(kicad_pcb (version 20211014) (generator pcbnew)
  (general
    (thickness 1.6)
  )
  (paper "A4")
  (layers
    (0 "F.Cu" signal)
    (31 "B.Cu" signal)
    (32 "B.Adhes" user "B.Adhesive")
    (33 "F.Adhes" user "F.Adhesive")
    (34 "B.Paste" user)
    (35 "F.Paste" user)
    (36 "B.SilkS" user "B.Silkscreen")
    (37 "F.SilkS" user "F.Silkscreen")
    (38 "B.Mask" user)
    (39 "F.Mask" user)
    (40 "Dwgs.User" user "User.Drawings")
    (41 "Cmts.User" user "User.Comments")
    (42 "Eco1.User" user "User.Eco1")
    (43 "Eco2.User" user "User.Eco2")
    (44 "Edge.Cuts" user)
    (45 "Margin" user)
    (46 "B.CrtYd" user "B.Courtyard")
    (47 "F.CrtYd" user "F.Courtyard")
    (48 "B.Fab" user)
    (49 "F.Fab" user)
  )
  (setup
    (stackup
      (layer "F.SilkS" (type "Top Silk Screen"))
      (layer "F.Paste" (type "Top Solder Paste"))
      (layer "F.Mask" (type "Top Solder Mask") (thickness 0.01))
      (layer "F.Cu" (type "copper") (thickness 0.035))
      (layer "dielectric 1" (type "core") (thickness 1.51) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
      (layer "B.Cu" (type "copper") (thickness 0.035))
      (layer "B.Mask" (type "Bottom Solder Mask") (thickness 0.01))
      (layer "B.Paste" (type "Bottom Solder Paste"))
      (layer "B.SilkS" (type "Bottom Silk Screen"))
      (copper_finish "None")
      (dielectric_constraints no)
    )
    (pad_to_mask_clearance 0.04445)
    (pcbplotparams
      (layerselection 0x00010fc_ffffffff)
      (disableapertmacros false)
      (usegerberextensions false)
      (usegerberattributes false)
      (usegerberadvancedattributes false)
      (creategerberjobfile false)
      (svguseinch false)
      (svgprecision 6)
      (excludeedgelayer true)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (dxfpolygonmode true)
      (dxfimperialunits true)
      (dxfusepcbnewfont true)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (sketchpadsonfab false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 1)
      (scaleselection 1)
      (outputdirectory "")
    )
  )
  (net 0 "")
  (net 1 "PWR5")
  (net 2 "GND")
  (net 3 "PWR3.3")
  (net 4 "NRST")
  (net 5 "OSC_IN")
  (net 6 "OSC_OUT")
  (net 7 "Net-(D2-Pad2)")
  (net 8 "USB-")
  (net 9 "Net-(J1-Pad4)")
  (net 10 "USB+")
  (net 11 "SWIO")
  (net 12 "SWCLK")
  (net 13 "T_IO")
  (net 14 "T_CLK")
  (net 15 "T_NRST")
  (net 16 "SPI_MOSI")
  (net 17 "SPI_MISO")
  (net 18 "SPI_CLK")
  (net 19 "BOOT0")
  (net 20 "Net-(R1-Pad2)")
  (net 21 "LED")
  (net 22 "VOLT")
  (net 23 "Net-(U1-Pad4)")
  (net 24 "Net-(D1-Pad1)")
  (footprint "uta:smd0603_hs" (layer "F.Cu")
    (tedit 5FA4A753)
    (at 101.2 109.8)
    (attr through_hole)
    (fp_text reference "C1" (at 0 1.2 -180) (layer "F.SilkS"))
    (fp_text value "4.7u" (at 0 1.4 -180) (layer "F.Fab"))
    (pad "1" smd roundrect locked (at -0.85 0) (size 1 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 1 "PWR5"))
    (pad "2" smd roundrect locked (at 0.85 0) (size 1 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 2 "GND"))
  )
  (footprint "uta:smd0603_hs" (layer "F.Cu")
    (tedit 5FA4A753)
    (at 102.2 101.2 180)
    (attr through_hole)
    (fp_text reference "C2" (at 0 1.2 180) (layer "F.SilkS"))
    (fp_text value "4.7u" (at 0 1.4 180) (layer "F.Fab"))
    (pad "1" smd roundrect locked (at -0.85 0 180) (size 1 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 3 "PWR3.3"))
    (pad "2" smd roundrect locked (at 0.85 0 180) (size 1 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 2 "GND"))
  )
  (footprint "uta:smd0603_hs" (layer "F.Cu")
    (tedit 5FA4A753)
