(kicad_pcb (version 20171130) (host pcbnew "(5.1.0-0)")
  (general
    (thickness 1.6)
    (drawings 130)
    (tracks 1448)
    (zones 0)
    (modules 134)
    (nets 85)
  )
  (page A4)
  (layers
    (0 F.Cu signal)
    (31 B.Cu signal)
    (32 B.Adhes user)
    (33 F.Adhes user)
    (34 B.Paste user)
    (35 F.Paste user)
    (36 B.SilkS user)
    (37 F.SilkS user)
    (38 B.Mask user)
    (39 F.Mask user)
    (40 Dwgs.User user)
    (41 Cmts.User user)
    (42 Eco1.User user)
    (43 Eco2.User user)
    (44 Edge.Cuts user)
    (45 Margin user)
    (46 B.CrtYd user)
    (47 F.CrtYd user)
    (48 B.Fab user hide)
    (49 F.Fab user hide)
  )
  (setup
    (last_trace_width 0.2032)
    (trace_clearance 0.1524)
    (zone_clearance 0.3)
    (zone_45_only no)
    (trace_min 0.1524)
    (via_size 0.762)
    (via_drill 0.381)
    (via_min_size 0.4)
    (via_min_drill 0.3)
    (uvia_size 0.3)
    (uvia_drill 0.1)
    (uvias_allowed no)
    (uvia_min_size 0.2)
    (uvia_min_drill 0.1)
    (edge_width 0.15)
    (segment_width 0.2)
    (pcb_text_width 0.3)
    (pcb_text_size 1.5 1.5)
    (mod_edge_width 0.15)
    (mod_text_size 1 1)
    (mod_text_width 0.15)
    (pad_size 0.7 0.7)
    (pad_drill 0.7)
    (pad_to_mask_clearance 0.0508)
    (solder_mask_min_width 0.25)
    (aux_axis_origin 0 0)
    (grid_origin 146.445 95.488)
    (visible_elements FFFFFF7F)
    (pcbplotparams
      (layerselection 0x010fc_ffffffff)
      (usegerberextensions false)
      (usegerberattributes false)
      (usegerberadvancedattributes false)
      (creategerberjobfile false)
      (excludeedgelayer true)
      (linewidth 0.100000)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (padsonsilk false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 0)
      (scaleselection 1)
      (outputdirectory "gerber/"))
  )
  (net 0 "")
  (net 1 +5V)
  (net 2 /D0)
  (net 3 /D1)
  (net 4 /D2)
  (net 5 GND)
  (net 6 /D3)
  (net 7 /D4)
  (net 8 /D5)
  (net 9 /D6)
  (net 10 /D7)
  (net 11 +3V3)
  (net 12 /SWDIO)
  (net 13 /SWCLK)
  (net 14 /CLK)
  (net 15 /WR)
  (net 16 /RD)
  (net 17 /CS)
  (net 18 /A0)
  (net 19 /A1)
  (net 20 /A2)
  (net 21 /A3)
  (net 22 /A4)
  (net 23 /A5)
  (net 24 /A6)
  (net 25 /A7)
  (net 26 /A8)
  (net 27 /A9)
  (net 28 /A10)
  (net 29 /A11)
  (net 30 /A12)
  (net 31 /A13)
  (net 32 /A14)
  (net 33 /A15)
  (net 34 /RESET)
  (net 35 /DATA_OE)
  (net 36 /DIR)
  (net 37 /3V_D0)
  (net 38 /3V_D1)
  (net 39 /3V_D2)
  (net 40 /3V_D3)
  (net 41 /3V_D4)
  (net 42 /3V_D5)
  (net 43 /3V_D6)
  (net 44 /3V_D7)
  (net 45 /GB_RESET)
  (net 46 /SAMD_RESET)
  (net 47 VBUS)
  (net 48 /3V_A12)
  (net 49 /3V_A13)
  (net 50 /3V_A14)
  (net 51 /3V_A15)
  (net 52 /3V_A11)
  (net 53 /3V_A10)
  (net 54 /3V_A9)
  (net 55 /3V_A8)
  (net 56 /3V_A7)
  (net 57 /3V_A6)
  (net 58 /3V_A5)
  (net 59 /3V_A4)
  (net 60 /3V_CLK)
  (net 61 /3V_WR)
  (net 62 /3V_RD)
  (net 63 /3V_CS)
  (net 64 /3V_A0)
  (net 65 /3V_A1)
  (net 66 /3V_A2)
  (net 67 /3V_A3)
  (net 68 /USB_D-)
  (net 69 /USB_D+)
  (net 70 "Net-(D3-Pad1)")
  (net 71 /LED)
  (net 72 +BATT)
  (net 73 /SWO)
  (net 74 "Net-(C14-Pad2)")
  (net 75 "Net-(TP44-Pad1)")
  (net 76 /MIDI_IN)
  (net 77 "Net-(J6-PadR)")
  (net 78 /MIDI_OUT)
  (net 79 "Net-(J6-PadT)")
  (net 80 "Net-(D4-Pad1)")
  (net 81 "Net-(D4-Pad2)")
  (net 82 /SHIELD)
  (net 83 /AUD)
  (net 84 "Net-(J5-PadR)")
  (net_class Default "This is the default net class."
    (clearance 0.1524)
    (trace_width 0.2032)
    (via_dia 0.762)
    (via_drill 0.381)
    (uvia_dia 0.3)
    (uvia_drill 0.1)
    (add_net +3V3)
    (add_net +5V)
    (add_net +BATT)
    (add_net /3V_A0)
    (add_net /3V_A1)
    (add_net /3V_A10)
    (add_net /3V_A11)
    (add_net /3V_A12)
    (add_net /3V_A13)
    (add_net /3V_A14)
    (add_net /3V_A15)
    (add_net /3V_A2)
    (add_net /3V_A3)
    (add_net /3V_A4)
    (add_net /3V_A5)
    (add_net /3V_A6)
    (add_net /3V_A7)
    (add_net /3V_A8)
    (add_net /3V_A9)
    (add_net /3V_CLK)
    (add_net /3V_CS)
    (add_net /3V_D0)
    (add_net /3V_D1)
    (add_net /3V_D2)
    (add_net /3V_D3)
    (add_net /3V_D4)
    (add_net /3V_D5)
    (add_net /3V_D6)
    (add_net /3V_D7)
    (add_net /3V_RD)
    (add_net /3V_WR)
    (add_net /A0)
    (add_net /A1)
    (add_net /A10)
    (add_net /A11)
    (add_net /A12)
    (add_net /A13)
    (add_net /A14)
    (add_net /A15)
    (add_net /A2)
    (add_net /A3)
    (add_net /A4)
    (add_net /A5)
    (add_net /A6)
    (add_net /A7)
    (add_net /A8)
    (add_net /A9)
    (add_net /AUD)
    (add_net /CLK)
    (add_net /CS)
    (add_net /D0)
    (add_net /D1)
    (add_net /D2)
    (add_net /D3)
    (add_net /D4)
    (add_net /D5)
    (add_net /D6)
    (add_net /D7)
    (add_net /DATA_OE)
    (add_net /DIR)
    (add_net /GB_RESET)
    (add_net /LED)
    (add_net /MIDI_IN)
    (add_net /MIDI_OUT)
    (add_net /RD)
    (add_net /RESET)
    (add_net /SAMD_RESET)
    (add_net /SHIELD)
    (add_net /SWCLK)
    (add_net /SWDIO)
    (add_net /SWO)
    (add_net /USB_D+)
    (add_net /USB_D-)
    (add_net /WR)
    (add_net GND)
    (add_net "Net-(C14-Pad2)")
    (add_net "Net-(D3-Pad1)")
    (add_net "Net-(D4-Pad1)")
    (add_net "Net-(D4-Pad2)")
    (add_net "Net-(J5-PadR)")
    (add_net "Net-(J6-PadR)")
    (add_net "Net-(J6-PadT)")
    (add_net "Net-(TP44-Pad1)")
    (add_net VBUS)
  )
  (module keystone:5015-SMT-TestPoint-NoPaste (layer F.Cu) (tedit 5CA10F06)
    (at 142.2105 77.978 90)
    (fp_text reference TP47 (at 0 2.25 90) (layer F.SilkS) hide)
    (fp_text value D0 (at 0 -0.5 90) (layer F.Fab))
    (pad 1 smd rect (at 0 0 90) (size 3.43 1.78) (layers F.Cu F.Mask)
      (net 2 /D0))
  )
  (module keystone:5015-SMT-TestPoint-NoPaste (layer F.Cu) (tedit 5CA10F06)
    (at 135.162 64.5795 90)
    (fp_text reference TP46 (at 0 2.25 90) (layer F.SilkS) hide)
    (fp_text value data0 (at 0 -0.5 90) (layer F.Fab))
    (pad 1 smd rect (at 0 0 90) (size 3.43 1.78) (layers F.Cu F.Mask)
      (net 37 /3V_D0))
  )
  (module keystone:5015-SMT-TestPoint-NoPaste (layer F.Cu) (tedit 5CA10F06)
    (at 112.2385 69.596 45)
    (fp_text reference TP45 (at 0 2.25 45) (layer F.SilkS) hide)
    (fp_text value cs (at 0 -0.5 45) (layer F.Fab))
    (pad 1 smd rect (at 0 0 45) (size 3.43 1.78) (layers F.Cu F.Mask)
      (net 63 /3V_CS))
  )
  (module keystone:5015-SMT-TestPoint-NoPaste (layer F.Cu) (tedit 5CA10F06)
    (at 133.003 51.7525 45)
    (fp_text reference TP44 (at 0 2.25 45) (layer F.SilkS) hide)
    (fp_text value PB17 (at 0 -0.5 45) (layer F.Fab))
    (pad 1 smd rect (at 0 0 45) (size 3.43 1.78) (layers F.Cu F.Mask)
      (net 75 "Net-(TP44-Pad1)"))
  )
  (module keystone:5015-SMT-TestPoint-NoPaste (layer F.Cu) (tedit 5CA10F06)
    (at 137.945 74.988)
    (fp_text reference TP43 (at 0 2.25) (layer F.SilkS) hide)
    (fp_text value a15 (at 0 -0.5) (layer F.Fab))
    (pad 1 smd rect (at 0 0) (size 3.43 1.78) (layers F.Cu F.Mask)
      (net 51 /3V_A15))
  )
  (module keystone:5015-SMT-TestPoint-NoPaste (layer F.Cu) (tedit 5CA10F06)
    (at 108.6825 73.7235 45)
    (fp_text reference TP42 (at 0 2.25 45) (layer F.SilkS) hide)
    (fp_text value wr (at 0 -0.5 45) (layer F.Fab))
    (pad 1 smd rect (at 0 0 45) (size 3.43 1.78) (layers F.Cu F.Mask)
      (net 61 /3V_WR))
  )
  (module keystone:5015-SMT-TestPoint-NoPaste (layer F.Cu) (tedit 5CA10F06)
    (at 104.3645 76.708 90)
    (fp_text reference TP41 (at 0 2.25 90) (layer F.SilkS) hide)
    (fp_text value rd (at 0 -0.5 90) (layer F.Fab))
    (pad 1 smd rect (at 0 0 90) (size 3.43 1.78) (layers F.Cu F.Mask)
      (net 62 /3V_RD))
  )
  (module keystone:5015-SMT-TestPoint-NoPaste (layer F.Cu) (tedit 5CA10F06)
    (at 133.695 71.738 135)
    (fp_text reference TP40 (at 0 2.25 135) (layer F.SilkS) hide)
    (fp_text value clk (at 0 -0.5 135) (layer F.Fab))
    (pad 1 smd rect (at 0 0 135) (size 3.43 1.78) (layers F.Cu F.Mask)
      (net 60 /3V_CLK))
  )
  (module keystone:5015-SMT-TestPoint-NoPaste (layer F.Cu) (tedit 5CA10F06)
    (at 101.507 69.723 90)
    (fp_text reference TP39 (at 0 2.25 90) (layer F.SilkS) hide)
    (fp_text value batt (at 0 -0.5 90) (layer F.Fab))
    (pad 1 smd rect (at 0 0 90) (size 3.43 1.78) (layers F.Cu F.Mask)
      (net 1 +5V))
  )
  (module keystone:5015-SMT-TestPoint-NoPaste (layer F.Cu) (tedit 5CA10F06)
    (at 113.7625 60.833 270)
    (fp_text reference TP38 (at 0 2.25 270) (layer F.SilkS) hide)
    (fp_text value 3.3v (at 0 -0.5 270) (layer F.Fab))
    (pad 1 smd rect (at 0 0 270) (size 3.43 1.78) (layers F.Cu F.Mask)
      (net 11 +3V3))
  )
  (module keystone:5015-SMT-TestPoint-NoPaste (layer F.Cu) (tedit 5CA10F06)
    (at 145.95 50.19)
    (fp_text reference TP37 (at 0 2.25) (layer F.SilkS) hide)
    (fp_text value gnd (at 0 -0.5) (layer F.Fab))
    (pad 1 smd rect (at 0 0) (size 3.43 1.78) (layers F.Cu F.Mask)
      (net 5 GND))
  )
  (module keystone:5015-SMT-TestPoint-NoPaste (layer F.Cu) (tedit 5CA10F06)
    (at 122.081 53.975 135)
    (fp_text reference TP36 (at 0 2.25 135) (layer F.SilkS) hide)
    (fp_text value SAMD_RESET (at 0 -0.5 135) (layer F.Fab))
    (pad 1 smd rect (at 0 0 135) (size 3.43 1.78) (layers F.Cu F.Mask)
      (net 46 /SAMD_RESET))
  )
  (module keystone:5015-SMT-TestPoint-NoPaste (layer F.Cu) (tedit 5CA10F06)
    (at 139.445 65.488 90)
    (fp_text reference TP35 (at 0 2.25 90) (layer F.SilkS) hide)
    (fp_text value GB_RESET (at 0 -0.5 90) (layer F.Fab))
    (pad 1 smd rect (at 0 0 90) (size 3.43 1.78) (layers F.Cu F.Mask)
      (net 45 /GB_RESET))
  )
  (module keystone:5015-SMT-TestPoint-NoPaste (layer F.Cu) (tedit 5CA10F06)
    (at 139.445 69.738 90)
    (fp_text reference TP34 (at 0 2.25 90) (layer F.SilkS) hide)
    (fp_text value DATA_OE (at 0 -0.5 90) (layer F.Fab))
    (pad 1 smd rect (at 0 0 90) (size 3.43 1.78) (layers F.Cu F.Mask)
      (net 35 /DATA_OE))
  )
  (module keystone:5015-SMT-TestPoint-NoPaste (layer F.Cu) (tedit 5CA10F06)
    (at 142.195 67.988 90)
    (fp_text reference TP33 (at 0 2.25 90) (layer F.SilkS) hide)
    (fp_text value Test_Point (at 0 -0.5 90) (layer F.Fab))
    (pad 1 smd rect (at 0 0 90) (size 3.43 1.78) (layers F.Cu F.Mask)
      (net 36 /DIR))
  )
  (module Package_DIP:SMDIP-6_W9.53mm (layer F.Cu) (tedit 5CA0707C)
    (at 104.6874 61.4012 270)
    (descr "6-lead surface-mounted (SMD) DIP package, row spacing 9.53 mm (375 mils)")
    (tags "SMD DIP DIL PDIP SMDIP 2.54mm 9.53mm 375mil")
    (attr smd)
    (fp_text reference U8 (at 2.4384 -4.826 270) (layer F.SilkS))
    (fp_text value H11L1 (at 0 4.87 270) (layer F.Fab))
    (fp_text user %R (at 0 0 270) (layer F.Fab))
    (pad 6 smd rect (at 4.635 -2.54 270) (size 1.52 1.78) (layers F.Cu F.Paste F.Mask)
      (net 11 +3V3))
    (pad 3 smd rect (at -4.635 2.54 270) (size 1.52 1.78) (layers F.Cu F.Paste F.Mask))
    (pad 5 smd rect (at 4.635 0 270) (size 1.52 1.78) (layers F.Cu F.Paste F.Mask)
      (net 5 GND))
    (pad 2 smd rect (at -4.635 0 270) (size 1.52 1.78) (layers F.Cu F.Paste F.Mask)
      (net 81 "Net-(D4-Pad2)"))
    (pad 4 smd rect (at 4.635 2.54 270) (size 1.52 1.78) (layers F.Cu F.Paste F.Mask)
      (net 76 /MIDI_IN))
