(kicad_pcb (version 20221018) (generator pcbnew)
  (general
    (thickness 1.6)
  )
  (paper "A4")
  (layers
    (0 "F.Cu" signal)
    (31 "B.Cu" signal)
    (32 "B.Adhes" user "B.Adhesive")
    (33 "F.Adhes" user "F.Adhesive")
    (34 "B.Paste" user)
    (35 "F.Paste" user)
    (36 "B.SilkS" user "B.Silkscreen")
    (37 "F.SilkS" user "F.Silkscreen")
    (38 "B.Mask" user)
    (39 "F.Mask" user)
    (40 "Dwgs.User" user "User.Drawings")
    (41 "Cmts.User" user "User.Comments")
    (42 "Eco1.User" user "User.Eco1")
    (43 "Eco2.User" user "User.Eco2")
    (44 "Edge.Cuts" user)
    (45 "Margin" user)
    (46 "B.CrtYd" user "B.Courtyard")
    (47 "F.CrtYd" user "F.Courtyard")
    (48 "B.Fab" user)
    (49 "F.Fab" user)
    (50 "User.1" user)
    (51 "User.2" user)
    (52 "User.3" user)
    (53 "User.4" user)
    (54 "User.5" user)
    (55 "User.6" user)
    (56 "User.7" user)
    (57 "User.8" user)
    (58 "User.9" user)
  )
  (setup
    (stackup
      (layer "F.SilkS" (type "Top Silk Screen"))
      (layer "F.Paste" (type "Top Solder Paste"))
      (layer "F.Mask" (type "Top Solder Mask") (thickness 0.01))
      (layer "F.Cu" (type "copper") (thickness 0.035))
      (layer "dielectric 1" (type "core") (thickness 1.51) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
      (layer "B.Cu" (type "copper") (thickness 0.035))
      (layer "B.Mask" (type "Bottom Solder Mask") (thickness 0.01))
      (layer "B.Paste" (type "Bottom Solder Paste"))
      (layer "B.SilkS" (type "Bottom Silk Screen"))
      (copper_finish "None")
      (dielectric_constraints no)
    )
    (pad_to_mask_clearance 0)
    (pcbplotparams
      (layerselection 0x00010fc_ffffffff)
      (plot_on_all_layers_selection 0x0000000_00000000)
      (disableapertmacros false)
      (usegerberextensions false)
      (usegerberattributes true)
      (usegerberadvancedattributes true)
      (creategerberjobfile true)
      (dashed_line_dash_ratio 12.000000)
      (dashed_line_gap_ratio 3.000000)
      (svgprecision 4)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (dxfpolygonmode true)
      (dxfimperialunits true)
      (dxfusepcbnewfont true)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (sketchpadsonfab false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 1)
      (scaleselection 1)
      (outputdirectory "")
    )
  )
  (net 0 "")
  (net 1 "+12C")
  (net 2 "Earth")
  (net 3 "NFET")
  (net 4 "PIN2")
  (net 5 "+3V3")
  (net 6 "SDA")
  (net 7 "SCL")
  (net 8 "+12V")
  (net 9 "MOSFET")
  (net 10 "Net-(U1-ADJ)")
  (net 11 "Net-(U3-NRST)")
  (net 12 "Net-(Q1-G)")
  (net 13 "OSCIN")
  (net 14 "unconnected-(U3-VBAT-Pad1)")
  (net 15 "unconnected-(U3-PC13-Pad2)")
  (net 16 "unconnected-(U3-PC14-Pad3)")
  (net 17 "unconnected-(U3-PC15-Pad4)")
  (net 18 "Net-(C4-Pad2)")
  (net 19 "OSCOUT")
  (net 20 "unconnected-(U3-PA1-Pad11)")
  (net 21 "unconnected-(U3-PA2-Pad12)")
  (net 22 "unconnected-(U3-PA3-Pad13)")
  (net 23 "unconnected-(U3-PA4-Pad14)")
  (net 24 "unconnected-(U3-PA5-Pad15)")
  (net 25 "unconnected-(U3-PA6-Pad16)")
  (net 26 "unconnected-(U3-PA7-Pad17)")
  (net 27 "unconnected-(U3-PB0-Pad18)")
  (net 28 "unconnected-(U3-PB1-Pad19)")
  (net 29 "unconnected-(U3-PB2-Pad20)")
  (net 30 "unconnected-(U3-PB10-Pad21)")
  (net 31 "unconnected-(U3-PB11-Pad22)")
  (net 32 "unconnected-(U3-PB12-Pad25)")
  (net 33 "unconnected-(U3-PB13-Pad26)")
  (net 34 "unconnected-(U3-PB14-Pad27)")
  (net 35 "unconnected-(U3-PB15-Pad28)")
  (net 36 "unconnected-(U3-PA9-Pad30)")
  (net 37 "unconnected-(U3-PA12-Pad33)")
  (net 38 "/SWIO")
  (net 39 "/SWCLK")
  (net 40 "unconnected-(U3-PA15-Pad38)")
  (net 41 "unconnected-(U3-PB3-Pad39)")
  (net 42 "unconnected-(U3-PB8-Pad45)")
  (net 43 "unconnected-(U3-PB9-Pad46)")
  (net 44 "unconnected-(J3-Pad1)")
  (net 45 "unconnected-(J3-Pad2)")
  (net 46 "WET2")
  (net 47 "WET1")
  (net 48 "/Boot")
  (net 49 "unconnected-(J2-Pin_4-Pad4)")
  (net 50 "PA0")
  (net 51 "unconnected-(U2-N.C.-Pad3)")
  (net 52 "unconnected-(U2-N.C.-Pad4)")
  (net 53 "PB5")
  (net 54 "unconnected-(U2-REV-Pad10)")
  (net 55 "unconnected-(U3-PA0-Pad10)")
  (net 56 "unconnected-(U3-PB5-Pad41)")
  (net 57 "PFET")
  (footprint "footprints:BEL_SS-6444-NF" (layer "F.Cu")
    (at 123.952 124.311)
    (property "Sheetfile" "WetSensorAntiDew.kicad_sch")
    (property "Sheetname" "")
    (property "ki_description" "RJ connector, 4P4C (4 positions 4 connected), RJ9/RJ10/RJ22")
