(kicad_pcb (version 20171130) (host pcbnew "(5.1.4-0-10_14)")
  (general
    (thickness 1.6)
    (drawings 25)
    (tracks 411)
    (zones 0)
    (modules 16)
    (nets 23)
  )
  (page A4)
  (layers
    (0 F.Cu signal)
    (31 B.Cu signal)
    (32 B.Adhes user)
    (33 F.Adhes user)
    (34 B.Paste user)
    (35 F.Paste user)
    (36 B.SilkS user)
    (37 F.SilkS user)
    (38 B.Mask user)
    (39 F.Mask user)
    (40 Dwgs.User user)
    (41 Cmts.User user)
    (42 Eco1.User user)
    (43 Eco2.User user)
    (44 Edge.Cuts user)
    (45 Margin user)
    (46 B.CrtYd user)
    (47 F.CrtYd user)
    (48 B.Fab user)
    (49 F.Fab user)
  )
  (setup
    (last_trace_width 0.1524)
    (user_trace_width 0.1524)
    (user_trace_width 0.3048)
    (user_trace_width 0.4572)
    (trace_clearance 0.1524)
    (zone_clearance 0.1524)
    (zone_45_only no)
    (trace_min 0.1524)
    (via_size 0.3302)
    (via_drill 0.254)
    (via_min_size 0.3302)
    (via_min_drill 0.254)
    (user_via 0.3302 0.254)
    (uvia_size 0.3)
    (uvia_drill 0.1)
    (uvias_allowed no)
    (uvia_min_size 0.2)
    (uvia_min_drill 0.1)
    (edge_width 0.05)
    (segment_width 0.2)
    (pcb_text_width 0.3)
    (pcb_text_size 1.5 1.5)
    (mod_edge_width 0.12)
    (mod_text_size 1 1)
    (mod_text_width 0.15)
    (pad_size 1.524 1.524)
    (pad_drill 0.762)
    (pad_to_mask_clearance 0.051)
    (solder_mask_min_width 0.25)
    (aux_axis_origin 0 0)
    (visible_elements FFFFFF7F)
    (pcbplotparams
      (layerselection 0x010fc_ffffffff)
      (usegerberextensions false)
      (usegerberattributes false)
      (usegerberadvancedattributes false)
      (creategerberjobfile false)
      (excludeedgelayer true)
      (linewidth 0.100000)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (padsonsilk false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 1)
      (scaleselection 1)
      (outputdirectory ""))
  )
  (net 0 "")
  (net 1 GND)
  (net 2 +3V3)
  (net 3 /ESP32_EN)
  (net 4 /3V3_Teensy)
  (net 5 /24_TX6)
  (net 6 /28)
  (net 7 /26)
  (net 8 /25_RX6)
  (net 9 "Net-(R2-Pad2)")
  (net 10 "Net-(R3-Pad2)")
  (net 11 /+5V)
  (net 12 "Net-(D1-Pad1)")
  (net 13 /SCK)
  (net 14 /CS)
  (net 15 /IO25)
  (net 16 /MOSI)
  (net 17 /IO26)
  (net 18 /MISO)
  (net 19 /IO27)
  (net 20 /IO22)
  (net 21 /ESP_BUSY)
  (net 22 /IO33)
  (net_class Default "This is the default net class."
