(kicad_pcb (version 20221018) (generator pcbnew)
  (general
    (thickness 1.6)
  )
  (paper "A4")
  (layers
    (0 "F.Cu" signal)
    (31 "B.Cu" signal)
    (32 "B.Adhes" user "B.Adhesive")
    (33 "F.Adhes" user "F.Adhesive")
    (34 "B.Paste" user)
    (35 "F.Paste" user)
    (36 "B.SilkS" user "B.Silkscreen")
    (37 "F.SilkS" user "F.Silkscreen")
    (38 "B.Mask" user)
    (39 "F.Mask" user)
    (40 "Dwgs.User" user "User.Drawings")
    (41 "Cmts.User" user "User.Comments")
    (42 "Eco1.User" user "User.Eco1")
    (43 "Eco2.User" user "User.Eco2")
    (44 "Edge.Cuts" user)
    (45 "Margin" user)
    (46 "B.CrtYd" user "B.Courtyard")
    (47 "F.CrtYd" user "F.Courtyard")
    (48 "B.Fab" user)
    (49 "F.Fab" user)
    (50 "User.1" user)
    (51 "User.2" user)
    (52 "User.3" user)
    (53 "User.4" user)
    (54 "User.5" user)
    (55 "User.6" user)
    (56 "User.7" user)
    (57 "User.8" user)
    (58 "User.9" user)
  )
  (setup
    (stackup
      (layer "F.SilkS" (type "Top Silk Screen"))
      (layer "F.Paste" (type "Top Solder Paste"))
      (layer "F.Mask" (type "Top Solder Mask") (thickness 0.01))
      (layer "F.Cu" (type "copper") (thickness 0.035))
      (layer "dielectric 1" (type "core") (thickness 1.51) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
      (layer "B.Cu" (type "copper") (thickness 0.035))
      (layer "B.Mask" (type "Bottom Solder Mask") (thickness 0.01))
      (layer "B.Paste" (type "Bottom Solder Paste"))
      (layer "B.SilkS" (type "Bottom Silk Screen"))
      (copper_finish "None")
      (dielectric_constraints no)
      (castellated_pads yes)
    )
    (pad_to_mask_clearance 0)
    (pcbplotparams
      (layerselection 0x00010fc_ffffffff)
      (plot_on_all_layers_selection 0x0000000_00000000)
      (disableapertmacros false)
      (usegerberextensions false)
      (usegerberattributes true)
      (usegerberadvancedattributes true)
      (creategerberjobfile true)
      (dashed_line_dash_ratio 12.000000)
      (dashed_line_gap_ratio 3.000000)
      (svgprecision 4)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (dxfpolygonmode true)
      (dxfimperialunits true)
      (dxfusepcbnewfont true)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (sketchpadsonfab false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 1)
      (scaleselection 1)
      (outputdirectory "")
    )
  )
  (net 0 "")
  (net 1 "VCC")
  (net 2 "GND")
  (net 3 "/Clk_{A}")
  (net 4 "/A_{out}")
  (net 5 "/~{A_{out}}")
  (net 6 "/Clk_{B}")
  (net 7 "/B_{out}")
  (net 8 "/~{B_{out}}")
  (net 9 "Net-(JP1-B)")
  (net 10 "/Clk_{A}_Enable")
  (net 11 "/Clk_{B}_enable")
  (footprint "Package_SO:TSSOP-8_3x3mm_P0.65mm" (layer "F.Cu")
    (at 68.952 52.578)
    (descr "TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot505-1_po.pdf)")
    (tags "SSOP 0.65")
    (property "Sheetfile" "clock.kicad_sch")
    (property "Sheetname" "")
    (property "ki_description" "Dual Inverter Buffer Tri-State, Low-Voltage CMOS")
    (property "ki_keywords" "Dual Inv Buff Tri-State LVC CMOS")
    (attr smd)
    (fp_text reference "U1" (at -3.166 1.793) (layer "F.SilkS"))
    (fp_text value "74LVC2G240" (at 0 2.55) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab"))
    (pad "1" smd rect (at -2.15 -0.975) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 10 "/Clk_{A}_Enable") (pintype "input"))
    (pad "2" smd rect (at -2.15 -0.325) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 9 "Net-(JP1-B)") (pintype "input"))
    (pad "3" smd rect (at -2.15 0.325) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 8 "/~{B_{out}}") (pintype "tri_state"))
    (pad "4" smd rect (at -2.15 0.975) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "GND") (pinfunction "GND") (pintype "power_in"))
