(kicad_pcb (version 4) (host pcbnew 4.0.7)
  (general
    (links 157)
    (no_connects 5)
    (area 76.276999 39.335999 153.847001 118.176001)
    (thickness 1.6)
    (drawings 24)
    (tracks 568)
    (zones 0)
    (modules 55)
    (nets 83)
  )
  (page A4)
  (layers
    (0 F.Cu signal)
    (31 B.Cu signal)
    (32 B.Adhes user)
    (33 F.Adhes user)
    (34 B.Paste user)
    (35 F.Paste user)
    (36 B.SilkS user)
    (37 F.SilkS user)
    (38 B.Mask user)
    (39 F.Mask user)
    (40 Dwgs.User user)
    (41 Cmts.User user)
    (42 Eco1.User user)
    (43 Eco2.User user)
    (44 Edge.Cuts user)
    (45 Margin user)
    (46 B.CrtYd user)
    (47 F.CrtYd user)
    (48 B.Fab user)
    (49 F.Fab user)
  )
  (setup
    (last_trace_width 0.35)
    (trace_clearance 0.2)
    (zone_clearance 0.508)
    (zone_45_only no)
    (trace_min 0.2)
    (segment_width 0.2)
    (edge_width 0.1)
    (via_size 0.6)
    (via_drill 0.4)
    (via_min_size 0.4)
    (via_min_drill 0.3)
    (uvia_size 0.3)
    (uvia_drill 0.1)
    (uvias_allowed no)
    (uvia_min_size 0.2)
    (uvia_min_drill 0.1)
    (pcb_text_width 0.3)
    (pcb_text_size 1.5 1.5)
    (mod_edge_width 0.15)
    (mod_text_size 1 1)
    (mod_text_width 0.15)
    (pad_size 1.5 1.5)
    (pad_drill 0.1)
    (pad_to_mask_clearance 0)
    (aux_axis_origin 75.946 119.126)
    (grid_origin 75.946 119.126)
    (visible_elements 7FFFFFFF)
    (pcbplotparams
      (layerselection 0x00030_80000001)
      (usegerberextensions false)
      (excludeedgelayer true)
      (linewidth 0.100000)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15)
      (hpglpenoverlay 2)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (padsonsilk false)
      (subtractmaskfromsilk false)
      (outputformat 3)
      (mirror false)
      (drillshape 0)
      (scaleselection 1)
      (outputdirectory ./))
  )
  (net 0 "")
  (net 1 GND)
  (net 2 "Net-(BAT1-PadPos)")
  (net 3 "Net-(C1-Pad1)")
  (net 4 +5V)
  (net 5 "Net-(C4-Pad2)")
  (net 6 "Net-(C5-Pad2)")
  (net 7 +12V)
  (net 8 "Net-(D3-Pad2)")
  (net 9 MISO)
  (net 10 "Net-(J1-Pad2)")
  (net 11 SCK)
  (net 12 MOSI)
  (net 13 RESET)
  (net 14 TEMP_IN)
  (net 15 "Net-(J4-Pad1)")
  (net 16 "Net-(J4-Pad2)")
  (net 17 "Net-(J4-Pad3)")
  (net 18 "Net-(J4-Pad4)")
  (net 19 "Net-(J4-Pad5)")
  (net 20 "Net-(J4-Pad6)")
  (net 21 "Net-(J4-Pad7)")
  (net 22 "Net-(J4-Pad8)")
  (net 23 SDA)
  (net 24 SCL)
  (net 25 BTN1)
  (net 26 BTN2)
  (net 27 BTN-ENC)
  (net 28 ENC-R)
  (net 29 ENC-L)
  (net 30 EN+)
  (net 31 EN-)
  (net 32 REVLIMIT)
  (net 33 FORLIMIT)
  (net 34 "Net-(R1-Pad1)")
  (net 35 "Net-(R2-Pad1)")
  (net 36 "Net-(R3-Pad1)")
  (net 37 "Net-(R4-Pad1)")
  (net 38 "Net-(R8-Pad2)")
  (net 39 "Net-(R9-Pad2)")
  (net 40 "Net-(R10-Pad1)")
  (net 41 "Net-(R11-Pad1)")
  (net 42 "Net-(R12-Pad1)")
  (net 43 K4)
  (net 44 K3)
  (net 45 K2)
  (net 46 K1)
  (net 47 "Net-(U6-Pad19)")
  (net 48 "Net-(U6-Pad20)")
  (net 49 "Net-(U6-Pad22)")
  (net 50 M_EN)
  (net 51 MREV)
  (net 52 MFOR)
  (net 53 "Net-(U7-Pad4)")
  (net 54 "Net-(J6-Pad10)")
  (net 55 "Net-(J4-Pad9)")
  (net 56 "Net-(R13-Pad1)")
  (net 57 "Net-(R14-Pad1)")
  (net 58 "Net-(R15-Pad1)")
  (net 59 "Net-(R16-Pad1)")
  (net 60 K8)
  (net 61 K7)
  (net 62 K6)
  (net 63 K5)
  (net 64 SD_CS)
  (net 65 "Net-(U6-Pad26)")
  (net 66 "Net-(U11-Pad19)")
  (net 67 "Net-(U11-Pad20)")
  (net 68 K9)
  (net 69 K10)
  (net 70 K11)
  (net 71 K12)
  (net 72 K13)
  (net 73 K14)
  (net 74 K15)
  (net 75 K16)
  (net 76 TX)
  (net 77 RX)
  (net 78 "Net-(U11-Pad11)")
  (net 79 "Net-(U11-Pad14)")
  (net 80 REV)
  (net 81 COM)
  (net 82 FOR)
  (net_class Default "This is the default net class."
    (clearance 0.2)
    (trace_width 0.35)
    (via_dia 0.6)
    (via_drill 0.4)
    (uvia_dia 0.3)
    (uvia_drill 0.1)
    (add_net BTN-ENC)
    (add_net BTN1)
    (add_net BTN2)
    (add_net COM)
    (add_net EN+)
    (add_net EN-)
    (add_net ENC-L)
    (add_net ENC-R)
    (add_net FOR)
    (add_net FORLIMIT)
    (add_net GND)
    (add_net K1)
    (add_net K10)
    (add_net K11)
    (add_net K12)
    (add_net K13)
    (add_net K14)
    (add_net K15)
    (add_net K16)
    (add_net K2)
    (add_net K3)
    (add_net K4)
    (add_net K5)
    (add_net K6)
    (add_net K7)
    (add_net K8)
    (add_net K9)
    (add_net MFOR)
    (add_net MISO)
    (add_net MOSI)
    (add_net MREV)
    (add_net M_EN)
    (add_net "Net-(BAT1-PadPos)")
    (add_net "Net-(C1-Pad1)")
    (add_net "Net-(C4-Pad2)")
    (add_net "Net-(C5-Pad2)")
    (add_net "Net-(D3-Pad2)")
    (add_net "Net-(J1-Pad2)")
    (add_net "Net-(J4-Pad1)")
    (add_net "Net-(J4-Pad2)")
    (add_net "Net-(J4-Pad3)")
    (add_net "Net-(J4-Pad4)")
    (add_net "Net-(J4-Pad5)")
    (add_net "Net-(J4-Pad6)")
    (add_net "Net-(J4-Pad7)")
    (add_net "Net-(J4-Pad8)")
    (add_net "Net-(J4-Pad9)")
    (add_net "Net-(J6-Pad10)")
    (add_net "Net-(R1-Pad1)")
    (add_net "Net-(R10-Pad1)")
    (add_net "Net-(R11-Pad1)")
    (add_net "Net-(R12-Pad1)")
    (add_net "Net-(R13-Pad1)")
    (add_net "Net-(R14-Pad1)")
    (add_net "Net-(R15-Pad1)")
    (add_net "Net-(R16-Pad1)")
    (add_net "Net-(R2-Pad1)")
    (add_net "Net-(R3-Pad1)")
    (add_net "Net-(R4-Pad1)")
    (add_net "Net-(R8-Pad2)")
    (add_net "Net-(R9-Pad2)")
    (add_net "Net-(U11-Pad11)")
    (add_net "Net-(U11-Pad14)")
    (add_net "Net-(U11-Pad19)")
    (add_net "Net-(U11-Pad20)")
    (add_net "Net-(U6-Pad19)")
    (add_net "Net-(U6-Pad20)")
    (add_net "Net-(U6-Pad22)")
    (add_net "Net-(U6-Pad26)")
    (add_net "Net-(U7-Pad4)")
    (add_net RESET)
    (add_net REV)
    (add_net REVLIMIT)
    (add_net RX)
    (add_net SCK)
    (add_net SCL)
    (add_net SDA)
    (add_net SD_CS)
    (add_net TEMP_IN)
    (add_net TX)
  )
  (net_class +12V ""
    (clearance 0.2)
    (trace_width 0.6)
    (via_dia 0.6)
    (via_drill 0.4)
    (uvia_dia 0.3)
    (uvia_drill 0.1)
    (add_net +12V)
  )
  (net_class +5V ""
    (clearance 0.2)
    (trace_width 0.4)
    (via_dia 0.6)
    (via_drill 0.4)
    (uvia_dia 0.3)
    (uvia_drill 0.1)
    (add_net +5V)
  )
  (module digikey-footprints:SOIC-28_W7.5mm (layer B.Cu) (tedit 59C28108)
    (at 118.2624 87.377 90)
    (fp_text reference U11 (at 0 10.04 90) (layer B.SilkS))
    (fp_text value MCP23017-E_SO (at 0 -10.15 90) (layer B.Fab))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 1 smd rect (at -4.7 8.255 90) (size 2 0.6) (layers B.Cu B.Paste B.Mask)
      (net 46 K1))
    (pad 2 smd rect (at -4.7 6.985 90) (size 2 0.6) (layers B.Cu B.Paste B.Mask)
      (net 45 K2))
    (pad 3 smd rect (at -4.7 5.715 90) (size 2 0.6) (layers B.Cu B.Paste B.Mask)
      (net 44 K3))
    (pad 4 smd rect (at -4.7 4.445 90) (size 2 0.6) (layers B.Cu B.Paste B.Mask)
      (net 43 K4))
    (pad 5 smd rect (at -4.7 3.175 90) (size 2 0.6) (layers B.Cu B.Paste B.Mask)
      (net 63 K5))
    (pad 6 smd rect (at -4.7 1.905 90) (size 2 0.6) (layers B.Cu B.Paste B.Mask)
      (net 62 K6))
    (pad 7 smd rect (at -4.7 0.635 90) (size 2 0.6) (layers B.Cu B.Paste B.Mask)
      (net 61 K7))
    (pad 8 smd rect (at -4.7 -0.635 90) (size 2 0.6) (layers B.Cu B.Paste B.Mask)
      (net 60 K8))
    (pad 9 smd rect (at -4.7 -1.905 90) (size 2 0.6) (layers B.Cu B.Paste B.Mask)
      (net 4 +5V))
    (pad 10 smd rect (at -4.7 -3.175 90) (size 2 0.6) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (pad 11 smd rect (at -4.7 -4.445 90) (size 2 0.6) (layers B.Cu B.Paste B.Mask)
