(kicad_pcb (version 4) (host pcbnew 4.0.4-stable)
  (general
    (links 82)
    (no_connects 0)
    (area 147.674998 47.424998 166.825002 89.075002)
    (thickness 1.6)
    (drawings 39)
    (tracks 422)
    (zones 0)
    (modules 44)
    (nets 21)
  )
  (page A4)
  (layers
    (0 F.Cu signal)
    (31 B.Cu signal)
    (32 B.Adhes user)
    (33 F.Adhes user)
    (34 B.Paste user)
    (35 F.Paste user)
    (36 B.SilkS user)
    (37 F.SilkS user)
    (38 B.Mask user)
    (39 F.Mask user)
    (40 Dwgs.User user)
    (41 Cmts.User user)
    (42 Eco1.User user)
    (43 Eco2.User user)
    (44 Edge.Cuts user)
    (45 Margin user)
    (46 B.CrtYd user hide)
    (47 F.CrtYd user)
    (48 B.Fab user hide)
    (49 F.Fab user hide)
  )
  (setup
    (last_trace_width 0.25)
    (user_trace_width 0.25)
    (user_trace_width 0.3)
    (user_trace_width 0.5)
    (user_trace_width 0.6)
    (user_trace_width 0.8)
    (trace_clearance 0.199)
    (zone_clearance 0.508)
    (zone_45_only no)
    (trace_min 0.25)
    (segment_width 0.2)
    (edge_width 0.15)
    (via_size 0.6)
    (via_drill 0.4)
    (via_min_size 0.6)
    (via_min_drill 0.3)
    (user_via 0.7 0.3)
    (uvia_size 0.3)
    (uvia_drill 0.1)
    (uvias_allowed no)
    (uvia_min_size 0.2)
    (uvia_min_drill 0.1)
    (pcb_text_width 0.3)
    (pcb_text_size 1.5 1.5)
    (mod_edge_width 0.15)
    (mod_text_size 1 1)
    (mod_text_width 0.15)
    (pad_size 1.8 1.8)
    (pad_drill 0.9)
    (pad_to_mask_clearance 0.2)
    (aux_axis_origin 0 0)
    (grid_origin 147.75 47.5)
    (visible_elements 7FFFFFFF)
    (pcbplotparams
      (layerselection 0x311f0_80000001)
      (usegerberextensions false)
      (excludeedgelayer true)
      (linewidth 0.200000)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15)
      (hpglpenoverlay 2)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (padsonsilk false)
      (subtractmaskfromsilk false)
      (outputformat 4)
      (mirror false)
      (drillshape 0)
      (scaleselection 1)
      (outputdirectory ../../../Gerbers/HallPreMini/))
  )
  (net 0 "")
  (net 1 /VREF)
  (net 2 GND)
  (net 3 "Net-(C2-Pad1)")
  (net 4 "Net-(C3-Pad1)")
  (net 5 /Vmid)
  (net 6 /VDD)
  (net 7 "Net-(C7-Pad1)")
  (net 8 "Net-(C7-Pad2)")
  (net 9 "Net-(D2-Pad1)")
  (net 10 "Net-(D2-Pad2)")
  (net 11 "Net-(D2-Pad3)")
  (net 12 "Net-(D3-Pad1)")
  (net 13 "Net-(D3-Pad2)")
  (net 14 "Net-(D3-Pad3)")
  (net 15 /VIN)
  (net 16 "Net-(P1-Pad2)")
  (net 17 "Net-(R6-Pad1)")
  (net 18 "Net-(R7-Pad1)")
  (net 19 "Net-(IC1-Pad1)")
  (net 20 "Net-(C8-Pad1)")
  (net_class Default "This is the default net class."
    (clearance 0.199)
    (trace_width 0.25)
    (via_dia 0.6)
    (via_drill 0.4)
    (uvia_dia 0.3)
    (uvia_drill 0.1)
    (add_net /VDD)
    (add_net /VIN)
    (add_net /VREF)
    (add_net /Vmid)
    (add_net GND)
    (add_net "Net-(C2-Pad1)")
    (add_net "Net-(C3-Pad1)")
    (add_net "Net-(C7-Pad1)")
    (add_net "Net-(C7-Pad2)")
    (add_net "Net-(C8-Pad1)")
    (add_net "Net-(D2-Pad1)")
    (add_net "Net-(D2-Pad2)")
    (add_net "Net-(D2-Pad3)")
    (add_net "Net-(D3-Pad1)")
    (add_net "Net-(D3-Pad2)")
    (add_net "Net-(D3-Pad3)")
    (add_net "Net-(IC1-Pad1)")
    (add_net "Net-(P1-Pad2)")
    (add_net "Net-(R6-Pad1)")
    (add_net "Net-(R7-Pad1)")
  )
  (module H_pots:Trimpot_SMD_mini (layer F.Cu) (tedit 57CE93AB)
    (at 152 67.75 90)
    (fp_text reference RV3 (at 0.5 4.75 90) (layer F.SilkS) hide)
    (fp_text value 10k (at 0.05 -3.3 90) (layer F.Fab))
    (pad 3 smd rect (at 1 1.8 90) (size 1.2 1.2) (layers F.Cu F.Paste F.Mask)
      (net 7 "Net-(C7-Pad1)"))
    (pad 2 smd rect (at 0 -1.45 90) (size 1.6 1.5) (layers F.Cu F.Paste F.Mask)
      (net 18 "Net-(R7-Pad1)"))
    (pad 1 smd rect (at -1 1.8 90) (size 1.2 1.2) (layers F.Cu F.Paste F.Mask)
      (net 18 "Net-(R7-Pad1)"))
    (model I:/Electronics/Projects/Hardware/kicad_libs/3d_models/smd_resistors/trim_murata_pva2a.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1.3 1.3 1.3))
      (rotate (xyz 0 0 0))
    )
  )
  (module H_vias:Via0703_GND (layer F.Cu) (tedit 57A8784F)