    (at 116.8 96.8)
    (attr through_hole)
    (fp_text reference "C3" (at 0 -1.18 180) (layer "F.SilkS"))
    (fp_text value "100n" (at 0 1.4 180) (layer "F.Fab"))
    (pad "1" smd roundrect locked (at -0.85 0) (size 1 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 3 "PWR3.3"))
    (pad "2" smd roundrect locked (at 0.85 0) (size 1 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 2 "GND"))
  )
  (footprint "uta:smd0603_hs" (layer "F.Cu")
    (tedit 5FA4A753)
    (at 110.2 102.4 180)
    (attr through_hole)
    (fp_text reference "C5" (at 0 1.2 180) (layer "F.SilkS"))
    (fp_text value "100n" (at 0 1.4 180) (layer "F.Fab"))
    (pad "1" smd roundrect locked (at -0.85 0 180) (size 1 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 2 "GND"))
    (pad "2" smd roundrect locked (at 0.85 0 180) (size 1 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 4 "NRST"))
  )
  (footprint "uta:smd0603_diode_hs" (layer "F.Cu")
    (tedit 5FA4A7FD)
    (at 119.3 110.05 90)
    (attr through_hole)
    (fp_text reference "D1" (at 0 1.3 90) (layer "F.SilkS"))
    (fp_text value "blue" (at 0 1.4 90) (layer "F.Fab"))
    (pad "1" smd roundrect locked (at -0.85 0 90) (size 1 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 24 "Net-(D1-Pad1)"))
    (pad "2" smd roundrect locked (at 0.85 0 90) (size 1 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 3 "PWR3.3"))
  )
  (footprint "uta:smd0603_diode_hs" (layer "F.Cu")
    (tedit 5FA4A7FD)
    (at 117.2 110.05 90)
    (attr through_hole)
    (fp_text reference "D2" (at 0.05 -1.2 90) (layer "F.SilkS"))
    (fp_text value "red" (at 0 1.4 90) (layer "F.Fab"))
    (pad "1" smd roundrect locked (at -0.85 0 90) (size 1 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 2 "GND"))
    (pad "2" smd roundrect locked (at 0.85 0 90) (size 1 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 7 "Net-(D2-Pad2)"))
  )
  (footprint "uta:conn_usb_b_micro" (layer "F.Cu")
    (tedit 5F85F63F)
    (at 110 110.49)
    (descr "http://portal.fciconnect.com/Comergent//fci/drawing/10118193.pdf")
    (attr smd)
    (fp_text reference "J1" (at 0 -4.75) (layer "F.SilkS") hide)
    (fp_text value "conn_usb_b_micro" (at 0 3.81) (layer "F.Fab"))
    (pad "1" smd roundrect locked (at -1.3 -2.675) (size 0.4 1.35) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 1 "PWR5"))
    (pad "2" smd roundrect locked (at -0.65 -2.675) (size 0.4 1.35) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 8 "USB-"))
    (pad "3" smd roundrect locked (at 0 -2.675) (size 0.4 1.35) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 10 "USB+"))
    (pad "4" smd roundrect locked (at 0.65 -2.675) (size 0.4 1.35) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 9 "Net-(J1-Pad4)"))
    (pad "5" smd roundrect locked (at 1.3 -2.675) (size 0.4 1.35) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 2 "GND"))
    (pad "6" smd roundrect locked (at -1.2 0) (size 1.9 1.9) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 2 "GND"))
    (pad "6" thru_hole oval locked (at -3.3 0) (size 0.95 1.55) (drill oval 0.5 1.1) (layers *.Cu *.Mask)
      (net 2 "GND"))
    (pad "6" smd roundrect locked (at 3.2 -2.45) (size 1.6 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 2 "GND"))
    (pad "6" smd roundrect locked (at 1.2 0) (size 1.9 1.9) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 2 "GND"))
    (pad "6" smd roundrect locked (at -3.2 -2.45) (size 1.6 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 2 "GND"))
    (pad "6" thru_hole oval locked (at 3.3 0) (size 0.95 1.55) (drill oval 0.5 1.1) (layers *.Cu *.Mask)
