(kicad_pcb (version 20171130) (host pcbnew "(5.1.10)-1")
  (general
    (thickness 1.6)
    (drawings 11)
    (tracks 294)
    (zones 0)
    (modules 24)
    (nets 17)
  )
  (page A4)
  (layers
    (0 F.Cu signal)
    (1 In1.Cu signal)
    (2 In2.Cu signal)
    (31 B.Cu signal)
    (32 B.Adhes user hide)
    (33 F.Adhes user hide)
    (34 B.Paste user hide)
    (35 F.Paste user hide)
    (36 B.SilkS user hide)
    (37 F.SilkS user)
    (38 B.Mask user hide)
    (39 F.Mask user hide)
    (40 Dwgs.User user hide)
    (41 Cmts.User user hide)
    (42 Eco1.User user hide)
    (43 Eco2.User user hide)
    (44 Edge.Cuts user)
    (45 Margin user hide)
    (46 B.CrtYd user hide)
    (47 F.CrtYd user hide)
    (48 B.Fab user hide)
    (49 F.Fab user hide)
  )
  (setup
    (last_trace_width 0.3556)
    (trace_clearance 0.1524)
    (zone_clearance 0.508)
    (zone_45_only no)
    (trace_min 0.2)
    (via_size 0.8128)
    (via_drill 0.4064)
    (via_min_size 0.4)
    (via_min_drill 0.3)
    (uvia_size 0.3)
    (uvia_drill 0.1)
    (uvias_allowed no)
    (uvia_min_size 0.2)
    (uvia_min_drill 0.1)
    (edge_width 0.05)
    (segment_width 0.2)
    (pcb_text_width 0.3)
    (pcb_text_size 1.5 1.5)
    (mod_edge_width 0.12)
    (mod_text_size 1 1)
    (mod_text_width 0.15)
    (pad_size 1.524 1.524)
    (pad_drill 0.762)
    (pad_to_mask_clearance 0)
    (aux_axis_origin 0 0)
    (visible_elements 7FFFFF7F)
    (pcbplotparams
      (layerselection 0x010fc_ffffffff)
      (usegerberextensions false)
      (usegerberattributes true)
      (usegerberadvancedattributes true)
      (creategerberjobfile true)
      (excludeedgelayer true)
      (linewidth 0.100000)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (padsonsilk false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 1)
      (scaleselection 1)
      (outputdirectory ""))
  )
  (net 0 "")
  (net 1 GND)
  (net 2 "Net-(C1-Pad1)")
  (net 3 +3.3VA)
  (net 4 /Q5-)
  (net 5 /Q5+)
  (net 6 /Q3-)
  (net 7 /Q3+)
  (net 8 /Q4+)
  (net 9 /Q4-)
  (net 10 /Q0-)
  (net 11 /Q0+)
  (net 12 /Q1+)
  (net 13 /Q1-)
  (net 14 /Q2+)
  (net 15 /Q2-)
  (net 16 "Net-(TP2-Pad1)")
  (net_class Default "This is the default net class."
    (clearance 0.1524)
    (trace_width 0.3556)
    (via_dia 0.8128)
    (via_drill 0.4064)
    (uvia_dia 0.3)
    (uvia_drill 0.1)
    (diff_pair_width 0.2921)
    (diff_pair_gap 0.1524)
    (add_net +3.3VA)
    (add_net /Q0+)
    (add_net /Q0-)
    (add_net /Q1+)
    (add_net /Q1-)
    (add_net /Q2+)
    (add_net /Q2-)
    (add_net /Q3+)
    (add_net /Q3-)
    (add_net /Q4+)
    (add_net /Q4-)
    (add_net /Q5+)
    (add_net /Q5-)
    (add_net GND)
    (add_net "Net-(C1-Pad1)")
    (add_net "Net-(TP2-Pad1)")
  )
  (module Connector_RF:SMA_EDGE_062_MOLEX0732512120 (layer F.Cu) (tedit 623CC557)
    (at 129.17 87.92 90)
    (fp_text reference TP2 (at 0.01 -4.15 90) (layer F.SilkS) hide)
    (fp_text value Conn_01x05_Male (at 0.01 3.73 90) (layer F.Fab) hide)
    (pad 1 smd rect (at 0 0 90) (size 1.778 4.191) (layers F.Cu F.Paste F.Mask)
      (net 16 "Net-(TP2-Pad1)"))
    (pad 2 smd rect (at 3.4925 0 90) (size 2.667 4.191) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 3 smd rect (at -3.4925 0 90) (size 2.667 4.191) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 4 smd rect (at -3.51 0.01 90) (size 2.667 4.191) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (pad 5 smd rect (at 3.5 0.01 90) (size 2.667 4.191) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
  )
  (module Housings_SSOP:TSSOP-24_4.4x7.8mm_Pitch0.65mm (layer F.Cu) (tedit 54130A77)
    (at 145.32 90.89)
    (descr "TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4.4 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot355-1_po.pdf)")
    (tags "SSOP 0.65")
    (attr smd)
    (fp_text reference U1 (at 1.67 -5.01) (layer F.SilkS))
