(kicad_pcb (version 4) (host pcbnew 4.0.4-stable)
  (general
    (links 89)
    (no_connects 0)
    (area 77.924999 87.924999 208.075001 109.075001)
    (thickness 1.6)
    (drawings 11)
    (tracks 479)
    (zones 0)
    (modules 36)
    (nets 31)
  )
  (page A4)
  (layers
    (0 F.Cu signal)
    (31 B.Cu signal)
    (32 B.Adhes user)
    (33 F.Adhes user)
    (34 B.Paste user)
    (35 F.Paste user)
    (36 B.SilkS user)
    (37 F.SilkS user hide)
    (38 B.Mask user)
    (39 F.Mask user)
    (40 Dwgs.User user)
    (41 Cmts.User user)
    (42 Eco1.User user hide)
    (43 Eco2.User user hide)
    (44 Edge.Cuts user)
    (45 Margin user hide)
    (46 B.CrtYd user hide)
    (47 F.CrtYd user hide)
    (48 B.Fab user hide)
    (49 F.Fab user hide)
  )
  (setup
    (last_trace_width 0.5)
    (user_trace_width 0.16)
    (user_trace_width 0.25)
    (user_trace_width 0.5)
    (user_trace_width 1)
    (trace_clearance 0.2)
    (zone_clearance 0.381)
    (zone_45_only no)
    (trace_min 0.1524)
    (segment_width 0.2)
    (edge_width 0.15)
    (via_size 0.6)
    (via_drill 0.4)
    (via_min_size 0.4)
    (via_min_drill 0.3)
    (uvia_size 0.3)
    (uvia_drill 0.1)
    (uvias_allowed no)
    (uvia_min_size 0.2)
    (uvia_min_drill 0.1)
    (pcb_text_width 0.3)
    (pcb_text_size 1.5 1.5)
    (mod_edge_width 0.15)
    (mod_text_size 1 1)
    (mod_text_width 0.15)
    (pad_size 1.524 1.524)
    (pad_drill 0.762)
    (pad_to_mask_clearance 0.2)
    (aux_axis_origin 0 0)
    (visible_elements FFFFD77F)
    (pcbplotparams
      (layerselection 0x00030_80000001)
      (usegerberextensions false)
      (excludeedgelayer true)
      (linewidth 0.200000)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15)
      (hpglpenoverlay 2)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (padsonsilk false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 1)
      (scaleselection 1)
      (outputdirectory ""))
  )
  (net 0 "")
  (net 1 GND)
  (net 2 /5V)
  (net 3 "Net-(U1-Pad5)")
  (net 4 "Net-(U3-Pad14)")
  (net 5 "Net-(U3-Pad36)")
  (net 6 /3V3)
  (net 7 /A12)
  (net 8 /A13)
  (net 9 /A11)
  (net 10 /A10)
  (net 11 /DAC)
  (net 12 /Half3v3)
  (net 13 /VSense2)
  (net 14 /VSense1)
  (net 15 /CurDriveA)
  (net 16 /CurDriveB)
  (net 17 /CurSense1)
  (net 18 "Net-(P3-Pad1)")
  (net 19 /SCL)
  (net 20 /SDA)
  (net 21 /A0)
  (net 22 /BATP)
  (net 23 /compensation)
  (net 24 /compensationC)
  (net 25 /Switching)
  (net 26 /U6gain)
  (net 27 /U8gain)
  (net 28 /Tbridge)
  (net 29 /U6gain2)
  (net 30 /U8gain2)
  (net_class Default "This is the default net class."
    (clearance 0.2)
    (trace_width 0.25)
    (via_dia 0.6)
    (via_drill 0.4)
    (uvia_dia 0.3)
    (uvia_drill 0.1)
    (add_net /A0)
    (add_net /A10)
    (add_net /A11)
    (add_net /A12)
    (add_net /A13)
    (add_net /CurSense1)
    (add_net /DAC)
    (add_net /SCL)
    (add_net /SDA)
    (add_net /Switching)
    (add_net /Tbridge)
    (add_net /U6gain)
    (add_net /U6gain2)
    (add_net /U8gain)
    (add_net /U8gain2)
    (add_net /VSense1)
    (add_net /VSense2)
    (add_net /compensation)
    (add_net /compensationC)
    (add_net "Net-(P3-Pad1)")
    (add_net "Net-(U1-Pad5)")
    (add_net "Net-(U3-Pad14)")
    (add_net "Net-(U3-Pad36)")
  )
  (net_class semiwide ""
    (clearance 0.2)
    (trace_width 0.5)
    (via_dia 0.6)
    (via_drill 0.4)
    (uvia_dia 0.3)
    (uvia_drill 0.1)
    (add_net /CurDriveA)
    (add_net /CurDriveB)
    (add_net /Half3v3)
  )
  (net_class wide ""
    (clearance 0.2)
    (trace_width 1)
    (via_dia 0.6)
    (via_drill 0.4)
    (uvia_dia 0.3)
    (uvia_drill 0.1)
    (add_net /3V3)
    (add_net /5V)
    (add_net /BATP)
    (add_net GND)
  )
  (module my_footprints:teensy31 (layer B.Cu) (tedit 583FB4AB)
    (at 150 97.6 270)
    (fp_text reference U3 (at 0 -20.32 270) (layer B.SilkS))
    (fp_text value Teensy3.1 (at 0.6 -4.8 270) (layer B.SilkS))
    (fp_text user USB (at 0 0 270) (layer B.SilkS))
    (fp_text user Aref (at 1.905 -7.62 270) (layer B.SilkS))
    (fp_text user A10 (at 1.905 -10.16 270) (layer B.SilkS))
    (fp_text user A11 (at 1.905 -12.7 270) (layer B.SilkS))