      (net 2 "GND"))
  )
  (footprint "uta:header_1x04_2p54mm" (layer "F.Cu")
    (tedit 5E6AB0E0)
    (at 97.028 80.645)
    (descr "Through hole straight pin header, 1x04, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x04 2.54mm single row")
    (attr through_hole)
    (fp_text reference "J4" (at 0 -2.33) (layer "F.SilkS") hide)
    (fp_text value "conn_01x04" (at 0 9.95) (layer "F.Fab"))
    (pad "1" thru_hole roundrect locked (at 0 0) (size 1.7 1.7) (drill 0.9) (layers *.Cu *.Mask) (roundrect_rratio 0.25)
      (net 2 "GND"))
    (pad "2" thru_hole oval locked (at 0 2.54) (size 1.7 1.7) (drill 0.9) (layers *.Cu *.Mask)
      (net 18 "SPI_CLK"))
    (pad "3" thru_hole oval locked (at 0 5.08) (size 1.7 1.7) (drill 0.9) (layers *.Cu *.Mask)
      (net 17 "SPI_MISO"))
    (pad "4" thru_hole oval locked (at 0 7.62) (size 1.7 1.7) (drill 0.9) (layers *.Cu *.Mask)
      (net 16 "SPI_MOSI"))
    (model "${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x04_P2.54mm_Vertical.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "uta:smd0603_hs" (layer "F.Cu")
    (tedit 5FA4A753)
    (at 116.8 94 180)
    (attr through_hole)
    (fp_text reference "R1" (at 0 1.2 180) (layer "F.SilkS"))
    (fp_text value "1k" (at 0 1.4 180) (layer "F.Fab"))
    (pad "1" smd roundrect locked (at -0.85 0 180) (size 1 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 13 "T_IO"))
    (pad "2" smd roundrect locked (at 0.85 0 180) (size 1 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 20 "Net-(R1-Pad2)"))
  )
  (footprint "uta:smd0603_hs" (layer "F.Cu")
    (tedit 5FA4A753)
    (at 116.8 99.6 180)
    (attr through_hole)
    (fp_text reference "R2" (at 0 1.2 180) (layer "F.SilkS"))
    (fp_text value "10k" (at 0 1.4 180) (layer "F.Fab"))
    (pad "1" smd roundrect locked (at -0.85 0 180) (size 1 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 19 "BOOT0"))
    (pad "2" smd roundrect locked (at 0.85 0 180) (size 1 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 2 "GND"))
  )
  (footprint "uta:smd0603_hs" (layer "F.Cu")
    (tedit 5FA4A753)
    (at 106.2 102.4)
    (attr through_hole)
    (fp_text reference "R4" (at 0 -1.2 180) (layer "F.SilkS"))
    (fp_text value "1k" (at 0 1.4 180) (layer "F.Fab"))
    (pad "1" smd roundrect locked (at -0.85 0) (size 1 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 3 "PWR3.3"))
    (pad "2" smd roundrect locked (at 0.85 0) (size 1 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 7 "Net-(D2-Pad2)"))
  )
  (footprint "uta:smd0603_hs" (layer "F.Cu")
    (tedit 5FA4A753)
    (at 102.2 95.2)
    (attr through_hole)
    (fp_text reference "R5" (at 0 -1.2 180) (layer "F.SilkS"))
    (fp_text value "100k" (at 0 1.4 180) (layer "F.Fab"))
    (pad "1" smd roundrect locked (at -0.85 0) (size 1 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 1 "PWR5"))
    (pad "2" smd roundrect locked (at 0.85 0) (size 1 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 22 "VOLT"))
  )
  (footprint "uta:smd0603_hs" (layer "F.Cu")
    (tedit 5FA4A753)
    (at 102.2 92.2 180)
    (attr through_hole)
    (fp_text reference "R6" (at 0 1.2 180) (layer "F.SilkS"))
    (fp_text value "100k" (at 0 1.4 180) (layer "F.Fab"))
    (pad "1" smd roundrect locked (at -0.85 0 180) (size 1 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 22 "VOLT"))
    (pad "2" smd roundrect locked (at 0.85 0 180) (size 1 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 2 "GND"))
  )
  (footprint "uta:sot_23_5_hs" (layer "F.Cu")
    (tedit 5E3FCAB3)
    (at 101.43 105.94 90)
