(kicad_pcb (version 20221018) (generator pcbnew)
  (general
    (thickness 1.6)
  )
  (paper "A4")
  (layers
    (0 "F.Cu" signal)
    (31 "B.Cu" signal)
    (32 "B.Adhes" user "B.Adhesive")
    (33 "F.Adhes" user "F.Adhesive")
    (34 "B.Paste" user)
    (35 "F.Paste" user)
    (36 "B.SilkS" user "B.Silkscreen")
    (37 "F.SilkS" user "F.Silkscreen")
    (38 "B.Mask" user)
    (39 "F.Mask" user)
    (40 "Dwgs.User" user "User.Drawings")
    (41 "Cmts.User" user "User.Comments")
    (42 "Eco1.User" user "User.Eco1")
    (43 "Eco2.User" user "User.Eco2")
    (44 "Edge.Cuts" user)
    (45 "Margin" user)
    (46 "B.CrtYd" user "B.Courtyard")
    (47 "F.CrtYd" user "F.Courtyard")
    (48 "B.Fab" user)
    (49 "F.Fab" user)
    (50 "User.1" user)
    (51 "User.2" user)
    (52 "User.3" user)
    (53 "User.4" user)
    (54 "User.5" user)
    (55 "User.6" user)
    (56 "User.7" user)
    (57 "User.8" user)
    (58 "User.9" user)
  )
  (setup
    (stackup
      (layer "F.SilkS" (type "Top Silk Screen"))
      (layer "F.Paste" (type "Top Solder Paste"))
      (layer "F.Mask" (type "Top Solder Mask") (thickness 0.01))
      (layer "F.Cu" (type "copper") (thickness 0.035))
      (layer "dielectric 1" (type "core") (thickness 1.51) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
      (layer "B.Cu" (type "copper") (thickness 0.035))
      (layer "B.Mask" (type "Bottom Solder Mask") (thickness 0.01))
      (layer "B.Paste" (type "Bottom Solder Paste"))
      (layer "B.SilkS" (type "Bottom Silk Screen"))
      (copper_finish "None")
      (dielectric_constraints no)
    )
    (pad_to_mask_clearance 0)
    (pcbplotparams
      (layerselection 0x00010fc_ffffffff)
      (plot_on_all_layers_selection 0x0000000_00000000)
      (disableapertmacros false)
      (usegerberextensions false)
      (usegerberattributes true)
      (usegerberadvancedattributes true)
      (creategerberjobfile true)
      (dashed_line_dash_ratio 12.000000)
      (dashed_line_gap_ratio 3.000000)
      (svgprecision 4)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (dxfpolygonmode true)
      (dxfimperialunits true)
      (dxfusepcbnewfont true)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (sketchpadsonfab false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 0)
      (scaleselection 1)
      (outputdirectory "")
    )
  )
  (net 0 "")
  (net 1 "N$27")
  (net 2 "V_LED")
  (net 3 "INC")
  (net 4 "IND")
  (net 5 "C_R")
  (net 6 "BLK")
  (net 7 "V_LOGIC")
  (net 8 "GND")
  (net 9 "INA")
  (net 10 "INB")
  (net 11 "LATCH")
  (net 12 "V_LED_IN")
  (net 13 "L7")
  (net 14 "L6")
  (net 15 "L5")
  (net 16 "L4")
  (net 17 "L3")
  (net 18 "L8")
  (net 19 "L2")
  (net 20 "L1")
  (net 21 "L12")
  (net 22 "L13")
  (net 23 "L11")
  (net 24 "L10")
  (net 25 "L9")
  (net 26 "C5")
  (net 27 "C4")
  (net 28 "C3")
  (net 29 "C6")
  (net 30 "C7")
  (net 31 "B5")
  (net 32 "B6")
  (net 33 "B7")
  (net 34 "B4")
  (net 35 "C2")
  (net 36 "C1")
  (net 37 "C0")
  (net 38 "N$2")
  (net 39 "L12B")
  (net 40 "L10B")
  (net 41 "L8B")
  (net 42 "L2B")
  (net 43 "L13B")
  (net 44 "L4B")
  (net 45 "L6B")
  (net 46 "N$3")
  (footprint "LED0402_B" (layer "F.Cu")
    (at 85.344 117.946 -90)
    (fp_text reference "LED8" (at -0.635 -0.635 90) (layer "F.SilkS") hide)
    (fp_text value "" (at -0.635 1.905 90) (layer "F.Fab"))
