(kicad_pcb (version 20171130) (host pcbnew "(5.1.4)-1")
  (general
    (thickness 1.6)
    (drawings 10)
    (tracks 86)
    (zones 0)
    (modules 18)
    (nets 1)
  )
  (page A4)
  (layers
    (0 F.Cu signal)
    (31 B.Cu signal)
    (32 B.Adhes user)
    (33 F.Adhes user)
    (34 B.Paste user)
    (35 F.Paste user)
    (36 B.SilkS user)
    (37 F.SilkS user)
    (38 B.Mask user)
    (39 F.Mask user)
    (40 Dwgs.User user)
    (41 Cmts.User user)
    (42 Eco1.User user)
    (43 Eco2.User user)
    (44 Edge.Cuts user)
    (45 Margin user)
    (46 B.CrtYd user)
    (47 F.CrtYd user)
    (48 B.Fab user)
    (49 F.Fab user hide)
  )
  (setup
    (last_trace_width 0.25)
    (user_trace_width 0.635)
    (trace_clearance 0.2)
    (zone_clearance 0.508)
    (zone_45_only no)
    (trace_min 0.2)
    (via_size 0.8)
    (via_drill 0.4)
    (via_min_size 0.4)
    (via_min_drill 0.3)
    (user_via 1.27 0.635)
    (user_via 2.54 1.778)
    (uvia_size 0.3)
    (uvia_drill 0.1)
    (uvias_allowed no)
    (uvia_min_size 0.2)
    (uvia_min_drill 0.1)
    (edge_width 0.05)
    (segment_width 0.2)
    (pcb_text_width 0.3)
    (pcb_text_size 1.5 1.5)
    (mod_edge_width 0.12)
    (mod_text_size 1 1)
    (mod_text_width 0.15)
    (pad_size 1.27 1.27)
    (pad_drill 0.508)
    (pad_to_mask_clearance 0.051)
    (solder_mask_min_width 0.25)
    (aux_axis_origin 0 0)
    (visible_elements 7FFFFFFF)
    (pcbplotparams
      (layerselection 0x010fc_ffffffff)
      (usegerberextensions false)
      (usegerberattributes false)
      (usegerberadvancedattributes false)
      (creategerberjobfile false)
      (excludeedgelayer true)
      (linewidth 0.100000)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (padsonsilk false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 1)
      (scaleselection 1)
      (outputdirectory ""))
  )
  (net 0 "")
  (net_class Default "This is the default net class."
    (clearance 0.2)
    (trace_width 0.25)
    (via_dia 0.8)
    (via_drill 0.4)
    (uvia_dia 0.3)
    (uvia_drill 0.1)
  )
  (module Connector_Wire:SolderWirePad_1x01_Drill1mm (layer F.Cu) (tedit 5E8F3D12)
    (at 174.752 84.074 270)
    (descr "Wire solder connection")
    (tags connector)
    (attr virtual)
    (fp_text reference 18 (at -1.651 0 180) (layer F.SilkS))
    (fp_text value SolderWirePad_1x01_Drill1mm (at 0 3.175 90) (layer F.Fab))
    (fp_text user %R (at 5.08 2.54 90) (layer F.Fab))
    (pad 1 thru_hole circle (at 0 0 270) (size 1.27 1.27) (drill 0.508) (layers *.Cu *.Mask))
  )
  (module Connector_Wire:SolderWirePad_1x01_Drill1mm (layer F.Cu) (tedit 5E8F3D12)
    (at 201.549 71.882 270)
    (descr "Wire solder connection")
    (tags connector)
    (attr virtual)
    (fp_text reference G (at 1.905 -0.254 180) (layer F.SilkS))
    (fp_text value SolderWirePad_1x01_Drill1mm (at 0 3.175 90) (layer F.Fab))
    (fp_text user %R (at 5.08 2.54 90) (layer F.Fab))