    (at 156 49)
    (fp_text reference Via0703_GND (at 0.00508 -0.42164) (layer F.Fab) hide)
    (fp_text value VAL** (at 0.03556 0.44196) (layer F.Fab) hide)
    (pad 1 thru_hole circle (at 0 0) (size 0.7 0.7) (drill 0.3) (layers *.Cu)
      (net 2 GND) (zone_connect 2))
  )
  (module H_vias:Via0703_GND (layer F.Cu) (tedit 57A8784F)
    (at 151.25 59.75)
    (fp_text reference Via0703_GND (at 0.00508 -0.42164) (layer F.Fab) hide)
    (fp_text value VAL** (at 0.03556 0.44196) (layer F.Fab) hide)
    (pad 1 thru_hole circle (at 0 0) (size 0.7 0.7) (drill 0.3) (layers *.Cu)
      (net 2 GND) (zone_connect 2))
  )
  (module H_vias:Via0703_GND (layer F.Cu) (tedit 57A8784F)
    (at 156 59.5)
    (fp_text reference Via0703_GND (at 0.00508 -0.42164) (layer F.Fab) hide)
    (fp_text value VAL** (at 0.03556 0.44196) (layer F.Fab) hide)
    (pad 1 thru_hole circle (at 0 0) (size 0.7 0.7) (drill 0.3) (layers *.Cu)
      (net 2 GND) (zone_connect 2))
  )
  (module H_vias:Via0703_GND (layer F.Cu) (tedit 57A8784F)
    (at 148.75 63)
    (fp_text reference Via0703_GND (at 0.00508 -0.42164) (layer F.Fab) hide)
    (fp_text value VAL** (at 0.03556 0.44196) (layer F.Fab) hide)
    (pad 1 thru_hole circle (at 0 0) (size 0.7 0.7) (drill 0.3) (layers *.Cu)
      (net 2 GND) (zone_connect 2))
  )
  (module H_vias:Via0703_GND (layer F.Cu) (tedit 57A8784F)
    (at 158.25 69.75)
    (fp_text reference Via0703_GND (at 0.00508 -0.42164) (layer F.Fab) hide)
    (fp_text value VAL** (at 0.03556 0.44196) (layer F.Fab) hide)
    (pad 1 thru_hole circle (at 0 0) (size 0.7 0.7) (drill 0.3) (layers *.Cu)
      (net 2 GND) (zone_connect 2))
  )
  (module H_vias:Via0703_GND (layer F.Cu) (tedit 57A8784F)
    (at 164.75 57.25)
    (fp_text reference Via0703_GND (at 0.00508 -0.42164) (layer F.Fab) hide)
    (fp_text value VAL** (at 0.03556 0.44196) (layer F.Fab) hide)
    (pad 1 thru_hole circle (at 0 0) (size 0.7 0.7) (drill 0.3) (layers *.Cu)
      (net 2 GND) (zone_connect 2))
  )
  (module H_vias:Via0703_GND (layer F.Cu) (tedit 57A8784F)
    (at 164.5 53.5)
    (fp_text reference Via0703_GND (at 0.00508 -0.42164) (layer F.Fab) hide)
    (fp_text value VAL** (at 0.03556 0.44196) (layer F.Fab) hide)
    (pad 1 thru_hole circle (at 0 0) (size 0.7 0.7) (drill 0.3) (layers *.Cu)
      (net 2 GND) (zone_connect 2))
  )
  (module H_vias:Via0703_GND (layer F.Cu) (tedit 57A8784F)
    (at 157.75 74)
    (fp_text reference Via0703_GND (at 0.00508 -0.42164) (layer F.Fab) hide)
    (fp_text value VAL** (at 0.03556 0.44196) (layer F.Fab) hide)
    (pad 1 thru_hole circle (at 0 0) (size 0.7 0.7) (drill 0.3) (layers *.Cu)
      (net 2 GND) (zone_connect 2))
  )
  (module H_vias:Via0703_GND (layer F.Cu) (tedit 57A8784F)
    (at 164.95 66)
    (fp_text reference Via0703_GND (at 0.00508 -0.42164) (layer F.Fab) hide)
    (fp_text value VAL** (at 0.03556 0.44196) (layer F.Fab) hide)
    (pad 1 thru_hole circle (at 0 0) (size 0.7 0.7) (drill 0.3) (layers *.Cu)
      (net 2 GND) (zone_connect 2))
  )
  (module H_smd_passives:CAPC_0805_2012X70N (layer B.Cu) (tedit 55F3DAB9)
    (at 159.5 84.75 270)
    (descr "Capacitor,non-polarized,Chip;2.00mm L X 1.25mm W X 0.70mm H")
    (tags "CMS XXX")
    (attr smd)
    (fp_text reference C1 (at 2.65 0 360) (layer B.SilkS))
    (fp_text value 1µ (at 0 0 270) (layer B.Fab))
    (pad 1 smd rect (at -0.89916 0 270) (size 1.14808 1.4478) (layers B.Cu B.Paste B.Mask)
      (net 1 /VREF))
    (pad 2 smd rect (at 0.89916 0 270) (size 1.14808 1.4478) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model Capacitors_SMD.3dshapes/C_0805_HandSoldering.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module H_smd_passives:CAPC_0805_2012X70N (layer B.Cu) (tedit 57A89578)
    (at 149.75 80.25 90)
    (descr "Capacitor,non-polarized,Chip;2.00mm L X 1.25mm W X 0.70mm H")
    (tags "CMS XXX")
    (attr smd)
    (fp_text reference C2 (at -2.55 0 180) (layer B.SilkS))
    (fp_text value 10n (at 0 0 90) (layer B.Fab))
    (pad 1 smd rect (at -0.89916 0 90) (size 1.14808 1.4478) (layers B.Cu B.Paste B.Mask)