      (net 78 "Net-(U11-Pad11)"))
    (pad 12 smd rect (at -4.7 -5.715 90) (size 2 0.6) (layers B.Cu B.Paste B.Mask)
      (net 24 SCL))
    (pad 13 smd rect (at -4.7 -6.985 90) (size 2 0.6) (layers B.Cu B.Paste B.Mask)
      (net 23 SDA))
    (pad 14 smd rect (at -4.7 -8.255 90) (size 2 0.6) (layers B.Cu B.Paste B.Mask)
      (net 79 "Net-(U11-Pad14)"))
    (pad 15 smd rect (at 4.7 -8.255 90) (size 2 0.6) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (pad 16 smd rect (at 4.7 -6.985 90) (size 2 0.6) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (pad 17 smd rect (at 4.7 -5.715 90) (size 2 0.6) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (pad 18 smd rect (at 4.7 -4.445 90) (size 2 0.6) (layers B.Cu B.Paste B.Mask)
      (net 4 +5V))
    (pad 19 smd rect (at 4.7 -3.175 90) (size 2 0.6) (layers B.Cu B.Paste B.Mask)
      (net 66 "Net-(U11-Pad19)"))
    (pad 20 smd rect (at 4.7 -1.905 90) (size 2 0.6) (layers B.Cu B.Paste B.Mask)
      (net 67 "Net-(U11-Pad20)"))
    (pad 21 smd rect (at 4.7 -0.635 90) (size 2 0.6) (layers B.Cu B.Paste B.Mask)
      (net 68 K9))
    (pad 22 smd rect (at 4.7 0.635 90) (size 2 0.6) (layers B.Cu B.Paste B.Mask)
      (net 69 K10))
    (pad 23 smd rect (at 4.7 1.905 90) (size 2 0.6) (layers B.Cu B.Paste B.Mask)
      (net 70 K11))
    (pad 24 smd rect (at 4.7 3.175 90) (size 2 0.6) (layers B.Cu B.Paste B.Mask)
      (net 71 K12))
    (pad 25 smd rect (at 4.7 4.445 90) (size 2 0.6) (layers B.Cu B.Paste B.Mask)
      (net 72 K13))
    (pad 26 smd rect (at 4.7 5.715 90) (size 2 0.6) (layers B.Cu B.Paste B.Mask)
      (net 73 K14))
    (pad 27 smd rect (at 4.7 6.985 90) (size 2 0.6) (layers B.Cu B.Paste B.Mask)
      (net 74 K15))
    (pad 28 smd rect (at 4.7 8.255 90) (size 2 0.6) (layers B.Cu B.Paste B.Mask)
      (net 75 K16))
    (model ${KIPRJMOD}/packages3d/SOIC-28_sc.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 90))
    )
  )
  (module Resistors_SMD:R_1206_HandSoldering (layer B.Cu) (tedit 58E0A804)
    (at 84.4423 92.456 270)
    (descr "Resistor SMD 1206, hand soldering")
    (tags "resistor 1206")
    (attr smd)
    (fp_text reference R5 (at 0 1.85 270) (layer B.SilkS))
    (fp_text value 4.7K (at 0 1.524 270) (layer B.Fab))
    (fp_text user %R (at 0 0 270) (layer B.Fab))
    (pad 1 smd rect (at -2 0 270) (size 2 1.7) (layers B.Cu B.Paste B.Mask)
      (net 14 TEMP_IN))
    (pad 2 smd rect (at 2 0 270) (size 2 1.7) (layers B.Cu B.Paste B.Mask)
      (net 4 +5V))
    (model ${KISYS3DMOD}/Resistors_SMD.3dshapes/R_1206.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Housings_QFP:TQFP-32_7x7mm_Pitch0.8mm (layer B.Cu) (tedit 58CC9A48)
    (at 108.018 75.444 90)
    (descr "32-Lead Plastic Thin Quad Flatpack (PT) - 7x7x1.0 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf)")
    (tags "QFP 0.8")
    (attr smd)
    (fp_text reference U6 (at -6.344 -0.068 180) (layer B.SilkS))
    (fp_text value ATMEGA328-PU (at 0 -6.05 90) (layer B.Fab))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 1 smd rect (at -4.25 2.8 90) (size 1.6 0.55) (layers B.Cu B.Paste B.Mask)
      (net 33 FORLIMIT))
    (pad 2 smd rect (at -4.25 2 90) (size 1.6 0.55) (layers B.Cu B.Paste B.Mask)
      (net 64 SD_CS))
    (pad 3 smd rect (at -4.25 1.2 90) (size 1.6 0.55) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (pad 4 smd rect (at -4.25 0.4 90) (size 1.6 0.55) (layers B.Cu B.Paste B.Mask)
      (net 4 +5V))
    (pad 5 smd rect (at -4.25 -0.4 90) (size 1.6 0.55) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (pad 6 smd rect (at -4.25 -1.2 90) (size 1.6 0.55) (layers B.Cu B.Paste B.Mask)
      (net 4 +5V))
    (pad 7 smd rect (at -4.25 -2 90) (size 1.6 0.55) (layers B.Cu B.Paste B.Mask)
      (net 5 "Net-(C4-Pad2)"))
    (pad 8 smd rect (at -4.25 -2.8 90) (size 1.6 0.55) (layers B.Cu B.Paste B.Mask)
      (net 6 "Net-(C5-Pad2)"))
    (pad 9 smd rect (at -2.8 -4.25) (size 1.6 0.55) (layers B.Cu B.Paste B.Mask)
      (net 28 ENC-R))
    (pad 10 smd rect (at -2 -4.25) (size 1.6 0.55) (layers B.Cu B.Paste B.Mask)
      (net 14 TEMP_IN))
    (pad 11 smd rect (at -1.2 -4.25) (size 1.6 0.55) (layers B.Cu B.Paste B.Mask)
      (net 29 ENC-L))
    (pad 12 smd rect (at -0.4 -4.25) (size 1.6 0.55) (layers B.Cu B.Paste B.Mask)
      (net 25 BTN1))
    (pad 13 smd rect (at 0.4 -4.25) (size 1.6 0.55) (layers B.Cu B.Paste B.Mask)
      (net 26 BTN2))
    (pad 14 smd rect (at 1.2 -4.25) (size 1.6 0.55) (layers B.Cu B.Paste B.Mask)
      (net 27 BTN-ENC))
    (pad 15 smd rect (at 2 -4.25) (size 1.6 0.55) (layers B.Cu B.Paste B.Mask)
      (net 12 MOSI))
    (pad 16 smd rect (at 2.8 -4.25) (size 1.6 0.55) (layers B.Cu B.Paste B.Mask)
      (net 9 MISO))
    (pad 17 smd rect (at 4.25 -2.8 90) (size 1.6 0.55) (layers B.Cu B.Paste B.Mask)
      (net 11 SCK))
    (pad 18 smd rect (at 4.25 -2 90) (size 1.6 0.55) (layers B.Cu B.Paste B.Mask)
      (net 4 +5V))
    (pad 19 smd rect (at 4.25 -1.2 90) (size 1.6 0.55) (layers B.Cu B.Paste B.Mask)
      (net 47 "Net-(U6-Pad19)"))
    (pad 20 smd rect (at 4.25 -0.4 90) (size 1.6 0.55) (layers B.Cu B.Paste B.Mask)
      (net 48 "Net-(U6-Pad20)"))
    (pad 21 smd rect (at 4.25 0.4 90) (size 1.6 0.55) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (pad 22 smd rect (at 4.25 1.2 90) (size 1.6 0.55) (layers B.Cu B.Paste B.Mask)
      (net 49 "Net-(U6-Pad22)"))
    (pad 23 smd rect (at 4.25 2 90) (size 1.6 0.55) (layers B.Cu B.Paste B.Mask)
      (net 50 M_EN))
    (pad 24 smd rect (at 4.25 2.8 90) (size 1.6 0.55) (layers B.Cu B.Paste B.Mask)
      (net 51 MREV))
    (pad 25 smd rect (at 2.8 4.25) (size 1.6 0.55) (layers B.Cu B.Paste B.Mask)
      (net 52 MFOR))
    (pad 26 smd rect (at 2 4.25) (size 1.6 0.55) (layers B.Cu B.Paste B.Mask)
      (net 65 "Net-(U6-Pad26)"))
    (pad 27 smd rect (at 1.2 4.25) (size 1.6 0.55) (layers B.Cu B.Paste B.Mask)
      (net 23 SDA))
    (pad 28 smd rect (at 0.4 4.25) (size 1.6 0.55) (layers B.Cu B.Paste B.Mask)
      (net 24 SCL))
    (pad 29 smd rect (at -0.4 4.25) (size 1.6 0.55) (layers B.Cu B.Paste B.Mask)
      (net 13 RESET))
    (pad 30 smd rect (at -1.2 4.25) (size 1.6 0.55) (layers B.Cu B.Paste B.Mask)
      (net 77 RX))
    (pad 31 smd rect (at -2 4.25) (size 1.6 0.55) (layers B.Cu B.Paste B.Mask)
      (net 76 TX))
    (pad 32 smd rect (at -2.8 4.25) (size 1.6 0.55) (layers B.Cu B.Paste B.Mask)
      (net 32 REVLIMIT))
    (model ${KISYS3DMOD}/Housings_QFP.3dshapes/TQFP-32_7x7mm_Pitch0.8mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module digikey-footprints:Battery_Holder_Coin_2032_BS-7 (layer F.Cu) (tedit 5ACD0859)
    (at 118.618 74.041 90)
    (descr http://www.memoryprotectiondevices.com/datasheets/BS-7-datasheet.pdf)
    (fp_text reference BAT1 (at 7.4422 0 90) (layer F.SilkS))
    (fp_text value BS-7 (at 7.4676 13.56 90) (layer F.Fab))
    (fp_text user %R (at 7.4676 0 90) (layer F.Fab))
    (pad Neg thru_hole rect (at 0 0 90) (size 2.17 2.17) (drill 1.17) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad Pos thru_hole circle (at 20 0 90) (size 2.5 2.5) (drill 1.5) (layers *.Cu *.Mask)
      (net 2 "Net-(BAT1-PadPos)"))
    (model "${KIPRJMOD}/packages3d/CR2032 BATTERY HOLDER.wrl"
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_1206_HandSoldering (layer B.Cu) (tedit 58AA84D1)
    (at 140.716 108.712 90)
    (descr "Capacitor SMD 1206, hand soldering")
