(kicad_pcb (version 4) (host pcbnew 4.0.6)
  (general
    (links 150)
    (no_connects 0)
    (area 138.476667 92.439 163.783334 134.215)
    (thickness 1.6)
    (drawings 62)
    (tracks 673)
    (zones 0)
    (modules 36)
    (nets 49)
  )
  (page A4)
  (layers
    (0 F.Cu signal)
    (31 B.Cu signal)
    (32 B.Adhes user)
    (33 F.Adhes user hide)
    (34 B.Paste user)
    (35 F.Paste user)
    (36 B.SilkS user)
    (37 F.SilkS user)
    (38 B.Mask user)
    (39 F.Mask user)
    (40 Dwgs.User user hide)
    (41 Cmts.User user)
    (42 Eco1.User user)
    (43 Eco2.User user)
    (44 Edge.Cuts user)
    (45 Margin user)
    (46 B.CrtYd user)
    (47 F.CrtYd user)
    (48 B.Fab user)
    (49 F.Fab user)
  )
  (setup
    (last_trace_width 0.1)
    (trace_clearance 0.1)
    (zone_clearance 0.25)
    (zone_45_only yes)
    (trace_min 0.1)
    (segment_width 0.2)
    (edge_width 0.15)
    (via_size 0.5)
    (via_drill 0.2)
    (via_min_size 0.5)
    (via_min_drill 0.2)
    (uvia_size 0.3)
    (uvia_drill 0.1)
    (uvias_allowed no)
    (uvia_min_size 0.2)
    (uvia_min_drill 0.1)
    (pcb_text_width 0.3)
    (pcb_text_size 1.5 1.5)
    (mod_edge_width 0.15)
    (mod_text_size 1 1)
    (mod_text_width 0.15)
    (pad_size 1.7 1.7)
    (pad_drill 1)
    (pad_to_mask_clearance 0.075)
    (aux_axis_origin 0 0)
    (grid_origin 151.13 99.314)
    (visible_elements 7FFFFFFF)
    (pcbplotparams
      (layerselection 0x310fc_80000001)
      (usegerberextensions false)
      (excludeedgelayer true)
      (linewidth 0.100000)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15)
      (hpglpenoverlay 2)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (padsonsilk false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 0)
      (scaleselection 1)
      (outputdirectory gerbers/))
  )
  (net 0 "")
  (net 1 CDONE)
  (net 2 VPP_FAST)
  (net 3 224)
  (net 4 221)
  (net 5 185)
  (net 6 174)
  (net 7 116)
  (net 8 3A)
  (net 9 3B)
  (net 10 148)
  (net 11 10A)
  (net 12 212)
  (net 13 115)
  (net 14 119)
  (net 15 10B)
  (net 16 24B)
  (net 17 26A)
  (net 18 24A)
  (net 19 81_GBIN5)
  (net 20 54)
  (net 21 26B)
  (net 22 55)
  (net 23 177)
  (net 24 "Net-(J3-Pad1)")
  (net 25 "Net-(J3-Pad2)")
  (net 26 "Net-(J3-Pad3)")
  (net 27 "Net-(J3-Pad4)")
  (net 28 "Net-(U4-Pad4)")
  (net 29 "Net-(U5-Pad7)")
  (net 30 +5V)
  (net 31 CLK)
  (net 32 +1V2)
  (net 33 SCK)
  (net 34 CRESET_B)
  (net 35 SDI)
  (net 36 2B)
  (net 37 SS)
  (net 38 GND)
  (net 39 +3V3)
  (net 40 SDO)
  (net 41 141_GBIN2)
  (net 42 USB_P)
  (net 43 USB_N)
  (net 44 "Net-(C6-Pad1)")
  (net 45 "Net-(C6-Pad2)")
  (net 46 "Net-(U1-PadE3)")
  (net 47 "Net-(U1-PadF3)")
  (net 48 "Net-(R7-Pad1)")
  (net_class Default "This is the default net class."
    (clearance 0.1)
    (trace_width 0.1)
    (via_dia 0.5)
    (via_drill 0.2)
    (uvia_dia 0.3)
    (uvia_drill 0.1)
    (add_net +1V2)
    (add_net +3V3)
    (add_net +5V)
    (add_net 10A)
    (add_net 10B)
    (add_net 115)
    (add_net 116)
    (add_net 119)
    (add_net 141_GBIN2)
    (add_net 148)
    (add_net 174)
    (add_net 177)
    (add_net 185)
    (add_net 212)
    (add_net 221)
    (add_net 224)
    (add_net 24A)
    (add_net 24B)
    (add_net 26A)
    (add_net 26B)
    (add_net 2B)
    (add_net 3A)
    (add_net 3B)
    (add_net 54)
    (add_net 55)
    (add_net 81_GBIN5)
    (add_net CDONE)
    (add_net CLK)
    (add_net CRESET_B)
    (add_net GND)
    (add_net "Net-(C6-Pad1)")
    (add_net "Net-(C6-Pad2)")
    (add_net "Net-(J3-Pad1)")
    (add_net "Net-(J3-Pad2)")
    (add_net "Net-(J3-Pad3)")
    (add_net "Net-(J3-Pad4)")
    (add_net "Net-(R7-Pad1)")
    (add_net "Net-(U1-PadE3)")
    (add_net "Net-(U1-PadF3)")
    (add_net "Net-(U4-Pad4)")
    (add_net "Net-(U5-Pad7)")
    (add_net SCK)
    (add_net SDI)
    (add_net SDO)
    (add_net SS)
    (add_net USB_N)
    (add_net USB_P)
    (add_net VPP_FAST)
  )
  (net_class large ""
    (clearance 0.1)
    (trace_width 0.15)
    (via_dia 0.6)
    (via_drill 0.3)
    (uvia_dia 0.3)
    (uvia_drill 0.1)
  )
  (net_class xlarge ""
    (clearance 0.2)
    (trace_width 0.2)
    (via_dia 0.5)
    (via_drill 0.2)
    (uvia_dia 0.3)
    (uvia_drill 0.1)
  )
  (module tinyfpga:CM81 (layer F.Cu) (tedit 595DDD14)
    (at 151.124 114.1049)
    (solder_mask_margin 0.05)
    (fp_text reference U1 (at 0 1.2091) (layer F.Fab))
    (fp_text value iCE40-LP8K-CM81 (at 0.006 -0.4909) (layer F.Fab))
    (pad A1 smd circle (at -1.6 -1.6) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 3 224) (solder_mask_margin -0.01))
    (pad A2 smd circle (at -1.2 -1.6) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 4 221) (solder_mask_margin -0.01))
    (pad A3 smd circle (at -0.8 -1.6) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 42 USB_P) (solder_mask_margin -0.01))
    (pad A4 smd circle (at -0.4 -1.6) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 43 USB_N) (solder_mask_margin -0.01))
    (pad A5 smd circle (at 0 -1.6) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 39 +3V3) (solder_mask_margin -0.01))
    (pad A6 smd circle (at 0.4 -1.6) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 5 185) (solder_mask_margin -0.01))
    (pad A7 smd circle (at 0.8 -1.6) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 23 177) (solder_mask_margin -0.01))
    (pad A8 smd circle (at 1.2 -1.6) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 6 174) (solder_mask_margin -0.01))
    (pad A9 smd circle (at 1.6 -1.6) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 7 116) (solder_mask_margin -0.01))