      (net 3 "Net-(C2-Pad1)"))
    (pad 2 smd rect (at 0.89916 0 90) (size 1.14808 1.4478) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model Capacitors_SMD.3dshapes/C_0805_HandSoldering.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module H_smd_passives:CAPC_0805_2012X70N (layer B.Cu) (tedit 55F3DAB9)
    (at 162.25 61.75 270)
    (descr "Capacitor,non-polarized,Chip;2.00mm L X 1.25mm W X 0.70mm H")
    (tags "CMS XXX")
    (attr smd)
    (fp_text reference C3 (at 0 -1.75 270) (layer B.SilkS))
    (fp_text value 100n (at 0 0 270) (layer B.Fab))
    (pad 1 smd rect (at -0.89916 0 270) (size 1.14808 1.4478) (layers B.Cu B.Paste B.Mask)
      (net 4 "Net-(C3-Pad1)"))
    (pad 2 smd rect (at 0.89916 0 270) (size 1.14808 1.4478) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model Capacitors_SMD.3dshapes/C_0805_HandSoldering.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module H_smd_passives:CAPC_0805_2012X70N (layer B.Cu) (tedit 55F3DAB9)
    (at 157.75 57.5 90)
    (descr "Capacitor,non-polarized,Chip;2.00mm L X 1.25mm W X 0.70mm H")
    (tags "CMS XXX")
    (attr smd)
    (fp_text reference C4 (at -2.5 0 180) (layer B.SilkS))
    (fp_text value 1µ (at 0 0 90) (layer B.Fab))
    (pad 1 smd rect (at -0.89916 0 90) (size 1.14808 1.4478) (layers B.Cu B.Paste B.Mask)
      (net 5 /Vmid))
    (pad 2 smd rect (at 0.89916 0 90) (size 1.14808 1.4478) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model Capacitors_SMD.3dshapes/C_0805_HandSoldering.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module H_smd_passives:CAPC_0805_2012X70N (layer B.Cu) (tedit 55F3DAB9)
    (at 152 73.25 270)
    (descr "Capacitor,non-polarized,Chip;2.00mm L X 1.25mm W X 0.70mm H")
    (tags "CMS XXX")
    (attr smd)
    (fp_text reference C5 (at 0.254 1.524 270) (layer B.SilkS))
    (fp_text value 100n (at 0 0 270) (layer B.Fab))
    (pad 1 smd rect (at -0.89916 0 270) (size 1.14808 1.4478) (layers B.Cu B.Paste B.Mask)
      (net 6 /VDD))
    (pad 2 smd rect (at 0.89916 0 270) (size 1.14808 1.4478) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model Capacitors_SMD.3dshapes/C_0805_HandSoldering.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module H_smd_passives:CAPC_0805_2012X70N (layer B.Cu) (tedit 55F3DAB9)
    (at 154.5 56.75)
    (descr "Capacitor,non-polarized,Chip;2.00mm L X 1.25mm W X 0.70mm H")
    (tags "CMS XXX")
    (attr smd)
    (fp_text reference C6 (at -0.5 1.524) (layer B.SilkS))
    (fp_text value 1µ (at 0 0) (layer B.Fab))
    (pad 1 smd rect (at -0.89916 0) (size 1.14808 1.4478) (layers B.Cu B.Paste B.Mask)
      (net 6 /VDD))
    (pad 2 smd rect (at 0.89916 0) (size 1.14808 1.4478) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model Capacitors_SMD.3dshapes/C_0805_HandSoldering.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module H_smd_passives:CAPC_0805_2012X70N (layer B.Cu) (tedit 55F3DAB9)
    (at 155.75 64 180)
    (descr "Capacitor,non-polarized,Chip;2.00mm L X 1.25mm W X 0.70mm H")
    (tags "CMS XXX")
    (attr smd)
    (fp_text reference C7 (at 2.75 0 180) (layer B.SilkS))
    (fp_text value 100n (at 0 0 180) (layer B.Fab))
    (pad 1 smd rect (at -0.89916 0 180) (size 1.14808 1.4478) (layers B.Cu B.Paste B.Mask)
      (net 7 "Net-(C7-Pad1)"))
    (pad 2 smd rect (at 0.89916 0 180) (size 1.14808 1.4478) (layers B.Cu B.Paste B.Mask)
      (net 8 "Net-(C7-Pad2)"))
    (model Capacitors_SMD.3dshapes/C_0805_HandSoldering.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module H_SOT:SOT-23 (layer B.Cu) (tedit 55F66754)
    (at 153.25 79)
    (fp_text reference D1 (at 1.75 1.75) (layer B.SilkS))
    (fp_text value BAT54S (at 0.05 0.15 90) (layer B.Fab))
    (pad 1 smd rect (at -1.1 0.95) (size 1.3 0.9) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (pad 2 smd rect (at -1.1 -0.95) (size 1.3 0.9) (layers B.Cu B.Paste B.Mask)
      (net 6 /VDD))
    (pad 3 smd rect (at 1.1 0) (size 1.3 0.8) (layers B.Cu B.Paste B.Mask)
      (net 3 "Net-(C2-Pad1)"))
