<?xml version="1.0" encoding="utf-8"?>
<!DOCTYPE eagle SYSTEM "eagle.dtd">
<eagle version="7.6.0">
<drawing>
<board>
<plain>
<text>RPUftdi</text>
<text>EPCCS.ORG</text>
<wire x1="60.325" y1="51.7525" x2="60.325" y2="1.5875" width="0" layer="20"/>
<wire x1="60.325" y1="1.5875" x2="58.7375" y2="0" width="0" layer="20" curve="-90"/>
<wire x1="58.7375" y1="0" x2="13.0175" y2="0" width="0" layer="20"/>
<wire x1="13.0175" y1="0" x2="11.43" y2="1.5875" width="0" layer="20" curve="-90"/>
<wire x1="11.43" y1="1.5875" x2="11.43" y2="13.6525" width="0" layer="20"/>
<wire x1="11.43" y1="13.6525" x2="9.8425" y2="15.24" width="0" layer="20" curve="90"/>
<wire x1="9.8425" y1="15.24" x2="1.5875" y2="15.24" width="0" layer="20"/>
<wire x1="1.5875" y1="15.24" x2="0" y2="16.8275" width="0" layer="20" curve="-90"/>
<wire x1="0" y1="16.8275" x2="0" y2="51.7525" width="0" layer="20"/>
<wire x1="0" y1="51.7525" x2="1.5875" y2="53.34" width="0" layer="20" curve="-90"/>
<wire x1="1.5875" y1="53.34" x2="58.7375" y2="53.34" width="0" layer="20"/>
<wire x1="58.7375" y1="53.34" x2="60.325" y2="51.7525" width="0" layer="20" curve="-90"/>
<text>14145^3</text>
<text>RX</text>
<text>TX</text>
<text>2</text>
<text>3</text>
<text>4</text>
<text>5</text>
<text>6</text>
<text>7</text>
<text>8</text>
<text>9</text>
<text>10</text>
<text>11</text>
<text>12</text>
<text>SDA</text>
<text>SCL</text>
<text>VIN</text>
<text>0V</text>
<text>0V</text>
<text>5V</text>
<text>!RESET</text>
<text>IOREF</text>
<text>IOREF</text>
<text>MOSI</text>
<text>0V</text>
<text>!RESET</text>
<text>SCK</text>
<text>MISO</text>
<text>MNG_ICSP</text>
<text>MNG_LED</text>
<text>100Ω
TERM-
INATIONS</text>
<text>-RX</text>
<text>+RX</text>
<text>-DTR</text>
<text>-TX</text>
<text>+DTR</text>
<text>+TX</text>
<text>GN</text>
<text>USBRX</text>
<text>USBTX</text>
<text>RD</text>
<text>YE</text>
<text>RD</text>
<text>13</text>
<text>ADC6</text>
<text>ADC7</text>
<text>0V</text>
<text>0V</text>
<text>5V</text>
<text>FTDI_RX</text>
<text>FTDI_TX</text>
<text>3V3</text>
<text>0V</text>
<text>ADC5</text>
<text>ADC4</text>
<text>ADC3</text>
<text>ADC2</text>
<text>ADC1</text>
<text>ADC0</text>
<text>!RST</text>
<text>SCK</text>
<text>MISO</text>
<text>MOSI</text>
<text>FTDI_3V3</text>
<text>3V3</text>
<text>FTDI_!DSR</text>
<text>FTDI_!CTS</text>
<text>FTDI
_!RTS</text>
<text>FTDI_!DTR</text>
<text>SDA1</text>
<text>SCL1</text>
<text>OC1A</text>
<text>5V</text>
<text>RPU_AREF</text>
<text>RPUftdi</text>
<text>EPCCS.ORG</text>
</plain>
<libraries>
<library name="P-DCDC">
<description>&lt;pre&gt;POWER SUPPLIE DC 2 DC
DIN rail mount units are for schmatics only
USE AT YOUR OWN RISK...
Copyright (C) 2013 Ronald Steven Sutherland
Permission is granted to copy, distribute and/or modify this document 
under the terms of the GNU Free Documentation License, Version 1.2 or 
any later version published by the Free Software Foundation; with no 
Invariant Sections, no Front-Cover Texts, and no Back-Cover Texts. A 
copy of the license is included in the section entitled "GNU Free 
Documentation License".</description>
<packages>
<package name="SOT23-5,SOT25">
<description>&lt;pre&gt;Small Outline SOT23-5,SOT25,SC-74A</description>
</package>
</packages>
</library>
<library name="C-C">
<description>&lt;pre&gt; MULTILAYER CERAMIC CHIP CAPACITORS