    (pad 1 smd rect (at -4.635 -2.54 270) (size 1.52 1.78) (layers F.Cu F.Paste F.Mask)
      (net 80 "Net-(D4-Pad1)"))
    (model ${KISYS3DMOD}/Package_DIP.3dshapes/SMDIP-6_W9.53mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module adafruit:4UCONN_20329_V2_USB (layer F.Cu) (tedit 5C85D8AC)
    (at 126.9705 42.6085 180)
    (fp_text reference J4 (at -2.778 5.852 180) (layer F.SilkS) hide)
    (fp_text value USB_B_Micro (at -2.778 6.41 180) (layer F.Fab))
    (fp_text user "PCB EDGE" (at 0 4 180) (layer F.Fab))
    (pad 6 smd rect (at 0.75 2 270) (size 2 1) (layers F.Cu F.Paste F.Mask)
      (net 5 GND) (solder_mask_margin 0.0508))
    (pad 6 smd rect (at -0.75 2 270) (size 2 1) (layers F.Cu F.Paste F.Mask)
      (net 5 GND) (solder_mask_margin 0.0508))
    (pad 5 smd rect (at 1.3 -0.775 180) (size 0.4 1.35) (layers F.Cu F.Mask)
      (net 5 GND) (solder_mask_margin 0.0508))
    (pad 4 smd rect (at 0.65 -0.775 180) (size 0.4 1.35) (layers F.Cu F.Mask)
      (solder_mask_margin 0.0508))
    (pad 3 smd rect (at 0 -0.775 180) (size 0.4 1.35) (layers F.Cu F.Mask)
      (net 69 /USB_D+) (solder_mask_margin 0.0508))
    (pad 2 smd rect (at -0.65 -0.775 180) (size 0.4 1.35) (layers F.Cu F.Mask)
      (net 68 /USB_D-) (solder_mask_margin 0.0508))
    (pad 1 smd rect (at -1.3 -0.775 180) (size 0.4 1.35) (layers F.Cu F.Mask)
      (net 47 VBUS) (solder_mask_margin 0.0508))
    (pad 6 thru_hole circle (at 3.3 -0.9 180) (size 1.143 1.143) (drill 0.8) (layers *.Cu *.Mask)
      (net 5 GND) (solder_mask_margin 0.0508))
    (pad 6 thru_hole circle (at -3.3 -0.9) (size 1.143 1.143) (drill 0.8) (layers *.Cu *.Mask)
      (net 5 GND) (solder_mask_margin 0.0508))
    (pad 6 thru_hole rect (at -3.6 1.9) (size 2.413 2.413) (drill oval 0.9 1.3) (layers *.Cu *.Mask)
      (net 5 GND) (solder_mask_margin 0.0508))
    (pad 6 thru_hole rect (at 3.6 1.9) (size 2.413 2.413) (drill oval 0.8 1.3) (layers *.Cu *.Mask)
      (net 5 GND) (solder_mask_margin 0.0508))
    (pad "" np_thru_hole circle (at 1.95 0 180) (size 0.7 0.7) (drill 0.7) (layers *.Mask B.Cu))
    (pad "" np_thru_hole circle (at -1.95 0 180) (size 0.7 0.7) (drill 0.7) (layers *.Mask B.Cu))
  )
  (module TestPoint:TestPoint_Pad_D1.5mm (layer B.Cu) (tedit 5C85CB4A)
    (at 138.445 40.988)
    (descr "SMD pad as test Point, diameter 1.5mm")
    (tags "test point SMD pad")
    (attr virtual)
    (fp_text reference TP85 (at 0 1.648) (layer B.SilkS) hide)
    (fp_text value Test_Point (at 0 -1.75) (layer B.Fab))
    (fp_text user %R (at 0 1.65) (layer B.Fab))
    (pad 1 smd circle (at 0 0) (size 1.5 1.5) (layers B.Cu B.Mask)
      (net 5 GND))
  )
  (module TestPoint:TestPoint_Pad_D1.5mm (layer B.Cu) (tedit 5C85CB42)
    (at 139.945 42.988)
    (descr "SMD pad as test Point, diameter 1.5mm")
    (tags "test point SMD pad")
    (attr virtual)
    (fp_text reference TP84 (at 0 1.648) (layer B.SilkS) hide)
    (fp_text value Test_Point (at 0 -1.75) (layer B.Fab))
    (fp_text user %R (at 0 1.65) (layer B.Fab))
    (pad 1 smd circle (at 0 0) (size 1.5 1.5) (layers B.Cu B.Mask)
      (net 11 +3V3))
  )
  (module TestPoint:TestPoint_Pad_D1.5mm (layer B.Cu) (tedit 5C85CB3E)
    (at 135.445 45.488)
    (descr "SMD pad as test Point, diameter 1.5mm")
    (tags "test point SMD pad")
    (attr virtual)
    (fp_text reference TP83 (at 0 1.648) (layer B.SilkS) hide)
    (fp_text value Test_Point (at 0 -1.75) (layer B.Fab))
    (fp_text user %R (at 0 1.65) (layer B.Fab))
    (pad 1 smd circle (at 0 0) (size 1.5 1.5) (layers B.Cu B.Mask)
      (net 73 /SWO))
  )
  (module TestPoint:TestPoint_Pad_D1.5mm (layer B.Cu) (tedit 5C85CB34)
    (at 141.445 45.488)
    (descr "SMD pad as test Point, diameter 1.5mm")
    (tags "test point SMD pad")
    (attr virtual)
    (fp_text reference TP82 (at 0 1.648) (layer B.SilkS) hide)
    (fp_text value Test_Point (at 0 -1.75) (layer B.Fab))
    (fp_text user %R (at 0 1.65) (layer B.Fab))
    (pad 1 smd circle (at 0 0) (size 1.5 1.5) (layers B.Cu B.Mask)
      (net 12 /SWDIO))
  )
  (module TestPoint:TestPoint_Pad_D1.5mm (layer B.Cu) (tedit 5C85CB39)
    (at 138.445 45.488)
    (descr "SMD pad as test Point, diameter 1.5mm")
    (tags "test point SMD pad")
    (attr virtual)
    (fp_text reference TP81 (at 0 1.648) (layer B.SilkS) hide)
    (fp_text value Test_Point (at 0 -1.75) (layer B.Fab))
    (fp_text user %R (at 0 1.65) (layer B.Fab))
    (pad 1 smd circle (at 0 0) (size 1.5 1.5) (layers B.Cu B.Mask)
      (net 13 /SWCLK))
  )
  (module TestPoint:TestPoint_Pad_D1.5mm (layer B.Cu) (tedit 5C85CB45)
    (at 136.945 42.988)
    (descr "SMD pad as test Point, diameter 1.5mm")
    (tags "test point SMD pad")
    (attr virtual)
    (fp_text reference TP80 (at 0 1.648) (layer B.SilkS) hide)
    (fp_text value Test_Point (at 0 -1.75) (layer B.Fab))
    (fp_text user %R (at 0 1.65) (layer B.Fab))
    (pad 1 smd circle (at 0 0) (size 1.5 1.5) (layers B.Cu B.Mask)
      (net 46 /SAMD_RESET))
  )
  (module Fiducial:Fiducial_1mm_Mask2mm (layer F.Cu) (tedit 5C85CF20)
    (at 138.945 82.488)
    (descr "Circular Fiducial, 1mm bare copper, 2mm soldermask opening (Level A)")
    (tags fiducial)
    (attr smd)
    (fp_text reference FID0 (at 0 -2) (layer F.SilkS) hide)
    (fp_text value TestPoint (at 0 2) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad "" smd circle (at 0 0) (size 1 1) (layers F.Cu F.Mask)
      (solder_mask_margin 0.5) (clearance 0.5))
  )
  (module Fiducial:Fiducial_1mm_Mask2mm (layer F.Cu) (tedit 5C85C699)
    (at 102.1474 54.0352)
    (descr "Circular Fiducial, 1mm bare copper, 2mm soldermask opening (Level A)")
    (tags fiducial)
    (attr smd)
    (fp_text reference FID1 (at 0 -2) (layer F.SilkS) hide)
    (fp_text value TestPoint (at 0 2) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad "" smd circle (at 0 0) (size 1 1) (layers F.Cu F.Mask)
      (solder_mask_margin 0.5) (clearance 0.5))
  )
  (module TestPoint:TestPoint_Pad_D1.5mm (layer B.Cu) (tedit 5C85C2C9)
    (at 146.445 95.488)
    (descr "SMD pad as test Point, diameter 1.5mm")
    (tags "test point SMD pad")
    (attr virtual)
    (fp_text reference TP78 (at 0 1.648) (layer B.SilkS) hide)
    (fp_text value Test_Point (at 0 -1.75) (layer B.Fab))
    (fp_text user %R (at 0 1.65) (layer B.Fab))
    (pad 1 smd circle (at 0 0) (size 1.5 1.5) (layers B.Cu B.Mask)
      (net 83 /AUD))
  )
  (module TestPoint:TestPoint_Pad_D1.5mm (layer B.Cu) (tedit 5C85C1D2)
    (at 101.445 95.488)
    (descr "SMD pad as test Point, diameter 1.5mm")
    (tags "test point SMD pad")
    (attr virtual)
    (fp_text reference TP48 (at 0 1.648) (layer B.SilkS) hide)
    (fp_text value Test_Point (at 0 -1.75) (layer B.Fab))
    (fp_text user %R (at 0 1.65) (layer B.Fab))
    (pad 1 smd circle (at 0 0) (size 1.5 1.5) (layers B.Cu B.Mask)
      (net 72 +BATT))
  )
  (module TestPoint:TestPoint_Pad_D1.5mm (layer B.Cu) (tedit 5C85C230)
    (at 132.945 92.488)
    (descr "SMD pad as test Point, diameter 1.5mm")
    (tags "test point SMD pad")
    (attr virtual)
    (fp_text reference TP69 (at 0 1.648) (layer B.SilkS) hide)
    (fp_text value Test_Point (at 0 -1.75) (layer B.Fab))
    (fp_text user %R (at 0 1.65) (layer B.Fab))
    (pad 1 smd circle (at 0 0) (size 1.5 1.5) (layers B.Cu B.Mask)
      (net 2 /D0))
  )
  (module TestPoint:TestPoint_Pad_D1.5mm (layer B.Cu) (tedit 5C85C1D7)
    (at 102.945 92.488)
    (descr "SMD pad as test Point, diameter 1.5mm")
    (tags "test point SMD pad")
    (attr virtual)
    (fp_text reference TP49 (at 0 1.648) (layer B.SilkS) hide)
    (fp_text value Test_Point (at 0 -1.75) (layer B.Fab))
    (fp_text user %R (at 0 1.65) (layer B.Fab))
    (pad 1 smd circle (at 0 0) (size 1.5 1.5) (layers B.Cu B.Mask)
      (net 14 /CLK))
  )
  (module TestPoint:TestPoint_Pad_D1.5mm (layer B.Cu) (tedit 5C85C1DC)
    (at 104.445 95.488)
    (descr "SMD pad as test Point, diameter 1.5mm")
    (tags "test point SMD pad")
    (attr virtual)
    (fp_text reference TP50 (at 0 1.648) (layer B.SilkS) hide)
    (fp_text value Test_Point (at 0 -1.75) (layer B.Fab))
    (fp_text user %R (at 0 1.65) (layer B.Fab))
    (pad 1 smd circle (at 0 0) (size 1.5 1.5) (layers B.Cu B.Mask)
      (net 15 /WR))
  )
  (module TestPoint:TestPoint_Pad_D1.5mm (layer B.Cu) (tedit 5C85C1E2)
    (at 105.945 92.488)
    (descr "SMD pad as test Point, diameter 1.5mm")
    (tags "test point SMD pad")
    (attr virtual)
    (fp_text reference TP51 (at 0 1.648) (layer B.SilkS) hide)
    (fp_text value Test_Point (at 0 -1.75) (layer B.Fab))
    (fp_text user %R (at 0 1.65) (layer B.Fab))
    (pad 1 smd circle (at 0 0) (size 1.5 1.5) (layers B.Cu B.Mask)
      (net 16 /RD))
  )
  (module TestPoint:TestPoint_Pad_D1.5mm (layer B.Cu) (tedit 5C85C1E7)
    (at 107.445 95.488)
    (descr "SMD pad as test Point, diameter 1.5mm")
    (tags "test point SMD pad")
    (attr virtual)
    (fp_text reference TP52 (at 0 1.648) (layer B.SilkS) hide)
    (fp_text value Test_Point (at 0 -1.75) (layer B.Fab))
    (fp_text user %R (at 0 1.65) (layer B.Fab))
    (pad 1 smd circle (at 0 0) (size 1.5 1.5) (layers B.Cu B.Mask)
      (net 17 /CS))
  )
  (module TestPoint:TestPoint_Pad_D1.5mm (layer B.Cu) (tedit 5C85C1EB)
    (at 108.945 92.488)
    (descr "SMD pad as test Point, diameter 1.5mm")
    (tags "test point SMD pad")
    (attr virtual)
    (fp_text reference TP53 (at 0 1.648) (layer B.SilkS) hide)
    (fp_text value Test_Point (at 0 -1.75) (layer B.Fab))
    (fp_text user %R (at 0 1.65) (layer B.Fab))
    (pad 1 smd circle (at 0 0) (size 1.5 1.5) (layers B.Cu B.Mask)
      (net 18 /A0))
  )
  (module TestPoint:TestPoint_Pad_D1.5mm (layer B.Cu) (tedit 5C85C233)
    (at 131.445 95.488)
    (descr "SMD pad as test Point, diameter 1.5mm")
    (tags "test point SMD pad")
    (attr virtual)
    (fp_text reference TP68 (at 0 1.648) (layer B.SilkS) hide)
    (fp_text value Test_Point (at 0 -1.75) (layer B.Fab))
    (fp_text user %R (at 0 1.65) (layer B.Fab))
    (pad 1 smd circle (at 0 0) (size 1.5 1.5) (layers B.Cu B.Mask)
      (net 33 /A15))
  )
  (module TestPoint:TestPoint_Pad_D1.5mm (layer B.Cu) (tedit 5C85C25E)
    (at 147.945 92.488)
    (descr "SMD pad as test Point, diameter 1.5mm")
    (tags "test point SMD pad")
    (attr virtual)
    (fp_text reference TP79 (at 0 1.648) (layer B.SilkS) hide)
    (fp_text value Test_Point (at 0 -1.75) (layer B.Fab))
    (fp_text user %R (at 0 1.65) (layer B.Fab))
    (pad 1 smd circle (at 0 0) (size 1.5 1.5) (layers B.Cu B.Mask)
      (net 5 GND))
  )
  (module TestPoint:TestPoint_Pad_D1.5mm (layer B.Cu) (tedit 5C85C25A)
    (at 144.945 92.5)
    (descr "SMD pad as test Point, diameter 1.5mm")
    (tags "test point SMD pad")
    (attr virtual)
    (fp_text reference TP77 (at 0 1.648) (layer B.SilkS) hide)
    (fp_text value Test_Point (at 0 -1.75) (layer B.Fab))
    (fp_text user %R (at 0 1.65) (layer B.Fab))
    (pad 1 smd circle (at 0 0) (size 1.5 1.5) (layers B.Cu B.Mask)
      (net 34 /RESET))
  )
  (module TestPoint:TestPoint_Pad_D1.5mm (layer B.Cu) (tedit 5C85C253)
    (at 143.445 95.377)
    (descr "SMD pad as test Point, diameter 1.5mm")
    (tags "test point SMD pad")
    (attr virtual)
