(kicad_pcb (version 4) (host pcbnew 4.0.4-stable)
  (general
    (links 38)
    (no_connects 10)
    (area 13.924999 12.924999 40.075001 36.075001)
    (thickness 1.6)
    (drawings 31)
    (tracks 130)
    (zones 0)
    (modules 10)
    (nets 11)
  )
  (page A4)
  (layers
    (0 F.Cu signal)
    (31 B.Cu signal)
    (32 B.Adhes user)
    (33 F.Adhes user)
    (34 B.Paste user)
    (35 F.Paste user)
    (36 B.SilkS user)
    (37 F.SilkS user)
    (38 B.Mask user)
    (39 F.Mask user)
    (40 Dwgs.User user)
    (41 Cmts.User user)
    (42 Eco1.User user)
    (43 Eco2.User user)
    (44 Edge.Cuts user)
    (45 Margin user)
    (46 B.CrtYd user)
    (47 F.CrtYd user)
    (48 B.Fab user)
    (49 F.Fab user)
  )
  (setup
    (last_trace_width 0.3)
    (trace_clearance 0.1524)
    (zone_clearance 0.2)
    (zone_45_only no)
    (trace_min 0.1524)
    (segment_width 0.2)
    (edge_width 0.15)
    (via_size 0.6858)
    (via_drill 0.3302)
    (via_min_size 0.6858)
    (via_min_drill 0.3302)
    (uvia_size 0.762)
    (uvia_drill 0.508)
    (uvias_allowed no)
    (uvia_min_size 0)
    (uvia_min_drill 0)
    (pcb_text_width 0.3)
    (pcb_text_size 1.5 1.5)
    (mod_edge_width 0.15)
    (mod_text_size 1 1)
    (mod_text_width 0.15)
    (pad_size 1.2 0.75)
    (pad_drill 0)
    (pad_to_mask_clearance 0.2)
    (aux_axis_origin 0 0)
    (grid_origin 13 13)
    (visible_elements 7FFFFFFF)
    (pcbplotparams
      (layerselection 0x00000_00000001)
      (usegerberextensions false)
      (excludeedgelayer true)
      (linewidth 0.300000)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15)
      (hpglpenoverlay 2)
      (psnegative false)
      (psa4output false)
      (plotreference false)
      (plotvalue false)
      (plotinvisibletext false)
      (padsonsilk false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 0)
      (scaleselection 1)
      (outputdirectory Sensor_SVG/))
  )
  (net 0 "")
  (net 1 GND)
  (net 2 /A)
  (net 3 /B)
  (net 4 "Net-(C1-Pad1)")
  (net 5 +5V)
  (net 6 /DO)
  (net 7 /PWM)
  (net 8 /CLK)
  (net 9 /CSn)
  (net 10 /IDX)
  (net_class Default "Dies ist die voreingestellte Netzklasse."
    (clearance 0.1524)
    (trace_width 0.3)
    (via_dia 0.6858)
    (via_drill 0.3302)
    (uvia_dia 0.762)
    (uvia_drill 0.508)
    (add_net +5V)
    (add_net /A)
    (add_net /B)
    (add_net /CLK)
    (add_net /CSn)
    (add_net /DO)
    (add_net /IDX)
    (add_net /PWM)
    (add_net GND)
    (add_net "Net-(C1-Pad1)")
  )
  (module dro_footprints:Pin_Header_Straight_1x03 (layer F.Cu) (tedit 583C7A60)
    (at 16.5 28.5)
    (descr "Through hole pin header")
    (tags "pin header")
    (fp_text reference P2 (at -8 -2) (layer F.SilkS))
    (fp_text value CONN_01X03 (at -14 -2) (layer F.Fab))
    (pad 1 thru_hole circle (at 0 0) (size 1.5 1.5) (drill 0.8) (layers F.Cu F.Mask)
      (net 5 +5V))
    (pad 2 thru_hole circle (at 0 2.54) (size 1.5 1.5) (drill 0.8) (layers F.Cu F.Mask)
      (net 1 GND))
    (pad 3 thru_hole circle (at 0 5.08) (size 1.5 1.5) (drill 0.8) (layers F.Cu F.Mask)
      (net 7 /PWM))
    (model Pin_Headers.3dshapes/Pin_Header_Straight_1x03.wrl
      (at (xyz 0 -0.1 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 90))
    )
  )
  (module dro_footprints:Pin_Header_Straight_2x03 (layer F.Cu) (tedit 583C7ADE)
    (at 32.5 32.25 90)
    (descr "Through hole pin header")
    (tags "pin header")
    (fp_text reference P1 (at -0.25 -24 180) (layer F.SilkS))
    (fp_text value CONN_02X03 (at -0.25 -30 180) (layer F.Fab))
    (pad 1 thru_hole circle (at 0 0 90) (size 1.5 1.5) (drill 0.8) (layers F.Cu F.Mask)
      (net 2 /A))
    (pad 2 thru_hole circle (at 2.54 0 90) (size 1.5 1.5) (drill 0.8) (layers F.Cu F.Mask)
      (net 9 /CSn))
    (pad 3 thru_hole circle (at 0 2.54 90) (size 1.5 1.5) (drill 0.8) (layers F.Cu F.Mask)
      (net 3 /B))
    (pad 4 thru_hole circle (at 2.54 2.54 90) (size 1.5 1.5) (drill 0.8) (layers F.Cu F.Mask)
      (net 8 /CLK))