    (property "ki_keywords" "4P4C RJ socket connector")
    (attr through_hole)
    (fp_text reference "J3" (at -2.475 -12.805) (layer "F.SilkS"))
    (fp_text value "4P4C" (at 3.24 -11.305) (layer "F.Fab"))
    (pad "" np_thru_hole circle (at -3.81 0) (size 3.25 3.25) (drill 3.25) (layers "*.Cu" "*.Mask"))
    (pad "" np_thru_hole circle (at 3.81 0) (size 3.25 3.25) (drill 3.25) (layers "*.Cu" "*.Mask"))
    (pad "1" thru_hole rect (at -1.905 -6.35) (size 1.478 1.478) (drill 0.97) (layers "*.Cu" "*.Mask")
      (net 44 "unconnected-(J3-Pad1)") (pintype "passive+no_connect"))
    (pad "2" thru_hole circle (at -0.635 -8.89) (size 1.478 1.478) (drill 0.97) (layers "*.Cu" "*.Mask")
      (net 45 "unconnected-(J3-Pad2)") (pintype "passive+no_connect"))
    (pad "3" thru_hole circle (at 0.635 -6.35) (size 1.478 1.478) (drill 0.97) (layers "*.Cu" "*.Mask")
      (net 46 "WET2") (pintype "passive"))
    (pad "4" thru_hole circle (at 1.905 -8.89) (size 1.478 1.478) (drill 0.97) (layers "*.Cu" "*.Mask")
      (net 47 "WET1") (pintype "passive"))
  )
  (footprint "footprints:228EJVAYFR" (layer "F.Cu")
    (at 110.320431 91.2114 -90)
    (property "Sheetfile" "WetSensorAntiDew.kicad_sch")
    (property "Sheetname" "")
    (property "ki_description" "Push button switch, generic, two pins")
    (property "ki_keywords" "switch normally-open pushbutton push-button")
    (attr smd)
    (fp_text reference "SWRESET" (at 0.127 4.478631 90 unlocked) (layer "F.SilkS"))
    (fp_text value "SW_Push" (at 0 -5.08 -90 unlocked) (layer "F.Fab") hide)
    (fp_circle (center -1.75 -1.7) (end -1.25 -1.7)
      (fill none) (layer "Edge.Cuts"))
    (fp_circle (center 1.75 -1.7) (end 2.25 -1.7)
      (fill none) (layer "Edge.Cuts"))
    (pad "1" smd roundrect (at -3.175 -2.5 270) (size 2.2 1) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.1)
      (net 2 "Earth") (pinfunction "1") (pintype "passive"))
    (pad "2" smd roundrect (at 3.175 -0.9 270) (size 2.2 1) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.1)
      (net 11 "Net-(U3-NRST)") (pinfunction "2") (pintype "passive"))
    (pad "3" smd roundrect (at -3.175 -0.9 270) (size 2.2 1) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.1))
    (pad "3" smd roundrect (at 3.175 -2.5 270) (size 2.2 1) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.1))
    (pad "5" smd roundrect (at 3.175 0.9 270) (size 2.2 1) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.1))
    (pad "6" smd roundrect (at -3.175 2.5 270) (size 2.2 1) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.1))
    (pad "7" smd roundrect (at 3.175 2.5 270) (size 2.2 1) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.1))
  )
  (footprint "Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder" (layer "F.Cu")
    (at 108.204 110.9472 -90)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (property "Sheetfile" "WetSensorAntiDew.kicad_sch")
    (property "Sheetname" "")
    (property "ki_description" "Resistor")
    (property "ki_keywords" "R res resistor")
    (attr smd)
    (fp_text reference "R6" (at -2.4384 0.0254 -180) (layer "F.SilkS"))
    (fp_text value "R" (at 0 1.43 90) (layer "F.Fab") hide)
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab"))
    (pad "1" smd roundrect (at -0.9125 0 270) (size 0.975 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 2 "Earth") (pintype "passive"))
    (pad "2" smd roundrect (at 0.9125 0 270) (size 0.975 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 10 "Net-(U1-ADJ)") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder" (layer "F.Cu")
    (at 104.5718 103.6828 -90)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (property "Sheetfile" "WetSensorAntiDew.kicad_sch")
    (property "Sheetname" "")
    (property "ki_description" "Resistor")
    (property "ki_keywords" "R res resistor")
    (attr smd)
    (fp_text reference "R7" (at 0.0254 1.6764 -180) (layer "F.SilkS"))
    (fp_text value "1.5k" (at 0 1.43 90) (layer "F.Fab") hide)
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab"))
    (pad "1" smd roundrect (at -0.9125 0 270) (size 0.975 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 2 "Earth") (pintype "passive"))
    (pad "2" smd roundrect (at 0.9125 0 270) (size 0.975 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 50 "PA0") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Package_TO_SOT_SMD:SOT-23" (layer "F.Cu")
    (at 97.8685 114.046)
