(kicad_pcb (version 20221018) (generator pcbnew)
  (general
    (thickness 1.6)
  )
  (paper "A4")
  (layers
    (0 "F.Cu" signal)
    (31 "B.Cu" signal)
    (32 "B.Adhes" user "B.Adhesive")
    (33 "F.Adhes" user "F.Adhesive")
    (34 "B.Paste" user)
    (35 "F.Paste" user)
    (36 "B.SilkS" user "B.Silkscreen")
    (37 "F.SilkS" user "F.Silkscreen")
    (38 "B.Mask" user)
    (39 "F.Mask" user)
    (40 "Dwgs.User" user "User.Drawings")
    (41 "Cmts.User" user "User.Comments")
    (42 "Eco1.User" user "User.Eco1")
    (43 "Eco2.User" user "User.Eco2")
    (44 "Edge.Cuts" user)
    (45 "Margin" user)
    (46 "B.CrtYd" user "B.Courtyard")
    (47 "F.CrtYd" user "F.Courtyard")
    (48 "B.Fab" user)
    (49 "F.Fab" user)
    (50 "User.1" user)
    (51 "User.2" user)
    (52 "User.3" user)
    (53 "User.4" user)
    (54 "User.5" user)
    (55 "User.6" user)
    (56 "User.7" user)
    (57 "User.8" user)
    (58 "User.9" user)
  )
  (setup
    (stackup
      (layer "F.SilkS" (type "Top Silk Screen"))
      (layer "F.Paste" (type "Top Solder Paste"))
      (layer "F.Mask" (type "Top Solder Mask") (thickness 0.01))
      (layer "F.Cu" (type "copper") (thickness 0.035))
      (layer "dielectric 1" (type "core") (thickness 1.51) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
      (layer "B.Cu" (type "copper") (thickness 0.035))
      (layer "B.Mask" (type "Bottom Solder Mask") (thickness 0.01))
      (layer "B.Paste" (type "Bottom Solder Paste"))
      (layer "B.SilkS" (type "Bottom Silk Screen"))
      (copper_finish "None")
      (dielectric_constraints no)
    )
    (pad_to_mask_clearance 0)
    (pcbplotparams
      (layerselection 0x00010fc_ffffffff)
      (plot_on_all_layers_selection 0x0000000_00000000)
      (disableapertmacros false)
      (usegerberextensions false)
      (usegerberattributes true)
      (usegerberadvancedattributes true)
      (creategerberjobfile true)
      (dashed_line_dash_ratio 12.000000)
      (dashed_line_gap_ratio 3.000000)
      (svgprecision 4)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (dxfpolygonmode true)
      (dxfimperialunits true)
      (dxfusepcbnewfont true)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (sketchpadsonfab false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 0)
      (scaleselection 1)
      (outputdirectory "")
    )
  )
  (net 0 "")
  (net 1 "GND")
  (net 2 "VCC")
  (net 3 "D3")
  (net 4 "D4")
  (net 5 "D5")
  (net 6 "D6")
  (net 7 "D7")
  (net 8 "~{CE}")
  (net 9 "~{OE}")
  (net 10 "A1")
  (net 11 "A2")
  (net 12 "A0")
  (net 13 "A3")
  (net 14 "A4")
  (net 15 "A5")
  (net 16 "A6")
  (net 17 "A7")
  (net 18 "~{WE}")
  (net 19 "A20")
  (net 20 "A21")
  (net 21 "D0")
  (net 22 "D1")
  (net 23 "D2")
  (net 24 "A12")
  (net 25 "A15")
  (net 26 "A16")
  (net 27 "A19")
  (net 28 "A18")
  (net 29 "A17")
  (net 30 "A14")
  (net 31 "A13")
  (net 32 "A8")
  (net 33 "A9")
  (net 34 "A11")
  (net 35 "A10")
  (footprint "GB SOP32 ROM Adapter:CASTELLATIONS_16-PINS" (layer "F.Cu")
    (at 141.8336 113.538 90)
    (fp_text reference "JP1" (at -1.3462 1.9812 90) (layer "F.SilkS") hide)
    (fp_text value "" (at 20.32 1.905 90) (layer "F.Fab"))
    (pad "1" thru_hole rect (at 0 0 180) (size 0.889 0.889) (drill 0.6) (layers "*.Cu" "*.Mask")
      (net 1 "GND") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "2" thru_hole rect (at 1.27 0 180) (size 0.889 0.889) (drill 0.6) (layers "*.Cu" "*.Mask")
      (net 23 "D2") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "3" thru_hole rect (at 2.54 0 180) (size 0.889 0.889) (drill 0.6) (layers "*.Cu" "*.Mask")
      (net 22 "D1") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "4" thru_hole rect (at 3.81 0 180) (size 0.889 0.889) (drill 0.6) (layers "*.Cu" "*.Mask")
      (net 21 "D0") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "5" thru_hole rect (at 5.08 0 180) (size 0.889 0.889) (drill 0.6) (layers "*.Cu" "*.Mask")
      (net 12 "A0") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "6" thru_hole rect (at 6.35 0 180) (size 0.889 0.889) (drill 0.6) (layers "*.Cu" "*.Mask")
      (net 10 "A1") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "7" thru_hole rect (at 7.62 0 180) (size 0.889 0.889) (drill 0.6) (layers "*.Cu" "*.Mask")
