(kicad_pcb (version 20221018) (generator pcbnew)

  (general
    (thickness 1.6)
  )

  (paper "A4")
  (layers
    (0 "F.Cu" signal)
    (31 "B.Cu" signal)
    (32 "B.Adhes" user "B.Adhesive")
    (33 "F.Adhes" user "F.Adhesive")
    (34 "B.Paste" user)
    (35 "F.Paste" user)
    (36 "B.SilkS" user "B.Silkscreen")
    (37 "F.SilkS" user "F.Silkscreen")
    (38 "B.Mask" user)
    (39 "F.Mask" user)
    (40 "Dwgs.User" user "User.Drawings")
    (41 "Cmts.User" user "User.Comments")
    (42 "Eco1.User" user "User.Eco1")
    (43 "Eco2.User" user "User.Eco2")
    (44 "Edge.Cuts" user)
    (45 "Margin" user)
    (46 "B.CrtYd" user "B.Courtyard")
    (47 "F.CrtYd" user "F.Courtyard")
    (48 "B.Fab" user)
    (49 "F.Fab" user)
    (50 "User.1" user)
    (51 "User.2" user)
    (52 "User.3" user)
    (53 "User.4" user)
    (54 "User.5" user)
    (55 "User.6" user)
    (56 "User.7" user)
    (57 "User.8" user)
    (58 "User.9" user)
  )

  (setup
    (stackup
      (layer "F.SilkS" (type "Top Silk Screen"))
      (layer "F.Paste" (type "Top Solder Paste"))
      (layer "F.Mask" (type "Top Solder Mask") (thickness 0.01))
      (layer "F.Cu" (type "copper") (thickness 0.035))
      (layer "dielectric 1" (type "core") (thickness 1.51) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
      (layer "B.Cu" (type "copper") (thickness 0.035))
      (layer "B.Mask" (type "Bottom Solder Mask") (thickness 0.01))
      (layer "B.Paste" (type "Bottom Solder Paste"))
      (layer "B.SilkS" (type "Bottom Silk Screen"))
      (copper_finish "None")
      (dielectric_constraints no)
    )
    (pad_to_mask_clearance 0)
    (pcbplotparams
      (layerselection 0x00010fc_ffffffff)
      (plot_on_all_layers_selection 0x0000000_00000000)
      (disableapertmacros false)
      (usegerberextensions false)
      (usegerberattributes true)
      (usegerberadvancedattributes true)
      (creategerberjobfile true)
      (dashed_line_dash_ratio 12.000000)
      (dashed_line_gap_ratio 3.000000)
      (svgprecision 4)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (dxfpolygonmode true)
      (dxfimperialunits true)
      (dxfusepcbnewfont true)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (sketchpadsonfab false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 0)
      (scaleselection 1)
      (outputdirectory "")
    )
  )

  (net 0 "")
  (net 1 "GND")
  (net 2 "VCC")
  (net 3 "D3")
  (net 4 "D4")
  (net 5 "D5")
  (net 6 "D6")
  (net 7 "D7")
  (net 8 "~{CE}")
  (net 9 "~{OE}")
  (net 10 "A1")
  (net 11 "A2")
  (net 12 "A0")
  (net 13 "A3")
  (net 14 "A4")
  (net 15 "A5")
  (net 16 "A6")
  (net 17 "A7")
  (net 18 "~{WE}")
  (net 19 "A20")
  (net 20 "A21")
  (net 21 "D0")
  (net 22 "D1")
  (net 23 "D2")
  (net 24 "A12")
  (net 25 "A15")
  (net 26 "A16")
  (net 27 "A19")
  (net 28 "A18")
  (net 29 "A17")
  (net 30 "A14")
  (net 31 "A13")
  (net 32 "A8")
  (net 33 "A9")
  (net 34 "A11")
  (net 35 "A10")

