(kicad_pcb (version 4) (host pcbnew 4.0.6-e0-6349~53~ubuntu16.04.1)
  (general
    (links 150)
    (no_connects 0)
    (area 56.424999 116.424999 121.575001 151.875001)
    (thickness 1.6)
    (drawings 36)
    (tracks 952)
    (zones 0)
    (modules 54)
    (nets 47)
  )
  (page A4)
  (layers
    (0 F.Cu signal)
    (31 B.Cu signal)
    (32 B.Adhes user)
    (33 F.Adhes user)
    (34 B.Paste user)
    (35 F.Paste user)
    (36 B.SilkS user)
    (37 F.SilkS user)
    (38 B.Mask user)
    (39 F.Mask user)
    (40 Dwgs.User user)
    (41 Cmts.User user)
    (42 Eco1.User user)
    (43 Eco2.User user)
    (44 Edge.Cuts user)
    (45 Margin user)
    (46 B.CrtYd user)
    (47 F.CrtYd user)
    (48 B.Fab user hide)
    (49 F.Fab user hide)
  )
  (setup
    (last_trace_width 0.175)
    (trace_clearance 0.175)
    (zone_clearance 0.508)
    (zone_45_only no)
    (trace_min 0.15)
    (segment_width 0.2)
    (edge_width 0.2)
    (via_size 0.6)
    (via_drill 0.4)
    (via_min_size 0.4)
    (via_min_drill 0.3)
    (uvia_size 0.3)
    (uvia_drill 0.1)
    (uvias_allowed no)
    (uvia_min_size 0.2)
    (uvia_min_drill 0.1)
    (pcb_text_width 0.3)
    (pcb_text_size 1.5 1.5)
    (mod_edge_width 0.15)
    (mod_text_size 1 1)
    (mod_text_width 0.15)
    (pad_size 1.524 1.524)
    (pad_drill 0.762)
    (pad_to_mask_clearance 0)
    (aux_axis_origin 0 0)
    (visible_elements FFFFFF7F)
    (pcbplotparams
      (layerselection 0x00030_80000001)
      (usegerberextensions false)
      (excludeedgelayer true)
      (linewidth 0.100000)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15)
      (hpglpenoverlay 2)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (padsonsilk false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 1)
      (scaleselection 1)
      (outputdirectory ""))
  )
  (net 0 "")
  (net 1 "Net-(BT1-Pad1)")
  (net 2 GND)
  (net 3 /Vusb)
  (net 4 /Vbatt)
  (net 5 +5V)
  (net 6 /Vbatt_r)
  (net 7 +3V3)
  (net 8 "Net-(C7-Pad1)")
  (net 9 /Microcontroller/~RST)
  (net 10 "Net-(C9-Pad1)")
  (net 11 "Net-(C10-Pad1)")
  (net 12 "Net-(C11-Pad1)")
  (net 13 "Net-(C12-Pad1)")
  (net 14 "Net-(C13-Pad1)")
  (net 15 "Net-(J6-Pad2)")
  (net 16 "Net-(J6-Pad3)")
  (net 17 "Net-(J6-Pad5)")
  (net 18 "Net-(L1-Pad1)")
  (net 19 "Net-(J3-Pad1)")
  (net 20 /SCL_5)
  (net 21 /SDA_5)
  (net 22 /stat)
  (net 23 /LED)
  (net 24 "Net-(R11-Pad1)")
  (net 25 /D+)
  (net 26 "Net-(R12-Pad1)")
  (net 27 /D-)
  (net 28 /~CS)
  (net 29 /MOSI)
  (net 30 /SCK)
  (net 31 /MISO)
  (net 32 /RX_MCU)
  (net 33 /TX_MCU)
  (net 34 "Net-(J6-Pad7)")
  (net 35 "Net-(R3-Pad1)")
  (net 36 "Net-(R14-Pad2)")
  (net 37 "Net-(R15-Pad2)")
  (net 38 /Thermistor)
  (net 39 "Net-(U6-Pad4)")
  (net 40 "Net-(U6-Pad5)")
  (net 41 /RST_RTC)
  (net 42 /RST_BT)
  (net 43 /Microcontroller/ADC13)
  (net 44 "Net-(D1-Pad1)")
  (net 45 /ON)
  (net 46 /keep_alive)
  (net_class Default "This is the default net class."
    (clearance 0.175)
    (trace_width 0.175)
    (via_dia 0.6)
    (via_drill 0.4)
    (uvia_dia 0.3)
    (uvia_drill 0.1)
    (add_net +3V3)
    (add_net +5V)
    (add_net /D+)
    (add_net /D-)
    (add_net /LED)
    (add_net /MISO)
    (add_net /MOSI)
    (add_net /Microcontroller/ADC13)
    (add_net /Microcontroller/~RST)
    (add_net /ON)
    (add_net /RST_BT)
    (add_net /RST_RTC)
    (add_net /RX_MCU)
    (add_net /SCK)
    (add_net /SCL_5)
    (add_net /SDA_5)
    (add_net /TX_MCU)
    (add_net /Thermistor)
    (add_net /Vbatt)
    (add_net /Vbatt_r)
    (add_net /Vusb)
    (add_net /keep_alive)
    (add_net /stat)
    (add_net /~CS)
    (add_net GND)
    (add_net "Net-(BT1-Pad1)")
    (add_net "Net-(C10-Pad1)")
    (add_net "Net-(C11-Pad1)")
    (add_net "Net-(C12-Pad1)")
    (add_net "Net-(C13-Pad1)")
    (add_net "Net-(C7-Pad1)")
    (add_net "Net-(C9-Pad1)")
    (add_net "Net-(D1-Pad1)")
    (add_net "Net-(J3-Pad1)")
    (add_net "Net-(J6-Pad2)")
    (add_net "Net-(J6-Pad3)")
    (add_net "Net-(J6-Pad5)")
    (add_net "Net-(J6-Pad7)")
    (add_net "Net-(L1-Pad1)")
    (add_net "Net-(R11-Pad1)")
    (add_net "Net-(R12-Pad1)")
    (add_net "Net-(R14-Pad2)")
    (add_net "Net-(R15-Pad2)")
    (add_net "Net-(R3-Pad1)")
    (add_net "Net-(U6-Pad4)")
    (add_net "Net-(U6-Pad5)")
  )
  (module custom:1503cb-led-ra (layer F.Cu) (tedit 58E19437)
    (at 62.3697 120.396 270)
    (fp_text reference D1 (at -1.27 -2.54 270) (layer F.SilkS))
    (fp_text value GRN (at -3.81 1.27 360) (layer F.Fab))
    (pad 2 thru_hole circle (at -1.27 0 270) (size 1.524 1.524) (drill 0.9) (layers *.Cu *.Mask)
      (net 5 +5V))
    (pad 1 thru_hole circle (at 1.27 0 270) (size 1.524 1.524) (drill 0.9) (layers *.Cu *.Mask)
      (net 44 "Net-(D1-Pad1)"))
    (model custom.3dshapes/1503cb-led-ra.wrl
      (at (xyz 0 -0.23 0))
      (scale (xyz 0.4 0.4 0.4))
      (rotate (xyz -90 0 -90))
    )
  )
  (module Housings_SSOP:TSSOP-14_4.4x5mm_Pitch0.65mm (layer F.Cu) (tedit 58C836B1)
    (at 82.8548 143.5735 180)
    (descr "14-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [TSSOP] (see Microchip Packaging Specification 00000049BS.pdf)")
    (tags "SSOP 0.65")
    (attr smd)
    (fp_text reference U6 (at 1.8161 -3.1877 180) (layer F.SilkS))
    (fp_text value NTS0104GT (at 0 3.55 180) (layer F.Fab))
    (pad 1 smd rect (at -2.95 -1.95 180) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 7 +3V3))
    (pad 2 smd rect (at -2.95 -1.3 180) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask))
    (pad 3 smd rect (at -2.95 -0.65 180) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask))
    (pad 4 smd rect (at -2.95 0 180) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 39 "Net-(U6-Pad4)"))
    (pad 5 smd rect (at -2.95 0.65 180) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 40 "Net-(U6-Pad5)"))
    (pad 6 smd rect (at -2.95 1.3 180) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask))
    (pad 7 smd rect (at -2.95 1.95 180) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad 8 smd rect (at 2.95 1.95 180) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 37 "Net-(R15-Pad2)"))
    (pad 9 smd rect (at 2.95 1.3 180) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask))
    (pad 10 smd rect (at 2.95 0.65 180) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 33 /TX_MCU))
    (pad 11 smd rect (at 2.95 0 180) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 32 /RX_MCU))
    (pad 12 smd rect (at 2.95 -0.65 180) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 21 /SDA_5))
    (pad 13 smd rect (at 2.95 -1.3 180) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 20 /SCL_5))
    (pad 14 smd rect (at 2.95 -1.95 180) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 5 +5V))
  )
  (module custom:BK-885 (layer F.Cu) (tedit 58C838AB)
    (at 110.9106 141.8844 180)
    (fp_text reference BT1 (at -6.666 -2.7813 180) (layer F.SilkS))
    (fp_text value Battery_Cell (at 0 -3.81 180) (layer F.Fab))
    (pad 1 smd rect (at -7.685 0 180) (size 4.17 4.17) (layers F.Cu F.Paste F.Mask)
      (net 1 "Net-(BT1-Pad1)"))
    (pad 1 smd rect (at 7.685 0 180) (size 4.17 4.17) (layers F.Cu F.Paste F.Mask)
      (net 1 "Net-(BT1-Pad1)"))
    (pad 2 smd rect (at 0 0 180) (size 3.96 3.96) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (model "custom.3dshapes/User Library-BK-885-TR.wrl"
      (at (xyz 0 0 0))
