RPUadpt
RPUBUS.ORG
14226^5
RX
TX
2
3
4
5
6
7
8
9
10
11
12
SDA
SCL
VIN
0V
0V
5V
!RESET
IOREF
IOREF
MOSI
0V
!RESET
SCK
MISO
MNG_ICSP
MNG_LED
100Ω
TERM-
INATIONS
-RX
+RX
-DTR
-TX
+DTR
+TX
RD
13
ADC6
ADC7
0V
0V
HOST_RX
HOST_TX
3V3
0V
ADC5
ADC4
ADC3
ADC2
ADC1
ADC0
!RST
SCK
MISO
MOSI
3V3
HOST_!DSR
HOST_!RTS
HOST_!DTR
SDA1
SCL1
OC1A
RPU_AREF
RPUadpt
RPUBUS.ORG
+5V
HOST_!CTS
HOST_0V
ICP1
DTR
TXD
DTR
RXD
<pre>POWER SUPPLIE DC 2 DC
DIN rail mount units are for schmatics only
USE AT YOUR OWN RISK...
Copyright (C) 2013 Ronald Steven Sutherland
Permission is granted to copy, distribute and/or modify this document
under the terms of the GNU Free Documentation License, Version 1.2 or
any later version published by the Free Software Foundation; with no
Invariant Sections, no Front-Cover Texts, and no Back-Cover Texts. A
copy of the license is included in the section entitled "GNU Free
Documentation License".
<pre>Small Outline SOT23-5,SOT25,SC-74A
>NAME
<pre> MULTILAYER CERAMIC CHIP CAPACITORS
Type: C1005 [EIA CC0402], C1608 [EIA CC0603], C2012 [EIA CC0805],
C3216 [EIA CC1206], C3225 [EIA CC1210], C4532 [EIA CC1812], C5750 [EIA CC2220]
CH 0±60 ppm/°C -25 to +85°C
C0G 0±30 ppm/°C -55 to +125°C
JB ±10% -25 to +85°C
X5R ±15% -55 to +85°C
X6S ±22% -55 to +105°C
X7R ±15% -55 to +125°C
X7S ±22% -55 to +125°C
X7T +22/-33% -55 to +125°C
TDK voltage cods
0G 4V
0J 6.3V
1A 10V
1C 16V
1E 25V
1V 35V
1H 50V
2A 100V
2E 250V
2V 350V
2W 450V
2J 630V
NOTE: rounded pads... http://www.kemet.com/kemet/web/homepage/kfbk3.nsf/vaFeedbackFAQ/2209BDBA03843BBF85256BCD004EBC11/$file/f2100e.pdf
See section on Tombstoneing. Lead free solder may not wet edges, and IPC does not allow exposed copper.
My (rsutherland@epccs) experience suggest highly rounded pads reduce solder beads that can be extruded along edges of larger capacitors (0805).
USE AT YOUR OWN RISK...
Copyright (C) 2013 Ronald Steven Sutherland
Released under the Creative Commons
Attribution Share-Alike 3.0 License
http://creativecommons.org/licenses/by-sa/3.0
<pre>EIA 0603 (Metric Code Size 1608) Ceramic Chip Capacitor
rounded pads are added in IPC 782 rev A, this pad was on Arduino Due and may have originated from Sparkfun.
http://www.kemet.com/kemet/web/homepage/kfbk3.nsf/vaFeedbackFAQ/2209BDBA03843BBF85256BCD004EBC11/$file/f2100e.pdf
>NAME
>VALUE
<pre>Tantalum Electrolytic Capacitors
EIA Code Case Code L W H W1 A
Tolerance ±0.2 +0.2/–0.1 +0.2/–0.1 +0.2 +0.3/–0.2
3216-10 I, K 3.2 1.6 1.0 (max) 1.2 0.8
3216-12 S 3.2 1.6 1.2 (max) 1.2 0.8
3216-18 A 3.2 1.6 1.6 1.2 0.8
3528-12 T 3.5 2.8 1.2 (max) 2.2 0.8
3528-15 M, H 3.5 2.8 1.5 (max) 2.2 0.8
3528-21 B 3.5 2.8 1.9 2.2 0.8
6032-15 U, W 6.0 3.2 1.5 (max) 2.2 1.3
6032-28 C 6.0 3.2 2.6 2.2 1.3
7343-20 V, Y 7.3 4.3 2.0 (max) 2.4 1.3
7343-31 D 7.3 4.3 2.9 2.4 1.3
7343-43 X, E 7.3 4.3 4.1 2.4 1.3
Metric [inch]
2013 [0805]
3216 [1206]
3528 [1411]
6032 [2413]
7343 [2917]
USE AT YOUR OWN RISK...
