(kicad_pcb (version 20171130) (host pcbnew "(5.0.0)")
  (general
    (thickness 1.6)
    (drawings 4)
    (tracks 608)
    (zones 0)
    (modules 45)
    (nets 32)
  )
  (page A4)
  (layers
    (0 F.Cu signal)
    (31 B.Cu signal)
    (32 B.Adhes user)
    (33 F.Adhes user)
    (34 B.Paste user hide)
    (35 F.Paste user)
    (36 B.SilkS user)
    (37 F.SilkS user)
    (38 B.Mask user)
    (39 F.Mask user)
    (40 Dwgs.User user)
    (41 Cmts.User user)
    (42 Eco1.User user)
    (43 Eco2.User user)
    (44 Edge.Cuts user)
    (45 Margin user)
    (46 B.CrtYd user hide)
    (47 F.CrtYd user hide)
    (48 B.Fab user hide)
    (49 F.Fab user hide)
  )
  (setup
    (last_trace_width 0.25)
    (trace_clearance 0.2)
    (zone_clearance 0.508)
    (zone_45_only no)
    (trace_min 0.2)
    (segment_width 0.2)
    (edge_width 0.2)
    (via_size 0.8)
    (via_drill 0.4)
    (via_min_size 0.4)
    (via_min_drill 0.3)
    (uvia_size 0.3)
    (uvia_drill 0.1)
    (uvias_allowed no)
    (uvia_min_size 0.2)
    (uvia_min_drill 0.1)
    (pcb_text_width 0.3)
    (pcb_text_size 1.5 1.5)
    (mod_edge_width 0.15)
    (mod_text_size 1 1)
    (mod_text_width 0.15)
    (pad_size 3.81508 3.81508)
    (pad_drill 2.79908)
    (pad_to_mask_clearance 0.2)
    (aux_axis_origin 0 0)
    (visible_elements 7FFFFFFF)
    (pcbplotparams
      (layerselection 0x010fc_ffffffff)
      (usegerberextensions false)
      (usegerberattributes false)
      (usegerberadvancedattributes false)
      (creategerberjobfile false)
      (excludeedgelayer true)
      (linewidth 0.100000)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (padsonsilk false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 0)
      (scaleselection 1)
      (outputdirectory "Gerbers/"))
  )
  (net 0 "")
  (net 1 "Net-(C1-Pad2)")
  (net 2 "Net-(C1-Pad1)")
  (net 3 GND)
  (net 4 3.3V)
  (net 5 5V)
  (net 6 /~MCLR~)
  (net 7 "Net-(J2-Pad2)")
  (net 8 /Select)
  (net 9 /Enter)
  (net 10 "Net-(Q1-Pad3)")
  (net 11 /LED_CNTL)
  (net 12 /SHDN)
  (net 13 /EE_WP)
  (net 14 /SCL)
  (net 15 /SDA)
  (net 16 "Net-(R9-Pad2)")
  (net 17 /RTC_MFP)
  (net 18 "Net-(C5-Pad2)")
  (net 19 "Net-(C6-Pad2)")
  (net 20 "Net-(C7-Pad1)")
  (net 21 "Net-(C9-Pad2)")
  (net 22 "Net-(C10-Pad2)")
  (net 23 "Net-(C12-Pad2)")
  (net 24 "Net-(C13-Pad1)")
  (net 25 /DO)
  (net 26 /RSSI)
  (net 27 "Net-(LED1-Pad1)")
  (net 28 /TX)
  (net 29 /RX)
  (net 30 "Net-(BT1-Pad1)")
  (net 31 GND-ISO)
  (net_class Default "This is the default net class."
    (clearance 0.2)
    (trace_width 0.25)
    (via_dia 0.8)
    (via_drill 0.4)
    (uvia_dia 0.3)
    (uvia_drill 0.1)
    (add_net /DO)
    (add_net /EE_WP)
    (add_net /Enter)
    (add_net /LED_CNTL)
    (add_net /RSSI)
    (add_net /RTC_MFP)
    (add_net /RX)
    (add_net /SCL)
    (add_net /SDA)
    (add_net /SHDN)
    (add_net /Select)
    (add_net /TX)
    (add_net /~MCLR~)
    (add_net 3.3V)
    (add_net 5V)
    (add_net GND)
    (add_net GND-ISO)
    (add_net "Net-(BT1-Pad1)")
    (add_net "Net-(C1-Pad1)")
    (add_net "Net-(C1-Pad2)")
    (add_net "Net-(C10-Pad2)")
    (add_net "Net-(C12-Pad2)")
    (add_net "Net-(C13-Pad1)")
    (add_net "Net-(C5-Pad2)")
    (add_net "Net-(C6-Pad2)")
    (add_net "Net-(C7-Pad1)")
    (add_net "Net-(C9-Pad2)")
    (add_net "Net-(J2-Pad2)")
    (add_net "Net-(LED1-Pad1)")
    (add_net "Net-(Q1-Pad3)")
    (add_net "Net-(R9-Pad2)")
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 152.344 81.4172 270)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C1 (at 0.06096 1.83896) (layer F.SilkS))
    (fp_text value 1.2pF (at 0 1.43 270) (layer F.Fab))
    (fp_text user %R (at 0 0 270) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0 270) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 "Net-(C1-Pad2)"))
    (pad 1 smd roundrect (at -0.875 0 270) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 "Net-(C1-Pad1)"))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 159.512 87.376 180)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C2 (at 0 -1.43 180) (layer F.SilkS))
    (fp_text value .1uF (at 0 1.43 180) (layer F.Fab))
    (fp_text user %R (at 0 0 180) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 4 3.3V))
    (pad 1 smd roundrect (at -0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 31 GND-ISO))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 109.743 105.816 270)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C3 (at 2.47904 0.36576) (layer F.SilkS))
    (fp_text value 10uF (at 0 1.43 270) (layer F.Fab))
    (fp_text user %R (at 0 0 270) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0 270) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 3 GND))
    (pad 2 smd roundrect (at 0.875 0 270) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 5 5V))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 111.587 105.872 270)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C4 (at 2.42316 -0.19304) (layer F.SilkS))
    (fp_text value 1uF (at 0 1.43 270) (layer F.Fab))
    (fp_text user %R (at 0 0 270) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0 270) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 3 GND))
    (pad 2 smd roundrect (at 0.875 0 270) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 5 5V))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 161.493 77.47 270)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C5 (at 2.57556 0.1016) (layer F.SilkS))
    (fp_text value 10pF (at 0 1.43 270) (layer F.Fab))
    (fp_text user %R (at 0 0 270) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0 270) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 18 "Net-(C5-Pad2)"))
    (pad 1 smd roundrect (at -0.875 0 270) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 31 GND-ISO))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 117.719 105.848 270)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C6 (at 2.427 0.11176) (layer F.SilkS))
    (fp_text value .1uF (at 0 1.43 270) (layer F.Fab))
    (fp_text user %R (at 0 0 270) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0 270) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 19 "Net-(C6-Pad2)"))
    (pad 1 smd roundrect (at -0.875 0 270) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 3 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 169.784 77.6326 90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C7 (at -2.47904 0.28448 180) (layer F.SilkS))
    (fp_text value 10pF (at 0 1.43 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0 90) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 20 "Net-(C7-Pad1)"))