    (fp_text value PI6C4921506 (at 0 4.95) (layer F.Fab) hide)
    (pad 1 smd rect (at -2.85 -3.575) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 2 "Net-(C1-Pad1)"))
    (pad 2 smd rect (at -2.85 -2.925) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 16 "Net-(TP2-Pad1)"))
    (pad 3 smd rect (at -2.85 -2.275) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 3 +3.3VA))
    (pad 4 smd rect (at -2.85 -1.625) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 3 +3.3VA))
    (pad 5 smd rect (at -2.85 -0.975) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 11 /Q0+))
    (pad 6 smd rect (at -2.85 -0.325) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 10 /Q0-))
    (pad 7 smd rect (at -2.85 0.325) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 8 smd rect (at -2.85 0.975) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 12 /Q1+))
    (pad 9 smd rect (at -2.85 1.625) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 13 /Q1-))
    (pad 10 smd rect (at -2.85 2.275) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 3 +3.3VA))
    (pad 11 smd rect (at -2.85 2.925) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 14 /Q2+))
    (pad 12 smd rect (at -2.85 3.575) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 15 /Q2-))
    (pad 13 smd rect (at 2.85 3.575) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 7 /Q3+))
    (pad 14 smd rect (at 2.85 2.925) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 6 /Q3-))
    (pad 15 smd rect (at 2.85 2.275) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 3 +3.3VA))
    (pad 16 smd rect (at 2.85 1.625) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 8 /Q4+))
    (pad 17 smd rect (at 2.85 0.975) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 9 /Q4-))
    (pad 18 smd rect (at 2.85 0.325) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 19 smd rect (at 2.85 -0.325) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 5 /Q5+))
    (pad 20 smd rect (at 2.85 -0.975) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 4 /Q5-))
    (pad 21 smd rect (at 2.85 -1.625) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 3 +3.3VA))
    (pad 22 smd rect (at 2.85 -2.275) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 3 +3.3VA))
    (pad 23 smd rect (at 2.85 -2.925) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 24 smd rect (at 2.85 -3.575) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (model Housings_SSOP.3dshapes/TSSOP-24_4.4x7.8mm_Pitch0.65mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0402 (layer F.Cu) (tedit 5415D599)
    (at 140.46 88.95 180)
    (descr "Capacitor SMD 0402, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0402")
    (attr smd)
    (fp_text reference C6 (at 2.31 0.01) (layer F.SilkS))
    (fp_text value 0.1u (at 0 1.7) (layer F.Fab) hide)
    (pad 2 smd rect (at 0.55 0 180) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 1 smd rect (at -0.55 0 180) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 3 +3.3VA))
    (model Capacitors_SMD.3dshapes/C_0402.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0402 (layer F.Cu) (tedit 5415CBB8)
    (at 155.61 92.32 90)
    (descr "Resistor SMD 0402, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0402")
    (attr smd)
    (fp_text reference R5 (at -0.09 1.65 90) (layer F.SilkS))
    (fp_text value 100 (at 0 1.8 90) (layer F.Fab) hide)
    (pad 1 smd rect (at -0.45 0 90) (size 0.4 0.6) (layers F.Cu F.Paste F.Mask)
      (net 8 /Q4+))
    (pad 2 smd rect (at 0.45 0 90) (size 0.4 0.6) (layers F.Cu F.Paste F.Mask)
      (net 9 /Q4-))
    (model Resistors_SMD.3dshapes/R_0402.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0402 (layer F.Cu) (tedit 5415CBB8)
    (at 155.61 90.36 90)
    (descr "Resistor SMD 0402, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0402")