    (pad "5" smd rect (at 2.15 0.975) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 6 "/Clk_{B}") (pintype "input"))
    (pad "6" smd rect (at 2.15 0.325) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 5 "/~{A_{out}}") (pintype "tri_state"))
    (pad "7" smd rect (at 2.15 -0.325) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 11 "/Clk_{B}_enable") (pintype "input"))
    (pad "8" smd rect (at 2.15 -0.975) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "VCC") (pinfunction "VCC") (pintype "power_in"))
    (model "${KICAD6_3DMODEL_DIR}/Package_SO.3dshapes/TSSOP-8_3x3mm_P0.65mm.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "F.Cu")
    (at 50.8 57.15 -90)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "Sheetfile" "clock.kicad_sch")
    (property "Sheetname" "")
    (property "ki_description" "Unpolarized capacitor")
    (property "ki_keywords" "cap capacitor")
    (attr smd)
    (fp_text reference "C4" (at -2.54 -0.508 90) (layer "F.SilkS"))
    (fp_text value "100n" (at -3.048 0.508 -90) (layer "F.SilkS"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab"))
    (pad "1" smd roundrect (at -1.0375 0 270) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 1 "VCC") (pintype "passive"))
    (pad "2" smd roundrect (at 1.0375 0 270) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 2 "GND") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Connector_PinHeader_2.54mm:PinHeader_1x03_P2.54mm_Vertical" (layer "F.Cu")
    (at 67.34 48.26 90)
    (descr "Through hole straight pin header, 1x03, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x03 2.54mm single row")
    (property "Sheetfile" "clock.kicad_sch")
    (property "Sheetname" "")
    (property "ki_description" "Generic connector, single row, 01x03, script generated")
    (property "ki_keywords" "connector")
    (attr through_hole)
    (fp_text reference "J3" (at -1.27 7.112) (layer "F.SilkS") hide)
    (fp_text value "Conn_01x03_Pin" (at 0 7.41 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 2.54) (layer "F.Fab"))
    (pad "1" thru_hole rect (at 0 0 90) (size 1.7 1.7) (drill 1) (layers "*.Cu" "*.Mask")
      (net 3 "/Clk_{A}") (pinfunction "Pin_1") (pintype "passive"))
    (pad "2" thru_hole oval (at 0 2.54 90) (size 1.7 1.7) (drill 1) (layers "*.Cu" "*.Mask")
      (net 4 "/A_{out}") (pinfunction "Pin_2") (pintype "passive"))
    (pad "3" thru_hole oval (at 0 5.08 90) (size 1.7 1.7) (drill 1) (layers "*.Cu" "*.Mask")
      (net 5 "/~{A_{out}}") (pinfunction "Pin_3") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x03_P2.54mm_Vertical.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "F.Cu")
    (at 73.152 52.07 -90)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "Sheetfile" "clock.kicad_sch")
    (property "Sheetname" "")
    (property "ki_description" "Unpolarized capacitor")
    (property "ki_keywords" "cap capacitor")
    (attr smd)
    (fp_text reference "C1" (at 2.286 0 180) (layer "F.SilkS"))
    (fp_text value "100n" (at 0 1.68 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab"))
    (pad "1" smd roundrect (at -1.0375 0 270) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 1 "VCC") (pintype "passive"))
    (pad "2" smd roundrect (at 1.0375 0 270) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 2 "GND") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Jumper:SolderJumper-2_P1.3mm_Open_RoundedPad1.0x1.5mm" (layer "F.Cu")
    (at 63.612 48.26 180)
    (descr "SMD Solder Jumper, 1x1.5mm, rounded Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (property "Sheetfile" "clock.kicad_sch")
    (property "Sheetname" "")
