(kicad_pcb (version 20211014) (generator pcbnew)
  (general
    (thickness 1.6)
  )
  (paper "A4")
  (title_block
    (title "Pre-Pressure board")
    (date "10/11/2022")
    (rev "v01")
    (company "NHMFL")
    (comment 1 "Sujana Uppalapati")
  )
  (layers
    (0 "F.Cu" signal)
    (31 "B.Cu" signal)
    (32 "B.Adhes" user "B.Adhesive")
    (33 "F.Adhes" user "F.Adhesive")
    (34 "B.Paste" user)
    (35 "F.Paste" user)
    (36 "B.SilkS" user "B.Silkscreen")
    (37 "F.SilkS" user "F.Silkscreen")
    (38 "B.Mask" user)
    (39 "F.Mask" user)
    (40 "Dwgs.User" user "User.Drawings")
    (41 "Cmts.User" user "User.Comments")
    (42 "Eco1.User" user "User.Eco1")
    (43 "Eco2.User" user "User.Eco2")
    (44 "Edge.Cuts" user)
    (45 "Margin" user)
    (46 "B.CrtYd" user "B.Courtyard")
    (47 "F.CrtYd" user "F.Courtyard")
    (48 "B.Fab" user)
    (49 "F.Fab" user)
    (50 "User.1" user)
    (51 "User.2" user)
    (52 "User.3" user)
    (53 "User.4" user)
    (54 "User.5" user)
    (55 "User.6" user)
    (56 "User.7" user)
    (57 "User.8" user)
    (58 "User.9" user)
  )
  (setup
    (stackup
      (layer "F.SilkS" (type "Top Silk Screen"))
      (layer "F.Paste" (type "Top Solder Paste"))
      (layer "F.Mask" (type "Top Solder Mask") (thickness 0.01))
      (layer "F.Cu" (type "copper") (thickness 0.035))
      (layer "dielectric 1" (type "core") (thickness 1.51) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
      (layer "B.Cu" (type "copper") (thickness 0.035))
      (layer "B.Mask" (type "Bottom Solder Mask") (thickness 0.01))
      (layer "B.Paste" (type "Bottom Solder Paste"))
      (layer "B.SilkS" (type "Bottom Silk Screen"))
      (copper_finish "None")
      (dielectric_constraints no)
    )
    (pad_to_mask_clearance 0)
    (pcbplotparams
      (layerselection 0x00010fc_ffffffff)
      (disableapertmacros false)
      (usegerberextensions false)
      (usegerberattributes true)
      (usegerberadvancedattributes true)
      (creategerberjobfile true)
      (svguseinch false)
      (svgprecision 6)
      (excludeedgelayer true)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (dxfpolygonmode true)
      (dxfimperialunits true)
      (dxfusepcbnewfont true)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (sketchpadsonfab false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 1)
      (scaleselection 1)
      (outputdirectory "")
    )
  )
  (net 0 "")
  (net 1 "Net-(C1-Pad1)")
  (net 2 "GND")
  (net 3 "Net-(C2-Pad1)")
  (footprint "ap_Cap_SMD:C_1206" (layer "F.Cu")
    (tedit 5F3ADD4B)
    (at 123.76871 84.421671 -90)
    (descr "Capacitor SMD 1206 Package")
    (tags "1206")
    (property "Sheetfile" "Pre-Pressure Board.kicad_sch")
    (property "Sheetname" "")
    (attr smd)
    (fp_text reference "C1" (at -1.9 0.05) (layer "F.SilkS"))
    (fp_text value "0.1uf" (at 1.778 3.7465 90) (layer "F.Fab") hide)
    (pad "1" smd rect locked (at 0 0 270) (size 1.7272 1.8288) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "Net-(C1-Pad1)") (pinfunction "1") (pintype "passive"))
