(kicad_pcb (version 20171130) (host pcbnew "(5.1.7)-1")
  (general
    (thickness 1.6)
    (drawings 16)
    (tracks 109)
    (zones 0)
    (modules 37)
    (nets 26)
  )
  (page A)
  (title_block
    (title "IR Transmitter Circuit Board")
    (date 2021-05-18)
    (company "Android Industries")
    (comment 1 "Designer: C. M. Bulliner")
    (comment 2 "Part Number: E10312-001")
    (comment 3 "Assembly Number: E10312-SAA")
  )
  (layers
    (0 F.Cu signal)
    (31 B.Cu signal)
    (32 B.Adhes user)
    (33 F.Adhes user)
    (34 B.Paste user)
    (35 F.Paste user hide)
    (36 B.SilkS user)
    (37 F.SilkS user)
    (38 B.Mask user)
    (39 F.Mask user)
    (40 Dwgs.User user hide)
    (41 Cmts.User user)
    (42 Eco1.User user)
    (43 Eco2.User user)
    (44 Edge.Cuts user)
    (45 Margin user)
    (46 B.CrtYd user)
    (47 F.CrtYd user)
    (48 B.Fab user)
    (49 F.Fab user)
  )
  (setup
    (last_trace_width 0.4)
    (user_trace_width 1)
    (trace_clearance 0.2)
    (zone_clearance 0.2)
    (zone_45_only no)
    (trace_min 0.1524)
    (via_size 0.8)
    (via_drill 0.4)
    (via_min_size 0.6858)
    (via_min_drill 0.3302)
    (user_via 0.6858 0.3302)
    (user_via 0.6858 0.3302)
    (uvia_size 254)
    (uvia_drill 127)
    (uvias_allowed no)
    (uvia_min_size 0)
    (uvia_min_drill 0)
    (edge_width 0.1)
    (segment_width 0.2)
    (pcb_text_width 0.3)
    (pcb_text_size 1.5 1.5)
    (mod_edge_width 0.15)
    (mod_text_size 0.6 0.6)
    (mod_text_width 0.15)
    (pad_size 4 4)
    (pad_drill 3)
    (pad_to_mask_clearance 0)
    (aux_axis_origin 139.7 107.95)
    (grid_origin 139.7 107.95)
    (visible_elements 7FFDFF7F)
    (pcbplotparams
      (layerselection 0x010f0_ffffffff)
      (usegerberextensions true)
      (usegerberattributes true)
      (usegerberadvancedattributes false)
      (creategerberjobfile false)
      (excludeedgelayer true)
      (linewidth 0.100000)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (padsonsilk false)
      (subtractmaskfromsilk true)
      (outputformat 1)
      (mirror false)
      (drillshape 0)
      (scaleselection 1)
      (outputdirectory "../F - CAM Data (STEPs DWGs)/"))
  )
  (net 0 "")
  (net 1 /~RESET)
  (net 2 GND)
  (net 3 +24V)
  (net 4 +5V)
  (net 5 /STATUS)
  (net 6 "Net-(D1-Pad2)")
  (net 7 "Net-(D2-Pad2)")
  (net 8 "Net-(D3-Pad2)")
  (net 9 "Net-(D4-Pad2)")
  (net 10 "Net-(J1-Pad4)")
  (net 11 "Net-(J1-Pad2)")
  (net 12 /OUT2)
  (net 13 /OUT1)
  (net 14 "Net-(D5-Pad2)")
  (net 15 "Net-(D6-Pad1)")
  (net 16 "Net-(Q1-Pad1)")
  (net 17 /IN1)
  (net 18 /IN2)
  (net 19 /TXIR)
  (net 20 "Net-(Q1-Pad3)")
  (net 21 "Net-(U2-Pad13)")
  (net 22 "Net-(U2-Pad12)")
  (net 23 "Net-(U2-Pad11)")
  (net 24 "Net-(U2-Pad10)")
  (net 25 "Net-(U2-Pad6)")
  (net_class Default "This is the default net class."
