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  (general
    (thickness 1.6)
    (drawings 17)
    (tracks 282)
    (zones 0)
    (modules 14)
    (nets 1)
  )
  (page A4)
  (layers
    (0 F.Cu signal)
    (31 B.Cu signal)
    (32 B.Adhes user)
    (33 F.Adhes user)
    (34 B.Paste user)
    (35 F.Paste user)
    (36 B.SilkS user)
    (37 F.SilkS user)
    (38 B.Mask user)
    (39 F.Mask user)
    (40 Dwgs.User user)
    (41 Cmts.User user)
    (42 Eco1.User user)
    (43 Eco2.User user)
    (44 Edge.Cuts user)
    (45 Margin user)
    (46 B.CrtYd user)
    (47 F.CrtYd user)
    (48 B.Fab user)
    (49 F.Fab user)
  )
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    (via_min_drill 0.3)
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    (uvia_drill 0.1)
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  (net 0 "")
  (net_class Default "This is the default net class."
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    (via_dia 0.8)
    (via_drill 0.4)
    (uvia_dia 0.3)
    (uvia_drill 0.1)
  )
  (module Mounting_Holes:MountingHole_2.5mm (layer F.Cu) (tedit 5CAA6487)
    (at 126 81.5)
    (descr "Mounting Hole 2.5mm, no annular")
    (tags "mounting hole 2.5mm no annular")
    (attr virtual)
    (fp_text reference REF** (at 0 -3.5) (layer F.SilkS) hide)
    (fp_text value MountingHole_2.5mm (at 0 3.5) (layer F.Fab) hide)
    (fp_text user %R (at 0.3 0) (layer F.Fab))
    (pad 1 np_thru_hole circle (at 0 0) (size 2.5 2.5) (drill 2.5) (layers *.Cu *.Mask))
  )
  (module Mounting_Holes:MountingHole_2.5mm (layer F.Cu) (tedit 5CAA648B)
    (at 155.9814 81.5)
    (descr "Mounting Hole 2.5mm, no annular")
    (tags "mounting hole 2.5mm no annular")
    (attr virtual)
    (fp_text reference REF** (at 0 -3.5) (layer F.SilkS) hide)
    (fp_text value MountingHole_2.5mm (at 0 3.5) (layer F.Fab) hide)
    (fp_text user %R (at 0.3 0) (layer F.Fab))
    (pad 1 np_thru_hole circle (at 0 0) (size 2.5 2.5) (drill 2.5) (layers *.Cu *.Mask))
  )
  (module open-project:MICRO-B_USB (layer F.Cu) (tedit 5CAB9411)
    (at 141.76248 78.1304 180)
    (fp_text reference MICRO-B_USB (at 0 -5.842 180) (layer F.SilkS) hide)
    (fp_text value USB (at -0.05 2.09 180) (layer F.SilkS))
    (pad "" smd rect (at -3.79984 -1.4478 180) (size 1.79578 1.89738) (layers F.Cu F.Paste F.Mask))
    (pad "" smd rect (at 3.0988 -3.99796 180) (size 2.0955 1.59766) (layers F.Cu F.Paste F.Mask))
    (pad GND smd rect (at 1.29794 -4.12496 180) (size 0.39878 1.3462) (layers F.Cu F.Paste F.Mask)
      (clearance 0.2032))
    (pad ID smd rect (at 0.6477 -4.12496 180) (size 0.39878 1.3462) (layers F.Cu F.Paste F.Mask)
      (clearance 0.2032))
    (pad D+ smd rect (at 0 -4.12496 180) (size 0.39878 1.3462) (layers F.Cu F.Paste F.Mask)
      (clearance 0.2032))
    (pad D- smd rect (at -0.6477 -4.12496 180) (size 0.39878 1.3462) (layers F.Cu F.Paste F.Mask)
      (clearance 0.2032))
    (pad +5 smd rect (at -1.29794 -4.12496 180) (size 0.39878 1.3462) (layers F.Cu F.Paste F.Mask)
      (clearance 0.2032))
    (pad "" smd rect (at -3.0988 -3.99796 180) (size 2.0955 1.59766) (layers F.Cu F.Paste F.Mask))