      (scale (xyz 400 400 400))
      (rotate (xyz -90 0 0))
    )
  )
  (module Capacitors_SMD:C_0805 (layer F.Cu) (tedit 58C83699)
    (at 67.0433 133.2484)
    (descr "Capacitor SMD 0805, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C1 (at 2.4257 0.0381 180) (layer F.SilkS))
    (fp_text value 4.7u (at 0 1.75) (layer F.Fab))
    (fp_text user %R (at 0 -1.5) (layer F.Fab))
    (pad 1 smd rect (at -1 0) (size 1 1.25) (layers F.Cu F.Paste F.Mask)
      (net 3 /Vusb))
    (pad 2 smd rect (at 1 0) (size 1 1.25) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (model Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0805 (layer F.Cu) (tedit 58C83899)
    (at 82.9691 122.0216)
    (descr "Capacitor SMD 0805, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C2 (at 0.0635 1.3716) (layer F.SilkS))
    (fp_text value 4.7u (at 0 1.75) (layer F.Fab))
    (fp_text user %R (at 0 -1.5) (layer F.Fab))
    (pad 1 smd rect (at -1 0) (size 1 1.25) (layers F.Cu F.Paste F.Mask)
      (net 4 /Vbatt))
    (pad 2 smd rect (at 1 0) (size 1 1.25) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (model Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0805 (layer B.Cu) (tedit 58C839ED)
    (at 82.804 135.9916 270)
    (descr "Capacitor SMD 0805, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C3 (at 2.3622 -0.127 270) (layer B.SilkS))
    (fp_text value 1u (at 0 -1.75 270) (layer B.Fab))
    (fp_text user %R (at 0 1.5 270) (layer B.Fab))
    (pad 1 smd rect (at -1 0 270) (size 1 1.25) (layers B.Cu B.Paste B.Mask)
      (net 5 +5V))
    (pad 2 smd rect (at 1 0 270) (size 1 1.25) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0805 (layer B.Cu) (tedit 58C83982)
    (at 73.2155 127.7747)
    (descr "Capacitor SMD 0805, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C4 (at 2.2098 -0.0127) (layer B.SilkS))
    (fp_text value 4.7u (at 0 -1.75) (layer B.Fab))
    (fp_text user %R (at 0 1.5) (layer B.Fab))
    (pad 1 smd rect (at -1 0) (size 1 1.25) (layers B.Cu B.Paste B.Mask)
      (net 6 /Vbatt_r))
    (pad 2 smd rect (at 1 0) (size 1 1.25) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0805 (layer F.Cu) (tedit 58C836CC)
    (at 84.0994 127.9779 180)
    (descr "Capacitor SMD 0805, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C5 (at -2.4511 -0.0127 180) (layer F.SilkS))
    (fp_text value 4.7u (at 0 1.75 180) (layer F.Fab))
    (fp_text user %R (at 0 -1.5 180) (layer F.Fab))
    (pad 1 smd rect (at -1 0 180) (size 1 1.25) (layers F.Cu F.Paste F.Mask)
      (net 5 +5V))
    (pad 2 smd rect (at 1 0 180) (size 1 1.25) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (model Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0805 (layer B.Cu) (tedit 58C8393F)
    (at 87.4522 136.5123 270)
    (descr "Capacitor SMD 0805, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C6 (at 2.6416 0.0127 270) (layer B.SilkS))
    (fp_text value 1u (at 0 -1.75 270) (layer B.Fab))
    (fp_text user %R (at 0 1.5 270) (layer B.Fab))
    (pad 1 smd rect (at -1 0 270) (size 1 1.25) (layers B.Cu B.Paste B.Mask)
      (net 7 +3V3))
    (pad 2 smd rect (at 1 0 270) (size 1 1.25) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0805 (layer B.Cu) (tedit 58C83938)
    (at 96.9645 143.51)
    (descr "Capacitor SMD 0805, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C7 (at 0.0889 1.4605) (layer B.SilkS))
    (fp_text value 1u (at 0 -1.75) (layer B.Fab))
    (fp_text user %R (at 0 1.5) (layer B.Fab))
    (pad 1 smd rect (at -1 0) (size 1 1.25) (layers B.Cu B.Paste B.Mask)
      (net 8 "Net-(C7-Pad1)"))
    (pad 2 smd rect (at 1 0) (size 1 1.25) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0805 (layer B.Cu) (tedit 58C8395E)
    (at 73.5805 138.7602)
    (descr "Capacitor SMD 0805, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C8 (at -0.0475 -1.4605) (layer B.SilkS))
    (fp_text value 1u (at 0 -1.75) (layer B.Fab))
    (fp_text user %R (at 0 1.5) (layer B.Fab))
    (pad 1 smd rect (at -1 0) (size 1 1.25) (layers B.Cu B.Paste B.Mask)
      (net 9 /Microcontroller/~RST))
    (pad 2 smd rect (at 1 0) (size 1 1.25) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0805 (layer F.Cu) (tedit 58C836AD)
    (at 75.9587 145.4023 270)
    (descr "Capacitor SMD 0805, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C9 (at -0.1651 -1.4859 270) (layer F.SilkS))
    (fp_text value 13p (at 0 1.75 270) (layer F.Fab))
    (fp_text user %R (at 0 -1.5 270) (layer F.Fab))
    (pad 1 smd rect (at -1 0 270) (size 1 1.25) (layers F.Cu F.Paste F.Mask)
      (net 10 "Net-(C9-Pad1)"))
    (pad 2 smd rect (at 1 0 270) (size 1 1.25) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (model Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0805 (layer B.Cu) (tedit 58C83964)
    (at 70.4469 138.2268 90)
    (descr "Capacitor SMD 0805, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C10 (at 0.0635 -1.5113 90) (layer B.SilkS))
    (fp_text value 1u (at 0 -1.75 90) (layer B.Fab))
    (fp_text user %R (at 0 1.5 90) (layer B.Fab))
    (pad 1 smd rect (at -1 0 90) (size 1 1.25) (layers B.Cu B.Paste B.Mask)
      (net 11 "Net-(C10-Pad1)"))
    (pad 2 smd rect (at 1 0 90) (size 1 1.25) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0805 (layer F.Cu) (tedit 58C836A9)
    (at 69.3674 145.161 90)
    (descr "Capacitor SMD 0805, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C11 (at 0 -1.4097 90) (layer F.SilkS))
    (fp_text value 13p (at 0 1.75 90) (layer F.Fab))
    (fp_text user %R (at 0 -1.5 90) (layer F.Fab))
    (pad 1 smd rect (at -1 0 90) (size 1 1.25) (layers F.Cu F.Paste F.Mask)
      (net 12 "Net-(C11-Pad1)"))
    (pad 2 smd rect (at 1 0 90) (size 1 1.25) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (model Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0805 (layer B.Cu) (tedit 58C839E2)
    (at 73.0029 134.7089 180)
    (descr "Capacitor SMD 0805, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C12 (at -0.2126 -1.3716 180) (layer B.SilkS))
    (fp_text value 100n (at 0 -1.75 180) (layer B.Fab))
    (fp_text user %R (at 0 1.5 180) (layer B.Fab))
    (pad 1 smd rect (at -1 0 180) (size 1 1.25) (layers B.Cu B.Paste B.Mask)
      (net 13 "Net-(C12-Pad1)"))
    (pad 2 smd rect (at 1 0 180) (size 1 1.25) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0805 (layer B.Cu) (tedit 58C836B5)
    (at 78.5495 139.9159 270)
    (descr "Capacitor SMD 0805, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C13 (at -0.1143 -1.524 270) (layer B.SilkS))
    (fp_text value 1u (at 0 -1.75 270) (layer B.Fab))
    (fp_text user %R (at 0 1.5 270) (layer B.Fab))
    (pad 1 smd rect (at -1 0 270) (size 1 1.25) (layers B.Cu B.Paste B.Mask)
      (net 14 "Net-(C13-Pad1)"))
    (pad 2 smd rect (at 1 0 270) (size 1 1.25) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0805 (layer F.Cu) (tedit 58C836CF)
    (at 84.1756 125.8189 180)
    (descr "Capacitor SMD 0805, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C14 (at -2.7813 -0.0635 180) (layer F.SilkS))
    (fp_text value 100n (at 0 1.75 180) (layer F.Fab))
    (fp_text user %R (at 0 -1.5 180) (layer F.Fab))
    (pad 1 smd rect (at -1 0 180) (size 1 1.25) (layers F.Cu F.Paste F.Mask)
      (net 5 +5V))
    (pad 2 smd rect (at 1 0 180) (size 1 1.25) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (model Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0805 (layer B.Cu) (tedit 58C83943)
