(kicad_pcb (version 20171130) (host pcbnew "(5.1.4-0-10_14)")
  (general
    (thickness 1.6)
    (drawings 16)
    (tracks 99)
    (zones 0)
    (modules 11)
    (nets 11)
  )
  (page A4)
  (layers
    (0 F.Cu signal)
    (31 B.Cu signal)
    (32 B.Adhes user)
    (33 F.Adhes user)
    (34 B.Paste user)
    (35 F.Paste user)
    (36 B.SilkS user)
    (37 F.SilkS user)
    (38 B.Mask user)
    (39 F.Mask user)
    (40 Dwgs.User user)
    (41 Cmts.User user)
    (42 Eco1.User user)
    (43 Eco2.User user)
    (44 Edge.Cuts user)
    (45 Margin user)
    (46 B.CrtYd user)
    (47 F.CrtYd user)
    (48 B.Fab user)
    (49 F.Fab user)
  )
  (setup
    (last_trace_width 0.4572)
    (user_trace_width 0.1524)
    (user_trace_width 0.3048)
    (user_trace_width 0.4572)
    (trace_clearance 0.1524)
    (zone_clearance 0.1524)
    (zone_45_only no)
    (trace_min 0.1524)
    (via_size 0.3302)
    (via_drill 0.254)
    (via_min_size 0.3302)
    (via_min_drill 0.254)
    (user_via 0.3302 0.254)
    (uvia_size 0.3)
    (uvia_drill 0.1)
    (uvias_allowed no)
    (uvia_min_size 0.2)
    (uvia_min_drill 0.1)
    (edge_width 0.05)
    (segment_width 0.2)
    (pcb_text_width 0.3)
    (pcb_text_size 1.5 1.5)
    (mod_edge_width 0.12)
    (mod_text_size 1 1)
    (mod_text_width 0.15)
    (pad_size 1.524 1.524)
    (pad_drill 0.762)
    (pad_to_mask_clearance 0.051)
    (solder_mask_min_width 0.25)
    (aux_axis_origin 0 0)
    (visible_elements FFFFFF7F)
    (pcbplotparams
      (layerselection 0x010fc_ffffffff)
      (usegerberextensions false)
      (usegerberattributes false)
      (usegerberadvancedattributes false)
      (creategerberjobfile false)
      (excludeedgelayer true)
      (linewidth 0.100000)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (padsonsilk false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 1)
      (scaleselection 1)
      (outputdirectory ""))
  )
  (net 0 "")
  (net 1 GND)
  (net 2 /VUSB)
  (net 3 /VBUS)
  (net 4 "Net-(D1-Pad2)")
  (net 5 "Net-(D1-Pad1)")
  (net 6 "Net-(F1-Pad1)")
  (net 7 /27)
  (net 8 /D+)
  (net 9 /D-)
  (net 10 "Net-(JP1-Pad2)")
  (net_class Default "This is the default net class."
