(kicad_pcb (version 20171130) (host pcbnew "(5.1.4)-1")
  (general
    (thickness 1.6)
    (drawings 55)
    (tracks 750)
    (zones 0)
    (modules 81)
    (nets 29)
  )
  (page A4)
  (layers
    (0 F.Cu mixed)
    (1 In1.Cu mixed hide)
    (2 In2.Cu mixed hide)
    (31 B.Cu mixed)
    (32 B.Adhes user hide)
    (33 F.Adhes user)
    (34 B.Paste user hide)
    (35 F.Paste user hide)
    (36 B.SilkS user)
    (37 F.SilkS user)
    (38 B.Mask user hide)
    (39 F.Mask user hide)
    (40 Dwgs.User user hide)
    (41 Cmts.User user hide)
    (42 Eco1.User user)
    (43 Eco2.User user)
    (44 Edge.Cuts user)
    (45 Margin user hide)
    (46 B.CrtYd user hide)
    (47 F.CrtYd user hide)
    (48 B.Fab user hide)
    (49 F.Fab user hide)
  )
  (setup
    (last_trace_width 0.1524)
    (user_trace_width 0.127)
    (user_trace_width 0.1524)
    (user_trace_width 0.2032)
    (user_trace_width 0.254)
    (user_trace_width 0.3048)
    (user_trace_width 0.381)
    (user_trace_width 0.508)
    (user_trace_width 0.635)
    (trace_clearance 0.1524)
    (zone_clearance 0.4064)
    (zone_45_only yes)
    (trace_min 0.127)
    (via_size 0.6858)
    (via_drill 0.3302)
    (via_min_size 0.508)
    (via_min_drill 0.3048)
    (user_via 0.6858 0.3302)
    (user_via 0.8128 0.4064)
    (user_via 1.2192 0.6096)
    (user_via 1.4224 0.8128)
    (blind_buried_vias_allowed yes)
    (uvia_size 0.3302)
    (uvia_drill 0.2032)
    (uvias_allowed yes)
    (uvia_min_size 0.2032)
    (uvia_min_drill 0.1016)
    (edge_width 0.15)
    (segment_width 0.2)
    (pcb_text_width 0.3)
    (pcb_text_size 1.5 1.5)
    (mod_edge_width 0.15)
    (mod_text_size 1 1)
    (mod_text_width 0.15)
    (pad_size 3.8 3.8)
    (pad_drill 2.2)
    (pad_to_mask_clearance 0.2)
    (aux_axis_origin 0 0)
    (visible_elements 7EFEFE7F)
    (pcbplotparams
      (layerselection 0x010fc_ffffffff)
      (usegerberextensions false)
      (usegerberattributes false)
      (usegerberadvancedattributes false)
      (creategerberjobfile false)
      (excludeedgelayer true)
      (linewidth 0.100000)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (padsonsilk false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 0)
      (scaleselection 1)
      (outputdirectory "./gerbers"))
  )
  (net 0 "")
  (net 1 GND)
  (net 2 VDD)
  (net 3 GNDA)
  (net 4 "Net-(R6-Pad1)")
  (net 5 +3.3VA)
  (net 6 "Net-(C8-Pad1)")
  (net 7 "Net-(C1-Pad1)")
  (net 8 "Net-(R10-Pad1)")
  (net 9 /Vin)
  (net 10 /Vsklpf)
  (net 11 /REFOUT)
  (net 12 /Vcm)
  (net 13 /Vadc+)
  (net 14 /Vadc-)
  (net 15 /REFIN)
  (net 16 /Vlpf)
  (net 17 /CMOSn_LVDS)
  (net 18 /SCSn_ADC)
  (net 19 "Net-(R13-Pad1)")
  (net 20 /V6655)
  (net 21 /Vadr44X)
  (net 22 /SCSn_FPGA)
  (net 23 /SCK_FPGA+)
  (net 24 /SCK_FPGA-)
  (net 25 /MISO_FPGA+)
  (net 26 /MISO_FPGA-)
  (net 27 "Net-(Jadc1-Pad1)")
  (net 28 "Net-(Jadc1-Pad3)")
  (net_class Default "This is the default net class."
    (clearance 0.1524)
    (trace_width 0.1524)
    (via_dia 0.6858)
    (via_drill 0.3302)
    (uvia_dia 0.3302)
    (uvia_drill 0.2032)
    (add_net +3.3VA)
    (add_net /CMOSn_LVDS)
    (add_net /MISO_FPGA+)
    (add_net /MISO_FPGA-)
    (add_net /REFIN)
    (add_net /REFOUT)
    (add_net /SCK_FPGA+)
    (add_net /SCK_FPGA-)
    (add_net /SCSn_ADC)
    (add_net /SCSn_FPGA)
    (add_net /V6655)
    (add_net /Vadc+)
    (add_net /Vadc-)
    (add_net /Vadr44X)
    (add_net /Vcm)
    (add_net /Vin)
    (add_net /Vlpf)
    (add_net /Vsklpf)
    (add_net GND)
    (add_net GNDA)
    (add_net "Net-(C1-Pad1)")
    (add_net "Net-(C8-Pad1)")
    (add_net "Net-(J3-Pad1)")
    (add_net "Net-(J3-Pad10)")
    (add_net "Net-(J3-Pad13)")
    (add_net "Net-(J3-Pad14)")
    (add_net "Net-(J3-Pad16)")
    (add_net "Net-(J3-Pad17)")
    (add_net "Net-(J3-Pad20)")
    (add_net "Net-(J3-Pad21)")
    (add_net "Net-(J3-Pad22)")
    (add_net "Net-(J3-Pad23)")
    (add_net "Net-(J3-Pad26)")
    (add_net "Net-(J3-Pad27)")
    (add_net "Net-(J3-Pad28)")
    (add_net "Net-(J3-Pad3)")
    (add_net "Net-(J3-Pad31)")
    (add_net "Net-(J3-Pad32)")
    (add_net "Net-(J3-Pad33)")
    (add_net "Net-(J3-Pad34)")
    (add_net "Net-(J3-Pad35)")
    (add_net "Net-(J3-Pad36)")
    (add_net "Net-(J3-Pad37)")
    (add_net "Net-(J3-Pad38)")
    (add_net "Net-(J3-Pad39)")
    (add_net "Net-(J3-Pad4)")
    (add_net "Net-(J3-Pad5)")
    (add_net "Net-(J3-Pad6)")
    (add_net "Net-(J3-Pad7)")
    (add_net "Net-(J3-Pad8)")
    (add_net "Net-(J3-Pad9)")
    (add_net "Net-(Jadc1-Pad1)")
    (add_net "Net-(Jadc1-Pad3)")
    (add_net "Net-(R10-Pad1)")
    (add_net "Net-(R13-Pad1)")
    (add_net "Net-(R6-Pad1)")
    (add_net "Net-(U1-Pad5)")
    (add_net "Net-(U2-Pad1)")
    (add_net "Net-(U2-Pad3)")
    (add_net "Net-(U2-Pad5)")
    (add_net "Net-(U2-Pad7)")
    (add_net "Net-(U2-Pad8)")
    (add_net "Net-(U3-Pad5)")
    (add_net "Net-(U6-Pad1)")
    (add_net "Net-(U7-Pad5)")
    (add_net VDD)
  )
  (net_class 10mil ""
    (clearance 0.1524)
    (trace_width 0.1524)
    (via_dia 0.8128)
    (via_drill 0.4064)
    (uvia_dia 0.3048)
    (uvia_drill 0.2032)
  )
  (net_class 15mil ""
    (clearance 0.1524)
    (trace_width 0.381)
    (via_dia 0.8128)
    (via_drill 0.4064)
    (uvia_dia 0.3048)
    (uvia_drill 0.2032)
  )
  (net_class 20mil ""
    (clearance 0.1524)
    (trace_width 0.508)
    (via_dia 1.2192)
    (via_drill 0.6096)
    (uvia_dia 0.3302)
    (uvia_drill 0.2032)
  )
  (net_class 25mil ""
    (clearance 0.1524)
    (trace_width 0.1524)
    (via_dia 1.4224)
    (via_drill 0.8128)
    (uvia_dia 0.3302)
    (uvia_drill 0.2032)
  )
  (net_class 6mil ""
    (clearance 0.1524)
    (trace_width 0.1524)
    (via_dia 0.6858)
    (via_drill 0.3302)
    (uvia_dia 0.3302)
    (uvia_drill 0.2032)
  )
  (net_class 8mil ""
    (clearance 0.1524)
    (trace_width 0.2032)
    (via_dia 0.6858)
    (via_drill 0.3302)
    (uvia_dia 0.3302)
    (uvia_drill 0.2032)
  )
  (module MSAG_Misc:BurstCube_bwA_0p3in (layer F.Cu) (tedit 0)
    (at 180.086 99.568 90)
    (fp_text reference G*** (at 0 0 90) (layer F.SilkS) hide)
    (fp_text value LOGO (at 0.75 0 90) (layer F.SilkS) hide)
  )
  (module MSAG_Misc:BNC_TE-5-1634503-1 (layer F.Cu) (tedit 5C5B374F)
    (at 155.5242 98.5139 270)
    (descr "25-pin D-Sub connector, straight/vertical, THT-mount, female, pitch 2.77x2.84mm, distance of mounting holes 47.1mm, see https://disti-assets.s3.amazonaws.com/tonar/files/datasheets/16730.pdf")
    (tags "25-pin D-Sub connector straight vertical THT female pitch 2.77x2.84mm mounting holes distance 47.1mm")
    (fp_text reference JIN2 (at 0.2413 -7.1882 270) (layer F.SilkS))
    (fp_text value BNC (at 3.937 0.889 90) (layer F.Fab))
    (fp_text user %R (at 3.429 -0.381 90) (layer F.Fab))
    (pad 5 thru_hole circle (at 3.23 3.23 270) (size 2.2 2.2) (drill 1.6) (layers *.Cu *.Mask)
      (net 3 GNDA))
    (pad 4 thru_hole circle (at -3.23 3.23 270) (size 2.2 2.2) (drill 1.6) (layers *.Cu *.Mask)
      (net 3 GNDA))
    (pad 3 thru_hole circle (at -3.23 -3.23 270) (size 2.2 2.2) (drill 1.6) (layers *.Cu *.Mask)
      (net 3 GNDA))
    (pad 2 thru_hole circle (at 3.23 -3.23 270) (size 2.2 2.2) (drill 1.6) (layers *.Cu *.Mask)
      (net 3 GNDA))
    (pad 1 thru_hole circle (at 0 0 270) (size 2.2 2.2) (drill 1.2) (layers *.Cu *.Mask)
      (net 9 /Vin))
    (model ${MSAG}/MSAG_KiCad3d/TE-5-1634503-1.stp
      (offset (xyz 0 0 13.33499979972839))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:SSMB_TH (layer F.Cu) (tedit 5D5FD4D3)
    (at 158.1658 109.9058)
    (descr "25-pin D-Sub connector, straight/vertical, THT-mount, female, pitch 2.77x2.84mm, distance of mounting holes 47.1mm, see https://disti-assets.s3.amazonaws.com/tonar/files/datasheets/16730.pdf")
    (tags "25-pin D-Sub connector straight vertical THT female pitch 2.77x2.84mm mounting holes distance 47.1mm")
    (fp_text reference Jinp1 (at 0 -3.175) (layer F.SilkS))
    (fp_text value SSMB (at 5.588 0.508) (layer F.Fab))
    (fp_text user %R (at 4.318 -1.27) (layer F.Fab))
    (pad 1 thru_hole circle (at 0 0) (size 1.524 1.524) (drill 0.889) (layers *.Cu *.Mask)
      (net 27 "Net-(Jadc1-Pad1)"))
    (pad 2 thru_hole circle (at -1.27 -1.27) (size 1.524 1.524) (drill 0.889) (layers *.Cu *.Mask)
      (net 3 GNDA))
    (pad 3 thru_hole circle (at -1.27 1.27) (size 1.524 1.524) (drill 0.889) (layers *.Cu *.Mask)
      (net 3 GNDA))
    (pad 4 thru_hole circle (at 1.27 1.27) (size 1.524 1.524) (drill 0.889) (layers *.Cu *.Mask)
      (net 3 GNDA))
    (pad 5 thru_hole circle (at 1.27 -1.27) (size 1.524 1.524) (drill 0.889) (layers *.Cu *.Mask)
      (net 3 GNDA))
    (model ${MSAG}/MSAG_KiCad3d/ssmb_straight_7209-1511-050.STEP
      (offset (xyz 0 0 6.7))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 -90 0))
    )
  )
  (module MSAG_Misc:SSMB_TH (layer F.Cu) (tedit 5D5FD4D3)
    (at 153.1112 109.9058)
    (descr "25-pin D-Sub connector, straight/vertical, THT-mount, female, pitch 2.77x2.84mm, distance of mounting holes 47.1mm, see https://disti-assets.s3.amazonaws.com/tonar/files/datasheets/16730.pdf")
    (tags "25-pin D-Sub connector straight vertical THT female pitch 2.77x2.84mm mounting holes distance 47.1mm")