    (pad 2 smd roundrect (at 0.875 0 90) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 31 GND-ISO))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 119.39 105.848 270)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C8 (at 2.5286 -0.34036) (layer F.SilkS))
    (fp_text value 1uF (at 0 1.43 270) (layer F.Fab))
    (fp_text user %R (at 0 0 270) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0 270) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 3 GND))
    (pad 2 smd roundrect (at 0.875 0 270) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 4 3.3V))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 165.781 84.8309 180)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C9 (at -2.75844 -0.12192 180) (layer F.SilkS))
    (fp_text value .1uF (at 0 1.43 180) (layer F.Fab))
    (fp_text user %R (at 0 0 180) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 31 GND-ISO))
    (pad 2 smd roundrect (at 0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 21 "Net-(C9-Pad2)"))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 165.74 83.3679 180)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C10 (at -3.28676 0.07112 180) (layer F.SilkS))
    (fp_text value 4.7uf (at 0 1.43 180) (layer F.Fab))
    (fp_text user %R (at 0 0 180) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 31 GND-ISO))
    (pad 2 smd roundrect (at 0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 22 "Net-(C10-Pad2)"))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 128.671 99.8537 90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C11 (at -0.15624 -2.24536 180) (layer F.SilkS))
    (fp_text value 1uF (at 0 1.43 90) (layer F.Fab))
    (fp_text user %R (at -0.130641 0.132399 90) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0 90) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 6 /~MCLR~))
    (pad 1 smd roundrect (at -0.875 0 90) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 3 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 162.607 100.178)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C12 (at -3.09496 0.28448) (layer F.SilkS))
    (fp_text value 10pF (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 3 GND))
    (pad 2 smd roundrect (at 0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 23 "Net-(C12-Pad2)"))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 162.601 105.872 180)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C13 (at 3.048 0.03556 180) (layer F.SilkS))
    (fp_text value 10pF (at 0 1.43 180) (layer F.Fab))
    (fp_text user %R (at 0 0 180) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 3 GND))
    (pad 1 smd roundrect (at -0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 24 "Net-(C13-Pad1)"))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_Molex:Molex_Sabre_43160-2103_1x03_P7.49mm_Vertical_ThermalVias (layer F.Cu) (tedit 5A18AC76)
    (at 112.545 81.854)
    (descr "Molex Sabre Power Connector, 43160-2103, With thermal vias in pads, 3 Pins per row (http://www.molex.com/pdm_docs/sd/431602102_sd.pdf), generated with kicad-footprint-generator")
    (tags "connector Molex Sabre side entry")
    (fp_text reference J2 (at -6.03804 -8.6106) (layer F.SilkS))
    (fp_text value Conn_01x03 (at 7.49 5.08) (layer F.Fab))
    (fp_text user %R (at 7.49 3.18) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0) (size 3.78 3.43) (drill 1.78) (layers *.Cu *.Mask)
      (net 5 5V))
    (pad 2 thru_hole rect (at 7.49 0) (size 3.78 3.43) (drill 1.78) (layers *.Cu *.Mask)
      (net 7 "Net-(J2-Pad2)"))
    (pad 3 thru_hole rect (at 14.98 0) (size 3.78 3.43) (drill 1.78) (layers *.Cu *.Mask)
      (net 3 GND))
    (pad 1 thru_hole rect (at 0 -3.18) (size 3.78 3.43) (drill 1.78) (layers *.Cu *.Mask)
      (net 5 5V))
    (pad 2 thru_hole rect (at 7.49 -3.18) (size 3.78 3.43) (drill 1.78) (layers *.Cu *.Mask)
      (net 7 "Net-(J2-Pad2)"))
    (pad 3 thru_hole rect (at 14.98 -3.18) (size 3.78 3.43) (drill 1.78) (layers *.Cu *.Mask)
      (net 3 GND))
    (pad 1 thru_hole rect (at 0 -4.445) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
      (net 5 5V))
    (pad 1 thru_hole rect (at 0 -1.59) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
      (net 5 5V))
    (pad 1 thru_hole rect (at 0 1.265) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
      (net 5 5V))
    (pad 1 thru_hole rect (at -1.44 -4.445) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
      (net 5 5V))
    (pad 1 thru_hole rect (at -1.44 -3.0175) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
      (net 5 5V))
    (pad 1 thru_hole rect (at -1.44 -1.59) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
      (net 5 5V))
    (pad 1 thru_hole rect (at -1.44 -0.1625) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
      (net 5 5V))
    (pad 1 thru_hole rect (at -1.44 1.265) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
      (net 5 5V))
    (pad 1 thru_hole rect (at 1.44 -4.445) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
      (net 5 5V))
    (pad 1 thru_hole rect (at 1.44 -3.0175) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
      (net 5 5V))
    (pad 1 thru_hole rect (at 1.44 -1.59) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
      (net 5 5V))
    (pad 1 thru_hole rect (at 1.44 -0.1625) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
      (net 5 5V))
    (pad 1 thru_hole rect (at 1.44 1.265) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
      (net 5 5V))
    (pad 2 thru_hole circle (at 7.49 -4.445) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
      (net 7 "Net-(J2-Pad2)"))
    (pad 2 thru_hole circle (at 7.49 -1.59) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
      (net 7 "Net-(J2-Pad2)"))
    (pad 2 thru_hole circle (at 7.49 1.265) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
      (net 7 "Net-(J2-Pad2)"))
    (pad 2 thru_hole circle (at 6.05 -4.445) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
      (net 7 "Net-(J2-Pad2)"))
    (pad 2 thru_hole circle (at 6.05 -3.0175) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
      (net 7 "Net-(J2-Pad2)"))
    (pad 2 thru_hole circle (at 6.05 -1.59) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
      (net 7 "Net-(J2-Pad2)"))
    (pad 2 thru_hole circle (at 6.05 -0.1625) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
      (net 7 "Net-(J2-Pad2)"))
    (pad 2 thru_hole circle (at 6.05 1.265) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
      (net 7 "Net-(J2-Pad2)"))
    (pad 2 thru_hole circle (at 8.93 -4.445) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
      (net 7 "Net-(J2-Pad2)"))