    (tags "capacitor 1206")
    (attr smd)
    (fp_text reference C1 (at 0 1.75 90) (layer B.SilkS))
    (fp_text value "47 uF" (at 0 -2 90) (layer B.Fab))
    (fp_text user %R (at 0 1.75 90) (layer B.Fab))
    (pad 1 smd rect (at -2 0 90) (size 2 1.6) (layers B.Cu B.Paste B.Mask)
      (net 3 "Net-(C1-Pad1)"))
    (pad 2 smd rect (at 2 0 90) (size 2 1.6) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (model Capacitors_SMD.3dshapes/C_1206.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_1206_HandSoldering (layer B.Cu) (tedit 58AA84D1)
    (at 128.905 103.5746 90)
    (descr "Capacitor SMD 1206, hand soldering")
    (tags "capacitor 1206")
    (attr smd)
    (fp_text reference C2 (at 0 1.75 90) (layer B.SilkS))
    (fp_text value "4.7 uF" (at 0 -2 90) (layer B.Fab))
    (fp_text user %R (at 0 1.75 90) (layer B.Fab))
    (pad 1 smd rect (at -2 0 90) (size 2 1.6) (layers B.Cu B.Paste B.Mask)
      (net 4 +5V))
    (pad 2 smd rect (at 2 0 90) (size 2 1.6) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (model Capacitors_SMD.3dshapes/C_1206.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_1206_HandSoldering (layer B.Cu) (tedit 58AA84D1)
    (at 102.3112 90.3666 90)
    (descr "Capacitor SMD 1206, hand soldering")
    (tags "capacitor 1206")
    (attr smd)
    (fp_text reference C4 (at 0 1.75 90) (layer B.SilkS))
    (fp_text value "22 pF" (at 0 -2 90) (layer B.Fab))
    (fp_text user %R (at 0 1.75 90) (layer B.Fab))
    (pad 1 smd rect (at -2 0 90) (size 2 1.6) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (pad 2 smd rect (at 2 0 90) (size 2 1.6) (layers B.Cu B.Paste B.Mask)
      (net 5 "Net-(C4-Pad2)"))
    (model Capacitors_SMD.3dshapes/C_1206.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_1206_HandSoldering (layer B.Cu) (tedit 58AA84D1)
    (at 98.298 90.4052 90)
    (descr "Capacitor SMD 1206, hand soldering")
    (tags "capacitor 1206")
    (attr smd)
    (fp_text reference C5 (at 0 -1.778 90) (layer B.SilkS))
    (fp_text value "22 pF" (at 0 -2 90) (layer B.Fab))
    (fp_text user %R (at 0 1.75 90) (layer B.Fab))
    (pad 1 smd rect (at -2 0 90) (size 2 1.6) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (pad 2 smd rect (at 2 0 90) (size 2 1.6) (layers B.Cu B.Paste B.Mask)
      (net 6 "Net-(C5-Pad2)"))
    (model Capacitors_SMD.3dshapes/C_1206.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_1206 (layer B.Cu) (tedit 58AA84B8)
    (at 100.33 58.42 90)
    (descr "Capacitor SMD 1206, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 1206")
    (attr smd)
    (fp_text reference C6 (at 0 -1.524 90) (layer B.SilkS))
    (fp_text value .1uF (at 0 -2 90) (layer B.Fab))
    (fp_text user %R (at 0 1.75 90) (layer B.Fab))
    (pad 1 smd rect (at -1.5 0 90) (size 1 1.6) (layers B.Cu B.Paste B.Mask)
      (net 4 +5V))
    (pad 2 smd rect (at 1.5 0 90) (size 1 1.6) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (model Capacitors_SMD.3dshapes/C_1206.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitors_SMD:C_1206 (layer B.Cu) (tedit 58AA84B8)
    (at 106.934 69.088)
    (descr "Capacitor SMD 1206, reflow soldering, AVX (see smccp.pdf)")
    (tags "capacitor 1206")
    (attr smd)
    (fp_text reference C7 (at 0 -1.778) (layer B.SilkS))
    (fp_text value .1uF (at 0 -2) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 1 smd rect (at -1.5 0) (size 1 1.6) (layers B.Cu B.Paste B.Mask)
      (net 4 +5V))
    (pad 2 smd rect (at 1.5 0) (size 1 1.6) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (model Capacitors_SMD.3dshapes/C_1206.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Diodes_SMD:D_1206 (layer B.Cu) (tedit 590CEAF5)
    (at 141.732 102.616)
    (descr "Diode SMD 1206, reflow soldering http://datasheets.avx.com/schottky.pdf")
    (tags "Diode 1206")
    (attr smd)
    (fp_text reference D1 (at 0 1.8) (layer B.SilkS))
    (fp_text value D (at 0 -1.9) (layer B.Fab))
    (fp_text user %R (at 0 1.8) (layer B.Fab))
    (pad 1 smd rect (at -1.5 0) (size 1 1.6) (layers B.Cu B.Paste B.Mask)
      (net 3 "Net-(C1-Pad1)"))
    (pad 2 smd rect (at 1.5 0) (size 1 1.6) (layers B.Cu B.Paste B.Mask)
      (net 7 +12V))
    (model ${KISYS3DMOD}/Diodes_SMD.3dshapes/D_1206.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Diodes_SMD:D_1206 (layer B.Cu) (tedit 590CEAF5)
    (at 135.382 108.712 180)
    (descr "Diode SMD 1206, reflow soldering http://datasheets.avx.com/schottky.pdf")
    (tags "Diode 1206")
    (attr smd)
    (fp_text reference D2 (at 0 -2.032 180) (layer B.SilkS))
    (fp_text value D (at 0 -1.9 180) (layer B.Fab))
    (fp_text user %R (at 0 1.8 180) (layer B.Fab))
    (pad 1 smd rect (at -1.5 0 180) (size 1 1.6) (layers B.Cu B.Paste B.Mask)
      (net 3 "Net-(C1-Pad1)"))
    (pad 2 smd rect (at 1.5 0 180) (size 1 1.6) (layers B.Cu B.Paste B.Mask)
      (net 4 +5V))
    (model ${KISYS3DMOD}/Diodes_SMD.3dshapes/D_1206.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module LEDs:LED_1206 (layer F.Cu) (tedit 57FE943C)
    (at 136.7282 112.7506)
    (descr "LED 1206 smd package")
    (tags "LED led 1206 SMD smd SMT smt smdled SMDLED smtled SMTLED")
    (attr smd)
    (fp_text reference D3 (at 0 -1.7272) (layer F.SilkS))
    (fp_text value LED (at 0 1.7) (layer F.Fab))
    (pad 2 smd rect (at 1.65 0 180) (size 1.5 1.5) (layers F.Cu F.Paste F.Mask)
      (net 8 "Net-(D3-Pad2)"))
    (pad 1 smd rect (at -1.65 0 180) (size 1.5 1.5) (layers F.Cu F.Paste F.Mask)
      (net 1 GND))
    (model ${KIPRJMOD}/packages3d/led_1206.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Pin_Headers:Pin_Header_Straight_2x03_Pitch2.54mm (layer F.Cu) (tedit 59650532)
    (at 99.568 70.866 270)
    (descr "Through hole straight pin header, 2x03, 2.54mm pitch, double rows")
    (tags "Through hole pin header THT 2x03 2.54mm double row")
    (fp_text reference J1 (at 1.27 -2.33 270) (layer F.SilkS))
    (fp_text value AVR_SPI_PRG_62X3_LOCK (at 1.27 7.41 270) (layer F.Fab))
    (fp_text user %R (at 1.27 2.54 360) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 9 MISO))
    (pad 2 thru_hole oval (at 2.54 0 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 10 "Net-(J1-Pad2)"))
    (pad 3 thru_hole oval (at 0 2.54 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 11 SCK))
    (pad 4 thru_hole oval (at 2.54 2.54 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 12 MOSI))
    (pad 5 thru_hole oval (at 0 5.08 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 13 RESET))
    (pad 6 thru_hole oval (at 2.54 5.08 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (model ${KISYS3DMOD}/Pin_Headers.3dshapes/Pin_Header_Straight_2x03_Pitch2.54mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Pin_Headers:Pin_Header_Straight_1x02_Pitch2.54mm (layer F.Cu) (tedit 59650532)
    (at 90.678 68.58 180)
    (descr "Through hole straight pin header, 1x02, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x02 2.54mm single row")
    (fp_text reference J2 (at 0 -2.33 180) (layer F.SilkS))
    (fp_text value Conn_01x02 (at 0 4.87 180) (layer F.Fab))
    (fp_text user %R (at 0 1.27 270) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 10 "Net-(J1-Pad2)"))
    (pad 2 thru_hole oval (at 0 2.54 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 4 +5V))
  )
  (module Pin_Headers:Pin_Header_Straight_1x03_Pitch2.54mm (layer F.Cu) (tedit 59650532)
    (at 80.8736 90.9574)