    (pad 1 thru_hole circle (at 0 0 270) (size 1.27 1.27) (drill 0.508) (layers *.Cu *.Mask))
  )
  (module Connector_Wire:SolderWirePad_1x01_Drill1mm (layer F.Cu) (tedit 5E8F3D12)
    (at 201.549 78.359 270)
    (descr "Wire solder connection")
    (tags connector)
    (attr virtual)
    (fp_text reference 5 (at 1.905 -0.254 180) (layer F.SilkS))
    (fp_text value SolderWirePad_1x01_Drill1mm (at 0 3.175 90) (layer F.Fab))
    (fp_text user %R (at 5.08 2.54 90) (layer F.Fab))
    (pad 1 thru_hole circle (at 0 0 270) (size 1.27 1.27) (drill 0.508) (layers *.Cu *.Mask))
  )
  (module Capacitor_THT:C_Disc_D3.8mm_W2.6mm_P2.50mm (layer F.Cu) (tedit 5AE50EF0)
    (at 190.921 76.708)
    (descr "C, Disc series, Radial, pin pitch=2.50mm, , diameter*width=3.8*2.6mm^2, Capacitor, http://www.vishay.com/docs/45233/krseries.pdf")
    (tags "C Disc series Radial pin pitch 2.50mm  diameter 3.8mm width 2.6mm Capacitor")
    (fp_text reference C2 (at 1.25 -2.55) (layer F.SilkS))
    (fp_text value C_Disc_D3.8mm_W2.6mm_P2.50mm (at 1.25 2.55) (layer F.Fab))
    (fp_text user %R (at 1.25 0) (layer F.Fab))
    (pad 1 thru_hole circle (at 0 0) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask))
    (pad 2 thru_hole circle (at 2.5 0) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask))
    (model ${KISYS3DMOD}/Capacitor_THT.3dshapes/C_Disc_D3.8mm_W2.6mm_P2.50mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module "VVA board:RVA-2500+" (layer F.Cu) (tedit 5E7A1461)
    (at 161.036 76.581 270)
    (fp_text reference "RVA 2500+" (at -0.508 2.667 90) (layer F.SilkS))
    (fp_text value RVA-2500+ (at 0.1524 -7.7216 90) (layer F.Fab))
    (fp_text user V+ (at -3.8862 -1.6002 90) (layer F.SilkS))
    (fp_text user VADJ (at 3.4798 0.9144 90) (layer F.SilkS))
    (fp_text user OUT (at 0.5588 -4.3688 90) (layer F.SilkS))
    (fp_text user IN (at -0.762 4.191 90) (layer F.SilkS))
    (pad 16 smd rect (at -6.096 3.429 270) (size 1.524 1.524) (layers F.Cu F.Paste F.Mask))
    (pad 15 smd rect (at -6.096 0.889 270) (size 1.524 1.524) (layers F.Cu F.Paste F.Mask))
    (pad 14 smd rect (at -6.096 -1.651 270) (size 1.524 1.524) (layers F.Cu F.Paste F.Mask))
    (pad 13 smd rect (at -6.096 -4.191 270) (size 1.524 1.524) (layers F.Cu F.Paste F.Mask))
    (pad 12 smd rect (at -4.318 -6.096 270) (size 1.524 1.524) (layers F.Cu F.Paste F.Mask))
    (pad 11 smd rect (at -1.778 -6.096 270) (size 1.524 1.524) (layers F.Cu F.Paste F.Mask))
    (pad 10 smd rect (at 0.762 -6.096 270) (size 1.524 1.524) (layers F.Cu F.Paste F.Mask))
    (pad 9 smd rect (at 3.302 -6.096 270) (size 1.524 1.524) (layers F.Cu F.Paste F.Mask))
    (pad 8 smd rect (at 6.096 -4.191 270) (size 1.524 1.524) (layers F.Cu F.Paste F.Mask))
    (pad 7 smd rect (at 6.096 -1.651 270) (size 1.524 1.524) (layers F.Cu F.Paste F.Mask))