Copyright (C) 2013 Ronald Steven Sutherland
Released under the Creative Commons
Attribution Share-Alike 3.0 License
http://creativecommons.org/licenses/by-sa/3.0
<pre>3.2mm x 1.6mm
Surface mount dimensions (EIA standard package sizes)
EIA Code Case Code L W H W1 A
Tolerance ±0.2 +0.2/–0.1 +0.2/–0.1 +0.2 +0.3/–0.2
3216-10 I, K 3.2 1.6 1.0 (max) 1.2 0.8
3216-12 S, P 3.2 1.6 1.2 (max) 1.2 0.8
3216-18 A 3.2 1.6 1.6 1.2 0.8
Note 3.2mm x 1.6mm is about 1206 (or .012 x .006 in)
>NAME
>VALUE
<pre>CHIP RESISTOR
NOTE: rounded pads... http://www.kemet.com/kemet/web/homepage/kfbk3.nsf/vaFeedbackFAQ/2209BDBA03843BBF85256BCD004EBC11/$file/f2100e.pdf
See section on Tombstoneing. Lead free solder may not wet edges, and IPC does not allow exposed copper.
My (rsutherland@epccs) experience suggest highly rounded pads reduce solder beads that can be extruded along edges of larger capacitors (0805).
USE AT YOUR OWN RISK...
Copyright (C) 2013 Ronald Steven Sutherland
Permission is granted to copy, distribute and/or modify this document
under the terms of the GNU Free Documentation License, Version 1.2 or
any later version published by the Free Software Foundation; with no
Invariant Sections, no Front-Cover Texts, and no Back-Cover Texts. A
copy of the license is included in the section entitled "GNU Free
Documentation License".
<pre>EIA 0805 (Metric Code Size 2012) Ceramic Chip
rounded pads are added in IPC 782 rev A
http://www.kemet.com/kemet/web/homepage/kfbk3.nsf/vaFeedbackFAQ/2209BDBA03843BBF85256BCD004EBC11/$file/f2100e.pdf
>NAME
>VALUE
<pre>HEADER 2.54MM center to center
USE AT YOUR OWN RISK...
Copyright (C) 2013 Ronald Steven Sutherland
Released under the Creative Commons
Attribution Share-Alike 3.0 License
http://creativecommons.org/licenses/by-sa/3.0
<pre>8 PIN
.1" CENTER
0.040" DRILL
auto PAD
http://www.sullinscorp.com/catalogs/78_Page80-81_HEADER_.100_2.54mm_FEMALE.pdf
>NAME
<pre>10 PIN
.1" CENTER
0.040 DRILL
auto PAD
http://www.sullinscorp.com/catalogs/78_Page80-81_HEADER_.100_2.54mm_FEMALE.pdf
>NAME
>NAME
<pre>POWER SUPPLIE DC 2 DC
DIN rail mount units are for schmatics only
USE AT YOUR OWN RISK...
Copyright (C) 2013 Ronald Steven Sutherland
Released under the Creative Commons
Attribution Share-Alike 3.0 License
http://creativecommons.org/licenses/by-sa/3.0
<pre>RJ45J [ASSMANN,A-2014-2-4-R] JACK MODULAR VERT PCB 8P8C UNSHIELD
mount hole was 3.2mm but that is an odd size that got rounded down to .125" so the
hole is now dril size 30 (.1285") and I hope it does not get rounded down...
>NAME
<pre>Transceiver (both transmitter and a receiver)
http://en.wikipedia.org/wiki/Transceiver
USE AT YOUR OWN RISK...
Copyright (C) 2013 Ronald Steven Sutherland
Released under the Creative Commons
Attribution Share-Alike 3.0 License
http://creativecommons.org/licenses/by-sa/3.0
<pre>8POS Standard SMALLl OUTLINE Package (SO/SOIC) Narrow Body
>NAME
<pre>N-CHANNEL MOSFET
ENHANCEMENT MODE is shown with a open/broken channel
DEPLETION MODE is shown with a closed/complete channel thus the idea of being on with zero gate voltage.
USE AT YOUR OWN RISK...
Copyright (C) 2013 Ronald Steven Sutherland
Released under the Creative Commons
Attribution Share-Alike 3.0 License
http://creativecommons.org/licenses/by-sa/3.0
<pre>SOT23 (based on SOT23-6) pin 3 is alone
http://www.diodes.com/_files/zetex_files/pack/SOT23-6.pdf
center(1) to center(2,3) 2.2 mm
center(2) to center(3) 1.9mm
pad .65X x 1.06Y mm
>NAME
>VALUE
<pre>Arduino Footprint
Standard Interface
USE AT YOUR OWN RISK...
Copyright (C) 2013 Ronald Steven Sutherland
Released under the Creative Commons
Attribution Share-Alike 3.0 License
http://creativecommons.org/licenses/by-sa/3.0
<pre>UNO R3 board footprint
INT0 D2
OC2B/INT1 D3
T0 D4
T1/OC0B D5
OC0A D6
D7
ICP1 B0
OC1A B1
B4
B5
C0 ADC0
C1 ADC1
C2 ADC2
C3 ADC3
!RESET!