    (descr "Through hole straight pin header, 1x03, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x03 2.54mm single row")
    (fp_text reference J3 (at 0 -2.33) (layer F.SilkS))
    (fp_text value Conn_01x03_Male (at 0 7.41) (layer F.Fab))
    (fp_text user %R (at 0 2.54 90) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 14 TEMP_IN))
    (pad 2 thru_hole oval (at 0 2.54) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 4 +5V))
    (pad 3 thru_hole oval (at 0 5.08) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (model ${KISYS3DMOD}/Pin_Headers.3dshapes/Pin_Header_Straight_1x03_Pitch2.54mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connectors_Multicomp:Multicomp_MC9A12-1434_2x07x2.54mm_Straight (layer F.Cu) (tedit 56C61E6B)
    (at 80.518 64.77 270)
    (descr http://www.farnell.com/datasheets/1520732.pdf)
    (tags "connector multicomp MC9A MC9A12")
    (fp_text reference J5 (at -3 -7 270) (layer F.SilkS))
    (fp_text value Conn_02x07_Odd_Even (at 7.62 5 270) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 4 +5V))
    (pad 2 thru_hole circle (at 0 -2.54 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 3 thru_hole circle (at 2.54 0 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 23 SDA))
    (pad 4 thru_hole circle (at 2.54 -2.54 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 24 SCL))
    (pad 5 thru_hole circle (at 5.08 0 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 25 BTN1))
    (pad 6 thru_hole circle (at 5.08 -2.54 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 26 BTN2))
    (pad 7 thru_hole circle (at 7.62 0 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 27 BTN-ENC))
    (pad 8 thru_hole circle (at 7.62 -2.54 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 9 thru_hole circle (at 10.16 0 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 28 ENC-R))
    (pad 10 thru_hole circle (at 10.16 -2.54 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 11 thru_hole circle (at 12.7 0 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 29 ENC-L))
    (pad 12 thru_hole circle (at 12.7 -2.54 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 13 thru_hole circle (at 15.24 0 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 14 thru_hole circle (at 15.24 -2.54 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (model "${KIPRJMOD}/packages3d/14 PIN HEADER.wrl"
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module WPSS_LIB:TerminalBlock_RND_205-00297_Pitch5.08mm (layer F.Cu) (tedit 59E50DA1)
    (at 147.32 50.8 270)
    (descr "terminal block RND 205-00297, 12 pins, pitch 5.08mm, size 60.96x10.16mm^2, drill diamater 1.6mm, pad diameter 3mm, see http://cdn-reichelt.de/documents/datenblatt/C151/RND_205-00287_DB_EN.pdf")
    (tags "THT terminal block RND 205-00297 pitch 5.08mm size 60.96x10.16mm^2 drill 1.6mm pad 3mm")
    (fp_text reference J6 (at -4.2418 -4.1148 270) (layer F.SilkS))
    (fp_text value Screw_Terminal_01x12 (at 27.94 6.36 270) (layer F.Fab))
    (fp_text user %R (at 27.94 -5.92 270) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0 270) (size 3 3) (drill 1.6) (layers *.Cu *.Mask)
      (net 30 EN+))
    (pad 2 thru_hole circle (at 5.08 0 270) (size 3 3) (drill 1.6) (layers *.Cu *.Mask)
      (net 31 EN-))
    (pad 3 thru_hole circle (at 10.16 0 270) (size 3 3) (drill 1.6) (layers *.Cu *.Mask)
      (net 80 REV))
    (pad 4 thru_hole circle (at 15.24 0 270) (size 3 3) (drill 1.6) (layers *.Cu *.Mask)
      (net 81 COM))
    (pad 5 thru_hole circle (at 20.32 0 270) (size 3 3) (drill 1.6) (layers *.Cu *.Mask)
      (net 82 FOR))
    (pad 6 thru_hole circle (at 25.4 0 270) (size 3 3) (drill 1.6) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 7 thru_hole circle (at 30.48 0 270) (size 3 3) (drill 1.6) (layers *.Cu *.Mask)
      (net 32 REVLIMIT))
    (pad 8 thru_hole circle (at 35.56 0 270) (size 3 3) (drill 1.6) (layers *.Cu *.Mask)
      (net 33 FORLIMIT))
    (pad 9 thru_hole circle (at 40.64 0 270) (size 3 3) (drill 1.6) (layers *.Cu *.Mask)
      (net 7 +12V))
    (pad 10 thru_hole circle (at 45.72 0 270) (size 3 3) (drill 1.6) (layers *.Cu *.Mask)
      (net 54 "Net-(J6-Pad10)"))
    (pad 11 thru_hole circle (at 50.8 0 270) (size 3 3) (drill 1.6) (layers *.Cu *.Mask)
      (net 54 "Net-(J6-Pad10)"))
    (pad 12 thru_hole circle (at 55.88 0 270) (size 3 3) (drill 1.6) (layers *.Cu *.Mask)
      (net 1 GND))
    (model "${KIPRJMOD}/packages3d/SCREW TERMINAL 5.08MM 12 contact.wrl"
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_1206_HandSoldering (layer B.Cu) (tedit 58E0A804)
    (at 109.061 115.9256)
    (descr "Resistor SMD 1206, hand soldering")
    (tags "resistor 1206")
    (attr smd)
    (fp_text reference R1 (at -0.095 -2.159) (layer B.SilkS))
    (fp_text value 1K (at 0 -1.9) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 1 smd rect (at -2 0) (size 2 1.7) (layers B.Cu B.Paste B.Mask)
      (net 34 "Net-(R1-Pad1)"))
    (pad 2 smd rect (at 2 0) (size 2 1.7) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (model ${KISYS3DMOD}/Resistors_SMD.3dshapes/R_1206.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_1206_HandSoldering (layer B.Cu) (tedit 58E0A804)
    (at 102.1019 115.9129)
    (descr "Resistor SMD 1206, hand soldering")
    (tags "resistor 1206")
    (attr smd)
    (fp_text reference R2 (at -0.032 -2.286) (layer B.SilkS))
    (fp_text value 1K (at 0 -1.9) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 1 smd rect (at -2 0) (size 2 1.7) (layers B.Cu B.Paste B.Mask)
      (net 35 "Net-(R2-Pad1)"))
    (pad 2 smd rect (at 2 0) (size 2 1.7) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (model ${KISYS3DMOD}/Resistors_SMD.3dshapes/R_1206.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_1206_HandSoldering (layer B.Cu) (tedit 58E0A804)
    (at 95.2246 115.9256)
    (descr "Resistor SMD 1206, hand soldering")
    (tags "resistor 1206")
    (attr smd)
    (fp_text reference R3 (at 0 -2.286) (layer B.SilkS))
    (fp_text value 1K (at 0 -1.9) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 1 smd rect (at -2 0) (size 2 1.7) (layers B.Cu B.Paste B.Mask)
      (net 36 "Net-(R3-Pad1)"))
    (pad 2 smd rect (at 2 0) (size 2 1.7) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (model ${KISYS3DMOD}/Resistors_SMD.3dshapes/R_1206.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_1206_HandSoldering (layer B.Cu) (tedit 58E0A804)
    (at 89.9668 94.7674 180)
    (descr "Resistor SMD 1206, hand soldering")
    (tags "resistor 1206")
    (attr smd)
    (fp_text reference R4 (at -0.1082 1.778 180) (layer B.SilkS))
    (fp_text value 1K (at -0.0574 -0.0508 180) (layer B.Fab))
    (fp_text user %R (at 0 0 180) (layer B.Fab))
    (pad 1 smd rect (at -2 0 180) (size 2 1.7) (layers B.Cu B.Paste B.Mask)
      (net 37 "Net-(R4-Pad1)"))
    (pad 2 smd rect (at 2 0 180) (size 2 1.7) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (model ${KISYS3DMOD}/Resistors_SMD.3dshapes/R_1206.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_1206_HandSoldering (layer B.Cu) (tedit 58E0A804)
    (at 137.319 115.951 180)
    (descr "Resistor SMD 1206, hand soldering")
    (tags "resistor 1206")
    (attr smd)
    (fp_text reference R6 (at -0.1082 1.8288 180) (layer B.SilkS))
    (fp_text value 4.7K (at 0 -1.9 180) (layer B.Fab))
    (fp_text user %R (at 0 0 180) (layer B.Fab))
    (pad 1 smd rect (at -2 0 180) (size 2 1.7) (layers B.Cu B.Paste B.Mask)
