(kicad_pcb (version 20171130) (host pcbnew 5.1.7-a382d34a8~88~ubuntu18.04.1)
  (general
    (thickness 1.6)
    (drawings 25)
    (tracks 214)
    (zones 0)
    (modules 19)
    (nets 25)
  )
  (page A4)
  (layers
    (0 F.Cu signal)
    (1 In1.Cu signal hide)
    (2 In2.Cu signal hide)
    (31 B.Cu signal)
    (32 B.Adhes user)
    (33 F.Adhes user)
    (34 B.Paste user)
    (35 F.Paste user)
    (36 B.SilkS user)
    (37 F.SilkS user)
    (38 B.Mask user)
    (39 F.Mask user)
    (40 Dwgs.User user)
    (41 Cmts.User user)
    (42 Eco1.User user)
    (43 Eco2.User user)
    (44 Edge.Cuts user)
    (45 Margin user)
    (46 B.CrtYd user hide)
    (47 F.CrtYd user hide)
    (48 B.Fab user hide)
    (49 F.Fab user hide)
  )
  (setup
    (last_trace_width 0.25)
    (user_trace_width 0.1524)
    (user_trace_width 0.508)
    (user_trace_width 0.762)
    (trace_clearance 0.2)
    (zone_clearance 0.1524)
    (zone_45_only no)
    (trace_min 0.1524)
    (via_size 0.8)
    (via_drill 0.4)
    (via_min_size 0.4)
    (via_min_drill 0.254)
    (user_via 0.508 0.254)
    (uvia_size 0.3)
    (uvia_drill 0.1)
    (uvias_allowed no)
    (uvia_min_size 0.2)
    (uvia_min_drill 0.1)
    (edge_width 0.05)
    (segment_width 0.2)
    (pcb_text_width 0.3)
    (pcb_text_size 1.5 1.5)
    (mod_edge_width 0.12)
    (mod_text_size 1 1)
    (mod_text_width 0.15)
    (pad_size 1.524 1.524)
    (pad_drill 0.762)
    (pad_to_mask_clearance 0)
    (aux_axis_origin 0 0)
    (grid_origin 38.608 35.814)
    (visible_elements FFFFFF7F)
    (pcbplotparams
      (layerselection 0x010fc_ffffffff)
      (usegerberextensions false)
      (usegerberattributes true)
      (usegerberadvancedattributes true)
      (creategerberjobfile true)
      (excludeedgelayer true)
      (linewidth 0.100000)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (padsonsilk false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 1)
      (scaleselection 1)
      (outputdirectory ""))
  )
  (net 0 "")
  (net 1 GND)
  (net 2 +3V3)
  (net 3 /RESET)
  (net 4 /TX)
  (net 5 /RX)
  (net 6 /GPIO5)
  (net 7 /GPIO4)
  (net 8 /GPIO0)
  (net 9 /DTR)
  (net 10 /RTS)
  (net 11 "Net-(U1-Pad4)")
  (net 12 /GPIO2)
  (net 13 VCC)
  (net 14 "Net-(J1-Pad2)")
  (net 15 /GPIO6)
  (net 16 /GPIO3)
  (net 17 /GPIO1)
  (net 18 /GPIO10)
  (net 19 /GPIO7)
  (net 20 /GPIO9)
  (net 21 /GPIO8)
  (net 22 "Net-(D1-Pad2)")
  (net 23 /USB_D-)
  (net 24 /USB_D+)
  (net_class Default "This is the default net class."
