(kicad_pcb (version 20171130) (host pcbnew 5.1.6-c6e7f7d~87~ubuntu18.04.1)
  (general
    (thickness 1.6)
    (drawings 16)
    (tracks 154)
    (zones 0)
    (modules 18)
    (nets 63)
  )
  (page A4)
  (layers
    (0 F.Cu signal)
    (31 B.Cu signal)
    (32 B.Adhes user hide)
    (33 F.Adhes user hide)
    (34 B.Paste user hide)
    (35 F.Paste user hide)
    (36 B.SilkS user)
    (37 F.SilkS user)
    (38 B.Mask user hide)
    (39 F.Mask user hide)
    (40 Dwgs.User user hide)
    (41 Cmts.User user hide)
    (42 Eco1.User user hide)
    (43 Eco2.User user hide)
    (44 Edge.Cuts user)
    (45 Margin user hide)
    (46 B.CrtYd user)
    (47 F.CrtYd user)
    (48 B.Fab user hide)
    (49 F.Fab user hide)
  )
  (setup
    (last_trace_width 0.25)
    (user_trace_width 2.76)
    (user_trace_width 5.6)
    (trace_clearance 0.2)
    (zone_clearance 0.254)
    (zone_45_only no)
    (trace_min 0.2)
    (via_size 0.8)
    (via_drill 0.4)
    (via_min_size 0.4)
    (via_min_drill 0.3)
    (uvia_size 0.3)
    (uvia_drill 0.1)
    (uvias_allowed no)
    (uvia_min_size 0.2)
    (uvia_min_drill 0.1)
    (edge_width 0.05)
    (segment_width 0.2)
    (pcb_text_width 0.3)
    (pcb_text_size 1.5 1.5)
    (mod_edge_width 0.12)
    (mod_text_size 1 1)
    (mod_text_width 0.15)
    (pad_size 0.5 1.9)
    (pad_drill 0)
    (pad_to_mask_clearance 0.05)
    (aux_axis_origin 0 0)
    (visible_elements FFFFFF7F)
    (pcbplotparams
      (layerselection 0x010fc_ffffffff)
      (usegerberextensions false)
      (usegerberattributes true)
      (usegerberadvancedattributes true)
      (creategerberjobfile true)
      (excludeedgelayer true)
      (linewidth 0.100000)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (padsonsilk false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 1)
      (scaleselection 1)
      (outputdirectory ""))
  )
  (net 0 "")
  (net 1 +5V)
  (net 2 "Net-(D1-Pad1)")
  (net 3 GND)
  (net 4 "Net-(D2-Pad1)")
  (net 5 "Net-(D2-Pad5)")
  (net 6 "Net-(D2-Pad2)")
  (net 7 "Net-(U1-Pad14)")
  (net 8 "Net-(U1-Pad15)")
  (net 9 "Net-(U1-Pad24)")
  (net 10 "Net-(U1-Pad13)")
  (net 11 "Net-(U1-Pad16)")
  (net 12 "Net-(U1-Pad11)")
  (net 13 "Net-(U1-Pad9)")
  (net 14 "Net-(U1-Pad8)")
  (net 15 "Net-(U1-Pad7)")
  (net 16 "Net-(U1-Pad5)")
  (net 17 +3V3)
  (net 18 "Net-(J3-Pad3)")
  (net 19 "Net-(J3-Pad2)")
  (net 20 "Net-(J3-Pad1)")
  (net 21 "Net-(J4-Pad3)")
  (net 22 /P29)
  (net 23 /P30)
  (net 24 "Net-(U1-Pad33)")
  (net 25 "Net-(U1-Pad31)")
  (net 26 "Net-(U1-Pad30)")
  (net 27 "Net-(U1-Pad29)")
  (net 28 "Net-(U1-Pad28)")
  (net 29 "Net-(U1-Pad27)")
  (net 30 "Net-(U1-Pad26)")
  (net 31 "Net-(U1-Pad25)")
  (net 32 "Net-(U1-Pad23)")
  (net 33 "Net-(U3-Pad44)")
  (net 34 "Net-(U3-Pad43)")
  (net 35 "Net-(U3-Pad42)")
  (net 36 "Net-(U3-Pad41)")
  (net 37 "Net-(U3-Pad38)")
  (net 38 /P28)
  (net 39 "Net-(U3-Pad34)")
  (net 40 "Net-(U3-Pad33)")
  (net 41 "Net-(U3-Pad32)")
  (net 42 "Net-(U3-Pad31)")
  (net 43 "Net-(U3-Pad29)")
  (net 44 "Net-(U3-Pad28)")
  (net 45 "Net-(U3-Pad26)")
  (net 46 "Net-(U3-Pad25)")
  (net 47 "Net-(U3-Pad24)")
  (net 48 "Net-(U3-Pad23)")
  (net 49 "Net-(U3-Pad22)")
  (net 50 "Net-(U3-Pad21)")
  (net 51 "Net-(U3-Pad20)")
  (net 52 "Net-(U3-Pad19)")
  (net 53 "Net-(U3-Pad13)")
  (net 54 "Net-(U3-Pad12)")
  (net 55 "Net-(U3-Pad11)")
  (net 56 "Net-(U3-Pad10)")
  (net 57 "Net-(U3-Pad9)")
  (net 58 "Net-(U3-Pad4)")
  (net 59 "Net-(U3-Pad3)")
  (net 60 "Net-(U3-Pad2)")
  (net 61 "Net-(U3-Pad1)")
  (net 62 "Net-(U4-Pad3)")
  (net_class Default "This is the default net class."