  (footprint "GB SOP32 ROM Adapter:CASTELLATIONS_16-PINS" (layer "F.Cu")
    (tstamp 27850df0-95af-4354-8fc6-e97e75ea974f)
    (at 141.8336 113.538 90)
    (fp_text reference "JP1" (at -1.3462 1.9812 90) (layer "F.SilkS") hide
        (effects (font (size 0.73152 0.73152) (thickness 0.08128)) (justify left bottom))
      (tstamp 3b0d7233-80e6-4e2d-8b62-e4f5dabc41c8)
    )
    (fp_text value "" (at 20.32 1.905 90) (layer "F.Fab")
        (effects (font (size 0.747776 0.747776) (thickness 0.065024)) (justify right bottom))
      (tstamp cb3f3023-dc12-4dcc-a95e-7eeac4ddb4c0)
    )
    (pad "1" thru_hole rect (at 0 0 180) (size 0.889 0.889) (drill 0.6) (layers "*.Cu" "*.Mask")
      (net 1 "GND") (solder_mask_margin 0.0635) (thermal_bridge_angle 0) (tstamp 6abc87b2-16b3-46e2-9272-4d4f826cb6d1))
    (pad "2" thru_hole rect (at 1.27 0 180) (size 0.889 0.889) (drill 0.6) (layers "*.Cu" "*.Mask")
      (net 23 "D2") (solder_mask_margin 0.0635) (thermal_bridge_angle 0) (tstamp 7ad8ad52-69bd-4a2d-89f7-c76ebe126855))
    (pad "3" thru_hole rect (at 2.54 0 180) (size 0.889 0.889) (drill 0.6) (layers "*.Cu" "*.Mask")
      (net 22 "D1") (solder_mask_margin 0.0635) (thermal_bridge_angle 0) (tstamp 7a440ec2-f631-4a6c-abb1-31d3ca53a7d6))
    (pad "4" thru_hole rect (at 3.81 0 180) (size 0.889 0.889) (drill 0.6) (layers "*.Cu" "*.Mask")
      (net 21 "D0") (solder_mask_margin 0.0635) (thermal_bridge_angle 0) (tstamp d1613d46-5c5c-4999-b090-d4b7abc8652f))
    (pad "5" thru_hole rect (at 5.08 0 180) (size 0.889 0.889) (drill 0.6) (layers "*.Cu" "*.Mask")
      (net 12 "A0") (solder_mask_margin 0.0635) (thermal_bridge_angle 0) (tstamp 15e7282b-1b25-4c60-90f4-3a4e802f0edc))
    (pad "6" thru_hole rect (at 6.35 0 180) (size 0.889 0.889) (drill 0.6) (layers "*.Cu" "*.Mask")
      (net 10 "A1") (solder_mask_margin 0.0635) (thermal_bridge_angle 0) (tstamp 3f52ae83-7e59-443b-a27b-7071eff21581))
    (pad "7" thru_hole rect (at 7.62 0 180) (size 0.889 0.889) (drill 0.6) (layers "*.Cu" "*.Mask")
      (net 11 "A2") (solder_mask_margin 0.0635) (thermal_bridge_angle 0) (tstamp 86e4f5a6-2b1f-4bbb-82b5-5395e41b59e7))
    (pad "8" thru_hole rect (at 8.89 0 180) (size 0.889 0.889) (drill 0.6) (layers "*.Cu" "*.Mask")
      (net 13 "A3") (solder_mask_margin 0.0635) (thermal_bridge_angle 0) (tstamp 95865e17-e424-4257-bc65-ae5897dc0dc0))
    (pad "9" thru_hole rect (at 10.16 0 180) (size 0.889 0.889) (drill 0.6) (layers "*.Cu" "*.Mask")
      (net 14 "A4") (solder_mask_margin 0.0635) (thermal_bridge_angle 0) (tstamp 85e05fb8-64c7-48ed-8345-688c02f6397f))
    (pad "10" thru_hole rect (at 11.43 0 180) (size 0.889 0.889) (drill 0.6) (layers "*.Cu" "*.Mask")
      (net 15 "A5") (solder_mask_margin 0.0635) (thermal_bridge_angle 0) (tstamp a95257b0-dc47-4c87-8efc-2803773cb75a))
    (pad "11" thru_hole rect (at 12.7 0 180) (size 0.889 0.889) (drill 0.6) (layers "*.Cu" "*.Mask")
      (net 16 "A6") (solder_mask_margin 0.0635) (thermal_bridge_angle 0) (tstamp 9b74dd87-9770-4079-b058-0812989b16fb))
    (pad "12" thru_hole rect (at 13.97 0 180) (size 0.889 0.889) (drill 0.6) (layers "*.Cu" "*.Mask")
      (net 17 "A7") (solder_mask_margin 0.0635) (thermal_bridge_angle 0) (tstamp 5d25a530-9d1d-435e-b98e-a7f3ea0c336e))
    (pad "13" thru_hole rect (at 15.24 0 180) (size 0.889 0.889) (drill 0.6) (layers "*.Cu" "*.Mask")
      (net 24 "A12") (solder_mask_margin 0.0635) (thermal_bridge_angle 0) (tstamp 6c251b97-4467-4d48-8356-97b7a2a6cbc2))
    (pad "14" thru_hole rect (at 16.51 0 180) (size 0.889 0.889) (drill 0.6) (layers "*.Cu" "*.Mask")
      (net 25 "A15") (solder_mask_margin 0.0635) (thermal_bridge_angle 0) (tstamp 8ebaa72a-474a-497e-bed6-37a0aebec09d))
    (pad "15" thru_hole rect (at 17.78 0 180) (size 0.889 0.889) (drill 0.6) (layers "*.Cu" "*.Mask")
      (net 26 "A16") (solder_mask_margin 0.0635) (thermal_bridge_angle 0) (tstamp 45a858ec-8d5f-4ca4-a43c-fac7185765d3))
    (pad "16" thru_hole rect (at 19.05 0 180) (size 0.889 0.889) (drill 0.6) (layers "*.Cu" "*.Mask")
      (net 27 "A19") (solder_mask_margin 0.0635) (thermal_bridge_angle 0) (tstamp db6839c9-16cb-4f60-a0b5-6751eff0f70a))
  )