    (clearance 0.2)
    (trace_width 0.25)
    (via_dia 0.8)
    (via_drill 0.4)
    (uvia_dia 0.3)
    (uvia_drill 0.1)
    (add_net +3V3)
    (add_net /DTR)
    (add_net /GPIO0)
    (add_net /GPIO1)
    (add_net /GPIO10)
    (add_net /GPIO2)
    (add_net /GPIO3)
    (add_net /GPIO4)
    (add_net /GPIO5)
    (add_net /GPIO6)
    (add_net /GPIO7)
    (add_net /GPIO8)
    (add_net /GPIO9)
    (add_net /RESET)
    (add_net /RTS)
    (add_net /RX)
    (add_net /TX)
    (add_net /USB_D+)
    (add_net /USB_D-)
    (add_net GND)
    (add_net "Net-(D1-Pad2)")
    (add_net "Net-(J1-Pad2)")
    (add_net "Net-(U1-Pad4)")
    (add_net VCC)
  )
  (module Jumper:SolderJumper-3_P1.3mm_Bridged12_RoundedPad1.0x1.5mm (layer F.Cu) (tedit 614F4F1A)
    (at 50.292 51.024 270)
    (descr "SMD Solder 3-pad Jumper, 1x1.5mm rounded Pads, 0.3mm gap, pads 1-2 bridged with 1 copper strip")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference JP1 (at 0 -1.8 270) (layer F.Fab))
    (fp_text value SolderJumper_3_Bridged12 (at 0 1.9 270) (layer F.Fab))
    (pad 1 smd custom (at -1.3 0 270) (size 1 0.5) (layers F.Cu F.Mask)
      (net 13 VCC) (zone_connect 2)
      (options (clearance outline) (anchor rect))
      (primitives
        (gr_circle (center 0 0.25) (end 0.5 0.25) (width 0))
        (gr_circle (center 0 -0.25) (end 0.5 -0.25) (width 0))
        (gr_poly (pts
           (xy 0.55 -0.75) (xy 0 -0.75) (xy 0 0.75) (xy 0.55 0.75)) (width 0))
      ))
    (pad 2 smd rect (at 0 0 270) (size 1 1.5) (layers F.Cu F.Mask)
      (net 14 "Net-(J1-Pad2)"))
    (pad 3 smd custom (at 1.3 0 270) (size 1 0.5) (layers F.Cu F.Mask)
      (net 2 +3V3) (zone_connect 2)
      (options (clearance outline) (anchor rect))
      (primitives
        (gr_circle (center 0 0.25) (end 0.5 0.25) (width 0))
        (gr_circle (center 0 -0.25) (end 0.5 -0.25) (width 0))
        (gr_poly (pts
           (xy -0.55 -0.75) (xy 0 -0.75) (xy 0 0.75) (xy -0.55 0.75)) (width 0))
      ))
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder (layer F.Cu) (tedit 5F68FEEE)
    (at 59.944 56.4915 90)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R6 (at 0 -1.43 90) (layer F.Fab))
    (fp_text value 10k (at 0 1.43 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 0.9125 0 90) (size 0.975 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 22 "Net-(D1-Pad2)"))
    (pad 1 smd roundrect (at -0.9125 0 90) (size 0.975 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 +3V3))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module LED_SMD:LED_0603_1608Metric (layer F.Cu) (tedit 5F68FEF1)
    (at 61.722 56.388 90)
    (descr "LED SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags LED)
    (attr smd)
    (fp_text reference D1 (at 0 -1.43 90) (layer F.Fab))
    (fp_text value LED (at 0 1.43 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 0.7875 0 90) (size 0.875 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 22 "Net-(D1-Pad2)"))
    (pad 1 smd roundrect (at -0.7875 0 90) (size 0.875 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 GND))
    (model ${KISYS3DMOD}/LED_SMD.3dshapes/LED_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module ESP32-C3-WROOM-02-H4:MODULE_ESP32-C3-WROOM-02-H4 (layer F.Cu) (tedit 614F3799)
    (at 50.01 37.806)
    (fp_text reference U2 (at -6.575 -11.085) (layer F.Fab))
    (fp_text value ESP32-C3-WROOM-02-H4 (at 7.395 11.085) (layer F.Fab))
    (pad 35 thru_hole circle (at -0.14 3.85) (size 0.4 0.4) (drill 0.3) (layers *.Cu)
      (net 1 GND))
    (pad 36 thru_hole circle (at 0.96 3.85) (size 0.4 0.4) (drill 0.3) (layers *.Cu)
      (net 1 GND))
    (pad 38 thru_hole circle (at 0.41 4.4) (size 0.4 0.4) (drill 0.3) (layers *.Cu)
      (net 1 GND))
    (pad 39 thru_hole circle (at 1.51 4.4) (size 0.4 0.4) (drill 0.3) (layers *.Cu)
      (net 1 GND))
    (pad 33 thru_hole circle (at 0.41 3.3) (size 0.4 0.4) (drill 0.3) (layers *.Cu)
      (net 1 GND))
    (pad 30 thru_hole circle (at -0.14 2.75) (size 0.4 0.4) (drill 0.3) (layers *.Cu)
      (net 1 GND))
    (pad 31 thru_hole circle (at 0.96 2.75) (size 0.4 0.4) (drill 0.3) (layers *.Cu)
      (net 1 GND))
    (pad 34 thru_hole circle (at 1.51 3.3) (size 0.4 0.4) (drill 0.3) (layers *.Cu)