    (pad B1 smd circle (at -1.6 -1.2) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 8 3A) (solder_mask_margin -0.01))
    (pad B2 smd circle (at -1.2 -1.2) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 36 2B) (solder_mask_margin -0.01))
    (pad B3 smd circle (at -0.8 -1.2) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 36 2B) (solder_mask_margin -0.01))
    (pad B4 smd circle (at -0.4 -1.2) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 31 CLK) (solder_mask_margin -0.01))
    (pad B5 smd circle (at 0 -1.2) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 31 CLK) (solder_mask_margin -0.01))
    (pad B6 smd circle (at 0.4 -1.2) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 39 +3V3) (solder_mask_margin -0.01))
    (pad B7 smd circle (at 0.8 -1.2) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 39 +3V3) (solder_mask_margin -0.01))
    (pad B8 smd circle (at 1.2 -1.2) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 39 +3V3) (solder_mask_margin -0.01))
    (pad B9 smd circle (at 1.6 -1.2) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 39 +3V3) (solder_mask_margin -0.01))
    (pad C1 smd circle (at -1.6 -0.8) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 9 3B) (solder_mask_margin -0.01))
    (pad C2 smd circle (at -1.2 -0.8) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 36 2B) (solder_mask_margin -0.01))
    (pad C3 smd circle (at -0.8 -0.8) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 36 2B) (solder_mask_margin -0.01))
    (pad C4 smd circle (at -0.4 -0.8) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 31 CLK) (solder_mask_margin -0.01))
    (pad C5 smd circle (at 0 -0.8) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 31 CLK) (solder_mask_margin -0.01))
    (pad C6 smd circle (at 0.4 -0.8) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 39 +3V3) (solder_mask_margin -0.01))
    (pad C7 smd circle (at 0.8 -0.8) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 2 VPP_FAST) (solder_mask_margin -0.01))
    (pad C8 smd circle (at 1.2 -0.8) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 39 +3V3) (solder_mask_margin -0.01))
    (pad C9 smd circle (at 1.6 -0.8) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 10 148) (solder_mask_margin -0.01))
    (pad D1 smd circle (at -1.6 -0.4) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 11 10A) (solder_mask_margin -0.01))
    (pad D2 smd circle (at -1.2 -0.4) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 32 +1V2) (solder_mask_margin -0.01))
    (pad D3 smd circle (at -0.8 -0.4) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 32 +1V2) (solder_mask_margin -0.01))
    (pad D4 smd circle (at -0.4 -0.4) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 32 +1V2) (solder_mask_margin -0.01))
    (pad D5 smd circle (at 0 -0.4) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 12 212) (solder_mask_margin -0.01))
    (pad D6 smd circle (at 0.4 -0.4) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 13 115) (solder_mask_margin -0.01))
    (pad D7 smd circle (at 0.8 -0.4) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 41 141_GBIN2) (solder_mask_margin -0.01))
    (pad D8 smd circle (at 1.2 -0.4) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 41 141_GBIN2) (solder_mask_margin -0.01))
    (pad D9 smd circle (at 1.6 -0.4) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 14 119) (solder_mask_margin -0.01))
    (pad E1 smd circle (at -1.6 0) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 15 10B) (solder_mask_margin -0.01))
    (pad E2 smd circle (at -1.2 0) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 32 +1V2) (solder_mask_margin -0.01))
    (pad E3 smd circle (at -0.8 0) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 46 "Net-(U1-PadE3)") (solder_mask_margin -0.01))
    (pad E4 smd circle (at -0.4 0) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 38 GND) (solder_mask_margin -0.01))
    (pad E5 smd circle (at 0 0) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 38 GND) (solder_mask_margin -0.01))
    (pad E6 smd circle (at 0.4 0) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 1 CDONE) (solder_mask_margin -0.01))
    (pad E7 smd circle (at 0.8 0) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 41 141_GBIN2) (solder_mask_margin -0.01))
    (pad E8 smd circle (at 1.2 0) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 41 141_GBIN2) (solder_mask_margin -0.01))
    (pad E9 smd circle (at 1.6 0) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 32 +1V2) (solder_mask_margin -0.01))
    (pad F1 smd circle (at -1.6 0.4) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 32 +1V2) (solder_mask_margin -0.01))
    (pad F2 smd circle (at -1.2 0.4) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 32 +1V2) (solder_mask_margin -0.01))
    (pad F3 smd circle (at -0.8 0.4) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 47 "Net-(U1-PadF3)") (solder_mask_margin -0.01))
    (pad F4 smd circle (at -0.4 0.4) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 38 GND) (solder_mask_margin -0.01))
    (pad F5 smd circle (at 0 0.4) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 38 GND) (solder_mask_margin -0.01))
    (pad F6 smd circle (at 0.4 0.4) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 38 GND) (solder_mask_margin -0.01))
    (pad F7 smd circle (at 0.8 0.4) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 37 SS) (solder_mask_margin -0.01))
    (pad F8 smd circle (at 1.2 0.4) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 37 SS) (solder_mask_margin -0.01))
    (pad F9 smd circle (at 1.6 0.4) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 38 GND) (solder_mask_margin -0.01))
