(kicad_pcb (version 20171130) (host pcbnew "(5.1.7)-1")
  (general
    (thickness 1.6)
    (drawings 33)
    (tracks 70)
    (zones 0)
    (modules 17)
    (nets 15)
  )
  (page A)
  (title_block
    (title "TPM Install Tool Load Cell Amp")
    (date 2021-03-30)
    (company "Android Industries")
    (comment 1 "Designer: C. M. Bulliner")
    (comment 2 "Part Number: E10289-001")
    (comment 3 "Assembly Number: E10289-000")
  )
  (layers
    (0 F.Cu signal)
    (31 B.Cu signal)
    (32 B.Adhes user)
    (33 F.Adhes user)
    (34 B.Paste user)
    (35 F.Paste user)
    (36 B.SilkS user)
    (37 F.SilkS user)
    (38 B.Mask user)
    (39 F.Mask user)
    (40 Dwgs.User user hide)
    (41 Cmts.User user)
    (42 Eco1.User user)
    (43 Eco2.User user)
    (44 Edge.Cuts user)
    (45 Margin user)
    (46 B.CrtYd user hide)
    (47 F.CrtYd user hide)
    (48 B.Fab user hide)
    (49 F.Fab user hide)
  )
  (setup
    (last_trace_width 0.25)
    (user_trace_width 0.508)
    (user_trace_width 0.762)
    (trace_clearance 0.2)
    (zone_clearance 0.4064)
    (zone_45_only yes)
    (trace_min 0.2)
    (via_size 0.6)
    (via_drill 0.4)
    (via_min_size 0.4)
    (via_min_drill 0.3)
    (uvia_size 0.3)
    (uvia_drill 0.1)
    (uvias_allowed no)
    (uvia_min_size 0.2)
    (uvia_min_drill 0.1)
    (edge_width 0.15)
    (segment_width 0.2)
    (pcb_text_width 0.3)
    (pcb_text_size 1.5 1.5)
    (mod_edge_width 0.15)
    (mod_text_size 1 1)
    (mod_text_width 0.15)
    (pad_size 4 4)
    (pad_drill 3)
    (pad_to_mask_clearance 0.2)
    (aux_axis_origin 111.125 126.365)
    (visible_elements 7FFFFF7F)
    (pcbplotparams
      (layerselection 0x010f0_ffffffff)
      (usegerberextensions false)
      (usegerberattributes true)
      (usegerberadvancedattributes true)
      (creategerberjobfile true)
      (excludeedgelayer true)
      (linewidth 0.100000)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin true)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue false)
      (plotinvisibletext false)
      (padsonsilk false)
      (subtractmaskfromsilk true)
      (outputformat 1)
      (mirror false)
      (drillshape 0)
      (scaleselection 1)
      (outputdirectory "../F - CAM Data (STEPs DWGs)/"))
  )
  (net 0 "")
  (net 1 +5V)
  (net 2 /+OUT)
  (net 3 /-OUT)
  (net 4 "Net-(R1-Pad1)")
  (net 5 "Net-(R1-Pad2)")
  (net 6 /FORCE)
  (net 7 "Net-(P3-Pad2)")
  (net 8 +24VA)
  (net 9 GNDA)
  (net 10 +1V2)
  (net 11 +24VD)
  (net 12 /INSTALL)
  (net 13 /DONE)
  (net 14 GNDD)
  (net_class Default "This is the default net class."
