(kicad_pcb (version 20171130) (host pcbnew "(5.1.6-0-10_14)")
  (general
    (thickness 1.6)
    (drawings 165)
    (tracks 1915)
    (zones 0)
    (modules 158)
    (nets 145)
  )
  (page USLedger)
  (title_block
    (date 2019-12-29)
  )
  (layers
    (0 F.Cu signal)
    (31 B.Cu signal)
    (32 B.Adhes user hide)
    (33 F.Adhes user hide)
    (34 B.Paste user hide)
    (35 F.Paste user hide)
    (36 B.SilkS user)
    (37 F.SilkS user)
    (38 B.Mask user hide)
    (39 F.Mask user hide)
    (40 Dwgs.User user hide)
    (41 Cmts.User user hide)
    (42 Eco1.User user hide)
    (43 Eco2.User user hide)
    (44 Edge.Cuts user)
    (45 Margin user hide)
    (46 B.CrtYd user hide)
    (47 F.CrtYd user)
    (48 B.Fab user hide)
    (49 F.Fab user hide)
  )
  (setup
    (last_trace_width 0.2032)
    (trace_clearance 0.1778)
    (zone_clearance 0.2032)
    (zone_45_only no)
    (trace_min 0.1778)
    (via_size 0.6604)
    (via_drill 0.4064)
    (via_min_size 0.4064)
    (via_min_drill 0.3556)
    (uvia_size 0.3)
    (uvia_drill 0.1)
    (uvias_allowed no)
    (uvia_min_size 0.2)
    (uvia_min_drill 0.1)
    (edge_width 0.05)
    (segment_width 0.2)
    (pcb_text_width 0.3)
    (pcb_text_size 1.5 1.5)
    (mod_edge_width 0.12)
    (mod_text_size 0.5 0.5)
    (mod_text_width 0.07)
    (pad_size 2.2 2.2)
    (pad_drill 2.2)
    (pad_to_mask_clearance 0.0254)
    (solder_mask_min_width 0.0254)
    (aux_axis_origin 0 0)
    (visible_elements FEFDBF7F)
    (pcbplotparams
      (layerselection 0x010fc_ffffffff)
      (usegerberextensions false)
      (usegerberattributes false)
      (usegerberadvancedattributes false)
      (creategerberjobfile false)
      (excludeedgelayer true)
      (linewidth 0.100000)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (padsonsilk false)
      (subtractmaskfromsilk false)
      (outputformat 4)
      (mirror false)
      (drillshape 0)
      (scaleselection 1)
      (outputdirectory ""))
  )
  (net 0 "")
  (net 1 GND)
  (net 2 MISOSD)
  (net 3 +3V3)
  (net 4 MOSISD)
  (net 5 SCKSD)
  (net 6 ~RESET~)
  (net 7 +3.3VA)
  (net 8 /3REG)
  (net 9 "Net-(H1-Pad1)")
  (net 10 "Net-(H2-Pad1)")
  (net 11 "Net-(H3-Pad1)")
  (net 12 "Net-(H4-Pad1)")
  (net 13 "Net-(L_DEF1-Pad1)")
  (net 14 "Net-(L_PWR1-Pad1)")
  (net 15 "Net-(L_SD1-Pad1)")
  (net 16 "Net-(CUFG1-Pad1)")
  (net 17 "Net-(BUZZER1-Pad2)")
  (net 18 /FB)
  (net 19 "Net-(FUSE1-Pad2)")
  (net 20 "Net-(J_USB1-Pad4)")
  (net 21 "Net-(JP_SWD1-Pad10)")
  (net 22 "Net-(JP_SWD1-Pad9)")
  (net 23 "Net-(JP_SWD1-Pad8)")
  (net 24 "Net-(JP_SWD1-Pad7)")
  (net 25 "Net-(U_DS3231-Pad4)")
  (net 26 "Net-(U_DS3231-Pad1)")
  (net 27 "Net-(CQ1-Pad1)")
  (net 28 "Net-(CQ2-Pad2)")
  (net 29 "Net-(RCLK1-Pad1)")
  (net 30 "Net-(L_RX1-Pad1)")
  (net 31 "Net-(L_TX1-Pad1)")
  (net 32 "Net-(RID1-Pad2)")
  (net 33 "Net-(RID2-Pad1)")
  (net 34 "Net-(Battery-Cell1-Pad1)")
  (net 35 "Net-(RLED1-Pad1)")
  (net 36 +3V0)
  (net 37 "Net-(L_PWR1-Pad2)")
  (net 38 "Net-(RVBUZ2-Pad1)")
  (net 39 "Net-(RVBUZ2-Pad2)")
  (net 40 AIN2)
  (net 41 AIN3)
  (net 42 "Net-(RBUZV1-Pad2)")
  (net 43 "Net-(RADALR1-Pad2)")
  (net 44 PWR_JACK)
  (net 45 PWR_BAT)
  (net 46 GP0)
  (net 47 GP7)
  (net 48 GP6)
  (net 49 GP5)
  (net 50 GP4)
  (net 51 GP1)
  (net 52 GP2)
  (net 53 GP3)
  (net 54 "Net-(RADDR1-Pad2)")
  (net 55 ANI0-TMP36)
  (net 56 MCP47-V1)
  (net 57 MCP47-V0)
  (net 58 "Net-(RMCP23A0-Pad1)")
  (net 59 "Net-(JP_RA8875-Pad4)")
  (net 60 "Net-(JP_RA8875-Pad3)")
  (net 61 "Net-(JP_PMONITOR1-Pad1)")
  (net 62 "Net-(J_Micro_SD1-Pad1)")
  (net 63 "Net-(J_Micro_SD1-Pad8)")
  (net 64 /VIN)
  (net 65 /BOOT)
  (net 66 /EN)
  (net 67 /SW)
  (net 68 PB03-SCL)
  (net 69 PB02-SDA)
  (net 70 PA16-D13-DEFLED)
  (net 71 PA12-MOSI)
  (net 72 PA13-SCK)
  (net 73 PA14-MISO)
  (net 74 PB12-D07-SD_INT12)
  (net 75 PA17-D12-TFT_CS)
  (net 76 PA18-D10-TFT_RESET)
  (net 77 PA19-D11-TFT_INT3)
  (net 78 PB11-QSPI_CS)
  (net 79 PA08-QSPI_DATA[0])
  (net 80 PA10-QSPI_DATA[2])
  (net 81 PA11-QSPI_DATA[3])
  (net 82 PB10-QSPI_SCK)
  (net 83 PA09-QSPI_DATA[1])
  (net 84 PA04-D17-A3-MCP_INT4)
  (net 85 PA02-A0-DAC0)
  (net 86 PA05-A1-DAC1)
  (net 87 PA06-D16-A2-RTC_INT6)
  (net 88 PB13-D04-NET_RES)
  (net 89 PB14-D05-NET_CS)
  (net 90 PB15-D06-NET_INT15)
  (net 91 PB16-D3-TX5)
  (net 92 PB17-D2-RX5)
  (net 93 PA22-D1-TX3)
  (net 94 PA23-D0-RX3)
  (net 95 "Net-(CDC53-Pad2)")
  (net 96 "Net-(CV7-Pad1)")
  (net 97 "Net-(IND55-Pad2)")
  (net 98 PA25-D31-USBD+)
  (net 99 PA24-D30-USBD-)
  (net 100 PB06-D27-RXLED)
  (net 101 PA27-D28-TXLED)
  (net 102 PB22-D40-NEOPIX)
  (net 103 PB07-D29-USBENA)
  (net 104 TFT12-PB00)
  (net 105 TFT13-PB01)
  (net 106 TFT14-PB05)
  (net 107 TFT15-PB04)
  (net 108 "Net-(SP_MCP_INT4-Pad2)")
  (net 109 "Net-(U_SAMD51J19-Pad60)")
  (net 110 "Net-(U_SAMD51J19-Pad50)")
  (net 111 "Net-(U_SAMD51J19-Pad32)")
  (net 112 PA20-D09)
  (net 113 PA21-D08)
  (net 114 PA07-BUZ)
  (net 115 AIN1-PCELL)
  (net 116 PB09-D19-A5-TFT_WAIT)
  (net 117 PB08-D18-A4_SD_CS)
  (net 118 /PA03-AREF)
  (net 119 /ADSVV)
  (net 120 /ADSGD)
  (net 121 +5C)
  (net 122 /TFT-15)
  (net 123 /TFT-14)
  (net 124 /TFT-13)
  (net 125 /TFT-12)
  (net 126 /TFT-MISO)
  (net 127 /SWO)
  (net 128 /PA30-D44-SWDCLK)
  (net 129 /PA31-D45-SWDIO)
  (net 130 "Net-(L_NEO1-Pad2)")
  (net 131 "Net-(L_NEO1-Pad4)")
  (net 132 /FLCS)
  (net 133 /MCP47-A00)
  (net 134 /MCP47-A01)
  (net 135 /FLMOSI)
  (net 136 /FLI02)
  (net 137 /FLIO3)
  (net 138 /FLSCK)
  (net 139 /FLMISO)
  (net 140 /TFT-WAIT)
  (net 141 "Net-(U_MCP23-Pad11)")
  (net 142 "Net-(U_MCP23-Pad10)")
  (net 143 "Net-(U_MCP23-Pad7)")
  (net 144 "Net-(CSN1-Pad1)")
  (net_class Default "This is the default net class."
    (clearance 0.1778)
    (trace_width 0.2032)
    (via_dia 0.6604)
    (via_drill 0.4064)
    (uvia_dia 0.3)
    (uvia_drill 0.1)
    (diff_pair_width 0.2032)
    (diff_pair_gap 0.25)
    (add_net +3.3VA)
    (add_net +3V0)
    (add_net +3V3)
    (add_net +5C)
    (add_net /3REG)
    (add_net /ADSGD)
    (add_net /ADSVV)
    (add_net /BOOT)
    (add_net /EN)
    (add_net /FB)
    (add_net /FLCS)
    (add_net /FLI02)
    (add_net /FLIO3)
    (add_net /FLMISO)
    (add_net /FLMOSI)
    (add_net /FLSCK)
    (add_net /MCP47-A00)
    (add_net /MCP47-A01)
    (add_net /PA03-AREF)
    (add_net /PA30-D44-SWDCLK)
    (add_net /PA31-D45-SWDIO)
    (add_net /SW)
    (add_net /SWO)
    (add_net /TFT-12)
    (add_net /TFT-13)
    (add_net /TFT-14)
    (add_net /TFT-15)
    (add_net /TFT-MISO)
    (add_net /TFT-WAIT)
    (add_net /VIN)
    (add_net AIN1-PCELL)
    (add_net AIN2)
    (add_net AIN3)
    (add_net ANI0-TMP36)
    (add_net GND)
    (add_net GP0)
    (add_net GP1)
    (add_net GP2)
    (add_net GP3)
    (add_net GP4)
    (add_net GP5)
    (add_net GP6)
    (add_net GP7)
    (add_net MCP47-V0)
    (add_net MCP47-V1)
    (add_net MISOSD)
    (add_net MOSISD)
    (add_net "Net-(BUZZER1-Pad2)")
    (add_net "Net-(Battery-Cell1-Pad1)")
    (add_net "Net-(CDC53-Pad2)")
    (add_net "Net-(CQ1-Pad1)")
    (add_net "Net-(CQ2-Pad2)")
    (add_net "Net-(CSN1-Pad1)")
    (add_net "Net-(CUFG1-Pad1)")
    (add_net "Net-(CV7-Pad1)")
    (add_net "Net-(FUSE1-Pad2)")
    (add_net "Net-(H1-Pad1)")
    (add_net "Net-(H2-Pad1)")
    (add_net "Net-(H3-Pad1)")
    (add_net "Net-(H4-Pad1)")
    (add_net "Net-(IND55-Pad2)")
    (add_net "Net-(JP_PMONITOR1-Pad1)")
    (add_net "Net-(JP_RA8875-Pad3)")
    (add_net "Net-(JP_RA8875-Pad4)")
    (add_net "Net-(JP_SWD1-Pad10)")
    (add_net "Net-(JP_SWD1-Pad7)")
    (add_net "Net-(JP_SWD1-Pad8)")
    (add_net "Net-(JP_SWD1-Pad9)")
    (add_net "Net-(J_Micro_SD1-Pad1)")
    (add_net "Net-(J_Micro_SD1-Pad8)")
    (add_net "Net-(J_USB1-Pad4)")
    (add_net "Net-(L_DEF1-Pad1)")
    (add_net "Net-(L_NEO1-Pad2)")
    (add_net "Net-(L_NEO1-Pad4)")
    (add_net "Net-(L_PWR1-Pad1)")
    (add_net "Net-(L_PWR1-Pad2)")
    (add_net "Net-(L_RX1-Pad1)")
    (add_net "Net-(L_SD1-Pad1)")
    (add_net "Net-(L_TX1-Pad1)")
    (add_net "Net-(RADALR1-Pad2)")
    (add_net "Net-(RADDR1-Pad2)")
    (add_net "Net-(RBUZV1-Pad2)")
    (add_net "Net-(RCLK1-Pad1)")
    (add_net "Net-(RID1-Pad2)")
    (add_net "Net-(RID2-Pad1)")
    (add_net "Net-(RLED1-Pad1)")
    (add_net "Net-(RMCP23A0-Pad1)")
    (add_net "Net-(RVBUZ2-Pad1)")
    (add_net "Net-(RVBUZ2-Pad2)")
    (add_net "Net-(SP_MCP_INT4-Pad2)")
    (add_net "Net-(U_DS3231-Pad1)")
    (add_net "Net-(U_DS3231-Pad4)")
    (add_net "Net-(U_MCP23-Pad10)")
    (add_net "Net-(U_MCP23-Pad11)")
    (add_net "Net-(U_MCP23-Pad7)")
    (add_net "Net-(U_SAMD51J19-Pad32)")
    (add_net "Net-(U_SAMD51J19-Pad50)")
    (add_net "Net-(U_SAMD51J19-Pad60)")
    (add_net PA02-A0-DAC0)
    (add_net PA04-D17-A3-MCP_INT4)
    (add_net PA05-A1-DAC1)
    (add_net PA06-D16-A2-RTC_INT6)
    (add_net PA07-BUZ)
    (add_net PA08-QSPI_DATA[0])
    (add_net PA09-QSPI_DATA[1])
    (add_net PA10-QSPI_DATA[2])
    (add_net PA11-QSPI_DATA[3])
    (add_net PA12-MOSI)
    (add_net PA13-SCK)
    (add_net PA14-MISO)
    (add_net PA16-D13-DEFLED)
    (add_net PA17-D12-TFT_CS)
    (add_net PA18-D10-TFT_RESET)
    (add_net PA19-D11-TFT_INT3)
    (add_net PA20-D09)
    (add_net PA21-D08)
    (add_net PA22-D1-TX3)
    (add_net PA23-D0-RX3)
    (add_net PA24-D30-USBD-)
    (add_net PA25-D31-USBD+)
    (add_net PA27-D28-TXLED)
    (add_net PB02-SDA)
    (add_net PB03-SCL)
    (add_net PB06-D27-RXLED)
    (add_net PB07-D29-USBENA)
    (add_net PB08-D18-A4_SD_CS)
    (add_net PB09-D19-A5-TFT_WAIT)
    (add_net PB10-QSPI_SCK)
    (add_net PB11-QSPI_CS)
    (add_net PB12-D07-SD_INT12)
    (add_net PB13-D04-NET_RES)
    (add_net PB14-D05-NET_CS)
    (add_net PB15-D06-NET_INT15)
    (add_net PB16-D3-TX5)
    (add_net PB17-D2-RX5)
    (add_net PB22-D40-NEOPIX)
    (add_net PWR_BAT)
    (add_net PWR_JACK)
    (add_net SCKSD)
    (add_net TFT12-PB00)
    (add_net TFT13-PB01)
    (add_net TFT14-PB05)
    (add_net TFT15-PB04)
    (add_net ~RESET~)
  )
  (module Package_SO:SOIC-16W_7.5x10.3mm_P1.27mm (layer F.Cu) (tedit 5EFBBDDC)
    (at 28.3972 43.6118 270)
    (descr "SOIC, 16 Pin (JEDEC MS-013AA, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/soic_wide-rw/rw_16.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py")
    (tags "SOIC SO")
    (attr smd)
    (fp_text reference U_DS3231 (at 0 -6.1 90) (layer F.SilkS))
    (fp_text value DS3231M (at 0 6.1 90) (layer F.Fab) hide)
    (fp_text user %R (at 0 0 90) (layer F.Fab) hide)
    (pad 16 smd roundrect (at 4.65 -4.445 270) (size 2.05 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 68 PB03-SCL))
    (pad 15 smd roundrect (at 4.65 -3.175 270) (size 2.05 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 69 PB02-SDA))
    (pad 14 smd roundrect (at 4.65 -1.905 270) (size 2.05 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 34 "Net-(Battery-Cell1-Pad1)"))
    (pad 13 smd roundrect (at 4.65 -0.635 270) (size 2.05 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 GND))
    (pad 12 smd roundrect (at 4.65 0.635 270) (size 2.05 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 GND))
    (pad 11 smd roundrect (at 4.65 1.905 270) (size 2.05 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 GND))
    (pad 10 smd roundrect (at 4.65 3.175 270) (size 2.05 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 GND))
    (pad 9 smd roundrect (at 4.65 4.445 270) (size 2.05 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 GND))
    (pad 8 smd roundrect (at -4.65 4.445 270) (size 2.05 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 GND))
    (pad 7 smd roundrect (at -4.65 3.175 270) (size 2.05 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 GND))
    (pad 6 smd roundrect (at -4.65 1.905 270) (size 2.05 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 GND))
    (pad 5 smd roundrect (at -4.65 0.635 270) (size 2.05 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 GND))
    (pad 4 smd roundrect (at -4.65 -0.635 270) (size 2.05 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 25 "Net-(U_DS3231-Pad4)"))
    (pad 3 smd roundrect (at -4.65 -1.905 270) (size 2.05 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 29 "Net-(RCLK1-Pad1)"))
    (pad 2 smd roundrect (at -4.65 -3.175 270) (size 2.05 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 3 +3V3))
    (pad 1 smd roundrect (at -4.65 -4.445 270) (size 2.05 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 26 "Net-(U_DS3231-Pad1)"))
    (model ${KISYS3DMOD}/Package_SO.3dshapes/SOIC-16W_7.5x10.3mm_P1.27mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_PinHeader_1.27mm:PinHeader_2x05_P1.27mm_Vertical (layer F.Cu) (tedit 5EFD6B88)
    (at 43.434 45.24756 90)
    (descr "Through hole straight pin header, 2x05, 1.27mm pitch, double rows")
    (tags "Through hole pin header THT 2x05 1.27mm double row")
    (fp_text reference JP_SWD1 (at -2.68224 2.5654 180) (layer F.SilkS))
    (fp_text value Conn_ARM_JTAG_SWD_10 (at 0.635 6.775 90) (layer F.Fab) hide)
    (fp_text user %R (at -2.2098 2.667) (layer F.Fab))
    (pad 10 thru_hole oval (at 1.27 5.08 90) (size 1 1) (drill 0.65) (layers *.Cu *.Mask)
      (net 21 "Net-(JP_SWD1-Pad10)"))
    (pad 9 thru_hole oval (at 0 5.08 90) (size 1 1) (drill 0.65) (layers *.Cu *.Mask)
      (net 22 "Net-(JP_SWD1-Pad9)"))
    (pad 8 thru_hole oval (at 1.27 3.81 90) (size 1 1) (drill 0.65) (layers *.Cu *.Mask)
      (net 23 "Net-(JP_SWD1-Pad8)"))
    (pad 7 thru_hole oval (at 0 3.81 90) (size 1 1) (drill 0.65) (layers *.Cu *.Mask)
      (net 24 "Net-(JP_SWD1-Pad7)"))
    (pad 6 thru_hole oval (at 1.27 2.54 90) (size 1 1) (drill 0.65) (layers *.Cu *.Mask)
      (net 127 /SWO))
    (pad 5 thru_hole oval (at 0 2.54 90) (size 1 1) (drill 0.65) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 4 thru_hole oval (at 1.27 1.27 90) (size 1 1) (drill 0.65) (layers *.Cu *.Mask)
      (net 128 /PA30-D44-SWDCLK))
    (pad 3 thru_hole oval (at 0 1.27 90) (size 1 1) (drill 0.65) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 2 thru_hole oval (at 1.27 0 90) (size 1 1) (drill 0.65) (layers *.Cu *.Mask)
      (net 129 /PA31-D45-SWDIO))
    (pad 1 thru_hole rect (at 0 0 90) (size 1 1) (drill 0.65) (layers *.Cu *.Mask)
      (net 7 +3.3VA))
    (model ${KISYS3DMOD}/Connector_PinHeader_1.27mm.3dshapes/PinHeader_2x05_P1.27mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module LED_SMD:LED_WS2812B_PLCC4_5.0x5.0mm_P3.2mm (layer F.Cu) (tedit 5EFBB7FE)
    (at 66.72072 71.22668)
    (descr https://cdn-shop.adafruit.com/datasheets/WS2812B.pdf)
    (tags "LED RGB NeoPixel")
    (attr smd)
    (fp_text reference L_NEO1 (at 0.13208 -3.38328 180) (layer F.SilkS))
    (fp_text value WS2812B-5050 (at 0.1016 3.4544) (layer F.Fab) hide)
    (fp_text user %R (at 0 0) (layer F.Fab) hide)
    (fp_text user 1 (at -3.8608 -1.778) (layer F.SilkS))
    (pad 1 smd rect (at -2.45 -1.6) (size 1.5 1) (layers F.Cu F.Paste F.Mask)
      (net 3 +3V3))
    (pad 2 smd rect (at -2.45 1.6) (size 1.5 1) (layers F.Cu F.Paste F.Mask)
      (net 130 "Net-(L_NEO1-Pad2)"))
    (pad 4 smd rect (at 2.45 -1.6) (size 1.5 1) (layers F.Cu F.Paste F.Mask)
      (net 131 "Net-(L_NEO1-Pad4)"))
    (pad 3 smd rect (at 2.45 1.6) (size 1.5 1) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (model ${KISYS3DMOD}/LED_SMD.3dshapes/LED_WS2812B_PLCC4_5.0x5.0mm_P3.2mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_QFP:TQFP-64_10x10mm_P0.5mm (layer F.Cu) (tedit 5EFBBEAA)
    (at 59.69 25.146 135)
    (descr "TQFP, 64 Pin (http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=131095), generated with kicad-footprint-generator ipc_gullwing_generator.py")
    (tags "TQFP QFP")
    (attr smd)
    (fp_text reference U_SAMD51J19 (at -0.1016 -7.1374 135) (layer F.SilkS))
    (fp_text value ATSAMD51J19A-A (at 0 7.35 135) (layer F.Fab) hide)
    (fp_text user %R (at -0.0508 8.382 135) (layer F.Fab) hide)
    (pad 64 smd roundrect (at -3.75 -5.6625 135) (size 0.3 1.475) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 68 PB03-SCL))
    (pad 63 smd roundrect (at -3.25 -5.6625 135) (size 0.3 1.475) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 69 PB02-SDA))
    (pad 62 smd roundrect (at -2.75 -5.6625 135) (size 0.3 1.475) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 105 TFT13-PB01))
    (pad 61 smd roundrect (at -2.25 -5.6625 135) (size 0.3 1.475) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 104 TFT12-PB00))
    (pad 60 smd roundrect (at -1.75 -5.6625 135) (size 0.3 1.475) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 109 "Net-(U_SAMD51J19-Pad60)"))
    (pad 59 smd roundrect (at -1.25 -5.6625 135) (size 0.3 1.475) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 127 /SWO))
    (pad 58 smd roundrect (at -0.75 -5.6625 135) (size 0.3 1.475) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 129 /PA31-D45-SWDIO))
    (pad 57 smd roundrect (at -0.25 -5.6625 135) (size 0.3 1.475) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 128 /PA30-D44-SWDCLK))
    (pad 56 smd roundrect (at 0.25 -5.6625 135) (size 0.3 1.475) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 7 +3.3VA))
    (pad 55 smd roundrect (at 0.75 -5.6625 135) (size 0.3 1.475) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 97 "Net-(IND55-Pad2)"))
    (pad 54 smd roundrect (at 1.25 -5.6625 135) (size 0.3 1.475) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 GND))
    (pad 53 smd roundrect (at 1.75 -5.6625 135) (size 0.3 1.475) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 95 "Net-(CDC53-Pad2)"))
    (pad 52 smd roundrect (at 2.25 -5.6625 135) (size 0.3 1.475) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 6 ~RESET~))