    (clearance 0.2)
    (trace_width 0.4)
    (via_dia 0.8)
    (via_drill 0.4)
    (uvia_dia 254)
    (uvia_drill 127)
    (add_net +24V)
    (add_net +5V)
    (add_net /IN1)
    (add_net /IN2)
    (add_net /OUT1)
    (add_net /OUT2)
    (add_net /STATUS)
    (add_net /TXIR)
    (add_net /~RESET)
    (add_net GND)
    (add_net "Net-(D1-Pad2)")
    (add_net "Net-(D2-Pad2)")
    (add_net "Net-(D3-Pad2)")
    (add_net "Net-(D4-Pad2)")
    (add_net "Net-(D5-Pad2)")
    (add_net "Net-(D6-Pad1)")
    (add_net "Net-(J1-Pad2)")
    (add_net "Net-(J1-Pad4)")
    (add_net "Net-(Q1-Pad1)")
    (add_net "Net-(Q1-Pad3)")
    (add_net "Net-(U2-Pad10)")
    (add_net "Net-(U2-Pad11)")
    (add_net "Net-(U2-Pad12)")
    (add_net "Net-(U2-Pad13)")
    (add_net "Net-(U2-Pad6)")
  )
  (module Resistor_SMD:R_2010_5025Metric_Pad1.40x2.65mm_HandSolder (layer B.Cu) (tedit 5F68FEEE)
    (at 159.385 86.36 270)
    (descr "Resistor SMD 2010 (5025 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R11 (at 0 -2.54 180) (layer B.SilkS))
    (fp_text value 36.5 (at 0 -2.28 90) (layer B.Fab))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 2 smd roundrect (at 2.4 0 270) (size 1.4 2.65) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.1785707142857143)
      (net 20 "Net-(Q1-Pad3)"))
    (pad 1 smd roundrect (at -2.4 0 270) (size 1.4 2.65) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.1785707142857143)
      (net 15 "Net-(D6-Pad1)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_2010_5025Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder (layer B.Cu) (tedit 5F68FEEE)
    (at 159.385 96.52 180)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R10 (at -2.54 0) (layer B.SilkS))
    (fp_text value 10K (at 0 -1.43) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 2 smd roundrect (at 0.9125 0 180) (size 0.975 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (pad 1 smd roundrect (at -0.9125 0 180) (size 0.975 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 16 "Net-(Q1-Pad1)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder (layer B.Cu) (tedit 5F68FEEE)
    (at 159.385 98.425 180)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R9 (at -2.54 0) (layer B.SilkS))
    (fp_text value 100 (at 0 -1.43) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 2 smd roundrect (at 0.9125 0 180) (size 0.975 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 19 /TXIR))
    (pad 1 smd roundrect (at -0.9125 0 180) (size 0.975 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 16 "Net-(Q1-Pad1)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder (layer B.Cu) (tedit 5F68FEEE)
    (at 135.89 123.825 270)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R8 (at -2.54 0 180) (layer B.SilkS))
    (fp_text value 2K (at 0 -1.43 90) (layer B.Fab))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 2 smd roundrect (at 0.9125 0 270) (size 0.975 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (pad 1 smd roundrect (at -0.9125 0 270) (size 0.975 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 18 /IN2))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder (layer B.Cu) (tedit 5F68FEEE)
    (at 143.51 123.825 270)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R7 (at -2.54 0 180) (layer B.SilkS))
    (fp_text value 2K (at 0 -1.43 90) (layer B.Fab))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 2 smd roundrect (at 0.9125 0 270) (size 0.975 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (pad 1 smd roundrect (at -0.9125 0 270) (size 0.975 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 17 /IN1))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder (layer B.Cu) (tedit 5F68FEEE)
    (at 138.43 123.825 90)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R6 (at 2.54 0 180) (layer B.SilkS))
    (fp_text value 10K (at 0 -1.43 90) (layer B.Fab))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 2 smd roundrect (at 0.9125 0 90) (size 0.975 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 18 /IN2))