    (descr "5-pin SOT23 package")
    (tags "SOT-23-5 hand-soldering")
    (attr smd)
    (fp_text reference "U1" (at 0 2.6 180) (layer "F.SilkS"))
    (fp_text value "pmic_mic5504" (at 0 2.9 90) (layer "F.Fab"))
    (pad "1" smd roundrect locked (at -1.3 -0.95 90) (size 1.4 0.65) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 1 "PWR5"))
    (pad "2" smd roundrect locked (at -1.3 0 90) (size 1.4 0.65) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 2 "GND"))
    (pad "3" smd roundrect locked (at -1.3 0.95 90) (size 1.4 0.65) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 1 "PWR5"))
    (pad "4" smd roundrect locked (at 1.3 0.95 90) (size 1.4 0.65) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 23 "Net-(U1-Pad4)"))
    (pad "5" smd roundrect locked (at 1.3 -0.95 90) (size 1.4 0.65) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 3 "PWR3.3"))
    (model "${KISYS3DMOD}/Package_TO_SOT_SMD.3dshapes/SOT-23-5.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "uta:tsop_20_hs" (layer "F.Cu")
    (tedit 5E586869)
    (at 109.6 96.2 180)
    (descr "20-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [TSSOP] (see Microchip Packaging Specification 00000049BS.pdf)")
    (tags "SSOP 0.65")
    (attr smd)
    (fp_text reference "U2" (at 0 4 180) (layer "F.SilkS"))
    (fp_text value "mcu_stm32f070f6" (at 0 4.3 180) (layer "F.Fab"))
    (pad "1" smd roundrect locked (at -3.1 -2.925 180) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 19 "BOOT0"))
    (pad "2" smd roundrect locked (at -3.1 -2.275 180) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 5 "OSC_IN"))
    (pad "3" smd roundrect locked (at -3.1 -1.625 180) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 6 "OSC_OUT"))
    (pad "4" smd roundrect locked (at -3.1 -0.975 180) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 4 "NRST"))
    (pad "5" smd roundrect locked (at -3.1 -0.325 180) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 3 "PWR3.3"))
    (pad "6" smd roundrect locked (at -3.1 0.325 180) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 14 "T_CLK"))
    (pad "7" smd roundrect locked (at -3.1 0.975 180) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 13 "T_IO"))
    (pad "8" smd roundrect locked (at -3.1 1.625 180) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 20 "Net-(R1-Pad2)"))
    (pad "9" smd roundrect locked (at -3.1 2.275 180) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 15 "T_NRST"))
    (pad "10" smd roundrect locked (at -3.1 2.925 180) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 21 "LED"))
    (pad "11" smd roundrect locked (at 3.1 2.925 180) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 18 "SPI_CLK"))
    (pad "12" smd roundrect locked (at 3.1 2.275 180) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 17 "SPI_MISO"))
    (pad "13" smd roundrect locked (at 3.1 1.625 180) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 16 "SPI_MOSI"))
    (pad "14" smd roundrect locked (at 3.1 0.975 180) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 22 "VOLT"))
    (pad "15" smd roundrect locked (at 3.1 0.325 180) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 2 "GND"))
    (pad "16" smd roundrect locked (at 3.1 -0.325 180) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 3 "PWR3.3"))
    (pad "17" smd roundrect locked (at 3.1 -0.975 180) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 8 "USB-"))
    (pad "18" smd roundrect locked (at 3.1 -1.625 180) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 10 "USB+"))