    (clearance 0.2)
    (trace_width 0.25)
    (via_dia 0.6)
    (via_drill 0.4)
    (uvia_dia 0.3)
    (uvia_drill 0.1)
    (add_net +1V2)
    (add_net +24VA)
    (add_net +24VD)
    (add_net +5V)
    (add_net /+OUT)
    (add_net /-OUT)
    (add_net /DONE)
    (add_net /FORCE)
    (add_net /INSTALL)
    (add_net GNDA)
    (add_net GNDD)
    (add_net "Net-(P3-Pad2)")
    (add_net "Net-(R1-Pad1)")
    (add_net "Net-(R1-Pad2)")
  )
  (module My_Modules:TE-T4040034041-000 (layer B.Cu) (tedit 5A8F33E6)
    (at 127 107.95 45)
    (fp_text reference P4 (at 0 -7.184205 45) (layer B.SilkS))
    (fp_text value DIGITAL (at 0 -7.62 45) (layer B.Fab) hide)
    (pad 1 thru_hole circle (at -1.7 -0.5 45) (size 1.8 1.8) (drill 1.3) (layers *.Cu *.Mask)
      (net 11 +24VD))
    (pad 2 thru_hole circle (at -1.075 1.45 195) (size 1.8 1.8) (drill 1.3) (layers *.Cu *.Mask)
      (net 13 /DONE))
    (pad 3 thru_hole circle (at 1.7 -0.5 45) (size 1.8 1.8) (drill 1.3) (layers *.Cu *.Mask)
      (net 14 GNDD))
    (pad 4 thru_hole circle (at 1.075 1.45 255) (size 1.8 1.8) (drill 1.3) (layers *.Cu *.Mask)
      (net 12 /INSTALL))
    (pad "" thru_hole circle (at -6.249999 0 15) (size 4 4) (drill 3) (layers *.Cu *.Mask))
    (pad "" thru_hole circle (at 6.249999 0 15) (size 4 4) (drill 3) (layers *.Cu *.Mask))
  )
  (module My_Modules:TE-T4040034031-000 (layer B.Cu) (tedit 5A8F33EA)
    (at 152.4 107.95 45)
    (fp_text reference P2 (at 0 -7.184205 45) (layer B.SilkS))
    (fp_text value ANALOG (at 0 -7.62 45) (layer B.Fab) hide)
    (pad 1 thru_hole circle (at -1.75 0 45) (size 2 2) (drill 1.3) (layers *.Cu *.Mask)
      (net 8 +24VA))
    (pad 3 thru_hole circle (at 1.75 0 45) (size 2 2) (drill 1.3) (layers *.Cu *.Mask)
      (net 9 GNDA))
    (pad 4 thru_hole circle (at 0 1.75 225) (size 2 2) (drill 1.3) (layers *.Cu *.Mask)
      (net 6 /FORCE))
    (pad "" thru_hole circle (at -6.249999 0 15) (size 4 4) (drill 3) (layers *.Cu *.Mask))
    (pad "" thru_hole circle (at 6.249999 0 15) (size 4 4) (drill 3) (layers *.Cu *.Mask))
  )
  (module My_Modules:OSTVN04A150 (layer F.Cu) (tedit 5A8F3397)
    (at 168.91 107.95 90)
    (fp_text reference P1 (at 6.35 0 180) (layer F.SilkS))
    (fp_text value "LOAD CELL" (at 0 4.445 90) (layer F.Fab) hide)
    (pad 1 thru_hole rect (at -3.81 0 90) (size 1.7272 3.048) (drill 1.3) (layers *.Cu *.Mask)
      (net 1 +5V))
    (pad 2 thru_hole oval (at -1.27 0 90) (size 1.7272 3.048) (drill 1.3) (layers *.Cu *.Mask)
      (net 2 /+OUT))
    (pad 3 thru_hole oval (at 1.27 0 90) (size 1.7272 3.048) (drill 1.3) (layers *.Cu *.Mask)
      (net 9 GNDA))
    (pad 4 thru_hole oval (at 3.81 0 90) (size 1.7272 3.048) (drill 1.3) (layers *.Cu *.Mask)
      (net 3 /-OUT))
  )
  (module Capacitors_SMD:C_1206_HandSoldering (layer F.Cu) (tedit 5A8F347C)
    (at 150.495 106.045 45)
    (descr "Capacitor SMD 1206, hand soldering")
    (tags "capacitor 1206")
    (attr smd)
    (fp_text reference C1 (at -4.490128 0 45) (layer F.SilkS))
    (fp_text value 10uF (at 7.633218 -5.837166 45) (layer F.Fab))
    (fp_text user %R (at 0 -1.75 45) (layer F.Fab))
    (pad 1 smd rect (at -2 0 45) (size 2 1.6) (layers F.Cu F.Paste F.Mask)
      (net 8 +24VA))
    (pad 2 smd rect (at 2 0 45) (size 2 1.6) (layers F.Cu F.Paste F.Mask)
      (net 9 GNDA))
    (model Capacitors_SMD.3dshapes/C_1206.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0603_HandSoldering (layer B.Cu) (tedit 5A8F33DE)
    (at 162.56 105.41)