3V3
5V
GND
GND
VIN
AREF
IOREF
NC
TX D1
RX D0
OC1B B2
OC2A B3
GND
SDA
SCL
C4 ADC4
C5 ADC5
MISO
SCK
!RESET
VCC
MOSI
GND
<pre>Fiducianl Mark
USE AT YOUR OWN RISK...
Copyright (C) 2013 Ronald Steven Sutherland
Permission is granted to copy, distribute and/or modify this document
under the terms of the GNU Free Documentation License, Version 1.2 or
any later version published by the Free Software Foundation; with no
Invariant Sections, no Front-Cover Texts, and no Back-Cover Texts. A
copy of the license is included in the section entitled "GNU Free
Documentation License".
<pre>Fiducian R=1.27mm
STOP=2.54mm
It is up to designer to not put traces under Fiducial (i.e. Void or sold plane only)
Autorouter restricted areas are defined as RECTangles, POLYGONs, or CIRCLEs on the
tRestrict, bRestrict, or vRestrict layers.
<pre>Logic
USE AT YOUR OWN RISK...
This was form cadsoft libraian, but much of it is not valid, I have only
looked at parts I'm using so far...
Copyright (C) 2013 Ronald Steven Sutherland
Released under the Creative Commons
Attribution Share-Alike 3.0 License
http://creativecommons.org/licenses/by-sa/3.0
<pre>14POS SMALL OUTLINE (14SO[IC])
pitch 1.27
pad .6mm X1.8mm
body-Center to pad-Center 2.7mm
referance TI's SOIC package, but pads are little larger and rounded
>NAME
<pre>Switch Tactile/Snap-acting
USE AT YOUR OWN RISK...
Copyright (C) 2013 Ronald Steven Sutherland
Released under the Creative Commons
Attribution Share-Alike 3.0 License
http://creativecommons.org/licenses/by-sa/3.0
<pre>SMD DIP SWITCH 1POS
SMDIP1S [E-SWITCH,KAE01SGGT]SWITCH 1 SPST 25MA 24V SMDIP
ON
>NAME
1
<pre>MCU's 8bit AVR
USE AT YOUR OWN RISK...
Copyright (C) 2013 Ronald Steven Sutherland
Released under the Creative Commons
Attribution Share-Alike 3.0 License
http://creativecommons.org/licenses/by-sa/3.0
>NAME
<B>Thin Plasic Quad Flat Package</B> Grid 0.8 mm
>NAME
>NAME
<pre>GEN PURPOSE DIODE
USE AT YOUR OWN RISK...
Copyright (C) 2013 Ronald Steven Sutherland
Released under the Creative Commons
Attribution Share-Alike 3.0 License
http://creativecommons.org/licenses/by-sa/3.0
<pre>SOD123
http://www.diodes.com/datasheets/ap02001.pdf
>NAME
<pre>Light-emitting diode
http://en.wikipedia.org/wiki/Light-emitting_diode
USE AT YOUR OWN RISK...
Copyright (C) 2013 Ronald Steven Sutherland
Released under the Creative Commons
Attribution Share-Alike 3.0 License
http://creativecommons.org/licenses/by-sa/3.0
<pre>EIA 0805 (Metric Code Size 2012) Ceramic Chip
rounded pads are added in IPC 782 rev A, this pad was on Arduino and may have originated from Sparkfun.
http://www.kemet.com/kemet/web/homepage/kfbk3.nsf/vaFeedbackFAQ/2209BDBA03843BBF85256BCD004EBC11/$file/f2100e.pdf
>NAME
<pre>Test Pins/Pads
Cream on SMD OFF
Attribute TP_SIGNAL_NAME
USE AT YOUR OWN RISK...
Copyright (C) 2015 Ronald Sutherland
Released under the Creative Commons
Attribution-ShareAlike 4.0 International
http://creativecommons.org/licenses/by-sa/4.0
<pre>TEST PAD 20AWG
>NAME
<pre>CRYSTAL
i.e. NDK NX3225SA-12.000000MHZ-STD-CSR-1
USE AT YOUR OWN RISK...
Copyright (C) 2014 Ronald Steven Sutherland
Released under the Creative Commons
Attribution Share-Alike 3.0 License
http://creativecommons.org/licenses/by-sa/3.0
<pre>SMD CRYSTAL
16MHZ20 [ECS,ECS-160-20-3X-TR] CRYSTAL 16MHZ 20PF 30PPM CSM-3X
Source: www.ecsxtal.com .. Crystal 16MHz CSM-3X.PDF
>NAME
>VALUE
<b>EAGLE Design Rules</b>
<p>
Die Standard-Design-Rules sind so gewählt, dass sie für
die meisten Anwendungen passen. Sollte ihre Platine
besondere Anforderungen haben, treffen Sie die erforderlichen
Einstellungen hier und speichern die Design Rules unter
einem neuen Namen ab.
<b>EAGLE Design Rules</b>
<p>
The default Design Rules have been set to cover
a wide range of applications. Your particular design
may have different requirements, so please make the
necessary adjustments and save your customized
design rules under a new name.
Since Version 6.2.2 text objects can contain more than one line,
which will not be processed correctly with this version.