    (descr "SOT, 3 Pin (https://www.jedec.org/system/files/docs/to-236h.pdf variant AB), generated with kicad-footprint-generator ipc_gullwing_generator.py")
    (tags "SOT TO_SOT_SMD")
    (property "Sheetfile" "WetSensorAntiDew.kicad_sch")
    (property "Sheetname" "")
    (property "ki_description" "4.2A Id, 20V Vds, N-Channel MOSFET, SOT-23")
    (property "ki_keywords" "N-Channel MOSFET")
    (attr smd)
    (fp_text reference "Q1" (at 2.3091 11.811) (layer "B.SilkS"))
    (fp_text value "MOSFET N-CH" (at 0 2.4) (layer "F.Fab") hide)
    (fp_text user "${REFERENCE}" (at 0.7472 12.5296) (layer "F.Fab"))
    (pad "1" smd roundrect (at -0.9375 -0.95) (size 1.475 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 12 "Net-(Q1-G)") (pinfunction "G") (pintype "input"))
    (pad "2" smd roundrect (at -0.9375 0.95) (size 1.475 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 2 "Earth") (pinfunction "S") (pintype "passive"))
    (pad "3" smd roundrect (at 0.9375 0) (size 1.475 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 9 "MOSFET") (pinfunction "D") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Package_TO_SOT_SMD.3dshapes/SOT-23.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder" (layer "F.Cu")
    (at 96.7232 110.5897 90)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (property "Sheetfile" "WetSensorAntiDew.kicad_sch")
    (property "Sheetname" "")
    (property "ki_description" "Resistor")
    (property "ki_keywords" "R res resistor")
    (attr smd)
    (fp_text reference "R1" (at -13.7687 4.2418 90) (layer "B.SilkS"))
    (fp_text value "R" (at 0 1.43 90) (layer "F.Fab") hide)
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab"))
    (pad "1" smd roundrect (at -0.9125 0 90) (size 0.975 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 12 "Net-(Q1-G)") (pintype "passive"))
    (pad "2" smd roundrect (at 0.9125 0 90) (size 0.975 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 3 "NFET") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder" (layer "F.Cu")
    (at 97.6376 108.1532 180)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (property "Sheetfile" "WetSensorAntiDew.kicad_sch")
    (property "Sheetname" "")
    (property "ki_description" "Resistor")
    (property "ki_keywords" "R res resistor")
    (attr smd)
    (fp_text reference "R3" (at -2.5654 -14.605) (layer "B.SilkS"))
    (fp_text value "R" (at 0 1.43) (layer "F.Fab") hide)
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab"))
    (pad "1" smd roundrect (at -0.9125 0 180) (size 0.975 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 2 "Earth") (pintype "passive"))
    (pad "2" smd roundrect (at 0.9125 0 180) (size 0.975 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 3 "NFET") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "F.Cu")
    (at 106.4768 110.8964 90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "Sheetfile" "WetSensorAntiDew.kicad_sch")
    (property "Sheetname" "")
    (property "ki_description" "Unpolarized capacitor")
    (property "ki_keywords" "cap capacitor")
    (attr smd)
    (fp_text reference "C1" (at 2.3114 -0.0762 180) (layer "F.SilkS"))
    (fp_text value "C" (at 0 1.43 90) (layer "F.Fab") hide)
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab"))
    (pad "1" smd roundrect (at -0.8625 0 90) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 8 "+12V") (pintype "passive"))
    (pad "2" smd roundrect (at 0.8625 0 90) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 2 "Earth") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Package_QFP:LQFP-48_7x7mm_P0.5mm" (layer "F.Cu")
    (at 111.252 101.9048 -135)
    (descr "LQFP, 48 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ltc2358-16.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py")
    (tags "LQFP QFP")
    (property "Sheetfile" "WetSensorAntiDew.kicad_sch")
    (property "Sheetname" "")
    (property "ki_description" "STMicroelectronics Arm Cortex-M3 MCU, 32KB flash, 10KB RAM, 72 MHz, 2.0-3.6V, 37 GPIO, LQFP48")
    (property "ki_keywords" "Arm Cortex-M3 STM32F1 STM32F103")
    (attr smd)
    (fp_text reference "U3" (at -0.053882 0.017961 45) (layer "F.SilkS"))
    (fp_text value "STM32F103C6Tx" (at 0 5.85 45) (layer "F.Fab") hide)
    (fp_text user "${REFERENCE}" (at 0 0 45) (layer "F.Fab"))
    (pad "1" smd roundrect (at -4.1625 -2.75 225) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 14 "unconnected-(U3-VBAT-Pad1)") (pinfunction "VBAT") (pintype "power_in"))