    (fp_text reference Jinn1 (at 0 -3.175) (layer F.SilkS))
    (fp_text value SSMB (at 5.588 0.508) (layer F.Fab))
    (fp_text user %R (at 4.318 -1.27) (layer F.Fab))
    (pad 1 thru_hole circle (at 0 0) (size 1.524 1.524) (drill 0.889) (layers *.Cu *.Mask)
      (net 28 "Net-(Jadc1-Pad3)"))
    (pad 2 thru_hole circle (at -1.27 -1.27) (size 1.524 1.524) (drill 0.889) (layers *.Cu *.Mask)
      (net 3 GNDA))
    (pad 3 thru_hole circle (at -1.27 1.27) (size 1.524 1.524) (drill 0.889) (layers *.Cu *.Mask)
      (net 3 GNDA))
    (pad 4 thru_hole circle (at 1.27 1.27) (size 1.524 1.524) (drill 0.889) (layers *.Cu *.Mask)
      (net 3 GNDA))
    (pad 5 thru_hole circle (at 1.27 -1.27) (size 1.524 1.524) (drill 0.889) (layers *.Cu *.Mask)
      (net 3 GNDA))
    (model ${MSAG}/MSAG_KiCad3d/ssmb_straight_7209-1511-050.STEP
      (offset (xyz 0 0 6.7))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 -90 0))
    )
  )
  (module MSAG_Misc:Pin_Header_Straight_1x03_Pitch2.54mm (layer F.Cu) (tedit 5C52ECD9)
    (at 156.4894 114.681)
    (descr "Through hole straight pin header, 1x03, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x03 2.54mm single row")
    (fp_text reference Jadc1 (at -2.3114 2.4384 270) (layer F.SilkS))
    (fp_text value Conn_03x01 (at 0 7.41) (layer F.Fab))
    (fp_text user %R (at 0 2.54 90) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 27 "Net-(Jadc1-Pad1)"))
    (pad 2 thru_hole oval (at 0 2.54) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 3 GNDA))
    (pad 3 thru_hole oval (at 0 5.08) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 28 "Net-(Jadc1-Pad3)"))
    (model ${MSAG3D}/Connector_PinHeader_2.54mm.3dshapes/Pin_Header_Straight_1x03_Pitch2.54mm.step
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:msag_logo2_0.5in (layer F.Cu) (tedit 0)
    (at 181.9402 115.951 90)
    (fp_text reference G*** (at 0 0 90) (layer F.SilkS) hide)
    (fp_text value LOGO (at 0.75 0 90) (layer F.SilkS) hide)
  )
  (module MSAG_Misc:goddard_rocket_0.3inA (layer F.Cu) (tedit 0)
    (at 169.926 125.9205)
    (fp_text reference G*** (at 0 0) (layer F.SilkS) hide)
    (fp_text value LOGO (at 0.75 0) (layer F.SilkS) hide)
  )
  (module MSAG_Misc:nasa_logo_0.3inA (layer F.Cu) (tedit 0)
    (at 171.958 105.918)
    (fp_text reference G*** (at 0 0) (layer F.SilkS) hide)
    (fp_text value LOGO (at 0.75 0) (layer F.SilkS) hide)
  )
  (module MSAG_Misc:R_0402_NoSilk (layer F.Cu) (tedit 5BBB6797)
    (at 176.3776 114.7064 270)
    (descr "Resistor SMD 0402, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0402")
    (attr smd)
    (fp_text reference Rt1 (at 0 -1.2 90) (layer F.SilkS))
    (fp_text value 100 (at 0 1.25 90) (layer F.Fab))
    (fp_text user %R (at 0 -1.2 90) (layer F.Fab))
    (pad 1 smd rect (at -0.45 0 270) (size 0.4 0.6) (layers F.Cu F.Paste F.Mask)
      (net 23 /SCK_FPGA+))
    (pad 2 smd rect (at 0.45 0 270) (size 0.4 0.6) (layers F.Cu F.Paste F.Mask)
      (net 24 /SCK_FPGA-))
    (model ${MSAG3D}/Resistors_SMD.3dshapes/R_0402.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:L_0603_HandSoldering (layer B.Cu) (tedit 5BBB6014)
    (at 181.665385 97.332642 180)
    (descr "Inductor SMD 0603, hand soldering")
    (tags "inductor 0603")
    (attr smd)
    (fp_text reference L2 (at 4.356473 -0.189113 180) (layer B.SilkS))
    (fp_text value Ferrite_Bead_Small (at 0 -1.5 180) (layer B.Fab))
    (fp_text user %R (at 0 1.25 180) (layer B.Fab))
    (pad 1 smd rect (at -0.95 0 180) (size 1.2 0.75) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (pad 2 smd rect (at 0.95 0 180) (size 1.2 0.75) (layers B.Cu B.Paste B.Mask)
      (net 3 GNDA))
    (model ${MSAG3d}/Inductor_SMD.3dshapes/L_0603_1608Metric.step
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:R_0805_HandSoldering (layer B.Cu) (tedit 5C5B175C)
    (at 160.6804 115.6335 180)
    (descr "Resistor SMD 0805, hand soldering")
    (tags "resistor 0805")
    (attr smd)
    (fp_text reference R13 (at -0.2286 2.2479 180) (layer B.SilkS))
    (fp_text value 200 (at 0 -0.35 180) (layer B.Fab))
    (fp_text user %R (at 0 0.2 180) (layer B.Fab))
    (pad 1 smd rect (at -1.35 0 180) (size 1.5 1.3) (layers B.Cu B.Paste B.Mask)
      (net 19 "Net-(R13-Pad1)"))
    (pad 2 smd rect (at 1.35 0 180) (size 1.5 1.3) (layers B.Cu B.Paste B.Mask)
      (net 27 "Net-(Jadc1-Pad1)"))
    (model ${MSAG3D}/Resistors_SMD.3dshapes/R_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:R_0805_HandSoldering (layer F.Cu) (tedit 5C5B175C)
    (at 160.6804 115.6335 180)
    (descr "Resistor SMD 0805, hand soldering")
    (tags "resistor 0805")
    (attr smd)
    (fp_text reference R15 (at -0.0762 2.2733) (layer F.SilkS))
    (fp_text value 50 (at 0 0.35) (layer F.Fab))
    (fp_text user %R (at 0 -0.2) (layer F.Fab))
    (pad 1 smd rect (at -1.35 0 180) (size 1.5 1.3) (layers F.Cu F.Paste F.Mask)
      (net 13 /Vadc+))
    (pad 2 smd rect (at 1.35 0 180) (size 1.5 1.3) (layers F.Cu F.Paste F.Mask)
      (net 27 "Net-(Jadc1-Pad1)"))
    (model ${MSAG3D}/Resistors_SMD.3dshapes/R_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:C_0805_HandSoldering (layer B.Cu) (tedit 5C5B15B8)
    (at 164.1348 116.7565 270)
    (descr "Capacitor SMD 0805, hand soldering")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C38 (at 0.1597 -2.6416 270) (layer B.SilkS))
    (fp_text value 3.3n (at 0 -0.35 270) (layer B.Fab))
    (fp_text user %R (at 0.15 0.2 270) (layer B.Fab))
    (pad 1 smd rect (at -1.25 0 270) (size 1.5 1.25) (layers B.Cu B.Paste B.Mask)
      (net 13 /Vadc+))
    (pad 2 smd rect (at 1.25 0 270) (size 1.5 1.25) (layers B.Cu B.Paste B.Mask)
      (net 14 /Vadc-))
    (model ${MSAG3D}/Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:Pin_Header_Straight_1x02_Pitch2.54mm (layer F.Cu) (tedit 5C52ECC1)
    (at 150.7998 131.2672 180)
    (descr "Through hole straight pin header, 1x02, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x02 2.54mm single row")
    (fp_text reference Jvref2 (at 0 -2.33) (layer F.SilkS))
    (fp_text value Conn_02x01 (at 0 4.87) (layer F.Fab))
    (fp_text user %R (at 0 1.27 90) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 21 /Vadr44X))
    (pad 2 thru_hole oval (at 0 2.54 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 11 /REFOUT))
    (model ${MSAG3D}/Connector_PinHeader_2.54mm.3dshapes/Pin_Header_Straight_1x02_Pitch2.54mm.step
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:Pin_Header_Straight_1x03_Pitch2.54mm (layer F.Cu) (tedit 5C52ECD9)
    (at 162.7505 132.0673 180)
    (descr "Through hole straight pin header, 1x03, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x03 2.54mm single row")
    (fp_text reference Jvref1 (at -2.2733 2.3495 90) (layer F.SilkS))
    (fp_text value Conn_03x01 (at 0 7.41) (layer F.Fab))
    (fp_text user %R (at 0 2.54 90) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 20 /V6655))
    (pad 2 thru_hole oval (at 0 2.54 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 11 /REFOUT))
    (pad 3 thru_hole oval (at 0 5.08 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 3 GNDA))
    (model ${MSAG3D}/Connector_PinHeader_2.54mm.3dshapes/Pin_Header_Straight_1x03_Pitch2.54mm.step
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:C_0805_HandSoldering (layer B.Cu) (tedit 5C5B15B8)
    (at 175.0314 114.86642 180)
    (descr "Capacitor SMD 0805, hand soldering")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C24 (at -3.7339 -0.0121) (layer B.SilkS))
    (fp_text value 0.01uF (at 0 -0.35) (layer B.Fab))
    (fp_text user %R (at 0.15 0.2) (layer B.Fab))
    (pad 1 smd rect (at -1.25 0 180) (size 1.5 1.25) (layers B.Cu B.Paste B.Mask)
      (net 2 VDD))
    (pad 2 smd rect (at 1.25 0 180) (size 1.5 1.25) (layers B.Cu B.Paste B.Mask)
      (net 3 GNDA))
    (model ${MSAG3D}/Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:C_0805_HandSoldering (layer B.Cu) (tedit 5C5B15B8)
    (at 175.0314 112.9538 180)
    (descr "Capacitor SMD 0805, hand soldering")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C22 (at -3.7847 -0.0254) (layer B.SilkS))
    (fp_text value 0.01uF (at 0 -0.35) (layer B.Fab))
    (fp_text user %R (at 0.15 0.2) (layer B.Fab))
    (pad 1 smd rect (at -1.25 0 180) (size 1.5 1.25) (layers B.Cu B.Paste B.Mask)
      (net 2 VDD))
    (pad 2 smd rect (at 1.25 0 180) (size 1.5 1.25) (layers B.Cu B.Paste B.Mask)
      (net 3 GNDA))
    (model ${MSAG3D}/Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:C_0805_HandSoldering (layer B.Cu) (tedit 5C5B15B8)
    (at 170.35282 120.780387)
    (descr "Capacitor SMD 0805, hand soldering")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C20 (at -3.7846 -0.0121) (layer B.SilkS))
    (fp_text value 1uF (at 0 -0.35) (layer B.Fab))
    (fp_text user %R (at 0.15 0.2) (layer B.Fab))
    (pad 1 smd rect (at -1.25 0) (size 1.5 1.25) (layers B.Cu B.Paste B.Mask)
      (net 5 +3.3VA))
    (pad 2 smd rect (at 1.25 0) (size 1.5 1.25) (layers B.Cu B.Paste B.Mask)
      (net 3 GNDA))
    (model ${MSAG3D}/Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:C_0805_HandSoldering (layer B.Cu) (tedit 5C5B15B8)
    (at 170.35282 122.70232)