    (pad "A" smd rect (at 0.6 0 270) (size 0.7 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "V_LED") (solder_mask_margin 0.0254) (thermal_bridge_angle 45))
    (pad "K" smd rect (at -0.6 0 270) (size 0.7 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 18 "L8") (solder_mask_margin 0.0254) (thermal_bridge_angle 45))
  )
  (footprint "LED0402_B" (layer "F.Cu")
    (at 82.677 108.802)
    (fp_text reference "LED1" (at -0.635 -0.635) (layer "F.SilkS") hide)
    (fp_text value "" (at -0.635 1.905) (layer "F.Fab"))
    (pad "A" smd rect (at 0.6 0) (size 0.7 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "V_LED") (solder_mask_margin 0.0254) (thermal_bridge_angle 45))
    (pad "K" smd rect (at -0.6 0) (size 0.7 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 20 "L1") (solder_mask_margin 0.0254) (thermal_bridge_angle 45))
  )
  (footprint "LED0402_B" (layer "F.Cu")
    (at 86.741 117.946 180)
    (fp_text reference "LED7" (at -0.635 -0.635) (layer "F.SilkS") hide)
    (fp_text value "" (at -0.635 1.905) (layer "F.Fab"))
    (pad "A" smd rect (at 0.6 0 180) (size 0.7 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "V_LED") (solder_mask_margin 0.0254) (thermal_bridge_angle 45))
    (pad "K" smd rect (at -0.6 0 180) (size 0.7 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 13 "L7") (solder_mask_margin 0.0254) (thermal_bridge_angle 45))
  )
  (footprint "LED0402_B" (layer "F.Cu")
    (at 87.9602 119.6086 180)
    (fp_text reference "LED15" (at -0.635 -0.635) (layer "F.SilkS") hide)
    (fp_text value "" (at -0.635 1.905) (layer "F.Fab"))
    (pad "A" smd rect (at 0.6 0 180) (size 0.7 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "N$27") (solder_mask_margin 0.0254) (thermal_bridge_angle 45))
    (pad "K" smd rect (at -0.6 0 180) (size 0.7 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 5 "C_R") (solder_mask_margin 0.0254) (thermal_bridge_angle 45))
  )
  (footprint "LED0402_B" (layer "F.Cu")
    (at 84.074 113.374 -90)
    (fp_text reference "LED21" (at -0.635 -0.635 90) (layer "F.SilkS") hide)
    (fp_text value "" (at 1.905 1.27) (layer "F.Fab"))
    (pad "A" smd rect (at 0.6 0 270) (size 0.7 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "V_LED") (solder_mask_margin 0.0254) (thermal_bridge_angle 45))
    (pad "K" smd rect (at -0.6 0 270) (size 0.7 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 43 "L13B") (solder_mask_margin 0.0254) (thermal_bridge_angle 45))
  )
  (footprint "LED0402_B" (layer "F.Cu")
    (at 86.741 114.898 180)
    (fp_text reference "LED6" (at -0.635 -0.635) (layer "F.SilkS") hide)
    (fp_text value "" (at -0.635 1.905) (layer "F.Fab"))
    (pad "A" smd rect (at 0.6 0 180) (size 0.7 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "V_LED") (solder_mask_margin 0.0254) (thermal_bridge_angle 45))
    (pad "K" smd rect (at -0.6 0 180) (size 0.7 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 14 "L6") (solder_mask_margin 0.0254) (thermal_bridge_angle 45))
  )
  (footprint "LED0402_B" (layer "F.Cu")
    (at 86.741 108.802 180)
    (fp_text reference "LED3" (at -0.635 -0.635) (layer "F.SilkS") hide)
    (fp_text value "" (at -0.635 1.905) (layer "F.Fab"))
    (pad "A" smd rect (at 0.6 0 180) (size 0.7 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "V_LED") (solder_mask_margin 0.0254) (thermal_bridge_angle 45))
    (pad "K" smd rect (at -0.6 0 180) (size 0.7 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 17 "L3") (solder_mask_margin 0.0254) (thermal_bridge_angle 45))