    (pad "2" smd roundrect (at -4.1625 -2.25 225) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 15 "unconnected-(U3-PC13-Pad2)") (pinfunction "PC13") (pintype "bidirectional"))
    (pad "3" smd roundrect (at -4.1625 -1.75 225) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 16 "unconnected-(U3-PC14-Pad3)") (pinfunction "PC14") (pintype "bidirectional"))
    (pad "4" smd roundrect (at -4.1625 -1.25 225) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 17 "unconnected-(U3-PC15-Pad4)") (pinfunction "PC15") (pintype "bidirectional"))
    (pad "5" smd roundrect (at -4.1625 -0.75 225) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 13 "OSCIN") (pinfunction "PD0") (pintype "bidirectional"))
    (pad "6" smd roundrect (at -4.1625 -0.25 225) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 19 "OSCOUT") (pinfunction "PD1") (pintype "bidirectional"))
    (pad "7" smd roundrect (at -4.1625 0.25 225) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 11 "Net-(U3-NRST)") (pinfunction "NRST") (pintype "input"))
    (pad "8" smd roundrect (at -4.1625 0.75 225) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 2 "Earth") (pinfunction "VSSA") (pintype "power_in"))
    (pad "9" smd roundrect (at -4.1625 1.25 225) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 5 "+3V3") (pinfunction "VDDA") (pintype "power_in"))
    (pad "10" smd roundrect (at -4.1625 1.75 225) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 55 "unconnected-(U3-PA0-Pad10)") (pinfunction "PA0") (pintype "bidirectional"))
    (pad "11" smd roundrect (at -4.1625 2.25 225) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 20 "unconnected-(U3-PA1-Pad11)") (pinfunction "PA1") (pintype "bidirectional"))
    (pad "12" smd roundrect (at -4.1625 2.75 225) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 21 "unconnected-(U3-PA2-Pad12)") (pinfunction "PA2") (pintype "bidirectional"))
    (pad "13" smd roundrect (at -2.75 4.1625 225) (size 0.3 1.475) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 22 "unconnected-(U3-PA3-Pad13)") (pinfunction "PA3") (pintype "bidirectional"))
    (pad "14" smd roundrect (at -2.25 4.1625 225) (size 0.3 1.475) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 23 "unconnected-(U3-PA4-Pad14)") (pinfunction "PA4") (pintype "bidirectional"))
    (pad "15" smd roundrect (at -1.75 4.1625 225) (size 0.3 1.475) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 24 "unconnected-(U3-PA5-Pad15)") (pinfunction "PA5") (pintype "bidirectional"))
    (pad "16" smd roundrect (at -1.25 4.1625 225) (size 0.3 1.475) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 25 "unconnected-(U3-PA6-Pad16)") (pinfunction "PA6") (pintype "bidirectional"))
    (pad "17" smd roundrect (at -0.75 4.1625 225) (size 0.3 1.475) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 26 "unconnected-(U3-PA7-Pad17)") (pinfunction "PA7") (pintype "bidirectional"))
    (pad "18" smd roundrect (at -0.25 4.1625 225) (size 0.3 1.475) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 27 "unconnected-(U3-PB0-Pad18)") (pinfunction "PB0") (pintype "bidirectional"))
    (pad "19" smd roundrect (at 0.25 4.1625 225) (size 0.3 1.475) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 28 "unconnected-(U3-PB1-Pad19)") (pinfunction "PB1") (pintype "bidirectional"))
    (pad "20" smd roundrect (at 0.75 4.1625 225) (size 0.3 1.475) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 29 "unconnected-(U3-PB2-Pad20)") (pinfunction "PB2") (pintype "bidirectional"))
    (pad "21" smd roundrect (at 1.25 4.1625 225) (size 0.3 1.475) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 30 "unconnected-(U3-PB10-Pad21)") (pinfunction "PB10") (pintype "bidirectional"))
    (pad "22" smd roundrect (at 1.75 4.1625 225) (size 0.3 1.475) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 31 "unconnected-(U3-PB11-Pad22)") (pinfunction "PB11") (pintype "bidirectional"))
    (pad "23" smd roundrect (at 2.25 4.1625 225) (size 0.3 1.475) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 2 "Earth") (pinfunction "VSS") (pintype "power_in"))
    (pad "24" smd roundrect (at 2.75 4.1625 225) (size 0.3 1.475) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 5 "+3V3") (pinfunction "VDD") (pintype "power_in"))
    (pad "25" smd roundrect (at 4.1625 2.75 225) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 32 "unconnected-(U3-PB12-Pad25)") (pinfunction "PB12") (pintype "bidirectional"))
