(kicad_pcb (version 4) (host pcbnew 4.0.1-stable)
  (general
    (links 101)
    (no_connects 9)
    (area 128.448999 76.632999 166.191001 108.533001)
    (thickness 1.6)
    (drawings 11)
    (tracks 451)
    (zones 0)
    (modules 22)
    (nets 47)
  )
  (page A4)
  (layers
    (0 F.Cu signal)
    (31 B.Cu signal)
    (32 B.Adhes user)
    (33 F.Adhes user)
    (34 B.Paste user)
    (35 F.Paste user)
    (36 B.SilkS user)
    (37 F.SilkS user)
    (38 B.Mask user)
    (39 F.Mask user)
    (40 Dwgs.User user)
    (41 Cmts.User user)
    (42 Eco1.User user)
    (43 Eco2.User user)
    (44 Edge.Cuts user)
    (45 Margin user)
    (46 B.CrtYd user)
    (47 F.CrtYd user)
    (48 B.Fab user)
    (49 F.Fab user)
  )
  (setup
    (last_trace_width 0.35)
    (user_trace_width 0.25)
    (user_trace_width 0.3)
    (user_trace_width 0.35)
    (user_trace_width 0.4)
    (user_trace_width 0.45)
    (user_trace_width 0.5)
    (user_trace_width 0.55)
    (trace_clearance 0.2)
    (zone_clearance 0.508)
    (zone_45_only no)
    (trace_min 0.2)
    (segment_width 0.2)
    (edge_width 0.15)
    (via_size 0.6)
    (via_drill 0.4)
    (via_min_size 0.4)
    (via_min_drill 0.3)
    (uvia_size 0.3)
    (uvia_drill 0.1)
    (uvias_allowed no)
    (uvia_min_size 0.2)
    (uvia_min_drill 0.1)
    (pcb_text_width 0.3)
    (pcb_text_size 1.5 1.5)
    (mod_edge_width 0.15)
    (mod_text_size 1 1)
    (mod_text_width 0.15)
    (pad_size 1.65 0.4)
    (pad_drill 0.6)
    (pad_to_mask_clearance 0.2)
    (aux_axis_origin 0 0)
    (visible_elements 7FFFFFFF)
    (pcbplotparams
      (layerselection 0x00030_80000001)
      (usegerberextensions false)
      (excludeedgelayer true)
      (linewidth 0.100000)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15)
      (hpglpenoverlay 2)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (padsonsilk false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 1)
      (scaleselection 1)
      (outputdirectory ""))
  )
  (net 0 "")
  (net 1 GND)
  (net 2 +3.3V)
  (net 3 "Net-(P1-Pad2)")
  (net 4 "Net-(P1-Pad3)")
  (net 5 "Net-(P1-Pad4)")
  (net 6 LED_PW)
  (net 7 +5V)
  (net 8 DataBus8)
  (net 9 DataBus7)
  (net 10 DataBus6)
  (net 11 DataBus5)
  (net 12 DataBus4)
  (net 13 DataBus3)
  (net 14 DataBus2)
  (net 15 DataBus1)
  (net 16 DataBus9)
  (net 17 DataBus10)
  (net 18 DataBus11)
  (net 19 DataBus12)
  (net 20 DataBus13)
  (net 21 DataBus14)
  (net 22 DataBus15)
  (net 23 DataBus16)
  (net 24 "Net-(P1-Pad10)")
  (net 25 "Net-(P1-Pad25)")
  (net 26 "Net-(P1-Pad26)")
  (net 27 "Net-(P1-Pad27)")
  (net 28 "Net-(P1-Pad28)")
  (net 29 "Net-(P1-Pad29)")
  (net 30 "Net-(P1-Pad30)")
  (net 31 "Net-(P1-Pad35)")
  (net 32 "Net-(P1-Pad36)")
  (net 33 "Net-(P1-Pad37)")
  (net 34 "Net-(P1-Pad38)")
  (net 35 "Net-(P1-Pad32)")
  (net 36 "Net-(P1-Pad31)")
  (net 37 "Net-(P1-Pad5)")
  (net 38 "Net-(P1-Pad39)")
  (net 39 "Net-(P1-Pad33)")
  (net 40 "Net-(U4-Pad11)")
  (net 41 "Net-(U4-Pad12)")
  (net 42 "Net-(U4-Pad13)")
  (net 43 "Net-(JP1-Pad2)")
  (net 44 "Net-(JP2-Pad2)")
  (net 45 "Net-(JP3-Pad2)")
  (net 46 "Net-(JP4-Pad2)")
  (net_class Default "Это класс цепей по умолчанию."
