Altium

Design Rule Verification Report

Date: 20/01/2018
Time: 19:15:15
Elapsed Time: 00:00:02
Filename: C:\Users\mgarivet\Documents\Altium perso\CapacitiveButton\PCB1.PcbDoc
Warnings: 0
Rule Violations: 64

Summary

Warnings Count
Total 0

Rule Violations Count
Clearance Constraint (Gap=0.254mm) (All),(All) 0
Short-Circuit Constraint (Allowed=No) (All),(All) 0
Un-Routed Net Constraint ( (All) ) 0
Modified Polygon (Allow modified: No), (Allow shelved: No) 0
Width Constraint (Min=0.254mm) (Max=0.254mm) (Preferred=0.254mm) (All) 0
Power Plane Connect Rule(Relief Connect )(Expansion=0.508mm) (Conductor Width=0.254mm) (Air Gap=0.254mm) (Entries=4) (All) 0
Hole Size Constraint (Min=0.025mm) (Max=2.54mm) (All) 0
Hole To Hole Clearance (Gap=0.254mm) (All),(All) 0
Minimum Solder Mask Sliver (Gap=0.254mm) (All),(All) 8
Silk To Solder Mask (Clearance=0.254mm) (IsPad),(All) 56
Silk to Silk (Clearance=0.254mm) (All),(All) 0
Net Antennae (Tolerance=0mm) (All) 0
Height Constraint (Min=0mm) (Max=25.4mm) (Prefered=12.7mm) (All) 0
Total 64

Minimum Solder Mask Sliver (Gap=0.254mm) (All),(All)
Minimum Solder Mask Sliver Constraint: (0.022mm < 0.254mm) Between Via (-10.8mm,2.2mm) from Top Layer to Bottom Layer And Pad D3-1(-10.8mm,1mm) on Top Layer [Top Solder] Mask Sliver [0.022mm]
Minimum Solder Mask Sliver Constraint: (0.022mm < 0.254mm) Between Via (-2.2mm,-10.9mm) from Top Layer to Bottom Layer And Pad D2-1(-1mm,-10.8mm) on Top Layer [Top Solder] Mask Sliver [0.022mm]
Minimum Solder Mask Sliver Constraint: (0.122mm < 0.254mm) Between Via (10.8mm,-2.3mm) from Top Layer to Bottom Layer And Pad D1-1(10.8mm,-1mm) on Top Layer [Top Solder] Mask Sliver [0.122mm]
Minimum Solder Mask Sliver Constraint: (0.122mm < 0.254mm) Between Via (2.3mm,10.8mm) from Top Layer to Bottom Layer And Pad D0-1(1mm,10.8mm) on Top Layer [Top Solder] Mask Sliver [0.122mm]
Minimum Solder Mask Sliver Constraint: (0.022mm < 0.254mm) Between Via (-2.2mm,-10.9mm) from Top Layer to Bottom Layer And Pad R2-1(-1mm,-10.8mm) on Bottom Layer [Bottom Solder] Mask Sliver [0.022mm]
Minimum Solder Mask Sliver Constraint: (0.022mm < 0.254mm) Between Via (-10.8mm,2.2mm) from Top Layer to Bottom Layer And Pad R3-1(-10.8mm,1mm) on Bottom Layer [Bottom Solder] Mask Sliver [0.022mm]
Minimum Solder Mask Sliver Constraint: (0.122mm < 0.254mm) Between Via (10.8mm,-2.3mm) from Top Layer to Bottom Layer And Pad R1-1(10.8mm,-1mm) on Bottom Layer [Bottom Solder] Mask Sliver [0.122mm]
Minimum Solder Mask Sliver Constraint: (0.122mm < 0.254mm) Between Via (2.3mm,10.8mm) from Top Layer to Bottom Layer And Pad R0-1(1mm,10.9mm) on Bottom Layer [Bottom Solder] Mask Sliver [0.122mm]
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Silk To Solder Mask (Clearance=0.254mm) (IsPad),(All)
Silk To Solder Mask Clearance Constraint: (Collision < 0.254mm) Between Track (-1mm,-10.5mm)(-1mm,-9.5mm) on Bottom Overlay And Pad R2-2(-1mm,-9.2mm) on Bottom Layer [Bottom Overlay] to [Bottom Solder] clearance [0mm]