    (at 85.3821 136.0424 270)
    (descr "Capacitor SMD 0805, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C15 (at 2.8067 -0.1143 270) (layer B.SilkS))
    (fp_text value 100n (at 0 -1.75 270) (layer B.Fab))
    (fp_text user %R (at 0 1.5 270) (layer B.Fab))
    (pad 1 smd rect (at -1 0 270) (size 1 1.25) (layers B.Cu B.Paste B.Mask)
      (net 7 +3V3))
    (pad 2 smd rect (at 1 0 270) (size 1 1.25) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0805 (layer B.Cu) (tedit 58C8398C)
    (at 73.3425 129.921)
    (descr "Capacitor SMD 0805, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C16 (at 0.1016 1.3843) (layer B.SilkS))
    (fp_text value 100n (at 0 -1.75) (layer B.Fab))
    (fp_text user %R (at 0 1.5) (layer B.Fab))
    (pad 1 smd rect (at -1 0) (size 1 1.25) (layers B.Cu B.Paste B.Mask)
      (net 6 /Vbatt_r))
    (pad 2 smd rect (at 1 0) (size 1 1.25) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module tinkercad:0ZCG (layer B.Cu) (tedit 58C839D5)
    (at 79.7814 128.5748 270)
    (fp_text reference F1 (at 1.1303 -2.5908 270) (layer B.SilkS))
    (fp_text value Fuse (at 0 2.54 270) (layer B.Fab))
    (pad 1 smd rect (at -2.115 0 270) (size 1.78 3.5) (layers B.Cu B.Paste B.Mask)
      (net 4 /Vbatt))
    (pad 2 smd rect (at 2.115 0 270) (size 1.78 3.5) (layers B.Cu B.Paste B.Mask)
      (net 6 /Vbatt_r))
    (model "custom.3dshapes/User Library-0ZCG-0_70mm.wrl"
      (at (xyz 0 0 0.016))
      (scale (xyz 400 400 400))
      (rotate (xyz -90 0 0))
    )
  )
  (module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58C8389F)
    (at 64.2366 132.5499 270)
    (descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0805")
    (attr smd)
    (fp_text reference L2 (at 0.127 1.3716 270) (layer F.SilkS))
    (fp_text value Ferrite_Bead (at 0 1.75 270) (layer F.Fab))
    (fp_text user %R (at 0 -1.65 270) (layer F.Fab))
    (pad 1 smd rect (at -0.95 0 270) (size 0.7 1.3) (layers F.Cu F.Paste F.Mask)
      (net 3 /Vusb))
    (pad 2 smd rect (at 0.95 0 270) (size 0.7 1.3) (layers F.Cu F.Paste F.Mask)
      (net 19 "Net-(J3-Pad1)"))
    (model Resistors_SMD.3dshapes/R_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0805 (layer B.Cu) (tedit 58C83958)
    (at 76.3905 139.9126 270)
    (descr "Capacitor SMD 0805, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference L3 (at -2.4859 -0.1143 270) (layer B.SilkS))
    (fp_text value 100u (at 0 -1.75 270) (layer B.Fab))
    (fp_text user %R (at 0 1.5 270) (layer B.Fab))
    (pad 1 smd rect (at -1 0 270) (size 1 1.25) (layers B.Cu B.Paste B.Mask)
      (net 14 "Net-(C13-Pad1)"))
    (pad 2 smd rect (at 1 0 270) (size 1 1.25) (layers B.Cu B.Paste B.Mask)
      (net 5 +5V))
    (model Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module robosub_footprints:DFN-4 (layer F.Cu) (tedit 58C836A5)
    (at 72.9234 145.1102 180)
    (fp_text reference Osc1 (at -0.0127 -2.0828 180) (layer F.SilkS))
    (fp_text value Osc (at 0 -2.286 180) (layer F.Fab))
    (pad 2 smd rect (at 1.1 0.85 180) (size 1.4 1.2) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad 1 smd rect (at -1.1 0.85 180) (size 1.4 1.2) (layers F.Cu F.Paste F.Mask)
      (net 10 "Net-(C9-Pad1)"))
    (pad 4 smd rect (at -1.1 -0.85 180) (size 1.4 1.2) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad 3 smd rect (at 1.1 -0.85 180) (size 1.4 1.2) (layers F.Cu F.Paste F.Mask)
      (net 12 "Net-(C11-Pad1)"))
    (model robosub.3dshapes/ABM8G.wrl
      (at (xyz 0 0 0))
      (scale (xyz 400 400 400))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0805 (layer B.Cu) (tedit 58C8399A)
    (at 64.1223 125.1077 270)
    (descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0805")
    (attr smd)
    (fp_text reference R1 (at 0.9144 1.3843 270) (layer B.SilkS))
    (fp_text value 330 (at 0 -1.75 270) (layer B.Fab))
    (fp_text user %R (at 0 1.65 270) (layer B.Fab))
    (pad 1 smd rect (at -0.95 0 270) (size 0.7 1.3) (layers B.Cu B.Paste B.Mask)
      (net 45 /ON))
    (pad 2 smd rect (at 0.95 0 270) (size 0.7 1.3) (layers B.Cu B.Paste B.Mask)
      (net 46 /keep_alive))
    (model Resistors_SMD.3dshapes/R_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0805 (layer B.Cu) (tedit 58C83994)
    (at 71.6661 125.3109 180)
    (descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0805")
    (attr smd)
    (fp_text reference R2 (at -2.3495 -0.0381 180) (layer B.SilkS))
    (fp_text value 10k (at 0 -1.75 180) (layer B.Fab))
    (fp_text user %R (at 0 1.65 180) (layer B.Fab))
    (pad 1 smd rect (at -0.95 0 180) (size 0.7 1.3) (layers B.Cu B.Paste B.Mask)
      (net 5 +5V))
    (pad 2 smd rect (at 0.95 0 180) (size 0.7 1.3) (layers B.Cu B.Paste B.Mask)
      (net 22 /stat))
    (model Resistors_SMD.3dshapes/R_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0805 (layer B.Cu) (tedit 58C83973)
    (at 64.262 131.1504 270)
    (descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0805")
    (attr smd)
    (fp_text reference R3 (at -0.0483 -1.4605 270) (layer B.SilkS))
    (fp_text value 5k (at 0 -1.75 270) (layer B.Fab))
    (fp_text user %R (at 0 1.65 270) (layer B.Fab))
    (pad 1 smd rect (at -0.95 0 270) (size 0.7 1.3) (layers B.Cu B.Paste B.Mask)
      (net 35 "Net-(R3-Pad1)"))
    (pad 2 smd rect (at 0.95 0 270) (size 0.7 1.3) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model Resistors_SMD.3dshapes/R_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0805 (layer B.Cu) (tedit 58C836DF)
    (at 109.2581 129.1209 90)
    (descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0805")
    (attr smd)
    (fp_text reference R4 (at -2.2098 0.0254 90) (layer B.SilkS))
    (fp_text value 10k (at 0 -1.75 90) (layer B.Fab))
    (fp_text user %R (at 0 1.65 90) (layer B.Fab))
    (pad 1 smd rect (at -0.95 0 90) (size 0.7 1.3) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (pad 2 smd rect (at 0.95 0 90) (size 0.7 1.3) (layers B.Cu B.Paste B.Mask)
      (net 38 /Thermistor))
    (model Resistors_SMD.3dshapes/R_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0805 (layer B.Cu) (tedit 58C839DE)
    (at 77.3557 134.0231 90)
    (descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0805")
    (attr smd)
    (fp_text reference R5 (at 0.0381 1.4986 90) (layer B.SilkS))
    (fp_text value 330 (at 0 -1.75 90) (layer B.Fab))
    (fp_text user %R (at 0 1.65 90) (layer B.Fab))
    (pad 1 smd rect (at -0.95 0 90) (size 0.7 1.3) (layers B.Cu B.Paste B.Mask)
      (net 23 /LED))
    (pad 2 smd rect (at 0.95 0 90) (size 0.7 1.3) (layers B.Cu B.Paste B.Mask)
      (net 44 "Net-(D1-Pad1)"))
    (model Resistors_SMD.3dshapes/R_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0805 (layer B.Cu) (tedit 58C8392B)
    (at 90.805 141.478)
    (descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0805")
    (attr smd)
    (fp_text reference R10 (at 0.6604 1.7145) (layer B.SilkS))
    (fp_text value 5k (at 0 -1.75) (layer B.Fab))
    (fp_text user %R (at 0 1.65) (layer B.Fab))
    (pad 1 smd rect (at -0.95 0) (size 0.7 1.3) (layers B.Cu B.Paste B.Mask)
      (net 7 +3V3))
    (pad 2 smd rect (at 0.95 0) (size 0.7 1.3) (layers B.Cu B.Paste B.Mask)
      (net 8 "Net-(C7-Pad1)"))
    (model Resistors_SMD.3dshapes/R_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58C83693)
    (at 65.9511 137.3632 180)
