(kicad_pcb (version 20211014) (generator pcbnew)
  (general
    (thickness 1.6)
  )
  (paper "A4")
  (layers
    (0 "F.Cu" signal)
    (1 "In1.Cu" power)
    (2 "In2.Cu" power)
    (31 "B.Cu" signal)
    (32 "B.Adhes" user "B.Adhesive")
    (33 "F.Adhes" user "F.Adhesive")
    (34 "B.Paste" user)
    (35 "F.Paste" user)
    (36 "B.SilkS" user "B.Silkscreen")
    (37 "F.SilkS" user "F.Silkscreen")
    (38 "B.Mask" user)
    (39 "F.Mask" user)
    (40 "Dwgs.User" user "User.Drawings")
    (41 "Cmts.User" user "User.Comments")
    (42 "Eco1.User" user "User.Eco1")
    (43 "Eco2.User" user "User.Eco2")
    (44 "Edge.Cuts" user)
    (45 "Margin" user)
    (46 "B.CrtYd" user "B.Courtyard")
    (47 "F.CrtYd" user "F.Courtyard")
    (48 "B.Fab" user)
    (49 "F.Fab" user)
  )
  (setup
    (pad_to_mask_clearance 0.2)
    (pcbplotparams
      (layerselection 0x00010f0_80000007)
      (disableapertmacros false)
      (usegerberextensions false)
      (usegerberattributes true)
      (usegerberadvancedattributes true)
      (creategerberjobfile true)
      (svguseinch false)
      (svgprecision 6)
      (excludeedgelayer true)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (dxfpolygonmode true)
      (dxfimperialunits true)
      (dxfusepcbnewfont true)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (sketchpadsonfab false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 0)
      (scaleselection 1)
      (outputdirectory "gerber01/")
    )
  )
  (net 0 "")
  (net 1 "GND")
  (net 2 "VDD")
  (net 3 "Net-(D1-Pad1)")
  (net 4 "Net-(D2-Pad1)")
  (net 5 "Net-(D3-Pad1)")
  (net 6 "Net-(D4-Pad1)")
  (net 7 "Net-(D5-Pad1)")
  (net 8 "Net-(D6-Pad1)")
  (net 9 "Net-(D7-Pad1)")
  (net 10 "Net-(D8-Pad1)")
  (net 11 "Net-(D10-Pad3)")
  (net 12 "Net-(D10-Pad1)")
  (net 13 "Net-(D11-Pad1)")
  (net 14 "Net-(D12-Pad1)")
  (net 15 "Net-(D13-Pad1)")
  (net 16 "Net-(D14-Pad1)")
  (net 17 "Net-(D15-Pad1)")
  (net 18 "Net-(D16-Pad1)")
  (net 19 "Net-(D17-Pad1)")
  (net 20 "Net-(D18-Pad1)")
  (net 21 "Net-(D19-Pad1)")
  (net 22 "Net-(D20-Pad1)")
  (net 23 "Net-(D21-Pad1)")
  (net 24 "Net-(D22-Pad1)")
  (net 25 "Net-(D23-Pad1)")
  (net 26 "Net-(D24-Pad1)")
  (net 27 "Net-(D25-Pad1)")
  (net 28 "Net-(D26-Pad1)")
  (net 29 "Net-(D27-Pad1)")
  (net 30 "Net-(D28-Pad1)")
  (net 31 "Net-(D29-Pad1)")
  (net 32 "Net-(D30-Pad1)")
  (net 33 "Net-(D31-Pad1)")
  (net 34 "Net-(D32-Pad1)")
  (net 35 "Net-(D33-Pad1)")
  (net 36 "Net-(D34-Pad1)")
  (net 37 "Net-(D35-Pad1)")
  (net 38 "Net-(D36-Pad1)")
  (net 39 "Net-(D37-Pad1)")
  (net 40 "Net-(D38-Pad1)")
  (net 41 "Net-(D39-Pad1)")
  (net 42 "Net-(D40-Pad1)")
  (net 43 "Net-(D41-Pad1)")
  (net 44 "Net-(D42-Pad1)")
  (net 45 "Net-(D43-Pad1)")
  (net 46 "Net-(D44-Pad1)")
  (net 47 "Net-(D45-Pad1)")
  (net 48 "Net-(D46-Pad1)")
  (net 49 "Net-(D47-Pad1)")
  (net 50 "Net-(D48-Pad1)")
  (net 51 "Net-(D49-Pad1)")
  (net 52 "Net-(D50-Pad1)")
  (net 53 "Net-(D51-Pad1)")
  (net 54 "Net-(D52-Pad1)")
  (net 55 "Net-(D53-Pad1)")
  (net 56 "Net-(D54-Pad1)")
  (net 57 "Net-(D55-Pad1)")
  (net 58 "Net-(D56-Pad1)")
  (net 59 "Net-(D57-Pad1)")
  (net 60 "Net-(D58-Pad1)")
  (net 61 "Net-(D59-Pad1)")
  (net 62 "Net-(D60-Pad1)")
  (net 63 "Net-(D61-Pad1)")
  (net 64 "Net-(D62-Pad1)")
  (net 65 "Net-(D63-Pad1)")
  (net 66 "DIN")
  (net 67 "DOUT")
  (footprint "SMD_Packages:WS2812B_2020" (layer "F.Cu")
    (tedit 5CB97F3B)
    (at 96.012 92.1004)
    (solder_mask_margin 0.0762)
    (attr through_hole)
    (fp_text reference "D1" (at 0 -1.397) (layer "F.SilkS"))
    (fp_text value "WS2812B_2020" (at 0 1.4605) (layer "F.Fab") hide)
    (pad "1" smd rect locked (at 0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 3 "Net-(D1-Pad1)"))
    (pad "2" smd rect locked (at 0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND"))
    (pad "3" smd rect locked (at -0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 66 "DIN"))
    (pad "4" smd rect locked (at -0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "VDD"))
  )
  (footprint "SMD_Packages:WS2812B_2020" (layer "F.Cu")
    (tedit 5CB97F3B)
    (at 99.06 92.1004)
    (solder_mask_margin 0.0762)
    (attr through_hole)
    (fp_text reference "D2" (at 0 -1.397) (layer "F.SilkS"))
    (fp_text value "WS2812B_2020" (at 0 1.4605) (layer "F.Fab") hide)
    (pad "1" smd rect locked (at 0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 4 "Net-(D2-Pad1)"))
    (pad "2" smd rect locked (at 0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND"))
    (pad "3" smd rect locked (at -0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 3 "Net-(D1-Pad1)"))
    (pad "4" smd rect locked (at -0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "VDD"))
  )
  (footprint "SMD_Packages:WS2812B_2020" (layer "F.Cu")
    (tedit 5CB97F3B)
    (at 102.108 92.1004)
    (solder_mask_margin 0.0762)
    (attr through_hole)
    (fp_text reference "D3" (at 0 -1.397) (layer "F.SilkS"))
    (fp_text value "WS2812B_2020" (at 0 1.4605) (layer "F.Fab") hide)
    (pad "1" smd rect locked (at 0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 5 "Net-(D3-Pad1)"))
    (pad "2" smd rect locked (at 0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND"))
    (pad "3" smd rect locked (at -0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 4 "Net-(D2-Pad1)"))
    (pad "4" smd rect locked (at -0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "VDD"))
  )
  (footprint "SMD_Packages:WS2812B_2020" (layer "F.Cu")
    (tedit 5CB9C15A)
    (at 105.156 92.1004)
    (solder_mask_margin 0.0762)
    (attr through_hole)
    (fp_text reference "D4" (at 0 -1.397) (layer "F.SilkS"))
    (fp_text value "WS2812B_2020" (at 0 1.4605) (layer "F.Fab") hide)
    (pad "1" smd rect locked (at 0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 6 "Net-(D4-Pad1)"))
    (pad "2" smd rect locked (at 0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND"))
    (pad "3" smd rect locked (at -0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 5 "Net-(D3-Pad1)"))
    (pad "4" smd rect locked (at -0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "VDD"))
  )
  (footprint "SMD_Packages:WS2812B_2020" (layer "F.Cu")
    (tedit 5CB97F3B)
    (at 108.204 92.1004)
    (solder_mask_margin 0.0762)
    (attr through_hole)
    (fp_text reference "D5" (at 0 -1.397) (layer "F.SilkS"))
    (fp_text value "WS2812B_2020" (at 0 1.4605) (layer "F.Fab") hide)
    (pad "1" smd rect locked (at 0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 7 "Net-(D5-Pad1)"))
    (pad "2" smd rect locked (at 0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND"))