    (fp_text reference TP76 (at 0 1.648) (layer B.SilkS) hide)
    (fp_text value Test_Point (at 0 -1.75) (layer B.Fab))
    (fp_text user %R (at 0 1.65) (layer B.Fab))
    (pad 1 smd circle (at 0 0) (size 1.5 1.5) (layers B.Cu B.Mask)
      (net 10 /D7))
  )
  (module TestPoint:TestPoint_Pad_D1.5mm (layer B.Cu) (tedit 5C85C250)
    (at 141.945 92.488)
    (descr "SMD pad as test Point, diameter 1.5mm")
    (tags "test point SMD pad")
    (attr virtual)
    (fp_text reference TP75 (at 0 1.648) (layer B.SilkS) hide)
    (fp_text value Test_Point (at 0 -1.75) (layer B.Fab))
    (fp_text user %R (at 0 1.65) (layer B.Fab))
    (pad 1 smd circle (at 0 0) (size 1.5 1.5) (layers B.Cu B.Mask)
      (net 9 /D6))
  )
  (module TestPoint:TestPoint_Pad_D1.5mm (layer B.Cu) (tedit 5C85C24B)
    (at 140.445 95.488)
    (descr "SMD pad as test Point, diameter 1.5mm")
    (tags "test point SMD pad")
    (attr virtual)
    (fp_text reference TP74 (at 0 1.648) (layer B.SilkS) hide)
    (fp_text value Test_Point (at 0 -1.75) (layer B.Fab))
    (fp_text user %R (at 0 1.65) (layer B.Fab))
    (pad 1 smd circle (at 0 0) (size 1.5 1.5) (layers B.Cu B.Mask)
      (net 8 /D5))
  )
  (module TestPoint:TestPoint_Pad_D1.5mm (layer B.Cu) (tedit 5C85C247)
    (at 138.945 92.488)
    (descr "SMD pad as test Point, diameter 1.5mm")
    (tags "test point SMD pad")
    (attr virtual)
    (fp_text reference TP73 (at 0 1.648) (layer B.SilkS) hide)
    (fp_text value Test_Point (at 0 -1.75) (layer B.Fab))
    (fp_text user %R (at 0 1.65) (layer B.Fab))
    (pad 1 smd circle (at 0 0) (size 1.5 1.5) (layers B.Cu B.Mask)
      (net 7 /D4))
  )
  (module TestPoint:TestPoint_Pad_D1.5mm (layer B.Cu) (tedit 5C85C242)
    (at 137.445 95.488)
    (descr "SMD pad as test Point, diameter 1.5mm")
    (tags "test point SMD pad")
    (attr virtual)
    (fp_text reference TP72 (at 0 1.648) (layer B.SilkS) hide)
    (fp_text value Test_Point (at 0 -1.75) (layer B.Fab))
    (fp_text user %R (at 0 1.65) (layer B.Fab))
    (pad 1 smd circle (at 0 0) (size 1.5 1.5) (layers B.Cu B.Mask)
      (net 6 /D3))
  )
  (module TestPoint:TestPoint_Pad_D1.5mm (layer B.Cu) (tedit 5C85C22B)
    (at 129.945 92.488)
    (descr "SMD pad as test Point, diameter 1.5mm")
    (tags "test point SMD pad")
    (attr virtual)
    (fp_text reference TP67 (at 0 1.648) (layer B.SilkS) hide)
    (fp_text value Test_Point (at 0 -1.75) (layer B.Fab))
    (fp_text user %R (at 0 1.65) (layer B.Fab))
    (pad 1 smd circle (at 0 0) (size 1.5 1.5) (layers B.Cu B.Mask)
      (net 32 /A14))
  )
  (module TestPoint:TestPoint_Pad_D1.5mm (layer B.Cu) (tedit 5C85C227)
    (at 128.445 95.488)
    (descr "SMD pad as test Point, diameter 1.5mm")
    (tags "test point SMD pad")
    (attr virtual)
    (fp_text reference TP66 (at 0 1.648) (layer B.SilkS) hide)
    (fp_text value Test_Point (at 0 -1.75) (layer B.Fab))
    (fp_text user %R (at 0 1.65) (layer B.Fab))
    (pad 1 smd circle (at 0 0) (size 1.5 1.5) (layers B.Cu B.Mask)
      (net 31 /A13))
  )
  (module TestPoint:TestPoint_Pad_D1.5mm (layer B.Cu) (tedit 5C85C1F6)
    (at 110.445 95.488)
    (descr "SMD pad as test Point, diameter 1.5mm")
    (tags "test point SMD pad")
    (attr virtual)
    (fp_text reference TP54 (at 0 1.648) (layer B.SilkS) hide)
    (fp_text value Test_Point (at 0 -1.75) (layer B.Fab))
    (fp_text user %R (at 0 1.65) (layer B.Fab))
    (pad 1 smd circle (at 0 0) (size 1.5 1.5) (layers B.Cu B.Mask)
      (net 19 /A1))
  )
  (module TestPoint:TestPoint_Pad_D1.5mm (layer B.Cu) (tedit 5C85C1F2)
    (at 111.945 92.488)
    (descr "SMD pad as test Point, diameter 1.5mm")
    (tags "test point SMD pad")
    (attr virtual)
    (fp_text reference TP55 (at 0 1.648) (layer B.SilkS) hide)
    (fp_text value Test_Point (at 0 -1.75) (layer B.Fab))
    (fp_text user %R (at 0 1.65) (layer B.Fab))
    (pad 1 smd circle (at 0 0) (size 1.5 1.5) (layers B.Cu B.Mask)
      (net 20 /A2))
  )
  (module TestPoint:TestPoint_Pad_D1.5mm (layer B.Cu) (tedit 5C85C1FA)
    (at 113.445 95.488)
    (descr "SMD pad as test Point, diameter 1.5mm")
    (tags "test point SMD pad")
    (attr virtual)
    (fp_text reference TP56 (at 0 1.648) (layer B.SilkS) hide)
    (fp_text value Test_Point (at 0 -1.75) (layer B.Fab))
    (fp_text user %R (at 0 1.65) (layer B.Fab))
    (pad 1 smd circle (at 0 0) (size 1.5 1.5) (layers B.Cu B.Mask)
      (net 21 /A3))
  )
  (module TestPoint:TestPoint_Pad_D1.5mm (layer B.Cu) (tedit 5C85C1FE)
    (at 114.945 92.488)
    (descr "SMD pad as test Point, diameter 1.5mm")
    (tags "test point SMD pad")
    (attr virtual)
    (fp_text reference TP57 (at 0 1.648) (layer B.SilkS) hide)
    (fp_text value Test_Point (at 0 -1.75) (layer B.Fab))
    (fp_text user %R (at 0 1.65) (layer B.Fab))
    (pad 1 smd circle (at 0 0) (size 1.5 1.5) (layers B.Cu B.Mask)
      (net 22 /A4))
  )
  (module TestPoint:TestPoint_Pad_D1.5mm (layer B.Cu) (tedit 5C85C224)
    (at 125.445 95.488)
    (descr "SMD pad as test Point, diameter 1.5mm")
    (tags "test point SMD pad")
    (attr virtual)
    (fp_text reference TP64 (at 0 1.648) (layer B.SilkS) hide)
    (fp_text value Test_Point (at 0 -1.75) (layer B.Fab))
    (fp_text user %R (at 0 1.65) (layer B.Fab))
    (pad 1 smd circle (at 0 0) (size 1.5 1.5) (layers B.Cu B.Mask)
      (net 29 /A11))
  )
  (module TestPoint:TestPoint_Pad_D1.5mm (layer B.Cu) (tedit 5C85C207)
    (at 116.445 95.488)
    (descr "SMD pad as test Point, diameter 1.5mm")
    (tags "test point SMD pad")
    (attr virtual)
    (fp_text reference TP58 (at 0 1.648) (layer B.SilkS) hide)
    (fp_text value Test_Point (at 0 -1.75) (layer B.Fab))
    (fp_text user %R (at 0 1.65) (layer B.Fab))
    (pad 1 smd circle (at 0 0) (size 1.5 1.5) (layers B.Cu B.Mask)
      (net 23 /A5))
  )
  (module TestPoint:TestPoint_Pad_D1.5mm (layer B.Cu) (tedit 5C85C203)
    (at 117.945 92.488)
    (descr "SMD pad as test Point, diameter 1.5mm")
    (tags "test point SMD pad")
    (attr virtual)
    (fp_text reference TP59 (at 0 1.648) (layer B.SilkS) hide)
    (fp_text value Test_Point (at 0 -1.75) (layer B.Fab))
    (fp_text user %R (at 0 1.65) (layer B.Fab))
    (pad 1 smd circle (at 0 0) (size 1.5 1.5) (layers B.Cu B.Mask)
      (net 24 /A6))
  )
  (module TestPoint:TestPoint_Pad_D1.5mm (layer B.Cu) (tedit 5C85C20B)
    (at 119.445 95.488)
    (descr "SMD pad as test Point, diameter 1.5mm")
    (tags "test point SMD pad")
    (attr virtual)
    (fp_text reference TP60 (at 0 1.648) (layer B.SilkS) hide)
    (fp_text value Test_Point (at 0 -1.75) (layer B.Fab))
    (fp_text user %R (at 0 1.65) (layer B.Fab))
    (pad 1 smd circle (at 0 0) (size 1.5 1.5) (layers B.Cu B.Mask)
      (net 25 /A7))
  )
  (module TestPoint:TestPoint_Pad_D1.5mm (layer B.Cu) (tedit 5C85C23E)
    (at 134.445 95.488)
    (descr "SMD pad as test Point, diameter 1.5mm")
    (tags "test point SMD pad")
    (attr virtual)
    (fp_text reference TP70 (at 0 1.648) (layer B.SilkS) hide)
    (fp_text value Test_Point (at 0 -1.75) (layer B.Fab))
    (fp_text user %R (at 0 1.65) (layer B.Fab))
    (pad 1 smd circle (at 0 0) (size 1.5 1.5) (layers B.Cu B.Mask)
      (net 3 /D1))
  )
  (module TestPoint:TestPoint_Pad_D1.5mm (layer B.Cu) (tedit 5C85C20F)
    (at 120.945 92.488)
    (descr "SMD pad as test Point, diameter 1.5mm")
    (tags "test point SMD pad")
    (attr virtual)
    (fp_text reference TP61 (at 0 1.648) (layer B.SilkS) hide)
    (fp_text value Test_Point (at 0 -1.75) (layer B.Fab))
    (fp_text user %R (at 0 1.65) (layer B.Fab))
    (pad 1 smd circle (at 0 0) (size 1.5 1.5) (layers B.Cu B.Mask)
      (net 26 /A8))
  )
  (module TestPoint:TestPoint_Pad_D1.5mm (layer B.Cu) (tedit 5C85C218)
    (at 122.445 95.488)
    (descr "SMD pad as test Point, diameter 1.5mm")
    (tags "test point SMD pad")
    (attr virtual)
    (fp_text reference TP62 (at 0 1.648) (layer B.SilkS) hide)
    (fp_text value Test_Point (at 0 -1.75) (layer B.Fab))
    (fp_text user %R (at 0 1.65) (layer B.Fab))
    (pad 1 smd circle (at 0 0) (size 1.5 1.5) (layers B.Cu B.Mask)
      (net 27 /A9))
  )
  (module TestPoint:TestPoint_Pad_D1.5mm (layer B.Cu) (tedit 5C85C214)
    (at 123.945 92.488)
    (descr "SMD pad as test Point, diameter 1.5mm")
    (tags "test point SMD pad")
    (attr virtual)
    (fp_text reference TP63 (at 0 1.648) (layer B.SilkS) hide)
    (fp_text value Test_Point (at 0 -1.75) (layer B.Fab))
    (fp_text user %R (at 0 1.65) (layer B.Fab))
    (pad 1 smd circle (at 0 0) (size 1.5 1.5) (layers B.Cu B.Mask)
      (net 28 /A10))
  )
  (module TestPoint:TestPoint_Pad_D1.5mm (layer B.Cu) (tedit 5C85C21F)
    (at 126.945 92.488)
    (descr "SMD pad as test Point, diameter 1.5mm")
    (tags "test point SMD pad")
    (attr virtual)
    (fp_text reference TP65 (at 0 1.648) (layer B.SilkS) hide)
    (fp_text value Test_Point (at 0 -1.75) (layer B.Fab))
    (fp_text user %R (at 0 1.65) (layer B.Fab))
    (pad 1 smd circle (at 0 0) (size 1.5 1.5) (layers B.Cu B.Mask)
      (net 30 /A12))
  )
  (module TestPoint:TestPoint_Pad_D1.5mm (layer B.Cu) (tedit 5C85C239)
    (at 135.945 92.488)
    (descr "SMD pad as test Point, diameter 1.5mm")
    (tags "test point SMD pad")
    (attr virtual)
    (fp_text reference TP71 (at 0 1.648) (layer B.SilkS) hide)
    (fp_text value Test_Point (at 0 -1.75) (layer B.Fab))
    (fp_text user %R (at 0 1.65) (layer B.Fab))
    (pad 1 smd circle (at 0 0) (size 1.5 1.5) (layers B.Cu B.Mask)
      (net 4 /D2))
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5C85D34A)
    (at 111.506 66.167 270)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R8 (at -0.1938 1.4338 90) (layer F.SilkS))
    (fp_text value 470 (at 0 1.43 270) (layer F.Fab))
    (fp_text user %R (at 0 0 270) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0 270) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 11 +3V3))
    (pad 2 smd roundrect (at 0.875 0 270) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 76 /MIDI_IN))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module LED_SMD:LED_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5C84B884)
    (at 133.638 40.64 90)
    (descr "LED SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "LED handsolder")
    (attr smd)
    (fp_text reference D3 (at 0 -1.65 90) (layer F.SilkS) hide)
    (fp_text value LED (at 0 1.65 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd roundrect (at -1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 70 "Net-(D3-Pad1)"))
    (pad 2 smd roundrect (at 1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 11 +3V3))
    (model ${KISYS3DMOD}/LED_SMD.3dshapes/LED_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B36C52B)
    (at 119.521 58.8104 315)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C14 (at -3.232892 0.628618 315) (layer F.SilkS))
    (fp_text value 10uF (at 0 1.65 315) (layer F.Fab))
    (fp_text user %R (at 0 0 315) (layer F.Fab))
    (pad 1 smd roundrect (at -1.024999 0 315) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 5 GND))