    (fp_text user A13 (at 3.81 -17.145 270) (layer B.SilkS))
    (fp_text user A12 (at -1.27 -17.145 270) (layer B.SilkS))
    (fp_text user DAC (at 5.08 -30.48 540) (layer B.SilkS))
    (pad 40 thru_hole circle (at -1.27 -15.24 270) (size 1.50114 1.50114) (drill 1.00076) (layers *.Cu *.Mask B.SilkS)
      (net 7 /A12))
    (pad 41 thru_hole circle (at 3.81 -15.24 270) (size 1.50114 1.50114) (drill 1.00076) (layers *.Cu *.Mask B.SilkS)
      (net 8 /A13))
    (pad 1 thru_hole circle (at -7.62 0 270) (size 1.50114 1.50114) (drill 1.00076) (layers *.Cu *.Mask B.SilkS)
      (net 1 GND))
    (pad 14 thru_hole circle (at -7.62 -33.02 270) (size 1.50114 1.50114) (drill 1.00076) (layers *.Cu *.Mask B.SilkS)
      (net 4 "Net-(U3-Pad14)"))
    (pad 21 thru_hole circle (at 7.62 -30.48 270) (size 1.50114 1.50114) (drill 1.00076) (layers *.Cu *.Mask B.SilkS)
      (net 21 /A0))
    (pad 25 thru_hole circle (at 7.62 -20.32 270) (size 1.50114 1.50114) (drill 1.00076) (layers *.Cu *.Mask B.SilkS)
      (net 20 /SDA))
    (pad 26 thru_hole circle (at 7.62 -17.78 270) (size 1.50114 1.50114) (drill 1.00076) (layers *.Cu *.Mask B.SilkS)
      (net 19 /SCL))
    (pad 34 thru_hole circle (at 5.08 -12.7 270) (size 1.50114 1.50114) (drill 1.00076) (layers *.Cu *.Mask B.SilkS)
      (net 9 /A11))
    (pad 35 thru_hole circle (at 5.08 -10.16 270) (size 1.50114 1.50114) (drill 1.00076) (layers *.Cu *.Mask B.SilkS)
      (net 10 /A10))
    (pad 36 thru_hole circle (at 5.08 -7.62 270) (size 1.50114 1.50114) (drill 1.00076) (layers *.Cu *.Mask B.SilkS)
      (net 5 "Net-(U3-Pad36)"))
    (pad 31 thru_hole circle (at 7.62 -5.08 270) (size 1.50114 1.50114) (drill 1.00076) (layers *.Cu *.Mask B.SilkS)
      (net 18 "Net-(P3-Pad1)"))
    (pad 33 thru_hole circle (at 7.62 0 270) (size 1.50114 1.50114) (drill 1.00076) (layers *.Cu *.Mask B.SilkS)
      (net 2 /5V))
    (pad 19 thru_hole circle (at 5.08 -33.02 270) (size 1.50114 1.50114) (drill 1.00076) (layers *.Cu *.Mask B.SilkS)
      (net 11 /DAC))
  )
  (module Capacitors_ThroughHole:C_Radial_D5_L11_P2 (layer F.Cu) (tedit 583EE5FE)
    (at 126.3 100.7)
    (descr "Radial Electrolytic Capacitor 5mm x Length 11mm, Pitch 2mm")
    (tags "Electrolytic Capacitor")
    (fp_text reference C1 (at -1.8 -2.3 90) (layer F.SilkS))
    (fp_text value 220uF (at -2.3 0.8 90) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0) (size 1.3 1.3) (drill 0.8) (layers *.Cu *.Mask)
      (net 22 /BATP))
    (pad 2 thru_hole circle (at 2 0) (size 1.3 1.3) (drill 0.8) (layers *.Cu *.Mask)
      (net 1 GND))
    (model Capacitors_ThroughHole.3dshapes/C_Radial_D5_L11_P2.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_ThroughHole:C_Radial_D5_L11_P2 (layer F.Cu) (tedit 583EE689)
    (at 134 102 90)
    (descr "Radial Electrolytic Capacitor 5mm x Length 11mm, Pitch 2mm")
    (tags "Electrolytic Capacitor")
    (fp_text reference C5 (at -0.8 -3.1 180) (layer F.SilkS))
    (fp_text value 220uF (at -2.2 1.1 180) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0 90) (size 1.3 1.3) (drill 0.8) (layers *.Cu *.Mask)
      (net 2 /5V))
    (pad 2 thru_hole circle (at 2 0 90) (size 1.3 1.3) (drill 0.8) (layers *.Cu *.Mask)
      (net 1 GND))
    (model Capacitors_ThroughHole.3dshapes/C_Radial_D5_L11_P2.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_ThroughHole:C_Radial_D5_L11_P2 (layer F.Cu) (tedit 583EE6E8)
    (at 145.6 91.8 180)
    (descr "Radial Electrolytic Capacitor 5mm x Length 11mm, Pitch 2mm")
    (tags "Electrolytic Capacitor")
    (fp_text reference C6 (at -1.6 2.5 180) (layer F.SilkS))
    (fp_text value 22uF (at -1.1 -3.6 180) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0 180) (size 1.3 1.3) (drill 0.8) (layers *.Cu *.Mask)
      (net 6 /3V3))
    (pad 2 thru_hole circle (at 2 0 180) (size 1.3 1.3) (drill 0.8) (layers *.Cu *.Mask)
      (net 1 GND))
    (model Capacitors_ThroughHole.3dshapes/C_Radial_D5_L11_P2.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module TO_SOT_Packages_SMD:SOT-23_Handsoldering (layer F.Cu) (tedit 583F903F)
    (at 143.9 98.4)
    (descr "SOT-23, Handsoldering")
    (tags SOT-23)