  )
  (footprint "1X07_NO6" (layer "F.Cu")
    (at 80.899 115.914 -90)
    (fp_text reference "JP1" (at -8.9662 -1.8288 90) (layer "F.SilkS") hide)
    (fp_text value "PINH-1X7_NO6," (at -8.89 5.969 90) (layer "F.Fab") hide)
    (pad "1" thru_hole circle (at -7.62 0) (size 1.27 1.27) (drill 0.7) (layers "*.Cu" "*.Mask")
      (net 12 "V_LED_IN") (solder_mask_margin 0.0254))
    (pad "2" thru_hole circle (at -5.08 0) (size 1.27 1.27) (drill 0.7) (layers "*.Cu" "*.Mask")
      (net 10 "INB") (solder_mask_margin 0.0254))
    (pad "3" thru_hole circle (at -2.54 0) (size 1.27 1.27) (drill 0.7) (layers "*.Cu" "*.Mask")
      (net 9 "INA") (solder_mask_margin 0.0254))
    (pad "4" thru_hole circle (at 0 0) (size 1.27 1.27) (drill 0.7) (layers "*.Cu" "*.Mask")
      (solder_mask_margin 0.0254))
    (pad "5" thru_hole circle (at 2.54 0) (size 1.27 1.27) (drill 0.7) (layers "*.Cu" "*.Mask")
      (net 11 "LATCH") (solder_mask_margin 0.0254))
    (pad "7" thru_hole circle (at 7.62 0) (size 1.27 1.27) (drill 0.7) (layers "*.Cu" "*.Mask")
      (net 8 "GND") (solder_mask_margin 0.0254))
  )
  (footprint "LED0402_B" (layer "F.Cu")
    (at 86.741 113.374 180)
    (fp_text reference "LED5" (at -0.635 -0.635) (layer "F.SilkS") hide)
    (fp_text value "" (at -0.635 1.905) (layer "F.Fab"))
    (pad "A" smd rect (at 0.6 0 180) (size 0.7 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "V_LED") (solder_mask_margin 0.0254) (thermal_bridge_angle 45))
    (pad "K" smd rect (at -0.6 0 180) (size 0.7 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 15 "L5") (solder_mask_margin 0.0254) (thermal_bridge_angle 45))
  )
  (footprint "LED0402_B" (layer "F.Cu")
    (at 86.741 116.422 180)
    (fp_text reference "LED18" (at -0.635 -0.635) (layer "F.SilkS") hide)
    (fp_text value "" (at 1.905 1.27 90) (layer "F.Fab"))
    (pad "A" smd rect (at 0.6 0 180) (size 0.7 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "V_LED") (solder_mask_margin 0.0254) (thermal_bridge_angle 45))
    (pad "K" smd rect (at -0.6 0 180) (size 0.7 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 45 "L6B") (solder_mask_margin 0.0254) (thermal_bridge_angle 45))
  )
  (footprint "LED0402_B" (layer "F.Cu")
    (at 86.741 111.85 180)
    (fp_text reference "LED19" (at -0.635 -0.635) (layer "F.SilkS") hide)
    (fp_text value "" (at 1.905 1.27 90) (layer "F.Fab"))
    (pad "A" smd rect (at 0.6 0 180) (size 0.7 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "V_LED") (solder_mask_margin 0.0254) (thermal_bridge_angle 45))
    (pad "K" smd rect (at -0.6 0 180) (size 0.7 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 44 "L4B") (solder_mask_margin 0.0254) (thermal_bridge_angle 45))
  )
  (footprint "LED0402_B" (layer "F.Cu")
    (at 82.677 116.422)
    (fp_text reference "LED23" (at -0.635 -0.635) (layer "F.SilkS") hide)
    (fp_text value "" (at 1.905 1.27 90) (layer "F.Fab"))
    (pad "A" smd rect (at 0.6 0) (size 0.7 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "V_LED") (solder_mask_margin 0.0254) (thermal_bridge_angle 45))
    (pad "K" smd rect (at -0.6 0) (size 0.7 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 40 "L10B") (solder_mask_margin 0.0254) (thermal_bridge_angle 45))
  )
  (footprint "1X07_NO2,4_THT" (layer "F.Cu")
    (at 88.519 115.914 90)