    (pad 2 thru_hole circle (at 8.93 -3.0175) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
      (net 7 "Net-(J2-Pad2)"))
    (pad 2 thru_hole circle (at 8.93 -1.59) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
      (net 7 "Net-(J2-Pad2)"))
    (pad 2 thru_hole circle (at 8.93 -0.1625) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
      (net 7 "Net-(J2-Pad2)"))
    (pad 2 thru_hole circle (at 8.93 1.265) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
      (net 7 "Net-(J2-Pad2)"))
    (pad 3 thru_hole circle (at 14.98 -4.445) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
      (net 3 GND))
    (pad 3 thru_hole circle (at 14.98 -1.59) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
      (net 3 GND))
    (pad 3 thru_hole circle (at 14.98 1.265) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
      (net 3 GND))
    (pad 3 thru_hole circle (at 13.54 -4.445) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
      (net 3 GND))
    (pad 3 thru_hole circle (at 13.54 -3.0175) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
      (net 3 GND))
    (pad 3 thru_hole circle (at 13.54 -1.59) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
      (net 3 GND))
    (pad 3 thru_hole circle (at 13.54 -0.1625) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
      (net 3 GND))
    (pad 3 thru_hole circle (at 13.54 1.265) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
      (net 3 GND))
    (pad 3 thru_hole circle (at 16.42 -4.445) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
      (net 3 GND))
    (pad 3 thru_hole circle (at 16.42 -3.0175) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
      (net 3 GND))
    (pad 3 thru_hole circle (at 16.42 -1.59) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
      (net 3 GND))
    (pad 3 thru_hole circle (at 16.42 -0.1625) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
      (net 3 GND))
    (pad 3 thru_hole circle (at 16.42 1.265) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
      (net 3 GND))
    (pad "" thru_hole circle (at -4.75 -3.43) (size 4 4) (drill 3) (layers *.Cu *.Mask))
    (pad "" thru_hole circle (at 19.73 -3.43) (size 4 4) (drill 3) (layers *.Cu *.Mask))
    (model ${KISYS3DMOD}/Connector_Molex.3dshapes/Molex_Sabre_43160-2103_1x03_P7.49mm_Vertical_ThermalVias.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MJ_Custom:PS2-Contact (layer F.Cu) (tedit 5B159E4E)
    (at 117.196 115.026)
    (fp_text reference PS1 (at -0.06604 -3.82524) (layer F.SilkS))
    (fp_text value Switch_PS2 (at 0.3 6.1) (layer F.Fab))
    (fp_text user SELECT (at 5.4 -4.1) (layer F.SilkS))
    (fp_text user Enter (at -5.9 -4.2) (layer F.SilkS))
    (pad 1 smd oval (at -6.281024 -2.85) (size 1.562049 0.4) (layers F.Cu F.Mask)
      (net 8 /Select))
    (pad 2 smd oval (at -4.905832 -2.05) (size 3.85547 0.4) (layers F.Cu F.Mask)
      (net 3 GND))
    (pad 1 smd oval (at -5.904281 -1.25) (size 5.191437 0.4) (layers F.Cu F.Mask)
      (net 8 /Select))
    (pad 2 smd oval (at -5.169949 -0.45) (size 5.777288 0.4) (layers F.Cu F.Mask)
      (net 3 GND))
    (pad 1 smd oval (at -5.823806 0.35) (size 5.814584 0.4) (layers F.Cu F.Mask)
      (net 8 /Select))
    (pad 2 smd oval (at -5.108228 1.15) (size 5.295928 0.4) (layers F.Cu F.Mask)
      (net 3 GND))
    (pad 1 smd oval (at -6.053943 1.95) (size 4.092112 0.4) (layers F.Cu F.Mask)
      (net 8 /Select))
    (pad 2 smd oval (at -4.633975 2.75) (size 1.73205 0.4) (layers F.Cu F.Mask)
      (net 3 GND))
    (pad 1 smd rect (at -7.23205 2.75 237.7957725) (size 0.4 0.4) (layers F.Cu F.Mask)
      (net 8 /Select))
    (pad 1 smd rect (at -7.538548 2.531169 231.1527836) (size 0.4 0.4) (layers F.Cu F.Mask)
      (net 8 /Select))
    (pad 1 smd rect (at -7.817674 2.278351 224.5097946) (size 0.4 0.4) (layers F.Cu F.Mask)
      (net 8 /Select))
    (pad 1 smd rect (at -8.065679 1.99494 217.8668057) (size 0.4 0.4) (layers F.Cu F.Mask)
      (net 8 /Select))
    (pad 1 smd rect (at -8.279233 1.684743 211.2238168) (size 0.4 0.4) (layers F.Cu F.Mask)
      (net 8 /Select))
    (pad 1 smd rect (at -8.455469 1.351923 204.5808279) (size 0.4 0.4) (layers F.Cu F.Mask)
      (net 8 /Select))
    (pad 1 smd rect (at -8.592021 1.000951 197.9378389) (size 0.4 0.4) (layers F.Cu F.Mask)
      (net 8 /Select))
    (pad 1 smd rect (at -8.687054 0.636538 191.29485) (size 0.4 0.4) (layers F.Cu F.Mask)
      (net 8 /Select))
    (pad 1 smd rect (at -8.739294 0.263578 184.6518611) (size 0.4 0.4) (layers F.Cu F.Mask)
      (net 8 /Select))
    (pad 1 smd rect (at -8.748037 -0.11292 178.0088721) (size 0.4 0.4) (layers F.Cu F.Mask)
      (net 8 /Select))
    (pad 1 smd rect (at -8.713168 -0.487903 171.3658832) (size 0.4 0.4) (layers F.Cu F.Mask)
      (net 8 /Select))
    (pad 1 smd rect (at -8.635154 -0.856334 164.7228943) (size 0.4 0.4) (layers F.Cu F.Mask)
      (net 8 /Select))
    (pad 1 smd rect (at -8.515042 -1.213267 158.0799053) (size 0.4 0.4) (layers F.Cu F.Mask)
      (net 8 /Select))
    (pad 1 smd rect (at -8.354446 -1.553909 151.4369164) (size 0.4 0.4) (layers F.Cu F.Mask)
      (net 8 /Select))
    (pad 1 smd rect (at -8.155522 -1.873686 144.7939275) (size 0.4 0.4) (layers F.Cu F.Mask)
      (net 8 /Select))
    (pad 1 smd rect (at -7.920941 -2.168304 138.1509386) (size 0.4 0.4) (layers F.Cu F.Mask)
      (net 8 /Select))
    (pad 1 smd rect (at -7.653852 -2.433807 131.5079496) (size 0.4 0.4) (layers F.Cu F.Mask)
      (net 8 /Select))
    (pad 1 smd rect (at -7.357843 -2.66663 124.8649607) (size 0.4 0.4) (layers F.Cu F.Mask)
      (net 8 /Select))
    (pad 1 smd rect (at -7.062049 -2.85 118.7266053) (size 0.4 0.4) (layers F.Cu F.Mask)
      (net 8 /Select))
    (pad 2 smd rect (at -3.937951 -2.85 61.27339465) (size 0.4 0.4) (layers F.Cu F.Mask)
      (net 3 GND))
    (pad 2 smd rect (at -3.618743 -2.650164 54.63040572) (size 0.4 0.4) (layers F.Cu F.Mask)
      (net 3 GND))
    (pad 2 smd rect (at -3.324796 -2.414743 47.98741679) (size 0.4 0.4) (layers F.Cu F.Mask)
      (net 3 GND))
    (pad 2 smd rect (at -3.060056 -2.146898 41.34442786) (size 0.4 0.4) (layers F.Cu F.Mask)
      (net 3 GND))
    (pad 2 smd rect (at -2.828079 -1.850225 34.70143894) (size 0.4 0.4) (layers F.Cu F.Mask)
      (net 3 GND))
    (pad 2 smd rect (at -2.631979 -1.528709 28.05845001) (size 0.4 0.4) (layers F.Cu F.Mask)
      (net 3 GND))
    (pad 2 smd rect (at -2.474389 -1.186666 21.41546108) (size 0.4 0.4) (layers F.Cu F.Mask)
      (net 3 GND))
    (pad 2 smd rect (at -2.357426 -0.828688 14.77247215) (size 0.4 0.4) (layers F.Cu F.Mask)