    (pad 5 thru_hole circle (at 0 5.08 90) (size 1.5 1.5) (drill 0.8) (layers F.Cu F.Mask)
      (net 10 /IDX))
    (pad 6 thru_hole circle (at 2.54 5.08 90) (size 1.5 1.5) (drill 0.8) (layers F.Cu F.Mask)
      (net 6 /DO))
    (model Pin_Headers.3dshapes/Pin_Header_Straight_2x03.wrl
      (at (xyz 0.05 -0.1 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 90))
    )
  )
  (module Capacitors_SMD:C_0603_HandSoldering (layer F.Cu) (tedit 583C70A7)
    (at 20.5 30.5 180)
    (descr "Capacitor SMD 0603, hand soldering")
    (tags "capacitor 0603")
    (attr smd)
    (fp_text reference C1 (at 12 0 180) (layer F.SilkS))
    (fp_text value 10uF (at 15 0 180) (layer F.Fab))
    (pad 1 smd rect (at -0.95 0 180) (size 1.2 0.75) (layers F.Cu F.Paste F.Mask)
      (net 4 "Net-(C1-Pad1)"))
    (pad 2 smd rect (at 0.95 0 180) (size 1.2 0.75) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (model Capacitors_SMD.3dshapes/C_0603_HandSoldering.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Housings_SSOP:TSSOP-20_4.4x6.5mm_Pitch0.65mm (layer F.Cu) (tedit 583ACC32)
    (at 26.5 31 90)
    (descr "20-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [TSSOP] (see Microchip Packaging Specification 00000049BS.pdf)")
    (tags "SSOP 0.65")
    (attr smd)
    (fp_text reference U1 (at 0 0 180) (layer F.SilkS))
    (fp_text value AS5311 (at 1.27 0 180) (layer F.Fab))
    (pad 1 smd rect (at -2.95 -2.925 90) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask))
    (pad 2 smd rect (at -2.95 -2.275 90) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask))
    (pad 3 smd rect (at -2.95 -1.625 90) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask))
    (pad 4 smd rect (at -2.95 -0.975 90) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 2 /A))
    (pad 5 smd rect (at -2.95 -0.325 90) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 3 /B))
    (pad 6 smd rect (at -2.95 0.325 90) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask))
    (pad 7 smd rect (at -2.95 0.975 90) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 10 /IDX))
    (pad 8 smd rect (at -2.95 1.625 90) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 9 smd rect (at -2.95 2.275 90) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 10 smd rect (at -2.95 2.925 90) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask))
    (pad 11 smd rect (at 2.95 2.925 90) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask))
    (pad 12 smd rect (at 2.95 2.275 90) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 6 /DO))
    (pad 13 smd rect (at 2.95 1.625 90) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 8 /CLK))
    (pad 14 smd rect (at 2.95 0.975 90) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 9 /CSn))
    (pad 15 smd rect (at 2.95 0.325 90) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 7 /PWM))
    (pad 16 smd rect (at 2.95 -0.325 90) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask))
    (pad 17 smd rect (at 2.95 -0.975 90) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask))
    (pad 18 smd rect (at 2.95 -1.625 90) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 4 "Net-(C1-Pad1)"))
    (pad 19 smd rect (at 2.95 -2.275 90) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 5 +5V))
    (pad 20 smd rect (at 2.95 -2.925 90) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask))
    (model Housings_SSOP.3dshapes/TSSOP-20_4.4x6.5mm_Pitch0.65mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0603_HandSoldering (layer F.Cu) (tedit 583C7C29)
    (at 20.5 28.5 180)
    (descr "Capacitor SMD 0603, hand soldering")
    (tags "capacitor 0603")
    (attr smd)
    (fp_text reference C2 (at 12 0 360) (layer F.SilkS))
    (fp_text value 100nF (at 15.5 0 360) (layer F.Fab))
    (pad 1 smd rect (at -0.95 0 180) (size 1.2 0.75) (layers F.Cu F.Paste F.Mask)
      (net 5 +5V))