    (pad 1 smd roundrect (at -0.9125 0 90) (size 0.975 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 11 "Net-(J1-Pad2)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder (layer B.Cu) (tedit 5F68FEEE)
    (at 140.97 123.825 90)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R5 (at 2.54 0 180) (layer B.SilkS))
    (fp_text value 10K (at 0 -1.43 90) (layer B.Fab))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 2 smd roundrect (at 0.9125 0 90) (size 0.975 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 17 /IN1))
    (pad 1 smd roundrect (at -0.9125 0 90) (size 0.975 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 10 "Net-(J1-Pad4)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_TO_SOT_SMD:SOT-23_Handsoldering (layer B.Cu) (tedit 5A0AB76C)
    (at 159.385 92.71 90)
    (descr "SOT-23, Handsoldering")
    (tags SOT-23)
    (attr smd)
    (fp_text reference Q1 (at 0 2.54 180) (layer B.SilkS))
    (fp_text value DMN6140L (at 0 -2.5 90) (layer B.Fab))
    (fp_text user %R (at 0 0 180) (layer B.Fab))
    (pad 3 smd rect (at 1.5 0 90) (size 1.9 0.8) (layers B.Cu B.Paste B.Mask)
      (net 20 "Net-(Q1-Pad3)"))
    (pad 2 smd rect (at -1.5 -0.95 90) (size 1.9 0.8) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (pad 1 smd rect (at -1.5 0.95 90) (size 1.9 0.8) (layers B.Cu B.Paste B.Mask)
      (net 16 "Net-(Q1-Pad1)"))
    (model ${KISYS3DMOD}/Package_TO_SOT_SMD.3dshapes/SOT-23.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module LED_THT:LED_D3.0mm_Horizontal_O1.27mm_Z2.0mm (layer F.Cu) (tedit 5880A862)
    (at 158.75 81.28 180)
    (descr "LED, diameter 3.0mm z-position of LED center 2.0mm, 2 pins")
    (tags "LED diameter 3.0mm z-position of LED center 2.0mm 2 pins")
    (fp_text reference D6 (at 1.27 -1.96) (layer F.SilkS))
    (fp_text value VSLB3940 (at 1.27 7.63) (layer F.Fab))
    (pad 2 thru_hole circle (at 2.54 0 180) (size 1.8 1.8) (drill 0.9) (layers *.Cu *.Mask)
      (net 4 +5V))
    (pad 1 thru_hole rect (at 0 0 180) (size 1.8 1.8) (drill 0.9) (layers *.Cu *.Mask)
      (net 15 "Net-(D6-Pad1)"))
    (model C:/Innovations/Libraries/Lite-On/LTL-4232N_Horizontal_O1.27mm_Z2.0mm.step
      (offset (xyz 1.27 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 180))
    )
  )
  (module Capacitor_SMD:C_1206_3216Metric_Pad1.33x1.80mm_HandSolder (layer B.Cu) (tedit 5F68FEEF)
    (at 155.575 86.36 270)
    (descr "Capacitor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C4 (at 0 1.905 180) (layer B.SilkS))
    (fp_text value 4.7uF (at 0 -1.85 90) (layer B.Fab))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 2 smd roundrect (at 1.5625 0 270) (size 1.325 1.8) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.1886777358490566)
      (net 2 GND))
    (pad 1 smd roundrect (at -1.5625 0 270) (size 1.325 1.8) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.1886777358490566)
      (net 4 +5V))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_SO:SOIC-14_3.9x8.7mm_P1.27mm (layer B.Cu) (tedit 5D9F72B1)
    (at 139.7 107.95 90)
    (descr "SOIC, 14 Pin (JEDEC MS-012AB, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/soic_narrow-r/r_14.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py")
    (tags "SOIC SO")
    (attr smd)
    (fp_text reference U2 (at 4.445 0 180) (layer B.SilkS))
    (fp_text value ATtiny84A-SSU (at 0 -5.28 90) (layer B.Fab))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 14 smd roundrect (at 2.475 3.81 90) (size 1.95 0.6) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (pad 13 smd roundrect (at 2.475 2.54 90) (size 1.95 0.6) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 21 "Net-(U2-Pad13)"))
    (pad 12 smd roundrect (at 2.475 1.27 90) (size 1.95 0.6) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 22 "Net-(U2-Pad12)"))