    (model I:/Electronics/Projects/Hardware/kicad_libs/3d_models/smd_transistor/sot23.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 90))
    )
  )
  (module H_SOT:SOT-23 (layer B.Cu) (tedit 55F66754)
    (at 161 79)
    (fp_text reference D2 (at -0.25 2.5) (layer B.SilkS))
    (fp_text value BAT54S (at 0.05 -0.2 90) (layer B.Fab))
    (pad 1 smd rect (at -1.1 0.95) (size 1.3 0.9) (layers B.Cu B.Paste B.Mask)
      (net 9 "Net-(D2-Pad1)"))
    (pad 2 smd rect (at -1.1 -0.95) (size 1.3 0.9) (layers B.Cu B.Paste B.Mask)
      (net 10 "Net-(D2-Pad2)"))
    (pad 3 smd rect (at 1.1 0) (size 1.3 0.8) (layers B.Cu B.Paste B.Mask)
      (net 11 "Net-(D2-Pad3)"))
    (model I:/Electronics/Projects/Hardware/kicad_libs/3d_models/smd_transistor/sot23.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 90))
    )
  )
  (module H_SOT:SOT-23 (layer B.Cu) (tedit 55F66754)
    (at 160.5 65.5)
    (fp_text reference D3 (at -1.05 -2.3) (layer B.SilkS))
    (fp_text value BAT54S (at 0 0 90) (layer B.Fab))
    (pad 1 smd rect (at -1.1 0.95) (size 1.3 0.9) (layers B.Cu B.Paste B.Mask)
      (net 12 "Net-(D3-Pad1)"))
    (pad 2 smd rect (at -1.1 -0.95) (size 1.3 0.9) (layers B.Cu B.Paste B.Mask)
      (net 13 "Net-(D3-Pad2)"))
    (pad 3 smd rect (at 1.1 0) (size 1.3 0.8) (layers B.Cu B.Paste B.Mask)
      (net 14 "Net-(D3-Pad3)"))
    (model I:/Electronics/Projects/Hardware/kicad_libs/3d_models/smd_transistor/sot23.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 90))
    )
  )
  (module H_diodes:Diode-MiniMELF_Standard (layer B.Cu) (tedit 57BDB911)
    (at 156 52.75 270)
    (descr "Diode Mini-MELF Standard")
    (tags "Diode Mini-MELF Standard")
    (attr smd)
    (fp_text reference D4 (at 1.75 -2 270) (layer B.SilkS))
    (fp_text value 1N4148 (at -0.15 0 270) (layer B.Fab))
    (pad 1 smd rect (at -1.75006 0 270) (size 1.30048 1.69926) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (pad 2 smd rect (at 1.75006 0 270) (size 1.30048 1.69926) (layers B.Cu B.Paste B.Mask)
      (net 6 /VDD))
    (model I:/Electronics/Projects/Hardware/kicad_libs/3d_models/Diodes_SMD.3dshapes/MiniMELF_Standard.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.39 0.39 0.39))
      (rotate (xyz 0 0 0))
    )
  )
  (module H_Fuses:Fuse_SMD1206_Reflow (layer B.Cu) (tedit 57BDB906)
    (at 152.25 54.25 180)
    (descr "Fuse, Sicherung, SMD1206, Littlefuse-Wickmann, Reflow,")
    (tags "Fuse, Sicherung, SMD1206,  Littlefuse-Wickmann, Reflow,")
    (attr smd)
    (fp_text reference F1 (at 3 0.25 180) (layer B.SilkS))
    (fp_text value 50mA (at 0 -0.05 180) (layer B.Fab))
    (pad 1 smd rect (at -1.20396 0 90) (size 2.02946 1.14046) (layers B.Cu B.Paste B.Mask)
      (net 6 /VDD))
    (pad 2 smd rect (at 1.20396 0 90) (size 2.02946 1.14046) (layers B.Cu B.Paste B.Mask)
      (net 15 /VIN))
    (model I:/Electronics/Projects/Hardware/kicad_libs/3d_models/fuses/Polyfuse_1206.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module H_soic:SOIC14 (layer B.Cu) (tedit 55F3DD6B)
    (at 157.75 72)
    (descr "SOIC,1.27mm pitch;14 pin,4.00mm W X 8.75mm L X 1.75mm H Body")
    (tags "CMS XXX")
    (attr smd)
    (fp_text reference IC1 (at -4.75 4.5) (layer B.SilkS))
    (fp_text value MCP6004 (at 0.1 -1.778 270) (layer B.Fab))
    (pad 1 smd rect (at -2.69748 3.81) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
      (net 19 "Net-(IC1-Pad1)"))
    (pad 2 smd oval (at -2.69748 2.54) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
      (net 19 "Net-(IC1-Pad1)"))
    (pad 3 smd oval (at -2.69748 1.27) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
      (net 3 "Net-(C2-Pad1)"))
    (pad 4 smd oval (at -2.69748 0) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
      (net 6 /VDD))
    (pad 5 smd oval (at -2.69748 -1.27) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
      (net 5 /Vmid))
    (pad 6 smd oval (at -2.69748 -2.54) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
      (net 7 "Net-(C7-Pad1)"))
    (pad 7 smd oval (at -2.69748 -3.81) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