    (descr "Resistor SMD 0603, hand soldering")
    (tags "resistor 0603")
    (attr smd)
    (fp_text reference R1 (at 0 -1.905) (layer B.SilkS))
    (fp_text value 1K (at 0 -7.62) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 1 smd rect (at -1.1 0) (size 1.2 0.9) (layers B.Cu B.Paste B.Mask)
      (net 4 "Net-(R1-Pad1)"))
    (pad 2 smd rect (at 1.1 0) (size 1.2 0.9) (layers B.Cu B.Paste B.Mask)
      (net 5 "Net-(R1-Pad2)"))
    (model ${KISYS3DMOD}/Resistors_SMD.3dshapes/R_0603.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Housings_SOIC:SOIC-8_3.9x4.9mm_Pitch1.27mm (layer B.Cu) (tedit 5A8F33D9)
    (at 162.56 110.49 270)
    (descr "8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC] (see Microchip Packaging Specification 00000049BS.pdf)")
    (tags "SOIC 1.27")
    (attr smd)
    (fp_text reference U1 (at 1.905 3.81) (layer B.SilkS))
    (fp_text value AD8227 (at 7.62 5.08) (layer B.Fab))
    (fp_text user %R (at 0 0 270) (layer B.Fab))
    (pad 1 smd rect (at -2.7 1.905 270) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
      (net 3 /-OUT))
    (pad 2 smd rect (at -2.7 0.635 270) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
      (net 4 "Net-(R1-Pad1)"))
    (pad 3 smd rect (at -2.7 -0.635 270) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
      (net 5 "Net-(R1-Pad2)"))
    (pad 4 smd rect (at -2.7 -1.905 270) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
      (net 2 /+OUT))
    (pad 5 smd rect (at 2.7 -1.905 270) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
      (net 9 GNDA))
    (pad 6 smd rect (at 2.7 -0.635 270) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
      (net 10 +1V2))
    (pad 7 smd rect (at 2.7 0.635 270) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
      (net 6 /FORCE))
    (pad 8 smd rect (at 2.7 1.905 270) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
      (net 8 +24VA))
    (model ${KISYS3DMOD}/Housings_SOIC.3dshapes/SOIC-8_3.9x4.9mm_Pitch1.27mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0603_HandSoldering (layer F.Cu) (tedit 5A8F3467)
    (at 148.59 104.14 45)
    (descr "Capacitor SMD 0603, hand soldering")
    (tags "capacitor 0603")
    (attr smd)
    (fp_text reference C2 (at -2.694077 0 45) (layer F.SilkS))
    (fp_text value 100nF (at 5.388154 -5.388154 45) (layer F.Fab))
    (fp_text user %R (at 0 -1.25 45) (layer F.Fab))
    (pad 1 smd rect (at -0.95 0 45) (size 1.2 0.75) (layers F.Cu F.Paste F.Mask)
      (net 8 +24VA))
    (pad 2 smd rect (at 0.95 0 45) (size 1.2 0.75) (layers F.Cu F.Paste F.Mask)
      (net 9 GNDA))
    (model Capacitors_SMD.3dshapes/C_0603.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0603_HandSoldering (layer B.Cu) (tedit 5A8F3427)
    (at 171.45 109.22 90)
    (descr "Capacitor SMD 0603, hand soldering")
    (tags "capacitor 0603")
    (attr smd)
    (fp_text reference C3 (at 0 1.905 180) (layer B.SilkS))
    (fp_text value 100nF (at 0 8.89 180) (layer B.Fab))
    (fp_text user %R (at 0 1.25 90) (layer B.Fab))
    (pad 1 smd rect (at -0.95 0 90) (size 1.2 0.75) (layers B.Cu B.Paste B.Mask)
      (net 1 +5V))
    (pad 2 smd rect (at 0.95 0 90) (size 1.2 0.75) (layers B.Cu B.Paste B.Mask)
      (net 9 GNDA))
    (model Capacitors_SMD.3dshapes/C_0603.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0603_HandSoldering (layer B.Cu) (tedit 5A8F33D8)
    (at 163.83 115.57)
    (descr "Capacitor SMD 0603, hand soldering")
    (tags "capacitor 0603")
    (attr smd)