    (pad G1 smd circle (at -1.6 0.8) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 16 24B) (solder_mask_margin -0.01))
    (pad G2 smd circle (at -1.2 0.8) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 17 26A) (solder_mask_margin -0.01))
    (pad G3 smd circle (at -0.8 0.8) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 18 24A) (solder_mask_margin -0.01))
    (pad G4 smd circle (at -0.4 0.8) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 19 81_GBIN5) (solder_mask_margin -0.01))
    (pad G5 smd circle (at 0 0.8) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 40 SDO) (solder_mask_margin -0.01))
    (pad G6 smd circle (at 0.4 0.8) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 40 SDO) (solder_mask_margin -0.01))
    (pad G7 smd circle (at 0.8 0.8) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 33 SCK) (solder_mask_margin -0.01))
    (pad G8 smd circle (at 1.2 0.8) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 33 SCK) (solder_mask_margin -0.01))
    (pad G9 smd circle (at 1.6 0.8) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 37 SS) (solder_mask_margin -0.01))
    (pad H1 smd circle (at -1.6 1.2) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 20 54) (solder_mask_margin -0.01))
    (pad H2 smd circle (at -1.2 1.2) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 21 26B) (solder_mask_margin -0.01))
    (pad H3 smd circle (at -0.8 1.2) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 39 +3V3) (solder_mask_margin -0.01))
    (pad H4 smd circle (at -0.4 1.2) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 40 SDO) (solder_mask_margin -0.01))
    (pad H5 smd circle (at 0 1.2) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 34 CRESET_B) (solder_mask_margin -0.01))
    (pad H6 smd circle (at 0.4 1.2) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 34 CRESET_B) (solder_mask_margin -0.01))
    (pad H7 smd circle (at 0.8 1.2) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 35 SDI) (solder_mask_margin -0.01) (clearance 0.1))
    (pad H8 smd circle (at 1.2 1.2) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 39 +3V3) (solder_mask_margin -0.01))
    (pad H9 smd circle (at 1.6 1.2) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 33 SCK) (solder_mask_margin -0.01))
    (pad J1 smd circle (at -1.6 1.6) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 22 55) (solder_mask_margin -0.01) (clearance 0.1))
    (pad J2 smd circle (at -1.2 1.6) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 39 +3V3) (solder_mask_margin -0.01))
    (pad J3 smd circle (at -0.8 1.6) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 40 SDO) (solder_mask_margin -0.01))
    (pad J4 smd circle (at -0.4 1.6) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 34 CRESET_B) (solder_mask_margin -0.01))
    (pad J5 smd circle (at 0 1.6) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 39 +3V3) (solder_mask_margin -0.01))
    (pad J6 smd circle (at 0.4 1.6) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 44 "Net-(C6-Pad1)") (solder_mask_margin -0.01))
    (pad J7 smd circle (at 0.8 1.6) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 45 "Net-(C6-Pad2)") (solder_mask_margin -0.01))
    (pad J8 smd circle (at 1.2 1.6) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 35 SDI) (solder_mask_margin -0.01))
    (pad J9 smd circle (at 1.6 1.6) (size 0.2 0.2) (layers F.Cu F.Paste F.Mask)
      (net 39 +3V3) (solder_mask_margin -0.01))
  )
  (module Connectors_Molex:USB_Micro-B_Molex_47346-0001 (layer F.Cu) (tedit 595DDA79)
    (at 151.13 97.964 180)
    (descr http://www.molex.com/pdm_docs/sd/473460001_sd.pdf)
    (tags "Micro-USB SMD")
    (solder_mask_margin 0.05)
    (attr smd)
    (fp_text reference J3 (at 0 4.55 360) (layer F.Fab))
    (fp_text value USB_OTG (at -0.005637 3.079657 360) (layer F.Fab))
    (fp_text user "PCB Front Edge" (at 7.65 1.5 360) (layer Dwgs.User))
    (pad 1 smd rect (at -1.3 -2.675 270) (size 1.35 0.4) (layers F.Cu F.Paste F.Mask)
      (net 24 "Net-(J3-Pad1)"))
    (pad 2 smd rect (at -0.65 -2.675 270) (size 1.35 0.4) (layers F.Cu F.Paste F.Mask)
      (net 25 "Net-(J3-Pad2)"))
    (pad 3 smd rect (at 0 -2.675 270) (size 1.35 0.4) (layers F.Cu F.Paste F.Mask)
      (net 26 "Net-(J3-Pad3)"))
    (pad 4 smd rect (at 0.65 -2.675 270) (size 1.35 0.4) (layers F.Cu F.Paste F.Mask)
      (net 27 "Net-(J3-Pad4)"))
    (pad 5 smd rect (at 1.3 -2.675 270) (size 1.35 0.4) (layers F.Cu F.Paste F.Mask)
      (net 38 GND))
    (pad 6 smd rect (at -3.1 -2.55 180) (size 2.1 1.6) (layers F.Cu F.Paste F.Mask)
      (net 38 GND))
    (pad 6 smd rect (at 3.1 -2.55 180) (size 2.1 1.6) (layers F.Cu F.Paste F.Mask)
      (net 38 GND))
    (pad 6 smd rect (at -3.8 0 270) (size 1.9 1.8) (layers F.Cu F.Paste F.Mask)
      (net 38 GND))
    (pad 6 smd rect (at 3.8 0 270) (size 1.9 1.8) (layers F.Cu F.Paste F.Mask)
      (net 38 GND))
    (pad 6 smd rect (at -1.2 0 270) (size 1.9 1.9) (layers F.Cu F.Paste F.Mask)
      (net 38 GND))
    (pad 6 smd rect (at 1.2 0 270) (size 1.9 1.9) (layers F.Cu F.Paste F.Mask)
      (net 38 GND))
    (model Connectors_Molex.3dshapes/USB_Micro-B_Molex_47346-0001.wrl
      (at (xyz -0.05 0 0.05))
      (scale (xyz 0.39 0.39 0.39))
      (rotate (xyz -90 0 90))
    )
  )
  (module tinyfpga:CDFN3225-4LD-PL-1 (layer F.Cu) (tedit 595DCA31)
    (at 148.033614 109.355754 180)
    (solder_mask_margin 0.05)
    (fp_text reference U3 (at 0 -0.6 180) (layer F.Fab))
    (fp_text value DSC6001CI2A-016.0000T (at 0 0 180) (layer F.Fab))