    (attr smd)
    (fp_text reference R3 (at 0.11 1.65 90) (layer F.SilkS))
    (fp_text value 100 (at 0 1.8 90) (layer F.Fab) hide)
    (pad 1 smd rect (at -0.45 0 90) (size 0.4 0.6) (layers F.Cu F.Paste F.Mask)
      (net 5 /Q5+))
    (pad 2 smd rect (at 0.45 0 90) (size 0.4 0.6) (layers F.Cu F.Paste F.Mask)
      (net 4 /Q5-))
    (model Resistors_SMD.3dshapes/R_0402.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0603_HandSoldering (layer F.Cu) (tedit 5418A00F)
    (at 141.17 85.7 180)
    (descr "Resistor SMD 0603, hand soldering")
    (tags "resistor 0603")
    (attr smd)
    (fp_text reference R1 (at 3.08 0.08) (layer F.SilkS))
    (fp_text value 1K (at 0 1.9) (layer F.Fab) hide)
    (pad 2 smd rect (at 1.1 0 180) (size 1.2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 1 smd rect (at -1.1 0 180) (size 1.2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 2 "Net-(C1-Pad1)"))
    (model Resistors_SMD.3dshapes/R_0603_HandSoldering.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0603_HandSoldering (layer F.Cu) (tedit 5418A00F)
    (at 140.99 82.46)
    (descr "Resistor SMD 0603, hand soldering")
    (tags "resistor 0603")
    (attr smd)
    (fp_text reference R2 (at -3.13 0.04) (layer F.SilkS))
    (fp_text value 1K (at 0 1.9) (layer F.Fab) hide)
    (pad 1 smd rect (at -1.1 0) (size 1.2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 3 +3.3VA))
    (pad 2 smd rect (at 1.1 0) (size 1.2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 2 "Net-(C1-Pad1)"))
    (model Resistors_SMD.3dshapes/R_0603_HandSoldering.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0402 (layer F.Cu) (tedit 5415CBB8)
    (at 135.13 90.12 270)
    (descr "Resistor SMD 0402, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0402")
    (attr smd)
    (fp_text reference R6 (at 0.24 1.61 270) (layer F.SilkS))
    (fp_text value 100 (at 0 1.8 270) (layer F.Fab) hide)
    (pad 2 smd rect (at 0.45 0 270) (size 0.4 0.6) (layers F.Cu F.Paste F.Mask)
      (net 10 /Q0-))
    (pad 1 smd rect (at -0.45 0 270) (size 0.4 0.6) (layers F.Cu F.Paste F.Mask)
      (net 11 /Q0+))
    (model Resistors_SMD.3dshapes/R_0402.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0402 (layer F.Cu) (tedit 5415CBB8)
    (at 135.13 92.37 270)
    (descr "Resistor SMD 0402, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0402")
    (attr smd)
    (fp_text reference R7 (at 0.19 1.59 270) (layer F.SilkS))
    (fp_text value 100 (at 0 1.8 270) (layer F.Fab) hide)
    (pad 2 smd rect (at 0.45 0 270) (size 0.4 0.6) (layers F.Cu F.Paste F.Mask)
      (net 13 /Q1-))
    (pad 1 smd rect (at -0.45 0 270) (size 0.4 0.6) (layers F.Cu F.Paste F.Mask)
      (net 12 /Q1+))
    (model Resistors_SMD.3dshapes/R_0402.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0402 (layer F.Cu) (tedit 5415CBB8)
    (at 144.24 100.22 180)
    (descr "Resistor SMD 0402, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0402")
    (attr smd)
    (fp_text reference R8 (at 0 -1.8 180) (layer F.SilkS))
    (fp_text value 100 (at 0 1.8 180) (layer F.Fab) hide)
    (pad 1 smd rect (at -0.45 0 180) (size 0.4 0.6) (layers F.Cu F.Paste F.Mask)
      (net 14 /Q2+))
    (pad 2 smd rect (at 0.45 0 180) (size 0.4 0.6) (layers F.Cu F.Paste F.Mask)
      (net 15 /Q2-))
    (model Resistors_SMD.3dshapes/R_0402.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Wire_Pads:SolderWirePad_single_1mmDrill (layer F.Cu) (tedit 0)
    (at 150.17 81.44)
    (fp_text reference TP3 (at 0.17 -4.24) (layer F.SilkS))
    (fp_text value TestPoint (at -1.905 3.175) (layer F.Fab) hide)
    (pad 1 thru_hole circle (at 0 0) (size 2.49936 2.49936) (drill 1.00076) (layers *.Cu *.Mask F.SilkS)
      (net 3 +3.3VA))
  )
  (module Wire_Pads:SolderWirePad_single_1mmDrill (layer F.Cu) (tedit 0)
    (at 155.31 98.06)