    (clearance 0.2)
    (trace_width 0.25)
    (via_dia 0.6)
    (via_drill 0.4)
    (uvia_dia 0.3)
    (uvia_drill 0.1)
    (add_net +3.3V)
    (add_net +5V)
    (add_net DataBus1)
    (add_net DataBus10)
    (add_net DataBus11)
    (add_net DataBus12)
    (add_net DataBus13)
    (add_net DataBus14)
    (add_net DataBus15)
    (add_net DataBus16)
    (add_net DataBus2)
    (add_net DataBus3)
    (add_net DataBus4)
    (add_net DataBus5)
    (add_net DataBus6)
    (add_net DataBus7)
    (add_net DataBus8)
    (add_net DataBus9)
    (add_net GND)
    (add_net LED_PW)
    (add_net "Net-(JP1-Pad2)")
    (add_net "Net-(JP2-Pad2)")
    (add_net "Net-(JP3-Pad2)")
    (add_net "Net-(JP4-Pad2)")
    (add_net "Net-(P1-Pad10)")
    (add_net "Net-(P1-Pad2)")
    (add_net "Net-(P1-Pad25)")
    (add_net "Net-(P1-Pad26)")
    (add_net "Net-(P1-Pad27)")
    (add_net "Net-(P1-Pad28)")
    (add_net "Net-(P1-Pad29)")
    (add_net "Net-(P1-Pad3)")
    (add_net "Net-(P1-Pad30)")
    (add_net "Net-(P1-Pad31)")
    (add_net "Net-(P1-Pad32)")
    (add_net "Net-(P1-Pad33)")
    (add_net "Net-(P1-Pad35)")
    (add_net "Net-(P1-Pad36)")
    (add_net "Net-(P1-Pad37)")
    (add_net "Net-(P1-Pad38)")
    (add_net "Net-(P1-Pad39)")
    (add_net "Net-(P1-Pad4)")
    (add_net "Net-(P1-Pad5)")
    (add_net "Net-(U4-Pad11)")
    (add_net "Net-(U4-Pad12)")
    (add_net "Net-(U4-Pad13)")
  )
  (module Capacitors_SMD:C_0805 (layer F.Cu) (tedit 5415D6EA)
    (at 163.306 82.55)
    (descr "Capacitor SMD 0805, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C1 (at 0.778 1.778) (layer F.SilkS))
    (fp_text value 10uF (at 0 2.1) (layer F.Fab))
    (pad 1 smd rect (at -1 0) (size 1 1.25) (layers F.Cu F.Paste F.Mask)
      (net 2 +3.3V))
    (pad 2 smd rect (at 1 0) (size 1 1.25) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (model Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0805 (layer F.Cu) (tedit 5415D6EA)
    (at 163.306 80.264)
    (descr "Capacitor SMD 0805, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C2 (at 2.048 0.254 270) (layer F.SilkS))
    (fp_text value 0.1uF (at 0 2.1) (layer F.Fab))
    (pad 1 smd rect (at -1 0) (size 1 1.25) (layers F.Cu F.Paste F.Mask)
      (net 2 +3.3V))
    (pad 2 smd rect (at 1 0) (size 1 1.25) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (model Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0805 (layer F.Cu) (tedit 5415D6EA)
    (at 163.306 78.232)
    (descr "Capacitor SMD 0805, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C3 (at -2.778 -0.508) (layer F.SilkS))
    (fp_text value 0.1uF (at 0 2.1) (layer F.Fab))
    (pad 1 smd rect (at -1 0) (size 1 1.25) (layers F.Cu F.Paste F.Mask)
      (net 2 +3.3V))
    (pad 2 smd rect (at 1 0) (size 1 1.25) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (model Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0805 (layer B.Cu) (tedit 5415D6EA)
    (at 157.226 93.71 270)
    (descr "Capacitor SMD 0805, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C4 (at 3.572 0 270) (layer B.SilkS))
    (fp_text value 0.1uF (at 0 -2.1 270) (layer B.Fab))
    (pad 1 smd rect (at -1 0 270) (size 1 1.25) (layers B.Cu B.Paste B.Mask)
      (net 2 +3.3V))
    (pad 2 smd rect (at 1 0 270) (size 1 1.25) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (model Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0805 (layer F.Cu) (tedit 5415D6EA)
    (at 132.842 99.584 270)
    (descr "Capacitor SMD 0805, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C6 (at 3.286 -1.016 270) (layer F.SilkS))
    (fp_text value 10uF (at 0 2.1 270) (layer F.Fab))
    (pad 1 smd rect (at -1 0 270) (size 1 1.25) (layers F.Cu F.Paste F.Mask)
      (net 2 +3.3V))
