(kicad_pcb (version 20171130) (host pcbnew 5.1.9-73d0e3b20d~88~ubuntu20.10.1)
  (general
    (thickness 1.2)
    (drawings 48)
    (tracks 238)
    (zones 0)
    (modules 5)
    (nets 33)
  )
  (page USLetter)
  (title_block
    (title "TANDY WP-2 ROM IC Card")
    (date 2021-01-14)
    (rev 003)
    (company "Brian K. White - b.kenyon.w@gmail.com")
  )
  (layers
    (0 F.Cu signal)
    (31 B.Cu signal)
    (33 F.Adhes user)
    (35 F.Paste user)
    (36 B.SilkS user)
    (37 F.SilkS user)
    (38 B.Mask user)
    (39 F.Mask user)
    (40 Dwgs.User user)
    (41 Cmts.User user hide)
    (42 Eco1.User user hide)
    (43 Eco2.User user hide)
    (44 Edge.Cuts user)
    (45 Margin user hide)
    (46 B.CrtYd user hide)
    (47 F.CrtYd user hide)
    (49 F.Fab user hide)
  )
  (setup
    (last_trace_width 0.254)
    (user_trace_width 0.1524)
    (user_trace_width 0.1778)
    (user_trace_width 0.2032)
    (user_trace_width 0.3048)
    (user_trace_width 0.508)
    (trace_clearance 0.1524)
    (zone_clearance 0.16)
    (zone_45_only no)
    (trace_min 0.1524)
    (via_size 0.46)
    (via_drill 0.3)
    (via_min_size 0.46)
    (via_min_drill 0.3)
    (user_via 0.46 0.3)
    (uvia_size 0.46)
    (uvia_drill 0.3)
    (uvias_allowed no)
    (uvia_min_size 0.46)
    (uvia_min_drill 0.3)
    (edge_width 0.05)
    (segment_width 0.2)
    (pcb_text_width 0.3)
    (pcb_text_size 1.5 1.5)
    (mod_edge_width 0.12)
    (mod_text_size 1 1)
    (mod_text_width 0.15)
    (pad_size 0.3 1)
    (pad_drill 0)
    (pad_to_mask_clearance 0)
    (solder_mask_min_width 0.22)
    (aux_axis_origin 158.75 99.695)
    (grid_origin 158.75 99.695)
    (visible_elements FFFFFF7F)
    (pcbplotparams
      (layerselection 0x010f0_ffffffff)
      (usegerberextensions true)
      (usegerberattributes false)
      (usegerberadvancedattributes false)
      (creategerberjobfile false)
      (excludeedgelayer true)
      (linewidth 0.100000)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (padsonsilk false)
      (subtractmaskfromsilk true)
      (outputformat 1)
      (mirror false)
      (drillshape 0)
      (scaleselection 1)
      (outputdirectory "GERBER_WP-2_IC_Card_ROM"))
  )
  (net 0 "")
  (net 1 GND)
  (net 2 /~CE1)
  (net 3 /~OE)
  (net 4 /D0)
  (net 5 /D1)
  (net 6 /D2)
  (net 7 /D3)
  (net 8 /D4)
  (net 9 /D5)
  (net 10 /D6)
  (net 11 /D7)
  (net 12 /A16)
  (net 13 /A15)
  (net 14 /A14)
  (net 15 /A13)
  (net 16 /A12)
  (net 17 /A11)
  (net 18 /A10)
  (net 19 /A9)
  (net 20 /A8)
  (net 21 /A7)
  (net 22 /A6)
  (net 23 /A5)
  (net 24 /A4)
  (net 25 /A3)
  (net 26 /A2)
  (net 27 /A1)
  (net 28 /A0)
  (net 29 VDD)
  (net 30 /A17)
  (net 31 /~WE)
  (net 32 /R~W)
  (net_class Default "This is the default net class."