    (descr "Capacitor SMD 0805, hand soldering")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C19 (at -3.8354 0.0127) (layer B.SilkS))
    (fp_text value 10uF (at 0 -0.35) (layer B.Fab))
    (fp_text user %R (at 0.15 0.2) (layer B.Fab))
    (pad 1 smd rect (at -1.25 0) (size 1.5 1.25) (layers B.Cu B.Paste B.Mask)
      (net 5 +3.3VA))
    (pad 2 smd rect (at 1.25 0) (size 1.5 1.25) (layers B.Cu B.Paste B.Mask)
      (net 3 GNDA))
    (model ${MSAG3D}/Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:SMA_TH (layer F.Cu) (tedit 5C81344B)
    (at 167.386 98.552)
    (descr "25-pin D-Sub connector, straight/vertical, THT-mount, female, pitch 2.77x2.84mm, distance of mounting holes 47.1mm, see https://disti-assets.s3.amazonaws.com/tonar/files/datasheets/16730.pdf")
    (tags "25-pin D-Sub connector straight vertical THT female pitch 2.77x2.84mm mounting holes distance 47.1mm")
    (fp_text reference JIN1 (at 4.5974 -0.1016 90) (layer F.SilkS))
    (fp_text value SMA (at 3.937 0.889) (layer F.Fab))
    (fp_text user %R (at 3.429 -0.381) (layer F.Fab))
    (pad 5 thru_hole circle (at 2.54 2.54) (size 2.2098 2.2098) (drill 1.4986) (layers *.Cu *.Mask)
      (net 3 GNDA))
    (pad 4 thru_hole circle (at -2.54 2.54) (size 2.2098 2.2098) (drill 1.4986) (layers *.Cu *.Mask)
      (net 3 GNDA))
    (pad 3 thru_hole circle (at -2.54 -2.54) (size 2.2098 2.2098) (drill 1.4986) (layers *.Cu *.Mask)
      (net 3 GNDA))
    (pad 2 thru_hole circle (at 2.54 -2.54) (size 2.2098 2.2098) (drill 1.4986) (layers *.Cu *.Mask)
      (net 3 GNDA))
    (pad 1 thru_hole circle (at 0 0) (size 2.1082 2.1082) (drill 1.397) (layers *.Cu *.Mask)
      (net 9 /Vin))
    (model ${MSAG}/MSAG_KiCad3d/SMA_VERTICAL_TH.stp
      (offset (xyz 0 0 9.4742))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:MSOP-8_3x3mm_Pitch0.65mm (layer F.Cu) (tedit 5D8D1EF0)
    (at 157.0101 130.3528)
    (descr "MS8E Package; 8-Lead Plastic MSOP, Exposed Die Pad (see Linear Technology 05081662_K_MS8E.pdf)")
    (tags "SSOP 0.65")
    (attr smd)
    (fp_text reference U9 (at -1.8669 -2.413) (layer F.SilkS))
    (fp_text value ‎LTC6655BHMS8-2.5 (at 0 2.55) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd rect (at -2.105 -0.975) (size 0.89 0.42) (layers F.Cu F.Paste F.Mask)
      (net 5 +3.3VA))
    (pad 2 smd rect (at -2.105 -0.325) (size 0.89 0.42) (layers F.Cu F.Paste F.Mask)
      (net 5 +3.3VA))
    (pad 3 smd rect (at -2.105 0.325) (size 0.89 0.42) (layers F.Cu F.Paste F.Mask)
      (net 3 GNDA))
    (pad 4 smd rect (at -2.105 0.975) (size 0.89 0.42) (layers F.Cu F.Paste F.Mask)
      (net 3 GNDA))
    (pad 5 smd rect (at 2.105 0.975) (size 0.89 0.42) (layers F.Cu F.Paste F.Mask)
      (net 3 GNDA))
    (pad 6 smd rect (at 2.105 0.325) (size 0.89 0.42) (layers F.Cu F.Paste F.Mask)
      (net 20 /V6655))
    (pad 7 smd rect (at 2.105 -0.325) (size 0.89 0.42) (layers F.Cu F.Paste F.Mask))
    (pad 8 smd rect (at 2.105 -0.975) (size 0.89 0.42) (layers F.Cu F.Paste F.Mask)
      (net 3 GNDA))
    (model ${MSAG}/MSAG_KiCad3d/Housings_MSOP.3dshapes/MSOP-8_3x3mm_P0.65mm.step
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:MSOP-16-1EP_3x4.039mm_P0.5mm_EP1.651x2.845mm (layer F.Cu) (tedit 5D8D1F41)
    (at 172.5463 116.3816)
    (descr "MSOP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-msop/05081667_F_MSE16.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py")
    (tags "MSOP SO")
    (attr smd)
    (fp_text reference U8 (at 0 -2.97) (layer F.SilkS))
    (fp_text value LTC2311 (at 0 2.97) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 16 smd roundrect (at 2.15 -1.75) (size 1.45 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 23 /SCK_FPGA+))
    (pad 15 smd roundrect (at 2.15 -1.25) (size 1.45 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 24 /SCK_FPGA-))
    (pad 14 smd roundrect (at 2.15 -0.75) (size 1.45 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 25 /MISO_FPGA+))
    (pad 13 smd roundrect (at 2.15 -0.25) (size 1.45 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 26 /MISO_FPGA-))
    (pad 12 smd roundrect (at 2.15 0.25) (size 1.45 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 2 VDD))
    (pad 11 smd roundrect (at 2.15 0.75) (size 1.45 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 3 GNDA))
    (pad 10 smd roundrect (at 2.15 1.25) (size 1.45 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 17 /CMOSn_LVDS))
    (pad 9 smd roundrect (at 2.15 1.75) (size 1.45 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 18 /SCSn_ADC))
    (pad 8 smd roundrect (at -2.15 1.75) (size 1.45 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 3 GNDA))
    (pad 7 smd roundrect (at -2.15 1.25) (size 1.45 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 14 /Vadc-))
    (pad 6 smd roundrect (at -2.15 0.75) (size 1.45 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 13 /Vadc+))
    (pad 5 smd roundrect (at -2.15 0.25) (size 1.45 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 3 GNDA))
    (pad 4 smd roundrect (at -2.15 -0.25) (size 1.45 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 5 +3.3VA))
    (pad 3 smd roundrect (at -2.15 -0.75) (size 1.45 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 11 /REFOUT))
    (pad 2 smd roundrect (at -2.15 -1.25) (size 1.45 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 15 /REFIN))
    (pad 1 smd roundrect (at -2.15 -1.75) (size 1.45 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 3 GNDA))
    (pad "" smd roundrect (at 0.415 0.71) (size 0.69 1.19) (layers F.Paste) (roundrect_rratio 0.25))
    (pad "" smd roundrect (at 0.415 -0.71) (size 0.69 1.19) (layers F.Paste) (roundrect_rratio 0.25))
    (pad "" smd roundrect (at -0.415 0.71) (size 0.69 1.19) (layers F.Paste) (roundrect_rratio 0.25))
    (pad "" smd roundrect (at -0.415 -0.71) (size 0.69 1.19) (layers F.Paste) (roundrect_rratio 0.25))
    (pad 17 smd roundrect (at 0 0) (size 1.651 2.845) (layers F.Cu F.Mask) (roundrect_rratio 0.151423)
      (net 3 GNDA))
    (model ${MSAG}/MSAG_KiCad3d/Housings_MSOP.3dshapes/MSOP-16-1EP_3x4mm_P0.5mm_EP1.65x2.85mm.step
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:SOT-23-6_Handsoldering (layer F.Cu) (tedit 5BBB694B)
    (at 147.6756 120.5103)
    (descr "6-pin SOT-23 package, Handsoldering")
    (tags "SOT-23-6 Handsoldering")
    (attr smd)
    (fp_text reference U7 (at 0 -2.9) (layer F.SilkS))
    (fp_text value OPA357 (at 0 2.9) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd rect (at -1.35 -0.95) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask)
      (net 28 "Net-(Jadc1-Pad3)"))
    (pad 2 smd rect (at -1.35 0) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask)
      (net 3 GNDA))
    (pad 3 smd rect (at -1.35 0.95) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask)
      (net 12 /Vcm))
    (pad 4 smd rect (at 1.35 0.95) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask)
      (net 19 "Net-(R13-Pad1)"))
    (pad 6 smd rect (at 1.35 -0.95) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask)
      (net 5 +3.3VA))
    (pad 5 smd rect (at 1.35 0) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask))
    (model ${MSAG3D}/TO_SOT_Packages_SMD.3dshapes/SOT-23-6.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:SOT-23-6_Handsoldering (layer F.Cu) (tedit 5BBB694B)
    (at 147.6337 115.1026)
    (descr "6-pin SOT-23 package, Handsoldering")
    (tags "SOT-23-6 Handsoldering")
    (attr smd)
    (fp_text reference U3 (at 0 -2.9) (layer F.SilkS))
    (fp_text value OPA357 (at 0 2.9) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd rect (at -1.35 -0.95) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask)
      (net 27 "Net-(Jadc1-Pad1)"))
    (pad 2 smd rect (at -1.35 0) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask)
      (net 3 GNDA))
    (pad 3 smd rect (at -1.35 0.95) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask)
      (net 16 /Vlpf))
    (pad 4 smd rect (at 1.35 0.95) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask)
      (net 27 "Net-(Jadc1-Pad1)"))
    (pad 6 smd rect (at 1.35 -0.95) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask)
      (net 5 +3.3VA))
    (pad 5 smd rect (at 1.35 0) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask))
    (model ${MSAG3D}/TO_SOT_Packages_SMD.3dshapes/SOT-23-6.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_SO:SOIC-8_3.9x4.9mm_P1.27mm (layer F.Cu) (tedit 5C97300E)
    (at 144.0307 130.6449)
    (descr "SOIC, 8 Pin (JEDEC MS-012AA, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/soic_narrow-r/r_8.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py")
    (tags "SOIC SO")
    (attr smd)
    (fp_text reference U2 (at 0 -3.4) (layer F.SilkS))
    (fp_text value ADR44X (at 0 3.4) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 8 smd roundrect (at 2.475 -1.905) (size 1.95 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
    (pad 7 smd roundrect (at 2.475 -0.635) (size 1.95 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
    (pad 6 smd roundrect (at 2.475 0.635) (size 1.95 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 21 /Vadr44X))
