(kicad_pcb (version 20221018) (generator pcbnew)
  (general
    (thickness 1.6)
  )
  (paper "A4")
  (layers
    (0 "F.Cu" signal)
    (31 "B.Cu" signal)
    (32 "B.Adhes" user "B.Adhesive")
    (33 "F.Adhes" user "F.Adhesive")
    (34 "B.Paste" user)
    (35 "F.Paste" user)
    (36 "B.SilkS" user "B.Silkscreen")
    (37 "F.SilkS" user "F.Silkscreen")
    (38 "B.Mask" user)
    (39 "F.Mask" user)
    (40 "Dwgs.User" user "User.Drawings")
    (41 "Cmts.User" user "User.Comments")
    (42 "Eco1.User" user "User.Eco1")
    (43 "Eco2.User" user "User.Eco2")
    (44 "Edge.Cuts" user)
    (45 "Margin" user)
    (46 "B.CrtYd" user "B.Courtyard")
    (47 "F.CrtYd" user "F.Courtyard")
    (48 "B.Fab" user)
    (49 "F.Fab" user)
    (50 "User.1" user)
    (51 "User.2" user)
    (52 "User.3" user)
    (53 "User.4" user)
    (54 "User.5" user)
    (55 "User.6" user)
    (56 "User.7" user)
    (57 "User.8" user)
    (58 "User.9" user)
  )
  (setup
    (pad_to_mask_clearance 0)
    (grid_origin 136 54)
    (pcbplotparams
      (layerselection 0x00010fc_ffffffff)
      (plot_on_all_layers_selection 0x0000000_00000000)
      (disableapertmacros false)
      (usegerberextensions false)
      (usegerberattributes true)
      (usegerberadvancedattributes true)
      (creategerberjobfile true)
      (dashed_line_dash_ratio 12.000000)
      (dashed_line_gap_ratio 3.000000)
      (svgprecision 4)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (dxfpolygonmode true)
      (dxfimperialunits true)
      (dxfusepcbnewfont true)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (sketchpadsonfab false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 1)
      (scaleselection 1)
      (outputdirectory "")
    )
  )
  (net 0 "")
  (net 1 "+48V")
  (net 2 "GND")
  (footprint "andrew:SAMTEC_EPTS-2-P-D-RA-04" (layer "F.Cu")
    (at 152 75.5)
    (property "MANUFACTURER" "Samtec")
    (property "MAXIMUM_PACKAGE_HEIGHT" "10.50mm")
    (property "PARTREV" "A")
    (property "STANDARD" "Manufacturer Recommendations")
    (property "Sheetfile" "pxpwr.kicad_sch")
    (property "Sheetname" "")
    (attr through_hole)
    (fp_text reference "J1" (at -6 -10.5) (layer "F.SilkS"))
    (fp_text value "EPTS-2-P-D-RA-04" (at 7 -0.5 90) (layer "F.SilkS"))
    (pad "" np_thru_hole circle (at 0 0) (size 2.2 2.2) (drill 2.2) (layers "*.Cu" "*.Mask"))
    (pad "P1_1" thru_hole circle (at -4 -1.5) (size 1.09 1.09) (drill 0.75) (layers "*.Cu" "*.Mask")
      (net 2 "GND") (pinfunction "P1") (pintype "power_in") (solder_mask_margin 0.102))
    (pad "P1_2" thru_hole circle (at -4 -3.5) (size 1.09 1.09) (drill 0.75) (layers "*.Cu" "*.Mask")
      (net 2 "GND") (pinfunction "P1__1") (pintype "power_in") (solder_mask_margin 0.102))
    (pad "P1_3" thru_hole circle (at -4 -5.5) (size 1.09 1.09) (drill 0.75) (layers "*.Cu" "*.Mask")
      (net 2 "GND") (pinfunction "P1__2") (pintype "power_in") (solder_mask_margin 0.102))
    (pad "P1_4" thru_hole circle (at -2 -5.5) (size 1.09 1.09) (drill 0.75) (layers "*.Cu" "*.Mask")
      (net 2 "GND") (pinfunction "P1__3") (pintype "power_in") (solder_mask_margin 0.102))
    (pad "P1_5" thru_hole circle (at -2 -3.5) (size 1.09 1.09) (drill 0.75) (layers "*.Cu" "*.Mask")
      (net 2 "GND") (pinfunction "P1__4") (pintype "power_in") (solder_mask_margin 0.102))
    (pad "P1_6" thru_hole circle (at -2 -1.5) (size 1.09 1.09) (drill 0.75) (layers "*.Cu" "*.Mask")
      (net 2 "GND") (pinfunction "P1__5") (pintype "power_in") (solder_mask_margin 0.102))
    (pad "P2_1" thru_hole circle (at 2 -1.5) (size 1.09 1.09) (drill 0.75) (layers "*.Cu" "*.Mask")
      (net 1 "+48V") (pinfunction "P2") (pintype "power_in") (solder_mask_margin 0.102))
    (pad "P2_2" thru_hole circle (at 2 -3.5) (size 1.09 1.09) (drill 0.75) (layers "*.Cu" "*.Mask")
      (net 1 "+48V") (pinfunction "P2__1") (pintype "power_in") (solder_mask_margin 0.102))
    (pad "P2_3" thru_hole circle (at 2 -5.5) (size 1.09 1.09) (drill 0.75) (layers "*.Cu" "*.Mask")