    (pad 1 smd rect (at -1.046386 0.941754 270) (size 1 0.9) (layers F.Cu F.Paste F.Mask)
      (net 39 +3V3))
    (pad 4 smd rect (at -1.046386 -0.958246 270) (size 1 0.9) (layers F.Cu F.Paste F.Mask)
      (net 39 +3V3))
    (pad 3 smd rect (at 1.053614 -0.958246 270) (size 1 0.9) (layers F.Cu F.Paste F.Mask)
      (net 31 CLK))
    (pad 2 smd rect (at 1.053614 0.941754 270) (size 1 0.9) (layers F.Cu F.Paste F.Mask)
      (net 38 GND))
  )
  (module Measurement_Points:Measurement_Point_Round-SMD-Pad_Small (layer B.Cu) (tedit 59227DE2)
    (at 146.98 129.914)
    (descr "Mesurement Point, Round, SMD Pad, DM 1.5mm,")
    (tags "Mesurement Point Round SMD Pad 1.5mm")
    (attr virtual)
    (fp_text reference TP1 (at 0 0.425) (layer B.Fab))
    (fp_text value TEST (at 0 -0.375) (layer B.Fab))
    (pad 1 smd circle (at 0 0) (size 1.5 1.5) (layers B.Cu B.Mask)
      (net 48 "Net-(R7-Pad1)"))
  )
  (module Measurement_Points:Measurement_Point_Round-SMD-Pad_Small (layer B.Cu) (tedit 5923CDF4)
    (at 151.18 129.914)
    (descr "Mesurement Point, Round, SMD Pad, DM 1.5mm,")
    (tags "Mesurement Point Round SMD Pad 1.5mm")
    (attr virtual)
    (fp_text reference TP2 (at 0 0.425) (layer B.Fab))
    (fp_text value TEST (at 0 -0.475) (layer B.Fab))
    (pad 1 smd circle (at 0 0) (size 1.5 1.5) (layers B.Cu B.Mask)
      (net 34 CRESET_B))
  )
  (module tinyfpga:SC-70-C5 (layer F.Cu) (tedit 593651E8)
    (at 153.63 105.164)
    (solder_mask_margin 0.05)
    (fp_text reference U2 (at 0 -0.1) (layer F.Fab))
    (fp_text value MIC5504-3.3YM5-TR (at 0 0.3) (layer F.Fab))
    (pad 2 smd rect (at 0 -1.3) (size 0.45 0.95) (layers F.Cu F.Paste F.Mask)
      (net 38 GND))
    (pad 3 smd rect (at -0.95 -1.3) (size 0.45 0.95) (layers F.Cu F.Paste F.Mask)
      (net 30 +5V))
    (pad 1 smd rect (at 0.95 -1.3) (size 0.45 0.95) (layers F.Cu F.Paste F.Mask)
      (net 30 +5V))
    (pad 4 smd rect (at -0.95 1.3) (size 0.45 0.95) (layers F.Cu F.Paste F.Mask)
      (net 39 +3V3))
    (pad 5 smd rect (at 0.95 1.3) (size 0.45 0.95) (layers F.Cu F.Paste F.Mask)
      (net 39 +3V3))
  )
  (module Resistors_SMD:R_0402_NoSilk (layer F.Cu) (tedit 59227D88)
    (at 148.23 127.364)
    (descr "Resistor SMD 0402, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0402")
    (attr smd)
    (fp_text reference R7 (at -0.875 0.05) (layer F.Fab))
    (fp_text value 10k (at 0 0) (layer F.Fab))
    (pad 1 smd rect (at -0.45 0) (size 0.4 0.6) (layers F.Cu F.Paste F.Mask)
      (net 48 "Net-(R7-Pad1)"))
    (pad 2 smd rect (at 0.45 0) (size 0.4 0.6) (layers F.Cu F.Paste F.Mask)
      (net 38 GND))
    (model ${KISYS3DMOD}/Resistors_SMD.3dshapes/R_0402.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Pin_Headers:Pin_Header_Straight_1x14_Pitch2.54mm (layer F.Cu) (tedit 5923D90E)
    (at 158.75 97.79)
    (descr "Through hole straight pin header, 1x14, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x14 2.54mm single row")
    (fp_text reference J2 (at 0 -2.33) (layer F.Fab) hide)
    (fp_text value CONN_01X14 (at 0 35.35) (layer F.Fab) hide)
    (fp_text user %R (at 0 -2.33) (layer F.Fab) hide)
    (pad 1 thru_hole circle (at 0 0) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 30 +5V))
    (pad 2 thru_hole oval (at 0 2.54) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 39 +3V3))
    (pad 3 thru_hole oval (at 0 5.08) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 32 +1V2))
    (pad 4 thru_hole oval (at 0 7.62) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 5 185))
    (pad 5 thru_hole oval (at 0 10.16) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 23 177))
    (pad 6 thru_hole oval (at 0 12.7) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 6 174))
    (pad 7 thru_hole oval (at 0 15.24) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 7 116))
    (pad 8 thru_hole oval (at 0 17.78) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 41 141_GBIN2))
    (pad 9 thru_hole oval (at 0 20.32) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 10 148))
    (pad 10 thru_hole oval (at 0 22.86) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 14 119))
    (pad 11 thru_hole oval (at 0 25.4) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 37 SS))
    (pad 12 thru_hole oval (at 0 27.94) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 33 SCK))
    (pad 13 thru_hole oval (at 0 30.48) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 35 SDI))
    (pad 14 thru_hole oval (at 0 33.02) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 40 SDO))
    (model ${KISYS3DMOD}/Pin_Headers.3dshapes/Pin_Header_Straight_1x14_Pitch2.54mm.wrl
      (at (xyz 0 -0.65 -0.05))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 180 90))
    )
  )
  (module Capacitors_SMD:C_0603 (layer F.Cu) (tedit 591FDE86)
    (at 156.03 100.914 90)
    (descr "Capacitor SMD 0603, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0603")
    (attr smd)
    (fp_text reference C17 (at -1.275 0 90) (layer F.Fab))
    (fp_text value 10uF (at 0 0.025 90) (layer F.Fab))
    (pad 1 smd rect (at -0.75 0 90) (size 0.8 0.75) (layers F.Cu F.Paste F.Mask)
      (net 30 +5V))
    (pad 2 smd rect (at 0.75 0 90) (size 0.8 0.75) (layers F.Cu F.Paste F.Mask)
      (net 38 GND))
    (model Capacitors_SMD.3dshapes/C_0603.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0402 (layer F.Cu) (tedit 595DCA43)
    (at 154.53 130.364 270)
    (descr "Resistor SMD 0402, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0402")
    (attr smd)
    (fp_text reference R6 (at -0.875 0 270) (layer F.Fab))
    (fp_text value 100 (at 0 0 270) (layer F.Fab))