    (pad 5 smd roundrect (at 2.475 1.905) (size 1.95 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
    (pad 4 smd roundrect (at -2.475 1.905) (size 1.95 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 3 GNDA))
    (pad 3 smd roundrect (at -2.475 0.635) (size 1.95 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
    (pad 2 smd roundrect (at -2.475 -0.635) (size 1.95 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 5 +3.3VA))
    (pad 1 smd roundrect (at -2.475 -1.905) (size 1.95 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
    (model ${KISYS3DMOD}/Package_SO.3dshapes/SOIC-8_3.9x4.9mm_P1.27mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:R_0805_HandSoldering (layer F.Cu) (tedit 5C5B175C)
    (at 142.3797 114.0587 180)
    (descr "Resistor SMD 0805, hand soldering")
    (tags "resistor 0805")
    (attr smd)
    (fp_text reference R18 (at -0.127 1.7145) (layer F.SilkS))
    (fp_text value TBD (at 0 0.35) (layer F.Fab))
    (fp_text user %R (at 0 -0.2) (layer F.Fab))
    (pad 1 smd rect (at -1.35 0 180) (size 1.5 1.3) (layers F.Cu F.Paste F.Mask)
      (net 16 /Vlpf))
    (pad 2 smd rect (at 1.35 0 180) (size 1.5 1.3) (layers F.Cu F.Paste F.Mask)
      (net 10 /Vsklpf))
    (model ${MSAG3D}/Resistors_SMD.3dshapes/R_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:R_0805_HandSoldering (layer F.Cu) (tedit 5C5B175C)
    (at 160.6842 117.6401 180)
    (descr "Resistor SMD 0805, hand soldering")
    (tags "resistor 0805")
    (attr smd)
    (fp_text reference R16 (at -0.2756 -1.6637) (layer F.SilkS))
    (fp_text value 50 (at 0 0.35) (layer F.Fab))
    (fp_text user %R (at 0 -0.2) (layer F.Fab))
    (pad 1 smd rect (at -1.35 0 180) (size 1.5 1.3) (layers F.Cu F.Paste F.Mask)
      (net 14 /Vadc-))
    (pad 2 smd rect (at 1.35 0 180) (size 1.5 1.3) (layers F.Cu F.Paste F.Mask)
      (net 28 "Net-(Jadc1-Pad3)"))
    (model ${MSAG3D}/Resistors_SMD.3dshapes/R_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:R_0805_HandSoldering (layer B.Cu) (tedit 5C5B175C)
    (at 160.6804 117.6401)
    (descr "Resistor SMD 0805, hand soldering")
    (tags "resistor 0805")
    (attr smd)
    (fp_text reference R14 (at 0.3556 1.7145 180) (layer B.SilkS))
    (fp_text value 200 (at 0 -0.35 180) (layer B.Fab))
    (fp_text user %R (at 0 0.2 180) (layer B.Fab))
    (pad 1 smd rect (at -1.35 0) (size 1.5 1.3) (layers B.Cu B.Paste B.Mask)
      (net 28 "Net-(Jadc1-Pad3)"))
    (pad 2 smd rect (at 1.35 0) (size 1.5 1.3) (layers B.Cu B.Paste B.Mask)
      (net 19 "Net-(R13-Pad1)"))
    (model ${MSAG3D}/Resistors_SMD.3dshapes/R_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:R_0805_HandSoldering (layer F.Cu) (tedit 5C5B175C)
    (at 158.4833 122.7201)
    (descr "Resistor SMD 0805, hand soldering")
    (tags "resistor 0805")
    (attr smd)
    (fp_text reference R12 (at 0.9271 -1.4097) (layer F.SilkS))
    (fp_text value 15k (at 0 0.35) (layer F.Fab))
    (fp_text user %R (at 0 -0.2) (layer F.Fab))
    (pad 1 smd rect (at -1.35 0) (size 1.5 1.3) (layers F.Cu F.Paste F.Mask)
      (net 3 GNDA))
    (pad 2 smd rect (at 1.35 0) (size 1.5 1.3) (layers F.Cu F.Paste F.Mask)
      (net 12 /Vcm))
    (model ${MSAG3D}/Resistors_SMD.3dshapes/R_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:R_0805_HandSoldering (layer F.Cu) (tedit 5C5B175C)
    (at 158.4833 124.6632 180)
    (descr "Resistor SMD 0805, hand soldering")
    (tags "resistor 0805")
    (attr smd)
    (fp_text reference R11 (at 0 -1.7) (layer F.SilkS))
    (fp_text value 10k (at 0 0.35) (layer F.Fab))
    (fp_text user %R (at 0 -0.2) (layer F.Fab))
    (pad 1 smd rect (at -1.35 0 180) (size 1.5 1.3) (layers F.Cu F.Paste F.Mask)
      (net 12 /Vcm))
    (pad 2 smd rect (at 1.35 0 180) (size 1.5 1.3) (layers F.Cu F.Paste F.Mask)
      (net 11 /REFOUT))
    (model ${MSAG3D}/Resistors_SMD.3dshapes/R_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:Pin_Header_Straight_1x02_Pitch2.54mm (layer F.Cu) (tedit 5C52ECC1)
    (at 178.1048 105.1306)
    (descr "Through hole straight pin header, 1x02, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x02 2.54mm single row")
    (fp_text reference Jcmos1 (at -2.0828 1.5494 90) (layer F.SilkS))
    (fp_text value Conn_02x01 (at 0 4.87) (layer F.Fab))
    (fp_text user %R (at 0 1.27 90) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 17 /CMOSn_LVDS))
    (pad 2 thru_hole oval (at 0 2.54) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 3 GNDA))
    (model ${MSAG3D}/Connector_PinHeader_2.54mm.3dshapes/Pin_Header_Straight_1x02_Pitch2.54mm.step
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:Pin_Header_Straight_1x02_Pitch2.54mm (layer F.Cu) (tedit 5C52ECC1)
    (at 165.3286 106.553)
    (descr "Through hole straight pin header, 1x02, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x02 2.54mm single row")
    (fp_text reference Jrefin1 (at 0.0508 -2.159) (layer F.SilkS))
    (fp_text value Conn_02x01 (at 0 4.87) (layer F.Fab))
    (fp_text user %R (at 0 1.27 90) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 15 /REFIN))
    (pad 2 thru_hole oval (at 0 2.54) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 3 GNDA))
    (model ${MSAG3D}/Connector_PinHeader_2.54mm.3dshapes/Pin_Header_Straight_1x02_Pitch2.54mm.step
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:C_0805_HandSoldering (layer B.Cu) (tedit 5C5B15B8)
    (at 156.0576 130.3347 270)
    (descr "Capacitor SMD 0805, hand soldering")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C43 (at -2.7505 0.127) (layer B.SilkS))
    (fp_text value 1uF (at 0 -0.35 90) (layer B.Fab))
    (fp_text user %R (at 0.15 0.2 90) (layer B.Fab))
    (pad 1 smd rect (at -1.25 0 270) (size 1.5 1.25) (layers B.Cu B.Paste B.Mask)
      (net 5 +3.3VA))
    (pad 2 smd rect (at 1.25 0 270) (size 1.5 1.25) (layers B.Cu B.Paste B.Mask)
      (net 3 GNDA))
    (model ${MSAG3D}/Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:C_0805_HandSoldering (layer B.Cu) (tedit 5C5B15B8)
    (at 157.9626 130.3347 270)
    (descr "Capacitor SMD 0805, hand soldering")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C42 (at 2.8375 -0.2667) (layer B.SilkS))
    (fp_text value 10uF (at 0 -0.35 90) (layer B.Fab))
    (fp_text user %R (at 0.15 0.2 90) (layer B.Fab))
    (pad 1 smd rect (at -1.25 0 270) (size 1.5 1.25) (layers B.Cu B.Paste B.Mask)
      (net 5 +3.3VA))
    (pad 2 smd rect (at 1.25 0 270) (size 1.5 1.25) (layers B.Cu B.Paste B.Mask)
      (net 3 GNDA))
    (model ${MSAG3D}/Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:C_0805_HandSoldering (layer F.Cu) (tedit 5C5B15B8)
    (at 142.4432 116.0526 180)
    (descr "Capacitor SMD 0805, hand soldering")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C41 (at 0.0181 -1.6637) (layer F.SilkS))
    (fp_text value TBD (at 0 0.35) (layer F.Fab))
    (fp_text user %R (at 0.15 -0.2) (layer F.Fab))
    (pad 1 smd rect (at -1.25 0 180) (size 1.5 1.25) (layers F.Cu F.Paste F.Mask)
      (net 16 /Vlpf))
    (pad 2 smd rect (at 1.25 0 180) (size 1.5 1.25) (layers F.Cu F.Paste F.Mask)
      (net 3 GNDA))
    (model ${MSAG3D}/Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:C_0805_HandSoldering (layer B.Cu) (tedit 5C5B15B8)
    (at 170.2816 116.1796 270)
    (descr "Capacitor SMD 0805, hand soldering")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C40 (at -0.0254 -1.6764 90) (layer B.SilkS))
    (fp_text value 10uF (at 0 -0.35 90) (layer B.Fab))
    (fp_text user %R (at 0.15 0.2 90) (layer B.Fab))
    (pad 1 smd rect (at -1.25 0 270) (size 1.5 1.25) (layers B.Cu B.Paste B.Mask)
      (net 11 /REFOUT))
    (pad 2 smd rect (at 1.25 0 270) (size 1.5 1.25) (layers B.Cu B.Paste B.Mask)
      (net 3 GNDA))
    (model ${MSAG3D}/Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:C_0805_HandSoldering (layer F.Cu) (tedit 5C5B15B8)
    (at 168.529 111.41932 90)
    (descr "Capacitor SMD 0805, hand soldering")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C39 (at 0.0835 1.905 270) (layer F.SilkS))
    (fp_text value 10uF (at 0 0.35 270) (layer F.Fab))
    (fp_text user %R (at 0.15 -0.2 270) (layer F.Fab))
    (pad 1 smd rect (at -1.25 0 90) (size 1.5 1.25) (layers F.Cu F.Paste F.Mask)
      (net 15 /REFIN))
    (pad 2 smd rect (at 1.25 0 90) (size 1.5 1.25) (layers F.Cu F.Paste F.Mask)
      (net 3 GNDA))
    (model ${MSAG3D}/Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:C_0805_HandSoldering (layer B.Cu) (tedit 5C5B15B8)
    (at 147.701 119.2911 180)
    (descr "Capacitor SMD 0805, hand soldering")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C35 (at -3.8608 0.7239) (layer B.SilkS))
    (fp_text value 1uF (at 0 -0.35) (layer B.Fab))
    (fp_text user %R (at 0.15 0.2) (layer B.Fab))
    (pad 1 smd rect (at -1.25 0 180) (size 1.5 1.25) (layers B.Cu B.Paste B.Mask)
      (net 5 +3.3VA))
    (pad 2 smd rect (at 1.25 0 180) (size 1.5 1.25) (layers B.Cu B.Paste B.Mask)
      (net 3 GNDA))
    (model ${MSAG3D}/Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:C_0805_HandSoldering (layer B.Cu) (tedit 5C5B15B8)
    (at 147.5867 114.1476 180)
    (descr "Capacitor SMD 0805, hand soldering")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C34 (at 0 1.75) (layer B.SilkS))