      (net 3 GND))
    (pad 2 smd rect (at -2.28266 -0.459584 8.129483219) (size 0.4 0.4) (layers F.Cu F.Mask)
      (net 3 GND))
    (pad 2 smd rect (at -2.251094 -0.084309 1.48649429) (size 0.4 0.4) (layers F.Cu F.Mask)
      (net 3 GND))
    (pad 2 smd rect (at -2.263153 0.292098 354.8435054) (size 0.4 0.4) (layers F.Cu F.Mask)
      (net 3 GND))
    (pad 2 smd rect (at -2.318675 0.664583 348.2005164) (size 0.4 0.4) (layers F.Cu F.Mask)
      (net 3 GND))
    (pad 2 smd rect (at -2.416915 1.028145 341.5575275) (size 0.4 0.4) (layers F.Cu F.Mask)
      (net 3 GND))
    (pad 2 smd rect (at -2.556552 1.377901 334.9145386) (size 0.4 0.4) (layers F.Cu F.Mask)
      (net 3 GND))
    (pad 2 smd rect (at -2.735713 1.709155 328.2715496) (size 0.4 0.4) (layers F.Cu F.Mask)
      (net 3 GND))
    (pad 2 smd rect (at -2.951991 2.01746 321.6285607) (size 0.4 0.4) (layers F.Cu F.Mask)
      (net 3 GND))
    (pad 2 smd rect (at -3.202482 2.298675 314.9855718) (size 0.4 0.4) (layers F.Cu F.Mask)
      (net 3 GND))
    (pad 2 smd rect (at -3.483824 2.549025 308.3425829) (size 0.4 0.4) (layers F.Cu F.Mask)
      (net 3 GND))
    (pad 2 smd rect (at -3.76795 2.75 302.2042275) (size 0.4 0.4) (layers F.Cu F.Mask)
      (net 3 GND))
    (pad 4 smd rect (at 7.516176 2.549025 308.3426) (size 0.4 0.4) (layers F.Cu F.Mask)
      (net 3 GND))
    (pad 4 smd rect (at 8.264287 1.709155 328.2715) (size 0.4 0.4) (layers F.Cu F.Mask)
      (net 3 GND))
    (pad 4 smd rect (at 8.048009 2.01746 321.6286) (size 0.4 0.4) (layers F.Cu F.Mask)
      (net 3 GND))
    (pad 4 smd rect (at 7.797518 2.298675 314.9856) (size 0.4 0.4) (layers F.Cu F.Mask)
      (net 3 GND))
    (pad 4 smd rect (at 8.443448 1.377901 334.9145) (size 0.4 0.4) (layers F.Cu F.Mask)
      (net 3 GND))
    (pad 4 smd rect (at 8.583085 1.028145 341.5575) (size 0.4 0.4) (layers F.Cu F.Mask)
      (net 3 GND))
    (pad 4 smd rect (at 8.368021 -1.528709 28.0585) (size 0.4 0.4) (layers F.Cu F.Mask)
      (net 3 GND))
    (pad 3 smd rect (at 3.937951 -2.85 118.727) (size 0.4 0.4) (layers F.Cu F.Mask)
      (net 9 /Enter))
    (pad 4 smd rect (at 7.675204 -2.414743 47.9874) (size 0.4 0.4) (layers F.Cu F.Mask)
      (net 3 GND))
    (pad 4 smd rect (at 7.062049 -2.85 61.2734) (size 0.4 0.4) (layers F.Cu F.Mask)
      (net 3 GND))
    (pad 4 smd rect (at 8.525611 -1.186666 21.4155) (size 0.4 0.4) (layers F.Cu F.Mask)
      (net 3 GND))
    (pad 4 smd oval (at 6.094168 -2.05) (size 3.85547 0.4) (layers F.Cu F.Mask)
      (net 3 GND))
    (pad 3 smd oval (at 4.718976 -2.85) (size 1.562049 0.4) (layers F.Cu F.Mask)
      (net 9 /Enter))
    (pad 4 smd rect (at 8.642574 -0.828688 14.7725) (size 0.4 0.4) (layers F.Cu F.Mask)
      (net 3 GND))
    (pad 4 smd rect (at 8.71734 -0.459584 8.12948) (size 0.4 0.4) (layers F.Cu F.Mask)
      (net 3 GND))
    (pad 4 smd rect (at 8.748906 -0.084309 1.48649) (size 0.4 0.4) (layers F.Cu F.Mask)
      (net 3 GND))
    (pad 4 smd rect (at 8.681325 0.664583 348.2005) (size 0.4 0.4) (layers F.Cu F.Mask)
      (net 3 GND))
    (pad 4 smd rect (at 8.736847 0.292098 354.84351) (size 0.4 0.4) (layers F.Cu F.Mask)
      (net 3 GND))
    (pad 4 smd oval (at 5.891772 1.15) (size 5.295928 0.4) (layers F.Cu F.Mask)
      (net 3 GND))
    (pad 4 smd rect (at 7.23205 2.75 302.2042) (size 0.4 0.4) (layers F.Cu F.Mask)
      (net 3 GND))
    (pad 4 smd oval (at 6.366025 2.75) (size 1.73205 0.4) (layers F.Cu F.Mask)
      (net 3 GND))
    (pad 3 smd rect (at 3.76795 2.75 237.796) (size 0.4 0.4) (layers F.Cu F.Mask)
      (net 9 /Enter))
    (pad 3 smd rect (at 3.079059 -2.168304 138.151) (size 0.4 0.4) (layers F.Cu F.Mask)
      (net 9 /Enter))
    (pad 3 smd rect (at 3.642157 -2.66663 124.865) (size 0.4 0.4) (layers F.Cu F.Mask)
      (net 9 /Enter))
    (pad 4 smd rect (at 7.381257 -2.650164 54.6304) (size 0.4 0.4) (layers F.Cu F.Mask)
      (net 3 GND))
    (pad 3 smd rect (at 3.346148 -2.433807 131.508) (size 0.4 0.4) (layers F.Cu F.Mask)
      (net 9 /Enter))
    (pad 3 smd rect (at 2.544531 1.351923 204.581) (size 0.4 0.4) (layers F.Cu F.Mask)
      (net 9 /Enter))
    (pad 3 smd rect (at 2.407979 1.000951 197.938) (size 0.4 0.4) (layers F.Cu F.Mask)
      (net 9 /Enter))
    (pad 3 smd rect (at 2.312946 0.636538 191.295) (size 0.4 0.4) (layers F.Cu F.Mask)
      (net 9 /Enter))
    (pad 3 smd rect (at 2.260706 0.263578 184.652) (size 0.4 0.4) (layers F.Cu F.Mask)
      (net 9 /Enter))
    (pad 3 smd rect (at 2.251963 -0.11292 178.009) (size 0.4 0.4) (layers F.Cu F.Mask)
      (net 9 /Enter))
    (pad 3 smd rect (at 2.286832 -0.487903 171.366) (size 0.4 0.4) (layers F.Cu F.Mask)
      (net 9 /Enter))
    (pad 3 smd rect (at 2.364846 -0.856334 164.723) (size 0.4 0.4) (layers F.Cu F.Mask)
      (net 9 /Enter))
    (pad 3 smd rect (at 3.461452 2.531169 231.153) (size 0.4 0.4) (layers F.Cu F.Mask)
      (net 9 /Enter))
    (pad 3 smd rect (at 2.720767 1.684743 211.224) (size 0.4 0.4) (layers F.Cu F.Mask)
      (net 9 /Enter))
    (pad 3 smd rect (at 2.934321 1.99494 217.867) (size 0.4 0.4) (layers F.Cu F.Mask)
      (net 9 /Enter))
    (pad 3 smd rect (at 3.182326 2.278351 224.51) (size 0.4 0.4) (layers F.Cu F.Mask)
      (net 9 /Enter))
    (pad 4 smd rect (at 8.171921 -1.850225 34.7014) (size 0.4 0.4) (layers F.Cu F.Mask)
      (net 3 GND))
    (pad 4 smd rect (at 7.939944 -2.146898 41.3444) (size 0.4 0.4) (layers F.Cu F.Mask)
      (net 3 GND))
    (pad 4 smd oval (at 5.830051 -0.45) (size 5.777288 0.4) (layers F.Cu F.Mask)
      (net 3 GND))
    (pad 3 smd oval (at 5.095719 -1.25) (size 5.191437 0.4) (layers F.Cu F.Mask)
      (net 9 /Enter))
    (pad 3 smd rect (at 2.844478 -1.873686 144.794) (size 0.4 0.4) (layers F.Cu F.Mask)
      (net 9 /Enter))
    (pad 3 smd rect (at 2.645554 -1.553909 151.437) (size 0.4 0.4) (layers F.Cu F.Mask)
      (net 9 /Enter))
    (pad 3 smd rect (at 2.484958 -1.213267 158.08) (size 0.4 0.4) (layers F.Cu F.Mask)
      (net 9 /Enter))
    (pad 3 smd oval (at 4.946057 1.95) (size 4.092112 0.4) (layers F.Cu F.Mask)
      (net 9 /Enter))
    (pad 3 smd oval (at 5.176194 0.35) (size 5.814584 0.4) (layers F.Cu F.Mask)
      (net 9 /Enter))
    (pad "" np_thru_hole circle (at 0 0) (size 2 2) (drill 2) (layers *.Cu *.Mask))
  )
  (module digikey-footprints:SOT-23-3 (layer F.Cu) (tedit 59D275F3)
    (at 114.828 88.7324)
    (fp_text reference Q1 (at 0.99568 -1.93548) (layer F.SilkS))
    (fp_text value BSS138 (at 0.025 3.25) (layer F.Fab))
    (fp_text user %R (at -0.125 0.15) (layer F.Fab))
    (pad 3 smd rect (at 1.05 0) (size 1.3 0.6) (layers F.Cu F.Paste F.Mask)
      (net 10 "Net-(Q1-Pad3)") (solder_mask_margin 0.07))