Silk To Solder Mask Clearance Constraint: (0.25mm < 0.254mm) Between Track (-1.5mm,-10mm)(-0.5mm,-10mm) on Bottom Overlay And Pad R2-2(-1mm,-9.2mm) on Bottom Layer [Bottom Overlay] to [Bottom Solder] clearance [0.25mm]
Silk To Solder Mask Clearance Constraint: (0.175mm < 0.254mm) Between Track (-1.75mm,-8.45mm)(-1.175mm,-8.45mm) on Bottom Overlay And Pad R2-2(-1mm,-9.2mm) on Bottom Layer [Bottom Overlay] to [Bottom Solder] clearance [0.175mm]
Silk To Solder Mask Clearance Constraint: (0.175mm < 0.254mm) Between Track (-1.175mm,-8.45mm)(-0.25mm,-8.45mm) on Bottom Overlay And Pad R2-2(-1mm,-9.2mm) on Bottom Layer [Bottom Overlay] to [Bottom Solder] clearance [0.175mm]
Silk To Solder Mask Clearance Constraint: (0.2mm < 0.254mm) Between Track (-1.75mm,-10.225mm)(-1.75mm,-8.45mm) on Bottom Overlay And Pad R2-2(-1mm,-9.2mm) on Bottom Layer [Bottom Overlay] to [Bottom Solder] clearance [0.2mm]
Silk To Solder Mask Clearance Constraint: (0.2mm < 0.254mm) Between Track (-0.25mm,-9.825mm)(-0.25mm,-8.45mm) on Bottom Overlay And Pad R2-2(-1mm,-9.2mm) on Bottom Layer [Bottom Overlay] to [Bottom Solder] clearance [0.2mm]
Silk To Solder Mask Clearance Constraint: (0.227mm < 0.254mm) Between Track (-0.25mm,-11.55mm)(-0.25mm,-9.825mm) on Bottom Overlay And Pad R2-2(-1mm,-9.2mm) on Bottom Layer [Bottom Overlay] to [Bottom Solder] clearance [0.227mm]
Silk To Solder Mask Clearance Constraint: (0.175mm < 0.254mm) Between Track (-1.75mm,-11.55mm)(-0.8mm,-11.55mm) on Bottom Overlay And Pad R2-1(-1mm,-10.8mm) on Bottom Layer [Bottom Overlay] to [Bottom Solder] clearance [0.175mm]
Silk To Solder Mask Clearance Constraint: (0.175mm < 0.254mm) Between Track (-0.8mm,-11.55mm)(-0.25mm,-11.55mm) on Bottom Overlay And Pad R2-1(-1mm,-10.8mm) on Bottom Layer [Bottom Overlay] to [Bottom Solder] clearance [0.175mm]
Silk To Solder Mask Clearance Constraint: (Collision < 0.254mm) Between Track (-1mm,-10.5mm)(-1mm,-9.5mm) on Bottom Overlay And Pad R2-1(-1mm,-10.8mm) on Bottom Layer [Bottom Overlay] to [Bottom Solder] clearance [0mm]
Silk To Solder Mask Clearance Constraint: (0.25mm < 0.254mm) Between Track (-1.5mm,-10mm)(-0.5mm,-10mm) on Bottom Overlay And Pad R2-1(-1mm,-10.8mm) on Bottom Layer [Bottom Overlay] to [Bottom Solder] clearance [0.25mm]
Silk To Solder Mask Clearance Constraint: (0.2mm < 0.254mm) Between Track (-1.75mm,-11.55mm)(-1.75mm,-10.225mm) on Bottom Overlay And Pad R2-1(-1mm,-10.8mm) on Bottom Layer [Bottom Overlay] to [Bottom Solder] clearance [0.2mm]
Silk To Solder Mask Clearance Constraint: (0.21mm < 0.254mm) Between Track (-1.75mm,-10.225mm)(-1.75mm,-8.45mm) on Bottom Overlay And Pad R2-1(-1mm,-10.8mm) on Bottom Layer [Bottom Overlay] to [Bottom Solder] clearance [0.21mm]
Silk To Solder Mask Clearance Constraint: (0.2mm < 0.254mm) Between Track (-0.25mm,-11.55mm)(-0.25mm,-9.825mm) on Bottom Overlay And Pad R2-1(-1mm,-10.8mm) on Bottom Layer [Bottom Overlay] to [Bottom Solder] clearance [0.2mm]
Silk To Solder Mask Clearance Constraint: (0.175mm < 0.254mm) Between Track (-8.45mm,0.25mm)(-8.45mm,1.175mm) on Bottom Overlay And Pad R3-2(-9.2mm,1mm) on Bottom Layer [Bottom Overlay] to [Bottom Solder] clearance [0.175mm]