    (pad "26" smd roundrect (at 4.1625 2.25 225) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 33 "unconnected-(U3-PB13-Pad26)") (pinfunction "PB13") (pintype "bidirectional"))
    (pad "27" smd roundrect (at 4.1625 1.75 225) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 34 "unconnected-(U3-PB14-Pad27)") (pinfunction "PB14") (pintype "bidirectional"))
    (pad "28" smd roundrect (at 4.1625 1.25 225) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 35 "unconnected-(U3-PB15-Pad28)") (pinfunction "PB15") (pintype "bidirectional"))
    (pad "29" smd roundrect (at 4.1625 0.75 225) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 50 "PA0") (pinfunction "PA8") (pintype "bidirectional"))
    (pad "30" smd roundrect (at 4.1625 0.25 225) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 36 "unconnected-(U3-PA9-Pad30)") (pinfunction "PA9") (pintype "bidirectional"))
    (pad "31" smd roundrect (at 4.1625 -0.25 225) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 3 "NFET") (pinfunction "PA10") (pintype "bidirectional"))
    (pad "32" smd roundrect (at 4.1625 -0.75 225) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 53 "PB5") (pinfunction "PA11") (pintype "bidirectional"))
    (pad "33" smd roundrect (at 4.1625 -1.25 225) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 37 "unconnected-(U3-PA12-Pad33)") (pinfunction "PA12") (pintype "bidirectional"))
    (pad "34" smd roundrect (at 4.1625 -1.75 225) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 38 "/SWIO") (pinfunction "PA13") (pintype "bidirectional"))
    (pad "35" smd roundrect (at 4.1625 -2.25 225) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 2 "Earth") (pinfunction "VSS") (pintype "passive"))
    (pad "36" smd roundrect (at 4.1625 -2.75 225) (size 1.475 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 5 "+3V3") (pinfunction "VDD") (pintype "power_in"))
    (pad "37" smd roundrect (at 2.75 -4.1625 225) (size 0.3 1.475) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 39 "/SWCLK") (pinfunction "PA14") (pintype "bidirectional"))
    (pad "38" smd roundrect (at 2.25 -4.1625 225) (size 0.3 1.475) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 40 "unconnected-(U3-PA15-Pad38)") (pinfunction "PA15") (pintype "bidirectional"))
    (pad "39" smd roundrect (at 1.75 -4.1625 225) (size 0.3 1.475) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 41 "unconnected-(U3-PB3-Pad39)") (pinfunction "PB3") (pintype "bidirectional"))
    (pad "40" smd roundrect (at 1.25 -4.1625 225) (size 0.3 1.475) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 57 "PFET") (pinfunction "PB4") (pintype "bidirectional"))
    (pad "41" smd roundrect (at 0.75 -4.1625 225) (size 0.3 1.475) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 56 "unconnected-(U3-PB5-Pad41)") (pinfunction "PB5") (pintype "bidirectional"))
    (pad "42" smd roundrect (at 0.25 -4.1625 225) (size 0.3 1.475) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 7 "SCL") (pinfunction "PB6") (pintype "bidirectional"))
    (pad "43" smd roundrect (at -0.25 -4.1625 225) (size 0.3 1.475) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 6 "SDA") (pinfunction "PB7") (pintype "bidirectional"))
    (pad "44" smd roundrect (at -0.75 -4.1625 225) (size 0.3 1.475) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 48 "/Boot") (pinfunction "BOOT0") (pintype "input"))
    (pad "45" smd roundrect (at -1.25 -4.1625 225) (size 0.3 1.475) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 42 "unconnected-(U3-PB8-Pad45)") (pinfunction "PB8") (pintype "bidirectional"))
    (pad "46" smd roundrect (at -1.75 -4.1625 225) (size 0.3 1.475) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 43 "unconnected-(U3-PB9-Pad46)") (pinfunction "PB9") (pintype "bidirectional"))
    (pad "47" smd roundrect (at -2.25 -4.1625 225) (size 0.3 1.475) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 2 "Earth") (pinfunction "VSS") (pintype "passive"))
    (pad "48" smd roundrect (at -2.75 -4.1625 225) (size 0.3 1.475) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 5 "+3V3") (pinfunction "VDD") (pintype "power_in"))
    (model "${KICAD6_3DMODEL_DIR}/Package_QFP.3dshapes/LQFP-48_7x7mm_P0.5mm.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Connector_PinSocket_2.54mm:PinSocket_1x05_P2.54mm_Horizontal" (layer "F.Cu")