    (pad "19" smd roundrect locked (at 3.1 -2.275 180) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 11 "SWIO"))
    (pad "20" smd roundrect locked (at 3.1 -2.925 180) (size 1.75 0.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 12 "SWCLK"))
    (model "${KISYS3DMOD}/Package_SO.3dshapes/TSSOP-20_4.4x6.5mm_P0.65mm.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "uta:header_1x04_2p54mm" (layer "F.Cu")
    (tedit 5E6AB0E0)
    (at 97.02 100.33)
    (descr "Through hole straight pin header, 1x04, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x04 2.54mm single row")
    (attr through_hole)
    (fp_text reference "J2" (at 0 -2.33) (layer "F.SilkS") hide)
    (fp_text value "conn_01x04" (at 0 9.95) (layer "F.Fab"))
    (pad "1" thru_hole roundrect locked (at 0 0) (size 1.7 1.7) (drill 0.9) (layers *.Cu *.Mask) (roundrect_rratio 0.25)
      (net 2 "GND"))
    (pad "2" thru_hole oval locked (at 0 2.54) (size 1.7 1.7) (drill 0.9) (layers *.Cu *.Mask)
      (net 4 "NRST"))
    (pad "3" thru_hole oval locked (at 0 5.08) (size 1.7 1.7) (drill 0.9) (layers *.Cu *.Mask)
      (net 12 "SWCLK"))
    (pad "4" thru_hole oval locked (at 0 7.62) (size 1.7 1.7) (drill 0.9) (layers *.Cu *.Mask)
      (net 11 "SWIO"))
    (model "${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x04_P2.54mm_Vertical.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "uta:smd0603_hs" (layer "F.Cu")
    (tedit 5FA4A753)
    (at 102.2 98.2 180)
    (attr through_hole)
    (fp_text reference "C4" (at 0 1.2 180) (layer "F.SilkS"))
    (fp_text value "100n" (at 0 1.4 180) (layer "F.Fab"))
    (pad "1" smd roundrect locked (at -0.85 0 180) (size 1 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 3 "PWR3.3"))
    (pad "2" smd roundrect locked (at 0.85 0 180) (size 1 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 2 "GND"))
  )
  (footprint "uta:hc_49_hs" (layer "F.Cu")
    (tedit 5E585A94)
    (at 122.23 101.21 90)
    (descr "SMD Crystal HC-49-SD http://cdn-reichelt.de/documents/datenblatt/B400/xxx-HC49-SMD.pdf, 11.4x4.7mm^2 package")
    (tags "SMD SMT crystal")
    (attr smd)
    (fp_text reference "Y1" (at 0 0) (layer "F.SilkS"))
    (fp_text value "std_crystal" (at 0 3.55 270) (layer "F.Fab"))
    (pad "1" smd roundrect locked (at -4.4 0 90) (size 4.8 1.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 5 "OSC_IN"))
    (pad "2" smd roundrect locked (at 4.4 0 90) (size 4.8 1.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 6 "OSC_OUT"))
    (model "${KISYS3DMOD}/Crystal.3dshapes/Crystal_SMD_HC49-SD.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "uta:smd0603_hs" (layer "F.Cu")
    (tedit 5FA4A753)
    (at 123.1 109.65 180)
    (attr through_hole)
    (fp_text reference "C6" (at 0 -1.25) (layer "F.SilkS"))
    (fp_text value "30p" (at 0 1.4) (layer "F.Fab"))
    (pad "1" smd roundrect locked (at -0.85 0 180) (size 1 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 2 "GND"))
    (pad "2" smd roundrect locked (at 0.85 0 180) (size 1 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 5 "OSC_IN"))
  )
  (footprint "uta:smd0603_hs" (layer "F.Cu")
    (tedit 5FA4A753)
    (at 123.1 92.7)
    (attr through_hole)
    (fp_text reference "C7" (at 0 -1.2) (layer "F.SilkS"))
    (fp_text value "30p" (at 0 1.4) (layer "F.Fab"))
    (pad "1" smd roundrect locked (at -0.85 0) (size 1 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 6 "OSC_OUT"))
    (pad "2" smd roundrect locked (at 0.85 0) (size 1 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 2 "GND"))
  )
  (footprint "uta:smd0603_hs" (layer "F.Cu")
    (tedit 5FA4A753)
    (at 114.2 102.4)