    (pad 51 smd roundrect (at 2.75 -5.6625 135) (size 0.3 1.475) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 101 PA27-D28-TXLED))
    (pad 50 smd roundrect (at 3.25 -5.6625 135) (size 0.3 1.475) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 110 "Net-(U_SAMD51J19-Pad50)"))
    (pad 49 smd roundrect (at 3.75 -5.6625 135) (size 0.3 1.475) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 102 PB22-D40-NEOPIX))
    (pad 48 smd roundrect (at 5.6625 -3.75 135) (size 1.475 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 7 +3.3VA))
    (pad 47 smd roundrect (at 5.6625 -3.25 135) (size 1.475 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 GND))
    (pad 46 smd roundrect (at 5.6625 -2.75 135) (size 1.475 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 98 PA25-D31-USBD+))
    (pad 45 smd roundrect (at 5.6625 -2.25 135) (size 1.475 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 99 PA24-D30-USBD-))
    (pad 44 smd roundrect (at 5.6625 -1.75 135) (size 1.475 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 94 PA23-D0-RX3))
    (pad 43 smd roundrect (at 5.6625 -1.25 135) (size 1.475 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 93 PA22-D1-TX3))
    (pad 42 smd roundrect (at 5.6625 -0.75 135) (size 1.475 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 113 PA21-D08))
    (pad 41 smd roundrect (at 5.6625 -0.25 135) (size 1.475 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 112 PA20-D09))
    (pad 40 smd roundrect (at 5.6625 0.25 135) (size 1.475 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 92 PB17-D2-RX5))
    (pad 39 smd roundrect (at 5.6625 0.75 135) (size 1.475 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 91 PB16-D3-TX5))
    (pad 38 smd roundrect (at 5.6625 1.25 135) (size 1.475 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 77 PA19-D11-TFT_INT3))
    (pad 37 smd roundrect (at 5.6625 1.75 135) (size 1.475 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 76 PA18-D10-TFT_RESET))
    (pad 36 smd roundrect (at 5.6625 2.25 135) (size 1.475 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 75 PA17-D12-TFT_CS))
    (pad 35 smd roundrect (at 5.6625 2.75 135) (size 1.475 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 70 PA16-D13-DEFLED))
    (pad 34 smd roundrect (at 5.6625 3.25 135) (size 1.475 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 7 +3.3VA))
    (pad 33 smd roundrect (at 5.6625 3.75 135) (size 1.475 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 GND))
    (pad 32 smd roundrect (at 3.75 5.6625 135) (size 0.3 1.475) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 111 "Net-(U_SAMD51J19-Pad32)"))
    (pad 31 smd roundrect (at 3.25 5.6625 135) (size 0.3 1.475) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 73 PA14-MISO))
    (pad 30 smd roundrect (at 2.75 5.6625 135) (size 0.3 1.475) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 72 PA13-SCK))
    (pad 29 smd roundrect (at 2.25 5.6625 135) (size 0.3 1.475) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 71 PA12-MOSI))
    (pad 28 smd roundrect (at 1.75 5.6625 135) (size 0.3 1.475) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 90 PB15-D06-NET_INT15))
    (pad 27 smd roundrect (at 1.25 5.6625 135) (size 0.3 1.475) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 89 PB14-D05-NET_CS))
    (pad 26 smd roundrect (at 0.75 5.6625 135) (size 0.3 1.475) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 88 PB13-D04-NET_RES))
    (pad 25 smd roundrect (at 0.25 5.6625 135) (size 0.3 1.475) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 74 PB12-D07-SD_INT12))
    (pad 24 smd roundrect (at -0.25 5.6625 135) (size 0.3 1.475) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 78 PB11-QSPI_CS))
    (pad 23 smd roundrect (at -0.75 5.6625 135) (size 0.3 1.475) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 82 PB10-QSPI_SCK))
    (pad 22 smd roundrect (at -1.25 5.6625 135) (size 0.3 1.475) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 GND))
    (pad 21 smd roundrect (at -1.75 5.6625 135) (size 0.3 1.475) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 7 +3.3VA))
    (pad 20 smd roundrect (at -2.25 5.6625 135) (size 0.3 1.475) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 81 PA11-QSPI_DATA[3]))
    (pad 19 smd roundrect (at -2.75 5.6625 135) (size 0.3 1.475) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 80 PA10-QSPI_DATA[2]))
    (pad 18 smd roundrect (at -3.25 5.6625 135) (size 0.3 1.475) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 83 PA09-QSPI_DATA[1]))
    (pad 17 smd roundrect (at -3.75 5.6625 135) (size 0.3 1.475) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 79 PA08-QSPI_DATA[0]))
    (pad 16 smd roundrect (at -5.6625 3.75 135) (size 1.475 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 114 PA07-BUZ))
    (pad 15 smd roundrect (at -5.6625 3.25 135) (size 1.475 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 87 PA06-D16-A2-RTC_INT6))
    (pad 14 smd roundrect (at -5.6625 2.75 135) (size 1.475 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 86 PA05-A1-DAC1))
    (pad 13 smd roundrect (at -5.6625 2.25 135) (size 1.475 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 84 PA04-D17-A3-MCP_INT4))
    (pad 12 smd roundrect (at -5.6625 1.75 135) (size 1.475 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 116 PB09-D19-A5-TFT_WAIT))
    (pad 11 smd roundrect (at -5.6625 1.25 135) (size 1.475 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 117 PB08-D18-A4_SD_CS))
    (pad 10 smd roundrect (at -5.6625 0.75 135) (size 1.475 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 103 PB07-D29-USBENA))
    (pad 9 smd roundrect (at -5.6625 0.25 135) (size 1.475 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 100 PB06-D27-RXLED))
    (pad 8 smd roundrect (at -5.6625 -0.25 135) (size 1.475 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 96 "Net-(CV7-Pad1)"))
    (pad 7 smd roundrect (at -5.6625 -0.75 135) (size 1.475 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 GND))
    (pad 6 smd roundrect (at -5.6625 -1.25 135) (size 1.475 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 106 TFT14-PB05))
    (pad 5 smd roundrect (at -5.6625 -1.75 135) (size 1.475 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 107 TFT15-PB04))
    (pad 4 smd roundrect (at -5.6625 -2.25 135) (size 1.475 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 118 /PA03-AREF))
    (pad 3 smd roundrect (at -5.6625 -2.75 135) (size 1.475 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 85 PA02-A0-DAC0))
    (pad 2 smd roundrect (at -5.6625 -3.25 135) (size 1.475 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 27 "Net-(CQ1-Pad1)"))
    (pad 1 smd roundrect (at -5.6625 -3.75 135) (size 1.475 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 28 "Net-(CQ2-Pad2)"))
    (model ${KISYS3DMOD}/Package_QFP.3dshapes/TQFP-64_10x10mm_P0.5mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_TO_SOT_SMD:SOT-23-5_HandSoldering (layer F.Cu) (tedit 5EFBBE5C)
    (at 21.51126 61.68136)
    (descr "5-pin SOT23 package")
    (tags "SOT-23-5 hand-soldering")
    (attr smd)
    (fp_text reference U_G125-LSCK1 (at 0.45974 -2.34696) (layer F.SilkS))
    (fp_text value SN74LVC1G125DBVR (at 0.0254 2.3622) (layer F.Fab) hide)
    (fp_text user %R (at 0 0 90) (layer F.Fab) hide)
    (pad 5 smd rect (at 1.35 -0.95) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask)
      (net 3 +3V3))
    (pad 4 smd rect (at 1.35 0.95) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask)
      (net 5 SCKSD))
    (pad 3 smd rect (at -1.35 0.95) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 2 smd rect (at -1.35 0) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask)
      (net 72 PA13-SCK))
    (pad 1 smd rect (at -1.35 -0.95) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask)
      (net 117 PB08-D18-A4_SD_CS))
    (model ${KISYS3DMOD}/Package_TO_SOT_SMD.3dshapes/SOT-23-5.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MountingHole:MountingHole_2.2mm_M2 locked (layer F.Cu) (tedit 5EFA9817)
    (at 16.51 78.867)
    (descr "Mounting Hole 2.2mm, no annular, M2")
    (tags "mounting hole 2.2mm no annular m2")
    (attr virtual)
    (fp_text reference HRA8875-4 (at 1.6002 -2.4384) (layer F.SilkS) hide)
    (fp_text value MountingHole (at 0 3.2) (layer F.Fab) hide)
    (fp_text user %R (at 0.1524 4.2926) (layer F.Fab) hide)
    (pad 1 np_thru_hole circle (at 0 0) (size 2.2 2.2) (drill 2.2) (layers *.Cu *.Mask))
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5EFB79D2)
    (at 7.68096 71.4121 180)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RSDLED1 (at 0.0508 -1.4224) (layer F.SilkS))
    (fp_text value 1K (at 0 1.65) (layer F.Fab) hide)
    (fp_text user %R (at -0.0762 2.3876) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 15 "Net-(L_SD1-Pad1)"))
    (pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 117 PB08-D18-A4_SD_CS))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module z51j:MicroSD (layer F.Cu) (tedit 5EFBBF18)
    (at 0.2032 68.5292 90)
    (attr smd)
    (fp_text reference J_Micro_SD1 (at 3.8354 17.2466 90) (layer F.SilkS))
    (fp_text value Micro_SD_Card_Det (at 6.8707 12.1031 90) (layer F.SilkS) hide)
    (fp_text user SWD (at 6.56082 14.04874 90) (layer F.SilkS))
    (fp_text user SWG (at 12.83462 11.04392) (layer F.SilkS))
    (fp_text user %R (at 7.3729 10.44672 90) (layer F.Fab) hide)
    (pad 10 smd rect (at 6.5532 15.50162 90) (size 1.5 1.524) (layers F.Cu F.Paste F.Mask)
      (net 74 PB12-D07-SD_INT12))
    (pad 9 smd rect (at 13.99032 10.9982 90) (size 1.143 1.4224) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 11 smd rect (at 0.7 1 90) (size 1.4 1.9) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 11 smd rect (at 13.6 1 90) (size 1.4 1.9) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 11 smd rect (at 13.55 15.325 90) (size 1.5 1.15) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 11 smd rect (at 4.00558 15.51432 90) (size 1.8 1.524) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 8 smd rect (at 12.15 3.8 90) (size 0.65 2.2) (layers F.Cu F.Paste F.Mask)
      (net 63 "Net-(J_Micro_SD1-Pad8)"))
    (pad 7 smd rect (at 11.05 3.8 90) (size 0.65 2.2) (layers F.Cu F.Paste F.Mask)
      (net 2 MISOSD))
    (pad 6 smd rect (at 9.95 3.8 90) (size 0.65 2.2) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 5 smd rect (at 8.85 3.8 90) (size 0.65 2.2) (layers F.Cu F.Paste F.Mask)
      (net 5 SCKSD))
    (pad 4 smd rect (at 7.75 3.8 90) (size 0.65 2.2) (layers F.Cu F.Paste F.Mask)
      (net 3 +3V3))
    (pad 3 smd rect (at 6.65 3.8 90) (size 0.65 2.2) (layers F.Cu F.Paste F.Mask)
      (net 4 MOSISD))
    (pad 2 smd rect (at 5.55 3.8 90) (size 0.65 2.2) (layers F.Cu F.Paste F.Mask)
      (net 117 PB08-D18-A4_SD_CS))
    (pad 1 smd rect (at 4.45 3.8 90) (size 0.65 2.2) (layers F.Cu F.Paste F.Mask)
      (net 62 "Net-(J_Micro_SD1-Pad1)"))
  )
  (module LED_SMD:LED_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5EFBBA39)
    (at 2.31648 71.68896 180)
    (descr "LED SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "LED handsolder")
    (attr smd)
    (fp_text reference L_SD1 (at -0.0508 -1.4986) (layer F.SilkS))
    (fp_text value Green (at 0.3302 1.5494) (layer F.Fab) hide)
    (fp_text user %R (at 0.0254 2.2098) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 3 +3V3))
    (pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 15 "Net-(L_SD1-Pad1)"))
    (model ${KISYS3DMOD}/LED_SMD.3dshapes/LED_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MountingHole:MountingHole_2.2mm_M2 locked (layer F.Cu) (tedit 5EFA9817)
    (at 16.51 43.307)
    (descr "Mounting Hole 2.2mm, no annular, M2")
    (tags "mounting hole 2.2mm no annular m2")
    (attr virtual)
    (fp_text reference HRA8875-2 (at 1.6002 -2.4384) (layer F.SilkS) hide)
    (fp_text value MountingHole (at 0 3.2) (layer F.Fab) hide)
    (fp_text user %R (at 0.1524 4.2926) (layer F.Fab) hide)
    (pad 1 np_thru_hole circle (at 0 0) (size 2.2 2.2) (drill 2.2) (layers *.Cu *.Mask))
  )
  (module MountingHole:MountingHole_2.2mm_M2 locked (layer F.Cu) (tedit 5EFA9817)
    (at 59.69 43.307)
    (descr "Mounting Hole 2.2mm, no annular, M2")
    (tags "mounting hole 2.2mm no annular m2")
    (attr virtual)
    (fp_text reference HRA8875-1 (at 1.6002 -2.4384) (layer F.SilkS) hide)
    (fp_text value MountingHole (at 0 3.2) (layer F.Fab) hide)
    (fp_text user %R (at 0.1524 4.2926) (layer F.Fab) hide)
    (pad 1 np_thru_hole circle (at 0 0) (size 2.2 2.2) (drill 2.2) (layers *.Cu *.Mask))
  )
  (module MountingHole:MountingHole_2.2mm_M2 locked (layer F.Cu) (tedit 5EFA9817)
    (at 59.69 78.867)
    (descr "Mounting Hole 2.2mm, no annular, M2")
    (tags "mounting hole 2.2mm no annular m2")
    (attr virtual)
    (fp_text reference HRA8875-3 (at 1.6002 -2.4384) (layer F.SilkS) hide)
    (fp_text value MountingHole (at 0 3.2) (layer F.Fab) hide)
    (fp_text user %R (at 0.1524 4.2926) (layer F.Fab) hide)
    (pad 1 np_thru_hole circle (at 0 0) (size 2.2 2.2) (drill 2.2) (layers *.Cu *.Mask))
  )
  (module z51j:SSOP-20_5.3x7.2mm_P0.65mm_fix (layer F.Cu) (tedit 5EFBBDB1)
    (at 77.9272 45.1358 90)
    (descr "SSOP, 20 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/40001800C.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py")
    (tags "SSOP SO")
    (attr smd)
    (fp_text reference U_MCP23 (at -0.3429 -4.2164 90) (layer F.SilkS))
    (fp_text value MCP23008 (at 0 4.55 90) (layer F.Fab) hide)
    (fp_text user %R (at 0 0 90) (layer F.Fab) hide)
    (pad 20 smd roundrect (at 3.5 -2.925 90) (size 1.9 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 3 +3V3))
    (pad 19 smd roundrect (at 3.5 -2.275 90) (size 1.9 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 47 GP7))
    (pad 18 smd roundrect (at 3.5 -1.625 90) (size 1.9 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 48 GP6))
    (pad 17 smd roundrect (at 3.5 -0.975 90) (size 1.9 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 49 GP5))
    (pad 16 smd roundrect (at 3.5 -0.325 90) (size 1.9 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 50 GP4))
    (pad 15 smd roundrect (at 3.5 0.325 90) (size 1.9 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 53 GP3))
    (pad 14 smd roundrect (at 3.5 0.975 90) (size 1.9 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 52 GP2))
    (pad 13 smd roundrect (at 3.5 1.625 90) (size 1.9 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 51 GP1))
    (pad 12 smd roundrect (at 3.5 2.275 90) (size 1.9 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 46 GP0))
    (pad 11 smd roundrect (at 3.5 2.925 90) (size 1.9 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 141 "Net-(U_MCP23-Pad11)"))
    (pad 10 smd roundrect (at -3.5 2.925 90) (size 1.9 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 142 "Net-(U_MCP23-Pad10)"))
    (pad 9 smd roundrect (at -3.5 2.275 90) (size 1.9 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 GND))
    (pad 8 smd roundrect (at -3.5 1.625 90) (size 1.9 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 108 "Net-(SP_MCP_INT4-Pad2)"))
    (pad 7 smd roundrect (at -3.5 0.975 90) (size 1.9 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 143 "Net-(U_MCP23-Pad7)"))
    (pad 6 smd roundrect (at -3.5 0.325 90) (size 1.9 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 6 ~RESET~))
    (pad 5 smd roundrect (at -3.5 -0.325 90) (size 1.9 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 58 "Net-(RMCP23A0-Pad1)"))
    (pad 4 smd roundrect (at -3.5 -0.975 90) (size 1.9 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 GND))
    (pad 3 smd roundrect (at -3.5 -1.625 90) (size 1.9 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 GND))
    (pad 2 smd roundrect (at -3.5 -2.275 90) (size 1.9 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 69 PB02-SDA))
    (pad 1 smd roundrect (at -3.5 -2.925 90) (size 1.9 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 68 PB03-SCL))
    (model ${KISYS3DMOD}/Package_SO.3dshapes/SSOP-20_5.3x7.2mm_P0.65mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MountingHole:MountingHole_3.2mm_M3_Pad locked (layer F.Cu) (tedit 5EFA97D2)
    (at 89.662 77.47)
    (descr "Mounting Hole 3.2mm, M3")
    (tags "mounting hole 3.2mm m3")
    (attr virtual)
    (fp_text reference H4 (at 0 -4.2) (layer F.SilkS) hide)
    (fp_text value MO4 (at 0 4.2) (layer F.Fab) hide)
    (fp_text user %R (at 0.3 0) (layer F.Fab))
    (pad 1 thru_hole circle (at 0 0) (size 6.4 6.4) (drill 3.2) (layers *.Cu *.Mask)
      (net 12 "Net-(H4-Pad1)"))
  )
  (module Jumper:SolderJumper-2_P1.3mm_Open_Pad1.0x1.5mm (layer B.Cu) (tedit 5EFBBB13)
    (at 30.5308 45.9994)
    (descr "SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference SP_RTC_INT6 (at 0.5588 -1.651) (layer B.SilkS))
    (fp_text value S_RTCINT (at 0 -1.9) (layer B.Fab) hide)
    (pad 1 smd rect (at -0.65 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 29 "Net-(RCLK1-Pad1)"))
    (pad 2 smd rect (at 0.65 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 87 PA06-D16-A2-RTC_INT6))
  )
  (module Package_TO_SOT_SMD:SOT-23-6_Handsoldering (layer F.Cu) (tedit 5EFBB84A)
    (at 22.41296 23.39212 270)
    (descr "6-pin SOT-23 package, Handsoldering")
    (tags "SOT-23-6 Handsoldering")
    (attr smd)
    (fp_text reference U_RT6222 (at -3.17372 0.08636) (layer F.SilkS))
    (fp_text value RT6222C (at 0.0254 2.2098 90) (layer F.Fab) hide)
    (fp_text user %R (at 0.3302 2.9972 270) (layer F.Fab) hide)