    (pad "2" smd rect locked (at 3.048 0 270) (size 1.7272 1.8288) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "GND") (pinfunction "2") (pintype "passive"))
    (model "${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1206_3216Metric.step"
      (offset (xyz 1.524 -0.0127 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "ap_Pad_Hole:125_Hole_Iso" (layer "F.Cu")
    (tedit 5F1621FD)
    (at 97.79 105.41)
    (property "Sheetfile" "Pre-Pressure Board.kicad_sch")
    (property "Sheetname" "")
    (attr through_hole)
    (fp_text reference "Pad2" (at 0.635 3.81) (layer "F.SilkS") hide)
    (fp_text value "125_hole_iso" (at 0.635 5.715) (layer "F.Fab") hide)
    (pad "" np_thru_hole circle locked (at 0 0) (size 3.175 3.175) (drill 3.175) (layers *.Cu *.Mask)
      (solder_mask_margin 4.445) (clearance 4.445))
  )
  (footprint "ap_Connector_Phoenix:MCV_4Pin_1803442" (layer "F.Cu")
    (tedit 5F3AFFC7)
    (at 134.36211 95.612971 90)
    (property "Sheetfile" "Pre-Pressure Board.kicad_sch")
    (property "Sheetname" "")
    (attr through_hole)
    (fp_text reference "J2" (at -4.0469 4.0223 90) (layer "F.SilkS"))
    (fp_text value "MCV_4Pin_1803442" (at 3.81 6.35 90) (layer "F.Fab") hide)
    (pad "1" thru_hole roundrect (at 0 0 90) (size 2.54 5.08) (drill 1.4224) (layers *.Cu *.Mask) (roundrect_rratio 0.25)
      (net 1 "Net-(C1-Pad1)") (pinfunction "1") (pintype "passive"))
    (pad "2" thru_hole roundrect (at 3.81 0 90) (size 2.54 5.08) (drill 1.4224) (layers *.Cu *.Mask) (roundrect_rratio 0.25)
      (net 2 "GND") (pinfunction "2") (pintype "passive"))
    (pad "3" thru_hole roundrect (at 7.62 0 90) (size 2.54 5.08) (drill 1.4224) (layers *.Cu *.Mask) (roundrect_rratio 0.25)
      (net 3 "Net-(C2-Pad1)") (pinfunction "3") (pintype "passive"))
    (pad "4" thru_hole roundrect (at 11.43 0 90) (size 2.54 5.08) (drill 1.4224) (layers *.Cu *.Mask) (roundrect_rratio 0.25)
      (net 2 "GND") (pinfunction "4") (pintype "passive"))
    (model "${KISYS3DMOD}/Connector_Phoenix_MC.3dshapes/MCV_6-Pin_1803468.stp"
      (offset (xyz -2.5908 -3.4798 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "ap_Pad_Hole:125_Hole_Iso" (layer "F.Cu")
    (tedit 5F1621FD)
    (at 152.4 76.2)
    (property "Sheetfile" "Pre-Pressure Board.kicad_sch")
    (property "Sheetname" "")
    (attr through_hole)
    (fp_text reference "Pad4" (at 0.635 3.81) (layer "F.SilkS") hide)
    (fp_text value "125_hole_iso" (at 0.635 5.715) (layer "F.Fab") hide)
    (pad "" np_thru_hole circle locked (at 0 0) (size 3.175 3.175) (drill 3.175) (layers *.Cu *.Mask)
      (solder_mask_margin 4.445) (clearance 4.445))
  )
  (footprint "ap_Resistor_SMD:R_1206" (layer "F.Cu")
    (tedit 5F3AF27A)
    (at 117.76871 92.021671 -90)
    (descr "Resistor SMD 1206 Package")
    (tags "1206")
    (property "Sheetfile" "Pre-Pressure Board.kicad_sch")
    (property "Sheetname" "")
    (attr smd)
    (fp_text reference "R2" (at -1.9 0.05 180) (layer "F.SilkS"))
    (fp_text value "500 ohms" (at 1.778 3.7465 90) (layer "F.Fab") hide)
    (pad "1" smd rect locked (at 0 0 270) (size 1.7272 1.8288) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 3 "Net-(C2-Pad1)") (pinfunction "1") (pintype "passive"))