      (net 8 "Net-(C7-Pad2)"))
    (pad 8 smd oval (at 2.69748 -3.81) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
      (net 14 "Net-(D3-Pad3)"))
    (pad 9 smd oval (at 2.69748 -2.54) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
      (net 12 "Net-(D3-Pad1)"))
    (pad 10 smd oval (at 2.69748 -1.27) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
      (net 5 /Vmid))
    (pad 11 smd oval (at 2.69748 0) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (pad 12 smd oval (at 2.69748 1.27) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
      (net 5 /Vmid))
    (pad 13 smd oval (at 2.69748 2.54) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
      (net 10 "Net-(D2-Pad2)"))
    (pad 14 smd oval (at 2.69748 3.81) (size 1.55 0.6) (layers B.Cu B.Paste B.Mask)
      (net 11 "Net-(D2-Pad3)"))
    (model Housings_SOIC.3dshapes/SOIC-14_3.9x8.7mm_Pitch1.27mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module H_pin_headers:1x3_254_socket_H (layer F.Cu) (tedit 57CE9BF5)
    (at 153.96 85.5)
    (fp_text reference P1 (at -0.635 5.08) (layer F.SilkS) hide)
    (fp_text value CONN_01X03 (at 0 -3.81) (layer F.Fab) hide)
    (pad 1 thru_hole rect (at 2.54 0) (size 1.8 1.8) (drill 0.9) (layers *.Cu *.Mask)
      (net 1 /VREF))
    (pad 2 thru_hole circle (at 0 0) (size 1.8 1.8) (drill 0.9) (layers *.Cu *.Mask)
      (net 16 "Net-(P1-Pad2)"))
    (pad 3 thru_hole circle (at -2.54 0) (size 1.8 1.8) (drill 0.9) (layers *.Cu *.Mask)
      (net 2 GND))
    (model I:/Electronics/Projects/Hardware/kicad_libs/3d_models/conn_kk100/22-23-2031.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module H_pin_headers:1x3_254_socket_H (layer F.Cu) (tedit 57CE9C03)
    (at 161 51 180)
    (fp_text reference P2 (at -0.635 5.08 180) (layer F.SilkS) hide)
    (fp_text value CONN_01X03 (at 0 -3.81 180) (layer F.Fab) hide)
    (pad 1 thru_hole rect (at 2.54 0 180) (size 1.8 1.8) (drill 0.9) (layers *.Cu *.Mask)
      (net 1 /VREF))
    (pad 2 thru_hole circle (at 0 0 180) (size 1.8 1.8) (drill 0.9) (layers *.Cu *.Mask)
      (net 20 "Net-(C8-Pad1)"))
    (pad 3 thru_hole circle (at -2.54 0 180) (size 1.8 1.8) (drill 0.9) (layers *.Cu *.Mask)
      (net 2 GND))
    (model I:/Electronics/Projects/Hardware/kicad_libs/3d_models/conn_kk100/22-23-2031.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module H_pin_headers:1x2_254_socket_H (layer F.Cu) (tedit 57CE9C0B)
    (at 152.27 51 180)
    (fp_text reference P3 (at 0 5.08 180) (layer F.SilkS) hide)
    (fp_text value CONN_01X02 (at 0 -3.81 180) (layer F.Fab) hide)
    (pad 1 thru_hole rect (at 1.27 0 180) (size 1.8 1.8) (drill 0.9) (layers *.Cu *.Mask)
      (net 15 /VIN))
    (pad 2 thru_hole circle (at -1.27 0 180) (size 1.8 1.8) (drill 0.9) (layers *.Cu *.Mask)
      (net 2 GND))
    (model I:/Electronics/Projects/Hardware/kicad_libs/3d_models/conn_kk100/22-23-2021.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module H_smd_passives:RESC_0805_2012X50N (layer B.Cu) (tedit 55F3DA05)
    (at 153 83.2)
    (descr "Resistor,Chip;2.05mm L X 1.25mm W X 0.50mm H")
    (tags "CMS XXX")
    (attr smd)
    (fp_text reference R1 (at -1.05 -1.6) (layer B.SilkS))
    (fp_text value 1k (at 0 0) (layer B.Fab))
    (pad 1 smd rect (at -0.99822 0) (size 0.94996 1.4478) (layers B.Cu B.Paste B.Mask)
      (net 3 "Net-(C2-Pad1)"))
    (pad 2 smd rect (at 0.99822 0) (size 0.94996 1.4478) (layers B.Cu B.Paste B.Mask)
      (net 16 "Net-(P1-Pad2)"))
    (model Resistors_SMD.3dshapes/R_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module H_smd_passives:RESC_0805_2012X50N (layer B.Cu) (tedit 55F3DA05)
    (at 157.25 78.5 270)
    (descr "Resistor,Chip;2.05mm L X 1.25mm W X 0.50mm H")
    (tags "CMS XXX")
    (attr smd)
    (fp_text reference R2 (at -0.7 1.7 360) (layer B.SilkS))
    (fp_text value 10k (at 0 0 270) (layer B.Fab))
    (pad 1 smd rect (at -0.99822 0 270) (size 0.94996 1.4478) (layers B.Cu B.Paste B.Mask)
      (net 10 "Net-(D2-Pad2)"))
    (pad 2 smd rect (at 0.99822 0 270) (size 0.94996 1.4478) (layers B.Cu B.Paste B.Mask)