    (pad 2 smd rect (at 1 0 270) (size 1 1.25) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (model Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0805 (layer F.Cu) (tedit 5415D6EA)
    (at 130.556 99.584 270)
    (descr "Capacitor SMD 0805, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C7 (at -2.048 1.27 270) (layer F.SilkS))
    (fp_text value 0.1uF (at 0 2.1 270) (layer F.Fab))
    (pad 1 smd rect (at -1 0 270) (size 1 1.25) (layers F.Cu F.Paste F.Mask)
      (net 2 +3.3V))
    (pad 2 smd rect (at 1 0 270) (size 1 1.25) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (model Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Personal:ZIF_50pin_SMD_0.5mm (layer F.Cu) (tedit 5788958A)
    (at 148.172 81.039 180)
    (descr "Molex Panelmate series connector, 1.25mm pitch, side entry SMT, P/N: 53780-3070")
    (tags "conn molex panelmate")
    (attr smd)
    (fp_text reference P1 (at 16.092 3.315 180) (layer F.SilkS))
    (fp_text value ZIF50 (at 0.29 3.52 180) (layer F.Fab))
    (pad 1 smd rect (at -9.76 -1.765 180) (size 0.3 1.25) (layers F.Cu F.Paste F.Mask)
      (net 2 +3.3V))
    (pad 2 smd rect (at -9.26 -1.765 180) (size 0.3 1.25) (layers F.Cu F.Paste F.Mask)
      (net 3 "Net-(P1-Pad2)"))
    (pad 3 smd rect (at -8.76 -1.765 180) (size 0.3 1.25) (layers F.Cu F.Paste F.Mask)
      (net 4 "Net-(P1-Pad3)"))
    (pad 4 smd rect (at -8.26 -1.765 180) (size 0.3 1.25) (layers F.Cu F.Paste F.Mask)
      (net 5 "Net-(P1-Pad4)"))
    (pad 5 smd rect (at -7.76 -1.765 180) (size 0.3 1.25) (layers F.Cu F.Paste F.Mask)
      (net 37 "Net-(P1-Pad5)"))
    (pad 6 smd rect (at -7.26 -1.765 180) (size 0.3 1.25) (layers F.Cu F.Paste F.Mask)
      (net 43 "Net-(JP1-Pad2)"))
    (pad 7 smd rect (at -6.76 -1.765 180) (size 0.3 1.25) (layers F.Cu F.Paste F.Mask)
      (net 46 "Net-(JP4-Pad2)"))
    (pad 8 smd rect (at -6.26 -1.765 180) (size 0.3 1.25) (layers F.Cu F.Paste F.Mask)
      (net 45 "Net-(JP3-Pad2)"))
    (pad 9 smd rect (at -5.76 -1.765 180) (size 0.3 1.25) (layers F.Cu F.Paste F.Mask)
      (net 44 "Net-(JP2-Pad2)"))
    (pad 10 smd rect (at -5.26 -1.765 180) (size 0.3 1.25) (layers F.Cu F.Paste F.Mask)
      (net 24 "Net-(P1-Pad10)"))
    (pad 11 smd rect (at -4.76 -1.765 180) (size 0.3 1.25) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 12 smd rect (at -4.26 -1.765 180) (size 0.3 1.25) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 13 smd rect (at -3.76 -1.765 180) (size 0.3 1.25) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 14 smd rect (at -3.26 -1.765 180) (size 0.3 1.25) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 15 smd rect (at -2.76 -1.765 180) (size 0.3 1.25) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 16 smd rect (at -2.26 -1.765 180) (size 0.3 1.25) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 17 smd rect (at -1.76 -1.765 180) (size 0.3 1.25) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 18 smd rect (at -1.26 -1.765 180) (size 0.3 1.25) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 19 smd rect (at -0.76 -1.765 180) (size 0.3 1.25) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 20 smd rect (at -0.26 -1.765 180) (size 0.3 1.25) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 21 smd rect (at 0.24 -1.765 180) (size 0.3 1.25) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 22 smd rect (at 0.74 -1.765 180) (size 0.3 1.25) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 23 smd rect (at 1.24 -1.765) (size 0.3 1.25) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 24 smd rect (at 1.74 -1.765 180) (size 0.3 1.25) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 25 smd rect (at 2.24 -1.765 180) (size 0.3 1.25) (layers F.Cu F.Paste F.Mask)
      (net 25 "Net-(P1-Pad25)"))
    (pad 26 smd rect (at 2.74 -1.765 180) (size 0.3 1.25) (layers F.Cu F.Paste F.Mask)
      (net 26 "Net-(P1-Pad26)"))