    (pad 5 smd rect (at 1.35 0 270) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask)
      (net 64 /VIN))
    (pad 6 smd rect (at 1.35 -0.95 270) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask)
      (net 67 /SW))
    (pad 4 smd rect (at 1.35 0.95 270) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask)
      (net 66 /EN))
    (pad 3 smd rect (at -1.35 0.95 270) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask)
      (net 18 /FB))
    (pad 2 smd rect (at -1.35 0 270) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 1 smd rect (at -1.35 -0.95 270) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask)
      (net 65 /BOOT))
    (model ${KISYS3DMOD}/Package_TO_SOT_SMD.3dshapes/SOT-23-6.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module LED_SMD:LED_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5EFBBA39)
    (at 2.794 40.132 180)
    (descr "LED SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "LED handsolder")
    (attr smd)
    (fp_text reference L_RX1 (at -0.0508 -1.4986) (layer F.SilkS))
    (fp_text value Green (at 0.3302 1.5494) (layer F.Fab) hide)
    (fp_text user %R (at 0.0254 2.2098) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 3 +3V3))
    (pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 30 "Net-(L_RX1-Pad1)"))
    (model ${KISYS3DMOD}/LED_SMD.3dshapes/LED_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_USB:USB_Micro-B_Molex-105017-0001 (layer F.Cu) (tedit 5EFBB8BE)
    (at 2.6162 31.2674 270)
    (descr http://www.molex.com/pdm_docs/sd/1050170001_sd.pdf)
    (tags "Micro-USB SMD Typ-B")
    (attr smd)
    (fp_text reference J_USB1 (at 0 -3.1125 90) (layer F.SilkS))
    (fp_text value USB_B_Micro (at 0.5842 -4.445 90) (layer F.Fab) hide)
    (fp_text user %R (at 0 0.8875 90) (layer F.Fab) hide)
    (fp_text user "PCB Edge" (at 0 2.6875 90) (layer Dwgs.User))
    (pad 6 smd rect (at -2.9 1.2375 270) (size 1.2 1.9) (layers F.Cu F.Mask)
      (net 16 "Net-(CUFG1-Pad1)"))
    (pad 6 smd rect (at 2.9 1.2375 270) (size 1.2 1.9) (layers F.Cu F.Mask)
      (net 16 "Net-(CUFG1-Pad1)"))
    (pad 6 thru_hole oval (at 3.5 1.2375 270) (size 1.2 1.9) (drill oval 0.6 1.3) (layers *.Cu *.Mask)
      (net 16 "Net-(CUFG1-Pad1)"))
    (pad 6 thru_hole oval (at -3.5 1.2375 90) (size 1.2 1.9) (drill oval 0.6 1.3) (layers *.Cu *.Mask)
      (net 16 "Net-(CUFG1-Pad1)"))
    (pad 6 smd rect (at -1 1.2375 270) (size 1.5 1.9) (layers F.Cu F.Paste F.Mask)
      (net 16 "Net-(CUFG1-Pad1)"))
    (pad 6 thru_hole circle (at 2.5 -1.4625 270) (size 1.45 1.45) (drill 0.85) (layers *.Cu *.Mask)
      (net 16 "Net-(CUFG1-Pad1)"))
    (pad 3 smd rect (at 0 -1.4625 270) (size 0.4 1.35) (layers F.Cu F.Paste F.Mask)
      (net 98 PA25-D31-USBD+))
    (pad 4 smd rect (at 0.65 -1.4625 270) (size 0.4 1.35) (layers F.Cu F.Paste F.Mask)
      (net 20 "Net-(J_USB1-Pad4)"))
    (pad 5 smd rect (at 1.3 -1.4625 270) (size 0.4 1.35) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 1 smd rect (at -1.3 -1.4625 270) (size 0.4 1.35) (layers F.Cu F.Paste F.Mask)
      (net 19 "Net-(FUSE1-Pad2)"))
    (pad 2 smd rect (at -0.65 -1.4625 270) (size 0.4 1.35) (layers F.Cu F.Paste F.Mask)
      (net 99 PA24-D30-USBD-))
    (pad 6 thru_hole circle (at -2.5 -1.4625 270) (size 1.45 1.45) (drill 0.85) (layers *.Cu *.Mask)
      (net 16 "Net-(CUFG1-Pad1)"))
    (pad 6 smd rect (at 1 1.2375 270) (size 1.5 1.9) (layers F.Cu F.Paste F.Mask)
      (net 16 "Net-(CUFG1-Pad1)"))
    (model ${KISYS3DMOD}/Connector_USB.3dshapes/USB_Micro-B_Molex-105017-0001.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_SO:TSSOP-10_3x3mm_P0.5mm (layer F.Cu) (tedit 5EFBBF31)
    (at 78.80096 20.89404 270)
    (descr "TSSOP10: plastic thin shrink small outline package; 10 leads; body width 3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot552-1_po.pdf)")
    (tags "SSOP 0.5")
    (attr smd)
    (fp_text reference U_ADS1115 (at 0.0762 2.24536 90) (layer F.SilkS))
    (fp_text value ADS1115IDGS (at 0 2.55 90) (layer F.Fab) hide)
    (fp_text user %R (at 0 3.2258 90) (layer F.Fab) hide)
    (pad 10 smd rect (at 2.15 -1 270) (size 1.1 0.25) (layers F.Cu F.Paste F.Mask)
      (net 68 PB03-SCL))
    (pad 9 smd rect (at 2.15 -0.5 270) (size 1.1 0.25) (layers F.Cu F.Paste F.Mask)
      (net 69 PB02-SDA))
    (pad 8 smd rect (at 2.15 0 270) (size 1.1 0.25) (layers F.Cu F.Paste F.Mask)
      (net 119 /ADSVV))
    (pad 7 smd rect (at 2.15 0.5 270) (size 1.1 0.25) (layers F.Cu F.Paste F.Mask)
      (net 41 AIN3))
    (pad 6 smd rect (at 2.15 1 270) (size 1.1 0.25) (layers F.Cu F.Paste F.Mask)
      (net 40 AIN2))
    (pad 5 smd rect (at -2.15 1 270) (size 1.1 0.25) (layers F.Cu F.Paste F.Mask)
      (net 115 AIN1-PCELL))
    (pad 4 smd rect (at -2.15 0.5 270) (size 1.1 0.25) (layers F.Cu F.Paste F.Mask)
      (net 55 ANI0-TMP36))
    (pad 3 smd rect (at -2.15 0 270) (size 1.1 0.25) (layers F.Cu F.Paste F.Mask)
      (net 120 /ADSGD))
    (pad 2 smd rect (at -2.15 -0.5 270) (size 1.1 0.25) (layers F.Cu F.Paste F.Mask)
      (net 43 "Net-(RADALR1-Pad2)"))
    (pad 1 smd rect (at -2.15 -1 270) (size 1.1 0.25) (layers F.Cu F.Paste F.Mask)
      (net 54 "Net-(RADDR1-Pad2)"))
    (model ${KISYS3DMOD}/Package_SO.3dshapes/TSSOP-10_3x3mm_P0.5mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Buzzer_Beeper:Buzzer_12x9.5RM7.6 (layer F.Cu) (tedit 5EFAA119)
    (at 80.0354 59.436 270)
    (descr "Generic Buzzer, D12mm height 9.5mm with RM7.6mm")
    (tags buzzer)
    (fp_text reference BUZZER1 (at 3.8 -7.2 90) (layer F.SilkS))
    (fp_text value "3V 12mm" (at 3.8 7.4 90) (layer F.Fab) hide)
    (fp_text user %R (at 3.8 -4 90) (layer F.Fab) hide)
    (fp_text user + (at -2.2987 -3.24866 90) (layer F.SilkS))
    (fp_text user + (at 0.0889 -2.05486 90) (layer B.SilkS))
    (pad 2 thru_hole circle (at 7.6 0 270) (size 2 2) (drill 1) (layers *.Cu *.Mask)
      (net 17 "Net-(BUZZER1-Pad2)"))
    (pad 1 thru_hole rect (at 0 0 270) (size 2 2) (drill 1) (layers *.Cu *.Mask)
      (net 3 +3V3))
    (model ${KISYS3DMOD}/Buzzer_Beeper.3dshapes/Buzzer_12x9.5RM7.6.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module LED_SMD:LED_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5EFBBA39)
    (at 70.104 78.994 180)
    (descr "LED SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "LED handsolder")
    (attr smd)
    (fp_text reference L_PWR1 (at -0.0508 -1.4986) (layer F.SilkS))
    (fp_text value Yellow (at 0.3302 1.5494) (layer F.Fab) hide)
    (fp_text user %R (at 0.0254 2.2098) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 37 "Net-(L_PWR1-Pad2)"))
    (pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 14 "Net-(L_PWR1-Pad1)"))
    (model ${KISYS3DMOD}/LED_SMD.3dshapes/LED_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Potentiometer_THT:Potentiometer_Bourns_3386C_Horizontal (layer F.Cu) (tedit 5EFBBE45)
    (at 76.2 78.486 90)
    (descr "Potentiometer, horizontal, Bourns 3386C, https://www.bourns.com/pdfs/3386.pdf")
    (tags "Potentiometer horizontal Bourns 3386C")
    (fp_text reference RVBUZ2 (at 3.4544 1.2446 180) (layer F.SilkS))
    (fp_text value "200 ohm TRIMMER " (at 3.5814 3.8608) (layer F.Fab) hide)
    (fp_text user %R (at -3.5052 5.0546) (layer F.Fab) hide)
    (pad 1 thru_hole circle (at 0 0 90) (size 1.44 1.44) (drill 0.8) (layers *.Cu *.Mask)
      (net 38 "Net-(RVBUZ2-Pad1)"))
    (pad 2 thru_hole circle (at 0 2.54 90) (size 1.44 1.44) (drill 0.8) (layers *.Cu *.Mask)
      (net 39 "Net-(RVBUZ2-Pad2)"))
    (pad 3 thru_hole circle (at 0 5.08 90) (size 1.44 1.44) (drill 0.8) (layers *.Cu *.Mask)
      (net 42 "Net-(RBUZV1-Pad2)"))
    (model ${KISYS3DMOD}/Potentiometer_THT.3dshapes/Potentiometer_Bourns_3386C_Horizontal.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MountingHole:MountingHole_3.2mm_M3_Pad locked (layer F.Cu) (tedit 5EFA97D2)
    (at 5.08 77.47)
    (descr "Mounting Hole 3.2mm, M3")
    (tags "mounting hole 3.2mm m3")
    (attr virtual)
    (fp_text reference H2 (at 0 -4.2) (layer F.SilkS) hide)
    (fp_text value MO2 (at 0 4.2) (layer F.Fab) hide)
    (fp_text user %R (at 0.3 0) (layer F.Fab))
    (pad 1 thru_hole circle (at 0 0) (size 6.4 6.4) (drill 3.2) (layers *.Cu *.Mask)
      (net 10 "Net-(H2-Pad1)"))
  )
  (module MountingHole:MountingHole_3.2mm_M3_Pad locked (layer F.Cu) (tedit 5EFA97D2)
    (at 89.662 5.08)
    (descr "Mounting Hole 3.2mm, M3")
    (tags "mounting hole 3.2mm m3")
    (attr virtual)
    (fp_text reference H3 (at 0 -4.2) (layer F.SilkS) hide)
    (fp_text value MO3 (at 0 4.2) (layer F.Fab) hide)
    (fp_text user %R (at 0.3 0) (layer F.Fab))
    (pad 1 thru_hole circle (at 0 0) (size 6.4 6.4) (drill 3.2) (layers *.Cu *.Mask)
      (net 11 "Net-(H3-Pad1)"))
  )
  (module MountingHole:MountingHole_3.2mm_M3_Pad locked (layer F.Cu) (tedit 5EFA97D2)
    (at 5.08 5.08)
    (descr "Mounting Hole 3.2mm, M3")
    (tags "mounting hole 3.2mm m3")
    (attr virtual)
    (fp_text reference H1 (at 0 -4.2) (layer F.SilkS) hide)
    (fp_text value MO1 (at 0 4.2) (layer F.Fab) hide)
    (fp_text user %R (at 0.3 0) (layer F.Fab))
    (pad 1 thru_hole circle (at 0 0) (size 6.4 6.4) (drill 3.2) (layers *.Cu *.Mask)
      (net 9 "Net-(H1-Pad1)"))
  )
  (module Package_TO_SOT_SMD:SOT-323_SC-70_Handsoldering (layer F.Cu) (tedit 5EFBB9F8)
    (at 54.62778 62.27826)
    (descr "SOT-323, SC-70 Handsoldering")
    (tags "SOT-323 SC-70 Handsoldering")
    (attr smd)
    (fp_text reference U_NMOS-LED1 (at -0.37338 -1.82626) (layer F.SilkS))
    (fp_text value 2N7002PW.115 (at 0 2.05) (layer F.Fab) hide)
    (fp_text user %R (at -0.127 2.667 180) (layer F.Fab))
    (pad 3 smd rect (at 1.33 0 270) (size 0.45 1.5) (layers F.Cu F.Paste F.Mask)
      (net 35 "Net-(RLED1-Pad1)"))
    (pad 2 smd rect (at -1.33 0.65 270) (size 0.45 1.5) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 1 smd rect (at -1.33 -0.65 270) (size 0.45 1.5) (layers F.Cu F.Paste F.Mask)
      (net 70 PA16-D13-DEFLED))
    (model ${KISYS3DMOD}/Package_TO_SOT_SMD.3dshapes/SOT-323_SC-70.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_TO_SOT_SMD:SOT-323_SC-70_Handsoldering (layer F.Cu) (tedit 5EFBB9F8)
    (at 68.81368 57.5183)
    (descr "SOT-323, SC-70 Handsoldering")
    (tags "SOT-323 SC-70 Handsoldering")
    (attr smd)
    (fp_text reference U_NMOS-BUZ1 (at -0.0254 -1.8542) (layer F.SilkS))
    (fp_text value 2N7002PW.115 (at 0 2.05) (layer F.Fab) hide)
    (fp_text user %R (at -0.127 2.667 180) (layer F.Fab))
    (pad 3 smd rect (at 1.33 0 270) (size 0.45 1.5) (layers F.Cu F.Paste F.Mask)
      (net 39 "Net-(RVBUZ2-Pad2)"))
    (pad 2 smd rect (at -1.33 0.65 270) (size 0.45 1.5) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 1 smd rect (at -1.33 -0.65 270) (size 0.45 1.5) (layers F.Cu F.Paste F.Mask)
      (net 114 PA07-BUZ))
    (model ${KISYS3DMOD}/Package_TO_SOT_SMD.3dshapes/SOT-323_SC-70.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_TO_SOT_SMD:SOT-23-5_HandSoldering (layer F.Cu) (tedit 5EFBBE5C)
    (at 25.4 67.53098 180)
    (descr "5-pin SOT23 package")
    (tags "SOT-23-5 hand-soldering")
    (attr smd)
    (fp_text reference U_G125-LMOSI1 (at -2.3114 -2.30632) (layer F.SilkS))
    (fp_text value SN74LVC1G125DBVR (at 0.0254 2.3622) (layer F.Fab) hide)
    (fp_text user %R (at 0 0 90) (layer F.Fab) hide)
    (pad 5 smd rect (at 1.35 -0.95 180) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask)
      (net 3 +3V3))
    (pad 4 smd rect (at 1.35 0.95 180) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask)
      (net 4 MOSISD))
    (pad 3 smd rect (at -1.35 0.95 180) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 2 smd rect (at -1.35 0 180) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask)
      (net 71 PA12-MOSI))
    (pad 1 smd rect (at -1.35 -0.95 180) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask)
      (net 117 PB08-D18-A4_SD_CS))
    (model ${KISYS3DMOD}/Package_TO_SOT_SMD.3dshapes/SOT-23-5.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_TO_SOT_SMD:SOT-23-5_HandSoldering (layer F.Cu) (tedit 5EFBBE5C)
    (at 50.84572 71.14032 90)
    (descr "5-pin SOT23 package")
    (tags "SOT-23-5 hand-soldering")
    (attr smd)
    (fp_text reference U_G125-TFT1 (at 2.81432 0.23368 180) (layer F.SilkS))
    (fp_text value SN74LVC1G125DBVR (at 0.0254 2.3622 90) (layer F.Fab) hide)
    (fp_text user %R (at 0 0) (layer F.Fab) hide)
    (pad 5 smd rect (at 1.35 -0.95 90) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask)
      (net 3 +3V3))
    (pad 4 smd rect (at 1.35 0.95 90) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask)
      (net 73 PA14-MISO))
    (pad 3 smd rect (at -1.35 0.95 90) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 2 smd rect (at -1.35 0 90) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask)
      (net 126 /TFT-MISO))
    (pad 1 smd rect (at -1.35 -0.95 90) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask)
      (net 75 PA17-D12-TFT_CS))
    (model ${KISYS3DMOD}/Package_TO_SOT_SMD.3dshapes/SOT-23-5.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5EFB79E5)
    (at 65.2272 33.5534 135)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CA1 (at -0.0508 -1.397 135) (layer F.SilkS))
    (fp_text value 0.1uf (at 0 1.65 135) (layer F.Fab) hide)
    (fp_text user %R (at 0.0508 2.3876 135) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 135) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 118 /PA03-AREF))
    (pad 1 smd roundrect (at -1.025 0 135) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5EFB79E5)
    (at 67.9704 36.2966 135)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CA2 (at -0.0508 -1.397 135) (layer F.SilkS))
    (fp_text value 4.7uf (at 0 1.65 135) (layer F.Fab) hide)
    (fp_text user %R (at 0.0508 2.3876 135) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 135) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 118 /PA03-AREF))
    (pad 1 smd roundrect (at -1.025 0 135) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5EFB79E5)
    (at 35.94862 36.1823)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CCLK1 (at -0.0508 -1.397) (layer F.SilkS))
    (fp_text value 1uf (at 0 1.65) (layer F.Fab) hide)
    (fp_text user %R (at 0.0508 2.3876) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 3 +3V3))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5EFB79E5)
    (at 46.8884 27.94 45)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CDC53 (at -3.52026 0.035921 45) (layer F.SilkS))
    (fp_text value 4.7uf (at 0 1.65 45) (layer F.Fab) hide)
    (fp_text user %R (at 0.0508 2.3876 45) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 45) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 95 "Net-(CDC53-Pad2)"))
    (pad 1 smd roundrect (at -1.025 0 45) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5EFB79E5)
    (at 66.4718 20.3962 135)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CF21 (at -0.125724 1.347038 135) (layer F.SilkS))
    (fp_text value 0.1uf (at 0 1.65 135) (layer F.Fab) hide)
    (fp_text user %R (at 0.0508 2.3876 135) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 135) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.025 0 135) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 7 +3.3VA))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5EFB79E5)
    (at 51.562 33.2486 225)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CF56 (at 2.981445 0.251447 45) (layer F.SilkS))
    (fp_text value 0.1uf (at 0 1.65 45) (layer F.Fab) hide)
    (fp_text user %R (at 0.0508 2.3876 45) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 225) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.025 0 225) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 7 +3.3VA))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5EFB79E5)
    (at 57.8104 15.8242 135)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CF34 (at 0.017961 1.490723 135) (layer F.SilkS))
    (fp_text value 0.1uf (at 0 1.65 135) (layer F.Fab) hide)
    (fp_text user %R (at 0.0508 2.3876 135) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 135) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.025 0 135) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 7 +3.3VA))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5EFB79E5)
    (at 18.92046 17.13992 90)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CTFF1 (at -0.10668 -1.34366 90) (layer F.SilkS))
    (fp_text value "12pf 50V" (at 0 1.65 90) (layer F.Fab) hide)
    (fp_text user %R (at 0.0508 2.3876 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 8 /3REG))
    (pad 1 smd roundrect (at -1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 18 /FB))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5EFBB95E)
    (at 10.46988 24.5618)
    (descr "Capacitor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CUFG1 (at 0 -1.5748) (layer F.SilkS))
    (fp_text value "4.7pf 1K" (at 0 1.82) (layer F.Fab) hide)
    (fp_text user %R (at 0.0508 2.6924) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.4875 0) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.4875 0) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 16 "Net-(CUFG1-Pad1)"))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1210_3225Metric_Pad1.42x2.65mm_HandSolder (layer F.Cu) (tedit 5EFBB8EA)
    (at 18.7452 29.96946 90)
    (descr "Capacitor SMD 1210 (3225 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CTI1 (at -3.05054 -0.0254 180) (layer F.SilkS))
    (fp_text value "0.1uf 50V" (at 0 2.28 90) (layer F.Fab) hide)