    (clearance 0.2)
    (trace_width 0.25)
    (via_dia 0.8)
    (via_drill 0.4)
    (uvia_dia 0.3)
    (uvia_drill 0.1)
    (add_net +3V3)
    (add_net +5V)
    (add_net /P28)
    (add_net /P29)
    (add_net /P30)
    (add_net GND)
    (add_net "Net-(D1-Pad1)")
    (add_net "Net-(D2-Pad1)")
    (add_net "Net-(D2-Pad2)")
    (add_net "Net-(D2-Pad5)")
    (add_net "Net-(J3-Pad1)")
    (add_net "Net-(J3-Pad2)")
    (add_net "Net-(J3-Pad3)")
    (add_net "Net-(J4-Pad3)")
    (add_net "Net-(U1-Pad11)")
    (add_net "Net-(U1-Pad13)")
    (add_net "Net-(U1-Pad14)")
    (add_net "Net-(U1-Pad15)")
    (add_net "Net-(U1-Pad16)")
    (add_net "Net-(U1-Pad23)")
    (add_net "Net-(U1-Pad24)")
    (add_net "Net-(U1-Pad25)")
    (add_net "Net-(U1-Pad26)")
    (add_net "Net-(U1-Pad27)")
    (add_net "Net-(U1-Pad28)")
    (add_net "Net-(U1-Pad29)")
    (add_net "Net-(U1-Pad30)")
    (add_net "Net-(U1-Pad31)")
    (add_net "Net-(U1-Pad33)")
    (add_net "Net-(U1-Pad5)")
    (add_net "Net-(U1-Pad7)")
    (add_net "Net-(U1-Pad8)")
    (add_net "Net-(U1-Pad9)")
    (add_net "Net-(U3-Pad1)")
    (add_net "Net-(U3-Pad10)")
    (add_net "Net-(U3-Pad11)")
    (add_net "Net-(U3-Pad12)")
    (add_net "Net-(U3-Pad13)")
    (add_net "Net-(U3-Pad19)")
    (add_net "Net-(U3-Pad2)")
    (add_net "Net-(U3-Pad20)")
    (add_net "Net-(U3-Pad21)")
    (add_net "Net-(U3-Pad22)")
    (add_net "Net-(U3-Pad23)")
    (add_net "Net-(U3-Pad24)")
    (add_net "Net-(U3-Pad25)")
    (add_net "Net-(U3-Pad26)")
    (add_net "Net-(U3-Pad28)")
    (add_net "Net-(U3-Pad29)")
    (add_net "Net-(U3-Pad3)")
    (add_net "Net-(U3-Pad31)")
    (add_net "Net-(U3-Pad32)")
    (add_net "Net-(U3-Pad33)")
    (add_net "Net-(U3-Pad34)")
    (add_net "Net-(U3-Pad38)")
    (add_net "Net-(U3-Pad4)")
    (add_net "Net-(U3-Pad41)")
    (add_net "Net-(U3-Pad42)")
    (add_net "Net-(U3-Pad43)")
    (add_net "Net-(U3-Pad44)")
    (add_net "Net-(U3-Pad9)")
    (add_net "Net-(U4-Pad3)")
  )
  (module digi_footprints:XCVR_XB3-24Z8CM-J (layer F.Cu) (tedit 600E60D7)
    (at 113.792 60.452)
    (fp_text reference U1 (at -2.919 -11.4982) (layer F.SilkS))
    (fp_text value XB3-24Z8CM-J (at 6.5394 11.4018) (layer F.Fab))
    (pad 34 smd rect (at 6.5532 -8.3566) (size 1.4478 0.8382) (layers F.Cu F.Paste F.Mask)
      (net 3 GND))
    (pad 33 smd rect (at 6.5532 -7.09168) (size 1.4478 0.8382) (layers F.Cu F.Paste F.Mask)
      (net 24 "Net-(U1-Pad33)"))
    (pad 32 smd rect (at 6.5532 -5.842) (size 1.4478 0.8382) (layers F.Cu F.Paste F.Mask)
      (net 3 GND))
    (pad 31 smd rect (at 6.5532 -4.59232) (size 1.4478 0.8382) (layers F.Cu F.Paste F.Mask)
      (net 25 "Net-(U1-Pad31)"))
    (pad 30 smd rect (at 6.5532 -3.34264) (size 1.4478 0.8382) (layers F.Cu F.Paste F.Mask)
      (net 26 "Net-(U1-Pad30)"))
    (pad 29 smd rect (at 6.5532 -2.09296) (size 1.4478 0.8382) (layers F.Cu F.Paste F.Mask)
      (net 27 "Net-(U1-Pad29)"))
    (pad 28 smd rect (at 6.5532 -0.843281) (size 1.4478 0.8382) (layers F.Cu F.Paste F.Mask)
      (net 28 "Net-(U1-Pad28)"))
    (pad 27 smd rect (at 6.5532 0.4064) (size 1.4478 0.8382) (layers F.Cu F.Paste F.Mask)
      (net 29 "Net-(U1-Pad27)"))
    (pad 26 smd rect (at 6.5532 1.65608) (size 1.4478 0.8382) (layers F.Cu F.Paste F.Mask)
      (net 30 "Net-(U1-Pad26)"))
    (pad 25 smd rect (at 6.5532 2.90576) (size 1.4478 0.8382) (layers F.Cu F.Paste F.Mask)
      (net 31 "Net-(U1-Pad25)"))
    (pad 24 smd rect (at 6.5532 4.15544) (size 1.4478 0.8382) (layers F.Cu F.Paste F.Mask)
      (net 9 "Net-(U1-Pad24)"))