      (net 1 GND))
    (pad 28 thru_hole circle (at 0.41 2.2) (size 0.4 0.4) (drill 0.3) (layers *.Cu)
      (net 1 GND))
    (pad 37 thru_hole circle (at 2.06 3.85) (size 0.4 0.4) (drill 0.3) (layers *.Cu)
      (net 1 GND))
    (pad 32 thru_hole circle (at 2.06 2.75) (size 0.4 0.4) (drill 0.3) (layers *.Cu)
      (net 1 GND))
    (pad 29 thru_hole circle (at 1.51 2.2) (size 0.4 0.4) (drill 0.3) (layers *.Cu)
      (net 1 GND))
    (pad 25 smd rect (at -0.14 4.4) (size 0.7 0.7) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 26 smd rect (at 0.96 4.4) (size 0.7 0.7) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 27 smd rect (at 2.06 4.4) (size 0.7 0.7) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 21 smd rect (at 2.06 2.2) (size 0.7 0.7) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 20 smd rect (at 0.96 2.2) (size 0.7 0.7) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 19 smd rect (at -0.14 2.2) (size 0.7 0.7) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 22 smd rect (at -0.14 3.3) (size 0.7 0.7) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 24 smd rect (at 2.06 3.3) (size 0.7 0.7) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 23 smd rect (at 0.96 3.3) (size 0.7 0.7) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 18 smd rect (at 8.75 -2.9) (size 1.5 0.9) (layers F.Cu F.Paste F.Mask)
      (net 8 /GPIO0))
    (pad 17 smd rect (at 8.75 -1.4) (size 1.5 0.9) (layers F.Cu F.Paste F.Mask)
      (net 17 /GPIO1))
    (pad 16 smd rect (at 8.75 0.1) (size 1.5 0.9) (layers F.Cu F.Paste F.Mask)
      (net 12 /GPIO2))
    (pad 15 smd rect (at 8.75 1.6) (size 1.5 0.9) (layers F.Cu F.Paste F.Mask)
      (net 16 /GPIO3))
    (pad 14 smd rect (at 8.75 3.1) (size 1.5 0.9) (layers F.Cu F.Paste F.Mask)
      (net 24 /USB_D+))
    (pad 13 smd rect (at 8.75 4.6) (size 1.5 0.9) (layers F.Cu F.Paste F.Mask)
      (net 23 /USB_D-))
    (pad 12 smd rect (at 8.75 6.1) (size 1.5 0.9) (layers F.Cu F.Paste F.Mask)
      (net 4 /TX))
    (pad 11 smd rect (at 8.75 7.6) (size 1.5 0.9) (layers F.Cu F.Paste F.Mask)
      (net 5 /RX))
    (pad 10 smd rect (at 8.75 9.1) (size 1.5 0.9) (layers F.Cu F.Paste F.Mask)
      (net 18 /GPIO10))
    (pad 9 smd rect (at -8.75 9.1) (size 1.5 0.9) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 8 smd rect (at -8.75 7.6) (size 1.5 0.9) (layers F.Cu F.Paste F.Mask)
      (net 20 /GPIO9))
    (pad 7 smd rect (at -8.75 6.1) (size 1.5 0.9) (layers F.Cu F.Paste F.Mask)
      (net 21 /GPIO8))
    (pad 6 smd rect (at -8.75 4.6) (size 1.5 0.9) (layers F.Cu F.Paste F.Mask)
      (net 19 /GPIO7))
    (pad 5 smd rect (at -8.75 3.1) (size 1.5 0.9) (layers F.Cu F.Paste F.Mask)
      (net 15 /GPIO6))
    (pad 4 smd rect (at -8.75 1.6) (size 1.5 0.9) (layers F.Cu F.Paste F.Mask)
      (net 6 /GPIO5))
    (pad 3 smd rect (at -8.75 0.1) (size 1.5 0.9) (layers F.Cu F.Paste F.Mask)
      (net 7 /GPIO4))
    (pad 2 smd rect (at -8.75 -1.4) (size 1.5 0.9) (layers F.Cu F.Paste F.Mask)
      (net 3 /RESET))
    (pad 1 smd rect (at -8.75 -2.9) (size 1.5 0.9) (layers F.Cu F.Paste F.Mask)
      (net 2 +3V3))
    (model ${KIPRJMOD}/kicad-library/ESP32-C3-WROOM-02-H4/ESP32-C3-WROOM-02-H4.step
      (offset (xyz -9.5 -10 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_PinHeader_2.54mm:PinHeader_1x08_P2.54mm_Vertical (layer B.Cu) (tedit 614F341A)
    (at 61.468 35.814 180)
    (descr "Through hole straight pin header, 1x08, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x08 2.54mm single row")
    (fp_text reference J3 (at 0 2.33) (layer B.Fab))
    (fp_text value Conn_01x08_Male (at 0 -20.11) (layer B.Fab))
    (fp_text user %R (at 0 -8.89 270) (layer B.Fab))
    (pad 8 thru_hole oval (at 0 -17.78 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 18 /GPIO10))
    (pad 7 thru_hole oval (at 0 -15.24 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 10 /RTS))
    (pad 6 thru_hole oval (at 0 -12.7 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 9 /DTR))
    (pad 5 thru_hole oval (at 0 -10.16 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 5 /RX))
    (pad 4 thru_hole oval (at 0 -7.62 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 4 /TX))