Type: C1005 [EIA CC0402], C1608 [EIA CC0603], C2012 [EIA CC0805],
C3216 [EIA CC1206], C3225 [EIA CC1210], C4532 [EIA CC1812], C5750 [EIA CC2220]

CH 0±60 ppm/°C -25 to +85°C
C0G 0±30 ppm/°C -55 to +125°C
JB ±10% -25 to +85°C
X5R ±15% -55 to +85°C
X6S ±22% -55 to +105°C
X7R ±15% -55 to +125°C
X7S ±22% -55 to +125°C
X7T +22/-33% -55 to +125°C

TDK voltage cods
0G 4V
0J 6.3V
1A 10V
1C 16V
1E 25V
1V 35V
1H 50V
2A 100V
2E 250V
2V 350V
2W 450V
2J 630V

NOTE: rounded pads... http://www.kemet.com/kemet/web/homepage/kfbk3.nsf/vaFeedbackFAQ/2209BDBA03843BBF85256BCD004EBC11/$file/f2100e.pdf
See section on Tombstoneing. Lead free solder may not wet edges, and IPC does not allow exposed copper. 
My (rsutherland@epccs) experience suggest highly rounded pads reduce solder beads that can be extruded along edges of larger capacitors (0805).

USE AT YOUR OWN RISK...

Copyright (C) 2013 Ronald Steven Sutherland
Released under the Creative Commons 
Attribution Share-Alike 3.0 License
http://creativecommons.org/licenses/by-sa/3.0</description>
<packages>
<package name="C0603(1608)">
<description>&lt;pre&gt;EIA 0603 (Metric Code Size 1608) Ceramic Chip Capacitor
rounded pads are added in IPC 782 rev A, this pad was on Arduino Due and may have originated from Sparkfun.
http://www.kemet.com/kemet/web/homepage/kfbk3.nsf/vaFeedbackFAQ/2209BDBA03843BBF85256BCD004EBC11/$file/f2100e.pdf</description>
</package>
<package name="C1206(3216)">
<description>&lt;pre&gt;EIA 1206 (Metric Code Size 3216) Ceramic Chip Capacitor
rounded pads are added in IPC 782 rev A.
http://www.kemet.com/kemet/web/homepage/kfbk3.nsf/vaFeedbackFAQ/2209BDBA03843BBF85256BCD004EBC11/$file/f2100e.pdf</description>
</package>
</packages>
</library>
<library name="C-T">
<description>&lt;pre&gt;Tantalum Electrolytic Capacitors
EIA Code 	Case Code 	L 	W 	H 	W1 	A
Tolerance 	±0.2 	+0.2/–0.1 	+0.2/–0.1 	+0.2 	+0.3/–0.2
3216-10 	I, K 	3.2 	1.6 	1.0 (max) 	1.2 	0.8
3216-12 	S 	3.2 	1.6 	1.2 (max) 	1.2 	0.8
3216-18 	A 	3.2 	1.6 	1.6 	1.2 	0.8
3528-12 	T 	3.5 	2.8 	1.2 (max) 	2.2 	0.8
3528-15 	M, H 	3.5 	2.8 	1.5 (max) 	2.2 	0.8
3528-21 	B 	3.5 	2.8 	1.9 	2.2 	0.8
6032-15 	U, W 	6.0 	3.2 	1.5 (max) 	2.2 	1.3
6032-28 	C 	6.0 	3.2 	2.6 	2.2 	1.3
7343-20 	V, Y 	7.3 	4.3 	2.0 (max) 	2.4 	1.3
7343-31 	D 	7.3 	4.3 	2.9 	2.4 	1.3
7343-43 	X, E 	7.3 	4.3 	4.1 	2.4 	1.3