    (pad 23 smd rect (at 6.5532 5.40512) (size 1.4478 0.8382) (layers F.Cu F.Paste F.Mask)
      (net 32 "Net-(U1-Pad23)"))
    (pad 22 smd rect (at 6.5532 6.6548) (size 1.4478 0.8382) (layers F.Cu F.Paste F.Mask))
    (pad 21 smd rect (at 6.5532 7.90448) (size 1.4478 0.8382) (layers F.Cu F.Paste F.Mask)
      (net 3 GND))
    (pad 20 smd rect (at 4.3815 9.4361) (size 0.8382 1.4478) (layers F.Cu F.Paste F.Mask))
    (pad 19 smd rect (at 3.11658 9.4361) (size 0.8382 1.4478) (layers F.Cu F.Paste F.Mask))
    (pad 18 smd rect (at 1.8669 9.4361) (size 0.8382 1.4478) (layers F.Cu F.Paste F.Mask))
    (pad 17 smd rect (at 0.617219 9.4361) (size 0.8382 1.4478) (layers F.Cu F.Paste F.Mask))
    (pad 16 smd rect (at -0.632459 9.4361) (size 0.8382 1.4478) (layers F.Cu F.Paste F.Mask)
      (net 11 "Net-(U1-Pad16)"))
    (pad 15 smd rect (at -1.88214 9.4361) (size 0.8382 1.4478) (layers F.Cu F.Paste F.Mask)
      (net 8 "Net-(U1-Pad15)"))
    (pad 14 smd rect (at -3.13182 9.4361) (size 0.8382 1.4478) (layers F.Cu F.Paste F.Mask)
      (net 7 "Net-(U1-Pad14)"))
    (pad 13 smd rect (at -4.3815 9.4361) (size 0.8382 1.4478) (layers F.Cu F.Paste F.Mask)
      (net 10 "Net-(U1-Pad13)"))
    (pad 12 smd rect (at -6.5532 7.90448) (size 1.4478 0.8382) (layers F.Cu F.Paste F.Mask)
      (net 3 GND))
    (pad 11 smd rect (at -6.5532 6.6548) (size 1.4478 0.8382) (layers F.Cu F.Paste F.Mask)
      (net 12 "Net-(U1-Pad11)"))
    (pad 10 smd rect (at -6.5532 5.40512) (size 1.4478 0.8382) (layers F.Cu F.Paste F.Mask)
      (net 3 GND))
    (pad 9 smd rect (at -6.5532 4.15544) (size 1.4478 0.8382) (layers F.Cu F.Paste F.Mask)
      (net 13 "Net-(U1-Pad9)"))
    (pad 8 smd rect (at -6.5532 2.90576) (size 1.4478 0.8382) (layers F.Cu F.Paste F.Mask)
      (net 14 "Net-(U1-Pad8)"))
    (pad 7 smd rect (at -6.5532 1.65608) (size 1.4478 0.8382) (layers F.Cu F.Paste F.Mask)
      (net 15 "Net-(U1-Pad7)"))
    (pad 6 smd rect (at -6.5532 0.4064) (size 1.4478 0.8382) (layers F.Cu F.Paste F.Mask)
      (net 18 "Net-(J3-Pad3)"))
    (pad 5 smd rect (at -6.5532 -0.843281) (size 1.4478 0.8382) (layers F.Cu F.Paste F.Mask)
      (net 16 "Net-(U1-Pad5)"))
    (pad 4 smd rect (at -6.5532 -2.09296) (size 1.4478 0.8382) (layers F.Cu F.Paste F.Mask)
      (net 19 "Net-(J3-Pad2)"))
    (pad 3 smd rect (at -6.5532 -3.34264) (size 1.4478 0.8382) (layers F.Cu F.Paste F.Mask)
      (net 20 "Net-(J3-Pad1)"))
    (pad 2 smd rect (at -6.5532 -4.59232) (size 1.4478 0.8382) (layers F.Cu F.Paste F.Mask)
      (net 17 +3V3))
    (pad 1 smd rect (at -6.5532 -5.842) (size 1.4478 0.8382) (layers F.Cu F.Paste F.Mask)
      (net 3 GND))
  )
  (module Capacitors_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer B.Cu) (tedit 5B301BBE)
    (at 119.681218 69.897218 315)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C3 (at 0 1.43 135) (layer B.SilkS))
    (fp_text value 0.1uF (at 0 -1.43 135) (layer B.Fab))
    (fp_text user %R (at 0 0 135) (layer B.Fab))
    (pad 2 smd roundrect (at 0.875 0 315) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 3 GND))
    (pad 1 smd roundrect (at -0.875 0 315) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 17 +3V3))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_PinHeader_2.54mm:PinHeader_1x04_P2.54mm_Vertical (layer F.Cu) (tedit 59FED5CC)
    (at 100.965 57.785)
    (descr "Through hole straight pin header, 1x04, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x04 2.54mm single row")
    (fp_text reference J3 (at 0 -2.33) (layer F.SilkS))
    (fp_text value "Xbee Prgrm" (at 0 9.95) (layer F.Fab))