    (pad "3" smd rect locked (at -0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 6 "Net-(D4-Pad1)"))
    (pad "4" smd rect locked (at -0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "VDD"))
  )
  (footprint "SMD_Packages:WS2812B_2020" (layer "F.Cu")
    (tedit 5CB97F3B)
    (at 111.252 92.1004)
    (solder_mask_margin 0.0762)
    (attr through_hole)
    (fp_text reference "D6" (at 0 -1.397) (layer "F.SilkS"))
    (fp_text value "WS2812B_2020" (at 0 1.4605) (layer "F.Fab") hide)
    (pad "1" smd rect locked (at 0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 8 "Net-(D6-Pad1)"))
    (pad "2" smd rect locked (at 0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND"))
    (pad "3" smd rect locked (at -0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 7 "Net-(D5-Pad1)"))
    (pad "4" smd rect locked (at -0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "VDD"))
  )
  (footprint "SMD_Packages:WS2812B_2020" (layer "F.Cu")
    (tedit 5CB97F3B)
    (at 114.3 92.1004)
    (solder_mask_margin 0.0762)
    (attr through_hole)
    (fp_text reference "D7" (at 0 -1.397) (layer "F.SilkS"))
    (fp_text value "WS2812B_2020" (at 0 1.4605) (layer "F.Fab") hide)
    (pad "1" smd rect locked (at 0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 9 "Net-(D7-Pad1)"))
    (pad "2" smd rect locked (at 0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND"))
    (pad "3" smd rect locked (at -0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 8 "Net-(D6-Pad1)"))
    (pad "4" smd rect locked (at -0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "VDD"))
  )
  (footprint "SMD_Packages:WS2812B_2020" (layer "F.Cu")
    (tedit 5CB97F3B)
    (at 117.348 92.1004)
    (solder_mask_margin 0.0762)
    (attr through_hole)
    (fp_text reference "D8" (at 0 -1.397) (layer "F.SilkS"))
    (fp_text value "WS2812B_2020" (at 0 1.4605) (layer "F.Fab") hide)
    (pad "1" smd rect locked (at 0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 10 "Net-(D8-Pad1)"))
    (pad "2" smd rect locked (at 0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND"))
    (pad "3" smd rect locked (at -0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 9 "Net-(D7-Pad1)"))
    (pad "4" smd rect locked (at -0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "VDD"))
  )
  (footprint "SMD_Packages:WS2812B_2020" (layer "F.Cu")
    (tedit 5CB97F3B)
    (at 96.012 95.1484)
    (solder_mask_margin 0.0762)
    (attr through_hole)
    (fp_text reference "D9" (at 0 -1.397) (layer "F.SilkS"))
    (fp_text value "WS2812B_2020" (at 0 1.4605) (layer "F.Fab") hide)
    (pad "1" smd rect locked (at 0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 11 "Net-(D10-Pad3)"))
    (pad "2" smd rect locked (at 0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND"))
    (pad "3" smd rect locked (at -0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 10 "Net-(D8-Pad1)"))
    (pad "4" smd rect locked (at -0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "VDD"))
  )
  (footprint "SMD_Packages:WS2812B_2020" (layer "F.Cu")
    (tedit 5CB97F3B)
    (at 99.06 95.1484)
    (solder_mask_margin 0.0762)
    (attr through_hole)
    (fp_text reference "D10" (at 0 -1.397) (layer "F.SilkS"))
    (fp_text value "WS2812B_2020" (at 0 1.4605) (layer "F.Fab") hide)
    (pad "1" smd rect locked (at 0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 12 "Net-(D10-Pad1)"))
    (pad "2" smd rect locked (at 0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND"))
    (pad "3" smd rect locked (at -0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 11 "Net-(D10-Pad3)"))
    (pad "4" smd rect locked (at -0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "VDD"))
  )
  (footprint "SMD_Packages:WS2812B_2020" (layer "F.Cu")
    (tedit 5CB97F3B)
    (at 102.108 95.1484)
    (solder_mask_margin 0.0762)
    (attr through_hole)
    (fp_text reference "D11" (at 0 -1.397) (layer "F.SilkS"))
    (fp_text value "WS2812B_2020" (at 0 1.4605) (layer "F.Fab") hide)
    (pad "1" smd rect locked (at 0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 13 "Net-(D11-Pad1)"))
    (pad "2" smd rect locked (at 0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND"))
    (pad "3" smd rect locked (at -0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 12 "Net-(D10-Pad1)"))
    (pad "4" smd rect locked (at -0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "VDD"))
  )
  (footprint "SMD_Packages:WS2812B_2020" (layer "F.Cu")
    (tedit 5CB97F3B)
    (at 105.156 95.1484)
    (solder_mask_margin 0.0762)
    (attr through_hole)
    (fp_text reference "D12" (at 0 -1.397) (layer "F.SilkS"))
    (fp_text value "WS2812B_2020" (at 0 1.4605) (layer "F.Fab") hide)
    (pad "1" smd rect locked (at 0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 14 "Net-(D12-Pad1)"))
    (pad "2" smd rect locked (at 0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND"))
    (pad "3" smd rect locked (at -0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 13 "Net-(D11-Pad1)"))
    (pad "4" smd rect locked (at -0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "VDD"))
  )
  (footprint "SMD_Packages:WS2812B_2020" (layer "F.Cu")
    (tedit 5CB97F3B)
    (at 108.204 95.1484)
    (solder_mask_margin 0.0762)
    (attr through_hole)
    (fp_text reference "D13" (at 0 -1.397) (layer "F.SilkS"))
    (fp_text value "WS2812B_2020" (at 0 1.4605) (layer "F.Fab") hide)
    (pad "1" smd rect locked (at 0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 15 "Net-(D13-Pad1)"))
    (pad "2" smd rect locked (at 0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND"))
    (pad "3" smd rect locked (at -0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 14 "Net-(D12-Pad1)"))
    (pad "4" smd rect locked (at -0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "VDD"))
  )
  (footprint "SMD_Packages:WS2812B_2020" (layer "F.Cu")
    (tedit 5CB97F3B)
    (at 111.252 95.1484)
    (solder_mask_margin 0.0762)
    (attr through_hole)
    (fp_text reference "D14" (at 0 -1.397) (layer "F.SilkS"))
    (fp_text value "WS2812B_2020" (at 0 1.4605) (layer "F.Fab") hide)
    (pad "1" smd rect locked (at 0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 16 "Net-(D14-Pad1)"))
    (pad "2" smd rect locked (at 0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND"))
    (pad "3" smd rect locked (at -0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 15 "Net-(D13-Pad1)"))
    (pad "4" smd rect locked (at -0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "VDD"))
  )