    (pad 27 smd rect (at 3.24 -1.765 180) (size 0.3 1.25) (layers F.Cu F.Paste F.Mask)
      (net 27 "Net-(P1-Pad27)"))
    (pad 28 smd rect (at 3.74 -1.765 180) (size 0.3 1.25) (layers F.Cu F.Paste F.Mask)
      (net 28 "Net-(P1-Pad28)"))
    (pad 29 smd rect (at 4.24 -1.765 180) (size 0.3 1.25) (layers F.Cu F.Paste F.Mask)
      (net 29 "Net-(P1-Pad29)"))
    (pad 30 smd rect (at 4.74 -1.765 180) (size 0.3 1.25) (layers F.Cu F.Paste F.Mask)
      (net 30 "Net-(P1-Pad30)"))
    (pad "" smd rect (at 16.28 0.46 180) (size 2 3) (layers F.Cu F.Paste F.Mask))
    (pad "" smd rect (at -11.3 0.46 180) (size 2 3) (layers F.Cu F.Paste F.Mask))
    (pad 34 smd rect (at 6.74 -1.765 180) (size 0.3 1.25) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 35 smd rect (at 7.24 -1.765 180) (size 0.3 1.25) (layers F.Cu F.Paste F.Mask)
      (net 31 "Net-(P1-Pad35)"))
    (pad 36 smd rect (at 7.74 -1.765 180) (size 0.3 1.25) (layers F.Cu F.Paste F.Mask)
      (net 32 "Net-(P1-Pad36)"))
    (pad 37 smd rect (at 8.24 -1.765 180) (size 0.3 1.25) (layers F.Cu F.Paste F.Mask)
      (net 33 "Net-(P1-Pad37)"))
    (pad 39 smd rect (at 9.24 -1.765 180) (size 0.3 1.25) (layers F.Cu F.Paste F.Mask)
      (net 38 "Net-(P1-Pad39)"))
    (pad 38 smd rect (at 8.74 -1.765 180) (size 0.3 1.25) (layers F.Cu F.Paste F.Mask)
      (net 34 "Net-(P1-Pad38)"))
    (pad 40 smd rect (at 9.74 -1.765 180) (size 0.3 1.25) (layers F.Cu F.Paste F.Mask)
      (net 2 +3.3V))
    (pad 32 smd rect (at 5.74 -1.765 180) (size 0.3 1.25) (layers F.Cu F.Paste F.Mask)
      (net 35 "Net-(P1-Pad32)"))
    (pad 33 smd rect (at 6.24 -1.765) (size 0.3 1.25) (layers F.Cu F.Paste F.Mask)
      (net 39 "Net-(P1-Pad33)"))
    (pad 31 smd rect (at 5.24 -1.765 180) (size 0.3 1.25) (layers F.Cu F.Paste F.Mask)
      (net 36 "Net-(P1-Pad31)"))
    (pad 45 smd rect (at 12.24 -1.775 180) (size 0.3 1.25) (layers F.Cu F.Paste F.Mask)
      (net 17 DataBus10))
    (pad 44 smd rect (at 11.74 -1.775 180) (size 0.3 1.25) (layers F.Cu F.Paste F.Mask)
      (net 9 DataBus7))
    (pad 43 smd rect (at 11.24 -1.775) (size 0.3 1.25) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 42 smd rect (at 10.74 -1.775 180) (size 0.3 1.25) (layers F.Cu F.Paste F.Mask)
      (net 2 +3.3V))
    (pad 46 smd rect (at 12.74 -1.775 180) (size 0.3 1.25) (layers F.Cu F.Paste F.Mask)
      (net 18 DataBus11))
    (pad 47 smd rect (at 13.24 -1.775 180) (size 0.3 1.25) (layers F.Cu F.Paste F.Mask)
      (net 8 DataBus8))
    (pad 48 smd rect (at 13.74 -1.775 180) (size 0.3 1.25) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 49 smd rect (at 14.24 -1.775 180) (size 0.3 1.25) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 50 smd rect (at 14.74 -1.775 180) (size 0.3 1.25) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 41 smd rect (at 10.24 -1.775 180) (size 0.3 1.25) (layers F.Cu F.Paste F.Mask)
      (net 2 +3.3V))
    (model Connectors_Molex.3dshapes/Molex_Panelmate-53780-3070_30x1.25mm_Angled.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0805 (layer B.Cu) (tedit 5415CDEB)
    (at 160.782 87.31 270)
    (descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0805")
    (attr smd)
    (fp_text reference R9 (at -3.236 0 270) (layer B.SilkS))
    (fp_text value 330R (at 0 -2.1 270) (layer B.Fab))
    (pad 1 smd rect (at -0.95 0 270) (size 0.7 1.3) (layers B.Cu B.Paste B.Mask)
      (net 3 "Net-(P1-Pad2)"))
    (pad 2 smd rect (at 0.95 0 270) (size 0.7 1.3) (layers B.Cu B.Paste B.Mask)
      (net 6 LED_PW))
    (model Resistors_SMD.3dshapes/R_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0805 (layer B.Cu) (tedit 5415CDEB)
    (at 158.496 87.31 270)
    (descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0805")
    (attr smd)