    (property "ki_description" "Jumper, 2-pole, open")
    (property "ki_keywords" "Jumper SPST")
    (attr exclude_from_pos_files)
    (fp_text reference "JP1" (at 2.906 0) (layer "F.SilkS"))
    (fp_text value "Jumper_2_Open" (at 0 1.9) (layer "F.Fab"))
    (pad "1" smd custom (at -0.65 0 180) (size 1 0.5) (layers "F.Cu" "F.Mask")
      (net 3 "/Clk_{A}") (pinfunction "A") (pintype "passive") (zone_connect 2) (thermal_bridge_angle 45)
      (options (clearance outline) (anchor rect))
      (primitives
        (gr_circle (center 0 0.25) (end 0.5 0.25) (width 0) (fill yes))
        (gr_circle (center 0 -0.25) (end 0.5 -0.25) (width 0) (fill yes))
        (gr_poly
          (pts
            (xy 0.5 0.75)
            (xy 0 0.75)
            (xy 0 -0.75)
            (xy 0.5 -0.75)
          )
          (width 0) (fill yes))
      ))
    (pad "2" smd custom (at 0.65 0 180) (size 1 0.5) (layers "F.Cu" "F.Mask")
      (net 9 "Net-(JP1-B)") (pinfunction "B") (pintype "passive") (zone_connect 2) (thermal_bridge_angle 45)
      (options (clearance outline) (anchor rect))
      (primitives
        (gr_circle (center 0 0.25) (end 0.5 0.25) (width 0) (fill yes))
        (gr_circle (center 0 -0.25) (end 0.5 -0.25) (width 0) (fill yes))
        (gr_poly
          (pts
            (xy 0 0.75)
            (xy -0.5 0.75)
            (xy -0.5 -0.75)
            (xy 0 -0.75)
          )
          (width 0) (fill yes))
      ))
  )
  (footprint "Connector_PinHeader_2.54mm:PinHeader_1x02_P2.54mm_Vertical" (layer "F.Cu")
    (at 49.535 60.96 -90)
    (descr "Through hole straight pin header, 1x02, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x02 2.54mm single row")
    (property "Sheetfile" "clock.kicad_sch")
    (property "Sheetname" "")
    (property "ki_description" "Generic connector, single row, 01x02, script generated")
    (property "ki_keywords" "connector")
    (attr through_hole)
    (fp_text reference "J5" (at 0 5.08) (layer "F.SilkS"))
    (fp_text value "Conn_01x02_Pin" (at 0 4.87 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 1.27) (layer "F.Fab"))
    (pad "1" thru_hole rect (at 0 0 270) (size 1.7 1.7) (drill 1) (layers "*.Cu" "*.Mask")
      (net 6 "/Clk_{B}") (pinfunction "Pin_1") (pintype "passive"))
    (pad "2" thru_hole oval (at 0 2.54 270) (size 1.7 1.7) (drill 1) (layers "*.Cu" "*.Mask")
      (net 11 "/Clk_{B}_enable") (pinfunction "Pin_2") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x02_P2.54mm_Vertical.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "F.Cu")
    (at 73.152 56.388 90)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "Sheetfile" "clock.kicad_sch")
    (property "Sheetname" "")
    (property "ki_description" "Unpolarized capacitor")
    (property "ki_keywords" "cap capacitor")
    (attr smd)
    (fp_text reference "C2" (at -2.286 0 90) (layer "F.SilkS"))
    (fp_text value "100n" (at 0 1.68 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab"))
    (pad "1" smd roundrect (at -1.0375 0 90) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 2 "GND") (pintype "passive"))
    (pad "2" smd roundrect (at 1.0375 0 90) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 1 "VCC") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Package_SO:TSSOP-8_3x3mm_P0.65mm" (layer "F.Cu")
    (at 68.952 56.429)
    (descr "TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot505-1_po.pdf)")
    (tags "SSOP 0.65")
    (property "Sheetfile" "clock.kicad_sch")
    (property "Sheetname" "")
    (property "ki_description" "Dual Buffer Tri-State, Low-Voltage CMOS")
    (property "ki_keywords" "Dual Buff Tri-State LVC CMOS")
    (attr smd)
    (fp_text reference "U2" (at -3.166 1.864 180) (layer "F.SilkS"))