    (pad "" smd rect (at 3.79984 -1.4478 180) (size 1.79578 1.89738) (layers F.Cu F.Paste F.Mask))
    (pad "" smd rect (at 1.19888 -1.4478 180) (size 1.89992 1.89738) (layers F.Cu F.Paste F.Mask))
    (pad "" smd rect (at -1.19888 -1.4478 180) (size 1.89738 1.89738) (layers F.Cu F.Paste F.Mask))
  )
  (module Housings_DFN_QFN:DFN-6-1EP_3x3mm_Pitch0.95mm (layer F.Cu) (tedit 5CA7AF9C)
    (at 133.8834 86.5)
    (descr "DFN6 3*3 MM, 0.95 PITCH; CASE 506AH-01 (see ON Semiconductor 506AH.PDF)")
    (tags "DFN 0.95")
    (attr smd)
    (fp_text reference VREG (at 0 -2.575) (layer F.SilkS))
    (fp_text value DFN-6-1EP_3x3mm_Pitch0.95mm (at 0 2.575) (layer F.Fab) hide)
    (pad EN smd rect (at -1.34 -0.95) (size 0.63 0.45) (layers F.Cu F.Paste F.Mask))
    (pad GND smd rect (at -1.34 0) (size 0.63 0.45) (layers F.Cu F.Paste F.Mask))
    (pad PG smd rect (at -1.34 0.95) (size 0.63 0.45) (layers F.Cu F.Paste F.Mask))
    (pad VOUT smd rect (at 1.34 0.95) (size 0.63 0.45) (layers F.Cu F.Paste F.Mask))
    (pad 5 smd rect (at 1.34 0) (size 0.63 0.45) (layers F.Cu F.Paste F.Mask))
    (pad VIN smd rect (at 1.34 -0.95) (size 0.63 0.45) (layers F.Cu F.Paste F.Mask))
    (pad 7 smd rect (at 0.425 0.65) (size 0.85 1.3) (layers F.Cu F.Paste F.Mask)
      (solder_paste_margin_ratio -0.2))
    (pad 7 smd rect (at 0.425 -0.65) (size 0.85 1.3) (layers F.Cu F.Paste F.Mask)
      (solder_paste_margin_ratio -0.2))
    (pad 7 smd rect (at -0.425 0.65) (size 0.85 1.3) (layers F.Cu F.Paste F.Mask)
      (solder_paste_margin_ratio -0.2))
    (pad 7 smd rect (at -0.425 -0.65) (size 0.85 1.3) (layers F.Cu F.Paste F.Mask)
      (solder_paste_margin_ratio -0.2))
    (model ${KISYS3DMOD}/Housings_DFN_QFN.3dshapes/DFN-6-1EP_3x3mm_Pitch0.95mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Pin_Headers:Pin_Header_Straight_1x04_Pitch2.54mm (layer F.Cu) (tedit 5CAB970C)
    (at 125.5776 93.1672)
    (descr "Through hole straight pin header, 1x04, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x04 2.54mm single row")
    (fp_text reference PWR (at 0 -2.33) (layer F.SilkS))
    (fp_text value Pin_Header_Straight_1x04_Pitch2.54mm (at 0 9.95) (layer F.Fab) hide)
    (fp_text user %R (at 0 3.81 90) (layer F.Fab))
    (pad +v thru_hole rect (at 0 0) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
    (pad GND thru_hole oval (at 0 2.54) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
    (pad PG thru_hole oval (at 0 5.08) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
    (pad ADC thru_hole oval (at 0 7.62) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
    (model ${KISYS3DMOD}/Pin_Headers.3dshapes/Pin_Header_Straight_1x04_Pitch2.54mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module RFM9X:RFM9X-SMD (layer F.Cu) (tedit 5CAA604E)
    (at 142.1996 98.44)
    (fp_text reference RFM95 (at -5.4714 -9.2606) (layer F.SilkS))
    (fp_text value RFM9X (at 0 7) (layer F.Fab))
    (pad ANT smd rect (at 7 7) (size 3 1.3) (drill (offset 0.5 0)) (layers F.Cu F.Paste F.Mask))
    (pad GND smd rect (at 7 5) (size 3 1.3) (drill (offset 0.5 0)) (layers F.Cu F.Paste F.Mask))
    (pad DIO3 smd rect (at 7 3) (size 3 1.3) (drill (offset 0.5 0)) (layers F.Cu F.Paste F.Mask))