    (clearance 0.1524)
    (trace_width 0.1524)
    (via_dia 0.3302)
    (via_drill 0.254)
    (uvia_dia 0.3)
    (uvia_drill 0.1)
    (add_net +3V3)
    (add_net /+5V)
    (add_net /24_TX6)
    (add_net /25_RX6)
    (add_net /26)
    (add_net /28)
    (add_net /3V3_Teensy)
    (add_net /CS)
    (add_net /ESP32_EN)
    (add_net /ESP_BUSY)
    (add_net /IO22)
    (add_net /IO25)
    (add_net /IO26)
    (add_net /IO27)
    (add_net /IO33)
    (add_net /MISO)
    (add_net /MOSI)
    (add_net /SCK)
    (add_net GND)
    (add_net "Net-(D1-Pad1)")
    (add_net "Net-(R2-Pad2)")
    (add_net "Net-(R3-Pad2)")
  )
  (module Connector_PinHeader_2.54mm:PinHeader_2x06_P2.54mm_Vertical (layer F.Cu) (tedit 59FED5CC)
    (at 154.94 101.6)
    (descr "Through hole straight pin header, 2x06, 2.54mm pitch, double rows")
    (tags "Through hole pin header THT 2x06 2.54mm double row")
    (fp_text reference J2 (at 1.27 -2.33) (layer F.SilkS))
    (fp_text value Conn_02x06_Odd_Even (at 1.27 15.03) (layer F.Fab))
    (fp_text user %R (at 1.27 6.35 90) (layer F.Fab))
    (pad 12 thru_hole oval (at 2.54 12.7) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 22 /IO33))
    (pad 11 thru_hole oval (at 0 12.7) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 21 /ESP_BUSY))
    (pad 10 thru_hole oval (at 2.54 10.16) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 19 /IO27))
    (pad 9 thru_hole oval (at 0 10.16) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 18 /MISO))
    (pad 8 thru_hole oval (at 2.54 7.62) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 17 /IO26))
    (pad 7 thru_hole oval (at 0 7.62) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 16 /MOSI))
    (pad 6 thru_hole oval (at 2.54 5.08) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 15 /IO25))
    (pad 5 thru_hole oval (at 0 5.08) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 14 /CS))
    (pad 4 thru_hole oval (at 2.54 2.54) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 11 /+5V))
    (pad 3 thru_hole oval (at 0 2.54) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 13 /SCK))
    (pad 2 thru_hole oval (at 2.54 0) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 2 +3V3))
    (pad 1 thru_hole rect (at 0 0) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_2x06_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module RF_Module:ESP32-WROOM-32 (layer F.Cu) (tedit 5B5B4654)
    (at 172.466 113.03 270)
    (descr "Single 2.4 GHz Wi-Fi and Bluetooth combo chip https://www.espressif.com/sites/default/files/documentation/esp32-wroom-32_datasheet_en.pdf")
    (tags "Single 2.4 GHz Wi-Fi and Bluetooth combo  chip")
    (attr smd)
    (fp_text reference U1 (at -4.953 0.127) (layer F.SilkS))
    (fp_text value ESP32-WROOM-32D (at 0 11.5 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (fp_text user "KEEP-OUT ZONE" (at 0 -19 90) (layer Cmts.User))
    (fp_text user Antenna (at 0 -13 90) (layer Cmts.User))
    (fp_text user "5 mm" (at 11.8 -14.375 90) (layer Cmts.User))
    (fp_text user "5 mm" (at -11.2 -14.375 90) (layer Cmts.User))
    (fp_text user "5 mm" (at 7.8 -19.075) (layer Cmts.User))
    (pad 39 smd rect (at -1 -0.755 270) (size 5 5) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 1 smd rect (at -8.5 -8.255 270) (size 2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 2 smd rect (at -8.5 -6.985 270) (size 2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 2 +3V3))
    (pad 3 smd rect (at -8.5 -5.715 270) (size 2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 3 /ESP32_EN))
    (pad 4 smd rect (at -8.5 -4.445 270) (size 2 0.9) (layers F.Cu F.Paste F.Mask))
    (pad 5 smd rect (at -8.5 -3.175 270) (size 2 0.9) (layers F.Cu F.Paste F.Mask))
    (pad 6 smd rect (at -8.5 -1.905 270) (size 2 0.9) (layers F.Cu F.Paste F.Mask))
    (pad 7 smd rect (at -8.5 -0.635 270) (size 2 0.9) (layers F.Cu F.Paste F.Mask))
    (pad 8 smd rect (at -8.5 0.635 270) (size 2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 21 /ESP_BUSY))
    (pad 9 smd rect (at -8.5 1.905 270) (size 2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 22 /IO33))