    (fp_text user %R (at -0.0254 3.2766 90) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.4875 0 90) (size 1.425 2.65) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 64 /VIN))
    (pad 1 smd roundrect (at -1.4875 0 90) (size 1.425 2.65) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 1 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1210_3225Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1210_3225Metric_Pad1.42x2.65mm_HandSolder (layer F.Cu) (tedit 5EFBB8EA)
    (at 22.4409 28.82646 270)
    (descr "Capacitor SMD 1210 (3225 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CTI2 (at 3.25374 -0.2413 180) (layer F.SilkS))
    (fp_text value "10uf 50V" (at 0 2.28 90) (layer F.Fab) hide)
    (fp_text user %R (at -0.0254 3.2766 90) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.4875 0 270) (size 1.425 2.65) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.4875 0 270) (size 1.425 2.65) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 64 /VIN))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1210_3225Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5EFB79E5)
    (at 55.7403 72.28078 270)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CU125 (at -0.0508 -1.397 90) (layer F.SilkS))
    (fp_text value 0.1uf (at 0 1.65 90) (layer F.Fab) hide)
    (fp_text user %R (at 0.0508 2.3876 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 3 +3V3))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1210_3225Metric_Pad1.42x2.65mm_HandSolder (layer F.Cu) (tedit 5EFBB8EA)
    (at 29.3259 17.4244)
    (descr "Capacitor SMD 1210 (3225 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CTO1 (at -3.5449 -1.143) (layer F.SilkS))
    (fp_text value 22uf (at 0 2.28) (layer F.Fab) hide)
    (fp_text user %R (at -0.0254 3.2766) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.4875 0) (size 1.425 2.65) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.4875 0) (size 1.425 2.65) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 8 /3REG))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1210_3225Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1210_3225Metric_Pad1.42x2.65mm_HandSolder (layer F.Cu) (tedit 5EFBB8EA)
    (at 29.3624 14.0208)
    (descr "Capacitor SMD 1210 (3225 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CTO2 (at -3.81 -0.2032) (layer F.SilkS))
    (fp_text value 22uf (at 0 2.28) (layer F.Fab) hide)
    (fp_text user %R (at -0.0254 3.2766) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.4875 0) (size 1.425 2.65) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.4875 0) (size 1.425 2.65) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 8 /3REG))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1210_3225Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5EFB79E5)
    (at 62.68212 37.15004 180)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CQ1 (at -0.0508 -1.397) (layer F.SilkS))
    (fp_text value 20pf (at 0 1.65) (layer F.Fab) hide)
    (fp_text user %R (at 0.0508 2.3876) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 27 "Net-(CQ1-Pad1)"))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5EFB79E5)
    (at 58.70194 37.18052 180)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CQ2 (at -0.0508 -1.397) (layer F.SilkS))
    (fp_text value 20pf (at 0 1.65) (layer F.Fab) hide)
    (fp_text user %R (at 0.0508 2.3876) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 28 "Net-(CQ2-Pad2)"))
    (pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5EFB79E5)
    (at 10.07618 48.8823)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CRST1 (at -0.01778 -1.3589 180) (layer F.SilkS))
    (fp_text value 0.1uf (at 0 1.65) (layer F.Fab) hide)
    (fp_text user %R (at 0.0508 2.3876) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 6 ~RESET~))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5EFB79E5)
    (at 25.02154 55.79872 270)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CSDI1 (at -0.0508 -1.397 90) (layer F.SilkS))
    (fp_text value 0.1uf (at 0 1.65 90) (layer F.Fab) hide)
    (fp_text user %R (at 0.0508 2.3876 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 3 +3V3))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5EFB79E5)
    (at 20.701 66.802 270)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CSDO1 (at -0.0508 -1.397 90) (layer F.SilkS))
    (fp_text value 0.1uf (at 0 1.65 90) (layer F.Fab) hide)
    (fp_text user %R (at 0.0508 2.3876 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 3 +3V3))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5EFB79E5)
    (at 25.5397 62.26048 270)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CSDS1 (at -0.0508 -1.397 90) (layer F.SilkS))
    (fp_text value 0.1uf (at 0 1.65 90) (layer F.Fab) hide)
    (fp_text user %R (at 0.0508 2.3876 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 3 +3V3))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5EFB79E5)
    (at 24.5364 18.7706)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CTSW1 (at -0.2032 -1.397) (layer F.SilkS))
    (fp_text value "0.1uf 50V" (at 0 1.65) (layer F.Fab) hide)
    (fp_text user %R (at 0.0508 2.3876) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 67 /SW))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 65 /BOOT))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5EFB79E5)
    (at 67.31 31.6738 315)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CV8 (at -0.0508 -1.397 135) (layer F.SilkS))
    (fp_text value 0.1uf (at 0 1.65 135) (layer F.Fab) hide)
    (fp_text user %R (at 0.0508 2.3876 135) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 315) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.025 0 315) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 96 "Net-(CV7-Pad1)"))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5EFB79E5)
    (at 70.0024 34.3916 315)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CV7 (at -0.431052 -1.364999 135) (layer F.SilkS))
    (fp_text value 10uf (at 0 1.65 135) (layer F.Fab) hide)
    (fp_text user %R (at 0.0508 2.3876 135) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 315) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.025 0 315) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 96 "Net-(CV7-Pad1)"))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Diode_SMD:D_SOD-123F (layer F.Cu) (tedit 5EFBB8D0)
    (at 15.1511 23.5331 90)
    (descr D_SOD-123F)
    (tags D_SOD-123F)
    (attr smd)
    (fp_text reference D_JAC1 (at 2.7686 -0.0254) (layer F.SilkS))
    (fp_text value MBR230LSFT1G (at -0.635 1.6256 90) (layer F.Fab) hide)
    (fp_text user %R (at 0.1016 2.3876 90) (layer F.Fab) hide)
    (pad 2 smd rect (at 1.4 0 90) (size 1.1 1.1) (layers F.Cu F.Paste F.Mask)
      (net 44 PWR_JACK))
    (pad 1 smd rect (at -1.4 0 90) (size 1.1 1.1) (layers F.Cu F.Paste F.Mask)
      (net 64 /VIN))
    (model ${KISYS3DMOD}/Diode_SMD.3dshapes/D_SOD-123F.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Diode_SMD:D_SOD-123F (layer F.Cu) (tedit 5EFBB8D0)
    (at 15.20698 30.07614 90)
    (descr D_SOD-123F)
    (tags D_SOD-123F)
    (attr smd)
    (fp_text reference D_USB1 (at 2.7686 -0.0254) (layer F.SilkS))
    (fp_text value MBR230LSFT1G (at -0.635 1.6256 90) (layer F.Fab) hide)
    (fp_text user %R (at 0.1016 2.3876 90) (layer F.Fab) hide)
    (pad 2 smd rect (at 1.4 0 90) (size 1.1 1.1) (layers F.Cu F.Paste F.Mask)
      (net 121 +5C))
    (pad 1 smd rect (at -1.4 0 90) (size 1.1 1.1) (layers F.Cu F.Paste F.Mask)
      (net 64 /VIN))
    (model ${KISYS3DMOD}/Diode_SMD.3dshapes/D_SOD-123F.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5EFB79D2)
    (at 72.136 27.0764 180)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference F_VDD1 (at -0.127 1.4732) (layer F.SilkS))
    (fp_text value "120 ohm Ferrite" (at 0 1.65) (layer F.Fab) hide)
    (fp_text user %R (at -0.0762 2.3876) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 96 "Net-(CV7-Pad1)"))
    (pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 7 +3.3VA))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module LED_SMD:LED_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5EFBBA39)
    (at 63.5 78.994 180)
    (descr "LED SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "LED handsolder")
    (attr smd)
    (fp_text reference L_DEF1 (at -0.0508 -1.4986) (layer F.SilkS))
    (fp_text value Blue (at 0.3302 1.5494) (layer F.Fab) hide)
    (fp_text user %R (at 0.0254 2.2098) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 3 +3V3))
    (pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 13 "Net-(L_DEF1-Pad1)"))
    (model ${KISYS3DMOD}/LED_SMD.3dshapes/LED_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module LED_SMD:LED_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5EFBBA39)
    (at 2.794 37.846 180)
    (descr "LED SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "LED handsolder")
    (attr smd)
    (fp_text reference L_TX1 (at -0.5334 1.7018) (layer F.SilkS))
    (fp_text value Red (at 0.3302 1.5494) (layer F.Fab) hide)
    (fp_text user %R (at 0.0254 2.2098) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 3 +3V3))
    (pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 31 "Net-(L_TX1-Pad1)"))
    (model ${KISYS3DMOD}/LED_SMD.3dshapes/LED_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_TO_SOT_SMD:SOT-143 (layer F.Cu) (tedit 5EFBB873)
    (at 9.96442 33.21558 180)
    (descr SOT-143)
    (tags SOT-143)
    (attr smd)
    (fp_text reference U_PRTR5 (at 0.46482 -2.19202) (layer F.SilkS))
    (fp_text value PRTR5V0U2X (at -0.28 2.48) (layer F.Fab) hide)
    (fp_text user %R (at 0 3.2004 180) (layer F.Fab) hide)
    (pad 4 smd rect (at 1.1 -0.95 90) (size 1 1.4) (layers F.Cu F.Paste F.Mask)
      (net 121 +5C))
    (pad 3 smd rect (at 1.1 0.95 90) (size 1 1.4) (layers F.Cu F.Paste F.Mask)
      (net 99 PA24-D30-USBD-))
    (pad 2 smd rect (at -1.1 0.95 90) (size 1 1.4) (layers F.Cu F.Paste F.Mask)
      (net 98 PA25-D31-USBD+))
    (pad 1 smd rect (at -1.1 -0.77 90) (size 1.2 1.4) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (model ${KISYS3DMOD}/Package_TO_SOT_SMD.3dshapes/SOT-143.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5EFB79D2)
    (at 21.08962 17.09674 90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RTBU1 (at 2.25044 0.25908 180) (layer F.SilkS))
    (fp_text value "115K 1%" (at 0 1.65 90) (layer F.Fab) hide)
    (fp_text user %R (at -0.0762 2.3876 90) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 8 /3REG))
    (pad 1 smd roundrect (at -1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 18 /FB))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5EFB79D2)
    (at 19.05508 21.34108 90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RTBU2 (at 0.33528 -1.42748 90) (layer F.SilkS))
    (fp_text value "25.5K 1%" (at 0 1.65 90) (layer F.Fab) hide)
    (fp_text user %R (at -0.0762 2.3876 90) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 18 /FB))
    (pad 1 smd roundrect (at -1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5EFB79D2)
    (at 65.05194 57.91454 90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RBUZG1 (at 0.0508 -1.4224 90) (layer F.SilkS))
    (fp_text value 10k (at 0 1.65 90) (layer F.Fab) hide)
    (fp_text user %R (at -0.0762 2.3876 90) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 114 PA07-BUZ))
    (pad 1 smd roundrect (at -1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5EFB79D2)
    (at 30.99562 36.4744)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RCLK1 (at 0.0508 -1.4224) (layer F.SilkS))
    (fp_text value 10K (at 0 1.65) (layer F.Fab) hide)
    (fp_text user %R (at -0.0762 2.3876) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 3 +3V3))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 29 "Net-(RCLK1-Pad1)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5EFB79D2)
    (at 18.9992 25.30348 90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RTREN1 (at 0.09398 -1.4224 90) (layer F.SilkS))
    (fp_text value "100K 1%" (at 0 1.65 90) (layer F.Fab) hide)
    (fp_text user %R (at -0.0762 2.3876 90) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 66 /EN))
    (pad 1 smd roundrect (at -1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 64 /VIN))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5EFB79D2)
    (at 5.94106 23.90902)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RUFG1 (at 0.0508 1.61798) (layer F.SilkS))
    (fp_text value 1Meg (at 0 1.65) (layer F.Fab) hide)
    (fp_text user %R (at -0.0762 2.3876) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 16 "Net-(CUFG1-Pad1)"))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5EFB79D2)
    (at 14.33576 37.00272 270)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RID1 (at 0.10668 1.53416 90) (layer F.SilkS))
    (fp_text value 100K (at 0 1.65 90) (layer F.Fab) hide)
    (fp_text user %R (at -0.0762 2.3876 90) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 32 "Net-(RID1-Pad2)"))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 3 +3V3))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5EFB79D2)
    (at 16.4338 36.9824 270)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RID2 (at 0.0508 -1.4224 90) (layer F.SilkS))
    (fp_text value 330 (at 0 1.65 90) (layer F.Fab) hide)
    (fp_text user %R (at -0.0762 2.3876 90) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 32 "Net-(RID1-Pad2)"))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 33 "Net-(RID2-Pad1)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5EFB79D2)
    (at 47.13986 71.06158 90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RLCS1 (at 0.80518 -1.26746 90) (layer F.SilkS))
    (fp_text value 10K (at 0 1.65 90) (layer F.Fab) hide)
    (fp_text user %R (at -0.0762 2.3876 90) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 3 +3V3))
    (pad 1 smd roundrect (at -1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 75 PA17-D12-TFT_CS))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5EFB79D2)
    (at 54.79542 65.39738)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RLED1 (at -0.03302 1.34112) (layer F.SilkS))
    (fp_text value 330 (at 0 1.65) (layer F.Fab) hide)
    (fp_text user %R (at -0.0762 2.3876) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 13 "Net-(L_DEF1-Pad1)"))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 35 "Net-(RLED1-Pad1)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5EFB79D2)
    (at 72.18172 71.13778 270)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RPWR1 (at 0.0508 -1.4224 90) (layer F.SilkS))
    (fp_text value 330 (at 0 1.65 90) (layer F.Fab) hide)
    (fp_text user %R (at -0.0762 2.3876 90) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 14 "Net-(L_PWR1-Pad1)"))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5EFB79D2)
    (at 15.51432 47.84344 180)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RRST1 (at -0.08128 1.33604) (layer F.SilkS))
    (fp_text value 10K (at 0 1.65) (layer F.Fab) hide)
    (fp_text user %R (at -0.0762 2.3876) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 6 ~RESET~))
    (pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 3 +3V3))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5EFB79D2)
    (at 13.1572 41.0464 180)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RRX1 (at -0.0762 1.4478) (layer F.SilkS))
    (fp_text value 820 (at 0 1.65) (layer F.Fab) hide)
    (fp_text user %R (at -0.0762 2.3876) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 30 "Net-(L_RX1-Pad1)"))
    (pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 100 PB06-D27-RXLED))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5EFB79D2)
    (at 70.5104 17.399)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RSDA1 (at 0.0508 -1.4224) (layer F.SilkS))
    (fp_text value 10K (at 0 1.65) (layer F.Fab) hide)
    (fp_text user %R (at -0.0762 2.3876) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 3 +3V3))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 69 PB02-SDA))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5EFB79D2)
    (at 66.421 15.0368 180)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RSCL1 (at 0.0254 1.524) (layer F.SilkS))
    (fp_text value 10K (at 0 1.65) (layer F.Fab) hide)
    (fp_text user %R (at -0.0762 2.3876) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 68 PB03-SCL))
    (pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 3 +3V3))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5EFB79D2)
    (at 16.41348 71.92264 180)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RSDET1 (at 0.0508 -1.4224) (layer F.SilkS))
    (fp_text value 10K (at 0 1.65) (layer F.Fab) hide)
    (fp_text user %R (at -0.0762 2.3876) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 3 +3V3))
    (pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 74 PB12-D07-SD_INT12))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5EFB79D2)
    (at 21.74102 51.8033)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RSDCS1 (at 0.0508 -1.4224) (layer F.SilkS))
    (fp_text value 10K (at 0 1.65) (layer F.Fab) hide)
    (fp_text user %R (at -0.0762 2.3876) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 3 +3V3))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 117 PB08-D18-A4_SD_CS))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5EFB79D2)
    (at 9.45642 51.4604 180)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RSDD1 (at 0.0508 -1.4224) (layer F.SilkS))
    (fp_text value 10K (at 0 1.65) (layer F.Fab) hide)
    (fp_text user %R (at -0.0762 2.3876) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 63 "Net-(J_Micro_SD1-Pad8)"))