    (fp_text reference R10 (at -3.744 0 270) (layer B.SilkS))
    (fp_text value 330R (at 0 -2.1 270) (layer B.Fab))
    (pad 1 smd rect (at -0.95 0 270) (size 0.7 1.3) (layers B.Cu B.Paste B.Mask)
      (net 4 "Net-(P1-Pad3)"))
    (pad 2 smd rect (at 0.95 0 270) (size 0.7 1.3) (layers B.Cu B.Paste B.Mask)
      (net 6 LED_PW))
    (model Resistors_SMD.3dshapes/R_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_0805 (layer B.Cu) (tedit 5415CDEB)
    (at 156.21 87.31 270)
    (descr "Resistor SMD 0805, reflow soldering, Vishay (see dcrcw.pdf)")
    (tags "resistor 0805")
    (attr smd)
    (fp_text reference R11 (at -3.744 0 270) (layer B.SilkS))
    (fp_text value 330R (at 0 -2.1 270) (layer B.Fab))
    (pad 1 smd rect (at -0.95 0 270) (size 0.7 1.3) (layers B.Cu B.Paste B.Mask)
      (net 5 "Net-(P1-Pad4)"))
    (pad 2 smd rect (at 0.95 0 270) (size 0.7 1.3) (layers B.Cu B.Paste B.Mask)
      (net 6 LED_PW))
    (model Resistors_SMD.3dshapes/R_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module TO_SOT_Packages_SMD:SOT-223 (layer F.Cu) (tedit 0)
    (at 132.842 92.202)
    (descr "module CMS SOT223 4 pins")
    (tags "CMS SOT")
    (attr smd)
    (fp_text reference U2 (at 0 -5.842) (layer F.SilkS))
    (fp_text value LD1117S33CTR (at 0 0.762) (layer F.Fab))
    (pad 4 smd rect (at 0 -3.302) (size 3.6576 2.032) (layers F.Cu F.Paste F.Mask))
    (pad 2 smd rect (at 0 3.302) (size 1.016 2.032) (layers F.Cu F.Paste F.Mask)
      (net 2 +3.3V))
    (pad 3 smd rect (at 2.286 3.302) (size 1.016 2.032) (layers F.Cu F.Paste F.Mask)
      (net 7 +5V))
    (pad 1 smd rect (at -2.286 3.302) (size 1.016 2.032) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (model TO_SOT_Packages_SMD.3dshapes/SOT-223.wrl
      (at (xyz 0 0 0))
      (scale (xyz 0.4 0.4 0.4))
      (rotate (xyz 0 0 0))
    )
  )
  (module Housings_SSOP:SSOP-20_4.4x6.5mm_Pitch0.65mm (layer B.Cu) (tedit 54130A77)
    (at 152.359 93.832 90)
    (descr "SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot266-1_po.pdf)")
    (tags "SSOP 0.65")
    (attr smd)
    (fp_text reference U3 (at 5.186 -2.499 90) (layer B.SilkS))
    (fp_text value 74LV245 (at 0 -4.3 90) (layer B.Fab))
    (pad 1 smd rect (at -2.9 2.925 90) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 2 +3.3V))
    (pad 2 smd rect (at -2.9 2.275 90) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 8 DataBus8))
    (pad 3 smd rect (at -2.9 1.625 90) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 9 DataBus7))
    (pad 4 smd rect (at -2.9 0.975 90) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 10 DataBus6))
    (pad 5 smd rect (at -2.9 0.325 90) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 11 DataBus5))
    (pad 6 smd rect (at -2.9 -0.325 90) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 12 DataBus4))
    (pad 7 smd rect (at -2.9 -0.975 90) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 13 DataBus3))
    (pad 8 smd rect (at -2.9 -1.625 90) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 14 DataBus2))
    (pad 9 smd rect (at -2.9 -2.275 90) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 15 DataBus1))
    (pad 10 smd rect (at -2.9 -2.925 90) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (pad 11 smd rect (at 2.9 -2.925 90) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 35 "Net-(P1-Pad32)"))
    (pad 12 smd rect (at 2.9 -2.275 90) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 36 "Net-(P1-Pad31)"))
    (pad 13 smd rect (at 2.9 -1.625 90) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 30 "Net-(P1-Pad30)"))
    (pad 14 smd rect (at 2.9 -0.975 90) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 29 "Net-(P1-Pad29)"))
    (pad 15 smd rect (at 2.9 -0.325 90) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 28 "Net-(P1-Pad28)"))