  (footprint "SMD_Packages:WS2812B_2020" (layer "F.Cu")
    (tedit 5CB97F3B)
    (at 114.3 95.1484)
    (solder_mask_margin 0.0762)
    (attr through_hole)
    (fp_text reference "D15" (at 0 -1.397) (layer "F.SilkS"))
    (fp_text value "WS2812B_2020" (at 0 1.4605) (layer "F.Fab") hide)
    (pad "1" smd rect locked (at 0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 17 "Net-(D15-Pad1)"))
    (pad "2" smd rect locked (at 0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND"))
    (pad "3" smd rect locked (at -0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 16 "Net-(D14-Pad1)"))
    (pad "4" smd rect locked (at -0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "VDD"))
  )
  (footprint "SMD_Packages:WS2812B_2020" (layer "F.Cu")
    (tedit 5CB97F3B)
    (at 117.348 95.1484)
    (solder_mask_margin 0.0762)
    (attr through_hole)
    (fp_text reference "D16" (at 0 -1.397) (layer "F.SilkS"))
    (fp_text value "WS2812B_2020" (at 0 1.4605) (layer "F.Fab") hide)
    (pad "1" smd rect locked (at 0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 18 "Net-(D16-Pad1)"))
    (pad "2" smd rect locked (at 0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND"))
    (pad "3" smd rect locked (at -0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 17 "Net-(D15-Pad1)"))
    (pad "4" smd rect locked (at -0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "VDD"))
  )
  (footprint "SMD_Packages:WS2812B_2020" (layer "F.Cu")
    (tedit 5CB97F3B)
    (at 96.012 98.1964)
    (solder_mask_margin 0.0762)
    (attr through_hole)
    (fp_text reference "D17" (at 0 -1.397) (layer "F.SilkS"))
    (fp_text value "WS2812B_2020" (at 0 1.4605) (layer "F.Fab") hide)
    (pad "1" smd rect locked (at 0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 19 "Net-(D17-Pad1)"))
    (pad "2" smd rect locked (at 0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND"))
    (pad "3" smd rect locked (at -0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 18 "Net-(D16-Pad1)"))
    (pad "4" smd rect locked (at -0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "VDD"))
  )
  (footprint "SMD_Packages:WS2812B_2020" (layer "F.Cu")
    (tedit 5CB97F3B)
    (at 99.06 98.1964)
    (solder_mask_margin 0.0762)
    (attr through_hole)
    (fp_text reference "D18" (at 0 -1.397) (layer "F.SilkS"))
    (fp_text value "WS2812B_2020" (at 0 1.4605) (layer "F.Fab") hide)
    (pad "1" smd rect locked (at 0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 20 "Net-(D18-Pad1)"))
    (pad "2" smd rect locked (at 0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND"))
    (pad "3" smd rect locked (at -0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 19 "Net-(D17-Pad1)"))
    (pad "4" smd rect locked (at -0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "VDD"))
  )
  (footprint "SMD_Packages:WS2812B_2020" (layer "F.Cu")
    (tedit 5CB97F3B)
    (at 102.108 98.1964)
    (solder_mask_margin 0.0762)
    (attr through_hole)
    (fp_text reference "D19" (at 0 -1.397) (layer "F.SilkS"))
    (fp_text value "WS2812B_2020" (at 0 1.4605) (layer "F.Fab") hide)
    (pad "1" smd rect locked (at 0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 21 "Net-(D19-Pad1)"))
    (pad "2" smd rect locked (at 0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND"))
    (pad "3" smd rect locked (at -0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 20 "Net-(D18-Pad1)"))
    (pad "4" smd rect locked (at -0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "VDD"))
  )
  (footprint "SMD_Packages:WS2812B_2020" (layer "F.Cu")
    (tedit 5CB97F3B)
    (at 105.156 98.1964)
    (solder_mask_margin 0.0762)
    (attr through_hole)
    (fp_text reference "D20" (at 0 -1.397) (layer "F.SilkS"))
    (fp_text value "WS2812B_2020" (at 0 1.4605) (layer "F.Fab") hide)
    (pad "1" smd rect locked (at 0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 22 "Net-(D20-Pad1)"))
    (pad "2" smd rect locked (at 0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND"))
    (pad "3" smd rect locked (at -0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 21 "Net-(D19-Pad1)"))
    (pad "4" smd rect locked (at -0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "VDD"))
  )
  (footprint "SMD_Packages:WS2812B_2020" (layer "F.Cu")
    (tedit 5CB97F3B)
    (at 108.204 98.1964)
    (solder_mask_margin 0.0762)
    (attr through_hole)
    (fp_text reference "D21" (at 0 -1.397) (layer "F.SilkS"))
    (fp_text value "WS2812B_2020" (at 0 1.4605) (layer "F.Fab") hide)
    (pad "1" smd rect locked (at 0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 23 "Net-(D21-Pad1)"))
    (pad "2" smd rect locked (at 0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND"))
    (pad "3" smd rect locked (at -0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 22 "Net-(D20-Pad1)"))
    (pad "4" smd rect locked (at -0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "VDD"))
  )
  (footprint "SMD_Packages:WS2812B_2020" (layer "F.Cu")
    (tedit 5CB97F3B)
    (at 111.252 98.1964)
    (solder_mask_margin 0.0762)
    (attr through_hole)
    (fp_text reference "D22" (at 0 -1.397) (layer "F.SilkS"))
    (fp_text value "WS2812B_2020" (at 0 1.4605) (layer "F.Fab") hide)
    (pad "1" smd rect locked (at 0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 24 "Net-(D22-Pad1)"))
    (pad "2" smd rect locked (at 0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND"))
    (pad "3" smd rect locked (at -0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 23 "Net-(D21-Pad1)"))
    (pad "4" smd rect locked (at -0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "VDD"))
  )
  (footprint "SMD_Packages:WS2812B_2020" (layer "F.Cu")
    (tedit 5CB97F3B)
    (at 114.3 98.1964)
    (solder_mask_margin 0.0762)
    (attr through_hole)
    (fp_text reference "D23" (at 0 -1.397) (layer "F.SilkS"))
    (fp_text value "WS2812B_2020" (at 0 1.4605) (layer "F.Fab") hide)
    (pad "1" smd rect locked (at 0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 25 "Net-(D23-Pad1)"))
    (pad "2" smd rect locked (at 0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND"))
    (pad "3" smd rect locked (at -0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 24 "Net-(D22-Pad1)"))
    (pad "4" smd rect locked (at -0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "VDD"))
  )
  (footprint "SMD_Packages:WS2812B_2020" (layer "F.Cu")
    (tedit 5CB97F3B)
    (at 117.348 98.1964)
    (solder_mask_margin 0.0762)
    (attr through_hole)
    (fp_text reference "D24" (at 0 -1.397) (layer "F.SilkS"))