  (footprint "GB SOP32 ROM Adapter:TP08SQ" (layer "F.Cu")
    (tstamp 435dea11-1fcb-4511-b748-994324e370d4)
    (at 143.05 93.95)
    (descr "<b>TEST PAD</b>")
    (fp_text reference "A20" (at -1.064 0.03) (layer "B.SilkS")
        (effects (font (size 0.4572 0.4572) (thickness 0.08)) (justify right bottom mirror))
      (tstamp 3d89e34f-c80a-4404-8820-63a69df6328f)
    )
    (fp_text value "TPTP08SQ" (at -0.381 0.508) (layer "F.Fab")
        (effects (font (size 0.023368 0.023368) (thickness 0.002032)) (justify left bottom))
      (tstamp 2c28ee79-4249-49ee-bdba-e8dba29982b2)
    )
    (fp_rect (start -0.4064 -0.4064) (end 0.4064 0.4064)
      (stroke (width 0) (type solid)) (fill solid) (layer "F.Paste") (tstamp 5a255413-46d7-4799-b33e-d027e2bb11e6))
    (pad "TP" smd rect (at 0 0) (size 0.8 0.8) (layers "F.Cu" "F.Mask")
      (net 19 "A20") (solder_mask_margin 0.0635) (thermal_bridge_angle 0) (tstamp 381e6824-7d93-4c5f-af9a-197f1b01e236))
  )

  (footprint "GB SOP32 ROM Adapter:TP08SQ" (layer "F.Cu")
    (tstamp 479583aa-b670-443a-9809-e49dc38a0fad)
    (at 154 114.15)
    (descr "<b>TEST PAD</b>")
    (fp_text reference "GND" (at 0.94 0.531) (layer "B.SilkS")
        (effects (font (size 0.4572 0.4572) (thickness 0.08)) (justify left bottom mirror))
      (tstamp 9bfdc7d8-0057-4336-8da8-b10198b14c56)
    )
    (fp_text value "TPTP08SQ" (at -0.381 0.508) (layer "F.Fab")
        (effects (font (size 0.023368 0.023368) (thickness 0.002032)) (justify left bottom))
      (tstamp 845985f8-da86-4cd9-816c-db595b22e2c5)
    )
    (fp_rect (start -0.4064 -0.4064) (end 0.4064 0.4064)
      (stroke (width 0) (type solid)) (fill solid) (layer "F.Paste") (tstamp ffe5e304-e381-4b3a-863a-27e73f002370))
    (pad "GND" smd rect (at 0 0) (size 0.8 0.8) (layers "F.Cu" "F.Mask")
      (net 1 "GND") (solder_mask_margin 0.0635) (thermal_bridge_angle 0) (tstamp 803e6db8-92e3-40d0-8406-7a5b6468582b))
  )