    (pad DIO4 smd rect (at 7 1) (size 3 1.3) (drill (offset 0.5 0)) (layers F.Cu F.Paste F.Mask))
    (pad 3.3V smd rect (at 7 -1) (size 3 1.3) (drill (offset 0.5 0)) (layers F.Cu F.Paste F.Mask))
    (pad DIO0 smd rect (at 7 -3) (size 3 1.3) (drill (offset 0.5 0)) (layers F.Cu F.Paste F.Mask))
    (pad DIO1 smd rect (at 7 -5) (size 3 1.3) (drill (offset 0.5 0)) (layers F.Cu F.Paste F.Mask))
    (pad GND smd rect (at -7 7) (size 3 1.3) (drill (offset -0.5 0)) (layers F.Cu F.Paste F.Mask))
    (pad DIO5 smd rect (at -7 5) (size 3 1.3) (drill (offset -0.5 0)) (layers F.Cu F.Paste F.Mask))
    (pad RESET smd rect (at -7 3) (size 3 1.3) (drill (offset -0.5 0)) (layers F.Cu F.Paste F.Mask))
    (pad NSS smd rect (at -7 1) (size 3 1.3) (drill (offset -0.5 0)) (layers F.Cu F.Paste F.Mask))
    (pad SCK smd rect (at -7 -1) (size 3 1.3) (drill (offset -0.5 0)) (layers F.Cu F.Paste F.Mask))
    (pad MOSI smd rect (at -7 -3) (size 3 1.3) (drill (offset -0.5 0)) (layers F.Cu F.Paste F.Mask))
    (pad MISO smd rect (at -7 -5) (size 3 1.3) (drill (offset -0.5 0)) (layers F.Cu F.Paste F.Mask))
    (pad DIO2 smd rect (at 7 -7) (size 3 1.3) (drill (offset 0.5 0)) (layers F.Cu F.Paste F.Mask))
    (pad GND smd rect (at -7 -7) (size 3 1.3) (drill (offset -0.5 0)) (layers F.Cu F.Paste F.Mask))
  )
  (module Pin_Headers:Pin_Header_Straight_1x03_Pitch2.54mm (layer F.Cu) (tedit 5CAA62CF)
    (at 157.9118 94.234)
    (descr "Through hole straight pin header, 1x03, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x03 2.54mm single row")
    (fp_text reference NEO (at 0 -2.33) (layer F.SilkS))
    (fp_text value Pin_Header_Straight_1x03_Pitch2.54mm (at 0 7.41) (layer F.Fab) hide)
    (fp_text user %R (at 0 2.54 90) (layer F.Fab))
    (pad +3.3 thru_hole rect (at 0 0) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
    (pad 2 thru_hole oval (at 0 2.54) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
    (pad GND thru_hole oval (at 0 5.08) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
    (model ${KISYS3DMOD}/Pin_Headers.3dshapes/Pin_Header_Straight_1x03_Pitch2.54mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Pin_Headers:Pin_Header_Straight_1x01_Pitch2.54mm (layer F.Cu) (tedit 5CAA618B)
    (at 153.9494 105.3592)
    (descr "Through hole straight pin header, 1x01, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x01 2.54mm single row")
    (fp_text reference ANT (at 0 -2.33) (layer F.SilkS))
    (fp_text value Pin_Header_Straight_1x01_Pitch2.54mm (at 0 2.33) (layer F.Fab) hide)
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
    (model ${KISYS3DMOD}/Pin_Headers.3dshapes/Pin_Header_Straight_1x01_Pitch2.54mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module kicad-ESP8266:ESP-07S (layer B.Cu) (tedit 5CAA7415)
    (at 142.3162 98.6282)
    (descr "Module, ESP-8266, ESP-07S, 14 pad, SMD")
    (tags "Module ESP-8266 ESP8266")
    (attr smd)
    (fp_text reference >NAME (at 0 9.5) (layer B.SilkS) hide)
    (fp_text value ESP12 (at 0 -9.5) (layer B.SilkS))
    (pad TX smd rect (at 7.7 7) (size 2.6 1.1) (layers B.Cu B.Paste B.Mask))