    (attr through_hole)
    (fp_text reference "R3" (at 0 -1.2) (layer "F.SilkS"))
    (fp_text value "75" (at 0 1.4) (layer "F.Fab"))
    (pad "1" smd roundrect locked (at -0.85 0) (size 1 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 21 "LED"))
    (pad "2" smd roundrect locked (at 0.85 0) (size 1 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 24 "Net-(D1-Pad1)"))
  )
  (footprint "uta:header_1x02_2p54mm" (layer "F.Cu")
    (tedit 5E6AB0D8)
    (at 110.99 88.11 90)
    (descr "Through hole straight pin header, 1x02, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x02 2.54mm single row")
    (attr through_hole)
    (fp_text reference "JP2" (at 0 -2.33 90) (layer "F.SilkS") hide)
    (fp_text value "jump_2_open" (at 0 4.87 90) (layer "F.Fab"))
    (pad "1" thru_hole roundrect locked (at 0 0 90) (size 1.7 1.7) (drill 0.9) (layers *.Cu *.Mask) (roundrect_rratio 0.25)
      (net 19 "BOOT0"))
    (pad "2" thru_hole oval locked (at 0 2.54 90) (size 1.7 1.7) (drill 0.9) (layers *.Cu *.Mask)
      (net 3 "PWR3.3"))
    (model "${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x02_P2.54mm_Vertical.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "uta:header_1x02_2p54mm" (layer "F.Cu")
    (tedit 5E6AB0D8)
    (at 120.13 88.11 90)
    (descr "Through hole straight pin header, 1x02, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x02 2.54mm single row")
    (attr through_hole)
    (fp_text reference "JP1" (at 0 -2.33 90) (layer "F.SilkS") hide)
    (fp_text value "jump_2_open" (at 0 4.87 90) (layer "F.Fab"))
    (pad "1" thru_hole roundrect locked (at 0 0 90) (size 1.7 1.7) (drill 0.9) (layers *.Cu *.Mask) (roundrect_rratio 0.25)
      (net 4 "NRST"))
    (pad "2" thru_hole oval locked (at 0 2.54 90) (size 1.7 1.7) (drill 0.9) (layers *.Cu *.Mask)
      (net 2 "GND"))
    (model "${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x02_P2.54mm_Vertical.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "uta:jst_b3b_ph_k_s" (layer "F.Cu")
    (tedit 5E805BE5)
    (at 122.15 75 180)
    (descr "JST PH series connector, B3B-PH-K (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator")
    (tags "connector JST PH side entry")
    (attr through_hole)
    (fp_text reference "J5" (at 2 -2.9) (layer "F.SilkS") hide)
    (fp_text value "conn_01x03" (at 2 4) (layer "F.Fab"))
    (pad "1" thru_hole roundrect locked (at 0 0 180) (size 1.2 1.75) (drill 0.8) (layers *.Cu *.Mask) (roundrect_rratio 0.208)
      (net 3 "PWR3.3"))
    (pad "2" thru_hole oval locked (at 2 0 180) (size 1.2 1.75) (drill 0.8) (layers *.Cu *.Mask)
      (net 2 "GND"))
    (pad "3" thru_hole oval locked (at 4 0 180) (size 1.2 1.75) (drill 0.8) (layers *.Cu *.Mask)
      (net 1 "PWR5"))
    (model "${KISYS3DMOD}/Connector_JST.3dshapes/JST_PH_B3B-PH-K_1x03_P2.00mm_Vertical.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "uta:logo_sm" (layer "F.Cu")
    (tedit 0)
    (at 97.5 74.8 -90)
    (attr through_hole)
    (fp_text reference "G***" (at 0 0 -90) (layer "F.SilkS") hide)
    (fp_text value "LOGO" (at 0.75 0 -90) (layer "F.SilkS") hide)
  )
  (footprint "uta:header_1x04_2p54mm" (layer "F.Cu")
    (tedit 5E6AB0E0)
    (at 105.41 73.533 90)
    (descr "Through hole straight pin header, 1x04, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x04 2.54mm single row")
    (attr through_hole)
    (fp_text reference "J3" (at 0 -2.33 90) (layer "F.SilkS") hide)
    (fp_text value "conn_01x04" (at 0 9.95 90) (layer "F.Fab"))
    (pad "1" thru_hole roundrect locked (at 0 0 90) (size 1.7 1.7) (drill 0.9) (layers *.Cu *.Mask) (roundrect_rratio 0.25)