    (attr smd)
    (fp_text reference U2 (at 2.7 -0.4) (layer F.SilkS))
    (fp_text value Reg3.3 (at 1.8 4) (layer F.SilkS))
    (pad 1 smd rect (at -0.95 1.50114) (size 0.8001 1.80086) (layers F.Cu F.Paste F.Mask)
      (net 2 /5V))
    (pad 2 smd rect (at 0.95 1.50114) (size 0.8001 1.80086) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 3 smd rect (at 0 -1.50114) (size 0.8001 1.80086) (layers F.Cu F.Paste F.Mask)
      (net 6 /3V3))
    (model TO_SOT_Packages_SMD.3dshapes/SOT-23_Handsoldering.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module my_footprints:bh123a (layer F.Cu) (tedit 583EE988)
    (at 100.5 98.5 180)
    (fp_text reference BT1 (at -5.99948 0 180) (layer F.SilkS))
    (fp_text value "Battery CR123" (at 8.6 5.5 180) (layer F.SilkS))
    (fp_text user + (at 10.50036 0 180) (layer F.SilkS))
    (fp_text user - (at -11.99896 0 180) (layer F.SilkS))
    (pad 1 thru_hole circle (at 18.98396 0 180) (size 2.90068 2.90068) (drill 1.56972) (layers *.Cu *.Mask F.SilkS)
      (net 22 /BATP))
    (pad 2 thru_hole circle (at -18.98396 0 180) (size 2.90068 2.90068) (drill 1.56972) (layers *.Cu *.Mask F.SilkS)
      (net 1 GND))
    (pad 3 thru_hole circle (at 19.58086 6.37032 180) (size 1.99898 1.99898) (drill 1.56972) (layers *.Cu *.Mask F.SilkS))
  )
  (module Housings_SOIC:SOIC-8_3.9x4.9mm_Pitch1.27mm (layer F.Cu) (tedit 583F9072)
    (at 135.1 94.7 180)
    (descr "8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC] (see Microchip Packaging Specification 00000049BS.pdf)")
    (tags "SOIC 1.27")
    (attr smd)
    (fp_text reference U1 (at -1.1 -1.5 270) (layer F.SilkS))
    (fp_text value LT1302 (at 0.3 -0.1 270) (layer F.SilkS))
    (pad 1 smd rect (at -2.7 -1.905 180) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 2 smd rect (at -2.7 -0.635 180) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 23 /compensation))
    (pad 3 smd rect (at -2.7 0.635 180) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 4 smd rect (at -2.7 1.905 180) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 2 /5V))
    (pad 5 smd rect (at 2.7 1.905 180) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 3 "Net-(U1-Pad5)"))
    (pad 6 smd rect (at 2.7 0.635 180) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 22 /BATP))
    (pad 7 smd rect (at 2.7 -0.635 180) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 25 /Switching))
    (pad 8 smd rect (at 2.7 -1.905 180) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (model Housings_SOIC.3dshapes/SOIC-8_3.9x4.9mm_Pitch1.27mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Housings_SOIC:SOIC-8_3.9x4.9mm_Pitch1.27mm (layer F.Cu) (tedit 583F9154)
    (at 167.8 92 180)
    (descr "8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC] (see Microchip Packaging Specification 00000049BS.pdf)")
    (tags "SOIC 1.27")
    (attr smd)
    (fp_text reference U4 (at -1.1 -1.6 270) (layer F.SilkS))
    (fp_text value opamp (at 1 0 270) (layer F.SilkS))
    (pad 1 smd rect (at -2.7 -1.905 180) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 17 /CurSense1))
    (pad 2 smd rect (at -2.7 -0.635 180) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 17 /CurSense1))
    (pad 3 smd rect (at -2.7 0.635 180) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 11 /DAC))
    (pad 4 smd rect (at -2.7 1.905 180) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 5 smd rect (at 2.7 1.905 180) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 12 /Half3v3))
    (pad 6 smd rect (at 2.7 0.635 180) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 16 /CurDriveB))
    (pad 7 smd rect (at 2.7 -0.635 180) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 16 /CurDriveB))
    (pad 8 smd rect (at 2.7 -1.905 180) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 6 /3V3))
    (model Housings_SOIC.3dshapes/SOIC-8_3.9x4.9mm_Pitch1.27mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Housings_SOIC:SOIC-8_3.9x4.9mm_Pitch1.27mm (layer F.Cu) (tedit 583F91C4)
    (at 185.6 94.6)
    (descr "8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC] (see Microchip Packaging Specification 00000049BS.pdf)")