    (pad "2" smd rect locked (at 3.048 0 270) (size 1.7272 1.8288) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "GND") (pinfunction "2") (pintype "passive"))
    (model "${KISYS3DMOD}/Resistor_SMD.3dshapes/R_1206_3216Metric.step"
      (offset (xyz 1.524 -0.0508 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "ap_Pad_Hole:125_Hole_Iso" (layer "F.Cu")
    (tedit 5F1621FD)
    (at 152.4 105.41)
    (property "Sheetfile" "Pre-Pressure Board.kicad_sch")
    (property "Sheetname" "")
    (attr through_hole)
    (fp_text reference "Pad3" (at 0.635 3.81) (layer "F.SilkS") hide)
    (fp_text value "125_hole_iso" (at 0.635 5.715) (layer "F.Fab") hide)
    (pad "" np_thru_hole circle locked (at 0 0) (size 3.175 3.175) (drill 3.175) (layers *.Cu *.Mask)
      (solder_mask_margin 4.445) (clearance 4.445))
  )
  (footprint "ap_Connector_Phoenix:MCV_4Pin_1803442" (layer "F.Cu")
    (tedit 5F3AFFC7)
    (at 107.3023 84.4169 -90)
    (property "Sheetfile" "Pre-Pressure Board.kicad_sch")
    (property "Sheetname" "")
    (attr through_hole)
    (fp_text reference "J1" (at -3.55 3.95 -90 unlocked) (layer "F.SilkS"))
    (fp_text value "MCV_4Pin_1803442" (at 4.85 6.35 90) (layer "F.Fab") hide)
    (pad "1" thru_hole roundrect (at 0 0 270) (size 2.54 5.08) (drill 1.4224) (layers *.Cu *.Mask) (roundrect_rratio 0.25)
      (net 1 "Net-(C1-Pad1)") (pinfunction "1") (pintype "passive"))
    (pad "2" thru_hole roundrect (at 3.81 0 270) (size 2.54 5.08) (drill 1.4224) (layers *.Cu *.Mask) (roundrect_rratio 0.25)
      (net 2 "GND") (pinfunction "2") (pintype "passive"))
    (pad "3" thru_hole roundrect (at 7.62 0 270) (size 2.54 5.08) (drill 1.4224) (layers *.Cu *.Mask) (roundrect_rratio 0.25)
      (net 3 "Net-(C2-Pad1)") (pinfunction "3") (pintype "passive"))
    (pad "4" thru_hole roundrect (at 11.43 0 270) (size 2.54 5.08) (drill 1.4224) (layers *.Cu *.Mask) (roundrect_rratio 0.25)
      (net 2 "GND") (pinfunction "4") (pintype "passive"))
    (model "${KISYS3DMOD}/Connector_Phoenix_MC.3dshapes/MCV_6-Pin_1803468.stp"
      (offset (xyz -2.5908 -3.4798 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "ap_Cap_SMD:C_1206" (layer "F.Cu")
    (tedit 5F3ADD4B)
    (at 123.71871 91.973671 -90)
    (descr "Capacitor SMD 1206 Package")
    (tags "1206")
    (property "Sheetfile" "Pre-Pressure Board.kicad_sch")
    (property "Sheetname" "")
    (attr smd)
    (fp_text reference "C2" (at -1.852 0 180) (layer "F.SilkS"))
    (fp_text value "0.1uf" (at 1.778 3.7465 90) (layer "F.Fab") hide)
    (pad "1" smd rect locked (at 0 0 270) (size 1.7272 1.8288) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 3 "Net-(C2-Pad1)") (pinfunction "1") (pintype "passive"))
    (pad "2" smd rect locked (at 3.048 0 270) (size 1.7272 1.8288) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "GND") (pinfunction "2") (pintype "passive"))
    (model "${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1206_3216Metric.step"
      (offset (xyz 1.524 -0.0127 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "ap_PCB_Misc:Maglab_Logo" (layer "F.Cu")
    (tedit 5F3FD4DC)
    (at 127.23046 108.63435)