    (fp_text value "WS2812B_2020" (at 0 1.4605) (layer "F.Fab") hide)
    (pad "1" smd rect locked (at 0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 26 "Net-(D24-Pad1)"))
    (pad "2" smd rect locked (at 0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND"))
    (pad "3" smd rect locked (at -0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 25 "Net-(D23-Pad1)"))
    (pad "4" smd rect locked (at -0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "VDD"))
  )
  (footprint "SMD_Packages:WS2812B_2020" (layer "F.Cu")
    (tedit 5CB97F3B)
    (at 96.012 101.2444)
    (solder_mask_margin 0.0762)
    (attr through_hole)
    (fp_text reference "D25" (at 0 -1.397) (layer "F.SilkS"))
    (fp_text value "WS2812B_2020" (at 0 1.4605) (layer "F.Fab") hide)
    (pad "1" smd rect locked (at 0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 27 "Net-(D25-Pad1)"))
    (pad "2" smd rect locked (at 0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND"))
    (pad "3" smd rect locked (at -0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 26 "Net-(D24-Pad1)"))
    (pad "4" smd rect locked (at -0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "VDD"))
  )
  (footprint "SMD_Packages:WS2812B_2020" (layer "F.Cu")
    (tedit 5CB97F3B)
    (at 99.06 101.2444)
    (solder_mask_margin 0.0762)
    (attr through_hole)
    (fp_text reference "D26" (at 0 -1.397) (layer "F.SilkS"))
    (fp_text value "WS2812B_2020" (at 0 1.4605) (layer "F.Fab") hide)
    (pad "1" smd rect locked (at 0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 28 "Net-(D26-Pad1)"))
    (pad "2" smd rect locked (at 0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND"))
    (pad "3" smd rect locked (at -0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 27 "Net-(D25-Pad1)"))
    (pad "4" smd rect locked (at -0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "VDD"))
  )
  (footprint "SMD_Packages:WS2812B_2020" (layer "F.Cu")
    (tedit 5CB97F3B)
    (at 102.108 101.2444)
    (solder_mask_margin 0.0762)
    (attr through_hole)
    (fp_text reference "D27" (at 0 -1.397) (layer "F.SilkS"))
    (fp_text value "WS2812B_2020" (at 0 1.4605) (layer "F.Fab") hide)
    (pad "1" smd rect locked (at 0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 29 "Net-(D27-Pad1)"))
    (pad "2" smd rect locked (at 0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND"))
    (pad "3" smd rect locked (at -0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 28 "Net-(D26-Pad1)"))
    (pad "4" smd rect locked (at -0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "VDD"))
  )
  (footprint "SMD_Packages:WS2812B_2020" (layer "F.Cu")
    (tedit 5CB97F3B)
    (at 105.156 101.2444)
    (solder_mask_margin 0.0762)
    (attr through_hole)
    (fp_text reference "D28" (at 0 -1.397) (layer "F.SilkS"))
    (fp_text value "WS2812B_2020" (at 0 1.4605) (layer "F.Fab") hide)
    (pad "1" smd rect locked (at 0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 30 "Net-(D28-Pad1)"))
    (pad "2" smd rect locked (at 0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND"))
    (pad "3" smd rect locked (at -0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 29 "Net-(D27-Pad1)"))
    (pad "4" smd rect locked (at -0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "VDD"))
  )
  (footprint "SMD_Packages:WS2812B_2020" (layer "F.Cu")
    (tedit 5CB97F3B)
    (at 108.204 101.2444)
    (solder_mask_margin 0.0762)
    (attr through_hole)
    (fp_text reference "D29" (at 0 -1.397) (layer "F.SilkS"))
    (fp_text value "WS2812B_2020" (at 0 1.4605) (layer "F.Fab") hide)
    (pad "1" smd rect locked (at 0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 31 "Net-(D29-Pad1)"))
    (pad "2" smd rect locked (at 0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND"))
    (pad "3" smd rect locked (at -0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 30 "Net-(D28-Pad1)"))
    (pad "4" smd rect locked (at -0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "VDD"))
  )
  (footprint "SMD_Packages:WS2812B_2020" (layer "F.Cu")
    (tedit 5CB97F3B)
    (at 111.252 101.2444)
    (solder_mask_margin 0.0762)
    (attr through_hole)
    (fp_text reference "D30" (at 0 -1.397) (layer "F.SilkS"))
    (fp_text value "WS2812B_2020" (at 0 1.4605) (layer "F.Fab") hide)
    (pad "1" smd rect locked (at 0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 32 "Net-(D30-Pad1)"))
    (pad "2" smd rect locked (at 0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND"))
    (pad "3" smd rect locked (at -0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 31 "Net-(D29-Pad1)"))
    (pad "4" smd rect locked (at -0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "VDD"))
  )
  (footprint "SMD_Packages:WS2812B_2020" (layer "F.Cu")
    (tedit 5CB97F3B)
    (at 114.3 101.2444)
    (solder_mask_margin 0.0762)
    (attr through_hole)
    (fp_text reference "D31" (at 0 -1.397) (layer "F.SilkS"))
    (fp_text value "WS2812B_2020" (at 0 1.4605) (layer "F.Fab") hide)
    (pad "1" smd rect locked (at 0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 33 "Net-(D31-Pad1)"))
    (pad "2" smd rect locked (at 0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND"))
    (pad "3" smd rect locked (at -0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 32 "Net-(D30-Pad1)"))
    (pad "4" smd rect locked (at -0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "VDD"))
  )
  (footprint "SMD_Packages:WS2812B_2020" (layer "F.Cu")
    (tedit 5CB97F3B)
    (at 117.348 101.2444)
    (solder_mask_margin 0.0762)
    (attr through_hole)
    (fp_text reference "D32" (at 0 -1.397) (layer "F.SilkS"))
    (fp_text value "WS2812B_2020" (at 0 1.4605) (layer "F.Fab") hide)
    (pad "1" smd rect locked (at 0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 34 "Net-(D32-Pad1)"))
    (pad "2" smd rect locked (at 0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND"))
    (pad "3" smd rect locked (at -0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 33 "Net-(D31-Pad1)"))
    (pad "4" smd rect locked (at -0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "VDD"))
  )
  (footprint "SMD_Packages:WS2812B_2020" (layer "F.Cu")
    (tedit 5CB97F3B)
    (at 96.012 104.2924)
    (solder_mask_margin 0.0762)
    (attr through_hole)
    (fp_text reference "D33" (at 0 -1.397) (layer "F.SilkS"))
    (fp_text value "WS2812B_2020" (at 0 1.4605) (layer "F.Fab") hide)
    (pad "1" smd rect locked (at 0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 35 "Net-(D33-Pad1)"))
    (pad "2" smd rect locked (at 0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND"))