    (tags "SOIC 1.27")
    (attr smd)
    (fp_text reference U5 (at -0.8 -1.5 90) (layer F.SilkS))
    (fp_text value opamp (at 0.4 0 90) (layer F.SilkS))
    (pad 1 smd rect (at -2.7 -1.905) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 8 /A13))
    (pad 2 smd rect (at -2.7 -0.635) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 8 /A13))
    (pad 3 smd rect (at -2.7 0.635) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 15 /CurDriveA))
    (pad 4 smd rect (at -2.7 1.905) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 5 smd rect (at 2.7 1.905) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 17 /CurSense1))
    (pad 6 smd rect (at 2.7 0.635) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 7 /A12))
    (pad 7 smd rect (at 2.7 -0.635) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 7 /A12))
    (pad 8 smd rect (at 2.7 -1.905) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 6 /3V3))
    (model Housings_SOIC.3dshapes/SOIC-8_3.9x4.9mm_Pitch1.27mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Housings_SOIC:SOIC-8_3.9x4.9mm_Pitch1.27mm (layer F.Cu) (tedit 583F9200)
    (at 199.1 93.6 180)
    (descr "8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC] (see Microchip Packaging Specification 00000049BS.pdf)")
    (tags "SOIC 1.27")
    (attr smd)
    (fp_text reference U6 (at -1.1 -1.5 270) (layer F.SilkS))
    (fp_text value AD623 (at 0.6 0 270) (layer F.SilkS))
    (pad 1 smd rect (at -2.7 -1.905 180) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 29 /U6gain2))
    (pad 2 smd rect (at -2.7 -0.635 180) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 13 /VSense2))
    (pad 3 smd rect (at -2.7 0.635 180) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 14 /VSense1))
    (pad 4 smd rect (at -2.7 1.905 180) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 5 smd rect (at 2.7 1.905 180) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 9 /A11))
    (pad 6 smd rect (at 2.7 0.635 180) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 10 /A10))
    (pad 7 smd rect (at 2.7 -0.635 180) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 6 /3V3))
    (pad 8 smd rect (at 2.7 -1.905 180) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 26 /U6gain))
    (model Housings_SOIC.3dshapes/SOIC-8_3.9x4.9mm_Pitch1.27mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Housings_SOIC:SOIC-8_3.9x4.9mm_Pitch1.27mm (layer F.Cu) (tedit 583FB3AC)
    (at 199 103.2)
    (descr "8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC] (see Microchip Packaging Specification 00000049BS.pdf)")
    (tags "SOIC 1.27")
    (attr smd)
    (fp_text reference U7 (at -0.9 -1.4 90) (layer F.SilkS))
    (fp_text value opamp (at 0.4 0 90) (layer F.SilkS))
    (pad 1 smd rect (at -2.7 -1.905) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 9 /A11))
    (pad 2 smd rect (at -2.7 -0.635) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 9 /A11))
    (pad 3 smd rect (at -2.7 0.635) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 12 /Half3v3))
    (pad 4 smd rect (at -2.7 1.905) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 5 smd rect (at 2.7 1.905) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask))
    (pad 6 smd rect (at 2.7 0.635) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask))
    (pad 7 smd rect (at 2.7 -0.635) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask))
    (pad 8 smd rect (at 2.7 -1.905) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 6 /3V3))
    (model Housings_SOIC.3dshapes/SOIC-8_3.9x4.9mm_Pitch1.27mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Discret:D4 (layer F.Cu) (tedit 583EE564)
    (at 128.8 106)
    (descr "Diode 4 pas")
    (tags "DIODE DEV")
    (fp_text reference D1 (at 0 0) (layer F.SilkS))
    (fp_text value D_Schottky_Small (at 0.5 2.5) (layer F.Fab) hide)
    (pad 2 thru_hole circle (at -5.08 0) (size 1.778 1.778) (drill 1.016) (layers *.Cu *.Mask)
      (net 25 /Switching))
    (pad 1 thru_hole rect (at 5.08 0) (size 1.778 1.778) (drill 1.016) (layers *.Cu *.Mask)
      (net 2 /5V))