    (fp_text value 1uF (at 0 -0.35) (layer B.Fab))
    (fp_text user %R (at 0.15 0.2) (layer B.Fab))
    (pad 1 smd rect (at -1.25 0 180) (size 1.5 1.25) (layers B.Cu B.Paste B.Mask)
      (net 5 +3.3VA))
    (pad 2 smd rect (at 1.25 0 180) (size 1.5 1.25) (layers B.Cu B.Paste B.Mask)
      (net 3 GNDA))
    (model ${MSAG3D}/Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:C_0805_HandSoldering (layer B.Cu) (tedit 5C5B15B8)
    (at 147.6756 121.1961 180)
    (descr "Capacitor SMD 0805, hand soldering")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C33 (at -3.7084 -0.2413) (layer B.SilkS))
    (fp_text value 10uF (at 0 -0.35) (layer B.Fab))
    (fp_text user %R (at 0.15 0.2) (layer B.Fab))
    (pad 1 smd rect (at -1.25 0 180) (size 1.5 1.25) (layers B.Cu B.Paste B.Mask)
      (net 5 +3.3VA))
    (pad 2 smd rect (at 1.25 0 180) (size 1.5 1.25) (layers B.Cu B.Paste B.Mask)
      (net 3 GNDA))
    (model ${MSAG3D}/Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:C_0805_HandSoldering (layer B.Cu) (tedit 5C5B15B8)
    (at 147.5867 116.0272 180)
    (descr "Capacitor SMD 0805, hand soldering")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C32 (at 0.0054 -1.6764) (layer B.SilkS))
    (fp_text value 10uF (at 0 -0.35) (layer B.Fab))
    (fp_text user %R (at 0.15 0.2) (layer B.Fab))
    (pad 1 smd rect (at -1.25 0 180) (size 1.5 1.25) (layers B.Cu B.Paste B.Mask)
      (net 5 +3.3VA))
    (pad 2 smd rect (at 1.25 0 180) (size 1.5 1.25) (layers B.Cu B.Paste B.Mask)
      (net 3 GNDA))
    (model ${MSAG3D}/Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:C_0805_HandSoldering (layer B.Cu) (tedit 5C5B15B8)
    (at 158.4706 122.7328 180)
    (descr "Capacitor SMD 0805, hand soldering")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C31 (at -0.762 1.4986) (layer B.SilkS))
    (fp_text value 1uF (at 0 -0.35) (layer B.Fab))
    (fp_text user %R (at 0.15 0.2) (layer B.Fab))
    (pad 1 smd rect (at -1.25 0 180) (size 1.5 1.25) (layers B.Cu B.Paste B.Mask)
      (net 12 /Vcm))
    (pad 2 smd rect (at 1.25 0 180) (size 1.5 1.25) (layers B.Cu B.Paste B.Mask)
      (net 3 GNDA))
    (model ${MSAG3D}/Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:R_0805_HandSoldering (layer B.Cu) (tedit 5C5B175C)
    (at 149.9489 104.902)
    (descr "Resistor SMD 0805, hand soldering")
    (tags "resistor 0805")
    (attr smd)
    (fp_text reference R7 (at -0.0635 -1.8415 -180) (layer B.SilkS))
    (fp_text value TBD (at 0 -1.75) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 1 smd rect (at -1.35 0) (size 1.5 1.3) (layers B.Cu B.Paste B.Mask)
      (net 10 /Vsklpf))
    (pad 2 smd rect (at 1.35 0) (size 1.5 1.3) (layers B.Cu B.Paste B.Mask)
      (net 9 /Vin))
    (model ${MSAG3D}/Resistors_SMD.3dshapes/R_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:Header_2x20_2.54mm_male (layer B.Cu) (tedit 5C02EEB4)
    (at 189.6491 94.8055 180)
    (descr "Through hole straight pin header, 2x20, 2.54mm pitch, double rows")
    (tags "Through hole pin header THT 2x20 2.54mm double row")
    (fp_text reference J3 (at 1.27 2.33 180) (layer B.SilkS))
    (fp_text value Conn_02x20_Odd_Even (at 1.27 -50.59 180) (layer B.Fab))
    (fp_text user %R (at 1.27 -24.13 90) (layer B.Fab))
    (pad 40 thru_hole oval (at 2.54 -48.26 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 39 thru_hole oval (at 0 -48.26 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
    (pad 38 thru_hole oval (at 2.54 -45.72 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
    (pad 37 thru_hole oval (at 0 -45.72 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
    (pad 36 thru_hole oval (at 2.54 -43.18 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
    (pad 35 thru_hole oval (at 0 -43.18 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
    (pad 34 thru_hole oval (at 2.54 -40.64 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
    (pad 33 thru_hole oval (at 0 -40.64 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
    (pad 32 thru_hole oval (at 2.54 -38.1 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
    (pad 31 thru_hole oval (at 0 -38.1 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
    (pad 30 thru_hole oval (at 2.54 -35.56 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 29 thru_hole oval (at 0 -35.56 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 2 VDD))
    (pad 28 thru_hole oval (at 2.54 -33.02 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
    (pad 27 thru_hole oval (at 0 -33.02 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
    (pad 26 thru_hole oval (at 2.54 -30.48 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
    (pad 25 thru_hole oval (at 0 -30.48 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 26 /MISO_FPGA-))
    (pad 24 thru_hole oval (at 2.54 -27.94 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 25 /MISO_FPGA+))
    (pad 23 thru_hole oval (at 0 -27.94 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
    (pad 22 thru_hole oval (at 2.54 -25.4 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
    (pad 21 thru_hole oval (at 0 -25.4 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
    (pad 20 thru_hole oval (at 2.54 -22.86 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
    (pad 19 thru_hole oval (at 0 -22.86 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 24 /SCK_FPGA-))
    (pad 18 thru_hole oval (at 2.54 -20.32 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 23 /SCK_FPGA+))
    (pad 17 thru_hole oval (at 0 -20.32 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
    (pad 16 thru_hole oval (at 2.54 -17.78 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
    (pad 15 thru_hole oval (at 0 -17.78 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 22 /SCSn_FPGA))
    (pad 14 thru_hole oval (at 2.54 -15.24 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
    (pad 13 thru_hole oval (at 0 -15.24 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
    (pad 12 thru_hole oval (at 2.54 -12.7 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 11 thru_hole oval (at 0 -12.7 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 2 VDD))
    (pad 10 thru_hole oval (at 2.54 -10.16 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
    (pad 9 thru_hole oval (at 0 -10.16 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
    (pad 8 thru_hole oval (at 2.54 -7.62 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
    (pad 7 thru_hole oval (at 0 -7.62 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
    (pad 6 thru_hole oval (at 2.54 -5.08 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
    (pad 5 thru_hole oval (at 0 -5.08 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
    (pad 4 thru_hole oval (at 2.54 -2.54 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
    (pad 3 thru_hole oval (at 0 -2.54 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
    (pad 2 thru_hole oval (at 2.54 0 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 1 thru_hole rect (at 0 0 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
    (model ${MSAG}/MSAG_KiCad3d/ESQ-120-12-G-D.step
      (offset (xyz 1.269999980926514 -24.12999963760376 1.904999971389771))
      (scale (xyz 1 1 1))
      (rotate (xyz -90 0 90))
    )
  )
  (module MSAG_Misc:Pin_Header_Straight_1x02_Pitch2.54mm (layer F.Cu) (tedit 5C52ECC1)
    (at 182.88 94.742 270)
    (descr "Through hole straight pin header, 1x02, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x02 2.54mm single row")
    (fp_text reference JGND1 (at -2.159 2.54 180) (layer F.SilkS))
    (fp_text value Conn_02x01 (at 0 4.87 270) (layer F.Fab))
    (fp_text user %R (at 0 1.27) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 2 thru_hole oval (at 0 2.54 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 3 GNDA))
    (model ${MSAG3D}/Connector_PinHeader_2.54mm.3dshapes/Pin_Header_Straight_1x02_Pitch2.54mm.step
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:Pin_Header_Straight_1x02_Pitch2.54mm (layer F.Cu) (tedit 5C52ECC1)
    (at 182.372 135.128)
    (descr "Through hole straight pin header, 1x02, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x02 2.54mm single row")
    (fp_text reference JPWRD1 (at 0.0508 -2.1336) (layer F.SilkS))
    (fp_text value Conn_02x01 (at 0 4.87) (layer F.Fab))
    (fp_text user %R (at 0 1.27 90) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 2 VDD))
    (pad 2 thru_hole oval (at 0 2.54) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (model ${MSAG3D}/Connector_PinHeader_2.54mm.3dshapes/Pin_Header_Straight_1x02_Pitch2.54mm.step
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:Pin_Header_Straight_1x02_Pitch2.54mm (layer F.Cu) (tedit 5C52ECC1)
    (at 146.812 139.065)
    (descr "Through hole straight pin header, 1x02, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x02 2.54mm single row")
    (fp_text reference JPWRA1 (at 0 -2.54 180) (layer F.SilkS))
    (fp_text value Conn_02x01 (at 0 4.87) (layer F.Fab))
    (fp_text user %R (at 0 1.27 90) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 5 +3.3VA))