    (clearance 0.1524)
    (trace_width 0.254)
    (via_dia 0.46)
    (via_drill 0.3)
    (uvia_dia 0.46)
    (uvia_drill 0.3)
    (diff_pair_width 0.1524)
    (diff_pair_gap 0.2032)
    (add_net /A0)
    (add_net /A1)
    (add_net /A10)
    (add_net /A11)
    (add_net /A12)
    (add_net /A13)
    (add_net /A14)
    (add_net /A15)
    (add_net /A16)
    (add_net /A17)
    (add_net /A2)
    (add_net /A3)
    (add_net /A4)
    (add_net /A5)
    (add_net /A6)
    (add_net /A7)
    (add_net /A8)
    (add_net /A9)
    (add_net /D0)
    (add_net /D1)
    (add_net /D2)
    (add_net /D3)
    (add_net /D4)
    (add_net /D5)
    (add_net /D6)
    (add_net /D7)
    (add_net /R~W)
    (add_net /~CE1)
    (add_net /~OE)
    (add_net /~WE)
    (add_net GND)
    (add_net VDD)
  )
  (module 0_LOCAL:R_0805 (layer F.Cu) (tedit 5F8B5224)
    (at 148 112.195 180)
    (descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0805")
    (attr smd)
    (fp_text reference R1 (at -0.05 0 90 unlocked) (layer F.SilkS))
    (fp_text value 47K (at -1.85 0 90) (layer F.SilkS))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd roundrect (at -0.95 0 180) (size 0.7 1.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.1)
      (net 29 VDD))
    (pad 2 smd roundrect (at 0.95 0 180) (size 0.7 1.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.1)
      (net 31 /~WE))
    (model ${KIPRJMOD}/3d/R_0805_2012Metric.step
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module 0_LOCAL:TSOP32-14mm (layer F.Cu) (tedit 5F8D316E)
    (at 149.25 99.695)
    (descr "Module CMS TSOP 32 pins")
    (tags "CMS TSOP")
    (attr smd)
    (fp_text reference U2 (at -1.905 -0.508 90) (layer F.SilkS) hide)
    (fp_text value "FLASH 256Kx8 5v Parallel" (at 1.27 0 90) (layer F.Fab))
    (pad 1 smd roundrect (at -3.75 6.75) (size 0.3 1) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 17 /A11))
    (pad 2 smd roundrect (at -3.25 6.75) (size 0.3 1) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 19 /A9))
    (pad 3 smd roundrect (at -2.75 6.75) (size 0.3 1) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 20 /A8))
    (pad 4 smd roundrect (at -2.25 6.75) (size 0.3 1) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 15 /A13))
    (pad 5 smd roundrect (at -1.75 6.75) (size 0.3 1) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 14 /A14))
    (pad 6 smd roundrect (at -1.25 6.75) (size 0.3 1) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 30 /A17))
    (pad 7 smd roundrect (at -0.75 6.75) (size 0.3 1) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 31 /~WE))
    (pad 8 smd roundrect (at -0.25 6.75) (size 0.3 1) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 29 VDD))
    (pad 9 smd roundrect (at 0.25 6.75) (size 0.3 1) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
    (pad 10 smd roundrect (at 0.75 6.75) (size 0.3 1) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 12 /A16))
    (pad 11 smd roundrect (at 1.25 6.75) (size 0.3 1) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 13 /A15))
    (pad 12 smd roundrect (at 1.75 6.75) (size 0.3 1) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 16 /A12))
    (pad 13 smd roundrect (at 2.25 6.75) (size 0.3 1) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 21 /A7))
    (pad 14 smd roundrect (at 2.75 6.75) (size 0.3 1) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 22 /A6))
    (pad 15 smd roundrect (at 3.25 6.75) (size 0.3 1) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 23 /A5))
    (pad 16 smd roundrect (at 3.75 6.75) (size 0.3 1) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 24 /A4))
    (pad 17 smd roundrect (at 3.75 -6.75) (size 0.3 1) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 25 /A3))
    (pad 18 smd roundrect (at 3.25 -6.75) (size 0.3 1) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 26 /A2))
    (pad 19 smd roundrect (at 2.75 -6.75) (size 0.3 1) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 27 /A1))
    (pad 20 smd roundrect (at 2.25 -6.75) (size 0.3 1) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 28 /A0))
    (pad 21 smd roundrect (at 1.75 -6.75) (size 0.3 1) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 4 /D0))
    (pad 22 smd roundrect (at 1.25 -6.75) (size 0.3 1) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 5 /D1))
    (pad 23 smd roundrect (at 0.75 -6.75) (size 0.3 1) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 6 /D2))