    (pad 2 smd roundrect (at 1.024999 0 315) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 74 "Net-(C14-Pad2)"))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_DFN_QFN:QFN-64-1EP_9x9mm_P0.5mm_EP4.7x4.7mm_ThermalVias (layer F.Cu) (tedit 5B316F24)
    (at 124.65 68.2625 45)
    (descr "QFN, 64 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/60001477A.pdf (page 1083)), generated with kicad-footprint-generator ipc_dfn_qfn_generator.py")
    (tags "QFN DFN_QFN")
    (attr smd)
    (fp_text reference U2 (at 0.494268 6.062026 45) (layer F.SilkS))
    (fp_text value SAMD51J (at 0 5.8 45) (layer F.Fab))
    (fp_text user %R (at 0 0 45) (layer F.Fab))
    (pad 65 smd roundrect (at 0 0 45) (size 4.7 4.7) (layers F.Cu F.Mask) (roundrect_rratio 0.053191)
      (net 5 GND))
    (pad 65 thru_hole circle (at -2.1 -2.1 45) (size 0.5 0.5) (drill 0.2) (layers *.Cu)
      (net 5 GND))
    (pad 65 thru_hole circle (at -0.7 -2.1 45) (size 0.5 0.5) (drill 0.2) (layers *.Cu)
      (net 5 GND))
    (pad 65 thru_hole circle (at 0.7 -2.1 45) (size 0.5 0.5) (drill 0.2) (layers *.Cu)
      (net 5 GND))
    (pad 65 thru_hole circle (at 2.1 -2.1 45) (size 0.5 0.5) (drill 0.2) (layers *.Cu)
      (net 5 GND))
    (pad 65 thru_hole circle (at -2.1 -0.7 45) (size 0.5 0.5) (drill 0.2) (layers *.Cu)
      (net 5 GND))
    (pad 65 thru_hole circle (at -0.7 -0.7 45) (size 0.5 0.5) (drill 0.2) (layers *.Cu)
      (net 5 GND))
    (pad 65 thru_hole circle (at 0.7 -0.7 45) (size 0.5 0.5) (drill 0.2) (layers *.Cu)
      (net 5 GND))
    (pad 65 thru_hole circle (at 2.1 -0.7 45) (size 0.5 0.5) (drill 0.2) (layers *.Cu)
      (net 5 GND))
    (pad 65 thru_hole circle (at -2.1 0.7 45) (size 0.5 0.5) (drill 0.2) (layers *.Cu)
      (net 5 GND))
    (pad 65 thru_hole circle (at -0.7 0.7 45) (size 0.5 0.5) (drill 0.2) (layers *.Cu)
      (net 5 GND))
    (pad 65 thru_hole circle (at 0.7 0.7 45) (size 0.5 0.5) (drill 0.2) (layers *.Cu)
      (net 5 GND))
    (pad 65 thru_hole circle (at 2.1 0.7 45) (size 0.5 0.5) (drill 0.2) (layers *.Cu)
      (net 5 GND))
    (pad 65 thru_hole circle (at -2.1 2.1 45) (size 0.5 0.5) (drill 0.2) (layers *.Cu)
      (net 5 GND))
    (pad 65 thru_hole circle (at -0.7 2.1 45) (size 0.5 0.5) (drill 0.2) (layers *.Cu)
      (net 5 GND))
    (pad 65 thru_hole circle (at 0.7 2.1 45) (size 0.5 0.5) (drill 0.2) (layers *.Cu)
      (net 5 GND))
    (pad 65 thru_hole circle (at 2.1 2.1 45) (size 0.5 0.5) (drill 0.2) (layers *.Cu)
      (net 5 GND))
    (pad 65 smd roundrect (at 0 0 45) (size 4.7 4.7) (layers B.Cu) (roundrect_rratio 0.053191)
      (net 5 GND))
    (pad "" smd roundrect (at -1.4 -1.4 45) (size 1.263087 1.263087) (layers F.Paste) (roundrect_rratio 0.197928))
    (pad "" smd roundrect (at -1.399999 0 45) (size 1.263087 1.263087) (layers F.Paste) (roundrect_rratio 0.197928))
    (pad "" smd roundrect (at -1.4 1.4 45) (size 1.263087 1.263087) (layers F.Paste) (roundrect_rratio 0.197928))
    (pad "" smd roundrect (at 0 -1.399999 45) (size 1.263087 1.263087) (layers F.Paste) (roundrect_rratio 0.197928))
    (pad "" smd roundrect (at 0 0 45) (size 1.263087 1.263087) (layers F.Paste) (roundrect_rratio 0.197928))
    (pad "" smd roundrect (at 0 1.399999 45) (size 1.263087 1.263087) (layers F.Paste) (roundrect_rratio 0.197928))
    (pad "" smd roundrect (at 1.4 -1.4 45) (size 1.263087 1.263087) (layers F.Paste) (roundrect_rratio 0.197928))
    (pad "" smd roundrect (at 1.399999 0 45) (size 1.263087 1.263087) (layers F.Paste) (roundrect_rratio 0.197928))
    (pad "" smd roundrect (at 1.4 1.4 45) (size 1.263087 1.263087) (layers F.Paste) (roundrect_rratio 0.197928))
    (pad 1 smd roundrect (at -4.4125 -3.75 45) (size 0.875 0.2) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 76 /MIDI_IN))
    (pad 2 smd roundrect (at -4.4125 -3.25 45) (size 0.875 0.2) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
    (pad 3 smd roundrect (at -4.4125 -2.75 45) (size 0.875 0.2) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
    (pad 4 smd roundrect (at -4.4125 -2.25 45) (size 0.875 0.2) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
    (pad 5 smd roundrect (at -4.4125 -1.75 45) (size 0.875 0.2) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 59 /3V_A4))
    (pad 6 smd roundrect (at -4.4125 -1.25 45) (size 0.875 0.2) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 58 /3V_A5))
    (pad 7 smd roundrect (at -4.4125 -0.75 45) (size 0.875 0.2) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 5 GND))
    (pad 8 smd roundrect (at -4.4125 -0.25 45) (size 0.875 0.2) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 11 +3V3))
    (pad 9 smd roundrect (at -4.4125 0.25 45) (size 0.875 0.2) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 57 /3V_A6))
    (pad 10 smd roundrect (at -4.4125 0.75 45) (size 0.875 0.2) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 56 /3V_A7))
    (pad 11 smd roundrect (at -4.4125 1.25 45) (size 0.875 0.2) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 55 /3V_A8))
    (pad 12 smd roundrect (at -4.4125 1.75 45) (size 0.875 0.2) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 54 /3V_A9))
    (pad 13 smd roundrect (at -4.4125 2.25 45) (size 0.875 0.2) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 60 /3V_CLK))
    (pad 14 smd roundrect (at -4.4125 2.75 45) (size 0.875 0.2) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 51 /3V_A15))
    (pad 15 smd roundrect (at -4.4125 3.25 45) (size 0.875 0.2) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 62 /3V_RD))
    (pad 16 smd roundrect (at -4.4125 3.75 45) (size 0.875 0.2) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 35 /DATA_OE))
    (pad 17 smd roundrect (at -3.75 4.4125 45) (size 0.2 0.875) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 51 /3V_A15))
    (pad 18 smd roundrect (at -3.25 4.4125 45) (size 0.2 0.875) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 61 /3V_WR))
    (pad 19 smd roundrect (at -2.75 4.4125 45) (size 0.2 0.875) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 60 /3V_CLK))
    (pad 20 smd roundrect (at -2.25 4.4125 45) (size 0.2 0.875) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 36 /DIR))
    (pad 21 smd roundrect (at -1.75 4.4125 45) (size 0.2 0.875) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 11 +3V3))
    (pad 22 smd roundrect (at -1.25 4.4125 45) (size 0.2 0.875) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 5 GND))
    (pad 23 smd roundrect (at -0.75 4.4125 45) (size 0.2 0.875) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 53 /3V_A10))
    (pad 24 smd roundrect (at -0.25 4.4125 45) (size 0.2 0.875) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 52 /3V_A11))
    (pad 25 smd roundrect (at 0.25 4.4125 45) (size 0.2 0.875) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 48 /3V_A12))
    (pad 26 smd roundrect (at 0.75 4.4125 45) (size 0.2 0.875) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 49 /3V_A13))
    (pad 27 smd roundrect (at 1.25 4.4125 45) (size 0.2 0.875) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 50 /3V_A14))
    (pad 28 smd roundrect (at 1.75 4.4125 45) (size 0.2 0.875) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 51 /3V_A15))
    (pad 29 smd roundrect (at 2.25 4.4125 45) (size 0.2 0.875) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
    (pad 30 smd roundrect (at 2.75 4.4125 45) (size 0.2 0.875) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
    (pad 31 smd roundrect (at 3.25 4.4125 45) (size 0.2 0.875) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
    (pad 32 smd roundrect (at 3.75 4.4125 45) (size 0.2 0.875) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 60 /3V_CLK))
    (pad 33 smd roundrect (at 4.4125 3.75 45) (size 0.875 0.2) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 5 GND))
    (pad 34 smd roundrect (at 4.4125 3.25 45) (size 0.875 0.2) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 11 +3V3))
    (pad 35 smd roundrect (at 4.4125 2.75 45) (size 0.875 0.2) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 37 /3V_D0))
    (pad 36 smd roundrect (at 4.4125 2.25 45) (size 0.875 0.2) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 38 /3V_D1))
    (pad 37 smd roundrect (at 4.4125 1.75 45) (size 0.875 0.2) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 39 /3V_D2))
    (pad 38 smd roundrect (at 4.4125 1.25 45) (size 0.875 0.2) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 40 /3V_D3))
    (pad 39 smd roundrect (at 4.4125 0.75 45) (size 0.875 0.2) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 63 /3V_CS))
    (pad 40 smd roundrect (at 4.4125 0.25 45) (size 0.875 0.2) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 75 "Net-(TP44-Pad1)"))
    (pad 41 smd roundrect (at 4.4125 -0.25 45) (size 0.875 0.2) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 41 /3V_D4))
    (pad 42 smd roundrect (at 4.4125 -0.75 45) (size 0.875 0.2) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 42 /3V_D5))
    (pad 43 smd roundrect (at 4.4125 -1.25 45) (size 0.875 0.2) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 43 /3V_D6))
    (pad 44 smd roundrect (at 4.4125 -1.75 45) (size 0.875 0.2) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 44 /3V_D7))
    (pad 45 smd roundrect (at 4.4125 -2.25 45) (size 0.875 0.2) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 68 /USB_D-))
    (pad 46 smd roundrect (at 4.4125 -2.75 45) (size 0.875 0.2) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 69 /USB_D+))
    (pad 47 smd roundrect (at 4.4125 -3.25 45) (size 0.875 0.2) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 5 GND))
    (pad 48 smd roundrect (at 4.4125 -3.75 45) (size 0.875 0.2) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 11 +3V3))
    (pad 49 smd roundrect (at 3.75 -4.4125 45) (size 0.2 0.875) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 45 /GB_RESET))
    (pad 50 smd roundrect (at 3.25 -4.4125 45) (size 0.2 0.875) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 71 /LED))
    (pad 51 smd roundrect (at 2.75 -4.4125 45) (size 0.2 0.875) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
    (pad 52 smd roundrect (at 2.25 -4.4125 45) (size 0.2 0.875) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 46 /SAMD_RESET))
    (pad 53 smd roundrect (at 1.75 -4.4125 45) (size 0.2 0.875) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 74 "Net-(C14-Pad2)"))
    (pad 54 smd roundrect (at 1.25 -4.4125 45) (size 0.2 0.875) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 5 GND))
    (pad 55 smd roundrect (at 0.75 -4.4125 45) (size 0.2 0.875) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
    (pad 56 smd roundrect (at 0.25 -4.4125 45) (size 0.2 0.875) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 11 +3V3))
    (pad 57 smd roundrect (at -0.25 -4.4125 45) (size 0.2 0.875) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 13 /SWCLK))
    (pad 58 smd roundrect (at -0.75 -4.4125 45) (size 0.2 0.875) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 12 /SWDIO))
    (pad 59 smd roundrect (at -1.25 -4.4125 45) (size 0.2 0.875) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 73 /SWO))