    (model Discret.3dshapes/D4.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.4 0.4 0.4))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_ThroughHole:C_Radial_D7.5_L11.2_P2.5 (layer F.Cu) (tedit 583EE4FC)
    (at 126.5 92 270)
    (descr "Radial Electrolytic Capacitor Diameter 7.5mm x Length 11.2mm, Pitch 2.5mm")
    (tags "Electrolytic Capacitor")
    (fp_text reference L1 (at 0.2 2.2 360) (layer F.SilkS))
    (fp_text value 10uH (at -1.9 2.3 360) (layer F.Fab))
    (pad 2 thru_hole circle (at 2.5 0 270) (size 1.3 1.3) (drill 0.8) (layers *.Cu *.Mask)
      (net 25 /Switching))
    (pad 1 thru_hole rect (at 0 0 270) (size 1.3 1.3) (drill 0.8) (layers *.Cu *.Mask)
      (net 22 /BATP))
    (model Capacitors_ThroughHole.3dshapes/C_Radial_D7.5_L11.2_P2.5.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_ThroughHole:Resistor_Horizontal_RM7mm (layer F.Cu) (tedit 583F91F2)
    (at 193.7 90 180)
    (descr "Resistor, Axial,  RM 7.62mm, 1/3W,")
    (tags "Resistor Axial RM 7.62mm 1/3W R3")
    (fp_text reference R3 (at 5.3 0.3 180) (layer F.SilkS))
    (fp_text value 500 (at 2.9 -0.4 180) (layer F.SilkS))
    (pad 1 thru_hole circle (at 0 0 180) (size 1.99898 1.99898) (drill 1.00076) (layers *.Cu *.SilkS *.Mask)
      (net 17 /CurSense1))
    (pad 2 thru_hole circle (at 7.62 0 180) (size 1.99898 1.99898) (drill 1.00076) (layers *.Cu *.SilkS *.Mask)
      (net 15 /CurDriveA))
  )
  (module Pin_Headers:Pin_Header_Straight_1x02 (layer F.Cu) (tedit 583FB453)
    (at 205.9 93.4 180)
    (descr "Through hole pin header")
    (tags "pin header")
    (fp_text reference P1 (at -0.1 4.5 180) (layer F.SilkS) hide)
    (fp_text value Vsens (at 2.4 0.3 270) (layer F.SilkS))
    (pad 1 thru_hole rect (at 0 0 180) (size 2.032 2.032) (drill 1.016) (layers *.Cu *.Mask)
      (net 13 /VSense2))
    (pad 2 thru_hole oval (at 0 2.54 180) (size 2.032 2.032) (drill 1.016) (layers *.Cu *.Mask)
      (net 14 /VSense1))
    (model Pin_Headers.3dshapes/Pin_Header_Straight_1x02.wrl
      (at (xyz 0 -0.05 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 90))
    )
  )
  (module Pin_Headers:Pin_Header_Straight_1x02 (layer F.Cu) (tedit 583FB461)
    (at 177.2 90.9 270)
    (descr "Through hole pin header")
    (tags "pin header")
    (fp_text reference P2 (at -0.6 4.6 270) (layer F.SilkS) hide)
    (fp_text value CondDrive (at 1.9 -2.4 270) (layer F.SilkS))
    (pad 1 thru_hole rect (at 0 0 270) (size 2.032 2.032) (drill 1.016) (layers *.Cu *.Mask)
      (net 15 /CurDriveA))
    (pad 2 thru_hole oval (at 0 2.54 270) (size 2.032 2.032) (drill 1.016) (layers *.Cu *.Mask)
      (net 16 /CurDriveB))
    (model Pin_Headers.3dshapes/Pin_Header_Straight_1x02.wrl
      (at (xyz 0 -0.05 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 90))
    )
  )
  (module Pin_Headers:Pin_Header_Straight_1x04 (layer F.Cu) (tedit 583F913F)
    (at 154.2 90.6 90)
    (descr "Through hole pin header")
    (tags "pin header")
    (fp_text reference "V SCL SDA G" (at -2.3 3 180) (layer F.SilkS))
    (fp_text value Press (at -0.4 -2.3 90) (layer F.SilkS))
    (pad 1 thru_hole rect (at 0 0 90) (size 2.032 1.7272) (drill 1.016) (layers *.Cu *.Mask)
      (net 18 "Net-(P3-Pad1)"))
    (pad 2 thru_hole oval (at 0 2.54 90) (size 2.032 1.7272) (drill 1.016) (layers *.Cu *.Mask)
      (net 19 /SCL))
    (pad 3 thru_hole oval (at 0 5.08 90) (size 2.032 1.7272) (drill 1.016) (layers *.Cu *.Mask)
      (net 20 /SDA))
    (pad 4 thru_hole oval (at 0 7.62 90) (size 2.032 1.7272) (drill 1.016) (layers *.Cu *.Mask)
      (net 1 GND))
    (model Pin_Headers.3dshapes/Pin_Header_Straight_1x04.wrl
      (at (xyz 0 -0.15 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 90))
    )
  )
  (module Pin_Headers:Pin_Header_Straight_1x02 (layer F.Cu) (tedit 583FB335)
    (at 206 99.9 180)
    (descr "Through hole pin header")
    (tags "pin header")
    (fp_text reference P4 (at 1.8 -2.5 180) (layer F.SilkS) hide)
    (fp_text value RTD (at 2.2 1.9 270) (layer F.SilkS))
    (pad 1 thru_hole rect (at 0 0 180) (size 2.032 2.032) (drill 1.016) (layers *.Cu *.Mask)
      (net 28 /Tbridge))
    (pad 2 thru_hole oval (at 0 2.54 180) (size 2.032 2.032) (drill 1.016) (layers *.Cu *.Mask)