    (pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 3 +3V3))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5EFB79D2)
    (at 11.8872 71.4121 180)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RSDD2 (at 0.0508 -1.4224) (layer F.SilkS))
    (fp_text value 10K (at 0 1.65) (layer F.Fab) hide)
    (fp_text user %R (at -0.0762 2.3876) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 3 +3V3))
    (pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 62 "Net-(J_Micro_SD1-Pad1)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5EFB79D2)
    (at 39.3192 39.4462)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RSWCLK1 (at 0.0508 -1.4224) (layer F.SilkS))
    (fp_text value 1K (at 0 1.65) (layer F.Fab) hide)
    (fp_text user %R (at -0.0762 2.3876) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 128 /PA30-D44-SWDCLK))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 7 +3.3VA))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5EFB79D2)
    (at 47.3202 40.6654 180)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RSWDRST1 (at -0.6858 1.3462) (layer F.SilkS))
    (fp_text value "39 1%" (at 0 1.65) (layer F.Fab) hide)
    (fp_text user %R (at -0.0762 2.3876) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 6 ~RESET~))
    (pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 21 "Net-(JP_SWD1-Pad10)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5EFB79D2)
    (at 50.75682 63.68542 90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RTR1 (at 0.0508 -1.4224 90) (layer F.SilkS))
    (fp_text value 820 (at 0 1.65 90) (layer F.Fab) hide)
    (fp_text user %R (at -0.0762 2.3876 90) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 70 PA16-D13-DEFLED))
    (pad 1 smd roundrect (at -1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5EFB79D2)
    (at 18.669 40.45458 180)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RTX1 (at -0.0762 1.28778) (layer F.SilkS))
    (fp_text value 820 (at 0 1.65) (layer F.Fab) hide)
    (fp_text user %R (at -0.0762 2.3876) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 31 "Net-(L_TX1-Pad1)"))
    (pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 101 PA27-D28-TXLED))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Crystal:Crystal_SMD_MicroCrystal_CC7V-T1A-2Pin_3.2x1.5mm (layer F.Cu) (tedit 5EFBB935)
    (at 60.58408 34.35858)
    (descr "SMD Crystal MicroCrystal CC7V-T1A/CM7V-T1A series https://www.microcrystal.com/fileadmin/Media/Products/32kHz/Datasheet/CC7V-T1A.pdf, 3.2x1.5mm^2 package")
    (tags "SMD SMT crystal")
    (attr smd)
    (fp_text reference Q32 (at -3.0734 0.3302) (layer F.SilkS))
    (fp_text value "32.768KHz 12.5pf" (at 0 1.95) (layer F.Fab) hide)
    (fp_text user %R (at 0.1016 2.8194) (layer F.Fab) hide)
    (pad 2 smd rect (at 1.25 0) (size 1 1.8) (layers F.Cu F.Paste F.Mask)
      (net 27 "Net-(CQ1-Pad1)"))
    (pad 1 smd rect (at -1.25 0) (size 1 1.8) (layers F.Cu F.Paste F.Mask)
      (net 28 "Net-(CQ2-Pad2)"))
    (model ${KISYS3DMOD}/Crystal.3dshapes/Crystal_SMD_MicroCrystal_CC7V-T1A-2Pin_3.2x1.5mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Jumper:SolderJumper-2_P1.3mm_Open_Pad1.0x1.5mm (layer B.Cu) (tedit 5EFBBB13)
    (at 46.2534 47.5996)
    (descr "SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference SP_GSWD1 (at -0.0254 1.8288) (layer B.SilkS))
    (fp_text value S_SWD (at 0 -1.9) (layer B.Fab) hide)
    (pad 1 smd rect (at -0.65 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 1 GND))
    (pad 2 smd rect (at 0.65 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 22 "Net-(JP_SWD1-Pad9)"))
  )
  (module Jumper:SolderJumper-2_P1.3mm_Open_Pad1.0x1.5mm (layer B.Cu) (tedit 5EFBBB13)
    (at 20.77212 36.87572 180)
    (descr "SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference SP_USBENA1 (at 0 1.8) (layer B.SilkS))
    (fp_text value S_USBENA* (at 0 -1.9) (layer B.Fab) hide)
    (pad 1 smd rect (at -0.65 0 180) (size 1 1.5) (layers B.Cu B.Mask)
      (net 103 PB07-D29-USBENA))
    (pad 2 smd rect (at 0.65 0 180) (size 1 1.5) (layers B.Cu B.Mask)
      (net 33 "Net-(RID2-Pad1)"))
  )
  (module Jumper:SolderJumper-2_P1.3mm_Open_Pad1.0x1.5mm (layer B.Cu) (tedit 5EFBBB13)
    (at 8.68426 37.2745 180)
    (descr "SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference SP_UID1 (at 0 1.8) (layer B.SilkS))
    (fp_text value S_UID (at 0 -1.9) (layer B.Fab) hide)
    (pad 1 smd rect (at -0.65 0 180) (size 1 1.5) (layers B.Cu B.Mask)
      (net 32 "Net-(RID1-Pad2)"))
    (pad 2 smd rect (at 0.65 0 180) (size 1 1.5) (layers B.Cu B.Mask)
      (net 20 "Net-(J_USB1-Pad4)"))
  )
  (module Capacitor_Tantalum_SMD:CP_EIA-3216-18_Kemet-A_Pad1.58x1.35mm_HandSolder (layer F.Cu) (tedit 5EFA9D23)
    (at 15.43304 52.00396)
    (descr "Tantalum Capacitor SMD Kemet-A (3216-18 Metric), IPC_7351 nominal, (Body size from: http://www.kemet.com/Lists/ProductCatalog/Attachments/253/KEM_TC101_STD.pdf), generated with kicad-footprint-generator")
    (tags "capacitor tantalum")
    (attr smd)
    (fp_text reference CSD1 (at 0.31496 -1.73736) (layer F.SilkS))
    (fp_text value "10uf TANT" (at -0.0254 1.4732) (layer F.Fab) hide)
    (fp_text user %R (at -0.0254 2.4384) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.4375 0) (size 1.575 1.35) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.185185)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.4375 0) (size 1.575 1.35) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.185185)
      (net 3 +3V3))
    (model ${KISYS3DMOD}/Capacitor_Tantalum_SMD.3dshapes/CP_EIA-3216-18_Kemet-A.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_Tantalum_SMD:CP_EIA-3216-18_Kemet-A_Pad1.58x1.35mm_HandSolder (layer F.Cu) (tedit 5EFA9D23)
    (at 22.45868 72.04202)
    (descr "Tantalum Capacitor SMD Kemet-A (3216-18 Metric), IPC_7351 nominal, (Body size from: http://www.kemet.com/Lists/ProductCatalog/Attachments/253/KEM_TC101_STD.pdf), generated with kicad-footprint-generator")
    (tags "capacitor tantalum")
    (attr smd)
    (fp_text reference CSDET1 (at -0.48768 1.64338) (layer F.SilkS))
    (fp_text value "10uf TANT" (at -0.0254 1.4732) (layer F.Fab) hide)
    (fp_text user %R (at -0.0254 2.4384) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.4375 0) (size 1.575 1.35) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.185185)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.4375 0) (size 1.575 1.35) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.185185)
      (net 74 PB12-D07-SD_INT12))
    (model ${KISYS3DMOD}/Capacitor_Tantalum_SMD.3dshapes/CP_EIA-3216-18_Kemet-A.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5EFB79D2)
    (at 44.7421 67.45732)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RLRES1 (at 0.0508 -1.4224) (layer F.SilkS))
    (fp_text value 10K (at 0 1.65) (layer F.Fab) hide)
    (fp_text user %R (at -0.0762 2.3876) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 3 +3V3))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 76 PA18-D10-TFT_RESET))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Jumper:SolderJumper-2_P1.3mm_Open_Pad1.0x1.5mm (layer B.Cu) (tedit 5EFBBB13)
    (at 53.8988 67.0814 180)
    (descr "SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference SP_NEO1 (at 0 1.8) (layer B.SilkS))
    (fp_text value S_NEO (at 0 -1.9) (layer B.Fab) hide)
    (pad 1 smd rect (at -0.65 0 180) (size 1 1.5) (layers B.Cu B.Mask)
      (net 131 "Net-(L_NEO1-Pad4)"))
    (pad 2 smd rect (at 0.65 0 180) (size 1 1.5) (layers B.Cu B.Mask)
      (net 102 PB22-D40-NEOPIX))
  )
  (module Jumper:SolderJumper-2_P1.3mm_Open_Pad1.0x1.5mm (layer B.Cu) (tedit 5EFBBB13)
    (at 60.6956 38.3794 180)
    (descr "SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference SP_AREF1 (at -0.0762 1.6256) (layer B.SilkS))
    (fp_text value S_AREF (at 0 -1.9) (layer B.Fab) hide)
    (pad 1 smd rect (at -0.65 0 180) (size 1 1.5) (layers B.Cu B.Mask)
      (net 118 /PA03-AREF))
    (pad 2 smd rect (at 0.65 0 180) (size 1 1.5) (layers B.Cu B.Mask)
      (net 3 +3V3))
  )
  (module Connector_PinHeader_2.54mm:PinHeader_1x02_P2.54mm_Vertical (layer F.Cu) (tedit 5EFBBA93)
    (at 8.86714 45.17898 180)
    (descr "Through hole straight pin header, 1x02, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x02 2.54mm single row")
    (fp_text reference JP_RST1 (at -2.08026 1.54178 90) (layer F.SilkS))
    (fp_text value Conn_01x02 (at 2.4638 1.2954 90) (layer F.Fab) hide)
    (fp_text user %R (at -2.2606 1.2954 90) (layer F.Fab) hide)
    (pad 2 thru_hole oval (at 0 2.54 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 1 thru_hole rect (at 0 0 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 6 ~RESET~))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x02_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_SO:SO-8_5.3x6.2mm_P1.27mm (layer F.Cu) (tedit 5EFBB9DA)
    (at 37.338 17.272)
    (descr "SO, 8 Pin (https://www.ti.com/lit/ml/msop001a/msop001a.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py")
    (tags "SO SO")
    (attr smd)
    (fp_text reference U_FLASH1 (at 0.0508 -3.81 180) (layer F.SilkS))
    (fp_text value GD25Q16C (at 0 4.05) (layer F.Fab) hide)
    (fp_text user %R (at 0 5.207) (layer F.Fab) hide)
    (pad 8 smd roundrect (at 3.5 -1.905) (size 1.9 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 3 +3V3))
    (pad 7 smd roundrect (at 3.5 -0.635) (size 1.9 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 137 /FLIO3))
    (pad 6 smd roundrect (at 3.5 0.635) (size 1.9 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 138 /FLSCK))
    (pad 5 smd roundrect (at 3.5 1.905) (size 1.9 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 135 /FLMOSI))
    (pad 4 smd roundrect (at -3.5 1.905) (size 1.9 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 GND))
    (pad 3 smd roundrect (at -3.5 0.635) (size 1.9 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 136 /FLI02))
    (pad 2 smd roundrect (at -3.5 -0.635) (size 1.9 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 139 /FLMISO))
    (pad 1 smd roundrect (at -3.5 -1.905) (size 1.9 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 132 /FLCS))
    (model ${KISYS3DMOD}/Package_SO.3dshapes/SO-8_5.3x6.2mm_P1.27mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5EFB79E5)
    (at 37.5285 21.72208 180)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CFL1 (at 0.0635 -1.40462) (layer F.SilkS))
    (fp_text value 0.1uf (at 0 1.65) (layer F.Fab) hide)
    (fp_text user %R (at 0.0508 2.3876) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 3 +3V3))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_PinHeader_2.54mm:PinHeader_1x02_P2.54mm_Vertical (layer F.Cu) (tedit 5EFBBA93)
    (at 7.9248 11.9888 90)
    (descr "Through hole straight pin header, 1x02, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x02 2.54mm single row")
    (fp_text reference JP_PMONITOR1 (at 1.8034 1.1938 180) (layer F.SilkS))
    (fp_text value Conn_01x02 (at 2.4638 1.2954) (layer F.Fab) hide)
    (fp_text user %R (at -2.2606 1.2954) (layer F.Fab) hide)
    (pad 2 thru_hole oval (at 0 2.54 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 3 +3V3))
    (pad 1 thru_hole rect (at 0 0 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 61 "Net-(JP_PMONITOR1-Pad1)"))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x02_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_PinSocket_2.54mm:PinSocket_2x02_P2.54mm_Vertical locked (layer B.Cu) (tedit 5EFAA33E)
    (at 52.07 7.62 270)
    (descr "Through hole straight socket strip, 2x02, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated")
    (tags "Through hole socket strip THT 2x02 2.54mm double row")
    (fp_text reference JP_I2C1 (at -4.5974 -1.397 180) (layer B.SilkS))
    (fp_text value Conn_02x02_Odd_Even (at -1.27 -5.31 90) (layer B.Fab) hide)
    (fp_text user %R (at -4.699 -1.3462 180) (layer B.Fab) hide)
    (pad 4 thru_hole oval (at -2.54 -2.54 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 3 thru_hole oval (at 0 -2.54 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 3 +3V3))
    (pad 2 thru_hole oval (at -2.54 0 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 68 PB03-SCL))
    (pad 1 thru_hole rect (at 0 0 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 69 PB02-SDA))
    (model ${KISYS3DMOD}/Connector_PinSocket_2.54mm.3dshapes/PinSocket_2x02_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5EFB79D2)
    (at 44.45762 14.21384)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RFLCS1 (at 0.03048 1.41986) (layer F.SilkS))
    (fp_text value 100K (at 0 1.65) (layer F.Fab) hide)
    (fp_text user %R (at -0.0762 2.3876) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 3 +3V3))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 132 /FLCS))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Jumper:SolderJumper-3_P1.3mm_Open_Pad1.0x1.5mm (layer B.Cu) (tedit 5EFBBB03)
    (at 36.99002 21.4249 180)
    (descr "SMD Solder 3-pad Jumper, 1x1.5mm Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference SP_FL_SO1 (at 0.08382 1.6383) (layer B.SilkS))
    (fp_text value S_FL_SO (at 0 -2) (layer B.Fab) hide)
    (pad 1 smd rect (at -1.3 0 180) (size 1 1.5) (layers B.Cu B.Mask)
      (net 73 PA14-MISO))
    (pad 2 smd rect (at 0 0 180) (size 1 1.5) (layers B.Cu B.Mask)
      (net 139 /FLMISO))
    (pad 3 smd rect (at 1.3 0 180) (size 1 1.5) (layers B.Cu B.Mask)
      (net 83 PA09-QSPI_DATA[1]))
  )
  (module Jumper:SolderJumper-2_P1.3mm_Open_Pad1.0x1.5mm (layer B.Cu) (tedit 5EFBBB13)
    (at 73.025 69.9897)
    (descr "SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference SP_PWRLED1 (at 0.2286 -1.7145) (layer B.SilkS))
    (fp_text value S_PWRLED (at 0 -1.9) (layer B.Fab) hide)
    (pad 1 smd rect (at -0.65 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 37 "Net-(L_PWR1-Pad2)"))
    (pad 2 smd rect (at 0.65 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 3 +3V3))
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5EFB79E5)
    (at 83.1596 20.574 270)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CADS1 (at -0.0508 -1.397 90) (layer F.SilkS))
    (fp_text value 0.1uf (at 0 1.65 90) (layer F.Fab) hide)
    (fp_text user %R (at 0.0508 2.3876 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 119 /ADSVV))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 120 /ADSGD))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5EFB79E5)
    (at 74.60488 14.9733 90)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CPREADS1 (at -0.0508 -1.397 90) (layer F.SilkS))
    (fp_text value 1uf (at 0 1.65 90) (layer F.Fab) hide)
    (fp_text user %R (at 0.0508 2.3876 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 3 +3V3))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5EFB79D2)
    (at 80.81772 14.48054 90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference F_GADS1 (at 0.0508 -1.4224 90) (layer F.SilkS))
    (fp_text value "120 ohm Ferrite" (at 0 1.65 90) (layer F.Fab) hide)
    (fp_text user %R (at -0.0762 2.3876 90) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 120 /ADSGD))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5EFB79D2)
    (at 74.3204 21.2344 270)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference F_VADS1 (at -0.127 1.3716 90) (layer F.SilkS))
    (fp_text value "120 ohm Ferrite" (at 0 1.65 90) (layer F.Fab) hide)
    (fp_text user %R (at -0.0762 2.3876 90) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 119 /ADSVV))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 3 +3V3))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5EFB79D2)
    (at 83.1596 23.5204 180)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RADDR1 (at -3.8608 0.0254) (layer F.SilkS))
    (fp_text value 10K (at 0 1.65) (layer F.Fab) hide)
    (fp_text user %R (at -0.0762 2.3876) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 54 "Net-(RADDR1-Pad2)"))
    (pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5EFB79D2)
    (at 83.03514 14.59992 270)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RADALR1 (at 0.0508 -1.4224 90) (layer F.SilkS))
    (fp_text value 10K (at 0 1.65 90) (layer F.Fab) hide)
    (fp_text user %R (at -0.0762 2.3876 90) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 43 "Net-(RADALR1-Pad2)"))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 119 /ADSVV))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Jumper:SolderJumper-3_P1.3mm_Open_Pad1.0x1.5mm (layer B.Cu) (tedit 5EFBBB03)
    (at 37.44976 13.68806 180)
    (descr "SMD Solder 3-pad Jumper, 1x1.5mm Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference SP_FL_SCLK1 (at 0.08636 1.64846) (layer B.SilkS))
    (fp_text value S_FL_CLK (at 0 -2) (layer B.Fab) hide)
    (pad 1 smd rect (at -1.3 0 180) (size 1 1.5) (layers B.Cu B.Mask)
      (net 72 PA13-SCK))
    (pad 2 smd rect (at 0 0 180) (size 1 1.5) (layers B.Cu B.Mask)
      (net 138 /FLSCK))
    (pad 3 smd rect (at 1.3 0 180) (size 1 1.5) (layers B.Cu B.Mask)
      (net 82 PB10-QSPI_SCK))
  )
  (module Jumper:SolderJumper-3_P1.3mm_Open_Pad1.0x1.5mm (layer B.Cu) (tedit 5EFBBB03)
    (at 45.1866 16.5354 180)
    (descr "SMD Solder 3-pad Jumper, 1x1.5mm Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference SP_FL_IO0 (at 0.1016 1.6256) (layer B.SilkS))
    (fp_text value S_FL_IO0 (at 0 -2) (layer B.Fab) hide)
    (pad 1 smd rect (at -1.3 0 180) (size 1 1.5) (layers B.Cu B.Mask)
      (net 71 PA12-MOSI))
    (pad 2 smd rect (at 0 0 180) (size 1 1.5) (layers B.Cu B.Mask)
      (net 135 /FLMOSI))