Metric	[inch]
2013 	[0805]
3216 	[1206]
3528 	[1411]
6032 	[2413]
7343 	[2917]

USE AT YOUR OWN RISK...

Copyright (C) 2013 Ronald Steven Sutherland
Released under the Creative Commons 
Attribution Share-Alike 3.0 License
http://creativecommons.org/licenses/by-sa/3.0</description>
<packages>
<package name="3216">
<description>&lt;pre&gt;3.2mm x 1.6mm
Surface mount dimensions (EIA standard package sizes)
EIA Code 	Case Code 	L 	W 	H 	W1 	A
Tolerance 	±0.2 	+0.2/–0.1 	+0.2/–0.1 	+0.2 	+0.3/–0.2
3216-10 	I, K 	3.2 	1.6 	1.0 (max) 	1.2 	0.8
3216-12 	S, P 	3.2 	1.6 	1.2 (max) 	1.2 	0.8
3216-18 	A 	3.2 	1.6 	1.6 	1.2 	0.8

Note 3.2mm x 1.6mm is about 1206 (or .012 x .006 in)</description>
</package>
</packages>
</library>
<library name="R-C">
<description>&lt;pre&gt;CHIP RESISTOR
NOTE: rounded pads... http://www.kemet.com/kemet/web/homepage/kfbk3.nsf/vaFeedbackFAQ/2209BDBA03843BBF85256BCD004EBC11/$file/f2100e.pdf
See section on Tombstoneing. Lead free solder may not wet edges, and IPC does not allow exposed copper. 
My (rsutherland@epccs) experience suggest highly rounded pads reduce solder beads that can be extruded along edges of larger capacitors (0805).
USE AT YOUR OWN RISK...
Copyright (C) 2013 Ronald Steven Sutherland
Permission is granted to copy, distribute and/or modify this document 
under the terms of the GNU Free Documentation License, Version 1.2 or 
any later version published by the Free Software Foundation; with no 
Invariant Sections, no Front-Cover Texts, and no Back-Cover Texts. A 
copy of the license is included in the section entitled "GNU Free 
Documentation License".</description>
<packages>
<package name="C0805(2012)">
<description>&lt;pre&gt;EIA 0805 (Metric Code Size 2012) Ceramic Chip
rounded pads are added in IPC 782 rev A
http://www.kemet.com/kemet/web/homepage/kfbk3.nsf/vaFeedbackFAQ/2209BDBA03843BBF85256BCD004EBC11/$file/f2100e.pdf</description>
</package>
</packages>
</library>
<library name="J-HDR2.54mm">
<description>&lt;pre&gt;HEADER 2.54MM center to center

USE AT YOUR OWN RISK...
 
Copyright (C) 2013 Ronald Steven Sutherland
Released under the Creative Commons 
Attribution Share-Alike 3.0 License
http://creativecommons.org/licenses/by-sa/3.0</description>
<packages>
<package name="1X8">
<description>&lt;pre&gt;8 PIN 
.1" CENTER 
0.040" DRILL
auto PAD

http://www.sullinscorp.com/catalogs/78_Page80-81_HEADER_.100_2.54mm_FEMALE.pdf</description>
</package>
<package name="1X10">
<description>&lt;pre&gt;10 PIN 
.1" CENTER 
0.040 DRILL
auto PAD

http://www.sullinscorp.com/catalogs/78_Page80-81_HEADER_.100_2.54mm_FEMALE.pdf</description>
</package>
<package name="F2X3">
</package>
</packages>
</library>
<library name="J-RJ45">
<description>&lt;pre&gt;POWER SUPPLIE DC 2 DC
DIN rail mount units are for schmatics only
USE AT YOUR OWN RISK...