      (net 6 /3V3))
    (model Pin_Headers.3dshapes/Pin_Header_Straight_1x02.wrl
      (at (xyz 0 -0.05 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 90))
    )
  )
  (module Housings_SOIC:SOIC-8_3.9x4.9mm_Pitch1.27mm (layer F.Cu) (tedit 583FB3E4)
    (at 189.6 103.3 180)
    (descr "8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC] (see Microchip Packaging Specification 00000049BS.pdf)")
    (tags "SOIC 1.27")
    (attr smd)
    (fp_text reference U8 (at -1.1 -1.5 270) (layer F.SilkS))
    (fp_text value AD623 (at 0.5 0 270) (layer F.SilkS))
    (pad 1 smd rect (at -2.7 -1.905 180) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 30 /U8gain2))
    (pad 2 smd rect (at -2.7 -0.635 180) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 12 /Half3v3))
    (pad 3 smd rect (at -2.7 0.635 180) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 28 /Tbridge))
    (pad 4 smd rect (at -2.7 1.905 180) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 5 smd rect (at 2.7 1.905 180) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 6 smd rect (at 2.7 0.635 180) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 21 /A0))
    (pad 7 smd rect (at 2.7 -0.635 180) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 6 /3V3))
    (pad 8 smd rect (at 2.7 -1.905 180) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask)
      (net 27 /U8gain))
    (model Housings_SOIC.3dshapes/SOIC-8_3.9x4.9mm_Pitch1.27mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0805_HandSoldering (layer F.Cu) (tedit 583EE52A)
    (at 132.8 90)
    (descr "Capacitor SMD 0805, hand soldering")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C2 (at 3.3 -0.9) (layer F.SilkS))
    (fp_text value 0.1uF (at 6.6 -0.9) (layer F.Fab))
    (pad 1 smd rect (at -1.25 0) (size 1.5 1.25) (layers F.Cu F.Paste F.Mask)
      (net 22 /BATP))
    (pad 2 smd rect (at 1.25 0) (size 1.5 1.25) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (model Capacitors_SMD.3dshapes/C_0805_HandSoldering.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0805_HandSoldering (layer F.Cu) (tedit 583EE6AA)
    (at 139.6 102.6 180)
    (descr "Capacitor SMD 0805, hand soldering")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C3 (at 0.1 3.2 180) (layer F.SilkS))
    (fp_text value 0.1uF (at -0.4 1.8 180) (layer F.Fab))
    (pad 1 smd rect (at -1.25 0 180) (size 1.5 1.25) (layers F.Cu F.Paste F.Mask)
      (net 24 /compensationC))
    (pad 2 smd rect (at 1.25 0 180) (size 1.5 1.25) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (model Capacitors_SMD.3dshapes/C_0805_HandSoldering.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0805_HandSoldering (layer F.Cu) (tedit 583EE61F)
    (at 138 106)
    (descr "Capacitor SMD 0805, hand soldering")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C4 (at 3.2 0.4) (layer F.SilkS))
    (fp_text value 0.1uF (at 6.5 0.4) (layer F.Fab))
    (pad 1 smd rect (at -1.25 0) (size 1.5 1.25) (layers F.Cu F.Paste F.Mask)
      (net 2 /5V))
    (pad 2 smd rect (at 1.25 0) (size 1.5 1.25) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (model Capacitors_SMD.3dshapes/C_0805_HandSoldering.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0805_HandSoldering (layer F.Cu) (tedit 583FB413)
    (at 195.4 107.5)
    (descr "Capacitor SMD 0805, hand soldering")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C7 (at -1.1 -1.5) (layer F.SilkS))
    (fp_text value 0.1uF (at 0 2.3) (layer F.Fab))
    (pad 1 smd rect (at -1.25 0) (size 1.5 1.25) (layers F.Cu F.Paste F.Mask)
      (net 12 /Half3v3))
    (pad 2 smd rect (at 1.25 0) (size 1.5 1.25) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (model Capacitors_SMD.3dshapes/C_0805_HandSoldering.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0805_HandSoldering (layer F.Cu) (tedit 583EE7B3)
    (at 162.4 95 270)
    (descr "Capacitor SMD 0805, hand soldering")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C8 (at 3 0 360) (layer F.SilkS))
    (fp_text value 0.1uF (at 0 1.8 270) (layer F.Fab))
    (pad 1 smd rect (at -1.25 0 270) (size 1.5 1.25) (layers F.Cu F.Paste F.Mask)