      (net 1 "+48V") (pinfunction "P2__2") (pintype "power_in") (solder_mask_margin 0.102))
    (pad "P2_4" thru_hole circle (at 4 -5.5) (size 1.09 1.09) (drill 0.75) (layers "*.Cu" "*.Mask")
      (net 1 "+48V") (pinfunction "P2__3") (pintype "power_in") (solder_mask_margin 0.102))
    (pad "P2_5" thru_hole circle (at 4 -3.5) (size 1.09 1.09) (drill 0.75) (layers "*.Cu" "*.Mask")
      (net 1 "+48V") (pinfunction "P2__4") (pintype "power_in") (solder_mask_margin 0.102))
    (pad "P2_6" thru_hole circle (at 4 -1.5) (size 1.09 1.09) (drill 0.75) (layers "*.Cu" "*.Mask")
      (net 1 "+48V") (pinfunction "P2__5") (pintype "power_in") (solder_mask_margin 0.102))
    (pad "P3_1" thru_hole circle (at 2 6.5) (size 1.09 1.09) (drill 0.75) (layers "*.Cu" "*.Mask")
      (net 2 "GND") (pinfunction "P3") (pintype "power_in") (solder_mask_margin 0.102))
    (pad "P3_2" thru_hole circle (at 2 4.5) (size 1.09 1.09) (drill 0.75) (layers "*.Cu" "*.Mask")
      (net 2 "GND") (pinfunction "P3__1") (pintype "power_in") (solder_mask_margin 0.102))
    (pad "P3_3" thru_hole circle (at 2 2.5) (size 1.09 1.09) (drill 0.75) (layers "*.Cu" "*.Mask")
      (net 2 "GND") (pinfunction "P3__2") (pintype "power_in") (solder_mask_margin 0.102))
    (pad "P3_4" thru_hole circle (at 4 2.5) (size 1.09 1.09) (drill 0.75) (layers "*.Cu" "*.Mask")
      (net 2 "GND") (pinfunction "P3__3") (pintype "power_in") (solder_mask_margin 0.102))
    (pad "P3_5" thru_hole circle (at 4 4.5) (size 1.09 1.09) (drill 0.75) (layers "*.Cu" "*.Mask")
      (net 2 "GND") (pinfunction "P3__4") (pintype "power_in") (solder_mask_margin 0.102))
    (pad "P3_6" thru_hole circle (at 4 6.5) (size 1.09 1.09) (drill 0.75) (layers "*.Cu" "*.Mask")
      (net 2 "GND") (pinfunction "P3__5") (pintype "power_in") (solder_mask_margin 0.102))
    (pad "P4_1" thru_hole circle (at -4 6.5) (size 1.09 1.09) (drill 0.75) (layers "*.Cu" "*.Mask")
      (net 1 "+48V") (pinfunction "P4") (pintype "power_in") (solder_mask_margin 0.102))
    (pad "P4_2" thru_hole circle (at -4 4.5) (size 1.09 1.09) (drill 0.75) (layers "*.Cu" "*.Mask")
      (net 1 "+48V") (pinfunction "P4__1") (pintype "power_in") (solder_mask_margin 0.102))
    (pad "P4_3" thru_hole circle (at -4 2.5) (size 1.09 1.09) (drill 0.75) (layers "*.Cu" "*.Mask")
      (net 1 "+48V") (pinfunction "P4__2") (pintype "power_in") (solder_mask_margin 0.102))
    (pad "P4_4" thru_hole circle (at -2 2.5) (size 1.09 1.09) (drill 0.75) (layers "*.Cu" "*.Mask")
      (net 1 "+48V") (pinfunction "P4__3") (pintype "power_in") (solder_mask_margin 0.102))
    (pad "P4_5" thru_hole circle (at -2 4.5) (size 1.09 1.09) (drill 0.75) (layers "*.Cu" "*.Mask")
      (net 1 "+48V") (pinfunction "P4__4") (pintype "power_in") (solder_mask_margin 0.102))
    (pad "P4_6" thru_hole circle (at -2 6.5) (size 1.09 1.09) (drill 0.75) (layers "*.Cu" "*.Mask")
      (net 1 "+48V") (pinfunction "P4__5") (pintype "power_in") (solder_mask_margin 0.102))
  )
  (gr_rect (start 144 50) (end 160 85)
    (fill none) (layer "Edge.Cuts"))
  (gr_text "P2,P4" (at 152 57 -90) (layer "B.SilkS"))
  (gr_text "P1,P3" (at 152 57 90) (layer "F.SilkS"))
  (gr_text "EPTS-2-P-D-RA-04" (at 159 75 90) (layer "F.Fab"))
  (zone (net 2) (net_name "GND") (layer "F.Cu") (hatch edge 0.5)
    (connect_pads (clearance 0.5))
    (min_thickness 0.25) (filled_areas_thickness no)
    (fill yes (thermal_gap 0.5) (thermal_bridge_width 0.5))
    (polygon
      (pts
        (xy 144 50)
        (xy 160 50)
        (xy 160 85)
        (xy 144 85)
      )
    )
  )
  (zone (net 1) (net_name "+48V") (layer "B.Cu") (hatch edge 0.5)
    (priority 1)
    (connect_pads (clearance 0.5))
    (min_thickness 0.25) (filled_areas_thickness no)
    (fill yes (thermal_gap 0.5) (thermal_bridge_width 0.5))
    (polygon
      (pts
        (xy 144 50)
        (xy 160 50)
        (xy 160 85)
        (xy 144 85)
      )
    )
  )
)