    (pad 2 smd rect (at -1.05 0.95) (size 1.3 0.6) (layers F.Cu F.Paste F.Mask)
      (net 11 /LED_CNTL) (solder_mask_margin 0.07))
    (pad 1 smd rect (at -1.05 -0.95) (size 1.3 0.6) (layers F.Cu F.Paste F.Mask)
      (net 4 3.3V) (solder_mask_margin 0.07))
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 153.345 85.913 180)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R1 (at 2.83972 -0.14732 180) (layer F.SilkS))
    (fp_text value 100K (at 0 1.43 180) (layer F.Fab))
    (fp_text user %R (at 0 0 180) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 12 /SHDN))
    (pad 2 smd roundrect (at 0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 31 GND-ISO))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 150.626 106.863)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R2 (at -3.04676 0.0762) (layer F.SilkS))
    (fp_text value 100K (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 3 GND))
    (pad 1 smd roundrect (at -0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 13 /EE_WP))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 156.129 101.845 270)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R3 (at 2.5032 -0.5588) (layer F.SilkS))
    (fp_text value 4.7K (at 0 1.43 270) (layer F.Fab))
    (fp_text user %R (at 0 0 270) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0 270) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 14 /SCL))
    (pad 1 smd roundrect (at -0.875 0 270) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 4 3.3V))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 154.259 101.849 270)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R4 (at 2.57556 -0.07112) (layer F.SilkS))
    (fp_text value 4.7K (at 0 1.43 270) (layer F.Fab))
    (fp_text user %R (at 0 0 270) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0 270) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 4 3.3V))
    (pad 2 smd roundrect (at 0.875 0 270) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 15 /SDA))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 128.671 95.8139 270)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R5 (at 0.34036 2.03708) (layer F.SilkS))
    (fp_text value 4.7K (at 0 1.43 270) (layer F.Fab))
    (fp_text user %R (at 0 0 270) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0 270) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 4 3.3V))
    (pad 2 smd roundrect (at 0.875 0 270) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 6 /~MCLR~))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 111.76 88.773 90)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R6 (at 0.9398 -1.95072 180) (layer F.SilkS))
    (fp_text value 1k (at 0 1.43 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0 90) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 11 /LED_CNTL))
    (pad 2 smd roundrect (at 0.875 0 90) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 4 3.3V))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 117.81 87.9539 90)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R7 (at -2.54632 0.04572 180) (layer F.SilkS))
    (fp_text value 1k (at 0 1.43 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0 90) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 5 5V))
    (pad 1 smd roundrect (at -0.875 0 90) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 10 "Net-(Q1-Pad3)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 119.395 87.9399 270)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R8 (at 2.51968 -0.61468) (layer F.SilkS))
    (fp_text value 470 (at 0 1.43 270) (layer F.Fab))
    (fp_text user %R (at 0 0 270) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0 270) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 10 "Net-(Q1-Pad3)"))
    (pad 1 smd roundrect (at -0.875 0 270) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 7 "Net-(J2-Pad2)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 128.732 103.759 90)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R9 (at -2.57048 -0.02032 180) (layer F.SilkS))
    (fp_text value 1K (at 0 1.43 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0 90) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 16 "Net-(R9-Pad2)"))
    (pad 1 smd roundrect (at -0.875 0 90) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 27 "Net-(LED1-Pad1)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 154.178 97.87 90)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R10 (at -0.31112 -2.39776 180) (layer F.SilkS))
    (fp_text value 4.7K (at 0 1.43 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0 90) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 4 3.3V))
    (pad 2 smd roundrect (at 0.875 0 90) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 17 /RTC_MFP))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_DFN_QFN:MLF-6-1EP_1.6x1.6mm_P0.5mm_EP0.5x1.26mm (layer F.Cu) (tedit 5B582EB0)
    (at 114.838 105.827)
    (descr "MLF, 6 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/mic5353.pdf), generated with kicad-footprint-generator ipc_dfn_qfn_generator.py")
    (tags "MLF DFN_QFN")
    (attr smd)
    (fp_text reference U2 (at 0 -1.75) (layer F.SilkS))
    (fp_text value MIC5353-3.3YMT (at 0 1.75) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 7 smd roundrect (at 0 0) (size 0.5 1.26) (layers F.Cu F.Mask) (roundrect_rratio 0.25)
      (net 3 GND))
    (pad "" smd roundrect (at 0 -0.315) (size 0.4 0.51) (layers F.Paste) (roundrect_rratio 0.25))
    (pad "" smd roundrect (at 0 0.315) (size 0.4 0.51) (layers F.Paste) (roundrect_rratio 0.25))
    (pad 1 smd roundrect (at -0.8 -0.5) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 5 5V))
    (pad 2 smd roundrect (at -0.8 0) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 3 GND))
    (pad 3 smd roundrect (at -0.8 0.5) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 5 5V))
    (pad 4 smd roundrect (at 0.8 0.5) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 4 3.3V))
    (pad 5 smd roundrect (at 0.8 0) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
    (pad 6 smd roundrect (at 0.8 -0.5) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 19 "Net-(C6-Pad2)"))
    (model ${KISYS3DMOD}/Package_DFN_QFN.3dshapes/MLF-6-1EP_1.6x1.6mm_P0.5mm_EP0.5x1.26mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Clocks:CRYSTAL-SMD-3.2X1.5MM (layer F.Cu) (tedit 5BB658BA)
    (at 163.561 102.967 270)
    (descr "3.2 X 1.5MM SMD CRYSTAL PACKAGE")
    (tags "3.2 X 1.5MM SMD CRYSTAL PACKAGE")
    (attr smd)
    (fp_text reference Y2 (at 0.04572 1.88976) (layer F.SilkS))