    (pad 3 smd rect (at 1.3 0 180) (size 1 1.5) (layers B.Cu B.Mask)
      (net 79 PA08-QSPI_DATA[0]))
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5EFB79D2)
    (at 76.9874 71.04126 270)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RBUZV1 (at 0.0508 -1.4224 90) (layer F.SilkS))
    (fp_text value 22 (at 0 1.65 90) (layer F.Fab) hide)
    (fp_text user %R (at -0.0762 2.3876 90) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 42 "Net-(RBUZV1-Pad2)"))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 17 "Net-(BUZZER1-Pad2)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_TO_SOT_SMD:SOT-23-5_HandSoldering (layer F.Cu) (tedit 5EFBBE5C)
    (at 20.65782 55.59806)
    (descr "5-pin SOT23 package")
    (tags "SOT-23-5 hand-soldering")
    (attr smd)
    (fp_text reference U_G125-LMISO1 (at 0.88138 -2.33426) (layer F.SilkS))
    (fp_text value SN74LVC1G125DBVR (at 0.0254 2.3622) (layer F.Fab) hide)
    (fp_text user %R (at 0 0 90) (layer F.Fab) hide)
    (pad 5 smd rect (at 1.35 -0.95) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask)
      (net 3 +3V3))
    (pad 4 smd rect (at 1.35 0.95) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask)
      (net 73 PA14-MISO))
    (pad 3 smd rect (at -1.35 0.95) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 2 smd rect (at -1.35 0) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask)
      (net 2 MISOSD))
    (pad 1 smd rect (at -1.35 -0.95) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask)
      (net 117 PB08-D18-A4_SD_CS))
    (model ${KISYS3DMOD}/Package_TO_SOT_SMD.3dshapes/SOT-23-5.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Diode_SMD:D_SOD-123F (layer F.Cu) (tedit 5EFBB8D0)
    (at 15.113 17.02816 90)
    (descr D_SOD-123F)
    (tags D_SOD-123F)
    (attr smd)
    (fp_text reference D_BAT1 (at 2.7686 -0.0254) (layer F.SilkS))
    (fp_text value MBR230LSFT1G (at -0.635 1.6256 90) (layer F.Fab) hide)
    (fp_text user %R (at 0.1016 2.3876 90) (layer F.Fab) hide)
    (pad 2 smd rect (at 1.4 0 90) (size 1.1 1.1) (layers F.Cu F.Paste F.Mask)
      (net 45 PWR_BAT))
    (pad 1 smd rect (at -1.4 0 90) (size 1.1 1.1) (layers F.Cu F.Paste F.Mask)
      (net 64 /VIN))
    (model ${KISYS3DMOD}/Diode_SMD.3dshapes/D_SOD-123F.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_PinHeader_2.54mm:PinHeader_2x08_P2.54mm_Vertical locked (layer F.Cu) (tedit 5EFBBEC1)
    (at 29.21 7.62 90)
    (descr "Through hole straight pin header, 2x08, 2.54mm pitch, double rows")
    (tags "Through hole pin header THT 2x08 2.54mm double row")
    (fp_text reference JP_EXT1 (at 1.7018 -2.3622 90) (layer F.SilkS))
    (fp_text value Conn_02x08_Odd_Even (at 5.1054 9.4742) (layer F.Fab) hide)
    (fp_text user %R (at -2.5654 8.8138) (layer F.Fab) hide)
    (pad 16 thru_hole oval (at 2.54 17.78 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 68 PB03-SCL))
    (pad 15 thru_hole oval (at 0 17.78 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 69 PB02-SDA))
    (pad 14 thru_hole oval (at 2.54 15.24 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 112 PA20-D09))
    (pad 13 thru_hole oval (at 0 15.24 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 87 PA06-D16-A2-RTC_INT6))
    (pad 12 thru_hole oval (at 2.54 12.7 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 113 PA21-D08))
    (pad 11 thru_hole oval (at 0 12.7 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 6 ~RESET~))
    (pad 10 thru_hole oval (at 2.54 10.16 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 72 PA13-SCK))
    (pad 9 thru_hole oval (at 0 10.16 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 71 PA12-MOSI))
    (pad 8 thru_hole oval (at 2.54 7.62 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 3 +3V3))
    (pad 7 thru_hole oval (at 0 7.62 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 73 PA14-MISO))
    (pad 6 thru_hole oval (at 2.54 5.08 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 44 PWR_JACK))
    (pad 5 thru_hole oval (at 0 5.08 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 44 PWR_JACK))
    (pad 4 thru_hole oval (at 2.54 2.54 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 45 PWR_BAT))
    (pad 3 thru_hole oval (at 0 2.54 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 45 PWR_BAT))
    (pad 2 thru_hole oval (at 2.54 0 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 1 thru_hole rect (at 0 0 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_2x08_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_PinHeader_2.54mm:PinHeader_1x02_P2.54mm_Vertical (layer F.Cu) (tedit 5EFBBA93)
    (at 67.9704 65.278 270)
    (descr "Through hole straight pin header, 1x02, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x02 2.54mm single row")
    (fp_text reference JP_PCELL1 (at -2.032 1.016 180) (layer F.SilkS))
    (fp_text value Conn_01x02 (at 2.4638 1.2954) (layer F.Fab) hide)
    (fp_text user %R (at -2.2606 1.2954) (layer F.Fab) hide)
    (pad 2 thru_hole oval (at 0 2.54 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 3 +3V3))
    (pad 1 thru_hole rect (at 0 0 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 115 AIN1-PCELL))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x02_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5EFB79D2)
    (at 66.1416 61.2648)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RPH1 (at 3.2766 0) (layer F.SilkS))
    (fp_text value 10K (at 0 1.65) (layer F.Fab) hide)
    (fp_text user %R (at -0.0762 2.3876) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 115 AIN1-PCELL))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Jumper:SolderJumper-2_P1.3mm_Open_Pad1.0x1.5mm (layer B.Cu) (tedit 5EFBBB13)
    (at 43.9166 12.0396 180)
    (descr "SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference SP_FL_CS1 (at 0.1524 1.651) (layer B.SilkS))
    (fp_text value S_FL_CS (at 0 -1.9) (layer B.Fab) hide)
    (pad 1 smd rect (at -0.65 0 180) (size 1 1.5) (layers B.Cu B.Mask)
      (net 78 PB11-QSPI_CS))
    (pad 2 smd rect (at 0.65 0 180) (size 1 1.5) (layers B.Cu B.Mask)
      (net 132 /FLCS))
  )
  (module Jumper:SolderJumper-2_P1.3mm_Open_Pad1.0x1.5mm (layer B.Cu) (tedit 5EFBBB13)
    (at 36.2712 69.723)
    (descr "SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference SP_TFT_WAIT1 (at 0.28956 -1.72212) (layer B.SilkS))
    (fp_text value S_TFT_WAIT (at 0 -1.9) (layer B.Fab) hide)
    (pad 1 smd rect (at -0.65 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 116 PB09-D19-A5-TFT_WAIT))
    (pad 2 smd rect (at 0.65 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 140 /TFT-WAIT))
  )
  (module Fuse:Fuse_1812_4532Metric_Pad1.30x3.40mm_HandSolder (layer F.Cu) (tedit 5EFBB886)
    (at 9.95172 27.87142 180)
    (descr "Fuse SMD 1812 (4532 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://www.nikhef.nl/pub/departments/mt/projects/detectorR_D/dtddice/ERJ2G.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference FUSE1 (at -0.05588 -2.45618) (layer F.SilkS))
    (fp_text value MF-MSMF050-2 (at 0 2.65) (layer F.Fab) hide)
    (fp_text user %R (at 0.1524 3.5814) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 2.225 0 180) (size 1.3 3.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.192308)
      (net 19 "Net-(FUSE1-Pad2)"))
    (pad 1 smd roundrect (at -2.225 0 180) (size 1.3 3.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.192308)
      (net 121 +5C))
    (model ${KISYS3DMOD}/Fuse.3dshapes/Fuse_1812_4532Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5EFB79E5)
    (at 72.4154 43.7896 270)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CMCP1 (at -0.127 1.27 90) (layer F.SilkS))
    (fp_text value 0.1uf (at 0 1.65 90) (layer F.Fab) hide)
    (fp_text user %R (at 0.0508 2.3876 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 3 +3V3))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5EFB79D2)
    (at 83.312 52.6542 270)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RMCP23A0 (at 0.0508 -1.4224 90) (layer F.SilkS))
    (fp_text value 10K (at 0 1.65 90) (layer F.Fab) hide)
    (fp_text user %R (at -0.0762 2.3876 90) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 58 "Net-(RMCP23A0-Pad1)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Jumper:SolderJumper-2_P1.3mm_Open_Pad1.0x1.5mm (layer B.Cu) (tedit 5EFBBB13)
    (at 77.36332 48.5394)
    (descr "SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference SP_MCP23A0 (at 0 1.8) (layer B.SilkS))
    (fp_text value S_MCPA (at 0 -1.9) (layer B.Fab) hide)
    (pad 1 smd rect (at -0.65 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 3 +3V3))
    (pad 2 smd rect (at 0.65 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 58 "Net-(RMCP23A0-Pad1)"))
  )
  (module Jumper:SolderJumper-2_P1.3mm_Open_Pad1.0x1.5mm (layer B.Cu) (tedit 5EFBBB13)
    (at 73.66 45.974)
    (descr "SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference SP_MCP_INT4 (at 1.0668 -1.5748) (layer B.SilkS))
    (fp_text value S_MCPINT (at 0 -1.9) (layer B.Fab) hide)
    (pad 1 smd rect (at -0.65 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 84 PA04-D17-A3-MCP_INT4))
    (pad 2 smd rect (at 0.65 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 108 "Net-(SP_MCP_INT4-Pad2)"))
  )
  (module Jumper:SolderJumper-2_P1.3mm_Open_Pad1.0x1.5mm (layer B.Cu) (tedit 5EFBBB13)
    (at 46.3192 56.5912)
    (descr "SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference SP_TFT13 (at 0.112 -1.651) (layer B.SilkS))
    (fp_text value S_TFT13 (at 0 -1.9) (layer B.Fab) hide)
    (pad 1 smd rect (at -0.65 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 105 TFT13-PB01))
    (pad 2 smd rect (at 0.65 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 124 /TFT-13))
  )
  (module Jumper:SolderJumper-2_P1.3mm_Open_Pad1.0x1.5mm (layer B.Cu) (tedit 5EFBBB13)
    (at 46.5432 63.5508)
    (descr "SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference SP_TFT12 (at -0.0762 -1.6002) (layer B.SilkS))
    (fp_text value S_TFT12 (at 0 -1.9) (layer B.Fab) hide)
    (pad 1 smd rect (at -0.65 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 104 TFT12-PB00))
    (pad 2 smd rect (at 0.65 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 125 /TFT-12))
  )
  (module Connector_PinHeader_2.54mm:PinHeader_2x10_P2.54mm_Vertical locked (layer F.Cu) (tedit 5EFBBED5)
    (at 59.69 7.62 90)
    (descr "Through hole straight pin header, 2x10, 2.54mm pitch, double rows")
    (tags "Through hole pin header THT 2x10 2.54mm double row")
    (fp_text reference JP_EXT2 (at 1.2446 -1.905 90) (layer F.SilkS))
    (fp_text value Conn_02x10_Odd_Even (at 5.0546 11.7856) (layer F.Fab) hide)
    (fp_text user %R (at -2.667 11.0998) (layer F.Fab) hide)
    (pad 20 thru_hole oval (at 2.54 22.86 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 55 ANI0-TMP36))
    (pad 19 thru_hole oval (at 0 22.86 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 115 AIN1-PCELL))
    (pad 18 thru_hole oval (at 2.54 20.32 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 40 AIN2))
    (pad 17 thru_hole oval (at 0 20.32 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 41 AIN3))
    (pad 16 thru_hole oval (at 2.54 17.78 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 46 GP0))
    (pad 15 thru_hole oval (at 0 17.78 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 51 GP1))
    (pad 14 thru_hole oval (at 2.54 15.24 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 52 GP2))
    (pad 13 thru_hole oval (at 0 15.24 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 53 GP3))
    (pad 12 thru_hole oval (at 2.54 12.7 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 50 GP4))
    (pad 11 thru_hole oval (at 0 12.7 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 49 GP5))
    (pad 10 thru_hole oval (at 2.54 10.16 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 56 MCP47-V1))
    (pad 9 thru_hole oval (at 0 10.16 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 57 MCP47-V0))
    (pad 8 thru_hole oval (at 2.54 7.62 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 85 PA02-A0-DAC0))
    (pad 7 thru_hole oval (at 0 7.62 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 86 PA05-A1-DAC1))
    (pad 6 thru_hole oval (at 2.54 5.08 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 94 PA23-D0-RX3))
    (pad 5 thru_hole oval (at 0 5.08 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 93 PA22-D1-TX3))
    (pad 4 thru_hole oval (at 2.54 2.54 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 92 PB17-D2-RX5))
    (pad 3 thru_hole oval (at 0 2.54 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 91 PB16-D3-TX5))
    (pad 2 thru_hole oval (at 2.54 0 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 1 thru_hole rect (at 0 0 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 3 +3V3))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_2x10_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5EFB79D2)
    (at 84.5058 42.5958 90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RGP6 (at 0.0508 -1.4224 90) (layer F.SilkS))
    (fp_text value 10K (at 0 1.65 90) (layer F.Fab) hide)
    (fp_text user %R (at -0.0762 2.3876 90) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 48 GP6))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5EFB79D2)
    (at 84.4804 47.28972 90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RGP7 (at 0.0508 -1.4224 90) (layer F.SilkS))
    (fp_text value 10K (at 0 1.65 90) (layer F.Fab) hide)
    (fp_text user %R (at -0.0762 2.3876 90) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 47 GP7))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_PinHeader_2.54mm:PinHeader_1x03_P2.54mm_Vertical (layer F.Cu) (tedit 5EFBBE32)
    (at 80.7974 71.8566 90)
    (descr "Through hole straight pin header, 1x03, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x03 2.54mm single row")
    (fp_text reference JP_TMP36 (at 0.0762 9.3726 180) (layer F.SilkS))
    (fp_text value Conn_01x03 (at 2.7432 3.5052) (layer F.Fab) hide)
    (fp_text user %R (at -2.3876 3.9624) (layer F.Fab) hide)
    (pad 3 thru_hole oval (at 0 5.08 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 2 thru_hole oval (at 0 2.54 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 55 ANI0-TMP36))
    (pad 1 thru_hole rect (at 0 0 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 3 +3V3))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x03_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Jumper:SolderJumper-2_P1.3mm_Open_Pad1.0x1.5mm (layer B.Cu) (tedit 5EFBBB13)
    (at 81.24444 21.1709)
    (descr "SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference SP_ADSADDR1 (at 0.44196 -1.5875) (layer B.SilkS))
    (fp_text value S_ADSADDR (at 0 -1.9) (layer B.Fab) hide)
    (pad 1 smd rect (at -0.65 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 54 "Net-(RADDR1-Pad2)"))
    (pad 2 smd rect (at 0.65 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 3 +3V3))
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5EFB79E5)
    (at 77.1906 37.1094 270)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CMCP47-0 (at -0.10922 1.21666 270) (layer F.SilkS))
    (fp_text value 0.1uf (at 0 1.65 90) (layer F.Fab) hide)
    (fp_text user %R (at 0.0508 2.3876 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 3 +3V3))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5EFB79E5)
    (at 77.07884 31.03372 270)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CMCP47-1 (at -0.09652 1.36144 90) (layer F.SilkS))
    (fp_text value 0.1uf (at 0 1.65 90) (layer F.Fab) hide)
    (fp_text user %R (at 0.0508 2.3876 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 3 +3V3))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5EFB79D2)
    (at 85.1916 30.988 90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RM47-1 (at 0.0508 1.4986 90) (layer F.SilkS))
    (fp_text value 10K (at 0 1.65 90) (layer F.Fab) hide)
    (fp_text user %R (at -0.0762 2.3876 90) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 134 /MCP47-A01))
    (pad 1 smd roundrect (at -1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_Tantalum_SMD:CP_EIA-3216-18_Kemet-A_Pad1.58x1.35mm_HandSolder (layer F.Cu) (tedit 5EFA9D23)
    (at 73.58634 37.75456 90)
    (descr "Tantalum Capacitor SMD Kemet-A (3216-18 Metric), IPC_7351 nominal, (Body size from: http://www.kemet.com/Lists/ProductCatalog/Attachments/253/KEM_TC101_STD.pdf), generated with kicad-footprint-generator")
    (tags "capacitor tantalum")
    (attr smd)
    (fp_text reference CATOD0 (at -0.635 -1.5748 90) (layer F.SilkS))
    (fp_text value "10uf TANT" (at -0.0254 1.4732 90) (layer F.Fab) hide)
    (fp_text user %R (at -0.0254 2.4384 90) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.4375 0 90) (size 1.575 1.35) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.185185)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.4375 0 90) (size 1.575 1.35) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.185185)
      (net 3 +3V3))
    (model ${KISYS3DMOD}/Capacitor_Tantalum_SMD.3dshapes/CP_EIA-3216-18_Kemet-A.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_Tantalum_SMD:CP_EIA-3216-18_Kemet-A_Pad1.58x1.35mm_HandSolder (layer F.Cu) (tedit 5EFA9D23)
    (at 73.75906 31.68396 90)
    (descr "Tantalum Capacitor SMD Kemet-A (3216-18 Metric), IPC_7351 nominal, (Body size from: http://www.kemet.com/Lists/ProductCatalog/Attachments/253/KEM_TC101_STD.pdf), generated with kicad-footprint-generator")
    (tags "capacitor tantalum")
    (attr smd)
    (fp_text reference CATOD1 (at -0.635 -1.5748 90) (layer F.SilkS))