    (descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0805")
    (attr smd)
    (fp_text reference R11 (at 2.5019 0.127 180) (layer F.SilkS))
    (fp_text value 22 (at 0 1.75 180) (layer F.Fab))
    (fp_text user %R (at 0 -1.65 180) (layer F.Fab))
    (pad 1 smd rect (at -0.95 0 180) (size 0.7 1.3) (layers F.Cu F.Paste F.Mask)
      (net 24 "Net-(R11-Pad1)"))
    (pad 2 smd rect (at 0.95 0 180) (size 0.7 1.3) (layers F.Cu F.Paste F.Mask)
      (net 25 /D+))
    (model Resistors_SMD.3dshapes/R_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58C8368F)
    (at 65.9003 135.4074 180)
    (descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0805")
    (attr smd)
    (fp_text reference R12 (at 2.4765 0.0635 180) (layer F.SilkS))
    (fp_text value 22 (at 0 1.75 180) (layer F.Fab))
    (fp_text user %R (at 0 -1.65 180) (layer F.Fab))
    (pad 1 smd rect (at -0.95 0 180) (size 0.7 1.3) (layers F.Cu F.Paste F.Mask)
      (net 26 "Net-(R12-Pad1)"))
    (pad 2 smd rect (at 0.95 0 180) (size 0.7 1.3) (layers F.Cu F.Paste F.Mask)
      (net 27 /D-))
    (model Resistors_SMD.3dshapes/R_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0805 (layer B.Cu) (tedit 58C8396A)
    (at 73.4085 140.7668)
    (descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0805")
    (attr smd)
    (fp_text reference R13 (at -0.0279 1.5494) (layer B.SilkS))
    (fp_text value 10k (at 0 -1.75) (layer B.Fab))
    (fp_text user %R (at 0 1.65) (layer B.Fab))
    (pad 1 smd rect (at -0.95 0) (size 0.7 1.3) (layers B.Cu B.Paste B.Mask)
      (net 9 /Microcontroller/~RST))
    (pad 2 smd rect (at 0.95 0) (size 0.7 1.3) (layers B.Cu B.Paste B.Mask)
      (net 5 +5V))
    (model Resistors_SMD.3dshapes/R_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module TO_SOT_Packages_SMD:SOT-23-5 (layer B.Cu) (tedit 58C8397A)
    (at 69.3547 129.286 180)
    (descr "5-pin SOT23 package")
    (tags SOT-23-5)
    (attr smd)
    (fp_text reference U2 (at -1.3716 -2.3241 180) (layer B.SilkS))
    (fp_text value Mcp73831 (at 0 -2.9 180) (layer B.Fab))
    (pad 1 smd rect (at -1.1 0.95 180) (size 1.06 0.65) (layers B.Cu B.Paste B.Mask)
      (net 22 /stat))
    (pad 2 smd rect (at -1.1 0 180) (size 1.06 0.65) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (pad 3 smd rect (at -1.1 -0.95 180) (size 1.06 0.65) (layers B.Cu B.Paste B.Mask)
      (net 6 /Vbatt_r))
    (pad 4 smd rect (at 1.1 -0.95 180) (size 1.06 0.65) (layers B.Cu B.Paste B.Mask)
      (net 3 /Vusb))
    (pad 5 smd rect (at 1.1 0.95 180) (size 1.06 0.65) (layers B.Cu B.Paste B.Mask)
      (net 35 "Net-(R3-Pad1)"))
    (model TO_SOT_Packages_SMD.3dshapes/SOT-23-5.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module TO_SOT_Packages_SMD:SOT-23-5 (layer F.Cu) (tedit 58C836C7)
    (at 84.3485 135.829)
    (descr "5-pin SOT23 package")
    (tags SOT-23-5)
    (attr smd)
    (fp_text reference U3 (at -1.2143 2.2581) (layer F.SilkS))
    (fp_text value AP2112 (at 0 2.9) (layer F.Fab))
    (pad 1 smd rect (at -1.1 -0.95) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask)
      (net 5 +5V))
    (pad 2 smd rect (at -1.1 0) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad 3 smd rect (at -1.1 0.95) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask)
      (net 5 +5V))
    (pad 4 smd rect (at 1.1 0.95) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask))
    (pad 5 smd rect (at 1.1 -0.95) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask)
      (net 7 +3V3))
    (model TO_SOT_Packages_SMD.3dshapes/SOT-23-5.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Housings_DFN_QFN:DFN-6-1EP_2x2mm_Pitch0.65mm (layer B.Cu) (tedit 58C839AC)
    (at 86.0257 122.4638 180)
    (descr "6-Lead Plastic Dual Flat, No Lead Package (MA) - 2x2x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)")
    (tags "DFN 0.65")
    (attr smd)
    (fp_text reference U4 (at 0.7833 -1.8184 180) (layer B.SilkS))
    (fp_text value TPS61240 (at 0 -2.025 180) (layer B.Fab))
    (pad 1 smd rect (at -1.05 0.65 180) (size 0.65 0.35) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (pad 2 smd rect (at -1.05 0 180) (size 0.65 0.35) (layers B.Cu B.Paste B.Mask)
      (net 5 +5V))
    (pad 3 smd rect (at -1.05 -0.65 180) (size 0.65 0.35) (layers B.Cu B.Paste B.Mask)
      (net 5 +5V))
    (pad 4 smd rect (at 1.05 -0.65 180) (size 0.65 0.35) (layers B.Cu B.Paste B.Mask)
      (net 45 /ON))
    (pad 5 smd rect (at 1.05 0 180) (size 0.65 0.35) (layers B.Cu B.Paste B.Mask)
      (net 18 "Net-(L1-Pad1)"))
    (pad 6 smd rect (at 1.05 0.65 180) (size 0.65 0.35) (layers B.Cu B.Paste B.Mask)
      (net 4 /Vbatt))
    (pad 7 smd rect (at 0 -0.4 180) (size 1 0.8) (layers B.Cu B.Paste B.Mask)
      (solder_paste_margin_ratio -0.2))
    (pad 7 smd rect (at 0 0.4 180) (size 1 0.8) (layers B.Cu B.Paste B.Mask)
      (solder_paste_margin_ratio -0.2))
    (model Housings_DFN_QFN.3dshapes/DFN-6-1EP_2x2mm_Pitch0.65mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Housings_DFN_QFN:QFN-44-1EP_7x7mm_Pitch0.5mm (layer F.Cu) (tedit 58C836BB)
    (at 73.4151 137.6064)
    (descr "UK Package; 44-Lead Plastic QFN (7mm x 7mm); (see Linear Technology QFN_44_05-08-1763.pdf)")
    (tags "QFN 0.5")
    (attr smd)
    (fp_text reference U8 (at -4.3525 -2.834 90) (layer F.SilkS))
    (fp_text value ATMEGA32U4-MU (at 0 4.75) (layer F.Fab))
    (pad 1 smd rect (at -3.4 -2.5) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
    (pad 2 smd rect (at -3.4 -2) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask)
      (net 5 +5V))
    (pad 3 smd rect (at -3.4 -1.5) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask)
      (net 26 "Net-(R12-Pad1)"))
    (pad 4 smd rect (at -3.4 -1) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask)
      (net 24 "Net-(R11-Pad1)"))
    (pad 5 smd rect (at -3.4 -0.5) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad 6 smd rect (at -3.4 0) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask)
      (net 11 "Net-(C10-Pad1)"))
    (pad 7 smd rect (at -3.4 0.5) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask)
      (net 3 /Vusb))
    (pad 8 smd rect (at -3.4 1) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask)
      (net 28 /~CS))
    (pad 9 smd rect (at -3.4 1.5) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask)
      (net 30 /SCK))
    (pad 10 smd rect (at -3.4 2) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask)
      (net 29 /MOSI))
    (pad 11 smd rect (at -3.4 2.5) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask)
      (net 31 /MISO))
    (pad 12 smd rect (at -2.5 3.4 90) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
    (pad 13 smd rect (at -2 3.4 90) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask)
      (net 9 /Microcontroller/~RST))
    (pad 14 smd rect (at -1.5 3.4 90) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask)
      (net 5 +5V))
    (pad 15 smd rect (at -1 3.4 90) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad 16 smd rect (at -0.5 3.4 90) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask)
      (net 12 "Net-(C11-Pad1)"))
    (pad 17 smd rect (at 0 3.4 90) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask)
      (net 10 "Net-(C9-Pad1)"))
    (pad 18 smd rect (at 0.5 3.4 90) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask)