    (fp_text user %R (at 0 3.81 90) (layer F.Fab))
    (pad 4 thru_hole oval (at 0 7.62) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 3 GND))
    (pad 3 thru_hole oval (at 0 5.08) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 18 "Net-(J3-Pad3)"))
    (pad 2 thru_hole oval (at 0 2.54) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 19 "Net-(J3-Pad2)"))
    (pad 1 thru_hole rect (at 0 0) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 20 "Net-(J3-Pad1)"))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x04_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer B.Cu) (tedit 5B301BBE)
    (at 121.412 55.88 45)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C2 (at 0 1.43 45) (layer B.SilkS))
    (fp_text value 0.1uF (at 0 -1.43 45) (layer B.Fab))
    (fp_text user %R (at 0 0 45) (layer B.Fab))
    (pad 2 smd roundrect (at 0.875 0 45) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 3 GND))
    (pad 1 smd roundrect (at -0.875 0 45) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 17 +3V3))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 117.856 82.042 270)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C6 (at 0 -1.43 90) (layer F.SilkS))
    (fp_text value 0.1uF (at 0 1.43 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0 270) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 3 GND))
    (pad 1 smd roundrect (at -0.875 0 270) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 +5V))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_PinHeader_2.54mm:PinHeader_1x04_P2.54mm_Vertical (layer F.Cu) (tedit 59FED5CC)
    (at 97.155 57.785)
    (descr "Through hole straight pin header, 1x04, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x04 2.54mm single row")
    (fp_text reference J4 (at 0 -2.33) (layer F.SilkS))
    (fp_text value "Prop Prgrm" (at 0 9.95) (layer F.Fab))
    (fp_text user %R (at 0 3.81 90) (layer F.Fab))
    (pad 4 thru_hole oval (at 0 7.62) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 3 GND))
    (pad 3 thru_hole oval (at 0 5.08) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 21 "Net-(J4-Pad3)"))
    (pad 2 thru_hole oval (at 0 2.54) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 22 /P29))
    (pad 1 thru_hole rect (at 0 0) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 23 /P30))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x04_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module digi_footprints:LQFP44-0.8-10X10MM (layer B.Cu) (tedit 600D1345)
    (at 114.046 61.976 315)
    (fp_text reference U3 (at -1.683133 7.432298 315) (layer B.SilkS))
    (fp_text value "MCU-P8X32A-Q44(LQFP44)" (at 6.099727 -0.182712 315) (layer B.Fab))
    (fp_text user 44 (at -4.50475 5.50581 315) (layer B.SilkS))
    (fp_text user 34 (at 5.00269 5.50296 315) (layer B.SilkS))
    (fp_text user 33 (at 5.50175 4.50144 315) (layer B.SilkS))
    (fp_text user 23 (at 5.501 -5.00091 315) (layer B.SilkS))
    (fp_text user 22 (at 5.007561 -6.50983 315) (layer B.SilkS))
    (fp_text user 12 (at -4.50017 -6.50025 315) (layer B.SilkS))
    (fp_text user 11 (at -6.51049 -5.00807 315) (layer B.SilkS))
    (pad 44 smd rect (at -4 5.7 315) (size 0.5 1.9) (layers B.Cu B.Paste B.Mask)
      (net 33 "Net-(U3-Pad44)"))
    (pad 43 smd rect (at -3.2 5.7 315) (size 0.5 1.9) (layers B.Cu B.Paste B.Mask)
      (net 34 "Net-(U3-Pad43)"))
    (pad 42 smd rect (at -2.4 5.7 315) (size 0.5 1.9) (layers B.Cu B.Paste B.Mask)
      (net 35 "Net-(U3-Pad42)"))
    (pad 41 smd rect (at -1.6 5.7 315) (size 0.5 1.9) (layers B.Cu B.Paste B.Mask)