      (net 6 /3V3))
    (pad 2 smd rect (at 1.25 0 270) (size 1.5 1.25) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (model Capacitors_SMD.3dshapes/C_0805_HandSoldering.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0805_HandSoldering (layer F.Cu) (tedit 583F9161)
    (at 169.1 96.1)
    (descr "Resistor SMD 0805, hand soldering")
    (tags "resistor 0805")
    (attr smd)
    (fp_text reference R1 (at -1.3 1.9) (layer F.SilkS))
    (fp_text value 50k (at 1.5 1.9) (layer F.SilkS))
    (pad 1 smd rect (at -1.35 0) (size 1.5 1.3) (layers F.Cu F.Paste F.Mask)
      (net 6 /3V3))
    (pad 2 smd rect (at 1.35 0) (size 1.5 1.3) (layers F.Cu F.Paste F.Mask)
      (net 12 /Half3v3))
    (model Resistors_SMD.3dshapes/R_0805_HandSoldering.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0805_HandSoldering (layer F.Cu) (tedit 583F9170)
    (at 174.9 94)
    (descr "Resistor SMD 0805, hand soldering")
    (tags "resistor 0805")
    (attr smd)
    (fp_text reference R2 (at -1.2 1.8) (layer F.SilkS))
    (fp_text value 50k (at 1.6 1.8) (layer F.SilkS))
    (pad 1 smd rect (at -1.35 0) (size 1.5 1.3) (layers F.Cu F.Paste F.Mask)
      (net 12 /Half3v3))
    (pad 2 smd rect (at 1.35 0) (size 1.5 1.3) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (model Resistors_SMD.3dshapes/R_0805_HandSoldering.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0805_HandSoldering (layer F.Cu) (tedit 583F920F)
    (at 199.5 89.5)
    (descr "Resistor SMD 0805, hand soldering")
    (tags "resistor 0805")
    (attr smd)
    (fp_text reference R4 (at -3.2 0 90) (layer F.SilkS))
    (fp_text value 10k (at 3.2 0.1 90) (layer F.SilkS))
    (pad 1 smd rect (at -1.35 0) (size 1.5 1.3) (layers F.Cu F.Paste F.Mask)
      (net 26 /U6gain))
    (pad 2 smd rect (at 1.35 0) (size 1.5 1.3) (layers F.Cu F.Paste F.Mask)
      (net 29 /U6gain2))
    (model Resistors_SMD.3dshapes/R_0805_HandSoldering.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0805_HandSoldering (layer F.Cu) (tedit 583F908C)
    (at 152.8 95.8 90)
    (descr "Resistor SMD 0805, hand soldering")
    (tags "resistor 0805")
    (attr smd)
    (fp_text reference R5 (at 0.1 -1.7 90) (layer F.SilkS))
    (fp_text value 10k (at -3.1 -0.7 180) (layer F.SilkS))
    (pad 1 smd rect (at -1.35 0 90) (size 1.5 1.3) (layers F.Cu F.Paste F.Mask)
      (net 18 "Net-(P3-Pad1)"))
    (pad 2 smd rect (at 1.35 0 90) (size 1.5 1.3) (layers F.Cu F.Paste F.Mask)
      (net 19 /SCL))
    (model Resistors_SMD.3dshapes/R_0805_HandSoldering.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0805_HandSoldering (layer F.Cu) (tedit 583F9095)
    (at 155.6 95.8 90)
    (descr "Resistor SMD 0805, hand soldering")
    (tags "resistor 0805")
    (attr smd)
    (fp_text reference R6 (at 0 1.8 90) (layer F.SilkS))
    (fp_text value 10k (at -3.2 0.2 180) (layer F.SilkS))
    (pad 1 smd rect (at -1.35 0 90) (size 1.5 1.3) (layers F.Cu F.Paste F.Mask)
      (net 18 "Net-(P3-Pad1)"))
    (pad 2 smd rect (at 1.35 0 90) (size 1.5 1.3) (layers F.Cu F.Paste F.Mask)
      (net 20 /SDA))
    (model Resistors_SMD.3dshapes/R_0805_HandSoldering.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0805_HandSoldering (layer F.Cu) (tedit 583FB3BC)
    (at 206.3 104.8 270)
    (descr "Resistor SMD 0805, hand soldering")
    (tags "resistor 0805")
    (attr smd)
    (fp_text reference R7 (at 1.3 1.8 270) (layer F.SilkS))
    (fp_text value 90k (at -1.2 1.8 270) (layer F.SilkS))
    (pad 1 smd rect (at -1.35 0 270) (size 1.5 1.3) (layers F.Cu F.Paste F.Mask)
      (net 28 /Tbridge))
    (pad 2 smd rect (at 1.35 0 270) (size 1.5 1.3) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (model Resistors_SMD.3dshapes/R_0805_HandSoldering.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0805_HandSoldering (layer F.Cu) (tedit 583FB431)
    (at 189.9 107.5)
    (descr "Resistor SMD 0805, hand soldering")
    (tags "resistor 0805")
    (attr smd)
    (fp_text reference R8 (at -3.1 0 90) (layer F.SilkS))
    (fp_text value 10k (at -4.4 -0.3 90) (layer F.SilkS))
    (pad 1 smd rect (at -1.35 0) (size 1.5 1.3) (layers F.Cu F.Paste F.Mask)