    (pad 10 smd rect (at -8.5 3.175 270) (size 2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 15 /IO25))
    (pad 11 smd rect (at -8.5 4.445 270) (size 2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 17 /IO26))
    (pad 12 smd rect (at -8.5 5.715 270) (size 2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 19 /IO27))
    (pad 13 smd rect (at -8.5 6.985 270) (size 2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 16 /MOSI))
    (pad 14 smd rect (at -8.5 8.255 270) (size 2 0.9) (layers F.Cu F.Paste F.Mask))
    (pad 15 smd rect (at -5.715 9.255) (size 2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 16 smd rect (at -4.445 9.255) (size 2 0.9) (layers F.Cu F.Paste F.Mask))
    (pad 17 smd rect (at -3.175 9.255) (size 2 0.9) (layers F.Cu F.Paste F.Mask))
    (pad 18 smd rect (at -1.905 9.255) (size 2 0.9) (layers F.Cu F.Paste F.Mask))
    (pad 19 smd rect (at -0.635 9.255) (size 2 0.9) (layers F.Cu F.Paste F.Mask))
    (pad 20 smd rect (at 0.635 9.255) (size 2 0.9) (layers F.Cu F.Paste F.Mask))
    (pad 21 smd rect (at 1.905 9.255) (size 2 0.9) (layers F.Cu F.Paste F.Mask))
    (pad 22 smd rect (at 3.175 9.255) (size 2 0.9) (layers F.Cu F.Paste F.Mask))
    (pad 23 smd rect (at 4.445 9.255) (size 2 0.9) (layers F.Cu F.Paste F.Mask))
    (pad 24 smd rect (at 5.715 9.255) (size 2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 6 /28))
    (pad 25 smd rect (at 8.5 8.255 270) (size 2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 7 /26))
    (pad 26 smd rect (at 8.5 6.985 270) (size 2 0.9) (layers F.Cu F.Paste F.Mask))
    (pad 27 smd rect (at 8.5 5.715 270) (size 2 0.9) (layers F.Cu F.Paste F.Mask))
    (pad 28 smd rect (at 8.5 4.445 270) (size 2 0.9) (layers F.Cu F.Paste F.Mask))
    (pad 29 smd rect (at 8.5 3.175 270) (size 2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 14 /CS))
    (pad 30 smd rect (at 8.5 1.905 270) (size 2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 13 /SCK))
    (pad 31 smd rect (at 8.5 0.635 270) (size 2 0.9) (layers F.Cu F.Paste F.Mask))
    (pad 32 smd rect (at 8.5 -0.635 270) (size 2 0.9) (layers F.Cu F.Paste F.Mask))
    (pad 33 smd rect (at 8.5 -1.905 270) (size 2 0.9) (layers F.Cu F.Paste F.Mask))
    (pad 34 smd rect (at 8.5 -3.175 270) (size 2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 10 "Net-(R3-Pad2)"))
    (pad 35 smd rect (at 8.5 -4.445 270) (size 2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 9 "Net-(R2-Pad2)"))
    (pad 36 smd rect (at 8.5 -5.715 270) (size 2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 20 /IO22))
    (pad 37 smd rect (at 8.5 -6.985 270) (size 2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 18 /MISO))
    (pad 38 smd rect (at 8.5 -8.255 270) (size 2 0.9) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (model ${KISYS3DMOD}/RF_Module.3dshapes/ESP32-WROOM-32.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_TO_SOT_SMD:SOT-23-5 (layer F.Cu) (tedit 5A02FF57)
    (at 156.21 117.475)
    (descr "5-pin SOT23 package")
    (tags SOT-23-5)
    (attr smd)
    (fp_text reference U2 (at -2.286 0.127 270) (layer F.SilkS))
    (fp_text value TLV75733PDBVR (at 0 2.9) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 5 smd rect (at 1.1 -0.95) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask)
      (net 2 +3V3))
    (pad 4 smd rect (at 1.1 0.95) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask))
    (pad 3 smd rect (at -1.1 0.95) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask)
      (net 11 /+5V))
    (pad 2 smd rect (at -1.1 0) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 1 smd rect (at -1.1 -0.95) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask)
      (net 11 /+5V))
    (model ${KISYS3DMOD}/Package_TO_SOT_SMD.3dshapes/SOT-23-5.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B36C52B)
    (at 161.036 113.792 270)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R4 (at -1.016 1.524 90) (layer F.SilkS))
