(kicad_pcb (version 20211014) (generator pcbnew)
  (general
    (thickness 1.6)
  )
  (paper "A4")
  (layers
    (0 "F.Cu" signal)
    (31 "B.Cu" signal)
    (32 "B.Adhes" user "B.Adhesive")
    (33 "F.Adhes" user "F.Adhesive")
    (34 "B.Paste" user)
    (35 "F.Paste" user)
    (36 "B.SilkS" user "B.Silkscreen")
    (37 "F.SilkS" user "F.Silkscreen")
    (38 "B.Mask" user)
    (39 "F.Mask" user)
    (40 "Dwgs.User" user "User.Drawings")
    (41 "Cmts.User" user "User.Comments")
    (42 "Eco1.User" user "User.Eco1")
    (43 "Eco2.User" user "User.Eco2")
    (44 "Edge.Cuts" user)
    (45 "Margin" user)
    (46 "B.CrtYd" user "B.Courtyard")
    (47 "F.CrtYd" user "F.Courtyard")
    (48 "B.Fab" user)
    (49 "F.Fab" user)
    (50 "User.1" user)
    (51 "User.2" user)
    (52 "User.3" user)
    (53 "User.4" user)
    (54 "User.5" user)
    (55 "User.6" user)
    (56 "User.7" user)
    (57 "User.8" user)
    (58 "User.9" user)
  )
  (setup
    (stackup
      (layer "F.SilkS" (type "Top Silk Screen"))
      (layer "F.Paste" (type "Top Solder Paste"))
      (layer "F.Mask" (type "Top Solder Mask") (thickness 0.01))
      (layer "F.Cu" (type "copper") (thickness 0.035))
      (layer "dielectric 1" (type "core") (thickness 1.51) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
      (layer "B.Cu" (type "copper") (thickness 0.035))
      (layer "B.Mask" (type "Bottom Solder Mask") (thickness 0.01))
      (layer "B.Paste" (type "Bottom Solder Paste"))
      (layer "B.SilkS" (type "Bottom Silk Screen"))
      (copper_finish "None")
      (dielectric_constraints no)
    )
    (pad_to_mask_clearance 0)
    (grid_origin 175.768 107.1626)
    (pcbplotparams
      (layerselection 0x00010fc_ffffffff)
      (disableapertmacros false)
      (usegerberextensions false)
      (usegerberattributes true)
      (usegerberadvancedattributes true)
      (creategerberjobfile true)
      (svguseinch false)
      (svgprecision 6)
      (excludeedgelayer true)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (dxfpolygonmode true)
      (dxfimperialunits true)
      (dxfusepcbnewfont true)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (sketchpadsonfab false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 1)
      (scaleselection 1)
      (outputdirectory "")
    )
  )
  (net 0 "")
  (net 1 "+5V")
  (net 2 "Net-(J1-Pad2)")
  (net 3 "Net-(J1-Pad3)")
  (net 4 "GND")
  (net 5 "Net-(J2-PadA6)")
  (net 6 "Net-(J2-PadA7)")
  (net 7 "unconnected-(J2-PadA8)")
  (net 8 "Net-(J2-PadA5)")
  (net 9 "unconnected-(J2-PadB8)")
  (net 10 "Net-(S1-Pad4)")
  (net 11 "Net-(S1-Pad6)")
  (net 12 "Net-(R3-Pad2)")
  (net 13 "Net-(R5-Pad2)")
  (footprint "Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEE)
    (at 171.5 112.4875 -90)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (property "Sheetfile" "rpi468-pcb.kicad_sch")
    (property "Sheetname" "")
    (attr smd)
    (fp_text reference "R3" (at 0 1.7 180) (layer "F.SilkS"))
    (fp_text value "100k" (at 0 1.43 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab"))
    (pad "1" smd roundrect (at -0.9125 0 270) (size 0.975 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 1 "+5V") (pintype "passive"))
    (pad "2" smd roundrect (at 0.9125 0 270) (size 0.975 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 12 "Net-(R3-Pad2)") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Connector_JST:JST_SH_BM04B-SRSS-TB_1x04-1MP_P1.00mm_Vertical" (layer "F.Cu")
    (tedit 5B78AD87)
    (at 167.8686 117.4242)
    (descr "JST SH series connector, BM04B-SRSS-TB (http://www.jst-mfg.com/product/pdf/eng/eSH.pdf), generated with kicad-footprint-generator")
    (tags "connector JST SH side entry")
    (property "Sheetfile" "rpi468-pcb.kicad_sch")
    (property "Sheetname" "")
    (attr smd)
    (fp_text reference "J3" (at 0 -3.3) (layer "F.SilkS"))