    (at 119.3292 112.0648 180)
    (descr "Through hole angled socket strip, 1x05, 2.54mm pitch, 8.51mm socket length, single row (from Kicad 4.0.7), script generated")
    (tags "Through hole angled socket strip THT 1x05 2.54mm single row")
    (property "Sheetfile" "WetSensorAntiDew.kicad_sch")
    (property "Sheetname" "")
    (property "ki_description" "Generic connector, single row, 01x05, script generated")
    (property "ki_keywords" "connector")
    (attr through_hole)
    (fp_text reference "J2" (at -3.683 5.0546) (layer "F.SilkS"))
    (fp_text value "Connector to BME280" (at -19.8628 5.1308) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at -5.775 5.08 90) (layer "F.Fab"))
    (pad "1" thru_hole rect (at 0 0 180) (size 1.7 1.7) (drill 1) (layers "*.Cu" "*.Mask")
      (net 5 "+3V3") (pinfunction "Pin_1") (pintype "passive"))
    (pad "2" thru_hole oval (at 0 2.54 180) (size 1.7 1.7) (drill 1) (layers "*.Cu" "*.Mask")
      (net 6 "SDA") (pinfunction "Pin_2") (pintype "passive"))
    (pad "3" thru_hole oval (at 0 5.08 180) (size 1.7 1.7) (drill 1) (layers "*.Cu" "*.Mask")
      (net 7 "SCL") (pinfunction "Pin_3") (pintype "passive"))
    (pad "4" thru_hole oval (at 0 7.62 180) (size 1.7 1.7) (drill 1) (layers "*.Cu" "*.Mask")
      (net 49 "unconnected-(J2-Pin_4-Pad4)") (pinfunction "Pin_4") (pintype "passive+no_connect"))
    (pad "5" thru_hole oval (at 0 10.16 180) (size 1.7 1.7) (drill 1) (layers "*.Cu" "*.Mask")
      (net 2 "Earth") (pinfunction "Pin_5") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Connector_PinSocket_2.54mm.3dshapes/PinSocket_1x05_P2.54mm_Horizontal.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Crystal:Crystal_SMD_3225-4Pin_3.2x2.5mm" (layer "F.Cu")
    (at 120.4038 98.1084 180)
    (descr "SMD Crystal SERIES SMD3225/4 http://www.txccrystal.com/images/pdf/7m-accuracy.pdf, 3.2x2.5mm^2 package")
    (tags "SMD SMT crystal")
    (property "Sheetfile" "WetSensorAntiDew.kicad_sch")
    (property "Sheetname" "")
    (property "ki_description" "Four pin crystal, GND on pins 2 and 4, small symbol")
    (property "ki_keywords" "quartz ceramic resonator oscillator")
    (attr smd)
    (fp_text reference "Y1" (at 0.0332 5.119) (layer "F.SilkS"))
    (fp_text value "Crystal_GND24_Small" (at 0 2.45) (layer "F.Fab") hide)
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab"))
    (pad "1" smd rect (at -1.1 0.85 180) (size 1.4 1.2) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 19 "OSCOUT") (pinfunction "1") (pintype "passive"))
    (pad "2" smd rect (at 1.1 0.85 180) (size 1.4 1.2) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "Earth") (pinfunction "2") (pintype "passive"))
    (pad "3" smd rect (at 1.1 -0.85 180) (size 1.4 1.2) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 13 "OSCIN") (pinfunction "3") (pintype "passive"))
    (pad "4" smd rect (at -1.1 -0.85 180) (size 1.4 1.2) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "Earth") (pinfunction "4") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Crystal.3dshapes/Crystal_SMD_3225-4Pin_3.2x2.5mm.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "F.Cu")
    (at 104.64772 97.89188 -135)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "Sheetfile" "WetSensorAntiDew.kicad_sch")
    (property "Sheetname" "")
    (property "ki_description" "Unpolarized capacitor")
    (property "ki_keywords" "cap capacitor")
    (attr smd)
    (fp_text reference "C5" (at 2.873286 -0.107763 45) (layer "F.SilkS"))
    (fp_text value "C" (at 0 1.43 45) (layer "F.Fab") hide)
    (fp_text user "${REFERENCE}" (at 0 0 45) (layer "F.Fab"))
    (pad "1" smd roundrect (at -0.8625 0 225) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 11 "Net-(U3-NRST)") (pintype "passive"))
    (pad "2" smd roundrect (at 0.8625 0 225) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 2 "Earth") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder" (layer "F.Cu")
    (at 117.5004 98.1456 90)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (property "Sheetfile" "WetSensorAntiDew.kicad_sch")
    (property "Sheetname" "")
    (property "ki_description" "Resistor")
    (property "ki_keywords" "R res resistor")
    (attr smd)
    (fp_text reference "R2" (at 5.2832 1.1938 270) (layer "F.SilkS"))
    (fp_text value "R" (at 0 1.43 90) (layer "F.Fab") hide)
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab"))