    (pad 1 smd rect (at -0.45 0 270) (size 0.4 0.6) (layers F.Cu F.Paste F.Mask)
      (net 39 +3V3))
    (pad 2 smd rect (at 0.45 0 270) (size 0.4 0.6) (layers F.Cu F.Paste F.Mask)
      (net 34 CRESET_B))
    (model ${KISYS3DMOD}/Resistors_SMD.3dshapes/R_0402.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Housings_SOIC:SOIC-8_3.9x4.9mm_Pitch1.27mm (layer F.Cu) (tedit 591F8EE7)
    (at 151.13 124.249)
    (descr "8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC] (see Microchip Packaging Specification 00000049BS.pdf)")
    (tags "SOIC 1.27")
    (attr smd)
    (fp_text reference U5 (at 0 0) (layer F.Fab))
    (fp_text value AT25SF041-SSHD-B (at 0 1.4) (layer F.Fab))
    (pad 1 smd rect (at -2.7 -1.905) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 37 SS))
    (pad 2 smd rect (at -2.7 -0.635) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 35 SDI))
    (pad 3 smd rect (at -2.7 0.635) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 48 "Net-(R7-Pad1)"))
    (pad 4 smd rect (at -2.7 1.905) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 38 GND))
    (pad 5 smd rect (at 2.7 1.905) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 40 SDO))
    (pad 6 smd rect (at 2.7 0.635) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 33 SCK))
    (pad 7 smd rect (at 2.7 -0.635) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 29 "Net-(U5-Pad7)"))
    (pad 8 smd rect (at 2.7 -1.905) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 39 +3V3))
    (model Housings_SOIC.3dshapes/SOIC-8_3.9x4.9mm_Pitch1.27mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0402_NoSilk (layer F.Cu) (tedit 591E97BE)
    (at 150.78 117.264 270)
    (descr "Capacitor SMD 0402, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0402")
    (attr smd)
    (fp_text reference C16 (at 0.9 0 270) (layer F.Fab))
    (fp_text value 100nF (at 0 0 270) (layer F.Fab))
    (pad 1 smd rect (at -0.55 0 270) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 39 +3V3))
    (pad 2 smd rect (at 0.55 0 270) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 38 GND))
    (model Capacitors_SMD.3dshapes/C_0402.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0402_NoSilk (layer F.Cu) (tedit 591E9512)
    (at 153.68 115.414 90)
    (descr "Resistor SMD 0402, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0402")
    (attr smd)
    (fp_text reference R5 (at -0.875 0 90) (layer F.Fab))
    (fp_text value 10k (at 0 0 90) (layer F.Fab))
    (pad 1 smd rect (at -0.45 0 90) (size 0.4 0.6) (layers F.Cu F.Paste F.Mask)
      (net 39 +3V3))
    (pad 2 smd rect (at 0.45 0 90) (size 0.4 0.6) (layers F.Cu F.Paste F.Mask)
      (net 37 SS))
    (model ${KISYS3DMOD}/Resistors_SMD.3dshapes/R_0402.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0402_NoSilk (layer F.Cu) (tedit 591E94D1)
    (at 154.23 114.064)
    (descr "Capacitor SMD 0402, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0402")
    (attr smd)
    (fp_text reference C13 (at 0.9 0) (layer F.Fab))
    (fp_text value 10nF (at 0 0) (layer F.Fab))
    (pad 1 smd rect (at -0.55 0) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 32 +1V2))
    (pad 2 smd rect (at 0.55 0) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 38 GND))
    (model Capacitors_SMD.3dshapes/C_0402.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0402_NoSilk (layer F.Cu) (tedit 591E9451)
    (at 151.13 110.964 90)
    (descr "Capacitor SMD 0402, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0402")
    (solder_mask_margin 0.05)
    (attr smd)
    (fp_text reference C15 (at 0.9 0 90) (layer F.Fab))
    (fp_text value 10nF (at 0 0 90) (layer F.Fab))
    (pad 1 smd rect (at -0.55 0 90) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 39 +3V3))
    (pad 2 smd rect (at 0.55 0 90) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 38 GND))
    (model Capacitors_SMD.3dshapes/C_0402.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0402_NoSilk (layer F.Cu) (tedit 591E93FE)
    (at 154.23 112.764)
    (descr "Capacitor SMD 0402, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0402")
    (attr smd)
    (fp_text reference C14 (at 0.9 0) (layer F.Fab))
    (fp_text value 10nF (at 0 0) (layer F.Fab))
    (pad 1 smd rect (at -0.55 0) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 39 +3V3))
    (pad 2 smd rect (at 0.55 0) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 38 GND))
    (model Capacitors_SMD.3dshapes/C_0402.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0402_NoSilk (layer F.Cu) (tedit 591E9370)
    (at 147.73 114.914 180)
    (descr "Capacitor SMD 0402, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0402")
    (attr smd)
    (fp_text reference C12 (at 0.9 0 180) (layer F.Fab))
    (fp_text value 10nF (at 0 0 180) (layer F.Fab))
    (pad 1 smd rect (at -0.55 0 180) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 32 +1V2))
    (pad 2 smd rect (at 0.55 0 180) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 38 GND))
    (model Capacitors_SMD.3dshapes/C_0402.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0402_NoSilk (layer F.Cu) (tedit 591E931C)
    (at 147.73 114.114 180)
    (descr "Capacitor SMD 0402, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0402")
    (attr smd)
    (fp_text reference C11 (at 0.9 0 180) (layer F.Fab))
    (fp_text value 100nF (at 0 0 180) (layer F.Fab))
    (pad 1 smd rect (at -0.55 0 180) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 32 +1V2))
    (pad 2 smd rect (at 0.55 0 180) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 38 GND))
    (model Capacitors_SMD.3dshapes/C_0402.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0402_NoSilk (layer F.Cu) (tedit 591E92B2)