Copyright (C) 2013 Ronald Steven Sutherland
Released under the Creative Commons 
Attribution Share-Alike 3.0 License
http://creativecommons.org/licenses/by-sa/3.0</description>
<packages>
<package name="RJ45-8HZT">
<description>&lt;pre&gt;RJ45J [ASSMANN,A-2014-2-4-R] JACK MODULAR VERT PCB 8P8C UNSHIELD
mount hole was 3.2mm but that is an odd size that got rounded down to .125" so the
hole is now dril size 30 (.1285") and I hope it does not get rounded down...</description>
</package>
</packages>
</library>
<library name="U-Transceiver">
<description>&lt;pre&gt;Transceiver (both transmitter and a receiver)
http://en.wikipedia.org/wiki/Transceiver

USE AT YOUR OWN RISK...

Copyright (C) 2013 Ronald Steven Sutherland
Released under the Creative Commons 
Attribution Share-Alike 3.0 License
http://creativecommons.org/licenses/by-sa/3.0</description>
<packages>
<package name="SOIC8">
<description>&lt;pre&gt;8POS Standard SMALLl OUTLINE Package (SO/SOIC) Narrow Body</description>
</package>
<package name="20SSOP">
<description>&lt;pre&gt; 20POS SHRINK SMALL OUTLINE PLASTIC (20-SSOP)

NOTE: FTDI data sheet shows .025" lead spacing, but the typical is 0.0256" (0.65mm), 
so this may be a datasheet error, but if not I think 0.025 will stillwork on 0.0256 pads.
I have verified that it is not a datasheet error and 0.635mm pitch is correct on the datasheet, 
so now(9/22/15) this package is fixed.</description>
</package>
</packages>
</library>
<library name="Q-NCH">
<description>&lt;pre&gt;N-CHANNEL MOSFET
ENHANCEMENT MODE is shown with a open/broken channel
DEPLETION MODE is shown with a closed/complete channel thus the idea of being on with zero gate voltage.

USE AT YOUR OWN RISK...

Copyright (C) 2013 Ronald Steven Sutherland
Released under the Creative Commons 
Attribution Share-Alike 3.0 License
http://creativecommons.org/licenses/by-sa/3.0</description>
<packages>
<package name="SOT23">
<description>&lt;pre&gt;SOT23 (based on SOT23-6) pin 3 is alone
http://www.diodes.com/_files/zetex_files/pack/SOT23-6.pdf
center(1) to center(2,3) 2.2 mm
center(2) to center(3) 1.9mm
pad .65X x 1.06Y mm</description>
</package>
</packages>
</library>
<library name="J-BoardHDR">
<description>&lt;pre&gt;Arduino Footprint
Standard Interface
USE AT YOUR OWN RISK...

Copyright (C) 2013 Ronald Steven Sutherland
Released under the Creative Commons 
Attribution Share-Alike 3.0 License
http://creativecommons.org/licenses/by-sa/3.0</description>
<packages>
<package name="ARDUINO_UNO">
<description>&lt;pre&gt;UNO R3 board footprint</description>
</package>
</packages>
</library>
<library name="H-Fiducial">
<description>&lt;pre&gt;Fiducianl Mark
USE AT YOUR OWN RISK...
Copyright (C) 2013 Ronald Steven Sutherland
Permission is granted to copy, distribute and/or modify this document 
under the terms of the GNU Free Documentation License, Version 1.2 or 
any later version published by the Free Software Foundation; with no 
Invariant Sections, no Front-Cover Texts, and no Back-Cover Texts. A 
copy of the license is included in the section entitled "GNU Free 
Documentation License".</description>
<packages>
<package name="FIDUCIAL-1.27">
<description>&lt;pre&gt;Fiducian R=1.27mm 
STOP=2.54mm
It is up to designer to not put traces under Fiducial (i.e. Void or sold plane only)
Autorouter restricted areas are defined as RECTangles, POLYGONs, or CIRCLEs on the 
tRestrict, bRestrict, or vRestrict layers.</description>
</package>
</packages>
</library>
<library name="U-7400">
<description>&lt;pre&gt;Logic