    (pad 3 thru_hole oval (at 0 -5.08 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 16 /GPIO3))
    (pad 2 thru_hole oval (at 0 -2.54 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 17 /GPIO1))
    (pad 1 thru_hole rect (at 0 0 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 8 /GPIO0))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x08_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_PinHeader_2.54mm:PinHeader_1x08_P2.54mm_Vertical (layer B.Cu) (tedit 614F33F8)
    (at 38.608 35.814 180)
    (descr "Through hole straight pin header, 1x08, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x08 2.54mm single row")
    (fp_text reference J2 (at 0 2.33) (layer B.Fab))
    (fp_text value Conn_01x08_Male (at 0 -20.11) (layer B.Fab))
    (fp_text user %R (at 0 -8.89 270) (layer B.Fab))
    (pad 8 thru_hole oval (at 0 -17.78 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 7 thru_hole oval (at 0 -15.24 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 13 VCC))
    (pad 6 thru_hole oval (at 0 -12.7 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 19 /GPIO7))
    (pad 5 thru_hole oval (at 0 -10.16 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 15 /GPIO6))
    (pad 4 thru_hole oval (at 0 -7.62 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 6 /GPIO5))
    (pad 3 thru_hole oval (at 0 -5.08 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 7 /GPIO4))
    (pad 2 thru_hole oval (at 0 -2.54 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 3 /RESET))
    (pad 1 thru_hole rect (at 0 0 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 2 +3V3))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x08_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_TO_SOT_SMD:SOT-23-5 (layer F.Cu) (tedit 5A02FF57)
    (at 44.704 50.796 270)
    (descr "5-pin SOT23 package")
    (tags SOT-23-5)
    (attr smd)
    (fp_text reference U1 (at 0 -2.9 90) (layer F.Fab))
    (fp_text value XC6220B331MR (at 0 2.9 90) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 5 smd rect (at 1.1 -0.95 270) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask)
      (net 2 +3V3))
    (pad 4 smd rect (at 1.1 0.95 270) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask)
      (net 11 "Net-(U1-Pad4)"))
    (pad 3 smd rect (at -1.1 0.95 270) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask)
      (net 13 VCC))
    (pad 2 smd rect (at -1.1 0 270) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 1 smd rect (at -1.1 -0.95 270) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask)
      (net 13 VCC))
    (model ${KISYS3DMOD}/Package_TO_SOT_SMD.3dshapes/SOT-23-5.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module "SM04B-SRSS-TB(LF)(SN):JST_SM04B-SRSS-TB(LF)(SN)" (layer F.Cu) (tedit 6096B8DD)
    (at 54.864 53.086)
    (fp_text reference J1 (at -0.545095 -1.767685) (layer F.Fab))
    (fp_text value "SM04B-SRSS-TB(LF)(SN)" (at 12.17039 5.74055) (layer F.Fab))
    (pad 4 smd rect (at 1.5 0) (size 0.6 1.55) (layers F.Cu F.Paste F.Mask)
      (net 23 /USB_D-))
    (pad 3 smd rect (at 0.5 0) (size 0.6 1.55) (layers F.Cu F.Paste F.Mask)
      (net 24 /USB_D+))
    (pad 2 smd rect (at -0.5 0) (size 0.6 1.55) (layers F.Cu F.Paste F.Mask)
      (net 14 "Net-(J1-Pad2)"))
    (pad 1 smd rect (at -1.5 0) (size 0.6 1.55) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad S1 smd rect (at -2.8 3.875) (size 1.2 1.8) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad S2 smd rect (at 2.8 3.875) (size 1.2 1.8) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (model "${KIPRJMOD}/kicad-library/SM04B-SRSS-TB(LF)(SN)/SM04B-SRSS-TB_LF__SN_.step"
      (offset (xyz 0 -0.5 -0.3))
      (scale (xyz 1 1 1))
      (rotate (xyz -90 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder (layer F.Cu) (tedit 5F68FEEF)
    (at 47.498 50.8 90)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C4 (at 0 -1.68 90) (layer F.Fab))
    (fp_text value 10uF (at 0 1.68 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.0375 0 90) (size 1.175 1.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.212766)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.0375 0 90) (size 1.175 1.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.212766)