    (pad "1" smd roundrect (at -0.9125 0 90) (size 0.975 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 13 "OSCIN") (pintype "passive"))
    (pad "2" smd roundrect (at 0.9125 0 90) (size 0.975 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 19 "OSCOUT") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Capacitor_SMD:C_0603_1608Metric_Pad1.08x0.95mm_HandSolder" (layer "F.Cu")
    (at 98.552 110.5905 90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (property "Sheetfile" "WetSensorAntiDew.kicad_sch")
    (property "Sheetname" "")
    (property "ki_description" "Unpolarized capacitor")
    (property "ki_keywords" "cap capacitor")
    (attr smd)
    (fp_text reference "C2" (at -13.8695 1.016 -90) (layer "B.SilkS"))
    (fp_text value "C" (at 0 1.43 90) (layer "F.Fab") hide)
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab"))
    (pad "1" smd roundrect (at -0.8625 0 90) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 1 "+12C") (pintype "passive"))
    (pad "2" smd roundrect (at 0.8625 0 90) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 2 "Earth") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Jumper:SolderJumper-2_P1.3mm_Open_Pad1.0x1.5mm" (layer "F.Cu")
    (at 94.488 114.188 90)
    (descr "SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, open")
    (tags "solder jumper open")
    (property "Sheetfile" "WetSensorAntiDew.kicad_sch")
    (property "Sheetname" "")
    (property "ki_description" "Solder Jumper, 2-pole, open")
    (property "ki_keywords" "solder jumper SPST")
    (attr exclude_from_pos_files)
    (fp_text reference "JP3" (at 0 -1.8 90) (layer "F.SilkS"))
    (fp_text value "SolderJumper_2_Open" (at -0.366 -10.414 90) (layer "F.Fab") hide)
    (pad "1" smd rect (at -0.65 0 90) (size 1 1.5) (layers "F.Cu" "F.Mask")
      (net 2 "Earth") (pinfunction "A") (pintype "passive"))
    (pad "2" smd rect (at 0.65 0 90) (size 1 1.5) (layers "F.Cu" "F.Mask")
      (net 9 "MOSFET") (pinfunction "B") (pintype "passive"))
  )
  (footprint "Diode_SMD:D_SOD-323" (layer "F.Cu")
    (at 100.33 110.651 90)
    (descr "SOD-323")
    (tags "SOD-323")
    (property "Sheetfile" "WetSensorAntiDew.kicad_sch")
    (property "Sheetname" "")
    (property "ki_description" "Schottky diode")
    (property "ki_keywords" "diode Schottky")
    (attr smd)
    (fp_text reference "D1" (at -13.682 -2.0574 -90) (layer "B.SilkS"))
    (fp_text value "D_Schottky" (at 0.1 1.9 90) (layer "F.Fab") hide)
    (pad "1" smd roundrect (at -1.05 0 90) (size 0.6 0.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 1 "+12C") (pinfunction "K") (pintype "passive"))
    (pad "2" smd roundrect (at 1.05 0 90) (size 0.6 0.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 2 "Earth") (pinfunction "A") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Diode_SMD.3dshapes/D_SOD-323.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Connector_RJ:RJ12_Amphenol_54601" (layer "F.Cu")
    (at 96.906 117.706)
    (descr "RJ12 connector  https://cdn.amphenol-icc.com/media/wysiwyg/files/drawing/c-bmj-0082.pdf")
    (tags "RJ12 connector")
    (property "Sheetfile" "WetSensorAntiDew.kicad_sch")
    (property "Sheetname" "")
    (property "ki_description" "RJ connector, 6P6C (6 positions 6 connected), RJ12/RJ18/RJ25")
    (property "ki_keywords" "6P6C RJ socket connector")
    (attr through_hole)
    (fp_text reference "J8" (at 3.1954 7.8462) (layer "F.SilkS"))
    (fp_text value "6P6C" (at 3.54 18.3) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 3.16 7.76) (layer "F.Fab"))
    (pad "" np_thru_hole circle (at -1.91 8.89) (size 3.25 3.25) (drill 3.25) (layers "*.Cu" "*.Mask"))
    (pad "" np_thru_hole circle (at 8.25 8.89) (size 3.25 3.25) (drill 3.25) (layers "*.Cu" "*.Mask"))
    (pad "1" thru_hole rect (at 0 0) (size 1.52 1.52) (drill 0.76) (layers "*.Cu" "*.Mask")
      (net 2 "Earth") (pintype "passive"))
    (pad "2" thru_hole circle (at 1.27 2.54) (size 1.52 1.52) (drill 0.76) (layers "*.Cu" "*.Mask")
      (net 4 "PIN2") (pintype "passive"))
    (pad "3" thru_hole circle (at 2.54 0) (size 1.52 1.52) (drill 0.76) (layers "*.Cu" "*.Mask")
      (net 47 "WET1") (pintype "passive"))
    (pad "4" thru_hole circle (at 3.81 2.54) (size 1.52 1.52) (drill 0.76) (layers "*.Cu" "*.Mask")
      (net 46 "WET2") (pintype "passive"))
    (pad "5" thru_hole circle (at 5.08 0) (size 1.52 1.52) (drill 0.76) (layers "*.Cu" "*.Mask")
      (net 1 "+12C") (pintype "passive"))