    (fp_text value "10uf TANT" (at -0.0254 1.4732 90) (layer F.Fab) hide)
    (fp_text user %R (at -0.0254 2.4384 90) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.4375 0 90) (size 1.575 1.35) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.185185)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.4375 0 90) (size 1.575 1.35) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.185185)
      (net 3 +3V3))
    (model ${KISYS3DMOD}/Capacitor_Tantalum_SMD.3dshapes/CP_EIA-3216-18_Kemet-A.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Jumper:SolderJumper-2_P1.3mm_Open_Pad1.0x1.5mm (layer B.Cu) (tedit 5EFBBB13)
    (at 81.8134 42.49166 180)
    (descr "SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference SP_GP6 (at -0.3048 1.75006) (layer B.SilkS))
    (fp_text value S_GP6 (at 0 -1.9) (layer B.Fab) hide)
    (pad 1 smd rect (at -0.65 0 180) (size 1 1.5) (layers B.Cu B.Mask)
      (net 48 GP6))
    (pad 2 smd rect (at 0.65 0 180) (size 1 1.5) (layers B.Cu B.Mask)
      (net 3 +3V3))
  )
  (module Jumper:SolderJumper-2_P1.3mm_Open_Pad1.0x1.5mm (layer B.Cu) (tedit 5EFBBB13)
    (at 82.296 46.482 180)
    (descr "SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference SP_GP7 (at 0 1.8) (layer B.SilkS))
    (fp_text value S_GP7 (at 0 -1.9) (layer B.Fab) hide)
    (pad 1 smd rect (at -0.65 0 180) (size 1 1.5) (layers B.Cu B.Mask)
      (net 47 GP7))
    (pad 2 smd rect (at 0.65 0 180) (size 1 1.5) (layers B.Cu B.Mask)
      (net 3 +3V3))
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5EFB79D2)
    (at 82.48396 38.6588)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RM47-0 (at 0.06604 1.3208 180) (layer F.SilkS))
    (fp_text value 10K (at 0 1.65) (layer F.Fab) hide)
    (fp_text user %R (at -0.0762 2.3876) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 133 /MCP47-A00))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Jumper:SolderJumper-2_P1.3mm_Open_Pad1.0x1.5mm (layer B.Cu) (tedit 5EFBBB13)
    (at 81.8134 36.07816)
    (descr "SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference SP_M47-0 (at 0.1397 -1.58496) (layer B.SilkS))
    (fp_text value S_M47-0 (at 0 -1.9) (layer B.Fab) hide)
    (pad 1 smd rect (at -0.65 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 3 +3V3))
    (pad 2 smd rect (at 0.65 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 133 /MCP47-A00))
  )
  (module Jumper:SolderJumper-2_P1.3mm_Open_Pad1.0x1.5mm (layer B.Cu) (tedit 5EFBBB13)
    (at 79.6902 29.8704)
    (descr "SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference SP_M47-1 (at 0.22606 -1.63068) (layer B.SilkS))
    (fp_text value S_M47-1 (at 0 -1.9) (layer B.Fab) hide)
    (pad 1 smd rect (at -0.65 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 3 +3V3))
    (pad 2 smd rect (at 0.65 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 134 /MCP47-A01))
  )
  (module Connector_PinSocket_2.54mm:PinSocket_2x03_P2.54mm_Vertical locked (layer B.Cu) (tedit 5EFAA2F5)
    (at 24.13 10.16)
    (descr "Through hole straight socket strip, 2x03, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated")
    (tags "Through hole socket strip THT 2x03 2.54mm double row")
    (fp_text reference JP_BAT1 (at -1.1684 -7.1882) (layer B.SilkS))
    (fp_text value Conn_02x03_Odd_Even (at -1.27 -7.85) (layer B.Fab) hide)
    (fp_text user %R (at -5.3086 -4.1402 -90) (layer B.Fab) hide)
    (pad 6 thru_hole oval (at -2.54 -5.08) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 5 thru_hole oval (at 0 -5.08) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 4 thru_hole oval (at -2.54 -2.54) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 45 PWR_BAT))
    (pad 3 thru_hole oval (at 0 -2.54) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 45 PWR_BAT))
    (pad 2 thru_hole oval (at -2.54 0) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 44 PWR_JACK))
    (pad 1 thru_hole rect (at 0 0) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 44 PWR_JACK))
    (model ${KISYS3DMOD}/Connector_PinSocket_2.54mm.3dshapes/PinSocket_2x03_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_PinSocket_2.54mm:PinSocket_1x15_P2.54mm_Vertical (layer F.Cu) (tedit 5EFBBE1D)
    (at 20.32 79.502 90)
    (descr "Through hole straight socket strip, 1x15, 2.54mm pitch, single row (from Kicad 4.0.7), script generated")
    (tags "Through hole socket strip THT 1x15 2.54mm single row")
    (fp_text reference JP_RA8875 (at -2.54 6.7564) (layer F.SilkS))
    (fp_text value Conn_01x15 (at 2.4384 15.113) (layer F.Fab) hide)
    (fp_text user %R (at 2.7178 32.1564) (layer F.Fab) hide)
    (pad 15 thru_hole oval (at 0 35.56 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 122 /TFT-15))
    (pad 14 thru_hole oval (at 0 33.02 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 123 /TFT-14))
    (pad 13 thru_hole oval (at 0 30.48 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 124 /TFT-13))
    (pad 12 thru_hole oval (at 0 27.94 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 125 /TFT-12))
    (pad 11 thru_hole oval (at 0 25.4 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 77 PA19-D11-TFT_INT3))
    (pad 10 thru_hole oval (at 0 22.86 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 140 /TFT-WAIT))
    (pad 9 thru_hole oval (at 0 20.32 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 76 PA18-D10-TFT_RESET))
    (pad 8 thru_hole oval (at 0 17.78 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 75 PA17-D12-TFT_CS))
    (pad 7 thru_hole oval (at 0 15.24 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 71 PA12-MOSI))
    (pad 6 thru_hole oval (at 0 12.7 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 126 /TFT-MISO))
    (pad 5 thru_hole oval (at 0 10.16 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 72 PA13-SCK))
    (pad 4 thru_hole oval (at 0 7.62 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 59 "Net-(JP_RA8875-Pad4)"))
    (pad 3 thru_hole oval (at 0 5.08 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 60 "Net-(JP_RA8875-Pad3)"))
    (pad 2 thru_hole oval (at 0 2.54 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 1 thru_hole rect (at 0 0 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 3 +3V3))
    (model ${KISYS3DMOD}/Connector_PinSocket_2.54mm.3dshapes/PinSocket_1x15_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_TO_SOT_SMD:SOT-23-6_Handsoldering (layer F.Cu) (tedit 5EFBB84A)
    (at 80.6196 35.7632)
    (descr "6-pin SOT-23 package, Handsoldering")
    (tags "SOT-23-6 Handsoldering")
    (attr smd)
    (fp_text reference U_M47-0 (at -0.9779 -2.1717 180) (layer F.SilkS))
    (fp_text value MCP4725A0T-E_CH (at 0.0254 2.2098) (layer F.Fab) hide)
    (fp_text user %R (at 0.3302 2.9972 180) (layer F.Fab) hide)
    (pad 5 smd rect (at 1.35 0) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask)
      (net 68 PB03-SCL))
    (pad 6 smd rect (at 1.35 -0.95) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask)
      (net 133 /MCP47-A00))
    (pad 4 smd rect (at 1.35 0.95) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask)
      (net 69 PB02-SDA))
    (pad 3 smd rect (at -1.35 0.95) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask)
      (net 3 +3V3))
    (pad 2 smd rect (at -1.35 0) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 1 smd rect (at -1.35 -0.95) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask)
      (net 57 MCP47-V0))
    (model ${KISYS3DMOD}/Package_TO_SOT_SMD.3dshapes/SOT-23-6.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_TO_SOT_SMD:SOT-23-6_Handsoldering (layer F.Cu) (tedit 5EFBB84A)
    (at 80.6704 30.861)
    (descr "6-pin SOT-23 package, Handsoldering")
    (tags "SOT-23-6 Handsoldering")
    (attr smd)
    (fp_text reference U_M47-1 (at -0.7366 -2.3114 180) (layer F.SilkS))
    (fp_text value MCP4725A0T-E_CH (at 0.0254 2.2098) (layer F.Fab) hide)
    (fp_text user %R (at 0.3302 2.9972 180) (layer F.Fab) hide)
    (pad 5 smd rect (at 1.35 0) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask)
      (net 68 PB03-SCL))
    (pad 6 smd rect (at 1.35 -0.95) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask)
      (net 134 /MCP47-A01))
    (pad 4 smd rect (at 1.35 0.95) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask)
      (net 69 PB02-SDA))
    (pad 3 smd rect (at -1.35 0.95) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask)
      (net 3 +3V3))
    (pad 2 smd rect (at -1.35 0) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 1 smd rect (at -1.35 -0.95) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask)
      (net 56 MCP47-V1))
    (model ${KISYS3DMOD}/Package_TO_SOT_SMD.3dshapes/SOT-23-6.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Jumper:SolderJumper-3_P1.3mm_Open_Pad1.0x1.5mm (layer B.Cu) (tedit 5EFBBB03)
    (at 66.8782 45.212)
    (descr "SMD Solder 3-pad Jumper, 1x1.5mm Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference TFT14 (at 0.0762 1.8034) (layer B.SilkS))
    (fp_text value TFT (at 0 -2) (layer B.Fab) hide)
    (pad 1 smd rect (at -1.3 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 106 TFT14-PB05))
    (pad 2 smd rect (at 0 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 123 /TFT-14))
    (pad 3 smd rect (at 1.3 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 69 PB02-SDA))
  )
  (module Jumper:SolderJumper-3_P1.3mm_Open_Pad1.0x1.5mm (layer B.Cu) (tedit 5EFBBB03)
    (at 66.929 49.0728)
    (descr "SMD Solder 3-pad Jumper, 1x1.5mm Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference TFT15 (at 0.0762 1.8034) (layer B.SilkS))
    (fp_text value TFT (at 0 -2) (layer B.Fab) hide)
    (pad 1 smd rect (at -1.3 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 107 TFT15-PB04))
    (pad 2 smd rect (at 0 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 122 /TFT-15))
    (pad 3 smd rect (at 1.3 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 68 PB03-SCL))
  )
  (module TestPoint:TestPoint_THTPad_D1.5mm_Drill0.7mm (layer F.Cu) (tedit 5EFA9F2C)
    (at 64.77 39.4208 180)
    (descr "THT pad as test Point, diameter 1.5mm, hole diameter 0.7mm")
    (tags "test point THT pad")
    (attr virtual)
    (fp_text reference AREF1 (at -2.7686 -0.0254) (layer F.SilkS))
    (fp_text value PA03-AREF (at 0 1.75) (layer F.Fab) hide)
    (fp_text user %R (at 2.7432 0.8636) (layer F.Fab) hide)
    (pad 1 thru_hole circle (at 0 0 180) (size 1.5 1.5) (drill 0.7) (layers *.Cu *.Mask)
      (net 118 /PA03-AREF))
  )
  (module Connector_PinHeader_2.54mm:PinHeader_2x10_P2.54mm_Vertical (layer F.Cu) (tedit 5EFBBED5)
    (at 90.17 40.64)
    (descr "Through hole straight pin header, 2x10, 2.54mm pitch, double rows")
    (tags "Through hole pin header THT 2x10 2.54mm double row")
    (fp_text reference JP_NET1 (at 1.1684 24.9682) (layer F.SilkS))
    (fp_text value Conn_02x10_Odd_Even (at 5.0546 11.7856 90) (layer F.Fab) hide)
    (fp_text user %R (at -2.667 11.0998 90) (layer F.Fab) hide)
    (pad 20 thru_hole oval (at 2.54 22.86) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 36 +3V0))
    (pad 19 thru_hole oval (at 0 22.86) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 36 +3V0))
    (pad 18 thru_hole oval (at 2.54 20.32) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 17 thru_hole oval (at 0 20.32) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 16 thru_hole oval (at 2.54 17.78) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 84 PA04-D17-A3-MCP_INT4))
    (pad 15 thru_hole oval (at 0 17.78) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 69 PB02-SDA))
    (pad 14 thru_hole oval (at 2.54 15.24) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 68 PB03-SCL))
    (pad 13 thru_hole oval (at 0 15.24) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 6 ~RESET~))
    (pad 12 thru_hole oval (at 2.54 12.7) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 90 PB15-D06-NET_INT15))
    (pad 11 thru_hole oval (at 0 12.7) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 71 PA12-MOSI))
    (pad 10 thru_hole oval (at 2.54 10.16) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 72 PA13-SCK))
    (pad 9 thru_hole oval (at 0 10.16) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 73 PA14-MISO))
    (pad 8 thru_hole oval (at 2.54 7.62) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 89 PB14-D05-NET_CS))
    (pad 7 thru_hole oval (at 0 7.62) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 88 PB13-D04-NET_RES))
    (pad 6 thru_hole oval (at 2.54 5.08) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 94 PA23-D0-RX3))
    (pad 5 thru_hole oval (at 0 5.08) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 93 PA22-D1-TX3))
    (pad 4 thru_hole oval (at 2.54 2.54) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 3 thru_hole oval (at 0 2.54) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 2 thru_hole oval (at 2.54 0) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 3 +3V3))
    (pad 1 thru_hole rect (at 0 0) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 3 +3V3))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_2x10_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Jumper:SolderJumper-2_P1.3mm_Open_Pad1.0x1.5mm (layer B.Cu) (tedit 5EFBBB13)
    (at 3.571 11.7602)
    (descr "SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference SP_H1 (at 0.2136 -1.778) (layer B.SilkS))
    (fp_text value S_H1 (at 0 -1.9) (layer B.Fab) hide)
    (pad 1 smd rect (at -0.65 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 9 "Net-(H1-Pad1)"))
    (pad 2 smd rect (at 0.65 0) (size 1 1.5) (layers B.Cu B.Mask)
      (net 1 GND))
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5EFB79E5)
    (at 28.956 28.3718 90)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CSN1 (at 0.0254 1.5748 90) (layer F.SilkS))
    (fp_text value "47pf 50V" (at 0 1.65 90) (layer F.Fab) hide)
    (fp_text user %R (at 0.0508 2.3876 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 144 "Net-(CSN1-Pad1)"))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5EFB79D2)
    (at 25.2476 28.3464 270)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference RSN1 (at 0 -1.5494 90) (layer F.SilkS))
    (fp_text value 10 (at 0 1.65 90) (layer F.Fab) hide)
    (fp_text user %R (at -0.0762 2.3876 90) (layer F.Fab) hide)
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 144 "Net-(CSN1-Pad1)"))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 67 /SW))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5EFB79E5)
    (at 48.3616 29.4386 225)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CDC54 (at 3.538221 0.089803 45) (layer F.SilkS))
    (fp_text value 0.1uf (at 0 1.65 45) (layer F.Fab) hide)
    (fp_text user %R (at 0.0508 2.3876 45) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 225) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.025 0 225) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 95 "Net-(CDC53-Pad2)"))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5EFB79E5)
    (at 50.0888 23.1902 180)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference CF48 (at -0.0508 1.6002) (layer F.SilkS))
    (fp_text value 0.1uf (at 0 1.65) (layer F.Fab) hide)
    (fp_text user %R (at 0.0508 2.3876) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 7 +3.3VA))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module z51j:pad1007-2518 (layer F.Cu) (tedit 5DC67BD8)
    (at 50.038 31.2674 45)
    (fp_text reference IND55 (at -3.107169 -0.017961 45) (layer F.SilkS))
    (fp_text value "10uH " (at 0.0508 1.9685 45) (layer F.Fab) hide)
    (pad 2 smd rect (at 1 0 45) (size 0.8 2) (layers F.Cu F.Paste F.Mask)
      (net 97 "Net-(IND55-Pad2)"))
    (pad 1 smd rect (at -1 0 45) (size 0.8 2) (layers F.Cu F.Paste F.Mask)
      (net 95 "Net-(CDC53-Pad2)"))
  )
  (module Jumper:SolderJumper-3_P1.3mm_Open_Pad1.0x1.5mm (layer B.Cu) (tedit 5EFBBB03)
    (at 37.5666 29.8704 180)
    (descr "SMD Solder 3-pad Jumper, 1x1.5mm Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference SP_FL_IO2 (at 0 1.6256) (layer B.SilkS))
    (fp_text value S_FL_IO2 (at 0 -2) (layer B.Fab) hide)
    (pad 1 smd rect (at -1.3 0 180) (size 1 1.5) (layers B.Cu B.Mask)
      (net 3 +3V3))
    (pad 2 smd rect (at 0 0 180) (size 1 1.5) (layers B.Cu B.Mask)
      (net 136 /FLI02))
    (pad 3 smd rect (at 1.3 0 180) (size 1 1.5) (layers B.Cu B.Mask)
      (net 80 PA10-QSPI_DATA[2]))
  )
  (module Jumper:SolderJumper-3_P1.3mm_Open_Pad1.0x1.5mm (layer B.Cu) (tedit 5EFBBB03)
    (at 43.2816 25.0317 180)
    (descr "SMD Solder 3-pad Jumper, 1x1.5mm Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference SP_FL_IO3 (at -0.0508 1.5875) (layer B.SilkS))
    (fp_text value S_FL_IO3 (at 0 -2) (layer B.Fab) hide)
    (pad 1 smd rect (at -1.3 0 180) (size 1 1.5) (layers B.Cu B.Mask)
      (net 3 +3V3))
    (pad 2 smd rect (at 0 0 180) (size 1 1.5) (layers B.Cu B.Mask)
      (net 137 /FLIO3))
    (pad 3 smd rect (at 1.3 0 180) (size 1 1.5) (layers B.Cu B.Mask)
      (net 81 PA11-QSPI_DATA[3]))
  )
  (module z51j:SPDT-612-500ASSP1M2QE (layer F.Cu) (tedit 5EFA9D83)
    (at 10.1854 18.1102)
    (descr "SPDT .100 switch")
    (tags SPDT)
    (fp_text reference SW_PWR1 (at 1.9431 -0.0635 90) (layer F.SilkS))
    (fp_text value SW_SPDT (at -7.1247 0.0127 90) (layer F.Fab) hide)
    (pad 4 thru_hole circle (at -5.08 2.54) (size 1.8 1.8) (drill 1.1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 4 thru_hole circle (at -5.08 -2.54) (size 1.8 1.8) (drill 1.1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 3 thru_hole circle (at 0 2.54) (size 1.8 1.8) (drill 1.1) (layers *.Cu *.Mask)