    (fp_text value "Conn_01x04_Female" (at 0 3.3) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 -0.25) (layer "F.Fab"))
    (pad "1" smd roundrect (at -1.5 1.325) (size 0.6 1.55) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 4 "GND") (pinfunction "Pin_1") (pintype "passive"))
    (pad "2" smd roundrect (at -0.5 1.325) (size 0.6 1.55) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 10 "Net-(S1-Pad4)") (pinfunction "Pin_2") (pintype "passive"))
    (pad "3" smd roundrect (at 0.5 1.325) (size 0.6 1.55) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 11 "Net-(S1-Pad6)") (pinfunction "Pin_3") (pintype "passive"))
    (pad "4" smd roundrect (at 1.5 1.325) (size 0.6 1.55) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 1 "+5V") (pinfunction "Pin_4") (pintype "passive"))
    (pad "MP" smd roundrect (at 2.8 -1.2) (size 1.2 1.8) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333))
    (pad "MP" smd roundrect (at -2.8 -1.2) (size 1.2 1.8) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.208333))
    (model "${KICAD6_3DMODEL_DIR}/Connector_JST.3dshapes/JST_SH_BM04B-SRSS-TB_1x04-1MP_P1.00mm_Vertical.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEE)
    (at 173.8875 111.6)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (property "Sheetfile" "rpi468-pcb.kicad_sch")
    (property "Sheetname" "")
    (attr smd)
    (fp_text reference "R6" (at 0 -1) (layer "F.SilkS"))
    (fp_text value "5.1k" (at 0 1.43) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab"))
    (pad "1" smd roundrect (at -0.9125 0) (size 0.975 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 1 "+5V") (pintype "passive"))
    (pad "2" smd roundrect (at 0.9125 0) (size 0.975 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 13 "Net-(R5-Pad2)") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Resistor_SMD:R_0603_1608Metric_Pad0.98x0.95mm_HandSolder" (layer "F.Cu")
    (tedit 5F68FEEE)
    (at 176.3 112.5 90)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (property "Sheetfile" "rpi468-pcb.kicad_sch")
    (property "Sheetname" "")
    (attr smd)
    (fp_text reference "R5" (at -2.5 0.3 180) (layer "F.SilkS"))
    (fp_text value "50k" (at 0 1.43 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab"))
    (pad "1" smd roundrect (at -0.9125 0 90) (size 0.975 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 12 "Net-(R3-Pad2)") (pintype "passive"))
    (pad "2" smd roundrect (at 0.9125 0 90) (size 0.975 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 13 "Net-(R5-Pad2)") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Package_TO_SOT_SMD:SOT-23-5" (layer "F.Cu")
    (tedit 5F6F9B37)
    (at 173.9 114.4625 90)
    (descr "SOT, 5 Pin (https://www.jedec.org/sites/default/files/docs/Mo-178c.PDF variant AA), generated with kicad-footprint-generator ipc_gullwing_generator.py")
    (tags "SOT TO_SOT_SMD")
    (property "Sheetfile" "rpi468-pcb.kicad_sch")
    (property "Sheetname" "")
    (attr smd)
    (fp_text reference "U1" (at -1.1375 -2.7 180) (layer "F.SilkS"))
    (fp_text value "LM397" (at 0 2.4 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab"))
    (pad "1" smd roundrect (at -1.1375 -0.95 90) (size 1.325 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 8 "Net-(J2-PadA5)") (pinfunction "-") (pintype "input"))
    (pad "2" smd roundrect (at -1.1375 0 90) (size 1.325 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 4 "GND") (pinfunction "V-") (pintype "power_in"))
    (pad "3" smd roundrect (at -1.1375 0.95 90) (size 1.325 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 12 "Net-(R3-Pad2)") (pinfunction "+") (pintype "input"))
    (pad "4" smd roundrect (at 1.1375 0.95 90) (size 1.325 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 13 "Net-(R5-Pad2)") (pintype "open_collector"))