      (net 20 /SCL_5))
    (pad 19 smd rect (at 1 3.4 90) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask)
      (net 21 /SDA_5))
    (pad 20 smd rect (at 1.5 3.4 90) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask)
      (net 32 /RX_MCU))
    (pad 21 smd rect (at 2 3.4 90) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask)
      (net 33 /TX_MCU))
    (pad 22 smd rect (at 2.5 3.4 90) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask)
      (net 41 /RST_RTC))
    (pad 23 smd rect (at 3.4 2.5) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad 24 smd rect (at 3.4 2) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask)
      (net 14 "Net-(C13-Pad1)"))
    (pad 25 smd rect (at 3.4 1.5) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
    (pad 26 smd rect (at 3.4 1) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
    (pad 27 smd rect (at 3.4 0.5) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
    (pad 28 smd rect (at 3.4 0) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask)
      (net 46 /keep_alive))
    (pad 29 smd rect (at 3.4 -0.5) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask)
      (net 42 /RST_BT))
    (pad 30 smd rect (at 3.4 -1) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask)
      (net 43 /Microcontroller/ADC13))
    (pad 31 smd rect (at 3.4 -1.5) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask)
      (net 22 /stat))
    (pad 32 smd rect (at 3.4 -2) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask)
      (net 23 /LED))
    (pad 33 smd rect (at 3.4 -2.5) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
    (pad 34 smd rect (at 2.5 -3.4 90) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask)
      (net 5 +5V))
    (pad 35 smd rect (at 2 -3.4 90) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad 36 smd rect (at 1.5 -3.4 90) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
    (pad 37 smd rect (at 1 -3.4 90) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
    (pad 38 smd rect (at 0.5 -3.4 90) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
    (pad 39 smd rect (at 0 -3.4 90) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
    (pad 40 smd rect (at -0.5 -3.4 90) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
    (pad 41 smd rect (at -1 -3.4 90) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask)
      (net 38 /Thermistor))
    (pad 42 smd rect (at -1.5 -3.4 90) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask)
      (net 13 "Net-(C12-Pad1)"))
    (pad 43 smd rect (at -2 -3.4 90) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad 44 smd rect (at -2.5 -3.4 90) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask)
      (net 14 "Net-(C13-Pad1)"))
    (pad 45 smd rect (at 1.93125 1.93125) (size 1.2875 1.2875) (layers F.Cu F.Paste F.Mask)
      (solder_paste_margin_ratio -0.2))
    (pad 45 smd rect (at 1.93125 0.64375) (size 1.2875 1.2875) (layers F.Cu F.Paste F.Mask)
      (solder_paste_margin_ratio -0.2))
    (pad 45 smd rect (at 1.93125 -0.64375) (size 1.2875 1.2875) (layers F.Cu F.Paste F.Mask)
      (solder_paste_margin_ratio -0.2))
    (pad 45 smd rect (at 1.93125 -1.93125) (size 1.2875 1.2875) (layers F.Cu F.Paste F.Mask)
      (solder_paste_margin_ratio -0.2))
    (pad 45 smd rect (at 0.64375 1.93125) (size 1.2875 1.2875) (layers F.Cu F.Paste F.Mask)
      (solder_paste_margin_ratio -0.2))
    (pad 45 smd rect (at 0.64375 0.64375) (size 1.2875 1.2875) (layers F.Cu F.Paste F.Mask)
      (solder_paste_margin_ratio -0.2))
    (pad 45 smd rect (at 0.64375 -0.64375) (size 1.2875 1.2875) (layers F.Cu F.Paste F.Mask)
      (solder_paste_margin_ratio -0.2))
    (pad 45 smd rect (at 0.64375 -1.93125) (size 1.2875 1.2875) (layers F.Cu F.Paste F.Mask)
      (solder_paste_margin_ratio -0.2))
    (pad 45 smd rect (at -0.64375 1.93125) (size 1.2875 1.2875) (layers F.Cu F.Paste F.Mask)
      (solder_paste_margin_ratio -0.2))
    (pad 45 smd rect (at -0.64375 0.64375) (size 1.2875 1.2875) (layers F.Cu F.Paste F.Mask)
      (solder_paste_margin_ratio -0.2))
    (pad 45 smd rect (at -0.64375 -0.64375) (size 1.2875 1.2875) (layers F.Cu F.Paste F.Mask)
      (solder_paste_margin_ratio -0.2))
    (pad 45 smd rect (at -0.64375 -1.93125) (size 1.2875 1.2875) (layers F.Cu F.Paste F.Mask)
      (solder_paste_margin_ratio -0.2))
    (pad 45 smd rect (at -1.93125 1.93125) (size 1.2875 1.2875) (layers F.Cu F.Paste F.Mask)
      (solder_paste_margin_ratio -0.2))
    (pad 45 smd rect (at -1.93125 0.64375) (size 1.2875 1.2875) (layers F.Cu F.Paste F.Mask)
      (solder_paste_margin_ratio -0.2))
    (pad 45 smd rect (at -1.93125 -0.64375) (size 1.2875 1.2875) (layers F.Cu F.Paste F.Mask)
      (solder_paste_margin_ratio -0.2))
    (pad 45 smd rect (at -1.93125 -1.93125) (size 1.2875 1.2875) (layers F.Cu F.Paste F.Mask)
      (solder_paste_margin_ratio -0.2))
    (model Housings_DFN_QFN.3dshapes/QFN-44-1EP_7x7mm_Pitch0.5mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module robosub_footprints:USB-Micro-B-TH (layer F.Cu) (tedit 58C83689)
    (at 62.0541 136.6162 270)
    (fp_text reference J3 (at 4.3411 0.294 360) (layer F.SilkS))
    (fp_text value USB_OTG (at -0.254 5.842 270) (layer F.Fab))
    (pad 3 smd rect (at 0 0.675 270) (size 0.4 1.35) (layers F.Cu F.Paste F.Mask)
      (net 25 /D+))
    (pad 2 smd rect (at -0.65 0.675 270) (size 0.4 1.35) (layers F.Cu F.Paste F.Mask)
      (net 27 /D-))
    (pad 4 smd rect (at 0.65 0.675 270) (size 0.4 1.35) (layers F.Cu F.Paste F.Mask))
    (pad 5 smd rect (at 1.3 0.675 270) (size 0.4 1.35) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad 1 smd rect (at -1.3 0.675 270) (size 0.4 1.35) (layers F.Cu F.Paste F.Mask)
      (net 19 "Net-(J3-Pad1)"))
    (pad "" smd rect (at 1.2 3.35 270) (size 1.9 1.9) (layers F.Cu F.Paste F.Mask))
    (pad "" smd rect (at -1.2 3.35 270) (size 1.9 1.9) (layers F.Cu F.Paste F.Mask))
    (pad "" thru_hole circle (at -2.5 0.675 270) (size 1.25 1.25) (drill 0.85) (layers *.Cu *.Mask F.SilkS))
    (pad "" thru_hole circle (at 2.5 0.675 270) (size 1.25 1.25) (drill 0.85) (layers *.Cu *.Mask F.SilkS))
    (pad "" thru_hole circle (at -3.5 3.35 270) (size 1.55 1.55) (drill 1.15) (layers *.Cu *.Mask F.SilkS))
    (pad "" thru_hole circle (at 3.5 3.35 270) (size 1.55 1.55) (drill 1.15) (layers *.Cu *.Mask F.SilkS))
    (model robosub.3dshapes/microUSB-TH.wrl
      (at (xyz 0 -0.125 0.05))
      (scale (xyz 400 400 400))
      (rotate (xyz -90 0 0))
    )
  )
  (module Pin_Headers:Pin_Header_Straight_2x03_Pitch2.54mm (layer F.Cu) (tedit 58C8369F)
    (at 58.928 146.6088 90)
    (descr "Through hole straight pin header, 2x03, 2.54mm pitch, double rows")
    (tags "Through hole pin header THT 2x03 2.54mm double row")
    (fp_text reference J7 (at -0.9017 7.1755 90) (layer F.SilkS))
    (fp_text value CONN_02X03 (at 1.27 7.47 90) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 31 /MISO))
    (pad 2 thru_hole oval (at 2.54 0 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 5 +5V))
    (pad 3 thru_hole oval (at 0 2.54 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 30 /SCK))
    (pad 4 thru_hole oval (at 2.54 2.54 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 29 /MOSI))
    (pad 5 thru_hole oval (at 0 5.08 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 9 /Microcontroller/~RST))