USE AT YOUR OWN RISK...
This was form cadsoft libraian, but much of it is not valid, I have only 
looked at parts I'm using so far...

Copyright (C) 2013 Ronald Steven Sutherland
Released under the Creative Commons 
Attribution Share-Alike 3.0 License
http://creativecommons.org/licenses/by-sa/3.0</description>
<packages>
<package name="14SOIC">
<description>&lt;pre&gt;14POS SMALL OUTLINE (14SO[IC])
pitch 1.27
pad .6mm X1.8mm
body-Center to pad-Center 2.7mm

referance TI's SOIC package, but pads are little larger and rounded</description>
</package>
</packages>
</library>
<library name="S-Toggle">
<description>&lt;pre&gt;Switch Tactile/Snap-acting

USE AT YOUR OWN RISK...

Copyright (C) 2013 Ronald Steven Sutherland
Released under the Creative Commons 
Attribution Share-Alike 3.0 License
http://creativecommons.org/licenses/by-sa/3.0</description>
<packages>
<package name="SMD-DIPSWITCH-1">
<description>&lt;pre&gt;SMD DIP SWITCH 1POS
SMDIP1S [E-SWITCH,KAE01SGGT]SWITCH 1 SPST 25MA 24V SMDIP</description>
</package>
</packages>
</library>
<library name="U-AVR">
<description>&lt;pre&gt;MCU's 8bit AVR 

USE AT YOUR OWN RISK...

Copyright (C) 2013 Ronald Steven Sutherland
Released under the Creative Commons 
Attribution Share-Alike 3.0 License
http://creativecommons.org/licenses/by-sa/3.0</description>
<packages>
<package name="ISP">
</package>
<package name="TQFP32-08">
<description>&lt;B&gt;Thin Plasic Quad Flat Package&lt;/B&gt; Grid 0.8 mm</description>
</package>
</packages>
</library>
<library name="D-GP">
<description>&lt;pre&gt;GEN PURPOSE DIODE
USE AT YOUR OWN RISK...

Copyright (C) 2013 Ronald Steven Sutherland
Released under the Creative Commons 
Attribution Share-Alike 3.0 License
http://creativecommons.org/licenses/by-sa/3.0</description>
<packages>
<package name="SOD123">
<description>&lt;pre&gt;SOD123
http://www.diodes.com/datasheets/ap02001.pdf</description>
</package>
</packages>
</library>
<library name="D-LED">
<description>&lt;pre&gt;Light-emitting diode
http://en.wikipedia.org/wiki/Light-emitting_diode
USE AT YOUR OWN RISK...

Copyright (C) 2013 Ronald Steven Sutherland
Released under the Creative Commons 
Attribution Share-Alike 3.0 License
http://creativecommons.org/licenses/by-sa/3.0</description>
<packages>
<package name="C0805(2012)">
<description>&lt;pre&gt;EIA 0805 (Metric Code Size 2012) Ceramic Chip
rounded pads are added in IPC 782 rev A, this pad was on Arduino and may have originated from Sparkfun.
http://www.kemet.com/kemet/web/homepage/kfbk3.nsf/vaFeedbackFAQ/2209BDBA03843BBF85256BCD004EBC11/$file/f2100e.pdf</description>
</package>
</packages>
</library>
<library name="L-FB">
<description>&lt;pre&gt;CHIP FERRITE BEADS
NOTE: rounded pads... http://www.kemet.com/kemet/web/homepage/kfbk3.nsf/vaFeedbackFAQ/2209BDBA03843BBF85256BCD004EBC11/$file/f2100e.pdf
See section on Tombstoneing. Lead free solder may not wet edges, and IPC does not allow exposed copper. 
My (rsutherland@epccs) experience suggest rounded pads reduce solder beads that can be extruded along edges of larger capacitors (0805) and similar devices.