    (pad 16 smd rect (at 2.9 0.325 90) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 27 "Net-(P1-Pad27)"))
    (pad 17 smd rect (at 2.9 0.975 90) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 26 "Net-(P1-Pad26)"))
    (pad 18 smd rect (at 2.9 1.625 90) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 25 "Net-(P1-Pad25)"))
    (pad 19 smd rect (at 2.9 2.275 90) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (pad 20 smd rect (at 2.9 2.925 90) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 2 +3.3V))
    (model Housings_SSOP.3dshapes/SSOP-20_4.4x6.5mm_Pitch0.65mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Housings_SSOP:SSOP-20_4.4x6.5mm_Pitch0.65mm (layer B.Cu) (tedit 54130A77)
    (at 141.153 93.832 90)
    (descr "SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot266-1_po.pdf)")
    (tags "SSOP 0.65")
    (attr smd)
    (fp_text reference U4 (at 4.932 -2.723 90) (layer B.SilkS))
    (fp_text value 74LV245 (at 0 -4.3 90) (layer B.Fab))
    (pad 1 smd rect (at -2.9 2.925 90) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 2 +3.3V))
    (pad 2 smd rect (at -2.9 2.275 90) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 16 DataBus9))
    (pad 3 smd rect (at -2.9 1.625 90) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 17 DataBus10))
    (pad 4 smd rect (at -2.9 0.975 90) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 18 DataBus11))
    (pad 5 smd rect (at -2.9 0.325 90) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 19 DataBus12))
    (pad 6 smd rect (at -2.9 -0.325 90) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 20 DataBus13))
    (pad 7 smd rect (at -2.9 -0.975 90) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 21 DataBus14))
    (pad 8 smd rect (at -2.9 -1.625 90) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 22 DataBus15))
    (pad 9 smd rect (at -2.9 -2.275 90) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 23 DataBus16))
    (pad 10 smd rect (at -2.9 -2.925 90) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (pad 11 smd rect (at 2.9 -2.925 90) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 40 "Net-(U4-Pad11)"))
    (pad 12 smd rect (at 2.9 -2.275 90) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 41 "Net-(U4-Pad12)"))
    (pad 13 smd rect (at 2.9 -1.625 90) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 42 "Net-(U4-Pad13)"))
    (pad 14 smd rect (at 2.9 -0.975 90) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 24 "Net-(P1-Pad10)"))
    (pad 15 smd rect (at 2.9 -0.325 90) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 34 "Net-(P1-Pad38)"))
    (pad 16 smd rect (at 2.9 0.325 90) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 33 "Net-(P1-Pad37)"))
    (pad 17 smd rect (at 2.9 0.975 90) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 32 "Net-(P1-Pad36)"))
    (pad 18 smd rect (at 2.9 1.625 90) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 31 "Net-(P1-Pad35)"))
    (pad 19 smd rect (at 2.9 2.275 90) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (pad 20 smd rect (at 2.9 2.925 90) (size 1 0.4) (layers B.Cu B.Paste B.Mask)
      (net 2 +3.3V))
    (model Housings_SSOP.3dshapes/SSOP-20_4.4x6.5mm_Pitch0.65mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0805 (layer F.Cu) (tedit 5415D6EA)
    (at 135.128 99.584 270)
    (descr "Capacitor SMD 0805, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C9 (at 3.286 -0.254 270) (layer F.SilkS))
    (fp_text value 10uF (at 0 2.1 270) (layer F.Fab))
    (pad 1 smd rect (at -1 0 270) (size 1 1.25) (layers F.Cu F.Paste F.Mask)
      (net 7 +5V))
    (pad 2 smd rect (at 1 0 270) (size 1 1.25) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (model Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_0805 (layer B.Cu) (tedit 5415D6EA)