      (net 36 "Net-(U3-Pad41)"))
    (pad 40 smd rect (at -0.8 5.7 315) (size 0.5 1.9) (layers B.Cu B.Paste B.Mask)
      (net 17 +3V3))
    (pad 39 smd rect (at 0 5.7 315) (size 0.5 1.9) (layers B.Cu B.Paste B.Mask)
      (net 3 GND))
    (pad 38 smd rect (at 0.8 5.7 315) (size 0.5 1.9) (layers B.Cu B.Paste B.Mask)
      (net 37 "Net-(U3-Pad38)"))
    (pad 37 smd rect (at 1.6 5.7 315) (size 0.5 1.9) (layers B.Cu B.Paste B.Mask)
      (net 23 /P30))
    (pad 36 smd rect (at 2.4 5.7 315) (size 0.5 1.9) (layers B.Cu B.Paste B.Mask)
      (net 22 /P29))
    (pad 35 smd rect (at 3.2 5.7 315) (size 0.5 1.9) (layers B.Cu B.Paste B.Mask)
      (net 38 /P28))
    (pad 34 smd rect (at 4 5.7 315) (size 0.5 1.9) (layers B.Cu B.Paste B.Mask)
      (net 39 "Net-(U3-Pad34)"))
    (pad 33 smd rect (at 5.7 4 315) (size 1.9 0.5) (layers B.Cu B.Paste B.Mask)
      (net 40 "Net-(U3-Pad33)"))
    (pad 32 smd rect (at 5.7 3.2 315) (size 1.9 0.5) (layers B.Cu B.Paste B.Mask)
      (net 41 "Net-(U3-Pad32)"))
    (pad 31 smd rect (at 5.7 2.4 315) (size 1.9 0.5) (layers B.Cu B.Paste B.Mask)
      (net 42 "Net-(U3-Pad31)"))
    (pad 30 smd rect (at 5.7 1.6 315) (size 1.9 0.5) (layers B.Cu B.Paste B.Mask)
      (net 17 +3V3))
    (pad 29 smd rect (at 5.7 0.8 315) (size 1.9 0.5) (layers B.Cu B.Paste B.Mask)
      (net 43 "Net-(U3-Pad29)"))
    (pad 28 smd rect (at 5.7 0 315) (size 1.9 0.5) (layers B.Cu B.Paste B.Mask)
      (net 44 "Net-(U3-Pad28)"))
    (pad 27 smd rect (at 5.7 -0.8 315) (size 1.9 0.5) (layers B.Cu B.Paste B.Mask)
      (net 3 GND))
    (pad 26 smd rect (at 5.7 -1.6 315) (size 1.9 0.5) (layers B.Cu B.Paste B.Mask)
      (net 45 "Net-(U3-Pad26)"))
    (pad 25 smd rect (at 5.7 -2.4 315) (size 1.9 0.5) (layers B.Cu B.Paste B.Mask)
      (net 46 "Net-(U3-Pad25)"))
    (pad 24 smd rect (at 5.7 -3.2 315) (size 1.9 0.5) (layers B.Cu B.Paste B.Mask)
      (net 47 "Net-(U3-Pad24)"))
    (pad 23 smd rect (at 5.7 -4 315) (size 1.9 0.5) (layers B.Cu B.Paste B.Mask)
      (net 48 "Net-(U3-Pad23)"))
    (pad 22 smd rect (at 4 -5.7 315) (size 0.5 1.9) (layers B.Cu B.Paste B.Mask)
      (net 49 "Net-(U3-Pad22)"))
    (pad 21 smd rect (at 3.2 -5.7 315) (size 0.5 1.9) (layers B.Cu B.Paste B.Mask)
      (net 50 "Net-(U3-Pad21)"))
    (pad 20 smd rect (at 2.4 -5.7 315) (size 0.5 1.9) (layers B.Cu B.Paste B.Mask)
      (net 51 "Net-(U3-Pad20)"))
    (pad 19 smd rect (at 1.6 -5.7 315) (size 0.5 1.9) (layers B.Cu B.Paste B.Mask)
      (net 52 "Net-(U3-Pad19)"))
    (pad 18 smd rect (at 0.8 -5.7 315) (size 0.5 1.9) (layers B.Cu B.Paste B.Mask)
      (net 17 +3V3))
    (pad 17 smd rect (at 0 -5.7 315) (size 0.5 1.9) (layers B.Cu B.Paste B.Mask)
      (net 3 GND))
    (pad 16 smd rect (at -0.8 -5.7 315) (size 0.5 1.9) (layers B.Cu B.Paste B.Mask)
      (net 6 "Net-(D2-Pad2)"))
    (pad 15 smd rect (at -1.6 -5.7 315) (size 0.5 1.9) (layers B.Cu B.Paste B.Mask)
      (net 20 "Net-(J3-Pad1)"))
    (pad 14 smd rect (at -2.4 -5.7 315) (size 0.5 1.9) (layers B.Cu B.Paste B.Mask)
      (net 19 "Net-(J3-Pad2)"))
    (pad 13 smd rect (at -3.2 -5.7 315) (size 0.5 1.9) (layers B.Cu B.Paste B.Mask)
      (net 53 "Net-(U3-Pad13)"))
    (pad 12 smd rect (at -4 -5.7 315) (size 0.5 1.9) (layers B.Cu B.Paste B.Mask)
      (net 54 "Net-(U3-Pad12)"))
    (pad 11 smd rect (at -5.7 -4 315) (size 1.9 0.5) (layers B.Cu B.Paste B.Mask)
      (net 55 "Net-(U3-Pad11)"))
    (pad 10 smd rect (at -5.7 -3.2 315) (size 1.9 0.5) (layers B.Cu B.Paste B.Mask)
      (net 56 "Net-(U3-Pad10)"))
    (pad 9 smd rect (at -5.7 -2.4 315) (size 1.9 0.5) (layers B.Cu B.Paste B.Mask)