    (at 154.23 111.964)
    (descr "Capacitor SMD 0402, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0402")
    (attr smd)
    (fp_text reference C10 (at 0.9 0) (layer F.Fab))
    (fp_text value 100nF (at 0 0) (layer F.Fab))
    (pad 1 smd rect (at -0.55 0) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 39 +3V3))
    (pad 2 smd rect (at 0.55 0) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 38 GND))
    (model Capacitors_SMD.3dshapes/C_0402.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0402_NoSilk (layer F.Cu) (tedit 591E9218)
    (at 152.88 117.264 270)
    (descr "Capacitor SMD 0402, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0402")
    (attr smd)
    (fp_text reference C9 (at 0.85 0 270) (layer F.Fab))
    (fp_text value 100nF (at 0 0 270) (layer F.Fab))
    (pad 1 smd rect (at -0.55 0 270) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 39 +3V3))
    (pad 2 smd rect (at 0.55 0 270) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 38 GND))
    (model Capacitors_SMD.3dshapes/C_0402.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0402_NoSilk (layer F.Cu) (tedit 591E91DB)
    (at 149.28 117.264 270)
    (descr "Capacitor SMD 0402, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0402")
    (attr smd)
    (fp_text reference C8 (at 0.85 0 270) (layer F.Fab))
    (fp_text value 100nF (at 0 0 270) (layer F.Fab))
    (pad 1 smd rect (at -0.55 0 270) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 39 +3V3))
    (pad 2 smd rect (at 0.55 0 270) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 38 GND))
    (model Capacitors_SMD.3dshapes/C_0402.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0603 (layer F.Cu) (tedit 591D4D01)
    (at 151.73 119.714 270)
    (descr "Capacitor SMD 0603, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0603")
    (attr smd)
    (fp_text reference C6 (at 1.1 0 270) (layer F.Fab))
    (fp_text value 10uF (at 0 0 270) (layer F.Fab))
    (pad 1 smd rect (at -0.75 0 270) (size 0.8 0.75) (layers F.Cu F.Paste F.Mask)
      (net 44 "Net-(C6-Pad1)"))
    (pad 2 smd rect (at 0.75 0 270) (size 0.8 0.75) (layers F.Cu F.Paste F.Mask)
      (net 45 "Net-(C6-Pad2)"))
    (model Capacitors_SMD.3dshapes/C_0603.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0402_NoSilk (layer F.Cu) (tedit 591D48CF)
    (at 151.73 117.264 270)
    (descr "Capacitor SMD 0402, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0402")
    (attr smd)
    (fp_text reference C7 (at 0.9 0 270) (layer F.Fab))
    (fp_text value 100nF (at 0 0 270) (layer F.Fab))
    (pad 1 smd rect (at -0.55 0 270) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 44 "Net-(C6-Pad1)"))
    (pad 2 smd rect (at 0.55 0 270) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 45 "Net-(C6-Pad2)"))
    (model Capacitors_SMD.3dshapes/C_0402.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0402_NoSilk (layer F.Cu) (tedit 591D4866)
    (at 152.93 120.014 90)
    (descr "Resistor SMD 0402, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0402")
    (attr smd)
    (fp_text reference R4 (at -0.8 0 90) (layer F.Fab))
    (fp_text value 100 (at 0 0 90) (layer F.Fab))
    (pad 1 smd rect (at -0.45 0 90) (size 0.4 0.6) (layers F.Cu F.Paste F.Mask)
      (net 45 "Net-(C6-Pad2)"))
    (pad 2 smd rect (at 0.45 0 90) (size 0.4 0.6) (layers F.Cu F.Paste F.Mask)
      (net 32 +1V2))
    (model ${KISYS3DMOD}/Resistors_SMD.3dshapes/R_0402.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0402_NoSilk locked (layer F.Cu) (tedit 591D47FF)
    (at 155.33 122.914 270)
    (descr "Capacitor SMD 0402, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0402")
    (attr smd)
    (fp_text reference C5 (at 0.85 0 270) (layer F.Fab))
    (fp_text value 100nF (at 0 0 270) (layer F.Fab))
    (pad 1 smd rect (at -0.55 0 270) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 39 +3V3))
    (pad 2 smd rect (at 0.55 0 270) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 38 GND))
    (model Capacitors_SMD.3dshapes/C_0402.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0402_NoSilk (layer F.Cu) (tedit 591D2795)
    (at 149.63 102.714 270)
    (descr "Resistor SMD 0402, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0402")
    (attr smd)
    (fp_text reference R1 (at 0.8 0 270) (layer F.Fab))
    (fp_text value 1.5k (at 0 0 270) (layer F.Fab))
    (pad 1 smd rect (at -0.45 0 270) (size 0.4 0.6) (layers F.Cu F.Paste F.Mask)
      (net 26 "Net-(J3-Pad3)"))
    (pad 2 smd rect (at 0.45 0 270) (size 0.4 0.6) (layers F.Cu F.Paste F.Mask)
      (net 39 +3V3))
    (model ${KISYS3DMOD}/Resistors_SMD.3dshapes/R_0402.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0402_NoSilk (layer F.Cu) (tedit 591D270C)
    (at 150.63 102.714 90)
    (descr "Resistor SMD 0402, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0402")
    (attr smd)
    (fp_text reference R2 (at -0.8 0 90) (layer F.Fab))
    (fp_text value 68 (at 0 0 90) (layer F.Fab))
    (pad 1 smd rect (at -0.45 0 90) (size 0.4 0.6) (layers F.Cu F.Paste F.Mask)
      (net 42 USB_P))
    (pad 2 smd rect (at 0.45 0 90) (size 0.4 0.6) (layers F.Cu F.Paste F.Mask)
      (net 26 "Net-(J3-Pad3)"))
    (model ${KISYS3DMOD}/Resistors_SMD.3dshapes/R_0402.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0402_NoSilk (layer F.Cu) (tedit 591D26E3)
    (at 151.63 102.714 90)
    (descr "Resistor SMD 0402, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0402")
    (attr smd)
    (fp_text reference R3 (at -0.8 0 90) (layer F.Fab))
    (fp_text value 68 (at 0 0 90) (layer F.Fab))