    (at 146.05 93.71 270)
    (descr "Capacitor SMD 0805, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0805")
    (attr smd)
    (fp_text reference C10 (at 3.572 0 270) (layer B.SilkS))
    (fp_text value 0.1uF (at 0 -2.1 270) (layer B.Fab))
    (pad 1 smd rect (at -1 0 270) (size 1 1.25) (layers B.Cu B.Paste B.Mask)
      (net 2 +3.3V))
    (pad 2 smd rect (at 1 0 270) (size 1 1.25) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (model Capacitors_SMD.3dshapes/C_0805.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connectors_Molex:Molex_MicroLatch-53253-0270_02x2.00mm_Straight (layer F.Cu) (tedit 572FDA94)
    (at 131.318 105.41)
    (descr "Molex Micro-Latch connector, PN:53253-0270, top entry type, through hole")
    (tags "conn molex micro latch")
    (fp_text reference P2 (at -2.032 -2.794) (layer F.SilkS))
    (fp_text value CONN_01X02 (at 1 -3.5) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0) (size 1.5 1.5) (drill 0.8) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 2 thru_hole circle (at 2 0) (size 1.5 1.5) (drill 0.8) (layers *.Cu *.Mask)
      (net 7 +5V))
    (model Connectors_Molex.3dshapes/Molex_MicroLatch-53253-0270_02x2.00mm_Straight.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connectors_Molex:Molex_MicroLatch-53253-0270_02x2.00mm_Straight (layer F.Cu) (tedit 572FDA94)
    (at 160.274 105.41)
    (descr "Molex Micro-Latch connector, PN:53253-0270, top entry type, through hole")
    (tags "conn molex micro latch")
    (fp_text reference P5 (at 2.286 -3.048) (layer F.SilkS))
    (fp_text value CONN_01X02 (at 1 -3.5) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0) (size 1.5 1.5) (drill 0.8) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 2 thru_hole circle (at 2 0) (size 1.5 1.5) (drill 0.8) (layers *.Cu *.Mask)
      (net 6 LED_PW))
    (model Connectors_Molex.3dshapes/Molex_MicroLatch-53253-0270_02x2.00mm_Straight.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connect:GS3 (layer F.Cu) (tedit 5797772D)
    (at 162.306 87.376 180)
    (descr "Pontet Goute de soudure")
    (attr virtual)
    (fp_text reference M0 (at 0 -3.556 270) (layer F.SilkS))
    (fp_text value JUMPER3 (at 1.524 0 270) (layer F.Fab))
    (pad 1 smd rect (at 0 -1.27 180) (size 1.27 0.9652) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 2 smd rect (at 0 0 180) (size 1.27 0.9652) (layers F.Cu F.Paste F.Mask)
      (net 43 "Net-(JP1-Pad2)"))
    (pad 3 smd rect (at 0 1.27 180) (size 1.27 0.9652) (layers F.Cu F.Paste F.Mask)
      (net 2 +3.3V))
  )
  (module Connect:GS3 (layer F.Cu) (tedit 5797771B)
    (at 156.21 87.376 180)
    (descr "Pontet Goute de soudure")
    (attr virtual)
    (fp_text reference M3 (at 0 -3.556 270) (layer F.SilkS))
    (fp_text value JUMPER3 (at 1.524 0 270) (layer F.Fab))
    (pad 1 smd rect (at 0 -1.27 180) (size 1.27 0.9652) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 2 smd rect (at 0 0 180) (size 1.27 0.9652) (layers F.Cu F.Paste F.Mask)
      (net 44 "Net-(JP2-Pad2)"))
    (pad 3 smd rect (at 0 1.27 180) (size 1.27 0.9652) (layers F.Cu F.Paste F.Mask)
      (net 2 +3.3V))
  )
  (module Connect:GS3 (layer F.Cu) (tedit 57977721)
    (at 158.242 87.376 180)
    (descr "Pontet Goute de soudure")
    (attr virtual)
    (fp_text reference M2 (at 0 -3.556 270) (layer F.SilkS))
    (fp_text value JUMPER3 (at 1.524 0 270) (layer F.Fab))
    (pad 1 smd rect (at 0 -1.27 180) (size 1.27 0.9652) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 2 smd rect (at 0 0 180) (size 1.27 0.9652) (layers F.Cu F.Paste F.Mask)
      (net 45 "Net-(JP3-Pad2)"))
    (pad 3 smd rect (at 0 1.27 180) (size 1.27 0.9652) (layers F.Cu F.Paste F.Mask)
      (net 2 +3.3V))
  )
  (module Connect:GS3 (layer F.Cu) (tedit 57977727)