    (fp_text reference "JP2" (at -8.9662 -1.8288 90) (layer "F.SilkS") hide)
    (fp_text value "PINH-1X7_NO2,4THT2" (at -9.017 4.953 90) (layer "F.Fab") hide)
    (pad "1" thru_hole circle (at -7.62 0 90) (size 1.27 1.27) (drill 0.7) (layers "*.Cu" "*.Mask")
      (net 6 "BLK") (solder_mask_margin 0.0254))
    (pad "3" thru_hole circle (at -2.54 0 90) (size 1.27 1.27) (drill 0.7) (layers "*.Cu" "*.Mask")
      (net 5 "C_R") (solder_mask_margin 0.0254))
    (pad "5" thru_hole circle (at 2.54 0 90) (size 1.27 1.27) (drill 0.7) (layers "*.Cu" "*.Mask")
      (net 4 "IND") (solder_mask_margin 0.0254))
    (pad "6" thru_hole circle (at 5.08 0 90) (size 1.27 1.27) (drill 0.7) (layers "*.Cu" "*.Mask")
      (net 3 "INC") (solder_mask_margin 0.0254))
    (pad "7" thru_hole circle (at 7.62 0 90) (size 1.27 1.27) (drill 0.7) (layers "*.Cu" "*.Mask")
      (net 7 "V_LOGIC") (solder_mask_margin 0.0254))
  )
  (footprint "LED0402_B" (layer "F.Cu")
    (at 82.677 113.374)
    (fp_text reference "LED11" (at -0.635 -0.635) (layer "F.SilkS") hide)
    (fp_text value "" (at -0.635 1.905) (layer "F.Fab"))
    (pad "A" smd rect (at 0.6 0) (size 0.7 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "V_LED") (solder_mask_margin 0.0254) (thermal_bridge_angle 45))
    (pad "K" smd rect (at -0.6 0) (size 0.7 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 23 "L11") (solder_mask_margin 0.0254) (thermal_bridge_angle 45))
  )
  (footprint "LED0402_B" (layer "F.Cu")
    (at 86.741 110.326 180)
    (fp_text reference "LED4" (at -0.635 -0.635) (layer "F.SilkS") hide)
    (fp_text value "" (at -0.635 1.905) (layer "F.Fab"))
    (pad "A" smd rect (at 0.6 0 180) (size 0.7 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "V_LED") (solder_mask_margin 0.0254) (thermal_bridge_angle 45))
    (pad "K" smd rect (at -0.6 0 180) (size 0.7 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 16 "L4") (solder_mask_margin 0.0254) (thermal_bridge_angle 45))
  )
  (footprint "LED0402_B" (layer "F.Cu")
    (at 84.074 108.802 90)
    (fp_text reference "LED20" (at -0.635 -0.635 90) (layer "F.SilkS") hide)
    (fp_text value "" (at 1.905 1.27) (layer "F.Fab"))
    (pad "A" smd rect (at 0.6 0 90) (size 0.7 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "V_LED") (solder_mask_margin 0.0254) (thermal_bridge_angle 45))
    (pad "K" smd rect (at -0.6 0 90) (size 0.7 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 42 "L2B") (solder_mask_margin 0.0254) (thermal_bridge_angle 45))
  )
  (footprint "LED0402_B" (layer "F.Cu")
    (at 85.344 108.802 90)
    (fp_text reference "LED2" (at -0.635 -0.635 90) (layer "F.SilkS") hide)
    (fp_text value "" (at -0.635 1.905 90) (layer "F.Fab"))
    (pad "A" smd rect (at 0.6 0 90) (size 0.7 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "V_LED") (solder_mask_margin 0.0254) (thermal_bridge_angle 45))
    (pad "K" smd rect (at -0.6 0 90) (size 0.7 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 19 "L2") (solder_mask_margin 0.0254) (thermal_bridge_angle 45))
  )
  (footprint "LED0402_B" (layer "F.Cu")
    (at 82.677 117.946)
    (fp_text reference "LED9" (at -0.635 -0.635) (layer "F.SilkS") hide)
    (fp_text value "" (at -0.635 1.905) (layer "F.Fab"))
    (pad "A" smd rect (at 0.6 0) (size 0.7 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "V_LED") (solder_mask_margin 0.0254) (thermal_bridge_angle 45))