    (fp_text reference C4 (at 3.175 0) (layer B.SilkS))
    (fp_text value 100nF (at 0 2.54) (layer B.Fab))
    (fp_text user %R (at 0 1.25) (layer B.Fab))
    (pad 1 smd rect (at -0.95 0) (size 1.2 0.75) (layers B.Cu B.Paste B.Mask)
      (net 10 +1V2))
    (pad 2 smd rect (at 0.95 0) (size 1.2 0.75) (layers B.Cu B.Paste B.Mask)
      (net 9 GNDA))
    (model Capacitors_SMD.3dshapes/C_0603.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Housings_SOIC:SOIC-8_3.9x4.9mm_Pitch1.27mm (layer F.Cu) (tedit 5A8F3483)
    (at 160.02 109.22 180)
    (descr "8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC] (see Microchip Packaging Specification 00000049BS.pdf)")
    (tags "SOIC 1.27")
    (attr smd)
    (fp_text reference U2 (at 0 3.81 180) (layer F.SilkS))
    (fp_text value L78L05ABD13TR (at 0 11.43 180) (layer F.Fab))
    (fp_text user %R (at 0 0 180) (layer F.Fab))
    (pad 1 smd rect (at -2.7 -1.905 180) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 1 +5V))
    (pad 2 smd rect (at -2.7 -0.635 180) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 9 GNDA))
    (pad 3 smd rect (at -2.7 0.635 180) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 9 GNDA))
    (pad 4 smd rect (at -2.7 1.905 180) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask))
    (pad 5 smd rect (at 2.7 1.905 180) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask))
    (pad 6 smd rect (at 2.7 0.635 180) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 9 GNDA))
    (pad 7 smd rect (at 2.7 -0.635 180) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 9 GNDA))
    (pad 8 smd rect (at 2.7 -1.905 180) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 8 +24VA))
    (model ${KISYS3DMOD}/Housings_SOIC.3dshapes/SOIC-8_3.9x4.9mm_Pitch1.27mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module TO_SOT_Packages_SMD:SOT-23_Handsoldering (layer F.Cu) (tedit 5A904BF2)
    (at 160.02 114.3)
    (descr "SOT-23, Handsoldering")
    (tags SOT-23)
    (attr smd)
    (fp_text reference U3 (at 3.81 0) (layer F.SilkS))
    (fp_text value AP7313-12SRG-7 (at 4.445 3.81) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd rect (at -1.5 -0.95) (size 1.9 0.8) (layers F.Cu F.Paste F.Mask)
      (net 9 GNDA))
    (pad 2 smd rect (at -1.5 0.95) (size 1.9 0.8) (layers F.Cu F.Paste F.Mask)
      (net 10 +1V2))
    (pad 3 smd rect (at 1.5 0) (size 1.9 0.8) (layers F.Cu F.Paste F.Mask)
      (net 1 +5V))
    (model ${KISYS3DMOD}/TO_SOT_Packages_SMD.3dshapes\SOT-23.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module My_Modules:OSTVN06A150 (layer F.Cu) (tedit 5A8F3394)
    (at 116.84 107.95 270)
    (fp_text reference P3 (at -6.985 -4.445) (layer F.SilkS))
    (fp_text value BUTTONS (at 0 4.445 270) (layer F.Fab) hide)
    (pad 1 thru_hole rect (at -6.35 0 270) (size 1.7272 3.048) (drill 1.3) (layers *.Cu *.Mask)
      (net 11 +24VD))
    (pad 2 thru_hole oval (at -3.81 0 270) (size 1.7272 3.048) (drill 1.3) (layers *.Cu *.Mask)
      (net 7 "Net-(P3-Pad2)"))
    (pad 3 thru_hole oval (at -1.27 0 270) (size 1.7272 3.048) (drill 1.3) (layers *.Cu *.Mask)
      (net 7 "Net-(P3-Pad2)"))
    (pad 4 thru_hole oval (at 1.27 0 270) (size 1.7272 3.048) (drill 1.3) (layers *.Cu *.Mask)
      (net 12 /INSTALL))
    (pad 5 thru_hole oval (at 3.81 0 270) (size 1.7272 3.048) (drill 1.3) (layers *.Cu *.Mask)
      (net 11 +24VD))
    (pad 6 thru_hole oval (at 6.35 0 270) (size 1.7272 3.048) (drill 1.3) (layers *.Cu *.Mask)
      (net 13 /DONE))
  )