    (pad 6 smd rect (at 6.096 0.889 270) (size 1.524 1.524) (layers F.Cu F.Paste F.Mask))
    (pad 5 smd rect (at 6.096 3.429 270) (size 1.524 1.524) (layers F.Cu F.Paste F.Mask))
    (pad 4 smd rect (at 4.191 6.096 270) (size 1.524 1.524) (layers F.Cu F.Paste F.Mask))
    (pad 3 smd rect (at 1.651 6.096 270) (size 1.524 1.524) (layers F.Cu F.Paste F.Mask))
    (pad 2 smd rect (at -0.889 6.096 270) (size 1.524 1.524) (layers F.Cu F.Paste F.Mask))
    (pad 1 smd rect (at -3.429 6.096 270) (size 1.524 1.524) (layers F.Cu F.Paste F.Mask))
  )
  (module Diode_THT:D_DO-41_SOD81_P7.62mm_Horizontal (layer F.Cu) (tedit 5AE50CD5)
    (at 177.546 82.804 270)
    (descr "Diode, DO-41_SOD81 series, Axial, Horizontal, pin pitch=7.62mm, , length*diameter=5.2*2.7mm^2, , http://www.diodes.com/_files/packages/DO-41%20(Plastic).pdf")
    (tags "Diode DO-41_SOD81 series Axial Horizontal pin pitch 7.62mm  length 5.2mm diameter 2.7mm")
    (fp_text reference D1 (at 4.191 0 90) (layer F.SilkS))
    (fp_text value D_DO-41_SOD81_P7.62mm_Horizontal (at 3.81 2.47 90) (layer F.Fab))
    (fp_text user K (at 0 -2.1 90) (layer F.Fab))
    (fp_text user %R (at 4.2 0 90) (layer F.Fab))
    (pad 2 thru_hole oval (at 7.62 0 270) (size 2.2 2.2) (drill 1.1) (layers *.Cu *.Mask))
    (pad 1 thru_hole rect (at 0 0 270) (size 2.2 2.2) (drill 1.1) (layers *.Cu *.Mask))
    (model ${KISYS3DMOD}/Diode_THT.3dshapes/D_DO-41_SOD81_P7.62mm_Horizontal.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_THT:C_Disc_D3.8mm_W2.6mm_P2.50mm (layer F.Cu) (tedit 5AE50EF0)
    (at 172.593 97.536 270)
    (descr "C, Disc series, Radial, pin pitch=2.50mm, , diameter*width=3.8*2.6mm^2, Capacitor, http://www.vishay.com/docs/45233/krseries.pdf")
    (tags "C Disc series Radial pin pitch 2.50mm  diameter 3.8mm width 2.6mm Capacitor")
    (fp_text reference C2 (at 2.794 2.794 90) (layer F.SilkS))
    (fp_text value C_Disc_D3.8mm_W2.6mm_P2.50mm (at 1.25 2.55 90) (layer F.Fab))
    (fp_text user %R (at 1.25 0 90) (layer F.Fab))
    (pad 1 thru_hole circle (at 0 0 270) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask))
    (pad 2 thru_hole circle (at 2.5 0 270) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask))
    (model ${KISYS3DMOD}/Capacitor_THT.3dshapes/C_Disc_D3.8mm_W2.6mm_P2.50mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_THT:C_Disc_D3.8mm_W2.6mm_P2.50mm (layer F.Cu) (tedit 5AE50EF0)
    (at 172.212 83.82 90)
    (descr "C, Disc series, Radial, pin pitch=2.50mm, , diameter*width=3.8*2.6mm^2, Capacitor, http://www.vishay.com/docs/45233/krseries.pdf")
    (tags "C Disc series Radial pin pitch 2.50mm  diameter 3.8mm width 2.6mm Capacitor")
    (fp_text reference C1 (at 1.25 -2.55 90) (layer F.SilkS))
    (fp_text value C_Disc_D3.8mm_W2.6mm_P2.50mm (at 1.25 2.55 90) (layer F.Fab))
    (fp_text user %R (at 1.25 0 90) (layer F.Fab))
    (pad 1 thru_hole circle (at 0 0 90) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask))