    (fp_text value "74LVC2G125" (at 0 2.55) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab"))
    (pad "1" smd rect (at -2.15 -0.975) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 10 "/Clk_{A}_Enable") (pintype "input"))
    (pad "2" smd rect (at -2.15 -0.325) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 9 "Net-(JP1-B)") (pintype "input"))
    (pad "3" smd rect (at -2.15 0.325) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 7 "/B_{out}") (pintype "tri_state"))
    (pad "4" smd rect (at -2.15 0.975) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "GND") (pinfunction "GND") (pintype "power_in"))
    (pad "5" smd rect (at 2.15 0.975) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 6 "/Clk_{B}") (pintype "input"))
    (pad "6" smd rect (at 2.15 0.325) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 4 "/A_{out}") (pintype "tri_state"))
    (pad "7" smd rect (at 2.15 -0.325) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 11 "/Clk_{B}_enable") (pintype "input"))
    (pad "8" smd rect (at 2.15 -0.975) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "VCC") (pinfunction "VCC") (pintype "power_in"))
    (model "${KICAD6_3DMODEL_DIR}/Package_SO.3dshapes/TSSOP-8_3x3mm_P0.65mm.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Oscillator:Oscillator_DIP-8" (layer "F.Cu")
    (at 54.61 59.944)
    (descr "Oscillator, DIP8,http://cdn-reichelt.de/documents/datenblatt/B400/OSZI.pdf")
    (tags "oscillator")
    (property "Sheetfile" "clock.kicad_sch")
    (property "Sheetname" "")
    (property "ki_description" "Crystal Clock Oscillator, DIP8-style metal package")
    (property "ki_keywords" "Crystal Clock Oscillator")
    (attr through_hole)
    (fp_text reference "X1" (at 0 -10.922) (layer "F.SilkS"))
    (fp_text value "CXO_DIP8" (at 3.81 3.74) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 3.81 -3.81) (layer "F.Fab"))
    (pad "1" thru_hole rect (at 0 0) (size 1.6 1.6) (drill 0.8) (layers "*.Cu" "*.Mask")
      (net 1 "VCC") (pinfunction "EN") (pintype "input"))
    (pad "4" thru_hole circle (at 7.62 0) (size 1.6 1.6) (drill 0.8) (layers "*.Cu" "*.Mask")
      (net 2 "GND") (pinfunction "GND") (pintype "power_in"))
    (pad "5" thru_hole circle (at 7.62 -7.62) (size 1.6 1.6) (drill 0.8) (layers "*.Cu" "*.Mask")
      (net 9 "Net-(JP1-B)") (pinfunction "OUT") (pintype "output"))
    (pad "8" thru_hole circle (at 0 -7.62) (size 1.6 1.6) (drill 0.8) (layers "*.Cu" "*.Mask")
      (net 1 "VCC") (pinfunction "Vcc") (pintype "power_in"))
    (model "${KICAD6_3DMODEL_DIR}/Oscillator.3dshapes/Oscillator_DIP-8.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Connector_PinHeader_2.54mm:PinHeader_1x03_P2.54mm_Vertical" (layer "F.Cu")
    (at 72.39 60.96 -90)
    (descr "Through hole straight pin header, 1x03, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x03 2.54mm single row")
    (property "Sheetfile" "clock.kicad_sch")
    (property "Sheetname" "")
    (property "ki_description" "Generic connector, single row, 01x03, script generated")
    (property "ki_keywords" "connector")
    (attr through_hole)
    (fp_text reference "J6" (at 0.508 6.985 180) (layer "F.SilkS") hide)
    (fp_text value "Conn_01x03_Pin" (at 0 7.41 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 2.54) (layer "F.Fab"))
    (pad "1" thru_hole rect (at 0 0 270) (size 1.7 1.7) (drill 1) (layers "*.Cu" "*.Mask")
      (net 2 "GND") (pinfunction "Pin_1") (pintype "passive"))
    (pad "2" thru_hole oval (at 0 2.54 270) (size 1.7 1.7) (drill 1) (layers "*.Cu" "*.Mask")
      (net 8 "/~{B_{out}}") (pinfunction "Pin_2") (pintype "passive"))
    (pad "3" thru_hole oval (at 0 5.08 270) (size 1.7 1.7) (drill 1) (layers "*.Cu" "*.Mask")