      (net 8 "Net-(D3-Pad2)"))
    (pad 2 smd rect (at 2 0 180) (size 2 1.7) (layers B.Cu B.Paste B.Mask)
      (net 4 +5V))
    (model ${KISYS3DMOD}/Resistors_SMD.3dshapes/R_1206.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_1206_HandSoldering (layer B.Cu) (tedit 58E0A804)
    (at 87.884 67.31 270)
    (descr "Resistor SMD 1206, hand soldering")
    (tags "resistor 1206")
    (attr smd)
    (fp_text reference R7 (at 0 1.85 270) (layer B.SilkS))
    (fp_text value 10K (at 0 -1.9 270) (layer B.Fab))
    (fp_text user %R (at 0 0 270) (layer B.Fab))
    (pad 1 smd rect (at -2 0 270) (size 2 1.7) (layers B.Cu B.Paste B.Mask)
      (net 4 +5V))
    (pad 2 smd rect (at 2 0 270) (size 2 1.7) (layers B.Cu B.Paste B.Mask)
      (net 13 RESET))
    (model ${KISYS3DMOD}/Resistors_SMD.3dshapes/R_1206.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_1206_HandSoldering (layer B.Cu) (tedit 58E0A804)
    (at 95.758 62.706 90)
    (descr "Resistor SMD 1206, hand soldering")
    (tags "resistor 1206")
    (attr smd)
    (fp_text reference R8 (at 0 1.85 90) (layer B.SilkS))
    (fp_text value 10K (at 0 -1.9 90) (layer B.Fab))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 1 smd rect (at -2 0 90) (size 2 1.7) (layers B.Cu B.Paste B.Mask)
      (net 4 +5V))
    (pad 2 smd rect (at 2 0 90) (size 2 1.7) (layers B.Cu B.Paste B.Mask)
      (net 38 "Net-(R8-Pad2)"))
    (model ${KISYS3DMOD}/Resistors_SMD.3dshapes/R_1206.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_1206_HandSoldering (layer B.Cu) (tedit 58E0A804)
    (at 101.092 64.77)
    (descr "Resistor SMD 1206, hand soldering")
    (tags "resistor 1206")
    (attr smd)
    (fp_text reference R9 (at 0 1.85) (layer B.SilkS))
    (fp_text value 10K (at 0 -1.9) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 1 smd rect (at -2 0) (size 2 1.7) (layers B.Cu B.Paste B.Mask)
      (net 4 +5V))
    (pad 2 smd rect (at 2 0) (size 2 1.7) (layers B.Cu B.Paste B.Mask)
      (net 39 "Net-(R9-Pad2)"))
    (model ${KISYS3DMOD}/Resistors_SMD.3dshapes/R_1206.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_1206_HandSoldering (layer B.Cu) (tedit 58E0A804)
    (at 127.921 69.088 180)
    (descr "Resistor SMD 1206, hand soldering")
    (tags "resistor 1206")
    (attr smd)
    (fp_text reference R10 (at 0 1.85 180) (layer B.SilkS))
    (fp_text value 1K (at 0 -1.9 180) (layer B.Fab))
    (fp_text user %R (at 0 0 180) (layer B.Fab))
    (pad 1 smd rect (at -2 0 180) (size 2 1.7) (layers B.Cu B.Paste B.Mask)
      (net 40 "Net-(R10-Pad1)"))
    (pad 2 smd rect (at 2 0 180) (size 2 1.7) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (model ${KISYS3DMOD}/Resistors_SMD.3dshapes/R_1206.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_1206_HandSoldering (layer B.Cu) (tedit 58E0A804)
    (at 128.048 62.23 180)
    (descr "Resistor SMD 1206, hand soldering")
    (tags "resistor 1206")
    (attr smd)
    (fp_text reference R11 (at 0 1.85 180) (layer B.SilkS))
    (fp_text value 1K (at 0 -1.9 180) (layer B.Fab))
    (fp_text user %R (at 0 0 180) (layer B.Fab))
    (pad 1 smd rect (at -2 0 180) (size 2 1.7) (layers B.Cu B.Paste B.Mask)
      (net 41 "Net-(R11-Pad1)"))
    (pad 2 smd rect (at 2 0 180) (size 2 1.7) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (model ${KISYS3DMOD}/Resistors_SMD.3dshapes/R_1206.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_1206_HandSoldering (layer B.Cu) (tedit 58E0A804)
    (at 128.048 52.07 180)
    (descr "Resistor SMD 1206, hand soldering")
    (tags "resistor 1206")
    (attr smd)
    (fp_text reference R12 (at 0 1.85 180) (layer B.SilkS))
    (fp_text value 1K (at 0 -1.9 180) (layer B.Fab))
    (fp_text user %R (at 0 0 180) (layer B.Fab))
    (pad 1 smd rect (at -2 0 180) (size 2 1.7) (layers B.Cu B.Paste B.Mask)
      (net 42 "Net-(R12-Pad1)"))
    (pad 2 smd rect (at 2 0 180) (size 2 1.7) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (model ${KISYS3DMOD}/Resistors_SMD.3dshapes/R_1206.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Buttons_Switches_THT:SW_PUSH_6mm (layer F.Cu) (tedit 5923F252)
    (at 89.154 83.208 90)
    (descr https://www.omron.com/ecb/products/pdf/en-b3f.pdf)
    (tags "tact sw push 6mm")
    (fp_text reference SW1 (at 3.25 -2 90) (layer F.SilkS))
    (fp_text value SW_Push (at 3.75 6.7 90) (layer F.Fab))
    (fp_text user %R (at 3.25 2.25 90) (layer F.Fab))
    (pad 2 thru_hole circle (at 0 4.5 180) (size 2 2) (drill 1.1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 1 thru_hole circle (at 0 0 180) (size 2 2) (drill 1.1) (layers *.Cu *.Mask)
      (net 13 RESET))
    (pad 2 thru_hole circle (at 6.5 4.5 180) (size 2 2) (drill 1.1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 1 thru_hole circle (at 6.5 0 180) (size 2 2) (drill 1.1) (layers *.Cu *.Mask)
      (net 13 RESET))
    (model ${KISYS3DMOD}/Buttons_Switches_THT.3dshapes/SW_PUSH_6mm.wrl
      (at (xyz 0.005 0 0))
      (scale (xyz 0.3937 0.3937 0.3937))
      (rotate (xyz 0 0 0))
    )
  )
  (module Housings_SOIC:SO-4_4.4x4.3mm_Pitch2.54mm (layer B.Cu) (tedit 59596140)
    (at 91.0336 100.7138 270)
    (descr "4-Lead Plastic Small Outline (SO), see https://docs.broadcom.com/docs/AV02-0173EN")
    (tags "SO SOIC 2.54")
    (attr smd)
    (fp_text reference U1 (at -0.3584 3.6576 360) (layer B.SilkS))
    (fp_text value C226STR (at 0 -3.5 270) (layer B.Fab))
    (fp_text user %R (at 0 0 270) (layer B.Fab))
    (pad 4 smd rect (at 3 1.27) (size 0.8 1.2) (layers B.Cu B.Paste B.Mask)
      (net 15 "Net-(J4-Pad1)"))
    (pad 1 smd rect (at -3 1.27) (size 0.8 1.2) (layers B.Cu B.Paste B.Mask)
      (net 60 K8))
    (pad 2 smd rect (at -3 -1.27) (size 0.8 1.2) (layers B.Cu B.Paste B.Mask)
      (net 37 "Net-(R4-Pad1)"))
    (pad 3 smd rect (at 3 -1.27) (size 0.8 1.2) (layers B.Cu B.Paste B.Mask)
      (net 55 "Net-(J4-Pad9)"))
    (model ${KIPRJMOD}/packages3d/SOP-4-PIN-SMD.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Housings_SOIC:SO-4_4.4x4.3mm_Pitch2.54mm (layer B.Cu) (tedit 59596140)
    (at 95.885 100.7138 270)
    (descr "4-Lead Plastic Small Outline (SO), see https://docs.broadcom.com/docs/AV02-0173EN")
    (tags "SO SOIC 2.54")
    (attr smd)
    (fp_text reference U2 (at -4.826 0 360) (layer B.SilkS))
    (fp_text value C226STR (at 0 -3.5 270) (layer B.Fab))
    (fp_text user %R (at 0 0 270) (layer B.Fab))
    (pad 4 smd rect (at 3 1.27) (size 0.8 1.2) (layers B.Cu B.Paste B.Mask)
      (net 16 "Net-(J4-Pad2)"))
    (pad 1 smd rect (at -3 1.27) (size 0.8 1.2) (layers B.Cu B.Paste B.Mask)
      (net 61 K7))
    (pad 2 smd rect (at -3 -1.27) (size 0.8 1.2) (layers B.Cu B.Paste B.Mask)
      (net 36 "Net-(R3-Pad1)"))
    (pad 3 smd rect (at 3 -1.27) (size 0.8 1.2) (layers B.Cu B.Paste B.Mask)
      (net 55 "Net-(J4-Pad9)"))
    (model ${KIPRJMOD}/packages3d/SOP-4-PIN-SMD.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Housings_SOIC:SO-4_4.4x4.3mm_Pitch2.54mm (layer B.Cu) (tedit 59596140)
    (at 100.7364 100.7138 270)
    (descr "4-Lead Plastic Small Outline (SO), see https://docs.broadcom.com/docs/AV02-0173EN")
    (tags "SO SOIC 2.54")
    (attr smd)
    (fp_text reference U3 (at -4.826 0 540) (layer B.SilkS))
    (fp_text value C226STR (at 0 -3.5 270) (layer B.Fab))
    (fp_text user %R (at 0 0 270) (layer B.Fab))
    (pad 4 smd rect (at 3 1.27) (size 0.8 1.2) (layers B.Cu B.Paste B.Mask)