    (pad 60 smd roundrect (at -1.75 -4.4125 45) (size 0.2 0.875) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 78 /MIDI_OUT))
    (pad 61 smd roundrect (at -2.25 -4.4125 45) (size 0.2 0.875) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 64 /3V_A0))
    (pad 62 smd roundrect (at -2.75 -4.4125 45) (size 0.2 0.875) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 65 /3V_A1))
    (pad 63 smd roundrect (at -3.25 -4.4125 45) (size 0.2 0.875) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 66 /3V_A2))
    (pad 64 smd roundrect (at -3.75 -4.4125 45) (size 0.2 0.875) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 67 /3V_A3))
    (model ${KISYS3DMOD}/Package_DFN_QFN.3dshapes/QFN-64-1EP_9x9mm_P0.5mm_EP4.7x4.7mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Diode_SMD:D_SOD-123 (layer F.Cu) (tedit 58645DC7)
    (at 126.7165 48.4472)
    (descr SOD-123)
    (tags SOD-123)
    (attr smd)
    (fp_text reference D1 (at 0 -2) (layer F.SilkS))
    (fp_text value MBR120 (at 0 2.1) (layer F.Fab))
    (fp_text user %R (at 0 -2) (layer F.Fab))
    (pad 2 smd rect (at 1.65 0) (size 0.9 1.2) (layers F.Cu F.Paste F.Mask)
      (net 47 VBUS))
    (pad 1 smd rect (at -1.65 0) (size 0.9 1.2) (layers F.Cu F.Paste F.Mask)
      (net 1 +5V))
    (model ${KISYS3DMOD}/Diode_SMD.3dshapes/D_SOD-123.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Diode_SMD:D_SOD-123 (layer F.Cu) (tedit 58645DC7)
    (at 101.473 74.041 270)
    (descr SOD-123)
    (tags SOD-123)
    (attr smd)
    (fp_text reference D2 (at 3.547 -0.472 270) (layer F.SilkS))
    (fp_text value MBR120 (at 0 2.1 270) (layer F.Fab))
    (fp_text user %R (at 0 -2 270) (layer F.Fab))
    (pad 1 smd rect (at -1.65 0 270) (size 0.9 1.2) (layers F.Cu F.Paste F.Mask)
      (net 1 +5V))
    (pad 2 smd rect (at 1.65 0 270) (size 0.9 1.2) (layers F.Cu F.Paste F.Mask)
      (net 72 +BATT))
    (model ${KISYS3DMOD}/Diode_SMD.3dshapes/D_SOD-123.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_SO:TSSOP-20_4.4x6.5mm_P0.65mm (layer F.Cu) (tedit 5A02F25C)
    (at 133.945 80.738 90)
    (descr "20-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [TSSOP] (see Microchip Packaging Specification 00000049BS.pdf)")
    (tags "SSOP 0.65")
    (attr smd)
    (fp_text reference U3 (at 0 4.519 180) (layer F.SilkS))
    (fp_text value 74LVC244 (at 0 4.3 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd rect (at -2.95 -2.925 90) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 5 GND))
    (pad 2 smd rect (at -2.95 -2.275 90) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 30 /A12))
    (pad 3 smd rect (at -2.95 -1.625 90) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask))
    (pad 4 smd rect (at -2.95 -0.975 90) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 31 /A13))
    (pad 5 smd rect (at -2.95 -0.325 90) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask))
    (pad 6 smd rect (at -2.95 0.325 90) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 32 /A14))
    (pad 7 smd rect (at -2.95 0.975 90) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask))
    (pad 8 smd rect (at -2.95 1.625 90) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 33 /A15))
    (pad 9 smd rect (at -2.95 2.275 90) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask))
    (pad 10 smd rect (at -2.95 2.925 90) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 5 GND))
    (pad 11 smd rect (at 2.95 2.925 90) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 5 GND))
    (pad 12 smd rect (at 2.95 2.275 90) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 51 /3V_A15))
    (pad 13 smd rect (at 2.95 1.625 90) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 5 GND))
    (pad 14 smd rect (at 2.95 0.975 90) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 50 /3V_A14))
    (pad 15 smd rect (at 2.95 0.325 90) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 5 GND))
    (pad 16 smd rect (at 2.95 -0.325 90) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 49 /3V_A13))
    (pad 17 smd rect (at 2.95 -0.975 90) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 5 GND))
    (pad 18 smd rect (at 2.95 -1.625 90) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 48 /3V_A12))
    (pad 19 smd rect (at 2.95 -2.275 90) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 11 +3V3))
    (pad 20 smd rect (at 2.95 -2.925 90) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 11 +3V3))
    (model ${KISYS3DMOD}/Package_SO.3dshapes/TSSOP-20_4.4x6.5mm_P0.65mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_SO:TSSOP-20_4.4x6.5mm_P0.65mm (layer F.Cu) (tedit 5A02F25C)
    (at 115.824 82.296)
    (descr "20-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [TSSOP] (see Microchip Packaging Specification 00000049BS.pdf)")
    (tags "SSOP 0.65")
    (attr smd)
    (fp_text reference U4 (at -0.0295 4.2545) (layer F.SilkS))
    (fp_text value 74LVC244 (at 0 4.3) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 20 smd rect (at 2.95 -2.925) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 11 +3V3))
    (pad 19 smd rect (at 2.95 -2.275) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 5 GND))
    (pad 18 smd rect (at 2.95 -1.625) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 56 /3V_A7))
    (pad 17 smd rect (at 2.95 -0.975) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 29 /A11))
    (pad 16 smd rect (at 2.95 -0.325) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 57 /3V_A6))
    (pad 15 smd rect (at 2.95 0.325) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 28 /A10))
    (pad 14 smd rect (at 2.95 0.975) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 58 /3V_A5))
    (pad 13 smd rect (at 2.95 1.625) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 27 /A9))
    (pad 12 smd rect (at 2.95 2.275) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 59 /3V_A4))
    (pad 11 smd rect (at 2.95 2.925) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 26 /A8))
    (pad 10 smd rect (at -2.95 2.925) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 5 GND))
    (pad 9 smd rect (at -2.95 2.275) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 55 /3V_A8))
    (pad 8 smd rect (at -2.95 1.625) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 22 /A4))
    (pad 7 smd rect (at -2.95 0.975) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 54 /3V_A9))
    (pad 6 smd rect (at -2.95 0.325) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 23 /A5))
    (pad 5 smd rect (at -2.95 -0.325) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 53 /3V_A10))
    (pad 4 smd rect (at -2.95 -0.975) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 24 /A6))
    (pad 3 smd rect (at -2.95 -1.625) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 52 /3V_A11))
    (pad 2 smd rect (at -2.95 -2.275) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 25 /A7))
    (pad 1 smd rect (at -2.95 -2.925) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 5 GND))
    (model ${KISYS3DMOD}/Package_SO.3dshapes/TSSOP-20_4.4x6.5mm_P0.65mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_SO:TSSOP-20_4.4x6.5mm_P0.65mm (layer F.Cu) (tedit 5A02F25C)
    (at 105.664 82.296)
    (descr "20-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [TSSOP] (see Microchip Packaging Specification 00000049BS.pdf)")
    (tags "SSOP 0.65")
    (attr smd)
    (fp_text reference U6 (at 0.161 4.2545) (layer F.SilkS))
    (fp_text value 74LVC244 (at 0 4.3) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd rect (at -2.95 -2.925) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 5 GND))
    (pad 2 smd rect (at -2.95 -2.275) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 14 /CLK))
    (pad 3 smd rect (at -2.95 -1.625) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 64 /3V_A0))
    (pad 4 smd rect (at -2.95 -0.975) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 15 /WR))
    (pad 5 smd rect (at -2.95 -0.325) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 65 /3V_A1))
    (pad 6 smd rect (at -2.95 0.325) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 16 /RD))
    (pad 7 smd rect (at -2.95 0.975) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 66 /3V_A2))
    (pad 8 smd rect (at -2.95 1.625) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 17 /CS))
    (pad 9 smd rect (at -2.95 2.275) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 67 /3V_A3))
    (pad 10 smd rect (at -2.95 2.925) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 5 GND))
    (pad 11 smd rect (at 2.95 2.925) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 21 /A3))
    (pad 12 smd rect (at 2.95 2.275) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 63 /3V_CS))
    (pad 13 smd rect (at 2.95 1.625) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 20 /A2))
    (pad 14 smd rect (at 2.95 0.975) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 62 /3V_RD))
    (pad 15 smd rect (at 2.95 0.325) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 19 /A1))
    (pad 16 smd rect (at 2.95 -0.325) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 61 /3V_WR))
    (pad 17 smd rect (at 2.95 -0.975) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 18 /A0))
    (pad 18 smd rect (at 2.95 -1.625) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 60 /3V_CLK))
    (pad 19 smd rect (at 2.95 -2.275) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 5 GND))
    (pad 20 smd rect (at 2.95 -2.925) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask)
      (net 11 +3V3))
    (model ${KISYS3DMOD}/Package_SO.3dshapes/TSSOP-20_4.4x6.5mm_P0.65mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_SO:TSSOP-24_4.4x7.8mm_P0.65mm (layer F.Cu) (tedit 5A02F25C)
    (at 139.446 54.229 180)
    (descr "TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4.4 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot355-1_po.pdf)")
    (tags "SSOP 0.65")
    (attr smd)
    (fp_text reference U5 (at -4.606 0 180) (layer F.SilkS))
    (fp_text value 74x4245 (at 0 4.95 180) (layer F.Fab))
    (fp_text user %R (at 0 0 180) (layer F.Fab))
    (pad 1 smd rect (at -2.85 -3.575 180) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 1 +5V))
    (pad 2 smd rect (at -2.85 -2.925 180) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 36 /DIR))
    (pad 3 smd rect (at -2.85 -2.275 180) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 2 /D0))
    (pad 4 smd rect (at -2.85 -1.625 180) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 3 /D1))
    (pad 5 smd rect (at -2.85 -0.975 180) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 4 /D2))
    (pad 6 smd rect (at -2.85 -0.325 180) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 6 /D3))
    (pad 7 smd rect (at -2.85 0.325 180) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 7 /D4))
    (pad 8 smd rect (at -2.85 0.975 180) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 8 /D5))
    (pad 9 smd rect (at -2.85 1.625 180) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 9 /D6))
    (pad 10 smd rect (at -2.85 2.275 180) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 10 /D7))