      (net 11 "A2") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "8" thru_hole rect (at 8.89 0 180) (size 0.889 0.889) (drill 0.6) (layers "*.Cu" "*.Mask")
      (net 13 "A3") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "9" thru_hole rect (at 10.16 0 180) (size 0.889 0.889) (drill 0.6) (layers "*.Cu" "*.Mask")
      (net 14 "A4") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "10" thru_hole rect (at 11.43 0 180) (size 0.889 0.889) (drill 0.6) (layers "*.Cu" "*.Mask")
      (net 15 "A5") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "11" thru_hole rect (at 12.7 0 180) (size 0.889 0.889) (drill 0.6) (layers "*.Cu" "*.Mask")
      (net 16 "A6") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "12" thru_hole rect (at 13.97 0 180) (size 0.889 0.889) (drill 0.6) (layers "*.Cu" "*.Mask")
      (net 17 "A7") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "13" thru_hole rect (at 15.24 0 180) (size 0.889 0.889) (drill 0.6) (layers "*.Cu" "*.Mask")
      (net 24 "A12") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "14" thru_hole rect (at 16.51 0 180) (size 0.889 0.889) (drill 0.6) (layers "*.Cu" "*.Mask")
      (net 25 "A15") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "15" thru_hole rect (at 17.78 0 180) (size 0.889 0.889) (drill 0.6) (layers "*.Cu" "*.Mask")
      (net 26 "A16") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "16" thru_hole rect (at 19.05 0 180) (size 0.889 0.889) (drill 0.6) (layers "*.Cu" "*.Mask")
      (net 27 "A19") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
  )
  (footprint "GB SOP32 ROM Adapter:TP08SQ" (layer "F.Cu")
    (at 143.05 93.95)
    (descr "<b>TEST PAD</b>")
    (fp_text reference "A20" (at -1.064 0.03) (layer "B.SilkS"))
    (fp_text value "TPTP08SQ" (at -0.381 0.508) (layer "F.Fab"))
    (pad "TP" smd rect (at 0 0) (size 0.8 0.8) (layers "F.Cu" "F.Mask")
      (net 19 "A20") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
  )
  (footprint "GB SOP32 ROM Adapter:TP08SQ" (layer "F.Cu")
    (at 154 114.15)
    (descr "<b>TEST PAD</b>")
    (fp_text reference "GND" (at 0.94 0.531) (layer "B.SilkS"))
    (fp_text value "TPTP08SQ" (at -0.381 0.508) (layer "F.Fab"))
    (pad "GND" smd rect (at 0 0) (size 0.8 0.8) (layers "F.Cu" "F.Mask")
      (net 1 "GND") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
  )
  (footprint "GB SOP32 ROM Adapter:TP08SQ" (layer "F.Cu")
    (at 143 114.15)
    (descr "<b>TEST PAD</b>")
    (fp_text reference "WR" (at -0.633 0.531) (layer "B.SilkS"))
    (fp_text value "TPTP08SQ" (at -0.381 0.508) (layer "F.Fab"))
    (pad "TP" smd rect (at 0 0) (size 0.8 0.8) (layers "F.Cu" "F.Mask")
      (net 18 "~{WE}") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
  )
  (footprint "GB SOP32 ROM Adapter:TP08SQ" (layer "F.Cu")
    (at 154 93.95)
    (descr "<b>TEST PAD</b>")
    (fp_text reference "A21" (at 0.94 0.03) (layer "B.SilkS"))
    (fp_text value "TPTP08SQ" (at -0.381 0.508) (layer "F.Fab"))
    (pad "TP" smd rect (at 0 0) (size 0.8 0.8) (layers "F.Cu" "F.Mask")
      (net 20 "A21") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
  )
  (footprint "GB SOP32 ROM Adapter:TSOP48" (layer "F.Cu")
    (at 148.5011 104.0461 -90)
    (fp_text reference "IC1" (at -11.0961 -3.5489 -90) (layer "F.Fab"))
    (fp_text value "AM29F016/32" (at 3.3539 8.7011 -90) (layer "F.Fab"))
    (pad "3" smd rect (at -10 -4.75 270) (size 1 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 27 "A19") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "4" smd rect (at -10 -4.25 270) (size 1 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 28 "A18") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "5" smd rect (at -10 -3.75 270) (size 1 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 29 "A17") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "6" smd rect (at -10 -3.25 270) (size 1 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 26 "A16") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "7" smd rect (at -10 -2.75 270) (size 1 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 25 "A15") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "8" smd rect (at -10 -2.25 270) (size 1 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 30 "A14") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "9" smd rect (at -10 -1.75 270) (size 1 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 31 "A13") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "10" smd rect (at -10 -1.25 270) (size 1 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 24 "A12") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "11" smd rect (at -10 -0.75 270) (size 1 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 8 "~{CE}") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "12" smd rect (at -10 -0.25 270) (size 1 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "VCC") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "13" smd rect (at -10 0.25 270) (size 1 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "14" smd rect (at -10 0.75 270) (size 1 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "VCC") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "15" smd rect (at -10 1.25 270) (size 1 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 34 "A11") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "16" smd rect (at -10 1.75 270) (size 1 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 35 "A10") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "17" smd rect (at -10 2.25 270) (size 1 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 33 "A9") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "18" smd rect (at -10 2.75 270) (size 1 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 32 "A8") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "19" smd rect (at -10 3.25 270) (size 1 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 17 "A7") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "20" smd rect (at -10 3.75 270) (size 1 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 16 "A6") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "21" smd rect (at -10 4.25 270) (size 1 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 15 "A5") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "22" smd rect (at -10 4.75 270) (size 1 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 14 "A4") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "27" smd rect (at 10 4.75 90) (size 1 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 13 "A3") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "28" smd rect (at 10 4.25 90) (size 1 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 11 "A2") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "29" smd rect (at 10 3.75 90) (size 1 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 10 "A1") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "30" smd rect (at 10 3.25 90) (size 1 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 12 "A0") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "31" smd rect (at 10 2.75 90) (size 1 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 21 "D0") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "32" smd rect (at 10 2.25 90) (size 1 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 22 "D1") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "33" smd rect (at 10 1.75 90) (size 1 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 23 "D2") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "34" smd rect (at 10 1.25 90) (size 1 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 3 "D3") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "35" smd rect (at 10 0.75 90) (size 1 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "36" smd rect (at 10 0.25 90) (size 1 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "37" smd rect (at 10 -0.25 90) (size 1 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "VCC") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "38" smd rect (at 10 -0.75 90) (size 1 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 4 "D4") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "39" smd rect (at 10 -1.25 90) (size 1 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 5 "D5") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "40" smd rect (at 10 -1.75 90) (size 1 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 