    (pad 6 thru_hole oval (at 2.54 5.08 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 2 GND))
    (model Pin_Headers.3dshapes/Pin_Header_Straight_2x03_Pitch2.54mm.wrl
      (at (xyz 0.05 -0.1 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 90))
    )
  )
  (module Capacitors_SMD:C_0805 (layer B.Cu) (tedit 58C836E3)
    (at 106.5784 137.2616)
    (descr "Capacitor SMD 0805, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C17 (at -2.6416 0.0635) (layer B.SilkS))
    (fp_text value 100n (at 0 -1.75) (layer B.Fab))
    (fp_text user %R (at 0 1.5) (layer B.Fab))
    (pad 1 smd rect (at -1 0) (size 1 1.25) (layers B.Cu B.Paste B.Mask)
      (net 5 +5V))
    (pad 2 smd rect (at 1 0) (size 1 1.25) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0805 (layer B.Cu) (tedit 58C83933)
    (at 89.2683 144.9578 90)
    (descr "Capacitor SMD 0805, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C18 (at 0.0762 1.7018 90) (layer B.SilkS))
    (fp_text value 100n (at 0 -1.75 90) (layer B.Fab))
    (fp_text user %R (at 0 1.5 90) (layer B.Fab))
    (pad 1 smd rect (at -1 0 90) (size 1 1.25) (layers B.Cu B.Paste B.Mask)
      (net 7 +3V3))
    (pad 2 smd rect (at 1 0 90) (size 1 1.25) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58C836D5)
    (at 94.3229 130.4569 270)
    (descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0805")
    (attr smd)
    (fp_text reference R14 (at -0.0152 1.4986 270) (layer F.SilkS))
    (fp_text value 10k (at 0 1.75 270) (layer F.Fab))
    (fp_text user %R (at 0 -1.65 270) (layer F.Fab))
    (pad 1 smd rect (at -0.95 0 270) (size 0.7 1.3) (layers F.Cu F.Paste F.Mask)
      (net 7 +3V3))
    (pad 2 smd rect (at 0.95 0 270) (size 0.7 1.3) (layers F.Cu F.Paste F.Mask)
      (net 36 "Net-(R14-Pad2)"))
    (model Resistors_SMD.3dshapes/R_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0805 (layer B.Cu) (tedit 58C8394B)
    (at 82.804 143.5354 90)
    (descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0805")
    (attr smd)
    (fp_text reference R15 (at -2.3622 0.0127 90) (layer B.SilkS))
    (fp_text value 10k (at 0 -1.75 90) (layer B.Fab))
    (fp_text user %R (at 0 1.65 90) (layer B.Fab))
    (pad 1 smd rect (at -0.95 0 90) (size 0.7 1.3) (layers B.Cu B.Paste B.Mask)
      (net 7 +3V3))
    (pad 2 smd rect (at 0.95 0 90) (size 0.7 1.3) (layers B.Cu B.Paste B.Mask)
      (net 37 "Net-(R15-Pad2)"))
    (model Resistors_SMD.3dshapes/R_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Housings_SSOP:TSSOP-14_4.4x5mm_Pitch0.65mm (layer F.Cu) (tedit 58C836DA)
    (at 98.4758 129.54 270)
    (descr "14-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [TSSOP] (see Microchip Packaging Specification 00000049BS.pdf)")
    (tags "SSOP 0.65")
    (attr smd)
    (fp_text reference U1 (at 1.9558 -3.3655 270) (layer F.SilkS))
    (fp_text value NTS0104GT (at 0 3.55 270) (layer F.Fab))
    (pad 1 smd rect (at -2.95 -1.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 7 +3V3))
    (pad 2 smd rect (at -2.95 -1.3 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 15 "Net-(J6-Pad2)"))
    (pad 3 smd rect (at -2.95 -0.65 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 16 "Net-(J6-Pad3)"))
    (pad 4 smd rect (at -2.95 0 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 17 "Net-(J6-Pad5)"))
    (pad 5 smd rect (at -2.95 0.65 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 34 "Net-(J6-Pad7)"))
    (pad 6 smd rect (at -2.95 1.3 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask))
    (pad 7 smd rect (at -2.95 1.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad 8 smd rect (at 2.95 1.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 36 "Net-(R14-Pad2)"))
    (pad 9 smd rect (at 2.95 1.3 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask))
    (pad 10 smd rect (at 2.95 0.65 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 31 /MISO))
    (pad 11 smd rect (at 2.95 0 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 30 /SCK))
    (pad 12 smd rect (at 2.95 -0.65 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 29 /MOSI))
    (pad 13 smd rect (at 2.95 -1.3 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 28 /~CS))
    (pad 14 smd rect (at 2.95 -1.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 5 +5V))
    (model Housings_SSOP.3dshapes/TSSOP-14_4.4x5mm_Pitch0.65mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connectors_JST:JST_PH_S2B-PH-SM4-TB_02x2.00mm_Angled (layer F.Cu) (tedit 58C836C3)
    (at 75.5678 124.6045 180)
    (descr "JST PH series connector, S2B-PH-SM4-TB, side entry type, surface mount, Datasheet: http://www.jst-mfg.com/product/pdf/eng/ePH.pdf")
    (tags "connector jst ph")
    (attr smd)
    (fp_text reference J1 (at -5.6995 4.4498 450) (layer F.SilkS))
    (fp_text value CONN_01X02 (at 0 5.375 180) (layer F.Fab))
    (fp_text user %R (at 0 1.5 180) (layer F.Fab))
    (pad 1 smd rect (at -1 -2.875 180) (size 1 3.5) (layers F.Cu F.Paste F.Mask)
      (net 6 /Vbatt_r))
    (pad 2 smd rect (at 1 -2.875 180) (size 1 3.5) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad "" smd rect (at -3.35 2.875 180) (size 1.5 3.4) (layers F.Cu F.Paste F.Mask))
    (pad "" smd rect (at 3.35 2.875 180) (size 1.5 3.4) (layers F.Cu F.Paste F.Mask))
    (model custom.3dshapes/s2b-ph-sm4.wrl
      (at (xyz -0.315 0.5 0))
      (scale (xyz 0.4 0.4 0.4))
      (rotate (xyz -90 0 0))
    )
  )
  (module Connectors_JST:JST_PH_S2B-PH-SM4-TB_02x2.00mm_Angled (layer F.Cu) (tedit 58C838B0)
    (at 116.4034 126.2789 90)
    (descr "JST PH series connector, S2B-PH-SM4-TB, side entry type, surface mount, Datasheet: http://www.jst-mfg.com/product/pdf/eng/ePH.pdf")
    (tags "connector jst ph")
    (attr smd)
    (fp_text reference J4 (at -4.9629 4.4371 360) (layer F.SilkS))
    (fp_text value CONN_01X02 (at 0 5.375 90) (layer F.Fab))
    (fp_text user %R (at 0 1.5 90) (layer F.Fab))
    (pad 1 smd rect (at -1 -2.875 90) (size 1 3.5) (layers F.Cu F.Paste F.Mask)
      (net 5 +5V))
    (pad 2 smd rect (at 1 -2.875 90) (size 1 3.5) (layers F.Cu F.Paste F.Mask)
      (net 38 /Thermistor))
    (pad "" smd rect (at -3.35 2.875 90) (size 1.5 3.4) (layers F.Cu F.Paste F.Mask))
    (pad "" smd rect (at 3.35 2.875 90) (size 1.5 3.4) (layers F.Cu F.Paste F.Mask))
    (model custom.3dshapes/s2b-ph-sm4.wrl
      (at (xyz -0.315 0.5 0))
      (scale (xyz 0.4 0.4 0.4))
      (rotate (xyz -90 0 0))
    )
  )
  (module custom:inductor-2520 (layer B.Cu) (tedit 58D3E68D)
    (at 82.1436 122.4788 90)
    (fp_text reference L1 (at 1.27 -2.54 90) (layer B.SilkS))
    (fp_text value 1u (at 0 3.81 90) (layer B.Fab))
    (pad 2 smd rect (at 0.95 0 90) (size 1 2.5) (layers B.Cu B.Paste B.Mask)
      (net 4 /Vbatt))
    (pad 1 smd rect (at -0.95 0 90) (size 1 2.5) (layers B.Cu B.Paste B.Mask)
      (net 18 "Net-(L1-Pad1)"))
    (model custom.3dshapes/2520.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.4 0.4 0.4))
      (rotate (xyz 0 0 0))
    )
  )
  (module custom:micro-sd (layer B.Cu) (tedit 58C87FE7)
    (at 99.5553 128.5875 180)
    (fp_text reference J6 (at 8.3566 6.4262 270) (layer B.SilkS))
    (fp_text value Micro_SD_Card (at 0 0.5 180) (layer B.Fab))
    (pad "" smd rect (at -7.245 5.725 180) (size 0.95 2.5) (layers B.Cu B.Paste B.Mask))
    (pad "" smd rect (at -7.145 -5.875 180) (size 1.15 2.2) (layers B.Cu B.Paste B.Mask))