    (pad 2 thru_hole circle (at 2.5 0 90) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask))
    (model ${KISYS3DMOD}/Capacitor_THT.3dshapes/C_Disc_D3.8mm_W2.6mm_P2.50mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_Wire:SolderWirePad_1x01_Drill1mm (layer F.Cu) (tedit 5AEE5EBE)
    (at 186.944 82.423 270)
    (descr "Wire solder connection")
    (tags connector)
    (attr virtual)
    (fp_text reference ADJ_IN (at 5.08 -0.381 90) (layer F.SilkS))
    (fp_text value SolderWirePad_1x01_Drill1mm (at 0 3.175 90) (layer F.Fab))
    (fp_text user %R (at 5.08 2.54 90) (layer F.Fab))
    (pad 1 thru_hole circle (at 0 0 270) (size 2.49936 2.49936) (drill 1.00076) (layers *.Cu *.Mask))
  )
  (module Resistor_THT:R_Axial_DIN0207_L6.3mm_D2.5mm_P10.16mm_Horizontal (layer F.Cu) (tedit 5AE5139B)
    (at 181.356 97.536 90)
    (descr "Resistor, Axial_DIN0207 series, Axial, Horizontal, pin pitch=10.16mm, 0.25W = 1/4W, length*diameter=6.3*2.5mm^2, http://cdn-reichelt.de/documents/datenblatt/B400/1_4W%23YAG.pdf")
    (tags "Resistor Axial_DIN0207 series Axial Horizontal pin pitch 10.16mm 0.25W = 1/4W length 6.3mm diameter 2.5mm")
    (fp_text reference R1 (at 4.953 0 90) (layer F.SilkS))
    (fp_text value R_Axial_DIN0207_L6.3mm_D2.5mm_P10.16mm_Horizontal (at 5.08 2.37 90) (layer F.Fab))
    (fp_text user %R (at 5.08 0 90) (layer F.Fab))
    (pad 2 thru_hole oval (at 10.16 0 90) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask))
    (pad 1 thru_hole circle (at 0 0 90) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask))
    (model ${KISYS3DMOD}/Resistor_THT.3dshapes/R_Axial_DIN0207_L6.3mm_D2.5mm_P10.16mm_Horizontal.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_TO_SOT_THT:TO-220F-3_Horizontal_TabDown (layer F.Cu) (tedit 5AC8BA0D)
    (at 197.739 80.899 180)
    (descr "TO-220F-3, Horizontal, RM 2.54mm, see http://www.st.com/resource/en/datasheet/stp20nm60.pdf")
    (tags "TO-220F-3 Horizontal RM 2.54mm")
    (fp_text reference 7805 (at 2.667 -10.033) (layer F.SilkS))
    (fp_text value TO-220F-3_Horizontal_TabDown (at 2.54 2) (layer F.Fab))
    (fp_text user %R (at 2.54 -20.22) (layer F.Fab))
    (pad "" np_thru_hole oval (at 2.54 -15.8 180) (size 3.5 3.5) (drill 3.5) (layers *.Cu *.Mask))
    (pad 1 thru_hole rect (at 0 0 180) (size 1.905 2) (drill 1.2) (layers *.Cu *.Mask))
    (pad 2 thru_hole oval (at 2.54 0 180) (size 1.905 2) (drill 1.2) (layers *.Cu *.Mask))
    (pad 3 thru_hole oval (at 5.08 0 180) (size 1.905 2) (drill 1.2) (layers *.Cu *.Mask))
    (model ${KISYS3DMOD}/Package_TO_SOT_THT.3dshapes/TO-220F-3_Horizontal_TabDown.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_Wire:SolderWirePad_1x01_Drill1mm (layer F.Cu) (tedit 5AEE5EBE)
    (at 177.038 94.488 90)
    (descr "Wire solder connection")
    (tags connector)
    (attr virtual)
    (fp_text reference pot_OUT (at -2.286 0.127 180) (layer F.SilkS) hide)