    (pad 24 smd roundrect (at 0.25 -6.75) (size 0.3 1) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 GND))
    (pad 25 smd roundrect (at -0.25 -6.75) (size 0.3 1) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 7 /D3))
    (pad 26 smd roundrect (at -0.75 -6.75) (size 0.3 1) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 8 /D4))
    (pad 27 smd roundrect (at -1.25 -6.75) (size 0.3 1) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 9 /D5))
    (pad 28 smd roundrect (at -1.75 -6.75) (size 0.3 1) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 10 /D6))
    (pad 29 smd roundrect (at -2.25 -6.75) (size 0.3 1) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 11 /D7))
    (pad 30 smd roundrect (at -2.75 -6.75) (size 0.3 1) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 /~CE1))
    (pad 31 smd roundrect (at -3.25 -6.75) (size 0.3 1) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 18 /A10))
    (pad 32 smd roundrect (at -3.75 -6.75) (size 0.3 1) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 3 /~OE))
    (model ${KIPRJMOD}/3d/TSOP32_8x14.step
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 -90))
    )
  )
  (module 0_LOCAL:TSOP32-20mm (layer F.Cu) (tedit 5F8D318C)
    (at 149.25 99.695)
    (descr "Module CMS TSOP 32 pins")
    (tags "CMS TSOP")
    (attr virtual)
    (fp_text reference U1 (at -1.905 -0.508 90) (layer F.SilkS) hide)
    (fp_text value "FLASH 256Kx8 5v Parallel" (at 1.27 0 90) (layer F.Fab))
    (pad 1 smd roundrect (at -3.75 9.75) (size 0.3 1) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 17 /A11))
    (pad 2 smd roundrect (at -3.25 9.75) (size 0.3 1) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 19 /A9))
    (pad 3 smd roundrect (at -2.75 9.75) (size 0.3 1) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 20 /A8))
    (pad 4 smd roundrect (at -2.25 9.75) (size 0.3 1) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 15 /A13))
    (pad 5 smd roundrect (at -1.75 9.75) (size 0.3 1) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 14 /A14))
    (pad 6 smd roundrect (at -1.25 9.75) (size 0.3 1) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 30 /A17))
    (pad 7 smd roundrect (at -0.75 9.75) (size 0.3 1) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 31 /~WE))
    (pad 8 smd roundrect (at -0.25 9.75) (size 0.3 1) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 29 VDD))
    (pad 9 smd roundrect (at 0.25 9.75) (size 0.3 1) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
    (pad 10 smd roundrect (at 0.75 9.75) (size 0.3 1) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 12 /A16))
    (pad 11 smd roundrect (at 1.25 9.75) (size 0.3 1) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 13 /A15))
    (pad 12 smd roundrect (at 1.75 9.75) (size 0.3 1) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 16 /A12))
    (pad 13 smd roundrect (at 2.25 9.75) (size 0.3 1) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 21 /A7))
    (pad 14 smd roundrect (at 2.75 9.75) (size 0.3 1) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 22 /A6))
    (pad 15 smd roundrect (at 3.25 9.75) (size 0.3 1) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 23 /A5))
    (pad 16 smd roundrect (at 3.75 9.75) (size 0.3 1) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 24 /A4))
    (pad 17 smd roundrect (at 3.75 -9.75) (size 0.3 1) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 25 /A3))
    (pad 18 smd roundrect (at 3.25 -9.75) (size 0.3 1) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 26 /A2))
    (pad 19 smd roundrect (at 2.75 -9.75) (size 0.3 1) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 27 /A1))
    (pad 20 smd roundrect (at 2.25 -9.75) (size 0.3 1) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 28 /A0))
    (pad 21 smd roundrect (at 1.75 -9.75) (size 0.3 1) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 4 /D0))
    (pad 22 smd roundrect (at 1.25 -9.75) (size 0.3 1) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 5 /D1))
    (pad 23 smd roundrect (at 0.75 -9.75) (size 0.3 1) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 6 /D2))
    (pad 24 smd roundrect (at 0.25 -9.75) (size 0.3 1) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 GND))
    (pad 25 smd roundrect (at -0.25 -9.75) (size 0.3 1) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 7 /D3))
    (pad 26 smd roundrect (at -0.75 -9.75) (size 0.3 1) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 8 /D4))