    (clearance 0.1524)
    (trace_width 0.1524)
    (via_dia 0.3302)
    (via_drill 0.254)
    (uvia_dia 0.3)
    (uvia_drill 0.1)
    (add_net /27)
    (add_net /D+)
    (add_net /D-)
    (add_net /VBUS)
    (add_net /VUSB)
    (add_net GND)
    (add_net "Net-(D1-Pad1)")
    (add_net "Net-(D1-Pad2)")
    (add_net "Net-(F1-Pad1)")
    (add_net "Net-(JP1-Pad2)")
  )
  (module Capacitor_SMD:C_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 178.6636 113.411)
    (descr "Capacitor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C2 (at 0.0254 -1.27) (layer F.SilkS))
    (fp_text value 100u (at 0 1.82) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 1.4875 0) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.4875 0) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 3 /VBUS))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B36C52B)
    (at 163.2712 112.6236)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C1 (at -2.4892 -0.8636 90) (layer F.SilkS))
    (fp_text value 2u2 (at 0 1.65) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 2 /VUSB))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Inductor_SMD:L_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B36C52B)
    (at 163.1188 114.6302 180)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "inductor handsolder")
    (attr smd)
    (fp_text reference F1 (at 2.3368 0.5842 90) (layer F.SilkS))
    (fp_text value 500mA (at 0 1.65) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 2 /VUSB))
    (pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 6 "Net-(F1-Pad1)"))
    (model ${KISYS3DMOD}/Inductor_SMD.3dshapes/L_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_TO_SOT_SMD:SOT-23-6 (layer F.Cu) (tedit 5A02FF57)
    (at 174.5488 116.332)
    (descr "6-pin SOT-23 package")
    (tags SOT-23-6)
    (attr smd)
    (fp_text reference U1 (at 0.2032 -2.032) (layer F.SilkS))
    (fp_text value TPD3S014 (at 0 2.9) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 5 smd rect (at 1.1 0) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask)
      (net 8 /D+))
    (pad 6 smd rect (at 1.1 -0.95) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask)
      (net 9 /D-))
    (pad 4 smd rect (at 1.1 0.95) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask)
      (net 3 /VBUS))
    (pad 3 smd rect (at -1.1 0.95) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask)
      (net 5 "Net-(D1-Pad1)"))
    (pad 2 smd rect (at -1.1 0) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 1 smd rect (at -1.1 -0.95) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask)
      (net 10 "Net-(JP1-Pad2)"))
    (model ${KISYS3DMOD}/Package_TO_SOT_SMD.3dshapes/SOT-23-6.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B36C52B)
    (at 178.7906 116.5098)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R1 (at 0 -1.3208) (layer F.SilkS))
    (fp_text value 100k (at 0 1.65) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 10 "Net-(JP1-Pad2)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Inductor_SMD:L_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B36C52B)
    (at 166.8526 116.0272 270)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "inductor handsolder")
    (attr smd)
    (fp_text reference L1 (at 0 1.4986 90) (layer F.SilkS))
    (fp_text value "ferrite 150" (at 0 1.65 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 4 "Net-(D1-Pad2)"))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 6 "Net-(F1-Pad1)"))
    (model ${KISYS3DMOD}/Inductor_SMD.3dshapes/L_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Jumper:SolderJumper-2_P1.3mm_Open_RoundedPad1.0x1.5mm (layer F.Cu) (tedit 5B391E66)
    (at 163.0172 116.84)
    (descr "SMD Solder Jumper, 1x1.5mm, rounded Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference JP1 (at -2.2352 -0.254 90) (layer F.SilkS))
    (fp_text value EN (at 0.2478 2.3226) (layer F.Fab))
    (pad 2 smd custom (at 0.65 0) (size 1 0.5) (layers F.Cu F.Mask)
      (net 10 "Net-(JP1-Pad2)") (zone_connect 2)
      (options (clearance outline) (anchor rect))
      (primitives
        (gr_circle (center 0 0.25) (end 0.5 0.25) (width 0))
        (gr_circle (center 0 -0.25) (end 0.5 -0.25) (width 0))
        (gr_poly (pts
           (xy 0 -0.75) (xy -0.5 -0.75) (xy -0.5 0.75) (xy 0 0.75)) (width 0))
      ))
    (pad 1 smd custom (at -0.65 0) (size 1 0.5) (layers F.Cu F.Mask)
      (net 7 /27) (zone_connect 2)
      (options (clearance outline) (anchor rect))
      (primitives
        (gr_circle (center 0 0.25) (end 0.5 0.25) (width 0))
        (gr_circle (center 0 -0.25) (end 0.5 -0.25) (width 0))