      (net 57 "Net-(U3-Pad9)"))
    (pad 8 smd rect (at -5.7 -1.6 315) (size 1.9 0.5) (layers B.Cu B.Paste B.Mask)
      (net 17 +3V3))
    (pad 7 smd rect (at -5.7 -0.8 315) (size 1.9 0.5) (layers B.Cu B.Paste B.Mask)
      (net 21 "Net-(J4-Pad3)"))
    (pad 6 smd rect (at -5.7 0 315) (size 1.9 0.5) (layers B.Cu B.Paste B.Mask)
      (net 3 GND))
    (pad 5 smd rect (at -5.7 0.8 315) (size 1.9 0.5) (layers B.Cu B.Paste B.Mask)
      (net 3 GND))
    (pad 4 smd rect (at -5.7 1.6 315) (size 1.9 0.5) (layers B.Cu B.Paste B.Mask)
      (net 58 "Net-(U3-Pad4)"))
    (pad 3 smd rect (at -5.7 2.4 315) (size 1.9 0.5) (layers B.Cu B.Paste B.Mask)
      (net 59 "Net-(U3-Pad3)"))
    (pad 2 smd rect (at -5.7 3.2 315) (size 1.9 0.5) (layers B.Cu B.Paste B.Mask)
      (net 60 "Net-(U3-Pad2)"))
    (pad 1 smd rect (at -5.7 4 315) (size 1.9 0.5) (layers B.Cu B.Paste B.Mask)
      (net 61 "Net-(U3-Pad1)"))
  )
  (module Resistors_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer B.Cu) (tedit 5B301BBD)
    (at 119.888 74.168 90)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R1 (at 0 1.43 -90) (layer B.SilkS))
    (fp_text value 10k (at 0 -1.43 -90) (layer B.Fab))
    (fp_text user %R (at 0 0 -90) (layer B.Fab))
    (pad 2 smd roundrect (at 0.875 0 90) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 22 /P29))
    (pad 1 smd roundrect (at -0.875 0 90) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 17 +3V3))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 120.4325 74.676)
    (descr "Capacitor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C5 (at 0 -1.82) (layer F.SilkS))
    (fp_text value 22uF (at 0 1.82) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 1.4875 0) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 3 GND))
    (pad 1 smd roundrect (at -1.4875 0) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 17 +3V3))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module VREG_LM2937IMP-3:NOPB (layer F.Cu) (tedit 600E18C1)
    (at 112.966 77.194 180)
    (fp_text reference VR1 (at -0.025 -4.754) (layer F.SilkS))
    (fp_text value LM2937IMP-3.3_NOPB (at 11.405 4.365) (layer F.Fab))
    (pad 4 smd rect (at 2.9 0 180) (size 2.15 3.25) (layers F.Cu F.Paste F.Mask)
      (net 3 GND))
    (pad 3 smd rect (at -2.9 2.3 180) (size 2.15 0.95) (layers F.Cu F.Paste F.Mask)
      (net 17 +3V3))
    (pad 2 smd rect (at -2.9 0 180) (size 2.15 0.95) (layers F.Cu F.Paste F.Mask)
      (net 3 GND))
    (pad 1 smd rect (at -2.9 -2.3 180) (size 2.15 0.95) (layers F.Cu F.Paste F.Mask)
      (net 1 +5V))
  )
  (module Capacitors_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer B.Cu) (tedit 5B301BBE)
    (at 107.061 67.8815 225)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C1 (at 0 1.43 45) (layer B.SilkS))
    (fp_text value 0.1uF (at 0 -1.43 45) (layer B.Fab))
    (fp_text user %R (at 0 0 45) (layer B.Fab))
    (pad 2 smd roundrect (at 0.875 0 225) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 3 GND))
    (pad 1 smd roundrect (at -0.875 0 225) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 17 +3V3))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_SO:TSSOP-8_4.4x3mm_P0.65mm (layer B.Cu) (tedit 5E476F32)
    (at 113.284 74.168)
    (descr "TSSOP, 8 Pin (JEDEC MO-153 Var AA https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator ipc_gullwing_generator.py")
    (tags "TSSOP SO")
    (attr smd)
    (fp_text reference U4 (at 0 2.45) (layer B.SilkS))