USE AT YOUR OWN RISK...
 
Copyright (C) 2013 Ronald Steven Sutherland
Released under the Creative Commons 
Attribution Share-Alike 3.0 License
http://creativecommons.org/licenses/by-sa/3.0</description>
<packages>
<package name="C0805(2012)">
<description>&lt;pre&gt;EIA 0805 (Metric Code Size 2012) Ferrite Chip
rounded pads are added in IPC 782 rev A
http://www.kemet.com/kemet/web/homepage/kfbk3.nsf/vaFeedbackFAQ/2209BDBA03843BBF85256BCD004EBC11/$file/f2100e.pdf</description>
</package>
</packages>
</library>
<library name="F-RST">
<description>&lt;pre&gt;Resettable Fuses
 
USE AT YOUR OWN RISK...
 
Copyright (C) 2013 Ronald Steven Sutherland
Released under the Creative Commons 
Attribution Share-Alike 3.0 License
http://creativecommons.org/licenses/by-sa/3.0</description>
<packages>
<package name="C1210(3225)">
<description>&lt;pre&gt;EIA 1210 (Metric Code Size 3225) Ceramic Chip
rounded pads are added in IPC 782 rev A.
http://www.kemet.com/kemet/web/homepage/kfbk3.nsf/vaFeedbackFAQ/2209BDBA03843BBF85256BCD004EBC11/$file/f2100e.pdf</description>
</package>
</packages>
</library>
<library name="D-SBR">
<description>&lt;pre&gt;Super Barrier Rectifier
Super barrier diodes are rectifier diodes that incorporate the low forward voltage
drop of the Schottky diode with the surge-handling capability and low reverse 
leakage current of a normal p–n junction diode.

USE AT YOUR OWN RISK...

Copyright (C) 2013 Ronald Steven Sutherland
Released under the Creative Commons 
Attribution Share-Alike 3.0 License
http://creativecommons.org/licenses/by-sa/3.0</description>
<packages>
<package name="SMA">
<description>&lt;pre&gt;SMB 
http://www.diodes.com/datasheets/ap02001.pdf
center to center 4 mm
pad 2.5X x 1.7Y mm</description>
</package>
</packages>
</library>
<library name="Q-PCH">
<description>&lt;pre&gt;N-CHANNEL MOSFET
ENHANCEMENT MODE is shown with a open/broken channel
DEPLETION MODE is shown with a closed/complete channel thus the idea of being on with zero gate voltage.

USE AT YOUR OWN RISK...

Copyright (C) 2013 Ronald Steven Sutherland
Released under the Creative Commons 
Attribution Share-Alike 3.0 License
http://creativecommons.org/licenses/by-sa/3.0</description>
<packages>
<package name="SOT23">
<description>&lt;pre&gt;SOT23 (based on SOT23-6) pin 3 is alone
http://www.diodes.com/_files/zetex_files/pack/SOT23-6.pdf
center(1) to center(2,3) 2.2 mm
center(2) to center(3) 1.9mm
pad .65X x 1.06Y mm</description>
</package>
</packages>
</library>
<library name="J-USB">
<description>&lt;pre&gt;USB Connectors

USE AT YOUR OWN RISK...

Copyright (C) 2014 Ronald Steven Sutherland
Released under the Creative Commons 
Attribution Share-Alike 3.0 License
http://creativecommons.org/licenses/by-sa/3.0</description>
<packages>
<package name="USB-B-PTH">
<description>&lt;pre&gt;B [MOLEX,0670688000] USB B THROUGH HOLE</description>
</package>
</packages>
</library>
<library name="J-TP">
<description>&lt;pre&gt;Test Pins/Pads

Cream on SMD OFF
Attribute TP_SIGNAL_NAME

USE AT YOUR OWN RISK...