    (pad 11 smd roundrect (at 2.475 0 90) (size 1.95 0.6) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 23 "Net-(U2-Pad11)"))
    (pad 10 smd roundrect (at 2.475 -1.27 90) (size 1.95 0.6) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 24 "Net-(U2-Pad10)"))
    (pad 9 smd roundrect (at 2.475 -2.54 90) (size 1.95 0.6) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 5 /STATUS))
    (pad 8 smd roundrect (at 2.475 -3.81 90) (size 1.95 0.6) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 13 /OUT1))
    (pad 7 smd roundrect (at -2.475 -3.81 90) (size 1.95 0.6) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 12 /OUT2))
    (pad 6 smd roundrect (at -2.475 -2.54 90) (size 1.95 0.6) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 25 "Net-(U2-Pad6)"))
    (pad 5 smd roundrect (at -2.475 -1.27 90) (size 1.95 0.6) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 19 /TXIR))
    (pad 4 smd roundrect (at -2.475 0 90) (size 1.95 0.6) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 1 /~RESET))
    (pad 3 smd roundrect (at -2.475 1.27 90) (size 1.95 0.6) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 18 /IN2))
    (pad 2 smd roundrect (at -2.475 2.54 90) (size 1.95 0.6) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 17 /IN1))
    (pad 1 smd roundrect (at -2.475 3.81 90) (size 1.95 0.6) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 4 +5V))
    (model ${KISYS3DMOD}/Package_SO.3dshapes/SOIC-14_3.9x8.7mm_P1.27mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Diode_SMD:D_SMA_Handsoldering (layer B.Cu) (tedit 58643398)
    (at 139.7 133.35)
    (descr "Diode SMA (DO-214AC) Handsoldering")
    (tags "Diode SMA (DO-214AC) Handsoldering")
    (attr smd)
    (fp_text reference D5 (at 0 2.54) (layer B.SilkS))
    (fp_text value D (at 0 -2.6) (layer B.Fab))
    (fp_text user %R (at 0 2.5) (layer B.Fab))
    (pad 2 smd rect (at 2.5 0) (size 3.5 1.8) (layers B.Cu B.Paste B.Mask)
      (net 14 "Net-(D5-Pad2)"))
    (pad 1 smd rect (at -2.5 0) (size 3.5 1.8) (layers B.Cu B.Paste B.Mask)
      (net 3 +24V))
    (model ${KISYS3DMOD}/Diode_SMD.3dshapes/D_SMA.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder (layer B.Cu) (tedit 5F68FEEF)
    (at 145.415 107.95 90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C3 (at 0 1.905 180) (layer B.SilkS))
    (fp_text value 0.1uF (at 0 -1.43 90) (layer B.Fab))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 2 smd roundrect (at 0.8625 0 90) (size 1.075 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 2 GND))
    (pad 1 smd roundrect (at -0.8625 0 90) (size 1.075 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 4 +5V))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1210_3225Metric_Pad1.33x2.70mm_HandSolder (layer B.Cu) (tedit 5F68FEEF)
    (at 126.365 133.35 180)
    (descr "Capacitor SMD 1210 (3225 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C1 (at 0 -2.54) (layer B.SilkS))
    (fp_text value 10uF (at 0 -2.3) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 2 smd roundrect (at 1.5625 0 180) (size 1.325 2.7) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.1886777358490566)
      (net 2 GND))
    (pad 1 smd roundrect (at -1.5625 0 180) (size 1.325 2.7) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.1886777358490566)
      (net 3 +24V))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1210_3225Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder (layer B.Cu) (tedit 5F68FEEE)
    (at 140.97 83.82 180)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R4 (at 0 -1.27) (layer B.SilkS))
    (fp_text value 150 (at 0 -1.43) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 2 smd roundrect (at 0.9125 0 180) (size 0.975 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 9 "Net-(D4-Pad2)"))
    (pad 1 smd roundrect (at -0.9125 0 180) (size 0.975 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 12 /OUT2))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder (layer B.Cu) (tedit 5F68FEEE)