      (net 2 +3V3))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder (layer F.Cu) (tedit 5F68FEEF)
    (at 41.91 50.8 270)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C1 (at 0 -1.68 90) (layer F.Fab))
    (fp_text value 10uF (at 0 1.68 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.0375 0 270) (size 1.175 1.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.212766)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.0375 0 270) (size 1.175 1.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.212766)
      (net 13 VCC))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder (layer F.Cu) (tedit 5F68FEEE)
    (at 53.848 49.276)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R5 (at 0 -1.43) (layer F.Fab))
    (fp_text value 4k7 (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 0.9125 0) (size 0.975 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 24 /USB_D+))
    (pad 1 smd roundrect (at -0.9125 0) (size 0.975 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 +3V3))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder (layer F.Cu) (tedit 5F68FEEE)
    (at 57.404 49.276 180)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R4 (at 0 -1.43) (layer F.Fab))
    (fp_text value 4k7 (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 0.9125 0 180) (size 0.975 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 23 /USB_D-))
    (pad 1 smd roundrect (at -0.9125 0 180) (size 0.975 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 +3V3))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder (layer F.Cu) (tedit 5F68FEEE)
    (at 40.894 55.626 90)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R3 (at 0 -1.43 90) (layer F.Fab))
    (fp_text value 10k (at 0 1.43 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 0.9125 0 90) (size 0.975 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 21 /GPIO8))
    (pad 1 smd roundrect (at -0.9125 0 90) (size 0.975 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 +3V3))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder (layer F.Cu) (tedit 5F68FEEE)
    (at 42.418 55.626 90)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R2 (at 0 -1.43 90) (layer F.Fab))
    (fp_text value 10k (at 0 1.43 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 0.9125 0 90) (size 0.975 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 12 /GPIO2))
    (pad 1 smd roundrect (at -0.9125 0 90) (size 0.975 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 +3V3))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder (layer F.Cu) (tedit 5F68FEEE)
    (at 43.942 55.626 90)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R1 (at 0 -1.43 90) (layer F.Fab))
    (fp_text value 10k (at 0 1.43 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 0.9125 0 90) (size 0.975 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 3 /RESET))
    (pad 1 smd roundrect (at -0.9125 0 90) (size 0.975 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 +3V3))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MUN5214DW1T1G:On_Semiconductor-MUN5214DW1T1G-Manufacturer_Recommended (layer F.Cu) (tedit 5EFF8995)
    (at 49.022 55.626 90)
    (fp_text reference Q1 (at -2.35 -1.975003 90) (layer F.Fab))
    (fp_text value MUN5214DW1T1G (at 0 0 90) (layer F.Fab))
    (pad 1 smd rect (at -0.920001 -0.650001 180) (size 0.299999 0.660001) (layers F.Cu F.Paste F.Mask)
      (net 10 /RTS))
    (pad 2 smd rect (at -0.920001 -0.000001 180) (size 0.299999 0.660001) (layers F.Cu F.Paste F.Mask)
      (net 9 /DTR))
    (pad 3 smd rect (at -0.920001 0.649999 180) (size 0.299999 0.660001) (layers F.Cu F.Paste F.Mask)
      (net 20 /GPIO9))
    (pad 4 smd rect (at 0.919998 0.649999 180) (size 0.299999 0.660001) (layers F.Cu F.Paste F.Mask)
      (net 9 /DTR))
    (pad 5 smd rect (at 0.919998 -0.000001 180) (size 0.299999 0.660001) (layers F.Cu F.Paste F.Mask)
      (net 10 /RTS))
    (pad 6 smd rect (at 0.919998 -0.650001 180) (size 0.299999 0.660001) (layers F.Cu F.Paste F.Mask)
      (net 3 /RESET))
    (model eec.models/On_Semiconductor_-_MUN5214DW1T1G.step
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder (layer F.Cu) (tedit 5F68FEEF)