    (pad 1 smd rect (at -0.45 0 90) (size 0.4 0.6) (layers F.Cu F.Paste F.Mask)
      (net 43 USB_N))
    (pad 2 smd rect (at 0.45 0 90) (size 0.4 0.6) (layers F.Cu F.Paste F.Mask)
      (net 25 "Net-(J3-Pad2)"))
    (model ${KISYS3DMOD}/Resistors_SMD.3dshapes/R_0402.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module tinyfpga:SC-70-C5 (layer F.Cu) (tedit 591AA44A)
    (at 153.93 108.714)
    (solder_mask_margin 0.05)
    (fp_text reference U4 (at 0 0) (layer F.Fab))
    (fp_text value MIC5365-1.2YC5-TR (at 0 1) (layer F.Fab))
    (pad 2 smd rect (at 0 -1.1) (size 0.45 0.95) (layers F.Cu F.Paste F.Mask)
      (net 38 GND))
    (pad 3 smd rect (at -0.65 -1.1) (size 0.45 0.95) (layers F.Cu F.Paste F.Mask)
      (net 39 +3V3))
    (pad 1 smd rect (at 0.65 -1.1) (size 0.45 0.95) (layers F.Cu F.Paste F.Mask)
      (net 39 +3V3))
    (pad 4 smd rect (at -0.65 1.1) (size 0.45 0.95) (layers F.Cu F.Paste F.Mask)
      (net 28 "Net-(U4-Pad4)"))
    (pad 5 smd rect (at 0.65 1.1) (size 0.45 0.95) (layers F.Cu F.Paste F.Mask)
      (net 32 +1V2))
  )
  (module Capacitors_SMD:C_0402_NoSilk (layer F.Cu) (tedit 591BE6A8)
    (at 155.93 109.914)
    (descr "Capacitor SMD 0402, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0402")
    (attr smd)
    (fp_text reference C3 (at 0.9 0) (layer F.Fab))
    (fp_text value 1uF (at 0 0) (layer F.Fab))
    (pad 1 smd rect (at -0.55 0) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 32 +1V2))
    (pad 2 smd rect (at 0.55 0) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 38 GND))
    (model Capacitors_SMD.3dshapes/C_0402.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0402_NoSilk (layer F.Cu) (tedit 591BE6A0)
    (at 155.93 103.914)
    (descr "Capacitor SMD 0402, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0402")
    (attr smd)
    (fp_text reference C1 (at 0.9 0) (layer F.Fab))
    (fp_text value 1uF (at 0 0) (layer F.Fab))
    (pad 1 smd rect (at -0.55 0) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 30 +5V))
    (pad 2 smd rect (at 0.55 0) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 38 GND))
    (model Capacitors_SMD.3dshapes/C_0402.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0402_NoSilk (layer F.Cu) (tedit 591BE664)
    (at 155.93 106.314)
    (descr "Capacitor SMD 0402, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0402")
    (attr smd)
    (fp_text reference C4 (at 0.9 0) (layer F.Fab))
    (fp_text value 1uF (at 0 0) (layer F.Fab))
    (pad 1 smd rect (at -0.55 0) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 39 +3V3))
    (pad 2 smd rect (at 0.55 0) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 38 GND))
    (model Capacitors_SMD.3dshapes/C_0402.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0402_NoSilk (layer F.Cu) (tedit 591BE66E)
    (at 155.93 107.514)
    (descr "Capacitor SMD 0402, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0402")
    (attr smd)
    (fp_text reference C2 (at 0.9 0) (layer F.Fab))
    (fp_text value 1uF (at 0 0) (layer F.Fab))
    (pad 1 smd rect (at -0.55 0) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 39 +3V3))
    (pad 2 smd rect (at 0.55 0) (size 0.6 0.5) (layers F.Cu F.Paste F.Mask)
      (net 38 GND))
    (model Capacitors_SMD.3dshapes/C_0402.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Pin_Headers:Pin_Header_Straight_1x14_Pitch2.54mm (layer F.Cu) (tedit 5923D90A)
    (at 143.51 97.79)
    (descr "Through hole straight pin header, 1x14, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x14 2.54mm single row")
    (fp_text reference J1 (at 0 -2.33) (layer F.Fab) hide)
    (fp_text value CONN_01X14 (at 0 35.35) (layer F.Fab) hide)
    (fp_text user %R (at 0 -2.33) (layer F.Fab) hide)
    (pad 1 thru_hole rect (at 0 0) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 38 GND))
    (pad 2 thru_hole oval (at 0 2.54) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 42 USB_P))
    (pad 3 thru_hole oval (at 0 5.08) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 43 USB_N))
    (pad 4 thru_hole oval (at 0 7.62) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 31 CLK))
    (pad 5 thru_hole oval (at 0 10.16) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 36 2B))
    (pad 6 thru_hole oval (at 0 12.7) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 4 221))
    (pad 7 thru_hole oval (at 0 15.24) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 3 224))
    (pad 8 thru_hole oval (at 0 17.78) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 8 3A))
    (pad 9 thru_hole oval (at 0 20.32) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 9 3B))
    (pad 10 thru_hole oval (at 0 22.86) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 11 10A))
    (pad 11 thru_hole oval (at 0 25.4) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 15 10B))
    (pad 12 thru_hole oval (at 0 27.94) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 16 24B))
    (pad 13 thru_hole oval (at 0 30.48) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 20 54))
    (pad 14 thru_hole oval (at 0 33.02) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 22 55))
    (model ${KISYS3DMOD}/Pin_Headers.3dshapes/Pin_Header_Straight_1x14_Pitch2.54mm.wrl
      (at (xyz 0 -0.65 -0.05))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 180 90))
    )
  )
  (module tinyfpga:PTS_810_SMT_Switch (layer F.Cu) (tedit 591BDDCE)
    (at 151.13 129.714)
    (fp_text reference SW1 (at 0 0) (layer F.Fab))
    (fp_text value SW_Push (at 0 -3) (layer F.Fab) hide)
    (pad 1 smd rect (at -2.075 -1.075) (size 1.05 0.65) (layers F.Cu F.Paste F.Mask)