    (at 133.35 83.82 180)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R3 (at 0 -1.27) (layer B.SilkS))
    (fp_text value 150 (at 0 -1.43) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 2 smd roundrect (at 0.9125 0 180) (size 0.975 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 8 "Net-(D3-Pad2)"))
    (pad 1 smd roundrect (at -0.9125 0 180) (size 0.975 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 13 /OUT1))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module LED_THT:LED_D3.0mm_Horizontal_O1.27mm_Z2.0mm (layer F.Cu) (tedit 5880A862)
    (at 142.24 81.28 180)
    (descr "LED, diameter 3.0mm z-position of LED center 2.0mm, 2 pins")
    (tags "LED diameter 3.0mm z-position of LED center 2.0mm 2 pins")
    (fp_text reference D4 (at 1.27 -1.905) (layer F.SilkS))
    (fp_text value YEL (at 1.27 7.63) (layer F.Fab))
    (pad 2 thru_hole circle (at 2.54 0 180) (size 1.8 1.8) (drill 0.9) (layers *.Cu *.Mask)
      (net 9 "Net-(D4-Pad2)"))
    (pad 1 thru_hole rect (at 0 0 180) (size 1.8 1.8) (drill 0.9) (layers *.Cu *.Mask)
      (net 2 GND))
    (model C:/Innovations/Libraries/Lite-On/LTL-4252N_Horizontal_O1.27mm_Z2.0mm.step
      (offset (xyz 1.27 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 180))
    )
  )
  (module LED_THT:LED_D3.0mm_Horizontal_O1.27mm_Z2.0mm (layer F.Cu) (tedit 5880A862)
    (at 134.62 81.28 180)
    (descr "LED, diameter 3.0mm z-position of LED center 2.0mm, 2 pins")
    (tags "LED diameter 3.0mm z-position of LED center 2.0mm 2 pins")
    (fp_text reference D3 (at 1.27 -1.905) (layer F.SilkS))
    (fp_text value YEL (at 1.27 7.63) (layer F.Fab))
    (pad 2 thru_hole circle (at 2.54 0 180) (size 1.8 1.8) (drill 0.9) (layers *.Cu *.Mask)
      (net 8 "Net-(D3-Pad2)"))
    (pad 1 thru_hole rect (at 0 0 180) (size 1.8 1.8) (drill 0.9) (layers *.Cu *.Mask)
      (net 2 GND))
    (model C:/Innovations/Libraries/Lite-On/LTL-4252N_Horizontal_O1.27mm_Z2.0mm.step
      (offset (xyz 1.27 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 180))
    )
  )
  (module Capacitor_SMD:C_1210_3225Metric_Pad1.33x2.70mm_HandSolder (layer B.Cu) (tedit 5F68FEEF)
    (at 120.015 133.35)
    (descr "Capacitor SMD 1210 (3225 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C2 (at 0 2.54) (layer B.SilkS))
    (fp_text value 22uF (at 0 -2.3) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 2 smd roundrect (at 1.5625 0) (size 1.325 2.7) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.1886777358490566)
      (net 2 GND))
    (pad 1 smd roundrect (at -1.5625 0) (size 1.325 2.7) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.1886777358490566)
      (net 4 +5V))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1210_3225Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Symbol_Android-Logo:Android-Logo_7.5mm (layer F.Cu) (tedit 605E3858)
    (at 139.7 92.075)
    (descr "Android Logo")
    (fp_text reference G1 (at 0 0) (layer F.SilkS) hide)
    (fp_text value Android-Logo (at 0.75 0) (layer F.SilkS) hide)
  )
  (module MountingHole:MountingHole_3.2mm_M3_ISO14580 locked (layer F.Cu) (tedit 56D1B4CB)
    (at 153.7 121.95)
    (descr "Mounting Hole 3.2mm, no annular, M3, ISO14580")
    (tags "mounting hole 3.2mm no annular m3 iso14580")
    (attr virtual)
    (fp_text reference H4 (at 0 -3.75) (layer F.SilkS) hide)
    (fp_text value MountingHole (at 0 3.75) (layer F.Fab))
    (fp_text user %R (at 0.3 0) (layer F.Fab))
    (pad 1 np_thru_hole circle (at 0 0) (size 3.2 3.2) (drill 3.2) (layers *.Cu *.Mask))
  )
  (module MountingHole:MountingHole_3.2mm_M3_ISO14580 locked (layer F.Cu) (tedit 56D1B4CB)
    (at 125.7 121.95)
    (descr "Mounting Hole 3.2mm, no annular, M3, ISO14580")
    (tags "mounting hole 3.2mm no annular m3 iso14580")
    (attr virtual)
    (fp_text reference H3 (at 0 -3.75) (layer F.SilkS) hide)