    (fp_text value CRYSTAL-32.768KHZSMD-3.2X1.5 (at -2.93624 -8.55472) (layer F.SilkS) hide)
    (pad P$1 smd rect (at -1.24968 0 270) (size 0.99822 1.79832) (layers F.Cu F.Paste F.Mask)
      (net 23 "Net-(C12-Pad2)") (solder_mask_margin 0.1016))
    (pad P$2 smd rect (at 1.24968 0 270) (size 0.99822 1.79832) (layers F.Cu F.Paste F.Mask)
      (net 24 "Net-(C13-Pad1)") (solder_mask_margin 0.1016))
  )
  (module MountingHole:MountingHole_3.2mm_M3_ISO7380 (layer F.Cu) (tedit 5BB65866)
    (at 178.074 104.186)
    (descr "Mounting Hole 3.2mm, no annular, M3, ISO7380")
    (tags "mounting hole 3.2mm no annular m3 iso7380")
    (attr virtual)
    (fp_text reference MK1 (at 0 -3.85) (layer F.SilkS) hide)
    (fp_text value Mounting_Hole (at 0 3.85) (layer F.Fab))
    (fp_text user %R (at 0.3 0) (layer F.Fab))
    (pad 1 np_thru_hole circle (at 0 0) (size 3.2 3.2) (drill 3.2) (layers *.Cu *.Mask))
  )
  (module MountingHole:MountingHole_3.2mm_M3_ISO7380 (layer F.Cu) (tedit 5BB6586B)
    (at 177.622 75.5091)
    (descr "Mounting Hole 3.2mm, no annular, M3, ISO7380")
    (tags "mounting hole 3.2mm no annular m3 iso7380")
    (attr virtual)
    (fp_text reference MK2 (at 0 -3.85) (layer F.SilkS) hide)
    (fp_text value Mounting_Hole (at 0 3.85) (layer F.Fab))
    (fp_text user %R (at 0.3 0) (layer F.Fab))
    (pad 1 np_thru_hole circle (at 0 0) (size 3.2 3.2) (drill 3.2) (layers *.Cu *.Mask))
  )
  (module MountingHole:MountingHole_3.2mm_M3_ISO7380 (layer F.Cu) (tedit 5BB65858)
    (at 132.771 118.72)
    (descr "Mounting Hole 3.2mm, no annular, M3, ISO7380")
    (tags "mounting hole 3.2mm no annular m3 iso7380")
    (attr virtual)
    (fp_text reference MK3 (at 0 -3.85) (layer F.SilkS) hide)
    (fp_text value Mounting_Hole (at 0 3.85) (layer F.Fab))
    (fp_text user %R (at 0.3 0) (layer F.Fab))
    (pad 1 np_thru_hole circle (at 0 0) (size 3.2 3.2) (drill 3.2) (layers *.Cu *.Mask))
  )
  (module MountingHole:MountingHole_3.2mm_M3_ISO7380 (layer F.Cu) (tedit 5BB65814)
    (at 124.541 91.5822)
    (descr "Mounting Hole 3.2mm, no annular, M3, ISO7380")
    (tags "mounting hole 3.2mm no annular m3 iso7380")
    (attr virtual)
    (fp_text reference MK4 (at 0 -3.85) (layer F.SilkS) hide)
    (fp_text value Mounting_Hole (at 0 3.85) (layer F.Fab))
    (fp_text user %R (at 0.3 0) (layer F.Fab))
    (pad 1 np_thru_hole circle (at 0 0) (size 3.2 3.2) (drill 3.2) (layers *.Cu *.Mask))
  )
  (module Silicon-Standard:SOT23-5 (layer F.Cu) (tedit 5BB65870)
    (at 150.663 103.957 90)
    (descr "SMALL OUTLINE TRANSISTOR")
    (tags "SMALL OUTLINE TRANSISTOR")
    (attr smd)
    (fp_text reference U1 (at 2.47396 -1.67132 180) (layer F.SilkS))
    (fp_text value 24AA01T-I/OT (at 2.159 0 180) (layer F.SilkS) hide)
    (pad 1 smd rect (at -0.94996 1.29794 90) (size 0.54864 1.19888) (layers F.Cu F.Paste F.Mask)
      (net 14 /SCL) (solder_mask_margin 0.1016))
    (pad 2 smd rect (at 0 1.29794 90) (size 0.54864 1.19888) (layers F.Cu F.Paste F.Mask)
      (net 3 GND) (solder_mask_margin 0.1016))
    (pad 3 smd rect (at 0.94996 1.29794 90) (size 0.54864 1.19888) (layers F.Cu F.Paste F.Mask)
      (net 15 /SDA) (solder_mask_margin 0.1016))
    (pad 4 smd rect (at 0.94996 -1.29794 90) (size 0.54864 1.19888) (layers F.Cu F.Paste F.Mask)
      (net 4 3.3V) (solder_mask_margin 0.1016))
    (pad 5 smd rect (at -0.94996 -1.29794 90) (size 0.54864 1.19888) (layers F.Cu F.Paste F.Mask)
      (net 13 /EE_WP) (solder_mask_margin 0.1016))
  )
  (module Package_SO:QSOP-16_3.9x4.9mm_P0.635mm (layer F.Cu) (tedit 5A02F25C)
    (at 159.583 83.6676)
    (descr "16-Lead Plastic Shrink Small Outline Narrow Body (QR)-.150\" Body [QSOP] (see Microchip Packaging Specification 00000049BS.pdf)")
    (tags "SSOP 0.635")
    (attr smd)
    (fp_text reference U3 (at -1.60528 -3.52044) (layer F.SilkS))
    (fp_text value MICRF220 (at 0 3.5) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd rect (at -2.6543 -2.2225) (size 1.6 0.41) (layers F.Cu F.Paste F.Mask)
      (net 18 "Net-(C5-Pad2)"))
    (pad 2 smd rect (at -2.6543 -1.5875) (size 1.6 0.41) (layers F.Cu F.Paste F.Mask)
      (net 31 GND-ISO))
    (pad 3 smd rect (at -2.6543 -0.9525) (size 1.6 0.41) (layers F.Cu F.Paste F.Mask)
      (net 1 "Net-(C1-Pad2)"))
    (pad 4 smd rect (at -2.6543 -0.3175) (size 1.6 0.41) (layers F.Cu F.Paste F.Mask)
      (net 31 GND-ISO))
    (pad 5 smd rect (at -2.6543 0.3175) (size 1.6 0.41) (layers F.Cu F.Paste F.Mask)
      (net 4 3.3V))
    (pad 6 smd rect (at -2.6543 0.9525) (size 1.6 0.41) (layers F.Cu F.Paste F.Mask))
    (pad 7 smd rect (at -2.6543 1.5875) (size 1.6 0.41) (layers F.Cu F.Paste F.Mask)
      (net 31 GND-ISO))
    (pad 8 smd rect (at -2.6543 2.2225) (size 1.6 0.41) (layers F.Cu F.Paste F.Mask)
      (net 12 /SHDN))
    (pad 9 smd rect (at 2.6543 2.2225) (size 1.6 0.41) (layers F.Cu F.Paste F.Mask)
      (net 31 GND-ISO))
    (pad 10 smd rect (at 2.6543 1.5875) (size 1.6 0.41) (layers F.Cu F.Paste F.Mask)
      (net 25 /DO))
    (pad 11 smd rect (at 2.6543 0.9525) (size 1.6 0.41) (layers F.Cu F.Paste F.Mask)
      (net 31 GND-ISO))
    (pad 12 smd rect (at 2.6543 0.3175) (size 1.6 0.41) (layers F.Cu F.Paste F.Mask)
      (net 21 "Net-(C9-Pad2)"))
    (pad 13 smd rect (at 2.6543 -0.3175) (size 1.6 0.41) (layers F.Cu F.Paste F.Mask)
      (net 22 "Net-(C10-Pad2)"))
    (pad 14 smd rect (at 2.6543 -0.9525) (size 1.6 0.41) (layers F.Cu F.Paste F.Mask)
      (net 26 /RSSI))
    (pad 15 smd rect (at 2.6543 -1.5875) (size 1.6 0.41) (layers F.Cu F.Paste F.Mask))
    (pad 16 smd rect (at 2.6543 -2.2225) (size 1.6 0.41) (layers F.Cu F.Paste F.Mask)
      (net 20 "Net-(C7-Pad1)"))
    (model ${KISYS3DMOD}/Package_SO.3dshapes/QSOP-16_3.9x4.9mm_P0.635mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_SO:SOIC-20W_7.5x12.8mm_P1.27mm (layer F.Cu) (tedit 5A02F2D3)
    (at 138.364 99.3597)
    (descr "20-Lead Plastic Small Outline (SO) - Wide, 7.50 mm Body [SOIC] (see Microchip Packaging Specification 00000049BS.pdf)")
    (tags "SOIC 1.27")
    (attr smd)
    (fp_text reference U5 (at 0 -7.5) (layer F.SilkS))
    (fp_text value PIC16F1619-I/SO (at 0 7.5) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd rect (at -4.7 -5.715) (size 1.95 0.6) (layers F.Cu F.Paste F.Mask)
      (net 4 3.3V))
    (pad 2 smd rect (at -4.7 -4.445) (size 1.95 0.6) (layers F.Cu F.Paste F.Mask))
    (pad 3 smd rect (at -4.7 -3.175) (size 1.95 0.6) (layers F.Cu F.Paste F.Mask))
    (pad 4 smd rect (at -4.7 -1.905) (size 1.95 0.6) (layers F.Cu F.Paste F.Mask)
      (net 6 /~MCLR~))
    (pad 5 smd rect (at -4.7 -0.635) (size 1.95 0.6) (layers F.Cu F.Paste F.Mask)
      (net 16 "Net-(R9-Pad2)"))