      (net 2 "GND"))
    (pad "2" thru_hole oval locked (at 0 2.54 90) (size 1.7 1.7) (drill 0.9) (layers *.Cu *.Mask)
      (net 15 "T_NRST"))
    (pad "3" thru_hole oval locked (at 0 5.08 90) (size 1.7 1.7) (drill 0.9) (layers *.Cu *.Mask)
      (net 14 "T_CLK"))
    (pad "4" thru_hole oval locked (at 0 7.62 90) (size 1.7 1.7) (drill 0.9) (layers *.Cu *.Mask)
      (net 13 "T_IO"))
    (model "${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x04_P2.54mm_Vertical.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (gr_line (start 96 112) (end 124 112) (layer "Edge.Cuts") (width 0.05))
  (gr_line (start 125.5 110.5) (end 125.5 72.5) (layer "Edge.Cuts") (width 0.05))
  (gr_line (start 124 71) (end 96 71) (layer "Edge.Cuts") (width 0.05))
  (gr_line (start 124 71) (end 125.5 72.5) (layer "Edge.Cuts") (width 0.05))
  (gr_line (start 94.5 72.5) (end 94.5 110.5) (layer "Edge.Cuts") (width 0.05))
  (gr_line (start 94.5 72.5) (end 96 71) (layer "Edge.Cuts") (width 0.05))
  (gr_line (start 96 112) (end 94.5 110.5) (layer "Edge.Cuts") (width 0.05))
  (gr_line (start 125.5 110.5) (end 124 112) (layer "Edge.Cuts") (width 0.05))
  (gr_text "\nD\n0.6" (at 119 107) (layer "B.SilkS"))
  (gr_text "COLD" (at 113.03 76.581 270) (layer "B.SilkS"))
  (gr_text "GND" (at 105.41 76.581 270) (layer "B.SilkS"))
  (gr_text "UTA\nPCB\nVER" (at 124 107) (layer "B.SilkS"))
  (gr_text "BOOT" (at 101.2 86.8 90) (layer "B.SilkS"))
  (gr_text "PWR" (at 107.95 76.581 270) (layer "B.SilkS"))
  (gr_text "GND" (at 98.806 80.645) (layer "B.SilkS"))
  (gr_text "RELAY" (at 98.933 83.185) (layer "B.SilkS"))
  (gr_text "HOT" (at 110.49 76.581 270) (layer "B.SilkS"))
  (gr_text "RESET" (at 121.4 85.57) (layer "F.SilkS"))
  (gr_text "NRST" (at 107.89 75.39 90) (layer "F.SilkS"))
  (gr_text "GND" (at 98.925 80.645) (layer "F.SilkS"))
  (gr_text "MOSI" (at 98.925 88.265) (layer "F.SilkS"))
  (gr_text "DIO" (at 112.97 75.39 90) (layer "F.SilkS"))
  (gr_text "GND" (at 105.35 75.39 90) (layer "F.SilkS"))
  (gr_text "CLK" (at 110.43 75.39 90) (layer "F.SilkS"))
  (gr_text "DBG" (at 97 97.5) (layer "F.SilkS"))
  (gr_text "5.0V" (at 117.9 77.5 90) (layer "F.SilkS"))
  (gr_text "3.3V" (at 122.4 77.5 90) (layer "F.SilkS"))
  (gr_text "GND" (at 120.15 77.5 90) (layer "F.SilkS"))
  (gr_text "SAFE" (at 112.26 85.57) (layer "F.SilkS"))
  (gr_text "MISO" (at 98.925 85.725) (layer "F.SilkS"))
  (gr_text "CLK" (at 98.925 83.185) (layer "F.SilkS"))
  (zone (net 2) (net_name "GND") (layer "F.Cu") (hatch edge 0.508)
    (priority 4)
    (connect_pads (clearance 0.1524))
    (min_thickness 0.1524) (filled_areas_thickness no)
    (fill yes (thermal_gap 0.1524) (thermal_bridge_width 0.3048) (island_removal_mode 1) (island_area_min 0))
    (polygon
      (pts
        (xy 111.6 99.3)
        (xy 107.6 99.3)
        (xy 107.6 93.1)
        (xy 111.6 93.1)
      )
    )
  )
  (zone (net 3) (net_name "PWR3.3") (layer "F.Cu") (hatch edge 0.508)
    (connect_pads (clearance 0.1524))
    (min_thickness 0.1524) (filled_areas_thickness no)
    (fill yes (thermal_gap 0.1524) (thermal_bridge_width 0.3048))
    (polygon
      (pts
        (xy 125.5 112)
        (xy 94.5 112)
        (xy 94.5 71)
        (xy 125.5 71)
      )
    )
  )
  (zone (net 2) (net_name "GND") (layer "B.Cu") (hatch edge 0.508)
    (connect_pads (clearance 0.1524))
    (min_thickness 0.1524) (filled_areas_thickness no)
    (fill yes (thermal_gap 0.1524) (thermal_bridge_width 0.3048))
    (polygon
      (pts
        (xy 125.5 112)
        (xy 94.5 112)
        (xy 94.5 71)
        (xy 125.5 71)
      )
    )
  )
)