    (pad 2 thru_hole oval (at 0 2.54) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 3 GNDA))
    (model ${MSAG3D}/Connector_PinHeader_2.54mm.3dshapes/Pin_Header_Straight_1x02_Pitch2.54mm.step
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:Pin_Header_Straight_1x02_Pitch2.54mm (layer F.Cu) (tedit 5C52ECC1)
    (at 182.9816 105.4862)
    (descr "Through hole straight pin header, 1x02, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x02 2.54mm single row")
    (fp_text reference JSCS1 (at -2.1336 1.4478 90) (layer F.SilkS))
    (fp_text value Conn_02x01 (at 0 4.87) (layer F.Fab))
    (fp_text user %R (at 0 1.27 90) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 22 /SCSn_FPGA))
    (pad 2 thru_hole oval (at 0 2.54) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (model ${MSAG3D}/Connector_PinHeader_2.54mm.3dshapes/Pin_Header_Straight_1x02_Pitch2.54mm.step
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:C_0805_HandSoldering (layer F.Cu) (tedit 5C5B15B8)
    (at 144.5187 103.8225)
    (descr "Capacitor SMD 0805, hand soldering")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C1 (at 3.3855 -0.127 180) (layer F.SilkS))
    (fp_text value TBD (at 0 1.75) (layer F.Fab))
    (fp_text user %R (at 0 -1.75) (layer F.Fab))
    (pad 1 smd rect (at -1.25 0) (size 1.5 1.25) (layers F.Cu F.Paste F.Mask)
      (net 7 "Net-(C1-Pad1)"))
    (pad 2 smd rect (at 1.25 0) (size 1.5 1.25) (layers F.Cu F.Paste F.Mask)
      (net 10 /Vsklpf))
    (model ${MSAG3D}/Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:C_0805_HandSoldering (layer F.Cu) (tedit 5C5B15B8)
    (at 160.274 140.315 270)
    (descr "Capacitor SMD 0805, hand soldering")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C16 (at -4.044 -0.381 270) (layer F.SilkS))
    (fp_text value 0.01uF (at 0 1.75 270) (layer F.Fab))
    (fp_text user %R (at 0 -1.75 270) (layer F.Fab))
    (pad 1 smd rect (at -1.25 0 270) (size 1.5 1.25) (layers F.Cu F.Paste F.Mask)
      (net 5 +3.3VA))
    (pad 2 smd rect (at 1.25 0 270) (size 1.5 1.25) (layers F.Cu F.Paste F.Mask)
      (net 3 GNDA))
    (model ${MSAG3D}/Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:C_0805_HandSoldering (layer F.Cu) (tedit 5C5B15B8)
    (at 158.01975 140.315 270)
    (descr "Capacitor SMD 0805, hand soldering")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C15 (at -4.038889 -0.09144 270) (layer F.SilkS))
    (fp_text value 0.1uF (at 0 1.75 270) (layer F.Fab))
    (fp_text user %R (at 0 -1.75 270) (layer F.Fab))
    (pad 1 smd rect (at -1.25 0 270) (size 1.5 1.25) (layers F.Cu F.Paste F.Mask)
      (net 5 +3.3VA))
    (pad 2 smd rect (at 1.25 0 270) (size 1.5 1.25) (layers F.Cu F.Paste F.Mask)
      (net 3 GNDA))
    (model ${MSAG3D}/Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:C_0805_HandSoldering (layer F.Cu) (tedit 5C5B15B8)
    (at 162.52825 140.315 270)
    (descr "Capacitor SMD 0805, hand soldering")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C12 (at -4.038889 -0.79375 270) (layer F.SilkS))
    (fp_text value 0.01uF (at 0 1.75 270) (layer F.Fab))
    (fp_text user %R (at 0 -1.75 270) (layer F.Fab))
    (pad 1 smd rect (at -1.25 0 270) (size 1.5 1.25) (layers F.Cu F.Paste F.Mask)
      (net 5 +3.3VA))
    (pad 2 smd rect (at 1.25 0 270) (size 1.5 1.25) (layers F.Cu F.Paste F.Mask)
      (net 3 GNDA))
    (model ${MSAG3D}/Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:C_0805_HandSoldering (layer F.Cu) (tedit 5C5B15B8)
    (at 153.51125 140.315 270)
    (descr "Capacitor SMD 0805, hand soldering")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C14 (at -4.044 0.34925 270) (layer F.SilkS))
    (fp_text value 1uF (at 0 1.75 270) (layer F.Fab))
    (fp_text user %R (at 0 -1.75 270) (layer F.Fab))
    (pad 1 smd rect (at -1.25 0 270) (size 1.5 1.25) (layers F.Cu F.Paste F.Mask)
      (net 5 +3.3VA))
    (pad 2 smd rect (at 1.25 0 270) (size 1.5 1.25) (layers F.Cu F.Paste F.Mask)
      (net 3 GNDA))
    (model ${MSAG3D}/Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:C_0805_HandSoldering (layer F.Cu) (tedit 5C5B15B8)
    (at 178.264265 136.380469 270)
    (descr "Capacitor SMD 0805, hand soldering")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C2 (at -3.2458 0 270) (layer F.SilkS))
    (fp_text value 1uF (at 0 1.75 270) (layer F.Fab))
    (fp_text user %R (at 0 -1.75 270) (layer F.Fab))
    (pad 1 smd rect (at -1.25 0 270) (size 1.5 1.25) (layers F.Cu F.Paste F.Mask)
      (net 2 VDD))
    (pad 2 smd rect (at 1.25 0 270) (size 1.5 1.25) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (model ${MSAG3D}/Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:C_0805_HandSoldering (layer F.Cu) (tedit 5C5B15B8)
    (at 151.257 140.315 270)
    (descr "Capacitor SMD 0805, hand soldering")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C13 (at -4.044 0.635 90) (layer F.SilkS))
    (fp_text value 10uF (at 0 1.75 270) (layer F.Fab))
    (fp_text user %R (at 0 -1.75 270) (layer F.Fab))
    (pad 1 smd rect (at -1.25 0 270) (size 1.5 1.25) (layers F.Cu F.Paste F.Mask)
      (net 5 +3.3VA))
    (pad 2 smd rect (at 1.25 0 270) (size 1.5 1.25) (layers F.Cu F.Paste F.Mask)
      (net 3 GNDA))
    (model ${MSAG3D}/Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:C_0805_HandSoldering (layer B.Cu) (tedit 5C5B15B8)
    (at 144.130364 107.279585 180)
    (descr "Capacitor SMD 0805, hand soldering")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C10 (at 3.882121 -0.010015 180) (layer B.SilkS))
    (fp_text value 10uF (at 0 -1.75 180) (layer B.Fab))
    (fp_text user %R (at 0 1.75 180) (layer B.Fab))
    (pad 1 smd rect (at -1.25 0 180) (size 1.5 1.25) (layers B.Cu B.Paste B.Mask)
      (net 5 +3.3VA))
    (pad 2 smd rect (at 1.25 0 180) (size 1.5 1.25) (layers B.Cu B.Paste B.Mask)
      (net 3 GNDA))
    (model ${MSAG3D}/Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:C_0805_HandSoldering (layer F.Cu) (tedit 5C5B15B8)
    (at 168.739265 136.380469 270)
    (descr "Capacitor SMD 0805, hand soldering")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C9 (at -3.2458 0.0762 270) (layer F.SilkS))
    (fp_text value 0.01uF (at 0 1.75 270) (layer F.Fab))
    (fp_text user %R (at 0 -1.75 270) (layer F.Fab))
    (pad 1 smd rect (at -1.25 0 270) (size 1.5 1.25) (layers F.Cu F.Paste F.Mask)
      (net 2 VDD))
    (pad 2 smd rect (at 1.25 0 270) (size 1.5 1.25) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (model ${MSAG3D}/Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:C_0805_HandSoldering (layer F.Cu) (tedit 5C5B15B8)
    (at 141.7828 108.2094 270)
    (descr "Capacitor SMD 0805, hand soldering")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C8 (at -2.9137 -0.0508) (layer F.SilkS))
    (fp_text value TBD (at 0 1.75 90) (layer F.Fab))
    (fp_text user %R (at 0 -1.75 90) (layer F.Fab))
    (pad 1 smd rect (at -1.25 0 270) (size 1.5 1.25) (layers F.Cu F.Paste F.Mask)
      (net 6 "Net-(C8-Pad1)"))
    (pad 2 smd rect (at 1.25 0 270) (size 1.5 1.25) (layers F.Cu F.Paste F.Mask)
      (net 3 GNDA))
    (model ${MSAG3D}/Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:C_0805_HandSoldering (layer F.Cu) (tedit 5C5B15B8)
    (at 155.7655 140.315 270)
    (descr "Capacitor SMD 0805, hand soldering")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C7 (at -3.562698 0.154231 90) (layer F.SilkS))
    (fp_text value 1uF (at 0 1.75 270) (layer F.Fab))
    (fp_text user %R (at 0 -1.75 270) (layer F.Fab))
    (pad 1 smd rect (at -1.25 0 270) (size 1.5 1.25) (layers F.Cu F.Paste F.Mask)
      (net 5 +3.3VA))
    (pad 2 smd rect (at 1.25 0 270) (size 1.5 1.25) (layers F.Cu F.Paste F.Mask)
      (net 3 GNDA))
    (model ${MSAG3D}/Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:C_0805_HandSoldering (layer F.Cu) (tedit 5C5B15B8)
    (at 176.425305 136.380469 270)
    (descr "Capacitor SMD 0805, hand soldering")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C3 (at -3.2458 0.06604 270) (layer F.SilkS))
    (fp_text value 0.1uF (at 0 1.75 270) (layer F.Fab))
    (fp_text user %R (at 0 -1.75 270) (layer F.Fab))
    (pad 1 smd rect (at -1.25 0 270) (size 1.5 1.25) (layers F.Cu F.Paste F.Mask)
      (net 2 VDD))
    (pad 2 smd rect (at 1.25 0 270) (size 1.5 1.25) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (model ${MSAG3D}/Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:C_0805_HandSoldering (layer F.Cu) (tedit 5C5B15B8)
    (at 174.454265 136.380469 270)
    (descr "Capacitor SMD 0805, hand soldering")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C4 (at -3.2458 0 270) (layer F.SilkS))
    (fp_text value 0.1uF (at 0 1.75 270) (layer F.Fab))
    (fp_text user %R (at 0 -1.75 270) (layer F.Fab))
    (pad 1 smd rect (at -1.25 0 270) (size 1.5 1.25) (layers F.Cu F.Paste F.Mask)
      (net 2 VDD))
    (pad 2 smd rect (at 1.25 0 270) (size 1.5 1.25) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (model ${MSAG3D}/Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:C_0805_HandSoldering (layer F.Cu) (tedit 5C5B15B8)
    (at 172.549265 136.380469 270)
    (descr "Capacitor SMD 0805, hand soldering")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C5 (at -3.2458 0.07112 270) (layer F.SilkS))