6 "D6") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "41" smd rect (at 10 -2.25 90) (size 1 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 7 "D7") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "42" smd rect (at 10 -2.75 90) (size 1 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "43" smd rect (at 10 -3.25 90) (size 1 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 9 "~{OE}") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "44" smd rect (at 10 -3.75 90) (size 1 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 18 "~{WE}") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "45" smd rect (at 10 -4.25 90) (size 1 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 20 "A21") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "46" smd rect (at 10 -4.75 90) (size 1 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 19 "A20") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
  )
  (footprint "GB SOP32 ROM Adapter:CASTELLATIONS_16-PINS" (layer "F.Cu")
    (at 155.1686 94.488 -90)
    (fp_text reference "JP2" (at 0.8964 -2.0314 -90) (layer "F.SilkS"))
    (fp_text value "" (at 20.32 1.905 -90) (layer "F.Fab"))
    (pad "1" thru_hole rect (at 0 0) (size 0.889 0.889) (drill 0.6) (layers "*.Cu" "*.Mask")
      (net 2 "VCC") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "2" thru_hole rect (at 1.27 0) (size 0.889 0.889) (drill 0.6) (layers "*.Cu" "*.Mask")
      (net 28 "A18") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "3" thru_hole rect (at 2.54 0) (size 0.889 0.889) (drill 0.6) (layers "*.Cu" "*.Mask")
      (net 29 "A17") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "4" thru_hole rect (at 3.81 0) (size 0.889 0.889) (drill 0.6) (layers "*.Cu" "*.Mask")
      (net 30 "A14") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "5" thru_hole rect (at 5.08 0) (size 0.889 0.889) (drill 0.6) (layers "*.Cu" "*.Mask")
      (net 31 "A13") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "6" thru_hole rect (at 6.35 0) (size 0.889 0.889) (drill 0.6) (layers "*.Cu" "*.Mask")
      (net 32 "A8") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "7" thru_hole rect (at 7.62 0) (size 0.889 0.889) (drill 0.6) (layers "*.Cu" "*.Mask")
      (net 33 "A9") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "8" thru_hole rect (at 8.89 0) (size 0.889 0.889) (drill 0.6) (layers "*.Cu" "*.Mask")
      (net 34 "A11") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "9" thru_hole rect (at 10.16 0) (size 0.889 0.889) (drill 0.6) (layers "*.Cu" "*.Mask")
      (net 9 "~{OE}") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "10" thru_hole rect (at 11.43 0) (size 0.889 0.889) (drill 0.6) (layers "*.Cu" "*.Mask")
      (net 35 "A10") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "11" thru_hole rect (at 12.7 0) (size 0.889 0.889) (drill 0.6) (layers "*.Cu" "*.Mask")
      (net 8 "~{CE}") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "12" thru_hole rect (at 13.97 0) (size 0.889 0.889) (drill 0.6) (layers "*.Cu" "*.Mask")
      (net 7 "D7") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "13" thru_hole rect (at 15.24 0) (size 0.889 0.889) (drill 0.6) (layers "*.Cu" "*.Mask")
      (net 6 "D6") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "14" thru_hole rect (at 16.51 0) (size 0.889 0.889) (drill 0.6) (layers "*.Cu" "*.Mask")
      (net 5 "D5") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "15" thru_hole rect (at 17.78 0) (size 0.889 0.889) (drill 0.6) (layers "*.Cu" "*.Mask")
      (net 4 "D4") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
    (pad "16" thru_hole rect (at 19.05 0) (size 0.889 0.889) (drill 0.6) (layers "*.Cu" "*.Mask")
      (net 3 "D3") (solder_mask_margin 0.0635) (thermal_bridge_angle 0))
  )
  (gr_line (start 155.1675 114.85) (end 155.1686 93.2611)
    (layer "Edge.Cuts"))
  (gr_line (start 141.8336 93.2611) (end 141.8325 114.85)
    (layer "Edge.Cuts"))
  (gr_line (start 141.8325 114.85) (end 155.1675 114.85)
    (layer "Edge.Cuts"))
  (gr_line (start 155.1686 93.2611) (end 141.8336 93.2611)
    (layer "Edge.Cuts"))
  (gr_text "GB ROM ADAPTER II\nJRodrigo.net\nEdited by Cutrus" (at 151 109.5 315) (layer "B.SilkS"))
)