    (pad "5" smd roundrect (at 1.1375 -0.95 90) (size 1.325 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 1 "+5V") (pinfunction "V+") (pintype "power_in"))
    (model "${KICAD6_3DMODEL_DIR}/Package_TO_SOT_SMD.3dshapes/SOT-23-5.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Package_DFN_QFN:DFN-10-1EP_3x3mm_P0.5mm_EP1.75x2.7mm" (layer "F.Cu")
    (tedit 5EA4BEDC)
    (at 165.7 108.4 90)
    (descr "10-Lead Plastic Dual Flat No-Lead Package, 3x3mm Body (see Atmel Appnote 8826)")
    (tags "DFN 0.5")
    (property "Sheetfile" "rpi468-pcb.kicad_sch")
    (property "Sheetname" "")
    (attr smd)
    (fp_text reference "S1" (at 0 2.8 180) (layer "F.SilkS"))
    (fp_text value "ISL54225" (at 0 2.475 90) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab"))
    (pad "" smd rect (at 0.3875 -0.62 90) (size 0.6 1.05) (layers "F.Paste"))
    (pad "" smd rect (at -0.3875 0.62 90) (size 0.6 1.05) (layers "F.Paste"))
    (pad "" smd rect (at -0.3875 -0.62 90) (size 0.6 1.05) (layers "F.Paste"))
    (pad "" smd rect (at 0.3875 0.62 90) (size 0.6 1.05) (layers "F.Paste"))
    (pad "1" smd rect (at -1.45 -1 90) (size 0.85 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 13 "Net-(R5-Pad2)") (pinfunction "SEL") (pintype "input"))
    (pad "2" smd rect (at -1.45 -0.5 90) (size 0.85 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 2 "Net-(J1-Pad2)") (pinfunction "HSD2-") (pintype "output"))
    (pad "3" smd rect (at -1.45 0 90) (size 0.85 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 3 "Net-(J1-Pad3)") (pinfunction "HSD2+") (pintype "output"))
    (pad "4" smd rect (at -1.45 0.5 90) (size 0.85 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 10 "Net-(S1-Pad4)") (pinfunction "D+") (pintype "input"))
    (pad "5" smd rect (at -1.45 1 90) (size 0.85 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 4 "GND") (pinfunction "GND") (pintype "passive"))
    (pad "6" smd rect (at 1.45 1 90) (size 0.85 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 11 "Net-(S1-Pad6)") (pinfunction "D-") (pintype "input"))
    (pad "7" smd rect (at 1.45 0.5 90) (size 0.85 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 6 "Net-(J2-PadA7)") (pinfunction "HSD1-") (pintype "output"))
    (pad "8" smd rect (at 1.45 0 90) (size 0.85 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 5 "Net-(J2-PadA6)") (pinfunction "HSD1+") (pintype "output"))
    (pad "9" smd rect (at 1.45 -0.5 90) (size 0.85 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 4 "GND") (pinfunction "!OE") (pintype "input"))
    (pad "10" smd rect (at 1.45 -1 90) (size 0.85 0.3) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "+5V") (pinfunction "VDD") (pintype "input"))
    (pad "11" smd rect (at 0 0 90) (size 1.75 2.7) (layers "F.Cu" "F.Mask")
      (net 4 "GND") (pinfunction "THERM") (pintype "input"))
    (model "${KICAD6_3DMODEL_DIR}/Package_DFN_QFN.3dshapes/DFN-10-1EP_3x3mm_P0.5mm_EP1.75x2.7mm.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Connector_USB:USB_C_Receptacle_Amphenol_12401610E4-2A" (layer "F.Cu")
    (tedit 5A142044)
    (at 170.911792 94.54 180)
    (descr "USB TYPE C, RA RCPT PCB, SMT, https://www.amphenolcanada.com/StockAvailabilityPrice.aspx?From=&PartNum=12401610E4%7e2A")
    (tags "USB C Type-C Receptacle SMD")
    (property "Sheetfile" "rpi468-pcb.kicad_sch")
    (property "Sheetname" "")
    (attr smd)
    (fp_text reference "J2" (at 0 -6.36) (layer "F.SilkS"))
    (fp_text value "USB_C_Receptacle_USB2.0" (at 0 6.14) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab"))
    (pad "" np_thru_hole oval (at 3.6 -4.36 180) (size 0.95 0.65) (drill oval 0.95 0.65) (layers *.Cu *.Mask))
    (pad "" np_thru_hole circle (at -3.6 -4.36 180) (size 0.65 0.65) (drill 0.65) (layers *.Cu *.Mask))
    (pad "A1" smd rect (at -2.75 -5.02 180) (size 0.3 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 4 "GND") (pinfunction "GND") (pintype "passive"))