    (fp_text value MountingHole (at 0 3.75) (layer F.Fab))
    (fp_text user %R (at 0.3 0) (layer F.Fab))
    (pad 1 np_thru_hole circle (at 0 0) (size 3.2 3.2) (drill 3.2) (layers *.Cu *.Mask))
  )
  (module Converter_DCDC_CUI:Converter_DCDC_CUI_VX78xx-500_THT (layer F.Cu) (tedit 60468CE0)
    (at 125.73 129.54 180)
    (descr "DCDC-Converter, CUI, CUI_VX78xx-500, SIP-3, pitch 2.54mm, package size 11.6x7.55x10.16mm^3, https://www.cui.com/product/resource/vx78-500.pdf")
    (tags "dc-dc cui buck sip-3 pitch 2.54mm")
    (fp_text reference U1 (at 2.54 3.175) (layer F.SilkS))
    (fp_text value VX7805-500 (at 2.54 3) (layer F.Fab))
    (fp_text user %R (at 2.54 -2.25) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0 180) (size 1.5 2.3) (drill 1) (layers *.Cu *.Mask)
      (net 3 +24V))
    (pad 2 thru_hole oval (at 2.54 0 180) (size 1.5 2.3) (drill 1) (layers *.Cu *.Mask)
      (net 2 GND))
    (pad 3 thru_hole oval (at 5.08 0 180) (size 1.5 2.3) (drill 1) (layers *.Cu *.Mask)
      (net 4 +5V))
    (model C:/Innovations/Libraries/kicad/modules/packages3d/Converter_DCDC_CUI.3dshapes/Converter_DCDC_CUI_VX78xx-500_THT.step
      (offset (xyz 2.54 5.4 0.5))
      (scale (xyz 1 1 1))
      (rotate (xyz -90 0 0))
    )
  )
  (module MountingHole:MountingHole_3.2mm_M3_ISO14580 locked (layer F.Cu) (tedit 56D1B4CB)
    (at 153.7 93.95)
    (descr "Mounting Hole 3.2mm, no annular, M3, ISO14580")
    (tags "mounting hole 3.2mm no annular m3 iso14580")
    (attr virtual)
    (fp_text reference H2 (at 0 -3.75) (layer F.SilkS) hide)
    (fp_text value MountingHole (at 0 3.75) (layer F.Fab))
    (fp_text user %R (at 0.3 0) (layer F.Fab))
    (pad 1 np_thru_hole circle (at 0 0) (size 3.2 3.2) (drill 3.2) (layers *.Cu *.Mask))
  )
  (module MountingHole:MountingHole_3.2mm_M3_ISO14580 locked (layer F.Cu) (tedit 56D1B4CB)
    (at 125.7 93.95)
    (descr "Mounting Hole 3.2mm, no annular, M3, ISO14580")
    (tags "mounting hole 3.2mm no annular m3 iso14580")
    (attr virtual)
    (fp_text reference H1 (at 0 -3.75) (layer F.SilkS) hide)
    (fp_text value MountingHole (at 0 3.75) (layer F.Fab))
    (fp_text user %R (at 0.3 0) (layer F.Fab))
    (pad 1 np_thru_hole circle (at 0 0) (size 3.2 3.2) (drill 3.2) (layers *.Cu *.Mask))
  )
  (module Fiducial:Fiducial_1mm_Mask2mm (layer B.Cu) (tedit 5C18CB26)
    (at 165.1 81.915)
    (descr "Circular Fiducial, 1mm bare copper, 2mm soldermask opening (Level A)")
    (tags fiducial)
    (attr smd)
    (fp_text reference FID6 (at 0 2) (layer B.SilkS) hide)
    (fp_text value Fiducial (at 0 -2) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad "" smd circle (at 0 0) (size 1 1) (layers B.Cu B.Mask)
      (solder_mask_margin 0.5) (clearance 0.5))
  )
  (module Fiducial:Fiducial_1mm_Mask2mm (layer B.Cu) (tedit 5C18CB26)
    (at 165.1 133.985)
    (descr "Circular Fiducial, 1mm bare copper, 2mm soldermask opening (Level A)")
    (tags fiducial)
    (attr smd)
    (fp_text reference FID5 (at 0 2) (layer B.SilkS) hide)
    (fp_text value Fiducial (at 0 -2) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad "" smd circle (at 0 0) (size 1 1) (layers B.Cu B.Mask)
      (solder_mask_margin 0.5) (clearance 0.5))
  )
  (module Fiducial:Fiducial_1mm_Mask2mm (layer B.Cu) (tedit 5C18CB26)
    (at 114.3 133.985)
    (descr "Circular Fiducial, 1mm bare copper, 2mm soldermask opening (Level A)")
    (tags fiducial)
    (attr smd)
    (fp_text reference FID4 (at 0 2) (layer B.SilkS) hide)
    (fp_text value Fiducial (at 0 -2) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad "" smd circle (at 0 0) (size 1 1) (layers B.Cu B.Mask)
      (solder_mask_margin 0.5) (clearance 0.5))
  )
  (module Fiducial:Fiducial_1mm_Mask2mm (layer F.Cu) (tedit 5C18CB26)
    (at 165.1 81.915)
    (descr "Circular Fiducial, 1mm bare copper, 2mm soldermask opening (Level A)")
    (tags fiducial)
    (attr smd)