      (net 7 "/B_{out}") (pinfunction "Pin_3") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x03_P2.54mm_Vertical.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "F.Cu")
    (at 46.99 52.07 -90)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "Sheetfile" "clock.kicad_sch")
    (property "Sheetname" "")
    (property "ki_description" "Unpolarized capacitor")
    (property "ki_keywords" "cap capacitor")
    (attr smd)
    (fp_text reference "C3" (at 2.794 0.762 90) (layer "F.SilkS"))
    (fp_text value "10µ" (at 0.762 -1.524 90) (layer "F.SilkS"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab"))
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      (net 1 "VCC") (pintype "passive"))
    (pad "2" smd roundrect (at 1.0375 0 270) (size 1.175 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.212766)
      (net 2 "GND") (pintype "passive"))
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      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
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  (footprint "Connector_PinHeader_2.54mm:PinHeader_1x02_P2.54mm_Vertical" (layer "F.Cu")
    (at 46.98 48.26 90)
    (descr "Through hole straight pin header, 1x02, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x02 2.54mm single row")
    (property "Sheetfile" "clock.kicad_sch")
    (property "Sheetname" "")
    (property "ki_description" "Generic connector, single row, 01x02, script generated")
    (property "ki_keywords" "connector")
    (attr through_hole)
    (fp_text reference "J4" (at 0 5.09 180) (layer "F.SilkS"))
    (fp_text value "Conn_01x02_Pin" (at 0 4.87 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 1.27) (layer "F.Fab"))
    (pad "1" thru_hole rect (at 0 0 90) (size 1.7 1.7) (drill 1) (layers "*.Cu" "*.Mask")
      (net 1 "VCC") (pinfunction "Pin_1") (pintype "passive"))
    (pad "2" thru_hole oval (at 0 2.54 90) (size 1.7 1.7) (drill 1) (layers "*.Cu" "*.Mask")
      (net 10 "/Clk_{A}_Enable") (pinfunction "Pin_2") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x02_P2.54mm_Vertical.wrl"
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      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
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  (gr_line (start 46.228 46.482) (end 73.406 46.482)
    (layer "Edge.Cuts"))
  (gr_line (start 45.212 61.722) (end 45.212 47.498)
    (layer "Edge.Cuts"))
  (gr_line (start 74.422 47.498) (end 74.422 61.722)
    (layer "Edge.Cuts"))
  (gr_line (start 73.406 62.738) (end 46.228 62.738)
    (layer "Edge.Cuts"))
  (gr_arc (start 45.212 47.498) (mid 45.50958 46.77958) (end 46.228 46.482)
    (layer "Edge.Cuts"))
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    (layer "Edge.Cuts"))
  (gr_arc (start 73.406 46.482) (mid 74.12442 46.77958) (end 74.422 47.498)
    (layer "Edge.Cuts"))
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  (gr_text "~{A_{EN}}" (at 50.927 49.784 180) (layer "F.SilkS"))
  (gr_text "B_{out}" (at 66.548 59.436) (layer "F.SilkS"))
  (gr_text "A_{out}" (at 69.977 49.784 180) (layer "F.SilkS"))
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  (gr_text "~{B_{out}}" (at 69.088 59.436) (layer "F.SilkS"))
  (zone (net 1) (net_name "VCC") (layer "F.Cu") (hatch edge 0.5)
    (connect_pads (clearance 0.5))
    (min_thickness 0.25) (filled_areas_thickness no)
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  (zone (net 2) (net_name "GND") (layer "B.Cu") (hatch edge 0.5)
    (priority 1)
    (connect_pads (clearance 0.5))
    (min_thickness 0.25) (filled_areas_thickness no)
    (fill yes (thermal_gap 0.5) (thermal_bridge_width 0.5))
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)