    (pad "3" smd rect locked (at -0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 34 "Net-(D32-Pad1)"))
    (pad "4" smd rect locked (at -0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "VDD"))
  )
  (footprint "SMD_Packages:WS2812B_2020" (layer "F.Cu")
    (tedit 5CB97F3B)
    (at 99.06 104.2924)
    (solder_mask_margin 0.0762)
    (attr through_hole)
    (fp_text reference "D34" (at 0 -1.397) (layer "F.SilkS"))
    (fp_text value "WS2812B_2020" (at 0 1.4605) (layer "F.Fab") hide)
    (pad "1" smd rect locked (at 0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 36 "Net-(D34-Pad1)"))
    (pad "2" smd rect locked (at 0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND"))
    (pad "3" smd rect locked (at -0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 35 "Net-(D33-Pad1)"))
    (pad "4" smd rect locked (at -0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "VDD"))
  )
  (footprint "SMD_Packages:WS2812B_2020" (layer "F.Cu")
    (tedit 5CB97F3B)
    (at 102.108 104.2924)
    (solder_mask_margin 0.0762)
    (attr through_hole)
    (fp_text reference "D35" (at 0 -1.397) (layer "F.SilkS"))
    (fp_text value "WS2812B_2020" (at 0 1.4605) (layer "F.Fab") hide)
    (pad "1" smd rect locked (at 0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 37 "Net-(D35-Pad1)"))
    (pad "2" smd rect locked (at 0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND"))
    (pad "3" smd rect locked (at -0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 36 "Net-(D34-Pad1)"))
    (pad "4" smd rect locked (at -0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "VDD"))
  )
  (footprint "SMD_Packages:WS2812B_2020" (layer "F.Cu")
    (tedit 5CB97F3B)
    (at 105.156 104.2924)
    (solder_mask_margin 0.0762)
    (attr through_hole)
    (fp_text reference "D36" (at 0 -1.397) (layer "F.SilkS"))
    (fp_text value "WS2812B_2020" (at 0 1.4605) (layer "F.Fab") hide)
    (pad "1" smd rect locked (at 0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 38 "Net-(D36-Pad1)"))
    (pad "2" smd rect locked (at 0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND"))
    (pad "3" smd rect locked (at -0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 37 "Net-(D35-Pad1)"))
    (pad "4" smd rect locked (at -0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "VDD"))
  )
  (footprint "SMD_Packages:WS2812B_2020" (layer "F.Cu")
    (tedit 5CB97F3B)
    (at 108.204 104.2924)
    (solder_mask_margin 0.0762)
    (attr through_hole)
    (fp_text reference "D37" (at 0 -1.397) (layer "F.SilkS"))
    (fp_text value "WS2812B_2020" (at 0 1.4605) (layer "F.Fab") hide)
    (pad "1" smd rect locked (at 0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 39 "Net-(D37-Pad1)"))
    (pad "2" smd rect locked (at 0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND"))
    (pad "3" smd rect locked (at -0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 38 "Net-(D36-Pad1)"))
    (pad "4" smd rect locked (at -0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "VDD"))
  )
  (footprint "SMD_Packages:WS2812B_2020" (layer "F.Cu")
    (tedit 5CB97F3B)
    (at 111.252 104.2924)
    (solder_mask_margin 0.0762)
    (attr through_hole)
    (fp_text reference "D38" (at 0 -1.397) (layer "F.SilkS"))
    (fp_text value "WS2812B_2020" (at 0 1.4605) (layer "F.Fab") hide)
    (pad "1" smd rect locked (at 0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 40 "Net-(D38-Pad1)"))
    (pad "2" smd rect locked (at 0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND"))
    (pad "3" smd rect locked (at -0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 39 "Net-(D37-Pad1)"))
    (pad "4" smd rect locked (at -0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "VDD"))
  )
  (footprint "SMD_Packages:WS2812B_2020" (layer "F.Cu")
    (tedit 5CB97F3B)
    (at 114.3 104.2924)
    (solder_mask_margin 0.0762)
    (attr through_hole)
    (fp_text reference "D39" (at 0 -1.397) (layer "F.SilkS"))
    (fp_text value "WS2812B_2020" (at 0 1.4605) (layer "F.Fab") hide)
    (pad "1" smd rect locked (at 0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 41 "Net-(D39-Pad1)"))
    (pad "2" smd rect locked (at 0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND"))
    (pad "3" smd rect locked (at -0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 40 "Net-(D38-Pad1)"))
    (pad "4" smd rect locked (at -0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "VDD"))
  )
  (footprint "SMD_Packages:WS2812B_2020" (layer "F.Cu")
    (tedit 5CB97F3B)
    (at 117.348 104.2924)
    (solder_mask_margin 0.0762)
    (attr through_hole)
    (fp_text reference "D40" (at 0 -1.397) (layer "F.SilkS"))
    (fp_text value "WS2812B_2020" (at 0 1.4605) (layer "F.Fab") hide)
    (pad "1" smd rect locked (at 0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 42 "Net-(D40-Pad1)"))
    (pad "2" smd rect locked (at 0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND"))
    (pad "3" smd rect locked (at -0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 41 "Net-(D39-Pad1)"))
    (pad "4" smd rect locked (at -0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "VDD"))
  )
  (footprint "SMD_Packages:WS2812B_2020" (layer "F.Cu")
    (tedit 5CB97F3B)
    (at 96.012 107.3404)
    (solder_mask_margin 0.0762)
    (attr through_hole)
    (fp_text reference "D41" (at 0 -1.397) (layer "F.SilkS"))
    (fp_text value "WS2812B_2020" (at 0 1.4605) (layer "F.Fab") hide)
    (pad "1" smd rect locked (at 0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 43 "Net-(D41-Pad1)"))
    (pad "2" smd rect locked (at 0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND"))
    (pad "3" smd rect locked (at -0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 42 "Net-(D40-Pad1)"))
    (pad "4" smd rect locked (at -0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "VDD"))
  )
  (footprint "SMD_Packages:WS2812B_2020" (layer "F.Cu")
    (tedit 5CB97F3B)
    (at 99.06 107.3404)
    (solder_mask_margin 0.0762)
    (attr through_hole)
    (fp_text reference "D42" (at 0 -1.397) (layer "F.SilkS"))
    (fp_text value "WS2812B_2020" (at 0 1.4605) (layer "F.Fab") hide)
    (pad "1" smd rect locked (at 0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 44 "Net-(D42-Pad1)"))
    (pad "2" smd rect locked (at 0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND"))
    (pad "3" smd rect locked (at -0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 43 "Net-(D41-Pad1)"))
    (pad "4" smd rect locked (at -0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "VDD"))