Silk To Solder Mask Clearance Constraint: (0.2mm < 0.254mm) Between Track (-9.825mm,0.25mm)(-8.45mm,0.25mm) on Bottom Overlay And Pad R3-2(-9.2mm,1mm) on Bottom Layer [Bottom Overlay] to [Bottom Solder] clearance [0.2mm]
Silk To Solder Mask Clearance Constraint: (0.175mm < 0.254mm) Between Track (-8.45mm,1.175mm)(-8.45mm,1.75mm) on Bottom Overlay And Pad R3-2(-9.2mm,1mm) on Bottom Layer [Bottom Overlay] to [Bottom Solder] clearance [0.175mm]
Silk To Solder Mask Clearance Constraint: (0.25mm < 0.254mm) Between Track (-10mm,0.5mm)(-10mm,1.5mm) on Bottom Overlay And Pad R3-2(-9.2mm,1mm) on Bottom Layer [Bottom Overlay] to [Bottom Solder] clearance [0.25mm]
Silk To Solder Mask Clearance Constraint: (0.227mm < 0.254mm) Between Track (-11.55mm,0.25mm)(-9.825mm,0.25mm) on Bottom Overlay And Pad R3-2(-9.2mm,1mm) on Bottom Layer [Bottom Overlay] to [Bottom Solder] clearance [0.227mm]
Silk To Solder Mask Clearance Constraint: (Collision < 0.254mm) Between Track (-10.5mm,1mm)(-9.5mm,1mm) on Bottom Overlay And Pad R3-2(-9.2mm,1mm) on Bottom Layer [Bottom Overlay] to [Bottom Solder] clearance [0mm]
Silk To Solder Mask Clearance Constraint: (0.2mm < 0.254mm) Between Track (-10.225mm,1.75mm)(-8.45mm,1.75mm) on Bottom Overlay And Pad R3-2(-9.2mm,1mm) on Bottom Layer [Bottom Overlay] to [Bottom Solder] clearance [0.2mm]
Silk To Solder Mask Clearance Constraint: (0.175mm < 0.254mm) Between Track (-11.55mm,0.25mm)(-11.55mm,0.8mm) on Bottom Overlay And Pad R3-1(-10.8mm,1mm) on Bottom Layer [Bottom Overlay] to [Bottom Solder] clearance [0.175mm]
Silk To Solder Mask Clearance Constraint: (0.175mm < 0.254mm) Between Track (-11.55mm,0.8mm)(-11.55mm,1.75mm) on Bottom Overlay And Pad R3-1(-10.8mm,1mm) on Bottom Layer [Bottom Overlay] to [Bottom Solder] clearance [0.175mm]
Silk To Solder Mask Clearance Constraint: (0.25mm < 0.254mm) Between Track (-10mm,0.5mm)(-10mm,1.5mm) on Bottom Overlay And Pad R3-1(-10.8mm,1mm) on Bottom Layer [Bottom Overlay] to [Bottom Solder] clearance [0.25mm]
Silk To Solder Mask Clearance Constraint: (0.2mm < 0.254mm) Between Track (-11.55mm,0.25mm)(-9.825mm,0.25mm) on Bottom Overlay And Pad R3-1(-10.8mm,1mm) on Bottom Layer [Bottom Overlay] to [Bottom Solder] clearance [0.2mm]
Silk To Solder Mask Clearance Constraint: (Collision < 0.254mm) Between Track (-10.5mm,1mm)(-9.5mm,1mm) on Bottom Overlay And Pad R3-1(-10.8mm,1mm) on Bottom Layer [Bottom Overlay] to [Bottom Solder] clearance [0mm]
Silk To Solder Mask Clearance Constraint: (0.21mm < 0.254mm) Between Track (-10.225mm,1.75mm)(-8.45mm,1.75mm) on Bottom Overlay And Pad R3-1(-10.8mm,1mm) on Bottom Layer [Bottom Overlay] to [Bottom Solder] clearance [0.21mm]
Silk To Solder Mask Clearance Constraint: (0.2mm < 0.254mm) Between Track (-11.55mm,1.75mm)(-10.225mm,1.75mm) on Bottom Overlay And Pad R3-1(-10.8mm,1mm) on Bottom Layer [Bottom Overlay] to [Bottom Solder] clearance [0.2mm]
Silk To Solder Mask Clearance Constraint: (0.175mm < 0.254mm) Between Track (8.45mm,-1.75mm)(8.45mm,-1.175mm) on Bottom Overlay And Pad R1-2(9.2mm,-1mm) on Bottom Layer [Bottom Overlay] to [Bottom Solder] clearance [0.175mm]