    (pad 2 smd rect (at 0.95 0 180) (size 1.2 0.75) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (model Capacitors_SMD.3dshapes/C_0603_HandSoldering.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0603_HandSoldering (layer F.Cu) (tedit 583C7C29)
    (at 20.5 15.5 180)
    (descr "Capacitor SMD 0603, hand soldering")
    (tags "capacitor 0603")
    (attr smd)
    (fp_text reference C2 (at 12 0 360) (layer F.SilkS))
    (fp_text value 100nF (at 15.5 0 360) (layer F.Fab))
    (pad 1 smd rect (at -0.95 0 180) (size 1.2 0.75) (layers F.Cu F.Paste F.Mask)
      (net 5 +5V))
    (pad 2 smd rect (at 0.95 0 180) (size 1.2 0.75) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (model Capacitors_SMD.3dshapes/C_0603_HandSoldering.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Housings_SSOP:TSSOP-20_4.4x6.5mm_Pitch0.65mm (layer F.Cu) (tedit 583ACC32)
    (at 26.5 18 90)
    (descr "20-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [TSSOP] (see Microchip Packaging Specification 00000049BS.pdf)")
    (tags "SSOP 0.65")
    (attr smd)
    (fp_text reference U1 (at 0 0 180) (layer F.SilkS))
    (fp_text value AS5311 (at 1.27 0 180) (layer F.Fab))
    (pad 1 smd rect (at -2.95 -2.925 90) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask))
    (pad 2 smd rect (at -2.95 -2.275 90) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask))
    (pad 3 smd rect (at -2.95 -1.625 90) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask))
    (pad 4 smd rect (at -2.95 -0.975 90) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 2 /A))
    (pad 5 smd rect (at -2.95 -0.325 90) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 3 /B))
    (pad 6 smd rect (at -2.95 0.325 90) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask))
    (pad 7 smd rect (at -2.95 0.975 90) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 10 /IDX))
    (pad 8 smd rect (at -2.95 1.625 90) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 9 smd rect (at -2.95 2.275 90) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 10 smd rect (at -2.95 2.925 90) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask))
    (pad 11 smd rect (at 2.95 2.925 90) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask))
    (pad 12 smd rect (at 2.95 2.275 90) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 6 /DO))
    (pad 13 smd rect (at 2.95 1.625 90) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 8 /CLK))
    (pad 14 smd rect (at 2.95 0.975 90) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 9 /CSn))
    (pad 15 smd rect (at 2.95 0.325 90) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 7 /PWM))
    (pad 16 smd rect (at 2.95 -0.325 90) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask))
    (pad 17 smd rect (at 2.95 -0.975 90) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask))
    (pad 18 smd rect (at 2.95 -1.625 90) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 4 "Net-(C1-Pad1)"))
    (pad 19 smd rect (at 2.95 -2.275 90) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 5 +5V))
    (pad 20 smd rect (at 2.95 -2.925 90) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask))
    (model Housings_SSOP.3dshapes/TSSOP-20_4.4x6.5mm_Pitch0.65mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0603_HandSoldering (layer F.Cu) (tedit 583C70A7)
    (at 20.5 17.5 180)
    (descr "Capacitor SMD 0603, hand soldering")
    (tags "capacitor 0603")
    (attr smd)
    (fp_text reference C1 (at 12 0 180) (layer F.SilkS))
    (fp_text value 10uF (at 15 0 180) (layer F.Fab))
    (pad 1 smd rect (at -0.95 0 180) (size 1.2 0.75) (layers F.Cu F.Paste F.Mask)
      (net 4 "Net-(C1-Pad1)"))
    (pad 2 smd rect (at 0.95 0 180) (size 1.2 0.75) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (model Capacitors_SMD.3dshapes/C_0603_HandSoldering.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module dro_footprints:Pin_Header_Straight_2x03 (layer F.Cu) (tedit 583C7ADE)
    (at 32.5 19.25 90)
    (descr "Through hole pin header")
    (tags "pin header")
    (fp_text reference P1 (at -0.25 -24 180) (layer F.SilkS))