    (pad RX smd rect (at 7.7 5) (size 2.6 1.1) (layers B.Cu B.Paste B.Mask))
    (pad IO5 smd rect (at 7.7 3) (size 2.6 1.1) (layers B.Cu B.Paste B.Mask))
    (pad IO4 smd rect (at 7.7 1) (size 2.6 1.1) (layers B.Cu B.Paste B.Mask))
    (pad IO0 smd rect (at 7.7 -1) (size 2.6 1.1) (layers B.Cu B.Paste B.Mask))
    (pad IO2 smd rect (at 7.7 -3) (size 2.6 1.1) (layers B.Cu B.Paste B.Mask))
    (pad IO15 smd rect (at 7.7 -5) (size 2.6 1.1) (layers B.Cu B.Paste B.Mask))
    (pad GND smd rect (at 7.7 -7) (size 2.6 1.1) (layers B.Cu B.Paste B.Mask))
    (pad VCC smd rect (at -7.7 -7) (size 2.6 1.1) (layers B.Cu B.Paste B.Mask))
    (pad IO13 smd rect (at -7.7 -5) (size 2.6 1.1) (layers B.Cu B.Paste B.Mask))
    (pad IO12 smd rect (at -7.7 -3) (size 2.6 1.1) (layers B.Cu B.Paste B.Mask))
    (pad IO14 smd rect (at -7.7 -1) (size 2.6 1.1) (layers B.Cu B.Paste B.Mask))
    (pad IO16 smd rect (at -7.7 1) (size 2.6 1.1) (layers B.Cu B.Paste B.Mask))
    (pad EN smd rect (at -7.7 3) (size 2.6 1.1) (layers B.Cu B.Paste B.Mask))
    (pad ADC smd rect (at -7.7 5) (size 2.6 1.1) (layers B.Cu B.Paste B.Mask))
    (pad RST smd rect (at -7.7 7) (size 2.6 1.1) (layers B.Cu B.Paste B.Mask))
  )
  (module Pin_Headers:Pin_Header_Straight_1x02_Pitch2.54mm (layer F.Cu) (tedit 5CAA7464)
    (at 157.9118 102.87)
    (descr "Through hole straight pin header, 1x02, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x02 2.54mm single row")
    (fp_text reference REF** (at 0 -2.33) (layer F.SilkS) hide)
    (fp_text value Pin_Header_Straight_1x02_Pitch2.54mm (at 0 4.87) (layer F.Fab) hide)
    (fp_text user %R (at 0 1.27 90) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
    (pad 2 thru_hole oval (at 0 2.54) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
    (model ${KISYS3DMOD}/Pin_Headers.3dshapes/Pin_Header_Straight_1x02_Pitch2.54mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Housings_DFN_QFN:QFN-16-1EP_3x3mm_Pitch0.5mm (layer F.Cu) (tedit 5CAB9906)
    (at 151.1118 86.5)
    (descr "16-Lead Plastic Quad Flat, No Lead Package (NG) - 3x3x0.9 mm Body [QFN]; (see Microchip Packaging Specification 00000049BS.pdf)")
    (tags "QFN 0.5")
    (attr smd)
    (fp_text reference USB (at 0 -2.85) (layer F.SilkS))
    (fp_text value QFN-16-1EP_3x3mm_Pitch0.5mm (at 0 2.85) (layer F.Fab) hide)
    (pad 1 smd oval (at -1.475 -0.75) (size 0.75 0.3) (layers F.Cu F.Paste F.Mask))
    (pad 2 smd oval (at -1.475 -0.25) (size 0.75 0.3) (layers F.Cu F.Paste F.Mask))
    (pad 3 smd oval (at -1.475 0.25) (size 0.75 0.3) (layers F.Cu F.Paste F.Mask))
    (pad 4 smd oval (at -1.475 0.75) (size 0.75 0.3) (layers F.Cu F.Paste F.Mask))
    (pad 5 smd oval (at -0.75 1.475 90) (size 0.75 0.3) (layers F.Cu F.Paste F.Mask))
    (pad 6 smd oval (at -0.25 1.475 90) (size 0.75 0.3) (layers F.Cu F.Paste F.Mask))
    (pad 7 smd oval (at 0.25 1.475 90) (size 0.75 0.3) (layers F.Cu F.Paste F.Mask))
    (pad 8 smd oval (at 0.75 1.475 90) (size 0.75 0.3) (layers F.Cu F.Paste F.Mask))
    (pad TX smd oval (at 1.475 0.75) (size 0.75 0.3) (layers F.Cu F.Paste F.Mask))
    (pad RX smd oval (at 1.475 0.25) (size 0.75 0.3) (layers F.Cu F.Paste F.Mask))