      (net 17 "Net-(J4-Pad3)"))
    (pad 1 smd rect (at -3 1.27) (size 0.8 1.2) (layers B.Cu B.Paste B.Mask)
      (net 62 K6))
    (pad 2 smd rect (at -3 -1.27) (size 0.8 1.2) (layers B.Cu B.Paste B.Mask)
      (net 35 "Net-(R2-Pad1)"))
    (pad 3 smd rect (at 3 -1.27) (size 0.8 1.2) (layers B.Cu B.Paste B.Mask)
      (net 55 "Net-(J4-Pad9)"))
    (model ${KIPRJMOD}/packages3d/SOP-4-PIN-SMD.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Housings_SOIC:SO-4_4.4x4.3mm_Pitch2.54mm (layer B.Cu) (tedit 59596140)
    (at 105.5878 100.7138 270)
    (descr "4-Lead Plastic Small Outline (SO), see https://docs.broadcom.com/docs/AV02-0173EN")
    (tags "SO SOIC 2.54")
    (attr smd)
    (fp_text reference U4 (at -4.826 0 360) (layer B.SilkS))
    (fp_text value C226STR (at 0 -3.5 270) (layer B.Fab))
    (fp_text user %R (at 0 0 270) (layer B.Fab))
    (pad 4 smd rect (at 3 1.27) (size 0.8 1.2) (layers B.Cu B.Paste B.Mask)
      (net 18 "Net-(J4-Pad4)"))
    (pad 1 smd rect (at -3 1.27) (size 0.8 1.2) (layers B.Cu B.Paste B.Mask)
      (net 63 K5))
    (pad 2 smd rect (at -3 -1.27) (size 0.8 1.2) (layers B.Cu B.Paste B.Mask)
      (net 34 "Net-(R1-Pad1)"))
    (pad 3 smd rect (at 3 -1.27) (size 0.8 1.2) (layers B.Cu B.Paste B.Mask)
      (net 55 "Net-(J4-Pad9)"))
    (model ${KIPRJMOD}/packages3d/SOP-4-PIN-SMD.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Weatherport:7805_DPAK_2 (layer B.Cu) (tedit 59F3A1A6)
    (at 135.381 104.394 180)
    (fp_text reference U5 (at 0 11.938 180) (layer B.SilkS))
    (fp_text value LM7805_TO220 (at 0 11.43 180) (layer B.Fab))
    (pad 3 smd rect (at 2.285 0 90) (size 3 1.6) (layers B.Cu B.Paste B.Mask)
      (net 4 +5V) (solder_mask_margin 0.1) (solder_paste_margin 0.1) (clearance 0.4))
    (pad 1 smd rect (at -2.285 0 90) (size 3 1.6) (layers B.Cu B.Paste B.Mask)
      (net 3 "Net-(C1-Pad1)") (solder_mask_margin 0.1) (solder_paste_margin 0.1) (clearance 0.4))
    (pad 2 smd rect (at 0 7.18 90) (size 6.2 5.8) (layers B.Cu B.Paste B.Mask)
      (net 1 GND) (zone_connect 1) (thermal_width 0.4) (thermal_gap 0.4))
    (model ${KIPRJMOD}/packages3d/DPAK_3.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Housings_SOIC:SOIC-16W_7.5x10.3mm_Pitch1.27mm (layer B.Cu) (tedit 58CC8F64)
    (at 106.934 56.896)
    (descr "16-Lead Plastic Small Outline (SO) - Wide, 7.50 mm Body [SOIC] (see Microchip Packaging Specification 00000049BS.pdf)")
    (tags "SOIC 1.27")
    (attr smd)
    (fp_text reference U7 (at 0 6.25) (layer B.SilkS))
    (fp_text value DS3231 (at 0 -6.25) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 1 smd rect (at -4.65 4.445) (size 1.5 0.6) (layers B.Cu B.Paste B.Mask)
      (net 39 "Net-(R9-Pad2)"))
    (pad 2 smd rect (at -4.65 3.175) (size 1.5 0.6) (layers B.Cu B.Paste B.Mask)
      (net 4 +5V))
    (pad 3 smd rect (at -4.65 1.905) (size 1.5 0.6) (layers B.Cu B.Paste B.Mask)
      (net 38 "Net-(R8-Pad2)"))
    (pad 4 smd rect (at -4.65 0.635) (size 1.5 0.6) (layers B.Cu B.Paste B.Mask)
      (net 53 "Net-(U7-Pad4)"))
    (pad 5 smd rect (at -4.65 -0.635) (size 1.5 0.6) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (pad 6 smd rect (at -4.65 -1.905) (size 1.5 0.6) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (pad 7 smd rect (at -4.65 -3.175) (size 1.5 0.6) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (pad 8 smd rect (at -4.65 -4.445) (size 1.5 0.6) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (pad 9 smd rect (at 4.65 -4.445) (size 1.5 0.6) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (pad 10 smd rect (at 4.65 -3.175) (size 1.5 0.6) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (pad 11 smd rect (at 4.65 -1.905) (size 1.5 0.6) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (pad 12 smd rect (at 4.65 -0.635) (size 1.5 0.6) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (pad 13 smd rect (at 4.65 0.635) (size 1.5 0.6) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (pad 14 smd rect (at 4.65 1.905) (size 1.5 0.6) (layers B.Cu B.Paste B.Mask)
      (net 2 "Net-(BAT1-PadPos)"))
    (pad 15 smd rect (at 4.65 3.175) (size 1.5 0.6) (layers B.Cu B.Paste B.Mask)
      (net 23 SDA))
    (pad 16 smd rect (at 4.65 4.445) (size 1.5 0.6) (layers B.Cu B.Paste B.Mask)
      (net 24 SCL))
    (model ${KISYS3DMOD}/Housings_SOIC.3dshapes/SOIC-16W_7.5x10.3mm_Pitch1.27mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Housings_SOIC:SO-4_4.4x4.3mm_Pitch2.54mm (layer B.Cu) (tedit 59596140)
    (at 136.1666 70.3834)
    (descr "4-Lead Plastic Small Outline (SO), see https://docs.broadcom.com/docs/AV02-0173EN")
    (tags "SO SOIC 2.54")
    (attr smd)
    (fp_text reference U8 (at 0 3.5) (layer B.SilkS))
    (fp_text value ASSR-1218 (at 0 -3.5) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 4 smd rect (at 3 1.27 90) (size 0.8 1.2) (layers B.Cu B.Paste B.Mask)
      (net 82 FOR))
    (pad 1 smd rect (at -3 1.27 90) (size 0.8 1.2) (layers B.Cu B.Paste B.Mask)
      (net 52 MFOR))
    (pad 2 smd rect (at -3 -1.27 90) (size 0.8 1.2) (layers B.Cu B.Paste B.Mask)
      (net 40 "Net-(R10-Pad1)"))
    (pad 3 smd rect (at 3 -1.27 90) (size 0.8 1.2) (layers B.Cu B.Paste B.Mask)
      (net 81 COM))
    (model ${KIPRJMOD}/packages3d/ASSR_1218.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Housings_SOIC:SO-4_4.4x4.3mm_Pitch2.54mm (layer B.Cu) (tedit 59596140)
    (at 136.192 63.5)
    (descr "4-Lead Plastic Small Outline (SO), see https://docs.broadcom.com/docs/AV02-0173EN")
    (tags "SO SOIC 2.54")
    (attr smd)
    (fp_text reference U9 (at 0 3.5) (layer B.SilkS))
    (fp_text value ASSR-1218 (at 0 -3.5) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 4 smd rect (at 3 1.27 90) (size 0.8 1.2) (layers B.Cu B.Paste B.Mask)
      (net 81 COM))
    (pad 1 smd rect (at -3 1.27 90) (size 0.8 1.2) (layers B.Cu B.Paste B.Mask)
      (net 51 MREV))
    (pad 2 smd rect (at -3 -1.27 90) (size 0.8 1.2) (layers B.Cu B.Paste B.Mask)
      (net 41 "Net-(R11-Pad1)"))
    (pad 3 smd rect (at 3 -1.27 90) (size 0.8 1.2) (layers B.Cu B.Paste B.Mask)
      (net 80 REV))
    (model ${KIPRJMOD}/packages3d/ASSR_1218.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Housings_SOIC:SO-4_4.4x4.3mm_Pitch2.54mm (layer B.Cu) (tedit 59596140)
    (at 136.144 53.34)
    (descr "4-Lead Plastic Small Outline (SO), see https://docs.broadcom.com/docs/AV02-0173EN")
    (tags "SO SOIC 2.54")
    (attr smd)
    (fp_text reference U10 (at 0 3.5) (layer B.SilkS))
    (fp_text value ASSR-1218 (at 0 -3.5) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 4 smd rect (at 3 1.27 90) (size 0.8 1.2) (layers B.Cu B.Paste B.Mask)
      (net 31 EN-))
    (pad 1 smd rect (at -3 1.27 90) (size 0.8 1.2) (layers B.Cu B.Paste B.Mask)
      (net 50 M_EN))
    (pad 2 smd rect (at -3 -1.27 90) (size 0.8 1.2) (layers B.Cu B.Paste B.Mask)
      (net 42 "Net-(R12-Pad1)"))
    (pad 3 smd rect (at 3 -1.27 90) (size 0.8 1.2) (layers B.Cu B.Paste B.Mask)
      (net 30 EN+))
    (model ${KIPRJMOD}/packages3d/ASSR_1218.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Crystals:Crystal_HC18-U_Vertical (layer F.Cu) (tedit 58CD2E9B)
    (at 104.394 85.598 180)
    (descr "Crystal THT HC-18/U, http://5hertz.com/pdfs/04404_D.pdf")
    (tags "THT crystalHC-18/U")
    (fp_text reference Y1 (at 2.45 -3.525 180) (layer F.SilkS))
    (fp_text value Crystal (at 2.45 3.525 180) (layer F.Fab))
    (fp_text user %R (at 2.45 0 180) (layer F.Fab))