    (pad 27 smd roundrect (at -1.25 -9.75) (size 0.3 1) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 9 /D5))
    (pad 28 smd roundrect (at -1.75 -9.75) (size 0.3 1) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 10 /D6))
    (pad 29 smd roundrect (at -2.25 -9.75) (size 0.3 1) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 11 /D7))
    (pad 30 smd roundrect (at -2.75 -9.75) (size 0.3 1) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 /~CE1))
    (pad 31 smd roundrect (at -3.25 -9.75) (size 0.3 1) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 18 /A10))
    (pad 32 smd roundrect (at -3.75 -9.75) (size 0.3 1) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 3 /~OE))
    (model ${KIPRJMOD}/3d/TSOP32_8X20.step_x
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 -90))
    )
  )
  (module 0_LOCAL:JP2 (layer F.Cu) (tedit 5F8B1E86)
    (at 147.32 116.205 90)
    (fp_text reference JP1 (at 0 1.5 90) (layer F.SilkS) hide)
    (fp_text value Write-Enable (at 0 1.5 90) (layer F.SilkS) hide)
    (pad 1 thru_hole circle (at -1.27 0 90) (size 1.524 1.524) (drill 0.9144) (layers *.Cu *.Mask)
      (net 32 /R~W))
    (pad 2 thru_hole circle (at 1.27 0 90) (size 1.524 1.524) (drill 0.9144) (layers *.Cu *.Mask)
      (net 31 /~WE))
  )
  (module 0_LOCAL:PinSocket_1x38x1.27_edge_s (layer F.Cu) (tedit 5F7C31EE)
    (at 158.75 99.695)
    (descr "Through hole straight socket strip, 1x38, 1.27mm pitch, single row")
    (tags "Through hole socket strip THT 1x38 1.27mm single row")
    (attr smd)
    (fp_text reference J1 (at -2.8956 4.4196 -90) (layer F.SilkS) hide)
    (fp_text value Conn_01x38_Female (at -2.921 23.114 -90) (layer F.Fab))
    (fp_text user "pins 6.0mm" (at 9.8425 -20.574 -90) (layer F.Fab))
    (fp_text user "Height 8.5mm, Bottom 2.5mm" (at 7.112 -30.0355 -90) (layer F.Fab))
    (fp_text user "samtec header" (at 8.001 -28.956 -90) (layer F.Fab))
    (fp_text user "Height 4.4mm, Bottom 0mm" (at 3.2385 -29.718 -90) (layer F.Fab))
    (fp_text user "generic header" (at 4.1275 -28.956 -90) (layer F.Fab))
    (fp_text user %R (at 0 -1.695) (layer F.Fab) hide)
    (pad 1 smd roundrect (at -1.57 -23.495) (size 3.048 0.762) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.1)
      (net 1 GND))
    (pad 2 smd oval (at -1.57 -22.225) (size 3.048 0.762) (layers F.Cu F.Paste F.Mask))
    (pad 3 smd oval (at -1.57 -20.955) (size 3.048 0.762) (layers F.Cu F.Paste F.Mask))
    (pad 4 smd oval (at -1.57 -19.685) (size 3.048 0.762) (layers F.Cu F.Paste F.Mask)
      (net 2 /~CE1))
    (pad 5 smd oval (at -1.57 -18.415) (size 3.048 0.762) (layers F.Cu F.Paste F.Mask)
      (net 3 /~OE))
    (pad 6 smd oval (at -1.57 -17.145) (size 3.048 0.762) (layers F.Cu F.Paste F.Mask)
      (net 4 /D0))
    (pad 7 smd oval (at -1.57 -15.875) (size 3.048 0.762) (layers F.Cu F.Paste F.Mask)
      (net 5 /D1))
    (pad 8 smd oval (at -1.57 -14.605) (size 3.048 0.762) (layers F.Cu F.Paste F.Mask)
      (net 6 /D2))
    (pad 9 smd oval (at -1.57 -13.335) (size 3.048 0.762) (layers F.Cu F.Paste F.Mask)
      (net 7 /D3))
    (pad 10 smd oval (at -1.57 -12.065) (size 3.048 0.762) (layers F.Cu F.Paste F.Mask)
      (net 8 /D4))
    (pad 11 smd oval (at -1.57 -10.795) (size 3.048 0.762) (layers F.Cu F.Paste F.Mask)
      (net 9 /D5))
    (pad 12 smd oval (at -1.57 -9.525) (size 3.048 0.762) (layers F.Cu F.Paste F.Mask)
      (net 10 /D6))
    (pad 13 smd oval (at -1.57 -8.255) (size 3.048 0.762) (layers F.Cu F.Paste F.Mask)
      (net 11 /D7))
    (pad 14 smd oval (at -1.57 -6.985) (size 3.048 0.762) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 15 smd oval (at -1.57 -5.715) (size 3.048 0.762) (layers F.Cu F.Paste F.Mask))
    (pad 16 smd oval (at -1.57 -4.445) (size 3.048 0.762) (layers F.Cu F.Paste F.Mask))
    (pad 17 smd oval (at -1.57 -3.175) (size 3.048 0.762) (layers F.Cu F.Paste F.Mask)
      (net 30 /A17))
    (pad 18 smd oval (at -1.57 -1.905) (size 3.048 0.762) (layers F.Cu F.Paste F.Mask)
      (net 12 /A16))
    (pad 19 smd oval (at -1.57 -0.635) (size 3.048 0.762) (layers F.Cu F.Paste F.Mask)
      (net 13 /A15))
    (pad 20 smd oval (at -1.57 0.635) (size 3.048 0.762) (layers F.Cu F.Paste F.Mask)
      (net 14 /A14))
    (pad 21 smd oval (at -1.57 1.905) (size 3.048 0.762) (layers F.Cu F.Paste F.Mask)
      (net 15 /A13))
    (pad 22 smd oval (at -1.57 3.175) (size 3.048 0.762) (layers F.Cu F.Paste F.Mask)
      (net 16 /A12))
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