    (pad 11 smd oval (at 1.475 -0.25) (size 0.75 0.3) (layers F.Cu F.Paste F.Mask))
    (pad 12 smd oval (at 1.475 -0.75) (size 0.75 0.3) (layers F.Cu F.Paste F.Mask))
    (pad 13 smd oval (at 0.75 -1.475 90) (size 0.75 0.3) (layers F.Cu F.Paste F.Mask))
    (pad 14 smd oval (at 0.25 -1.475 90) (size 0.75 0.3) (layers F.Cu F.Paste F.Mask))
    (pad 15 smd oval (at -0.25 -1.475 90) (size 0.75 0.3) (layers F.Cu F.Paste F.Mask))
    (pad 16 smd oval (at -0.75 -1.475 90) (size 0.75 0.3) (layers F.Cu F.Paste F.Mask))
    (pad 17 smd rect (at 0.45 0.45) (size 0.9 0.9) (layers F.Cu F.Paste F.Mask)
      (solder_paste_margin_ratio -0.2))
    (pad 17 smd rect (at 0.45 -0.45) (size 0.9 0.9) (layers F.Cu F.Paste F.Mask)
      (solder_paste_margin_ratio -0.2))
    (pad 17 smd rect (at -0.45 0.45) (size 0.9 0.9) (layers F.Cu F.Paste F.Mask)
      (solder_paste_margin_ratio -0.2))
    (pad 17 smd rect (at -0.45 -0.45) (size 0.9 0.9) (layers F.Cu F.Paste F.Mask)
      (solder_paste_margin_ratio -0.2))
    (model ${KISYS3DMOD}/Housings_DFN_QFN.3dshapes/QFN-16-1EP_3x3mm_Pitch0.5mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module ws2812:3535 (layer F.Cu) (tedit 5CAB8B0B)
    (at 142.3628 87.009)
    (fp_text reference 3535 (at 0 2.4) (layer F.SilkS))
    (fp_text value 3535 (at 0.05 -2.4) (layer F.Fab))
    (pad OUT smd rect (at -1.325 -0.875) (size 1.05 0.85) (drill (offset -0.1 0)) (layers F.Cu F.Paste F.Mask))
    (pad GND smd rect (at -1.325 0.875) (size 1.05 0.85) (drill (offset -0.1 0)) (layers F.Cu F.Paste F.Mask))
    (pad VDD smd rect (at 1.325 -0.875) (size 1.05 0.85) (drill (offset 0.1 0)) (layers F.Cu F.Paste F.Mask))
    (pad IN smd rect (at 1.325 0.875) (size 1.05 0.85) (drill (offset 0.1 0)) (layers F.Cu F.Paste F.Mask))
  )
  (module Resistors_ThroughHole:R_Axial_DIN0204_L3.6mm_D1.6mm_P1.90mm_Vertical (layer F.Cu) (tedit 5CAB9661)
    (at 124.46 105.3084)
    (descr "Resistor, Axial_DIN0204 series, Axial, Vertical, pin pitch=1.9mm, 0.16666666666666666W = 1/6W, length*diameter=3.6*1.6mm^2, http://cdn-reichelt.de/documents/datenblatt/B400/1_4W%23YAG.pdf")
    (tags "Resistor Axial_DIN0204 series Axial Vertical pin pitch 1.9mm 0.16666666666666666W = 1/6W length 3.6mm diameter 1.6mm")
    (fp_text reference VDR1 (at 0.95 -1.86) (layer F.SilkS))
    (fp_text value R_Axial_DIN0204_L3.6mm_D1.6mm_P1.90mm_Vertical (at 0.95 1.86) (layer F.Fab) hide)
    (pad 1 thru_hole circle (at 0 0) (size 1.4 1.4) (drill 0.7) (layers *.Cu *.Mask))
    (pad 2 thru_hole oval (at 1.9 0) (size 1.4 1.4) (drill 0.7) (layers *.Cu *.Mask))
    (model ${KISYS3DMOD}/Resistors_THT.3dshapes/R_Axial_DIN0204_L3.6mm_D1.6mm_P1.90mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.393701 0.393701 0.393701))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_ThroughHole:R_Axial_DIN0204_L3.6mm_D1.6mm_P1.90mm_Vertical (layer F.Cu) (tedit 5CAB9664)
    (at 130.0734 100.3554 90)
    (descr "Resistor, Axial_DIN0204 series, Axial, Vertical, pin pitch=1.9mm, 0.16666666666666666W = 1/6W, length*diameter=3.6*1.6mm^2, http://cdn-reichelt.de/documents/datenblatt/B400/1_4W%23YAG.pdf")
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