    (fp_text value 24LC512 (at 0 -2.45) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 8 smd roundrect (at 2.8625 0.975) (size 1.475 0.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 17 +3V3))
    (pad 7 smd roundrect (at 2.8625 0.325) (size 1.475 0.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 3 GND))
    (pad 6 smd roundrect (at 2.8625 -0.325) (size 1.475 0.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 38 /P28))
    (pad 5 smd roundrect (at 2.8625 -0.975) (size 1.475 0.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 22 /P29))
    (pad 4 smd roundrect (at -2.8625 -0.975) (size 1.475 0.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 3 GND))
    (pad 3 smd roundrect (at -2.8625 -0.325) (size 1.475 0.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 62 "Net-(U4-Pad3)"))
    (pad 2 smd roundrect (at -2.8625 0.325) (size 1.475 0.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 3 GND))
    (pad 1 smd roundrect (at -2.8625 0.975) (size 1.475 0.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 3 GND))
    (model ${KISYS3DMOD}/Package_SO.3dshapes/TSSOP-8_4.4x3mm_P0.65mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer B.Cu) (tedit 5B301BBE)
    (at 108.6485 54.4195 135)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C4 (at 0 1.43 135) (layer B.SilkS))
    (fp_text value 0.1uF (at 0 -1.43 135) (layer B.Fab))
    (fp_text user %R (at 0 0 135) (layer B.Fab))
    (pad 2 smd roundrect (at 0.875 0 135) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 3 GND))
    (pad 1 smd roundrect (at -0.875 0 135) (size 1.05 0.95) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.25)
      (net 17 +3V3))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module digi_footprints:XTAL_ECS-50-20-5PX-TR (layer B.Cu) (tedit 600E2D65)
    (at 125.6665 63.373 270)
    (fp_text reference Y1 (at -3.029915 3.551635 270) (layer B.SilkS))
    (fp_text value Crystal_Small (at 5.005855 -3.504095 270) (layer B.Fab))
    (pad 2 smd rect (at 4.75 0 270) (size 5.5 2) (layers B.Cu B.Paste B.Mask)
      (net 43 "Net-(U3-Pad29)"))
    (pad 1 smd rect (at -4.75 0 270) (size 5.5 2) (layers B.Cu B.Paste B.Mask)
      (net 44 "Net-(U3-Pad28)"))
  )
  (module Connector_PinHeader_2.54mm:PinHeader_1x03_P2.54mm_Vertical (layer F.Cu) (tedit 59FED5CC)
    (at 104.775 82.55 180)
    (descr "Through hole straight pin header, 1x03, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x03 2.54mm single row")
    (fp_text reference J2 (at 0 -2.33) (layer F.SilkS) hide)
    (fp_text value RGB (at 0 7.41) (layer F.Fab))
    (fp_text user %R (at 0 2.54 90) (layer F.Fab))
    (pad 3 thru_hole oval (at 0 5.08 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 +5V))
    (pad 2 thru_hole oval (at 0 2.54 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 4 "Net-(D2-Pad1)"))
    (pad 1 thru_hole rect (at 0 0 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 3 GND))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x03_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module RobsDigiKeyLibs:WS2812_SMD (layer B.Cu) (tedit 600BBC08)
    (at 106.2355 80.645 270)
    (fp_text reference D2 (at 0 -0.5 90) (layer B.SilkS) hide)
    (fp_text value WS2812-3in-3out (at 0 0.5 90) (layer B.Fab) hide)
    (pad 6 smd roundrect (at 2.54 -19.54 270) (size 2 4.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5)
      (net 3 GND))
    (pad 1 smd roundrect (at 0 -19.54 270) (size 2 4.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5)
      (net 4 "Net-(D2-Pad1)"))
    (pad 5 smd roundrect (at -2.54 -19.54 270) (size 2 4.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5)