Silk To Solder Mask Clearance Constraint: (0.2mm < 0.254mm) Between Track (8.45mm,-0.25mm)(9.825mm,-0.25mm) on Bottom Overlay And Pad R1-2(9.2mm,-1mm) on Bottom Layer [Bottom Overlay] to [Bottom Solder] clearance [0.2mm]
Silk To Solder Mask Clearance Constraint: (0.175mm < 0.254mm) Between Track (8.45mm,-1.175mm)(8.45mm,-0.25mm) on Bottom Overlay And Pad R1-2(9.2mm,-1mm) on Bottom Layer [Bottom Overlay] to [Bottom Solder] clearance [0.175mm]
Silk To Solder Mask Clearance Constraint: (0.2mm < 0.254mm) Between Track (8.45mm,-1.75mm)(10.225mm,-1.75mm) on Bottom Overlay And Pad R1-2(9.2mm,-1mm) on Bottom Layer [Bottom Overlay] to [Bottom Solder] clearance [0.2mm]
Silk To Solder Mask Clearance Constraint: (Collision < 0.254mm) Between Track (9.5mm,-1mm)(10.5mm,-1mm) on Bottom Overlay And Pad R1-2(9.2mm,-1mm) on Bottom Layer [Bottom Overlay] to [Bottom Solder] clearance [0mm]
Silk To Solder Mask Clearance Constraint: (0.25mm < 0.254mm) Between Track (10mm,-1.5mm)(10mm,-0.5mm) on Bottom Overlay And Pad R1-2(9.2mm,-1mm) on Bottom Layer [Bottom Overlay] to [Bottom Solder] clearance [0.25mm]
Silk To Solder Mask Clearance Constraint: (0.227mm < 0.254mm) Between Track (9.825mm,-0.25mm)(11.55mm,-0.25mm) on Bottom Overlay And Pad R1-2(9.2mm,-1mm) on Bottom Layer [Bottom Overlay] to [Bottom Solder] clearance [0.227mm]
Silk To Solder Mask Clearance Constraint: (0.2mm < 0.254mm) Between Track (10.225mm,-1.75mm)(11.55mm,-1.75mm) on Bottom Overlay And Pad R1-1(10.8mm,-1mm) on Bottom Layer [Bottom Overlay] to [Bottom Solder] clearance [0.2mm]
Silk To Solder Mask Clearance Constraint: (0.175mm < 0.254mm) Between Track (11.55mm,-1.75mm)(11.55mm,-0.8mm) on Bottom Overlay And Pad R1-1(10.8mm,-1mm) on Bottom Layer [Bottom Overlay] to [Bottom Solder] clearance [0.175mm]
Silk To Solder Mask Clearance Constraint: (0.175mm < 0.254mm) Between Track (11.55mm,-0.8mm)(11.55mm,-0.25mm) on Bottom Overlay And Pad R1-1(10.8mm,-1mm) on Bottom Layer [Bottom Overlay] to [Bottom Solder] clearance [0.175mm]
Silk To Solder Mask Clearance Constraint: (0.21mm < 0.254mm) Between Track (8.45mm,-1.75mm)(10.225mm,-1.75mm) on Bottom Overlay And Pad R1-1(10.8mm,-1mm) on Bottom Layer [Bottom Overlay] to [Bottom Solder] clearance [0.21mm]
Silk To Solder Mask Clearance Constraint: (Collision < 0.254mm) Between Track (9.5mm,-1mm)(10.5mm,-1mm) on Bottom Overlay And Pad R1-1(10.8mm,-1mm) on Bottom Layer [Bottom Overlay] to [Bottom Solder] clearance [0mm]
Silk To Solder Mask Clearance Constraint: (0.25mm < 0.254mm) Between Track (10mm,-1.5mm)(10mm,-0.5mm) on Bottom Overlay And Pad R1-1(10.8mm,-1mm) on Bottom Layer [Bottom Overlay] to [Bottom Solder] clearance [0.25mm]
Silk To Solder Mask Clearance Constraint: (0.2mm < 0.254mm) Between Track (9.825mm,-0.25mm)(11.55mm,-0.25mm) on Bottom Overlay And Pad R1-1(10.8mm,-1mm) on Bottom Layer [Bottom Overlay] to [Bottom Solder] clearance [0.2mm]