    (fp_text reference FID3 (at 0 -2) (layer F.SilkS) hide)
    (fp_text value Fiducial (at 0 2) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad "" smd circle (at 0 0) (size 1 1) (layers F.Cu F.Mask)
      (solder_mask_margin 0.5) (clearance 0.5))
  )
  (module Fiducial:Fiducial_1mm_Mask2mm (layer F.Cu) (tedit 5C18CB26)
    (at 165.1 133.985)
    (descr "Circular Fiducial, 1mm bare copper, 2mm soldermask opening (Level A)")
    (tags fiducial)
    (attr smd)
    (fp_text reference FID2 (at 0 -2) (layer F.SilkS) hide)
    (fp_text value Fiducial (at 0 2) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad "" smd circle (at 0 0) (size 1 1) (layers F.Cu F.Mask)
      (solder_mask_margin 0.5) (clearance 0.5))
  )
  (module Fiducial:Fiducial_1mm_Mask2mm (layer F.Cu) (tedit 5C18CB26)
    (at 114.3 133.985)
    (descr "Circular Fiducial, 1mm bare copper, 2mm soldermask opening (Level A)")
    (tags fiducial)
    (attr smd)
    (fp_text reference FID1 (at 0 -2) (layer F.SilkS) hide)
    (fp_text value Fiducial (at 0 2) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad "" smd circle (at 0 0) (size 1 1) (layers F.Cu F.Mask)
      (solder_mask_margin 0.5) (clearance 0.5))
  )
  (module Connector_Phoenix_SACC:PhoenixContact_SACC-DSI-M8MS-4CON-L90_SH-1456048 locked (layer F.Cu) (tedit 604916FC)
    (at 139.7 137.28)
    (fp_text reference J1 (at 0 -12.185) (layer F.SilkS))
    (fp_text value M8-4 (at 0 -3.05) (layer F.Fab))
    (pad 4 thru_hole circle (at 1.075 -9.65) (size 1.7 1.7) (drill 1.3) (layers *.Cu *.Mask)
      (net 10 "Net-(J1-Pad4)"))
    (pad 1 thru_hole circle (at -1.7 -7.7) (size 1.7 1.7) (drill 1.3) (layers *.Cu *.Mask)
      (net 14 "Net-(D5-Pad2)"))
    (pad 2 thru_hole circle (at -1.075 -9.65) (size 1.7 1.7) (drill 1.3) (layers *.Cu *.Mask)
      (net 11 "Net-(J1-Pad2)"))
    (pad 3 thru_hole circle (at 1.7 -7.7) (size 1.7 1.7) (drill 1.3) (layers *.Cu *.Mask)
      (net 2 GND))
    (pad 3 thru_hole circle (at -6.25 -8.2) (size 4 4) (drill 3) (layers *.Cu *.Mask)
      (net 2 GND))
    (pad 3 thru_hole circle (at 6.25 -8.2) (size 4 4) (drill 3) (layers *.Cu *.Mask)
      (net 2 GND))
    (model C:/Innovations/Libraries/kicad/modules/packages3d/Connector_Phoenix_SACC.3dshapes/PhoenixContact_SACC-DSI-M8MS-4CON-L90_SH-1456048.step
      (offset (xyz -10.08 2.2 6.4))
      (scale (xyz 1 1 1))
      (rotate (xyz 90 0 180))
    )
  )
  (module LED_THT:LED_D3.0mm_Horizontal_O1.27mm_Z2.0mm (layer F.Cu) (tedit 5880A862)
    (at 119.38 81.28 180)
    (descr "LED, diameter 3.0mm z-position of LED center 2.0mm, 2 pins")
    (tags "LED diameter 3.0mm z-position of LED center 2.0mm 2 pins")
    (fp_text reference D1 (at 1.27 -1.905) (layer F.SilkS))
    (fp_text value GRN (at 1.27 7.63) (layer F.Fab))
    (pad 2 thru_hole circle (at 2.54 0 180) (size 1.8 1.8) (drill 0.9) (layers *.Cu *.Mask)
      (net 6 "Net-(D1-Pad2)"))
    (pad 1 thru_hole rect (at 0 0 180) (size 1.8 1.8) (drill 0.9) (layers *.Cu *.Mask)
      (net 2 GND))
    (model C:/Innovations/Libraries/Lite-On/LTL-4232N_Horizontal_O1.27mm_Z2.0mm.step
      (offset (xyz 1.27 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 180))
    )
  )
  (module LED_THT:LED_D3.0mm_Horizontal_O1.27mm_Z2.0mm (layer F.Cu) (tedit 5880A862)
    (at 127 81.28 180)
    (descr "LED, diameter 3.0mm z-position of LED center 2.0mm, 2 pins")
    (tags "LED diameter 3.0mm z-position of LED center 2.0mm 2 pins")
    (fp_text reference D2 (at 1.27 -1.905) (layer F.SilkS))
    (fp_text value YEL (at 1.27 7.63) (layer F.Fab))
    (pad 2 thru_hole circle (at 2.54 0 180) (size 1.8 1.8) (drill 0.9) (layers *.Cu *.Mask)
      (net 7 "Net-(D2-Pad2)"))
    (pad 1 thru_hole rect (at 0 0 180) (size 1.8 1.8) (drill 0.9) (layers *.Cu *.Mask)
      (net 2 GND))
    (model C:/Innovations/Libraries/Lite-On/LTL-4252N_Horizontal_O1.27mm_Z2.0mm.step