      (net 38 GND))
    (pad 1 smd rect (at 2.075 -1.075) (size 1.05 0.65) (layers F.Cu F.Paste F.Mask)
      (net 38 GND))
    (pad 2 smd rect (at 2.075 1.075) (size 1.05 0.65) (layers F.Cu F.Paste F.Mask)
      (net 34 CRESET_B))
    (pad 2 smd rect (at -2.075 1.075) (size 1.05 0.65) (layers F.Cu F.Paste F.Mask)
      (net 34 CRESET_B))
  )
  (module Inductors_SMD:L_0603 (layer F.Cu) (tedit 591BE5E4)
    (at 153.88 102.414 180)
    (descr "Resistor SMD 0603, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0603")
    (attr smd)
    (fp_text reference L1 (at 0 0 180) (layer F.Fab))
    (fp_text value Bead (at 0 0.65 180) (layer F.Fab))
    (pad 1 smd rect (at -0.75 0 180) (size 0.5 0.9) (layers F.Cu F.Paste F.Mask)
      (net 30 +5V))
    (pad 2 smd rect (at 0.75 0 180) (size 0.5 0.9) (layers F.Cu F.Paste F.Mask)
      (net 24 "Net-(J3-Pad1)"))
    (model Inductors_SMD.3dshapes\L_0603.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (gr_text "Tiny\nFPGA" (at 146.558 119.761) (layer F.SilkS))
  (gr_text Bx (at 146.28 105.764) (layer F.SilkS))
  (gr_text 5v (at 157.48 97.79) (layer B.SilkS))
  (gr_text 3.3v (at 157.48 100.33) (layer B.SilkS))
  (gr_text 1.2v (at 157.48 102.87) (layer B.SilkS))
  (gr_text 24 (at 157.48 105.41) (layer B.SilkS))
  (gr_text 23 (at 157.48 107.95) (layer B.SilkS))
  (gr_text 22 (at 157.48 110.49) (layer B.SilkS))
  (gr_text 21 (at 157.48 113.03) (layer B.SilkS))
  (gr_text 20 (at 157.48 115.57) (layer B.SilkS))
  (gr_text 19 (at 157.48 118.11) (layer B.SilkS))
  (gr_text 18 (at 157.48 120.65) (layer B.SilkS))
  (gr_text 17/SS (at 157.48 123.19) (layer B.SilkS))
  (gr_text 16/SCK (at 157.48 125.73) (layer B.SilkS))
  (gr_text 15/SDI (at 157.48 128.27) (layer B.SilkS))
  (gr_text 14/SDO (at 157.48 130.81) (layer B.SilkS))
  (gr_text 13 (at 144.78 130.81) (layer B.SilkS))
  (gr_text 12 (at 144.78 128.27) (layer B.SilkS))
  (gr_text 11 (at 144.78 125.73) (layer B.SilkS))
  (gr_text 10 (at 144.78 123.19) (layer B.SilkS))
  (gr_text 9 (at 144.78 120.65) (layer B.SilkS))
  (gr_text 8 (at 144.78 118.11) (layer B.SilkS))
  (gr_text 7 (at 144.78 115.57) (layer B.SilkS))
  (gr_text 6 (at 144.78 113.03) (layer B.SilkS))
  (gr_text 5 (at 144.78 110.49) (layer B.SilkS))
  (gr_text 4 (at 144.78 107.95) (layer B.SilkS))
  (gr_text CLK/3 (at 144.78 105.41) (layer B.SilkS))
  (gr_text USB-/2 (at 144.78 102.87) (layer B.SilkS))
  (gr_text USB+/1 (at 144.78 100.33) (layer B.SilkS))
  (gr_text GND (at 144.78 97.79) (layer B.SilkS))
  (gr_text 3.3v (at 158.08 99.214) (layer F.SilkS))
  (gr_text 5v (at 157.73 97.464) (layer F.SilkS))
  (gr_text 1.2v (at 157.48 102.87) (layer F.SilkS))
  (gr_text 24 (at 157.48 105.156) (layer F.SilkS))
  (gr_text 23 (at 157.48 108.712) (layer F.SilkS))
  (gr_text 22 (at 157.48 110.998) (layer F.SilkS))
  (gr_text 21 (at 157.48 113.03) (layer F.SilkS))
  (gr_text 20 (at 157.48 115.57) (layer F.SilkS))
  (gr_text 19 (at 157.48 118.11) (layer F.SilkS))
  (gr_text 18 (at 157.48 120.65) (layer F.SilkS))
  (gr_text 17 (at 157.48 123.19) (layer F.SilkS))
  (gr_text 16 (at 157.48 125.73) (layer F.SilkS))
  (gr_text 15 (at 157.48 128.27) (layer F.SilkS))
  (gr_text 14 (at 157.48 130.81) (layer F.SilkS))
  (gr_text 13 (at 144.78 130.81) (layer F.SilkS))
  (gr_text 12 (at 144.78 128.27) (layer F.SilkS))
  (gr_text 11 (at 144.78 125.73) (layer F.SilkS))
  (gr_text 10 (at 144.78 123.19) (layer F.SilkS))
  (gr_text 9 (at 144.78 120.65) (layer F.SilkS))
  (gr_text 8 (at 144.78 118.11) (layer F.SilkS))
  (gr_text 7 (at 144.78 115.57) (layer F.SilkS))
  (gr_text 6 (at 144.78 113.03) (layer F.SilkS))
  (gr_text 5 (at 144.78 110.49) (layer F.SilkS))
  (gr_text 4 (at 144.78 107.95) (layer F.SilkS))
  (gr_text 3 (at 144.78 105.41) (layer F.SilkS))
  (gr_text 2 (at 144.78 102.87) (layer F.SilkS))
  (gr_text 1 (at 144.78 100.33) (layer F.SilkS))
  (gr_text G (at 144.78 97.79) (layer F.SilkS))
  (gr_line (start 142.24 132.08) (end 142.24 96.52) (layer Edge.Cuts) (width 0.15))
  (gr_line (start 160.02 132.08) (end 142.24 132.08) (layer Edge.Cuts) (width 0.15))
  (gr_line (start 160.02 96.52) (end 160.02 132.08) (layer Edge.Cuts) (width 0.15))
  (gr_line (start 142.24 96.52) (end 160.02 96.52) (layer Edge.Cuts) (width 0.15))
  (zone (net 38) (net_name GND) (layer B.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.25))
    (min_thickness 0.25)
    (fill yes (arc_segments 16) (thermal_gap 0.25) (thermal_bridge_width 0.26))
    (polygon
      (pts
        (xy 142.63 96.814) (xy 159.63 96.814) (xy 159.63 131.814) (xy 142.63 131.814)
      )
    )
  )
  (zone (net 38) (net_name GND) (layer F.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.2))
    (min_thickness 0.2)
    (fill yes (arc_segments 16) (thermal_gap 0.2) (thermal_bridge_width 0.21))
    (polygon
      (pts
        (xy 142.63 96.814) (xy 159.63 96.814) (xy 159.63 131.814) (xy 142.63 131.814)
      )
    )
  )
  (zone (net 0) (net_name "") (layer F.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.1))
    (min_thickness 0.254)
    (keepout (tracks allowed) (vias allowed) (copperpour not_allowed))
    (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 149.18 112.164) (xy 153.08 112.164) (xy 153.08 116.064) (xy 149.18 116.064)
      )
    )
  )
  (zone (net 0) (net_name "") (layer F.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.25))
    (min_thickness 0.254)
    (keepout (tracks allowed) (vias allowed) (copperpour not_allowed))
    (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 154.03 114.364) (xy 155.48 114.364) (xy 155.48 115.664) (xy 154.38 114.814) (xy 153.98 114.614)
      )
    )
  )
)