  )
  (footprint "SMD_Packages:WS2812B_2020" (layer "F.Cu")
    (tedit 5CB97F3B)
    (at 102.108 107.3404)
    (solder_mask_margin 0.0762)
    (attr through_hole)
    (fp_text reference "D43" (at 0 -1.397) (layer "F.SilkS"))
    (fp_text value "WS2812B_2020" (at 0 1.4605) (layer "F.Fab") hide)
    (pad "1" smd rect locked (at 0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 45 "Net-(D43-Pad1)"))
    (pad "2" smd rect locked (at 0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND"))
    (pad "3" smd rect locked (at -0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 44 "Net-(D42-Pad1)"))
    (pad "4" smd rect locked (at -0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "VDD"))
  )
  (footprint "SMD_Packages:WS2812B_2020" (layer "F.Cu")
    (tedit 5CB97F3B)
    (at 105.156 107.3404)
    (solder_mask_margin 0.0762)
    (attr through_hole)
    (fp_text reference "D44" (at 0 -1.397) (layer "F.SilkS"))
    (fp_text value "WS2812B_2020" (at 0 1.4605) (layer "F.Fab") hide)
    (pad "1" smd rect locked (at 0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 46 "Net-(D44-Pad1)"))
    (pad "2" smd rect locked (at 0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND"))
    (pad "3" smd rect locked (at -0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 45 "Net-(D43-Pad1)"))
    (pad "4" smd rect locked (at -0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "VDD"))
  )
  (footprint "SMD_Packages:WS2812B_2020" (layer "F.Cu")
    (tedit 5CB97F3B)
    (at 108.204 107.3404)
    (solder_mask_margin 0.0762)
    (attr through_hole)
    (fp_text reference "D45" (at 0 -1.397) (layer "F.SilkS"))
    (fp_text value "WS2812B_2020" (at 0 1.4605) (layer "F.Fab") hide)
    (pad "1" smd rect locked (at 0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 47 "Net-(D45-Pad1)"))
    (pad "2" smd rect locked (at 0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND"))
    (pad "3" smd rect locked (at -0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 46 "Net-(D44-Pad1)"))
    (pad "4" smd rect locked (at -0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "VDD"))
  )
  (footprint "SMD_Packages:WS2812B_2020" (layer "F.Cu")
    (tedit 5CB97F3B)
    (at 111.252 107.3404)
    (solder_mask_margin 0.0762)
    (attr through_hole)
    (fp_text reference "D46" (at 0 -1.397) (layer "F.SilkS"))
    (fp_text value "WS2812B_2020" (at 0 1.4605) (layer "F.Fab") hide)
    (pad "1" smd rect locked (at 0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 48 "Net-(D46-Pad1)"))
    (pad "2" smd rect locked (at 0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND"))
    (pad "3" smd rect locked (at -0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 47 "Net-(D45-Pad1)"))
    (pad "4" smd rect locked (at -0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "VDD"))
  )
  (footprint "SMD_Packages:WS2812B_2020" (layer "F.Cu")
    (tedit 5CB97F3B)
    (at 114.3 107.3404)
    (solder_mask_margin 0.0762)
    (attr through_hole)
    (fp_text reference "D47" (at 0 -1.397) (layer "F.SilkS"))
    (fp_text value "WS2812B_2020" (at 0 1.4605) (layer "F.Fab") hide)
    (pad "1" smd rect locked (at 0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 49 "Net-(D47-Pad1)"))
    (pad "2" smd rect locked (at 0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND"))
    (pad "3" smd rect locked (at -0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 48 "Net-(D46-Pad1)"))
    (pad "4" smd rect locked (at -0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "VDD"))
  )
  (footprint "SMD_Packages:WS2812B_2020" (layer "F.Cu")
    (tedit 5CB97F3B)
    (at 117.348 107.3404)
    (solder_mask_margin 0.0762)
    (attr through_hole)
    (fp_text reference "D48" (at 0 -1.397) (layer "F.SilkS"))
    (fp_text value "WS2812B_2020" (at 0 1.4605) (layer "F.Fab") hide)
    (pad "1" smd rect locked (at 0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 50 "Net-(D48-Pad1)"))
    (pad "2" smd rect locked (at 0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND"))
    (pad "3" smd rect locked (at -0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 49 "Net-(D47-Pad1)"))
    (pad "4" smd rect locked (at -0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "VDD"))
  )
  (footprint "SMD_Packages:WS2812B_2020" (layer "F.Cu")
    (tedit 5CB97F3B)
    (at 96.012 110.3884)
    (solder_mask_margin 0.0762)
    (attr through_hole)
    (fp_text reference "D49" (at 0 -1.397) (layer "F.SilkS"))
    (fp_text value "WS2812B_2020" (at 0 1.4605) (layer "F.Fab") hide)
    (pad "1" smd rect locked (at 0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 51 "Net-(D49-Pad1)"))
    (pad "2" smd rect locked (at 0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND"))
    (pad "3" smd rect locked (at -0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 50 "Net-(D48-Pad1)"))
    (pad "4" smd rect locked (at -0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "VDD"))
  )
  (footprint "SMD_Packages:WS2812B_2020" (layer "F.Cu")
    (tedit 5CB97F3B)
    (at 99.06 110.3884)
    (solder_mask_margin 0.0762)
    (attr through_hole)
    (fp_text reference "D50" (at 0 -1.397) (layer "F.SilkS"))
    (fp_text value "WS2812B_2020" (at 0 1.4605) (layer "F.Fab") hide)
    (pad "1" smd rect locked (at 0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 52 "Net-(D50-Pad1)"))
    (pad "2" smd rect locked (at 0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND"))
    (pad "3" smd rect locked (at -0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 51 "Net-(D49-Pad1)"))
    (pad "4" smd rect locked (at -0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "VDD"))
  )
  (footprint "SMD_Packages:WS2812B_2020" (layer "F.Cu")
    (tedit 5CB97F3B)
    (at 102.108 110.3884)
    (solder_mask_margin 0.0762)
    (attr through_hole)
    (fp_text reference "D51" (at 0 -1.397) (layer "F.SilkS"))
    (fp_text value "WS2812B_2020" (at 0 1.4605) (layer "F.Fab") hide)
    (pad "1" smd rect locked (at 0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 53 "Net-(D51-Pad1)"))
    (pad "2" smd rect locked (at 0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND"))
    (pad "3" smd rect locked (at -0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 52 "Net-(D50-Pad1)"))
    (pad "4" smd rect locked (at -0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "VDD"))
  )
  (footprint "SMD_Packages:WS2812B_2020" (layer "F.Cu")
    (tedit 5CB97F3B)
    (at 105.156 110.3884)
    (solder_mask_margin 0.0762)
    (attr through_hole)