    (fp_text value 0.01uF (at 0 1.75 270) (layer F.Fab))
    (fp_text user %R (at 0 -1.75 270) (layer F.Fab))
    (pad 1 smd rect (at -1.25 0 270) (size 1.5 1.25) (layers F.Cu F.Paste F.Mask)
      (net 2 VDD))
    (pad 2 smd rect (at 1.25 0 270) (size 1.5 1.25) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (model ${MSAG3D}/Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:C_0805_HandSoldering (layer B.Cu) (tedit 5C5B15B8)
    (at 143.0655 130.6757 270)
    (descr "Capacitor SMD 0805, hand soldering")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C11 (at -3.8662 0 90) (layer B.SilkS))
    (fp_text value 10uF (at 0 -1.75 270) (layer B.Fab))
    (fp_text user %R (at 0 1.75 270) (layer B.Fab))
    (pad 1 smd rect (at -1.25 0 270) (size 1.5 1.25) (layers B.Cu B.Paste B.Mask)
      (net 5 +3.3VA))
    (pad 2 smd rect (at 1.25 0 270) (size 1.5 1.25) (layers B.Cu B.Paste B.Mask)
      (net 3 GNDA))
    (model ${MSAG3D}/Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:C_0805_HandSoldering (layer F.Cu) (tedit 5C5B15B8)
    (at 170.644265 136.380469 270)
    (descr "Capacitor SMD 0805, hand soldering")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C6 (at -3.2458 0 270) (layer F.SilkS))
    (fp_text value 0.01uF (at 0 1.75 270) (layer F.Fab))
    (fp_text user %R (at 0 -1.75 270) (layer F.Fab))
    (pad 1 smd rect (at -1.25 0 270) (size 1.5 1.25) (layers F.Cu F.Paste F.Mask)
      (net 2 VDD))
    (pad 2 smd rect (at 1.25 0 270) (size 1.5 1.25) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (model ${MSAG3D}/Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:R_0805_HandSoldering (layer F.Cu) (tedit 5C5B175C)
    (at 145.2245 100.33 90)
    (descr "Resistor SMD 0805, hand soldering")
    (tags "resistor 0805")
    (attr smd)
    (fp_text reference R2 (at 3.0734 -2.1082 180) (layer F.SilkS))
    (fp_text value TBD (at 0 1.75 270) (layer F.Fab))
    (fp_text user %R (at 0 0 270) (layer F.Fab))
    (pad 1 smd rect (at -1.35 0 90) (size 1.5 1.3) (layers F.Cu F.Paste F.Mask)
      (net 7 "Net-(C1-Pad1)"))
    (pad 2 smd rect (at 1.35 0 90) (size 1.5 1.3) (layers F.Cu F.Paste F.Mask)
      (net 9 /Vin))
    (model ${MSAG3D}/Resistors_SMD.3dshapes/R_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:R_0805_HandSoldering (layer F.Cu) (tedit 5C5B175C)
    (at 147.1676 100.33 270)
    (descr "Resistor SMD 0805, hand soldering")
    (tags "resistor 0805")
    (attr smd)
    (fp_text reference R1 (at -3.048 -0.1397) (layer F.SilkS))
    (fp_text value 49.9 (at 0 1.75 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd rect (at -1.35 0 270) (size 1.5 1.3) (layers F.Cu F.Paste F.Mask)
      (net 9 /Vin))
    (pad 2 smd rect (at 1.35 0 270) (size 1.5 1.3) (layers F.Cu F.Paste F.Mask)
      (net 3 GNDA))
    (model ${MSAG3D}/Resistors_SMD.3dshapes/R_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:R_0805_HandSoldering (layer F.Cu) (tedit 5C5B175C)
    (at 143.2433 100.3808 270)
    (descr "Resistor SMD 0805, hand soldering")
    (tags "resistor 0805")
    (attr smd)
    (fp_text reference R3 (at -3.0734 -1.9685) (layer F.SilkS))
    (fp_text value TBD (at 0 1.75 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd rect (at -1.35 0 270) (size 1.5 1.3) (layers F.Cu F.Paste F.Mask)
      (net 6 "Net-(C8-Pad1)"))
    (pad 2 smd rect (at 1.35 0 270) (size 1.5 1.3) (layers F.Cu F.Paste F.Mask)
      (net 7 "Net-(C1-Pad1)"))
    (model ${MSAG3D}/Resistors_SMD.3dshapes/R_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:SOT-23-6_Handsoldering (layer F.Cu) (tedit 5BBB694B)
    (at 144.8206 108.1621 270)
    (descr "6-pin SOT-23 package, Handsoldering")
    (tags "SOT-23-6 Handsoldering")
    (attr smd)
    (fp_text reference U1 (at -1.317 -2.4232 90) (layer F.SilkS))
    (fp_text value OPA357 (at 0 2.9 90) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd rect (at -1.35 -0.95 270) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask)
      (net 10 /Vsklpf))
    (pad 2 smd rect (at -1.35 0 270) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask)
      (net 3 GNDA))
    (pad 3 smd rect (at -1.35 0.95 270) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask)
      (net 6 "Net-(C8-Pad1)"))
    (pad 4 smd rect (at 1.35 0.95 270) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask)
      (net 10 /Vsklpf))
    (pad 6 smd rect (at 1.35 -0.95 270) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask)
      (net 5 +3.3VA))
    (pad 5 smd rect (at 1.35 0 270) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask))
    (model ${MSAG3D}/TO_SOT_Packages_SMD.3dshapes/SOT-23-6.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:C_0805_HandSoldering (layer B.Cu) (tedit 5C5B15B8)
    (at 144.130364 109.3216 180)
    (descr "Capacitor SMD 0805, hand soldering")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C17 (at 3.81 -0.127) (layer B.SilkS))
    (fp_text value 1uF (at 0 -1.75 180) (layer B.Fab))
    (fp_text user %R (at 0 1.75 180) (layer B.Fab))
    (pad 1 smd rect (at -1.25 0 180) (size 1.5 1.25) (layers B.Cu B.Paste B.Mask)
      (net 5 +3.3VA))
    (pad 2 smd rect (at 1.25 0 180) (size 1.5 1.25) (layers B.Cu B.Paste B.Mask)
      (net 3 GNDA))
    (model ${MSAG3D}/Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:C_0805_HandSoldering (layer B.Cu) (tedit 5C5B15B8)
    (at 178.6836 125.18644)
    (descr "Capacitor SMD 0805, hand soldering")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C27 (at -0.25368 -1.53416) (layer B.SilkS))
    (fp_text value 0.01uF (at 0 -1.75) (layer B.Fab))
    (fp_text user %R (at 0 1.75) (layer B.Fab))
    (pad 1 smd rect (at -1.25 0) (size 1.5 1.25) (layers B.Cu B.Paste B.Mask)
      (net 2 VDD))
    (pad 2 smd rect (at 1.25 0) (size 1.5 1.25) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (model ${MSAG3D}/Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:C_0805_HandSoldering (layer B.Cu) (tedit 5C5B15B8)
    (at 145.034 130.683 270)
    (descr "Capacitor SMD 0805, hand soldering")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C18 (at -3.8862 -0.0889 270) (layer B.SilkS))
    (fp_text value 1uF (at 0 -1.75 270) (layer B.Fab))
    (fp_text user %R (at 0 1.75 270) (layer B.Fab))
    (pad 1 smd rect (at -1.25 0 270) (size 1.5 1.25) (layers B.Cu B.Paste B.Mask)
      (net 5 +3.3VA))
    (pad 2 smd rect (at 1.25 0 270) (size 1.5 1.25) (layers B.Cu B.Paste B.Mask)
      (net 3 GNDA))
    (model ${MSAG3D}/Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:C_0805_HandSoldering (layer F.Cu) (tedit 5C5B15B8)
    (at 153.5938 125.6665)
    (descr "Capacitor SMD 0805, hand soldering")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C23 (at -1.143 -1.6383 180) (layer F.SilkS))
    (fp_text value 1uF (at 0 1.75) (layer F.Fab))
    (fp_text user %R (at 0 -1.75) (layer F.Fab))
    (pad 1 smd rect (at -1.25 0) (size 1.5 1.25) (layers F.Cu F.Paste F.Mask)
      (net 11 /REFOUT))
    (pad 2 smd rect (at 1.25 0) (size 1.5 1.25) (layers F.Cu F.Paste F.Mask)
      (net 3 GNDA))
    (model ${MSAG3D}/Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:C_0805_HandSoldering (layer F.Cu) (tedit 5C5B15B8)
    (at 148.4757 125.6665 180)
    (descr "Capacitor SMD 0805, hand soldering")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C21 (at 0.0508 1.5367 180) (layer F.SilkS))
    (fp_text value 10uF (at 0 1.75) (layer F.Fab))
    (fp_text user %R (at 0 -1.75) (layer F.Fab))
    (pad 1 smd rect (at -1.25 0 180) (size 1.5 1.25) (layers F.Cu F.Paste F.Mask)
      (net 11 /REFOUT))
    (pad 2 smd rect (at 1.25 0 180) (size 1.5 1.25) (layers F.Cu F.Paste F.Mask)
      (net 3 GNDA))
    (model ${MSAG3D}/Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:L_1206_HandSoldering (layer B.Cu) (tedit 5BBB6159)
    (at 181.447358 99.416829 180)
    (descr "Inductor SMD 1206, hand soldering")
    (tags "inductor 1206")
    (attr smd)
    (fp_text reference L1 (at 4.214273 -0.011313 180) (layer B.SilkS))
    (fp_text value Ferrite_Bead_Small (at 0 -2 180) (layer B.Fab))
    (fp_text user %R (at 0 1.75 180) (layer B.Fab))
    (pad 1 smd rect (at -2 0 180) (size 2 1.6) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (pad 2 smd rect (at 2 0 180) (size 2 1.6) (layers B.Cu B.Paste B.Mask)
      (net 3 GNDA))
    (model ${MSAG3d}/Inductor_SMD.3dshapes/L_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:MountingHole_2.2mm_M2_ISO14580_Pad (layer F.Cu) (tedit 5C5B357B)
    (at 174.371 94.234 270)
    (descr "Mounting Hole 2.2mm, M2, ISO14580")
    (tags "mounting hole 2.2mm m2 iso14580")
    (attr virtual)
    (fp_text reference MH3 (at 0 -2.9 270) (layer F.SilkS) hide)
    (fp_text value MountingHole (at 0 2.9 270) (layer F.Fab))
    (fp_text user %R (at 0.3 0 270) (layer F.Fab))
    (pad 1 thru_hole circle (at 0 0 270) (size 3.8 3.8) (drill 2.2) (layers *.Cu *.Mask)
      (net 3 GNDA))
  )
  (module MSAG_Misc:MountingHole_2.2mm_M2_ISO14580_Pad (layer F.Cu) (tedit 5C5B357B)
    (at 141.605 94.234 180)
    (descr "Mounting Hole 2.2mm, M2, ISO14580")
    (tags "mounting hole 2.2mm m2 iso14580")
    (attr virtual)
    (fp_text reference MH4 (at 0 -2.9 180) (layer F.SilkS) hide)
    (fp_text value MountingHole (at 0 2.9 180) (layer F.Fab))