    (pad 6 smd rect (at -4.7 0.635) (size 1.95 0.6) (layers F.Cu F.Paste F.Mask))
    (pad 7 smd rect (at -4.7 1.905) (size 1.95 0.6) (layers F.Cu F.Paste F.Mask))
    (pad 8 smd rect (at -4.7 3.175) (size 1.95 0.6) (layers F.Cu F.Paste F.Mask)
      (net 25 /DO))
    (pad 9 smd rect (at -4.7 4.445) (size 1.95 0.6) (layers F.Cu F.Paste F.Mask))
    (pad 10 smd rect (at -4.7 5.715) (size 1.95 0.6) (layers F.Cu F.Paste F.Mask)
      (net 28 /TX))
    (pad 11 smd rect (at 4.7 5.715) (size 1.95 0.6) (layers F.Cu F.Paste F.Mask)
      (net 14 /SCL))
    (pad 12 smd rect (at 4.7 4.445) (size 1.95 0.6) (layers F.Cu F.Paste F.Mask)
      (net 29 /RX))
    (pad 13 smd rect (at 4.7 3.175) (size 1.95 0.6) (layers F.Cu F.Paste F.Mask)
      (net 15 /SDA))
    (pad 14 smd rect (at 4.7 1.905) (size 1.95 0.6) (layers F.Cu F.Paste F.Mask)
      (net 11 /LED_CNTL))
    (pad 15 smd rect (at 4.7 0.635) (size 1.95 0.6) (layers F.Cu F.Paste F.Mask)
      (net 12 /SHDN))
    (pad 16 smd rect (at 4.7 -0.635) (size 1.95 0.6) (layers F.Cu F.Paste F.Mask)
      (net 26 /RSSI))
    (pad 17 smd rect (at 4.7 -1.905) (size 1.95 0.6) (layers F.Cu F.Paste F.Mask)
      (net 17 /RTC_MFP))
    (pad 18 smd rect (at 4.7 -3.175) (size 1.95 0.6) (layers F.Cu F.Paste F.Mask)
      (net 9 /Enter))
    (pad 19 smd rect (at 4.7 -4.445) (size 1.95 0.6) (layers F.Cu F.Paste F.Mask)
      (net 8 /Select))
    (pad 20 smd rect (at 4.7 -5.715) (size 1.95 0.6) (layers F.Cu F.Paste F.Mask)
      (net 3 GND))
    (model ${KISYS3DMOD}/Package_SO.3dshapes/SOIC-20W_7.5x12.8mm_P1.27mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_SO:MSOP-8_3x3mm_P0.65mm (layer F.Cu) (tedit 5A02F25C)
    (at 169.57 103.8)
    (descr "8-Lead Plastic Micro Small Outline Package (MS) [MSOP] (see Microchip Packaging Specification 00000049BS.pdf)")
    (tags "SSOP 0.65")
    (attr smd)
    (fp_text reference U4 (at 0 -2.6) (layer F.SilkS))
    (fp_text value MCP7940N-xMS (at 0 2.6) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd rect (at -2.2 -0.975) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 23 "Net-(C12-Pad2)"))
    (pad 2 smd rect (at -2.2 -0.325) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 24 "Net-(C13-Pad1)"))
    (pad 3 smd rect (at -2.2 0.325) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 30 "Net-(BT1-Pad1)"))
    (pad 4 smd rect (at -2.2 0.975) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 3 GND))
    (pad 5 smd rect (at 2.2 0.975) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 15 /SDA))
    (pad 6 smd rect (at 2.2 0.325) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 14 /SCL))
    (pad 7 smd rect (at 2.2 -0.325) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 17 /RTC_MFP))
    (pad 8 smd rect (at 2.2 -0.975) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 4 3.3V))
    (model ${KISYS3DMOD}/Package_SO.3dshapes/MSOP-8_3x3mm_P0.65mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Inductor_SMD:L_0603_1608Metric (layer F.Cu) (tedit 5B301BBE)
    (at 153.203 84.1096 180)
    (descr "Inductor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags inductor)
    (attr smd)
    (fp_text reference L1 (at 2.53492 -0.16256 180) (layer F.SilkS))
    (fp_text value 39nH (at 0 1.43 180) (layer F.Fab))
    (fp_text user %R (at 0 0 180) (layer F.Fab))
    (pad 1 smd roundrect (at -0.7875 0 180) (size 0.875 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 "Net-(C1-Pad2)"))
    (pad 2 smd roundrect (at 0.7875 0 180) (size 0.875 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 31 GND-ISO))
    (model ${KISYS3DMOD}/Inductor_SMD.3dshapes/L_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module LED_SMD:LED_0805_2012Metric (layer F.Cu) (tedit 5B36C52C)
    (at 126.456 103.741 90)
    (descr "LED SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags diode)
    (attr smd)
    (fp_text reference LED1 (at -2.62866 -1.016 180) (layer F.SilkS))
    (fp_text value LEDCHIPLED_0805 (at 0 1.65 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd roundrect (at -0.9375 0 90) (size 0.975 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 27 "Net-(LED1-Pad1)"))
    (pad 2 smd roundrect (at 0.9375 0 90) (size 0.975 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 3 GND))
    (model ${KISYS3DMOD}/LED_SMD.3dshapes/LED_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Battery:BatteryHolder_Keystone_3000_1x12mm (layer F.Cu) (tedit 58972371)
    (at 170.8 114.259)
    (descr http://www.keyelco.com/product-pdf.cfm?p=777)
    (tags "Keystone type 3000 coin cell retainer")
    (attr smd)
    (fp_text reference BT1 (at 0 -8) (layer F.SilkS))
    (fp_text value BATTERY-12MM_PTH (at 0 7.5) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd rect (at -7.9 0) (size 3.5 3.3) (layers F.Cu F.Paste F.Mask)
      (net 30 "Net-(BT1-Pad1)"))
    (pad 1 smd rect (at 7.9 0) (size 3.5 3.3) (layers F.Cu F.Paste F.Mask)
      (net 30 "Net-(BT1-Pad1)"))
    (pad 2 smd rect (at 0 0) (size 4 4) (layers F.Cu F.Mask)
      (net 3 GND))
    (model ${KISYS3DMOD}/Battery.3dshapes/BatteryHolder_Keystone_3000_1x12mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_Coaxial:SMA_Molex_73251-1153_EdgeMount_Horizontal (layer F.Cu) (tedit 5A1B666F)
    (at 152.288 76.7567 270)
    (descr "Molex SMA RF Connectors, Edge Mount, (http://www.molex.com/pdm_docs/sd/732511150_sd.pdf)")
    (tags "sma edge")
    (attr smd)
    (fp_text reference J4 (at -3.63008 7.27456) (layer F.SilkS))
    (fp_text value SMA_EDGE (at -1.72 -7.11 270) (layer F.Fab))
    (fp_text user %R (at -1.5 7 270) (layer F.Fab))
    (pad 1 smd rect (at -1.72 0 270) (size 5.08 2.29) (layers F.Cu F.Paste F.Mask)
      (net 2 "Net-(C1-Pad1)"))
    (pad 2 smd rect (at -1.72 -4.38 270) (size 5.08 2.42) (layers F.Cu F.Paste F.Mask)
      (net 31 GND-ISO))
    (pad 2 smd rect (at -1.72 4.38 270) (size 5.08 2.42) (layers F.Cu F.Paste F.Mask)
      (net 31 GND-ISO))
    (pad 2 smd rect (at -1.72 -4.38 270) (size 5.08 2.42) (layers B.Cu B.Paste B.Mask)
      (net 31 GND-ISO))
    (pad 2 smd rect (at -1.72 4.38 270) (size 5.08 2.42) (layers B.Cu B.Paste B.Mask)
      (net 31 GND-ISO))
    (pad 2 thru_hole circle (at 1.72 -4.38 270) (size 0.97 0.97) (drill 0.46) (layers *.Cu)
      (net 31 GND-ISO))
    (pad 2 thru_hole circle (at 1.72 4.38 270) (size 0.97 0.97) (drill 0.46) (layers *.Cu)
      (net 31 GND-ISO))
    (pad 2 smd rect (at 1.27 -4.38 270) (size 0.95 0.46) (layers F.Cu)
      (net 31 GND-ISO))
    (pad 2 smd rect (at 1.27 4.38 270) (size 0.95 0.46) (layers F.Cu)
      (net 31 GND-ISO))
    (pad 2 smd rect (at 1.27 -4.38 270) (size 0.95 0.46) (layers B.Cu)