    (fp_text value SolderWirePad_1x01_Drill1mm (at 0 3.175 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 thru_hole circle (at 0 0 90) (size 2.49936 2.49936) (drill 1.00076) (layers *.Cu *.Mask))
  )
  (module Connector_Wire:SolderWirePad_1x01_Drill1mm (layer F.Cu) (tedit 5AEE5EBE)
    (at 177.038 99.06 90)
    (descr "Wire solder connection")
    (tags connector)
    (attr virtual)
    (fp_text reference pot_IN (at -2.159 -0.254 180) (layer F.SilkS) hide)
    (fp_text value SolderWirePad_1x01_Drill1mm (at 0 3.175 90) (layer F.Fab))
    (fp_text user %R (at 5.08 2.54 90) (layer F.Fab))
    (pad 1 thru_hole circle (at 0 0 90) (size 2.49936 2.49936) (drill 1.00076) (layers *.Cu *.Mask))
  )
  (module Package_TO_SOT_THT:TO-220F-3_Horizontal_TabDown (layer F.Cu) (tedit 5AC8BA0D)
    (at 172.593 93.345 90)
    (descr "TO-220F-3, Horizontal, RM 2.54mm, see http://www.st.com/resource/en/datasheet/stp20nm60.pdf")
    (tags "TO-220F-3 Horizontal RM 2.54mm")
    (fp_text reference 317 (at 2.794 -10.795 90) (layer F.SilkS))
    (fp_text value TO-220F-3_Horizontal_TabDown (at 2.54 2 90) (layer F.Fab))
    (fp_text user %R (at 2.54 -20.22 90) (layer F.Fab))
    (pad 3 thru_hole oval (at 5.08 0 90) (size 1.905 2) (drill 1.2) (layers *.Cu *.Mask))
    (pad 2 thru_hole oval (at 2.54 0 90) (size 1.905 2) (drill 1.2) (layers *.Cu *.Mask))
    (pad 1 thru_hole rect (at 0 0 90) (size 1.905 2) (drill 1.2) (layers *.Cu *.Mask))
    (pad "" np_thru_hole oval (at 2.54 -15.8 90) (size 3.5 3.5) (drill 3.5) (layers *.Cu *.Mask))
    (model ${KISYS3DMOD}/Package_TO_SOT_THT.3dshapes/TO-220F-3_Horizontal_TabDown.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_THT:C_Disc_D3.8mm_W2.6mm_P2.50mm (layer F.Cu) (tedit 5AE50EF0)
    (at 181.483 81.788 270)
    (descr "C, Disc series, Radial, pin pitch=2.50mm, , diameter*width=3.8*2.6mm^2, Capacitor, http://www.vishay.com/docs/45233/krseries.pdf")
    (tags "C Disc series Radial pin pitch 2.50mm  diameter 3.8mm width 2.6mm Capacitor")
    (fp_text reference C3 (at 1.25 -2.55 90) (layer F.SilkS))
    (fp_text value C_Disc_D3.8mm_W2.6mm_P2.50mm (at 1.25 2.55 90) (layer F.Fab))
    (fp_text user %R (at 1.25 0 90) (layer F.Fab))
    (pad 2 thru_hole circle (at 2.5 0 270) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask))
    (pad 1 thru_hole circle (at 0 0 270) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask))
    (model ${KISYS3DMOD}/Capacitor_THT.3dshapes/C_Disc_D3.8mm_W2.6mm_P2.50mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_THT:C_Disc_D3.8mm_W2.6mm_P2.50mm (layer F.Cu) (tedit 5AE50EF0)
    (at 196.215 76.708)
    (descr "C, Disc series, Radial, pin pitch=2.50mm, , diameter*width=3.8*2.6mm^2, Capacitor, http://www.vishay.com/docs/45233/krseries.pdf")
    (tags "C Disc series Radial pin pitch 2.50mm  diameter 3.8mm width 2.6mm Capacitor")