    (fp_text value 2k (at 0 1.65 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 12 "Net-(D1-Pad1)"))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 20 /IO22))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module LED_SMD:LED_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B4B45C9)
    (at 161.036 117.475 270)
    (descr "LED SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "LED handsolder")
    (attr smd)
    (fp_text reference D1 (at 2.54 -1.27 90) (layer F.SilkS))
    (fp_text value LED (at 0 1.65 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 2 +3V3))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 12 "Net-(D1-Pad1)"))
    (model ${KISYS3DMOD}/LED_SMD.3dshapes/LED_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B36C52B)
    (at 161.036 110.109 90)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C5 (at -0.254 -1.524 90) (layer F.SilkS))
    (fp_text value 1u (at 0 1.65 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 2 +3V3))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B36C52B)
    (at 159.131 117.475 90)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C4 (at 2.667 0.381 270) (layer F.SilkS))
    (fp_text value 1u (at 0 1.65 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 11 /+5V))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Button_Switch_SMD:Panasonic_EVQPUJ_EVQPUA (layer F.Cu) (tedit 5A02FC95)
    (at 158.0896 121.3358 180)
    (descr http://industrial.panasonic.com/cdbs/www-data/pdf/ATV0000/ATV0000CE5.pdf)
    (tags "SMD SMT SPST EVQPUJ EVQPUA")
    (attr smd)
    (fp_text reference SW1 (at -0.0254 -1.0922) (layer F.SilkS))
    (fp_text value ON_OFF (at 0 3.5) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd rect (at 2.625 -0.85) (size 1.55 1) (layers F.Cu F.Paste F.Mask)
      (net 3 /ESP32_EN))
    (pad 1 smd rect (at -2.625 -0.85) (size 1.55 1) (layers F.Cu F.Paste F.Mask)
      (net 3 /ESP32_EN))
    (pad 2 smd rect (at -2.625 0.85) (size 1.55 1) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (pad 2 smd rect (at 2.625 0.85) (size 1.55 1) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (model ${KISYS3DMOD}/Button_Switch_SMD.3dshapes/Panasonic_EVQPUJ_EVQPUA.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B36C52B)
    (at 160.528 106.045 90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R3 (at 0 -1.27 90) (layer F.SilkS))
    (fp_text value 0R (at 0 1.65 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 10 "Net-(R3-Pad2)"))
    (pad 1 smd roundrect (at -1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 5 /24_TX6))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B36C52B)
    (at 160.528 102.108 270)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R2 (at 0.127 1.397 90) (layer F.SilkS))
    (fp_text value 0R (at 0 1.65 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 9 "Net-(R2-Pad2)"))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 8 /25_RX6))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B36C52B)
    (at 171.196 101.854 180)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R1 (at -0.127 -1.397 180) (layer F.SilkS))
    (fp_text value 10k (at 0 1.65) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 2 +3V3))
    (pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 3 /ESP32_EN))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Jumper:SolderJumper-2_P1.3mm_Bridged_RoundedPad1.0x1.5mm (layer F.Cu) (tedit 5C745284)
    (at 163.322 101.981 180)
    (descr "SMD Solder Jumper, 1x1.5mm, rounded Pads, 0.3mm gap, bridged with 1 copper strip")
    (tags "solder jumper open")
    (attr virtual)
    (fp_text reference JP1 (at 0.254 -1.524) (layer F.SilkS))
    (fp_text value "Teensy 3.3" (at 0 1.9) (layer F.Fab))
    (pad 1 smd custom (at -0.65 0 180) (size 1 0.5) (layers F.Cu F.Mask)
      (net 4 /3V3_Teensy) (zone_connect 2)
      (options (clearance outline) (anchor rect))
      (primitives
        (gr_circle (center 0 0.25) (end 0.5 0.25) (width 0))
        (gr_circle (center 0 -0.25) (end 0.5 -0.25) (width 0))
        (gr_poly (pts
           (xy 0 -0.75) (xy 0.5 -0.75) (xy 0.5 0.75) (xy 0 0.75)) (width 0))
      ))
    (pad 2 smd custom (at 0.65 0 180) (size 1 0.5) (layers F.Cu F.Mask)