    (at 160.274 87.376 180)
    (descr "Pontet Goute de soudure")
    (attr virtual)
    (fp_text reference M1 (at 0 -3.556 270) (layer F.SilkS))
    (fp_text value JUMPER3 (at 1.524 0 270) (layer F.Fab))
    (pad 1 smd rect (at 0 -1.27 180) (size 1.27 0.9652) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 2 smd rect (at 0 0 180) (size 1.27 0.9652) (layers F.Cu F.Paste F.Mask)
      (net 46 "Net-(JP4-Pad2)"))
    (pad 3 smd rect (at 0 1.27 180) (size 1.27 0.9652) (layers F.Cu F.Paste F.Mask)
      (net 2 +3.3V))
  )
  (module Pin_Headers:Pin_Header_Straight_2x08 (layer F.Cu) (tedit 0)
    (at 155.702 103.886 270)
    (descr "Through hole pin header")
    (tags "pin header")
    (fp_text reference P3 (at -2.54 -0.762 360) (layer F.SilkS))
    (fp_text value CONN_01X16 (at 0 -3.1 270) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0 270) (size 1.7272 1.7272) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 8 DataBus8))
    (pad 2 thru_hole oval (at 2.54 0 270) (size 1.7272 1.7272) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 9 DataBus7))
    (pad 3 thru_hole oval (at 0 2.54 270) (size 1.7272 1.7272) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 10 DataBus6))
    (pad 4 thru_hole oval (at 2.54 2.54 270) (size 1.7272 1.7272) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 11 DataBus5))
    (pad 5 thru_hole oval (at 0 5.08 270) (size 1.7272 1.7272) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 12 DataBus4))
    (pad 6 thru_hole oval (at 2.54 5.08 270) (size 1.7272 1.7272) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 13 DataBus3))
    (pad 7 thru_hole oval (at 0 7.62 270) (size 1.7272 1.7272) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 14 DataBus2))
    (pad 8 thru_hole oval (at 2.54 7.62 270) (size 1.7272 1.7272) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 15 DataBus1))
    (pad 9 thru_hole oval (at 0 10.16 270) (size 1.7272 1.7272) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 16 DataBus9))
    (pad 10 thru_hole oval (at 2.54 10.16 270) (size 1.7272 1.7272) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 17 DataBus10))
    (pad 11 thru_hole oval (at 0 12.7 270) (size 1.7272 1.7272) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 18 DataBus11))
    (pad 12 thru_hole oval (at 2.54 12.7 270) (size 1.7272 1.7272) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 19 DataBus12))
    (pad 13 thru_hole oval (at 0 15.24 270) (size 1.7272 1.7272) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 20 DataBus13))
    (pad 14 thru_hole oval (at 2.54 15.24 270) (size 1.7272 1.7272) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 21 DataBus14))
    (pad 15 thru_hole oval (at 0 17.78 270) (size 1.7272 1.7272) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 22 DataBus15))
    (pad 16 thru_hole oval (at 2.54 17.78 270) (size 1.7272 1.7272) (drill 1.016) (layers *.Cu *.Mask F.SilkS)
      (net 23 DataBus16))
    (model Pin_Headers.3dshapes/Pin_Header_Straight_2x08.wrl
      (at (xyz 0.05 -0.35 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 90))
    )
  )
  (gr_text "rev 1.0" (at 164.084 99.822) (layer F.SilkS))
  (gr_text "2.2\" 50 pin LCD Shield\nw/ Touch screen" (at 151.13 98.044) (layer F.SilkS))
  (gr_text "Aleks IC" (at 146.05 91.694) (layer F.SilkS))
  (gr_text GND (at 164.592 89.916) (layer F.SilkS))
  (gr_text VCC (at 153.416 85.852) (layer F.SilkS))
  (gr_line (start 128.524 108.458) (end 128.524 76.708) (layer Edge.Cuts) (width 0.15))
  (gr_line (start 166.116 108.458) (end 128.524 108.458) (layer Edge.Cuts) (width 0.15))
  (gr_line (start 166.116 76.708) (end 166.116 108.458) (layer Edge.Cuts) (width 0.15))
  (gr_line (start 128.524 76.708) (end 166.116 76.708) (layer Edge.Cuts) (width 0.15))
)