  (footprint "GB SOP32 ROM Adapter:TP08SQ" (layer "F.Cu")
    (tstamp 84303518-387b-44f2-ae23-09c7f468a975)
    (at 143 114.15)
    (descr "<b>TEST PAD</b>")
    (fp_text reference "WR" (at -0.633 0.531) (layer "B.SilkS")
        (effects (font (size 0.4572 0.4572) (thickness 0.08)) (justify right bottom mirror))
      (tstamp 9de9481d-4fcd-4153-8bb1-8ec79ee7f856)
    )
    (fp_text value "TPTP08SQ" (at -0.381 0.508) (layer "F.Fab")
        (effects (font (size 0.023368 0.023368) (thickness 0.002032)) (justify left bottom))
      (tstamp ccbecc2b-7e96-43b4-a71a-730997951e70)
    )
    (fp_rect (start -0.4064 -0.4064) (end 0.4064 0.4064)
      (stroke (width 0) (type solid)) (fill solid) (layer "F.Paste") (tstamp ae8359e5-7918-4f9c-97d7-0866419e494c))
    (pad "TP" smd rect (at 0 0) (size 0.8 0.8) (layers "F.Cu" "F.Mask")
      (net 18 "~{WE}") (solder_mask_margin 0.0635) (thermal_bridge_angle 0) (tstamp 5262b587-2ee0-4639-bed5-09d9cbb26be0))
  )

  (footprint "GB SOP32 ROM Adapter:TP08SQ" (layer "F.Cu")
    (tstamp bea86da6-d9f6-4106-9977-66b86455bae0)
    (at 154 93.95)
    (descr "<b>TEST PAD</b>")
    (fp_text reference "A21" (at 0.94 0.03) (layer "B.SilkS")
        (effects (font (size 0.4572 0.4572) (thickness 0.0762)) (justify left bottom mirror))
      (tstamp c42dc3ff-58ab-432c-b034-1826ed71583d)
    )
    (fp_text value "TPTP08SQ" (at -0.381 0.508) (layer "F.Fab")
        (effects (font (size 0.023368 0.023368) (thickness 0.002032)) (justify left bottom))
      (tstamp c41d6fc3-429d-496e-b7dc-74563ca2b444)
    )
    (fp_rect (start -0.4064 -0.4064) (end 0.4064 0.4064)
      (stroke (width 0) (type solid)) (fill solid) (layer "F.Paste") (tstamp 0397de80-41e7-4e53-a20e-70caaac9a1c6))
    (pad "TP" smd rect (at 0 0) (size 0.8 0.8) (layers "F.Cu" "F.Mask")
      (net 20 "A21") (solder_mask_margin 0.0635) (thermal_bridge_angle 0) (tstamp 40ecdb14-eddc-41cf-9a5d-709f04250699))
  )