      (net 5 "Net-(D2-Pad5)"))
    (pad 4 smd roundrect (at 2.54 -2.54 270) (size 2 4.299999) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5)
      (net 3 GND))
    (pad 2 smd roundrect (at 0 -2.54 270) (size 2 4.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5)
      (net 6 "Net-(D2-Pad2)"))
    (pad 3 smd roundrect (at -2.54 -2.54 270) (size 2 4.3) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.5)
      (net 2 "Net-(D1-Pad1)"))
  )
  (module digi_footprints:CUI_PJ-037AH (layer F.Cu) (tedit 600BBE7E)
    (at 97.79 70.485 270)
    (fp_text reference J1 (at 2.675 -5.635 90) (layer F.SilkS) hide)
    (fp_text value Barrel_Jack (at 7.12 5.635 270) (layer F.Fab) hide)
    (pad 2 thru_hole oval (at 6 0 270) (size 2.25 4.5) (drill oval 1 3) (layers *.Cu *.Mask)
      (net 3 GND))
    (pad 1 thru_hole oval (at 0 0 270) (size 2.5 5) (drill oval 1 3.5) (layers *.Cu *.Mask)
      (net 1 +5V))
  )
  (module RobsDigiKeyLibs:RRE02VTM4SFHTR (layer B.Cu) (tedit 0)
    (at 107.188 74.549 90)
    (fp_text reference D1 (at -0.0635 -1.8415 90) (layer B.SilkS))
    (fp_text value D_Small (at 0 2.54 90) (layer B.SilkS) hide)
    (fp_text user 0.033in/0.838mm (at 3.7592 0 90) (layer Dwgs.User))
    (fp_text user * (at -1.9304 0 90) (layer B.SilkS))
    (fp_text user * (at -0.7493 0 90) (layer B.Fab))
    (fp_text user 0.018in/0.457mm (at -1.3208 3.4163 90) (layer Dwgs.User))
    (fp_text user * (at -0.7493 0 90) (layer B.Fab))
    (fp_text user * (at -1.9304 0 90) (layer B.SilkS))
    (fp_text user "Copyright 2016 Accelerated Designs. All rights reserved." (at 0 0 90) (layer Cmts.User))
    (pad 2 smd rect (at 1.3208 0 90) (size 0.4572 0.8382) (layers B.Cu B.Paste B.Mask)
      (net 1 +5V))
    (pad 1 smd rect (at -1.3208 0 90) (size 0.4572 0.8382) (layers B.Cu B.Paste B.Mask)
      (net 2 "Net-(D1-Pad1)"))
  )
  (gr_text RGB (at 104.775 75.565) (layer F.SilkS))
  (gr_line (start 128.905 50.8) (end 92.075 50.8) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 128.905 85.09) (end 128.905 50.8) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 92.075 85.09) (end 128.905 85.09) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 92.075 50.8) (end 92.075 85.09) (layer Edge.Cuts) (width 0.05))
  (gr_text DO (at 122.174 80.645) (layer B.SilkS))
  (gr_text +5 (at 122.174 78.105) (layer B.SilkS))
  (gr_text +5 (at 113.03 78.232) (layer B.SilkS))
  (gr_text DIN (at 112.776 80.772) (layer B.SilkS))
  (gr_text GND (at 112.776 83.312) (layer B.SilkS))
  (gr_text GND (at 121.7295 83.185) (layer B.SilkS))
  (gr_text GND (at 102.87 82.55 90) (layer F.SilkS))
  (gr_text DAT (at 102.87 80.01 90) (layer F.SilkS))
  (gr_text +5 (at 102.87 77.47 90) (layer F.SilkS))
  (gr_text GND (at 97.5995 79.5655) (layer F.SilkS))
  (gr_text +5v (at 97.536 73.3425) (layer F.SilkS))
  (zone (net 0) (net_name "") (layer Dwgs.User) (hatch edge 0.508)
    (connect_pads (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 165.1 86.36) (xy 104.14 86.36) (xy 104.14 49.53) (xy 165.1 49.53)
      )
    )
  )
  (zone (net 3) (net_name GND) (layer F.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 128.905 85.09) (xy 92.075 85.09) (xy 92.075 50.165) (xy 128.905 50.165)
      )
    )
  )
  (zone (net 3) (net_name GND) (layer B.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.254))
    (min_thickness 0.15)
    (fill yes (arc_segments 32) (thermal_gap 0.254) (thermal_bridge_width 0.508) (smoothing chamfer))
    (polygon
      (pts
        (xy 128.905 85.09) (xy 92.075 85.09) (xy 92.075 50.8) (xy 128.905 50.8)
      )
    )
  )
)