    (fp_text reference TP4 (at 0.09 2.48) (layer F.SilkS))
    (fp_text value TestPoint (at -1.905 3.175) (layer F.Fab) hide)
    (pad 1 thru_hole circle (at 0 0) (size 2.49936 2.49936) (drill 1.00076) (layers *.Cu *.Mask F.SilkS)
      (net 1 GND))
  )
  (module Wire_Pads:SolderWirePad_single_1mmDrill (layer F.Cu) (tedit 0)
    (at 156.02 81.31)
    (fp_text reference TP5 (at 0.03 -4.17) (layer F.SilkS))
    (fp_text value TestPoint (at -1.905 3.175) (layer F.Fab) hide)
    (pad 1 thru_hole circle (at 0 0) (size 2.49936 2.49936) (drill 1.00076) (layers *.Cu *.Mask F.SilkS)
      (net 1 GND))
  )
  (module Wire_Pads:SolderWirePad_single_1mmDrill (layer F.Cu) (tedit 0)
    (at 137.38 98.06)
    (fp_text reference TP6 (at -0.05 2.44) (layer F.SilkS))
    (fp_text value TestPoint (at -1.905 3.175) (layer F.Fab) hide)
    (pad 1 thru_hole circle (at 0 0) (size 2.49936 2.49936) (drill 1.00076) (layers *.Cu *.Mask F.SilkS)
      (net 1 GND))
  )
  (module Wire_Pads:SolderWirePad_single_1mmDrill (layer F.Cu) (tedit 0)
    (at 150.5 98.06)
    (fp_text reference TP7 (at 0.1 2.41) (layer F.SilkS))
    (fp_text value TestPoint (at -1.905 3.175) (layer F.Fab) hide)
    (pad 1 thru_hole circle (at 0 0) (size 2.49936 2.49936) (drill 1.00076) (layers *.Cu *.Mask F.SilkS)
      (net 1 GND))
  )
  (module Resistors_SMD:R_0402 (layer F.Cu) (tedit 5415CBB8)
    (at 146.22 100.19 180)
    (descr "Resistor SMD 0402, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0402")
    (attr smd)
    (fp_text reference R4 (at 0 -1.8) (layer F.SilkS))
    (fp_text value 100 (at 0 1.8) (layer F.Fab) hide)
    (pad 2 smd rect (at 0.45 0 180) (size 0.4 0.6) (layers F.Cu F.Paste F.Mask)
      (net 6 /Q3-))
    (pad 1 smd rect (at -0.45 0 180) (size 0.4 0.6) (layers F.Cu F.Paste F.Mask)
      (net 7 /Q3+))
    (model Resistors_SMD.3dshapes/R_0402.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0402 (layer F.Cu) (tedit 5415D599)
    (at 141.79 84.12 180)
    (descr "Capacitor SMD 0402, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0402")
    (attr smd)
    (fp_text reference C1 (at 2.29 0.02) (layer F.SilkS))
    (fp_text value 0.1u (at 0 1.7) (layer F.Fab) hide)
    (pad 1 smd rect (at -0.55 0 180) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 2 "Net-(C1-Pad1)"))
    (pad 2 smd rect (at 0.55 0 180) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (model Capacitors_SMD.3dshapes/C_0402.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0402 (layer F.Cu) (tedit 5415D599)
    (at 150.59 89.03)
    (descr "Capacitor SMD 0402, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0402")
    (attr smd)
    (fp_text reference C2 (at 2.23 0.1) (layer F.SilkS))
    (fp_text value 0.1u (at 0 1.7) (layer F.Fab) hide)
    (pad 2 smd rect (at 0.55 0) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 1 smd rect (at -0.55 0) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 3 +3.3VA))
    (model Capacitors_SMD.3dshapes/C_0402.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0402 (layer F.Cu) (tedit 5415D599)
    (at 149.71 93.98 270)
    (descr "Capacitor SMD 0402, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0402")
    (attr smd)
    (fp_text reference C3 (at 0 -1.7 180) (layer F.SilkS))
    (fp_text value 0.1u (at 7.62 40.15 90) (layer F.Fab) hide)
    (pad 1 smd rect (at -0.55 0 270) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 3 +3.3VA))
    (pad 2 smd rect (at 0.55 0 270) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (model Capacitors_SMD.3dshapes/C_0402.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0402 (layer F.Cu) (tedit 5415D599)
    (at 140.35 93.48 180)
    (descr "Capacitor SMD 0402, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0402")
    (attr smd)
    (fp_text reference C4 (at 2.31 -0.17) (layer F.SilkS))