    (fp_text value CONN_02X03 (at -0.25 -30 180) (layer F.Fab))
    (pad 1 thru_hole circle (at 0 0 90) (size 1.5 1.5) (drill 0.8) (layers F.Cu F.Mask)
      (net 2 /A))
    (pad 2 thru_hole circle (at 2.54 0 90) (size 1.5 1.5) (drill 0.8) (layers F.Cu F.Mask)
      (net 9 /CSn))
    (pad 3 thru_hole circle (at 0 2.54 90) (size 1.5 1.5) (drill 0.8) (layers F.Cu F.Mask)
      (net 3 /B))
    (pad 4 thru_hole circle (at 2.54 2.54 90) (size 1.5 1.5) (drill 0.8) (layers F.Cu F.Mask)
      (net 8 /CLK))
    (pad 5 thru_hole circle (at 0 5.08 90) (size 1.5 1.5) (drill 0.8) (layers F.Cu F.Mask)
      (net 10 /IDX))
    (pad 6 thru_hole circle (at 2.54 5.08 90) (size 1.5 1.5) (drill 0.8) (layers F.Cu F.Mask)
      (net 6 /DO))
    (model Pin_Headers.3dshapes/Pin_Header_Straight_2x03.wrl
      (at (xyz 0.05 -0.1 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 90))
    )
  )
  (module dro_footprints:Pin_Header_Straight_1x03 (layer F.Cu) (tedit 583C7A60)
    (at 16.5 15.5)
    (descr "Through hole pin header")
    (tags "pin header")
    (fp_text reference P2 (at -8 -2) (layer F.SilkS))
    (fp_text value CONN_01X03 (at -14 -2) (layer F.Fab))
    (pad 1 thru_hole circle (at 0 0) (size 1.5 1.5) (drill 0.8) (layers F.Cu F.Mask)
      (net 5 +5V))
    (pad 2 thru_hole circle (at 0 2.54) (size 1.5 1.5) (drill 0.8) (layers F.Cu F.Mask)
      (net 1 GND))
    (pad 3 thru_hole circle (at 0 5.08) (size 1.5 1.5) (drill 0.8) (layers F.Cu F.Mask)
      (net 7 /PWM))
    (model Pin_Headers.3dshapes/Pin_Header_Straight_1x03.wrl
      (at (xyz 0 -0.1 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 90))
    )
  )
  (gr_text A (at 32.5 34.5) (layer F.SilkS))
  (gr_text B (at 35 34.5) (layer F.SilkS))
  (gr_text GND (at 15 31 90) (layer F.SilkS))
  (gr_text +5V (at 15 27.75 90) (layer F.SilkS))
  (gr_text IDX (at 37.5 34.5) (layer F.SilkS))
  (gr_text 100nF (at 20.5 27) (layer F.SilkS))
  (gr_text 10uF (at 20.5 32) (layer F.SilkS))
  (gr_text CSn (at 32 27.5) (layer F.SilkS))
  (gr_text CLK (at 35 27.5) (layer F.SilkS))
  (gr_text DO (at 37.5 27.5) (layer F.SilkS))
  (gr_text PWM (at 15 34.25 90) (layer F.SilkS))
  (gr_text PWM (at 15 21.25 90) (layer F.SilkS))
  (gr_line (start 38 26) (end 16 26) (angle 90) (layer Edge.Cuts) (width 0.15))
  (gr_line (start 38 23) (end 38 26) (angle 90) (layer Edge.Cuts) (width 0.15))
  (gr_line (start 16 23) (end 38 23) (angle 90) (layer Edge.Cuts) (width 0.15))
  (gr_line (start 40 36) (end 14 36) (angle 90) (layer Edge.Cuts) (width 0.15))
  (gr_line (start 40 13) (end 40 36) (angle 90) (layer Edge.Cuts) (width 0.15))
  (gr_line (start 14 13) (end 40 13) (angle 90) (layer Edge.Cuts) (width 0.15))
  (gr_text DO (at 37.5 14.5) (layer F.SilkS))
  (gr_text CLK (at 35 14.5) (layer F.SilkS))
  (gr_text CSn (at 32 14.5) (layer F.SilkS))
  (gr_text 10uF (at 20.5 19) (layer F.SilkS))
  (gr_line (start 14 36) (end 14 13) (angle 90) (layer Edge.Cuts) (width 0.15))
  (gr_line (start 16 23) (end 16 26) (angle 90) (layer Edge.Cuts) (width 0.15))
  (gr_text 100nF (at 20.5 14) (layer F.SilkS))
  (gr_text IDX (at 37.5 21.5) (layer F.SilkS))
  (gr_text +5V (at 15 14.75 90) (layer F.SilkS))
  (gr_text GND (at 15 18 90) (layer F.SilkS))
  (gr_text B (at 35 21.5) (layer F.SilkS))
  (gr_text A (at 32.5 21.5) (layer F.SilkS))
  (gr_text "cut out" (at 24 24.5) (layer Dwgs.User))
  (zone (net 1) (net_name GND) (layer F.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.2))
    (min_thickness 0.19)
    (fill yes (arc_segments 16) (thermal_gap 0.3) (thermal_bridge_width 0.35))
    (polygon
      (pts
        (xy 39.5 22.5) (xy 14.5 22.5) (xy 14.5 13.5) (xy 39.5 13.5)
      )
    )
  )
  (zone (net 1) (net_name GND) (layer F.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.2))
    (min_thickness 0.19)
    (fill yes (arc_segments 16) (thermal_gap 0.3) (thermal_bridge_width 0.35))
    (polygon
      (pts
        (xy 39.5 35.5) (xy 14.5 35.5) (xy 14.5 26.5) (xy 39.5 26.5)
      )
    )
  )
)