      (net 19 "Net-(IC1-Pad1)"))
    (model Resistors_SMD.3dshapes/R_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module H_smd_passives:RESC_0805_2012X50N (layer B.Cu) (tedit 55F3DA05)
    (at 163.4 72.5)
    (descr "Resistor,Chip;2.05mm L X 1.25mm W X 0.50mm H")
    (tags "CMS XXX")
    (attr smd)
    (fp_text reference R3 (at 2.35 -0.1 90) (layer B.SilkS))
    (fp_text value 10k (at 0 0) (layer B.Fab))
    (pad 1 smd rect (at -0.99822 0) (size 0.94996 1.4478) (layers B.Cu B.Paste B.Mask)
      (net 12 "Net-(D3-Pad1)"))
    (pad 2 smd rect (at 0.99822 0) (size 0.94996 1.4478) (layers B.Cu B.Paste B.Mask)
      (net 19 "Net-(IC1-Pad1)"))
    (model Resistors_SMD.3dshapes/R_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module H_smd_passives:RESC_0805_2012X50N (layer B.Cu) (tedit 55F3DA05)
    (at 163 75.4 90)
    (descr "Resistor,Chip;2.05mm L X 1.25mm W X 0.50mm H")
    (tags "CMS XXX")
    (attr smd)
    (fp_text reference R4 (at 0 1.75 180) (layer B.SilkS))
    (fp_text value 10k (at 0 0 90) (layer B.Fab))
    (pad 1 smd rect (at -0.99822 0 90) (size 0.94996 1.4478) (layers B.Cu B.Paste B.Mask)
      (net 9 "Net-(D2-Pad1)"))
    (pad 2 smd rect (at 0.99822 0 90) (size 0.94996 1.4478) (layers B.Cu B.Paste B.Mask)
      (net 10 "Net-(D2-Pad2)"))
    (model Resistors_SMD.3dshapes/R_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module H_smd_passives:RESC_0805_2012X50N (layer B.Cu) (tedit 55F3DA05)
    (at 162.75 69.25 270)
    (descr "Resistor,Chip;2.05mm L X 1.25mm W X 0.50mm H")
    (tags "CMS XXX")
    (attr smd)
    (fp_text reference R5 (at -2.35 0.2 360) (layer B.SilkS))
    (fp_text value 10k (at 0 0 270) (layer B.Fab))
    (pad 1 smd rect (at -0.99822 0 270) (size 0.94996 1.4478) (layers B.Cu B.Paste B.Mask)
      (net 13 "Net-(D3-Pad2)"))
    (pad 2 smd rect (at 0.99822 0 270) (size 0.94996 1.4478) (layers B.Cu B.Paste B.Mask)
      (net 12 "Net-(D3-Pad1)"))
    (model Resistors_SMD.3dshapes/R_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module H_smd_passives:RESC_0805_2012X50N (layer B.Cu) (tedit 55F3DA05)
    (at 151.75 70.25)
    (descr "Resistor,Chip;2.05mm L X 1.25mm W X 0.50mm H")
    (tags "CMS XXX")
    (attr smd)
    (fp_text reference R6 (at -2.75 0) (layer B.SilkS))
    (fp_text value 3k3 (at 0 0) (layer B.Fab))
    (pad 1 smd rect (at -0.99822 0) (size 0.94996 1.4478) (layers B.Cu B.Paste B.Mask)
      (net 17 "Net-(R6-Pad1)"))
    (pad 2 smd rect (at 0.99822 0) (size 0.94996 1.4478) (layers B.Cu B.Paste B.Mask)
      (net 9 "Net-(D2-Pad1)"))
    (model Resistors_SMD.3dshapes/R_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module H_smd_passives:RESC_0805_2012X50N (layer B.Cu) (tedit 55F3DA05)
    (at 151.75 68)
    (descr "Resistor,Chip;2.05mm L X 1.25mm W X 0.50mm H")
    (tags "CMS XXX")
    (attr smd)
    (fp_text reference R7 (at -2.75 0) (layer B.SilkS))
    (fp_text value 3k3 (at 0 0) (layer B.Fab))
    (pad 1 smd rect (at -0.99822 0) (size 0.94996 1.4478) (layers B.Cu B.Paste B.Mask)
      (net 18 "Net-(R7-Pad1)"))
    (pad 2 smd rect (at 0.99822 0) (size 0.94996 1.4478) (layers B.Cu B.Paste B.Mask)
      (net 13 "Net-(D3-Pad2)"))
    (model Resistors_SMD.3dshapes/R_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module H_smd_passives:RESC_0805_2012X50N (layer B.Cu) (tedit 55F3DA05)
    (at 163.15 81.5)
    (descr "Resistor,Chip;2.05mm L X 1.25mm W X 0.50mm H")
    (tags "CMS XXX")
    (attr smd)
    (fp_text reference R8 (at 1 -1.6) (layer B.SilkS))
    (fp_text value 20k (at 0 0) (layer B.Fab))
    (pad 1 smd rect (at -0.99822 0) (size 0.94996 1.4478) (layers B.Cu B.Paste B.Mask)
      (net 10 "Net-(D2-Pad2)"))
    (pad 2 smd rect (at 0.99822 0) (size 0.94996 1.4478) (layers B.Cu B.Paste B.Mask)
      (net 4 "Net-(C3-Pad1)"))
    (model Resistors_SMD.3dshapes/R_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module H_smd_passives:RESC_0805_2012X50N (layer B.Cu) (tedit 55F3DA05)
    (at 150.75 56.75 180)
    (descr "Resistor,Chip;2.05mm L X 1.25mm W X 0.50mm H")
    (tags "CMS XXX")