    (pad "K" smd rect (at -0.6 0) (size 0.7 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 25 "L9") (solder_mask_margin 0.0254) (thermal_bridge_angle 45))
  )
  (footprint "LED0402_B" (layer "F.Cu")
    (at 85.344 113.374 -90)
    (fp_text reference "LED13" (at -0.635 -0.635 90) (layer "F.SilkS") hide)
    (fp_text value "" (at -0.635 1.905 90) (layer "F.Fab"))
    (pad "A" smd rect (at 0.6 0 270) (size 0.7 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "V_LED") (solder_mask_margin 0.0254) (thermal_bridge_angle 45))
    (pad "K" smd rect (at -0.6 0 270) (size 0.7 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 22 "L13") (solder_mask_margin 0.0254) (thermal_bridge_angle 45))
  )
  (footprint "LED0402_B" (layer "F.Cu")
    (at 84.074 117.946 -90)
    (fp_text reference "LED22" (at -0.635 -0.635 90) (layer "F.SilkS") hide)
    (fp_text value "" (at 1.905 1.27) (layer "F.Fab"))
    (pad "A" smd rect (at 0.6 0 270) (size 0.7 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "V_LED") (solder_mask_margin 0.0254) (thermal_bridge_angle 45))
    (pad "K" smd rect (at -0.6 0 270) (size 0.7 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 41 "L8B") (solder_mask_margin 0.0254) (thermal_bridge_angle 45))
  )
  (footprint "LED0402_B" (layer "F.Cu")
    (at 82.677 114.898)
    (fp_text reference "LED10" (at -0.635 -0.635) (layer "F.SilkS") hide)
    (fp_text value "" (at -0.635 1.905) (layer "F.Fab"))
    (pad "A" smd rect (at 0.6 0) (size 0.7 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "V_LED") (solder_mask_margin 0.0254) (thermal_bridge_angle 45))
    (pad "K" smd rect (at -0.6 0) (size 0.7 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 24 "L10") (solder_mask_margin 0.0254) (thermal_bridge_angle 45))
  )
  (footprint "LED0402_B" (layer "F.Cu")
    (at 82.677 111.85)
    (fp_text reference "LED24" (at -0.635 -0.635) (layer "F.SilkS") hide)
    (fp_text value "" (at 1.905 1.27 90) (layer "F.Fab"))
    (pad "A" smd rect (at 0.6 0) (size 0.7 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "V_LED") (solder_mask_margin 0.0254) (thermal_bridge_angle 45))
    (pad "K" smd rect (at -0.6 0) (size 0.7 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 39 "L12B") (solder_mask_margin 0.0254) (thermal_bridge_angle 45))
  )
  (footprint "LED0402_B" (layer "F.Cu")
    (at 82.677 110.326)
    (fp_text reference "LED12" (at -0.635 -0.635) (layer "F.SilkS") hide)
    (fp_text value "" (at -0.635 1.905) (layer "F.Fab"))
    (pad "A" smd rect (at 0.6 0) (size 0.7 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "V_LED") (solder_mask_margin 0.0254) (thermal_bridge_angle 45))
    (pad "K" smd rect (at -0.6 0) (size 0.7 0.5) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 21 "L12") (solder_mask_margin 0.0254) (thermal_bridge_angle 45))
  )
  (footprint "R0402" (layer "B.Cu")
    (at 88.1253 124.8548 180)
    (descr "<b>RESISTOR</b>")
    (fp_text reference "R38" (at -0.635 0.635) (layer "B.SilkS") hide)
    (fp_text value "" (at -0.635 -1.905) (layer "B.Fab"))
    (pad "1" smd rect (at -0.65 0 180) (size 0.7 0.9) (layers "B.Cu" "B.Paste" "B.Mask")
      (net 1 "N$27") (solder_mask_margin 0.0254) (thermal_bridge_angle 45))
    (pad "2" smd rect (at 0.65 0 180) (size 0.7 0.9) (layers "B.Cu" "B.Paste" "B.Mask")
      (net 2 "V_LED") (solder_mask_margin 0.0254) (thermal_bridge_angle 45))
  )
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