    (pad "6" thru_hole circle (at 6.35 2.54) (size 1.52 1.52) (drill 0.76) (layers "*.Cu" "*.Mask")
      (net 9 "MOSFET") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Connector_RJ.3dshapes/RJ12_Amphenol_54601.wrl"
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      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
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  )
  (footprint "Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder" (layer "F.Cu")
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    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (property "Sheetfile" "WetSensorAntiDew.kicad_sch")
    (property "Sheetname" "")
    (property "ki_description" "Resistor")
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    (pad "2" smd roundrect (at 0.9125 0 225) (size 0.975 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 5 "+3V3") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl"
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    (tags "resistor handsolder")
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    (fp_text user "${REFERENCE}" (at 0 0 45) (layer "F.Fab"))
    (pad "1" smd roundrect (at -0.9125 0 45) (size 0.975 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
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    (pad "2" smd roundrect (at 0.9125 0 45) (size 0.975 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
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    (tags "resistor handsolder")
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    (pad "2" smd roundrect (at 0.9125 0 90) (size 0.975 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
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  (footprint "Connector:FanPinHeader_1x04_P2.54mm_Vertical" (layer "F.Cu")
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    (descr "4-pin CPU fan Through hole pin header, e.g. for Wieson part number 2366C888-007 Molex 47053-1000, Foxconn HF27040-M1, Tyco 1470947-1 or equivalent, see http://www.formfactors.org/developer%5Cspecs%5Crev1_2_public.pdf")
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      (net 39 "/SWCLK") (pinfunction "Pin_2") (pintype "passive"))
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      (rotate (xyz 0 0 0))
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    (tags "capacitor handsolder")
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    (property "Sheetname" "")
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    (property "Sheetfile" "WetSensorAntiDew.kicad_sch")
    (property "Sheetname" "")
    (property "ki_description" "1A Low Dropout regulator, positive, adjustable output, SOT-223")
    (property "ki_keywords" "linear regulator ldo adjustable positive")
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    (property "Sheetname" "")
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      (net 8 "+12V") (pinfunction "Pin_2") (pintype "passive"))
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    (pad "2" smd roundrect (at 0.8625 0 180) (size 1.075 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
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    (property "Sheetfile" "WetSensorAntiDew.kicad_sch")
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    (pad "" smd roundrect (at -0.4 0.625 180) (size 0.64 1.01) (layers "F.Paste") (roundrect_rratio 0.25))
    (pad "" smd roundrect (at 0.4 -0.625 180) (size 0.64 1.01) (layers "F.Paste") (roundrect_rratio 0.25))
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    (pad "12" smd roundrect (at 1.425 -1.25 180) (size 0.85 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
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    (property "Sheetname" "")
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    (property "ki_keywords" "solder jumper SPST")
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    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab"))
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    (attr board_only exclude_from_pos_files exclude_from_bom)
    (fp_text reference "G***" (at 0 0) (layer "B.SilkS") hide)
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  (zone (net 2) (net_name "Earth") (layer "B.Cu") (hatch edge 0.5)
    (connect_pads yes (clearance 0.1778))
    (min_thickness 0.25) (filled_areas_thickness no)
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