    (fp_text value 0.1u (at 0 1.7) (layer F.Fab) hide)
    (pad 1 smd rect (at -0.55 0 180) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 3 +3.3VA))
    (pad 2 smd rect (at 0.55 0 180) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (model Capacitors_SMD.3dshapes/C_0402.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0805_HandSoldering (layer F.Cu) (tedit 541A9B8D)
    (at 151.62 85.69)
    (descr "Capacitor SMD 0805, hand soldering")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C7 (at 3.53 0.01) (layer F.SilkS))
    (fp_text value 10u (at 0 2.1) (layer F.Fab) hide)
    (pad 1 smd rect (at -1.25 0) (size 1.5 1.25) (layers F.Cu F.Paste F.Mask)
      (net 3 +3.3VA))
    (pad 2 smd rect (at 1.25 0) (size 1.5 1.25) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (model Capacitors_SMD.3dshapes/C_0805_HandSoldering.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Wire_Pads:SolderWirePad_single_1mmDrill (layer F.Cu) (tedit 0)
    (at 133.09 98.06 90)
    (fp_text reference TP1 (at -2.35 -0.03 180) (layer F.SilkS))
    (fp_text value TestPoint (at -1.905 3.175 90) (layer B.Fab) hide)
    (pad 1 thru_hole circle (at 0 0 90) (size 2.49936 2.49936) (drill 1.00076) (layers *.Cu *.Mask F.SilkS)
      (net 1 GND))
  )
  (module Capacitors_SMD:C_0402 (layer F.Cu) (tedit 5415D599)
    (at 150.58 87.73)
    (descr "Capacitor SMD 0402, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0402")
    (attr smd)
    (fp_text reference C5 (at 2.24 -0.05) (layer F.SilkS))
    (fp_text value 0.1u (at 0 1.7) (layer F.Fab) hide)
    (pad 1 smd rect (at -0.55 0) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 3 +3.3VA))
    (pad 2 smd rect (at 0.55 0) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (model Capacitors_SMD.3dshapes/C_0402.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0402 (layer F.Cu) (tedit 5415D599)
    (at 144.06 85.42 90)
    (descr "Capacitor SMD 0402, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0402")
    (attr smd)
    (fp_text reference C8 (at 1.95 -0.01 180) (layer F.SilkS))
    (fp_text value 0.1u (at -0.04 0.22 90) (layer F.Fab) hide)
    (pad 1 smd rect (at -0.55 0 90) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 3 +3.3VA))
    (pad 2 smd rect (at 0.55 0 90) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (model Capacitors_SMD.3dshapes/C_0402.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (gr_text "PI6C4921506\nNDR580" (at 127.3 78.46) (layer F.SilkS))
  (gr_line (start 127 75.692) (end 160 75.68) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 160 75.68) (end 160.02 104.14) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 160.02 104.14) (end 127 104.14) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 127 75.692) (end 127 104.14) (layer Edge.Cuts) (width 0.05))
  (gr_text GND (at 133.2 102.29) (layer F.SilkS))
  (gr_text GND (at 137.6 102.22) (layer F.SilkS))
  (gr_text GND (at 150.65 102.35) (layer F.SilkS))
  (gr_text GND (at 155.45 102.49) (layer F.SilkS))
  (gr_text GND (at 156.16 78.87) (layer F.SilkS))
  (gr_text 3.3V (at 150.23 78.85) (layer F.SilkS))
  (zone (net 1) (net_name GND) (layer B.Cu) (hatch edge 0.508)
    (connect_pads yes (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 160.11 75.51) (xy 160.11 104.34) (xy 126.71 104.28) (xy 126.58 75.51) (xy 126.71 75.45)
      )
    )
  )
  (zone (net 3) (net_name +3.3VA) (layer In2.Cu) (hatch edge 0.508)
    (connect_pads yes (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 160.52 104.64) (xy 126.17 104.48) (xy 126.34 75.84) (xy 126.51 75.36) (xy 160.32 75.29)
      )
    )
  )
  (zone (net 1) (net_name GND) (layer In1.Cu) (hatch edge 0.508)
    (connect_pads yes (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 160.14 75.56) (xy 160.17 104.32) (xy 126.76 104.39) (xy 126.86 75.61) (xy 126.84 75.5)
      )
    )
  )
)