    (pad "" smd rect (at 4.94 -6.4 180) (size 1.5 1.15) (layers B.Cu B.Paste B.Mask))
    (pad "" smd rect (at -2.84 -6.4 180) (size 1.5 1.15) (layers B.Cu B.Paste B.Mask))
    (pad "" smd rect (at 7.145 5.875 180) (size 1.15 2.2) (layers B.Cu B.Paste B.Mask))
    (pad 1 smd rect (at -2.9 6.355 180) (size 0.8 1.24) (layers B.Cu B.Paste B.Mask))
    (pad 2 smd rect (at -1.8 6.355 180) (size 0.8 1.24) (layers B.Cu B.Paste B.Mask)
      (net 15 "Net-(J6-Pad2)"))
    (pad 4 smd rect (at 0.4 6.355 180) (size 0.8 1.24) (layers B.Cu B.Paste B.Mask)
      (net 7 +3V3))
    (pad 3 smd rect (at -0.7 6.355 180) (size 0.8 1.24) (layers B.Cu B.Paste B.Mask)
      (net 16 "Net-(J6-Pad3)"))
    (pad 5 smd rect (at 1.5 6.355 180) (size 0.8 1.24) (layers B.Cu B.Paste B.Mask)
      (net 17 "Net-(J6-Pad5)"))
    (pad 8 smd rect (at 4.8 6.355 180) (size 0.8 1.24) (layers B.Cu B.Paste B.Mask))
    (pad 6 smd rect (at 2.6 6.355 180) (size 0.8 1.24) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (pad 7 smd rect (at 3.7 6.355 180) (size 0.8 1.24) (layers B.Cu B.Paste B.Mask)
      (net 34 "Net-(J6-Pad7)"))
    (model "custom.3dshapes/User Library-cardholder_5031820852.wrl"
      (at (xyz 0 0.03 0.03))
      (scale (xyz 400 400 400))
      (rotate (xyz 0 0 0))
    )
  )
  (module TO_SOT_Packages_SMD:SOT-23 (layer B.Cu) (tedit 58C87AC2)
    (at 89.7001 129.3495)
    (descr "SOT-23, Standard")
    (tags SOT-23)
    (attr smd)
    (fp_text reference Q2 (at -0.0254 2.1463) (layer B.SilkS))
    (fp_text value Q_NMOS_GSD (at 0 -2.5) (layer B.Fab))
    (pad 1 smd rect (at -1 0.95) (size 0.9 0.8) (layers B.Cu B.Paste B.Mask)
      (net 42 /RST_BT))
    (pad 2 smd rect (at -1 -0.95) (size 0.9 0.8) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (pad 3 smd rect (at 1 0) (size 0.9 0.8) (layers B.Cu B.Paste B.Mask)
      (net 8 "Net-(C7-Pad1)"))
    (model TO_SOT_Packages_SMD.3dshapes/SOT-23.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 90))
    )
  )
  (module Resistors_SMD:R_0805 (layer B.Cu) (tedit 58C87ABC)
    (at 86.8172 129.4257 90)
    (descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0805")
    (attr smd)
    (fp_text reference R7 (at -2.1844 0.0254 90) (layer B.SilkS))
    (fp_text value 10k (at 0 -1.75 90) (layer B.Fab))
    (fp_text user %R (at 0 1.65 90) (layer B.Fab))
    (pad 1 smd rect (at -0.95 0 90) (size 0.7 1.3) (layers B.Cu B.Paste B.Mask)
      (net 42 /RST_BT))
    (pad 2 smd rect (at 0.95 0 90) (size 0.7 1.3) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model Resistors_SMD.3dshapes/R_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module custom:BM71 (layer F.Cu) (tedit 58C88002)
    (at 98.5136 141.2358 180)
    (fp_text reference U7 (at -0.7369 -0.2041 180) (layer F.SilkS))
    (fp_text value BM71 (at 5.08 -2.54 180) (layer F.Fab))
    (pad 4 smd rect (at 0.25 -3.1 180) (size 1.5 0.7) (layers F.Cu F.Paste F.Mask))
    (pad 7 smd rect (at 2.7 -0.25 270) (size 1.5 0.7) (layers F.Cu F.Paste F.Mask)
      (net 40 "Net-(U6-Pad5)"))
    (pad 5 smd rect (at 0.25 -1.9 180) (size 1.5 0.7) (layers F.Cu F.Paste F.Mask))
    (pad 3 smd rect (at 0.25 -4.3 180) (size 1.5 0.7) (layers F.Cu F.Paste F.Mask))
    (pad 2 smd rect (at 0.25 -5.5 180) (size 1.5 0.7) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad 1 smd rect (at 0.25 -6.7 180) (size 1.5 0.7) (layers F.Cu F.Paste F.Mask))
    (pad 13 smd rect (at 8.75 -3.1 180) (size 1.5 0.7) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad 14 smd rect (at 8.75 -4.3 180) (size 1.5 0.7) (layers F.Cu F.Paste F.Mask)
      (net 7 +3V3))
    (pad 12 smd rect (at 8.75 -1.9 180) (size 1.5 0.7) (layers F.Cu F.Paste F.Mask))
    (pad 15 smd rect (at 8.75 -5.5 180) (size 1.5 0.7) (layers F.Cu F.Paste F.Mask))
    (pad 16 smd rect (at 8.75 -6.7 180) (size 1.5 0.7) (layers F.Cu F.Paste F.Mask))
    (pad 6 smd rect (at 1.5 -0.25 270) (size 1.5 0.7) (layers F.Cu F.Paste F.Mask))
    (pad 8 smd rect (at 3.9 -0.25 270) (size 1.5 0.7) (layers F.Cu F.Paste F.Mask)
      (net 39 "Net-(U6-Pad4)"))
    (pad 10 smd rect (at 6.3 -0.25 270) (size 1.5 0.7) (layers F.Cu F.Paste F.Mask)
      (net 8 "Net-(C7-Pad1)"))
    (pad 9 smd rect (at 5.1 -0.25 270) (size 1.5 0.7) (layers F.Cu F.Paste F.Mask))
    (pad 11 smd rect (at 7.5 -0.25 270) (size 1.5 0.7) (layers F.Cu F.Paste F.Mask))
  )
  (module Resistors_SMD:R_0805 (layer F.Cu) (tedit 58C96947)
    (at 88.9762 127.9525 270)
    (descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0805")
    (attr smd)
    (fp_text reference R8 (at -0.0508 -1.4351 270) (layer F.SilkS))
    (fp_text value 5k (at 0 1.75 270) (layer F.Fab))
    (fp_text user %R (at 0 -1.65 270) (layer F.Fab))
    (pad 1 smd rect (at -0.95 0 270) (size 0.7 1.3) (layers F.Cu F.Paste F.Mask)
      (net 4 /Vbatt))
    (pad 2 smd rect (at 0.95 0 270) (size 0.7 1.3) (layers F.Cu F.Paste F.Mask)
      (net 43 /Microcontroller/ADC13))
    (model Resistors_SMD.3dshapes/R_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0805 (layer B.Cu) (tedit 58DE9211)
    (at 66.6623 125.1331 270)
    (descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0805")
    (attr smd)
    (fp_text reference R9 (at 0.0381 -1.3716 270) (layer B.SilkS))
    (fp_text value 10k (at 0 -1.75 270) (layer B.Fab))
    (fp_text user %R (at 0 1.65 270) (layer B.Fab))
    (pad 1 smd rect (at -0.95 0 270) (size 0.7 1.3) (layers B.Cu B.Paste B.Mask)
      (net 45 /ON))
    (pad 2 smd rect (at 0.95 0 270) (size 0.7 1.3) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model Resistors_SMD.3dshapes/R_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Housings_SOIC:SOIC-16W_7.5x10.3mm_Pitch1.27mm (layer B.Cu) (tedit 58CC8F64)
    (at 114.4778 140.3985)
    (descr "16-Lead Plastic Small Outline (SO) - Wide, 7.50 mm Body [SOIC] (see Microchip Packaging Specification 00000049BS.pdf)")
    (tags "SOIC 1.27")
    (attr smd)
    (fp_text reference U5 (at 0 6.25) (layer B.SilkS))
    (fp_text value DS3231 (at 0 -6.25) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 1 smd rect (at -4.65 4.445) (size 1.5 0.6) (layers B.Cu B.Paste B.Mask))
    (pad 2 smd rect (at -4.65 3.175) (size 1.5 0.6) (layers B.Cu B.Paste B.Mask)
      (net 5 +5V))
    (pad 3 smd rect (at -4.65 1.905) (size 1.5 0.6) (layers B.Cu B.Paste B.Mask))
    (pad 4 smd rect (at -4.65 0.635) (size 1.5 0.6) (layers B.Cu B.Paste B.Mask)
      (net 41 /RST_RTC))
    (pad 5 smd rect (at -4.65 -0.635) (size 1.5 0.6) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (pad 6 smd rect (at -4.65 -1.905) (size 1.5 0.6) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (pad 7 smd rect (at -4.65 -3.175) (size 1.5 0.6) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (pad 8 smd rect (at -4.65 -4.445) (size 1.5 0.6) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (pad 9 smd rect (at 4.65 -4.445) (size 1.5 0.6) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (pad 10 smd rect (at 4.65 -3.175) (size 1.5 0.6) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (pad 11 smd rect (at 4.65 -1.905) (size 1.5 0.6) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (pad 12 smd rect (at 4.65 -0.635) (size 1.5 0.6) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (pad 13 smd rect (at 4.65 0.635) (size 1.5 0.6) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (pad 14 smd rect (at 4.65 1.905) (size 1.5 0.6) (layers B.Cu B.Paste B.Mask)
