 90) (layer F.SilkS))
  (gr_text "  BL Ctrl\nOnbrd  Ext" (at 137.75 97.75) (layer F.SilkS))
  (gr_text "External Supply" (at 131.5 102.5 90) (layer F.SilkS))
  (gr_text "Use onboard power\n(from VCC Pin)" (at 140.5 107.25) (layer F.SilkS))
  (gr_text GND (at 167.64 85.25 90) (layer F.SilkS))
  (gr_text GND (at 165.1 85.25 90) (layer F.SilkS))
  (gr_text YU (at 162.56 85.25 90) (layer F.SilkS))
  (gr_text XL (at 160.02 85.25 90) (layer F.SilkS))
  (gr_text YD (at 157.75 85.25 90) (layer F.SilkS))
  (gr_text XR (at 155.25 85.25 90) (layer F.SilkS))
  (gr_text GND (at 152.4 85.25 90) (layer F.SilkS))
  (gr_text VCC (at 149.86 85.25 90) (layer F.SilkS))
  (gr_text "TFT\nCS" (at 147.32 85.25 90) (layer F.SilkS))
  (gr_text "TFT\nDC" (at 144.78 85.25 90) (layer F.SilkS))
  (gr_text SCLK (at 142.24 85.25 90) (layer F.SilkS))
  (gr_text MOSI (at 139.7 85.25 90) (layer F.SilkS))
  (gr_text "TFT\nRST" (at 137.16 85.25 90) (layer F.SilkS))
  (gr_text LEDK (at 134.62 85.25 90) (layer F.SilkS))
  (gr_text LEDA (at 132.25 85.25 90) (layer F.SilkS))
  (gr_text "ER-TFT035 Breakout." (at 157.75 107.25) (layer F.SilkS))
  (gr_line (start 170.18 83.5) (end 130.81 83.5) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 170.18 109) (end 170.18 83.5) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 130.81 109) (end 170.18 109) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 130.81 83.5) (end 130.81 109) (layer Edge.Cuts) (width 0.05))
  (zone (net 9) (net_name GND) (layer F.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.254))
    (min_thickness 0.254)
    (fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 174 109) (xy 127 109) (xy 127.5 83.5) (xy 174.5 83.5)
      )
    )
  )
  (zone (net 9) (net_name GND) (layer B.Cu) (hatch edge 0.508)
    (connect_pads yes (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 174 109) (xy 127 109) (xy 127 83.5) (xy 174 83.5)
      )
    )
  )
)