    Copyright (C) 2015 Ronald Sutherland
    Released under the Creative Commons 
    Attribution-ShareAlike 4.0 International
    http://creativecommons.org/licenses/by-sa/4.0</description>
<packages>
<package name="P1-08">
<description>&lt;pre&gt;TEST PAD 20AWG</description>
</package>
</packages>
</library>
<library name="Y-XTL">
<description>&lt;pre&gt;CRYSTAL
i.e. NDK NX3225SA-12.000000MHZ-STD-CSR-1

USE AT YOUR OWN RISK...

Copyright (C) 2014 Ronald Steven Sutherland
Released under the Creative Commons 
Attribution Share-Alike 3.0 License
http://creativecommons.org/licenses/by-sa/3.0</description>
<packages>
<package name="CSM-3X">
<description>&lt;pre&gt;SMD CRYSTAL
16MHZ20  [ECS,ECS-160-20-3X-TR] CRYSTAL 16MHZ 20PF 30PPM  CSM-3X
Source: www.ecsxtal.com .. Crystal 16MHz CSM-3X.PDF</description>
</package>
</packages>
</library>
</libraries>
<attributes>
</attributes>
<variantdefs>
</variantdefs>
<elements>
<element name="J4" library="J-RJ45" package="RJ45-8HZT" value="RJ45J">
<attribute name="NAME"/>
</element>
<element name="U2" library="U-Transceiver" package="SOIC8" value="3172EIBZ">
<attribute name="NAME"/>
</element>
<element name="U4" library="U-Transceiver" package="SOIC8" value="3172EIBZ">
<attribute name="NAME"/>
</element>
<element name="U6" library="U-Transceiver" package="SOIC8" value="3172EIBZ">
<attribute name="NAME"/>
</element>
<element name="C6" library="C-C" package="C0603(1608)" value=".1uF">
<attribute name="NAME"/>
<attribute name="VALUE"/>
</element>
<element name="C11" library="C-C" package="C0603(1608)" value=".1uF">
<attribute name="NAME"/>
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<signal name="DTR_!RE">
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<signal name="-TX">
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<signal name="TX_RPU">
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<signal name="TX_DE">
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<signal name="RX_RPU">
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<signal name="N$7">
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<signal name="N$8">
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</signal>
<signal name="FTDI_RX">
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<contactref element="TP1" pad="TP"/>
</signal>
<signal name="FTDI_TX">
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<contactref element="R27" pad="1"/>
<contactref element="TP2" pad="TP"/>
</signal>
<signal name="FT3V3">
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<contactref element="TP3" pad="TP"/>
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<signal name="N$13">
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</signal>
<signal name="N$15">
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<signal name="N$18">
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</signal>
<signal name="N$19">
<contactref element="U4" pad="1"/>
<contactref element="R18" pad="1"/>
<contactref element="R15" pad="1"/>
</signal>
<signal name="N$20">
<contactref element="U4" pad="3"/>
<contactref element="R17" pad="1"/>
<contactref element="Q3" pad="3(D)"/>
</signal>
<signal name="FTDI_!DTR">
<contactref element="U1" pad="1"/>
<contactref element="U7" pad="32"/>
<contactref element="TP12" pad="TP"/>
</signal>
<signal name="N$22">
<contactref element="Q3" pad="1(G)"/>