      (net 8 /3REG))
    (pad 2 thru_hole circle (at 0 0) (size 1.8 1.8) (drill 1.1) (layers *.Cu *.Mask)
      (net 61 "Net-(JP_PMONITOR1-Pad1)"))
    (pad 1 thru_hole circle (at 0 -2.54) (size 1.8 1.8) (drill 1.1) (layers *.Cu *.Mask)
      (net 36 +3V0))
  )
  (module z51j:COIL_VLCF5024 (layer F.Cu) (tedit 5EFBBDC6)
    (at 28.0416 23.0124)
    (descr "Shielded Power Inductor SMD")
    (tags inductor)
    (attr smd)
    (fp_text reference LT1 (at 3.42392 -0.12446 90) (layer F.SilkS))
    (fp_text value 1.8mH (at 0 3.5814) (layer F.Fab) hide)
    (fp_text user %R (at -0.0254 0.0508) (layer F.Fab) hide)
    (pad 1 smd custom (at -2.15 0) (size 1.055 3.4) (layers F.Cu F.Paste F.Mask)
      (net 67 /SW) (zone_connect 2)
      (options (clearance outline) (anchor rect))
      (primitives
        (gr_poly (pts
           (xy 1.4675 -1.7) (xy 0.9562 -0.8191) (xy 0.9562 0.8699) (xy 1.4675 1.7) (xy 1.4675 2.755)
           (xy 0.5275 2.755) (xy -0.5275 1.7) (xy -0.5275 -1.7) (xy 0.5275 -2.755) (xy 1.4675 -2.755)
) (width 0))
      ))
    (pad 2 smd custom (at 2.15 0) (size 1.055 3.4) (layers F.Cu F.Paste F.Mask)
      (net 8 /3REG) (zone_connect 2)
      (options (clearance outline) (anchor rect))
      (primitives
        (gr_poly (pts
           (xy -1.4675 -1.7) (xy -0.8927 -0.8699) (xy -0.8927 0.8191) (xy -1.4675 1.7) (xy -1.4675 2.755)
           (xy -0.5275 2.755) (xy 0.5275 1.7) (xy 0.5275 -1.7) (xy -0.5275 -2.755) (xy -1.4675 -2.755)
) (width 0))
      ))
    (model ${KISYS3DMOD}/Inductor_SMD.3dshapes/L_Coilcraft_LPS5030.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module z51j:Switch_Tactile_B3F (layer F.Cu) (tedit 5EFBBE83)
    (at 2.9718 47.7774 270)
    (attr smd)
    (fp_text reference SW_RESET1 (at 0.1016 -3.302 90) (layer F.SilkS))
    (fp_text value SW_B3F-3100 (at -0.0762 0.0508 90) (layer F.Fab) hide)
    (fp_text user %R (at 0.16256 -0.21336 90) (layer F.Fab) hide)
    (pad 2 thru_hole circle (at 2.25 1.25 180) (size 1.6 1.6) (drill 1.2) (layers *.Cu *.Mask)
      (net 6 ~RESET~))
    (pad 4 thru_hole circle (at 3.5 -1.25 180) (size 2.4 2.4) (drill 1.8) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 3 thru_hole circle (at -3.5 -1.25 180) (size 2.4 2.4) (drill 1.8) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 1 thru_hole circle (at -2.25 1.25 180) (size 1.6 1.6) (drill 1.2) (layers *.Cu *.Mask)
      (net 1 GND))
  )
  (module z51j:BarrelJack_CUI_PJ-102AH_Horiz_4pin (layer F.Cu) (tedit 5EFBBD9A)
    (at 15.1892 8.8138 180)
    (descr "Thin-pin DC Barrel Jack, https://cdn-shop.adafruit.com/datasheets/21mmdcjackDatasheet.pdf")
    (tags "Power Jack")
    (fp_text reference J_PW1 (at -5.3848 6.8834 90) (layer F.SilkS))
    (fp_text value Barrel_Jack_sw_4pin (at -0.1778 -2.3622 180) (layer F.Fab) hide)
    (fp_text user 3.5mm (at 2.9718 2.6416 90) (layer F.SilkS))
    (fp_text user %R (at -3.175 3.4036 90) (layer F.Fab) hide)
    (pad 1 thru_hole circle (at 1.2 3 180) (size 2.6 2.6) (drill 1.6) (layers *.Cu *.Mask)
      (net 44 PWR_JACK))
    (pad 1 thru_hole rect (at 0 0 180) (size 2.6 2.6) (drill 1.6) (layers *.Cu *.Mask)
      (net 44 PWR_JACK))
    (pad 2 thru_hole circle (at 0 6 180) (size 2.6 2.6) (drill 1.6) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 2 thru_hole circle (at 4.7 3 180) (size 2.6 2.6) (drill 1.6) (layers *.Cu *.Mask)
      (net 1 GND))
    (model ${KISYS3DMOD}/Connector_BarrelJack.3dshapes/BarrelJack_CUI_PJ-102AH_Horizontal.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module z51j:Battery_CR1220 (layer F.Cu) (tedit 5E1684E0)
    (at 35.6362 61.5442 90)
    (descr "CR1220 battery")
    (tags "battery CR1220 coin cell")
    (attr virtual)
    (fp_text reference Battery-Cell1 (at 2.8956 8.3058 90) (layer F.SilkS))
    (fp_text value CR1220_Cell (at -1.6129 0.0762) (layer F.Fab) hide)
    (fp_text user - (at -8.22706 -2.40284 90) (layer F.SilkS))
    (fp_text user + (at 7.90194 -2.49936 90) (layer F.SilkS))
    (pad 3 thru_hole circle (at 4 0 90) (size 1.5748 1.5748) (drill 1.4478) (layers *.Cu *.Mask))
    (pad 3 thru_hole circle (at -3.5 0 90) (size 1.18 1.18) (drill 1.06) (layers *.Cu *.Mask))
    (pad 1 smd rect (at 8.18 0 90) (size 3.66 2.6) (layers F.Cu F.Paste F.Mask)
      (net 34 "Net-(Battery-Cell1-Pad1)"))
    (pad 2 smd rect (at -8.18 0 90) (size 3.66 2.6) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (model ${KISYS3DMOD}/Battery.3dshapes/Battery_CR1225.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module z51j:pad1007-2518 (layer F.Cu) (tedit 5DC67BD8)
    (at 84.4804 26.6954 180)
    (fp_text reference IND1 (at -2.3622 0.0508 90) (layer F.SilkS))
    (fp_text value "10uH " (at 0.0508 1.9685) (layer F.Fab) hide)
    (pad 2 smd rect (at 1 0 180) (size 0.8 2) (layers F.Cu F.Paste F.Mask)
      (net 7 +3.3VA))
    (pad 1 smd rect (at -1 0 180) (size 0.8 2) (layers F.Cu F.Paste F.Mask)
      (net 3 +3V3))
  )
  (gr_text GND (at 86.3092 74.3712) (layer F.SilkS))
  (gr_text "TO EXTERNAL COMMS" (at 87.63 51.562 90) (layer B.SilkS))
  (gr_text 3V (at 44.6024 27.3812 90) (layer B.SilkS))
  (gr_text PA11.3 (at 41.9354 28.2956 90) (layer B.SilkS))
  (gr_text "3V3 3V3\nGND GND\nPA22 PA23\nPB13 PB14\nMISO SCK\nMOSI PB15\n~RST~ SCL\nSDA PA04\nGND GND\n3POE 3POE" (at 91.2876 32.3596) (layer F.SilkS))
  (gr_text "Mini51jPad\nVer 01a\n8 July 2020" (at 24.1046 25.8064) (layer B.SilkS))
  (gr_text N/C (at 27.94 76.708 90) (layer F.SilkS))
  (gr_text N/C (at 25.527 76.708 90) (layer F.SilkS))
  (gr_text PCELL (at 66.9544 63.3222) (layer B.SilkS))
  (gr_text "(c) Copyright S. Cooper 2020\nLicensed under CERN OHL v.1.2 " (at 91.5416 16.3576 90) (layer F.SilkS))
  (gr_text SDA (at 69.7484 45.1358 90) (layer B.SilkS))
  (gr_text PB05 (at 64.008 45.212 90) (layer B.SilkS))
  (gr_text PB04 (at 64.008 48.9458 90) (layer B.SilkS))
  (gr_text SCL (at 69.723 49.1744 90) (layer B.SilkS))
  (gr_text "(c) Copyright S. Cooper 2020\n\nLicensed under CERN OHL v.1.2 \n\nPlease see the CERN OHL v.1.2 for applicable conditions\nhttp://ohwr.org/cernohl" (at 31.0896 57.1754) (layer B.SilkS))
  (gr_text D44 (at 66.3956 74.7268) (layer F.SilkS))
  (gr_text INA1 (at 70.0532 65.278 90) (layer F.SilkS))
  (gr_text ANI0 (at 83.2612 74.3458) (layer F.SilkS))
  (gr_text ANI0 (at 83.3628 74.2442) (layer B.SilkS))
  (gr_text "Micro SD\n~CS~  PB08 D18\nDetect PB12 D07" (at 4.30022 60.77966 90) (layer B.SilkS))
  (gr_text ~RESET (at 10.922 43.93184 90) (layer B.SilkS))
  (gr_text PMON (at 9.28878 10.08634) (layer B.SilkS))
  (gr_text TMP36 (at 83.82 69.469) (layer B.SilkS))
  (gr_text AREF (at 67.7672 39.624) (layer B.SilkS))
  (gr_text MicroSD (at 2.5654 69.469) (layer F.SilkS))
  (gr_text "PB22\nD40" (at 53.9496 69.5452) (layer B.SilkS))
  (gr_text "PB07\nD29" (at 20.78228 39.1414) (layer B.SilkS))
  (gr_text + (at 63.5762 64.262) (layer F.SilkS))
  (gr_text +3 (at 80.3656 74.3204) (layer F.SilkS))
  (gr_text G (at 84.81822 73.1774) (layer F.SilkS))
  (gr_text JACK (at 19.304 11.176 90) (layer B.SilkS))
  (gr_text JACK (at 26.67 11.0998 90) (layer B.SilkS))
  (gr_text * (at 77.25664 30.44952) (layer B.SilkS))
  (gr_text BAT+ (at 26.416 7.5184 90) (layer B.SilkS))
  (gr_text "EXTERNAL 2" (at 70.71868 2.4511) (layer B.SilkS))
  (gr_text "EXTERNAL 1" (at 38.16604 2.40538) (layer B.SilkS))
  (gr_text "Unit Code" (at 82.59064 39.11092) (layer B.SilkS))
  (gr_text "———————————— TFT JACK ————————————" (at 38.4048 81.2038) (layer B.SilkS))
  (gr_text "PA04\nD17" (at 73.3298 48.641) (layer B.SilkS))
  (gr_text ANI3 (at 80.0354 10.48258 90) (layer F.SilkS))
  (gr_text ANI1 (at 82.53984 10.4267 90) (layer F.SilkS))
  (gr_text ANI2 (at 80.01508 2.04216 90) (layer F.SilkS))
  (gr_text ANI0 (at 82.55508 2.0193 90) (layer F.SilkS))
  (gr_text PB01 (at 50.8254 77.8764 90) (layer F.SilkS))
  (gr_text PB00 (at 48.387 77.9018 90) (layer F.SilkS))
  (gr_text "PB17\nD2" (at 62.25794 3.67538 90) (layer F.SilkS))
  (gr_text 3V (at 59.92368 10.01268 90) (layer F.SilkS))
  (gr_text "SDA or\nPB05" (at 53.3146 78.00848 90) (layer F.SilkS))
  (gr_text "SCL or\nPB04" (at 55.95112 77.89926 90) (layer F.SilkS))
  (gr_text "Default\nLED" (at 64.4398 76.6064) (layer F.SilkS))
  (gr_text "CPU\nPower" (at 70.4596 76.454) (layer F.SilkS))
  (gr_text GND (at 26.416 3.937 90) (layer B.SilkS))
  (gr_text "To TFT Jack" (at 66.802 42.7736) (layer B.SilkS))
  (gr_text AtoD1 (at 69.9008 11.2776 90) (layer F.SilkS))
  (gr_text GP4 (at 72.37984 2.45872 90) (layer F.SilkS))
  (gr_text GP5 (at 72.4662 10.6934 90) (layer F.SilkS))
  (gr_text AtoD2 (at 69.68998 1.76784 90) (layer F.SilkS))
  (gr_text GP3 (at 75.17638 10.36828 90) (layer F.SilkS))
  (gr_text GP1 (at 77.74432 10.30224 90) (layer F.SilkS))
  (gr_text GP2 (at 74.90206 2.4384 90) (layer F.SilkS))
  (gr_text GP0 (at 77.45222 2.4384 90) (layer F.SilkS))
  (gr_text "PA20\nD9" (at 44.54144 3.70586 90) (layer F.SilkS))
  (gr_text "PA20\nD09" (at 36.2712 72.1868) (layer B.SilkS))
  (gr_text "PA20 D9 WAIT" (at 43.4086 78.0034 90) (layer F.SilkS))
  (gr_text VJAC (at 34.5059 1.99136 90) (layer F.SilkS))
  (gr_text VBAT (at 31.89732 2.00914 90) (layer F.SilkS))
  (gr_text PA10.2 (at 36.0934 33.274 90) (layer B.SilkS))
  (gr_text 3V (at 38.9128 32.131 90) (layer B.SilkS))
  (gr_text MOSI (at 46.482 19.431 90) (layer B.SilkS))
  (gr_text "PA13\nSCK" (at 38.862 16.4846 90) (layer B.SilkS))
  (gr_text "3.3V SRC\nSwitch" (at 7.76478 18.16862 90) (layer B.SilkS))
  (gr_text "Remote\nBattery\nMonitor" (at 53.34 11.5062) (layer B.SilkS))
  (gr_text "PA10\nSCK" (at 35.8394 16.3576 90) (layer B.SilkS))
  (gr_text PA08.0 (at 43.9166 19.8628 90) (layer B.SilkS))
  (gr_text "FLASH\nHardware\nPins" (at 42.5196 34.3154) (layer B.SilkS))
  (gr_text "PA06\nD16" (at 30.5816 48.2854) (layer B.SilkS))
  (gr_text **3.3V** (at 60.5536 40.0558) (layer B.SilkS))
  (gr_text INA1 (at 70.0532 65.3542 90) (layer B.SilkS))
  (gr_text * (at 71.02602 70.49516) (layer B.SilkS))
  (gr_text "3V Cell\nCR1220" (at 43.434 52.2224) (layer F.SilkS))
  (gr_text "3.3V\nSource\nSwitch" (at 2.40792 18.25752 270) (layer F.SilkS))
  (gr_text PA09.1 (at 35.56 24.8666 90) (layer B.SilkS))
  (gr_text MISO (at 38.3032 24.257 90) (layer B.SilkS))
  (gr_text PB11-CS (at 44.0182 13.589) (layer B.SilkS))
  (gr_text "Remote\nBattery\nPack" (at 22.86 13.843) (layer B.SilkS))
  (gr_text 3V (at 56.88076 7.874 90) (layer B.SilkS))
  (gr_text SCL (at 49.784 4.572 90) (layer B.SilkS))
  (gr_text SDA (at 49.784 7.62 90) (layer B.SilkS))
  (gr_text GND (at 56.896 4.572 90) (layer B.SilkS))
  (gr_text BAT+ (at 19.431 7.493 90) (layer B.SilkS))
  (gr_text GND (at 19.431 3.937 90) (layer B.SilkS))
  (gr_text "Not used\nwith RA8875" (at 66.802 52.8574) (layer B.SilkS))
  (gr_text * (at 18.81632 37.34816) (layer B.SilkS))
  (gr_text "JACK\nBAT" (at 2.08026 25.12314) (layer F.SilkS))
  (gr_text "Buzzer Vol" (at 78.6511 76.43368) (layer B.SilkS))
  (gr_text SWD (at 45.9994 42.7736) (layer B.SilkS))
  (gr_text "Mini51JPad\nVer 01a\n8 July 2020" (at 67.5386 51.4858) (layer F.SilkS))
  (gr_text "BUZZER\nPA07" (at 80.0354 62.3316) (layer B.SilkS))
  (gr_text "BUZZER\nPA07" (at 80.01 55.753) (layer F.SilkS))
  (gr_text 3V (at 20.3835 77.04836 90) (layer F.SilkS))
  (gr_text GND (at 23.00224 76.7334 90) (layer F.SilkS))
  (gr_text "PA17 D12\nLCS" (at 38.1508 78.01356 90) (layer F.SilkS))
  (gr_text "PA14 MISO" (at 33.16732 74.7776 90) (layer F.SilkS))
  (gr_text "PA19 D11\nLINT" (at 45.9486 77.978 90) (layer F.SilkS))
  (gr_text "PA18 D10 LRES" (at 40.66794 77.98816 90) (layer F.SilkS))
  (gr_text "PB11 SCK" (at 30.72638 74.94016 90) (layer F.SilkS))
  (gr_text "PB10 MOSI" (at 35.67938 74.77252 90) (layer F.SilkS))
  (gr_text ~RESET (at 3.4544 47.9044) (layer B.SilkS))
  (gr_text USB (at 2.58064 31.2928) (layer B.SilkS))
  (gr_text V+ (at 12.8016 7.8232) (layer B.SilkS))
  (gr_text GND (at 10.0838 2.921 90) (layer B.SilkS))
  (gr_text GND (at 15.24 0.7112) (layer B.SilkS))
  (gr_text "Buzzer Vol" (at 78.68412 81.788) (layer F.SilkS))
  (gr_text "6 - 16 VDC" (at 5.1816 1.1684) (layer F.SilkS))
  (gr_text PoE (at 1.72974 12.18946) (layer F.SilkS))
  (gr_text "PB16\nD3" (at 62.28842 9.1059 90) (layer F.SilkS))
  (gr_text "PA23\nD0" (at 64.84366 3.67538 90) (layer F.SilkS))
  (gr_text "PA22\nD1" (at 64.82842 9.13638 90) (layer F.SilkS))
  (gr_text VBAT (at 31.88208 10.6426 90) (layer F.SilkS))
  (gr_text GND (at 29.3751 2.22758 90) (layer F.SilkS))
  (gr_text GND (at 29.33954 10.40638 90) (layer F.SilkS))
  (gr_text VJAC (at 34.45764 10.62482 90) (layer F.SilkS))
  (gr_text 3V (at 36.86048 2.70256 90) (layer F.SilkS))
  (gr_text "PA21\nD08" (at 42.11066 3.69062 90) (layer F.SilkS))
  (gr_text "PA02\nA0" (at 67.36588 3.66014 90) (layer F.SilkS))
  (gr_text "PA06\nD16" (at 44.71162 9.13638 90) (layer F.SilkS))
  (gr_text "PA13\nSCK" (at 39.40302 3.61442 90) (layer F.SilkS))
  (gr_text "PA14\nMISO" (at 36.85794 10.50798 90) (layer F.SilkS))
  (gr_text "PA12\nMOSI" (at 39.48938 10.51052 90) (layer F.SilkS))
  (gr_text GND (at 59.63666 2.1717 90) (layer F.SilkS))
  (gr_text SCL (at 47.00524 2.29616 90) (layer F.SilkS))
  (gr_text "PA05\nA1" (at 67.5513 9.0297 90) (layer F.SilkS))
  (gr_text ~RESET (at 42.15892 11.02614 90) (layer F.SilkS))
  (gr_text SDA (at 47.14748 10.49274 90) (layer F.SilkS))
  (gr_line (start 0 82.55) (end 0 0) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 94.742 82.55) (end 0 82.55) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 94.742 0) (end 94.742 82.55) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 0 0) (end 94.742 0) (layer Edge.Cuts) (width 0.05))
  (zone (net 0) (net_name "") (layer F.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.2032))
    (min_thickness 0.254)
    (keepout (tracks not_allowed) (vias not_allowed) (copperpour not_allowed))
    (fill (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 14.63683 59.761835) (xy 16.622713 59.741753) (xy 16.640334 61.048424) (xy 14.654451 61.055806)
      )
    )
  )
  (zone (net 0) (net_name "") (layer F.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.2032))
    (min_thickness 0.254)
    (keepout (tracks not_allowed) (vias not_allowed) (copperpour not_allowed))
    (fill (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 14.835688 62.91817) (xy 16.680088 62.900815) (xy 16.695512 63.438786) (xy 14.841672 63.441329)
      )
    )
  )
  (zone (net 0) (net_name "") (layer F.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.2032))
    (min_thickness 0.254)
    (keepout (tracks not_allowed) (vias not_allowed) (copperpour not_allowed))
    (fill (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 12.108339 53.872289) (xy 14.818837 53.851017) (xy 14.849634 57.308274) (xy 12.123261 57.328911)
      )
    )
  )
  (zone (net 0) (net_name "") (layer F.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.2032))
    (min_thickness 0.254)
    (keepout (tracks not_allowed) (vias not_allowed) (copperpour not_allowed))
    (fill (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 9.25068 53.85308) (xy 10.305892 53.854192) (xy 10.298589 55.482649) (xy 9.23544 55.48376)
      )
    )
  )
  (zone (net 0) (net_name "") (layer F.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.2032))
    (min_thickness 0.254)
    (keepout (tracks not_allowed) (vias not_allowed) (copperpour not_allowed))
    (fill (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 16.714022 63.48408) (xy 16.717169 62.159039) (xy 17.090232 62.148562) (xy 17.08772 63.469158)
      )
    )
  )
  (zone (net 0) (net_name "") (layer F.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.2032))
    (min_thickness 0.254)
    (keepout (tracks not_allowed) (vias not_allowed) (copperpour not_allowed))
    (fill (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 14.622145 61.690885) (xy 14.62024 61.07938) (xy 14.81836 61.0743) (xy 14.826615 61.692155)
      )
    )
  )
  (zone (net 0) (net_name "") (layer F.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.2032))
    (min_thickness 0.254)
    (keepout (tracks not_allowed) (vias not_allowed) (copperpour not_allowed))
    (fill (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 2.709676 28.985345) (xy 3.044034 28.970294) (xy 3.02514 33.53816) (xy 2.682845 33.555434)
      )
    )
  )
  (zone (net 0) (net_name "") (layer F.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.2032))
    (min_thickness 0.254)
    (keepout (tracks not_allowed) (vias not_allowed) (copperpour not_allowed))
    (fill (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 14.596745 63.428245) (xy 14.59992 62.6872) (xy 14.79804 62.68212) (xy 14.801215 63.429515)
      )
    )
  )
  (zone (net 0) (net_name "") (layers F&B.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.2032))
    (min_thickness 0.254)
    (keepout (tracks allowed) (vias allowed) (copperpour not_allowed))
    (fill (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 22.86 23.368) (xy 22.8854 28.2702) (xy 27.7114 28.2702) (xy 27.686 17.78) (xy 24.13 17.78)
        (xy 24.13 23.114)
      )
    )
  )
  (zone (net 1) (net_name GND) (layer F.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.2032))
    (min_thickness 0.254)
    (fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy -0.508 -0.508) (xy 95.25 -0.508) (xy 95.25 83.058) (xy -0.508 83.058)
      )
    )
  )
  (zone (net 1) (net_name GND) (layer B.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.2032))
    (min_thickness 0.254)
    (fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy -0.508 -0.46593) (xy 95.25 -0.46593) (xy 95.25 83.10007) (xy -0.508 83.10007)
      )
    )
  )
)