  (footprint "GB SOP32 ROM Adapter:TSOP48" (layer "F.Cu")
    (tstamp e42f6b2d-790f-4214-b019-9471b32f1075)
    (at 148.5011 104.0461 -90)
    (fp_text reference "IC1" (at -11.0961 -3.5489 -90) (layer "F.Fab")
        (effects (font (size 1.1684 1.1684) (thickness 0.1016)) (justify left bottom))
      (tstamp 0112b64e-8888-4d40-bce8-1166c9234269)
    )
    (fp_text value "AM29F016/32" (at 3.3539 8.7011 -90) (layer "F.Fab")
        (effects (font (size 1.1684 1.1684) (thickness 0.1016)) (justify left bottom))
      (tstamp d53a9a5c-6ec7-475a-ad97-ba54ad7c9c29)
    )
    (fp_line (start -9.25 -6) (end 9.25 -6)
      (stroke (width 0.127) (type solid)) (layer "F.SilkS") (tstamp 7c96d0a1-93c2-4e17-9d7b-85597643db05))
    (fp_line (start -9.25 -5.08) (end 9.25 -5.08)
      (stroke (width 0.127) (type solid)) (layer "F.SilkS") (tstamp eecdb579-7731-407c-bb2c-114e240a4f5f))
    (fp_line (start -9.25 6) (end -9.25 -6)
      (stroke (width 0.127) (type solid)) (layer "F.SilkS") (tstamp 9ebe0caa-63a6-4294-9127-687e3af43efa))
    (fp_line (start 9.25 -6) (end 9.25 6)
      (stroke (width 0.127) (type solid)) (layer "F.SilkS") (tstamp 0ec5be45-f035-451b-b870-abb946ec810f))
    (fp_line (start 9.25 5.08) (end -9.25 5.08)
      (stroke (width 0.127) (type solid)) (layer "F.SilkS") (tstamp 58b104a0-9ee9-498c-912f-af3aaadc81b1))
    (fp_line (start 9.25 6) (end -9.25 6)
      (stroke (width 0.127) (type solid)) (layer "F.SilkS") (tstamp 87d2420a-bc45-4620-b7c4-481987b4c7b8))
    (fp_circle (center -8.75 -5.5) (end -8.5 -5.5)
      (stroke (width 0.127) (type solid)) (fill solid) (layer "F.SilkS") (tstamp a469e7ba-a81b-4a8d-9572-e14e976c0b48))
    (pad "3" smd rect (at -10 -4.75 270) (size 1 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 27 "A19") (solder_mask_margin 0.0635) (thermal_bridge_angle 0) (tstamp 2b331965-47bd-4d3f-b126-5d0b073340b3))
    (pad "4" smd rect (at -10 -4.25 270) (size 1 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 28 "A18") (solder_mask_margin 0.0635) (thermal_bridge_angle 0) (tstamp 56963968-4414-41ea-a249-d39090cdae60))
    (pad "5" smd rect (at -10 -3.75 270) (size 1 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 29 "A17") (solder_mask_margin 0.0635) (thermal_bridge_angle 0) (tstamp b3cb398f-4e42-4dd5-ab8a-4237800348c9))
    (pad "6" smd rect (at -10 -3.25 270) (size 1 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 26 "A16") (solder_mask_margin 0.0635) (thermal_bridge_angle 0) (tstamp bb30a59c-9839-4959-927f-ee6edac2a246))
    (pad "7" smd rect (at -10 -2.75 270) (size 1 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 25 "A15") (solder_mask_margin 0.0635) (thermal_bridge_angle 0) (tstamp e45f73a2-f7db-49a2-91bf-35f6e20b4343))
    (pad "8" smd rect (at -10 -2.25 270) (size 1 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 30 "A14") (solder_mask_margin 0.0635) (thermal_bridge_angle 0) (tstamp 44ce4320-7cd6-4cfa-89f0-f7b65100239e))
    (pad "9" smd rect (at -10 -1.75 270) (size 1 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 31 "A13") (solder_mask_margin 0.0635) (thermal_bridge_angle 0) (tstamp 318ee7c2-b224-48f1-9724-81f3b262016d))
    (pad "10" smd rect (at -10 -1.25 270) (size 1 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 24 "A12") (solder_mask_margin 0.0635) (thermal_bridge_angle 0) (tstamp 796ac543-e42b-4f56-815a-84d718793968))
    (pad "11" smd rect (at -10 -0.75 270) (size 1 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 8 "~{CE}") (solder_mask_margin 0.0635) (thermal_bridge_angle 0) (tstamp 3ca233e0-2e10-4574-8c90-e156cc9431a0))
    (pad "12" smd rect (at -10 -0.25 270) (size 1 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "VCC") (solder_mask_margin 0.0635) (thermal_bridge_angle 0) (tstamp 308f7b2f-c811-417d-818d-d2c0d2f72aa1))
    (pad "13" smd rect (at -10 0.25 270) (size 1 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (solder_mask_margin 0.0635) (thermal_bridge_angle 0) (tstamp 2198eeb1-d396-48f3-aada-617982652583))
    (pad "14" smd rect (at -10 0.75 270) (size 1 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "VCC") (solder_mask_margin 0.0635) (thermal_bridge_angle 0) (tstamp 6334b7a3-9bc9-4543-aa46-f75e326ff02f))
    (pad "15" smd rect (at -10 1.25 270) (size 1 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 34 "A11") (solder_mask_margin 0.0635) (thermal_bridge_angle 0) (tstamp c19cb000-804f-41f3-945c-18d7870482ef))
    (pad "16" smd rect (at -10 1.75 270) (size 1 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 35 "A10") (solder_mask_margin 0.0635) (thermal_bridge_angle 0) (tstamp 13c8c6ae-0466-4a55-98e5-467d1a80aa94))
    (pad "17" smd rect (at -10 2.25 270) (size 1 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 33 "A9") (solder_mask_margin 0.0635) (thermal_bridge_angle 0) (tstamp de4b5fa3-4254-4870-852d-ea2deec88e69))
    (pad "18" smd rect (at -10 2.75 270) (size 1 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 32 "A8") (solder_mask_margin 0.0635) (thermal_bridge_angle 0) (tstamp 4f7f0f2f-2669-45a1-9ebc-32b244e22fca))
    (pad "19" smd rect (at -10 3.25 270) (size 1 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 17 "A7") (solder_mask_margin 0.0635) (thermal_bridge_angle 0) (tstamp bcc1e930-f737-4c6e-8fda-ee4814db4802))
    (pad "20" smd rect (at -10 3.75 270) (size 1 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 16 "A6") (solder_mask_margin 0.0635) (thermal_bridge_angle 0) (tstamp 60ea8378-7e0a-4450-b4fa-7f86809c224f))
    (pad "21" smd rect (at -10 4.25 270) (size 1 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
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