      (net 2 +3V3) (zone_connect 2)
      (options (clearance outline) (anchor rect))
      (primitives
        (gr_circle (center 0 0.25) (end 0.5 0.25) (width 0))
        (gr_circle (center 0 -0.25) (end 0.5 -0.25) (width 0))
        (gr_poly (pts
           (xy 0 -0.75) (xy -0.5 -0.75) (xy -0.5 0.75) (xy 0 0.75)) (width 0))
      ))
  )
  (module Connector_PinHeader_2.54mm:PinHeader_1x08_P2.54mm_Vertical (layer F.Cu) (tedit 59FED5CC)
    (at 152.4 101.6)
    (descr "Through hole straight pin header, 1x08, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x08 2.54mm single row")
    (fp_text reference J1 (at 0 -2.33) (layer F.SilkS))
    (fp_text value Conn_01x08 (at 0 20.11) (layer F.Fab))
    (fp_text user %R (at 0 8.89 90) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 8 /25_RX6))
    (pad 2 thru_hole oval (at 0 2.54) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 7 /26))
    (pad 3 thru_hole oval (at 0 5.08) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 6 /28))
    (pad 4 thru_hole oval (at 0 7.62) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 5 /24_TX6))
    (pad 5 thru_hole oval (at 0 10.16) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 4 /3V3_Teensy))
    (pad 6 thru_hole oval (at 0 12.7) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 7 thru_hole oval (at 0 15.24) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
    (pad 8 thru_hole oval (at 0 17.78) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 3 /ESP32_EN))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x08_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B36C52B)
    (at 167.132 101.854 180)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C3 (at 0.127 -1.397 180) (layer F.SilkS))
    (fp_text value 1u (at 0 1.65) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 3 /ESP32_EN))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_Tantalum_SMD:CP_EIA-2012-12_Kemet-R_Pad1.30x1.05mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 175.26 101.854 180)
    (descr "Tantalum Capacitor SMD Kemet-R (2012-12 Metric), IPC_7351 nominal, (Body size from: https://www.vishay.com/docs/40182/tmch.pdf), generated with kicad-footprint-generator")
    (tags "capacitor tantalum")
    (attr smd)
    (fp_text reference C2 (at 0.127 -1.27 180) (layer F.SilkS))
    (fp_text value 22u/10v (at 0 1.58) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 0.975 0 180) (size 1.3 1.05) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.238095)
      (net 1 GND))
    (pad 1 smd roundrect (at -0.975 0 180) (size 1.3 1.05) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.238095)
      (net 2 +3V3))
    (model ${KISYS3DMOD}/Capacitor_Tantalum_SMD.3dshapes/CP_EIA-2012-12_Kemet-R.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B36C52B)
    (at 179.324 101.854)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C1 (at -0.127 1.27) (layer F.SilkS))
    (fp_text value 0.1u/50v (at 0 1.65) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 GND))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 2 +3V3))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (gr_text "3.3v\n5v\nIO25\nIO26\nIO27\nIO33" (at 181.356 108.077) (layer B.SilkS))
  (gr_text "GND\nSCK\nCS\nMOSI\nMISO\nBUSY" (at 168.275 108.077) (layer B.SilkS))
  (gr_text "RX6\nIO0\nIO2\nTX6\n3.3v\nGND\nPGM\nRESET" (at 158.877 110.49) (layer B.SilkS))
  (gr_text "Teensy 4.0 \nESP32 Breakout\n2019-09-25" (at 181.356 120.015) (layer B.SilkS))
  (gr_line (start 151.13 123.19) (end 151.13 100.33) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 181.61 123.19) (end 151.13 123.19) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 181.61 100.33) (end 181.61 123.19) (layer Edge.Cuts) (width 0.05))
  (gr_line (start 151.13 100.33) (end 181.61 100.33) (layer Edge.Cuts) (width 0.05))
  (zone (net 1) (net_name GND) (layer B.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.1524))
    (min_thickness 0.254)
    (fill yes (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 183.134 124.46) (xy 149.86 124.46) (xy 149.86 99.06) (xy 183.134 99.06)
      )
    )
  )
)