    (fp_text reference C1 (at 1.25 -2.55) (layer F.SilkS))
    (fp_text value C_Disc_D3.8mm_W2.6mm_P2.50mm (at 1.25 2.55) (layer F.Fab))
    (fp_text user %R (at 1.25 0) (layer F.Fab))
    (pad 2 thru_hole circle (at 2.5 0) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask))
    (pad 1 thru_hole circle (at 0 0) (size 1.6 1.6) (drill 0.8) (layers *.Cu *.Mask))
    (model ${KISYS3DMOD}/Capacitor_THT.3dshapes/C_Disc_D3.8mm_W2.6mm_P2.50mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_Coaxial:BNC_Amphenol_B6252HB-NPP3G-50_Horizontal (layer F.Cu) (tedit 5C13907B)
    (at 190.5 63.5)
    (descr http://www.farnell.com/datasheets/612848.pdf)
    (tags "BNC Amphenol Horizontal")
    (fp_text reference REF** (at 0 4) (layer F.SilkS) hide)
    (fp_text value BNC_Amphenol_B6252HB-NPP3G-50_Horizontal (at 0 6 180) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 thru_hole oval (at -2.54 0) (size 1.6 2.5) (drill 0.89) (layers *.Cu *.Mask))
    (pad 1 thru_hole oval (at 0 0) (size 1.6 2.5) (drill 0.89) (layers *.Cu *.Mask))
    (pad 2 thru_hole oval (at 5.08 -5.08) (size 3.5 7) (drill 2.01) (layers *.Cu *.Mask))
    (pad 2 thru_hole oval (at -5.08 -5.08) (size 3.5 7) (drill 2.01) (layers *.Cu *.Mask))
    (model ${KISYS3DMOD}/Connector_Coaxial.3dshapes/BNC_Amphenol_B6252HB-NPP3G-50_Horizontal.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_Coaxial:BNC_Amphenol_B6252HB-NPP3G-50_Horizontal (layer F.Cu) (tedit 5C13907B)
    (at 165.1 63.5)
    (descr http://www.farnell.com/datasheets/612848.pdf)
    (tags "BNC Amphenol Horizontal")
    (fp_text reference REF** (at 0 4) (layer F.SilkS) hide)
    (fp_text value BNC_Amphenol_B6252HB-NPP3G-50_Horizontal (at 0 6 180) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 thru_hole oval (at -2.54 0) (size 1.6 2.5) (drill 0.89) (layers *.Cu *.Mask))
    (pad 1 thru_hole oval (at 0 0) (size 1.6 2.5) (drill 0.89) (layers *.Cu *.Mask))
    (pad 2 thru_hole oval (at 5.08 -5.08) (size 3.5 7) (drill 2.01) (layers *.Cu *.Mask))
    (pad 2 thru_hole oval (at -5.08 -5.08) (size 3.5 7) (drill 2.01) (layers *.Cu *.Mask))
    (model ${KISYS3DMOD}/Connector_Coaxial.3dshapes/BNC_Amphenol_B6252HB-NPP3G-50_Horizontal.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (gr_text POT (at 181.102 100.076) (layer F.SilkS))
  (gr_text G (at 165.608 99.822) (layer F.SilkS))
  (gr_text OUT (at 193.294 67.691) (layer F.SilkS))
  (gr_text IN (at 160.909 67.691) (layer F.SilkS))
  (gr_text "I\nG\nO" (at 195.58 85.344 270) (layer F.SilkS))
  (gr_text "I\nO\nA" (at 166.497 90.551) (layer F.SilkS))
  (gr_line (start 152.4 101.6) (end 152.4 50.8) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 203.2 101.6) (end 152.4 101.6) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 203.2 50.8) (end 203.2 101.6) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 152.4 50.8) (end 203.2 50.8) (layer Edge.Cuts) (width 0.05))
)