    (pad 11 smd rect (at -2.85 2.925 180) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 5 GND))
    (pad 12 smd rect (at -2.85 3.575 180) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 5 GND))
    (pad 13 smd rect (at 2.85 3.575 180) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 5 GND))
    (pad 14 smd rect (at 2.85 2.925 180) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 44 /3V_D7))
    (pad 15 smd rect (at 2.85 2.275 180) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 43 /3V_D6))
    (pad 16 smd rect (at 2.85 1.625 180) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 42 /3V_D5))
    (pad 17 smd rect (at 2.85 0.975 180) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 41 /3V_D4))
    (pad 18 smd rect (at 2.85 0.325 180) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 40 /3V_D3))
    (pad 19 smd rect (at 2.85 -0.325 180) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 39 /3V_D2))
    (pad 20 smd rect (at 2.85 -0.975 180) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 38 /3V_D1))
    (pad 21 smd rect (at 2.85 -1.625 180) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 37 /3V_D0))
    (pad 22 smd rect (at 2.85 -2.275 180) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 35 /DATA_OE))
    (pad 23 smd rect (at 2.85 -2.925 180) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 11 +3V3))
    (pad 24 smd rect (at 2.85 -3.575 180) (size 1.1 0.4) (layers F.Cu F.Paste F.Mask)
      (net 11 +3V3))
    (model ${KISYS3DMOD}/Package_SO.3dshapes/TSSOP-24_4.4x7.8mm_P0.65mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_TO_SOT_SMD:SOT-23-5 (layer F.Cu) (tedit 5A02FF57)
    (at 104.682 71.12)
    (descr "5-pin SOT23 package")
    (tags SOT-23-5)
    (attr smd)
    (fp_text reference U7 (at 1.0214 -2.3495) (layer F.SilkS))
    (fp_text value AP2204K-3.3 (at 0 2.9) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd rect (at -1.1 -0.95) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask)
      (net 1 +5V))
    (pad 2 smd rect (at -1.1 0) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask)
      (net 5 GND))
    (pad 3 smd rect (at -1.1 0.95) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask)
      (net 1 +5V))
    (pad 4 smd rect (at 1.1 0.95) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask))
    (pad 5 smd rect (at 1.1 -0.95) (size 1.06 0.65) (layers F.Cu F.Paste F.Mask)
      (net 11 +3V3))
    (model ${KISYS3DMOD}/Package_TO_SOT_SMD.3dshapes/SOT-23-5.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 120.65 50.546 270)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R1 (at -0.889 -1.43 270) (layer F.SilkS))
    (fp_text value 10k (at 0 1.43 270) (layer F.Fab))
    (fp_text user %R (at 0 0 270) (layer F.Fab))
    (pad 2 smd roundrect (at 0.874999 0 270) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 46 /SAMD_RESET))
    (pad 1 smd roundrect (at -0.874999 0 270) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 11 +3V3))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 137.287 65.532 270)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R2 (at -2.54 -0.034 270) (layer F.SilkS))
    (fp_text value 10k (at 0 1.43 270) (layer F.Fab))
    (fp_text user %R (at 0 0 270) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0 270) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 11 +3V3))
    (pad 2 smd roundrect (at 0.875 0 270) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 45 /GB_RESET))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 137.668 61.214)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R3 (at -2.6965 -0.0635) (layer F.SilkS))
    (fp_text value 10k (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 35 /DATA_OE))
    (pad 1 smd roundrect (at -0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 11 +3V3))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 133.638 44.831 270)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R4 (at 0 -1.43 270) (layer F.SilkS))
    (fp_text value 1k (at 0 1.43 270) (layer F.Fab))
    (fp_text user %R (at 0 0 270) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0 270) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 70 "Net-(D3-Pad1)"))
    (pad 2 smd roundrect (at 0.875 0 270) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 71 /LED))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 117.094 61.4045 315)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C1 (at -0.046315 1.47849 315) (layer F.SilkS))
    (fp_text value 0.1uF (at 0 1.43 315) (layer F.Fab))
    (fp_text user %R (at 0 0 315) (layer F.Fab))
    (pad 1 smd roundrect (at -0.874999 0 315) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 5 GND))
    (pad 2 smd roundrect (at 0.874999 0 315) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 11 +3V3))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 118.3526 60.1312 135)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C2 (at 2.580233 -0.155563 135) (layer F.SilkS))
    (fp_text value 0.1uF (at 0 1.43 135) (layer F.Fab))
    (fp_text user %R (at 0 0 135) (layer F.Fab))
    (pad 2 smd roundrect (at 0.874999 0 135) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 5 GND))
    (pad 1 smd roundrect (at -0.874999 0 135) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 74 "Net-(C14-Pad2)"))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 118.237 74.041 45)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C3 (at 0 -1.43 45) (layer F.SilkS))
    (fp_text value 0.1uF (at 0 1.43 45) (layer F.Fab))
    (fp_text user %R (at 0 0 45) (layer F.Fab))
    (pad 1 smd roundrect (at -0.874999 0 45) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 5 GND))
    (pad 2 smd roundrect (at 0.874999 0 45) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 11 +3V3))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 127.889 75.565 45)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C4 (at 2.628316 0.113844 45) (layer F.SilkS))
    (fp_text value 0.1uF (at 0 1.43 45) (layer F.Fab))
    (fp_text user %R (at 0 0 45) (layer F.Fab))
    (pad 2 smd roundrect (at 0.874999 0 45) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 11 +3V3))
    (pad 1 smd roundrect (at -0.874999 0 45) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 5 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 133.3205 67.31 90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C5 (at 2.54 0 90) (layer F.SilkS))
    (fp_text value 0.1uF (at 0 1.43 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0 90) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 5 GND))
    (pad 2 smd roundrect (at 0.875 0 90) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 11 +3V3))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 127.923 58.9915 225)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C6 (at 1.212335 1.39194 225) (layer F.SilkS))
    (fp_text value 0.1uF (at 0 1.43 225) (layer F.Fab))
    (fp_text user %R (at 0 0 225) (layer F.Fab))
    (pad 2 smd roundrect (at 0.874999 0 225) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 11 +3V3))
    (pad 1 smd roundrect (at -0.874999 0 225) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 5 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 141.605 59.563 180)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C7 (at 0 -1.43 180) (layer F.SilkS))
    (fp_text value 0.1uF (at 0 1.43 180) (layer F.Fab))
    (fp_text user %R (at 0 0 180) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 +5V))
    (pad 2 smd roundrect (at 0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 5 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 137.541 59.563)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C8 (at -2.76 0) (layer F.SilkS))
    (fp_text value 0.1uF (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 5 GND))
    (pad 1 smd roundrect (at -0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 11 +3V3))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 129.445 80.137 270)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C9 (at -2.54 -0.0655 270) (layer F.SilkS))
    (fp_text value 0.1uF (at 0 1.43 270) (layer F.Fab))
    (fp_text user %R (at 0 0 270) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0 270) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 11 +3V3))
    (pad 2 smd roundrect (at 0.875 0 270) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 5 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 104.682 73.914 180)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C10 (at 3.1115 -0.0635 180) (layer F.SilkS) hide)
    (fp_text value 1uF (at 0 1.43 180) (layer F.Fab))
    (fp_text user %R (at 0 0 180) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 1 +5V))
    (pad 1 smd roundrect (at -0.875 0 180) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 5 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 111.887 77.724)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C11 (at 3.0185 0.0635) (layer F.SilkS))
    (fp_text value 0.1uF (at 0 1.43) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 11 +3V3))
    (pad 2 smd roundrect (at 0.875 0) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 5 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 121.5022 79.0288 45)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C12 (at 0 -1.43 45) (layer F.SilkS))
    (fp_text value 0.1uF (at 0 1.43 45) (layer F.Fab))
    (fp_text user %R (at 0 0 45) (layer F.Fab))
    (pad 2 smd roundrect (at 0.874999 0 45) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 5 GND))
    (pad 1 smd roundrect (at -0.874999 0 45) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 11 +3V3))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 107.476 71.0565 90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C13 (at 1.016 1.524 90) (layer F.SilkS))
    (fp_text value 1uF (at 0 1.43 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0 90) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 5 GND))
    (pad 2 smd roundrect (at 0.875 0 90) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 11 +3V3))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5C843A9A)
    (at 120.845 57.638 315)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C15 (at -3.108088 0.6219) (layer F.SilkS))
    (fp_text value 1uF (at 0 1.43 315) (layer F.Fab))
    (fp_text user %R (at 0 0 315) (layer F.Fab))
    (pad 1 smd roundrect (at -0.874999 0 315) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 5 GND))
    (pad 2 smd roundrect (at 0.874999 0 315) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 74 "Net-(C14-Pad2)"))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module adafruit:4UCONN_19269_TRS (layer F.Cu) (tedit 5C84387E)
    (at 116.366 37.846 270)
    (descr "<br>\n4UCONN: 19269\n<br>\n4UCONN: 19268\n<br>\n4UCONN: 19267\n<br>\nhttp://www.4uconnector.com/online/Itemadrawing.asp?fldseries=19267&seriesno_a=18")
    (fp_text reference J6 (at 1.9 -0.4 270) (layer F.SilkS) hide)
    (fp_text value "MIDI OUT" (at 4.445 4.445 270) (layer F.Fab))
    (pad "" np_thru_hole circle (at 10.5 0 270) (size 2 2) (drill 2) (layers *.Cu *.Mask))