    (fp_text reference "D52" (at 0 -1.397) (layer "F.SilkS"))
    (fp_text value "WS2812B_2020" (at 0 1.4605) (layer "F.Fab") hide)
    (pad "1" smd rect locked (at 0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 54 "Net-(D52-Pad1)"))
    (pad "2" smd rect locked (at 0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND"))
    (pad "3" smd rect locked (at -0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 53 "Net-(D51-Pad1)"))
    (pad "4" smd rect locked (at -0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "VDD"))
  )
  (footprint "SMD_Packages:WS2812B_2020" (layer "F.Cu")
    (tedit 5CB97F3B)
    (at 108.204 110.3884)
    (solder_mask_margin 0.0762)
    (attr through_hole)
    (fp_text reference "D53" (at 0 -1.397) (layer "F.SilkS"))
    (fp_text value "WS2812B_2020" (at 0 1.4605) (layer "F.Fab") hide)
    (pad "1" smd rect locked (at 0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 55 "Net-(D53-Pad1)"))
    (pad "2" smd rect locked (at 0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND"))
    (pad "3" smd rect locked (at -0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 54 "Net-(D52-Pad1)"))
    (pad "4" smd rect locked (at -0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "VDD"))
  )
  (footprint "SMD_Packages:WS2812B_2020" (layer "F.Cu")
    (tedit 5CB97F3B)
    (at 111.252 110.3884)
    (solder_mask_margin 0.0762)
    (attr through_hole)
    (fp_text reference "D54" (at 0 -1.397) (layer "F.SilkS"))
    (fp_text value "WS2812B_2020" (at 0 1.4605) (layer "F.Fab") hide)
    (pad "1" smd rect locked (at 0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 56 "Net-(D54-Pad1)"))
    (pad "2" smd rect locked (at 0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND"))
    (pad "3" smd rect locked (at -0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 55 "Net-(D53-Pad1)"))
    (pad "4" smd rect locked (at -0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "VDD"))
  )
  (footprint "SMD_Packages:WS2812B_2020" (layer "F.Cu")
    (tedit 5CB97F3B)
    (at 114.3 110.3884)
    (solder_mask_margin 0.0762)
    (attr through_hole)
    (fp_text reference "D55" (at 0 -1.397) (layer "F.SilkS"))
    (fp_text value "WS2812B_2020" (at 0 1.4605) (layer "F.Fab") hide)
    (pad "1" smd rect locked (at 0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 57 "Net-(D55-Pad1)"))
    (pad "2" smd rect locked (at 0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND"))
    (pad "3" smd rect locked (at -0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 56 "Net-(D54-Pad1)"))
    (pad "4" smd rect locked (at -0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "VDD"))
  )
  (footprint "SMD_Packages:WS2812B_2020" (layer "F.Cu")
    (tedit 5CB97F3B)
    (at 117.348 110.3884)
    (solder_mask_margin 0.0762)
    (attr through_hole)
    (fp_text reference "D56" (at 0 -1.397) (layer "F.SilkS"))
    (fp_text value "WS2812B_2020" (at 0 1.4605) (layer "F.Fab") hide)
    (pad "1" smd rect locked (at 0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 58 "Net-(D56-Pad1)"))
    (pad "2" smd rect locked (at 0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND"))
    (pad "3" smd rect locked (at -0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 57 "Net-(D55-Pad1)"))
    (pad "4" smd rect locked (at -0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "VDD"))
  )
  (footprint "SMD_Packages:WS2812B_2020" (layer "F.Cu")
    (tedit 5CB97F3B)
    (at 96.012 113.4364)
    (solder_mask_margin 0.0762)
    (attr through_hole)
    (fp_text reference "D57" (at 0 -1.397) (layer "F.SilkS"))
    (fp_text value "WS2812B_2020" (at 0 1.4605) (layer "F.Fab") hide)
    (pad "1" smd rect locked (at 0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 59 "Net-(D57-Pad1)"))
    (pad "2" smd rect locked (at 0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND"))
    (pad "3" smd rect locked (at -0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 58 "Net-(D56-Pad1)"))
    (pad "4" smd rect locked (at -0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "VDD"))
  )
  (footprint "SMD_Packages:WS2812B_2020" (layer "F.Cu")
    (tedit 5CB97F3B)
    (at 99.06 113.4364)
    (solder_mask_margin 0.0762)
    (attr through_hole)
    (fp_text reference "D58" (at 0 -1.397) (layer "F.SilkS"))
    (fp_text value "WS2812B_2020" (at 0 1.4605) (layer "F.Fab") hide)
    (pad "1" smd rect locked (at 0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 60 "Net-(D58-Pad1)"))
    (pad "2" smd rect locked (at 0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND"))
    (pad "3" smd rect locked (at -0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 59 "Net-(D57-Pad1)"))
    (pad "4" smd rect locked (at -0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "VDD"))
  )
  (footprint "SMD_Packages:WS2812B_2020" (layer "F.Cu")
    (tedit 5CB97F3B)
    (at 102.108 113.4364)
    (solder_mask_margin 0.0762)
    (attr through_hole)
    (fp_text reference "D59" (at 0 -1.397) (layer "F.SilkS"))
    (fp_text value "WS2812B_2020" (at 0 1.4605) (layer "F.Fab") hide)
    (pad "1" smd rect locked (at 0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 61 "Net-(D59-Pad1)"))
    (pad "2" smd rect locked (at 0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND"))
    (pad "3" smd rect locked (at -0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 60 "Net-(D58-Pad1)"))
    (pad "4" smd rect locked (at -0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "VDD"))
  )
  (footprint "SMD_Packages:WS2812B_2020" (layer "F.Cu")
    (tedit 5CB97F3B)
    (at 105.156 113.4364)
    (solder_mask_margin 0.0762)
    (attr through_hole)
    (fp_text reference "D60" (at 0 -1.397) (layer "F.SilkS"))
    (fp_text value "WS2812B_2020" (at 0 1.4605) (layer "F.Fab") hide)
    (pad "1" smd rect locked (at 0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 62 "Net-(D60-Pad1)"))
    (pad "2" smd rect locked (at 0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND"))
    (pad "3" smd rect locked (at -0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 61 "Net-(D59-Pad1)"))
    (pad "4" smd rect locked (at -0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "VDD"))
  )
  (footprint "SMD_Packages:WS2812B_2020" (layer "F.Cu")
    (tedit 5CB97F3B)
    (at 108.204 113.4364)
    (solder_mask_margin 0.0762)
    (attr through_hole)
    (fp_text reference "D61" (at 0 -1.397) (layer "F.SilkS"))
    (fp_text value "WS2812B_2020" (at 0 1.4605) (layer "F.Fab") hide)
    (pad "1" smd rect locked (at 0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 63 "Net-(D61-Pad1)"))