    (pad 1 thru_hole circle (at 0 0 180) (size 1.5 1.5) (drill 0.8) (layers *.Cu *.Mask)
      (net 5 "Net-(C4-Pad2)"))
    (pad 2 thru_hole circle (at 4.9 0 180) (size 1.5 1.5) (drill 0.8) (layers *.Cu *.Mask)
      (net 6 "Net-(C5-Pad2)"))
    (model "${KIPRJMOD}/packages3d/Crystal lowprofile.wrl"
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Weatherport:Weatherport_logo (layer F.Cu) (tedit 0)
    (at 103.378 46.228)
    (fp_text reference G*** (at 0 0) (layer F.SilkS) hide)
    (fp_text value LOGO (at 0.75 0) (layer F.SilkS) hide)
  )
  (module Mounting_Holes:MountingHole_3mm_Pad (layer F.Cu) (tedit 5B03284F)
    (at 147.066 42.926)
    (descr "Mounting Hole 3mm")
    (tags "mounting hole 3mm")
    (attr virtual)
    (fp_text reference "" (at 0 -4) (layer F.SilkS))
    (fp_text value MountingHole_3mm_Pad (at 0 4) (layer F.Fab))
    (fp_text user %R (at 0.3 0) (layer F.Fab))
    (pad 1 thru_hole circle (at 0 0) (size 6 6) (drill 3) (layers *.Cu *.Mask))
  )
  (module Mounting_Holes:MountingHole_3mm_Pad (layer F.Cu) (tedit 5B03284A)
    (at 81.026 42.926)
    (descr "Mounting Hole 3mm")
    (tags "mounting hole 3mm")
    (attr virtual)
    (fp_text reference "" (at 0 -4) (layer F.SilkS))
    (fp_text value MountingHole_3mm_Pad (at 0 4) (layer F.Fab))
    (fp_text user %R (at 0.3 0) (layer F.Fab))
    (pad 1 thru_hole circle (at 0 0) (size 6 6) (drill 3) (layers *.Cu *.Mask))
  )
  (module Mounting_Holes:MountingHole_3mm_Pad (layer F.Cu) (tedit 5B16D90F)
    (at 81.026 114.046)
    (descr "Mounting Hole 3mm")
    (tags "mounting hole 3mm")
    (attr virtual)
    (fp_text reference "" (at 0 -4) (layer F.SilkS))
    (fp_text value MountingHole_3mm_Pad (at 0 4) (layer F.Fab))
    (fp_text user %R (at 0.3 0) (layer F.Fab))
    (pad 1 thru_hole circle (at 0 0) (size 6 6) (drill 3) (layers *.Cu *.Mask))
  )
  (module Mounting_Holes:MountingHole_3mm_Pad (layer F.Cu) (tedit 5B032863)
    (at 147.066 114.046)
    (descr "Mounting Hole 3mm")
    (tags "mounting hole 3mm")
    (attr virtual)
    (fp_text reference "" (at 0 -4) (layer F.SilkS))
    (fp_text value MountingHole_3mm_Pad (at 0 4) (layer F.Fab))
    (fp_text user %R (at 0.3 0) (layer F.Fab))
    (pad 1 thru_hole circle (at 0 0) (size 6 6) (drill 3) (layers *.Cu *.Mask))
  )
  (module TerminalBlock_RND:TerminalBlock_RND_205-00239_Pitch5.08mm (layer F.Cu) (tedit 59E50DAB)
    (at 89.154 109.22)
    (descr "terminal block RND 205-00239, 9 pins, pitch 5.08mm, size 45.72x8.45mm^2, drill diamater 1.3mm, pad diameter 2.5mm, see http://cdn-reichelt.de/documents/datenblatt/C151/RND_205-00232_DB_EN.pdf")
    (tags "THT terminal block RND 205-00239 pitch 5.08mm size 45.72x8.45mm^2 drill 1.3mm pad 2.5mm")
    (fp_text reference J4 (at -4.4958 -3.4036) (layer F.SilkS))
    (fp_text value Screw_Terminal_01x09 (at 20.32 5.11) (layer F.Fab))
    (fp_text user %R (at 20.32 -5.46) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0) (size 2.5 2.5) (drill 1.3) (layers *.Cu *.Mask)
      (net 15 "Net-(J4-Pad1)"))
    (pad 2 thru_hole circle (at 5.08 0) (size 2.5 2.5) (drill 1.3) (layers *.Cu *.Mask)
      (net 16 "Net-(J4-Pad2)"))
    (pad 3 thru_hole circle (at 10.16 0) (size 2.5 2.5) (drill 1.3) (layers *.Cu *.Mask)
      (net 17 "Net-(J4-Pad3)"))
    (pad 4 thru_hole circle (at 15.24 0) (size 2.5 2.5) (drill 1.3) (layers *.Cu *.Mask)
      (net 18 "Net-(J4-Pad4)"))
    (pad 5 thru_hole circle (at 20.32 0) (size 2.5 2.5) (drill 1.3) (layers *.Cu *.Mask)
      (net 19 "Net-(J4-Pad5)"))
    (pad 6 thru_hole circle (at 25.4 0) (size 2.5 2.5) (drill 1.3) (layers *.Cu *.Mask)
      (net 20 "Net-(J4-Pad6)"))
    (pad 7 thru_hole circle (at 30.48 0) (size 2.5 2.5) (drill 1.3) (layers *.Cu *.Mask)
      (net 21 "Net-(J4-Pad7)"))
    (pad 8 thru_hole circle (at 35.56 0) (size 2.5 2.5) (drill 1.3) (layers *.Cu *.Mask)
      (net 22 "Net-(J4-Pad8)"))
    (pad 9 thru_hole circle (at 40.64 0) (size 2.5 2.5) (drill 1.3) (layers *.Cu *.Mask)
      (net 55 "Net-(J4-Pad9)"))
    (model ${KISYS3DMOD}/TerminalBlock_RND.3dshapes/TerminalBlock_RND_205-00239_Pitch5.08mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_1206_HandSoldering (layer B.Cu) (tedit 58E0A804)
    (at 128.8542 96.774 90)
    (descr "Resistor SMD 1206, hand soldering")
    (tags "resistor 1206")
    (attr smd)
    (fp_text reference R13 (at 0 1.85 90) (layer B.SilkS))
    (fp_text value 1K (at 0 -1.9 90) (layer B.Fab))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 1 smd rect (at -2 0 90) (size 2 1.7) (layers B.Cu B.Paste B.Mask)
      (net 56 "Net-(R13-Pad1)"))
    (pad 2 smd rect (at 2 0 90) (size 2 1.7) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (model ${KISYS3DMOD}/Resistors_SMD.3dshapes/R_1206.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_1206_HandSoldering (layer B.Cu) (tedit 58E0A804)
    (at 129.9906 115.9256)
    (descr "Resistor SMD 1206, hand soldering")
    (tags "resistor 1206")
    (attr smd)
    (fp_text reference R14 (at 0.1524 -2.341) (layer B.SilkS))
    (fp_text value 1K (at 0 -1.9) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 1 smd rect (at -2 0) (size 2 1.7) (layers B.Cu B.Paste B.Mask)
      (net 57 "Net-(R14-Pad1)"))
    (pad 2 smd rect (at 2 0) (size 2 1.7) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (model ${KISYS3DMOD}/Resistors_SMD.3dshapes/R_1206.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_1206_HandSoldering (layer B.Cu) (tedit 58E0A804)
    (at 122.9487 115.9256)
    (descr "Resistor SMD 1206, hand soldering")
    (tags "resistor 1206")
    (attr smd)
    (fp_text reference R15 (at 0.1524 -2.341) (layer B.SilkS))
    (fp_text value 1K (at 0 -1.9) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 1 smd rect (at -2 0) (size 2 1.7) (layers B.Cu B.Paste B.Mask)
      (net 58 "Net-(R15-Pad1)"))
    (pad 2 smd rect (at 2 0) (size 2 1.7) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (model ${KISYS3DMOD}/Resistors_SMD.3dshapes/R_1206.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistors_SMD:R_1206_HandSoldering (layer B.Cu) (tedit 58E0A804)
    (at 116.0206 115.9129)
    (descr "Resistor SMD 1206, hand soldering")
    (tags "resistor 1206")
    (attr smd)
    (fp_text reference R16 (at 0.1524 -2.341) (layer B.SilkS))
    (fp_text value 1K (at 0 -1.9) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 1 smd rect (at -2 0) (size 2 1.7) (layers B.Cu B.Paste B.Mask)
      (net 59 "Net-(R16-Pad1)"))
    (pad 2 smd rect (at 2 0) (size 2 1.7) (layers B.Cu B.Paste B.Mask)
      (net 1 GND))
    (model ${KISYS3DMOD}/Resistors_SMD.3dshapes/R_1206.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Housings_SOIC:SO-4_4.4x4.3mm_Pitch2.54mm (layer B.Cu) (tedit 59596140)
    (at 110.4392 100.7138 270)
    (descr "4-Lead Plastic Small Outline (SO), see https://docs.broadcom.com/docs/AV02-0173EN")
    (tags "SO SOIC 2.54")
    (attr smd)
    (fp_text reference U12 (at -4.778 0.0254 360) (layer B.SilkS))
    (fp_text value C226STR (at 0 -3.5 270) (layer B.Fab))
    (fp_text user %R (at 0 0 270) (layer B.Fab))
    (pad 4 smd rect (at 3 1.27) (size 0.8 1.2) (layers B.Cu B.Paste B.Mask)
      (net 19 "Net-(J4-Pad5)"))
    (pad 1 smd rect (at -3 1.27) (size 0.8 1.2) (layers B.Cu B.Paste B.Mask)
      (net 43 K4))
    (pad 2 smd rect (at -3 -1.27) (size 0.8 1.2) (layers B.Cu B.Paste B.Mask)
      (net 59 "Net-(R16-Pad1)"))