    (pad "" np_thru_hole circle (at 3.5 0 270) (size 2 2) (drill 2) (layers *.Cu *.Mask))
    (pad RN smd rect (at 1.5 -3.5 270) (size 1.2 2.5) (layers F.Cu F.Paste F.Mask)
      (solder_mask_margin 0.0508))
    (pad R smd rect (at 4.3 -3.5 270) (size 2 2.5) (layers F.Cu F.Paste F.Mask)
      (net 77 "Net-(J6-PadR)") (solder_mask_margin 0.0508))
    (pad TN smd rect (at 15.8 -0.75) (size 2 2.5) (layers F.Cu F.Paste F.Mask)
      (solder_mask_margin 0.0508))
    (pad T smd rect (at 11.7 3.5 270) (size 2 2.5) (layers F.Cu F.Paste F.Mask)
      (net 79 "Net-(J6-PadT)") (solder_mask_margin 0.0508))
    (pad S smd rect (at 2.5 3.5 270) (size 2 2.5) (layers F.Cu F.Paste F.Mask)
      (net 5 GND) (solder_mask_margin 0.0508))
  )
  (module Diode_SMD:D_SOD-123 (layer F.Cu) (tedit 58645DC7)
    (at 110.1738 57.7436 270)
    (descr SOD-123)
    (tags SOD-123)
    (attr smd)
    (fp_text reference D4 (at 3.429 0 270) (layer F.SilkS))
    (fp_text value 1N4148W (at 0 2.1 270) (layer F.Fab))
    (fp_text user %R (at 0 -2 270) (layer F.Fab))
    (pad 1 smd rect (at -1.65 0 270) (size 0.9 1.2) (layers F.Cu F.Paste F.Mask)
      (net 80 "Net-(D4-Pad1)"))
    (pad 2 smd rect (at 1.65 0 270) (size 0.9 1.2) (layers F.Cu F.Paste F.Mask)
      (net 81 "Net-(D4-Pad2)"))
    (model ${KISYS3DMOD}/Diode_SMD.3dshapes/D_SOD-123.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module adafruit:4UCONN_19269_TRS (layer F.Cu) (tedit 5C84387A)
    (at 105.698 37.846 270)
    (descr "<br>\n4UCONN: 19269\n<br>\n4UCONN: 19268\n<br>\n4UCONN: 19267\n<br>\nhttp://www.4uconnector.com/online/Itemadrawing.asp?fldseries=19267&seriesno_a=18")
    (fp_text reference J5 (at 1.9 -0.4 270) (layer F.SilkS) hide)
    (fp_text value "MIDI IN" (at 4.445 4.445 270) (layer F.Fab))
    (pad S smd rect (at 2.5 3.5 270) (size 2 2.5) (layers F.Cu F.Paste F.Mask)
      (net 82 /SHIELD) (solder_mask_margin 0.0508))
    (pad T smd rect (at 11.7 3.5 270) (size 2 2.5) (layers F.Cu F.Paste F.Mask)
      (net 81 "Net-(D4-Pad2)") (solder_mask_margin 0.0508))
    (pad TN smd rect (at 15.8 -0.75) (size 2 2.5) (layers F.Cu F.Paste F.Mask)
      (solder_mask_margin 0.0508))
    (pad R smd rect (at 4.3 -3.5 270) (size 2 2.5) (layers F.Cu F.Paste F.Mask)
      (net 84 "Net-(J5-PadR)") (solder_mask_margin 0.0508))
    (pad RN smd rect (at 1.5 -3.5 270) (size 1.2 2.5) (layers F.Cu F.Paste F.Mask)
      (solder_mask_margin 0.0508))
    (pad "" np_thru_hole circle (at 3.5 0 270) (size 2 2) (drill 2) (layers *.Cu *.Mask))
    (pad "" np_thru_hole circle (at 10.5 0 270) (size 2 2) (drill 2) (layers *.Cu *.Mask))
  )
  (module Button_Switch_SMD:SW_SPST_KMR2 (layer F.Cu) (tedit 5C843068)
    (at 146.9095 45.6565 90)
    (descr "CK components KMR2 tactile switch http://www.ckswitches.com/media/1479/kmr2.pdf")
    (tags "tactile switch kmr2")
    (attr smd)
    (fp_text reference SW1 (at 3.302 -0.254 180) (layer F.SilkS) hide)
    (fp_text value SW_Push (at 0 2.55 90) (layer F.Fab))
    (fp_text user %R (at 0 -2.45 90) (layer F.Fab))
    (pad 1 smd rect (at -2.05 -0.8 180) (size 0.9 1) (layers F.Cu F.Paste F.Mask)
      (net 46 /SAMD_RESET))
    (pad 2 smd rect (at -2.05 0.8 180) (size 0.9 1) (layers F.Cu F.Paste F.Mask)
      (net 5 GND))
    (pad 1 smd rect (at 2.05 -0.8 180) (size 0.9 1) (layers F.Cu F.Paste F.Mask)
      (net 46 /SAMD_RESET))
    (pad 2 smd rect (at 2.05 0.8 180) (size 0.9 1) (layers F.Cu F.Paste F.Mask)
      (net 5 GND))
    (model ${KISYS3DMOD}/Button_Switch_SMD.3dshapes/SW_SPST_KMR2.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 113.064 65.786 90)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C17 (at 0.1905 1.524 90) (layer F.SilkS))
    (fp_text value C_Small (at 0 1.43 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0 90) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 11 +3V3))
    (pad 2 smd roundrect (at 0.875 0 90) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 5 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 121.446 56.0705 135)
    (descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C16 (at -3.008386 -0.314309 135) (layer F.SilkS))
    (fp_text value C_Small (at 0 1.43 135) (layer F.Fab))
    (fp_text user %R (at 0 0 135) (layer F.Fab))
    (pad 1 smd roundrect (at -0.874999 0 135) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 46 /SAMD_RESET))
    (pad 2 smd roundrect (at 0.874999 0 135) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 5 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 110.0795 53.34 90)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R5 (at 2.667 0 90) (layer F.SilkS))
    (fp_text value 220 (at 0 1.43 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0 90) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 84 "Net-(J5-PadR)"))
    (pad 1 smd roundrect (at -0.875 0 90) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 80 "Net-(D4-Pad1)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 120.6386 46.974 90)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R6 (at 0 1.524 90) (layer F.SilkS))
    (fp_text value 51 (at 0 1.43 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd roundrect (at -0.875 0 90) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 11 +3V3))
    (pad 2 smd roundrect (at 0.875 0 90) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 77 "Net-(J6-PadR)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer F.Cu) (tedit 5B301BBD)
    (at 112.2566 53.4256 90)
    (descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R7 (at 0 1.4605 90) (layer F.SilkS))
    (fp_text value 51 (at 0 1.43 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 0.875 0 90) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 79 "Net-(J6-PadT)"))
    (pad 1 smd roundrect (at -0.875 0 90) (size 1.05 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
      (net 78 /MIDI_OUT))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0603_1608Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module gameboy:Cartridge (layer F.Cu) (tedit 5B6F11B9)
    (at 123.445 96.988)
    (fp_text reference U1 (at 0 0.5) (layer F.SilkS) hide)
    (fp_text value CARTRIDGE (at 0 -0.5) (layer F.Fab))
    (pad 1 smd rect (at -22 -2.54) (size 1.4 6) (drill (offset -0.2 0)) (layers F.Cu F.Mask)
      (net 72 +BATT))
    (pad 2 smd rect (at -20.5 -2.5) (size 1 6) (layers F.Cu F.Mask)
      (net 14 /CLK))
    (pad 3 smd rect (at -19 -2.5) (size 1 6) (layers F.Cu F.Mask)
      (net 15 /WR))
    (pad 4 smd rect (at -17.5 -2.5) (size 1 6) (layers F.Cu F.Mask)
      (net 16 /RD))
    (pad 5 smd rect (at -16 -2.5) (size 1 6) (layers F.Cu F.Mask)
      (net 17 /CS))
    (pad 6 smd rect (at -14.5 -2.5) (size 1 6) (layers F.Cu F.Mask)
      (net 18 /A0))
    (pad 7 smd rect (at -13 -2.5) (size 1 6) (layers F.Cu F.Mask)
      (net 19 /A1))
    (pad 8 smd rect (at -11.5 -2.5) (size 1 6) (layers F.Cu F.Mask)
      (net 20 /A2))
    (pad 9 smd rect (at -10 -2.5) (size 1 6) (layers F.Cu F.Mask)
      (net 21 /A3))
    (pad 10 smd rect (at -8.5 -2.5) (size 1 6) (layers F.Cu F.Mask)
      (net 22 /A4))
    (pad 11 smd rect (at -7 -2.5) (size 1 6) (layers F.Cu F.Mask)
      (net 23 /A5))
    (pad 12 smd rect (at -5.5 -2.5) (size 1 6) (layers F.Cu F.Mask)
      (net 24 /A6))
    (pad 13 smd rect (at -4 -2.5) (size 1 6) (layers F.Cu F.Mask)
      (net 25 /A7))
    (pad 14 smd rect (at -2.5 -2.5) (size 1 6) (layers F.Cu F.Mask)
      (net 26 /A8))
    (pad 15 smd rect (at -1 -2.5) (size 1 6) (layers F.Cu F.Mask)
      (net 27 /A9))
    (pad 16 smd rect (at 0.5 -2.5) (size 1 6) (layers F.Cu F.Mask)
      (net 28 /A10))
    (pad 17 smd rect (at 2 -2.5) (size 1 6) (layers F.Cu F.Mask)
      (net 29 /A11))
    (pad 18 smd rect (at 3.5 -2.5) (size 1 6) (layers F.Cu F.Mask)
      (net 30 /A12))
    (pad 19 smd rect (at 5 -2.5) (size 1 6) (layers F.Cu F.Mask)
      (net 31 /A13))
    (pad 20 smd rect (at 6.5 -2.5) (size 1 6) (layers F.Cu F.Mask)
      (net 32 /A14))
    (pad 21 smd rect (at 8 -2.5) (size 1 6) (layers F.Cu F.Mask)
      (net 33 /A15))
    (pad 22 smd rect (at 9.5 -2.5) (size 1 6) (layers F.Cu F.Mask)
      (net 2 /D0))
    (pad 23 smd rect (at 11 -2.5) (size 1 6) (layers F.Cu F.Mask)
      (net 3 /D1))
    (pad 24 smd rect (at 12.5 -2.5) (size 1 6) (layers F.Cu F.Mask)
      (net 4 /D2))
    (pad 25 smd rect (at 14 -2.5) (size 1 6) (layers F.Cu F.Mask)
      (net 6 /D3))
    (pad 26 smd rect (at 15.5 -2.5) (size 1 6) (layers F.Cu F.Mask)
      (net 7 /D4))
    (pad 27 smd rect (at 17 -2.5) (size 1 6) (layers F.Cu F.Mask)
      (net 8 /D5))
    (pad 28 smd rect (at 18.5 -2.5) (size 1 6) (layers F.Cu F.Mask)
      (net 9 /D6))
    (pad 29 smd rect (at 20 -2.5) (size 1 6) (layers F.Cu F.Mask)
      (net 10 /D7))
    (pad 30 smd rect (at 21.5 -2.5) (size 1 6) (layers F.Cu F.Mask)
      (net 34 /RESET))
    (pad 31 smd rect (at 23 -2.5) (size 1 6) (layers F.Cu F.Mask)
      (net 83 /AUD))
    (pad 32 smd rect (at 24.5 -2.5) (size 1.4 6) (drill (offset 0.2 0)) (layers F.Cu F.Mask)
      (net 5 GND))
  )
  (module "gameboy:Test Point" (layer F.Cu) (tedit 5B6F0FD6)
    (at 110.445 87.738)
    (fp_text reference TP7 (at 2.75 0) (layer F.SilkS) hide)
    (fp_text value Test_Point (at 0 -0.5) (layer F.Fab) hide)
    (pad 1 smd rect (at 0 0) (size 1 1) (layers F.Cu F.Mask)
      (net 19 /A1))
  )
  (module "gameboy:Test Point" (layer F.Cu) (tedit 5B6F0FD6)
    (at 120.945 87.738)
    (fp_text reference TP14 (at 2.75 0) (layer F.SilkS) hide)
    (fp_text value Test_Point (at 0 -0.5) (layer F.Fab) hide)
    (pad 1 smd rect (at 0 0) (size 1 1) (layers F.Cu F.Mask)
      (net 26 /A8))
  )
  (module "gameboy:Test Point" (layer F.Cu) (tedit 5B6F0FD6)
    (at 111.945 87.738)
    (fp_text reference TP8 (at 2.75 0) (layer F.SilkS) hide)
    (fp_text value Test_Point (at 0 -0.5) (layer F.Fab) hide)
    (pad 1 smd rect (at 0 0) (size 1 1) (layers F.Cu F.Mask)
      (net 20 /A2))
  )
  (module "gameboy:Test Point" (layer F.Cu) (tedit 5B6F0FD6)
    (at 108.945 87.738)
    (fp_text reference TP6 (at 2.75 0) (layer F.SilkS) hide)
    (fp_text value Test_Point (at 0 -0.5) (layer F.Fab) hide)
    (pad 1 smd rect (at 0 0) (size 1 1) (layers F.Cu F.Mask)
      (net 18 /A0))
  )
  (module "gameboy:Test Point" (layer F.Cu) (tedit 5B6F0FD6)
    (at 107.445 87.738)
    (fp_text reference TP5 (at 2.75 0) (layer F.SilkS) hide)
    (fp_text value Test_Point (at 0 -0.5) (layer F.Fab) hide)
    (pad 1 smd rect (at 0 0) (size 1 1) (layers F.Cu F.Mask)
      (net 17 /CS))
  )
  (module "gameboy:Test Point" (layer F.Cu) (tedit 5B6F0FD6)
    (at 105.945 87.738)
    (fp_text reference TP4 (at 2.75 0) (layer F.SilkS) hide)
    (fp_text value Test_Point (at 0 -0.5) (layer F.Fab) hide)
    (pad 1 smd rect (at 0 0) (size 1 1) (layers F.Cu F.Mask)
      (net 16 /RD))
  )
  (module "gameboy:Test Point" (layer F.Cu) (tedit 5B6F0FD6)
    (at 104.445 87.738)
    (fp_text reference TP3 (at 2.75 0) (layer F.SilkS) hide)
    (fp_text value Test_Point (at 0 -0.5) (layer F.Fab) hide)
    (pad 1 smd rect (at 0 0) (size 1 1) (layers F.Cu F.Mask)
      (net 15 /WR))
  )
  (module "gameboy:Test Point" (layer F.Cu) (tedit 5B6F0FD6)