      (net 1 "Net-(BT1-Pad1)"))
    (pad 15 smd rect (at 4.65 3.175) (size 1.5 0.6) (layers B.Cu B.Paste B.Mask)
      (net 21 /SDA_5))
    (pad 16 smd rect (at 4.65 4.445) (size 1.5 0.6) (layers B.Cu B.Paste B.Mask)
      (net 20 /SCL_5))
    (model Housings_SOIC.3dshapes/SOIC-16W_7.5x10.3mm_Pitch1.27mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module custom:pb_switch-1825027-5 (layer F.Cu) (tedit 58E19806)
    (at 60.4393 127.9144 270)
    (fp_text reference SW1 (at -2.032 3.048 450) (layer F.SilkS))
    (fp_text value SW_Push (at 0 -0.5 270) (layer F.Fab))
    (pad ~ thru_hole circle (at 3.505 -1.245 270) (size 1.3 1.3) (drill 1.3) (layers *.Cu *.Mask))
    (pad ~ thru_hole circle (at -3.505 -1.245 270) (size 1.3 1.3) (drill 1.3) (layers *.Cu *.Mask))
    (pad 1 thru_hole circle (at -2.25 1.245 270) (size 1.8 1.8) (drill 1) (layers *.Cu *.Mask)
      (net 4 /Vbatt))
    (pad 2 thru_hole circle (at 2.25 1.245 270) (size 1.8 1.8) (drill 1) (layers *.Cu *.Mask)
      (net 45 /ON))
    (model custom.3dshapes/pb_switch.wrl
      (at (xyz 0 -0.155 0.16))
      (scale (xyz 0.4 0.4 0.4))
      (rotate (xyz -90 0 0))
    )
  )
  (dimension 3.0099 (width 0.3) (layer Dwgs.User)
    (gr_text "0.118 in" (at 124.2225 109.22 270) (layer Dwgs.User))
    (feature1 (pts (xy 120.523 119.507) (xy 125.5725 119.507)))
    (feature2 (pts (xy 120.523 116.4971) (xy 125.5725 116.4971)))
    (crossbar (pts (xy 122.8725 116.4971) (xy 122.8725 119.507)))
    (arrow1a (pts (xy 122.8725 119.507) (xy 122.286079 118.380496)))
    (arrow1b (pts (xy 122.8725 119.507) (xy 123.458921 118.380496)))
    (arrow2a (pts (xy 122.8725 116.4971) (xy 122.286079 117.623604)))
    (arrow2b (pts (xy 122.8725 116.4971) (xy 123.458921 117.623604)))
  )
  (dimension 7.112283 (width 0.3) (layer Dwgs.User)
    (gr_text "0.2800 in" (at 52.482258 137.16 89.48844413) (layer Dwgs.User))
    (feature1 (pts (xy 56.5658 124.3584) (xy 51.164062 124.358382)))
    (feature2 (pts (xy 56.5023 131.4704) (xy 51.100562 131.470382)))
    (crossbar (pts (xy 53.800455 131.446276) (xy 53.863955 124.334276)))
    (arrow1a (pts (xy 53.863955 124.334276) (xy 54.440295 125.465971)))
    (arrow1b (pts (xy 53.863955 124.334276) (xy 53.2675 125.455499)))
    (arrow2a (pts (xy 53.800455 131.446276) (xy 54.39691 130.325053)))
    (arrow2b (pts (xy 53.800455 131.446276) (xy 53.224115 130.314581)))
  )
  (dimension 5.969 (width 0.3) (layer Dwgs.User)
    (gr_text "0.2350 in" (at 52.379177 109.22 90) (layer Dwgs.User))
    (feature1 (pts (xy 56.6166 117.4115) (xy 51.029177 117.4115)))
    (feature2 (pts (xy 56.6166 123.3805) (xy 51.029177 123.3805)))
    (crossbar (pts (xy 53.729177 123.3805) (xy 53.729177 117.4115)))
    (arrow1a (pts (xy 53.729177 117.4115) (xy 54.315598 118.538004)))
    (arrow1b (pts (xy 53.729177 117.4115) (xy 53.142756 118.538004)))
    (arrow2a (pts (xy 53.729177 123.3805) (xy 54.315598 122.253996)))
    (arrow2b (pts (xy 53.729177 123.3805) (xy 53.142756 122.253996)))
  )
  (dimension 6.8961 (width 0.3) (layer Dwgs.User)
    (gr_text "0.2715 in" (at 48.26 109.22 90) (layer Dwgs.User))
    (feature1 (pts (xy 57.4929 116.4971) (xy 46.499744 116.4971)))
    (feature2 (pts (xy 57.4929 123.3932) (xy 46.499744 123.3932)))
    (crossbar (pts (xy 49.199744 123.3932) (xy 49.199744 116.4971)))
    (arrow1a (pts (xy 49.199744 116.4971) (xy 49.786165 117.623604)))
    (arrow1b (pts (xy 49.199744 116.4971) (xy 48.613323 117.623604)))
    (arrow2a (pts (xy 49.199744 123.3932) (xy 49.786165 122.266696)))
    (arrow2b (pts (xy 49.199744 123.3932) (xy 48.613323 122.266696)))
  )
  (dimension 14.9733 (width 0.3) (layer Dwgs.User)
    (gr_text "0.5895 in" (at 43.4683 109.22 90) (layer Dwgs.User))
    (feature1 (pts (xy 57.4929 116.4971) (xy 42.1183 116.4971)))
    (feature2 (pts (xy 57.4929 131.4704) (xy 42.1183 131.4704)))
    (crossbar (pts (xy 44.8183 131.4704) (xy 44.8183 116.4971)))
    (arrow1a (pts (xy 44.8183 116.4971) (xy 45.404721 117.623604)))
    (arrow1b (pts (xy 44.8183 116.4971) (xy 44.231879 117.623604)))
    (arrow2a (pts (xy 44.8183 131.4704) (xy 45.404721 130.343896)))
    (arrow2b (pts (xy 44.8183 131.4704) (xy 44.231879 130.343896)))
  )
  (gr_text "3V 12.0mm\nCoin Cell" (at 107.2007 133.5024) (layer F.SilkS))
  (gr_text "Revision C\nRyan Summers\n04-20-2017" (at 90.7034 124.4727) (layer F.SilkS))
  (gr_text Serial (at 115.6843 121.8057) (layer B.SilkS))
  (gr_text "Pasteurization \nThermometer" (at 90.4748 121.4501) (layer F.SilkS))
  (gr_text THRM (at 110.4265 126.4031 270) (layer F.SilkS))
  (gr_text BAT (at 75.7555 130.6957) (layer F.SilkS))
  (gr_arc (start 120.5 117.5) (end 120.5 116.5) (angle 90) (layer Edge.Cuts) (width 0.15))
  (gr_arc (start 120.5 150.8) (end 121.5 150.8) (angle 90) (layer Edge.Cuts) (width 0.15))
  (gr_arc (start 57.5 150.8) (end 57.5 151.8) (angle 90) (layer Edge.Cuts) (width 0.15))
  (gr_arc (start 57.5 117.5) (end 56.5 117.5) (angle 90) (layer Edge.Cuts) (width 0.15))
  (dimension 64.998601 (width 0.3) (layer Dwgs.User)
    (gr_text "2.5590 in" (at 89.002963 112.524516 359.988805) (layer Dwgs.User))
    (feature1 (pts (xy 121.5009 119.507) (xy 121.502527 111.180866)))
    (feature2 (pts (xy 56.5023 119.4943) (xy 56.503927 111.168166)))
    (crossbar (pts (xy 56.503399 113.868166) (xy 121.501999 113.880866)))
    (arrow1a (pts (xy 121.501999 113.880866) (xy 120.375381 114.467067)))
    (arrow1b (pts (xy 121.501999 113.880866) (xy 120.37561 113.294225)))
    (arrow2a (pts (xy 56.503399 113.868166) (xy 57.629788 114.454807)))
    (arrow2b (pts (xy 56.503399 113.868166) (xy 57.630017 113.281965)))
  )
  (dimension 35.255282 (width 0.3) (layer Dwgs.User)
    (gr_text "1.3880 in" (at 39.9786 109.22 89.87616205) (layer Dwgs.User))
    (feature1 (pts (xy 57.524554 116.54452) (xy 38.666703 116.503761)))
    (feature2 (pts (xy 57.448354 151.79972) (xy 38.590503 151.758961)))
    (crossbar (pts (xy 41.290497 151.764797) (xy 41.366697 116.509597)))
    (arrow1a (pts (xy 41.366697 116.509597) (xy 41.950682 117.637366)))
    (arrow1b (pts (xy 41.366697 116.509597) (xy 40.777843 117.634831)))
    (arrow2a (pts (xy 41.290497 151.764797) (xy 41.879351 150.639563)))
    (arrow2b (pts (xy 41.290497 151.764797) (xy 40.706512 150.637028)))
  )
  (gr_line (start 57.5 151.8) (end 120.5 151.8) (layer Edge.Cuts) (width 0.15))
  (gr_line (start 56.5 117.5) (end 56.5 150.8) (layer Edge.Cuts) (width 0.15))
  (gr_line (start 57.5 116.5) (end 120.5 116.5) (layer Edge.Cuts) (width 0.15))
  (gr_line (start 121.5 117.5) (end 121.5 150.8) (layer Edge.Cuts) (width 0.15))
  (zone (net 0) (net_name "") (layer F.SilkS) (hatch edge 0.508)
    (connect_pads (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 80.264 132.969) (xy 80.264 132.0165) (xy 70.993 132.0038) (xy 70.993 132.969)
      )
    )
  )
  (zone (net 0) (net_name "") (layer F.SilkS) (hatch edge 0.508)
    (connect_pads (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 107.95 121.539) (xy 108.966 121.539) (xy 108.966 130.556) (xy 108.077 130.556)
      )
    )
  )
  (zone (net 0) (net_name "") (layer B.SilkS) (hatch edge 0.508)
    (connect_pads (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 120.4722 123.0122) (xy 120.4976 132.969) (xy 111.0361 132.9817) (xy 111.0234 123.0249)
      )
    )
  )
)