    (pad 3 smd rect (at 3 -1.27) (size 0.8 1.2) (layers B.Cu B.Paste B.Mask)
      (net 55 "Net-(J4-Pad9)"))
    (model ${KIPRJMOD}/packages3d/SOP-4-PIN-SMD.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Housings_SOIC:SO-4_4.4x4.3mm_Pitch2.54mm (layer B.Cu) (tedit 59596140)
    (at 115.2906 100.7138 270)
    (descr "4-Lead Plastic Small Outline (SO), see https://docs.broadcom.com/docs/AV02-0173EN")
    (tags "SO SOIC 2.54")
    (attr smd)
    (fp_text reference U13 (at -4.905 -0.127 360) (layer B.SilkS))
    (fp_text value C226STR (at 0 -3.5 270) (layer B.Fab))
    (fp_text user %R (at 0 0 270) (layer B.Fab))
    (pad 4 smd rect (at 3 1.27) (size 0.8 1.2) (layers B.Cu B.Paste B.Mask)
      (net 20 "Net-(J4-Pad6)"))
    (pad 1 smd rect (at -3 1.27) (size 0.8 1.2) (layers B.Cu B.Paste B.Mask)
      (net 44 K3))
    (pad 2 smd rect (at -3 -1.27) (size 0.8 1.2) (layers B.Cu B.Paste B.Mask)
      (net 58 "Net-(R15-Pad1)"))
    (pad 3 smd rect (at 3 -1.27) (size 0.8 1.2) (layers B.Cu B.Paste B.Mask)
      (net 55 "Net-(J4-Pad9)"))
    (model ${KIPRJMOD}/packages3d/SOP-4-PIN-SMD.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Housings_SOIC:SO-4_4.4x4.3mm_Pitch2.54mm (layer B.Cu) (tedit 59596140)
    (at 120.142 100.7138 270)
    (descr "4-Lead Plastic Small Outline (SO), see https://docs.broadcom.com/docs/AV02-0173EN")
    (tags "SO SOIC 2.54")
    (attr smd)
    (fp_text reference U14 (at -4.9558 -0.1524 360) (layer B.SilkS))
    (fp_text value C226STR (at 0 -3.5 270) (layer B.Fab))
    (fp_text user %R (at 0 0 270) (layer B.Fab))
    (pad 4 smd rect (at 3 1.27) (size 0.8 1.2) (layers B.Cu B.Paste B.Mask)
      (net 21 "Net-(J4-Pad7)"))
    (pad 1 smd rect (at -3 1.27) (size 0.8 1.2) (layers B.Cu B.Paste B.Mask)
      (net 45 K2))
    (pad 2 smd rect (at -3 -1.27) (size 0.8 1.2) (layers B.Cu B.Paste B.Mask)
      (net 57 "Net-(R14-Pad1)"))
    (pad 3 smd rect (at 3 -1.27) (size 0.8 1.2) (layers B.Cu B.Paste B.Mask)
      (net 55 "Net-(J4-Pad9)"))
    (model ${KIPRJMOD}/packages3d/SOP-4-PIN-SMD.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Housings_SOIC:SO-4_4.4x4.3mm_Pitch2.54mm (layer B.Cu) (tedit 59596140)
    (at 124.9934 100.7138 270)
    (descr "4-Lead Plastic Small Outline (SO), see https://docs.broadcom.com/docs/AV02-0173EN")
    (tags "SO SOIC 2.54")
    (attr smd)
    (fp_text reference U15 (at -4.9558 -0.127 360) (layer B.SilkS))
    (fp_text value C226STR (at 0 -3.5 270) (layer B.Fab))
    (fp_text user %R (at 0 0 270) (layer B.Fab))
    (pad 4 smd rect (at 3 1.27) (size 0.8 1.2) (layers B.Cu B.Paste B.Mask)
      (net 22 "Net-(J4-Pad8)"))
    (pad 1 smd rect (at -3 1.27) (size 0.8 1.2) (layers B.Cu B.Paste B.Mask)
      (net 46 K1))
    (pad 2 smd rect (at -3 -1.27) (size 0.8 1.2) (layers B.Cu B.Paste B.Mask)
      (net 56 "Net-(R13-Pad1)"))
    (pad 3 smd rect (at 3 -1.27) (size 0.8 1.2) (layers B.Cu B.Paste B.Mask)
      (net 55 "Net-(J4-Pad9)"))
    (model ${KIPRJMOD}/packages3d/SOP-4-PIN-SMD.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Pin_Headers:Pin_Header_Straight_2x06_Pitch2.54mm (layer F.Cu) (tedit 59650532)
    (at 133.1468 90.0938 180)
    (descr "Through hole straight pin header, 2x06, 2.54mm pitch, double rows")
    (tags "Through hole pin header THT 2x06 2.54mm double row")
    (fp_text reference J7 (at 1.27 -2.33 180) (layer F.SilkS))
    (fp_text value Conn_02x06_Counter_Clockwise (at 1.27 15.03 180) (layer F.Fab))
    (fp_text user %R (at 1.27 6.35 270) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 4 +5V))
    (pad 2 thru_hole oval (at 2.54 0 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 68 K9))
    (pad 3 thru_hole oval (at 0 2.54 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 69 K10))
    (pad 4 thru_hole oval (at 2.54 2.54 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 70 K11))
    (pad 5 thru_hole oval (at 0 5.08 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 71 K12))
    (pad 6 thru_hole oval (at 2.54 5.08 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 72 K13))
    (pad 7 thru_hole oval (at 0 7.62 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 GND))
    (pad 8 thru_hole oval (at 2.54 7.62 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 73 K14))
    (pad 9 thru_hole oval (at 0 10.16 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 74 K15))
    (pad 10 thru_hole oval (at 2.54 10.16 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 75 K16))
    (pad 11 thru_hole oval (at 0 12.7 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 76 TX))
    (pad 12 thru_hole oval (at 2.54 12.7 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 77 RX))
    (model ${KISYS3DMOD}/Pin_Headers.3dshapes/Pin_Header_Straight_2x06_Pitch2.54mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (gr_text EXPANSION (at 127.2794 83.8962 90) (layer F.SilkS))
  (gr_text K7 (at 89.154 101.854 90) (layer F.SilkS))
  (gr_text K6 (at 94.488 101.854 90) (layer F.SilkS))
  (gr_text K5 (at 99.314 101.854 90) (layer F.SilkS))
  (gr_text K4 (at 104.521 101.854 90) (layer F.SilkS))
  (gr_text K-IN (at 129.667 101.473 90) (layer F.SilkS))
  (gr_text ICSP (at 97.028 67.818) (layer F.SilkS))
  (gr_text SENSOR (at 84.0232 93.5482 270) (layer F.SilkS))
  (gr_text RESET (at 96.5962 79.9211 90) (layer F.SilkS))
  (gr_text PWR (at 136.7536 115.1636) (layer F.SilkS))
  (gr_text "Growport controller Rev 2.1" (at 129.032 46.228) (layer F.SilkS))
  (gr_text K3 (at 109.474 101.854 90) (layer F.SilkS))
  (gr_text K2 (at 114.554 101.854 90) (layer F.SilkS))
  (gr_text K1 (at 119.761 101.854 90) (layer F.SilkS))
  (gr_text K0 (at 124.714 101.854 90) (layer F.SilkS))
  (gr_text "EN+\nEN-\nREV\nCOM\nFOR\nLMCM\nLMT1\nLMT2\nKILL\nKILL\n+V\nGND" (at 138.938 78.74) (layer F.SilkS))
  (gr_line (start 79.502 39.386) (end 150.622 39.386) (angle 90) (layer Edge.Cuts) (width 0.1))
  (gr_line (start 153.797 42.561) (end 153.797 114.951) (angle 90) (layer Edge.Cuts) (width 0.1))
  (gr_line (start 150.622 118.126) (end 79.502 118.126) (angle 90) (layer Edge.Cuts) (width 0.1))
  (gr_line (start 76.327 114.951) (end 76.327 42.561) (angle 90) (layer Edge.Cuts) (width 0.1))
  (gr_arc (start 79.502 114.951) (end 76.327 114.951) (angle -90) (layer Edge.Cuts) (width 0.1))
  (gr_arc (start 150.622 114.951) (end 150.622 118.126) (angle -90) (layer Edge.Cuts) (width 0.1))
  (gr_arc (start 150.622 42.561) (end 153.797 42.561) (angle -90) (layer Edge.Cuts) (width 0.1))
  (gr_arc (start 79.502 42.561) (end 79.502 39.386) (angle -90) (layer Edge.Cuts) (width 0.1))
  (zone (net 1) (net_name GND) (layer F.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 153.416 119.126) (xy 153.416 37.846) (xy 75.946 37.846) (xy 75.946 119.126)
      )
    )
  )
  (zone (net 1) (net_name GND) (layer B.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.508))
    (min_thickness 0.254)
    (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 75.946 37.846) (xy 153.416 37.846) (xy 153.416 119.126) (xy 75.946 119.126)
      )
    )
  )
  (zone (net 0) (net_name "") (layer B.Cu) (hatch edge 0.508)
    (connect_pads (clearance 0.508))
    (min_thickness 0.254)
    (keepout (tracks allowed) (vias allowed) (copperpour not_allowed))
    (fill yes (arc_segments 16) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 88.646 96.8756) (xy 127.4064 96.8756) (xy 127.4064 104.5718) (xy 88.6206 104.5718) (xy 88.6206 96.8756)
      )
    )
  )
)