    (at 102.945 87.738)
    (fp_text reference TP2 (at 2.75 0) (layer F.SilkS) hide)
    (fp_text value Test_Point (at 0 -0.5) (layer F.Fab) hide)
    (pad 1 smd rect (at 0 0) (size 1 1) (layers F.Cu F.Mask)
      (net 14 /CLK))
  )
  (module "gameboy:Test Point" (layer F.Cu) (tedit 5B6F0FD6)
    (at 101.219 87.738)
    (fp_text reference TP1 (at 2.75 0) (layer F.SilkS) hide)
    (fp_text value Test_Point (at 0 -0.5) (layer F.Fab))
    (pad 1 smd rect (at 0 0) (size 1 1) (layers F.Cu F.Mask)
      (net 72 +BATT))
  )
  (module "gameboy:Test Point" (layer F.Cu) (tedit 5B6F0FD6)
    (at 122.445 87.738)
    (fp_text reference TP15 (at 2.75 0) (layer F.SilkS) hide)
    (fp_text value Test_Point (at 0 -0.5) (layer F.Fab) hide)
    (pad 1 smd rect (at 0 0) (size 1 1) (layers F.Cu F.Mask)
      (net 27 /A9))
  )
  (module "gameboy:Test Point" (layer F.Cu) (tedit 5B6F0FD6)
    (at 123.945 87.738)
    (fp_text reference TP16 (at 2.75 0) (layer F.SilkS) hide)
    (fp_text value Test_Point (at 0 -0.5) (layer F.Fab) hide)
    (pad 1 smd rect (at 0 0) (size 1 1) (layers F.Cu F.Mask)
      (net 28 /A10))
  )
  (module "gameboy:Test Point" (layer F.Cu) (tedit 5B6F0FD6)
    (at 125.445 87.738)
    (fp_text reference TP17 (at 2.75 0) (layer F.SilkS) hide)
    (fp_text value Test_Point (at 0 -0.5) (layer F.Fab) hide)
    (pad 1 smd rect (at 0 0) (size 1 1) (layers F.Cu F.Mask)
      (net 29 /A11))
  )
  (module "gameboy:Test Point" (layer F.Cu) (tedit 5B6F0FD6)
    (at 126.945 87.738)
    (fp_text reference TP18 (at 2.75 0) (layer F.SilkS) hide)
    (fp_text value Test_Point (at 0 -0.5) (layer F.Fab) hide)
    (pad 1 smd rect (at 0 0) (size 1 1) (layers F.Cu F.Mask)
      (net 30 /A12))
  )
  (module "gameboy:Test Point" (layer F.Cu) (tedit 5B6F0FD6)
    (at 128.445 87.738)
    (fp_text reference TP19 (at 2.75 0) (layer F.SilkS) hide)
    (fp_text value Test_Point (at 0 -0.5) (layer F.Fab) hide)
    (pad 1 smd rect (at 0 0) (size 1 1) (layers F.Cu F.Mask)
      (net 31 /A13))
  )
  (module "gameboy:Test Point" (layer F.Cu) (tedit 5B6F0FD6)
    (at 114.945 87.738)
    (fp_text reference TP10 (at 2.75 0) (layer F.SilkS) hide)
    (fp_text value Test_Point (at 0 -0.5) (layer F.Fab) hide)
    (pad 1 smd rect (at 0 0) (size 1 1) (layers F.Cu F.Mask)
      (net 22 /A4))
  )
  (module "gameboy:Test Point" (layer F.Cu) (tedit 5B6F0FD6)
    (at 129.945 87.738)
    (fp_text reference TP20 (at 2.75 0) (layer F.SilkS) hide)
    (fp_text value Test_Point (at 0 -0.5) (layer F.Fab) hide)
    (pad 1 smd rect (at 0 0) (size 1 1) (layers F.Cu F.Mask)
      (net 32 /A14))
  )
  (module "gameboy:Test Point" (layer F.Cu) (tedit 5B6F0FD6)
    (at 116.445 87.738)
    (fp_text reference TP11 (at 2.75 0) (layer F.SilkS) hide)
    (fp_text value Test_Point (at 0 -0.5) (layer F.Fab) hide)
    (pad 1 smd rect (at 0 0) (size 1 1) (layers F.Cu F.Mask)
      (net 23 /A5))
  )
  (module "gameboy:Test Point" (layer F.Cu) (tedit 5B6F0FD6)
    (at 117.945 87.738)
    (fp_text reference TP12 (at 2.75 0) (layer F.SilkS) hide)
    (fp_text value Test_Point (at 0 -0.5) (layer F.Fab) hide)
    (pad 1 smd rect (at 0 0) (size 1 1) (layers F.Cu F.Mask)
      (net 24 /A6))
  )
  (module "gameboy:Test Point" (layer F.Cu) (tedit 5B6F0FD6)
    (at 131.445 87.738)
    (fp_text reference TP21 (at 2.75 0) (layer F.SilkS) hide)
    (fp_text value Test_Point (at 0 -0.5) (layer F.Fab) hide)
    (pad 1 smd rect (at 0 0) (size 1 1) (layers F.Cu F.Mask)
      (net 33 /A15))
  )
  (module "gameboy:Test Point" (layer F.Cu) (tedit 5B6F0FD6)
    (at 132.945 87.738)
    (fp_text reference TP22 (at 2.75 0) (layer F.SilkS) hide)
    (fp_text value Test_Point (at 0 -0.5) (layer F.Fab) hide)
    (pad 1 smd rect (at 0 0) (size 1 1) (layers F.Cu F.Mask)
      (net 2 /D0))
  )
  (module "gameboy:Test Point" (layer F.Cu) (tedit 5B6F0FD6)
    (at 134.445 87.738)
    (fp_text reference TP23 (at 2.75 0) (layer F.SilkS) hide)
    (fp_text value Test_Point (at 0 -0.5) (layer F.Fab) hide)
    (pad 1 smd rect (at 0 0) (size 1 1) (layers F.Cu F.Mask)
      (net 3 /D1))
  )
  (module "gameboy:Test Point" (layer F.Cu) (tedit 5B6F0FD6)
    (at 135.945 87.738)
    (fp_text reference TP24 (at 2.75 0) (layer F.SilkS) hide)
    (fp_text value Test_Point (at 0 -0.5) (layer F.Fab) hide)
    (pad 1 smd rect (at 0 0) (size 1 1) (layers F.Cu F.Mask)
      (net 4 /D2))
  )
  (module "gameboy:Test Point" (layer F.Cu) (tedit 5B6F0FD6)
    (at 137.445 87.738)
    (fp_text reference TP25 (at 2.75 0) (layer F.SilkS) hide)
    (fp_text value Test_Point (at 0 -0.5) (layer F.Fab) hide)
    (pad 1 smd rect (at 0 0) (size 1 1) (layers F.Cu F.Mask)
      (net 6 /D3))
  )
  (module "gameboy:Test Point" (layer F.Cu) (tedit 5B6F0FD6)
    (at 138.945 87.738)
    (fp_text reference TP26 (at 2.75 0) (layer F.SilkS) hide)
    (fp_text value Test_Point (at 0 -0.5) (layer F.Fab) hide)
    (pad 1 smd rect (at 0 0) (size 1 1) (layers F.Cu F.Mask)
      (net 7 /D4))
  )
  (module "gameboy:Test Point" (layer F.Cu) (tedit 5B6F0FD6)
    (at 140.445 87.738)
    (fp_text reference TP27 (at 2.75 0) (layer F.SilkS) hide)
    (fp_text value Test_Point (at 0 -0.5) (layer F.Fab) hide)
    (pad 1 smd rect (at 0 0) (size 1 1) (layers F.Cu F.Mask)
      (net 8 /D5))
  )
  (module "gameboy:Test Point" (layer F.Cu) (tedit 5B6F0FD6)
    (at 141.945 87.738)
    (fp_text reference TP28 (at 2.75 0) (layer F.SilkS) hide)
    (fp_text value Test_Point (at 0 -0.5) (layer F.Fab) hide)
    (pad 1 smd rect (at 0 0) (size 1 1) (layers F.Cu F.Mask)
      (net 9 /D6))
  )
  (module "gameboy:Test Point" (layer F.Cu) (tedit 5B6F0FD6)
    (at 143.445 87.738)
    (fp_text reference TP29 (at 2.75 0) (layer F.SilkS) hide)
    (fp_text value Test_Point (at 0 -0.5) (layer F.Fab) hide)
    (pad 1 smd rect (at 0 0) (size 1 1) (layers F.Cu F.Mask)
      (net 10 /D7))
  )
  (module "gameboy:Test Point" (layer F.Cu) (tedit 5B6F0FD6)
    (at 144.945 87.738)
    (fp_text reference TP30 (at 2.75 0) (layer F.SilkS) hide)
    (fp_text value Test_Point (at 0 -0.5) (layer F.Fab) hide)
    (pad 1 smd rect (at 0 0) (size 1 1) (layers F.Cu F.Mask)
      (net 34 /RESET))
  )
  (module "gameboy:Test Point" (layer F.Cu) (tedit 5B6F0FD6)
    (at 145.795 85.738)
    (fp_text reference TP31 (at 2.75 0) (layer F.SilkS) hide)
    (fp_text value Test_Point (at 0 -0.5) (layer F.Fab) hide)
    (pad 1 smd rect (at 0 0) (size 1 1) (layers F.Cu F.Mask)
      (net 83 /AUD))
  )
  (module "gameboy:Test Point" (layer F.Cu) (tedit 5B6F0FD6)
    (at 148.045 87.688)
    (fp_text reference TP32 (at 2.75 0) (layer F.SilkS) hide)
    (fp_text value Test_Point (at 0 -0.5) (layer F.Fab) hide)
    (pad 1 smd rect (at 0 0) (size 1 1) (layers F.Cu F.Mask)
      (net 5 GND))
  )
  (module "gameboy:Test Point" (layer F.Cu) (tedit 5B6F0FD6)
    (at 119.445 87.738)
    (fp_text reference TP13 (at 2.75 0) (layer F.SilkS) hide)
    (fp_text value Test_Point (at 0 -0.5) (layer F.Fab) hide)
    (pad 1 smd rect (at 0 0) (size 1 1) (layers F.Cu F.Mask)
      (net 25 /A7))
  )
  (module "gameboy:Test Point" (layer F.Cu) (tedit 5B6F0FD6)
    (at 113.445 87.738)
    (fp_text reference TP9 (at 2.75 0) (layer F.SilkS) hide)
    (fp_text value Test_Point (at 0 -0.5) (layer F.Fab) hide)
    (pad 1 smd rect (at 0 0) (size 1 1) (layers F.Cu F.Mask)
      (net 21 /A3))
  )
  (module Pin_Headers:Pin_Header_Straight_2x05_Pitch1.27mm_SMD (layer F.Cu) (tedit 5C8430D3)
    (at 139.1625 43.4975 270)
    (descr "surface-mounted straight pin header, 2x05, 1.27mm pitch, double rows")
    (tags "Surface mounted pin header SMD 2x05 1.27mm double row")
    (attr smd)
    (fp_text reference J3 (at 2.0955 3.7465 270) (layer F.SilkS) hide)
    (fp_text value Conn_ARM_JTAG_SWD_10 (at 0 4.235 270) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 10 smd rect (at 1.95 2.54 270) (size 2.4 0.74) (layers F.Cu F.Paste F.Mask)
      (net 46 /SAMD_RESET))
    (pad 9 smd rect (at -1.95 2.54 270) (size 2.4 0.74) (layers F.Cu F.Paste F.Mask))
    (pad 8 smd rect (at 1.95 1.27 270) (size 2.4 0.74) (layers F.Cu F.Paste F.Mask))
    (pad 7 smd rect (at -1.95 1.27 270) (size 2.4 0.74) (layers F.Cu F.Paste F.Mask))
    (pad 6 smd rect (at 1.95 0 270) (size 2.4 0.74) (layers F.Cu F.Paste F.Mask)
      (net 73 /SWO))
    (pad 5 smd rect (at -1.95 0 270) (size 2.4 0.74) (layers F.Cu F.Paste F.Mask)
      (net 5 GND))
    (pad 4 smd rect (at 1.95 -1.27 270) (size 2.4 0.74) (layers F.Cu F.Paste F.Mask)
      (net 13 /SWCLK))
    (pad 3 smd rect (at -1.95 -1.27 270) (size 2.4 0.74) (layers F.Cu F.Paste F.Mask)
      (net 5 GND))
    (pad 2 smd rect (at 1.95 -2.54 270) (size 2.4 0.74) (layers F.Cu F.Paste F.Mask)
      (net 12 /SWDIO))
    (pad 1 smd rect (at -1.95 -2.54 270) (size 2.4 0.74) (layers F.Cu F.Paste F.Mask)
      (net 11 +3V3))
    (model ${KISYS3DMOD}/Pin_Headers.3dshapes/Pin_Header_Straight_2x05_Pitch1.27mm_SMD.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module TO_SOT_Packages_SMD:SOT-23 (layer F.Cu) (tedit 58CE4E7E)
    (at 136.271 69.723 270)
    (descr "SOT-23, Standard")
    (tags SOT-23)
    (attr smd)
    (fp_text reference Q1 (at 2.515 -0.674) (layer F.SilkS))
    (fp_text value BSS138 (at 0 2.5 270) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 3 smd rect (at 1 0 270) (size 0.9 0.8) (layers F.Cu F.Paste F.Mask)
      (net 34 /RESET))
    (pad 2 smd rect (at -1 0.95 270) (size 0.9 0.8) (layers F.Cu F.Paste F.Mask)
      (net 5 GND))
    (pad 1 smd rect (at -1 -0.95 270) (size 0.9 0.8) (layers F.Cu F.Paste F.Mask)
      (net 45 /GB_RESET))
    (model ${KISYS3DMOD}/TO_SOT_Packages_SMD.3dshapes/SOT-23.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module "gameboy:Large Hole" (layer F.Cu) (tedit 5C843B67)
    (at 124.65 82.35)
    (fp_text reference J2 (at 0 0.5) (layer F.SilkS) hide)
    (fp_text value Conn_01x01 (at 0 -0.5) (layer F.Fab) hide)
    (pad 1 thru_hole circle (at 0 0) (size 7.4 7.4) (drill 7.3) (layers *.Cu *.Mask))
  )
  (module "gameboy:Small Hole" (layer F.Cu) (tedit 5AE80885)
    (at 124.65 57.3)
    (fp_text reference J1 (at 0 0.5) (layer F.SilkS) hide)
    (fp_text value Conn_01x01 (at 0 -0.5) (layer F.Fab) hide)
    (pad 1 thru_hole circle (at 0 0) (size 2.3 2.3) (drill 2.2) (layers *.Cu *.Mask))
  )
  (module chickadee:chickadee_1mm_ss (layer F.Cu) (tedit 0)
    (at 121.345 44.888)
    (fp_text reference G*** (at 0 0) (layer F.SilkS) hide)
    (fp_text value LOGO (at 0.75 0) (layer F.SilkS) hide)
  )
  (module chickadee:chickadee_3mm_fcu (layer B.Cu) (tedit 0)
    (at 115.145 45.788 180)
    (fp_text reference G*** (at 0 0 180) (layer B.SilkS) hide)
    (fp_text value "Chickadee 3mm" (at 0.75 0 180) (layer B.SilkS) hide)
  )
  (gr_text SWDIO (at 141.445 46.488 90) (layer B.SilkS))
  (gr_text SWCLK (at 138.445 46.488 90) (layer B.SilkS))
  (gr_text SWO (at 135.445 46.488 90) (layer B.SilkS))
  (gr_text RESET (at 135.945 42.988) (layer B.SilkS))
  (gr_text +3V (at 140.945 42.988) (layer B.SilkS))
  (gr_text GND (at 138.445 39.488) (layer B.SilkS))
  (gr_text GND (at 147.88 91.41 270) (layer B.SilkS))
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