Silk To Solder Mask Clearance Constraint: (0.175mm < 0.254mm) Between Track (1.175mm,8.55mm)(1.75mm,8.55mm) on Bottom Overlay And Pad R0-2(1mm,9.3mm) on Bottom Layer [Bottom Overlay] to [Bottom Solder] clearance [0.175mm]
Silk To Solder Mask Clearance Constraint: (0.175mm < 0.254mm) Between Track (0.25mm,8.55mm)(1.175mm,8.55mm) on Bottom Overlay And Pad R0-2(1mm,9.3mm) on Bottom Layer [Bottom Overlay] to [Bottom Solder] clearance [0.175mm]
Silk To Solder Mask Clearance Constraint: (Collision < 0.254mm) Between Track (1mm,9.6mm)(1mm,10.6mm) on Bottom Overlay And Pad R0-2(1mm,9.3mm) on Bottom Layer [Bottom Overlay] to [Bottom Solder] clearance [0mm]
Silk To Solder Mask Clearance Constraint: (0.25mm < 0.254mm) Between Track (0.5mm,10.1mm)(1.5mm,10.1mm) on Bottom Overlay And Pad R0-2(1mm,9.3mm) on Bottom Layer [Bottom Overlay] to [Bottom Solder] clearance [0.25mm]
Silk To Solder Mask Clearance Constraint: (0.2mm < 0.254mm) Between Track (1.75mm,8.55mm)(1.75mm,10.325mm) on Bottom Overlay And Pad R0-2(1mm,9.3mm) on Bottom Layer [Bottom Overlay] to [Bottom Solder] clearance [0.2mm]
Silk To Solder Mask Clearance Constraint: (0.2mm < 0.254mm) Between Track (0.25mm,8.55mm)(0.25mm,9.925mm) on Bottom Overlay And Pad R0-2(1mm,9.3mm) on Bottom Layer [Bottom Overlay] to [Bottom Solder] clearance [0.2mm]
Silk To Solder Mask Clearance Constraint: (0.227mm < 0.254mm) Between Track (0.25mm,9.925mm)(0.25mm,11.65mm) on Bottom Overlay And Pad R0-2(1mm,9.3mm) on Bottom Layer [Bottom Overlay] to [Bottom Solder] clearance [0.227mm]
Silk To Solder Mask Clearance Constraint: (Collision < 0.254mm) Between Track (1mm,9.6mm)(1mm,10.6mm) on Bottom Overlay And Pad R0-1(1mm,10.9mm) on Bottom Layer [Bottom Overlay] to [Bottom Solder] clearance [0mm]
Silk To Solder Mask Clearance Constraint: (0.25mm < 0.254mm) Between Track (0.5mm,10.1mm)(1.5mm,10.1mm) on Bottom Overlay And Pad R0-1(1mm,10.9mm) on Bottom Layer [Bottom Overlay] to [Bottom Solder] clearance [0.25mm]
Silk To Solder Mask Clearance Constraint: (0.175mm < 0.254mm) Between Track (0.8mm,11.65mm)(1.75mm,11.65mm) on Bottom Overlay And Pad R0-1(1mm,10.9mm) on Bottom Layer [Bottom Overlay] to [Bottom Solder] clearance [0.175mm]
Silk To Solder Mask Clearance Constraint: (0.175mm < 0.254mm) Between Track (0.25mm,11.65mm)(0.8mm,11.65mm) on Bottom Overlay And Pad R0-1(1mm,10.9mm) on Bottom Layer [Bottom Overlay] to [Bottom Solder] clearance [0.175mm]
Silk To Solder Mask Clearance Constraint: (0.21mm < 0.254mm) Between Track (1.75mm,8.55mm)(1.75mm,10.325mm) on Bottom Overlay And Pad R0-1(1mm,10.9mm) on Bottom Layer [Bottom Overlay] to [Bottom Solder] clearance [0.21mm]
Silk To Solder Mask Clearance Constraint: (0.2mm < 0.254mm) Between Track (1.75mm,10.325mm)(1.75mm,11.65mm) on Bottom Overlay And Pad R0-1(1mm,10.9mm) on Bottom Layer [Bottom Overlay] to [Bottom Solder] clearance [0.2mm]
Silk To Solder Mask Clearance Constraint: (0.2mm < 0.254mm) Between Track (0.25mm,9.925mm)(0.25mm,11.65mm) on Bottom Overlay And Pad R0-1(1mm,10.9mm) on Bottom Layer [Bottom Overlay] to [Bottom Solder] clearance [0.2mm]
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