    (fp_text user %R (at 0.3 0 180) (layer F.Fab))
    (pad 1 thru_hole circle (at 0 0 180) (size 3.8 3.8) (drill 2.2) (layers *.Cu *.Mask)
      (net 3 GNDA))
  )
  (module MSAG_Misc:MountingHole_2.2mm_M2_ISO14580_Pad (layer F.Cu) (tedit 5C5B357B)
    (at 141.478 144.526)
    (descr "Mounting Hole 2.2mm, M2, ISO14580")
    (tags "mounting hole 2.2mm m2 iso14580")
    (attr virtual)
    (fp_text reference MH1 (at 0 -2.9) (layer F.SilkS) hide)
    (fp_text value MountingHole (at 0 2.9) (layer F.Fab))
    (fp_text user %R (at 0.3 0) (layer F.Fab))
    (pad 1 thru_hole circle (at 0 0) (size 3.8 3.8) (drill 2.2) (layers *.Cu *.Mask)
      (net 3 GNDA))
  )
  (module MSAG_Misc:MountingHole_2.2mm_M2_ISO14580_Pad (layer F.Cu) (tedit 5C5B357B)
    (at 174.371 144.526 270)
    (descr "Mounting Hole 2.2mm, M2, ISO14580")
    (tags "mounting hole 2.2mm m2 iso14580")
    (attr virtual)
    (fp_text reference MH2 (at 0 -2.9 270) (layer F.SilkS) hide)
    (fp_text value MountingHole (at 0 2.9 270) (layer F.Fab))
    (fp_text user %R (at 0.3 0 270) (layer F.Fab))
    (pad 1 thru_hole circle (at 0 0 270) (size 3.8 3.8) (drill 2.2) (layers *.Cu *.Mask)
      (net 3 GNDA))
  )
  (module MSAG_Misc:R_0805_HandSoldering (layer F.Cu) (tedit 5C5B175C)
    (at 175.02124 124.11964 90)
    (descr "Resistor SMD 0805, hand soldering")
    (tags "resistor 0805")
    (attr smd)
    (fp_text reference R6 (at -0.02032 -1.64846 270) (layer F.SilkS))
    (fp_text value 22 (at 0 1.75 270) (layer F.Fab))
    (fp_text user %R (at 0 0 270) (layer F.Fab))
    (pad 1 smd rect (at -1.35 0 90) (size 1.5 1.3) (layers F.Cu F.Paste F.Mask)
      (net 4 "Net-(R6-Pad1)"))
    (pad 2 smd rect (at 1.35 0 90) (size 1.5 1.3) (layers F.Cu F.Paste F.Mask)
      (net 18 /SCSn_ADC))
    (model ${MSAG3D}/Resistors_SMD.3dshapes/R_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:SOT-353_SC-70-5_Handsoldering (layer F.Cu) (tedit 5D8D105A)
    (at 178.682098 125.215207 180)
    (descr "SOT-353, SC-70-5, Handsoldering")
    (tags "SOT-353 SC-70-5 Handsoldering")
    (attr smd)
    (fp_text reference U6 (at -0.743502 -2.140393) (layer F.SilkS))
    (fp_text value SN74AUP1G17-EP (at 0 2) (layer F.Fab))
    (fp_text user %R (at 0 0 270) (layer F.Fab))
    (pad 1 smd rect (at -1.33 -0.65 180) (size 1.5 0.4) (layers F.Cu F.Paste F.Mask))
    (pad 2 smd rect (at -1.33 0 180) (size 1.5 0.4) (layers F.Cu F.Paste F.Mask)
      (net 8 "Net-(R10-Pad1)"))
    (pad 3 smd rect (at -1.33 0.65 180) (size 1.5 0.4) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 4 smd rect (at 1.33 0.65 180) (size 1.5 0.4) (layers F.Cu F.Paste F.Mask)
      (net 4 "Net-(R6-Pad1)"))
    (pad 5 smd rect (at 1.33 -0.65 180) (size 1.5 0.4) (layers F.Cu F.Paste F.Mask)
      (net 2 VDD))
    (model ${MSAG3D}/TO_SOT_Packages_SMD.3dshapes/SOT-353_SC-70-5.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MSAG_Misc:R_0805_HandSoldering (layer F.Cu) (tedit 5C5B175C)
    (at 178.65472 122.83694 180)
    (descr "Resistor SMD 0805, hand soldering")
    (tags "resistor 0805")
    (attr smd)
    (fp_text reference R10 (at -0.08508 1.60274) (layer F.SilkS))
    (fp_text value 22 (at 0 1.75) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd rect (at -1.35 0 180) (size 1.5 1.3) (layers F.Cu F.Paste F.Mask)
      (net 8 "Net-(R10-Pad1)"))
    (pad 2 smd rect (at 1.35 0 180) (size 1.5 1.3) (layers F.Cu F.Paste F.Mask)
      (net 22 /SCSn_FPGA))
    (model ${MSAG3D}/Resistors_SMD.3dshapes/R_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (gr_text 03/2020 (at 143.764 92.71) (layer F.SilkS))
  (gr_text 6 (at 185.18886 99.80676) (layer F.SilkS))
  (gr_text 5 (at 191.3636 99.83216) (layer F.SilkS))
  (gr_text 16 (at 185.18886 112.68964) (layer F.SilkS))
  (gr_text 17 (at 191.42456 115.18392) (layer F.SilkS))
  (gr_text GND (at 184.97042 129.43332) (layer F.SilkS))
  (gr_text VIO (at 191.3636 129.4765) (layer F.SilkS))
  (gr_text VIO (at 191.41694 107.48772 90) (layer F.SilkS))
  (gr_text GND (at 185.547 93.36786) (layer F.SilkS))
  (gr_text GND (at 187.09132 145.08988) (layer F.SilkS))
  (gr_text 23 (at 191.4271 122.70232) (layer F.SilkS))
  (gr_text 26 (at 184.87898 125.25248) (layer F.SilkS))
  (gr_text MISO+ (at 185.30062 122.38482 90) (layer F.SilkS))
  (gr_text MISO- (at 191.30264 125.07722 90) (layer F.SilkS))
  (gr_text SCK- (at 191.26708 117.59184 90) (layer F.SilkS))
  (gr_text Gnda (at 165.1508 123.7488) (layer F.SilkS))
  (gr_text Gnda (at 161.9758 106.7816 90) (layer F.SilkS))
  (gr_text Vadc+ (at 167.2844 113.9698) (layer F.SilkS))
  (gr_text Gnda (at 143.1671 122.2756) (layer F.SilkS))
  (gr_text Vcm (at 140.3858 119.7864) (layer F.SilkS))
  (gr_text GND (at 185.3565 107.442 90) (layer F.SilkS))
  (gr_text SCSn (at 191.262 112.776 90) (layer F.SilkS))
  (gr_text SCK+ (at 185.26506 114.89944 90) (layer F.SilkS))
  (gr_text Vadc- (at 167.4368 119.6086) (layer F.SilkS))
  (gr_text Vref (at 141.8971 124.5362) (layer F.SilkS))
  (gr_text 29 (at 191.516 130.429) (layer F.SilkS))
  (gr_text 30 (at 185.039 130.429) (layer F.SilkS))
  (gr_text 20 (at 185.039 117.729) (layer F.SilkS))
  (gr_text 10 (at 185.039 105.029) (layer F.SilkS))
  (gr_text 9 (at 191.516 105.029) (layer F.SilkS))
  (gr_text 40 (at 185.039 143.129) (layer F.SilkS))
  (gr_text 39 (at 191.516 143.129) (layer F.SilkS))
  (gr_text 1 (at 191.516 94.742) (layer F.SilkS))
  (gr_text 2 (at 185.039 94.742) (layer F.SilkS))
  (gr_text "*PINS FLIPPED" (at 187.96 92.329) (layer F.SilkS))
  (gr_text "BurstCube ADC\nRev2" (at 160.6296 93.3704) (layer F.SilkS))
  (gr_line (start 138.557 147.32) (end 138.557 91.44) (layer Edge.Cuts) (width 0.15))
  (gr_line (start 192.278 147.32) (end 138.557 147.32) (layer Edge.Cuts) (width 0.15))
  (gr_line (start 192.278 91.44) (end 192.278 147.32) (layer Edge.Cuts) (width 0.15))
  (gr_line (start 138.557 91.44) (end 192.278 91.44) (layer Edge.Cuts) (width 0.15))
  (zone (net 3) (net_name GNDA) (layer In2.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.4064))
    (min_thickness 0.254)
    (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508) (smoothing fillet))
    (polygon
      (pts
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        (xy 181.446598 111.944153) (xy 181.483 91.44) (xy 138.557 91.44)
      )
    )
  )
  (zone (net 2) (net_name VDD) (layer In1.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.4064))
    (min_thickness 0.254)
    (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508) (smoothing fillet))
    (polygon
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      )
    )
  )
  (zone (net 2) (net_name VDD) (layer In1.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.4064))
    (min_thickness 0.254)
    (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508) (smoothing fillet))
    (polygon
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      )
    )
  )
  (zone (net 2) (net_name VDD) (layer F.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.4064))
    (min_thickness 0.254)
    (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508) (smoothing fillet))
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        (xy 188.52642 108.74248) (xy 188.52642 106.045) (xy 191.009557 106.050081) (xy 191.008 96.012) (xy 188.341 96.012)
        (xy 188.341 93.472) (xy 185.801 93.472) (xy 185.801 91.44)
      )
    )
  )
  (zone (net 5) (net_name +3.3VA) (layer In1.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.4064))
    (min_thickness 0.254)
    (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508) (smoothing fillet))
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      )
    )
  )
  (zone (net 5) (net_name +3.3VA) (layer F.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.4064))
    (min_thickness 0.254)
    (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508) (smoothing fillet))
    (polygon
      (pts
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    )
  )
  (zone (net 3) (net_name GNDA) (layer F.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.4064))
    (min_thickness 0.254)
    (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508) (smoothing fillet))
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        (xy 138.557 147.32)
      )
    )
  )
  (zone (net 1) (net_name GND) (layer In2.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.4064))
    (min_thickness 0.254)
    (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508) (smoothing fillet))
    (polygon
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        (xy 181.737 147.32) (xy 192.278 147.32) (xy 192.278 91.44)
      )
    )
  )
  (zone (net 2) (net_name VDD) (layer F.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.4064))
    (min_thickness 0.254)
    (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508) (smoothing fillet))
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      )
    )
  )
  (zone (net 1) (net_name GND) (layer F.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.4064))
    (min_thickness 0.254)
    (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508) (smoothing fillet))
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  )
)