    (property "Sheetfile" "Pre-Pressure Board.kicad_sch")
    (property "Sheetname" "")
    (attr smd)
    (fp_text reference "1" (at 2.0574 3.13436) (layer "F.SilkS") hide)
    (fp_text value "MAGLAB_LOGO_1_2" (at 2.62382 1.36652) (layer "F.Fab") hide)
    (fp_text user "NATIONAL" (at 9.144 -4.2545) (layer "F.SilkS"))
    (fp_text user "AGLAB" (at 11.176 -1.5875) (layer "F.SilkS"))
  )
  (footprint "ap_Pad_Hole:125_Hole_Iso" (layer "F.Cu")
    (tedit 5F1621FD)
    (at 97.79 76.2)
    (property "Sheetfile" "Pre-Pressure Board.kicad_sch")
    (property "Sheetname" "")
    (attr through_hole)
    (fp_text reference "Pad1" (at 0.635 3.81) (layer "F.SilkS") hide)
    (fp_text value "125_hole_iso" (at 0.635 5.715) (layer "F.Fab") hide)
    (pad "" np_thru_hole circle locked (at 0 0) (size 3.175 3.175) (drill 3.175) (layers *.Cu *.Mask)
      (solder_mask_margin 4.445) (clearance 4.445))
  )
  (footprint "ap_Resistor_SMD:R_1206" (layer "F.Cu")
    (tedit 5F3AF27A)
    (at 117.76871 84.471671 -90)
    (descr "Resistor SMD 1206 Package")
    (tags "1206")
    (property "Sheetfile" "Pre-Pressure Board.kicad_sch")
    (property "Sheetname" "")
    (attr smd)
    (fp_text reference "R1" (at -1.95 0.05) (layer "F.SilkS"))
    (fp_text value "500 ohms" (at 0.65 3.05 90) (layer "F.Fab") hide)
    (pad "1" smd rect locked (at 0 0 270) (size 1.7272 1.8288) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "Net-(C1-Pad1)") (pinfunction "1") (pintype "passive"))
    (pad "2" smd rect locked (at 3.048 0 270) (size 1.7272 1.8288) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "GND") (pinfunction "2") (pintype "passive"))
    (model "${KISYS3DMOD}/Resistor_SMD.3dshapes/R_1206_3216Metric.step"
      (offset (xyz 1.524 -0.0508 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (gr_rect (start 90.191791 68.501839) (end 160.168075 113.03) (layer "Edge.Cuts") (width 0.1) (fill none))
  (gr_text "Pre-Pressure board (v01)\nS Uppalapati 2022" (at 116.44546 106.18935) (layer "F.SilkS"))
  (gr_text "Inlet +" (at 113.157 84.582) (layer "F.SilkS"))
  (gr_text "Inlet -" (at 128.49071 91.651671) (layer "F.SilkS"))
  (gr_text "Inlet -" (at 113.157 88.646) (layer "F.SilkS"))
  (gr_text "Outlet -" (at 128.23671 84.285671) (layer "F.SilkS"))
  (gr_text "To Pressure Board" (at 140.062407 89.889863 -270) (layer "F.SilkS"))
  (gr_text "Outlet +" (at 128.23671 87.976774) (layer "F.SilkS"))
  (gr_text "Outlet -" (at 113.538 96.012) (layer "F.SilkS"))
  (gr_text "Outlet +" (at 113.538 92.456) (layer "F.SilkS"))
  (gr_text "To Pressure Sensors" (at 101.6 90.424 -90) (layer "F.SilkS"))
  (gr_text "1" (at 139.55441 98.271871 90) (layer "F.SilkS"))
  (gr_text "1" (at 102.1403 82.1729 -90) (layer "F.SilkS"))
  (gr_text "Inlet +" (at 128.49071 95.588671) (layer "F.SilkS"))
  (zone (net 2) (net_name "GND") (layer "F.Cu") (hatch edge 0.508)
    (connect_pads (clearance 0.508))
    (min_thickness 0.254) (filled_areas_thickness no)
    (fill yes (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 161.29 114.3)
        (xy 88.9 114.3)
        (xy 88.9 67.31)
        (xy 161.29 67.31)
      )
    )
  )
)