      (net 31 GND-ISO))
    (pad 2 smd rect (at 1.27 4.38 270) (size 0.95 0.46) (layers B.Cu)
      (net 31 GND-ISO))
    (model ${KISYS3DMOD}/Connector_Coaxial.3dshapes/SMA_Molex_73251-1153_EdgeMount_Horizontal.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_PinHeader_2.54mm:PinHeader_1x04_P2.54mm_Vertical (layer F.Cu) (tedit 59FED5CC)
    (at 152.766 120.279 90)
    (descr "Through hole straight pin header, 1x04, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x04 2.54mm single row")
    (fp_text reference J3 (at 2.50444 -1.08712 180) (layer F.SilkS))
    (fp_text value Conn_01x04 (at 0 9.95 90) (layer F.Fab))
    (fp_text user %R (at 0 3.81 180) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 4 3.3V))
    (pad 2 thru_hole oval (at 0 2.54 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 3 GND))
    (pad 3 thru_hole oval (at 0 5.08 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 29 /RX))
    (pad 4 thru_hole oval (at 0 7.62 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 28 /TX))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x04_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MATT_MCHP:DCJACK_2MM_PTH (layer F.Cu) (tedit 5BB65990)
    (at 105.192 96.4844 270)
    (descr "DJ JACK 2.0MM PTH RIGHT-ANGLE")
    (tags "DJ JACK 2.0MM PTH RIGHT-ANGLE")
    (attr virtual)
    (fp_text reference J1 (at -5.68452 -1.3462) (layer F.SilkS))
    (fp_text value Barrel_Jack_MountingPin (at 5.461 -7.74192) (layer F.SilkS) hide)
    (fp_text user "DC 2.0/2.1" (at 0.762 -1.6764 270) (layer Dwgs.User))
    (pad 2 thru_hole circle (at 0 -7.34822 270) (size 3.81508 3.81508) (drill 2.79908) (layers *.Cu *.Mask)
      (net 3 GND))
    (pad 3 thru_hole circle (at 4.79806 -10.74928 270) (size 3.81508 3.81508) (drill 2.79908) (layers *.Cu *.Mask)
      (net 3 GND))
    (pad 1 thru_hole circle (at 0 -13.59916 270) (size 4.21386 4.21386) (drill 3.19786) (layers *.Cu *.Mask)
      (net 5 5V))
  )
  (module MATT_MCHP:CRYSTAL-SMD-5X3.2-2PAD (layer F.Cu) (tedit 5BB65880)
    (at 165.649 78.5063 180)
    (descr "5X3.2MM 2-PAD SMD CRYSTAL")
    (tags "5X3.2MM 2-PAD SMD CRYSTAL")
    (attr smd)
    (fp_text reference Y1 (at 0 -2.286 180) (layer F.SilkS))
    (fp_text value 13.52313MHz (at 0 2.286 180) (layer F.SilkS) hide)
    (pad 1 smd rect (at 1.84912 0 180) (size 1.69926 2.39776) (layers F.Cu F.Paste F.Mask)
      (net 18 "Net-(C5-Pad2)") (solder_mask_margin 0.1016))
    (pad 2 smd rect (at -1.84912 0 180) (size 1.69926 2.39776) (layers F.Cu F.Paste F.Mask)
      (net 20 "Net-(C7-Pad1)") (solder_mask_margin 0.1016))
  )
  (module Tag-Connect:TC2030_BIG (layer F.Cu) (tedit 4FBCB217)
    (at 144.501 117.099)
    (descr "Tag-Connect TC2030 footprint by carloscuev@gmail.com")
    (tags "Tag-Connect TC2030")
    (clearance 0.127)
    (attr virtual)
    (fp_text reference P1 (at 0 -5.20192) (layer F.SilkS))
    (fp_text value TC2030-MCP (at 0 5.334) (layer F.SilkS) hide)
    (pad 1 connect circle (at -1.27 0.635) (size 0.78486 0.78486) (layers F.Cu F.Mask)
      (net 6 /~MCLR~))
    (pad 2 connect circle (at -1.27 -0.635) (size 0.78486 0.78486) (layers F.Cu F.Mask)
      (net 4 3.3V))
    (pad 3 connect circle (at 0 0.635) (size 0.78486 0.78486) (layers F.Cu F.Mask)
      (net 3 GND))
    (pad 4 connect circle (at 0 -0.635) (size 0.78486 0.78486) (layers F.Cu F.Mask)
      (net 8 /Select))
    (pad 5 connect circle (at 1.27 0.635) (size 0.78486 0.78486) (layers F.Cu F.Mask)
      (net 9 /Enter))
    (pad 6 connect circle (at 1.27 -0.635) (size 0.78486 0.78486) (layers F.Cu F.Mask))
    (pad "" np_thru_hole circle (at -2.54 0) (size 0.98806 0.98806) (drill 0.98806) (layers *.Cu *.Mask F.SilkS))
    (pad "" np_thru_hole circle (at 2.54 -1.016) (size 0.98552 0.98552) (drill 0.98552) (layers *.Cu *.Mask F.SilkS))
    (pad "" np_thru_hole circle (at 2.54 1.016) (size 0.98552 0.98552) (drill 0.98552) (layers *.Cu *.Mask F.SilkS))
    (pad "" np_thru_hole circle (at -2.54 -2.54) (size 2.37236 2.37236) (drill 2.37236) (layers *.Cu *.Mask F.SilkS))
    (pad "" np_thru_hole circle (at 0.635 -2.54) (size 2.36982 2.36982) (drill 2.36982) (layers *.Cu *.Mask F.SilkS))
    (pad "" np_thru_hole circle (at -2.413 2.54) (size 2.36982 2.36982) (drill 2.36982) (layers *.Cu *.Mask F.SilkS))
    (pad "" np_thru_hole circle (at 0.635 2.54) (size 2.36982 2.36982) (drill 2.36982) (layers *.Cu *.Mask F.SilkS))
  )
  (module digikey-footprints:0805 (layer F.Cu) (tedit 5995D0E3)
    (at 141.986 83.058)
    (fp_text reference FB1 (at 0 -1.84) (layer F.SilkS))
    (fp_text value Ferrite_Bead_Small (at 0 1.95) (layer F.Fab))
    (pad 2 smd rect (at 1.05 0) (size 1.2 1.2) (layers F.Cu F.Paste F.Mask)
      (net 31 GND-ISO))
    (pad 1 smd rect (at -1.05 0) (size 1.2 1.2) (layers F.Cu F.Paste F.Mask)
      (net 3 GND))
  )
  (gr_line (start 105.19664 122.6312) (end 105.19664 71.8312) (layer Edge.Cuts) (width 0.2))
  (gr_line (start 181.39664 122.6312) (end 105.19664 122.6312) (layer Edge.Cuts) (width 0.2))
  (gr_line (start 181.39664 71.8312) (end 181.39664 122.6312) (layer Edge.Cuts) (width 0.2))
  (gr_line (start 105.19664 71.8312) (end 181.39664 71.8312) (layer Edge.Cuts) (width 0.2))
  (zone (net 3) (net_name GND) (layer F.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 105.664 72.39) (xy 139.7 72.39) (xy 140.208 72.39) (xy 140.208 84.074) (xy 140.208 89.662)
        (xy 180.848 89.662) (xy 180.848 122.174) (xy 105.664 122.174)
      )
    )
  )
  (zone (net 31) (net_name GND-ISO) (layer F.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 143.256 72.39) (xy 143.256 88.392) (xy 180.848 88.392) (xy 180.848 72.39)
      )
    )
  )
  (zone (net 3) (net_name GND) (layer B.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 1))
    (polygon
      (pts
        (xy 105.664 72.39) (xy 139.7 72.39) (xy 140.208 72.39) (xy 140.208 84.074) (xy 140.208 89.662)
        (xy 180.848 89.662) (xy 180.848 122.174) (xy 105.664 122.174)
      )
    )
  )
  (zone (net 31) (net_name GND-ISO) (layer B.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 143.256 72.39) (xy 143.256 88.392) (xy 180.848 88.392) (xy 180.848 72.39)
      )
    )
  )
  (zone (net 0) (net_name "") (layers F&B.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.508))
    (min_thickness 0.254)
    (keepout (tracks allowed) (vias allowed) (copperpour not_allowed))
    (fill (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 151.1269 77.547851) (xy 154.2765 77.535151) (xy 154.2796 82.6135) (xy 150.3934 82.6262) (xy 150.403 77.547851)
        (xy 151.1396 77.547851) (xy 150.784 77.547851)
      )
    )
  )
)