    (attr smd)
    (fp_text reference R9 (at 0 -1.75 180) (layer B.SilkS))
    (fp_text value 10k (at 0 0 180) (layer B.Fab))
    (pad 1 smd rect (at -0.99822 0 180) (size 0.94996 1.4478) (layers B.Cu B.Paste B.Mask)
      (net 6 /VDD))
    (pad 2 smd rect (at 0.99822 0 180) (size 0.94996 1.4478) (layers B.Cu B.Paste B.Mask)
      (net 5 /Vmid))
    (model Resistors_SMD.3dshapes/R_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module H_smd_passives:RESC_0805_2012X50N (layer B.Cu) (tedit 55F3DA05)
    (at 160.75 58.25)
    (descr "Resistor,Chip;2.05mm L X 1.25mm W X 0.50mm H")
    (tags "CMS XXX")
    (attr smd)
    (fp_text reference R10 (at 3 0) (layer B.SilkS))
    (fp_text value 10k (at 0 0) (layer B.Fab))
    (pad 1 smd rect (at -0.99822 0) (size 0.94996 1.4478) (layers B.Cu B.Paste B.Mask)
      (net 5 /Vmid))
    (pad 2 smd rect (at 0.99822 0) (size 0.94996 1.4478) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model Resistors_SMD.3dshapes/R_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module H_smd_passives:RESC_0805_2012X50N (layer B.Cu) (tedit 55F3DA05)
    (at 155.75 66.25)
    (descr "Resistor,Chip;2.05mm L X 1.25mm W X 0.50mm H")
    (tags "CMS XXX")
    (attr smd)
    (fp_text reference R11 (at -3 0) (layer B.SilkS))
    (fp_text value 10k (at 0 0) (layer B.Fab))
    (pad 1 smd rect (at -0.99822 0) (size 0.94996 1.4478) (layers B.Cu B.Paste B.Mask)
      (net 8 "Net-(C7-Pad2)"))
    (pad 2 smd rect (at 0.99822 0) (size 0.94996 1.4478) (layers B.Cu B.Paste B.Mask)
      (net 7 "Net-(C7-Pad1)"))
    (model Resistors_SMD.3dshapes/R_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module H_smd_passives:RESC_0805_2012X50N (layer B.Cu) (tedit 55F3DA05)
    (at 150.75 62.5 270)
    (descr "Resistor,Chip;2.05mm L X 1.25mm W X 0.50mm H")
    (tags "CMS XXX")
    (attr smd)
    (fp_text reference R12 (at 0.75 1.75 270) (layer B.SilkS))
    (fp_text value 220R (at 0 0 270) (layer B.Fab))
    (pad 1 smd rect (at -0.99822 0 270) (size 0.94996 1.4478) (layers B.Cu B.Paste B.Mask)
      (net 20 "Net-(C8-Pad1)"))
    (pad 2 smd rect (at 0.99822 0 270) (size 0.94996 1.4478) (layers B.Cu B.Paste B.Mask)
      (net 8 "Net-(C7-Pad2)"))
    (model Resistors_SMD.3dshapes/R_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module H_smd_passives:CAPC_0805_2012X70N (layer B.Cu) (tedit 55F3DAB9)
    (at 162 53.5)
    (descr "Capacitor,non-polarized,Chip;2.00mm L X 1.25mm W X 0.70mm H")
    (tags "CMS XXX")
    (attr smd)
    (fp_text reference C8 (at 2.75 1) (layer B.SilkS))
    (fp_text value 100n (at 0 0) (layer B.Fab))
    (pad 1 smd rect (at -0.89916 0) (size 1.14808 1.4478) (layers B.Cu B.Paste B.Mask)
      (net 20 "Net-(C8-Pad1)"))
    (pad 2 smd rect (at 0.89916 0) (size 1.14808 1.4478) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model Capacitors_SMD.3dshapes/C_0805_HandSoldering.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module H_switches:PCB_jumper_2 (layer B.Cu) (tedit 565CC1D4)
    (at 161 55.75 270)
    (descr "PCB solder blob jumper")
    (attr smd)
    (fp_text reference JP1 (at 0 -1.75 270) (layer B.SilkS))
    (fp_text value Jumper_NO_Small (at -0.05 0 270) (layer B.Fab) hide)
    (pad 1 smd rect (at -0.5 0.15 270) (size 0.3 0.9) (layers B.Cu B.Mask)
      (net 6 /VDD))
    (pad 2 smd rect (at 0 -0.15 180) (size 0.9 0.3) (layers B.Cu B.Mask)
      (net 1 /VREF))
    (pad 1 smd rect (at 0.5 0.15 270) (size 0.3 0.9) (layers B.Cu B.Mask)
      (net 6 /VDD))
    (pad 1 smd rect (at 0 0.65 180) (size 0.3 1.3) (layers B.Cu B.Mask)
      (net 6 /VDD))
    (pad 2 smd rect (at 0 -0.65 90) (size 1.3 0.3) (layers B.Cu B.Mask)
      (net 1 /VREF))
  )
  (module H_smd_passives:RESC_0805_2012X50N (layer B.Cu) (tedit 55F3DA05)
    (at 156.75 82.25 180)
    (descr "Resistor,Chip;2.05mm L X 1.25mm W X 0.50mm H")
    (tags "CMS XXX")
    (attr smd)
    (fp_text reference R13 (at -0.2 -1.55 180) (layer B.SilkS))
    (fp_text value 2M2 (at 0 0 180) (layer B.Fab))