      (offset (xyz 1.27 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 180))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder (layer B.Cu) (tedit 5F68FEEE)
    (at 118.11 83.82 180)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R1 (at 0 -1.27) (layer B.SilkS))
    (fp_text value 150 (at 0 -1.43) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 2 smd roundrect (at 0.9125 0 180) (size 0.975 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 6 "Net-(D1-Pad2)"))
    (pad 1 smd roundrect (at -0.9125 0 180) (size 0.975 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 4 +5V))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder (layer B.Cu) (tedit 5F68FEEE)
    (at 125.72746 83.82 180)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R2 (at -0.00254 -1.27) (layer B.SilkS))
    (fp_text value 150 (at 0 -1.43) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 2 smd roundrect (at 0.9125 0 180) (size 0.975 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 7 "Net-(D2-Pad2)"))
    (pad 1 smd roundrect (at -0.9125 0 180) (size 0.975 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 5 /STATUS))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_IDC:IDC-Header_2x03_P2.54mm_Vertical (layer F.Cu) (tedit 5EAC9A07)
    (at 130.81 105.41)
    (descr "Through hole IDC box header, 2x03, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0")
    (tags "Through hole vertical IDC box header THT 2x03 2.54mm double row")
    (fp_text reference J2 (at 1.27 -6.35) (layer F.SilkS))
    (fp_text value AVR-ISP-6 (at 1.27 11.18) (layer F.Fab))
    (fp_text user %R (at 1.27 2.54 90) (layer F.Fab))
    (pad 6 thru_hole circle (at 2.54 5.08) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 2 GND))
    (pad 4 thru_hole circle (at 2.54 2.54) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 12 /OUT2))
    (pad 2 thru_hole circle (at 2.54 0) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 4 +5V))
    (pad 5 thru_hole circle (at 0 5.08) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 /~RESET))
    (pad 3 thru_hole circle (at 0 2.54) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 5 /STATUS))
    (pad 1 thru_hole roundrect (at 0 0) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask) (roundrect_rratio 0.1470588235294118)
      (net 13 /OUT1))
    (model ${KISYS3DMOD}/Connector_IDC.3dshapes/IDC-Header_2x03_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
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  (gr_line (start 111.395 136.78) (end 168.005 136.78) (layer Edge.Cuts) (width 0.1))
  (gr_text "RIGHT ANGLE CONNECTORS ON \nFRONT AND BACK ONLY" (at 140.005 140.303) (layer Dwgs.User))
  (gr_text "IR Transmitter\nCircuit Board\nPN: E10312-001\nAN: E10312-SAA" (at 156.21 104.775) (layer F.SilkS))
  (gr_text "NO CONNECTORS " (at 109.005 105.303 90) (layer Dwgs.User))
  (gr_text "NO CONNECTORS " (at 171.005 105.303 90) (layer Dwgs.User))
  (gr_arc (start 114.7 115.282) (end 114.7 111.967) (angle 180) (layer Edge.Cuts) (width 0.1))
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  (gr_line (start 111.395 111.967) (end 114.7 111.967) (layer Edge.Cuts) (width 0.1))
  (gr_line (start 168.005 118.597) (end 164.7 118.597) (layer Edge.Cuts) (width 0.1))
  (gr_line (start 111.395 118.597) (end 111.395 136.78) (layer Edge.Cuts) (width 0.1))
  (zone (net 2) (net_name GND) (layer F.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.2))
    (min_thickness 0.3)
    (fill yes (arc_segments 32) (thermal_gap 0.2) (thermal_bridge_width 0.4))
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      (pts
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  )
  (zone (net 2) (net_name GND) (layer B.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.2))
    (min_thickness 0.3)
    (fill yes (arc_segments 32) (thermal_gap 0.2) (thermal_bridge_width 0.4))
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      (pts
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