      (net 27 /U8gain))
    (pad 2 smd rect (at 1.35 0) (size 1.5 1.3) (layers F.Cu F.Paste F.Mask)
      (net 30 /U8gain2))
    (model Resistors_SMD.3dshapes/R_0805_HandSoldering.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0805_HandSoldering (layer F.Cu) (tedit 583EE6D0)
    (at 140.4 93.8 270)
    (descr "Resistor SMD 0805, hand soldering")
    (tags "resistor 0805")
    (attr smd)
    (fp_text reference R9 (at -3 0 360) (layer F.SilkS))
    (fp_text value 22k1 (at 3.2 -0.4 360) (layer F.Fab))
    (pad 1 smd rect (at -1.35 0 270) (size 1.5 1.3) (layers F.Cu F.Paste F.Mask)
      (net 23 /compensation))
    (pad 2 smd rect (at 1.35 0 270) (size 1.5 1.3) (layers F.Cu F.Paste F.Mask)
      (net 24 /compensationC))
    (model Resistors_SMD.3dshapes/R_0805_HandSoldering.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0805_HandSoldering (layer F.Cu) (tedit 583FB3CC)
    (at 200.4 107.5 180)
    (descr "Capacitor SMD 0805, hand soldering")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C9 (at -3.3 -0.5 180) (layer F.SilkS))
    (fp_text value 0.1uF (at -0.4 -2.3 180) (layer F.Fab))
    (pad 1 smd rect (at -1.25 0 180) (size 1.5 1.25) (layers F.Cu F.Paste F.Mask)
      (net 6 /3V3))
    (pad 2 smd rect (at 1.25 0 180) (size 1.5 1.25) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (model Capacitors_SMD.3dshapes/C_0805_HandSoldering.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0805_HandSoldering (layer F.Cu) (tedit 583FB41E)
    (at 183.5 106.4 90)
    (descr "Capacitor SMD 0805, hand soldering")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C10 (at -0.8 -2.4 180) (layer F.SilkS))
    (fp_text value 0.1uF (at -3.6 -0.1 180) (layer F.Fab))
    (pad 1 smd rect (at -1.25 0 90) (size 1.5 1.25) (layers F.Cu F.Paste F.Mask)
      (net 6 /3V3))
    (pad 2 smd rect (at 1.25 0 90) (size 1.5 1.25) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (model Capacitors_SMD.3dshapes/C_0805_HandSoldering.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0805_HandSoldering (layer F.Cu) (tedit 583FB391)
    (at 198.8 97.6)
    (descr "Capacitor SMD 0805, hand soldering")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C11 (at -3 0.2 90) (layer F.SilkS))
    (fp_text value 0.1uF (at 0.2 1.7) (layer F.Fab))
    (pad 1 smd rect (at -1.25 0) (size 1.5 1.25) (layers F.Cu F.Paste F.Mask)
      (net 6 /3V3))
    (pad 2 smd rect (at 1.25 0) (size 1.5 1.25) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (model Capacitors_SMD.3dshapes/C_0805_HandSoldering.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0805_HandSoldering (layer F.Cu) (tedit 583EE8E5)
    (at 191.5 94.6 90)
    (descr "Capacitor SMD 0805, hand soldering")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C12 (at -3 0.1 180) (layer F.SilkS))
    (fp_text value 0.1uF (at 0 2.1 90) (layer F.Fab))
    (pad 1 smd rect (at -1.25 0 90) (size 1.5 1.25) (layers F.Cu F.Paste F.Mask)
      (net 6 /3V3))
    (pad 2 smd rect (at 1.25 0 90) (size 1.5 1.25) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (model Capacitors_SMD.3dshapes/C_0805_HandSoldering.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (gr_text "rev5020 minictd dev board" (at 99 104.2) (layer B.SilkS))
  (gr_text "Track width 4mil (better 6mil)\nTrack spacing 4mil (better 6mil)\nVia and pad spacing 4mil (better 6mil)\nSilkscreen height 23mil / 0.5842mm\n       thickness 4mil / 0.1016mm\nBetween pad and silkscreen: 0.1524mm / 6mil\nDrilled hole: 0.2mm to 6.5mm\nMin width of solder mask: 0.1mm\nMin distance between solder mask: 0.13mm\ncircuit to edge: 0.2mm (thin blue line)\n" (at 188.9 68.3) (layer Cmts.User))
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  (gr_line (start 208 88) (end 208 109) (angle 90) (layer Edge.Cuts) (width 0.15))
  (gr_line (start 78 88) (end 78 109) (angle 90) (layer Edge.Cuts) (width 0.15))
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        (xy 137.6 88.6) (xy 158.5 88.6)
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  (zone (net 1) (net_name GND) (layer B.Cu) (hatch edge 0.508)
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