<contactref element="R16" pad="1"/>
</signal>
<signal name="N$25">
<contactref element="R27" pad="2"/>
<contactref element="Q4" pad="1(G)"/>
</signal>
<signal name="N$26">
<contactref element="L1" pad="2"/>
<contactref element="Q1" pad="2(S)"/>
<contactref element="C2" pad="1"/>
</signal>
<signal name="N$27">
<contactref element="Q1" pad="1(G)"/>
<contactref element="R2" pad="1"/>
<contactref element="C2" pad="2"/>
<contactref element="C3" pad="2"/>
</signal>
<signal name="N$29">
<contactref element="R37" pad="2"/>
<contactref element="D6" pad="A"/>
</signal>
<signal name="FTDI_!RTS">
<contactref element="U1" pad="2"/>
<contactref element="U7" pad="1"/>
<contactref element="TP11" pad="TP"/>
</signal>
<signal name="FTDI_!CTS">
<contactref element="U1" pad="9"/>
<contactref element="U7" pad="23"/>
<contactref element="TP10" pad="TP"/>
</signal>
<signal name="FTDI_!DSR">
<contactref element="U1" pad="7"/>
<contactref element="U7" pad="24"/>
<contactref element="TP9" pad="TP"/>
</signal>
<signal name="RPU_AREF">
<contactref element="C19" pad="1"/>
<contactref element="U7" pad="20"/>
<contactref element="TP5" pad="TP"/>
</signal>
<signal name="SDA1">
<contactref element="U7" pad="3"/>
<contactref element="TP6" pad="TP"/>
</signal>
<signal name="SCL1">
<contactref element="U7" pad="6"/>
<contactref element="TP7" pad="TP"/>
</signal>
<signal name="SCK">
<contactref element="U7" pad="17"/>
<contactref element="J9" pad="3"/>
</signal>
<signal name="MISO">
<contactref element="U7" pad="16"/>
<contactref element="J9" pad="1"/>
</signal>
<signal name="MOSI">
<contactref element="U7" pad="15"/>
<contactref element="J9" pad="4"/>
</signal>
<signal name="SDA0">
<contactref element="R32" pad="2"/>
<contactref element="U7" pad="27"/>
<contactref element="R34" pad="1"/>
</signal>
<signal name="SCL0">
<contactref element="R33" pad="2"/>
<contactref element="U7" pad="28"/>
<contactref element="R35" pad="1"/>
</signal>
<signal name="DTR_TXD">
<contactref element="U7" pad="31"/>
<contactref element="U4" pad="4"/>
<contactref element="R16" pad="2"/>
</signal>
<signal name="MGR_!RESET">
<contactref element="R31" pad="1"/>
<contactref element="D5" pad="A"/>
<contactref element="U7" pad="29"/>
<contactref element="J9" pad="5"/>
</signal>
<signal name="LED_BUILTIN">
<contactref element="U7" pad="13"/>
<contactref element="D6" pad="K"/>
<contactref element="TP4" pad="TP"/>
</signal>
<signal name="N$11">
<contactref element="R30" pad="2"/>
<contactref element="Q4" pad="3(D)"/>
<contactref element="U6" pad="3"/>
</signal>
<signal name="USB5V_ADC6">
<contactref element="U7" pad="19"/>
<contactref element="R3" pad="1"/>
<contactref element="R4" pad="1"/>
<contactref element="C5" pad="1"/>
</signal>
<signal name="VIN_ADC7">
<contactref element="U7" pad="22"/>
<contactref element="R20" pad="1"/>
<contactref element="R19" pad="2"/>
<contactref element="C13" pad="1"/>
</signal>
<signal name="N$3">
<contactref element="U3" pad="8"/>
<contactref element="S1" pad="2"/>
<contactref element="S1" pad="1"/>
<contactref element="J7" pad="6"/>
</signal>
<signal name="XTAL1">
<contactref element="U7" pad="7"/>
<contactref element="Y1" pad="1"/>
<contactref element="C20" pad="1"/>
</signal>
<signal name="XTAL2">
<contactref element="U7" pad="8"/>
<contactref element="Y1" pad="2"/>
<contactref element="C21" pad="1"/>
</signal>
</signals>
</board>
</drawing>
</eagle>