    (pad "A2" smd rect (at -2.25 -5.02 180) (size 0.3 0.7) (layers "F.Cu" "F.Paste" "F.Mask"))
    (pad "A3" smd rect (at -1.75 -5.02 180) (size 0.3 0.7) (layers "F.Cu" "F.Paste" "F.Mask"))
    (pad "A4" smd rect (at -1.25 -5.02 180) (size 0.3 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "+5V") (pinfunction "VBUS") (pintype "passive"))
    (pad "A5" smd rect (at -0.75 -5.02 180) (size 0.3 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 8 "Net-(J2-PadA5)") (pinfunction "CC1") (pintype "bidirectional"))
    (pad "A6" smd rect (at -0.25 -5.02 180) (size 0.3 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 5 "Net-(J2-PadA6)") (pinfunction "D+") (pintype "bidirectional"))
    (pad "A7" smd rect (at 0.25 -5.02 180) (size 0.3 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 6 "Net-(J2-PadA7)") (pinfunction "D-") (pintype "bidirectional"))
    (pad "A8" smd rect (at 0.75 -5.02 180) (size 0.3 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 7 "unconnected-(J2-PadA8)") (pinfunction "SBU1") (pintype "bidirectional+no_connect"))
    (pad "A9" smd rect (at 1.25 -5.02 180) (size 0.3 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "+5V") (pinfunction "VBUS") (pintype "passive"))
    (pad "A10" smd rect (at 1.75 -5.02 180) (size 0.3 0.7) (layers "F.Cu" "F.Paste" "F.Mask"))
    (pad "A11" smd rect (at 2.25 -5.02 180) (size 0.3 0.7) (layers "F.Cu" "F.Paste" "F.Mask"))
    (pad "A12" smd rect (at 2.75 -5.02 180) (size 0.3 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 4 "GND") (pinfunction "GND") (pintype "passive"))
    (pad "B1" smd rect (at 2.5 -3.32 180) (size 0.3 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 4 "GND") (pinfunction "GND") (pintype "passive"))
    (pad "B2" smd rect (at 2 -3.32 180) (size 0.3 0.7) (layers "F.Cu" "F.Paste" "F.Mask"))
    (pad "B3" smd rect (at 1.5 -3.32 180) (size 0.3 0.7) (layers "F.Cu" "F.Paste" "F.Mask"))
    (pad "B4" smd rect (at 1 -3.32 180) (size 0.3 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "+5V") (pinfunction "VBUS") (pintype "passive"))
    (pad "B5" smd rect (at 0.5 -3.32 180) (size 0.3 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 8 "Net-(J2-PadA5)") (pinfunction "CC2") (pintype "bidirectional"))
    (pad "B6" smd rect (at 0 -3.32 180) (size 0.3 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 5 "Net-(J2-PadA6)") (pinfunction "D+") (pintype "bidirectional"))
    (pad "B7" smd rect (at -0.5 -3.32 180) (size 0.3 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 6 "Net-(J2-PadA7)") (pinfunction "D-") (pintype "bidirectional"))
    (pad "B8" smd rect (at -1 -3.32 180) (size 0.3 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 9 "unconnected-(J2-PadB8)") (pinfunction "SBU2") (pintype "bidirectional+no_connect"))
    (pad "B9" smd rect (at -1.5 -3.32 180) (size 0.3 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 1 "+5V") (pinfunction "VBUS") (pintype "passive"))
    (pad "B10" smd rect (at -2 -3.32 180) (size 0.3 0.7) (layers "F.Cu" "F.Paste" "F.Mask"))
    (pad "B11" smd rect (at -2.5 -3.32 180) (size 0.3 0.7) (layers "F.Cu" "F.Paste" "F.Mask"))
    (pad "B12" smd rect (at -3 -3.32 180) (size 0.3 0.7) (layers "F.Cu" "F.Paste" "F.Mask")
      (net 4 "GND") (pinfunction "GND") (pintype "passive"))
    (pad "S1" thru_hole oval (at -4.13 -3.11 180) (size 0.8 1.4) (drill oval 0.5 1.1) (layers *.Cu *.Mask)
      (net 4 "GND") (pinfunction "SHIELD") (pintype "passive"))
    (pad "S1" thru_hole oval (at 4.13 -3.11 180) (size 0.8 1.4) (drill oval 0.5 1.1) (layers *.Cu *.Mask)
      (net 4 "GND") (pinfunction "SHIELD") (pintype "passive"))
    (pad "S1" thru_hole oval (at 4.49 2.84 180) (size 0.8 1.4) (drill oval 0.5 1.1) (layers *.Cu *.Mask)
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