    (pad 1 smd rect (at -0.99822 0 180) (size 0.94996 1.4478) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (pad 2 smd rect (at 0.99822 0 180) (size 0.94996 1.4478) (layers B.Cu B.Paste B.Mask)
      (net 16 "Net-(P1-Pad2)"))
    (model Resistors_SMD.3dshapes/R_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module H_smd_passives:RESC_0805_2012X50N (layer B.Cu) (tedit 55F3DA05)
    (at 164.85 69.2 90)
    (descr "Resistor,Chip;2.05mm L X 1.25mm W X 0.50mm H")
    (tags "CMS XXX")
    (attr smd)
    (fp_text reference R14 (at 4.8 0.4 90) (layer B.SilkS))
    (fp_text value 20k (at 0 0 90) (layer B.Fab))
    (pad 1 smd rect (at -0.99822 0 90) (size 0.94996 1.4478) (layers B.Cu B.Paste B.Mask)
      (net 12 "Net-(D3-Pad1)"))
    (pad 2 smd rect (at 0.99822 0 90) (size 0.94996 1.4478) (layers B.Cu B.Paste B.Mask)
      (net 4 "Net-(C3-Pad1)"))
    (model Resistors_SMD.3dshapes/R_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module H_pots:Trimpot_SMD_mini (layer F.Cu) (tedit 57CE93C8)
    (at 152 62.5 90)
    (fp_text reference RV1 (at 0.05 3.45 90) (layer F.SilkS) hide)
    (fp_text value 10k (at 0.05 -3.3 90) (layer F.Fab))
    (pad 3 smd rect (at 1 1.8 90) (size 1.2 1.2) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad 2 smd rect (at 0 -1.45 90) (size 1.6 1.5) (layers F.Cu F.Paste F.Mask)
      (net 4 "Net-(C3-Pad1)"))
    (pad 1 smd rect (at -1 1.8 90) (size 1.2 1.2) (layers F.Cu F.Paste F.Mask)
      (net 6 /VDD))
    (model I:/Electronics/Projects/Hardware/kicad_libs/3d_models/smd_resistors/trim_murata_pva2a.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1.3 1.3 1.3))
      (rotate (xyz 0 0 0))
    )
  )
  (module H_pots:Trimpot_SMD_mini (layer F.Cu) (tedit 57CE93C8)
    (at 152 73 90)
    (fp_text reference RV2 (at 0.05 3.45 90) (layer F.SilkS) hide)
    (fp_text value 10k (at 0.05 -3.3 90) (layer F.Fab))
    (pad 3 smd rect (at 1 1.8 90) (size 1.2 1.2) (layers F.Cu F.Paste F.Mask)
      (net 7 "Net-(C7-Pad1)"))
    (pad 2 smd rect (at 0 -1.45 90) (size 1.6 1.5) (layers F.Cu F.Paste F.Mask)
      (net 17 "Net-(R6-Pad1)"))
    (pad 1 smd rect (at -1 1.8 90) (size 1.2 1.2) (layers F.Cu F.Paste F.Mask)
      (net 17 "Net-(R6-Pad1)"))
    (model I:/Electronics/Projects/Hardware/kicad_libs/3d_models/smd_resistors/trim_murata_pva2a.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1.3 1.3 1.3))
      (rotate (xyz 0 0 0))
    )
  )
  (gr_text "Rev. 2.0" (at 162.05 87.4) (layer F.SilkS))
  (gr_text ZERO (at 157.75 62.5) (layer F.SilkS))
  (gr_text "(c) 2016\nPiotr Zapart" (at 162.25 84.2) (layer F.SilkS))
  (gr_text VCC (at 148.75 51 90) (layer F.SilkS))
  (gr_text VCC=Vref (at 162.5 48.75) (layer B.SilkS))
  (gr_text "-HALL PREAMP-" (at 149.5 77.5) (layer F.SilkS))
  (gr_text GND (at 151.5 80.8 90) (layer F.SilkS))
  (gr_text sig (at 154 81.05 90) (layer F.SilkS))
  (gr_text "Vref/\nVCC" (at 157.25 80.55 90) (layer F.SilkS))
  (gr_arc (start 164.749999 87) (end 166.75 87) (angle 90) (layer Edge.Cuts) (width 0.15))
  (gr_arc (start 149.75 86.999999) (end 149.75 89) (angle 90) (layer Edge.Cuts) (width 0.15))
  (gr_arc (start 164.75 49.500001) (end 164.75 47.5) (angle 90) (layer Edge.Cuts) (width 0.15))
  (gr_arc (start 149.75 49.5) (end 147.749999 49.5) (angle 90) (layer Edge.Cuts) (width 0.15))
  (gr_text sig (at 161 55) (layer F.SilkS))
  (gr_text GND (at 163.5 55.75 90) (layer F.SilkS))
  (gr_text Vref (at 158.5 55.75 90) (layer F.SilkS))
  (gr_text ADC (at 161 57) (layer F.SilkS))
  (gr_text - (at 153.5 54.8) (layer F.SilkS))
  (gr_text + (at 150.75 54.8) (layer F.SilkS))
  (gr_text PWR (at 152.25 57) (layer F.SilkS))
  (gr_text GAIN (at 158.75 70.5) (layer F.SilkS))
  (gr_text NEGATIVE (at 155.25 73) (layer F.SilkS))
  (gr_text POSITIVE (at 155 67.75) (layer F.SilkS))
  (gr_text - (at 153.85 64.6) (layer F.SilkS))
  (gr_text + (at 153.75 59.8) (layer F.SilkS))
  (gr_line (start 149.75 47.5) (end 164.75 47.5) (layer Edge.Cuts) (width 0.15))
  (gr_line (start 147.75 87) (end 147.75 49.5) (layer Edge.Cuts) (width 0.15))
  (dimension 19 (width 0.3) (layer Dwgs.User)
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