  (module Capacitors_SMD:C_1206_HandSoldering (layer F.Cu) (tedit 5A8F347A)
    (at 125.095 106.045 45)
    (descr "Capacitor SMD 1206, hand soldering")
    (tags "capacitor 1206")
    (attr smd)
    (fp_text reference C5 (at 4.490128 0 45) (layer F.SilkS))
    (fp_text value 10uF (at 7.633218 -5.837166 45) (layer F.Fab))
    (fp_text user %R (at 0 -1.75 45) (layer F.Fab))
    (pad 1 smd rect (at -2 0 45) (size 2 1.6) (layers F.Cu F.Paste F.Mask)
      (net 11 +24VD))
    (pad 2 smd rect (at 2 0 45) (size 2 1.6) (layers F.Cu F.Paste F.Mask)
      (net 14 GNDD))
    (model Capacitors_SMD.3dshapes/C_1206.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0603_HandSoldering (layer F.Cu) (tedit 5A8F3471)
    (at 123.19 104.14 45)
    (descr "Capacitor SMD 0603, hand soldering")
    (tags "capacitor 0603")
    (attr smd)
    (fp_text reference C6 (at 2.694077 0 45) (layer F.SilkS))
    (fp_text value 100nF (at 5.388154 -5.388154 45) (layer F.Fab))
    (fp_text user %R (at 0 -1.25 45) (layer F.Fab))
    (pad 1 smd rect (at -0.95 0 45) (size 1.2 0.75) (layers F.Cu F.Paste F.Mask)
      (net 11 +24VD))
    (pad 2 smd rect (at 0.95 0 45) (size 1.2 0.75) (layers F.Cu F.Paste F.Mask)
      (net 14 GNDD))
    (model Capacitors_SMD.3dshapes/C_0603.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0603_HandSoldering (layer F.Cu) (tedit 5A8F34C0)
    (at 139.7 109.22)
    (descr "Resistor SMD 0603, hand soldering")
    (tags "resistor 0603")
    (attr smd)
    (fp_text reference R2 (at -3.175 0) (layer F.SilkS))
    (fp_text value DNP (at 0 8.89) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd rect (at -1.1 0) (size 1.2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 11 +24VD))
    (pad 2 smd rect (at 1.1 0) (size 1.2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 8 +24VA))
    (model ${KISYS3DMOD}/Resistors_SMD.3dshapes/R_0603.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0603_HandSoldering (layer F.Cu) (tedit 5A8F34BE)
    (at 139.7 106.68)
    (descr "Resistor SMD 0603, hand soldering")
    (tags "resistor 0603")
    (attr smd)
    (fp_text reference R3 (at -3.175 0) (layer F.SilkS))
    (fp_text value DNP (at 0 -8.89) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd rect (at -1.1 0) (size 1.2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 14 GNDD))
    (pad 2 smd rect (at 1.1 0) (size 1.2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 9 GNDA))
    (model ${KISYS3DMOD}/Resistors_SMD.3dshapes/R_0603.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0603_HandSoldering (layer F.Cu) (tedit 5A904BF6)
    (at 154.94 114.3 90)
    (descr "Resistor SMD 0603, hand soldering")
    (tags "resistor 0603")
    (attr smd)
    (fp_text reference R4 (at 0 -1.905 180) (layer F.SilkS))
    (fp_text value 1K (at -3.81 0 180) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd rect (at -1.1 0 90) (size 1.2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 10 +1V2))
    (pad 2 smd rect (at 1.1 0 90) (size 1.2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 9 GNDA))
    (model ${KISYS3DMOD}/Resistors_SMD.3dshapes/R_0603.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (gr_text "ANDROID INDUSTRIES" (at 143.51 100.965) (layer F.SilkS))
  (gr_text "TPM Install Tool\nLoad Cell Amp\nPN: E10289-001  AN: E10289-000" (at 136.525 114.3) (layer F.SilkS))
  (gr_line (start 112.395 116.84) (end 173.355 116.84) (angle 90) (layer Edge.Cuts) (width 0.15))
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