    (pad "2" smd rect locked (at 0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND"))
    (pad "3" smd rect locked (at -0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 62 "Net-(D60-Pad1)"))
    (pad "4" smd rect locked (at -0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "VDD"))
  )
  (footprint "SMD_Packages:WS2812B_2020" (layer "F.Cu")
    (tedit 5CB97F3B)
    (at 111.252 113.4364)
    (solder_mask_margin 0.0762)
    (attr through_hole)
    (fp_text reference "D62" (at 0 -1.397) (layer "F.SilkS"))
    (fp_text value "WS2812B_2020" (at 0 1.4605) (layer "F.Fab") hide)
    (pad "1" smd rect locked (at 0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 64 "Net-(D62-Pad1)"))
    (pad "2" smd rect locked (at 0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND"))
    (pad "3" smd rect locked (at -0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 63 "Net-(D61-Pad1)"))
    (pad "4" smd rect locked (at -0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "VDD"))
  )
  (footprint "SMD_Packages:WS2812B_2020" (layer "F.Cu")
    (tedit 5CB97F3B)
    (at 114.3 113.4364)
    (solder_mask_margin 0.0762)
    (attr through_hole)
    (fp_text reference "D63" (at 0 -1.397) (layer "F.SilkS"))
    (fp_text value "WS2812B_2020" (at 0 1.4605) (layer "F.Fab") hide)
    (pad "1" smd rect locked (at 0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 65 "Net-(D63-Pad1)"))
    (pad "2" smd rect locked (at 0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND"))
    (pad "3" smd rect locked (at -0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 64 "Net-(D62-Pad1)"))
    (pad "4" smd rect locked (at -0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "VDD"))
  )
  (footprint "SMD_Packages:WS2812B_2020" (layer "F.Cu")
    (tedit 5CB97F3B)
    (at 117.348 113.4364)
    (solder_mask_margin 0.0762)
    (attr through_hole)
    (fp_text reference "D64" (at 0 -1.397) (layer "F.SilkS"))
    (fp_text value "WS2812B_2020" (at 0 1.4605) (layer "F.Fab") hide)
    (pad "1" smd rect locked (at 0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 67 "DOUT"))
    (pad "2" smd rect locked (at 0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "GND"))
    (pad "3" smd rect locked (at -0.915 -0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 65 "Net-(D63-Pad1)"))
    (pad "4" smd rect locked (at -0.915 0.55) (size 0.7 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "VDD"))
  )
  (footprint "Capacitors_SMD:C_0603" (layer "B.Cu")
    (tedit 5CB9BAD5)
    (at 100.33 99.7204 -90)
    (descr "Capacitor SMD 0603, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 0603")
    (solder_mask_margin 0.0762)
    (attr smd)
    (fp_text reference "C1" (at 0 -1.4224 -90) (layer "B.SilkS"))
    (fp_text value "1u" (at 0 -1.9 -90) (layer "B.Fab") hide)
    (pad "1" smd rect locked (at -0.75 0 270) (size 0.8 0.75) (layers "B.Cu" "B.Paste" "B.Mask")
      (net 2 "VDD"))
    (pad "2" smd rect locked (at 0.75 0 270) (size 0.8 0.75) (layers "B.Cu" "B.Paste" "B.Mask")
      (net 1 "GND"))
    (model "Capacitors_SMD.3dshapes/C_0603.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "SMD_Packages:smd_pin_2" (layer "B.Cu")
    (tedit 5CB9B948)
    (at 97.536 98.1964 -90)
    (solder_mask_margin 0.0762)
    (attr through_hole)
    (fp_text reference "J1" (at 1.524 0) (layer "B.SilkS"))
    (fp_text value "Power" (at 1.524 0 180) (layer "B.Fab") hide)
    (pad "1" smd oval locked (at 0 0 270) (size 1.778 2.54) (layers "B.Cu" "B.Paste" "B.Mask")
      (net 2 "VDD"))
    (pad "2" smd oval locked (at 3.048 0 270) (size 1.778 2.54) (layers "B.Cu" "B.Paste" "B.Mask")
      (net 1 "GND"))
  )
  (footprint "SMD_Packages:smd_pin_2" (layer "B.Cu")
    (tedit 5CB9B93A)
    (at 97.536 92.1004 -90)
    (solder_mask_margin 0.0762)
    (attr through_hole)
    (fp_text reference "J2" (at 1.524 0) (layer "B.SilkS"))
    (fp_text value "Data" (at 1.524 0 180) (layer "B.Fab") hide)
    (pad "1" smd oval locked (at 0 0 270) (size 1.778 2.54) (layers "B.Cu" "B.Paste" "B.Mask")
      (net 66 "DIN"))
    (pad "2" smd oval locked (at 3.048 0 270) (size 1.778 2.54) (layers "B.Cu" "B.Paste" "B.Mask")
      (net 67 "DOUT"))
  )
  (gr_line (start 93.98 115.4684) (end 93.98 90.0684) (layer "Edge.Cuts") (width 0.15))
  (gr_line (start 119.38 115.4684) (end 93.98 115.4684) (layer "Edge.Cuts") (width 0.15))
  (gr_line (start 93.98 90.0684) (end 119.38 90.0684) (layer "Edge.Cuts") (width 0.15))
  (gr_line (start 119.38 90.0684) (end 119.38 115.4684) (layer "Edge.Cuts") (width 0.15))
  (gr_text "VDD: 3.7 - 5.3V" (at 109.728 96.6724) (layer "B.SilkS"))
  (gr_text "64 x WS2812-2020" (at 106.68 108.8644) (layer "B.SilkS"))
  (gr_text "8 x 8 RGB LED Matrix" (at 106.68 105.8164) (layer "B.SilkS"))
  (gr_text "DI" (at 95.1484 92.1004 90) (layer "B.SilkS"))
  (gr_text "GND" (at 95.1484 101.2444 90) (layer "B.SilkS"))
  (gr_text "DO" (at 95.1484 95.1484 90) (layer "B.SilkS"))
  (gr_text "https://maleetronic.com" (at 106.68 111.9124) (layer "B.SilkS"))
  (gr_text "CERN OHL v1.2" (at 106.68 114.8588) (layer "B.SilkS"))
  (gr_text "VDD" (at 95.1484 98.1964 90) (layer "B.SilkS"))
  (dimension (type aligned) (layer "Dwgs.User")
    (pts (xy 119.38 90.0684) (xy 93.98 90.0684))
    (height 2.2352)
    (gr_text "25.4000 mm" (at 106.68 86.0332) (layer "Dwgs.User"))
    (format (units 2) (units_format 1) (precision 4))
    (style (thickness 0.3) (arrow_length 1.27) (text_position_mode 0) (extension_height 0.58642) (extension_offset 0) keep_text_aligned)
  )
  (zone (net 1) (net_name "GND") (layer "In1.Cu") (hatch edge 0.508)
    (connect_pads yes (clearance 0.0762))
    (min_thickness 0.127)
    (fill yes (thermal_gap 0.127) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 119.2784 115.3668)
        (xy 94.0816 115.3668)
        (xy 94.0816 90.17)
        (xy 119.2784 90.17)
      )
    )
  )
  (zone (net 2) (net_name "VDD") (layer "In2.Cu") (hatch edge 0.508)
    (connect_pads yes (clearance 0.0762))
    (min_thickness 0.127)
    (fill yes (thermal_gap 0.127) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 119.2784 115.3668)
        (xy 94.0816 115.3668)
        (xy 94.0816 90.17)
        (xy 119.2784 90.17)
      )
    )
  )
  (zone (net 1) (net_name "GND") (layer "B.Cu") (hatch edge 0.508)
    (connect_pads yes (clearance 0.0762))
    (min_thickness 0.127)
    (fill yes (thermal_gap 0.127) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 119.2784 115.3668)
        (xy 94.0816 115.3668)
        (xy 94.0816 90.17)
        (xy 119.2784 90.17)
      )
    )
  )
)