    (at 57.404 50.8)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C6 (at 0 -1.43) (layer F.Fab))
    (fp_text value 22pF (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 0.8625 0) (size 1.075 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 GND))
    (pad 1 smd roundrect (at -0.8625 0) (size 1.075 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 23 /USB_D-))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder (layer F.Cu) (tedit 5F68FEEF)
    (at 53.848 50.8 180)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C5 (at 0 -1.43) (layer F.Fab))
    (fp_text value 22pF (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 0.8625 0 180) (size 1.075 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 GND))
    (pad 1 smd roundrect (at -0.8625 0 180) (size 1.075 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 24 /USB_D+))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder (layer F.Cu) (tedit 5F68FEEF)
    (at 45.466 55.626 270)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C2 (at 0 -1.43 90) (layer F.Fab))
    (fp_text value 0.1uF (at 0 1.43 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 0.8625 0 270) (size 1.075 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 GND))
    (pad 1 smd roundrect (at -0.8625 0 270) (size 1.075 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 3 /RESET))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (gr_arc (start 37.592 34.036) (end 37.592 33.782) (angle -90) (layer Edge.Cuts) (width 0.05))
  (gr_arc (start 62.484 34.036) (end 62.738 34.036) (angle -90) (layer Edge.Cuts) (width 0.05))
  (gr_arc (start 62.484 57.912) (end 62.484 58.166) (angle -90) (layer Edge.Cuts) (width 0.05))
  (gr_arc (start 37.592 57.912) (end 37.338 57.912) (angle -90) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 37.592 58.166) (end 62.484 58.166) (layer Edge.Cuts) (width 0.05))
  (gr_text "François Gervais\n25 sept. 2021\nrev 1.0" (at 59.182 37.338) (layer B.SilkS))
  (gr_text 10 (at 60.198 52.578) (layer F.SilkS))
  (gr_text RTS (at 60.198 50.038) (layer F.SilkS))
  (gr_text DTR (at 60.198 47.498) (layer F.SilkS))
  (gr_text TX (at 60.198 44.958) (layer F.SilkS))
  (gr_text RX (at 60.198 42.418) (layer F.SilkS))
  (gr_text 3 (at 60.198 39.878) (layer F.SilkS))
  (gr_text 0 (at 60.198 34.544) (layer F.SilkS))
  (gr_text 1 (at 60.198 37.338) (layer F.SilkS))
  (gr_text VCC (at 39.878 50.038) (layer F.SilkS))
  (gr_text GND (at 39.878 52.578) (layer F.SilkS))
  (gr_text 7 (at 39.624 47.498) (layer F.SilkS))
  (gr_text 6 (at 39.624 44.958) (layer F.SilkS))
  (gr_text 5 (at 39.624 42.418) (layer F.SilkS))
  (gr_text 4 (at 39.624 39.878) (layer F.SilkS))
  (gr_text 3V3 (at 39.624 34.544) (layer F.SilkS))
  (gr_text RST (at 39.624 37.338) (layer F.SilkS))
  (gr_line (start 62.484 33.782) (end 37.592 33.782) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 62.738 57.912) (end 62.738 34.036) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 37.338 34.036) (end 37.338 57.912) (layer Edge.Cuts) (width 0.05))
  (zone (net 1) (net_name GND) (layer In1.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.1524))
    (min_thickness 0.254)
    (fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 62.738 58.166) (xy 37.338 58.166) (xy 37.338 33.782) (xy 62.738 33.782)
      )
    )
  )
  (zone (net 2) (net_name +3V3) (layer In2.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.1524))
    (min_thickness 0.254)
    (fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 62.738 58.166) (xy 37.338 58.166) (xy 37.338 33.782) (xy 62.738 33.782)
      )
    )
  )
  (zone (net 13) (net_name VCC) (layer F.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.1524))
    (min_thickness 0.254)
    (fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 51.9176 52.5907) (xy 37.338 52.5526) (xy 37.338 47.244) (xy 51.9176 47.2821)
      )
    )
  )
  (zone (net 1) (net_name GND) (layer B.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.1524))
    (min_thickness 0.254)
    (fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 62.738 58.166) (xy 37.338 58.166) (xy 37.338 33.782) (xy 62.738 33.782)
      )
    )
  )
)