        (gr_poly (pts
           (xy 0 -0.75) (xy 0.5 -0.75) (xy 0.5 0.75) (xy 0 0.75)) (width 0))
      ))
  )
  (module USB_A_Receptacle_SMD_Wuerth_629104190121:USB_A_Receptacle_SMD_Wuerth_629104190121 (layer F.Cu) (tedit 5D7E69EB)
    (at 171.0182 112.4712 180)
    (fp_text reference J2 (at 0.1 12.1) (layer F.SilkS) hide)
    (fp_text value USB_A (at -0.3 -2.5) (layer F.Fab))
    (pad "" np_thru_hole circle (at 2.45 2.7 180) (size 1.5 1.5) (drill 1.5) (layers *.Cu *.Mask))
    (pad "" np_thru_hole circle (at -2.45 2.7 180) (size 1.5 1.5) (drill 1.5) (layers *.Cu *.Mask))
    (pad 5 smd rect (at 7.625 8.1 180) (size 3.5 2) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 5 smd rect (at 7.625 2 180) (size 3.5 2) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 5 smd rect (at -7.625 8.1 180) (size 3.5 2) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 5 smd rect (at -7.625 2 180) (size 3.5 2) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 4 smd rect (at 3.5 0 180) (size 1.25 2) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 3 smd rect (at 1 0 180) (size 1.25 2) (layers F.Cu F.Paste F.Mask)
      (net 8 /D+))
    (pad 2 smd rect (at -1 0 180) (size 1.25 2) (layers F.Cu F.Paste F.Mask)
      (net 9 /D-))
    (pad 1 smd rect (at -3.5 0 180) (size 1.25 2) (layers F.Cu F.Paste F.Mask)
      (net 3 /VBUS))
  )
  (module Connector_PinHeader_2.54mm:PinHeader_1x06_P2.54mm_Vertical (layer F.Cu) (tedit 59FED5CC)
    (at 158.75 104.14)
    (descr "Through hole straight pin header, 1x06, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x06 2.54mm single row")
    (fp_text reference J1 (at 0 -2.33) (layer F.SilkS) hide)
    (fp_text value Conn_01x06 (at 0 15.03) (layer F.Fab))
    (fp_text user %R (at 0 6.35 90) (layer F.Fab))
    (pad 6 thru_hole oval (at 0 12.7) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 7 /27))
    (pad 5 thru_hole oval (at 0 10.16) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 4 thru_hole oval (at 0 7.62) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 3 thru_hole oval (at 0 5.08) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 8 /D+))
    (pad 2 thru_hole oval (at 0 2.54) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 9 /D-))
    (pad 1 thru_hole rect (at 0 0) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 2 /VUSB))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x06_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Diode_SMD:D_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B4B45C8)
    (at 170.2562 117.1448 180)
    (descr "Diode SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "diode handsolder")
    (attr smd)
    (fp_text reference D2 (at -1.1938 6.6548) (layer F.SilkS))
    (fp_text value 1A (at 0 1.65) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 4 "Net-(D1-Pad2)"))
    (pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 5 "Net-(D1-Pad1)"))
    (model ${KISYS3DMOD}/Diode_SMD.3dshapes/D_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Diode_SMD:D_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B4B45C8)
    (at 170.2562 115.0874 180)
    (descr "Diode SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "diode handsolder")
    (attr smd)
    (fp_text reference D1 (at -1.1938 6.1214) (layer F.SilkS))
    (fp_text value 1A (at 0 1.65) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 4 "Net-(D1-Pad2)"))
    (pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 5 "Net-(D1-Pad1)"))
    (model ${KISYS3DMOD}/Diode_SMD.3dshapes/D_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (gr_text "2019-09-21\n\nTeensy 4.0\nUSB Host\nBreakout\n" (at 181.356 111.76) (layer B.SilkS))
  (gr_text 27/EN (at 160.02 116.84) (layer B.SilkS))
  (gr_text GND (at 160.02 114.3) (layer B.SilkS))
  (gr_text GND (at 160.02 111.76) (layer B.SilkS))
  (gr_text D+ (at 160.02 109.22) (layer B.SilkS))
  (gr_text D- (at 160.02 106.68) (layer B.SilkS))
  (gr_text VUSB (at 160.02 104.14) (layer B.SilkS))
  (gr_line (start 157.48 118.11) (end 157.48 102.87) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 181.61 118.11) (end 157.48 118.11) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 181.61 102.87) (end 181.61 118.11) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 157.48 102.87) (end 181.61 102.87) (layer Edge.Cuts) (width 0.05))
  (zone (net 1) (net_name GND) (layer B.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.1524))
    (min_thickness 0.1524)
    (fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 182.88 101.6) (xy 182.88 119.38) (xy 154.94 119.38) (xy 154.94 101.6) (xy 157.48 101.6)
      )
    )
  )
)
